smt today issue 6

AIRBUS INCORPORATES THE LATEST TECHNOLOGY FOR CLEANING

RINSING TO REMOVE CLEANING AGENT FROM BOTTOM TERMINATIONS

red carpetWho’s doing what, where?

inside

meet the CEos Page 6

Chan Wah Pak, MIRTEC (cover) Scott Fillebrown of ACD Founding Directors of Cogiscan Rob Boguski of Datest Mike Scimeca of FCT Assembly Ben Khoshnood of Inovaxe

| SEPTEMBER/OCTOBER 2014 ISSUE smttoday.com

SMTAI 201430th Sept - 1st oct 2014

SMTA International 2014 Take a look into some of the featured products

Technology Today Industry experts share their knowledge

10 Rinsing to Remove Cleaning Agent from Bottom Terminations12 Airbus Incorporates the Latest Technology for Cleaning-Bath

Monitoring14 AutomaticProfilingSystems:Howithasimprovedproduction20 SynergiesforGrowthandInnovation22 Advances in Aerosol Benchtop Cleaning Maximise

Environmental Protections26 JAVADEMS:OneofSiliconValley’s“JEMS”30 eTECH-WEBPromotesSelectiveSolderSolutionsbyThinking

Outside the Box36 AStudytoDeterminetheImpactofSolderPowderMeshSize

and Stencil Technology Advancement on Deposition Volume whenPrintingSolderPaste

42 Paths Taken by Businesses to Streamline Overseas Factories46 Enhancing the Electronics Manufacturing Experience –

A Real Solution for Traceability, Process Control and Quality Improvements

52 ImplementingWarpageManagement:A5-StepProcessforEMSProviders

57 FacingtheChallengesofTHTInspection58 EssemtecSolutionsHelpEMS,Inc.ContinuetoProvideBest

Possible Customer Service and Quality

Industry Interviews Interviews with industry experts

7 MIRTEC’sBrianD’Amico,DavidBennettandChanWahPak

New Products Exciting new industry innovations

Industry News What’s happening in the world of electronics

Red Carpet Photo gallery of industry personalities and events

inside this issue...

magazine contacts...

4SMTA International 2014

32NewProducts

10Rinsing to Remove Cleaning Agent

6Meet the CEOs

52Implementing Warpage

Editor Lin Ramsay [email protected] +44(0)1292 834009 skype: lin-smttoday

Design Big Blue Dog bigbluedogdesign.com +44(0)1292 280022

Website smttoday.com

Articles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every effort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers for loss arising from articles/information contained and published.All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

NEXT EDITION November/December 2014 - Solderwave & Reflow

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| SEPTEMBER/OCTOBER 2014 ISSUE

SMTA International 2014 Donald Stephens Convention Center, Chicago, USA Conference: 28th Sept - 2nd OctExhibition: 30th Sept - 1st Oct

Attendees and exhibitors at SMTA International can expect a focused event with the strongest technical conferences connecting with the exhibition through technical tours, links and the Power and High Temperature Electronics Experience, etc. SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.To get the most from the show and to stay updated on the newest trends and developments, we have gathered a sampling of the customers, products and systems that will be available at the exhibition:

Speedprintbooth #825

PRODUCT Toshowcasenewfeatures for the SP710 Screen

Printer

CyberOpticsbooth #218

PRODUCT To debut its Conformal Coating Inspection

Solution

MIRTECbooth #112

PRODUCT Todemonstrateawardwinning2D/3Din-lineanddesktop

AOI Systems

NordsonYESTECHbooth #606

PRODUCT To debut FX-940 AOI with3DCapability

Essemtecbooth #640

PRODUCT To highlight the world’sfirstSMTAssemblerwith

Integrated Solder Paste Jet Printer

Kyzenbooth #506

PRODUCT To exhibit the UltraLowVOCStencil

Cleaning Agent

Seika Machinerybooth #835

PRODUCT To debut RD-500VAll-In-OneRework

Station

Europlacerbooth #907

PRODUCT To demonstrate the iineo II SMT Pick-and-

Place Platform

Metcalbooth #539

PRODUCT To demonstrate their advancedreworkrepertoire,the

Scorpion and the MS-5200


ACDScottFillebrownis the President and CEO of ACD, an AS9100 and ISO 13485 certified full-service EMS company. The company’s services comprise complete board layout, DFM/DFA capability, printed circuit fabrication, component procurement, thru-hole, SMT and part-on-part mixed technology assembly, box build, rework, flying probe, functional and JTAG test, and development. Today, Fillebrown and his team are leading suppliers of design through final packaged electronics and the company is one of the leading EMS companies in the U.S., offering support for high-tech OEMs from concept through design, to quick-turn prototyping and end-customer support.

CogiscanThe leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, Cogiscan was founded by Vincent Dubois, François Monette and André Corriveau. Over the last 15 years, the three men have led the company as it developed innovative solutions to solve challenging industry problems. Among others, Cogiscan was the first company to automate tracking of moisture-sensitive components. The company also developed the unique and patented RFID Smart Feeder system that is used on hundreds of machines around the world. Cogiscan is now widely recognized as the expert provider of traceability solutions for electronics assembly.

DatestRob Boguski is the President of Datest, an ISO9001- and AS9100-certified provider. Datest is the first test services company in the United States to fully integrate the latest SPEA 4060 double-sided flying probe tester with the latest Goepel boundary scan tools. This integration provides crucial benefits, such as increased digital test and fault coverage as well as significant time savings using automatic diagnostics. Combining advanced test platforms (flying probe, X-ray, boundary scan and ICT) with 30 years’ experience, Boguski and his team deliver superior value-added services. Datest has been providing the CM/EMS as well as the OEM community with advanced, integrated PCBA testing and inspection services since 1984. The company offers in-circuit testing (ICT) and test development (hardware and software) for all major ICT platforms (Agilent 3070, GenRad, and Teradyne). Additionally, Datest augments ICT with SPEA Flying Probe testing, Agilent 5DX and Dage Ruby 2D X-ray with X-Plane Technology, benchtop boundary scan, and functional testing.

FCT AssemblyMike Scimeca is the President and CEO of FCT Assembly, believes in taking a multi- and interdisciplinary approach when developing new products and processes. With expertise in micro-machining, metallurgy, chemistry and polymer technology, he and his team have positioned FCT Assembly to develop products that meet technology challenges and satisfy customer demands. FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. FCT Assembly is a leading and innovative manufacturer of lead-free and leaded solder products, superior quality stencils and precision laser-cut parts with multiple locations throughout North America.

InovaxeBen Khoshnood is the President of Inovaxe. A world leader and provider of innovative material handling and inventory control systems, Khoshnood and his team focus on delivering innovative production and inventory management solutions to the electronics industry. Khoshnood believes that the solution to electronics manufacturers’ challenge of managing WIP inventory and reducing non-value added costs are achieved by bridging the gap between material handling systems and software specifically devised for the electronics manufacturing world. By designing material handling systems to work hand in hand with its software offering, he and his team provide real solutions for the electronics manufacturing world. The company’s product offering includes ambient air and moisture-sensitive device material storage hardware, a supply chain management system, and an inventory and kit management software tool.

meet the CEOs the people who make it happen

Our industry is driven by a global network of CEOs with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.

directorspotlight

Q. MIRTEC has grown rapidly overthelast15years.Howmanydivisionsdoes the company have worldwide?Doyouplantoopenanynewofficesintheimmediatefuture?

A. MIRTEC has maintained an aggressive campaign to strengthen its brand perception on a global level through constant innovation and worldwide expansion of its sales and service network.

Over the past decade MIRTEC has established a total of 11 worldwide “Centers of Excellence.” The company opened subsidiaries in the United States and in Hong Kong, China in 2004; a new manufacturing plant in An-sung, South Korea and a European subsidiary in 2008. In 2009, MIRTEC opened local support centers in Vietnam and China, followed by official incorporation in China in 2011. In 2012, MIRTEC established a Core Technology Research Center in Korea and opened support offices in Slovakia

and Hungary. MIRTEC founded a Fusion Technology Center in 2013, followed by official incorporation in Japan.

Regarding our immediate expansion plans, we are in the process of opening a Competence Center in Germany to meet growing demand for our equipment in this market.

Q. Speaking of growth, we’ve beenreading about ISVI Corporation, MIRTEC’s Industrial Camera Division.What is the primary reason for this new division? Brian, as the president,perhapsyoucanexplainforourreaders?

A. The electronics manufacturing industry is a very demanding market with a wide range of inspection requirements. At one end of the spectrum is the high-speed, high-volume production requirements associated with mobile device and LED Back Light Unit (BLU) manufacturing. At the other end of the

spectrum is the high-end, high-accuracy inspection requirements associated with the manufacturing of microelectronic components. Although several industrial camera manufacturers have designed cameras suitable for the inspection industry, none have developed cost-effective camera technology capable of addressing this diverse range of requirements. With this in mind, in 2010 MIRTEC established an Industrial Camera Division, ISVI Corp., for the design and manufacture of high-speed, high-resolution camera systems for our entire product line of inspection equipment.

Based on the overwhelming success of these advanced camera systems, ISVI began to market its camera products worldwide and quickly has become a recognized leader in this industry. ISVI services span a wide range of industrial camera applications such as microscopy, machine vision, factory automation,

an interview with MIRTEC’s Brian D’Amico, David Bennett and Chan Wah PakMIRTEC is a leading global supplier of Automated Optical Inspection systems to the electronics manufacturing industry. MIRTEC products have been extremely successful in high-volume markets including cell phone and MP3 player manufacturing, as well as low-volume, high-mix markets such as medical, automotive, aerospace and defense. “The Global Leader in Inspection Technology,” the company lives up to its name by having equally strong divisions in Korea, the United States, Europe, China and Japan. We recently spoke with MIRTEC CEO Chan Wha Pak, Brian D’Amico, President of MIRTEC’s North American Division, and David Bennett, President of MIRTEC Europe Ltd to discuss what’s new with the company and how it’s making history.


directorspotlight

robotics, medical and more. Customers include OEMs, system integrators, end-users, researchers and developers. For further information, please visit www.isvi-corp.com.

Q. MIRTEC has recorded consistent revenue growth for the past severalyears. Can you describe the current global market conditions that have fueledthissignificantgrowth?

A. Advancements within the electronics manufacturing industry have led to ever-increasing PCB density and complexity. As a direct result of this phenomenon, a growing number of OEM and EMS providers have begun to invest in new inspection equipment capable of meeting today’s higher standards of productivity and provide them with a much needed competitive edge.

MIRTEC is regarded as one of the most progressive and dynamic equipment suppliers to the electronics manufacturing industry. Our company invests heavily in research and development (R&D), combining sophisticated vision algorithms with state-of-the-art optics, lighting and laser technology in the development of our Technologically Advanced Inspection Systems. This unwavering commitment to product innovation combined with an extremely talented team of sales and support professionals has resulted in a continued expansion of MIRTEC’s market share in this highly competitive industry.

Q. From our viewpoint, MIRTEC’sgrowth is due to many reasons,including the fact that you listen to your customers and create products to meet their current needs. Your global presence, strong customer service and advanced technologies combine to make MIRTEC an industry leader. What else does MIRTEC do to be successful and how does thisrelatetoyourcompetition?

A. MIRTEC has the largest R&D division of any automated optical inspection company throughout the world. We are also unique in that we are the only AOI company who actually manufactures its own optics. This has allowed MIRTEC to offer unparalleled advantages with which all other manufacturers are unable to compete. MIRTEC’s revolutionary OMNI-VISION® 2D/3D Inspection Technology, for instance, combines MIRTEC’s exclusive 25 Mega Pixel 2D CoaXPress Camera Technology with a proprietary 3D Digital Multi-Frequency Moiré System to provide precision inspection of SMT devices on finished PCB assemblies. This advanced technology not only provides unprecedented speed and performance to the electronics inspection industry, but has set a new standard by which all other inspection equipment is measured.

Q. We have noticed that the company has entered the LED arena with thedebut of the MV-9XP LED Package Inspection System. We understand this technology was developed tospecifically address the inspectionrequirements of the LED manufacturing industry.Canyoupleaseexplainwhatbenefitsthissystemprovides?

A. Automated optical inspection is required at two different stages within the LED packaging process. In the first stage, the bond wire, chip die and stitch ball are inspected for defects prior to encapsulation. In the second stage, post-encapsulation, the epoxy is inspected for foreign materials, bubbles and sufficient volume.

MIRTEC’s MV-9XP Inspection Machine was developed to specifically address the inspection requirements of the LED manufacturing industry. This specialized system is configured with a 15 Mega Pixel Camera combined with an Ultra High Resolution 5 Micron Telecentric Lens and high intensity blue LED lighting to perform bond wire, chip die and stitch ball inspection of LED packages prior to encapsulation.

Q. Why is the use of 2D and 3D on a single platform important to inspecting today’s technologies? What benefitsdoesthisprovideusers?

A. For years, the AOI industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder and solder bridges, there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded devices, BGAs and LED packages. True co-planarity inspection of these challenging devices is an absolute necessity and literally requires the addition of a third dimension in inspection capability – 3D inspection technology. It is important to understand that there are advantages and disadvantages associated with both 2D and 3D inspection technology. In order to achieve the highest level of quality assurance, the AOI system must, therefore, employ a combination of both 2D and 3D inspection technology in a single platform.

As a world-leading supplier of 2D AOI inspection systems, MIRTEC recognized the requirement of 3D technology to complement the capabilities of its award-winning 2D technology, NOT to replace it, this is the reason why MIRTEC’s 2D/3D combination is unrivaled when it is in a production environment whereas several other offerings are useful only in a low-volume laboratory setting.

Q. Besides LED production, industrial camerasand2D/3D inspection,whatother challenges is the industry facing? Do you anticipate MIRTECdebuting new technologies to solvethesedifficultiesinthenearterm?

A. MIRTEC has several exciting developments with camera and sensor technologies but, of course, we need to keep these close to our chest until we are ready to release them. However, one area where MIRTEC is also making big advances is in process feedback control. No longer does the customer simply rely on their inspection systems to catch “bad” PCBs, now MIRTEC has the means to help them stop making them in the first place. We believe this will become the requirement for the world’s most advanced manufacturers and, again, MIRTEC has the solution ready for them.

Q. WeseethatthecompanywillbeatSMTA International. Can you give our readers a sneakpeekofwhatwill beondisplay in thebooth?Wewishyoumuch success before, during and after the exhibition!

A. MIRTEC will showcase our award-winning MV-7 OMNI 2D/3D In-Line AOI Machine and MV-3L Desktop AOI system at SMTA International.____________________________________

‘‘No longer does the customer simply rely on their inspection systems to catch “bad” PCBs____________________________________

The MV-7 OMNI 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION® 2D/3D inspection technology that combines an exclusive 15MP CoaXPress 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies. The MV-7 OMNI machine also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

The MV-3L Desktop AOI system is the industry’s most widely accepted five camera desktop AOI system. This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

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Rinsing to Remove Cleaning Agent from Bottom Terminationsby David Lober, Dr. Mike Bixenman, Ram Wissel & Jason Chan of Kyzen Corporation

One of today’s major cleaning challenges is to successfully clean and rinse under bottom terminated components. Because of the demands placed on modern printed circuits, including increased component density and circuit complexity, cleaning proves especially critical to ensure proper reliability. This article examines the interplay between cleaning agent and number of rinse cycles on the resistivity of the rinse water, the ionic contamination on the board, and the relative amount of organic residue present in the rinse water and trapped under bottom terminated components. By understanding the nature of these interactions, the ability of different cleaning agents to be rinsed and the optimum rinsing protocol for aqueous cleaning agents can be determined.

In an aqueous electronic assembly cleaning process, water quality is extremely important. Water purity at each process stage, low levels of foam, applied impingement energy, rinse temperature and rinse time are critical factors to ensure an adequately rinsed part. An inadequately rinsed part can leave behind residue that may impact product reliability.

Rinsing Study

The commercially available aqueous cleaning agents in this study are commonly used in cabinet style batch cleaning machines. The properties of the seven cleaning agents are categorized within Table 1. The letters within the table mean the following: CA = Cleaning Agent; H = High; M = Medium; L = Low.

Table 1: cleaning agents included in this study

Process parameters:Wash time: 5 minutesWash temperature: 65°CRinse temperature: 26.6°CNumber of rinses: # needed to reach valueResistivity setting: 250kΩ and 500kΩ

The cleaning agents were run in a cabinet style batch cleaning machine. The circuit boards processed within the machine

were pre-cleaned to ensure that no flux residues were present under the chip caps. The purpose of the pre-cleaning was to eliminate the interference from residual anions or cations present in flux residues that may remain after cleaning and to ensure that these ions do not skew data findings. The research objective was to compare rinsing effectiveness on industry-accepted aqueous cleaning agents.

For the batch cabinet cleaning machine used to run the DOE, a rinse cycle added approximately three gallons to the process chamber at ambient temperature. No heat was added to the rinse water before the rinse cycle was initiated. Each rinse ran for 30 seconds. Following each rinse, a mid-stream sample was collected as the water was drained. A chemical oxygen demand (COD) analysis was run on each water sample collected.

The quantitative study researched the rinse efficiency of each cleaning agent. The rinse efficiencies were measured in the following five ways:

1. A wash cycle was run with no boards loaded into the cleaning chamber. The number of rinses needed to meet rinse water resistivity values of 250 kΩ and 500kΩ was determined.

2. The machine was loaded with 15 clean Kyzen low-gap test vehicles. Boards were pre-cleaned to ensure no flux residue was present under chip caps. After that, a wash cycle was run but a water rinse following the wash was not run. Two boards were collected, air was blown off, the boards were bagged and ion chromatography (IC) was run.

Figure 1: Board Configuration – Yellow boards are the sites where the boards were taken for IC analysis

3. The machine was loaded with 15 clean Kyzen low-gap test vehicles. A wash cycle was run and the number of rinse cycles needed to achieve 250kΩ water resistivity was determined. Two boards were collected, air was blown off, the boards were bagged and ion chromatography was run.

4. The machine was loaded with 15 clean Kyzen low-gap test vehicles. A wash cycle was run and rinsed to 500kΩ water resistivity. Two boards were collected, air was blown off, the boards were bagged and ion chromatography was run.

5. Following each rinse cycle, a sample was pulled at the drain line to run a COD analysis in mg/liter. A mid-stream sample was pulled after each rinse and a series of COD measurements were run for each cleaning agent tested.

Data Findings

Test #1 A wash cycle was run with no boards loaded into the cleaning chamber. The number of rinses needed to meet rinse water resistivity values of 250kΩ and 500kΩ was determined.

Figure 2: Number of rinses needed to meet set values

The batch cabinet cleaning machine automatically determined the number of rinse cycles required based on the resistivity of the rinse water during each rinse. The rinse cycles needed to reach the preset values were relatively similar with the exception of cleaning agents with lower pH values. The data found that one additional rinse cycle on average improved the resistivity value from 250kΩ to 500kΩ.

Test #2 The machine was loaded with 15 clean Kyzen low-gap test vehicles. A wash cycle was run but the boards were not rinsed following the wash cycle. IC was run on the boards to measure the cation levels present following a wash cycle. Figure 1 illustrates the placement of Boards #1 and #2.

Figure 3: Legend for IC data

Figure 4: Cation levels before rinse. See Figure 3 for legend.

Many aqueous cleaning agents use amine activators to saponify and soften rosin and resin structures. These amines are derivatives of ammonium cations and, as such, can show on IC as ammonium. To avoid disclosures of proprietary amines, no effort was made to identify or quantitate amines — they were treated as ammonium for the calibration of the IC. The anticipated response differences between various common amines were small enough to allow for relative comparisons instead of absolute comparison. Cleaning agents that are highly buffered resulted in lower levels of the ammonium ion. CA-1 registered high ammonium ion levels, indicating a cleaning agent that is poorly buffered and containing higher levels of free alkalinity. Magnesium, sodium, potassium and calcium were found at higher levels from some cleaning agents vs. other cleaning agents.

Test #3 The machine was loaded with 15 clean Kyzen low-gap test vehicles. A wash cycle was run. Following the wash cycle, the number of rinse cycles needed to reach rinse water resistivity of 250kΩ was tabulated. For each rinse cycle run, a sample was pulled for COD analysis. Once the rinse water reached 250kΩ resistivity, the rinsing process was stopped and two boards were collected for IC analysis.

Figure 5: Cation levels at 250kΩ. See Figure 3 for legend.

The cation levels present at 250kΩ showed mixed results. The ammonium ion for CA-1 was reduced by a factor of 5:1 vs. not being rinsed, yet was unchanged on CA-2, CA-5 and slightly increased on the others. Upon rinsing, the ammonium ion hydrates and hydrogen bonds with water, resulting in a potentially higher recorded level. While reduced, CA-1 with low buffering remained at consistently higher levels of ammonium

ions vs. the more buffered materials. One of CA-4’s cards showed an increase in ammonium, sodium and magnesium while calcium did not have a large spike like the un-rinsed condition. Overall, rinsing to a value of 250kΩ did not show a significant change in ionic contamination vs. no rinsing except on the less buffered cleaning agent.

Test #4 The machine was loaded with 15 clean Kyzen low-gap test vehicles. A wash cycle was run and the number of rinse cycles needed to reach rinse water resistivity of 500kΩ was tabulated. For each rinse cycle run, a sample was pulled for COD analysis. Once the rinse water reached 500kΩ resistivity, the rinsing process was stopped and two boards were collected for IC analysis.

Figure 6: Cation levels to 500kΩ. See Figure 3 for legend.

The cation levels present at 500kΩ rinse water were very low. The ammonium cation again remained higher for CA-1. The data found all the cleaning agents rinsed well relative to typically accepted values. Cleaning agents with higher pH values and greater alkalinity required 1-2 additional rinse cycles. Compared to the 250kΩ results, one additional rinse typically was required to achieve the 500kΩ value, providing consistently lower ionic values.

Test #5 Following each rinse cycle, a mid-stream sample was pulled at the drain line to run a COD analysis. The purpose of this test was to provide a rough indication of the amount of bulk organics, presumably cleaning agent, in the rinse water for each rinse.

The COD levels were measured for each rinse cycle. The first rinse cycle recorded the highest COD level, which indicates that the majority of the wash solution was removed using the first rinse cycle. During the first rinse, the organic constituents within the cleaning agent contributed to the COD level. CA-2 was run at 25%, with the data bearing out that during the first rinse sample, the COD levels were higher. On some cleaning agents, the COD levels were very low, indicating a cleaning agent that wets and drains from the assembly and wash chamber well following the cleaning process. The COD values ranged over several orders of magnitude so a base 10 logarithmic transformation was used. Following the first rinse, the COD levels dropped significantly, which indicated that all the cleaning agents were rinsed well with water.

Figure 7: COD measurements on each cleaning agent for each rinse cycle. Note the logarithmic scale.

Conclusion

The data finds that all the commercially available cleaning agents in this study are highly rinsable with water. The bulk of the cleaning agent left on the boards and within the process chamber is rinsed off the assembly during the first rinse cycle. The subsequent rinse cycles effectively remove trace ions and cleaning agent remaining on both the assembly and within the process chamber. ____________________________________

‘‘98% reduction in organics after the first rinse____________________________________

The data finds that the ammonium ion is more pronounced on highly saponified/less buffered cleaning agents. This strength of the buffer can also be a contributing factor to the ammonium ions present. On highly buffered cleaning agents, the ammonium ion dissociates when rinsed and has a higher tendency to be detected.

The data finds that 4-6 rinse cycles are needed to reach water resistivity of 250kΩ. To reach 500kΩ higher purity levels, only an additional 1-2 rinse cycles is required. The additional rinse required to 500kΩ made a notable change in the level of ionic species detected.

The effect that the number of rinse cycles has on the organic materials in the rinse water varies more than the ionic data. Some cleaning agents had an approximate 98% reduction in organics after the first rinse, while others took an additional 3-4 rinses to achieve that reduction. This presumably arises from the wide variety of organic materials used in cleaning agents. Some organics are highly water soluble and will be removed at a faster rate than less soluble ones. Because the COD data is a non-specific, it will vary more than a specific test. This is because the fundamental properties of ions are relatively constant, so sodium ions will all have similar solubility properties regardless of cleaning agent type, whereas the sheer variety of organic molecules in aqueous cleaning agents means that some will leave at faster rates than others.


Airbus Incorporates the Latest Technology for Cleaning-Bath Monitoring by Emmanuel Bernard, Process Engineer at Airbus Toulouse

Maintaining the highest product quality standards is critical for ensuring maximum safety and is thus the cornerstone of Airbus’ success. Therefore, the entire production chain is subject to constant monitoring and a continuous improvement process at the same time.

With approximately 70,000 employees worldwide, Airbus is one of the world’s largest aircraft manufacturers for civilian aircraft. Airbus’ production line covers complete product families based on four aircraft types, ranging from the smallest with a central aisle and 100 seats to the world’s largest airliner, the A380 with a double deck.

Airbus’ headquarters are located in Toulouse, France (Figure 1). Central planning and final assembly for aircraft models ATR, A320, A330, A350 and A380 occur here.

Within Airbus, the “Avionics & Simulation” department is tasked with assuring the planning, production and maintenance of electronic control units for aircraft control, alarm generators or communications modules. Additionally, this department is responsible for the coordination of the production, manufacturing and testing of the assemblies.

Fig. 1: Airbus headquarters in Toulouse, France

Cleaning electronic assemblies has always been a critical step within the production process and is thus a core component of Airbus’ quality assurance program. Cleaning significantly reduces the risk of component field failures that can result from failure mechanisms such as electrochemical migration and ensures the long-term reliability of the electronics.

This is critical since long-term warranties apply in civil aviation.

The cleaning process at Airbus Toulouse

The cleaning process at Airbus Toulouse uses a dip process with spray-under-immersion agitation. A water-based micro phase cleaning agent is used in a multi-chamber stainless steel cleaning equipment from a French manufacturer. There are several advantages to Airbus by using a water based cleaning process including the ability to abide by general environmental protection standards such as low Volatile Organic Compounds (VOC) content in the cleaning agent, as well as guaranteeing a high degree of worker safety.

The cleaning process used must produce consistently good cleaning results thereby ensuring long service life for the assemblies. Additionally, the cleaning agent should be environmentally friendly and safe for use within the equipment and by the operators. It should be noted that there are various factors that may significantly affect both the quality of the cleaning results and the bath life time.

Flux residues continuously accumulate within the bath during the cleaning process. In practice, this means that the bath contamination constantly increases until a critical value is reached beyond which the cleaner can no longer produce satisfactory results. At this stage, the cleaning bath is exhausted. Bath life time can be extended by using an additional filter circuit, as it is the case at Airbus. This is used to continuously remove flux residues from the cleaning chemistry, thereby maximizing the cleaning agent bath life, minimizing bath changes and thereby reducing cleaning process costs.

The cleaning medium can also be impacted by the rinsing stage as well as through evaporation, resulting in undesirable shifts in concentration. Unmonitored, the cleaning media concentration can drift outside the recommended application range. If the application concentration drops significantly lower than recommended, poor cleaning results

are often the consequence. Conversely, if the application concentration becomes significantly higher than recommended, material compatibility problems with the electronic components on the circuit board are a likely result. Automatic monitoring of cleaning agent concentration is a sensible way to avoid these issues.

Previous cleaning bath monitoring with limits

Routine inspection of cleaning agent concentration has always taken place at Airbus since their products have to meet the highest quality standards. At the same time, documented evidence is required that is specifically examined as part of audits according to NADCAP, IPECA, or even IPECA+ rules (Industrial Process Control Assessment, Airbus supplier’s internal tracking tool). Furthermore, the key parameters of the cleaning process are defined as part of a risk analysis. At Airbus, one of these key parameters is the cleaning agent application concentration.

To date, only manual methods have been available for determining cleaning agent concentration in the area of electronics manufacturing. These include chemical testing based on acid-base titration, the phase separation method, or refractive index. Both the titration method and refractive index are only suitable for freshly prepared cleaning baths. They are unreliable measurement techniques for cleaning agent concentration when contaminants such as flux residues are present.

The phase separation concentration measurement technique does produce reliable and accurate results for both fresh and contaminated cleaning baths. At Airbus, this was the chosen technique to monitor the cleaning bath concentration and was conducted regularly once per week.

As part of continuous process optimization, there was the desire at Airbus to replace the manual method with an automatic method. Airbus recognized that regardless of the accuracy of the manual method, automated real time control and documentation were lacking.

Introduction of an automatic concentration measurement system

To meet the demand for real-time monitoring and continuous traceability, a new automated concentration measurement system, the ZESTRON EYE, was introduced (Fig. 2) as a joint project between Airbus, MBtech, the cleaning equipment manufacturer, and ZESTRON, the cleaning chemistry manufacturer.

Fig. 2: The sensor and touch screen controller of the concentration measurement system at Airbus Toulouse

This automatic concentration measurement system is the first in the world that measures the cleaning agent concentration in real time in both fresh and contaminated baths using a special acoustical measuring method. Especially designed for the water-based micro phase cleaning agent that is used at Airbus, this device enables accurate concentration measurement. The sensor is compact and thus can be easily installed within the cleaning equipment. Measurement system control is accomplished via a control unit with a touch screen interface.

The measurement system allows a direct connection to the cleaning machine programming interface (PLC) and thereby the control of the dosing unit enables complete automatic control of the concentration (Fig. 5).

The new concentration measurement system test phase

After the introduction of the system, Airbus began a four-week test program. A key factor in their decision to trial the new measurement system was the possibility to achieve automated real time monitoring and traceability. This would enable Airbus to meet their need to achieve consistently high quality cleaning results and avoid the issues associated with cleaning agent concentration outside the recommended application range. Additionally, errors that accompany the manual method due to improper sampling technique can be avoided.

Prior to the test, the concentration measurement system was installed in the multi-chamber immersion system at Airbus. Reference measurements were conducted regularly during the test period, both at Airbus with the chemical quick-

test bath analyzer and at the German manufacturer of the cleaning chemistry with the aid of gas chromatography analysis (GC). Additionally, conductivity measurements were made and the alkaline reserve of the cleaning agent was examined.

The results are detailed in Figure 3 and clearly indicate a close correlation between all concentration measurement techniques.

Fig. 3: Change in the cleaning bath’s concentration by various methods in the test phase

For Airbus, the results generated throughout the test period confirmed the accuracy of the automatic concentration measurement system (ZESTRON® Eye) as compared with GC analysis and, as a result, they established it as the accepted concentration measurement system within their process after the 4 week test program.

Automatic concentration measurement in practical use

Permanent installation of the automatic measurement system has given the Airbus operator a continuous visual and real-time overview of the current status of critical process parameters such as the cleaning agent concentration, cleaning bath temperature and sensor status (Figure 4).

In addition, NC25MANAGER traceability software developed by cleaning equipment manufacturer MBtech displays these parameters on the cleaning equipment display screen.

Airbus has used qualification tests to determine the upper and lower concentration limits of the process at which optimal cleaning results are guaranteed and entered them into the control unit. Adherence to these limits guarantees good cleaning results and prevents material compatibility problems due to excessive cleaning agent concentration. The concentration-measuring unit employs visible and audible signals to alert the responsible operator of a possible deviation of the programmed limits. In this way, the responsible department head can take immediate countermeasures to correct the situation and ensure that insufficiently cleaned assemblies do not leave the process.

The state of automatic cleaning bath monitoring at Airbus today

The new measuring system has been in use at Airbus for a year and they are very satisfied with its performance. It has proved to be reliable, accurate and easy to use. Additionally, it meets an

Fig. 4: Automatic concentration measurement with the ZESTRON® EYE in the MBtech-NC25 cleaning system at Airbus in Toulouse.

Airbus primary requirement that, at any time, the current process parameters of temperature, concentration and sensor status must be displayed and reported when these lie outside the process limits previously defined.

Now, the cleaning process is more transparent and can be accurately analyzed as required.

A further advantage, particularly in regard to process audits, is the ability for continuous data recording and storage of measured parameters

As a result, Airbus was able to meet its own requirements for modern bath monitoring through constructive co-operation between the manufacturers of the cleaning equipment and cleaning chemistry.

As a result of the success of the concentration measurement system, the next task posed by Airbus to MB Tech, the equipment manufacturer, and Zestron, the cleaning chemistry manufacturer, is to introduce an automated dosing system that is controlled by the cleaning equipment PLC for the addition of cleaning agent concentrate or DI-water. The intent is to test this solution for the first time in their operation during their next annual maintenance (Figure 5).

Fig. 5: Process diagram (S = sensor, C = controller of the concentration measuring system with automatic re-dosing).


2014 Global Flexible SMT Placement Equipment

CoMPany oF ThE yEar

Blakell europlacer was judged Based on five criteria:

• growth strategy excellence

• growth implementation excellence

• degree of innovation with products and technologies

• leadership in customer value

• leadership in Market penetration

frost and sullivan scored europlacer 9.5/10.0 total, which is significantly higher than the 7.9 and 7.0 scores earned by their two closest competitors, respectively.

“Europlacer’s strong, versatile product

portfolio has helped strengthen its

market position. By means of the high

quality of its customer service, the

company has created innovative

products and strengthened its market

position. Based on Frost & Sullivan’s

independent analysis on the Global

Flexible SMT Placement Equipment

market, Europlacer is recognized with

the 2014 Company of the year award.”

— Frost & Sullivan

2014

GLOBAL FLEXIBLE SMT PLACEMENT EQUIPMENTCOMPANY OF THE YEAR AWARD

Automatic Profiling Systems: How it has improved productionby Mark Stansfield, MD, Solderstar Ltd.

With electronic assembly continuously evolving it is paramount that systems are put in place that can meet today’s requirements and expectations, whether that be ensuring quality or simply cost saving.

One system that has improved production significantly is thermal profiling. Traditionally a profiling instrument is used to establish the correct thermal profiling for the soldering process. Thermocouples are attached to a PCB (Printed Circuit Board) and the component level temperatures are captured by the measurement datalogger.

Verification profiles are then captured on the SMT (Surface Mount Technology) line by periodically passing the test PCB and instrument through the process.

The Need for an Automatic System

Until recently the preferred and only way to manage assembly was through manual profiling, recent innovations in the area of automatic profiling technology has resulted in increased levels of process quality and less need for labour intensive manual. The need for regular monitoring of temperature profiles has always been an important consideration. Past methods included obtaining temperature profile through attaching thermocouple sensors to the PCB and recording temperature profiles using a heat protected datalogger, which travels through the process behind a test PCB. Although this method appeared to work effectively for initial machine set-up, it does not lend itself to ongoing process monitoring in high production rate environments, something becoming ever more important.

As this system could only be deployed periodically manufacturers were faced with having to manually take a reading at different times in the process and hope that

in between this time the process continues to work effectively – this of course was not a guaranteed process and was based on ‘hope’. Not only was the process unreliable but every time a reading was taken production had to be stopped to allow the test board and profiler to pass through. If a problem did occur, it would only be discovered when the next reading took place and, if incorrect, would involve loss of production time to rectify the situation.

Developing the APS

To combat this rather inefficient method, the SolderStar Automatic Profiling System (APS) was designed. SolderStar first developed the APS-1000, which measured the stability of the process parameters within a reflow oven. Designed with a rigid thermocouple tube with internal thermocouple sensors mounted at the desired position, it measured the zone temperature at product level. Although it was very robust and was a far cry from the manual method, it still had disadvantages. It was found that the response time was slow and there were conduction problems between zones. It was also extremely expensive to manufacture and caused problems to distribute overseas. The physical diameter of the probe was also undesirable on bigger machines and could potentially cause shadowing of the product as it passed through the process. This obviously was not ideal and although taking the right step forward a newer, more reliable system was required.

The New and Efficient APS is Developed

SolderStar worked on improving this process and designed a profiling system that did not have the flaws of its predecessor and so the APS-2000 was developed. The new system was the first product offering to measure the stability of the process parameters within

a reflow oven, combined with assembly position tracking to produce the most representative virtual profile possible for every PCB passing through the machine, a breakthrough for the industry. The APS 2000 continuously tracks PCB movements through the machine and also monitors process fluctuations at product level. These changes are then used by a mathematical model to calculate what the resulting PCB profile would be, this is known as the virtual profile. Process parameters can then be calculated and tested within limits.____________________________________

‘‘The need for regular monitoring of temperature profiles has always been an important consideration____________________________________

This system has been worked on, re-designed and improved over the years and is quickly catching the attention of manufacturers across the globe. Two years ago a round of development took place and a new design was produced which solved previous problems. The original APS product was based around the same instrumentation circuits used in their profiling systems but, due to research and experience, it was understood that a new instrumentation circuit could be developed that was specific to the needs of the systems. The new electronic measurement system deployed in the APS 2000 would reduce the number of thermocouple conductors required to make the measurements needed. This allowed for a much smaller probe diameter to be achieved. For example on a 16 zone machine a probe diameter of typically 6mm could be used.

The response time of these probes is exceptional, allowing the detection of machine faults quickly and easily so they can be rectified, saving both time and money.

Faults the APS-2000 can detect:• Zone temperatures set incorrectly from a

defined reference• Speed set incorrectly from defined reference

2014 Global Flexible SMT Placement Equipment

CoMPany oF ThE yEar

Blakell europlacer was judged Based on five criteria:

• growth strategy excellence

• growth implementation excellence

• degree of innovation with products and technologies

• leadership in customer value

• leadership in Market penetration

frost and sullivan scored europlacer 9.5/10.0 total, which is significantly higher than the 7.9 and 7.0 scores earned by their two closest competitors, respectively.

“Europlacer’s strong, versatile product

portfolio has helped strengthen its

market position. By means of the high

quality of its customer service, the

company has created innovative

products and strengthened its market

position. Based on Frost & Sullivan’s

independent analysis on the Global

Flexible SMT Placement Equipment

market, Europlacer is recognized with

the 2014 Company of the year award.”

— Frost & Sullivan

2014

GLOBAL FLEXIBLE SMT PLACEMENT EQUIPMENTCOMPANY OF THE YEAR AWARD


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• Oven zone feedback thermocouple failures• Fan failures• Conveyor speed failures• Incorrect oven recipe loaded by operator• Overloading of oven throughput• Thermal profile outside process limited

This combination of benefits has given manufacturers peace of mind and helped to improve manufacture. It is because of this that most recently two leading European manufacturers have decided to invest in the APS 2000, after successful long term and comprehensive testing of the system.

The SolderStar APS is a full time system for profiling each and every PCB soldered in a convection reflow oven. The system is tailored for, and fitted, to a customer’s oven so their requirements are met precisely. The system works by continuously measuring product level zone temperatures and conveyor speed and comparing these measurements to a captured process reference which the system has previously learned.

The system continuously compares each new set of measurements with the reference and evaluates any differences.

Should the difference between the current process and the reference exceed user defined limits, then further boards are prevented from entering the oven by way of the SMEMA (Surface Mount Equipment Manufacturer’s Association) interface.

Special temperature probes are mounted along the heated length on both sides of the machine to monitor actual product level temperatures in real time. In addition to this, the system keeps track of the current speed and position of each assembly in the process.

The temperature probes have been designed to be smaller and can be positioned closer to the PCB providing a much more accurate temperature measurement in the vicinity of the electronic assembly during soldering. The smaller size also reduces the danger of the probe shadowing the product.

Why measure independently of the oven?

The APS system measures the product level zone temperatures and conveyor speed independently of the oven. This is important for two reasons:-

Firstly, the machine may malfunction; for example a heater or fan may give trouble.

Secondly, an operator may load the wrong recipe for the board being produced.

Why measure temperature at product level?

The oven itself monitors and maintains the temperature of each zone. This measurement is made near to the heaters and does not closely reflect the temperature seen at product level which is a function of the machine convection.

The APS system adds independent temperature sensors mounted at product level close to the conveyor rails. These sensors are designed to closely measure the heating levels impinging on passing circuit boards whilst at the same time minimizing shadowing caused by the sensor itself.

As a PCB enters the reflow oven, its progress is tracked through and temperatures recorded at product level sensor as the PCB goes through the zone.

When the PCB exits the oven, the profile is mathematically calculated using the live measurements, and the PCB reference profile. It is then evaluated PASS/FAIL and recorded, making the results easy to follow. For each PCB there is a record of the process speed and each zone temperature together with the mathematical profile, so again 100% traceability is available.

Traceability, barcoding and SMEMA integration

Where barcoding is available the APS can also integrate with internal enterprise resource planning (ERP) systems to provide automatic storage of PCB data from the production lines. Because there is barcode integration it allows the profiles in the database to be tied to a specific PCB produced, ensuring 100% traceability. It also has SMEMA functionality which allows the APS to control the flow of product into the reflow oven. These two features make a very powerful system.

Additionally, there is the ability to automatically detect product changeover on the production line, as the PCB moves along the in-feed conveyor to the oven, the PCB barcode can be scanned and fed to the APS system. The PCB assembly type can then be determined by the APS and a decision made if the process is correct for that assembly, if not the PCB will be held on the in-feed conveyor and an engineer notified. Once the oven has been changed over to the correct settings for the new assembly being produced, the APS will wait until all parameters are stabilised before allowing the flow of product to continue.

When barcoding is employed, a virtual profile and all oven conditions are recorded for every assembly which can be later retrieved to provide total traceability of each assembly produced.

feature continued...

SolderLab has the tools to ensure your solder quality remains high and rework expenses stay low.

SolderLab is an independent test facility specializing in the analysis and measurement of solder alloys.

More than just testing, Solderlab provides full service monitoring and scheduled testing of your solder -

simple, fail-safe quality assurance starting at just $79.

Visit www.solderlab.com today to learn more, order tests or schedule your service.

Easy to order, easy to use, ALWAYS on time!

SolderLab12675 Danielson Ct.Suite 403Poway, CA 9204www.SolderLab.com(858) [email protected]

We Remember… So you don’t have to!

“The most expensive tool in your toolbox is the one

you never use.” –unknown

MW/SL/8/July 2014 full page ad-8.indd 1 7/10/14 2:29 PM

http://www.solderlab.com

http://www.SolderLab.com



When the APS 2000 is used it follows specific steps to calculate profiles in real-time.

Step 1 Capture the actual profile from a PCB using a test PCB and manual profiler (This gives the software the thermal model of the oven and the components/PCB)

Step 2 The APS 2000 analyses and records the ‘good’ state of the reflow oven

Step 3 The system measures in real-time any fluctuations in the process. The information from steps 1 and 2 are then used to calculate the resulting profile. Process parameters are also calculated and tested against defined limits.

The APS System Advantages

• Provides full time monitoring of reflow soldering process which does not rely on repeated profiling.

• An easy to understand system concept - ‘PROCESS TEACH then TEST’.

• Simple to install and operate.• User process limits allow the machine to

be automatically stopped if the process drifts too far away from the reference.

• Automatic process tracking and traceability for all products produced.

Why Use the APS System?

A system like the SolderStar APS 2000 offers everything an electronics manufacturer would require in profiling. It can discover ‘problems’ as they happen which can be rectified easily and efficiently reducing down-time and man hours and is a fail safe way to ensure the PCB assembly and manufacture is correct with

guaranteed traceability.

The continuous nature of the APS means that the thermal process no longer runs blind. The profile for every single PCB is measured and meets the requirements of that particular load. Being bespoke it can also work to meet strict requirements of the manufacturer lowering the cost of production by reducing production downtime due to rework and labour.

SolderStar APS has been designed to include a sophisticated computer algorithm which uses a reference profile, captured once from a traditional profiling system along with live readings from the process to calculate a mathematical profile for each PCB exiting the oven. The algorithm used by

the software to produce this profile from the live readings and reference profile has been modified based on the input of a leading mathematician to yield more accurate results.____________________________________

‘‘The algorithm used by the software to produce this profile from the live readings and reference profile has been modified based on the input of a leading mathematician to yield more accurate results____________________________________

The APS system allows 100% checking of temperature profiles, an automatic analysis of the profile, and checking of production parameters against production limits. The computer software tracks the progress of the PCB through the oven allowing for the most accurate calculation of the profile seen at product level.


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• Onceyouhaveoneprofilevariableinspecandyouadjustforthesecond,thefirstvariablegoesoutofspec

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Synergies for Growth and Innovationby Keith Bryant, SMT Today’s Technology Editor

I recently attended my first press event, as a journalist, at Siemens’ Electronics Works Amberg, Germany plant (EWA) where ASM Assembly Systems announced the successful completion of its DEK acquisition and outlined the company’s ambitious plans for the future. The two well-established brands, DEK and SIPLACE, and their respective teams now form ASMPT’s SMT Solutions business segment. Günter Lauber, CEO of SMT Solutions, had some very good reasons to select Siemens’s Electronics Works Amberg plant as the site for the press conference, because both divisions have long and successful partnerships with EWA that enabled them to develop many new SMT placement and printing solutions in joint projects.

“Process optimization” and “Industry 4.0” are the keywords at EWA and, having toured the facility, I believe it has one of the strongest process control and optimization systems around. Industry 4.0 could be described as the introduction of the Internet of Things in the factory and marks the advent of a fourth industrial revolution “in the opinion of many experts”. For sure, you will see articles expanding on this topic in SMT Today very soon.

Listening to the panel discussions at the press conference, it was clear that there are strong bonds developing within the senior team and throughout the businesses. Prof. Dr. Karl-Heinz Büttner (Head of Siemens’ Electronics Works at the Amberg plant), Günter Lauber (CEO ASMPT SMT Solutions), Günter Schindler (Head of the Placement Solutions Division) and Michael Brianda (Head of the Printing Solutions Division) not only talked about the objectives and requirements for a strong integrated business, but also of divisions that were autonomous when this was needed.

Günter Lauber stated several times that the acquisition of DEK was seen very much as a platform for growth and ASMPT’s goal is no less than to become the undisputed Number One in the SMT equipment field by 2016. That is the number one supplier to the industry, not just first in their sectors, so definitely putting a stake in the ground and making his vision crystal clear.

It was also interesting that he spoke about the ASM takeover of Siemens’ Pick and Place business a few years ago showing that ASM did a great job of allowing the business to thrive and grow. ____________________________________

‘‘I have always believed that the perfect SMT solution for our customers would comprise more than just placement machines and the right software____________________________________

He acknowledged the skills and experience of the DEK team and was confident that this would fuel the growth needed. When asked about integrating the teams he said that there would, of course, be some restructuring but the focus would be on improving customer service and sales growth. Making the valid point that change is part of our lives and all businesses restructure to meet the ever-fluid market conditions.

Lauber stated, “ASMPT’s acquisitions of DEK and SIPLACE also demonstrate that the company pursues innovation and growth. We will keep the successful DEK brand so that the DEK team can continue to go full speed ahead with its current processes and organization. This is one of ASMPT’s great strengths: the company decides on acquisitions with a much more long-term-oriented perspective and makes any changes regarding people and customers in a very careful and consensus-oriented manner.”

This statement from WK Lee, CEO ASM Pacific Technology, reinforces the qualities that DEK bring to the group. “We want

to employ these skills and resources to develop solutions that are always a step ahead of the competition so that our customers can realize a distinctive advantage in efficiency, quality and flexibility in their electronics production.”

Lauber is also focusing on his vision of how electronics manufacturing processes can be improved: “I have always believed that the perfect SMT solution for our customers would comprise more than just placement machines and the right software. Equipment makers and electronics producers know that the improved integration of printers, inspection system and placement machines, i.e. the early stage of the SMT process chain, harbors huge improvement potential. Acquiring DEK enables us to grow and develop innovative solutions for our customers by sharing our extensive knowledge and experience. “Our goal is to further improve and optimize our customers’ production processes.” Accordingly, the company plans to set up joint projects for developing integrated solutions, which Lauber believes will produce new growth impulses and competitive benefits over other equipment manufacturers. “We are at Siemens’ EWA here in Amberg, which is one of the most advanced manufacturing plants in the world. Electronics producers like Siemens and equipment manufacturers like ASMPT SMT Solutions believe that further integration harbors huge potential. We want to deliver these improvements in efficiency and process reliability by offering a new generation of SMT solutions that effectively integrate the printing, inspection and placement processes.”

I think I should let Michael Brianda; Head of the ASM Assembly Systems Printing Solutions Division have the final words:

“The integration of the DEK team into ASM Assembly Systems and its new SMT Solutions business segment is progressing rapidly. The entire DEK team senses the great openness and dynamic attitude. We appreciate that we are part of a community that values customer orientation, quality and innovation. The new organizational structure also brings opportunities with it.”

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Synergies for Growth and Innovationby Keith Bryant, SMT Today’s Technology Editor



Advances in Aerosol Benchtop Cleaning Maximise Environmental Protectionsby Mike Jones, MicroCare Corporation

Two decades of environmental progress has profoundly changed benchtop cleaning in electronics. The first major global effort to protect the environment was the phase-out of ozone-depleting CFCs that began in the 1980s and was substantially completed by the turn of the century. Today, larger and more complex issues challenge the poor production engineer: the elimination of volatile organic compounds (which cause low-altitude smog in cities); the protection of water resources; global warming; enhanced worker safety and the economic pressures of the continuing contraction of product life cycles in electronics. ____________________________________

‘‘These conflicts may prevent companies from adopting universal cleaning procedures, potentially leading to inconsistencies in their production____________________________________

Different companies and communities each select different strategies to accommodate these issues. For larger companies with facilities in many parts of the world, this can often present a problem because the rules in one community may conflict with those in another region. These conflicts may prevent companies from adopting universal cleaning procedures, potentially leading to inconsistencies in their production.

This paper will highlight the problems caused by inconsistent regulations and recommend a three-step process engineers can use when searching for continuing improvements.

BENCHTOP CLEANING – BE CAREFUL WHAT YOU ASK FOR

Benchtop cleaning, also called ‘manual cleaning’ is superficially very simple, yet it is a challenging industrial process. This is because the requirements for successful benchtop cleaning are very different than

the requirements for a chemical to be used in an automated cleaning machine.

A cleaning fluid must meet a number of criteria to make it a commercially acceptable product for workers to use on the benchtop. It must have exceptionally good toxicity profiles because employees touch the cleaning fluid on a daily basis. Fluid should also be fast drying and with no aroma and preferably with no flashpoint. Of course, the cleaner has to be easy to use, easy to handle, easy to store, easy to dispose of and affordably priced. The cleaner must be powerful, but not so strong as to attack substrates and components being cleaned. There are not many chemicals that can meet all of these criteria.

On top of these performance requirements are new regulations being imposed around the world, inconsistently and often by regulators with little knowledge or interest in the particular problems of employees working on the benchtop or the companies that pay them. REACH in the EU, the GHS rules from the UN, the new CLP rules in Europe, the halogen regulations in Asia, and SCAQMD rules in California all limit the choices engineers make. These dynamic regulatory pressures are eliminating many otherwise promising chemistries.

Europe was the originator of the ROHS and WEEE initiatives, but those efforts pale in comparison to the European REACH program. This is a massive effort to detect previously-unknown health effects caused by chemicals and to control their use with the goal of improving public safety. REACH will, in a few years, touch every industry in Europe, requiring testing and analysis of every liquid, paste and solid material — including the inks on this page you are reading. It encompasses expensive compliance obligations; MSDS sheets will jump from a few terse pages only understood by experts to unreadable lengths only understood by experts. Due to the requirement of extensive toxicity testing, only well-established materials with well-understood toxicity profiles are likely to be used in the years ahead, probably stifling innovation.

The problem extends far beyond Europe. Both China and California are home to extraordinarily innovative people, but the evolving and uncertain nature of environmental regulations are a burden on companies in both areas. For example, simple containers of isopropyl alcohol are prohibited in California because of their VOC emissions. Recently the Chinese regulatory agencies published drafts of their new ROHS and GHS environmental regulations to bring their systems in synch with the global systems, but have added significant local rules that may, if fully implemented, make it very difficult and very expensive for companies to comply globally. ____________________________________

‘‘Both China and California are home to extraordinarily innovative people____________________________________

Another constraint is the current packaging and labeling requirements. Many countries now require safety labeling in local languages, which is a worthy goal. But there are 23 official languages in the EU. The unintended effect of this requirement is to push companies out of smaller markets, denying customers in those regions the benefits of innovative chemical technologies simply because it is not possible to get safety warnings in 23 languages on to a label.

Lastly, many regulatory decisions are made without considering the entire work flow. For example, in many locations the recommended cleaning fluid is water because it is deemed as ‘green’ and ‘environmentally safe’. This is an over-simplification, as water does not work in every application such as in benchtop defluxing. Furthermore, since burning fossil fuels to produce electricity is one of the main sources of greenhouse gasses, any migration to water-based cleaning will have the unintended and undesired effect of increasing greenhouse gas emissions.


Like it or not, increasing regulatory pressures are a fact of life and companies are going to have to adapt to them.____________________________________

‘‘in many locations the recommended cleaning fluid is water because it is deemed as ‘green’ and ‘environmentally safe’____________________________________

BETTER CHOICES REQUIRE NEW GUIDELINES

For busy manufacturing engineers, finding, evaluating and approving benchtop defluxers and cleaners is a time-consuming and expensive process. A few simple rules may help simplify the selection process:

1. Any alternative chemical selection should limit consideration only to commercially available materials that have long-term market viability. Materials subject to international regulatory scrutiny that could affect long-term availability should be avoided.

2. Engineers also must consider not just the chemical itself but the packaging in which it comes. While aerosols tend to be more expensive per litre, the benchtop aerosols offer several important advantages. Modern packaging can enhance the effectiveness of a cleaning fluid as well as minimize any environmental impact and improve worker safety. To make a solvent selection by simply comparing MSDS sheets, for example, is to miss a big part of the cleaning story.

3. Finally, engineers need to consider the cleaning process itself. The old-style ‘dip-and-brush’ cleaning is obsolete. Several manufacturers now provide cleaning tools designed to work and enhance their cleaning fluids. These tools can dramatically improve cleaning performance whilst reducing cleaning costs.

There is a recommended ‘one-two-three’ step to finding the newest cleaning options in today’s difficult regulatory constraints.

STEP ONE FIND A NEW CLEANING CHEMISTRY

Since the turn of the century, thousands of companies across the EU have selected cleaning fluids containing

‘volatile methyl siloxanes’ (CAS #107-46-0). This is a superior, although not perfect, cleaning choice.

Methyl siloxanes have an unusual combination of benign qualities. Distantly related to silicone, they are mild, fast-drying fluids that have almost no aroma. With an atmospheric lifetime under 30 days, siloxanes do not accumulate in the atmosphere but rapidly degrade into naturally-occurring chemicals. This means they have a negligible contribution to global warming and urban smog and, of course, do not attack the stratospheric ozone layer. (See the references, below, for more details.)

Siloxanes have an excellent toxicity pedigree. Variations on these fluids are found in cosmetics and other personal care formulations, often as carriers and emollients in antiperspirant, hair care and skin care applications. For technicians working on the benchtop, where skin contact is frequent, this is an important and unique advantage.

These fluids can be tailored to specific applications by the addition of small quantities of other ingredients. This makes them highly effective as defluxers, particularly for no-clean solders. Versatile, residue-free siloxane blends easily clean fluxes, pastes, organic residues, ionics, silicone-based conformal coatings, adhesives, grease and oils. Siloxanes will easily remove cured silicone conformal coatings and silicone adhesives. The cleaner will also temporarily swell silicone tubing without damaging its elosteric properties.

Siloxanes are also safe on components. As a nearly ‘universal’ cleaner it will not harm any substrate, material, connector or chip (except silicones), so it is popular in repair depots where the widest variety of materials are found. These fluids typically dry quickly, leave no residues and are non-corrosive.

But siloxane-based cleaners are not perfect. They are generally flammable, with a flashpoint about the same as isopropyl alcohol. This means they are not suitable for use in cleaning machines. In addition, some formulations are not strong enough to handle the toughest, lead-free fluxes which are soldered at the highest temperatures. In those instances, other choices will have to be found.

STEP TWO FIND A NEW PROPELLANT

Aerosol products have an undeserved reputation as being harmful to the environment. Today’s aerosols in the electronics industry have a proven record of innovation and environmental compliance. In addition, and unlike consumer products, most electronics aerosols are sufficiently expensive that they are only used in essential processes.____________________________________

‘‘Versatile, residue-free siloxane blends easily clean fluxes, pastes, organic residues, ionics, silicone-based conformal coatings, adhesives, grease and oils____________________________________

The most significant remaining problem with industrial aerosol products has been the propellant. In the past, ozone-depleting propellants were widely used because they were safe and nonflammable. When those options were phased-out, flammable propellants were deployed and even carbon dioxide was used by some companies. But all of these alternatives have immutable limitations grounded in chemical compatibility, physics, safety, economics or applications.

Recently several companies pioneered a new type of propellant, known as an HFO. This appears to be an excellent substitute for old-style propellants without the handling or packaging problems of flammables. Most remarkably, the material reduces the global warming impact 99.9% without compromising any other characteristics, such as flammability, aroma or performance.

Several large chemical companies are getting close to commercialising HFO or similar propellants. Some companies, including MicroCare, have begun small-scale packaging of electronics cleaners with these new HFO propellants, to test the market and confirm the commercialisation processes. Safety and environmental regulators have approved the HFO materials for use in Europe and North America. While prices today remain higher than the older alternatives, they are expected to decline as production volumes increase. Knowledgeable and concerned engineers looking for environmentally acceptable benchtop cleaners will


search for vendors deploying the latest in propellant technology to ensure their aerosols are leading the industry.

STEP THREE FIND A NEW DISPENSER

The king of benchtop cleaning has been, for years, the process widely known as ‘dip-and-brush’ cleaning. This involves using an inexpensive cleaning fluid – usually isopropyl alcohol – and an inexpensive brush and pump bottle to apply the cleaning fluid to the circuit board. It is now time for engineers to acknowledge that this particular king has no clothes!

The answer is found with controlled dispensing systems that attach onto the aerosol cans. Several companies market these tools, and all of them deliver faster and better cleaning, with less waste than the dip-and-brush method. They instill a true benchtop cleaning process using the universal four steps of cleaning: wet, scrub, rinse and dry. This process can easily be documented and standardised, even to ISO standards, which will improve quality across the board.

In addition, it has been documented that technicians use less solvent when they use

controlled dispensing technology. This is because the solvent is fresh and pure, and it is sprayed onto the exact location where it is needed. There is no over-spray from traditional, high-pressure aerosols, and no dirty solvent being thrown away.____________________________________

‘‘Another benefit of dispensing tools is that there is less waste____________________________________

Another benefit of dispensing tools is that there is less waste. Everybody has experienced an aerosol can of paint or hair spray that will not empty completely. This problem is completely eliminated with controlled dispensing systems. With these systems, some manufacturers even guarantee the aerosols will empty completely. This is a cost-effective method as technicians use all the solvent. In addition, it also makes it far easier to dispose of the cans because they are not partially filled with residual solvent.

In short, cleaning more boards with less cleaning fluid produces financial savings,

quality improvements and environmental benefits that everybody can appreciate.

CONCLUSIONS

These new formulations and cleaning tools represent a breakthrough in cleaning performance and environmental protection for manufacturing engineers. These are proven technologies with strong regulatory, safety, economic and performance approvals. None are a temporary fix that could put a user in jeopardy due to an unexpected regulatory twist.

New regulations may impose onerous burdens, but they also represent an opportunity to re-think manufacturing processes. Engineers should seek chemical vendors that understand international regulatory compliance and have developed answers for their customers to meet those regulations. Innovative, environmentally-progressive multi-national suppliers will help companies comply with new regulations, both domestically and internationally, and actually use this opportunity to go beyond the regulations and improve processes and reduce costs.

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JAVAD EMS: One of Silicon Valley’s “JEMS” by SMT Today Staff Editor

The Vice President of JAVAD EMS (JEMS) is Gary Walker, a true industry visionary. Prior to JEMS, Walker spent more than 20 years building executive management experience in the EMS industry. He co-founded SMTC Mfg. Corp. with his brother in 1989 in Toronto, Canada and led the expansion into the United States in 1995, opening a facility in San Jose, CA. Additionally, he held a corporate Executive VP position, helping grow the business to its peak of $850 million in revenue, with nine sites globally and more than 5000 employees.____________________________________

‘‘JEMS was founded to focus on low- to medium-volume, high-mix applications____________________________________

In 1998, while at SMTC, Walker met Javad Ashjaee, a small entrepreneurial startup looking for products to be assembled and that customer-supplier relationship blossomed into a working relationship and friendship that has lasted for over 16 years. After struggling to find a Tier 3 contract manufacturer (CM) in San Jose who could meet the dynamic requirements of Ashjaee’s new entity, JAVAD GNSS, they decided to create a Tier 3 CM three years ago and a new legacy was born. JEMS was founded to focus on low- to medium-volume, high-mix applications for customers who needed prototype through volume production and wanted to get it from one source. At the inception of the company, Ashjaee, JEMS’ President and CEO, joked with Walker that if they could build a CM that met his demanding needs and make him happy then they would have the formula to meet any demands from OEMs in the market. This became JEMS’ focus. They started by purchasing and opening a 40,000 sq. ft. state-of-the-art facility in San Jose, nestled in the heart of Silicon Valley. Today, JEMS is a thriving, full-service contract electronics manufacturer that provides leading-edge,

high-quality products for its customers.

At the time of this new venture in 2009, the market was flooded with old and used machines. But Ashjaee and Walker wanted a specialized facility that would not just get by but rather be one of the premier facilities in the United States. Also, at this time, the industry was laying off people and pulling back; however, JEMS was just starting and Ashjaee and Walker were willing to spend the money necessary to kick off a world-class, highly technological facility. “We could have put used equipment in at 10 cents on the dollar,” said Walker. “Instead we chose to buy the latest equipment on the market so that we would always be on the cutting edge.” For example, Walker explained that a year ago it was uncommon to place package on package (PoP) technology but today the company does place these on products they assemble because of the state-of-the-art Juki equipment they purchased in 2009. “A whole new machine set was not needed to deal with this technology, merely a change in process and not capital,” said Walker.

Financial stability is also an extremely important factor for Ashjaee and Walker. They consider it a key differentiator for an industry that is so capital-intensive to operate in. Everything in the business is owned including the building, land and every piece of equipment within the building. The company boasts numerous

Juki machines that perform from a few prototype runs to running at high-volume speeds as well as a Juki RS1000 reflow system complete with Nitrogen capability. Additionally, to ensure that quality is built into the product as opposed to trying to inspect quality into the product at the end, JEMS uses 3-D solder paste inspection from CyberOptics (SPI) after screen printing on every single board it produces, whether it is a five-piece prototype run or a multi-thousand piece production run. This guarantees that when the board gets to the Juki machines the solder paste is optimum prior to placement. After reflow, all products go through 100 percent automated optical inspection (AOI) and even automated X-ray inspection (AXI) with the latest X-ray innovations from Malaysia-based ViTrox Technologies. It also predominately uses Metcal’s rework and repair systems. As another way to ensure quality, the company recently ordered, and in the third quarter of 2014 will install, new equipment to support the assembly of large boards. This includes a Juki K3 screen printer, CyberOptics’ SE500-X solder paste inspection systems, Juki RX-6 placement system and a ViTrox 800 XL AXI system.

The high-tech systems that JEMS uses are highly flexible, allowing for diverse and complex products that use the latest in component packaging technologies to be assembled with quick changeover between products, enabling high-mix/low-

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World Class Folks!General Microcircuits (GMI) is a customer focused, global ad-vanced electronics company that manufactures circuit boards and integrated assemblies to support its customers from NPI through end of life. Founded in 1980 and headquartered in Mooresville, NC, GMI works in a diverse set of market sectors, including industrial, commercial, medical, energy, defense, telecommunications and emerging markets. GMI uses Juki solder paste printers and SMT placement systems in its NC and Costa Rica facilities.

“From the very first line of equipment that we purchased from Juki, they have made us feel like we are the most important customer they have. The thing I love about Juki is their Solid – Capable – Reliable equipment, combined with their world-class folks. There are others that do it right on the equipment side, but no one is in the same league on the folks side.”

Nick HarrisCo-Founder/CTO – General Microcircuits, Inc.www.gmimfg.com

Call Juki today to learn more about our outstanding reliability, service and support.

Global HeadquartersTokyo, JapanTel: (+81) 3 3480 1111 Email: [email protected]

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to medium-volume production. Additionally, the company provides customers a wide and varied list of printed circuit board (PCB) process capabilities, software and testing systems/capabilities such as (flying head probe (FHP) and in-circuit test (ICT) through the use of an Agilent 3070 tester because it knows that this is what its customers need to not only succeed in today’s manufacturing environment but to stay ahead of its competition. ____________________________________

‘‘In 2011, that number increased to approximately 135,000 PCBs and 2012 JEMS produced 215,000 PCBs____________________________________

EMS is very capital-intensive not only for the equipment but also for the working capital to fund full turnkey services for customers and, as a result, many EMS companies experience cash flow difficulty. This is not the case for JEMS — the company is very well financed for growth, regardless of customer demand. In 2010, the company produced approximately 60,000 PCBs. In 2011, that number increased to approximately 135,000 PCBs and 2012 JEMS produced 215,000 PCBs. Its year over year growth in 2013 and, based on current forecast/projections for 2014, is 40 percent. The unique structure of the business allows for builds from 5-25 boards/month up to 1000s/month and everything in between.

JEMS’ core business and strength is supporting those customers that demand high-reliability products, which includes customers in the segments covering military, aerospace, communications, medical and industrial. With customers having product applications ranging from those that are launched into space

to those that are used at the bottom of the ocean for oil exploration, quality and reliability is a must.

While the company’s focus is low to medium volume, it has the bandwidth to take on higher turn jobs. Unlike many companies that turn to China and Asia, JEMS strives to keep jobs in America and has increased its staff to more than 150. Walker also pointed out that JEMS is in this market for the long term to serve these industries and has no exit plan — in direct opposition to many other firms that sell out to conglomerates as soon as possible.

Additionally, because of the company’s state-of-the-art training and equipment, which also includes Aegis software to help run the factory floor, JEMS received ISO 9001, 13485 and AS9100 certifications in only two short years. On the floor, it uses a paperless system that includes monitors in front of each rework and repair station allowing for seamless transfer of information — an innovation that no other EMS company has. All this combines to provide the customer with cradle to grave traceability through every process. Every product is tested whether the customer requests it or not. “We want perfect boards every time,” said Walker.

“We may not be the biggest EMS company in the United States, but we strive to be the best,” Walker proudly claimed. Caring about its customers and suppliers as well as its employees is part of JEMS’ master plan and culture. Walker continued, “We are a family here and we have an interest in our employees’ happiness. We want this to be a great place to work.” Customer focus is also a high priority, with an emphasis on providing a service that exceeds expectations every time. This is shown in every way, down to the smallest details. For example, when calling JEMS there is no voice-automated system that requires extension numbers to speak to a live person. Instead, the front desk is always staffed and visitors are greeted with hot cappuccino.____________________________________

‘‘We may not be the biggest EMS company in the United States, but we strive to be the best____________________________________

Walker said JEMS’ business philosophy is to be “all things to a chosen few” and to do a great job for its customers. “Many years ago a prospective customer told me that all CMs make lemonade. He asked ‘what makes yours any different?’ Yes, we all make lemonade,” Walker concluded. “But our recipe now guarantees that we make it sweeter.”


World Class Folks!General Microcircuits (GMI) is a customer focused, global ad-vanced electronics company that manufactures circuit boards and integrated assemblies to support its customers from NPI through end of life. Founded in 1980 and headquartered in Mooresville, NC, GMI works in a diverse set of market sectors, including industrial, commercial, medical, energy, defense, telecommunications and emerging markets. GMI uses Juki solder paste printers and SMT placement systems in its NC and Costa Rica facilities.

“From the very first line of equipment that we purchased from Juki, they have made us feel like we are the most important customer they have. The thing I love about Juki is their Solid – Capable – Reliable equipment, combined with their world-class folks. There are others that do it right on the equipment side, but no one is in the same league on the folks side.”

Nick HarrisCo-Founder/CTO – General Microcircuits, Inc.www.gmimfg.com

Call Juki today to learn more about our outstanding reliability, service and support.

Global HeadquartersTokyo, JapanTel: (+81) 3 3480 1111 Email: [email protected]

American HeadquartersMorrisville, NC, U.S.A.Tel: (+1) 919 460 0111 Email: [email protected]

European HeadquartersSolothurn, SwitzerlandTel: (+41) 32 626 29 29 Email: [email protected]

www.jas-smt.com

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eTech-WEB Promotes Selective Solder Solutions by Thinking Outside the Boxby SMT Today Staff Editor

eTECH is a leading company in the market of BGA reballing

Based in Round Rock, Texas, eTECH-WEB, Inc. builds, repairs and upgrades printed circuit boards (PCBs) with quality, value and exceptional customer service. A leading tech company in the market of ball grid array (BGA) rework and reballing, it has been serving OEMs, contract manufacturers, telecom, aerospace, high-tech industry, higher education organizations and government since

2003, and its customer base ranges across the United States, Europe and Asia. A company of 20 employees, eTECH also provides high-mix PCB assembly and prototyping solutions.

eTECH was founded on the principal that the company strives to provide superior quality, service and value. In today’s economy, these qualities are just as important as fast turnaround and low prices because today’s business owners know that quality and service are the keys to success. The company stands behind all work performed. Its process and methodologies are the foundation of its quality. With more than eight years of experience in the BGA business, it provides a well-defined and repeatable process that allows the company to exceed its customers’ highest expectations. Additionally, eTECH will help provide solutions to any needs that its customers have. “No job is too small and we do not have minimum per job charges,” said

Logan Willis, the company’s VP, Technical Sales. “We will communicate to ensure that each job requirement is well defined.” He continued to say that regardless of how well eTECH does its job, if it cannot offer better value, the company cannot survive. Its goal is to understand each and every aspect of its customers’ projects and to add value to the entire process.____________________________________

‘‘No job is too small and we do not have minimum per job charges____________________________________

Today, it is important to stand out from competition. eTECH does that by providing numerous specialties, including the fact that it specializes in difficult BGA repairs, offers full-scale production capacity BGA-

From L to R: eTECH’s Logan Willis, Juki’s Bob Black and Chris Guest, and eTECH’s Greg Berry

reballing and routinely works with quantities of 1-1,000. The company also has in-house expertise to solve challenging BGA problems as well as fine pitch QFN, LGA and other leadless device attachments. eTECH truly makes customers its top priority and, as a result, always provides a cost-effective outsource solution and the best response time available.____________________________________

‘‘The CUBE system has been up and running successfully in the eTech facility for several months____________________________________

This focus makes the company a good fit with Juki Automation Systems, who constantly puts customers first and designs systems to meet – and exceed – customer demands. One of Juki’s newest technologies, the CUBE.460 Selective Soldering System, has recently become available for sale, and eTECH is its first customer.

“We like to think of ourselves as early adopters. Being the first customer to purchase the machine gave us no pause because we typically ride on the leading edge of technology and processes. This is just an extension of that attitude,” said Willis.

The CUBE is the first new machine that the company has purchased from Juki, although it has been using the company’s pick-and-place equipment for the past six years. “We certainly knew from Juki’s existing line of pick-and-place machines that its products are very high quality. When we started looking at selective solder equipment, we actually did not even know that Juki made them,” continued Willis. “But after looking at some competitors, we came to understand that Juki had the new CUBE line of selective solder machines coming out and we started investigating. The Juki team came to us and explained the systems’ capabilities and we were impressed enough to fly out to their North Carolina Factory to meet their technical staff and see a machine in operation. At that point, we knew that this was the machine for us.”

Willis added that because eTECH has firsthand knowledge of Juki’s technology being fast, reliable and easy to use, it was an easy transition to use the company as a vendor for its production equipment. eTECH is a high-mix facility so the equipment must be able to change quickly to meet customer

needs. “The Juki machines are really good at accommodating that,” said Willis.

The CUBE system has been up and running successfully in the eTECH facility for several months. Willis mentioned that there are new upgrades coming as well. He also said that the machine allows eTECH to push more products through the door by increasing efficiencies by as much as 2X, which helps its customers move quicker than ever.

Juki’s CUBE.460 Selective Soldering System’s low cost and small footprint uses the same soldering technology found on Juki’s larger platforms while offering a superior ROI of 6-12 months. The CUBE.460 sets the new standard for mini-wave soldering systems. The unique batch platform offers excellent flexibility for through-hole applications. The system can be configured with a single nozzle or dual nozzle for increased flexibility and it supports an easy-to-use exchangeable solder pot for dual alloys. The CUBE.460 comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles including wetted nozzle tips and non-wetted nozzles, a live viewing camera and fast-reacting Quartz IR bottom side preheater, making it good value for the price.

eTECH is in good hands with the Juki service and support team, which is the largest in the Americas. As part of the purchase, the company receives installation and training, one year parts and labor warranty, and one week of advanced process training to be

used anytime within the warranty period. Additionally, there is no charge for attending any regularly scheduled training course at Juki facilities, free machine software upgrades for life of the system and free 24-hour phone support.____________________________________

‘‘As part of the purchase, the company receives installation and training, one year parts and labor warranty, and one week of advanced process training to be used anytime within the warranty period____________________________________

“Juki’s Regional Sales Manager Chris Guest has been great to work with. The guy that really has shined for us, however, has been Juki’s Selective Soldering Applications Engineer Bryce Timms. He is very knowledgeable of the Juki production line and a true problem solver. This support and service, combined with Juki’s quality, value and low-cost guarantee, has made Juki an ideal strategic partner for eTECH,” concluded Willis.

Juki’s CUBE.460 Selective Soldering System helps eTECH push more products through the door quicker


KurtzErsaNAOffersIdealEntry-Level Soldering Station

The superior heating of the i-Tool PICO technology ensures precise control (temperature variation < +/- 2°C) of the soldering tip temperature and allows for the independent change of the soldering tip and heating element. This minimizes the costs in wearable parts. Additionally, standby and sleep functions reduce energy use and tip wear during work breaks.

The unit has a LCD display and two control buttons. Safe and simple configuration of the soldering parameters, i.e. three fix temperatures also be achieved using a microSD card and PC software. The i-CON PICO is the ideal station for ambitious hobbyist and professionals electricians who do not require ESD-safe equipment.

ViscomIntroducestheNewSoftwareReleaseSI7.47

Viscom paste print inspection (SPI) with advanced downlink function. In addition to fast and reliable paste print inspection, with the Quality Uplink Viscom also has created a comprehensive package for process optimization. An integral part of the software is the closed-loop feedback to the paste printer. Here, the SPI provides information about the paste print, and if the print image shifts during production, can bring about an automatic correction of the print. Furthermore, because of the evaluation of the print image, it is possible to optimize the cleaning cycle and adapt it to specific needs.

The Release comprises the Closed-Loop Interfaces to MPM and Panasonic printers as well as extended connections to DEK and Ekra printers. With automatic print direction recognition, the print process is now also supported without barcodes.

Data I/O Introduces PSV3000 Automated Programming System for Asian Markets

The PSV3000 automated programming system is the cost-effective entry point for high-quality Data I/O programming. The PSV3000 delivers trusted performance, high reliability and local support at a great value.

“We are pleased to introduce the PSV3000, the high quality automated programming system at a cost effective price,” said Ching Ma, General Manager, Data I/O China. “The PSV3000 is designed by Data I/O’s local China engineering team to meet the needs of Chinese and Asian local manufacturers moving from manual to automated programming. With local labor rates rising, the PSV3000 significantly reduces the total cost of programming compared to a manual programming process while delivering the highest quality.”

The PSV3000 is capable of delivering up to 1000 parts per hour in tape and tray configurations in a small footprint. The PSV3000 supports up to 16 individual programming sockets and supports all device types, including FPGAs, CPLDs,

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Microcontrollers, and flash memories (including Serial Flash, eMMC, NAND and NOR devices). Existing Data I/O customers can leverage their installed base of FlashCORE III adapters, software, and algorithms with the PSV3000. Data I/O Serial Number Server Software is also supported on the PSV3000. All Customers are supported by Data I/O’s global service and support network, with over 25 engineers and service technicians in China.

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Cogiscan’sNewGenealogyModule Provides Complete Traceability

With the Genealogy Module, one or several serialized PCB assemblies, serialized sub-assemblies, and other components that are tracked at a lot number level, are assembled together during final product assembly. The Cogiscan traceability database captures the identity of each individual PCBA, sub-assembly and other items. This information is linked directly to the serial number of the finished product. It is possible to drill-down to multiple levels of sub-assembly, for example to identify which component lot numbers were used to build a specific PCBA in a specific product serial number. Also, it is possible to search the traceability database backwards to identify which product serial numbers were built using a specific component lot number.

The new module provides a higher level of traceability by allowing multi-level box build traceability and improves inventory control with real-time visibility of all materials in process (WIP). Additionally, it reduces manufacturing, warranty and customer service costs, and improves product quality with automated quality control.

____________________________________

Metcal Launches Cost-EffectiveSolutiontoReworkComplexandSmallComponents

“The popularity of 01005 components has generated a new rework challenge making it virtually impossible unless carried out by expensive rework equipment,” said Paul

Wood, Advanced Applications Manager at Metcal. “This kit, added to a hot air pencil, provides a complete and effective solution for reworking most small components at a low cost.”

Reworking small chip components such as 01005, 0201, 0402 and 0602s can be difficult and require specialized tools. The Solder Ball Placement Kit includes the tools necessary to rework small chip components.

Thekitcontains:

• 2000 each of .04mm, .06mm, .08mm, & .10mm solder balls with container

• Four ESD-safe carbon fiber reinforced oilers; black 0.2mm, blue 0.3mm, green 0.5mm, and red 0.8mm

• One part positioning matrix and squeegee

• One PEEK spudger

• One bent tweezers

• One half tweezers

• One 5000 grit sharpening stone

____________________________________

Gen3 Systems Announces the Next Generation of Solder Saver

The design changes include a separate activation switch, enabling the user to hold the system in one hand and activate it with the other and an adjustable handle for the sometimes awkward to reach solder pots in wave soldering machines.

The Solder saver offers companies ‘wave soldering’ the opportunity to rapidly recycle dross created in the wave solder pot, thereby saving up to 50 percent in new solder bar purchases. The handheld, lightweight Solder saver scoops hot dross up from the surface of the wave solder pot. Dross oxides are swiftly separated from the solder by the Solder saver’s unique high-speed rotary process system.

The Solder saver works on a continuous process basis, meaning no lengthy and costly operator delays while the recycling operation takes place. Typically the complete process is as fast as any conventional de-drossing operation, but with the added advantage of reduced handling of toxic and weighty materials.

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A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Pasteby Karl Seelig, Vice President Technology and Tim O’Neill, Technical Marketing Manager, AIM Solder

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and µBGA components will be the focus of the test utilizing optimized aperture designs. The test procedure will evaluate pause-to-print and volume transfer efficiencies on twenty boards over an eight hour period. A concurrent study utilizing the same boards will evaluate the impact of powder particle size on voiding of QFN ground pads testing eighteen different aperture designs.

Introduction

With components such as QFNs, µBGA and 01005 passive devices with small lead areas and corresponding pad geometries, it is possible that Type 3 solder paste is too large to permit accurate and repeatable solder paste deposition. This issue impacts all facets of the manufacturing process, not limited to which solder paste should be used when assembling PCB utilizing these components.

1) Paste Printing

It has been a held assumption that the smallest aperture a solder paste can pass through repeatedly is five times the largest sphere size of the metal powder. In Type 3 powder the average sphere size is 45um

with allowances to 53um. Theoretically, an 8.9 mil aperture is the minimum aperture that can be printed with Type 3 solder paste.

2) Stencil Design

There are myriad aspects when considering the proper stencil design for a given assembly. For the purposes of this experiment, the goal was to keep the variables to a minimum in order to ensure the results obtained reflected the aspects under our control.

Electroformed nickel stencils (e-form) are considered the most capable available technology. They provide the taper, wall smoothness and lubricity that lend to the best paste release characteristics. However, they are significantly more costly than traditional laser cut, electropolished stencils and may not be as readily available.

“Laser-formed” stencils are a relatively new option. These stencils are cut using upgraded lasers in combination with high nickel content foil materials. They represent an improvement over standard laser cut stencils at a lower cost than e-form. These two technologies were utilized in this experiment.

Finally, an emerging technology termed “nano-coating” has been made available in some markets. This technology and process are largely proprietary, but the process is described as follows:

“After the brushing and cleaning operation the laser cut stencil runs through a special designed coating machine. The inorganic coating is dissolved in a very environmental friendly solvent. The constant thickness of the nano-coating is the key technology of the coating process. In a continuous furnace the coating is dried out, and a multiple stage heat treatment polymerizes the dry inorganic layer. In the same

equipment a chemical reaction with an organic chemical is carried out to provide the hydrophobic anti adhesion properties.”

The main function of the coating is to reduce the surface tension between the paste and the stencil material. A reduction in surface tension creates a non-stick surface, facilitating better paste release, resulting in more consistent paste volume deposits and less residual paste in the aperture, thereby aiding in volume deposition accuracy in subsequent print cycles.

A stencil identical to the laser formed stencil was nano-coated using Laser Job in Germany and included in the experiment. Aperture designs were optimized for paste volume deposition.

Stencil Specifics:• PHD stainless steel• Thickness tolerance is +/- 3 or 4%• Hardness is 370 HV min• Flatness: max edge wave 1.5mm and

max centre wave 0.50mm• Grain size is typically 10-25 microns

A fiber diode type laser was used to cut the stencils.

Gantry Style Motion System:• Resolution 10 nanometer, • Repeatability .5 micron

Operation and Connections:• Auto-focus

Laser:• 150W fiber laser system, air cooled• Permanent align beam delivery• Compressed air cutting• Class I laser system

The experiments were conducted at AIM Montreal Production Simulation Facility.

Equipment Utilized:• DEK 265 GS• Quad QSP IV• Heller 1500• Koh Young SPI - KY3020T

Lab Process:• Temp : 22-23°C• Rh: 24-26%• Squeegee: 12 inches • Squeegee pressure: 0.8 lbs • Speed: 1 inch/sec

Materials Utilized:• No Clean SAC305 T3 Solder Paste A • No Clean SAC305 T4 Solder Paste B • No Clean SAC305 T5 Solder Paste C• No Clean SAC305 T3 Solder Paste D

(modified for better printing)• No Clean SAC305 T3 Solder Paste E • BGA Stencil• Laser Cut 5 Mil• QFN LGA Stencil• Laser Cut 5 Mil• Electroform 5 Mil• Nanocoat 5 Mil• Nanocoat Laser Cut 5 Mil• Proprietary Coated Laser Cut 5 Mil

Typical Laser Cut Stencils

Round BGA Aperture20mil pitch / 10 mil padWidth (x): 0.254000mm Length (y): 0.254000mmArea: 0.0354838mm

Square BGA ApertureWidth (x): 0.254000mm Length (y): 0.254000mm Area: 0.0645160m

Test Method

The test method was developed to simulate a low-to-mid volume production environment with pauses between print cycles at regular intervals. Volume and height measurements were taken immediately following completion of printing of the test board.

Boards 1-5 were printed and measured, the process paused for 30 minutes. Boards 6-10 were printed and measured, the process paused for 60 minutes. Boards 11-15 were printed and measured, the process paused for 90 minutes. Boards 16-20 were printed and measured

Type 3

Type 4

Type 5

Solder Paste Chemistry Interaction

Observations

These results indicate that neither mesh size nor stencil type have a significant impact on the volume of paste released from the stencil aperture.2 The paste deposit may have a different appearance visually between types, but the critical measure of volume is unaffected.

This was somewhat surprising as it was believed that e-form stencils and paste

manufactured with Type 4 powders would provide the most consistent paste release characteristics. To further develop the data, an additional variable was introduced to determine the impact of paste chemistry on the deposition volume. A developmental solder paste material was introduced to the experiment for comparison and the following results were obtained.

As evidenced in the data, paste chemistry/rheology has a more profound effect on release characteristics than either stencil or powder mesh size.

Observations

The impact of nano-coating on the release characteristics of solder paste from stencil apertures was the single biggest variable in improving release volume consistency.

Testing was performed with the addition of a solvent deemed compatible with the paste chemistry in use to asses the impact on the release characteristics.

Observations

The addition of a solvent to the underside wipe cycle of a stencil printer has a moderately positive effect on the release volume of the paste from the stencil aperture.

Conclusions

The variables that have the most significant impact on paste release on fine pitch apertures are listed below in order of significance:• Stencil Type (nano)• Paste Chemistry/Characteristics• Stencil Wipe (solvent wipe

compatible with paste)

Nano-stencil technology has a profound impact on the performance of paste release. This is an emerging process with many competing technologies under development.

Following nano-coating, paste rheology and chemistry are areas of continued development by solder paste manufacturers. Lead-free solder pastes are still relatively new in comparison to their leaded predecessors and continued improvements are expected as the technology matures.

The introduction of solvent to the printer stencil wipe process is a relatively inexpensive process improvement with few negative side effects assuming the material is deemed compatible with the solder paste in use.

Based on these findings, it can be inferred that stencil design and materials have a far greater impact on release characteristics than paste powder mesh size.

Acknowledgements

AIM would like to thank Stentech for their contribution to this study.


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Industry News Keep up to date with what’s new

With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

Computrol Installs a Second KISS-103 Selective Soldering System at Its Utah Plant

The KISS-103 comes standard with universal PCB location rails with motor driven adjustment, a heated Nitrogen inerting system, manual fiducial alignment, and the KFS-DJ Automated DROP JET Fluxing System. The fully configured automated selective soldering machine features the new high-speed Z-axis, which translates into an additional 20 percent increase in production speed for Computrol.

“ACE has done a great job with the new version of software for the KISS machines,” said James Spencer, Computrol’s Engineering Manager. “It is easier to use and programming is much quicker. You can make changes on-the-fly and see the results right away. We get the same great results as we have been getting with our existing machines with speed and repeatability upgrades.

____________________________________

SMTA Ambassador Reception toBeHeldduringSMTAI

All SMTA Ambassadors are invited to the reception and meeting. A special pinning

ceremony will take place as well as an exchange of ideas for future growth and promotion of the SMTA membership and ambassador program. New members or interested parties are welcome to join the reception to learn more about the SMTA Ambassadorship. Reservations are necessary to join this meeting in order to arrange entry.

Surface Mount Technology Association (SMTA) ambassadors are representatives of the network who seek to grow membership. All ambassadors should understand the mission statement of the SMTA and know the general membership categories and benefits offered. The Ambassador Program has been implemented with the same spirit of volunteerism that the SMTA was first founded on. It is based upon “spreading the good word and providing good will” to all potential and future members of the SMTA globally. Michelle Ogihara is the founder and chair of this program.

____________________________________

BTUSponsorstheSMTA’s30thAnniversary Celebration

The SMTA will celebrate 30 years of building skills, sharing practical experience and developing solutions in the industry. SMTA members will come together to celebrate with an anniversary dinner and Oktoberfest

party during SMTA International 2014 conference and exhibition.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations. For more information about the SMTA, visit www.smta.org.

BTU International has been a corporate member of the SMTA since 1994. The company originally joined to learn more about the industry and for networking purposes. Now in its 20th year as a member, BTU has greatly benefited from its corporate membership.

____________________________________

Acculogic Inc. Appoints SeveralNewRepAgencies

Acculogic has engaged the sales services of Contech Marketing to cover parts of New York State, New Jersey, Delaware and Pennsylvania. Also on board, EQS Systems will cover Michigan, Kentucky, Indiana and Ohio; Cope Assembly Products will handle sales efforts in Maryland, Virginia and West Virginia; and Testech Inc. will cover Oklahoma, Arkansas and Louisiana.

Greg LeBlonc, Acculogic’s Product/Sales Manager, said, “We have made a significant move forward in increasing our sales coverage and building a knowledgeable and effective sales force to represent Acculogic throughout the United States. We will continue to increase our regional sales coverage and we are actively looking for representation in a number of other areas.”

____________________________________

http://www.smta.org

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Sono-Tek Corporation AnnouncesNewClean Room Rated Laboratory Facility in China

The laboratory will be focused primarily toward Sono-Tek’s medical device coating systems such as stent and balloon catheter coating equipment, as well as many nano-research applications. Sono-Tek President Steve Harshbarger stated, “The new China-based facility is our first clean room rated laboratory. The rapidly growing demand for high-quality medical devices in China has made this a logical place for expansion of our worldwide laboratory capabilities. Sono-Tek already has a very large customer base in China for stent coating systems. This new site will allow China-based customers easy access to test our next-generation stent and balloon coating machines, as well as our latest thin-film coating equipment.”

____________________________________

STI to Exhibit One-Stop Contract Manufacturing and Training Services at SMTAI

STI’s Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full-service design review and preproduction facility. STI’s Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).

STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds

these classes around company-specific standards and specifications. STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and cable harness to NASA-STD-8739.1, .2, .3 and .4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials ranging from chip scale and BGA to through-hole and terminal attachments.

____________________________________

Saline Lectronics Increases SMT Capacity

In addition to the Juki mounters, Saline Lectronics also purchased a DEK Horizon 03iX printer with Hawkeye 2D inspection, two PROMATION ERB-700 Buffers and two MIRTEC MV-7XI In-Line AOI systems. With the two new AOIs, Saline Lectronics now utilizes seven AOI systems in order to 100 percent inspect all SMT placements.

This new equipment helps to increase Saline Lectronics’ overall throughput and speed, while drastically improving efficiency within SMT. Helping to reduce changeover time, manufacturing technicians will be able to rely more on these intelligent machines.

The two Juki FX-3RA High Speed Modular Mounters will be installed on two of Saline Lectronics’ SMT lines and will allow each line to place an additional 66,000 parts per hour. Placing components from 0402mm to 33.5mm, these new FX-3RA machines support everything from capacitors and resistors to ICs and BGAs. They also have improved placement accuracy as they utilize laser recognition instead of cameras. Supporting Saline Lectronics’ intelligent feeder program the Juki FX-3RA’s also integrate seamlessly with the Cogiscan TTC System.

“We have been incredibly fortunate to experience tremendous growth over the last year. In order to keep up with this progress, as well as better prepare for the future, we

felt it was essential to procure this new equipment. I am thrilled that we will increase our capacity while simultaneously becoming more efficient to further streamline our SMT department,” commented Jason Sciberras, Manufacturing Manager.

____________________________________

ACD Increases Burn-in Capacity and Ramps up End-Consumer Support

The warehouse was expanded to meet the need for surplus raw materials as well as finished goods that support end-customer fulfillment and reconditioned finished goods that support customer RMA requirements. ACD’s team works very closely with its customers to develop an accurate test for each assembly. The added space will better support ACD in providing quality, defect free assemblies.

Additionally, ACD has expanded its end-consumer support, offering worldwide product fulfillment to its customers’ end-consumers. The company now provides worldwide RMA support with quick turnaround and cross shipping. The service includes domestic on-site service and repairs.

industry news continued...

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Paths Taken by Businesses to Streamline Overseas Factoriesby Yusaku Kono, Marketing Director, JAPAN UNIX Co Ltd

China, known as the “world’s factory,” has reached a turning point. What choices are being made by businesses with overseas factories in turmoil? A look at overseas production when survival is on the line.

In this era of advancing globalization, relying solely on factories in specific regions makes survival a difficult prospect. Even in the culturally mixed manufacturing industry, differing business practices can result in considerable trouble for the stable provision of products.

Soldering technology is indispensable with the advancement of electronics in fields including automobiles, home appliances, and digital equipment. This article examines ways to streamline and optimize soldering in overseas factories as well as resulting benefits.

Figure 1. Labor costs are soaring and good workers are hard to find. The world is facing a turning point regarding the streamlining of overseas factories.

World’s Factory?

Backed by a billion-strong cheap labor force and massive consumer market, China has amassed so many factories that it is known as the “world’s factory.” However, it has now reached a turning point due to the rapid economic growth of recent years.

Over the past decade or so, rising levels of education have led to a decline in manpower for manual labor. As a result of soaring labor costs, the advantage

offered by the cheap labor force is no longer what it once was. In the wake of the growth of Chinese-owned businesses and improvement of production technology and worker standards, the mobility of individuals within the labor market is increasing, and it is becoming increasingly difficult to acquire high-quality personnel.

Three Options

Broadly speaking, businesses are responding to this state of affairs in one of three ways. The first is to realize a high-quality, high productivity production line while remaining in China. The billion-strong Chinese market is still attractive, and production in that market will also be a major advantage from a sales standpoint. However, soaring labor costs are an urgent problem. The “low-quality, low-cost” situation in China is changing. In order to survive in China, many businesses are producing varieties of equipment with greater added value and shifting toward high margin sales models while reining in labor costs by partially automating existing processes.____________________________________

‘‘Broadly speaking, businesses are responding to this state of affairs in one of three ways____________________________________

The second solution is to relocate to a region with cheaper labor costs. Recent years have seen an increase in expansion to locations such as Southeast Asia, Bangladesh, and Myanmar. For a time, the cheap labor force can bring about a reduction in production costs. However, the education levels and stabilization of quality accumulated in China over the past 10 years will need to be built starting from scratch. When reinvestment in education and infrastructure are taken into account, reduction of production costs becomes less likely.

For this reason, there is a trend toward automation of the production line from

the very beginning in the most recent developing nations. ____________________________________

‘‘high labor and material costs are an obstacle____________________________________

The third solution is to return from overseas to home country. For production in homeland, high-quality materials and components are easy to acquire, and infrastructure is in good shape. Moreover, the levels of education are far beyond those for overseas production. However, high labor and material costs are an obstacle.

In this case, full automation is assumed from the start of business and the requirement for few or zero personnel makes it possible to construct a system for 24-hour operation. This trend has been seen recently in North America, Japan, Korea as well as other developed nations.

No matter which path is taken, “streamlining” of production is unavoidable from a variety of respects. In particular, as products become more highly functional and soldering becomes more complex, know-how regarding “automation” entailing more than robots alone has come into the spotlight.

One Chinese Factory’s Automation Solution

Even in the Chinese market, which has grown through cost competition, the increasing trend toward premium products is unstoppable. Consumer confidence has increased and the Chinese public is demanding better products, with consumption focused on products with high added value. In order to make the most of existing production lines and ensure stable production of high value added products, a division of roles between people and robots is imperative.

At one Chinese EMS factory, soldering was performed by hand on a scale utilizing hundreds of workers. However, significant environmental changes such as rapid market growth and increase in circuit board density far outpaced

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the speed of personnel education. For this reason, several dozen desktop form robots were introduced, and a cell manufacturing-based soldering system was implemented, transferring surplus personnel to processes unlikely to impact product performance such as assembly. With people no longer responsible for soldering operations, advanced skills are not required and product quality has become more uniform.____________________________________

‘‘Reducing workers and skills also led to a reduction in costs of greater than 50%____________________________________

In addition to the miniaturization of connections, the increasing density of circuit boards has made weight management essential. For this reason, high precision feeding equipment was installed. Being able to feed 0.6mm of 0.15mm diameter solder wire enabled weight management with a precision of less than the amount of solder for a single point, a mere 0.1mg.

The resulting reduction in the number of workers by roughly half and the reduction of required skills also led to a reduction in costs of greater than 50%. At the same time, production quality with a quality rate over 99% was achieved.

Figure 2. Overseas factory after introduction of the UNIX 41S.F partial automation, the versatile desktop robot UNIX 41S series enables quick start up.

UNIX 41S

The UNIX 41S series features a desktop form factor, and is specialized for rapid introduction and start up. The series offers easy operability and delivers high-quality soldering without requiring advanced knowledge. It has been widely adopted for a broad range of manufacturing purposes, including automobiles, household appliances, smartphones and renewable energy, and is capable of supporting virtually any soldering need when paired with options. One thing that must be paid attention to when setting up an automation line in a new region is maintenance and control of the quality rate. In addition to equipment robustness, management of the initially configured soldering conditions is an important factor in determining whether it will be possible to maintain the initial quality rate.

One new factory in Southeast Asia has adopted the UNIX-413S. It comes equipped with a position correction mechanism and corrects the solder position of the iron tip with a precision of 0.05mm. Incisions are also made into solder wire to prevent flux dispersal and solder balls. As a result, the initially configured conditions are maintained, making it possible to maintain a high-quality rate.____________________________________

‘‘The series offers easy operability and delivers high-quality soldering without requiring advanced knowledge____________________________________

When implementing partial automation, condition management must be sensitive to maintenance and environmental changes. Unless causes of change are understood and resolved flexibly by the equipment, line stoppage and management personnel increases and resumption of operations ultimately will make cost increases unavoidable.

Figure 3. SOLDER MEISTER UNIX 413S. For implementing full automation, the UNIX 413S reduces tact time to 1/3, and simultaneously automates picking, component insertion, and soldering.

UNIVERSE S

The state-of-the-art soldering robot UNIVERSE S (Universe Series) positions the circuit board between a scalar robot above and articulated robot below. It automates electronic component picking, board insertion and soldering as a single sequence. In the traditional process model, four processes (component insertion, board setting, inversion and soldering) are performed by a number of workers. In contrast, the UNIVERSE S takes advantage of two types of robots to integrate component insertion, setting and soldering into a single process.

As a result, at the Japanese factory of one automotive component manufacturer, the UNIVERSE reduced a 150-second mounting process to roughly 55 seconds, one third of the previous time. The installation area also was reduced to a third of what it had been. Additionally, the uniformity offered by automation along with the image recognition-based error detection feature reportedly led to an increase in the quality rate of the soldering process to almost 100%.

In Japanese factories, unmanned, 24-hour, full automation is ideal. The UNIVERSE S is an ideal product, achieving full automation that simultaneously delivers significant quality rate improvements together with a reduction in operating space.


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| SEPTEMBER/OCTOBER 2014 ISSUE Tampa, FL • Seymour, CT • Poole Dorset, UK • Rocheseviere, France • Shanghai, China

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MW/SP/19/SMTAI-SMT Today.indd 1 8/28/14 6:50 AM

Enhancing the Electronics Manufacturing Experience – A Real Solution for Traceability, Process Control and Quality Improvements by Davina McDonnell, Saline Lectronics Inc. & Mitch DeCaire, Cogiscan Inc.

Saline Lectronics recently partnered with Cogiscan to implement their innovative Track, Trace and Control System throughout Saline’s 110,000 square foot manufacturing facility. Thoroughly committed to being a Solutions Provider in the EMS industry, this new system will allow Saline to offer customers detailed end-to-end traceability of product flow at every step of the manufacturing process.

As electronics technology advances to complex micro-components and to placing systems in harsh or human-critical environments, the need for thorough traceability during manufacturing is essential. Not only is this traceability necessary for the end-user to ensure that their product is safe and reliable, but it’s extremely helpful to the manufacturer in order to better regulate process and quality controls.____________________________________

‘‘Saline Lectronics chose to partner with Cogiscan for the Track, Trace and Control System____________________________________

One of the most advanced solutions available on the market for EMS traceability is Cogiscan’s Track, Trace and Control (TTC) System. The TTC System provides visibility and verification of materials and product status throughout the entire manufacturing process – showcasing real-time data of work-in-progress, implementing a check and balance alert system to remove human error and offering a history of component lifecycle and traceability in the event of a recall. Looking to provide the most comprehensive data to customers that require it, while also improving quality control throughout the factory, Saline Lectronics recently installed this TTC System in its static-controlled manufacturing facility in Saline, Michigan.

“Saline Lectronics chose to partner with

Cogiscan for the Track, Trace and Control System in order to provide a greater level of traceability to customers who require it on different assemblies,” commented Mario Sciberras, President and CEO of Saline. “Overall, implementing the system was an easy decision for me because of the holistic, factory-wide benefits it provides to our manufacturing team. I am very encouraged by the advanced level of data collection and process control that we will receive by utilizing TTC.”____________________________________

‘‘the new reports will give Saline’s customers an actual snapshot of an assembly’s progress____________________________________

The traceability system at Saline is currently running on 2 Juki hi-speed surface mount lines, 5 automated optical inspection machines, repair cells, as well as hand assembly and test stations. At each location the TTC System tracks every component that is used on a circuit board assembly. Tracked by the unique serial number on each PCB assembly, this system records every component required for a product including the PCBA plus each individual electronic component. In addition, the system is tracking the operator at each process station, how much time spent at each cell, and the actual work performed.

Prior to implementing this system, Saline was able to offer traceability per job lot. Now with all of this new data being tracked by Cogiscan, Saline can provide customers in the TTC Program with more granular data – including traceability to the reference designator. This will be key for many of Saline’s clients in the medical and aerospace markets as they typically require rigorous traceability efforts.

For customers enrolled in the Cogiscan Program, Product Traceability Reports detail each part number, the lot number utilized and the exact reference designator placement of each part number for the tracked assembly.

Post SMT Operations, the Product Traceability Report shows a time-stamped summary of all remaining manufacturing operations including exact cell locations. This report also provides access to the test & inspection results, and lot code traceability data for the manually added components.____________________________________

‘‘Beyond SMT, the Cogiscan system will also help correctly route an assembly through the plant____________________________________

Beyond showing component traceability to the reference designator, Saline can now offer real-time information by providing WIP reports. When driving for a spike demand, these new reports will give Saline’s customers an actual snapshot of an assembly’s progress through the manufacturing plant thus allowing them

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to provide real updates to their end users. These real-time WIP reports also display operational yield data to help the production team recognize and react to corrective action requirements immediately.

In addition to providing real-time data, this new TTC System allows Saline to enforce a more thorough check and balance system with alerts in order to help prevent human error. Utilizing RFID Smart Feeder technology within the SMT equipment, Saline now supports automated and closed-loop validation of machine set-up and replenishment. These built-in alerts at SMT will notify operators when a reel is close to running out, or when the incorrect reel is loaded. If an incorrect reel does get loaded, the system will actually stop the line from running thus preventing any wrong parts from being placed on the circuit board assembly.

The above snapshot from the Cogiscan system shows the operators visibility of all SMT lines. The yellow square on SMT Line 1 is the built-in alarm system that notifies an operator of a reel running low.

Beyond SMT, the Cogiscan system will also help correctly route an assembly through the plant. If a product is flagged at AOI for a repair and it mistakenly gets routed to another cell, the receiving operator will get an alert to send the board back to repair in order to clear the defect originally found at AOI. These built-in alerts not only offer

a way to help prevent human error in the manufacturing process, but also provide an additional quality verification to circuit board assemblies on the TTC Program.

Overall, this TTC System introduces a new level of accountability into the contract manufacturing equation. It is an excellent tool for clients to accurately measure product flow by their chosen EMS provider. By implementing this new system, Saline is demonstrating a new level of transparency seldom seen in this industry, and further strengthening the partnership with each customer. Furthermore, Saline is proving to its client base that they are prepared to take on more challenging assembly projects, and also employing rigorous methods to ensure accountability for that process.

“This project exemplifies Saline’s dedication to providing the highest-quality products at the lowest possible cost for their customers. Cogiscan’s TTC system will help Saline achieve optimal use of materials and resources throughout the entire manufacturing process, while verifying that products are assembled correctly and collecting the traceability data to prove it. These capabilities are essential to thriving in today’s economy and will help to fuel Saline’s continued growth and success,” commented Vincent Dubois, Co-President of Cogiscan.

Customers that choose to enroll in the TTC Program will gain complete visibility of their product through Saline’s production floor. Beyond the medical and aerospace markets, this can be extremely beneficial for clients looking to gain detailed access and quality control of an outsourced assembly. The data provided by this TTC System showcases a deeper understanding of a product’s true lifecycle opening up for potential cost reductions. In addition, this system can improve risk management in the event of a product recall as Saline will be able to provide detailed information to the specific serial numbers rather than recalling an entire job lot. This targeted recall system can save clients tenfold in money, resources and time.

As an EMS provider committed to providing real-time manufacturing solutions to customers, Saline is looking forward to the holistic improvement this TTC System will provide to its manufacturing facility. The additional data provided by this system will improve assembly processes beyond those on the Cogiscan program. Contributing to lean and sustainable initiatives, this system

will help eliminate additional waste and unnecessary procedures. Wasted time on the production floor will be dramatically reduced due to the transition from manual data logging to automated RFID and semi-automatic bar code scanning. Overall, analyzing calculated through-put compared to actual real-time data will also encourage improvements factory-wide that will lead to lower costs and tighter process controls. ____________________________________

‘‘We are very excited to roll out the Cogiscan traceability software____________________________________

Since implementing the TTC System in April 2014, Saline has already seen a reduction in cycle time as the automated offline set-up validation has accelerated changeover at SMT. For Kanban and Kit Management, the built-in low level alarms are maximizing asset utilization and productivity by prompting operators to pull parts before running empty and shutting down a line. These immediate benefits will not only allow for improvements within Saline’s facility, but will also be directly felt by all clients partnered with Saline for their assembly production.

“We are very excited to roll out the Cogiscan traceability software across all of our manufacturing processes. This TTC System, working in conjunction with Juki’s Intelligent Feeder System, will provide an advanced level of control across the SMT assembly process,” commented Eric Hassen, General Manager and VP at Saline. “I’m also looking forward to the paperless method of defect data mining, which will provide quick identification of any negative quality trends that will allow us to react much sooner.”

Staying on the forefront of the changing requirements in the electronics manufacturing industry — including new regulation, smaller components and RoHS initiatives — allows Saline to remain a competitive force in domestic contract manufacturing. Committed to giving customers sustainable and meaningful solutions, this partnership with Cogiscan provides Saline’s clients with the most innovative and advanced traceability system available.


TechnicalSupport

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Etek technical support is a leading electronics manufacturing training service provider.

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red carpet out & about in the industry

In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...

Libra Industries receives Ohio Division Safety Award.Photo: Carol Brown with the Safety Award.

Libra Industries awards more than $20k in Scholarships. Photo: Rod Howell awards Christopher R Howell Memorial Scholarship to Jacob McClelland.

Carlos Tamez, Kurt Ersa’s new Regional Sales Manager for Northern Mexico.

EVS International appoints Hitech Electronica to be its distributor in Brazil. Photo: Simon G Norman, Business Director, EVS International.

George Surjan, FCT Assembly’s new Mechanical Engineer for the A-Laser Division.

Steve Kirby, Akrometrix LLC’s new representative for the Pacific Northwestern US.

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Cogiscan Inc appoints Anouk Hurbutt to Marketing and Sales Coordinator.

SEHO Systems GmbH strengthens its key account management with the announcement that Christian Ott will take over the global key account manager’s role for the Siemens Group.

Alan Sibenthall, Akrometrix LLC’s new representative for the Pacific Northwestern US.

Inovaxe Corp announces that Javad EMS has purchased and received two Two Bay InoCart units. Photo: Gary Walker,Vice President of Javad EMS shakes hands with Ben Khoshnood, President of Inovaxe.

Aqueous announces the expansion of its partnership with Etek Europe to cover sales and support in Europe, the Middle East and North Africa. From left to right: Mike Konrad, Chad Cisneros, Dave Shaw, John Hall, Mike Nelson



Implementing Warpage Management: A 5-Step Process for EMS Providersby Ken Chiavone, VP, Engineering, Akrometrix LLC.

Warpage Management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had Warpage Management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced Warpage Management programs.

Managing warpage is important not only for those who manufacture the components, but also for those responsible for manufacturing products using a reflow assembly process. Some EMS providers involved with the most complex, thinnest, most mission-critical electronics have already implemented Warpage Management systems, out of necessity. Akrometrix has advised and assisted several of these companies

throughout the global EMS industry, to create protocols that help them understand, monitor, compensate for, and correct warpage-related issues that affect their ability to provide high-quality, high-reliability products to their customers. Some factors that are often present when creating a Warpage Management program for Electronics Manufacturing Service providers can be summarized as a five-step process:

EMS Warpage Management Implementation Process

Step 1: Understand the relevant standards

Step 2: Plan to share data with customers and supply chain partners

Step 3: Choose necessary equipment and people to be trained

Step 4: Implement ‘best practices’Step 5: Benefit from ongoing data

collection and analysis

Akrometrix is in a good position to advise about how to manage warpage. The original technology for measuring electronics components in a simulated reflow environment was invented in the early 1990’s by a team at the Georgia Institute of Technology led by Dr. Charles Ume. That team spun-off and grew into a company called Electronics Packaging Services who focused on meeting urgent semiconductor industry requests for component warpage measurement. EPS later became Akrometrix, LLC in 1994. The high volume of testing services needed by cutting-edge electronics innovators led to the development and release of the first TherMoiré equipment products. By using patented shadow moiré and phase-stepping technologies, for the first time TherMoiré users could get 3D full-field, high-resolution information about the shape of electronics components as they progressed through a reflow cycle.

The first TherMoiré measurement system was installed in Berlin, Germany in 1998, and hundreds of systems are now in-use throughout all segments of the global electronics supply chain network. Part of the reason this equipment is in such widespread use is that, in addition to shadow moiré technology, the TherMoiré

features ‘modular metrology’, meaning that measurement capabilities utilizing other technologies, such as Digital Image Correlation (DIC) for surface strain, and Digital Fringe Projection (DFP), can be used interchangeably inside a common TherMoiré hardware and software platform. Another reason is that shadow moiré technology still provides the best combination of high speed, high resolution measurement at elevated temperatures, and delivers accurate full-field 3D warpage results for any measured area. ____________________________________

‘‘The high volume of testing services needed by cutting-edge electronics innovators resulted in TherMoiré products____________________________________

Because Akrometrix engineers invented full-field, high-resolution reflow warpage measurement and, in the last fifteen years, have trained, assisted and advised divisions of major semiconductor, electronics materials, OEMs and EMS providers around the world, they are in a unique position to help companies implement Warpage Management systems that are as basic or as advanced as needed. The five key steps in the process, summarized below, provide an outline for how companies, that want and/or need to implement any program that involves warpage data, can add that to their capabilities.

Step 1 Understand the relevant standards

Currently, no international standard directly addresses stacked package or package-to-board assembly, related to collecting warpage data or how to use that data from more than one surface. Some OEM customers of EMS providers have their own, internal and proprietary standards that provide direction about EMS processes related to warpage, but for now all the relevant public standards address warpage of packages and their corresponding land areas, separately.

Traditionally, warpage standards and internal company specifications about allowable warpage levels only address the ‘package side’, typically setting limits on the maximum coplanarity of packages at a peak reflow temperature. Recently, however, standards bodies have begun to address how warpage of package land areas on PCBs affects assembly yield and reliability. The most relevant current public standards are:____________________________________

‘‘an EMS provider implementing Warpage Management will need to obtain the capability to collect, analyze, and report surface measurements in-house____________________________________

IPC-9641, ‘High Temperature Printed Board Flatness Guideline’, published in 2013, provides explanations about why measuring PCB land areas is important, guidelines for selecting equipment, and an introduction to collecting warpage data so it can be correlated with other companies’ results. (Anyone wanting more background about PCB warpage should check the 2011 iNEMI-published study led by Intel’s John Davignon entitled ‘PCB Dynamic Coplanarity at Elevated Temperatures’.)

JESD22-B112A ‘Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature’, released in 2009, is the major document used throughout the electronics industry as the foundation for package warpage measurement. This standard defines warpage and how to measure it, introduces relevant measurement technologies such as shadow moiré, DIC, and Fringe Projection, and provides example measurement processes and results. Anyone characterizing the warpage performance of components needs to first understand the contents of this standard.

In Japan, JEITA ED-7306 ‘Measurement Methods of Package Warpage at Elevated Temperature and the Maximum Permissible Warpage’, published in 2007, is often used, though the warpage limits presented in that document are best considered as guidelines rather than ‘pass/fail’ specifications.

In addition to public standards, EMS companies often have customer requirements that inform their choices about how to plan for and react to warpage-related issues. Customer-provided guidelines and design-specific requirements should be considered in this step of implementing a Warpage Management program.

Step 2 Plan to share data with customers and supply chain partners

A Warpage Management system is most effective when important data is shared with others. Collecting data internally, and reacting to it with changes to the assembly process is one way an EMS provider can benefit from warpage measurement. For short-term fixes, and smaller-scale issues, this can be an effective plan. But the major benefits of warpage management only happen when relevant data is shared with supply chain partners who can use the information gathered to improve current and future product designs, to make products that assemble with fewer defects and perform more reliably for end customers.

An EMS company that is considering implementing Warpage Management, or upgrading their existing surface measurement data collection and analysis system, should consult with supply chain partners about what data would be useful to have, and how all parties involved could share appropriate data, upstream and downstream, to improve product designs, assembly planning, and continuous improvement processes. All these benefits do occur, amongst partners who share warpage-related data, in the most advanced electronics warpage management systems.

Step 3 Choose necessary equipment and people to be trained

After conversations with customers, internal stakeholders and other external partners, an EMS provider implementing Warpage Management will need to obtain the capability to collect, analyze, and report surface measurements in-house. Companies can outsource the warpage

measurement and reporting process, using outside test services laboratories that have equipment but, due to confidentiality requirements, many EMS providers typically cannot ship out components to be tested, making it essential to install equipment on-site where component receipt and assembly is happening.

The standards noted above mention technologies that can be used to obtain surface warpage data. The evaluation method to determine which tools are appropriate for a specific situation should take into account factors such as required volume of measurement (how many samples per day, for example, to collect data from), resolution of measurement required (how fine or close-to-actual-shape the results must be, typically expressed in microns), which people will be using the equipment (ease-of-use requirements) and what tools are being used already by supply chain partners.____________________________________

‘‘The testing at Akrometrix headquarters is done according to ‘best practices’ that are published and available to all TherMoiré users____________________________________

Warpage measurement systems are used in R&D laboratories and Quality Assurance departments all over the world and are fairly easy to incorporate into existing technically-oriented departments. For EMS providers, adding warpage measurement capability to an existing incoming Quality Control or outgoing Quality Assurance department is usually a good fit. Manufacturing Engineering is another department that can easily add warpage measurement to its set of capabilities. Installation and training for a new system typically happens over the course of two or three days, depending on


which measurement technology options are chosen and how many equipment operators need training. Maintenance and upkeep of warpage measurement systems is very simple and can usually be satisfied with a half day of preventive maintenance, performed once per year.

Step 4 Implement ‘best practices’

Once warpage measurement equipment is in place, and the EMS organization has a plan for using and sharing the data that is collected, it’s a good idea to test, analyze and report results according to industry ‘best practices’, so that data will correlate with that gathered by other companies, including OEMs, partner companies and even competitors. ____________________________________

‘‘Ongoing data collection also opens the possibility of Statistical Process Control (SPC) of the warpage characteristics of all components involved in reflow assembly____________________________________

Data correlation is often an important factor, especially for OEMs that are partnered with a large network of suppliers and EMS providers. For example, Akrometrix assists OEMs and EMS companies in cases where ‘the numbers just don’t match up’, where validity of collected data and a real understanding on what is happening throughout reflow, is in doubt. Applications Engineers sometimes perform testing on samples in question to provide a ‘baseline standard’ for what warpage results should be from all parties involved. The testing at Akrometrix headquarters is done according to ‘best practices’ that are published and available to all TherMoiré users. These guides cover subjects such as ‘how to attach thermocouples’, ‘how to verify calibration results’, ‘how to test high volumes of samples at one time’, and ‘how to process data consistently’. Taken together, the ‘best practices’ documents

are a clear set of instructions about how to operate the equipment in a way that produces accurate results that can be correlated with any other TherMoiré user who is also producing accurate results.

Once best practices are being performed consistently, an EMS company is well-positioned to reap the benefits of a functioning Warpage Management system.

Step 5 Benefit from ongoing data collection and analysis

The last step in the process isn’t so much an event as it is a continuous state. With a well-running Warpage Management system in place, EMS providers are prepared for any warpage-related customer request and any reflow assembly process problem involving shape mismatch within the temperature profile (defects such as head-on-pillow, non-wet opens, or shorts). Products such as Akrometrix Interface Analysis (see Figure X, IA) enable simple but powerful visualization and evaluation of interconnect gaps between top and bottom assembly surfaces at any temperature during the process, which can help determine problem locations where defects are likely to form. Knowing how the component shapes at the interface are matching or not matching at each stage of reflow helps those responsible for assembly to adjust process parameters such as solder print sizes for problem locations, to get better and more reliable yields. Ongoing data collection also opens the possibility of Statistical Process Control (SPC) of the warpage characteristics of all components involved in reflow assembly. Because variation in incoming

component warpage can negatively affect assembled product quality, knowing when data shows a statistically ‘out of control’ situation provides warning that assembly process parameters may need to be adjusted to ensure consistent output quality. ____________________________________

‘‘Those companies with greater capabilities to manage warpage are benefiting from overcoming the negative effects warpage is having on end-product yield and reliability____________________________________

As components become thinner, and have more interconnects that must solder together properly, managing warpage is becoming critical, at all stages from component design, to manufacture, to final product assembly. Those companies with greater capabilities to manage warpage are benefiting from overcoming the negative effects warpage is having on end-product yield and reliability. For these reasons, EMS providers that have, up until now, not had a Warpage Management program are deciding that taking the steps to implement one is worth the effort.



We hope you have enjoyed our sixth edition and found it an interesting and enjoyable read.

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Facing the Challenges of THT Inspectionby SMT Today Staff Editor

The deployment of AOI technology for THT inspection has historically been restricted by a number of factors. These include the physical configuration of most wave and selective soldering lines, which do not lend themselves to conventionally designed AOI machines that are now popular in SMT flow lines. Product is processed in pallets moving on a continuous drive with automatic return on which the inspection must take place.Although this material handling obstacle has been overcome in different ways, the inspection of THT joints by most AOI methodologies still leaves most manufacturers wary and resistant, while at the same time the high reliability characteristics of many of today’s THT inclusive products demand more rigorous production yields because rework is increasingly forbidden.

Long programming times and high false call rates are two fundamental concerns that have traditionally kept THT manufacturers from attempting to implement automatic inspection. By their nature, wave soldered joints include an enormously wide variety of appearances that might seem to preclude rapid programming or deep detection without false calls, and frequent interruption of wave soldering lines is both impractical and unacceptable.

Mek AOI faces the challenges of automated THT inspection with a unique combination of mechanical, optical and software design alternatives different from many conventional systems. In addition to unique, low profile bottom-up mechanics with 9 camera capability, the software and detection strategy employed

directly addresses the wide variations in THT joint appearances. Rather than using commercial component libraries as is otherwise common, the SpectorBox algorithms are histogram based measurements capable of delivering high yield and high detection rates.

Multi-Colour, multi-angle lighting visualizes the solder joint shape in 3D projection. By analyzing the reflections from the various angles, (90° 65° 45°) the quality of the solder joint can be determined. The shadow free illumination by the perpendicular lighting system and other omnidirectional lighting systems ensure solder joint quality inspection of any shape and height of any component orientation.

The range of detectable defects is large, and encompasses many otherwise“subjective”issues:• Mounting errors; no pin, no solder, solder

without pin.• Solder deficiency; pin without solder.• Solder Ball detection.• Land wetting defect; pin present, solder

attached to pad.• Convex fillet with no discernible lead.• Meniscus deficiencies.

• Improper wetting leading to poorly shaped connection.

• Circumferential wetting deficiency or excess.

The histogram analysis used to determine defects is a condition based decision, not one based on master images. Tolerances can be set tightly and there is a very low false alarm sensitivity. A single setting can be used for different pad sizes, multiple strategies can be employed in one spot, and the algorithms can be used in conjunction with other decision methods as well.

Optics overview

• HD CameraLink Camera @ 70FPS • 18.75/10µ Telecentric Lens with Prism• Lighting from 3 angles 90, 65, 45.


Essemtec Solutions Help EMS, Inc. Continue to Provide Best Possible Customer Service and Quality by SMT Today Staff Editor

Founded approximately eight years ago, Electronic Manufacturing Solutions, Inc. (EMS, Inc.) provides expertise in PCB assembly, electro-mechanical assembly, electrical panels, cable assembly and wiring harnesses, and provides a turnkey solution for customers’ electronic manufacturing needs. Originally focused on supporting its customers’ requirements for cable and harness assemblies, the company used its strengths and core values to grow and expand. EMS, Inc. is a small, family-owned establishment with an unequaled focus on customer service and quality. “Exceptional Quality, Superior Service, Improved Economic Value” are the cornerstones of the business and the company’s primary objectives when serving customers.

Over the years, the company has experienced significant growth with its customers. As a result, in Spring 2011, EMS, Inc. entered the SMT circuit board business. It gathered a team with the necessary expertise to make this happen. The team attended the IPC APEX EXPO in Las Vegas with the primary purpose of identifying and sourcing the equipment needed to complete its venture. Thus began the company’s successful partnership with the Essemtec team.

According to Clayton Hornsby, Production Manager, EMS, Inc. purchased its first Essemtec equipment in May 2011 after reviewing the product line on display at the IPC APEX EXPO. “We bought an entire line (Tucano screen printer, Paraquda SMT machine, inspection conveyor, and an RO400FC reflow oven). This setup has been the heart of our operation here and continues to be today,” he added.

The line has helped the company expand

and now it is back for more: EMS, Inc. recently purchased and is awaiting the arrival of a second SMT line consisting of a Tucano screen printer, Paraquda SMT machine with Jet valve dispenser, conveyors and an upgraded Zonda oven. Hornsbury said that the company is upgrading its original RO400FC reflow oven to a Zonda as well. This will result in two identical lines for the company, allowing production to be doubled.

Just as important as the increased capacity is the relationship between the two companies, especially with respect to customer service. “Essemtec has been with us every step of the way,” said Hornsby. The company’s main business consists of a high-mix and medium to low volumes. Essemtec’s Paraquda fills this niche well, allowing for easy setup and quick changeover, which is vital to EMS, Inc.’s operation. As an additional benefit, the Paraquda is capable of handling the newest advancements in the SMT industry.

Hornsby continues, “Essemtec is always ready to help when issues arrive. They have excellent technical support. They are always available for remote sessions and have been quick to respond when an issue requires an onsite visit, usually within a day or two. Essemtec’s support is far above par when compared to other equipment vendors that we have dealt with in the past.”

In addition to the high-quality customer care, the other reason that EMS, Inc. first looked at Essemtec was because of its reputation for its price point to capability ratio. From the company’s research, other vendors’ products with similar capabilities were much more expensive. Also, at the time, the product line that EMS, Inc. chose was a new offering from Essemtec. The company wanted to buy into a product line that was at the beginning of its lifecycle, not nearing the end. As the years progress, Essemtec continues updating its products and EMS, Inc. upgrades its lines as necessary.

After purchasing the equipment, the level of service was beyond anything that the company expected, which made its purchase even more valuable. “I would have to say that this is the main reason that we have continued to choose Essemtec,” said Hornsby. “We know that we will be

taken care of. Essemtec is more than just an equipment supplier, they are our partner in success.”

As partners, Essemtec has helped advance EMS, Inc.’s mission. The equipment has given the company a competitive advantage over its competitors, with increased capability and flexibility to service its ever-changing customer requirements.

The Essemtec equipment has allowed EMS, Inc. to offer a full-service assembly option to its existing and new customers. “The SMT equipment gives us the opportunity to include the assembled PCB into the enclosures we currently build. This has opened doors with new customers as well, given our full-service offering. This new ability has helped to fuel our growth and diversify our offering. We are very happy with the equipment we purchased and the level of support offered by Essemtec,” Hornsby said.

To this small business, quality is the top priority. As such, it is committed to understanding customers’ expectations, and meeting those expectations by performing the correct tasks — defect-free and on time — every time. While Essemtec’s systems help EMS, Inc. achieve this goal, there are numerous other facets, including EMS, Inc.’s state-of-the-art facility and highly trained staff.

The company recognizes that the highest quality possible is essential for its continued success. To that end, it provides employees with the necessary industry training, strives to continuously improve process control and test to the highest standards. To stay on top of the latest electronics manufacturing technology available, the company has an in-house ESD Training Program and IPC-A-610 CIT on staff. Additionally, EMS, Inc.’s employees have many years of electronic manufacturing experience, as well as strong program management experience. This experience helps facilitate projects moving from concept to production seamlessly. “We strive to provide our customers with the highest level of service in the industry,” said Hornsby. “Our dedicated team and quality facilities offer the flexibility necessary to meet the ever-changing requirements of our customers.”

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u Digital Multi-Frequency Quad Moiréu 15 Mega Pixel Camera Technologyu 10 um/pixel Telecentric Compound Lensu 10 Mega Pixel SIDE-VIEWER® Camera Systemu Six Phase Color Lighting Systemu Precision Linear Drive Motor System

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MW/MI/41/Vadatech testimonial ad for SMT Today.indd 1 8/27/14 4:39 PM

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