smartrf06 evaluation board user's guide (rev. b) · 5.2 power sources ... 18 5.7 ambient light...

SmartRF06 Evaluation Board (EVM)

User's Guide

Literature Number: SWRU321BMay 2012–Revised March 2017

2 SWRU321B–May 2012–Revised March 2017Submit Documentation Feedback

Copyright © 2012–2017, Texas Instruments Incorporated

Table of Contents

Contents

1 Introduction......................................................................................................................... 52 About This Manual ............................................................................................................... 5

2.1 Acronyms.................................................................................................................. 63 Getting Started .................................................................................................................... 6

3.1 Installing SmartRF Studio and USB Drivers .......................................................................... 64 Using the SmartRF06 Evaluation Board .................................................................................. 9

4.1 Absolute Maximum Ratings ........................................................................................... 105 SmartRF06 Evaluation Board Overview................................................................................. 11

5.1 XDS100v3 Emulator.................................................................................................... 135.2 Power Sources.......................................................................................................... 135.3 Power Domains ......................................................................................................... 155.4 LCD....................................................................................................................... 175.5 Micro SD Card Slot ..................................................................................................... 175.6 Accelerometer........................................................................................................... 185.7 Ambient Light Sensor .................................................................................................. 185.8 Buttons ................................................................................................................... 195.9 LEDs...................................................................................................................... 195.10 EVM Connectors........................................................................................................ 195.11 Breakout Headers and Jumpers ...................................................................................... 225.12 Current Measurement ................................................................................................. 25

6 Debugging an External Target Using SmartRF06EB ............................................................... 276.1 20-Pin ARM JTAG Header ............................................................................................ 286.2 10-Pin ARM Cortex Debug Header .................................................................................. 286.3 Custom Strapping....................................................................................................... 29

7 Frequently Asked Questions................................................................................................ 308 References ........................................................................................................................ 30Appendix A Schematics .............................................................................................................. 31

A.1 SmartRF06EB 1.2.1................................................................................................... 31

Revision History.......................................................................................................................... 37

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SWRU321B

www.ti.com

3SWRU321B–May 2012–Revised March 2017Submit Documentation Feedback


List of Figures

List of Figures1 Driver Install: Update Driver ................................................................................................ 72 Driver Install: Specify Path to FTDI Drivers .............................................................................. 73 Driver Install: VCP Loaded ................................................................................................. 84 Driver Install: Drivers Successfully Installed ............................................................................. 85 SmartRF06EB (rev. 1.2.1) With EVM Connected ....................................................................... 96 SmartRF06EB Architecture ............................................................................................... 117 SmartRF06EB Revision 1.2.1 Front Side ............................................................................... 128 SmartRF06EB Revision 1.2.1 Reverse Side ........................................................................... 129 Jumper Mounted on J5 to Enable the UART Back Channel ......................................................... 1310 Main Power Switch (P501) ................................................................................................ 1411 Source Selection Switch (P502).......................................................................................... 1412 SmartRF06EB Power Selection Switch (P502) in “USB” Position ................................................... 1413 SmartRF06EB Power Source Selection Switch (P502) in “BAT” Position .......................................... 1414 SmartRF06EB External Power Supply Header (J501) ................................................................ 1515 Power Domain Overview of SmartRF06EB............................................................................. 1516 Mount a Jumper on J502 to Bypass EVM Domain Voltage Regulator.............................................. 1617 Simplified Schematic of Ambient Light Sensor Setup ................................................................. 1818 SmartRF06EB EVM Connectors RF1 and RF2 ........................................................................ 1919 SmartRF06EB I/O Breakout Overview .................................................................................. 2220 XDS100v3 Emulator Bypass Header (P408) ........................................................................... 2421 20-Pin ARM JTAG Header (P409) ....................................................................................... 2422 10-Pin ARM Cortex Debug Header (P410) ............................................................................. 2523 Measuring Current Consumption Using Jumper J503 ................................................................ 2624 Measuring Current Consumption Using Jumper J503 ................................................................ 2625 Simplified Connection Diagram for Different Debugging Scenarios ................................................. 2726 Debugging External Target Using SmartRF06EB...................................................................... 2827 ARM JTAG Header (P409) With Strapping to Debug External Target .............................................. 2928 SmartRF06EB - Top Level ................................................................................................ 3129 SmartRF06EB - XDS100v3 - FPGA ..................................................................................... 3230 SmartRF06EB - XDS100v3 - FTDI ...................................................................................... 3331 SmartRF06EB - EVM Interfaces/Level Shifters ........................................................................ 3432 SmartRF06EB - Power Supply ........................................................................................... 3533 SmartRF06EB - High Voltage Peripheral ............................................................................... 3634 SmartRF06EB - Low Voltage Peripherals .............................................................................. 36

http://www.ti.com


www.ti.com



List of Tables

List of Tables1 SmartRF06EB Features .................................................................................................... 52 Acronyms ..................................................................................................................... 63 Supply Voltage: Recommended Operating Conditions and Absolute Maximum Ratings ........................ 104 Temperature: Recommended Operating Conditions and Storage Temperatures ................................. 105 UART Back Channel Signal Connections............................................................................... 136 Power Domain Overview of SmartRF06EB............................................................................. 167 LCD Signal Connections .................................................................................................. 178 Micro SD Card Signal Connections ...................................................................................... 179 Accelerometer Signal Connections ...................................................................................... 1810 Ambient Light Sensor Signal Connections.............................................................................. 1811 Button Signal Connections ................................................................................................ 1912 General Purpose LED Signal Connections ............................................................................. 1913 EVM connector RF1 Pin Out ............................................................................................. 2014 EVM Connector RF2 Pin Out ............................................................................................ 2115 SmartRF06EB I/O Breakout Overview .................................................................................. 2316 20-Pin ARM JTAG Header Pin-Out (P409) ............................................................................. 2417 10-Pin ARM Cortex Debug Header Pin-Out (P410) ................................................................... 2518 Debugging External Target: Minimum Strapping (cJTAG support) .................................................. 2919 Debugging External Target: Optional Strapping ....................................................................... 29

http://www.ti.com





User's GuideSWRU321B–May 2012–Revised March 2017


SmartRF is a trademark of Texas Instruments.ARM, Cortex are registered trademarks of ARM Limited.All other trademarks are the property of their respective owners.

1 IntroductionThe SmartRF06 Evaluation Board (SmartRF06EB or simply EB) is the motherboard in development kitsfor Low Power RF ARM® Cortex®-M based System-on-Chips from Texas Instruments. The board has awide range of features, shown in Table 1.

Table 1. SmartRF06EB Features

Component Description

TI XDS100v3 emulator cJTAG and JTAG emulator for easy programming and debugging of SoCs on EvaluationModules (EVM) or external targets.

High-speed USB 2.0 interface Easy plug and play access to full SoC control using SmartRF™ Studio PC software. Integratedserial port over USB enables communication between the SoC via the UART back channel.

64x128 pixels serial LCD Big LCD display for demo use and user interface development.LEDs Four general purpose LEDs for demo use or debugging.Micro SD card slot External flash for extra storage, over-the-air upgrades and more.Buttons Five push-buttons for demo use and user interfacing.Accelerometer Three-axis highly configurable digital accelerometer for application development and demo use.Light sensor Ambient light sensor for application development and demo use.Breakout pins Easy access to SoC GPIO pins for quick and easy debugging.

2 About This ManualThis manual contains reference information about the SmartRF06EB.

Section 3 will give a quick introduction on how to get started with the SmartRF06EB. It describes how toinstall the SmartRF Studio software to get the required USB drivers for the evaluation board. Section 4briefly explains how the EB can be used throughout a project’s development cycle. Section 5 gives anoverview of the various features and functionality provided by the board.

A troubleshooting guide is found in Section 7 and Appendix A contains the schematics for SmartRF06EBrevision 1.2.1.

The PC tools SmartRF Studio and SmartRF Flash Programmer have their own user manual.

For references to relevant documents and web pages, see Section 8.


About This Manual www.ti.com




2.1 Acronyms

Table 2. Acronyms

Acronym DescriptionALS Ambient Light Sensor

cJTAG Compact JTAG (IEEE 1149.7)CW Continuous WaveDK Development KitEB Evaluation Board

EVM Evaluation ModuleFPGA Field-Programmable Gate Array

I/O Input/OutputJTAG Joint Test Action Group (IEEE 1149.1)LCD Liquid Crystal DisplayLED Light Emitting Diode

LPRF Low Power RFMCU MicrocontrollerMISO Master In, Slave Out (SPI signal)MOSI Master Out, Slave In (SPI signal)

NA Not Applicable / Not AvailableNC Not ConnectedRF Radio Frequency

RTS Request to SendRX Receive

SoC System-on-ChipSPI Serial Peripheral InterfaceTI Texas InstrumentsTP Test PointTX Transmit

UART Universal Asynchronous Receive TransmitUSB Universal Serial BusVCP Virtual COM Port

3 Getting StartedBefore connecting the SmartRF06EB to the PC via the USB cable, it is highly recommended to performthe steps described below.

3.1 Installing SmartRF Studio and USB DriversBefore your PC can communicate with the SmartRF06EB over USB, the USB drivers for the EB needs tobe installed. The latest SmartRF Studio installer [1] includes USB drivers both for Windows x86 andWindows x64 platforms.

After you have downloaded SmartRF Studio from the web, extract the zip-file, run the installer and followthe instructions. Select the complete installation to include the SmartRF Studio program, the SmartRFStudio documentation and the necessary drivers needed to communicate with the SmartRF06EB.

http://www.ti.com


www.ti.com Getting Started




3.1.1 SmartRF StudioSmartRF Studio is a PC application developed for configuration and evaluation of many RF-IC productsfrom Texas Instruments. The application is designed for use with SmartRF Evaluation Boards, such asSmartRF06EB, and runs on the Microsoft Windows operating systems.

SmartRF Studio lets you explore and experiment with the RF-ICs as it gives full overview and access tothe devices’ registers to configure the radio and has a control interface for simple radio operation from thePC.

This means that SmartRF Studio will help radio system designers to easily evaluate the RF-IC at an earlystage in the design process. It also offers a flexible code export function of radio register settings forsoftware developers.

The latest version of SmartRF Studio can be downloaded from the Texas Instruments website [1], where acomplete user manual can be found.

3.1.2 FTDI USB DriverSmartRF PC software such as SmartRF Studio uses a proprietary USB driver from FTDI [2] tocommunicate with SmartRF06 evaluation boards. Connect your SmartRF06EB to the computer with aUSB cable and turn it on. If you did a complete install of SmartRF Studio, the device is automaticallyrecognized by Windows and the SmartRF06EB is ready for use!

3.1.2.1 Install FTDI USB Driver Manually in WindowsIf the SmartRF06EB was not properly recognized after plugging it into your PC, try the following steps toinstall the necessary USB drivers. The steps described are for Microsoft Windows 7, but are very similar tothose in Windows XP and Windows Vista. It is assumed that you have already downloaded and installedthe latest version of SmartRF Studio 7 [1].

Open the Windows Device Manager and right click on the first “Texas Instruments XDS100v3” foundunder “Other devices” as shown in Figure 1.

Select “Update Driver Software…” and, in the appearing dialog, browse to <Studio install dir>\Drivers\ftdias shown in Figure 2.

Figure 1. Driver Install: Update Driver Figure 2. Driver Install: Specify Path to FTDI Drivers

Press Next and wait for the driver to be installed. The selected device should now appear in the DeviceManager as “TI XDS100v3 Channel x” (x = A or B) as seen in Figure 4. Repeat the above steps for thesecond “Texas Instruments XDS100v3” listed under “Other devices”.

http://www.ti.com


Getting Started www.ti.com




3.1.2.1.1 Enable XDS100v3 UART Back Channel on WindowsIf you have both “TI XDS100v3 Channel A” and “TI XDS100v3 Channel B” listed under Universal SerialBus Controllers, you can proceed. Right click on “TI XDS100v3 Channel B” and select Properties. Underthe Advanced tab, make sure “Load VCP” is checked as shown in Figure 3.

A “USB Serial Port” may be listed under “Other devices”, as seen in Figure 1. Follow the same steps asfor the “Texas Instruments XDS100v3” devices to install the VCP driver. When the drivers from <Studioinstall dir>\Drivers\ftdi is properly installed, you should see the USB Serial Port device be listed under“Ports (COM & LPT)” as shown in Figure 4.

The SmartRF06EB drivers are now installed correctly.

Figure 3. Driver Install: VCP Loaded Figure 4. Driver Install: Drivers Successfully Installed

3.1.2.2 Install XSD100v3 UART Back Channel on LinuxThe ports on SmartRF06EB will typically be mounted as ttyUSB0 or ttyUSB1. The UART back channel isnormally mounted as ttyUSB1.1. Download the Linux drivers from [2].2. Untar the ftdi_sio.tar.gz file on your Linux system.3. Connect the SmartRF06EB to your system.4. Install driver:

(a) Verify the USB Product ID (PID) and Vendor ID (VID). The TI XDS100v3 USB VID is 0x0403 andthe PID is 0xA6D1, but if you wish to find the PID using a terminal window/shell, use> lsusb | grep -i future.

(b) Install driver using modprobe In a terminal window/shell, navigate to the ftdi_sio folder and run> sudo modprobe ftdi_sio vendor=0x403 product=0xA6D1 .

SmartRF06EB should now be correctly mounted. The above steps have been tested on Fedora andUbuntu distributions.

If the above steps failed, try uninstalling ‘brltty’ prior to step 4 (technical note TN_101, [2]):> sudo apt-get remove brltty.

http://www.ti.com


www.ti.com Using the SmartRF06 Evaluation Board




4 Using the SmartRF06 Evaluation BoardThe SmartRF06EB is a flexible test and development platform that works together with RF EvaluationModules from Texas Instruments.

An Evaluation Module is a small RF module with RF chip, balun, matching filter, SMA antenna connectorand I/O connectors. The modules can be plugged into the SmartRF06EB, which lets the PC take directcontrol of the RF device on the EVM over the USB interface.

SmartRF06EB currently supports: CC2538EM

SmartRF06EB is included in the CC2538 development kit.

Figure 5. SmartRF06EB (rev. 1.2.1) With EVM Connected

The PC software that controls the SmartRF06EB + EVM is SmartRF Studio. Studio can be used toperform several RF tests and measurements, for example, to set up a CW signal and send or receivepackets.

http://www.ti.com


Using the SmartRF06 Evaluation Board www.ti.com




The EB+EVM can be of great help during the whole development cycle for a new RF product.• Perform comparative studies. Compare results obtained with EB+EVM with results from your own

system.• Perform basic functional tests of your own hardware by connecting the radio on your board to

SmartRF06EB. SmartRF Studio can be used to exercise the radio.• Verify your own software with known good RF hardware, by simply connecting your own

microcontroller to an EVM via the EB. Test the send function by transmitting packets from yoursoftware and receive with another board using SmartRF Studio. Then, transmit using SmartRF Studioand receive with your own software.

• Develop code for your SoC and use the SmartRF06EB as a standalone board without PC tools.

The SmartRF06EB can also be used as a debugger interface to the SoCs from IAR Embedded workbenchfor ARM or Code Composer Studio from Texas Instruments. For details on how to use the SmartRF06EBto debug external targets, see Section 6.

4.1 Absolute Maximum RatingsThe minimum and maximum operating supply voltages and absolute maximum ratings for the activecomponents onboard the SmartRF06EB are summarized in Table 3. Table 3 lists the recommendedoperating temperature and storage temperature ratings. For more details, see the device-specific datasheet.

(1) The XDS100v3 Emulator is USB powered. Values refer to the supply and I/O pin voltages of the connected target.(2) Recommended minimum operating voltage.

Table 3. Supply Voltage: Recommended Operating Conditions and Absolute Maximum Ratings

Component Operating Voltage Absolute Maximum RatingMin [V] Max [V] Min [V] Max [V]

XDS100v3 Emulator (1)

[4]+1.8 +3.6 –0.3 +3.75

LCD [5] +3.0 +3.3 –0.3 +3.6Accelerometer [6] +1.62 +3.6 –0.3 +4.25Ambient light sensor [7] +2.3 (2) +5.5 NA +6

Table 4. Temperature: Recommended Operating Conditions and Storage Temperatures

Component Operating Voltage Absolute Maximum RatingMin [V] Max [V] Min [V] Max [V]

XDS100v3 Emulator [4] –20 +70 –50 +110LCD [5] –20 +70 –30 +80Accelerometer [6] –40 +85 –50 +150Ambient light sensor [7] –40 +85 –40 +85

http://www.ti.com


www.ti.com SmartRF06 Evaluation Board Overview




5 SmartRF06 Evaluation Board OverviewSmartRF06EB acts as the motherboard in development kits for ARM Cortex-based low power RF SoCsfrom Texas Instruments. The board has several user interfaces and connections to external interfaces,allowing fast prototyping and testing of both software and hardware. An overview of the SmartRF06EBarchitecture is found in Figure 6. The board layout is found in Figure 7 and Figure 8, while the schematicsare located in Appendix A.

This section provides an overview of the general architecture of the board and describes the available I/O.The following subsections explain the I/O in more detail. Pin connections between the EVM and theevaluation board I/O can be found in Section 5.10.

Figure 6. SmartRF06EB Architecture

http://www.ti.com


1.5 V AAA Alkaline Battery holder

XDS100v3 Emulator

1.5 V AAA Alkaline Battery

holder

CR2032 coin cell battery

holder

EM current measurement testpoint and jumper

XDS bypass header

20-pin ARM JTAG Header

General purposebuttons

UART back channel breakout

XDS LEDs

10-pin ARM Cortex Header

EM I/O breakout

Main power switch

Power source selection switch

External power supply connector

EM reset button

Regulator bypass jumper

Micro SD card slot

LCD

Accelerometer

LEDs

Ambient Light Sensor

EM connectors

UART back channel enable Jumper

SmartRF06 Evaluation Board Overview www.ti.com




Figure 7. SmartRF06EB Revision 1.2.1 Front Side

Figure 8. SmartRF06EB Revision 1.2.1 Reverse Side

http://www.ti.com






5.1 XDS100v3 EmulatorThe XDS100v3 Emulator from Texas Instruments has cJTAG and regular JTAG support. cJTAG is a 2-pinextension to regular 4-pin JTAG. The XDS100v3 consists of a USB to JTAG chip from FTDI [2] and anFPGA to convert JTAG instructions to cJTAG format.

In addition to regular debugging capabilities using cJTAG or JTAG, the XDS100v3 Emulator supports aUART backchannel over a USB Virtual COM Port (VCP) to the PC. The UART back channel supports flowcontrol, 8-N-1 format and data rates up to 12Mbaud.

For detailed information about the emulator, see the XDS100v3 emulator product page [4]. The XDS100v3Emulator is powered over USB and is switched on as long as the USB cable is connected to theSmartRF06EB and the main power switch (S501) is in the ON position. The XDS100v3 Emulator supportstargets with operating voltages between 1.8 V and 3.6 V. The min (max) operating temperature is -20(+70) °C.

5.1.1 UART Back ChannelThe mounted EVM can be connected to the PC via the XDS100v3 Emulator’s UART back channel. Whenconnected to a PC, the XDS100v3 is enumerated as a Virtual COM Port (VCP) over USB. The driver usedis a royalty free VCP driver from FTDI, available, for example, on Microsoft Windows, Linux and Max OSX. The UART back channel gives the mounted EVM access to a four pin UART interface, supporting 8-N-1 format at data rates up to 12 Mbaud.

To enable the SmartRF06EB UART back channel the “Enable UART over XDS100v3” jumper (J5),located on the lower right side of the EB, must be mounted (see Figure 9). Table 5 shows an overview ofthe I/O signals related to UART Back Channel.

Figure 9. Jumper Mounted on J5 to Enable the UART Back Channel

Table 5. UART Back Channel Signal Connections

Signal Name Description Probe Header EVM PinRF1.7_UART_RX UART receive (EVM data in) EM_UART_RX (P412.2) RF1.7RF1.9_UART_TX UART transmit (EVM data out) EM_UART_TX (P412.3) RF1.9RF1.3_UART_CTS UART clear to send signal EM_UART_CTS (P412.4) RF1.3RF2.18_UART_RTS UART request to send signal EM_UART_RTS (P412.5) RF2.18

5.2 Power SourcesThere are three ways to power the SmartRF06EB: batteries, USB bus and external power supply. Thepower source can be selected using the power source selection switch (S502) seen in Figure 10. TheXDS100v3 Emulator can only be powered over USB. The main power supply switch (S501) cuts power tothe SmartRF06EB.

CAUTIONNever connect batteries and an external power source to the SmartRF06EB atthe same time! Doing so may lead to excessive currents that may damage thebatteries or cause onboard components to break. The CR2032 coin cell batteryis in particular very sensitive to reverse currents (charging) and must never becombined with other power sources (AAA batteries or an external powersource).

http://www.ti.com






Figure 10. Main Power Switch (P501) Figure 11. Source Selection Switch (P502)

5.2.1 USB PowerWhen the SmartRF06EB is connected to a PC via a USB cable, it can draw power from the USB bus. Theonboard voltage regulator supplies approximately 3.3 V to the mounted EVM and the EB peripherals. Topower the mounted EVM and the EB peripherals from the USB bus, the power source selection switch(S502) should be in “USB” position (see Figure 12).

The maximum current consumption is limited by the regulator to 1500 mA.

NOTE: Most USB power sources are limited to 500 mA.

Figure 12. SmartRF06EB Power Selection Switch (P502) in “USB” Position

5.2.2 Battery PowerThe SmartRF06EB can be powered using two 1.5 V AAA alkaline batteries or a 3 V CR2032 coin cellbattery. The battery holders for the AAA batteries and the CR2032 coin cell battery are located on thereverse side of the PCB. To power the mounted EVM and the EB peripherals using batteries, the powersource selection switch (S502) should be in “BAT” position (see Figure 13).

When battery powered, the EVM power domain is by default regulated to 2.1 V. The voltage regulator maybe bypassed by mounting a jumper on J502. For more details, see Section 5.3.2.

CAUTIONDo not power the SmartRF06EB using two 1.5 V AAA batteries and a 3 VCR2032 coin cell battery at the same time. Doing so may lead to excessivecurrents that may damage the batteries or cause onboard components to break

Figure 13. SmartRF06EB Power Source Selection Switch (P502) in “BAT” Position

http://www.ti.com


XDS domain(3.3 V)

XDS100v3, XDS LEDs

EM domain(1.8 - 3.6 V)

ACC, ALS, keys, LEDs

3.3 V domain(3.3 V)

LCD, SD card

Power sourcesUSB, batteries, external supply

Level

shifters

Level

shifters

Mounted EM





5.2.3 External Power SupplyThe SmartRF06EB can be powered using an external power supply. To power the mounted EVM and theEB peripherals using an external power supply, the power source selection switch (S502) should be in“BAT” position (see Figure 13).

The external supply’s ground should be connected to the SmartRF06EB ground, for example, to theground pad in the top left corner of the EB. Connect the positive supply connector to the external powerheader J501 (see Figure 14). The applied voltage must be in the range from 2.1 V to 3.6 V and limited tomax 1.5 A.

When powered by an external power supply, the EVM power domain is by default regulated to 2.1 V. Thevoltage regulator may be bypassed by mounting a jumper on J502. For more details, see Section 5.3.2.

CAUTIONThere is a risk of damaging the onboard components if the applied voltage onthe external power connector/header is lower than -0.3 V or higher than 3.6 V(combined absolute maximum ratings for onboard components). For moreinformation, see Section 4.1.

Figure 14. SmartRF06EB External Power Supply Header (J501)

5.3 Power DomainsThe SmartRF06EB is divided into three power domains, described in detail in the following sections. TheSmartRF06EB components, and what power domain they belong to, is shown in Figure 15 and Table 6.

Figure 15. Power Domain Overview of SmartRF06EB

http://www.ti.com






Table 6. Power Domain Overview of SmartRF06EB

Component Power Domain Power SourceEvaluation Module EVM domain (LO_VDD) USB, battery, externalGeneral Purpose LEDs EVM domain (LO_VDD) USB, battery, externalAccelerometer EVM domain (LO_VDD) USB, battery, externalAmbient Light Sensor EVM domain (LO_VDD) USB, battery, externalCurrent Measurement MSP MCU EVM domain (LO_VDD) USB, battery, externalLEDs EVM domain (LO_VDD) USB, battery, externalXDS100v3 Emulator XDS domain USBXDS100v3 LEDs XDS domain USBSD Card Slot 3.3 V domain (HI_VDD) Same as EVM domainLCD 3.3 V domain (HI_VDD) Same as EVM domain

5.3.1 XDS DomainThe XDS100v3 Emulator (see Section 5.1) onboard the SmartRF06EB is in the XDS domain. The XDSdomain is powered over USB. The USB voltage supply (+5 V) is down-converted to +3.3 V and +1.5 V forthe different components of the XDS100v3 Emulator.

The SmartRF06EB must be connected to a PC over USB for the XDS domain to be powered up. Thedomain is turned on or off by the SmartRF06EB main power switch.

5.3.2 EVM DomainThe mounted EVM board and most of the SmartRF06EB peripherals are powered in the EVM domain andsignals in this domain (accessible by the EVM), are prefixed “LV_” in the schematics. Table 6 lists the EBperipherals that are powered in the EVM domain. The domain is turned on or off by the SmartRF06EBpower switch.

The EVM domain may be powered using various power sources: USB powered (regulated to 3.3 V),battery powered (regulated to 2.1 V or unregulated) and using an external power supply (regulated to 2.1V or unregulated).

When battery powered or powered by an external source, the EVM power domain is by default regulatedto 2.1 V using a step down converter. The step down converter may be bypassed by mounting a jumperon J502 (see Figure 16), powering the EVM domain directly from the source. When J502 is not mounted,the EVM power domain is regulated to 2.1 V. The maximum current consumption of the EVM powerdomain is then limited by the regulator to 410 mA.

Figure 16. Mount a Jumper on J502 to Bypass EVM Domain Voltage Regulator

NOTE: Mounting a jumper on J502 will not have any effect if the SmartRF06EB is powered overUSB (when the power source selection switch, S502, is in “USB” position).

http://www.ti.com






5.3.3 3.3 V DomainThe 3.3 V domain is a sub domain of the EVM domain. The 3.3 V domain is regulated to 3.3 V using abuck-boost converter, irrespective of the source powering the EVM domain. Signals in the 3.3 V domain(controlled by the EVM) are prefixed “HV_” for High Voltage in the schematics.

Two EB peripherals are in the 3.3 V domain, the LCD and the SD card slot, as listed in Table 6. Theseperipherals are connected to the EVM domain via level shifters U401 and U402.

The 3.3 V domain may be switched on (off) completely by the mounted EVM board by pulling signalLV_3.3V_EN to a logical 1 (0). For details about the mapping between the EVM and signals onboard theSmartRF06EB, see Table 15.

5.4 LCDThe SmartRF06EB comes with a 128x64 pixels display from Electronic Assembly (DOGM128E-6) [4]. TheLCD display is available to mounted EVM via a SPI interface, enabling software development of userinterfaces and demo use. Table 7 shows an overview of the I/O signals related to the LCD.

The recommended operating condition for the LCD display is a supply voltage between 3.0 V and 3.3 V.The LCD display is powered from the 3.3 V power domain (HI_VDD). The min (max) operatingtemperature is –20 (+70) °C.

CAUTIONThe LCD connector on SmartRF06EB is very tight to ensure proper contactbetween the EVM and the LCD. Be extremely cautious when removing the LCDto avoid the display from breaking.

Table 7. LCD Signal Connections

Signal Name Description Probe Header EVM PinLV_3.3V_EN 3.3 V domain enable signal RF1.15 (P407.1) RF1.15LV_LCD_MODE LCD mode signal RF1.11 (P406.7) RF1.11;LV_LCD_RESET LCD reset signal (active low) RF1.13 (P406.9) RF1.13;LV_LCD_CS LCD chip select (active low) RF1.17 (P407.3) RF1.17LV_SPI_SCK SPI clock RF1.16_SCK (P407.2) RF1.16LV_SPI_MOSI SPI MOSI (LCD input) RF1.18_MOSI (P407.4) RF1.18

5.5 Micro SD Card SlotThe SmartRF06EB has a micro SD card slot for connecting external SD/MMC flash devices (flash devicenot included). A connected flash device is available to the mounted EVM via a SPI interface, giving itaccess to extra flash, enabling over-the-air upgrades and more. Table 9 shows an overview of I/O signalsrelated to the micro SD card slot.

The micro SD card is powered from the 3.3 V power domain (HI_VDD).

(1) The LCD and SD card are both powered in the 3.3 V domain and cannot be powered on or off individually.

Table 8. Micro SD Card Signal Connections

Signal Name Description Probe Header EVM PinLV_3.3V_EN 3.3 V domain enable signal (1) RF1.15 (P407.1) RF1.15;LV_SDCARD_CS SD card chip select (active low) RF2.12 (P411.1) RF2.12LV_SPI_SCK SPI clock RF1.16_SCK (P407.2) RF1.16LV_SPI_MOSI SPI MOSI (SD card input) RF1.18_MOSI (P407.4) RF1.18LV_SPI_MISO SPI MISO (SD card output) RF1.20_MISO (P407.5) RF1.20

http://www.ti.com






5.6 AccelerometerThe SmartRF06EB is equipped with a BMA250E digital accelerometer from Bosch Sensortech [6]. Theaccelerometer is available to the mounted EVM via an SPI interface and has two dedicated interrupt lines.The accelerometer is suitable for application development, prototyping and demo use. Table 9 shows anoverview of I/O signals related to the accelerometer.

Note that some versions of the SmartRF06EB (1.2.2 and earlier – see the sticker on bottom side of PCB)used the original BMA250 IC, while later versions (1.2.3 and later) use BMA250E. The primary differenceis that the BMA250E uses a different device ID. For more information, see the Bosch Sensortech datasheet [6].

The recommended operating condition for the accelerometer is a supply voltage between 1.62 V and 3.6V. The min (max) operating temperature is -40 (+85) °C

Table 9. Accelerometer Signal Connections

Signal Name Description Probe Header EVM PinLV_ACC_PWR Acc. power enable signal RF2.8 (P407.8) RF2.8LV_ACC_INT1 Acc. interrupt signal RF2.16 (P411.5) RF2.16LV_ACC_INT2 Acc. interrupt signal RF2.14 (P411.3) RF2.14;LV_ACC_CS Acc. chip select (active low) RF2.10 (P407.9) RF2.10LV_SPI_SCK SPI clock RF1.16_SCK (P407.2) RF1.16LV_SPI_MOSI SPI MOSI (acc. input) RF1.18_MOSI (P407.4) RF1.18LV_SPI_MISO SPI MISO (acc. output) RF1.20_MISO (P407.5) RF1.20

5.7 Ambient Light SensorThe SmartRF06EB has an analog SFH 5711 ambient light sensor (ALS) from Osram [7] that is availablefor the mounted EVM via the EVM connectors, enabling quick application development for demo use andprototyping. Figure 17 and Table 10 shows an overview of I/O signals related to the ambient light sensor.

The recommended operating condition for the ambient light sensor is a supply voltage between 2.3 V and5.5 V. The min (max) operating temperature is -40 (+85) °C.

Figure 17. Simplified Schematic of Ambient Light Sensor Setup

Table 10. Ambient Light Sensor Signal Connections

Signal Name Description Probe Header EVM PinLV_ALS_PWR ALS power enable signal RF2.6 (P407.7) RF2.6LV_ALS_OUT ALS output signal (analog) RF2.5 (P411.6) RF2.5

http://www.ti.com






5.8 ButtonsThere are six buttons on the SmartRF06EB. Status of the LEFT, RIGHT, UP, DOWN and SELECTbuttons are available to the mounted EVM. These buttons are intended for user interfacing anddevelopment of demo applications.

The EVM RESET button resets the mounted EVM by pulling its reset line low (RF2.15_RESET;). Table 11shows an overview of I/O signals related to the buttons.

Table 11. Button Signal Connections

Signal Name Description Probe Header EVM PinLV_BTN_LEFT Left button (active low) RF1.6 (P406.4) RF1.6LV_BTN_RIGHT Right button (active low) RF1.8 (P406.5) RF1.8LV_BTN_UP Up button (active low) RF1.10 (P406.6) RF1.10LV_BTN_DOWN Down button (active low) RF1.12 (P406.8) RF1.12LV_BTN_SELECT Select button (active low) RF1.14 (P406.10) RF1.14;LV_BTN_RESET EVM reset button (active low) RF2.15_RESET; (P411.4) RF2.15

5.9 LEDs

5.9.1 General Purpose LEDsThe four LEDs D601, D602, D603, D604 can be controlled from the mounted EVM and are suitable fordemo use and debugging. The LEDs are active high. Table 12 shows an overview of I/O signals related tothe LEDs.

Table 12. General Purpose LED Signal Connections

Signal Name Description Probe Header EVM PinLV_LED_1 LED 1 (red) RF2.11 (P407.10) RF2.11LV_LED_2 LED 2 (yellow) RF2.13 (P411.2) RF2.13LV_LED_3 LED 3 (green) RF1.2 (P406.1) RF1.2LV_LED_4 LED 4 (red-orange) RF1.4 (P406.2) RF1.4

5.9.2 XDS100v3 Emulator LEDsThe XDS100v3 emulator has two LEDs to indicate its status: D2 and D4. The LEDs are located on the topside of the SmartRF06EB. LED D2 is lit whenever the XDS100v3 Emulator is powered, while LED D4(ADVANCED MODE) is lit when the XDS100v3 is in an active cJTAG debug state.

5.10 EVM ConnectorsThe EVM connectors, shown in Figure 18, are used for connecting an EVM board to the SmartRF06EB.The connectors RF1 and RF2 are the main interface and are designed to inhibit incorrect mounting of theEVM board. The pin-out of the EVM connectors is given in Table 13 and Table 14.

Figure 18. SmartRF06EB EVM Connectors RF1 and RF2

http://www.ti.com






Table 13. EVM connector RF1 Pin Out

EVM Pin Signal Name Description Probe Header Breakout HeaderRF1.1 GND GroundRF1.2 RF1.2 GPIO signal to EVM

boardP406.1 P403.1-2

RF1.3 RF1.3_UART_CTS UART back channel /GPIO

P412.4 P408.15-16

RF1.4 RF1.4 GPIO signal to EVMboard

P406.2 P403.3-4


P406.3 P403.5-6


P406.4 P403.7-8

RF1.7 RF1.7_UART_RX UART back channel(EVM RX)

P412.2 P408.11-12


P406.5 P403.9-10

RF1.9 RF1.9_UART_TX UART back channel(EVM TX)

P412.3 P408.13-14


P406.6 P403.11-12


P406.7 P403.13-14


P406.8 P403.15-16


P406.9 P403.17-18


P406.10 P403.19-20


P407.1 P404.1-2

RF1.16 RF1.16_SPI_SCK EVM SPI Clock P407.2 P404.3-4RF1.17 RF1.17 GPIO signal to EVM

boardP407.3 P404.5-6

RF1.18 RF1.18_SPI_MOSI EVM SPI MOSI P407.4 P404.7-8RF1.19 GND GroundRF1.20 RF1.20_SPI_MISO EVM SPI MISO P407.5 P404.9-10

http://www.ti.com






Table 14. EVM Connector RF2 Pin Out

EVM Pin Signal Name Description Probe Header Breakout HeaderRF2.1 RF2.1_JTAG_TCK JTAG test clock P409.9 P408.1-2RF2.2 GND GroundRF2.3 RF_VDD2 EVM power TP10 J503.1-2RF2.4 RF2.4_JTAG_TMS JTAG test mode select P409.7 P408.3-4RF2.5 RF2.5 GPIO signal to EVM

boardP407.6 P404.11-12


P407.7 P404.13-14

RF2.7 RF_VDD1 EVM power TP10 J503.1-2RF2.8 RF2.8 GPIO signal to EVM

boardP407.8 P404.15-16

RF2.9 RF_VDD1 EVM power TP10 J503.1-2RF2.10 RF2.10 GPIO signal to EVM

boardP407.9 P404.17-18


P407.10 P404.19-20


P411.1 P405.1-2


P411.2 P405.3-4


P411.3 P405.5-6

RF2.15 RF2.15_RESET; EVM reset signal (activelow)

P411.4 P405.7-8


P411.5 P405.9-10

RF2.17 RF2.17_JTAG_TDI GPIO / JTAG test data in P409.5 P408.5-6RF2.18 RF2.18_UART_RTS GPIO / UART back

channelP412.5 P408.17-18

RF2.19 RF2.19_JTAG_TDO GPIO / JTAG test data out P409.13 P408.7-8RF2.20 GND Ground

http://www.ti.com


EvaluationModule

Peripheral probe headers

P406, P407, P411

I/O breakout headersP403, P404, P405

SmartRF06EB peripherals

ACC, ALS, keys, LCD, LED, SD card

XDS bypass headerP408

XDS100v3Emulator

20-pinARM-JTAG

Debug HeaderP409

10-pin Cortex Debug Header

P410

UART back channel probe

headerP412





5.11 Breakout Headers and JumpersThe SmartRF06EB has several breakout headers, giving access to all EVM connector pins. An overviewof the SmartRF06EB I/O breakout headers is given in Figure 19. Probe headers P406, P407, P411 andP412 give access to the I/O signals of the mounted EVM. Breakout headers P403, P404 and P405 allowthe user to map any EVM I/O signal to any peripheral on the SmartRF06EB.

The XDS bypass header (P408) makes it possible to disconnect the XDS100v3 Emulator onboard the EBfrom the EVM. Using the 20-pin ARM JTAG header (P409) or the 10-pin ARM Cortex Debug Header(P410), it is possible to debug external targets using the onboard emulator.

NOTE: By default, all jumpers are mounted on P403, P404, P405 and P408. The defaultconfiguration is assumed in this user’s guide, unless otherwise stated.

Figure 19. SmartRF06EB I/O Breakout Overview

http://www.ti.com






5.11.1 I/O Breakout HeadersThe I/O breakout headers on SmartRF06EB consist of pin connectors P406, P407, P411 and P412. P406,P407 and P411 are located at the top left side of SmartRF06EB. All EVM signals available on these probeheaders can be connected to or disconnected from SmartRF06EB peripherals using jumpers on headersP403, P404, P405.

Probe header P412 is located near the bottom right corner of the SmartRF06EB. The signals available onP412 are connected to the XDS100v3 Emulator’s UART back channel using jumpers on header P408.

The I/O breakout mapping between the SmartRF06EB and the mounted EVM is given in Table 15. Theleftmost column in the table refers to the silk print seen on the SmartRF06EB. The rightmost columnshows the corresponding CC2538 I/O pad on CC2538EM.

Table 15. SmartRF06EB I/O Breakout Overview

Probe Header Silk Print EB Signal Name EVM ConnectorCC2538EM

I/OP406 RF1.2 LV_LED_3 RF1.2 PC2

RF1.4 LV_LED_4 RF1.4 PC3RF1.5 NC RF1.5 PB1RF1.6 LV_BTN_LEFT RF1.6 PC4RF1.8 LV_BTN_RIGHT RF1.8 PC5

RF1.10 LV_BTN_UP RF1.10 PC6RF1.11 LV_LCD_MODE RF1.11 PB2RF1.12 LV_BTN_DOWN RF1.12 PC7RF1.13 ;LV_LCD_RESET RF1.13 PB3RF1.14 LV_BTN_SELECT RF1.14 PA3

P407 RF1.15 LV_3.3V_EN RF1.15 PB4RF1.16_SCK LV_SPI_SCK RF1.16 PA2

RF1.17 ;LV_LCD_CS RF1.17 PB5RF1.18_MOSI LV_SPI_MOSI RF1.18 PA4RF1.20_MISO LV_SPI_MISO RF1.20 PA5

RF2.5 LV_ALS_OUT RF2.5 PA6RF2.6 LV_ALS_PWR RF2.6 PA7RF2.8 LV_ACC_PWR RF2.8 PD4

RF2.10 ;LV_ACC_CS RF2.10 PD5RF2.11 LV_LED_1 RF2.11 PC0

P411 RF2.12 ;LV_SDCARD_CS RF2.12 PD0RF2.13 LV_LED_2 RF2.13 PC1RF2.14 LV_ACC_INT2 RF2.14 PD1

RF2.15_RESET ;LV_BTN_RESET RF2.15 nRESETRF2.16 LV_ACC_INT1 RF2.16 PD2

P412 EM_UART_RX RF1.7_UART_RX RF1.7 PA0EM_UART_TX RF1.9_UART_TX RF1.9 PA1

EM_UART_CTS RF1.3_UART_CTS RF1.3 PB0EM_UART_RTS RF2.18_UART_RTS RF2.18 PD3

http://www.ti.com






5.11.2 XDS100v3 Emulator Bypass HeadersThe XDS100v3 Emulator bypass header, P408, is by default mounted with jumpers (see Figure 20),connecting the XDS100v3 Emulator to a mounted EVM or external target. By removing the jumpers onP408, the XDS100v3 Emulator can be disconnected from the target.

Figure 20. XDS100v3 Emulator Bypass Header (P408)

5.11.3 20-Pin ARM JTAG HeaderThe SmartRF06EB comes with a standard 20-pin ARM JTAG header [8] (see Figure 21), enabling theuser to debug an external target using the XDS100v3 Emulator. The pin-out of the ARM JTAG header isgiven in Table 16. Section 6 has more information on how to debug an external target using theXDS100v3 Emulator onboard the SmartRF06EB.

Figure 21. 20-Pin ARM JTAG Header (P409)

Table 16. 20-Pin ARM JTAG Header Pin-Out (P409)

Pin Signal Description EB Signal Name XDS Bypass HeaderP409.1 VTRef Voltage reference VDD_SENSE P408.19-20P409.2 VSupply Voltage supply NCP409.3 nTRST Test reset NCP409.4 GND Ground GNDP409.5 TDI Test data in RF2.17_JTAG_TDI P408.5-6P409.6 GND Ground GNDP409.7 TMS Test mode select RF2.4_JTAG_TMS P408.3-4P409.8 GND Ground GNDP409.9 TCK Test clock RF2.1_JTAG_TCK P408.1-2P409.10 GND Ground GNDP409.11 RTCK Return clock NCP409.12 GND Ground GNDP409.13 TDO Test data out RF2.19_JTAG_TDO P408.7-8P409.14 GND Ground GNDP409.15 nSRST System reset RF2.15_RESET; P408.9-10P409.16 GND Ground GNDP409.17 DBGRQ Debug request NCP409.18 GND Ground GNDP409.19 DBGACK Debug acknowledge NCP409.20 GND Ground GND

http://www.ti.com






5.11.4 10-Pin ARM Cortex Debug HeaderThe SmartRF06EB comes with a standard 10-pin ARM Cortex debug header [8] (see Figure 22), enablingthe user to debug an external target using the XDS100v3 Emulator. The ARM Cortex debug header islocated near the right hand edge of the EB. The header pin-out is given in Table 17. Section 6 has moreinformation on how to debug an external target using the XDS100v3 Emulator onboard the SmartRF06EB.

Figure 22. 10-Pin ARM Cortex Debug Header (P410)

Table 17. 10-Pin ARM Cortex Debug Header Pin-Out (P410)

Pin Signal Description EB Signal Name XDS Bypass HeaderP410.1 VCC Voltage reference VDD_SENSE P408.19-20P410.2 TMS Test mode select RF2.4_JTAG_TMS P408.3-4P410.3 GND Ground GNDP410.4 TCK Test clock RF2.1_JTAG_TCK P408.1-2P410.5 GND Ground GNDP410.6 TDO Test data out RF2.19_JTAG_TDO P408.7-8P410.7 KEY Key NCP410.8 TDI Test data in RF2.17_JTAG_TDI P408.5-6P410.9 GNDDetect Ground detect GNDP410.10 nRESET System reset RF2.15_RESET; P408.9-10

5.12 Current MeasurementThe SmartRF06EB provides two options for easy measurements of the current consumption of a mountedEVM. The following sections describe these two options in detail.

5.12.1 Current Measurement JumperSmartRF06EB has a current measurement header, J503, for easy measurement of EVM currentconsumption. Header J503 is located on the upper right hand side of the EB. By replacing the jumper withan ammeter, as shown in Figure 23, the current consumption of the mounted EVM can be measured.

http://www.ti.com






Figure 23. Measuring Current Consumption Using Jumper J503

Figure 24. Measuring Current Consumption Using Jumper J503

http://www.ti.com


XDS100v3

06EB XDS + EM

EM(EM domain)

XDS100v3

06EB XDS + external target

Ext. target(Target VDD)

EM(EM domain)

XDS100v3

External debugger + EM

External debugger

EM(EM domain)

P408(jumpers on)

P408(jumpers off)

J503(mounted)

J503(mounted)

J503(not mounted)

Current measurement jumper

XDS bypass headerP408(jumpers on)

Debug header

P409/P410P409/P410

www.ti.com Debugging an External Target Using SmartRF06EB




6 Debugging an External Target Using SmartRF06EBYou can easily use XDS100v3 Emulator onboard the SmartRF06EB to debug an external target. In thissection, it is assumed that the target is self-powered.

When debugging an external, self-powered target using SmartRF06EB, make sure to remove the jumperfrom the current measurement header (J503) as shown in the second scenario of Figure 25. In thisscenario, the onboard XDS100v3 senses the target voltage of the external target. In the left side scenarioof the same figure, the XDS100v3 senses the target voltage of the EB’s EVM domain.

CAUTIONHaving a jumper mounted on header J503 when debugging an external targetcauses a conflict between the EB’s EVM domain supply voltage and thetarget’s supply voltage. This may result in excess currents, damaging theonboard components of the SmartRF06EB or the target board.

In Figure 25, the right hand side scenario shows how it is possible to debug an EVM mounted on theSmartRF06EB using an external debugger. In this scenario, all the jumpers must be removed from theSmartRF06EB header P408 to avoid signaling conflicts between the onboard XDS100v3 Emulator and theexternal debugger.

Figure 25. Simplified Connection Diagram for Different Debugging Scenarios

http://www.ti.com


Debugging an External Target Using SmartRF06EB www.ti.com




6.1 20-Pin ARM JTAG HeaderThe SmartRF06EB has a standard 20-pin ARM JTAG header mounted on the right hand side (P409).Make sure all the jumpers on the XDS bypass header (P408) are mounted and that the jumper is removedfrom header J503.

Connect the external board to the 20-pin ARM JTAG header (P409) using a 20-pin flat cable as seen inFigure 26. Make sure pin 1 on P409 matches pin 1 on the external target. For more info about the 20-pinARM JTAG header and the XDS bypass header, see Section 5.11.2 and Section 5.11.3.

Figure 26. Debugging External Target Using SmartRF06EB

6.2 10-Pin ARM Cortex Debug HeaderThe SmartRF06EB has a standard 10-pin ARM Cortex Debug header mounted on the right hand side(P410). Make sure all the jumpers on the XDS bypass header (P408) are mounted and that the jumper isremoved from header J503.

Connect the external board to the 10-pin ARM JTAG header using a 10-pin flat cable. Make sure pin 1 onP410 matches pin 1 on the external target. For more info about the 10-pin ARM Cortex Debug header andthe XDS bypass header, see Section 5.11.2 and Section 5.11.4.

http://www.ti.com


VDD_SENSE

RF2.17_JTAG_TDI

RF2.4_JTAG_TMS

RF2.1_JTAG_TCK

RF2.19_JTAG_TDO

RF2.15_RESET

GND

2-pin cJTAG

4-pin JTAG

Optional

+

www.ti.com Debugging an External Target Using SmartRF06EB




6.3 Custom StrappingIf the external board does not have a 20-pin ARM JTAG connector nor a 10-pin ARM Cortex connector,the needed signals may be strapped from the onboard XDS100v3 Emulator to the external target board.

Make sure all the jumpers on the XDS bypass header (P408) are mounted and that the jumper is removedfrom header J503. Table 18 shows the signals that must be strapped between the SmartRF06EB and thetarget board. Table 19 shows additional signals that are optional or needed for debugging using 4-pinJTAG. Figure 27 shows where the signals listed in Table 18 and Table 19 can be found on the 20-pinARM JTAG header.

Table 18. Debugging External Target: Minimum Strapping (cJTAG support)

EB Signal Name EB Breakout DescriptionVDD_SENSE P409.1 Target voltage supplyGND P409.4 Common ground for EB and external

boardRF2.1_JTAG_TCK P409.9 Test clockRF2.4_JTAG_TMS P409.7 Test mode select

Table 19. Debugging External Target: Optional Strapping

EB Signal Name EB Breakout DescriptionRF2.17_JTAG_TDI P409.5 Test data in (optional for cJTAG)RF2.19_JTAG_TDO P409.13 Test data out (optional for cJTAG)RF2.15_RESET; P409.15 Target reset signal (optional)

Figure 27. ARM JTAG Header (P409) With Strapping to Debug External Target

http://www.ti.com


Frequently Asked Questions www.ti.com




7 Frequently Asked QuestionsQuestion: Nothing happens when I power up the evaluation board. Why?

Answer: Make sure that a power source is connected to the EB. Verify that the power source selectionswitch (S502) is set correctly according to your power source. When powering the EB from either batteriesor an external power source, S502 should be in the “BAT” position. When powering the EB over USB, theswitch should be in the “USB” position. Also, make sure the EVM current measurement jumper (J503) isshort circuited.

Question: Why are there two JTAG connectors on the SmartRF06EB, and which one should I use?

Answer: The SmartRF06EB comes with two different standard debug connectors: the 20-pin ARM JTAGconnector (P409) and the compact 10-pin ARM Cortex debug connector (P410). These debug connectorsare there to more easily debug external targets without the need of customized strapping. For more detailson how to debug external targets using the SmartRF06EB, see Section 6.

Question: Can I use the SmartRF06EB to debug an 8051 SoC such as CC2530?

Answer: No, you cannot debug an 8051 SoC using the SmartRF06EB.

Question: When connecting my SmartRF06EB to my PC, no serial port appears. Why?

Answer: It may be that the virtual COM port on the SmartRF06EB’s XDS100 channel B has not beenenabled. Section 3.1.2.1.1 describes how to enable the Vritual COM Port in the USB driver.

8 References1. SmartRF Studio Product Page2. FTDI USB Driver Page3. SmarRF Flash Programmer Product Page4. XDS100 Emulator Programmer wiki5. Electronic Assembly DOGM128-6 Data Sheet6. Bosch Sensortec BMA250 Data Sheet7. Osram SFH 57118. Cortex-M Debug Connectors

http://www.ti.com


http://www.ti.com/tool/smartrftm-studio

http://www.ftdichip.com/

http://www.ti.com/tool/flash-programmer

http://processors.wiki.ti.com/index.php/XDS100

http://www.lcd-module.com/eng/pdf/grafik/dogm128e.pdf

https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMA250E-DS004-06.pdf

http://www.osram-os.com

http://infocenter.arm.com/help/topic/com.arm.doc.faqs/attached/13634/cortex_debug_connectors.pdf

LOW VOLTAGE

PERIPHERALS

XDS100v3 - FPGAXDS100v3 - FTDI

EM INTERFACE/

LEVEL SHIFTERS POWER SUPPLYHIGH VOLTAGE

PERIPHERALS

1

FM2FIDUCIAL_MARK_1mm

1


H2HOLE_3

H3HOLE_3

1


H1HOLE_3

1


1


H4HOLE_3

1


TP13

TESTPOINT_PAD

TP12

TESTPOINT_PAD

Copyright © 2017, Texas Instruments Incorporated



Schematics

Appendix ASWRU321B–May 2012–Revised March 2017

Schematics

A.1 SmartRF06EB 1.2.1

Figure 28. SmartRF06EB - Top Level


PRG_TDO

EXT_SELECT

ADV_MODE

V_USB V_USB

RESET_NVCCPLF

T_TVD

VTARGET

UART_EN_N

P3.3VXDS

P1.8V

P3.3VXDS

P3.3VXDS +1.5V

P3.3VXDS P3.3VXDS

P3.3VXDS P3.3VXDS

P3.3VXDSP3.3VXDS

P3.3VXDS

P3.3VXDS

1

2 3

4STANDBY VDD

OUTPUT

ASDM

GND

O1

ASDM 100.000MHZ

1

2

3

Q1

BC846

1

2

3

4

5 6

7

8

9

10

INA+

INA-

OUTA

OUTB

V+

INB+

OPA2363 INB-

V-

ENBENA

U6

OPA2363

12345678910111213141516171819202122232425

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

GN

D

GN

D

GN

D

GN

D

GN

D

UA

RT

_E

N_

N

GN

D

VC

CP

LF

CL

K_

10

0M

P1

.5V

P3

.3V

XD

S

RE

SE

T_

N

DT

SA

_B

YP

CB

L_

DIS

EM

U1

PO

D_

RL

S

P3

.3V

XD

S

TVD

CLK_FAIL

SRST_OUT

RTCK

EMU0

EMU_EN

TRST

TMS

TDO

TDI

TCK

P1.5V

P3.3VXDS

SUSPEND

ALT_FUNC

PRG_TCK

PRG_TMS

PRG_TDI

PRG_TDO

PRG_TCK

PRG_TDI

PRG_TMS

P3.3VXDS

P3

.3V

XD

S

PR

G_

TD

O

PR

G_

TR

ST

P3

.3V

XD

S

VT

AR

GE

T

P1

.5V

VT

AR

GE

T

PWRGOOD

VTARGET

P1.5V

ADV_MODE

EXT_SELECT

T_DIS

VTARGET

IO32RSB0

GBC0/IO35RSB0

IO13RSB0

GAA0/IO00RSB0

GBC1/IO36RSB0

IO15RSB0

GAA1/IO01RSB0

GAC1/IO05RSB0

GBB0/IO37RSB0

IO19RSB0

GN

DQ

GB

A2

/IO4

1R

SB

0

GBA0/IO39RSB0

GBB1/IO38RSB0

GBA1/IO40RSB0

GC

C2

/IO5

9R

SB

0

GB

B2

/IO4

3R

SB

0

GD

C1

/IO6

1R

SB

0

IO09RSB0

GC

C1

/IO5

1R

SB

0

GD

C0

/IO6

2R

SB

0

GC

C0

/IO5

2R

SB

0

VM

V0

GD

A1

/IO6

5R

SB

0

VC

CIB

0

GAB1/IO03RSB0

GC

A1

/IO5

5R

SB

0

TD

O

VCC

GB

C2

/IO4

5R

SB

0

VC

C

VJT

AG

VCC

VCCIB1

VC

C

IO11RSB0

VMV1

NC

GC

A0

/IO5

6R

SB

0

TMS

GAC0/IO04RSB0

TR

ST

GDA2/IO70RSB1

IO84RSB1

TDI

VP

UM

P

IO87RSB1

GDB2/IO71RSB1

IO4

2R

SB

0

IO93RSB1

IO75RSB1

TCK

IO96RSB1

IO94RSB1

GDC2/IO72RSB1

IO97RSB1

IO81RSB1

GN

D

IO95RSB1

IO99RSB1

GC

B2

/IO5

8R

SB

0

GN

D

IO100RSB1

IO4

7R

SB

0

IO102RSB1

GEC2/IO104RSB1

GEB2/IO105RSB1

GEA2/IO106RSB1

GN

DQ

VM

V1

GE

A0

/IO1

07

RS

B1

GND

GE

A1

/IO1

08

RS

B1

GE

B0

/IO1

09

RS

B1

GE

B1

/IO1

10

RS

B1

GE

C0

/IO1

11

RS

B1

GF

A2

/IO1

20

RS

B1

GF

A1

/IO1

21

RS

B1

VC

CP

LF

GF

A0

/IO1

22

RS

B1

VC

OM

PL

F

GF

B0

/IO1

23

RS

B1

GF

B1

/IO1

24

RS

B1

IO1

29

RS

B1

IO1

30

RS

B1

GA

C2

/IO1

31

RS

B1

IO1

32

RS

B1

GA

A2

/IO6

7R

SB

1

GN

D

GA

B2

/IO6

9R

SB

1

GN

D

VC

CIB

1

VCCIB0

GND

IO6

8R

SB

1

IO28RSB0

IO25RSB0

IO22RSB0

IO07RSB0

GAB0/IO02RSB0A3

PN

12

5-Z

VQ

G1

00

U11

A3PN125-VQFP

1

2C2

3

C_

4U

7_

06

03

_X

5R

_K

_6

1

2

C27C_4U7_0603_X5R_K_6

1

2

C26

C_

4U

7_

06

03

_X

5R

_K

_6

1

2C2

4

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2C2

2

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C21C_100N_0402_X5R_K_10

1

2

C25

C_

10

0N

_0

40

2_

X5

R_

K_

10

2

1

D1

CD

BP

01

30

L-G

12

R1

L_

BE

AD

_1

02

_0

40

2

1

2 D4

LED_EL19-21SRC

1

2

J5

PINROW_SMD_1X2_2.54MM

1 2 T_TMS

R47 R_10K_0402_F

12

R5

0R

_1

K0

_0

40

2_

F

12

R4

9R

_1

K0

_0

40

2_

F

1 2

R27R_1K0_0402_F

1 2

R24R_5K1_0402_J

12

R5

4R

_5

K1

_0

40

2_

J

12

R4

1R

_1

0K

_0

40

2_

F

12

R4

8R

_1

0K

_0

40

2_

F

12

R4

6

R_

10

K_

04

02

_F

12

PWRGOOD

R3

1

R_

10

K_

04

02

_F

12

PRG_TMS

R4

3

R_

10

K_

04

02

_F

12

R4

4

R_

10

K_

04

02

_F

1 2 T_EMU4

R52 R_51_0402_G

1 2 T_EMU2

R51 R_51_0402_G

1 2 T_EMU3

R53 R_51_0402_G

1 2 T_TDI

R18 R_51_0402_G

1 2 T_RTCK

R23 R_51_0402_G

1 2 T_TRST

R19 R_51_0402_G

1 2 T_EMU5

R55 R_51_0402_G

1 2 T_TMS

R15 R_51_0402_G

1 2 T_TDO

R16 R_51_0402_G

1 2 T_TCK

R17 R_51_0402_G

1 2 CLK_100M

R33R_51_0402_G

12

R3

0

R_

12

0K

_0

40

2_

F

12

R2

9

R_

12

0K

_0

40

2_

F

12

R2

5R

_1

20

K_

04

02

_F

12

R4

2R

_2

20

_0

40

2_

J1 2 T_EMU1

R20 R_470_0402_F

1 2 T_EMU0

R22 R_470_0402_F

1 2 T_SRST

R21 R_470_0402_F

1

2

C34C_15N_0402_X7R_K_25

12

T_DIS

R1

2R

_0

_0

40

2

1

2

3 4

5T_TVD

T_TDI T_TDO

T_RTCK

IO3IO2

IO1

GND TPD4E002

IO4

U8TPD4E002

1

2

3 4

5T_DIS

T_TRST T_EMU2

T_TMS

IO3IO2

IO1

GND TPD4E002

IO4

U7TPD4E002

1

2

3 4

5T_TCK

T_EMU0 T_SRST

T_EMU1

IO3IO2

IO1

GND TPD4E002

IO4

U9TPD4E002

1

2

3 4

5T_EMU5

T_EMU3 GND

T_EMU4

IO3IO2

IO1

GND TPD4E002

IO4

U12TPD4E002

PRG_TRSTTP7Testpoint_Circle_40mils

PRG_TCKTP6Testpoint_Circle_40mils

PRG_TDITP5Testpoint_Circle_40mils

TP9Testpoint_Circle_40mils

TP8

Testpoint_Circle_40mils

PRG_TMSTP4Testpoint_Circle_40mils

PRG_TDOTP3


The XDS100 is connected to the EM through

connector P408. See the EM interface page

for details.


SmartRF06EB 1.2.1 www.ti.com



Schematics

Figure 29. SmartRF06EB - XDS100v3 - FPGA

http://www.ti.com


PWREN

V_USB

USBDP

EEPROM_DATA

EEPROM_CS

EEPROM_CLK

P3.3VXDS

P3.3VXDSP3.3VXDS

P3.3VXDSP3.3VXDS

P3.3VXDS

P3.3VXDS

P3.3VXDS

+1.5V

P3.3VXDS

P3.3VXDS

P3.3VXDS

P3.3VXDS P3.3VXDS+1.5V P1.8V+1.5V +1.5V P1.8V P1.8V P1.8V

VBUS

P1.8V

P1.8V

P3.3VXDS P3.3VXDS

12

R5

R_

1K

0_

04

02

_F

1

2

3

4

5

6

7

D-

VBUS

D+

ID

GND

Shield

Shield

P1USB-B_MICRO

1

2

3 4

5

6

GND

DO

CLK

93AA46B CS

VCC

DIN

U193AA46B

1

2

C9

C_

4U

7_

06

03

_X

5R

_K

_6

1

2C15

C_4U7_0603_X5R_K_6

1

2C19

C_4U7_0603_X5R_K_6

1

2

C3

C_

4U

7_

06

03

_X

5R

_K

_6

1

2

C2

8

C_

4U

7_

06

03

_X

5R

_K

_6

1

2C18

C_

27

P_

04

02

_N

P0

_J_

50

1

2C13

C_

27

P_

04

02

_N

P0

_J_

50

1

2

C2

9

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C6

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C1

2

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C8C_100N_0402_X5R_K_10

1

2

C17C_100N_0402_X5R_K_10

1

2

C1

1

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C20C_100N_0402_X5R_K_10

1

2

C3

0

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C5

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C4

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C1

6

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C1

4

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C3

1

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

3

4

5

6

7

8

9

10 11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

USBDM

TCK

TDI

TDO

TMS

TRST

EMU_EN

EMU0

RTCK

SRST_OUT

CLK_FAIL

TVD

POD_RLS

EMU1

CBL_DIS

DTSA_BYP

ALT_FUNC

SUSPEND

PRG_TCK

PRG_TDI

PRG_TDO

PRG_TMS

PRG_TRST

PWREN

EEPROM_DATA

EEPROM_CLK

EEPROM_CS

EECLK

EECS

RESET

REF

DP

FT2232H

DM

TEST

VREGOUT

OSCO

BCBUS7

BCBUS6

BCBUS4

BCBUS3

BCBUS2

BCBUS1

VC

OR

E

BDBUS7

BDBUS6

VREGIN

BDBUS5

BDBUS4

BDBUS3

BDBUS2

BDBUS1

VC

CIO

ACBUS7

ACBUS6

ACBUS5

ACBUS3

ADBUS7

VC

OR

E

OSCI

ADBUS6

BCBUS5

ADBUS3

VP

HY

SUSPEND

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

ACBUS4

AG

ND

EEDATA

BCBUS0

VC

OR

E

ACBUS0

BDBUS0

ACBUS2

ADBUS2

VC

CIO

VC

CIO

PWREN

ADBUS4

VC

CIO

ADBUS1

ADBUS5

VP

LL

ACBUS1

ADBUS0

U4

FT2232HL

12

R8

L_BEAD_102_0402

12

R7

L_BEAD_102_0402

1

2 D2

LED_EL19-21SYGC

12

R2

R_

0_

04

02

12

R3

R_

1K

0_

04

02

_F

12

R9

R_

1K

0_

04

02

_F

12

R4

R_

1K

0_

04

02

_F

12

R6

R_

2K

7_

04

02

_F

12

R1

0R

_1

2K

_0

40

2_

F

12

R2

8R

_2

70

_0

40

2_

F

1

2

3 4

5

GND

IO2

IO1

NC

VCC

TPD2E001

U3TPD2E001

1

2

3

4

Y1X_12.000/30/30/10/20


www.ti.com SmartRF06EB 1.2.1



Schematics

Figure 30. SmartRF06EB - XDS100v3 - FTDI

http://www.ti.com


VDD_MEASURED

LV_SDCARD_CS

LV_LED_2

LV_BTN_RESET

LV_ACC_INT1

LV_ACC_INT2

RF2.12

RF2.13

RF2.14

RF2.15_RESET

RF_VDD1

RF_VDD2

RF1.4

RF1.5

RF1.6

RF1.8

RF1.10

RF1.11

RF1.12

RF1.13

RF1.14

RF1.16_SPI_SCK

RF1.17

RF1.18_SPI_MOSI

RF1.20_SPI_MISO

RF2.5

RF2.6

RF2.8

RF2.10

RF2.11

LV_LED_4

LV_BTN_LEFT

LV_BTN_RIGHT

LV_BTN_UP

LV_LCD_MODE

LV_BTN_DOWN

LV_LCD_RESET

LV_BTN_SELECT

LV_3.3V_EN

LV_SPI_SCK

LV_LCD_CS

LV_SPI_MOSI

LV_SPI_MISO

LV_ALS_OUT

LV_ALS_PWR

LV_ACC_PWR

LV_ACC_CS

LV_LED_1

RF1.2

RF1.4

RF1.5

RF1.6

RF1.8

RF1.10

RF1.11

RF1.12

RF1.13

RF1.14

RF1.7_UART_RX

RF1.9_UART_TX

RF1.3_UART_CTS

RF2.18_UART_RTS

VDD_MEASURED

LV_BTN_RESET

VDD_SENSE

LO_VDD

LO_VDD

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

RF2.1_JTAG_TCK GNDRF_VDD2 RF2.4_JTAG_TMSRF2.5 RF2.6

RF_VDD1 RF2.8

RF_VDD1 RF2.10

RF2.11 RF2.12

RF2.13 RF2.14RF2.15_RESET RF2.16RF2.17_JTAG_TDI RF2.18_UART_RTSRF2.19_JTAG_TDO GND

RF2SMD_HEADER_2X10

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

LV_LED_3 RF1.2

P403PINROW_SMD_2X10_2.54MM

1

2

3

4

5

6

7

8

9

10

P406

PIN

RO

W_

1X

10

1

2

3

4

5

6

P412

PIN

RO

W_

1X

6

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

VDD_SENSE

GND

RF2.17_JTAG_TDI GND

RF2.4_JTAG_TMS GND

RF2.1_JTAG_TCK GND

GND

RF2.19_JTAG_TDO GND

RF2.15_RESET GND

GND

GND

P409


1

2

3

4

5

6

7

8

9

10

RF1.15

RF1.16_SPI_SCK

RF1.17

RF1.18_SPI_MOSI

RF1.20_SPI_MISO

RF2.5

RF2.6

RF2.8

RF2.10

RF2.11

P407

PIN

RO

W_

1X

10

1

2

C4

03

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C5

07

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C4

04

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

C5

08

C_

10

0N

_0

40

2_

X5

R_

K_

10

1 2

R402

R_0_0603

1 2 3 4

S606

PUSH_BUTTON_SKRAAK

1 2

J503


1 2

3 4

5 6

7 8

9 10 RF2.16

P405


1 2

3 4

5 6

7 8

9 10

VDD_SENSE RF2.4_JTAG_TMS

RF2.1_JTAG_TCKRF2.19_JTAG_TDORF2.17_JTAG_TDIRF2.15_RESET

P410


1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

T_TCK RF2.1_JTAG_TCK

T_TMS RF2.4_JTAG_TMS

T_TDI RF2.17_JTAG_TDI

T_TDO RF2.19_JTAG_TDO

T_SRST RF2.15_RESET

T_EMU3 RF1.7_UART_RX

T_EMU2 RF1.9_UART_TX

T_EMU5 RF1.3_UART_CTS

T_EMU4 RF2.18_UART_RTS

T_TVD VDD_SENSE

P408


1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

GND RF1.2RF1.3_UART_CTS RF1.4RF1.5 RF1.6RF1.7_UART_RX RF1.8RF1.9_UART_TX RF1.10RF1.11 RF1.12RF1.13 RF1.14RF1.15 RF1.16_SPI_SCKRF1.17 RF1.18_SPI_MOSIGND RF1.20_SPI_MISO

RF1SMD_HEADER_2X10

1 2

3 4

CURMEAS_OUTPUT

R2

R1

IN-

1.6

M

GN

D

OU

T

1.6

MIN

A2

16

IN+

U5

04

INA

21

6A

3

1

2

C402

C_

06

03

1 2

R502R_0R15_0603_F

1

2

C401

C_

08

05

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

RF1.15

P404


1

2

3

4

5

RF2.12

RF2.13

RF2.14

RF2.15_RESET

RF2.16

P411

PIN

RO

W_

1X

5

TP10


TP11

TESTPIN_SMALL

TP20

TESTPIN_SMALL

EM DEBUG CONNECTIONEM CONNECTORS

10-pin ARM Cortex

JTAG Connector

RESET

Optional

RC filter

EM CURRENT MEASUREMENT

20-pin ARM JTAG Connector

EM <--> EB BREAKOUT and PROBE HEADERS

Rshunt = 0.15 Ohm

Gain = 100

Vin = Ishunt x Rshunt

Vout = Vin x Gain

Saturation point for INA216

-----------------------------

Vout_max = LO_VDD (2.1V to 3.6V)

Vin_max = LO_VDD / 100 = 21mV to 36mV

Ishunt_max = 140mA to 240mA

Bypass jumper block for connection

between EM and XDS100v3





Schematics

Figure 31. SmartRF06EB - EVM Interfaces/Level Shifters

http://www.ti.com


V_USB

P3.3V

V_USB

P2.1V

V_UNREG

V_UNREG

VBAT

VBUS

P3.3VXDS

VBAT

HI_VDD

P3.3VXDS

+1.5V

P3.3VXDSP3.3VXDS

LO_VDD

3

12

+

B5

03

CR

20

32

_S

OC

KE

T

1

2

34

5

6

78

VOUT

EN

NC

VIN

GND

NR

TPS73533

GND

U2

TPS73533

1

2

C3

3C

_1

00

N_

04

02

_X

5R

_K

_1

0

1 2 3

456

V_UNREG

V_USB

S501 SMD_SWITCH_DPDT

21

D3

BA

T5

4J

12

3

V_UNREG

R1

1R

_0

_0

40

2_

3P

OR

T_

2-3

1

2C3

2C

_1

00

N_

04

02

_X

5R

_K

_1

0

12

345

6

P3.3VP2.1VS502

SMD_SWITCH_DPDT

1

2

C5

03

C_

2U

2_

04

02

_X

5R

_M

_6

P3

VD

C

1

2

C5

02

C_

2U

2_

04

02

_X

5R

_M

_6

P3

VD

C

1

2

C1

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2C5

01

C_

2U

2_

04

02

_X

5R

_M

_6

P3

VD

C

1

2

+B501

1X

AA

A_

KE

YS

TO

NE

1

2

+B502

1X

AA

A_

KE

YS

TO

NE

1

2

C2

C_

18

N_

06

03

_X

7R

_J_

50

1

2

C1

0C

_1

00

N_

04

02

_X

5R

_K

_1

0

12

L502L_2U2_0805_N_LQM21

1

2

C7

C_

4U

7_

06

03

_X

5R

_K

_6

12L501

L_2U2_0805_N_LQM21

1

2

J5

02

PIN

RO

W_

SM

D_

1X

2_

2.5

4M

M

1

2

J5

01

PIN

RO

W_

SM

D_

1X

2_

2.5

4M

M

12

R4

03

R_

10

K_

04

02

_F

1

2

C504C_2U2_0402_X5R_M_6P3VDC

12

V_UNREG

R5

01

R_

47

K_

04

02

_F

2

4

1

3

LV_3.3V_EN

ON GND

VOUTVIN

U601

TPS22902

1

2

3 4

5

SUSPENDTLV70015

NC4

VOUT

EN

GND

VIN

U5

TLV70015

12

R3

2R

_1

0K

_0

40

2_

F

1

2

34

5

6STAT

SW

VINGND

ON/BYP

VOUT

U501

TPS62730

1

2

3

4

56

7

8

9

10

11

V_UNREG

LV_3.3V_EN

FB

Thermal

VINA

L1PS

GND

PGND

L2

VINEN

VOUT

U502

TPS63031

TP2

Test

po

int_

Cir

cle

_4

0m

ils

TP18


TP1

Test

po

int_

Cir

cle

_4

0m

ils

TP17


TP19

Test

po

int_

Cir

cle

_4

0m

ils

OF

F

MAIN ON/OFF SWITCH

2.1V

REG

POWER SELECT SWITCH

USB (5V)

ON

USB TO 1.5V (FPGA)

3.3V FOR HV PERIPHERALS

3.3V

REG

USB TO 3.3V

BATTERIES

BATTERY or

EXTERNAL

BA

TT

ER

Yo

r

EX

TE

RN

AL

XDS 3.3V

BATTERY REGULATORS

REGULATOR

BYPASS

JUMPER

POWERED from USB

(XDS100v3)

XDS100v3 VOLTAGE REGULATORS

BUCK/BOOST (3.3V)BUCK (2.1V)

CONNECTOR FOR

EXTERNAL POWER

POWERED from BATTERY or

External Power Supply

2.1V FOR EM and LV PERIPHERALS

US

B

Software controlled switch

for enabling the "High Voltage"

domain for board peripherals.


www.ti.com SmartRF06EB 1.2.1



Schematics

Figure 32. SmartRF06EB - Power Supply

http://www.ti.com


LV_ALS_OUT

LO_VDD

LO_VDD

1

2

3

4

5

6

7

8 9

10

11

12

LV_SPI_MISO

LV_SPI_MOSI

LV_ACC_INT1

LV_ACC_INT2

LV_ACC_PWR

LV_ACC_CS

LV_SPI_SCKINT1

VDDIO

BMA250NC

VDD

GNDIO

INT2

SDx

PS

CSB

SCx

3-AXIS

Accelerometer

GND

SDO

U602BMA250

1

2C6

14

C_

10

0N

_0

40

2_

X5

R_

K_

10

1

2

LV_ACC_PWR

C612C_100N_0402_X5R_K_10

1

2

C615C_100N_0402_X5R_K_10

1 2LV_LED_1

D601

LED_EL19-21SRC

1 2LV_LED_4

D604

LED_EL19-21SURC

1 2LV_LED_3

D603

LED_EL19-21SYGC

1

2 3

4

LV_ALS_PWR

Iout

GND

GND

VDDLS601

LIGHT_SENSOR_SFH5711

1 2 3 4

LV_BTN_LEFTS601

PUSH_BUTTON_SKRAAK

1 2 3 4

LV_BTN_RIGHTS602

PUSH_BUTTON_SKRAAK

1 2 3 4

LV_BTN_SELECTS603

PUSH_BUTTON_SKRAAK

1 2 3 4

LV_BTN_UPS604

PUSH_BUTTON_SKRAAK

1 2 3 4

LV_BTN_DOWNS605

PUSH_BUTTON_SKRAAK

12

R6

13

R_

22

K_

06

03

_G

1 2LV_LED_2

D602

LED_EL19-21UYC_A2

12

R608R_680_0402_G

12

R609R_680_0402_G

12

R610R_680_0402_G

12

R607R_820_0402_G

BUTTONS AMBIENT LIGHT SENSOR

YELLOW

GREEN

RED

ACCELEROMETERLEDS

RED-ORANGE

Accelerometer

RECOMMENDED 2.3V-5.5V

Needs from 1.62V-3.6V


HV_SPI_MOSI

HV_SPI_SCK

HV_SPI_MISO

LO_VDD

HI_VDD

HI_VDD

HI_VDD

HI_VDD

HI_VDD

LO_VDD

HI_VDD

LO_VDD

LO_VDD

LO_VDD

HI_VDD

HI_VDD

HI_VDD

HI_VDD

HI_VDD

LO_VDD

LO_VDD

LO_VDD

1

2

C601

C_

1U

_0

40

2_

X5

R_

K_

6P

3

NC

(C2

-)

NC

(A3

+)

NC

(A2

+)

NC

(A1

+)

V2

CA

P2

P

VD

D

VS

S

RS

T

CA

P3

P

SI

SC

L

INSERT:

1 pc SIP_SOCKET_SMD_1X20_2.54MM

2 pc SIP_SOCKET_SMD_1X3_2.54MM

NC

(C1

-)

NC

(C3

-)

CA

P1

P

A0

CA

P2

N

VO

UT

CA

P1

N

VS

S

V0

VD

D2

CS

1B

V3

V4

V1

LCD

LCD1

DOGM128W-6_NO_CON

1

2

3

4

5

6

7

8 9

10

11

12

13

14

15

16

LV_SPI_SCK

LV_SPI_MOSI

LV_SPI_MISO HV_SPI_MISO

HV_SPI_MOSI

HV_SPI_SCK

LV_SDCARD_CS

LV_3.3V_EN

GND

VCCA

1A1

1A2

2DIR

2A1

2A2

2OE

1B1

2B1

VCCB

2B2

1DIR 1OE

GND

1B2

U401

SN74AVC4T245

1

2

3

4

5

6

7

8

HV_SDCARD_CS

HV_SPI_MOSI

HV_SPI_SCK

HV_SPI_MISO

VDD

N/A

GND

N/A

CS

DI/MOSI

DO/MISO

SCLK

MicroSD

SPI-Mode

J601MICROSD-SPI

1

2

C605

C_

1U

_0

80

5_

X7

R_

K_

16

1

2C6

04

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C607

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C609

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C608

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C6

02

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C6

03

C_

1U

_0

80

5_

X7

R_

K_

16

1

2C6

10

C_

1U

_0

80

5_

X7

R_

K_

16

12

R6

02

R_

10

K_

04

02

_F

12

R6

14

R_

0_

06

03

1

2

C613C_100N_0402_X5R_K_10

12

R6

01

R_

10

K_

04

02

_F

1

2

C408

C_100N_0402_X5R_K_10

12

R6

12

R_

10

K_

04

02

_F

1

2

C407

C_100N_0402_X5R_K_10

12

R1

3R

_1

0K

_0

40

2_

F

1

2

3

LV_3.3V_EN

LV_3.3V_EN

Q2

2N7002F

1

2

C405

C_100N_0402_X5R_K_10

12

R6

06

R_

0_

06

03

1 2 3

P3SIP_SOCKET_SMD_1X3_2.54MM

12

R6

15

R_

0_

06

03

1

2

C606

C_

1U

_0

80

5_

X7

R_

K_

16

1

2

C406

C_100N_0402_X5R_K_10

12

R6

03

R_

39

_0

60

3

12

R6

04

R_

39

_0

60

3

12

R6

05

R_

39

_0

60

3

1 2 3


123456789101112

13

14

15

16

17

18

19

20

HV_SPI_MOSI

HV_SPI_SCK

HV_LCD_MODE

HV_LCD_RESET

HV_LCD_CS


1

2

3

4

5

6

7

8 9

10

11

12

13

14

15

16

LV_LCD_RESET

LV_LCD_CS

LV_LCD_MODE

LV_SDCARD_CS HV_SDCARD_CS

HV_LCD_MODE

HV_LCD_CS

HV_LCD_RESET

LV_3.3V_EN

LV_3.3V_EN

GND

VCCA

1A1

1A2

2DIR

2A1

2A2

2OE

1B1

2B1

VCCB

2B2

1DIR 1OE

GND

1B2

U402

SN74AVC4T245




LCD

LEVEL SHIFTERS TRANSLATION :

MICROSD

U401:

LO HI

1A1 --> 1B1

1A2 --> 1B2

2A1 <-- 2B1

2A2 <-- 2B2

U402:

LO HI

1A1 --> 1B1

1A2 --> 1B2

2A1 --> 2B1

2A2 --> 2B2

LEVEL SHIFTERS





Schematics

Figure 33. SmartRF06EB - High Voltage Peripheral

Figure 34. SmartRF06EB - Low Voltage Peripherals

http://www.ti.com


www.ti.com Revision History



Revision History

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from A Revision (May 2012) to B Revision ...................................................................................................... Page

• Added note of change in accelerometer................................................................................................ 5

http://www.ti.com


STANDARD TERMS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordancewith the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License

Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused byneglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that havebeen altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specificationsor instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality controltechniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or creditUser's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warrantyperiod to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair orreplace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall bewarranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or softwareassociated with the kit to determine whether to incorporate such items in a finished product and software developers to writesoftware applications for use with the end product. This kit is not a finished product and when assembled may not be resold orotherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the conditionthat this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit mustoperate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow theinstructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):

This is a class A product intended for use in environments other than domestic environments that are connected to alow-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment thisproduct may cause radio interference in which case the user may be required to take adequate measures.

4 EVM Use Restrictions and Warnings:4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling

or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.




6. Disclaimers:6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT

LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALLFAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUTNOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESSFOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADESECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BECONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL ORINTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THEEVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY ORIMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLYWHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGALTHEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OFSUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL ORREINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OFUSE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TIMORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HASOCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDEDHEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR INCONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAREVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARECLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2017, Texas Instruments Incorporated

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who aredeveloping applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms ofthis Notice.TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TIproducts, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,enhancements, improvements and other changes to its TI Resources.You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing yourapplications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. Yourepresent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures thatmight cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, youwill thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted anytesting other than that specifically described in the published documentation for a particular TI Resource.You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that includethe TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TOANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTYRIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationregarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty orendorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES ORREPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TOACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OFMERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUALPROPERTY RIGHTS.TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOTLIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IFDESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH ORARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THEPOSSIBILITY OF SUCH DAMAGES.You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-compliance with the terms and provisions of this Notice.This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluationmodules, and samples (http://www.ti.com/sc/docs/sampterms.htm).

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2017, Texas Instruments Incorporated

http://www.ti.com/sc/docs/stdterms.htm

http://www.ti.com/lit/pdf/SSZZ027

http://www.ti.com/lit/pdf/SSZZ027

http://www.ti.com/sc/docs/sampterms.htm

smartrf06 evaluation board user's guide (rev. b) · 5.2 power sources ... 18 5.7 ambient light...

Documents