smartpac-3000 user manual · 2.5 sumit-ita ” for detailed information. figure 1-9: flexible...

TPM SPC-3000 User Manual

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SmartPAC

SPC-3000 User Manual

Version: V2.1 2017Dec01

To properly use the product, read this manual thoroughly is necessary.

Part No.: 81-00SPC300-021


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Revision History Date Revision Description Author

2016/3/30 1.0 Document creation. Kelvin 2016/8/12 1.1 Revise GPIO signal circuit. Kelvin

2016/11/17 2.0 Document revision. Lyra 2017/12/01 2.1 Add SPE-L121D-2PA and SPE-C116D description Kelvin


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© Copyright 2012 TPM The product, including the product itself, the accessories, the software, the manual and the software description in it, without the permission of TPM Inc. (“TPM”), is not allowed to be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except the documentation kept by the purchaser for backup purposes. The names of products and corporations appearing in this manual may or may not be registered trademarks, and may or may not have copyrights of their respective companies. These names should be used only for identification or explanation, and to the owners’ benefit, should not be infringed without any intention. The product’s name and version number are both printed on the product itself. Released manual visions for each product design are represented by the digit before and after the period of the manual vision number. Manual updates are represented by the third digit in the manual vision number. Trademark MS-DOS and Windows 95/98/NT/2000/XP, Visual Studio, Visual C++, Visual BASIC are registered

trademarks of Microsoft. BCB (Borland C++ Builder) is registered trademark of Borland. Other product names mentioned herein are used for identification purposes only and may be trademarks

and/or registered trademarks of their respective companies.


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Electrical safely To prevent electrical shock hazard, disconnect the power cable from the electrical outlet before

relocating the system. When adding or removing devices to or from the system, ensure that the power cables for the devices

are unplugged before the signal cables are connected. Disconnect all power cables from the existing system before you add a device.

Before connecting or removing signal cables from motherboard, ensure that all power cables are unplugged.

Seek professional assistance before using an adapter or extension card. These devices could interrupt the grounding circuit.

Make sure that your power supply is set to the voltage available in your area. If the power supply is broken, contact a qualified service technician or your retailer. Operational safely Please carefully read all the manuals that came with the package, before installing the new device. Before use ensure all cables are correctly connected and the power cables are not damaged. If you

detect and damage, contact the dealer immediately. To avoid short circuits, keep paper clips, screws, and staples away from connectors, slots, sockets and

circuitry. Avoid dust, humidity, and temperature extremes. Do not place the product in any area where it may

become wet. If you encounter technical problems with the product, contact a qualified service technician or the

dealer.


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Contents CONTENTS .................................................................................................................................................................................. 5

1. SPC-3000 INTRODUCTION ....................................................................................................................................................... 8

1.1. INTRODUCTION ............................................................................................................................................................................ 8 1.1.1. Architecture ............................................................................................................................................................ 8 1.1.1. Mechanical Dimension .......................................................................................................................................... 9

1.2. FEATURES.................................................................................................................................................................................. 11 1.2.1. Fan-less Design .................................................................................................................................................... 11 1.2.2. Flexible Extension ............................................................................................................................................... 12 1.2.3. High Security ....................................................................................................................................................... 13

2. CPU BOARD .......................................................................................................................................................................... 14

2.1. BLOCK DIAGRAM ........................................................................................................................................................................ 14 2.2. BOARD LAYOUT .......................................................................................................................................................................... 15 2.3. EXTERNAL I/O CONNECTORS ........................................................................................................................................................ 16 2.4. COM 1/2 SERIAL PORT .............................................................................................................................................................. 17 2.5. USB3 PORT .............................................................................................................................................................................. 18 2.6. LAN PORT ................................................................................................................................................................................ 19 2.7. DVI-I PORT ............................................................................................................................................................................... 20 2.8. MEMORY .................................................................................................................................................................................. 22 2.9. SUMIT-ITA .............................................................................................................................................................................. 22

3. SPC-3201D WITH SPC-C114D ................................................................................................................................................ 23

3.1. SPECIFICATIONS .......................................................................................................................................................................... 23 3.2. INTRODUCTION .......................................................................................................................................................................... 24 3.3. SPE-C114D BOARD LAYOUT ........................................................................................................................................................ 25 3.4. POWER CONNECTOR ................................................................................................................................................................... 25

3.4.1. DC24V Input ........................................................................................................................................................ 26 3.4.2. ON/OFF Switch ................................................................................................................................................... 26

3.5. ISOLATED 8DI/8DO ................................................................................................................................................................... 27 3.6. EXTERNAL I/O CONNECTORS ........................................................................................................................................................ 29

3.6.1. LED Indicator ...................................................................................................................................................... 29 3.6.2. COM 3/4 and 5/6 Serial Port................................................................................................................................ 30 3.6.3. USB3 Port ............................................................................................................................................................ 31 3.6.4. miniPCIe .............................................................................................................................................................. 32

4. SPC-3204D WITH SPC-C116D ................................................................................................................................................ 33

4.1. SPECIFICATIONS .......................................................................................................................................................................... 33 4.2. INTRODUCTION .......................................................................................................................................................................... 34 4.3. SPE-C116D BOARD LAYOUT ........................................................................................................................................................ 35


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4.4. POWER CONNECTOR ................................................................................................................................................................... 35 4.4.1. DC24V Input ........................................................................................................................................................ 36 4.4.2. ON/OFF Switch ................................................................................................................................................... 36

4.5. ISOLATED 8DI/8DO ................................................................................................................................................................... 37 4.6. EXTERNAL I/O CONNECTORS ........................................................................................................................................................ 39

4.6.1. LED Indicator ...................................................................................................................................................... 40 4.6.2. COM 3/4 and 5/6 Serial Port................................................................................................................................ 41 4.6.1. COM 7/8 .............................................................................................................................................................. 42 4.6.2. USB2 Port ............................................................................................................................................................ 43 4.6.3. USB3 Port ............................................................................................................................................................ 44

5. SPC-3221 WITH SPC-L122D-CSM ........................................................................................................................................... 45

5.1. SPECIFICATIONS .......................................................................................................................................................................... 45 5.2. INTRODUCTION .......................................................................................................................................................................... 46 5.3. SPE-L122D-CSM BOARD LAYOUT................................................................................................................................................ 47 5.4. POWER CONNECTOR ................................................................................................................................................................... 47


5.5. CN1 ISOLATED 8DI/8DO ............................................................................................................................................................ 49 5.6. EXTERNAL I/O CONNECTORS ........................................................................................................................................................ 51

5.6.1. LED Indicator ...................................................................................................................................................... 52 5.6.2. USB3 Port ............................................................................................................................................................ 53 5.6.3. COM 3/4 and 5/6 Serial Port................................................................................................................................ 54 5.6.4. Mnet Motionnet Rings ......................................................................................................................................... 55

5.7. MOTIONNET .............................................................................................................................................................................. 56

6. SPC-3212 WITH SPC-L121D-2PA ............................................................................................................................................ 57

6.1. SPECIFICATIONS .......................................................................................................................................................................... 57 6.2. INTRODUCTION .......................................................................................................................................................................... 58 6.3. SPE-L121D-2PA BOARD LAYOUT ................................................................................................................................................. 59 6.4. POWER CONNECTOR ................................................................................................................................................................... 59


6.5. ADVANCED DIGITAL I/O ............................................................................................................................................................... 61 6.6. EXTERNAL I/O CONNECTORS ........................................................................................................................................................ 64

6.6.1. LED Indicator ...................................................................................................................................................... 65 6.6.2. USB3 Port ............................................................................................................................................................ 66 6.6.3. USB2 Port ............................................................................................................................................................ 67 6.6.4. Mnet Motionnet Ring ........................................................................................................................................... 68 6.6.5. PoE Power Ethernet ............................................................................................................................................. 69 6.6.6. CN2 Analog Output ............................................................................................................................................. 70


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6.7. MOTIONNET .............................................................................................................................................................................. 71

7. APPENDIX A: TPM899 BIOS SETUP ........................................................................................................................................ 72

7.1. MAIN MENU ............................................................................................................................................................................. 72 7.2. SELECT SERIAL PORT 2 TRANSMISSION PROTOCOL ............................................................................................................................ 73 7.3. SIO POWER FAILURE ................................................................................................................................................................... 74

8. APPENDIX B: EEPROM .......................................................................................................................................................... 75

9. APPENDIX C: PIN DEFINITION OF SUMIT-ITA ......................................................................................................................... 76

10. APPENDIX D: INTERNAL USB DONGLE INSTALLATION .......................................................................................................... 77

11. APPENDIX E: CABLE FOR COM PORT ................................................................................................................................... 79

11.1. Y CABLE FOR COM 1/2 ............................................................................................................................................................ 79 11.2. Y-CABLE FOR COM 3/4 AND 5/6 (OPTION) ................................................................................................................................. 81

12. APPENDIX F: MOTIONNET UTILITY - MYLINK ....................................................................................................................... 83

12.1. LOGIN OF MYLINK .................................................................................................................................................................... 84


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1. SPC-3000 Introduction

1.1. Introduction

Figure 1-1: SmartPAC SPC-3000

1.1.1. Architecture The architecture of SPC-3000 = Heat sink + TPM899’s MB + SPE SUMIT add-on card + SSD-OS + Chassis + Front panel


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Figure 1-2: Heat Sink, MB, SPE, Chassis, Front Panel

1.1.1. Mechanical Dimension

Figure 1-3: The dimensions of SmartPAC SPC-3000


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Figure 1-4: The wall mount drawing of SmartPAC SPC-3000

Figure 1-5: The DIN rail drawing of SmartPAC SPC-3000


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1.2. Features

1.2.1. Fan-less Design SPC-3000 Series are all fan-less design. Hence, the size of SPC-3000 is form factor. The dimension is

smaller than any other embedded system. It is suitable for different environment. With fan-less design, the design of Heat Sink is important. The CPU and Heat Sink can directly contact

together with thermal grease to increase the efficiency of thermal conductivity.

Figure 1-6: Thermal conductivity

The surface area with curved shape increased about 50% will lead to high efficiency of dissipating.

Figure 1-7: Heat dissipation

Thermal grease

CPU

Heat sink


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Vertical wall-mounted designed will result in better convection because heat can come out easily.

Figure 1-8: Convection

1.2.2. Flexible Extension

SPE add-on board is an extensible card. It can be customized for different function. SPE and MB can connect together through the connector SUMIT-ITA. Please refer to “2.5 SUMIT-ITA” for detailed information.

Figure 1-9: Flexible Extension


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1.2.3. High Security SPC-3000 has EEPROM on the CPU board and Secure IC on SUMIT Add-on card. Users can choose to execute AES encryption on EEPROM or Secure IC. SI Key is provided by users. A registration key, which can be stored into storage device and EEPROM, can be generated through AES encryption system. When users load the program into SPC-3000 series, AES can prevent other people and TPM from duplicating the program.

Figure 1-10: AES Encryption System

SPC-3000 provides one inner USB socket for user to protect USB Dongle. Please refer to “Appendix D” for the internal USB Dongle installation.

SI Key AES Secure IC

Registration

Storage Device EEPROM

Users TPM


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2. CPU Board

2.1. Block Diagram

Figure 2-1: Diagram of TPM899

System Hardware

CPU Intel ® Pentium ® Processor N3710 1.6 GHz / 2.56 GHz (Boost), 4 Cores / 4 Threads 2MB L2 Cache

Memory Dual channel supports 2 DDR3L SO-DIMM, up to 8GB Storage SATA III for HDD/SSD

Graphics Intel® HD Graphics 405 DVI-D : DVI-I + VGA

Audio Internal stereo headphone, internal microphone I/O Interface

Serial Ports 1 DB15 serial port: 1 RS-232, 1 RS-232/422/485 with automatic data flow control

LAN 2 Intel® GbE I211-AT

USB 3.0 Front : 2 USB3.0 SUMIT ITA : 2 USB3.0

Table 2-1: Specification of CPU Board


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2.2. Board Layout

Figure 2-2: Layout of TPM899


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2.3. External I/O Connectors

Figure 2-3: Front I/O Interface of TPM899

Label Function Description COM1/2 DB15 port supports 1 RS232 and 1 RS232/422/485 compatible serial devices. USB Provides extensions for USB 2.0/1.1 devices. LAN Used to connect the system to a local area network. DVI-I Used to connect an analog VGA monitor and a digital DVI-D monitor.

Figure 2-4: Front side connector of TPM899

COM1/2 USB3.0 LAN 1 LAN 2 DVI-I


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2.4. COM 1/2 Serial Port

Figure 2-5: Serial Port

Serial ports 1 and 2 have combined in a male DB15 connector and port 2 can be configured for RS-232, RS-422, or RS-485 with auto flow control communication. Serial port 2 default setting is RS-232. It could be adjusted as RS-422 or RS-485 by changing the settings in the BIOS. Please refer to “Appendix A.2” for BIOS setting. The pin assignments of COM 1/2 are shown in the following table:

COM Port Pin NO. RS-232 RS-422 (4-Wire) RS-485 (2-Wire)

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1 DCD --- --- 2 RXD --- --- 3 TXD --- --- 4 DTR --- --- 5 GND --- --- 6 DSR --- --- 7 RTS --- --- 8 CTS --- --- 9 RI --- --- 10 --- --- ---


2

11 RXD RXD+ --- 12 TXD RXD- --- 13 RTS TXD+ DATA+ 14 CTS TXD- DATA- 15 GND GND GND

Figure 2-6: Pin Definition of COM 1/2 Serial Port

Users can use the Y-type cable to convert the 15-pin D-Sub connector into two 9-pin D-Sub connectors to

connect both COM1 and COM2 at the same time. Please refer to “Appendix E.1” for the Y-type cable of COM 1/2.

1 5

11 15


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2.5. USB3 Port

Figure 2-7: USB3 Port

The USB port is 3.0. It is compatible with USB 2.0. The pin assignments are shown in the following

table:

Pin NO. Label Description 1 VBUS Power 2 D-

USB 2.0 differential pair 3 D+ 4 GND Ground 5 SSRX-

SuperSpeed transmitter differential pair 6 SSRX+ 7 GND Ground 8 SSTX-

SuperSpeed receiver differential pair 9 SSTX+

Figure 2-8: Pin Definition of USB 3 Port


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2.6. LAN Port

Figure 2-9: LAN Port

The LAN ports use standard RJ-45 jack connectors with LED indicators on the front side to show active/link status and speed status. The LED indicators on the bottom corners show the cable is properly connected to a 100 Mbps or 1000 Mbps Ethernet network. The pin assignments are shown in the following table:

Pin No. 10/100 Mbps 1000 Mbps

1 E_TX+ MDI0_P 2 E_TX- MDI0_N 3 E_RX+ MDI1_P 4 --- MDI2_P 5 --- MDI2_N 6 E_RX- MDI1_N 7 --- MDI3_P 8 --- MDI3_N

Figure 2-10: Pin Definition of LAN Port

8 1


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2.7. DVI-I Port

Figure 2-11: DVI-I Port

The DVI-I port can both send out a digital signal and an analog signal. Users are allowed to use two monitors simultaneously. Dual display is supported. The pin assignments are shown in the Figure 2-12.

Figure 2-12: Dual Display

DVI-I

DVI-D

VGA


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Pin NO. Label Pin NO. Label 1 TMDS Data 2- 15 GND 2 TMDS Data 2+ 16 Hot plug detect 3 TMDS Data 2/4 shield 17 TMDS Data 0- 4 --- 18 TMDS Data 0+ 5 --- 19 TMDS Data 0/5 shield 6 DDC clock 20 --- 7 DDC data 21 --- 8 Analog vertical sync 22 TMDS clock shield 9 TMDS Data 1- 23 TMDS clock+ 10 TMDS Data 1+ 24 TMDS clock- 11 TMDS Data 1/3 shield C1 Analog Red 12 --- C2 Analog Green 13 --- C3 Analog Blue 14 +5V C4 Analog Horizontal sync

Figure 2-13: Pin Definition of DVI-I Port


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2.8. Memory

Figure 2-14: DDR3L-1600 SO-DIMM

The system memory is Dual Channel DDR3L 1600 MHz SO-DIMM and it is up to 8GB.

2.9. SUMIT-ITA

Figure 2-15: SUMIT-ITA

SUMIT-ITA is based on SUMIT A and it is a connector that connects with SPE and MB. It’s designed by iBASE and TPM with new specification. The capital “I”means “iBASE”, the capital “T”means “TPM”, and the capital “A”means “SUMIT A”. Please refer to “Appendix C” for the pin definition of SUMIT-ITA.


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3. SPC-3201D with SPC-C114D

3.1. Specifications

System Hardware


Memory Dual channel supports 2 DDR3L SO-DIMM, up to 8GB

Storage SATA III for HDD/SSD mSATA for SSD


I/O Interface


LAN 2 Intel® GbE I211-AT USB 4x USB 3.0 ports Security

USB 1x internal USB port supporting installation of a USB dongle for security function.

SID Hardware IC with unique id EEPROM 256 bytes PCI Express Mini PCIe 1 Mini PCIe for expansion Expansion I/O Isolated DI/O 8 Digital input and 8 Digital output General Operating System Windows Embedded 7 Dimensions 160 mm x 62 mm x 115 mm Weight 1.38 kg Construction Aluminum chassis with fan-less design Mounting Wall-mounting for DIN-rail

Power Requirements ATX Power mode: 2-pin remote power on/off switch 24V DC input, 60 W (typical)

Environment Operating temperature 0°C~60°C ( 32°F~140°F) ambient temperature with air flow


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Storage temperature -20°C~80°C (-4°F~176°F) Humidity 90% (non-condensing @60°C)

Shock Protection IEC 68 2-27 SSD: 50G @ Wall-mount, half sine, 11ms HDD: 20G @ Wall-mount, half sine, 11ms

Vibration Protection IEC 68 2-64 (Random 1 Oct./min, 1hr/axis.) SSD: 5 Grms @ 5~500Hz, HDD: 1 Grms @ 5~500Hz

Figure 3-1: Specification of SPC-3201D

3.2. Introduction

The architecture of SPC-3201D = TPM899 CPU Board + SPE-C114D

Figure 3-2: Architecture of SPC-3201D


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3.3. SPE-C114D Board Layout

Figure 3-3: Layout of SPE-C114D

3.4. Power Connector

Figure 3-4: Top Side Connector

24VDC PWR-ON

GND V- V+


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3.4.1. DC24V Input

Figure 3-5: 24V DC Input

Pin No. Label Description

1 24V 24V DC power input 2 GND Ground 3 FG Frame ground

Figure 3-6: Pin Definition of Power Connector

3.4.2. ON/OFF Switch

Figure 3-7: Remote Power

It is a 2-pin power-on or power-off switch through Phoenix Contact terminal block. You could turn on or off the system power by using this contact. This terminal block support dual function of soft power-on / power-off (instant off or delay 4 second), and suspend mode. There are two power modes to choose: AT/ATX. Please refer to “Appendix A.3” for detailed information

1


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of power management in BIOS setting.

3.5. Isolated 8DI/8DO

Figure 3-8: Isolated DI/O

The SPC-3201D offers a 16-bit DIO (8-DI / 8-DO) SCSI-20 pin connector on the bottom side of I/O interface. Each bit of DI and DO equipped with a photo-coupler for isolated protection. The pin assignments are shown in the following table:

Pin No. Definition Description Pin No. Definition Description 1 EXT_IN0 GPIO Input 0 11 EXT_OUT0 GPIO Output 0 2 EXT_IN1 GPIO Input 1 12 EXT_OUT1 GPIO Output 1 3 EXT_IN2 GPIO Input 2 13 EXT_OUT2 GPIO Output 2 4 EXT_IN3 GPIO Input 3 14 EXT_OUT3 GPIO Output 3 5 EXT_IN4 GPIO Input 4 15 EXT_OUT4 GPIO Output 4 6 EXT_IN5 GPIO Input 5 16 EXT_OUT5 GPIO Output 5 7 EXT_IN6 GPIO Input 6 17 EXT_OUT6 GPIO Output 6 8 EXT_IN7 GPIO Input 7 18 EXT_OUT7 GPIO Output 7 9 DI_COM GPIO COM 19 Reserved NC 10 EGND GPIO GND 20 E24V External 24V DC

Figure 3-9: Pin Definition of the 8DI/DO

Digital GPIO output signal circuit in SINK mode (NPN) is illustrated as follows.


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Figure 3-10: Signal circuit of output NPN

Digital GPIO input signal circuit in SINK mode (NPN) is illustrated as follows.

Figure 3-11: Signal circuit of input NPN

Digital GPIO input signal circuit in SOURCE mode (PNP) is illustrated as follows.

Figure 3-12: Signal circuit of input PNP


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Figure 3-13: Front I/O Interface of SPE-C114D

Label Function Description Com3/4 DB15 port supports 2 RS232 compatible serial devices. Com5/6 DB15 port supports 2 RS232 compatible serial devices. USB Provides extensions for USB 2.0/1.1 devices. EZ-Expansion Provides extended function.

Figure 3-14: Front side connector of SPE-C114D

3.6.1. LED Indicator

Figure 3-15: LED indicator

Green-HDD LED If the LED is on, it indicates that the system’s storage is functional. If it is off, it indicates that the system’s

storage is not functional. If it is flashing, it indicates that data access activates. Yellow-Power LED If the LED is solid yellow, it indicates that the system is powered on.

COM5/6 COM3/4 USB3.0

HD

PWR


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3.6.2. COM 3/4 and 5/6 Serial Port


Serial ports 3, 4, 5 and 6 have combined in a male DB15 connector. Users can use the Y-type cable to convert the 15-pin D-Sub connector into two 9-pin D-Sub connectors to connect both COM3/COM5 and COM4/COM6 at the same time. Please refer to “Appendix E.2” for the Y-type cable of COM 3/4 and 5/6. The pin assignments are shown in the following table:


3/5 (Isolated)



4/6 (Isolated)

11 RXD --- --- 12 TXD --- --- 13 RTS --- --- 14 CTS --- --- 15 GND --- ---

Figure 3-17: Pin Definition of COM 3/4 and 5/6 Serial Port

11 15

1 5


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3.6.3. USB3 Port



table:


USB 2.0 differential pair 3 D+ 4 GND Ground for power return 5 SSRX-

SuperSpeed transmitter differential pair 6 SSRX+ 7 GND Ground for signal return 8 SSTX-


Figure 3-19: Pin Definition of USB3 Port


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3.6.4. miniPCIe

Figure 3-20: Hilscher CIFX 90E-RE\F

SPE-C114D has an EZ-expansion on the front panel. With miniPCIe, users can expand the function of the board. Users can install Motionnet port, USB port, LAN port or COM port.

Figure 3-21: EZ-expansion with miniPCIe


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4. SPC-3204D with SPC-C116D

4.1. Specifications

System Hardware



Storage 1 mSATA for SSD 1 CFast


I/O Interface

Serial Ports

3 DB15 serial port: 5 RS-232, 1 RS-232/422/485 with automatic data flow control 1 Terminal Block serial port: 2 RS-485 with automatic data flow control


USB 4x USB 3.0 ports 2x USB 2.0 ports

Security


EEPROM 256 bytes Expansion I/O Isolated DI/O 8 Digital input and 8 Digital output General Operating System Windows Embedded 7 Dimensions 160 mm x 62 mm x 115 mm Weight 1.38 kg Construction Aluminum chassis with fan-less design Mounting Wall-mounting for DIN-rail




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Figure 4-1: Specification of SPC-3204D

4.2. Introduction

The architecture of SPC-3204D = TPM899 CPU Board + SPE-C116D

Figure 4-2: Architecture of SPC-3204D


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4.3. SPE-C116D Board Layout

USB

CFastSCSI20

COM 3/4 USB3.0USB2.0

AT/ATX

SU

MIT-ITA

mSATA

COM 5/6 COM 7/8RS485

Figure 4-3: Layout of SPE-C116D



24VDC PWR-ON

GND V- V+


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4.4.1. DC24V Input


Pin No. Label Description 1 24V 24V DC power input 2 GND Ground 3 FG Frame ground




It is a 2-pin power-on or power-off switch through Phoenix Contact terminal block. You could turn on or off the system power by using this contact. This terminal block support dual function of soft power-on / power-off (instant off or delay 4 second), and suspend mode. There are two power modes to choose: AT/ATX. Please refer to “Appendix A.3” for detailed information of power management in BIOS setting.

1


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4.5. Isolated 8DI/8DO


The SPC-3221 offers a 16-bit DIO (8-DI / 8-DO) SCSI-20 pin connector on the bottom side of I/O interface. Each bit of DI and DO equipped with a photo-coupler for isolated protection. The pin assignments are shown in the following table:







38





39


Figure 4-13: Front I/O Interface of SPE-C116D-CSM

Label Function Description USB 3.0 Provides extensions for USB 3.0 devices. USB 2.0 Provides extensions for USB 2.0 devices. COM 3/4 DB15 port supports 2 RS232 compatible serial devices. COM 5/6 DB15 port supports 2 RS232 compatible serial devices. COM 7/8 Terminal Block supports 2 RS85 compatible serial devices.

Figure 4-14: Front side connector of SPE-C116D

COM 3/4 COM 5/6 USB 3.0 USB 2.0

HD

PWR

COM 7/8


40


Figure 4-15: LED



HD

PWR


41





3/5 (Isolated)



4/6 (Isolated)



11 15

1 5


42

4.6.1. COM 7/8

Heatsink

1

4

3

6


The pin assignments are shown in the following table:


7/8 (Isolated)

1 --- --- DATA_7+ 2 --- --- DATA_7- 3 --- --- --- 4 --- --- DATA_8+ 5 --- --- DATA_8- 6 --- --- ---

Figure 4-19: Pin Definition of COM 7/8


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4.6.2. USB2 Port



Pin NO. Label Description

1 VBUS Power 2 D-

USB 2.0 differential pair 3 D+ 4 GND Ground for power return



44

4.6.3. USB3 Port



table:







45

5. SPC-3221 with SPC-L122D-CSM

5.1. Specifications

System Hardware



Storage SATA III for HDD/SSD mSATA for SSD


I/O Interface


LAN 2 Intel® GbE I211-AT USB 4x USB 3.0 ports Security


SID Hardware IC with unique id EEPROM 256 bytes Motionnet Number of Rings 2 Rings with RJ45 connector Expansion I/O Isolated DI/O 8 Digital input and 8 Digital output General Operating System Windows Embedded 7 Dimensions 160 mm x 62 mm x 115 mm Weight 1.38 kg Construction Aluminum chassis with fan-less design Mounting Wall-mounting for DIN-rail




46




Figure 5-1: Specification of SPC-3221

5.2. Introduction

The architecture of SPC-3221 = TPM899 CPU Board + SPE-L122D-CSM

Figure 5-2: Architecture of SPC-3221


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5.3. SPE-L122D-CSM Board Layout

Figure 5-3: Layout of SPE-L122D



GND V- V+

24VDC

PWR-ON


48

5.4.1. DC24V Input








1


49

5.5. CN1 Isolated 8DI/8DO


The SPC-3221 offers a 16-bit DIO (8-DI / 8-DO) SCSI-20 pin connector on the bottom side of I/O interface. Each bit of DI and DO equipped with a photo-coupler for isolated protection. The pin assignments are shown in the following table:







50





51


Figure 5-13: Front I/O Interface of SPE-L122D-CSM

Label Function Description USB 3.0 Provides extensions for USB 3.0 devices. Mnet Connecting to Motionnet slave modules. COM 3/4 DB15 port supports 2 RS232 compatible serial devices. COM 5/6 DB15 port supports 2 RS232 compatible serial devices.

Figure 5-14: Front side connector of SPE-L122D-CSM

COM 3/4 COM 5/6

Mnet 0

Mnet 1

USB 3.0

PWR

HD


52


Figure 5-15: LED



HD

PWR


53

5.6.2. USB3 Port



table:







54





3/5 (Isolated)



4/6 (Isolated)



11 15

1 5


55

5.6.4. Mnet Motionnet Rings

Figure 5-20: Motionnet Ring

Pin NO. Label Description 1 FG Filed Ground 2 FG Filed Ground 3 RS485+ High Speed RS-485 protocol 4 FG Filed Ground 5 FG Filed Ground 6 RS485- High Speed RS-485 protocol 7 FG Filed Ground 8 FG Filed Ground

Figure 5-21: Pin Definition of Motionnet Ring


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5.7. Motionnet

Motionnet is a super high-speed serial communication system. The G9000 devices provide input/output control, motor control, CPU emulation and message communication with high speed serial communications (up to 20Mbps) all of which are required by current Factory Automation techniques. Motionnet always transfers 4 bytes of data in 15.1μsec using cyclic communication to control input and output. While this data is being transferred, it can communicate a maximum of 256 bytes, such as motor control data, and the LSI controls the data transmission using interrupts. Communication times can be calculated using formulas, allowing users to see that Motionnet guarantees the real-time oriented support needed by FA industries.

Figure 5-22: Wire-Saving and Long-Distance Figure 5-23: High-Speed and Time-Deterministic

Please click the following link for detailed information of Motionnet: http://www.motionnet.jp/

http://www.motionnet.jp/


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6. SPC-3212 with SPC-L121D-2PA

6.1. Specifications

System Hardware



Storage 1 mSATA for SSD 1 CFast


I/O Interface



USB 4x USB 3.0 ports 2x USB 3.0 ports

Security


SID Hardware IC with unique id EEPROM 256 bytes Motionnet Number of Rings 1 Rings with RJ45 connector Power Over Ethernet PoE1 Gigabit IEEE 802.3af (15.4W/48V) PoE+ by Intel® I350-AM2 PoE2 Gigabit IEEE 802.3af (15.4W/48V) PoE+ by Intel® I350-AM2 Expansion I/O

Isolated DI/O 4 Digital input, 4 for High speed 1024 FIFO Latch. 4 Digital output, 2 for programmable square signal generator.

Encoder Input 2 A/B phase encoder counters Compare Trigger 2 High speed 1024 FIFO Position Compare output Analog Output 4 Analog Output 0 ~ 10V in 12bits General Operating System Windows Embedded 7


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Dimensions 160 mm x 62 mm x 115 mm Weight 1.38 kg Construction Aluminum chassis with fan-less design Mounting Wall-mounting for DIN-rail


Environment Operating temperature 0°C~60°C ( 32°F~140°F) ambient temperature with air flow Storage temperature -20°C~80°C (-4°F~176°F) Humidity 90% (non-condensing @60°C)



Figure 6-1: Specification of SPC-3212

6.2. Introduction

The architecture of SPC-3212 = TPM899 CPU Board + SPE-L121D-2PA

Figure 6-2: Architecture of SPC-3212


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6.3. SPE-L121D-2PA Board Layout

USB

CFastSCSI20

AnalogOutput PoE1 USB3.0Mnet

AT/ATX

SU

MIT-ITA

mSATA

PoE2

USB

2.0

USB2.0

Figure 6-3: Layout of SPE-L121D-2PA



GND V- V+

24VDC

PWR-ON


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6.4.1. DC24V Input








1


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6.5. Advanced Digital I/O

Figure 6-8: Advanced Digital I/O

The SPC-3212 offers SCSI-20 pin connector on the bottom side of I/O interface. Each bit of DI and DO equipped with a photo-coupler for isolated protection. The pin assignments are shown in the following table:

Pin No. Definition Description Pin No. Definition Description 1 EA+_1 1st encoder A phase

(+) 11 EA-_1 1st encoder A phase

(-) 2 EB+_1 1st encoder B phase

(+) 12 EB-_1 1st encoder B phase

(-) 3 EA+_2 2nd encoder A phase

(+) 13 EA-_2 2nd encoder A phase

(-) 4 EB+_2 2nd encoder B phase

(+) 14 EB-_2 2nd encoder B phase

(-) 5 CMP_1 1st compare output 15 CMP_2 2nd compare output

6 DI_1

LTC_1 1st digital input 1st latch input

16 DI_2

LTC_2 2nd digital input 2nd latch input

7 DI_3

LTC_3 3rd digital input 3rd latch input

17 DI_4

LTC_4 4th digital input 4th latch input

8 DO_1 1st digital output

1st signal generator 18 DO_2

2nd digital output 2nd signal generator

9 DO_3 3rd digital output 19 DO_4 4th digital output 10 EGND External Ground 20 E24V External 24V DC



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Digital Input and Latch Input Interface

Figure 6-10: Digital input for NPN-Sink mode

Digital Output Interface

Figure 6-11: Digital output for NPN-Sink mode

4.7K NPN

Switch

VCC

4.7K

+24V

VCC

DI 1

D 4I

+24V

Internal Circuit External Circuit

+Open collector

VCC

VCC

DO 1

DO 4

Internal Circuit External Circuit

+LOAD

GND

LOAD

GND+COM

+COM

GND

+COM


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CMP output Interface

Figure 6-12: CMP output interface

Encoder input Interface

Figure 6-13: CMP output interface

CMP 1

6

5

43

1I5V I5V

1K

GND

Internal Curcuit

1

2 3

4

CMP 2

6

5

43

1I5V I5V

GND

GND

1K

VccVcc

1

2 3

4

GND

Vcc

External Circuit

6

5

4 3

1

EA- /1 2

EA+ /1 2

100

Internal Curcuit

13

2

AM26LS31

OUT_A-

OUT_A+

External Circuit

6

5

4 3

1

EB- /1 2

EB+ /1 2

75

6

AM26LS31

OUT_B-

OUT_B+

100

100

100


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Figure 6-14: Front I/O Interface of SPE-L122D-CSM

Label Function Description USB 3.0 Provides extensions for USB 3.0 devices. Mnet Connecting to Motionnet slave modules. PoE Power over Ethernet. CN2 4-CH Analog output USB 2.0 Provides extensions for USB 3.0 devices.

Figure 6-15: Front side connector of SPE-L122D-CSM

USB 2.0 USB 3.0 CN2

Analog out

PoE2 PoE1 Mnet USB 2.0

PWR

HD


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Figure 6-16: LED



HD

PWR


66

6.6.2. USB3 Port



table:







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6.6.3. USB2 Port



Pin NO. Label Description

1 VBUS Power 2 D-

USB 2.0 differential pair 3 D+ 4 GND Ground for power return



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6.6.4. Mnet Motionnet Ring

Figure 6-21: Motionnet Ring

Pin NO. Label Description 1 FG Filed Ground 2 FG Filed Ground 3 RS485+ High Speed RS-485 protocol 4 FG Filed Ground 5 FG Filed Ground 6 RS485- High Speed RS-485 protocol 7 FG Filed Ground 8 FG Filed Ground

Figure 6-22: Pin Definition of Motionnet Ring


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6.6.5. PoE Power Ethernet

Figure 6-23: Analog Output

Power over Ethernet or PoE, is the technology used for power transmission in network equipment, via network UTP cable, together with data. PoE is useful in situations when we want to connect network devices that are far away from a power source. In this situation we take advantage of the Ethernet cable, because there are 4 pairs of wires, but for the majority of networks, only 2 pairs are used for data transmission. PoE uses 2 unused twisted pairs, for electrical transmission needed to power the device.

Pin No. 10/100 Mbps 1000 Mbps 1 E_TX+ MDI0_P 2 E_TX- MDI0_N 3 E_RX+ MDI1_P 4 --- MDI2_P 5 --- MDI2_N 6 E_RX- MDI1_N 7 --- MDI3_P 8 --- MDI3_N



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6.6.6. CN2 Analog Output

Heatsink



Label N/A AGND AGND AGND AGND Label N/A AO 3 AO 2 AO 1 AO 0

Figure 6-26: Pin Definition of Analog output

Analog output signals

AOUT_0

AGND+-

AOUT_1+-

AOUT_2+-

AOUT_3+-

AGND

AGND

AGND

Figure 6-27: Interface of Analog output signals


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6.7. Motionnet

Motionnet is a super high-speed serial communication system. The G9000 devices provide input/output control, motor control, CPU emulation and message communication with high speed serial communications (up to 20Mbps) all of which are required by current Factory Automation techniques. Motionnet always transfers 4 bytes of data in 15.1μsec using cyclic communication to control input and output. While this data is being transferred, it can communicate a maximum of 256 bytes, such as motor control data, and the LSI controls the data transmission using interrupts. Communication times can be calculated using formulas, allowing users to see that Motionnet guarantees the real-time oriented support needed by FA industries.

Figure 6-28: Wire-Saving and Long-Distance Figure 6-29: High-Speed and Time-Deterministic

Please click the following link for detailed information of Motionnet: http://www.motionnet.jp/

http://www.motionnet.jp/


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7. Appendix A: TPM899 BIOS Setup The board uses UEFI BIOS that is use Serial Peripheral Interface (SPI) Flash. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN, EEPROM information, and Serial port support. The BIOS setup program is accessed by pressing the <DEL> or <ESC>key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Figure 7-1: BIOS Menu Bar

7.1. Main Menu

Figure 7-2: BIOS Main screen

System Time / Date : Press “TAB” key to switch sub-items of value .Then press “ +” key or “-“ key number key for modify value.


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7.2. Select Serial Port 2 Transmission Protocol

Advanced → NCT5523D Super IO CONFIGURATION → Serial Port 2 Configuration

Figure 7-3: Setting of Super IO devices

COM2 Select: COM2 support RS-232 / 422 / 485 multi functions. Super IO Device Setup lets you decide parameters of the system communication ports. Only COM2 has various transmission protocols.

The options are: RS232 RS422 RS485


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7.3. SIO Power Failure

Advanced → NCT5523D Hardware Monitor

Figure 7-4: Setting of Power Management

“Always Off” Mode If the power management is set to OFF and power failure happens, the system power will be off when the power supply restores. Users have to switch the power on to start the system.

“Always On” Mode

If the power management is set to ON and power failure happens, the system power will be on automatically when the power supply restores.

“Keep Last State” Mode

If the power management is set to Former-Status and power failure happens, when the power supply restores, the system power status will be ON if the system power is ON before the power failure. The system power status will be OFF if the system power is OFF before the power failure. In one word, SmartPAC-3000 synchronizes the power status before and after power failures.


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8. Appendix B: EEPROM

Figure 8-1: EEPROM

EEPROM is a chip that is put on the MB. It can be read and written. Users can not only read the parameters, but also storage your own parameters. For example, the registration key can be stored on it.

With regard to the operation of EEPROM, please refer to TPM for more information.

http://www.tpm-pac.com/contact


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9. Appendix C: Pin Definition of SUMIT-ITA

SUMIT-ITA Pin NO. Label Description Pin NO. Label Description 1 GND

PCIe PORT#2

2 GND

PCIe PORT#3

3 PCIE_CLK_P2 4 PCIE_CLK_P3 5 PCIE_CLK_N2 6 PCIE_CLK_N3 7 GND 8 GND 9 PCIE_TXP_2 10 PCIE_TXP_3 11 PCIE_TXN_2 12 PCIE_TXN_3 13 PCIE_RXP_2 14 PCIE_RXP_3 15 PCIE_RXN_2 16 PCIE_RXN_3 17 GND 18 GND 19 SATA_TXP1 SATA III

PORT#1 20 SATA_RXP1 SATA III

PORT#1 21 SATA_TXN1 22 SATA_RXN1 23 GND 24 GND 25 USB3_P2_TX_DP

USB 3.0 PORT#2 (STANDARD)

OC PIN for Port 2 & 3

26 USB3_P3_TX_DP

USB 3.0 PORT#3 (STANDARD)

27 USB3_P2_TX_DN 28 USB3_P3_TX_DN 29 USB3_P2_RX_DP 30 USB3_P3_RX_DP 31 USB3_P2_RX_DN 32 USB3_P3_RX_DN 33 GND 34 GND 35 USB_P2_DP 36 USB_P3_DP 37 USB_P2_DN 38 USB_P3_DN 39 USB_OC_23 40 HUB_OCI128

USB 2.0 PORT#3 41 HUB_DP3 USB 2.0 PORT#2

42 HUB_DP4 43 HUB_DM3 44 HUB_DM4 45 PLT_RST# 46 PCIE_WAKE# 47 5VNORMAL 48 3.3VNORMAL 49 5VNORMAL 50 3.3VNORMAL 51 5VNORMAL 52 3.3VNORMAL

Figure 9-1: Pin Definition of SUMIT-ITA


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10. Appendix D: Internal USB Dongle Installation

With the front, rear, left and right side of the chassis, remove 19 screws of those faces, the front panel and bottom cover board could be taken off.

Figure 10-1: Screws on the chassis


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Figure 10-2: Internal USB slot


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11. Appendix E: Cable for COM Port

11.1. Y Cable for COM 1/2

Y Cable from DB15 to Two DB9 FM

Figure 11-1: HD15 Female


1



2


Figure 11-2: Pin Definition of HD15 Female

HD15 Female

5

1

15

11


80

Figure 11-3: DB9 Male and DB9 Female

Pin NO. Label Description 1 DCD Data Carrier Detect 2 RXD Receive Data 3 TXD Transmit Data 4 DTR Data Terminal Ready 5 GND Signal Ground 6 DSR Data Set Ready 7 RTS Request to Send 8 CTS Clear to Send 9 RI Ring Indicator

Figure 11-4: Pin Definition of DB9 Male and DB9 Female

DB9 Male

DB9 Female

5 9

1 6

1 6

5 9


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11.2. Y-Cable for COM 3/4 and 5/6 (Option)

Y Cable from DB15 to Two DB9 MM

Figure 11-5: HD15 Female


3/5



4/6


Figure 11-6: Pin Definition of HD15 Female

HD15 Female

5

1

15

11


82

Figure E-7: DB9 Male and DB9 Male

Pin NO. Label Description 1 DCD Data Carrier Detect 2 RXD Receive Data 3 TXD Transmit Data 4 DTR Data Terminal Ready z5 GND Signal Ground 6 DSR Data Set Ready 7 RTS Request to Send 8 CTS Clear to Send 9 RI Ring Indicator

Figure 11-7: Pin Definition of DB9 Male and DB9 Male

DB9 Male

5

1

9

6

DB9 Male

5

1

9

6


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12. Appendix F: Motionnet Utility - MyLink Before hands on programming the controller to control the Motionnet modules, usually we would like to test the communication interface, accessibility and the functionalities of the chained modules. TPM provides a software utility named MyLink to test, diagnose and verify the status of the Motionnet connection and the functions of the remote Motionnet modules. As long as all the modules are working correctly, the next step would be starting programming the logic of the modules.

The TPM MyLink is a utility for users to manage TPM Motionnet Master and Slaves devices. Users do not have to write the program to run the Master and Slaves instead. It provides simple and convenient interface to test the Master and Slave devices.

MyLink execution is divided into two types of execution methods. The first one is to execute MyLink from the controller or PC with control card inserted directly. The second one is that MyLink is executed from the remote PC connected to the target controller running MyLink server. Users would feel almost the same at operation even with different MyLink running methods. This manual will focus on MyLink from the controller or PC with control card.

MyLink operation instructions will be introduced in the following sections separated with Master and Slave.

After successful installation the TPM utility, MyLink.exe with icon could be found in the remote PC/controller.

Please refer to “TPM Utility User Manual_v2.0” for detailed information.

http://www.tpm-pac.com/sites/default/files/files/doc/TPM%20Utility%20User%20Manual_v2.0.pdf


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12.1. Login of MyLink

After executing the MyLink.exe to launch the program, users can follow the steps to login. Also, following will

introduce the interface of MyLink.

The controllers would be classified into two types according to the IP address. There are Remote type and Local

type. Here will only introduce Local type. For Remote type, please refer to Appendix B.

Login

Local Type

Except EPC-1000, EPC-1800 series, and SPC-2000, the other controllers, for example, SPC-3000 series, can use

local type MyLink. The figures below show the login dialog for local type of MyLink. Take LPE-L122 as an

example.

Step 1: Click “Scan” to find the Master in the PC.

Figure 12-1: Scan the Master


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Step 2: Choose the Master and click “OK”.

Figure F-2: Choose the Master

Step 3: After clicking “OK”, users will enter into the Master Interface.

Figure 12-2: The Master Interface

Note that if users want to know further information of installation of MyLink, please refer to Appendix A.

Tool Bar


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Figure 12-3: MyLink main functions

There are 4 main functions in the tool bar. Functions are introduced below.

File

This is used for file access. Also this is used to set and save of axes module parameters or copy the parameters for

other axes. The function “System Configuration” is designed for KW MULTIPROG of EasyPAC, the SPC-2000

has not supported this function so far.

Figure 12-4: Functions under File option

Tools

Provide functions for setting system parameters and initializing the system. There are 2 sub-functions:

Figure 12-5: Functions under Tools option

1. Edit Path…:

This option is only available when two axis modules are grouped up. Later we will discuss about

the “Group” function. Note that “Edit Path…” is for KW MULTIPROG development environment


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only (EasyPAC). For detailed information, please refer to Appendix D.

2. Refresh:

This function provides users to rescan all the devices connected to MyLink server after adding,

removing or replacing Motionnet slave modules without the need of restarting MyLink.

3. GetRingCount:

The Motionnet connection quality is displayed on the status bar of the MyLink main frame which is in

percentage format. The more detailed connection loss log could be retrieved in the “GetRingCount”

function option. The detailed connection loss log dialog will be popped up when

GetRingCount option is selected. The dialog is shown in the following figure.

Figure 12-6: GetRingCount dialog box


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List:

- Index: the order of error count.

- Time: the time when error happens.

- Count: it will list all the connection error count. The upper limit of the error count value is 65535. Once

the count value reaches 65535, it will be reset to 0.

- Difference: it is a shift value between the accumulated error counts of two consecutive time stamps.

Save:

It will export the above listed records of the Ring_0 and Ring_1 to a .csv file which could be opened with

Microsoft Excel.

4. Property Type:

- Alphabetical: the property will be listed by alphabetical list.

- Categorized: the property will be listed by its categorization.

- CategorizedAlphabetical: the property will be listed by its categorization and alphabetical list for each

property.

- NoSort: the property type will not be sorted.

Windows

When multiple slave modules are displayed in the same time, the related menu will be re-arranged accordingly.

Figure 12-7: Functions under Window option

Help

This shows the information of TPM and the update for MyLink.


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Figure 12-8: Functions under Help option

Figure12-9: Update version interface

Ring Status

The Ring status shows the ring connection quality in percentage format. The font in green means the data

package loss rate is less than 20%, which is a good to go status. In orange means the loss rate is in between 20%

to 50%, users are supposed to check the connection status. If the font is in red means the data package loss rate is

larger than 50%. The modules will stop working and connection checking is necessary.

If the ring status is in red, the entire opened dialog will be disabled and not able to operate any module. Users

need to check the connection of all modules and take two actions:

1. Make sure the cable connections are well connected. After this checking and ensuring

the connection, click on the ring in red to reset the communication quality checking.

2. If the status is still bad, please check the wiring status again and press the “Refresh” button to

reset and rescan the entire modules.

Figure 12-10: Ring status

Message


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There is a block above the ring status displaying responses from MyLink. The responses include time stamp the

event occurred and error or hint messages.

Figure 12-11: Message box information

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