smart systems - visions become reality - fraunhofer€¦ · smart systems - visions become reality...

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SMART SYSTEMS - ViSionS bEcoME REAliTY

F r a u n h o F e r I n s t I t u t e F o r e l e c t r o n I c n a n o s y s t e m s e n a s

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Power Source

Commu-nication

UnitMEMS/ NEMS

Electronic Components

Integration& Packaging

F r a u n h o F e r e n a s - P r o F I l e 4

B u s I n e s s u n I t s 6

Micro and Nano Systems 6

Micro and Nano Electronics / Back-end of Line 8

Green and Wireless Systems 10

c o r e c o m P e t e n c e s 1 2

Design and Test of Components and Systems 13

Silicon Based Technologies for Micro and Nano Systems 14

Polymer Based Technologies for Micro and Nano Systems 15

Printing Technologies for Functional Layers and Components 16

Interconnect Technologies 17

System Integration Technologies 18

Reliability of Components and Systems 19

c o n t a c t 2 0

Contact details 21

How to reach Fraunhofer ENAS 22

conTEnTSMART SYSTEMS inTEgRATion bY uSing MicRo And nAno TEchnologiES

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bild ASE

The Fraunhofer-Gesellschaft is one of the leading organizations

for applied research in Germany and Europe. Its core purpose

is the pursuit of knowledge of practical utility. The Fraunhofer

Institute for Electronic Nano Systems ENAS is focusing on smart

systems integration by using micro and nano technologies.

In semiconductor technologies / microelectronics the strategic

research agenda of the European Nanoelectronics Initiative

Advisory Counsil ENIAC as well as the International Technology

Roadmap of Semiconductors ITRS predict with “More Moore”

and “More than Moore” not only a further downscaling of the

structural dimensions but also the diversification of technolo-

gies. Main topic of this so-called “More than Moore“ strategy

is the integration of different components in one system to

ensure the multifunctionality of the system itself.

The European Platform on Smart Systems Integration EPoSS

takes up this trend to multifunctional devices and smart sys-

tems. Smart systems go beyond microsystems for single physi-

cal, biological or chemical parameter measurements combined

with signal processing and actuating functions. Smart systems

integration addresses the demand for miniaturized multi-

functional devices and specialized connected and interacting

solutions. Multidisciplinary approaches featuring devices for

complex solutions and making use of shared and, increasingly,

self-organising resources are among the most ambitious chal-

lenges.

Fraunhofer ENAS is working in both fields. In the “More Moore”

field Fraunhofer ENAS focuses on metallization and interconnect

systems as well as on reliability of microelectronic components.

In the field of smart systems or “More than Moore” sensors,

actuators as well as communication units and therefore more

functionalities are integrated into one system.

These foci of Fraunhofer ENAS are strongly affected by develop-

ments of nanotechnology and ensured by the following unique

features of Fraunhofer ENAS within the Fraunhofer-Gesellschaft:

� High precision MEMS and NEMS

� Digital pilot station (Inkjet-Technikum), adaptive prin-

ting technologies inclusively material development

and characterization

� Nano systems: system design and nano reliability

� Wafer bonding for 3D system integration

� Interconnect technologies, back-end of line for nano

electronics and nano systems.

fRAunhofER EnAS - pRofilE Six departments belong to Fraunhofer Institute for Electronic

Nano Systems:

Multi Device Integration

Micro Materials Center

Printed Functionalities

Back-end of Line

System Packaging

Advanced System Engineering

In order to ensure a longterm scientific and economic success

Fraunhofer ENAS has defined the three business units “Micro

and Nano Systems”, “Micro and Nano Electronics / Back-end of

Line” as well as “Green and Wireless Systems”. They address

different markets and different customers.

Microand NanoSystems

Green andWirelessSystems

Micro and NanoElectronics / BEOL

Fraunhofer ENAS accesses on a broad variety of technologies

and methods for smart systems integration. There have been

defined seven core competences, which are the inner structure

of the technology portfolio of Fraunhofer ENAS.

The core competences “Silicon Based Technologies for Micro

and Nano systems”, “Polymer Based Technologies for Micro

and Nano Systems” as well as “Printing Technologies for

Functional Layers and Components” are the technological

basis for the development of components of micro and nano

systems. “Interconnect Technologies” and “System Integration

Technologies” are so-called cross-sectional technologies. They

have a strong interaction with the other core competences

via common projects. “Design and Test of Components and

Systems” as well as “Reliability of Components and Systems”

are supporting fields for the other technologies. They have a lot

of interfaces to all other core competences. Moreover they also

interact as e.g. reliability issues have to be considered just in the

design phase and vice versa simulations and life time predic-

tions need to be supported and calibrated by measured data.

Based on these basic technologies, the cross-sectional tech-

nologies and methods for design, test and reliability Fraunhofer

ENAS is able to process complete MEMS/NEMS and to integrate

them into challenging smart systems.

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The business unit ”Micro and Nano Systems” includes all

silicon based and polymer based micro and nano systems.

According to markets and customers it is divided into the

three parts “High Precision MEMS/NEMS“, “Polymer Based

low-cost Systems” and “RF-MEMS”. The business unit bases

on the core competences “Design and Test of Components

and Systems“, “Silicon Based Micro and Nano Technologies“,

“Polymer Based Micro and Nano Technologies“, “System In-

tegration Technologies“ as well as “Reliability of Components

and Systems“.

h I G h P r e c I s I o n m e m s / n e m s

“High Precision MEMS/NEMS“ includes the development of

prototypes and system solutions of high precision micro electro

mechanical systems (MEMS) and nano electro mechanical

systems (NEMS). The focus is on high precision actuators for

optical MEMS as well as on high precision inertial sensors for

industrial applications, navigation and medical application.

Fraunhofer ENAS provides services in:

� MEMS/NEMS design and modeling

� System design and modeling

� Technology development

� MEMS/NEMS test

� System test

� Prototypes manufactured by basic and special tech-

nologies.

P o ly m e r B a s e D l o W - c o s t m e m s /

n e m s

“Polymer Based low-cost MEMS/NEMS“ addresses the integra-

tion of micro and nano sensoric as well as actuatoric function-

alities as integrative components of smart systems. Focus is on

nano composite based sensors as well as material integrated

actuators for polymeric micro systems. Thereby two different

markets are addressed. The first one is industrial process moni-

toring and the second one medical and life science. Related

to nano composite based sensors industrial process monitoring

is especially of interest. Thereby the sensors need to fulfill the

following requirements:

� Cost-effective, large area, high sensitive sensors

� Integration of sensor principles which could not be in-

tegrated up to now (integrated condition monitoring)

� Components and systems for precise reliability moni-

toring

� Cost reduction based on mass production.

Fraunhofer ENAS provides services in:

� Development of system integrated functionalities

based on nano composites

� Customer specific configuration of the nano com-

posites for specific applications, e.g. in lightweight

structures engineering

� Condition monitoring based on cost-effective nano

composite based sensors

� Development of customer specific fully integrated

sensoric and actuatoric solutions

� Common developments with SMEs in the field of

molecular diagnostics and cell biology.

r F - m e m s

“RF-MEMS“ comprises manufacturing of components for

radio frequency applications, which electrical properties

may vary based on implementation of micromechanical

components or which functionality is mainly determined

by mechanical components. RF-MEMS include RF-MEMS

switches and varactors, which will be able to substitute exist-

ing conventional products or enable new applications due to

better electrical performance. The market of RF-MEMS can be

divided into two parts.

Aeronautic applications, security and defence applications as

well as measuring technique belong to the first one. Therefore

components are required with extremely high demands on

performance (at the threshold of the physical possibilities). This

is the main market.

The second market is communication technique (stationary and

mobile). Thereby the improvement of main properties is in the

focus. These are power requirements, configuration as well as

functionality. RF-MEMS can be applied for instance as tunable

filters. Using tunable components it is possible to ensure their

functionality at different frequencies and standards without

constructing parallel signal paths.

The following topics are in the focus:

� Concepts and developments of RF-MEMS

� Development of technologies for manufacturing and

integration of RF-MEMS

� Prototypes and small series

buSinESS uniTS

MicRo And nAno SYSTEMS

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The business unit “Micro- and Nanoelectronics / Back-end of

Line“ focuses on three main fields of activity:

� Materials, processes, and technologies for micro- and

nanoelectronics with emphasis on back-end of line

� Modeling and simulation of processes, equipments, as

well as complete interconnect systems

� Characterization and reliability assessment, starting

from BEOL-components towards complete chip-

package interactions.

The back-end of line (BEOL) comprises all process steps start-

ing from contact level till complete wafer processing prior to

electrical testing. In other words, the entire interconnect system

including passivation. Depending on the specific product (high

performance / low power / generic), significant changes in

the back-end of line have been implemented within the past

years due to ongoing downscaling. While transistors become

faster as their dimension shrink, the interconnect system is

limiting this gain in speed, because its RC-product rises. Thus,

signal delay time increases. Appropriate materials can reduce

resistance and capacitance of the interconnect system and

consequently compensate for the losses. While the past decade

was characterized by the introduction of copper and low-k-

dielectrics, future challenges require a more holistic approach.

Strong interactions between technology, material science, as

well as modeling and simulation are necessary to face these

challenges. At Fraunhofer ENAS close meshed interrelations

have been established between the specific fields of activity

within the past years.

The business unit “Micro- and Nanoelectronics / Back-end of

Line” is mainly driven by the core competences “Interconnect

Technologies“ and “Reliability of Components and Systems”.

Moreover, additional input comes from the core competences

“System Integration Technologies“, “Silicon Based Technolo-

gies for Micro and Nano Systems“, and “Design and Test of

Components and Systems “.

Markets and branches, which are relevant to this business unit,

can be derived from the value chain of integrated electronic

devices:

� Materials, chemicals, and consumables

� Device fabrication and testing / equipment manufac-

turing

� Integrated devices (ICs) and systems (SiPs).

Sorting the final products (ICs & SiPs) by application fields, the

following further classification can be conducted:

� Consumer electronics and communication

� Medical

� Automotive

� Aerospace and defense

� Industrial and instrumentation.

Within the working fields materials, processes, technologies,

and simulation, research and development are dedicated mainly

to consumer electronics and communication. Thereby, empha-

sis is placed on leading edge CMOS-technologies with highly

efficient and low parasitic interconnects. Within the working

field reliability, almost all application areas are addressed.

Fraunhofer ENAS offers services in research, development, and

wafer processing specific to markets and branches.

� Device manufacturers:

» Process development, process control methodo-

logy and methods

» Process integration issues

» Analytics and reliability assessment

» Simulation and modeling.

� Equipment manufacturers:

» Process development and optimization dedicated

to specific equipment

» Process and equipment simulation and modeling.

� Chemicals and material manufacturers:

» Evaluation, screening, and development of chemi-

cals and precursors

» Analytics and characterization

» Wafer processing and process optimization.

Further activities within the business unit are determined by the

international semiconductor roadmap (ITRS) as well as by the

global trends “Beyond CMOS“ and “More than Moore“.

Within leading edge micro and nanoelectronics, emphasis will

be on dielectrics as well as metallization and barriers, e.g.:

� Ultra-low-k-materials (k = 2.0 – 2.3), deposited by

CVD or spin-on-technologies

� Alternative ultra-low-k-approaches, e.g. airgaps (k < 1.3)

� Ultra thin CVD and ALD barriers

� Self forming barriers

� Airgap-compatible barriers and barriers for copper

layers with extremely low resistivity.

Beyond CMOS is characterized by new designs and materials,

like carbon nano tubes (CNTs). Fraunhofer ENAS has started

basic research in that field in close cooperation with the Center

for Microtechnologies at Chemnitz University of Technology.

Bringing this research to an application is an important goal for

the coming years.

Various functionalities integrated in two and three dimensional

systems earmark “More than Moore“ approaches. Forwarding

development of integration concepts and technologies specifi-

cally directed to inter-chip interconnections is a central research

topic within that area. Moreover, integration of novel BEOL

materials in MEMS/NEMS-applications is aimed for.

MicRo And nAno ElEcTRonicS /bAck-End of linE

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According to the name the business unit „Green and Wireless

Systems” aggregates all activities of Fraunhofer ENAS which

belong to wireless, periodic data collection and / or monitoring

to protect the environment (environmental monitoring) and

the state of objects (Condition Monitoring). The business unit

focuses on customer specific integration solutions for logistics

and on system solutions for the condition monitoring based on

MEMS / NEMS. It is divided in the two parts “Logistics” and

“Smart Monitoring Systems”.

l o G I s t I c s

“Logistics” addresses the development and integration of

components for manufacturing new smart labels which au-

tonomously and wirelessly transfer data and to some extent

energy with optimal quality at minimal production costs. They

are used for instance in the automation of supply chains. There-

fore application-specific antenna systems are designed and

printed primary cells as well as wireless power supply systems

based on near field coupling are developed. If necessary these

customer specific products are produced at low cost with high

throughput printing systems. Additionally a further focus is on

the development of complex RF labels with integrated MEMS

sensors for data acquisition. Electronic components, that are

necessary for the RF technology and sensor systems, are sup-

plied by industrial partners.

In the field of application-specific antennas, the intention is to

analyze the dielectric environment of the material to be marked

during the lifetime in advance and to include the results in

the design of the RFID solution. In addition, beyond printing

technology work is carried out in the field of antenna design in

the ultra high frequency (UHF) and super high frequency (SHF)

range and for matters of electro magnetic compatibility.

In order to bring together elements printed with silicon based

chips in terms of a hybrid solution there is a strong cooperation

with the core competences “Interconnect Technologies” and

“System Integration Technologies“ as well as with the business

unit “Micro and Nano Electronics / Back-end of Line”.

This strategy targets at the growth market of packaging. Paral-

lel to the activities of the pure packaging market, approaches

are developed to integrate MEMS-based sensors in non-rigid,

thin and smart labels, which collect, store and process data

measured. Such complex systems are used e.g. for container la-

beling. They require an integrated, wireless power supply in ad-

dition to optimized dielectric antennas and sensor systems. For

simple single-use applications, environmentally friendly primary

batteries may be used, which are based on zinc-manganese

dioxide and deliver voltages of 1.5 to 6 volts.

Therefore, highly efficient production technologies are used

based on printing processes. They will be further developed to

inexpensively produce thin, flexible energy reservoirs in (almost)

any form. Competitive advantages exist for the printed batter-

ies last but not least from the in-house design and the existing

infrastructure for their characterization and reliability testing.

Fraunhofer ENAS offers the following services:

� Antenna design and modeling

� Prototype antenna manufacturing and metrological

characterization

� System design for energy supply by wireless near-field

coupling

� Integration of sensors / MEMS in smart label

� Development of assembling and packaging technolo-

gies of printed elements and silicon components

� Adaptation of printing production technologies

� Design and modeling of printed batteries and integra-

tion of these elements

� Small batch production and metrological characteriza-

tion of batteries.

s m a r t m o n I t o r I n G s y s t e m s

“Smart Monitoring Systems“ includes the development of

system solutions for the condition monitoring using MEMS /

NEMS based systems and optimized data analysis / communi-

cation.

Main focus is the application of silicon based MOEMS (transmis-

sion or reflection orders) in miniaturized spectrometers for gas

analysis, environmental monitoring and medical applications.

Today‘s customers are developers and users of IR detectors,

spectrometers and analytical systems.

gREEn And WiRElESS SYSTEMS Smart monitoring systems are another aspect of this sub busi-

ness unit. For example they are relevant for active flow control

systems, which are currently intensively studied since the airline

industry calls for monitoring of components to meet the very

high standards for certification.

Fraunhofer ENAS offers the following services:

� System design and modeling

� Technology development

� Manufacturing of prototypes with specific technologies

� System Test

� Development of applications.

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coRE coMpETEncES

Electronic micro and nano systems use shaped elements and

functional components which have dimensions in the micro

and nano meter range. Comparable to microelectronics the

miniaturization and integration is ongoing. So the scaling of

dimensions has a big influence on functional principles as well

on the design of the elements and components. Moreover, the

diversity of technologies and the integration of heterogeneous

functionalities are increasing, too. Design and test require

a stronger combination of component and system design

methods. There is not only a mechanical design necessary but

also the integration of stationary electrical and magnetic fields,

electromagnetic waves in micro wave and terahertz range as

well as optical radiation, the electronic function and often

aspects of signal and system theory. Due to heterogeneous

composition it is often impossible to do this only based on one

simulation tool. Also in the field of measuring technique a lot of

different devices or meters have to be applied.

The core competence “Design and Test of Components and

Systems“ combines all simulation, layout and design methods

for the development of components and systems with the

test methods for analyzing and characterizing geometrical,

topographical and functional parameters. Design and test of

high precision MEMS/NEMS as well as the development of fast,

broad band near field measuring technique are unique features

of the core competence. The interaction with the technology

driven core competence like “Silicon Based Technologies for

Micro and Nano Systems” and “Polymer Based Technologies

for Micro and Nano Systems” together with their technology

dESign And TEST of coMponEnTS And SYSTEMS

platforms has a positive influence on the core competence

“Design and Test of Components and Systems“. The basis for

the excellent reputation are the high quality technical equip-

ment (design software, models, measuring technique for func-

tional characterization of MEMS on the wafer, chip and system

level, application adapted functional test, RF test, reliability and

analysis of tolerances, software algorithm) as well as the highly

educated and qualified stuff.

The departments Multi Device Integration and Advanced Sys-

tem Engineering mainly contribute to this core competence of

Fraunhofer ENAS.

gREEn AndWiRElESSSYSTEMS

dESign And TEST of coMponEnTS And SYSTEMS


interaction of the core

competence with the

business units

MicRo And nAno ElEcTRo-

nicS / bEol

The core competences are an indicator for the specific tech-

nological know-how of the Fraunhofer Institute for Electronic

Nano Systems. The excellence of Fraunhofer ENAS is based on

a broad variety of technologies and methods for smart systems

integration.

These are:

� Design and Test of Components and Systems

� Silicon Based Technologies for Micro and Nano Systems

� Polymer Based Technologies for Micro and Nano

Systems

� Printing Technologies for Functional Layers and Com-

ponents

� Interconnect Technologies

� System Integration Technologies

� Reliability of Components and Systems

The three core competences “Silicon Based Technologies for

Micro and Nano Systems“, “Polymer Based Technologies for

Micro and Nano Systems” and “Printing Technologies for Func-

tional Layers and Components” are the technological basis for

the development of components of micro and nano systems.

“Interconnect Technologies” and “System Integration Tech-

nologies” are so-called cross-sectional technologies of smart

systems integration. “Design and Test of Components and

Systems” as well as “Reliability of Components and Systems”

support the other technologies.

The core competences are based on the know-how of the

employees of the six departments of Fraunhofer ENAS. It

needs to be mentioned that departments contribute to dif-

ferent core competences. Moreover the core competences are

supported by the cooperation with our partners:

� Center for Microtechnologies ZfM of Chemnitz

University of Technology

� Chair Digital Printing and Imaging Technology of

the faculty of mechanical engineering of Chemnitz

University of Technology

� Chair Sensor Systems of the faculty of electrical

engineering of University Paderborn

The relevance of the core competences for the different

business units is graphically shown. Any overlap shown is an

indicator that the core competence interacts with the business

unit.

design and test of components and systems

reliability of components and systems

polymer basedtechnologiesfor micro andnano systems

printingtechnologiesfor functional

layers andcomponents

silicon basedtechnologiesfor micro andnano systems

interconnect technologies

system integration technologies

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“Silicon based Technologies for Micro and Nano Systems“

combine the equipment and stuff, the know-how and the tech-

nological processes for manufacturing silicon based micro and

nano systems. Silicon based technologies have been developed

at the Center for Microtechnologies ZfM of Chemnitz University

of Technology just since the early 90s. With the foundation of

the department Multi Device Integration of Fraunhofer IZM in

Chemnitz (now Fraunhofer ENAS) the technological portfolio

has been expanded and further developed in direction of

application-oriented manufacturing of prototypes and integra-

tion technologies.

In the future the focus will be on the development and inte-

gration of nano structures for new and novel systems. The

departments Multi Device Integration and marginally System

Packaging contribute to this core competence.

Based on the technological developments of the past 20 years

the following technologies have been established and are ap-

plied for manufacturing prototypes in the business units “Micro

and Nano Systems“ and “Green and Wireless Systems“ :

� Surface high aspect ratio technologies for high preci-

sion capacitive MEMS (AIM, SCREAM, BDRIE)

� Technologies for reducing pitches to nm range

� Technologies for RF-MEMS based on capacitive and

ohmic principles

� Technologies for hermetic encapsulation on wafer

level

� Application-specific bulk technologies

� Technologies for precision actuators

� Technologies for precision mechanical parts and com-

ponents

� Technological processes for photovoltaics

As the line is very flexible it is possible to develop new technolo-

gies for MEMS/NEMS for the in-house production process (de-

sign, technology development, prototypes, test), for customer

specific MEMS/NEMS and single processes. The technology can

also be transferred to the customer.

Silicon bASEd TEchnologiES foR MicRo And nAno SYSTEMS

This core competence covers the technological and human re-

sources for the development of micro and nano systems based

on polymeric materials. Being affiliated to the department

Multi Device Integration, the focus of the core competence is

not the development of individual sensors and actuators, but a

system approach in which the sensor and actuator functionality

is a direct part of the overall system.

The core competence can be divided into:

� Development of the polymer based integrated func-

tionalities themselves, and

� Key technologies necessary for the fabrication thereof.

Two different types of integrated functionalities are addressed:

� system- and material-integrated actuators:

A completely integrated, low-cost micro actuator

technology has been developed and patented for

polymer based microsystems. Based on these patents

a modular platform for in-vitro-diagnostics has been

developed together with other Fraunhofer Institutes,

which has now gained a high visibility in the market.

� system-integrated polymer based sensors: The

application of nano composites in polymer based

sensors exhibits a high potential. The polymeric matrix

of the composite can be relatively freely chosen and

adapted to a certain application. The sensor’s function-

ality, however, can be realized based only on a proper

selection of nano particles embedded in the polymer

matrix. The main research topics therefore are system-

adapted sensor design, integration technologies for

nano composites in polymeric materials as well as the

measuring techniques for characterization of polymer

based nano composites and sensors.

A certain number of key technologies is needed for the devel-

opment of polymer based sensors and actuators. All necessary

technologies are available at ENAS, such as surface modifica-

tion, metallization, micro structuring, dispersion technologies,

coating technologies for polymers and nano composites, bond-

ing technologies for plastics, and an assembly line for polymer

based micro systems based on electrochemical micro actuators.

polYMER bASEd TEchnologiES foR MicRo And nAno SYSTEMS

polYMER bASEd TEchnologiES

foR MicRo And nAno SYSTEMS


competence with the

business units


MicRo And

nAno SYSTEMS


nicS / bEol


competence with the

business units

Silicon bASEd TEchnologiES

foR MicRo And nAno SYSTEMS


MicRo And

nAno SYSTEMS


nicS / bEol

16 17

With the establishment of the Fraunhofer ENAS the depart-

ment Printed Functionalities was founded that embodies the

core competence “Printing Technologies for Functional Layers

and Components”.

The core competence “Printing Technologies for Functional

Layers and Components“ includes the usage and optimiza-

tion of industrial printing technologies (gravure, flexo, screen

printing and inkjet printing) for defined pictorially application

of functional coatings for application-relevant, usually flexible

substrates.

The close cooperation with the Chair of Digital Printing and

Imaging Technology of the Institute for Print and Media Tech-

nology pmTUC at Chemnitz University of Technology and the

related technological width are particular strengths of this core

competence. Unique features are in the field of inkjet pilot line

with the available roll-to-roll printing machines for inkjet, flexo

and gravure printing. Due to the aforementioned flexibility of

the implementation of various technical printing substrates and

printing materials, a broadband research and development area

opens up starting from printed batteries via printed reactive

functional layers up to the printed low-cost radio frequency

identification antenna systems which have been adapted to the

specific demands of their usage.

Depending on the particular application, suitable printing

methods are selected taking into account the requested

purpose, whereby customer needs are flexibly and specifi-

cally considered in the context of the technical possibilities. The

process advantages of an effective, pictorial material applica-

tion of functional layers at defined locations on the substrate

(additive technology) limit the use of materials to the required

areas and therefore costs for customers. To achieve the goal of

transferring the manufacturing process into mass production,

the imagewise coating is carried out under ambient conditions.

Only oxygen and humidity-sensitive materials require process-

ing in an artificial atmosphere.

pRinTing TEchnologiES foR funcTionAl lAYERS And coMponEnTS

The core competence “Interconnect Technologies“ is based on

the experience of the research and development carried out

since 1991 at the Center for Mirotechnologies ZfM of Chemnitz

University of Technology, founded as the „Technikum Mikroele-

ktronik“ already in 1979. With the foundation of Fraunhofer

ENAS and the establishment of the department Back-end of

Line, competences were transferred to Fraunhofer ENAS.

The core competence is characterized by two main elements:

� Material and process development as well as process

integration for interconnect systems and NEMS

� Modeling and simulation of processes and equipment,

of material properties and behavior of materials as

well as interconnect systems

With respect to the experimental work, the following topics are

in the focus:

� low-k / ultralow-k materials – deposition, pat-

terning, integration as well as characterization and k-

restore, alternatively airgap concepts and technology

� cVD and alD especially for metals – process develop-

ment based on metalorganic precursors, evaluation

of new precursors, Cu-CVD integrations schemes for

metallization systems and through silicon vias (TSV)

� In-situ plasma diagnostics – development and

optimization of plasma-based etching

Based on the available equipment, complete damascene archi-

tectures with Cu/low-k as well as airgap-based metallization

schemes can be realized on wafers up to 200 mm diameter.

Additionally, new research domains are addressed:

� Development of stressors for mobility enhancement

of charge carriers in MOS transistors

� Wafer-level integration of carbon nano tubes (CNT)

into interconnect systems and NEMS

� Integration of sensor materials, e.g. spintronic film

systems for GMR sensors

The modeling and simulation activities concentrate on processes

like PVD, CVD or CMP. Another focus is put on models and

simulation of devices and nano structures as well as on material

properties at the nanometer scale. In this manner, modeling

and simulation supports the technology development. The

close interaction of the two main elements, modeling and

simulation with material and process development and integra-

tion, represents a unique feature.

inTERconnEcT TEchnologiES


inTERcon-nEcT TEchno-

logiES

MicRo And

nAno SYSTEMS


competence with the

business units


nicS / bEol

gREEn And

WiRElESSSYSTEMS

pRinTing TEch-nologiES foR funcTionAl lAYERS And

coMponEnTS

MicRo And

nAno SYSTEMS


competence with the

business units


nicS / bEol

18 19

System integration and packaging technologies are very im-

portant in the value added chain of micro technical products.

Due to the broad range of customer-specific requirements

integration technologies contribute between 20 and 95% to

the component costs. Fraunhofer ENAS focuses on zero level

and first level packaging and develops methods and technolo-

gies for hybrid, monolithic and vertical integration of MEMS/

NEMS with electronic components. The departments System

Packaging and partly Back-end of Line contribute to this core

competence.

Since the early 90s first wafer bonding technologies such as

silicon direct bonding and anodic bonding have been devel-

oped in Chemnitz. With the increasing materials and structure

complexity it is a challenge to join very different materials

and to bridge surface topographies. This is possible by ap-

plying different intermediate layers such as glasses, polymers

or metals, which are used and investigated in new bonding

technologies like eutectic bonding, glass frit bonding and

adhesive bonding.

The request to higher integration densities was a main premise

for the development of technologies for structuring through

silicon vias (TSV) and for the development of TSV metallization.

In parallel barrier and isolation techniques had to be applied

and developed further. With increasing experiences it was

possible to switch from hybrid to vertical system integration.

Fraunhofer ENAS offers now integration technologies based on

hybrid as well as vertical technologies.

A big strength of the core competence is the close connec-

tion to the basic research by cooperating with the Center

for Microtechnologies of Chemnitz University of Technology.

The interaction with MEMS/NEMS and TSV development at

Fraunhofer ENAS and the cooperation with Fraunhofer IZM/

ASSID strengthen also the core competence.

A unique feature is the availability of a broad variety of bond-

ing technologies for MEMS/NEMS and electronic components

based on 4, 6 and 8 inch substrates. Moreover there is a focus

on the development of low temperature bonding, bonding

with reactive nano layers as well as Cu-CVD and Cu-ECD for

starting layer deposition as well as complete filling of TSVs.

SYSTEM inTEgRATion TEchnologiES

The knowledge and the experiences of Fraunhofer ENAS in the

field of reliability are the result of developments in the past 20

years. Started as research work in the field of lifetime prediction,

fracture mechanics, and damage mechanics within the former

Institute of Mechanics in Chemnitz, the methods have been

transferred and widely expanded by the Micro Materials Center

into the field of electronic components and systems during the

90s of the previous century. With the foundation of Fraunhofer

ENAS, the work has been continued with the clear focus on

the reliability of components and systems in the micro / nano

transition range.

Today, the accumulated competences allow the identification,

the analysis, and the evaluation of the effects and their interac-

tions leading to drift or degradation of functional parameters

and finally to failures of components and complete micro/nano

systems. Based on this “physics of failure“ approach, which

includes comprehensive calibration of all models and rigorous

validation of all simulation results by experimental tests and

analysis, the mechanisms and the consequences are studied

thoroughly so that the reliability risks can be quantified and

converted into lifetime models. These models are directly utilized

in the design and development of new smart systems and tech-

nologies (design for manufacturability and reliability). The

ultimate goal is to completely avoid the time and staff consum-

ing preliminary experiments in the design optimization of new

products. Instead, this should be done by „virtual prototyping“,

i.e. by means of perfectly validated numerical simulation, which

requires a fraction of the experimental effort only. Hence, the

solutions and design decisions based on virtual prototyping shall

REliAbiliTY of coMponEnTS And SYSTEMS

be as reliable as those based on the conventional sample tests.

This way, the first physical realization of the new products would

immediately be able to enter und to pass the final qualification

tests. Today‘s best practice in microelectronics‘ circuit design and

in the automotive industry gives rise to optimism that such a

vision can also be implemented successfully in the complex field

of micro and nano systems.

This area of expertise of Fraunhofer ENAS is mainly supported by

the department Micro Materials Center and to some degree also

by the departments Advanced System Engineering and Multi

Device Integration. Through the years of systematic development

and consistent implementation, it has clearly become a unique

feature of this institute. The strategy of seamless combination

of experimental investigations and realistic numerical simulation

pioneered and advanced by Fraunhofer ENAS has reached a

level of excellence that is well known and acknowledged.


SYSTEM inTEgRATion

TEchnologiES



competence with the

business units


nicS / bEol


REliAbiliTY of coMponEnTS

And SYSTEMS

MicRo And

nAno SYSTEMS


competence with the

business units


nicS / bEol

20 21

conTAcT

F r a u n h o F e r e n a s

Prof. Dr. thomas Geßner

Director

Phone: +49 (0) 371 45001-100

Fax: +49 (0) 371 45001-101

Email: [email protected]

Prof. Dr. thomas otto

Deputy Director

head of department multi Device Integration

Phone: +49 (0) 371 45001-231

Fax: +49 (0) 371 45001-331


Prof. Dr. Bernd michel

head of department micro materials center

Phone: +49 (0) 371 45001-220

Fax: +49 (0) 371 45001-320


Dr. sven rzepka

head of department micro materials center

Phone: +49 (0) 371 45001-421

Fax: +49 (0) 371 45001-521


Prof. Dr. reinhard Baumann

head of department Printed Functionalities

Phone: +49 (0) 371 45001-234

Fax: +49 (0) 371 45001-334


Prof. Dr. stefan e. schulz

head of department Back-end of line

Phone: +49 (0) 371 45001-232

Fax: +49 (0) 371 45001-332


Dr. maik Wiemer

head of department system Packaging

Phone: +49 (0) 371 45001-233

Fax: +49 (0) 371 45001-333


Dr. christian hedayat

head of department advanced system engineering

Phone: +49 (0) 5251 60-5630

Fax: +49 (0) 49 5251 60-5621


Gottfried höppner

head administration

Phone: +49 (0) 371 45001-210

Fax: +49 (0) 371 45001-310


Dr. martina Vogel

Officer of the director / PR officer

Phone: +49 (0) 371 45001-203

Fax: +49 (0) 371 45001-303


c e n t e r F o r m I c r o t e c h n o l o G I e s

Dr. Karla hiller

Deputy director of Zfm

Phone: +49 (0) 371 45001-400

Fax: +49 (0) 371 45001-500


Dr. andreas Bertz

head of department lithography

Phone: +49 (0) 371 45001-402

Fax: +49 (0) 371 45001-502


Dr. christian Kaufmann

head of department thin Film Deposition

Phone: +49 (0) 371 45001-401

Fax: +49 (0) 371 45001-501


norbert Zichner

technology advisor

Phone: +49 (0) 371 531-33650

Fax: +49 (0) 371 531-833650


Dr. Danny reuter

Project coordinator nanett

Phone: +49 (0) 371 531-35041

Fax: +49 (0) 371 531-835041


u n I V e r s I t y P a D e r B o r n

Prof. Dr. ulrich hilleringmann

chair sensor technology

Phone: +49 (0) 5251 60-2225

Fax: +49 (0) 5251 60-5913


22 23

C.-Süd

C.-Rottlu�

C.-Mitte

Dresdner Straße

Neefestraße

Südring

Augustusburger Straße

Südring

Reichenhainer Straße

Zschopauer Straße

Ann

aber

ger S

traß

eZwickauer Straße

Leipziger Straße

Reichsstraße

Limbacher Straße

Leipzig

Erfurt

Hof

Dresden

ChemnitzTh

üringer W

eg

War

tburg

straß

e

Technologie-Campus

Reichenhainer Straße

Rosenbergstraße

TUC

TUC

Mensa

Smart Systems CampusChemnitz

Technische UniversitätChemnitz

Zentrum

Südring / C.-Reichenhain

hoW To REAch fRAunhofER EnAS B y t r a I n

From the central station Fraunhofer ENAS can be reached by

taxi or bus (5-minute walk to the bus station). Take bus line 51

towards Altchemnitz/Reichenhain (get off at ‚Ebertstrasse‘). Fol-

low Reichenhainer Strasse (same direction as the bus) for 100

m to reach Rosenbergstrasse. Turn right into Rosenbergstrasse.

Go straight on for 200 m to reach the Smart Systems Campus.

Follow main street (passing the 3D-Micromac AG building on

the right and the Start-up building on the left). Fraunhofer

ENAS is located on the left.

B y P l a I n

You can reach Chemnitz via the airports Dresden and Leipzig.

B y c a r

e x I t a 4 , c h e m n I t Z - m I t t e

Follow B 95 and go straight on to the city center (direction

signs: TUC, Campus Reichenhainer Strasse). Go straight ahead

Leipziger Strasse leading into Reichsstrasse and Gustav-Freytag-

Strasse. Turn right into Reichenhainer Strasse. Proceed straight

ahead for approximately 1 km and turn right into Rosenberg-

strasse. Go on for 200 m to reach the Smart Systems Campus.

Follow main street (passing 3D -Micromac AG on the right) and

turn right into Technologie -Campus. Fraunhofer ENAS is located

on the left. Free parking in front of the Fraunhofer building or

at the parking lot in front of the Start-up building.

e x I t a 7 2 , e x I t c h e m n I t Z - s u e D

Coming from the freeway A72 towards Dresden, leave at the

exit Chemnitz Sued. Pass the fly-over (Neefestrasse) and turn

right into South beltway (Suedring). Go straight ahead and

follow direction signs for Annaberg. Continue following the

South beltway straight to the Reichenhainer Strasse (exit on the

right) and turn left into Reichenhainer Strasse (direction sign:

TUC, Campus Reichenhainer Strasse). Proceed straight ahead

for approximately 1 km (passing the cemetery, crematory and

Chemnitz University of Technology TUC) and turn left into

Rosenbergstrasse. Go straight on for 200 m to reach the Smart

Systems Campus. Follow main street (passing the 3D-Micromac

AG building on the right and the Start-up building on the left).

Fraunhofer ENAS is located on the left. Free parking is possible

in front of the Fraunhofer building.

The Fraunhofer Institute for

Electronic Nano Systems is part

of the Smart Systems Campus

Chemnitz and is located next

to Chemnitz University of Tech-

nology (Campus Reichenhainer

Straße).

Please note that Technology

Campus is not yet available in

all navigation systems. Alterna-

tively, you can use the Rosen-

bergstrasse.

CZ

PL

Chemnitz

Leipzig

Dresden

Berlin

Prag

Nürnberg / München

Berlin

13

4

174

14

14

38

9

9

72

4

Frankfurt

Flughäfen/Airports:

1 - Leipzig/Halle2 - Dresden3 - Altenburg-Nobitz

Fraunhofer ENAS

24

conTAcT

Fraunhofer enas

Technologie-Campus 3

09126 Chemnitz

Phone: +49 (0)371 45001 - 0

Fax: +49 (0)371 45001 - 101


www.enas.fraunhofer.de

cover photo: building of Fraunhofer ENAS

photos: Fraunhofer ENAS

smart systems - visions become reality - fraunhofer€¦ · smart systems - visions become reality...

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