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Smart Building/Internet-of-Things

Sensors

Wireless

Connectivity

Wired

ImageLightProximityTouchTemperature

•••••

ZigBeeS-FSKKNXM-BUSHART6loWPANProprietary

•••••••

Boost / FlybackConverters & Battery Management

System PowerManagement

Non-VolatileMemory & Security

Processor / MCU

Motor Control

BatteryEnergyHarvester

• Seamlessly connected intelligent devices that sense, analyze and control the environment

• Connected smart lighting, surveillance/security systems, HVAC systems, home appliances, energy management systems, vehicles, traffic control

• Key building blocks include sensors/actuators, ultra low power MCUs/DSPs, connectivity, power management, security and software, chip integration and micro-packaging

Internet of Things Solutions

PAC

KAG

ING

Broad Packaging Portfolio

AYRE SA3291 - Wireless DSP SiP for Hearing Aids

Custom 3D packaging connects different silicon die and discrete components together in the same package to dramatically save space and improve electrical performance by decreasing signal distances.

ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio.

• Stacking with or without wirebonds• Modular, scalable architectures with high

degree of manufacturing testability • Mature, robust technologies and structures• RoHS-compliant and ISO-certified

Die

Top Substrate

Interposer

Capacitors

Solder Pads

Flip Chip Connections

Main Substrate

Solder Connections

Advanced 3D Packaging

IPM

DPAK6.0 x 6.5 mm

SO8-FL5.0 x 6.0 x 1.0 mm

SOT-8831.0 x 0.6 x 0.4 mm

XDFN-40.8 x 0.8 x 0.4 mm

PIM

ON Semiconductor

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2.4 GHz IEEE 802.15.4-2006 Wireless Transceiver

Low power, fully integrated system-on-chip for secure wireless connectivity

Features• Integrates ARM® Cortex-M3 32-bit µP, 640kB FLASH,

48 kB RAM, hardware accelerated MAC• AES 256 / 128 encryption engine• Peripherals: DMA, UART (x2), SPI (x2), I2C (x2), PWM,

RTC, WDT, 18 GPIO, 10-bit ADC, programmable timers (x3), temperature sensor, supply voltage sensor

• Programmable transmit power (up to ~8 dBm)• Receiver sensitivity less than –99 dBm• Antennae diversity• Supports external LNA & PA• <0.5 µA Timed Coma Mode Current• 6.9 mW Transmit Mode Power Consumption• 6.6 mW Receive Mode Power Consumption• VDD includes low voltage mode with operation down

to 1.0 V

Software Ecosystem• 2.4 GHz IEEE 802.15.4-2006 certified MAC/PHY• ZigBee PRO support included (ZHA, ZSE 1.x, ZLL, etc.)• ZigBee IP support included (SE 2.0)• 802.15.4-2006 compatible applications• Partner program for design services & support

UART 1

UART 2

SPI 1

I2C 1

GPIO

PWM

SUPPLYMONITOR

SAR ADC

TEMP SENSOR

PMUDVDDDVDDA

FVDDLRVDDn

AVDDn128 AES

RESETCTRL

DIO[17:0]

NCS36510

A[3:0]

V3V

V1VO

FVDDHO

FVDDHI

VDDIO

TIMERS

MUX

TEST MODES

FLASHCONTROL

CLOCKCTRL

32 kHz

32 MHzRTC

WATCHDOG

32MO

32MI

32KO

32KI

POWER SEQ

MACMODULATOR

DEMODULATOR

RF ANALOGCONTROL

RADIO

VPA

RFPWR

TX

RX

RESETN

RANDOMNUMBER

GENERATOR

SPI 2

I2C 2

CROSSBAR

PAD CONTROL

System Bus

ARMCORTEX−M3

I−code D−code

BUS MATRIX

INTERRUPTAND

WAKEUPCONTROL

ataDnoitcurtsnI

AHB to APBBRIDGE

320 kBFLASH A

320 kBFLASH B

16 kBSRAM A

16 kBSRAM B

16 kBSRAM C

DMASERIALWIRE

DEBUG

TEST

V1VI

DIO[13]

DIO[12]

DIO[11]

RESETN

SWDIO

SWDCLK

SWO

SWD_RESET

NCS36510 Block Diagram


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PLC Modems/Power Line Driver

12 V 3V3_D

3V3_DVEEVcom

GNDuC R9

C5

R7

R8

C8

C6

R6

R14

R2

REF_OUT

RX_IN

RX_OUT

TX_ENB

TX_OUT

R1

CDREF

C1C2

R4R5

C4 C3

R3

Vwarn Rlim

VCC

C7C9

D3

D2

D1

D4

ZC_INR11

C11

Tr1:2

R10MAINS

C10

12 V

D5

C12

3 V 3_A

VDDA

C13

NCS5651Application

&Metering

μC

T_REQ

R12

TXD

RXD

BR0

BR1

RESB

EXT_CLK_E

SEN

VDD1V8

3V3_D

C17

3V3_A

C16

VDD

C14

XTA

L_IN

XTA

L_O

UT

VS

SA

VS

S

C15

NCN49597

Device Function Features Package(s)

Smart Grid

Modem

NCN49599PLC S-FSK Modem;

A - D Band

• ARM Cortex M0• Baud rate: 4800 Bauds• S-FSK modulation

• Hardware embedded MAC + PHY• Embedded 1.2 A, 2-stage power amplifier

with current limitation and thermal protectionQFN-56

NCN49597PLC S-FSK Modem;

A - D Band• ARM Cortex M0• Baud rate: 4800 Bauds

• S-FSK modulation• Hardware embedded MAC + PHY

QFN-52

Smart Metering Modem

AMIS49587PLC S-FSK Modem;

A & B Band

• ARM7TDMi, 24 MHz core• Baud rate: 2400 Bauds

• S-FSK modulation• Hardware embedded MAC + PHY QFN-52

Power Amplifier NCS5651

Power Line Driver;Class AB

• Low distortion power line driver with optimized interface for PLC modems

• Capability to drive 2.0 A peak into reactive loads

• Current shutdown minimizes power consumption during power down state

• Rail-to-Rail Drop of Only ±1 V with Iout = 1.5 A

QFN-20 EP

ON Semiconductor

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ECTIVITY

KNX TransceiversKNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based network communications protocol for intelligent buildings. KNX is the successor to, and convergence of, three previous standards:

the European Home Systems Protocol (EHS), BatiBUS, and the European Installation Bus (EIB or Instabus).

Applications• Connects appliances and sensors, especially for climate

and light control to the 9600 Baud KNX twisted pair (TP) bus inside a building

• TP bus provides data communication and power supply

KNX Open Standards• EN 50090: European Standard• ISO/IEC 14543-3: International Standard • GB/Z 20965: Chinese Standard • ANSI/ASHRAE 135: US Standard

Switch

230 VMain

Distribution

230 V

230 V

TP (Twisted Pair)

PL (Power-Line)

RF (Radio Frequency) or IR (Infrared)

Lighting SunBlinds

Heating Monitoring

PhysicalCommunication

Media

WashingMachine

Oven

Device

DC=DC Converters 20 V Regulator

Embedded MAC + LLC1

KNX Host Interface

PackageFixed 3.3 V Adj 3.3 to 21 V Digital SPI/UART Analog UART

NCN5120 4 4 4 4 4 4 QFN-40

Note 1: LLC = Logical Link Control layer of the OSI-based communications network.


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General Application Diagram

Wired M-BUS Transceiver

Features• Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3• UART communication speeds up to 38400 baud• Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA)• Supports powering slave device from the bus or from external power supply• SOIC-16 and QFN-20 packages

RIS

RIS

PFb

SC

CSC

CVDD

RIDD

TVS1 MBUS

RBUS1

RBUS2

RIDD STCGND

CSTC

RXIRXTXTXI

VDD

μC

VIOVS

BUSL2

VB

BUSL1

NCN5150

ON Semiconductor

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ECTIVITY

Modems

AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units• Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112

per FF-816) and PROFIBUS PA standards

• Enables Fieldbus to completely power field devices using the integrated power supply block

• Data rate: 31.25 kbps voltage mode

• Low current consumption 500 μA typ

• LQFP-44 and NQFP-44 packages

ProcessSensor

Microprocessorwith RAM and ROM

LinkController

FieldbusMAU

FieldbusSegment

Industrial HART Protocol Modems• Single-chip, half-duplex 1200 bps FSK modem

• Bell 202 shift frequencies of 1200 Hz and 2200 Hz

• Transmit-signal wave shaping

• Receive band-pass filter

HART Modems

DeviceInput

Frequency DACTemp Range

(°C) Package

NCN5193460.8 kHz, 920 kHz,or

1.8 MHz

Integrated 16-bit

Sigma-Delta–40 to +85 QFN-32

NCN5192460.8 kHz, 920 kHz,or

1.8 MHz

Integrated 16-bit

Sigma-Delta–40 to +85 QFN-32

A5191HRT 460.8 kHz External –40 to +85QFN-32, LQFP-32, PLCC-28

NCN5193

XOUT

XIN3.6864 MHz

CBIAS VSS MODE

μC

VDDA

HART &4 – 20 mA OUT

HART IN

1.8 V − 3.5 V

TxA

CDREF

AREF

RxAN

RxAFRxAFIVDDAVDD

RxD

CD

TxD

RTS

RESET

VPOR

CS

DATA

SCLK

KICK

DACVDDA

JUMPDACREF

CLK2

CLK1

VDDA

TEST1

TEST2

RxAP


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CAN Transceivers for Long Networks, >500 m

Features• ISO 11898-2 compliant

• Up to 1 Mb/s communication speed

• Delivers low transmit data rate in networks exceeding 1 km

• Functional in 12 V and 24 V systems

Text

Rx0

Tx0

Rint

CANH2

CANL1

GND

VrefVCC

CANL2

CANH1

CANBUS 2

CANBUS 1

100 nF

VBAT5 V−reg

RLT60

RLT60

CD

EN1

EN2

AMIS–427707

9

2

3

10

4

18

1312

19

14

8

5 6 15 16 17

CAN TransceiversDevice Type Description Package

AMIS42770 Dual High-Speed CAN Repeater SOIC-20

AMIS42670 Single High-Speed CAN Transceiver for Long Networks SOIC-8




ON Semiconductor

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ECTIVITY

Motion Detector Passive Infrared Controller (PIR ) — NCS36000

• Passive infrared controller circuit for the lighting and occupancy sensing market• Amplifies and conditions signal from PIR sensor

Features• 3.0 – 5.75 V operation• Integrated low noise 2-stage amplifiers• Internal voltage reference to drive sensor• Internal oscillator with external RC• Single or dual pulse detection• Digital filter to minimize false alarms• Direct drive of LED and relay

Benefits• Lower BOM cost than comparable discrete solutions

• Extremely flexible solution• Customer can customize digital filtering

• Customer can customize analog processing• Designed for wide range of occupancy sensors

NCS36000

DigitalControlCircuit

2WindowComparator

OUT

VSS VDD

LED

AmplifierCircuit

SystemOscillator

LDO &Voltage

References

xLED_ENMODEOP1_P

OP1_NOP1_O

VREF

OP2_N

OSC

OP2_O

2

Old Solution NCS36000 Solution


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IEEE 802.3at + Auxiliary, 40 W• Auxiliary input voltage range from 9.0 V to 57 V• Integrated DC-DC converter controller implements highly efficient

power conversion at low output voltages in conjunction with auxiliary voltage input

• Delivers 25.5 W for PoE+ IEEE 802.3at and up to 40 W in proprietary applications

• Supports IEEE two event classification• Best-in-class cable ESD and thermal characteristics

Features – NCP1083NCP1083, consisting of fully compliant PoE functionality and DC-DC controller, may be used to drive LED lamps. Additionally, lamps may be controlled remotely through PoE.

• Emits white color of ~2700°K

• LED lamp overall maximum power output 33 W

• Peak efficiency ~89%

• LED lamp powered by PSE directly over NCP1083 load switch circuitry; DC-DC controller can provide 3.3 V, 5 V or 15 V power supply

• LED drivers operate in buck operation mode, switching frequency about 1.05 MHz, PWM dimming frequency 16 kHz

• DC-DC controller working frequency up to 500 kHz, fly-back topology used

• Under-voltage startup level set to 38 V, or programmble down to 8.5 V; current limit 970 mA

NCP1083

nCLASS_AT

GATE

RTNCOMP

VDDL

VAUX(+)

VOUT

DataPairs

SparePins

VAUX(–)

CLASS

INRUSH

ILIM1

UVLO

AUX

VPORTIN

VPORTP

TL431

MBRS1100

MBRS1100

1SM

A58A

Power-Over-Ethernet (PoE ) Controllers

Device Description TopologyControl Mode

VCC Min (V)

VCC Max (V)

Pd Typ (W)

Ron Typ (Ω) Package

NCP1080 PoE-PD Controller and DC-DC Converter Flyback Current 0 57 15 0.6 TSSOP-20

NCP1081 PoE-PD Controller and DC-DC Converter Flyback Current 0 57 40 0.6 TSSOP-20

NCP1082 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 0 57 15 0.6 TSSOP-20

NCP1083 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 0 57 40 0.6 TSSOP-20

NCP1090 PoE-PD Interface Controller — — 0 57 15 0.5 SOIC-8, TSSOP-8

NCP1091 PoE-PD Interface Controller with Programmable UVLO — — 0 57 15 0.5 SOIC-8, TSSOP-8

NCP1092 PoE-PD Interface Controller with Vaux Support — — 0 57 15 0.5 SOIC-8, TSSOP-8

NCP1093 PoE-PD Interface Controller — — 0 57 25 0.5 DFN-10

NCP1094 PoE-PD Interface Controller with Vaux Support — — 0 57 25 0.5 DFN-10

ON Semiconductor

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NCN8024R Demo Board

VccRSTCLKC4

GNDVppI/OC8

DET DET

GNDGND1

234

567

8

SMART CARD

VDD

VDDP10 uF

100 nF

VDDR1

R2

Microcontroller

DAT

APO

RTC

ON

TRO

L

GND

GND220nF

100nF

100 uF

CRD_VCC

CRD_AUX1CRD_CLK

I/Ouc

CRD_RST

CRD_PRES

VDD

CLKDIV2CLKDIV1

GNDP

CRD_AUX2

CRD_GND

CRD_IO

CLKIN

AUX1ucAUX2uc

PORADJ

RSTIN

INT

CMDVCC5V/3V

VDDP

CRD_PRES

NCN8024R

GND

Smart Card Interfaces

Device PortsControl

InterfaceCard Type

VDD μC Interface(V)

PowerSupply Sequencer

Card Detect

Clock Divider Standards Package(s)

SmartCard

NCN6001 1 SPI A, B, C 2.7 – 5.5InductiveDC-DC

Yes Yes Yes ISO7816; EMV4.3TSSOP-20, TLLGA-20

NCN8024R 1 Parallel A, B 2.7 – 5.5 LDO Yes Yes Yes ISO7816; EMV4.3 SOIC-28W

NCN8025/A (SAM/SIM)

1/3 Parallel A, B, C 2.7 – 5.5 LDO Yes Yes YesISO7816; EMV4.3;

UICCQFN-16, QFN-24

NCN8026 (SAM/SIM)

1 Parallel A, B, C 1.6 – 5.5 LDO Yes Yes YesISO7816; EMV4.3;

UICC; SIMQFN-24

SAM NCN4555 1 Parallel B, C 1.8 – 5.5 LDO No No No UICC; SIM QFN-16

Features• ISO & EMV compliance• ESD protection on card pins up to

+8kV (Human Body Model)


SEN

SIN

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ON Semiconductor

Mainstream CMOS Image Sensors

DeviceSensor/

SOC Resolution

(MP)Optical Format Frame Rate

Pixel Size(μm) Shutter Type1 CFA

Operating Temp (°C)

MT9V115 SOC VGA 1/13” 30 fps 1.8 ERS Color -30 to +70


ASX350AT SOC VGA 1/5” 60 fps digital, 30 fps analog 3.8 ERS Color -40 to +105

ASX340AT SOC VGA 1/4” 60 fps digital, 30 fps analog 5.6 ERS Color -40 to +105

ASX340CS SOC VGA 1/4” 60 fps 5.6 ERS Color -30 to +70


MT9V024 Sensor WVGA 1/3” 60 fps 6.0 GS Color, Mono, RCCC -40 to +105

MT9V034 Sensor WVGA 1/3” 60 fps 6.0 GS Color, Mono -30 to +70

ARX550AT Sensor 0.5 1/5” 66 fps 3.8 ERS Color, RCCC -40 to +105

AR0140AT Sensor 1.0 1/4” 60 fps 3.0 ERS Color -40 to +105

AR0140CS Sensor 1.2 1/4” 1.2 45 fps, 720p60 3.0 ERS Color -30 to +85

AR0141 Sensor 1.2 1/4” 1.2 45 fps, 720p60 3.0 ERS Color, Mono -30 to +85

AR0130 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70

AR0132AT Sensor 1.2 1/3” 1.2 45 fps, 720p 60 fps 3.8 ERS Color, Mono, RCCC -40 to +105

AR0134 Sensor 1.2 1/3” 1.2 54 fps, 720p60 3.8 GS Color, Mono -30 to +70

MT9M021/31 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 GS Mono -30 to +70

MT9M024/34 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70

MT9M114 SOC 1.3 1/6” 1.3 30 fps, VGA 75 fps 1.9 ERS Color -30 to +70

MT9M001 Sensor 1.3 1/2” 30 fps 5.2 ERS Mono 0 to +70

MT9D131 SOC 1.9 1/3.2” 1.9 15 fps, SVGA 30 fps 2.8 ERS Color -30 to +70

AR0261 Sensor 2.1 1/6” 1080p60 1.4 ERS Color -30 to +70

AR0262CP Sensor 2.1 1/6” 1080p 60 fps 1.4 ERS Clarity+ -30 to +70

AS0260 SOC 2.1 1/6” 30 fps 1.4 ERS Color -30 to +70

AR0331 Sensor 3.1 1/3” 1080p60 2.2 ERS, GRR Color -30 to +85

AR0330 Sensor 3.5 1/3” 1080p60 2.2 ERS, GRR Color -30 to +70

AR0543 Sensor 5.0 1/4” 5 15 fps, 1080P 30fps 1.4 ERS Color -30 to +70

MT9P004 Sensor 5.0 1/3.2” 5 15 fps, 1080p30 1.8 ERS, GRR Color -30 to +70

MT9P006 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color -30 to +70

MT9P031 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color, Mono -30 to +70

AR0842CP Sensor 8.0 1/4” 8 30fps, 1080P 30fps 1.1 ERS Clarity+ -30 to +70

AR0833 Sensor 8.0 1/3.2” 8 30 fps, 1080P 30fps 1.4 ERS, GRR Color -30 to +70

AR0835 Sensor 8.0 1/3.2” 8 42 fps, 1080P 60fps 1.4 ERS, GRR Color -30 to +70

MT9J003 Sensor 10 1/2.3” 10 15 fps, 1080p60 1.7 ERS, GRR Color, Mono -30 to +70

AR1011HS Sensor 10 1” 60 fps 3.4 ERS Color -30 to +70

AR1335 Sensor 13 1/3.2” 13 30 FPS, 1080p 60 fps 1.1 ERS Color -30 to +70

MT9F002 Sensor 14 1/2.3” 14 13 fps 1.4 ERS, GRR Color -30 to +70

AR1820HS Sensor 18 1/2.3” 18 24 fps, 1080p 120 fps 1.3 ERS, GRR Color -30 to +70

1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter

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Co-Processors for Mainstream CMOS Image Sensors

Automotive/Industrial Co-Processors

AP0100 AP0101

Applications Home Security, Surveillance, Automotive

Home Security, Surveillance, Automotive

Sensors Supported

MT9M024/34,AR0130, AR0140CS,

AR0132AT, AR0140AT, ARX550AT

MT9M024/34,AR0140CS, AR0132AT, AR0140AT, ARX550AT

Maximum Resolution 1.2 MP 1.2 MP

Frame Rate 1.2 MP 45 fps 720p60 1.2 MP 45 fps

Color Pipe Features

Demosaic Demosaic

Gamma correction Gamma correction

Auto white balance Auto white balance

Defect correction Defect correction

Noise reduction Noise reduction

Auto exposure Auto exposure

Flicker detection Flicker detection

HDR with ALTM YES YES

Dewarp (Yes or No)

YES Up to 165 degrees NO

Spatial Transform Engine Software Add-on

YES,Multiple viewing options,

PTZ NO

Overlays YES NO

GPIOs Up to 5 Up to 5

Sensor Interfaces 2-lane HiSPi,12-bit parallel 12-bit parallel

Output Interfaces NTSC/PAL, 16-bit parallel 16-bit parallel

Input Clock 6-30 MHz 6-30 MHz

Output Clock 27 MHz (NTSC/PAL)84 MHz parallel 84 MHz parallel

Operating Temp –30 to +70°C (CS Version)–40 to +105°C (AT Version)

–30 to +70°C (CS Version)–40 to +105°C (AT Version)

Package VFBGA-100 VFBGA-81

Mobile Applications Co-Processors

AP1302

Full Featured Image Processor

Main Camera Up to 13 MP @ 30 fps

Secondary Camera Up to 1080 @ 60 fps

MobileHDR Support 4

Clarity+ Processing 4

Bayer Output 4

JPEG Output 4

YUV Output 4

Gamma Correction

4

Face Detection/ Smile Detection

4

SEN

SIN

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ON Semiconductor

Major Components Description

ON Semiconductor AR0230 2 MP/1080p CMOS image sensor with superior low light performance

Gainspan Wi-Fi Module GS2011M module streams data over Wi-Fi

Bluetooth Module Noridc BLE nRF51822

TI DM368 ARM9 core, high performance digital media system on chip

PIR Motion Sensor Triggers camera functions on motion detection

Microphone Omnidirectional microphones

LEDs For power, video streaming

USB Port Provides power to board, firmware upgrades

Battery 4200 mAH Lithium-ion battery

Storage Micro SD card slot

Internet of Things ( IoT) Video Development Kitfor Home Automation – smart lock, home security, smart lighting, smart door bell, smart appliances

Features• 1080p, Video on Demand (VOD), Live Streaming,

Cloud Connectivity, WiFi, BLE, Ethernet, remote control of device, Android and ios app for control, open source APIs

• Based on AR0230 (2MP/1080p) – Superior Low Light, Flexible interfaces (Parallel, HiSpi), High Dynamic Range

• Pending 2Q15

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Interline Transfer CCD Image Sensors

With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. All 5.5 μm and most 7.4 μm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products.

Features• Progressive scan with electronic

shutter and anti-blooming support• High resolution• High sensitivity• Low image lag and smear

1. CFA Options – Bayer Color (C), Monochrome (M), and TRUESENSE Sparse CFA (S). 2. Pin and Electrically Compatible

5.5 μm Interline Transfer CCD Image Sensors

DeviceResolution

(MPix) Pixel CountPixel(μm)

Diagonal(mm) Lens CFA1 FPS Max

Evaluation Kit

KAI-0330 VGA 648 x 484 9 7.3 1/2” C/M 120 3

KAI-0340 VGA 640 x 480 7.4 5.9 1/3” C/M 210 3

KAI-0373 WVGA 768 x 484 11.6 x 13.6 11.1 2/3” C/M 30

KAI-011502 0.9 1280 x 720 5.5 8.1 1/2” C/M/S 138 3

KAI-1003 1 1024 x 1024 12.8 18.5 4/3” M 30 3

KAI-1010 1 1008 x 1018 9 12.9 1” M 30

KAI-1020 1 1000 x 1000 7.4 10.5 2/3” C/M 50 3

KAI-010502 1 1024 x 1024 5.5 8 1/2” C/M 120 3

KAI-2001 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3

KAI-2020 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3

KAI-020502 1.9 1600 x 1200 5.5 11.1 2/3” C/M 68 3

KAI-021702 2.1 1920 x 1080 7.4 16.3 1” C/M/S 60 3

KAI-021502 2.1 1920 x 1080 5.5 12.1 2/3” C/M/S 64 3

KAI-040702 4.2 2048 x 2048 7.4 21.4 4/3” C/M/S 28 3

KAI-040502 4.1 2336 x 1752 5.5 16.1 1” C/M/S 32 3

KAI-080512 8.1 3296 x 2472 5.5 22.7 4/3” C/M/S 16 3

KAI-11002 10.7 4008 x 2672 9 43.4 35 mm C/M 5 3

KAI-16000 15.8 4872 x 3248 7.4 43.3 35 mm C/M 3

KAI-160502 16 4896 x 3264 5.5 32.4 APS-H C/M/S 8 3

KAI-160702 15.7 4864 x 3232 7.4 43.2 35 mm C/M/S 8 3

KAI-290502 28.8 6576 x 4384 5.5 43.5 35 mm C/M/S 4 3

SEN

SIN

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ON Semiconductor

Full Frame CCD Image Sensors

From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection.

Features• High resolution• Support for large sensor formats• Simple, two-phase clocking• Very low dark current for long exposures• Vertical and horizontal binning

1. CFA Options – Bayer Color (C), Monochrome (M).

Full Frame CCD Image Sensors

DeviceResolution

(MPix) Pixel CountPixel(μm)


Evaluation Kit

KAF-0261 VGA 512 x 512 20 14.5 1” M 15 3

KAF-0402 WVGA 768 x 512 9 8.3 1/2" M 20 3

KAF-1001 1 1024 x 1024 24 34.8 APS-H M 3 3

KAF-1603 1.6 1536 x 1024 9 16.6 1” M 2.2 3

KAF-3200 3.3 2184 x 1510 6.8 18 4/3” M 2.5 3

KAF-4320 4.3 2084 x 2084 24 70.7 645 M 2 3

KAF-6303 6.3 3088 x 2056 9 33.4 APS-H M 0.6 3

KAF-8300 8.3 3326 x 2504 5.4 22.5 4/3” C/M 2.9 3

KAF-09000 9.3 3056 x 3056 12 51.9 645 1.3x M 0.4

KAF-16801 16.8 4096 x 4096 9 52.1 645 1.3x M 0.4 3

KAF-16803 16.8 4096 x 4096 9 52.1 645 1.3x M 0.2

KAF-40000 40 7304 x 5478 6 54.8 645 1.3x C 1.3

KAF-50100 50.1 8176 x 6132 6 61.3 645 1.1x C/M 1

SENSIN

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Linear CCD Image Sensors

Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging.

Features• High dynamic range• Pinned photodiodes for low lag and low dark current• Channel independent electronic exposure control• Single output per color, including multi-readout register

architectures• High data rates Linear CCD Image Sensors


Device Pixel CountPixel(μm)

Diagonal(mm) CFA1 Evaluation Kit

KLI-2104 4196 x 1, 2098 x 3 7.0, 14.0 29.4 Luma+C

KLI-2113 2098 x 3 14 29.4 C/M 3

KLI-4104 8160 x 1, 4080 x 3 5.0, 10.0 40.8 Luma+C/M 3

KLI-8023 8002 x 3 9 72 C/M 3

SEN

SIN

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ON Semiconductor

High Sensitivity CMOS Image SensorsWith resolutions of 300 K, 500 K and 1.3 Megapixels (MPix) respectively, the PYTHON 300, 500 and 1300 are designed to address the needs of general purpose industrial image sensing applications such as machine vision, inspection and motion monitoring, as well as security and surveillance applications including intelligent transportation systems (ITS).

ON Semiconductor’s new global shutter image sensors combine flexibility in configuration and resolution with high speed and high sensitivity for the industrial imaging market. The pixel in these PYTHON sensors allows the capture of fast moving scenes without distortion by combining a read noise of less than 9 e-, with 7.7 V/lux sensitivity and frame rates as high as 850 fps.

The KAC-12040 and KAC-06040 CMOS image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14 bit) with a flexible readout architecture that supports interspersed video streams. This feature enables the use of multiple regions of interest that can simultaneously monitor both wide areas and local regions. These devices are ideal for machine vision, surveillance, ITS, and analytical microscopy.


DeviceResolution

(MPix)Pixel Count

(H x V)Pixel(μm)


Evaluation Kit

PYTHON 300 0.3 640 x 480 4.8 3.8 ¼” C/M 840 3

PYTHON 500 0.5 800 x 600 4.8 4.8 1/3.6” C/M 560 3

PYTHON 1300 1.3 1280 x 1024 4.8 7.9 ½” C/M 210 3

PYTHON 2000 2 1920 x 1200 4.8 10.9 2/3” C/M 245 3

PYTHON 5000 5 2592 x 2048 4.8 15.9 1” C/M 105 3


DeviceResolution

(MPix)Pixel Count

(H x V)Pixel(μm)


Evaluation Kit

KAC-06040 6 2832 x 2128 4.7 16.7 1” C/M 160 3

KAC-12040 12 4000 x 3000 4.7 23.5 4/3” C/M 70 3

Features• CDS global shutter technology with single digit

noise performance• True HW scalable family concept• High configurability and fast adaptability• High frame rates• Multiple regions of interest• High dynamic range• High NIR sensitivity

Features• Global shutter, low noise rolling shutter • Programmable bit depth• Interspersed video streams• Multiple regions of interest• High frame rates• High NIR sensitivity

KAC-12040

KAC-06040

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Ambient Light & Proximity Sensors

Features• Design flexibility/customization (i.e., EEPROM if

desired for trimming)• 0.0125 lux detection with customizable filtering

(i.e., Photopic Light Response)• Dark current and temperature compensation• Lowest power consumption per resolution bit• I2C Interface (including High Speed Mode) and

no effect on bus during power down

SDA

1 k

Vin = 3.3 V

1 k

1 μFSCL

MCU LEDDrivers LEDs

SDA

SCL

VDDAmbient

LightSensor

VSS

hν

Device Special FeaturesIO Typ @ EV = 100 Lux

(μA) Output InterfaceVin Range

(V)TA Range

(°C) Package

LA0151CS 2-Stage Gain Switching 8 (high gain) Analog, linear current 2.2 - 5.5 -30 to +85 ODCSP-4

LA0152CS Standby Function 8 Analog, linear current 2.2 - 5.5 -30 to +85 ODCSP-4

LV0104CS Integrated Sleep Mode - I2C, 16-bit ADC 2.3 - 3.6 -30 to +85 ODCSP-4

LV0111CF Standby Function 21 Analog, logarithmic current 2.3 - 5.5 -30 to +85 ODCSP-4J

NOA1212 Dark Current Compensation 51 (high gain) Analog, linear current 2 - 5.5 -40 to +85 CUDFN-6

NOA1305 Dark Current Compensation - I2C, 16-bit ADC 2.4 - 3.6 -40 to +85 CUDFN-6

NOA3302 Proximity Sensor - I2C, 16-bit ADC 2.3 - 3.6 -40 to +80 CWDFN-8

LA0151CS

0.1 μF

VoltageSupply

SW Gain Cont.

OUT

VCC

GND

Current-VoltageConversion

When the Sunlight is Strong,Extending the Dynamic Range

by Lowering Gain

AmpCPU

I/O

ADC

LV0104CS

0.1 μF

VoltageSupply

CPUSCL

SD

ApproximatesHuman EyeResponse

Simple2-Wire I2CInterface

16-BitADC

I2CBus

ControlLogic

VCC

GND


SEN

SIN

G

ON Semiconductor

Capacitive Touch Sensors

Design Friendly, Low-Cost Operation, High Reliability

Acrylic Thickness: 3.0 mm

Air Gap: 1.5 mm

• Adhesive free • Reduce manufacturing cost and improve reliability by eliminating existing adhesive process

• Long sensor trace • Provide flexible PCB design

• Wide range operational temperature • Available in high-temperature environment

• No extra components • Reduce BOM

• High noise immunity • Improve stability and reliability

SENSIN

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Capacitive Touch Sensors

OverviewThe LC717A00/10 is a high-performance and low-cost capacitance-digital-converter LSI for electrostatic capacitive touch sensor, especially focused on usability. It has 8/16 channels of capacitance-sensor input. This makes it ideal for various switch applications.

The calibration function and the judgment of ON/OFF are automatically performed internal to the LSI, reducing development time. A detection result (ON/OFF) for each input can be read out by the serial interface (I2C compatible bus or SPI). Moreover, LC717A00 outputs a detection result (ON/OFF) by changing the Pout output level.

Also, the measurement value of each input can be read out as 8-bit digital data. Gain and other parameters can also be adjusted via serial interface.

Features• Detection system: Differential capacitance detection (mutual

capacitance type)• Input capacitance resolution: Can detect capacitance changes in the

femto-Farad order• LC717A00 measurement interval (8 differential inputs)

• 18 ms typical at initial configuration• 3 ms typical at minimum interval configuration

• LC717A10 measurement interval (16 differential inputs)• 30 ms typical at initial configuration• 6 ms typical at minimum interval configuration

• External components for measurement: Not required• LC717A00 current consumption: 320 μA typical (VDD = 2.8 V);

740 µA typical (VDD = 5.5 V)• LC717A10 current consumption: 570 μA typical (VDD = 2.8 V);

1.3 mA typical (VDD = 5.5 V)• Supply voltage: 2.6 V to 5.5 V• Detection operations: Switch• Packages: VCT-28 for LC717A00/10AR; SSOP-30 for LC717A00/10AJ• Interface: I2C compatible bus or SPI selectable

Cin0

SCL/SCK

SDA/SI

VDD

VSS

INTOUT

Cin1

Cin2

Cin3

Cin4

Cin5

Cin6

Cin7

Pout0

Pout1

Pout6

Pout7

Pout5

Pout4

Pout3

Pout2

nCS

SA/SO

Cdrv

GAIN

nRST

ERROR

Cref

MUX

1stAMP

A/DCONVERTER

2ndAMP

POR

CONTROLLOGIC

OSCILLATOR

I2C/SPI

Cin0

VDD

VSS

INTOUT

Cin1

Cin2

Cin3

Cin4

Cin5

Cin6

Cin7

Cin8

Cin9

Cin10

Cin11

Cin12

Cin13

Cin14

Cin15

Cref

CrefAdd

Cdrv

nRST

nCS

SCL/SCK

SDA/SI

SA0/SO

SA1

MUX

MUX

1stAMP

A/DCONVERTER

2ndAMP

CONTROLLOGIC

I2C/SPI

POR OSCILLATOR

LC717A00 Block Diagram LC717A10 Block Diagram

SEN

SIN

G

1

VDD 3.0 V To 5.5 V

2

5

6

7

4

3OS/ALERT

GND

SDA

SCL

A2

A1

A0

CBYPASS

ADDRESS(SET AS DESIRED)

SERIAL INTERFACE

NOTE: SDA, SCL AND OS/ALERT PINSREQUIRE PULL-UP RESISTORS TO VDD

NCT75

Device Sensor Type

Data Transmission

StandardICC Max

(mA)VCC Max

(V)VCC Min

(V)T Min (°C)

T Max (°C)

Temperature Error (°C) Package

NCT175 Local SMBus 0.575 3 5.5 -55 125 ±1 Micro8™

NCT203 Local I2C 44 µA 1.6 2.75 -40 125 ±1.75 WDFN-8, WLCSP-8

NCT275 Local SMBus 0.575 3 5.5 -55 125 ±1 WLCSP-6

NCT75 Local SMBus 0.575 3 5.5 -55 125 ±1 DFN-8, Micro8, SOIC-8

NCT218 Remote I2C — 1.6 2.75 — — — WDFN-8, WLCSP-8

NCT210 Local & Remote SMBus 0.37 3 5.5 -65 125 ±3 QSOP-16

NCT214 Local & Remote SMBus 0.35 3 3.6 -40 125 ±1 WDFN-10

NCT72 Local & Remote I2C 0.35 2.8 3.6 -40 125 ±1 DFN-8, WDFN-8

ON Semiconductor

Typical Application Diagram

Temperature Sensors

SENSIN

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JFETs for Infrared ( IR ) Sensing

DeviceVGDO Min

(V)IDSS Min

(mA)IDSS Max

(mA)|yfs| Typ

(mS)Ciss Typ

(pF)Crss Typ

(pF) Package

TF412S 30 1.2 3 5 4 1.1 SOT-883

TF414 40 0.05 0.13 0.11 0.7 0.3 SOT-883

2SK3738 40 0.05 0.13 0.13 1.7 0.7 SOT-490

2SK3796 30 0.6 3 6.5 4 1.1 SOT-490

2SK545 40 0.055 0.095 0.13 1.7 0.7 CP (SOT-23)

2SK3666 30 0.6 3 6.5 4 1.1 CP (SOT-23)

Infrared Sensor for White Goods, Security, and Lighting

ThermalEnergy

JFET

R

1

2

D

S

G3

POW

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EMEN

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ON Semiconductor

Full Bridge Rectifier for Wireless Charging

Features – NMLU1210• Full Bridge Rectification block - up of 3.2 A of operation• Low RDS(ON) minimizes conduction losses• Low profile UDFN-8 package (4 x 4 x 0.55 mm)

Device

MOSFET SCHOTTKY

Package(s) VLL(V)

ID(A)

RDS(ON) Max @ VGS = 10 V (Ω)

VR(V)

VF(A)

IF(A)

NMLU1210 20 3.2 0.017 20 0.45 3.2 UDFN-8

D2

A2

C2

S2G2

D1

L1_1 A1

C1

S1 G1

GND1

GND1

ACInput

DCOutput

L1_2

GND2

GND2

Vout Vout

NMLU1210AC-DC

DC-DCStep Downand Control

AC-DC

Transmitter Receiver

Drivers+

Controller+

V/I Sensing

POW

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ANAG

EMEN

T


LC709203F High Accuracy Fuel Gauge LSIFuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register

Features• Accuracy of remaining capacity ±2.8% (0 ~ +50°C)• Active mode current of 15 µA• Hibernate mode current of 2 µA• Standby mode current (RAM retention) of 0.1 µA• No need for sense register for current detection

Conventional Display

Detailed Display ofRemaining Capacity

CorrectOperating Time

WithLC709203F

Standby Time120 h

Call Time75 min

77%

Ideal vs. Display (by Temperature) Ideal vs. Display (by Load)

Discharge Characteristics

100

100 90 80 70 60 50 40 30 20 10 0 100 90 80 70 60 50 40 30 20 10 0

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

Real (%)

Dis

p (%

)

Dis

p (%

)

Load: 50 mABattery: DB-L50 Typ 1900 mAh

Room TempBattery: DB-L50 Typ 1900 mAh

Real (%)

0°CRoom Temp50°CIdeal

500 mA750 mA1000 mA1250 mA1500 mAIdeal

POW

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ON Semiconductor

Power Supply/Management, Voltage Regulation

POWER SUPPLY/MANAGEMENTN L

High VoltageAC-DC

SwitchingRegulator

DC-DCConverters

LDO VoltageRegulators

Device Function Features Package

AC-DC

NCP1010~15NCP1070~77

Self-Supply High Voltage Monolithic Switching Regulator for Low Power Offline Power Supplies

• Dynamic self-supply, no need of an auxiliary winding• Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz)

PDIP-7, SOT-223

NCP1027~28NCP1124/26/29NCP1136*

High Voltage Monolithic Switching Regulator for Medium Power Offline Power Supplies

• 700 V, 5.8 Ω FET current-mode fixed frequency (65 kHz, 100 kHz)• 650 V, 9/6/2 Ω rugged FET current-mode fixed frequency (65 kHz, 100 kHz)• 800 V, 3.8 Ω rugged FET current-mode fixed frequency (65 kHz, 100 kHz)

PDIP-7

NCP1050~5High Voltage Gated Oscillator Monolithic Switching Regulator

• Oscillator frequency (options of 44 kHz, 100 kHz, 136 kHz) dithering with controlled slew rate driver for reduced EMI

• Startup circuit eliminates the need for transformer auxiliary bias winding

PDIP-7, SOT-223

DC-DC

NCP3170 3 A Switching Regulator• Output voltage adjustable to 0.8 V• 500 kHz or 1 MHz switching frequency

SOIC-8

NCP3063/41.5 A Switching Regulator or utilize as controller for up to 5 A

• Capable of 40 V input• Up to 250 kHz switching frequency

SOIC-8

LM2594/5/6 0.5 A/1.0 A/3 A Switching Regulators• Capable of 40 V input• Fixed 150 kHz switching frequency

TO-220, DPAK,

SOIC-8, PDIP-8

NCP3020/11 PWM Controller• 4.7-28 V input voltage range• EN/PG/SYNC features• Fixed 300/400/600 kHz switching frequency

SOIC-8, TSSOP-14

NCP1034 PWM Controller• Capable of up to 100 V input• Adjustable switching frequency (50-500 kHz)

SOIC-16

* Pending 2Q15.

POW

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Power Source Voltage Device

VDDS (V)

ID(A)

RDS(ON) (Ω) @ 10 VCiss (pF)

Qg (nC)

G-S Protection DiodeTyp Max Package

≤AC 120 V

FW276 450 0.7 8.6 11.2 55 3.5 Built in SOIC-8

SFT1423 500 2 3.8 4.9 175 8.7 Built in DPAK

2SK4196LS 500 5.5 1.2 1.56 360 14.6 — TO-220F

2SK4096LS 500 8 0.65 0.85 600 24 — TO-220F

BFL4036 500 14 0.4 0.52 1000 38.4 Built in TO-220F

BFL4037 500 16 0.33 0.43 1200 48.6 Built in TO-220F

2SK4085LS 500 16 0.33 0.43 1200 46.6 — TO-220F

2SK4124 500 20 0.33 0.43 1200 — — TO-3P

≤AC 240 V

SFT1440 600 1.5 6.2 8.1 130 6.3 Built in DPAK

SFT1458 600 1 10 13 73 4.7 Built in DPAK

2SK4197FS 600 3.5 2.5 3.25 260 11 — TO-220F

2SK4198FS 600 5 1.8 2.34 360 14.3 — TO-220F

2SK4099LS 600 8.5 0.72 0.94 750 29 — TO-220F

2SK4087LS 600 14 0.47 0.61 1200 46 — TO-220F

2SK4125 600 17 0.47 0.61 1200 — — TO-3P

2SK4088LS 650 11 0.65 0.85 1000 37.6 — TO-220F

BFL4004 800 6.5 1.9 2.5 710 36 — TO-220F

BFL4026 900 5 2.8 3.6 650 33 — TO-220F

BFL4001 900 6.5 2.1 2.7 850 44 — TO-220F

AC 380 V to 480 V

2SK3745LS 1500 2 10 13 380 37.5 Built in TO-220F

2SK4177 1500 2 10 13 380 — Built in TO-263 (D2PAK)

2SK3746 1500 2 10 13 380 — Built in TO-3P

2SK3747 1500 2 10 13 380 — Built in TO-3PF

2SK3748 1500 4 5 7 790 80 Built in TO-3PF

NDFPD1N150C 1500 0.1 100 150 80 4.2 — TO-220F

NDFP03N150C 1500 2.5 8 10.5 650 34 — TO-220F

NDTL03N150C 1500 2.5 8 10.5 650 34 — TO-3P

NDUL03N150C 1500 2.5 8 10.5 650 34 — TO-3PF

NDUL09N150C 1500 9 2.2 3 2400 130 — TO-3PF

AC 590 V to 690 V WPH4003 1700 3 8.2 10.5 850 48 — TO-3PF

Power MOSFETs for Circuit Breakers and Metering Power Supplies

Features• High reliability• Low power dissipation• Avalanche ruggedness• High-speed switching

Transformer/Primary Side

Clamper Circuit

FeedbackCircuit

Output 1

Output 2

RectifierBridge

Driver

AC InputVoltage

DC Output 1

DC Output 2

Low Saturation Voltage BJT forOver Current Sensing Circuit2SC6144SG: 50 V/10 A TO-220F-3FS2SC5707: 50 V/8 A TP, TP-FA

POW

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ON Semiconductor

LDO Regulators

DeviceIout(mA)

Dropout Typ @ 3.3 V

(mV)Iq

(μA)

PSRR @ 120 Hz

(dB)Vin Max

(V) Vout(V) Package(s)

NCP785A 10 - 12 80 450 3.3, 5.0, 12, 15 SOT-89-3

NCP508 50 180 145 70 13 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SC-70-5, WDFN-6

NCP715 50 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6

NCP716 80 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6

NCP120 150 30 80 72 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6

NCP571 150 450 40 - 12 0.8, 0.9, 1.0, 1.2 TSOP-5, DFN-6

NCP170 150 240 0.5 40 5.5 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SOT-563, uDFN-4

NCP700B 200 118 70 82 5.5 1.8, 2.8, 3.0, 3.3 WDFN-6, TSOP-5

NCP702 200 140 10 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5

NCP752 200 130 12 68 6 1.8, 2.8, 3.0, 3.3 SOT-23-5, XDFN-6

NCP160 250 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4

NCP703 300 180 12 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5

NCP130 300 60 80 75 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6

NCP161 450 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4

NCP3335A 500 250 190 75 18 Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0 Micro8, DFN-10

NCP3334 500 250 190 75 18 Adj. SOIC-8

NCP705 500 250 12 70 6 0.8, 1.8, 2.8, 3.0, 3.3 SOT-223-6, WDFN-6

NCP5500 500 230 300 75 18 Adj., 1.5, 5.0 DPAK-5, SOIC-8

NCP133 500 140 80 72 6 Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8 XDFN-6

NCP59748 1.5 60 - 70 6 Adj. DFN-10, QFN-20

NCP59744 3 100 - 70 6 Adj. QFN-20

MO

TOR

CO

NTRO

L


Motor Drive for Small Motor Control

Features• Integrated active flyback protection• Thermal and UVLO fault detection• Over-current fault detection on LV8711T

Motor Controllers

Device TypeVM Max

(V)VCC Max

(V)IO Max

(A)IO Peak Max (A)

Step Resolution

Control Type Current Sense

Regulator Output Package

LV8400V Brush DC 16 6 1.2 3.8 — Parallel None No SSOP-16

LV8711T Stepper/Brush DC 18 6 0.8 1 1/2 Parallel External Resistor Yes TSSOP-24

LV8712T Stepper 18 6 0.8 1 1/8 Clock External Resistor Yes TSSOP-24

LV8713T Stepper 18 6 0.8 1 1/32 Clock External Resistor Yes TSSOP-24

Motor Driver for Zoom

Motor Driver for Focus

Motor Driver forLens Shift

(Up/Down, Left/Right)

LensUnit

Lens

Motor Driver for Iris

CPU

MO

TOR

CO

NTR

OL

MOSFETs and MOSFET Drivers for Motor Control

ON Semiconductor

MOSFET Features• Low RDS(on) improves efficiency by reducing

conduction loss• Low Gate Charge reduces dynamic power loss• Extensive voltage lineup

Power MOSFETs

Device ChannelVDS (V)

ID (A)

RDS(on) (mΩ)

Qg (nC) Package

ATP208 N 40 90 6 83 ATPAKATP401 N 60 100 3.7 300 ATPAK2SK4066 N 60 100 4.7 220 D2PAK, I2PAKNDBA170N06A N 60 170 3.3 280 D2PAKNDBA180N10B N 100 180 2.8 95 D2PAKCPH3461 N 250 0.35 6500 2.1 CPH-3PCP1405 N 250 0.6 6500 2.1 PCP-1 (SOT-89)SFT1452 N 250 3 2400 4.2 DPAK, IPAKNDDP010N25AZ N 250 10 420 16 DPAK, IPAKFW297 N+N 60 4.5 58 14 SOIC-8FW276 N+N 450 0.7 12100 3.7 SOIC-8FW4604 P+N 30 -4.5/6 65/39 7.5/9.1 SOIC-8ECH8690 P+N 60 -3.5/4.7 94/55 15/18 ECH-8FW389 P+N 100 -2/2 300/225 21/10 SOIC-8ATP107 P -40 -50 17 47 ATPAKATP108 P -40 -70 10.4 79.5 ATPAKATP304 P -60 -100 6.5 250 ATPAKBBS3002 P -60 -100 5.8 280 D2PAK, I2PAKSMP3003 P -75 -100 8 280 D2PAK, I2PAKBMS3004 P -75 -68 8.5 300 TO-220F-3FG

MOSFET Drivers

Device DescriptionNumber of

DriversVin Max

(V)Drive Source/Sink Typ

(mA) Package

TND523SS Single Input High Voltage High Side MOSFET Driver 1 625 200/400 SOIC-8TND524VS Single Input High Voltage High Side MOSFET Driver 1 625 200/400 VEC-8TND525SS Dual Input High Voltage High and Low Side MOSFET Driver 2 625 200/400 SOIC-8TND314S Dual Low Side Driver(Dual Inverter) 2 25 1000/1000 SOIC-8TND315S Dual Low Side Driver(Dual Buffer) 2 25 1000/1000 SOIC-8TND316S Dual Low Side Driver(Inverter and Buffer) 2 25 1000/1000 SOIC-8TND321VD Dual Low Side Driver(Dual Inverter) 2 25 800/1000 VEC-8TND322VD Dual Low Side Driver(Dual Buffer) 2 25 800/1000 VEC-8TND323VD Dual Low Side Driver(Inverter and Buffer) 2 25 800/1000 VEC-8

M

High SideDriver

MOSFETDriver

MOSFETDriver

High SideDriver

Low SideDriver

Low SideDriver

PROC

ESSING


ASIC

• Microcontroller• DSP

• Coil Driver• Class-D Amp• DAC• Display Driver

• Magnetic Flux• Temperature• Light• Sound• Pressure• Acceleration• Angular Rate

Example:Example:

AnalogSignals

Sensor:• Stepper Motors• Transducers• MOSFETs & BJTs• Relays• Speakers• Lamps• LCD/LED Displays

Mechanical orElectrical System:

• EEPROM• OTP• SRAM• ROM

High Voltage (40 to 80 V)Low Voltage (<3.3 V)

• CAN, LIN• I2C-bus• USB• KNX• M-BUS

• RF

Low orHigh

Voltage

Low orHigh

Voltage

Filtering

Amplification

Sensor Interface

SignalProcessing Actuator

WirelessRadio

WiredCommunications

Power/Battery

Management

SupportingLogic

Analog/Digital

Conversion

Memory

Value Proposition• Experienced resources and assets to bring customers’ design objectives successfully to market

• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP

• Flexible cost models to reduce customers’ total cost

IP & Fab Processes• ≥55 nm, analog-focused CMOS/BCDMOS process technologies

utilizing internal fabs and external foundry partners

• Low, medium, high voltages — ≤1 V to 90 V

• Low current optimization — active & standby

• Low noise design — “count the electrons”

• High temperature — ≤200°C (profile, for selected technologies)

• Integrated low power wireless

• Non-Volatile Memory (EEPROM, OTP), RAM & ROM

• Embedded digital IP

• Robust ESD protection

• Extensive building block ‘starting points’ consisting of amplifiers, references, DACs, ADCs, linear & switching regulators, power management, etc.

Design Engineering• Approximately 200 expert mixed-signal

designers with extensive SoC and SiP experience

• Robust custom development process

• Dedicated project managers track & report development progress

• Flexible customer development engagement — from full turnkey to subcontractor production services

• Design expertise in:

» Sensor interface

» Wireless systems

» Medical imaging

» Energy management

» Building & home control

Mixed-Signal Custom Solutions

Category Mixed Signal Intellectual Property (IP)

Serial Interfaces USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART

Microprocessors ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals

Memory SRAM, DPRAM, ROM, EEPROM, OTP, FLASH

Clocking Oscillators, PLLs, DLLs

Communication Wireless (Proprietary & Standards), Wired (KNX, PLC and others)

Encryption ECC, AES, 3-DES, DES, RSA

Data Converters DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)

Wireless IP PGA, LNA, PLLs, Correlators, DSP

Power Management Efficient Switching Regulators, LDOs, Charge Pumps, Thermal Protection

References Precision Bandgaps, Current References, Temperature Sensors

Analog and High Voltage Interfaces

High-Voltage Drivers, Display and LCD Drivers, Class D Amplifiers

Signal Conditioning PGA, Instrumentation Amps, Digital and Analog Filters

PRO

CES

SIN

G

ON Semiconductor

General and LCD MCUs

MCUs for USB

MCU Features• Pins: 10 – 100• ROM: 4 – 512 KBytes• RAM: 256 – 24,576 Bytes• ADC: 3 – 16 channels

• Operation Voltage: 1.8 – 5.5 (V)• Stand-by IDD: 0.02 µA• RTC (Clock) IDD: 0.45 µA

(with low power model)

Device TypeROM

(kByte)RAM

(Byte) I/Os PWMs UARTs ADC LVD POR Features Package

LC87FBG08A 8-bit General 8 256 21 2 1 12/8-bit x 9ch 4 4 High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V SSOP-24, VCT-24

LC87FBK08A 8-bit General 8 256 21 2 — 12/8-bit x 8ch 4 4 High accuracy internal OSC (±3.0%); Support Mask Type SSOP-24

LC87FBL08A 8-bit General 8 256 26 2 — 12/8-bit x 11ch 4 4 High accuracy internal OSC (±3.0%) QFP-36

LC87FBH08A 8-bit General 8 256 26 2 1 12/8-bit x 11ch 4 4 High accuracy internal OSC (±3.0%) QFP-36

LC87F2R04A 8-bit General 4 128 21 — — 12/8-bit x 8ch 4 4 Small scale 8bit MCU; Remote Control Receiver Circuit SSOP-24

LC87BK08A* 8-bit General 8 256 21 2 — 12/8-bit x 8ch 4 4 Mask ROM edition of LC87FBK08A SSOP-24

LC87F2416A 8-bit General 16 512 26 2 1 12/8-bit x 10ch — — Premium market segment QFP-36

LC87F2J32A 8-bit General 32 1024 41 2 1 12/8-bit x 14ch 4 4 Premium market segment SQFP-48, QIP-48

LC87F2W48A 8-bit General 50 1536 40 2 1 12/8-bit x 14ch 4 — Premium market segment SQFP-48

LC87F2C64A 8-bit General 64 2048 73 4 2 12/8-bit x 16ch 4 4 RTC; low power consumption QFP-80

LC87FC096A 8-bit General 96 4096 55 6 2 12/8-bit x 11ch 4 4 12bit PWM x 6 QIP-64E

LC87F2608A 8-bit General 8 512 7 1 — 12/8-bit x 3ch 4 4 High speed 12-bit PWM; Analog Comparator MFP-10SK

LC87F0808A 8-bit General 8 256 30 6 1 10/8-bit x 10ch 4 4 MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2 QFP-36

LC87F0N04A 8-bit General 4.5 128 12 4 — 10/8-bit x 6ch 4 4 MCPWM; High speed ADC (10-bit); Analog Comparator x 2 SSOP-16

LC87F0G08A 8-bit General 8 256 18 3 — 12/8-bit x 7ch — — MCPWM, OP-AMP, Analog comparator SSOP-24

LC87F0A08A 8-bit General 8 256 30 2 — 12/8-bit x 8ch 4 4 OP-AMP, Analog comparator, Constant current output port QFP-36

LC87F5VP6A 8-bit General 256 10240 89 4 2 8-bit x 15ch — — Large scale memory QIP-100E

LC88F58B0A 16-bit General 128 6144 54 2 2 12/8-bit x 11ch — 4 Motor control signal generator SQFP-64

LC88F52H0A 16-bit General 512 24576 90 4 4 12/8-bit x 16ch — 4 DAC; PWM; RTC; SIO x 5; UART x 4 TQFP-100

LC87F7932B 8-bit LCD 32 2048 49 2 1 12/8-bit x 7ch — 4 32 x 4 segment driver; RTC; low power consumption SQFP-64

LC87F7J32A 8-bit LCD 32 1024 51 2 1 12/8-bit x 12ch 4 4 24 x 4 segment driver; support 5 V/3 V for LCD-panel TQFP-64

LC87F76C8A 8-bit LCD 128 4096 71 2 1 12/8-bit x 12ch — — 32 x 4 segment driver QFP-80

LC87F7DC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; many segment drivers QIP-100E

LC87F7NC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E

LC87F7NJ2A 8-bit LCD 192 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E

LC87F7NP6A 8-bit LCD 256 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E

Device TypeROM

(kByte)RAM

(Byte) I/Os PWMs UARTs ADC LVD POR Features Package

LC87F1A32A 8-bit USB 32 2048 39 2 1 12/8-bit x 12ch — — IR reciever SQFP-48

LC87F1M16A 8-bit USB 16 1024 38 2 1 12/8-bit x 20ch 4 4 UART & SCUART; high current driver SQFP-48

LC87F1K64A 8-bit USB 64 8192 39 2 1 12-bit x 12ch 4 4 USB I/F x 2; USB Host; Audio I/F SQFP-48

LC87F17C8A 8-bit USB 128 8192 39 2 1 12/8-bit x 12ch 4 4 USB 2.0 full speed host/device controller x2; audio IF SQFP-48

LC87F1HC8A 8-bit USB 128 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48

LC87F1JJ2A 8-bit USB 192 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48



* Mask ROM Device; Contact ON Semiconductor for additional information.

MCU Features• USB 2.0 full-speed / low speed functions• USB device function / USB host function

• Integrated voltage regulator• USB D+ line pull-up function

μA

PROC

ESSING


Development Tools for Microcontrollers

SoftwareDevelopment

Debugging/Verification

Writing

•

•

Inst87 (Information on micro-controller models)SU (Options setup program)

Single programmer AF9709C / AF9711

Gang programmer AF9723/23B (main body) AF9833 (unit)

Onboard Programmer AF9101/03 (main body) SIB87-TYPEC-GMDT (ON Semiconductor)

Supports Both 8- and 16-Bits

For 8-Bit

For 16-Bit

C Compiler/Assembler

C Compiler/Assembler

Software DevelopmentEnvironment CD

•

•

Inst87 (Information on micro-controller models)SU (Options setup program)

Software DevelopmentEnvironment CD

On-chip DebuggerFlash Writing System

Display Panel EmulationTool

TCB87-TYPEC-MDT(On-chip debugger software included)

On-chip DebuggerEOCUIF2-MDT(On-chip debugger software included)

Panel Design

On Board WriterSKK-DBG-TYPECMDT

•

Flash ROM WriterSKK-TYPEC-MDT

•

On Board WriterFWSX16DITYPE2MDT

•

Flash ROM Writer fromSupport Group

•

PRO

TEC

TIO

N

ON Semiconductor

USB 2.0 for ConsumerOne High Speed Pair, VCC, Low Capacitance ESD Protection

Key Requirement• Cap < 1.5 pF

Features• 0.5 - 0.8 pF• 4 low speed + 1 VBUS integrated – can protect

up to 2 USB ports• Industry leading low clamping voltage

Device LinesCapacitance

(pF) PackageSize(mm)

NUP4114UPX 4 0.8 SOT-563 1.6 x 1.6

NUP4114UCL 4 0.5 SC-88 2.0 x 2.1

NUP4114H 4 0.8 TSOP-6 3.0 x 2.75

ESD7L5.0 2 0.5 SOT-723 1.2 x 1.2

ESD9L5.0 1 0.5 SOD-923 1.0 x 0.6

VBUS

D-

D+

GND

NUP4114

I/O 1 I/O 2

=

I/O 3 I/O 4

One High Speed Pair, VCC, Common Mode Filter + ESD Protection

Key Requirement• Cap < 1.5 pF• Common Mode Filtering

Features• 0.5 - 0.8 pF• Integrated EMI suppression with ESD protection• Industry leading low clamping voltage

Device PairsCapacitance@ 2.5 V (pF)

CM Attenuation@ 800 MHz (–dB)

DM Bandwidth F3dB (GHz) Package

Size(mm)

EMI2121 1 0.9 –25 2.5 WQFN 2.2 x 2.0 x 0.75

USB 2.0 @ 480 Mb/s

D+

D-

VBUS

Top layerOther layer

ID

GND

Micro USBConnector

EMI2121

-35

-30

-25

-20

-15

-10

-5

0

1.E+06 1.E+07 1.E+08 1.E+09

dB

Frequency

CommonMode

DifferentialMode

Suppresses Common Mode NoiseDeeper than Competing Passive Solution

PROTEC

TION


Ethernet : 10/100BASE-T, 1000BASE-TX, and GigabitTwo & Four Pairs, Low Capacitance Surge and ESD Protection

Signal Integrity for Gigabit Ehternet

Line Side : LC03-6 (optional)Transformer Side: ESD1014

Protection against metallic (transverse) strikes

Typical ApplicationFeatures• Wide range of voltages and capacitance values for tertiary

protection• Vclamp (25 A surge) < 11 V• IEC 61000-4-2 rating > 30 kV• No latching danger• Surge rating maintained to 125°C

Benefits• Compatible with Gigabit Ethernet and beyond• Enhanced protection for downstream electronics• Accommodates operating transients above 3.3 V• Small form-factor allows integration into connectors

The 10/100BASE-T, 1000BASE-TX, and Gigabit Ethernet (GigE) interfaces operating at higher rates are susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.

C5VDDC1

C1

ESD1014 LC03

C1

C1

ESD1014

C5VDD

LC03

C5VDD

LC03

C5VDD

LC03

TPOPA

TPONA

TPOPB

TPONB

TPOPC

TPONC

TPOPD

TPOND

A+

A-

B+

B-

C+

C-

D+

D-

1000

BA

SE

-TE

TH

ER

NE

T T

RA

NS

CE

IVE

R

TR

AN

SF

OR

ME

R

RJ4

5

1 8

1 8

1 8

1 8

Through Board

With ESD1014

VDD

RJ4

5

A+

A–

B+

B–

C+

C–

D+

D–

MX4+

MX4–

TR4+

TR4–

TCT4MCT4

MDI_A+

MDI_A–

10/100BASE-T

LINEDRIVER

TRANSFORMER

VDD

GNDCHASSIS

SRDA3.3

1 8

Transformer Side – SRDA3.3Line-to-Line protection against metallic strikes

Typical Application

Transient Voltage Suppressors

Device Data LinesVDC Max

(V)

Surge IPP 8/20 μs

(A)

Typical Line-Line

Capacitance(pF)

ESD Contact Rating(±kV) Package

NUP4114H 2 pair ESD Only10/100/1000BASE-TX, GigE 5.0 12* 0.4 13 TSOP-6

SRDA3.3 1 pair10/100BASE-T 3.3 25 4 8 SOIC-8

ESD1014 2 pair1000BASE-TX, GigE 3.3 25 1.5 30 UDFN-10

LC03-6 1 pair Line Side10/100/BASE-T, GigE 5.0 100 8 30 SOIC-8

CO

MPO

NEN

TS

ON Semiconductor

Serial EEPROMs

Features• Broad density range: 1 kb to 2 Mb

• Wide operating Vcc range: 1.8/1.7 V to 5.5 V

• High endurance: 1 million program/erase cycles

• Wide temperature range: industrial and extended

EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs

(I2C, SPI, Microwire)

EEPROMsData

Transmission Standard Device Density Organization*

VCC Min(V)

VCC Max(V)

fCLK Max(MHz) Package(s)

I2C

CAT24M01 1 Mb 128k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8

CAT24C512 512 kb 64k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8



CAT24C64 64 kb 8k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4

CAT24C32 32 kb 4k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-5

CAT24C16 16 kb 2k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C08 8 kb 1k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C04 4 kb 512 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C02 2 kb 256 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

SPI

CAT25M02 2 Mb 256k x 8 1.7 5.5 10 SOIC-8

CAT25M01 1 Mb 128k x 8 1.8 5.5 10 SOIC-8, TSSOP-8

CAT25512 512 kb 64k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8







CAT25040 4 kb 512 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8



Microwire

CAT93C86 16 kb 2k x 8 / 1k x 16 1.8 5.5 3 SOIC-8

CAT93C86B 16 kb 2k x 8 / 1k x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

CAT93C76 8 kb 1k x 8 / 512 x 16 1.8 5.5 3 SOIC-8, TSSOP-8

CAT93C76B 8 kb 1k x 8 / 512 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

CAT93C66 4 kb 512 x 8 / 256 x 16 1.8 5.5 2 SOIC-8, TSSOP-8



CAT93C46B 1 kb 128 x 8 / 64 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

* Organization for Microwire devices is selectable.

CO

MPO

NEN

TS


Integrated Passive Devices ( IPD)• Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and

matching networks• Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics)• Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs• Based on 110 nm silicon process with high performance and tight process control

• Wafers manufactured on high precision equipment, designed for 110 nm transistor fabrication

• Very tight performance tolerances and low variation across wafers• ±4.3% tolerance 1K MIM caps• ±3.9% tolerance 2K MIM caps• < 1% variance between caps on common IPD

Integration of multiple R, L, and Cinto single IPD

Available Components

• MIM capacitors, 0.62 nF/mm2 , typical tolerance ±5%

• TiN resistors, 9 Ω/sq

• Copper inductors, minimum spacing 3 µm, minimum line width 5 µm, current handling >50 mA/µm, achieves Q-factors up to 45

Picked & Diced Wafer Edge

Inductor Within IPD (SEM Photo)

Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 μm

CO

MPO

NEN

TS

ON Semiconductor

Logic TranslatorsDual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages.

Features• Industry’s first devices with independent power

supplies (VL < VCC, VL = VCC, or VL > VCC)• High 100 pF capacitive drive capability • Overvoltage tolerant enable and I/O pins • Non-preferential power-up sequencing • Power-off protection

Unidirectional Translator

Autosense BidirectionalTranslator

(Push-Pull Output)

Autosense BidirectionalTranslator

(Open-Drain Output)

BidirectionalTranslator

(with Direction Pin)

Block Diagram

VCCA VCCB

B

OE

A

POne−Shot

NOne−Shot

POne−Shot

NOne−Shot

VL

I/O VL I/O VCC

VCC

R1

R2

1k

1k

PU1

RPullup10 k

VL

I/O VL I/O VCC

VCC

One−ShotBlock

One−ShotBlock

PU2

GateBias

N

RPullup10 k

EN ENB

A

DIR

VCCA VCCB

Attributes• High Data Rate• Low Power Consumption

• High Data Rate• Low Power Consumption

• High Data Rate• Low Power Consumption• Flexible PCB Design

• High Data Rate• Low Power Consumption• Flexible PCB Design

Trade-Offs • Fixed Input & Output Pins • Modest Output Current • Modest Bandwidth • Directional Control Pin Required

Applications

• SPI• GPIO

• SPI• GPIO

• I2C, SMBus, PMBus• GPIO• SDIO Cards• 1-Wire Bus

• GPIO

Sample Device (I/O Channels, Package)

• NLSV1T34 (1-Bit, ULLGA-6)• NLSV1T240/244 (1-Bit, UDFN-6)• NLSV2T240/244 (2-Bit, UDFN-8)• NLSV4T240/244 (4-Bit, UDFN-12)• NLSV4T3234 (4-Bit, CSP-11)• NLSV8T240/244 (8-Bit, UDFN-20)

• NLSX3012 (2-Bit, UDFN-8)• NLSX3014 (4-Bit, UQFN-12)• NLSX3013 (8-Bit, CSP-20)• NLSX3018 (8-Bit, UDFN-20)• NLSX4014 (4-Bit, UQFN-12)• NLSX5011 (1-Bit, UULGA-6, UDFN-6)• NLSX5012 (2-Bit, UDFN-8)• NLSX5014 (4-Bit, UDFN-12)

• NLSX3373 (2-Bit, UDFN-8)• NLSX3378 (4-Bit, CSP-12)• NLSX4373 (2-Bit, UDFN-8)• NLSX4378 (4-Bit, CSP-12)

• NLSV1T45 (1-Bit, ULLGA-6)• NLSV2T245 (2-Bit, UQFN-10)• NLSV2T3236 (2-Bit, UQFN-10)• NLA16T245 (16-Bit, TSSOP-48)

Translator

EEPROM

Translator

Translator

On-boardtranslations• SPI• I2C• SMBus

PCB-to-PCBTranslation

PCB #1 PCB #2

μC #1 μC #2

BRD8075/DBRD8075-6 PRINTED IN USA 2/15 IRONWOOD XXXX 2K

ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected]

N. American Technical Support: 800-282-9855 Toll Free USA/Canada.Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910Japan Customer Focus Center Phone: 81-3-5817-1050

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local Sales Representative

PUBLICATION ORDERING INFORMATION

Sales and Design Assistance from ON Semiconductor

AMERICAS REP FIRMSAlabama Huntsville e-Components (256) 533-2444Brazil Countrywide Ammon & Rizos (+55) 11-4688-1960California Bay Area Electec (408) 496-0706

Southern California Tech Coast Sales (949) 305-6869Canada Eastern Canada Astec (905) 607-1444Connecticut Statewide Paragon Electronic Systems (603) 645-7630Florida Statewide e-Components (888) 468-2444Georgia Atlanta e-Components (888) 468-2444Illinois Statewide Matrix – Design Technology (952) 400-1070Indiana Fishers Bear VAI (317) 570-0707Iowa Statewide Matrix – Design Technology (319) 362-6824Maine Statewide Paragon Electronic Systems (603) 645-7630Maryland Columbia Third Wave Solutions (410) 290-5990Massachusetts Statewide Paragon Electronic Systems (603) 645-7630Mexico Countrywide Ammon & Rizos (+55) 11-4688-1960Michigan St. Joseph Bear VAI (440) 526-1991Minnesota Eden Prairie Matrix – Design Technology (952) 400-1070Missouri Belton Matrix – Design Technology (816) 589-2308Nebraska Statewide Matrix – Design Technology (816) 589-2308New Hampshire Statewide Paragon Electronic Systems (603) 645-7630New Jersey Statewide S.J. Metro (516) 942-3232New York Binghamton TriTech - Full Line Rep (607) 722-3580

Jericho S.J. Metro (516) 942-3232Rochester TriTech - Full Line Rep (585) 385-6500

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ON Semiconductor Distribution PartnersAllied Electronics www.alliedelec.com (800) 433-5700

Altima Corp. www.altima.co.jp (81) 45 476 2155

Arrow Electronics www.arrow.com (800) 777-2776

Avnet www.em.avnet.com (800) 332-8638

Chip One Stop, Inc. www.chip1stop.com/maker/on (81) 45 470 8771

Daiwa Distribution Ltd. www.daiwahk.com (852) 2341 3351

Digi-Key www.digikey.com (800) 344-4539

EBV Elektronik www.ebv.com/en/locations.html (49) 8121 774-0

Future & FAI Electronics www.futureelectronics.com/contact 1-800-FUTURE1 (388-8731)

Mouser Electronics www.mouser.com (800) 346-6873

Newark/Farnell www.farnell.com/onsemi (800) 4-NEWARK

OS Electronics Co., Ltd. www.oselec.jp Japanese: (81) 3 3255 5985Other Languages: (81) 3 3255 6066

Promate Electronic Co. www.promate.com.tw (886) 2 2659 0303

RinnoVent Co., Ltd. (Ryosan Group)

www.ryosan.co.jp (81) 3 3862 2440

RS Components KK jp.rs-online.com (81) 45 335 8550

Segyung Britestone Co. www.britestone.com (82) 2 3218 1511

Serial AMSC www.serialsystem.jp (81) 3 5795 1635

Serial Microelectronics, HK www.serialsys.com.hk (852) 2790 8220

World Peace Industries Co. www.wpi-group.com (852) 2365 4860

WT Microelectronics Co. www.wtmec.com (852) 2950 0820

Yosun Electronics www.yosun.com.tw (886) 2 2659 8168

ON SEMICONDUCTOR INTERNATIONAL SALES OFFICESGREATER CHINA Beijing 86-10-8577-8200

Hong Kong 852-2689-0088Shenzhen 86-755-8209-1128Shanghai 86-21-5131-7168Taipei, Taiwan 886-2-2377-9911

FRANCE Paris 33 (0)1 39-26-41-00GERMANY Munich 49 (0) 89-93-0808-0INDIA Bangalore 91-98-808-86706ISRAEL Raanana 972 (0) 9-9609-111ITALY Milan 39 02 9239311JAPAN Tokyo 81-3-5817-1050KOREA Seoul 82-31-786-3700MALAYSIA Penang 60-4-6463877SINGAPORE Singapore 65-6484-8603SLOVAKIA Piestany 421 33 790 2450UNITED KINGDOM Windsor 44 1753 62 6718

www.onsemi.com/supportON Semiconductor Technical Support For a comprehensive listing of

ON Semiconductor Sales Offices, Distributors, and Rep Firms, please visit:

Americas & EMEA: www.onsemi.com/sales

China: www.onsemi.cn/sales

Japan: www.onsemi.jp/salesFeb-15

ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. HART is a registered trademark of the HART Communication Foundation. KNX and the KNX logos are registered trademarks of KNX and its suppliers or licensors. Micro8 is a trademark of International Rectifier. OMS is a registered trademark of OMS Group, Germany. ZigBee is a registered trademark of ZigBee Alliance. All other brand names and product names appearing in this document are trademarks of their respective holders.

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