small feature reproducibilitycden.ucsd.edu/internal/publications/workshop...11/14/2001 sfr workshop...

Small Feature Reproducibility

11/14/2001 SFR Workshop - Overview

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Small Feature Reproducibility Measuring, Understanding and Controlling Variability in Deep Sub-micron Patterning

UC-SMART Major Program Award

E. Aydil, J. Bokor, N. Cheung, D. Dornfeld, F. Doyle, B. Dunn, D. Graves, E. Haller, M. Lieberman, A. Neureuther, K. Poolla, R. Smith, C. Spanos, J. Talbot

University of CaliforniaBerkeley, Davis, Los Angeles, Santa Barbara, San Diego

Fourth Annual Workshop11/14/2001


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Program Goals

• We have pursued solutions by focusing on:– fundamental understanding– modeling variability mechanisms– sensing variability causes during production

• We will are now focusing on controlling and improving variability.

• Our context is lithography, plasma, CMP, diffusion, and the way these steps interact with each other.


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Small Feature Reproducibility• Capture

– In-situ and off-line metrology – Hierarchical Analysis of Variance

• Understand– Resist, Plasma, Diffusion Modeling– Variability Impact on Device / Interconnect Performance

• Enable– Fundamental modeling of variability– Optimal recipe generation– On-wafer / real-time / in-situ sensors– Run-to-run and real-time control– Process diagnosis– Chamber, process and product design

2000-2003themes


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Industrial / Academic Team• Advanced Energy• ASML• Atmel Corp.• Advanced Micro Devices• Applied Materials• Asyst Technologies Inc.• Cymer• Etec Systems Inc.• Intel Corporation

• KLA-TENCOR• Mykrolis Corp.• Nikon Research Corp.• Novellus Systems Inc.• Silicon Valley Group• Schlumberger• Tokyo Electron

University of CA, Berkeley, Davis, Los Angeles, Santa Barbara, San Diego


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Our Research Structure•• EducationEducation

– Spread the word through workshops, GSRs, USRs, long / short courses, and freshman seminars.

•• Novel TechnologiesNovel Technologies– Study bold new process steps and methods in order to leapfrog current

technology limitations.•• Modeling and SimulationModeling and Simulation

– Develop goal-oriented numerical and statistical abstractions for processes and their respective hardware.

•• Sensors and MetrologySensors and Metrology– Justify and spearhead smart sensors that transcend process steps and

technology generations.•• Recipe Generation, Process Optimization and ControlRecipe Generation, Process Optimization and Control

– Enable better process agility, reliability and reproducibility.


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SFR First year Milestones, due September 30, 2001Novel Technologies

• Initial experiments and simulations for resist processes, polarization masks, and multi-parameter test structures. (Neureuther) done

• Metalorganic precursor doser. Preliminary deposition studies. Self-limiting film formation for low toxicity precursors. (Graves) changed to: Focus on TiN barrier layers deposited by novel ALD technology: REALCVD. Conduct preliminary film deposition studies. Test self-limiting film formation for various precursors. done

• Etch resist in LAPS to examine uniformity. Characterize instability using OES/actinometry and planar probe. (Lieberman) done

• Establish plasma recipes and adhesion data for plasma-treated Si, oxide, and metal surfaces. (Cheung) done


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SFR First year Milestones, due September 30, 2001Modeling and Simulation

• Determine importance of physical effects on resist chemistry/optics interaction using simulation and experiment. (Neureuther) done

• Molecular dynamics code for deposition energy. Preliminary sputtering studies, compare to phenomenological theory. (Graves) changed to:Focus on plasma reactor modeling of etch products transport (SiClx). Role of gas inlet and outlet, flow rates on redeposition. Develop experimental testbed to examine plasma-wall interactions. done

• Simulations for AMD device designs at 100nm, 70 nm, and 50 nm gate length, including effect of isolation roughness. (Bokor) delayed

• Analyze boron diffusion in silicon isotope hetero-structures. Predictive model for various experimental conditions. (Haller) done. Also completed studies of the effect of the Fermi level position on self- and dopant diffusion for the acceptor boron in silicon. Developing a quantitative model based on the kick-out mechanism. Studies with arsenic and phosphorus are in progress.

• Integrated CMP model for basic mechanical and chemical elements. Periodic grating metrology (Dornfeld, Talbot, Spanos) done


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SFR First year Milestones, due September 30, 2001Sensors and Metrology

• Build and demonstrate Langmuir probe based on-wafer ion flux probe array using external electronics. (Aydil) done

• Design and build a single MEMS based retarding field ion energy analyzer with external electronics. (Poolla) (similar project at Sandia) changed to: Thermal Flux Sensor for Etch Processes. Design and fabricate sensor. Test sensor in XenonDiFloride ecth. Evaluate sensitivities. done

• Design and fabricate first generation prototype MEMS sensor array. Bench test using Joule heating. (Smith) delayed

• Demonstrate cut-and-paste approach for membrane arrays, LED arrays, and battery encapsulation. (Cheung) done

• Develop thermally robust inorganic electrolyte. Lid added to battery encapsulation scheme. (Dunn) done

• Build Microplasma generating system. Test with bulk optical components. (Poolla, Graves) (Prof. Solgaard left) changed to: Electrical Impedance Tomography based Sensor to measure Spatially-resolved Natural Plasma Potential. Design sensor. Evaluate sensitivities. Study and devise efficient algorithms for inversion. Test numerical effectiveness in simulation studies. done


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SFR First year Milestones, due September 30, 2001Recipe Generation, Process Optimization and Control

• Install automated OES on LAM 9400 reactor and build large statistical database of process fingerprinting data. (Spanos) done

• Install the Z-scan sensor and explore the spectral RF signature of plasma instabilities. (Spanos, Lieberman) delayed

• Publish ellipsometric detection specifications for full-profile, 100nm metrology. (Spanos) done

• Demonstrate simulator tuning for full profile matching over a range of focus and exposure conditions. (Spanos) ongoing

• Develop performance metrics for CMP and lithography. Assess input sensitivity and controllability. (Poolla) delayed


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SFR First year Milestones, due September 30, 2001Education

• Second offering of the cross listed 133 course: increase student numbers from 16 to 24. Additional experiment: spin coating low k dielectric. Add plasma diagnostics to etch experiment. (Graves) refined/modified to:

Additional experiment: spin coating low k dielectric. (Switched with year 2 milestone). Add plasma diagnostics to etch experiment. doneOffer 133 as summer UC Extension course. cancelledDevelop web-based equipment simulation. begun

• Organize two workshops (Fall and Spring) for all the project participants. (Spanos) done

• Also completed second phase of major upgrade of the EE143 laboratory: both cleanroom and testing were were rebuild and enlarged over the summer of 2001.


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EE 143 Clean room reconstruction – Summer 2001


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SFR Second year Milestones, due September 30, 2002Novel TechnologiesConduct and quantitatively interpret resist processes, polarization masks, and multi-parameter test structures. (Neureuther)Study effects of surface preparation, type and temperature on film properties. Measure key radical-surface kinetics. (Graves)Characterize plasma instability using V-I-phase probe. Model for reduced electron temperature and density. (Lieberman)Demonstrate polymer surface modification with plasma implantation (Cheung)

Modeling and SimulationGuidelines for 3D defect sizing and feature interactions. Extend line-end shortening to underlying topography. (Neureuther)Code to study ion-induced surface diffusion. Compare results to phenomenological theory and experiment. (Graves)Wafers processed at AMD finished with varying, and well-characterized LER. (Bokor)Model diffusion of dopants in isotopic multilayer structures. Study interference between diffusion and native defects. (Haller)Integrate initial chemical models into basic CMP model. Validate predicted pattern development. (Dornfeld, Talbot)

Sensors and MetrologyBuild and demonstrate 8” on-wafer ion flux probe array in industrial plasma etcher with external electronics. (Aydil)Demonstrate MEMS based thermal flux probe in plasma with external electronics. (Poolla) changedIntegrate the inorganic electrolyte into the battery structure. Develop an in-situ lithium formation process. (Dunn)Implement Prototype Plasma Tomography Sensor, test for etch rate metrology. (Poolla) changed

Recipe Generation, Process Optimization and ControlAutomated fault detection using RF fingerprinting. Automated generation of syntactic rules for RF fingerprinting. (Spanos)Feasibility of building 100nm capable profile extraction using small footprint, in-line spectroscopic ellipsometry. (Spanos)Demonstrate simulator tuning (using Prolith) for full statistical profile matching over a range of conditions. (Spanos)Design optimal recipes for unit processes, evaluate robustness using simulators and experiments. (Poolla)

EducationOffer 133 as summer UC Extension course. Develop of web-based equipment simulation. (Graves)Development and first offering of 1- and 2-hour freshman seminar modules on semiconductor manufacturing. (Lieberman, all)Organize two workshops (Fall and Spring) for all the project participants. (Spanos, all)


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SFR Third year Milestones, due September 30, 2003Novel TechnologiesDesign and test apparatus, interpret data for resist, polarization masks, and multi-parameter test structures. (Neureuther)Study effects of surface preparation, surface type and surface temperature on REALCVD film properties. Measure key radical-surface kinetics (Graves) changedDevelop and test instabilities control. Reduce electron temperature and density in discharges. (Lieberman, Spanos)Demonstrate concomitant plasma treated/deposition surfaces as effective diffusion barrier. (Cheung)

Modeling and SimulationDefect modeling to relate inspection to printing. Link resist, tool and substrate effects to line-end shortening. (Neureuther)Model etch product creation, transport and redeposition for various Si etch chemistries. Compare experimental results to simulations (Graves) changedDevice characterization on AMD wafers completed and data analyzed. (Bokor)Comprehensive model on dopant- and self-diffusion in Si. Properties of dopants and native point defects in silicon. (Haller)Comprehensive chemical and mechanical model. Experimental and metrological validation. (Dornfeld, Talbot, Spanos)

Sensors and MetrologyIntegration of Si-based IC with sensor arrays. Characterize and test integrated thermal flux array. (Aydil, Poolla) changedBattery operation between room temperature and 150°C. Battery survivability to sensor soldering operation. (Dunn)Implement Prototype Plasma Impedance Tomography Sensor, test for plasma potential. (Poolla) changed

Recipe Generation, Process Optimization and ControlStudy systems of real-time instability detection and plasma stabilization control. Spanos)Perform field studies of automated OES classification for fault diagnosis. (Spanos)Implement lithography controller that merges full profile in-line information with available metrology. (Spanos, Poolla)Model-based RTR control schemes, assess theoretical, simulated and experimental performance on SFR variance. (Poolla)

EducationAdd new spin-coating low k dielectric experiment. Develop web-based equipment simulation. Second offering UC Extension summer short course. (Graves) changedFreshman seminars related to semiconductor manufacturing at all SFR-participating campuses (Lieberman, all)Organize two workshops (Fall and Spring) for all the project participants. (Spanos)


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New Tools

• UC Berkeley Microlab 6” process is functional.• ASML DUV stepper + SVG track has been released• Hitachi CD SEM.• Novellus M2I 5-chamber sputtering tool.• Complete planarization (CMP/back etch). • AMAT P5000 planarization tool installed.• State of the art electrical CD metrology. • State of the art RF and OES sensing capabilities.• State of the art thin-film and scatterometry tools.


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EE 143 – IC Processing Enrollment Statistics

We have further enhanced the training laboratory.We will disseminate course modules to other schools.

EECS45%

ChemE12%

Physics2%

BioE11%

ME11%

Chemistry5%MSE

7%Double Major

7%

Spring 2001

EECS40%

ME35%

BioEng9%ChemE

5%

Others5% NE

2% MSE2%

Physics2%

Fall 2001


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Enrollment in Semiconductor Manufacturing Courses at Berkeley~ 100 more students a year get exposed to IC Technologies!

0

50

100

150

200

250

300

350

400

93-94 94-95 95-96 96-97 97-98 98-99 99-00 00-01

Ac ade mic Ye ar

Stu

dent

s En

rolle

d

Cours e 133

MSE 125

MSE 123

MSE 111

ME 122

ME 101

EECS 143

Che m E 179 EE 143

SMART Lab


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2000-2003 Education Goals•• Freshman seminar program at all campusesFreshman seminar program at all campuses

– One seminar per faculty member per year - 13 seminars/yr– 15 freshmen per seminar– Related to semiconductor manufacturing and the Department discipline

•• UC Extension summer offering of Equipment LabUC Extension summer offering of Equipment Lab– First offering attempted in Summer 2001

•• Undergraduate internships at participating companiesUndergraduate internships at participating companies– At least five positions

•• Seminar series with industrial speakers?Seminar series with industrial speakers?– Biweekly, with emphasis on business and technology


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Internships at Participating Companies

• At least five summer undergraduate positions each year• Student applications late in Fall Semester

– Advertise among 300+ students taking semiconductor manufacturing courses

• Identify positions by end of January• Select and fill positions by end of March• Company Mentors and UC PIs coordinate exchange• Coordinate with EECS BS/MS Internship Program


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Seminar Series With Industrial Speakers

• Create bi-weekly seminar series with invited speakers from the participating companies

• Emphasis on business and technology highlights

We are now asking/selecting presentation proposals!We are now asking/selecting presentation proposals!


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Today’s Objectives

1. An interim presentation of progress and directions.

2. Bring PIs, students, industrial participants together.Emphasis of presentations shifted to poster session.

3. Collect Feedback from Steering CommitteeClosed meeting and feedback session this afternoon.


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Web site, etc.TK Chen550 Cory Hall,phone: (510) 643-7542fax: (510) [email protected]

People to Meet and Places to GoAccount ManagementLinda Manly558 Cory Hall, ERLphone: (510) 642-8814fax: (510) [email protected]

http://sfr.berkeley.eduAccess restricted by password

Administrative SupportCharlotte Jones558 Cory Hall, ERLphone: (510) 642-1818fax: (510) [email protected]

University of California, Berkeley CA, 94720-1770

8:30 – 9:00 Research and Educational Objectives / Spanos

9:00 9:00 –– 9:45 9:45 CMP / CMP / Doyle,Doyle, Dornfeld, Talbot,Dornfeld, Talbot, SpanosSpanos

9:45 – 10:30 Plasma & Diffusion / Graves, Lieberman, Cheung, Haller

10:30 – 10:45 break10:45 – 12:00 Poster Session / Education, CMP, Plasma, Diffusion

12:00 – 1:00 lunch, CITRIS Presentation / King

1:00 – 1:45 Lithography / Spanos, Neureuther, Bokor

1:45 – 2:30 Sensors & Controls /Aydil, Poolla, Smith, Dunn, Cheung, Spanos

2:30 – 2:45 Break2:45 – 4:30 Poster Session / all subjects

3:30 – 4:30 Steering Committee Meeting in room 606 Soda4:30 – 5:30 Feedback Session

4th Annual SFR Workshop, Nov. 14, 2001

small feature reproducibilitycden.ucsd.edu/internal/publications/workshop...11/14/2001 sfr workshop...

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