Slide 1US silicon group meeting 5/6/2003

Hybrid Testing Status• 10 new hybrids brought by Lenny all tested

9 tested with no flaws 1 had 1 chip + 1 wirebond smashed

– Looks like smashed by a finger

– Probably occurred during taping down for shipping

• 10 new hybrids just arrived from FNAL Visually inspected

– One foot lift between hybrid-APV (long bond)

Test to keep up with production

Slide 2US silicon group meeting 5/6/2003

Ladder Testing Status• 8 modules bonded so far

1st module had 3 opens between PA-sensor (unbondable) and 2 opens added between sensor-sensor for testing

– Removed all bonds from problems found in sensor probing

– Two channels found to have high noise which increase with voltage (3.55.0 ADC)

Damage found on sensor 2nd-4th module had bias return bonds

missing– Damage to bulk unrepairable

Draw ~80 A, ~600 A, ~800 A

– 2 opens between APV-PA found in one module, otherwise no other bonding problems

– Will turn into x-calibration pieces with shorts and pinholes added on purpose

5th and 6th modules perfect– Three channels have high

noise which increases with voltage (1.51.9 ADC) and (1.79.0 ADC)

Damage found on sensor

7th module had wirebond damage on ~40 channels between APV and PA

– Not clear how or when 8th module had no bonding

problems– Channels found bad in sensor

probing pulled

– 2 channels has increasing noise vs. voltage (1.53.0 ADC)

Neighbors of pinhole found in probing

Slide 3US silicon group meeting 5/6/2003

High noise channels

Slide 4US silicon group meeting 5/6/2003

Ladder Testing SummaryLadder Bias Current Sensor Bad

ChannelsBonding Bad Channels

Testing

Bad Channels

Total % Bad Channels

Grade Comments

876 1090 nA 1.5+2 3 1 1.4% B2 channels with high noise not in sensor probing

0018-P1 613 A 1.5Bulk

damage 5.5 1.4% FMissing bias bonds,

turn into x-calibration piece

0019-P1 758 A 1.5Bulk

damage 9.5 2.1% FMissing bias bonds,

turn into x-calibration piece

0024-P1 89 A 4.5Bulk

damage+2 1.5 1.2% F

Missing bias bonds, turn into x-

calibration piece; 2 opens during APV-

PA bonding

877 930 nA 0 (1??) 0 0 0.0% AOne channel has increasing noise

with voltage; sensor damage seen

878 1100 nA 0 (2??) 0 0 0.0% ATwo channels have

increasing noise with voltage;

sensor damage seen

879~ 40 smashed

wirebonds APV-PA, reconverable

880 720 nA 2(+2??) 0 0 0.3% ANeighbors of

pinhole noisy @ 550 V

Slide 5US silicon group meeting 5/6/2003

Summary• 4 of 8 bonded modules good

3 had bias return bonds missing 1 has ~40 APV-PA bonds smashed

– Can be repaired

• Of 4 good modules All have channels with increasing noise vs. voltage

– 2 channels on 1 ladder due to inherit pinhole

– 5 channels total on 3 ladders due to lithographic errors in sensor production

Not seen in wafer probing