sLHC Strip Tracker Module Envelopes

(Tim)WP4 Meeting

Glasgow, 13th June 2011

Overview• Development of engineering design for stave layout

requires knowledge of likely stave core thickness.• Components

– Core Dimensions• outer dimensions, bus-tape to bus-tape

– Core Envelope• Twists, bows local ‘roughness’, thermo-mechanical deformations

– Module-to-tape adhesive– Module Envelope

• Module Envelope– Use experience from ABCN25’s with likely extrapolation to

‘final’ ABCN13 modules

ABCN25 Module Z Heights

• SmartScope survey of one hybrid glued to a sensor– Mount wire-bonding jig on SmartCcope and

measure z-height– Locate module and establish vacuum– Measure z-heights of:-

• Silicon wafer• Hybrid• ASICs• Wirebonds• Capacitors

Results• Wirebonds– Intended difference in loop-height is 0.2mm– 4-row wirebonding establishes on LHCb VeLo Beetle ASICs –

0.2mm bond height difference maintained.– Expect 4-row ABCN13 wirebonding to be similar giving

wirebond height of 0.8mm above ASICs– Total height = 1.30 + 0.80 = 2.21mm

• Capacitors– Measured height = 2.17 above local hybrid height of 0.65mm– Hybrid unsupported so measured height affected– Corrected height = 2.17 + 0.8 - 0.65 = 2.32mm