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2018 Microchip Technology Inc. DS20006018A-page 1 MIC69101/103 Features Single Input Voltage Range: V IN 1.65V to 5.5V Maximum Dropout (V IN – V OUT ) of 500 mV over Temperature Adjustable Output Voltage Down to 0.5V Stable with 4.7 µF Ceramic Output Capacitor Excellent Line and Load Regulation Specifications Logic-Controlled Shutdown Thermal Shutdown and Current-Limit Protection 10-Pin 3 mm x 3 mm DFN Package –40°C to +125°C Junction Temperature Range Applications Point-of-Load Applications Industrial Power Sensitive RF Applications General Description The MIC69101/103 are the 1A output current member of the MIC69xxx family of high current, low voltage regulators, that support currents of 1A, 1.5A, 3A, and 5A. The MIC69101/103 operates from a single low voltage supply, yet offers high precision and ultra-low dropout of 500 mV under worst case conditions. The MIC69101/103 operate from an input voltage of 1.65V to 5.5V. It is designed to drive digital circuits requiring low voltage at high currents (i.e. PLDs, DSP, microcontroller, etc.). These regulators are available in adjustable and fixed output voltages including 1.8V. The adjustable version can support output voltages down to 0.5V. The µCap design of the MIC69101/103 is optimized for stability with low value low-ESR ceramic output capacitors. Features of the MIC69101/103 include thermal shutdown and current limit protection. Logic enable and error flag pins are also available. The MIC69101/103 are offered in a tiny 10-pin 3 mm x 3 mm DFN package and has an operating temperature range of –40°C to +125°C. Package Type NC EN 5 1 FLG NC GND NC 10 ADJ/SNS VOUT NC VIN 9 8 7 2 3 4 6 MIC69101/03 10-Pin 3 mm x 3 mm DFN (ML) Single Supply V IN , LOW V IN , LOW V OUT , 1A LDO

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Page 1: Single Supply VIN, LOW VIN, LOW VOUT, 1A LDOww1.microchip.com/.../en/...VIN-LOW-VIN-LOW-VOUT-1A-LDO-DS200… · 7 VIN Input voltage that supplies current to the output power device

2018 Microchip Technology Inc. DS20006018A-page 1

MIC69101/103

Features

• Single Input Voltage Range: VIN 1.65V to 5.5V

• Maximum Dropout (VIN – VOUT) of 500 mV over Temperature

• Adjustable Output Voltage Down to 0.5V

• Stable with 4.7 µF Ceramic Output Capacitor

• Excellent Line and Load Regulation Specifications

• Logic-Controlled Shutdown

• Thermal Shutdown and Current-Limit Protection

• 10-Pin 3 mm x 3 mm DFN Package

• –40°C to +125°C Junction Temperature Range

Applications• Point-of-Load Applications

• Industrial Power

• Sensitive RF Applications

General Description

The MIC69101/103 are the 1A output current memberof the MIC69xxx family of high current, low voltageregulators, that support currents of 1A, 1.5A, 3A, and5A. The MIC69101/103 operates from a single lowvoltage supply, yet offers high precision and ultra-lowdropout of 500 mV under worst case conditions.

The MIC69101/103 operate from an input voltage of1.65V to 5.5V. It is designed to drive digital circuitsrequiring low voltage at high currents (i.e. PLDs, DSP,microcontroller, etc.). These regulators are available inadjustable and fixed output voltages including 1.8V.The adjustable version can support output voltagesdown to 0.5V.

The µCap design of the MIC69101/103 is optimized forstability with low value low-ESR ceramic outputcapacitors.

Features of the MIC69101/103 include thermalshutdown and current limit protection. Logic enable anderror flag pins are also available.

The MIC69101/103 are offered in a tiny 10-pin3 mm x 3 mm DFN package and has an operatingtemperature range of –40°C to +125°C.

Package Type

NC EN5

1FLG

NC

GND

NC

10 ADJ/SNS

VOUT

NC

VIN

9

8

7

2

3

4

6

MIC69101/0310-Pin 3 mm x 3 mm DFN (ML)

Single Supply VIN, LOW VIN, LOW VOUT, 1A LDO

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MIC69101/103

DS20006018A-page 2 2018 Microchip Technology Inc.

Typical Application Circuits

Functional Block Diagram

Fixed 1.8V Regulator w/Flag Error Adjustable Regulator

ENABLE

IN

EN

OUT

ADJ

VREF

GND

VREF

50mV FLG

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2018 Microchip Technology Inc. DS20006018A-page 3

MIC69101/103

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Supply Input Voltage (VIN) ..........................................................................................................................................+6VLogic Input Voltage (VEN)....................................................................................................................................0V to VINPower Dissipation (PD) (Note 1) ............................................................................................................ Internally LimitedFlag Pin (FLG) ............................................................................................................................................................+6VESD Rating (Note 1) .................................................................................................................................................. 2 kV

Operating Ratings ‡

Supply Voltage (VIN) ............................................................................................................................... +1.65V to +5.5VEnable Input Voltage (VEN) .................................................................................................................................0V to VIN

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.This is a stress rating only and functional operation of the device at those or any other conditions above those indicatedin the operational sections of this specification is not intended. Exposure to maximum rating conditions for extendedperiods may affect device reliability. Specifications are for packaged product only.

‡ Notice: The device is not guaranteed to function outside its operating ratings.

Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA.Exceeding the maximum allowable power dissipation will result in excessive die temperature and the regu-lator will go into thermal shutdown.

2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in serieswith 100 pF

TABLE 1-1: ELECTRICAL CHARACTERISTICS

Electrical Characteristics: TA = 25°C with VIN = VOUT + 0.5V; Bold values indicate –40°C ≤ TJ ≤ +125°C;IOUT = 10 mA; COUT = 4.7 µF ceramic, unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

Output Voltage Accuracy (Fixed)VOUT

–2 — +2 % Over temperature range

Output Voltage Accuracy (Adj) 0.49 0.5 0.51 V —

Feedback Pin Current IFB — 0.21 1 µA —

Output Voltage Line Regulation (Note 1)

ΔVOUT/ΔVIN — ±0.1 ±0.3 %/VVIN = VOUT +1.0V to 5.5V

For VOUT ≥ 0.65V, VIN = 1.65 to 5.5V

Output Voltage Load Regulation ΔVOUT/VOUT — ±0.25 — % IL = 10 mA to 1A

VIN – VOUT; Dropout Voltage(Note 2)

VDO —150 300 mV IL = 0.5A

215 500 mV IL = 1.0A

Ground Pin Current IGND —

1.1 — mA IL = 10 mA

4.7 — mA IL = 0.5A

11 20 mA IL = 1.0A

Ground Pin Current in Shutdown ISHDN — 1 — µA VEN = 0V

Current Limit ILIM 1.2 1.95 — A VOUT = 0V

Start-up Time tSTART — 10 150 µs VEN = VIN

Thermal Shutdown ThSHDN — 165 — °C —

Enable Input

Enable Input Threshold VEN0.8 0.6 — V Regulator enable

— — 0.2 V Regulator shutdown

Enable Pin Input Current IEN— 0.005 — µA VIL ≤ 0.2V (Regulator shutdown)

— 7 — µA VIH ≥ 0.8V (Regulator enable)

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MIC69101/103

DS20006018A-page 4 2018 Microchip Technology Inc.

Flag Output

Flag Output Leakage Current IFLG(LEAK) — 0.05 — µA Flag off

Output Logic-Low Voltage (Undervoltage condition)

VFLG(LO) — 150 — mV IL = 5 mA

Flag Threshold VFLG 7.5 10 14 %% of VOUT below nominal (falling)

Hysteresis — — 2 — % —

1: Minimum input for line regulation test is set to VOUT + 1V relative to the highest output voltage.

2: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. For outputs below 1.65V, dropout voltage is considered the input-to-output voltage differential with the minimum input voltage of 1.65V. Minimum input operatingvoltage is 1.65V.

Electrical Characteristics: TA = 25°C with VIN = VOUT + 0.5V; Bold values indicate –40°C ≤ TJ ≤ +125°C;IOUT = 10 mA; COUT = 4.7 µF ceramic, unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

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2018 Microchip Technology Inc. DS20006018A-page 5

MIC69101/103

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters Sym. Min. Typ. Max. Units Conditions

Temperature Ranges

Storage Temperature Range TS –65 — +125 °C —

Junction Temperature Range TJ –40 — +125 °C —

Package Thermal Resistances

Thermal Resistance (3 mm x 3 mm DFN-10) JA — 60 — °C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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MIC69101/103

DS20006018A-page 6 2018 Microchip Technology Inc.

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: Power Supply Rejection Ratio.

FIGURE 2-2: Dropout Voltage vs. Output Current.

FIGURE 2-3: Dropout Voltage vs. Temperature.

FIGURE 2-4: Output Voltage vs. Temperature.

FIGURE 2-5: Output Voltage vs. Input Voltage.

FIGURE 2-6: Ground Current vs. Output Current.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0

10

20

30

40

50

60

70

1K 10KFREQUENCY (Hz)

VIN = 3.3VVOUT = 1.8VIOUT = 0.5A

0

50

100

150

200

250

300

350

400

100 300 500 700 900OUTPUT CURRENT (mA)

VOUT = 1.8VCOUT = 10 F

0

50

100

150

200

250

300

350

400

20 40 60 80TEMPERATURE (°C)

IOUT=1A

IOUT=0.5A

VOUT = 1.8VCOUT = 10 F

1.60

1.65

1.70

1.75

1.80

1.85

1.90

1.95

2.00

20 40 60 80TEMPERATURE (°C)

VIN = VOUT + 1VVOUT = 1.8VCOUT = 10 FIOUT = 10mA

00.20.40.60.81.01.21.41.61.82.0

0 0.4 0.8 1.2 1.6 2.0 2.4 2.8INPUT VOLTAGE (V)

VOUT = 1.8VCOUT = 10 F

1A0.5A

0123456789

10

0.5 0.7OUTPUT CURRENT (A)

VIN = 2.8VVOUT = 1.8VCOUT = 10 F

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2018 Microchip Technology Inc. DS20006018A-page 7

MIC69101/103

FIGURE 2-7: Ground Current vs. Temperature.

FIGURE 2-8: Enable Threshold vs. Temperature.

FIGURE 2-9: Load Regulation.

FIGURE 2-10: Current-Limit vs. Temperature.

FIGURE 2-11: Line Transient.

FIGURE 2-12: Load Transient.

02468

101214161820

20 40 60 80TEMPERATURE (°C)

1A

0.5A

VIN = VOUT + 1VVOUT = 1.8VCOUT = 10 F

00.10.20.30.40.50.60.70.80.91.0

20 40 60 80TEMPERATURE (°C)

VIN = 2.8VVOUT = 1.8VCOUT = 10 FIOUT = 100mA

OFF

ON

1.700

1.725

1.750

1.775

1.800

1.825

1.850

1.875

1.900

0.4 0.6OUTPUT CURRENT (A)

VIN = 2.8VVOUT = 1.8VCOUT = 10 F

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

20 40 60 80TEMPERATURE (°C)

VIN = 2.8VVOUT = 1.8VCOUT = 10 F

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MIC69101/103

DS20006018A-page 8 2018 Microchip Technology Inc.

FIGURE 2-13: Enable Turn-On.

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2018 Microchip Technology Inc. DS20006018A-page 9

MIC69101/103

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin Number Pin Name Description

1 FLGError Flag (Output): Open collector output. Active low indicates an output fault condition.

2, 4, 5, 8 NC Not internally connected.

3 (EP) GND Ground (exposed pad is recommended to connect to ground on DFN).

6 ENEnable (Input): CMOS compatible input. Logic high = enable,logic low = shutdown. Do not leave pin floating.

7 VIN Input voltage that supplies current to the output power device.

9 VOUT Regulator Output.

10 (ADJ) ADJ Adjustable regulator feedback input. Connect to resistor voltage divider.

10 (FIXED) SNS Sense pin, connect to output for improved voltage regulation.

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MIC69101/103

DS20006018A-page 10 2018 Microchip Technology Inc.

4.0 APPLICATION INFORMATION

The MIC69101/103 are ultra-high performance lowdropout linear regulators designed for high currentapplications requiring a fast transient response. Theyutilize a single input supply, perfect for low-voltageDC-to-DC conversion. The MIC69101/103 require aminimum number of external components. TheMIC69101/103 regulators are fully protected fromdamage due to fault conditions offering constantcurrent limiting and thermal shutdown.

4.1 Input Supply Voltage

VIN provides a high current to the collector of the passtransistor. The minimum input voltage is 1.65V allowingconversion from low voltage supplies.

4.2 Input Capacitor

An input capacitor of 1 µF or greater is recommendedwhen the device is more than 4 inches away from thebulk AC supply capacitance or when the supply is abattery. Small, surface mount, ceramic chip capacitorscan be used for bypassing. The capacitor should beplaced within 1 inch of the device for optimalperformance. Larger values will help to improve ripplerejection by bypassing the input to the regulator, furtherimproving the integrity of the output voltage.

4.3 Output Capacitor

The MIC69101/103 require a minimum of outputcapacitance to maintain stability. However, propercapacitor selection is important to ensure desiredtransient response. The MIC69101/103 are specificallydesigned to be stable with low ESR ceramic chipcapacitors. A 4.7 µF ceramic chip capacitor shouldsatisfy most applications. Output capacitor can beincreased without bound. See typical characteristics forexamples of load transient response.

X7R dielectric ceramic capacitors are recommendedbecause of their temperature performance. X7R-typecapacitors change capacitance by only 15% over theiroperating temperature range and are the most stabletype of ceramic capacitors. Z5U and Y5V dielectriccapacitors change value by as much as 50% and 60%,respectively over their operating temperature ranges.To use a ceramic chip capacitor with Y5V dielectric thevalue must be much higher than an X7R ceramic or atantalum capacitor to ensure the same capacitancevalue over the operating temperature range. Tantalumcapacitors have a very stable dielectric (10% over theiroperating temperature range) and can also be usedwith this device.

4.4 Minimum Load Current

The MIC69101/103 regulator is specified betweenfinite loads. If the output current is too small, leakagecurrents dominate and the output voltage rises. A10 mA minimum load current is necessary for properoperation.

4.5 Adjustable Regulator Design

The MIC69103 adjustable version allows programmingthe output voltage anywhere between 0.5V and 5.5Vwith two resistors. The resistor value between VOUTand the adjust pin should not exceed10 kΩ. Larger values can cause instability. The resistorvalues are calculated by:

EQUATION 4-1:

4.6 Enable

The MIC69101 fixed output voltage version features anactive high enable input (EN) that allows on-off controlof the regulator. Current drain reduces to near “zero”when the device is shutdown, with only microamperesof leakage current. EN may be directly tied to VIN andpulled up to the maximum supply voltage.

4.7 Thermal Design

Linear regulators are simple to use. The mostcomplicated design parameters to consider are thermalcharacteristics. Thermal design requires the followingapplication-specific parameters:

• Maximum ambient temperature (TA)

• Output current (IOUT)

• Output voltage (VOUT)

• Input voltage (VIN)

• Ground current (IGND)

First, calculate the power dissipation of the regulatorfrom these numbers and the device parameters fromthis data sheet.

VOUT 0.5R1R2------- 1+ =

Where:

VOUT is the desired output Voltage

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2018 Microchip Technology Inc. DS20006018A-page 11

MIC69101/103

EQUATION 4-2:

In Equation 4-2, the ground current is approximated byusing numbers from the Section 1.0 “ElectricalCharacteristics” or Section 2.0 “TypicalPerformance Curves” sections. The maximumallowable power dissipation of any TA (ambienttemperature) is PD(MAX) = (TJ(MAX) – TA) / θJA.Exceeding the maximum allowable power dissipationwill result in excessive die temperature and theregulator will go into thermal shutdown.

Refer to Application Note 9 for further details andexamples on thermal design and heat sinkapplications.

PD VIN VOUT– IOUT VIN IGND+=

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MIC69101/103

DS20006018A-page 12 2018 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

XX

Example10-Lead DFN*

XXXXX

1869101

Example10-Lead DFN*

XXXXXNNN

69103412

NNNX 189Y

YX

Legend: XX...X Product code or customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (trianglemark).

Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information. Package may or may not includethe corporate logo.

Underbar (_) and/or Overbar (‾) symbol may not be to scale.

3e

3e

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2018 Microchip Technology Inc. DS20006018A-page 13

MIC69101/103

10-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

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MIC69101/103

DS20006018A-page 14 2018 Microchip Technology Inc.

10-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

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2018 Microchip Technology Inc. DS20006018A-page 15

MIC69101/103

APPENDIX A: REVISION HISTORY

Revision A (May 2018)

• Converted Micrel document MIC69101/103 to Microchip data sheet DS20006018A.

• Minor text changes throughout.

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MIC69101/103

DS20006018A-page 16 2018 Microchip Technology Inc.

NOTES:

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2018 Microchip Technology Inc. DS20006018A-page 17

MIC69101/103

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

a) MIC69101-1.8YML-TR:

Single Supply VIN, LOW VIN, LOW VOUT, 1A LDO, 1.8 Fixed Output Voltage, –40°C to +125°C Junction Temperature Range, 10-Lead DFN Package, 5000/Reel

b) MIC69103YML-TR: Single Supply VIN, LOW VIN, LOW VOUT, 1A LDO, Adjustable Output Voltage, –40°C to +125°C Junction Temperature Range, 10-Lead DFN Package, 5000/Reel

PART NO. XX

PackageDevice

Device:

MIC6910x: Single Supply VIN, LOW VIN, LOW VOUT, 1A LDO

MIC69101: Fixed Output VoltageMIC69103: Adjustable Output Voltage Down to 0.5V

Output Voltage:1.8 = 1.8V Fixed<blank> = Adjustable

JunctionTemperature Range:

Y = –40°C to +125°C, Industrial, RoHSCompliant

Package: ML = 10-Lead DFN (3 mm x 3 mm x 0.9 mm)

Media Type: TR = 5000/Reel

X

Junction

Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

–XX

Media Type

–X.X

OutputVoltage Temperature

Range

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MIC69101/103

DS20006018A-page 18 2018 Microchip Technology Inc.

NOTES:

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2018 Microchip Technology Inc. DS220006018A-page 19

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2018, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-3000-1

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTSYSTEMCERTIFIEDBYDNV

== ISO/TS16949==

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DS20006018A-page 20 2018 Microchip Technology Inc.

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10/25/17