shrinking rugged mission subsystems

1 | June 22, 2015 | Proprietary | © 2015 Curtiss-Wright

Defense Solutions Division

Shrinking Rugged Mission Subsystems

Prepared for Technology Horizons Series, June 2015


Defense Solutions Division

Phil Evans

Field Applications Engineer

Curtiss-Wright - Defense Solutions Division

15 Lambourne Cres, Llanishen, Cardiff, United Kingdom CF14 5GF

T +44.2920.747.927 | M +44.7500.794.866

[email protected] | http://www.cwcdefense.com

mailto:[email protected]

http://www.cwcdefense.com/


MIL-Aero Market is Demanding Less & More

Less: (SWaP-C) • Size

• Weight

• Power

• Cost

More: • Advanced sensor / vetronics payload capabilities

• Greater processor, memory and graphics compute engines

• High-speed network connectivity and situational awareness

• Aircraft/vehicle power input compatibility/voltage protections

• Device management, diagnostics & security capabilities

• Excellent signal integrity in noisy EMI conditions

• Harsh environment survivability (wide temperatures, high shock/vibe, high altitude, humidity, dust/water ingress)

Examples: SWaP-Sensitive Platforms:

• Fixed Wing and Rotary Aircraft

• Smaller/Mid-size Unmanned Air Systems

• Tactical Ground Vehicles (including UGVs)

• Wearable / Portable Comms

http://www.google.com/url?sa=i&source=images&cd=&cad=rja&uact=8&ved=0CAgQjRw&url=http://www.unmanned.co.uk/platforms/unmanned-vehicles-news/unmanned-surface-vehicles-usv-news/page/2/&ei=-gd1VNqxCOfLsASag4GgDg&psig=AFQjCNFT9S09pUvCUK3Slw78dl9JlMML9A&ust=1417042298281228

http://www.google.com/url?sa=i&source=images&cd=&cad=rja&uact=8&ved=0CAgQjRw&url=http://www.lockheedmartin.com/us/news/features/2013/smss.html&ei=BAh1VKDrFJbasASTv4HwCw&psig=AFQjCNF4GgIeCC87O27uz9eOCIpYJCDccQ&ust=1417042308511778


Curtiss-Wright Parvus Business Unit

• Parvus Business Unit, Part of Curtiss-Wright Defense Solutions Since Oct 2013

• Facility Located in Salt Lake City, Utah (USA), Since 1983

• AS9100 Rev-C Aerospace Quality Manufacturing Program

• Cisco Systems Partner: Solution Technology Integrator (STI) for Rugged Subsystems Integration

• Proven Provider of Small Form Factor (SWaP-C Optimized) Computing & Networking Subsystems for C4ISR Apps

• COTS products typically ITAR-Free (EAR export controlled)

• Application engineering services for turnkey Modified COTS (MCOTS) systems without traditional development NRE fees

• Ideal solutions for budget constrained government environment and COTS tech refresh upgrades

Key Facts


Parvus Dura Systems Enable C4ISR Capabilities

Target Applications:

• Non-flight/safety-critical mission processing and network backbone tech upgrades (interfacing with vehicle / aircraft sensors, data links, radios, IP devices), typically on size, weight, power, cost (SWaP-C) constrained platforms

Parvus COTS subsystem portfolio enables Network Centric Operations:

• Every warfighter, every platform becomes network node w/interoperability (no stove pipes)

• Real-time sharing of voice, video and data for shared situational awareness

Processor

Processor

Ethernet

Switch IP

Router

Radios/

Satellite

Processor Sensors

Sensors Processor

Ethernet

Switch IP

Router

Radios/

Satellite

Parvus Subsystems for

Intra / Inter-Vehicle Networks

Sensors

Sensors

Data

Voice

Video


Pedigree of Success

AH-64 Apache

Stryker

CH-53K Super Stallion

IBCS

AAV

UH-60 Blackhawk

AC-130J

PC-12

P-3-Orion

Littoral Combat Ship (LCS)

Delta / Atlas Launch Vehicle Joint Light Tactical Vehicle

MM-104 Patriot Missile

WIN-T

MRAP M-ATV

LEMV

MQ-1 Predator / MQ-9 Reaper

Sentinel Radar

JSTARS (Boeing 707-300)

C-RAM

HC-130H/J

CP-140 Aurora

Fire Scout

RQ-5 Hunter

M-8 Passenger Trains

Boeing 737

Firebird UAS

New Shepherd Husky HMDS

OH-58 Kiowa Warrior

Sampling of land, sea, air, and space platforms where Parvus products are installed:

http://www.harris.com/

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=CwYm9xOVBIY74M&tbnid=bbHffLNeLxQvhM:&ved=0CAUQjRw&url=http://spacefellowship.com/news/art27601/nasa-s-commercial-crew-partner-ula-completes-two-milestones.html&ei=s1wVUfy_GY3riQLZ0ID4Cw&bvm=bv.42080656,d.cGE&psig=AFQjCNGKuB04evVfnIqjrK_b81OsaokqWQ&ust=1360440878382236

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=EX1RguXRV7rzlM&tbnid=DVnD2OwMzjvttM:&ved=0CAUQjRw&url=http://www.spacewar.com/reports/US_Army_Awards_Northrop_Grumman_Counter_Rocket_Artillery_and_Mortar_C_RAM_Contract_999.html&ei=XlYVUeqCG43LigK_moGIBg&psig=AFQjCNFk8tRY3QRe-ejgsIn2vfg0FTBkng&ust=1360439152728306


Comparison: Commonly Integrated x86 Small Form Factor (SFF) Modules

PCIe104

(90x96mm) COM-Express Compact

(95x95mm)

PCIe Mini Card

(30x51 mm) XMC

(149 x 74mm)

3U VPX

(160x 100mm)

Different Modules to Tailor Performance / SWaP-C Optimization Levels

http://www.versalogic.com/products/ds.asp?productid=236


Comparison: commonly integrated small form factor (SFF) modules

PCIe104

(90 x 96 mm)

COM-Express Compact

(95 x 95 mm)

PCIe Mini

(30 x51 mm)

XMC

(149 x 74 mm) 3U VPX

(160 x 100 mm)

Continuum of rugged standards-based module building blocks to choose from

to tailor system performance / SWaP-C optimization levels

COM-Express Basic

(125 x 95 mm)

SMARC-full SoM

(82 x 80 mm)

SMARC-short SoM

(82 x 55 mm)

http://www.versalogic.com/products/ds.asp?productid=236


Computing Networking

Board-Level

DuraMAR

DuraCOR® Mission Computers DuraMAR® Mobile IP Routers

DuraNET® Ethernet Switches

PC104 SBC, Power, I/O, Ethernet

Multi-Function DuraWORX® Computer + Router

DuraNET

Parvus Dura System Product Line (DuraCOR / MAR / NET / WORX)


Rugged SFF Open Architecture Systems

Based on Rugged, Modular Small Form Factor (SFF) Building Blocks:

• Open Architecture: PC104, COM-Express, Mini-PCIe, mSATA, etc.

• Typically No Backplane: Lego-Like Stacking / Carrier Board Slot Architecture

• Rugged: Extended Temp Boards (-40◦ to +85◦C), Fanless, Shock/Vibe-Resistant

• Large Module Ecosystem: 100+ Suppliers of Interoperable Cards

• x86 PC Software Compatibility: Linux, Windows, etc

Low Size, Weight & Power-Cost (SWaP-C) Architectures (examples):

• Small Form Factor Modules

• PCIe104: 3.6” x 3.8” (90x96mm)

• COM-Express (95x95mm for COMe Compact)

• Mini-PCIe: (30x51mm / 30x27mm)

• mSATA (same as Mini-PCIe)

• Low Power: 2 to 50 Watts (Typical)

• Affordable: Fraction of VPX / VME Architecture

PCIe104 SBC & I/O Cards:

Stacking CPU, GPU, FPGA,

DIO, Serial, Ethernet Modules

for complex I/O requirements

COM-Express: CPU

Mezzanine Module with

Standardized Pinout

Integrates with Carrier Board

Mini-PCIe I/O Modules:

MIL-1553, ARINC429, Serial,

Ethernet, CAN, ADIO, Wireless,

Video Cards, etc.

mSATA SSDs

(87% smaller and 90% lighter

than a 2.5” solid state drive)


Rugged SFF Open Architecture Systems Ruggedized Single Board Computer (SBC)

– Conformal Coating (for humidity and tin whisker mitigation)

– Underfilling of BGAs, staking of large components (for shock/vibe)

– Extended temperature components/screening (for thermal reliability)

– Minimal (or no) wiring harness/cables internally (for shock/vibe and

manufacturability (Rather, board to board interfaces or flex cabling)

Vehicle / Aircraft Power Supply

– 1500 VDC Isolated DC-DC Converter (28VDC Nominal)

– Surge/Spike Transient Protections per MIL-STD-1275D & 704F

– Built-in Power Conditioning & EMI Filtering per MIL-STD-461F

Near Cable-less Electrical Design:

PSU & Breakout boards for PCIe104 Corei7

SBC I/O and MIL-DTL-38999 Connectors


Rugged Mechanical Design

Rugged Mechanicals

• IP67 Sealed (Dust/Water Proof) Enclosures

• Aerospace-Grade Aluminum-Alloy Enclosure

• Extruded / machined / sheet metal / brazed

• O-Ring gaskets for ingress protection

• Hardware torque spec’d for optimal sealing

• Rugged Connectors

• Circular MIL-DTL-38999 (or similar) Connectors

• Pre-installed spare I/O connectors/pins for add-on I/O cards

• Passive Thermal Management

• No Moving Parts / No Coldplate Required (Bolt it Down Anywhere and Go)

• Passive Thermal Management Devices (Heatpipes / Heatspreaders)

• PCB Clamshell Thermal Plates/Conduction Path to Chassis SBC Heatpipe/Spreader

SBC Heat Spreader w/

Embedded Copper Plugs

Enclosure Heatsink

Modular Chassis


Rugged System Approach – Typical Qual Testing

MIL-STD-810G (Environmental) Qual-Tested (& RTCA/DO-160 for New Models) • Operating Temp.: -40ºC to +71ºC (-40ºF to +160ºF) Ambient (select models:-40ºC to +85ºC)

• Storage Temp: -40ºC to +85ºC (-40ºF to +185ºF); Newer Models: -55ºC/+85ºC

• Operating Shock: 40g, 11ms, 3 pos/neg per axis, 18 terminal peak sawtooth pulses

• Crash Safety Shock: 75g, 11ms, 2 pos/neg per axis, total 12 sawtooth

• Random Vibration: 3 Axes, 1 Hour/Axis (per Jet- Helo and Tracked Vehicle Profiles)

• Humidity: Up to 95% RH @ 40C, Non-Condensing

• Water Immersion: 1 Meter Submersion, 30 Minutes

• Dust Ingress: No Dust Ingress per Method 510.4

• Altitude: Up to 50,000ft Operational / 60,000ft Storage (for newer models)

MIL-STD-461F (EMI) Qual-Tested (& RTCA/DO-160 for New Models) • Conducted Emissions, CE102, Power Leads, 10 KHz to 10MHz, basic curve

• Conducted Susceptibility, CS101, Power Leads, 30 Hz to 150 KHz, Curve 2

• Radiated Emissions, RE102, Electric Field, 10 KHz to 18 GHz, Figure RE102-3

• Radiated Susceptibility, RS103, Electric Field, 2MHz to 18 GHz, 200V/m

Other Tests as Needed: i.e. MIL-S-901D, etc.


Pre-Integrated MCOTS Systems

Pre-Integrated Subsystems

System Modularity = Many Permutations / Variants Possible

• Various CW/3rd Party I/O Module Options (PCIe104, Mini-PCIe)

• Add: MIL-STD-1553, ARINC429, Video Encoders, DIO, Ethernet, etc.

• Internal/Fixed/Removable Storage Options (Capacities/OS/Type), etc.

• Special Order: Different Connectors, Mechanical Modifications

Modified COTS (MCOTS) Variants Available Pre-Integrated by Factory

• Consult with Parvus Systems Application Engineering Team –

Minimize Customer Risk, Accelerate Schedule via Turnkey MCOTS

• Responsive & Cost-Competitive Subsystem Integration Services

• Initial Prototypes Delivered within Weeks (2-8 Typical)

• Without Traditional NRE (rather, Recurring Integration Fee)

• MCOTS Often Qualified by Similarity Analysis without NRE

• Numerous Pre-Qualified 3rd party I/O Cards

Support Mission-Specific

I/O Interfaces

(e.g. Avionics / Vehicle Databus,

GPS, Video Capture, Legacy

Radio Interfaces)


Quality, Longevity, Export Control

Commercial / Dual-Use COTS Products

• ITAR-Free, EAR Export Controlled (US Commerce Dept)

Quality Manufacturing

• AS9100 Rev C Aerospace Quality Audited Production

• Preferred Supplier Status for On-Time Delivery and Quality

• Salt Lake City (USA) Manufacturing Facilities Optimized for

High Quality Typical of Military Programs; Scalable for Large Programs

• High Workmanship Standards to IPC Specifications

• Counterfeit Parts Prevention Program

• QA Inspections; 100% ATP testing; Env. Stress Screening Available

Longevity of Supply/Service

• Objective: Minimum 8 years Standard Product Lifecycle • 6 Month Customer Last Time Buy Notifications + Migration Path Planning

• Component Obsolescence Monitoring – Config. Manag. Control Option

• Multi-Year Extended Service Contracts Available


DuraCOR®: Small Form Factor Mission Computers

DuraCOR 810

DuraCOR 810-Duo

DuraCOR 820 DuraWORX 10-10 / 10-11

Roadmapped

(Core i7 Computer + Cisco Router) (Core i7 Gen 5)

Typical Features:

• Multi-core Intel x86 CPU

• PCIe bus (or legacy PCI / ISA)

• PCIe104 / Mini-PCIe I/O Slots

• Flash SSD(s)

• IP67 Aluminum Chassis

• MIL-DTL-38999 Connectors

• MIL-STD-1275/704/DO-60 Power

• Environmental / EMI Tested:

MIL-STD-810G, MIL-STD-461F / DO-160 DuraCOR 80-41

DuraCOR 80-42 DuraCOR 80-40

(Haswell,

Quad-Core)

(SandyBridge,

Dual-Core)

DuraCOR 830


Selecting the Right Mission Computer...

80-41 80-40 810-Duo 810 830 820

Processor

Intel Core i7-4700EQ

(4th Gen)

Intel Core i7-2655LE

(2nd Gen) Intel Core2Duo L7400 Intel Pentium M 738 Intel Atom Z530 Intel Pentium M 738

Architecture 64-Bit, 4-Core 64-Bit, 2-Core 64-Bit, 2-Core 32-Bit, 1-Core 32-Bit, 1-Core 32-Bit, 1-Core

Size (cubic inches) 139 / 223 / 307 186 / 270 / 354 298 298 155 92

Weight (lbs) 6.0 / 7.4 / 8.8 8.5 / 9.9 / 11.3 8 7.8 4 2.9

Power Consumption < 75 W < 50 W < 40 W < 25 W < 16 W < 24 W

Power Supply 200 Watt 200 Watt 100 Watt 100 Watt 50 Watt 50 Watt

Expansion Slots

2x Mini-PCIe,

0 / 3x / 6x PCIe104 0 / 3x / 6x PCIe104 6x PCI-104 Slots 6x PC/104-Plus Slots 2x PC/104-Plus Slots -

Bus

PCI-Express

(PCIe104) PCI-Express (PCIe104) PCI (PCI-104)

PCI, ISA

(PC/104-Plus)

PCI, ISA

(PC/104-Plus)

PCI, ISA

(PC/104-Plus)

RAM 16 GB 8 GB 2 GB 1 GB 2 GB 1 GB

Storage

2x mSATA, 1x eSATA,

2x 2.5” SATA 2x 2.5” SATA

2x CF, 1x 1.8" SATA, 1x

eSATA 1x CF

1x CF +

1x SSD Internal 1x CF

USB 6x (incl. 2x USB3.0) 6x USB 2.0 6x USB 2.0 4x USB 2.0 3x USB 2.0 3x USB 2.0

Serial

2x RS232, 2x RS422,

1x RS485 2x RS232 2x RS232 2x RS232 2x RS232 2x RS232

Ethernet 2x GigE 2x GigE 1x GigE + 1x 10/100 1x 10/100 1x GigE 2x 10/100

Video 1x VGA, 2x DP++ 1x VGA, 1x HDMI 1x VGA, 1x LVDS 1x VGA 1x VGA 1x VGA

Audio Yes Yes Yes Yes Yes -

GPIO 7x 16x - - 8x 8x

MIL-STD-810G Yes Yes Yes Yes Yes Yes

MIL-STD-461F Yes Yes Yes Yes Yes Yes

MIL-STD-1275D Yes Yes Yes Yes Yes -

MIL-STD-704F Yes Yes Yes Yes Yes Yes

RTCA/DO-160 Yes Yes No No No No

DuraCOR 820

DuraCOR 830

DuraCOR 810-Duo

DuraCOR 810

DuraCOR 80-40

DuraCOR 80-41


New Product Highlight: DuraCOR 80-41

Product Parvus DuraCOR 80-41 Mission Computer

Processor Intel Core i7 (4th Gen “Haswell”), 4-core, 2.4GHz (3.4GHz w/Turbo

Boost), Intel QM87 Chipset, Intel GT2-4600 GPU

RAM 16 GB

TPM Atmel AT97SC3204 Trusted Platform Module (TPM)

Storage (Fixed) Up to 2x Internal mSATA SSD Slots (64GB-256GB Capacity)

Add-on 2.5” SATA 1 / 2-Disk SSD Segment (up to 1 TB/each)

Storage (Removable) Add-on 1 / 2-Disk 2.5” SATA SSD Segment (up to 1TB/each)

I/O Modularity

(PCIe Bus Expansion)

- Up to 2x PCIe-Mini Card I/O Slots (Internal to Base System)

with 60+ pins on DTL-38999 Connectors Reserved for I/O

- Up to 2x PCIe104 Add-on Segments (3x PC104 I/O Card Slots

Per Segment with 132-Pins each on DTL-38999 Connectors)

USB 6x Ports (2x USB 3.0, 4x USB 2.0)

Network 2x Gigabit Ethernet (GbE) Interfaces

COM 5x Serial Ports (2x RS232, 2x RS422, 1x RS485)

Video 3x Indep. Displays: 1x VGA, 2x DisplayPort++ (DP/HDMI/DVI)

Audio Stereo Audio and Microphone (Left/Right)

Discrete / GPIO 7x General-Purpose Digital I/O (3IN, 4OUT)

eSATA Supported, for Direct Attached Storage Device

Size (base system) ~135 in³ (add ~ 84 in³ per I/O expansion segment added)

Weight (base system) < 6.0 lbs (add ~ 1.5 lbs per I/O expansion segment added)

Ingress Protection Dust and Water Proof (Similar to IP67)

Power Supply 200 Watt, MIL-STD-704/1275/DO-160 Compliant (12-36VDC)

Power Consumption < 75 W

Cooling Passive, No Moving Parts, Natural Convection

Temperature -40 to +71C per MIL-STD-810G, DO-160G

Shock/Vibe 40G Shock, Jet-Helo-Tracked Vehicle Vibe per MIL-810, DO-160G

EMI/EMC CE/RE/CS/RS per MIL-STD-461 + DO-160G

Parvus® DuraCOR® 80-41 Mission Computer

• Quad-Core, 4th-Gen Intel Core i7 Modular Processor System

• 25% Size and Weight Reduction from Previous Generation

• Rugged IP67 (Dust/Waterproof) Chassis w/ Modularity (I/O & Storage)

• Base I/O: 6x USB, 2x GbE, 5x COM, 3x Video, 7x DIO, eSATA, Audio

• Application-Specific I/O Expansion via Mini-PCIe + PCIe104 I/O Cards

• 2x Mini-PCIe Module Slots in Base System

• Up to 6x PCIe104 I/O Cards (via Add-on PC104 I/O Expansion Segments)

• SATA SSDs (2x mSATA Internal Slots / Opt. 2.5” Removable SSDs)

• 28V DC MIL-STD-1275/704/DO-160 Power Supply

• MIL-STD-810G / DO-160 / MIL-STD-461F Qual Testing Pending


Carriers with Mezzanine Cards Shrink Multi-core x86 Mission Computers

Hybrid Board Form Factor I/O Expansion Promotes Flexibility and Size/Weight Reduction

Couple Together Strengths of Open Standard SFF Modules to Reduce SWaP

• While Leveraging Multi-Vendor, Interoperable Module Ecosystem

DuraCOR 80-40

2nd Gen Core i7

(PCIe104-based)

DuraCOR 80-41

4th Gen Core i7

(COMe, PCIe104,

Mini-PCIe-based)

Mini PCI-E Card (30 x 51 mm or 30 x 27 mm)

mSATA SSD (30 x 51mm or 30 x 27 mm)

PCIe104 Expansion Cards (90x96 mm)

Mini PCIe I/O Module

Slots: MIL-1553, ARINC429,

Serial, Ethernet, CAN, ADIO,

Wireless, Video, etc.

mSATA SSD Slots

(87% smaller and 90% lighter

than a 2.5” solid state drive)

PCIe104 I/O Card

Expansion (GPU, FPGA,

DIO, Serial, Ethernet) for

complex I/O requirements

COM-E Module

Carrier Card

PCIe104 PCIe Mini / mSATA

COM-Express: Standardized

Pinout Enables Next Gen i7

Module to Drop Onto Carrier;

Memory on Top Gives Direct

Thermal Interface to Chassis

COMe Compact (95x95 mm)

Size and Weight Reduction:

• Fewer mechanical parts for

thermal and storage

• Fewer interconnect parts to

bring out SBC I/O signals

• Integrate Multiple Type I/O

Expansion and Storage Slots


DuraCOR 80-41: Scalable Architecture


DuraCOR 80-41: I/O & Storage Modularity

PCIe104 I/O Card Expansion

Internal I/O Expansion:

- 1 Slot Mini-PCIe (Dedicated)

- 1 Slot Mini-PCIe / mSATA (Shared)

Internal Storage:

- 1 Slot mSATA Half-Size (Dedicated)

- 1 Slot mSATA / Mini-PCIe (Shared)

Add-on: Single / Dual PCIe104 I/O Expansion Segment(s):

- 2x 66-Pin DTL-38999 Connectors for

PC104 Card I/O per Segment (Fits up to 3 Cards Each)

1-Slot 2.5” Removable SSD

2-Slot 2.5” Removable SSD

1 or 2 Disk 2.5” Fixed SSD

Modular, Interlocking Segments Scale Functionality

External SATA (eSATA) on 38999

for Direct Attached Storage Device

Add: Application-Specific I/O Modules:

- MIL-STD-1553, ARINC429, Serial, Ethernet,

Video Frame Grabber, GPS, Wi-Fi, CANbus,

DIO, USB, Analog I/O, etc.


Boosting Performance with Intel “Tick-Tock” Processor Advancements

Multi-core processors from Intel reduce power consumption / watt and boost performance • 5th Gen Core i7 (Broadwell) Mission Computer – to be Announced in 2015 (DuraCOR 80-42)

• Continued Improvement in GPU/CPU MIPS per watt performance

with 14nm geometry die shrink

• Estimated 60% improvement in GPU performance

Tock 32nm (Sandy Bridge)

Tick 32nm (Westmere)

Tock 22nm (Haswell)

Tick 22nm (Ivy Bridge)

Tock 14nm (Sky Lake)

Tick 14nm (Broadwell)

DuraCOR 80-41

DuraCOR 80-42

DuraCOR 80-40


Roadmap: 5th Gen Core i7 Mission Processor

DuraCOR 80-41:

• 4th Gen 22nm

CPU/GPU

• High-Speed I/O:

USB 3.0, PCIe

Gen 3 Bus,

DP++, GbE

• Flexibility: Built-in

Mini-PCIe I/O &

mSATA SSDs

DuraCOR 80-42

• Same chassis

and I/O pinout

• 5th Gen 14nm

CPU/GPU (more

perf / watt)

• 50/250ms Power

Hold-up

• N+1 Power

Redundancy

• Built-in-Test (BIT)

• More EMI Testing

Highlights:


DuraNET 10-10

Layer 2+ IOS Managed Layer 2 / 3 IOS Managed

Datacenter Class - Layer 2 / 3 IOS Managed

2x

17x

GigE

10/100

DuraNET 1268

10x GigE

Lightly Managed

10/100 5x

GigE

10/100

2x

8x / 16x / 24x

10G

GigE

3x

49x DuraNET 1059

Unmanaged

Fully Managed Layer 2+

DuraNET 20-10

20x GigE

DuraNET 30-2020 (Cisco ESS 2020-based)

DuraNET 3000 (Cisco IE-3000-based)

DuraNET 4948 (Cisco Catalyst 4948E-based)

10/100 1x

Unmanaged

10/100 5x

DuraNET® Ethernet Switch Box Product Line

20-11

8x GigE


MIL-38999

(IP67)

M12 (IP67)

DuraMAR 5915

DuraMAR 31-5915

RJ-45 (IP67)

Ethernet Switch

Router

Low SWaP-C rugged mobile IP network

router/switch subsystems for extreme tactical

vehicle / aircraft / outdoor deployments

Featuring Advanced Cisco IOS software security

and mobile networking features

Dust + waterproof, fanless, shock/vibe resistant

rugged chassis, MIL/industrial connectors,

MIL-STD power supply, MIL-STD Qual

5x 10/100

DuraMAR: Secure Mobile Router Subsystems

5x 10/100

4x 10/100

15x GbE

21x 10/100

2x GbE

4x 10/100

19x GbE

“1X” Variant “2X” Variant “3X” Variant

“0X” Variant

Router

Router


Compare/Contrast DuraNET models:

10-10 1059 20-11 1268 20-10 30-2020 3000 4948

Layer 2/3 Layer 2 Layer 2

Layer 2

+ Static L3 Layer 2

Layer 2

+ Static L3

Layer 2

+ Static L3 Layer 2 / 3 Options Layer 2 + 3

Management Unmanaged Unmanaged Managed Managed Managed Managed Managed Managed

Software - -

Vitesse CE

Services

Parvus

Firmware

Vitesse CE

Services

Cisco IOS

Cisco IOS

Cisco IOS

Size (inch³) 99 110 10 152 112 126 220 / 354 / 358 1518

Weight (lbs) 3.5 1.9 0.50 5.0 4.0 5.0 6.8 / 9.9 / 10.4 23.0

10/100 5x 5x - - - 17x 8x / 16x / 24x 1x

GigE - - 8x 10x 20x 2x 2x 49x

10Gig - - - - - - - 3x

Fiber Optic - - - 2x / 4x Opt - - - 2x

Connectors M12 / RJ45 DTL-38999

Micro-mini

DTL-38999

DTL-38999 /

TFOCA II DTL-38999 DTL-38999 DTL-38999 DTL-38999

Ingress IP67 IP65 IP67 IP67 IP67 IP67 IP67 IP21

Cooling Passive Passive Passive Passive Passive Passive Passive Forced Air

VDC Input 12V / 28V 28V 12V / 28V 28V 12V / 28V 12V / 28V 28V (18-60V) 28V

Power Cons. < 8 W < 8 W < 8 W < 25 W < 20 W < 20 W < 25 W < 275 W

MIL-704 - Yes Yes Yes Yes Yes Yes Yes

MIL-1275 - - Yes Yes Yes Yes Yes -

Zeroize - - Yes Yes Yes - - -

Oper. Temp -40 to +85C -40 to +85C -40 to +85C -40 to +71C -40 to +71C -40 to +71C -40 to +71C -40 to +54C

MIL-STD-810 - Yes Yes (pend) Yes Yes Yes Yes Yes

MIL-STD-461 - - Yes (pend) Yes Yes Yes Yes Yes

DO-160 - - Yes (pend) Yes Yes Yes - -

DuraNET 30-2020

DuraNET 4948

DuraNET 10-10

DuraNET 3000

DuraNET 1059

DuraNET 1268

DuraNET 20-10 / 20-11


Curtiss-Wright / Cisco Partnership

• Cisco Solution Technology Integrator (STI)

• Leverage Cisco brand preference (50-60% market share), Cisco IOS

familiarity & IT staff training for Cisco technology

Repackage Cisco Systems technology

• Harden Cisco IOS-managed Ethernet switches and routers

• Equip with rugged chassis, connectors, power supply

• Qualify to MIL-STD/DO-160 standards (environmental, EMI)

• Enable proven and familiar Cisco IOS security, mobile networking

technology to be deployed in extreme tactical apps

Commercial Version

• Tactical Communications on the

Move / Satcom

• Attack Helicopters and

Unmanned Air Systems

• Tactical Ground & Amphibious

Assault Vehicles

• Missile Defense Systems

• Littoral Combat Ships &

Unmanned Surface Vehicles

• Commercial Space Flight

Program Support

Select Models Integrate Ruggedized Cisco Technology

Ruggedized Version


Scaling x86 LRU Consolidation Through Modular Chassis Design

+ +

Core i7 Computer Cisco Router DuraNET 20-10 / 30-2020 Switch DuraWORX 10-11 Multifunction LRUs

=

Consolidate Multiple Functions in One (vs Distributed)

• Scalable System Architecture – Reduce SWaP & Simplify

Systems Integration (Cabling, Power, Installation)

• DuraMAR 5915 “2X” and “3X” Series Systems Combine

Cisco Router + Ethernet Switches into one LRU

• DuraWORX Systems Combine DuraCOR Mission Processor +

DuraMAR Router + DuraNET Switch

• DuraWORX 10-11: Haswell Core i7-based

• DuraWORX 10-10: Sandy Bridge Core i7-based

Scale Standalone Line Replaceable Unit (LRU) Hardware Functions with Modular Architecture –

Reduce SWaP & Simplify Systems Integration (Cabling, Power, Installation)


Design Highlights: DuraNET 20-10

Ethernet Switch

Router

DuraMAR 5915 Router Variant w/Integrated

DuraNET 20-10 Switch Option Roadmapped 2014

Side Boss Mounts (x2) Base Flange Mounts (x4)

Vertical / Horizontal Orientation

Modular Chassis: Factory Mateable with DuraCOR 80-40/41

Computer & DuraMAR 5915 Router or as

Router/Computer/Switch Combo as

“DuraWORX”

SWI-22-10

Gigabit Ethernet Switch

PWR-22-11

MIL-704/1275 Power

+

Rugged PC104 Subassemblies

Software Highlights: VITESSE Carrier Ethernet (CE) Services

Software (Same as DBH & SMS-652)

Zeroize & Built-in-Test (BIT) Support

IEEE-1588v2 Precision Timing Protocol

SNMPv3, HTTP Server, Web GUI, RS-232

Console CLI, IPv4/IPv6 Layer 3 Static IP

Routing, Port Monitoring, RMON, Syslog, 802.1X

Authentication, IGMP Snooping, Access Control

Lists (ACLs), IPv4 / IPv6 Multicast, VLAN, QoS /

CoS Traffic Prioritization, Multiple/Rapid

Spanning Tree, Link Aggregation


New Product Highlight: DuraNET 20-10 / 20-11

• Rugged Low-SWaP Gigabit Ethernet Switch Box Systems

• Ports: 8x GbE ports (20-11), 20x GbE ports (20-10)

• Size: 10 in³ (20-11), 112 in³ (20-10)

• Weight: 0.50 lb (20-11), 4.0 lbs (20-10)

• Power (max): < 8 Watts (20-11), < 25 W (20-10)

• Key Features:

• Fully managed Layer 2+ Gigabit Ethernet Switches (supports static L3 routing)

• Rugged design with full MIL-STD and DO-160 qual testing

• Operating Temp: -40 to +85C (20-11), -40 to +71C (20-10), natural convection

• Carrier Ethernet network management: SNMPv3, Web GUI, Serial CLI, IPv4/IPv6,

Port Monitoring, 802.1X authentication, Access Control Lists (ACLs), QoS/CoS Traffic Prioritization,

MSTP/RSTP, IGMP Snooping, Link Aggregation….

• IEEE-1588v2 Precision Timing Protocol

• Zeroize & Built-in-Test (BIT) Support

• Power Management Features – reduces power consumption from unused/idle ports

8x GbE

RS232 Console

Zeorize

Power Input


Evolutionary Miniaturization Continues with GbE Switching

8x GbE

RS232 Console

Zeorize

Power Input

Re-use of technology optimized for

smallest/lightest physical package

SWITCH DuraNET 20-10 DuraNET 20-11

SIZE 112 in3 10 in³

WEIGHT 4.0 lbs 0.50

POWER < 25 W < 8 W

Ports 20x GbE 8x GbE

Architecture

PC104, Modular

Chassis Purpose-Built PCBA/Chassis

DTL-38999 Connectors

Micro-Miniature

DTL-38999-like Connectors


Paradigm Shift in SWaP Reduction for Ethernet Switches

SWITCH SMS-684 DBH-670 DuraNET 1268 SMS-652 DuraNET 1059 DuraNET 20-10 DuraNET 20-11 DuraNET 20-12

SIZE 313 in³ 236 in³ 204 in³ 178 in³ 124 in3 112 in3 10 in³ 10 in³

WEIGHT 12 lbs 6.5 lbs 4.8 lbs 5 lbs 1.9 lbs 4.0 lbs 0.50 0.54

POWER < 60 W < 25 W < 25 W < 20 W < 8 W < 25 W < 8 W (est) < 5 W (est)

Ports 24x GbE + 4x 10G 16x GbE 10x GbE 16x GbE 5x 10/100 20x GbE 8x GbE 6x 10/100

Oper. Temp -40 / +70C -40 / +71C -40 / +71C -40 / +75C -40 / +85C -40 / +71C -40 / +85C -40 / +85C

< 10% of Size of Next Smallest CW Switch System

0

50

100

150

200

250

300

350

System Size (in Cubic Inches)

DuraNET 20-11 DuraNET 20-10

UAS Platforms Particularly

Driving Demand for Connectivity

w/ Low SWaP & Low EMI


Details: Miniaturizing Low-Power Mission Computing

SOM/COM

Carrier Board + PSU

Spare Pins for Expansion I/O

PCIe-Mini

I/O Slot(s)

Shrinking the Computer: “DuraCOR Mini”

• Variants with Low-Power (a) ARM, (b) x86 Processors • Freescale i.MX6-based ARM Processor (quad-core)

• Intel Atom E8000 x86 Processor (single/dual/quad-core)

• Integrated -40/+85C Rugged SOM/COM CPU Module

• < 1.0 lb Weight, < 30 Cubic Inches Size, < 5-10 Watts Power

• I/O Expansion: Mini-PCIe I/O / mSATA SSD Module Site(s)

• Power Conditioning/EMI Filtering (MIL-STD-704 / 1275 / DO-160)

• MIL-STD-810G / MIL-STD-461F / DO-160 Qual Testing

• Rugged IP67 (Dust/Waterproof) Extended Temp Chassis

• Vetronics I/O & I/O Expansion Capabilities

• GbE, USB, CANbus, Serial, Video, Audio (I/O TBD)

• Mini-PCIe I/O Expansion Card Slot

(i.e. for MIL-STD-1553/ARINC429/etc.)

http://versalogic.com/products/ds.asp?productid=232

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=&url=http://commons.wikimedia.org/wiki/File:Intel-logo.svg&ei=JfArVdW2M5DdsASGoIGwDA&bvm=bv.90491159,d.cWc&psig=AFQjCNGRYJrjXSmlIGM6Nn2l0aAdMjxOtQ&ust=1429029289207167


Shrinking Standalone Mission Computing through Lower-Power CPUs

PRODUCT DuraCOR 80-40 DuraCOR 80-41 DuraCOR "Mini”

SIZE 186 in³ 139 in³ < 30 in³

WEIGHT 8.5 lbs 5.5 lbs < 1.0 lb

POWER

< 50 W

(x86, 64-bit, 2-core)

< 75 W

(x86, 64-bit, 4-core)

< 10 W (x86, 32-bit, 1-4-core)

< 5 W (ARM, 32-bit, 1-4-core)

25% Reduction 75% Reduction

Power-efficient multi-core ARM and x86 SystemOnChip (SoCs) CPUs are enabling

smaller form factor computers with less thermal management requirements

• Freescale i.MX6 ARM or Intel Atom

x86 Baytrail CPU (1 / 2 / 4-cores) on

System on Module (SOM)

• I/O and storage expansion via small

form factor Mini-PCIe + mSATA slots

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=&url=http://commons.wikimedia.org/wiki/File:Intel-logo.svg&ei=JfArVdW2M5DdsASGoIGwDA&bvm=bv.90491159,d.cWc&psig=AFQjCNGRYJrjXSmlIGM6Nn2l0aAdMjxOtQ&ust=1429029289207167


Summary

• Miniaturization of components (ICs, SOCs, connectors etc) enable new

levels of rugged system miniaturization

• Intelligent use of modular open architectures can support scalability of

I/O, various classes of processor performance, and form factor

• Multi-core low-power processors (ARM, x86) enable size/power system

reduction

• Software-based add-on functionality can combine multiple functions into

one (networking, computing)


Q&A

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