short course: power electronics packaging (c-liu part 1)

08:30

Short Course: Power Electronics Packaging (C-Liu part 1)

Sunday March 24 2019Instructed by Prof. Sheng Liu

Boardroom

08:30 Part 1

08:30

Short Course: Design for Reliability in MEMS (C-CoriglianoPart 1)

Sunday March 24 2019Instructed by Prof. Alberto Corigliano

Salon 4

08:30 Part 1

10:30 Coffee break

10:45

Short Course: Power Electronics Packaging (C-Liu part 2)

Sunday March 24 2019Instructed by Prof. Sheng Liu

Boardroom

10:45 Part 2

10:45

Short Course: Design for Reliability in MEMS (C-Coriglianopart 2)

Sunday March 24 2019Instructed by Prof. Alberto Corigliano

Salon 4

10:45 Part 2

13:00 Lunch in Bankett Foyer

EuroSimE 2019 Hannover 1

Sunday March 24 2019

14:00

Short Course: System-Level Simulation of Microsystems-MOR (C-Bechtold Part 1)

Sunday March 24 2019 Instructed by Prof. Dr.-Ing. Tamara Bechtold

Boardroom

14:00 Part 1

14:00

Short Course: Reliability of Semiconductor Devices (C-Pufall)

Sunday March 24 2019 Instructed by Prof. Reinhard Pufall

Salon 4

14:00 2 hour course

14:00

Short Course: Molecular Modelling (C-Iwamoto Part 1)

Sunday March 24 2019 Instructed by Dr. Nancy Iwamoto

Salon 2 & 3

14:00 Part 1

16:00 Coffee break

16:15

Short Course: Applications of test chips (C-Suhling)

Sunday March 24 2019 Instructed by Prof. Jeffrey C. Suhling

Salon 4

16:15 2h course

EuroSimE 2019 Hannover2

Sunday March 24 2019

16:15

Short Course: System-Level Simulation of Microsystems-MOR (C-Bechtold Part 2)

Sunday March 24 2019Instructed by Prof. Dr.-Ing. Tamara Bechtold

Boardroom

16:15 Part 2

16:15

Short Course: Molecular Modelling (C-Iwamoto Part 2)

Sunday March 24 2019Instructed by Dr. Nancy Iwamoto

Salon 2 & 3

16:15 Part 2


Monday March 25 2019

09:00 Welcome by W. van Driel

09:15

Industry keynotes

Monday March 25 2019 Chaired by Willem van Driel and Kouchi Zhang

Salon 5 & 6

09:15 Pushing the limits of MEMS – Success factors design and simulation - Udo-Martin Gómez, Robert Bosch GmbH

09:45 Package Developments at Qualcomm - Ahmer Syed, Qualcomm

10:15 Package Development for Autonomous Driving - Darrel Frear, NXP

10:45 Coffee break



— Session 1Technical Keynotes - I

11:15 Monday March 25 2019Chaired by Chris Bailey and Peter RodgersSalon 5-6

Future Challenges related to Thermo-Mechanics, Multi-Physics, Thermal andReliability in Microelectronics and Microsystems

11:1560mn

C. Bailey, University of Greenwich, London, UKB. Vandevelde, IMEC, Leuven, BelgiumW. van Driel, Signify, Eindhoven, The NetherlandsPeter Rodgers, Khalifa University, Abu Dhabi, UAE

Past, present and future of EuroSimE12:1530mn

Prof. G.Q. Zhang, Delft University of Technology, The Netherlands

12:45 Lunch



Session 2 — Solder joint reliability

14:00Monday March 25 2019Chaired by Torsten Hauck and Piet Watté Salon 5-6

Numerical study on local effects of composition and geometry in self-healing solders

14:0030mn

Georg Siroky 1, Elke Kraker 2, Julien Magnien 2, Ernst Kozeschnik 3, DietmarKieslinger 4, Werner Ecker 21 Technical University Vienna / Materials Center Leoben GmbH2 Materials Center Leoben GmbH3 Technical University Vienna4 ZKW Electronics GmbH

Transgranular Crack Propagation in Thermal Cycling of SnAgCu SolderJoints

14:3020mn

Andreas Lövberg, Per-Erik Tegehall, RISE IVF, Mölndal, Sweden

Improved QFN thermal cycling reliability using low melting temperatureSnBi based solder paste LMPA-Q

14:5020mn

Bart Vandevelde 1, Riet Labie 1, Ralph Lauwaert 2, Daniel Werkhoven 2, DanielVanderstraeten 3, Eddy Blansaer 3, Jonas Lannoo 4, Davy Pissoort 41 Imec, Leuven, Belgium2 Interflux Electronics, Gent, Belgium3 ON Semiconductor Belgium, Oudenaarde, Belgium4 KU Leuven Bruges Campus, Brugge, Belgium

Effect of Stress State on Fatigue Characterization of SAC305 Solder Joints15:1020mn

Abhishek Deshpande, Hannah Kaeser, Abhijit Dasgupta, University of Maryland,College Park, USA

Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading

15:3020mn

M. Kuczynska 1, Y. Maniar 2, N. Schafet 3, U. Becker 3, S. Weihe 41 Robert Bosch GmbH, Automotive Electronics Division, Stuttgart, Germany; MaterialsTesting Institute (MPA) University of Stuttgart, Stuttgart, Germany2 Robert Bosch GmbH, Corporate Research Division, Stuttgart, Germany; Institute forMaterials Testing, Materials Science and Strength of Materials (IMWF) UniversityStuttgart, Stuttgart, Germany3 Robert Bosch GmbH, Automotive Electronics Division, Stuttgart, Germany4 Materials Testing Institute (MPA) University of Stuttgart, Stuttgart, Germany



— Session 3MEMS structures - I

14:00 Monday March 25 2019Chaired by Alberto Corigliano and Nancy IwamotoSalon 4

Simulation and Design of an Optical Accelerometer14:0030mn

Veronique Rochus, Wouter Westerveld, Bruno Figeys, Xavier Rottenberg, RoelofJansen, imec

Finite element method simulation of graphene phononic crystals with cross-shaped nanopores

14:3020mn

Seiya Kubo 1, Marek E. Schmidt 1, Manoharan Muruganathan 1, Hiroshi Mizuta 21 Japan Advanced Institute of Science and Technology2 Japan Advanced Institute of Science and Technology, Hitachi Cambridge Lab, UK

Enhanced Fluid Flow by Wavelike Excitation of a Micromechanical BendingActuator

14:5020mn

Wolfgang Hölzl, Regine Behlert, Matthias Gehring, Gabriele Schrag, TechnicalUniversity of Munich, Munich, Germany

Optical micro-machined ultrasound sensors with a silicon photonicresonator in a buckled acoustical membrane

15:1020mn

Wouter J. Westerveld 1, Suzanne M. Leinders 2, Paul L. M. J. van Neer 3, H. PaulUrbach 2, Nico de Jong 2, Martin D. Verweij 2, Xavier Rottenberg 1, Veronique Rochus 11 Imec, Leuven, Belgium2 Delft University of Technology, Delft, The Netherlands3 TNO, Den Haag, The Netherlands

Modelling of display-compatible piezoelectric micromachined ultrasonictransducers for haptic feedback

15:3020mn

Alexandre Halbach, Pieter Gijsenbergh, Yongbin Jeong, Margo Billen, ChristopherChare, Hang Gao, Guilherme Brondani Torri, David Cheyns, Xavier Rottenberg,Veronique Rochus, IMEC



Session 4 — Thermal Behavioral Modelling

14:00Monday March 25 2019Chaired by René Metasch and Péter Pálovics Salon 2-3

Analysis of Self Heating Effect in Vertical-channel Field Effect Transistor14:0030mn

Ilho Myeong 1, Jongwook Jeon 2, Myounggon Kang 3, Hyungcheol Shin 11 Inter-University Semiconductor Research Center (ISRC) and School of ElectricalEngineering, Seoul National University2 Department of Electronics Engineering, Konkuk University3 Department of Electronic Engineering, Korea National University of Transportation

Numerical simulation of reflow soldering14:3020mn

Michael Stadler, Infineon

Simulation of self-heating of printed interconnects for thermal design14:5020mn

Daniel Bülz, Petra Streit, Roman Forke, Thomas Otto, Fraunhofer Institute ForElectronic Nanosystems, Chemnitz, Germany

Advanced Electro-Thermal Analysis of IGBT Modules in a Power ConverterSystem

15:1020mn

Xiang Li 1, Daohui Li 1, Fang Qi 2, Matthew Packwood 1, Haihui Luo 2, Guoyou Liu 2,Yangang Wang 2, Xiaoping Dai 21 Power Semiconductor R2 CRRC Times Electric Co. Ltd, Zhuzhou, China

Modelling of thermal processes in thin-film BAW resonators 15:3020mn

Alexander Kozlov, Omsk State Technical University, Omsk, Russia

15:50 Coffee break



— Session 5Prognostics and health monitoring

16:30 Monday March 25 2019Chaired by Abhijit Dasgupta and JiaJie FanSalon 5-6

Smart textiles: how electronics merge into our clothing16:3030mn

Kaspar Jansen, Delft University of Technology, Department of Design Engineering, TheNetherlands

Degradation Prediction of Electronic Packages using Machine Learning17:0020mn

Alexandru Prisacaru 1, Ernesto Oquelis Guerrero 1, Przemyslaw Jakub Gromala 1,Bongtae Han 2, Guo Qi Zhang 31 Robert Bosch GmbH2 University of Maryland College Park3 Delft University of Technology

A Combined Methodology to Include System Effects in Board-Level StressSimulations

17:2020mn

Rainer Dudek 1, Marcus Hildebrandt 1, Sven Rzepka 1, Ralf Döring 2, Lutz Scheiter 2,Bastian Tröger 3, Mengjia Zhang 4, Reinhold W. Ortmann 51 Fraunhofer ENAS, Dept. MMC, Chemnitz, Germany2 CWM GmbH, Chemnitz, Germany3 FRT GmbH, Bergisch-Gladbach, Germany4 Robert Bosch GmbH, AE/ESI4.1, Reutlingen, Germany5 Continental Automotive France SAS, France

A Probabilistic approach to the robust thermo-mechanical analysis of BallGrid Array Solder Joints

17:4020mn

Ayda Halouani 1, Abel Cherouat 2, Mariem Miladi Chaabane 3, Mohamed Haddar 31 Charles Delaunay Institute, GAMMA3, University of Technology of Troyes, France andLaboratory of Mechanics, Modeling and Production, National School of Engineers ofSfax, Tunisia2 Charles Delaunay Institute, GAMMA3, University of Technology of Troyes, France3 Laboratory of Mechanics, Modeling and Production, National School of Engineers ofSfax, Tunisia

Development of a Modular Test Setup for Reliability Testing under HarshEnvironment Conditions

18:0020mn

Laura Wambera 1, Karsten Meier 1, Robert Höhne 1, Björn Böhme 2, Christian Götze 2,Jens Paul 2, Marcel Wieland 2, Karlheinz Bock 11 Technische Universität Dresden, Institute of Electronic Packaging Technology,Dresden, Germany2 GLOBALFOUNDRIES, Dresden Module One LLC



Session 6 — Multi-Physics process models

16:30Monday March 25 2019Chaired by Dag Andersson and Cadmus Yuan Salon 2-3

Micro-Transfer-Printing and Potential Process Optimizations by FEA16:3030mn

Kjell Buehler 1, Georg Lorenz 1, Marcel Mittag 1, Uwe Krieger 2, Niclas Heise 2,Sebastian Wicht 2, Ronny Gerbach 3, Falk Naumann 11 Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale),Germany2 X-FAB MEMS Foundry GmbH, Erfurt, Germany3 Ernst-Abbe-Hochschule, Department of SciTec, Jena, Germany

Numerical modelling of magnetic nanoparticle dynamics in microfluidicdevices

17:0020mn

Péter Pálovics, Márta Rencz, Budapest University of Technology and Economics,Department of Electron Devices, Hungary

Modeling temperature dependent chemical reaction of intermetalliccompound growth

17:2020mn

Aleksandr Morozov 1, Alexander Freidin 2, Wolfgang Müller 1, Alexander Semencha 2,Mikhail Tribunskiy 21 Berlin Institute of Technology, Berlin, Germany2 Peter the Great St. Petersburg Polytechnic University, St. Petersburg, Russia

Virtual Prototyping and Simulation of Electro-Thermal Systems17:4020mn

Torsten Hauck, Vibhash Jha, NXP Semiconductors



— Session 7Package level thermo-mechanicalassessment

16:30 Monday March 25 2019Chaired by Tamara Bechtold and Karsten MeierSalon 4

Prediction of robustness of packages by cohesive zone finite elementsimulation and verification by non-destructive tests

16:3030mn

Reinhard Pufall 1, Daniel May 2, Bernhard Wunderle 2, Georg M. Reuther 1, NadinePflügler 1, Dominik Udiljak 11 Infineon Technologies AG, Am Campeon 1-15, 85579 Neubiberg, Germany2 Technische Universität Chemnitz, Reichenhainer Str. 70, 09126 Chemnitz, Germany

Advanced Mixed-Mode Bending Test: Influence of the Surface Topographyon the Fracture Behaviour of an EMC to Copper Lead Frame Bi-MaterialInterface

17:0020mn

M. Schulz 1, R. Mroßko 1, B. Wunderle 2, M. Abo Ras 11 AMIC Angewandte Micro-Messtechnik GmbH2 Chemnitz University of Technology

Package Level Warpage Simulation of a Fan Out System in Board Module17:2020mn

M.Frewein 1, T. Krivec 1, Q. Tao 1, J. Zündel 1, J. Rosc 2, M. Gschwandl 3, Peter F. Fuchs 31 ATS - Austria Technologie und Systemtechnik Aktiengesselschaft, Leoben, Austria2 Materials Center Leoben Forschungs GmbH, Leoben, Austria3 Polymer Competence Center Leoben GmbH, Leoben, Austria

Numerical estimation of local load during manufacturing process in hightemperature PCB resins based on viscoelastic material modelling

17:4020mn

Michael Schmidt 1, Youssef Maniar 1, Alexander Kabakchiev 1, Roumen Ratchev 1,Michael Guyenot 1, Hans Walter 2, Martin Schneider-Ramelow 31 Robert Bosch GmbH, Corporate Sector Research and Advance Engineering,Renningen, Germany2 Fraunhofer IZM, Department System Integration and Interconnection Technologies,Berlin, Germany3 Technical University of Berlin, Faculty IV – Electrical Engineering and ComputerScience, Germany

Material Model and Simulation of Multilayer-AgSn-Foils for Transient-Liquid-Phase Bonding of Sensor Elements

18:0020mn

Markus Feißt, Cong Li, Jürgen Wilde, University of Freiburg - IMTEK, Department ofMicrosystems Engineering, Laboratory of Assembly and Packaging

19:00 Dinner downtown


Tuesday March 26 2019

Session 8 — System level mechanical reliability

08:30Tuesday March 26 2019Chaired by Jeff Suhling and Alexandru Prisacaru Salon 5-6

Accelerated Pump Out Testing for Thermal Greases08:3030mn

B. Wunderle 1, D. May 1, J. Heilmann 1, J. Arnold 1, J. Hirscheider 1, Y. Li 1, J. Bauer 2, R.Schacht 3, M. Abo Ras 41 TU Chemnitz, Germany2 Fraunhofer IZM, Berlin, Germany3 BTU Cottbus, Germany4 Berliner Nanotest

Automated Method Using Finite Element Simulation to Identify MicroviaStacks at Risk of Separation in Complex PCB Designs

09:0020mn

Kourosh Kalayeh, Natalie Hernandez, Craig Hillman, David Dang, Nathan Blattau, DfRSolutions, Beltsville, MD, USA

Layout Optimization for CMOS Interconnects for Heating, Cooling andImproved Stress Distribution

09:2020mn

Verena Hein 1, Kirsten Weide-Zaage 2, Xi Yang 21 X-FAB Semiconductor Foundries AG, Erfurt Germany2 RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz UniversitätHannover, Germany



— Session 9Thermal Modelling and Characterization

08:30 Tuesday March 26 2019Chaired by Marcus Schulz and Mahdi SadeghiniaSalon 4

The effect of the thermal conductivity of room-temperature-vulcanizingsilicone used for boiling heat transfer

08:3030mn

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Sanyo-Onoda City University, Japan

Measurement and Simulation of Test Structures Dedicated to theInvestigation of Heat Diffusion at Nanoscale

09:0020mn

Marcin Janicki, Jedrzej Topilko, Artur Sobczak, Piotr Zajac, Piotr Pietrzak, AndrzejNapieralski, Lodz University of Technology

Migration of flow induced hotspot with heat spreader integratedmicrochannel subjected to asymmetric hot spots: A multiphysics approach

09:2020mn

G Narendran, N Gnanasekaran, D Arumuga Perumal, National Institute of TechnologyKarnataka, Surathkal, India

New Method to Determine the Local Joule Heat Distribution in FastSwitching Device

09:4020mn

Christian Römelsberger, Martin Hanke, CADFEM GmbH



Session 10 — Solid State Lighting

08:30Tuesday March 26 2019Chaired by Geneviève Martin and Bernd Schwarz Salon 2-3

Solder interconnect degradation with irregular joint shape08:3030mn

X.J.Zhao 1, H. De Vries 1, R. Engelen 1, P. Watté 2, G. van Hees 11 Signify (Philips Lighting) Research, Eindhoven, The Netherlands2 Signify LED Electronics, Eindhoven, The Netherlands

Lifetime Prediction of Ultraviolet light-emitting diodes with acceleratedWiener degradation process

09:0020mn

Zhou Jing 1, Mesfin Seid Ibrahim 2, Jiajie Fan 1, Xuejun Fan 3, Guoqi Zhang 41 College of Mechanical and Electrical Engineering, Hohai University, Changzhou213022, China2 Department of Industrial and System Engineering, The Hong Kong PolytechnicUniversity, Hung Hom, Hong Kong3 Department of Mechanical Engineering, Lamar University, Beaumont, TX 77710, USA4 EEMCS Faculty, Delft University of Technology, Delft 2628, the Netherlands

Modelling Thermo-mechanical Stress in GaN-LEDs Soldered on CopperSubstrate with simulations validated by Raman experiments

09:2020mn

Fosca Conti 1, Raffaella Signorini 1, Enrico Brugnolotto 1, Gordon Elger 2, Sri KrishnaBhogaraju 2, E Liu 21 Department of Chemical Sciences, University of Padova, Italy2 Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Germany

Failure Identification in LED packages by Transient Thermal Analysis andCalibrated FE Models

09:4020mn

Alexander Hanss, E Liu, Muhammad Rizwan Abdullah, Gordon Elger, Institute forInnovative Mobility, Technische Hochschule Ingolstadt

10:20 Coffee break



— Session 11Dialog session (posters)

10:20 Tuesday March 26 2019Chaired by Sven Rzepka and Mike Röllig. Vote for best poster.Boardroom

PID 8Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing

Raj Sekar Sethu 1, Lars Bergmann 1, Marco Erstling 1, Peter Lammert 1, Angela Fahr 1,Hansika Jayawardana 21 X-FAB Semiconductor Foundries AG, Kuching Sarawak, Malaysia2 Swinburne University of Technology Sarawak, Kuching Sarawak, Malaysia

PID 9Determination of BEOL Aluminum-Copper Constitutive Equation using FEASimulation and Response Surface Methodology

Verena Hein 1, Raj Sekar Sethu 2, Hansika Jayawardana 3, Kok Heng Soon 3, Almon Wei-Yen Chai 31 X-FAB Semiconductor Foundries AG, Erfurt, Germany2 X-FAB Semiconductor Foundries AG, Kuching, Malaysia3 Swinburne University of Technology Sarawak Campus, Kuching, Malaysia

PID 11Electromigration Effects in Corroded BGA

Kirsten Weide-Zaage 1, Alexandrine Guédon-Gracia 2, Hélène Frémont 21 RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz UniversitätHannover, Hannover, Germany2 Laboratoire IMS, CNRS UMR 5218, Université de Bordeaux, Talence, France

PID 13High Power Terminal Vibrational Analysis in Response to ExperimentalQualification Results

Matt Packwood, Daohui Li, Paul Mumby-Croft, Xiang Li, Dynex Semiconductor, Lincoln,United Kingdom

PID 27A SPICE-based Transient Thermal-Electronic Model for LEDs

Bo Sun, Guangdong University of TechnologyJiajie Fan, Hohai UniversityXuejun Fan, Lamar UniversityGuoqi Zhang, Delft University of Technology



PID 29Electrical and optical characterization of MoS2 thin film transistors and theeffect of strain on their performances

Zuopeng Qu 1, Hongyu Tang 2, Huaiyu Ye 3, Xuejun Fan 4, Guoqi Zhang 21 Renewable Energy School, North China Electric Power University, Beijing, China2 Delft Institute of Microsystems and Nanoelectronics, Delft University of Technology,Delft, The Netherlands3 Key Laboratory of Optoelectronic Technology and Systems, Education Ministry ofChina, Chongqing University, Chongqing, China4 Department of Mechanical Engineering, Lamar University, Beaumont, Texas, USA

PID 32Online prognostication of remaining useful life for random discharge lithium-ion batteries using a gamma process model

Zeyu Wu, Zili Wang, Cheng Qian, Bo Sun, Yi Ren, Qiang Feng, Dezhen Yang, School ofReliability and Systems Engineering, Beihang University, Beijing, China

PID 39Comparison of the thermal-mechanical behavior of a soldered stackinfluenced by the choice of the solder

Vargas Ramiro, Gonda Viktor, Obuda University

PID 46Numerical and experimental study of a novel body-mounted piezoelectricenergy harvester based on synchronized multi-magnet excitation

Arunas Kleiva, Rolanas Dauksevicius, Kaunas University of Technology, Kaunas,Lithuania

PID 47Modelling and Simulation of Glass Frit Bonding of Silicon Wafers

Seyed Amir Fouad Farshchi Yazdi 1, Matteo Garavaglia 2, Aldo Ghisi 1, AlbertoCorigliano 11 Politecnico di Milano, Milan, Italy2 ST Microelectronics, Agrate Brianza, Italy

PID 48Analytical modelling of MEMS Z-axis comb-drive accelerometer

Cezary Maj, Michał Szermer, Piotr Zając, Piotr Amrozik, Lodz University of Technology

PID 65Coupled Electro-mechanical Simulation of Capacitive MEMS Accelerometerfor Determining Optimal Parameters of Readout Circuit

Piotr Zajac, Michał Szermer, Piotr Amrozik, Cezary Maj, Grzegorz Jabłoński, LodzUniversity of Technology

PID 81Warpage Behavior Analysis of Semiconductor Package Including Chip

Kento Kariya, Naoaki Tsurumi, Takuji Maekawa, Mitsuru Morimoto, Noriyuki Masago, Research and Development Center, ROHM Co., Ltd. Kyoto, Japan



PID 104Design for Package Miniaturization for a MEMS Pressure Sensor

Roseanne Duca, STMicroelectronics Malta (Ltd)Marco Omar Ghidoni, STMicroelectronics Italy (Ltd)

PID 109Degradation of Bisphenol-A-polycarbonate (BPA-PC) Optical Lenses underSimulated Harsh Environment Conditions

Maryam Yazdan Mehr , Willem van Driel, Kouchi Zhang, EEMCS Faculty, DelftUniversity of Technology, The Netherlands

12:30 Lunch



Session 12 — Electronics reliability under vibrationloadings

14:00Tuesday March 26 2019Chaired by Ehmad Poshtan and Susan Zhao Salon 5-6

Effect of Nonlinear Interactions of Electronic Assemblies in Response toMultiaxial Vibration Excitation

14:0030mn

Xiao Lin, Abhijit Dasgupta, University of Maryland, College Park, United States.

Effect of Material properties and Boundary condition on PCB frequencies inelectronic control unit

14:3020mn

Mahdi Sadeghinia 1, Chalukya Chincholi 2, Alexander Udyansky 3, Andreas Fischer 11 Robert Bosch GmbH2 Robert Bosch Engineering and business solutions private limited-India3 Bosch Automotive Products (Suzhou) Co. Ltd-China

Harmonic Vibration Durability Tests on Lead-Free Solder Joints at DifferentIsothermal Conditions

14:5020mn

Karsten Meier 1, David Leslie 2, Tamara Storz 2, Abhijit Dasgupta 2, Karlheinz Bock 11 Technische Universität Dresden, Institute of Electronics Packaging Technology,Dresden, Germany2 Center for Advanced Life Cycle Engineering (CALCE), Mechanical EngineeringDepartment, University of Maryland, College Park, USA



— Session 13Multiphysics / Scale analysis - includingmoisture, electromigration, etc.

14:00 Tuesday March 26 2019Chaired by Bart Vandevelde and Gordon ElgerSalon 4

Resistor-Capacitor Approach for Modelling of Temperature and HumidityResponse Inside Electronic Enclosures

14:0030mn

Zygimantas Staliulionis 1, Sankhya Mohanty 2, Jesper Henri Hattel 21 FORCE Technology, Product Compliance, Hørsholm, Denmark2 Process Modelling Group, Department of Mechanical Engineering, TechnicalUniversity of Denmark, Lyngby, Denmark

Computational Mechanics for Flexible and Wearable Electronics14:3020mn

ZhuangJian Liu, Institute of High Performance Computing, A*STAR Research Entities

Application of Artificial and recurrent neural network on the steady-stateand transient finite element modeling

14:5020mn

Cadmus Yuan 1, Yu-Jun Hong 1, Chang-Chi Lee 1, Kou-Ning Chiang 2, Jin-Huang Huang 11 Department of Mechanical and Computer-aided Engineering, Feng Chia University,Taichung, Taiwan2 Department of Power Mechanical Engineering, National Tsing Hua University,Hsinchu, Taiwan

15:15 Coffee break



Session 14 — MEMS structures - II

15:45Tuesday March 26 2019Chaired by Véronique Rochus and Rainer Dudek Salon 2-3

Automatic assembly of multiscale models and its application to a family ofhomogenized models of wave propagation through interfaces having aperiodic structure

15:4530mn

Michel Lenczner, Walid Belkhir, Nicolas Ratier, Nhat Binh Trinh, Bruno Cavallier, FEMTO-ST Institute, University of Bourgogne Franche-Comté

Simulation Methodology for Active Semiconductor Devices in MEMS16:1520mn

Mike Schwarz, Volkmar Senz, Arne Dannenberg, Wolfgang Feiler, Friedjof Heuck,Thomas Friedrich, Christian Sorger, Jochen Franz, Robert Bosch GmbH

Simulation-Based Design of an Electrostatically Driven Microactuator forFluid Transport in Mobile Applications

16:3520mn

M. Seidl 1, M. Gehring 1, U. Krumbein 2, G. Schrag 11 Chair for Physics of Electrotechnology, Technical University of Munich, Munich,Germany2 Infineon Technologies AG, Neubiberg, Germany

Reconstructing mid-air acoustic holograms using PMUT arrays: a simulationstudy

16:5520mn

Hang Gao, Pieter Gijsenbergh, Shengping Mao, Alexandre Halbach, Yongbin Jeong,David Cheyns, Xavier Rottenberg, Veronique Rochus, Imec, Leuven, Belgium

Modelling, Simulations and Performance Analysis of MEMS vibratingGyroscope in Coventor MEMS Environment

17:1520mn

Jacek Nazdrowicz, Andrzej Napieralski, Lodz University of Technology, Lodz, Poland



— Session 15EU projects

15:45 Tuesday March 26 2019Chaired by Kirsten Weide-ZaageSalon 5-6

Delphi4LED EU project15:4530mn

Genevieve Martin, Signify, Eindhoven, The Netherlands

TRACE EU project16:1530mn

Rainer Dudek, Fraunhofer ENAS, Dept. MMC, Chemnitz, Germany

EuroPAT-MASIP16:4530mn

Sven Rzepka, Fraunhofer Institute for Electronic Nano Systems, Chemnitz, Germany

IoSense EU project17:1530mn

Willem van Driel, Signify (Philips Lighting), Eindhoven, The Netherlands



Session 16 — High power applications

15:45Tuesday March 26 2019Chaired by Kaspar Jansen and Hélène Frémont Salon 4

Vacancy Transport, Mechanical Stress, and Self-Diffusion underElectromigration

15:4530mn

Xuejun Fan 1, Zhen Cui 2, Kasemsak Kijkanjanapaiboon 1, G.Q. Zhang 21 Department of Mechanical Engineering, Lamar University, Beaumont, USA2 Department of Microelectronics, Delft University of Technology, The Netherlands

Simulative Comparison of Polymer and Ceramic Encapsulations on SiC-MOSFET Power Modules under Thermomechanical Load

16:1520mn

Felix Wagner 1, Youssef Maniar 1, Martin Rittner 1, Stefan Kaessner 1, MichaelGuyenot 1, Lukas Lang 1, Bernhard Wunderle 21 Robert Bosch GmbH, Corporate Research and Advance Engineering, Renningen,Germany2 TU Chemnitz, Institute for Materials and Reliability of Microtechnology Systems,Chemnitz, Germany

Micro Bending Test on Double Cantilever Beams: A specimen-centredapproach to accurate determination of the visco-plastic properties ofSintered Silver for Power Electronics applications

16:3520mn

Uwe Zschenderlein 1, Markus Klingler 2, Jörg Arnold 1, Mario Baum 3, Marie Weißbach 3,Marco Schaal 2, Bernhard Wunderle 11 Chemnitz University of Technology, Chemnitz, Germany2 Robert Bosch GmbH Reutlingen, Germany3 Fraunhofer Institute ENAS, Chemnitz, Germany

Methodology for Correlation of Porosity and Mechanical Properties of SilverSintered Joints in Electronics

16:5520mn

R. Metasch 1, M. Roellig 1, P. Knoch 1, C. Weinmann 1, K. Meier 21 Fraunhofer Institute for Ceramic Technologies and Systems2 Technische Universität Dresden, Institute of Electronic Packaging Technology

18:00

Exhibitor and Sponsor special session

Tuesday March 26 2019 Chaired by Willem van Driel

Salon 5-6

18:00 Bosch / CADFEM / Dynardo / FRT-CWM / Huawei / Siemens

19:15 Dinner-cocktail party at venue, until 21h15



19:45

EuroSimE Steering Committee, open to everyone. 60mnmax, during the cocktail party.

Tuesday March 26 2019Willem van Driel

Salon 2+3

19:45 The EuroSimE Steering Committee is open to anybody. Among theaddressed topics, it will select the local organiser and city where to holdEuroSimE 2020 (please prepare pitch)


Wednesday March 27 2019

Session 17 — Technical keynotes - II

08:30Wednesday March 27 2019Chaired by Bernhard Wunderle and Maryam Yazdan Mehr Salon 4

Air-coupled array of PMUTS at 100 kHz with PZT Active Layer: MultiphysicsModel and Experiments

08:3030mn

Gianluca Massimino 1, Alessandro Colombo 1, Raffaele Ardito 1, Fabio Quaglia 2,Francesco Foncellino 3, Alberto Corigliano 11 Department of Civil and Environmental Engineering, Politecnico di Milano, Italy2 Analog, MEMS and Sensors Group, ST Microelectronics, Cornaredo, Italy3 AMS, RnD Group, ST Microelectronics, Arzano, Italy

Modeling Based Development and Challenges of Key ElectronicManufacturing Chain Equipment

09:0030mn

Sheng Liu, Zhiyin Gan, Bin Gao, Institute of Technological Sciences, Wuhan University,China

Reliabilty of electronic materials when subjected to aging conditions09:3030mn

Mohammad Motalab, Bangladesh University of Engineering and Technology (BUET),Dhaka, Bangladesh Munshi M. Basit, Georgia Southern University, Statesboro, GA, USAJeffrey C. Suhling, Auburn University, Auburn, AL, USA

10:00

Awards ceremony

Wednesday March 27 2019 Chaired by Sven Rzepka

Salon 4

10:00 Best and outstanding papers and posters

10:30 Coffee break



— Session 18IC level thermo-mechanical analysis

11:00 Wednesday March 27 2019Chaired by Reinhard Pufall and Cheng QianSalon 4

Simulations in Terms of Radiation Effects on different BEOL MaterialSystems

11:0030mn

Kirsten Weide-Zaage 1, Guillermo Paya-Vaya 2, Philemon Eichin 11 RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz UniversitätHannover2 AS, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover

BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses11:3020mn

Juergen Auersperg 1, Ellen Auerswald 2, Dietmar Vogel 2, Sven Rzepka 21 Micro Materials Center at Fraunhofer ENAS, Chemnitz and Berliner Nanotest undDesign GmbH, Berlin und Chemnitz, Germany2 Micro Materials Center at Fraunhofer ENAS, Chemnitz, Germany

Study of wafer warpage for Fan-Out wafer level packaging: finite elementmodelling and experimental validation

11:5020mn

Abdellah Salahouelhadj, Mario Gonzalez, Kris Vanstreels, Arnita Podpod, AlainPhommahaxay, Kenneth June Rebibis, Eric Beyne, IMEC, Leuven, Belgium

Characterization of Stochastically Distributed Voids in Sintered Nano-SilverJoints

12:1020mn

Zhongchao Sun, Zili Wang, Cheng Qian, Yi Ren, Qiang Feng, Dezhen Yang, Bo Sun, Beihang University



Session 19 — Advanced experimental analysis techniques

11:00Wednesday March 27 2019Chaired by Michel Lenczner and Xuejun Fan Salon 2-3

Direct Measurements of Underfill Local Strain Using Confocal Microscopyand Digital Image Correlation

11:0030mn

Ying Yang, Papa Momar Souare, Julien Sylvestre, Institut Interdisciplinaire d’InnovationTechnologique (3iT), University of Sherbrooke, Canada

Plastic deformation and failure modes of moulding compounds duringindentation loading and their importance for the quantitativecharacterisation of adhesion

11:3020mn

Nadine Pflügler 1, Georg M. Reuther 1, Michael Goroll 1, Reinhard Pufall 1, BernhardWunderle 21 Infineon Technologies AG, Neubiberg, Germany2 Technische Universität Chemnitz, Chemnitz, Germany

Measurements and Simulations of the Creep Strain in Flip Chip Dies11:5020mn

Florian Schindler-Saefkow 1, Florian Rost 2, Sven Rzepka 11 Fraunhofer ENAS, Micro Materials Center, Chemnitz, Germany2 TU Chemnitz, Germany

Warpage Investigation of PCB Embedding Technology – Determination ofRelevant Modelling Parameters by Means of FEM and Experiments

12:1020mn

Florian Rost 1, Saskia Huber 1, Hans Walter 1, Marius van Dijk 1, Thomas Cramer 2,Johannes Jaeschke 1, Olaf Wittler 1, Martin Schneider-Ramelow 31 Fraunhofer Institute for Reliability and Microintegration (IZM) , Berlin, Germany2 ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH, Hannover,Germany3 Technische Universität Berlin, Berlin, Germany

12:30 Lunch

13:30

Visit of Robert Bosch plant of Salzgitter




13:30 Departure by bus from venue

16:30 Return to venue

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short course: power electronics packaging (c-liu part 1)

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