shim bonding (connecting the dots)
TRANSCRIPT
Connecting the dots between the past, present & future of bonding Ryan French & Haroon Mohmand, 2013.08.29
2013-08-29 TRELLEBORG GROUP 2
2013-08-29 TRELLEBORG GROUP 3
bond /bänd/ verb joined securely to another thing, esp. by an adhesive, a heat process, or pressure
2013-08-29 TRELLEBORG GROUP 4
de·bond /de-bänd/ verb occurs when an adhesive stops sticking (adhering) to an adherend or substrate material
2013-08-29 TRELLEBORG GROUP 5
6 2012-12-06 TRELLEBORG GROUP
2013-08-29 TRELLEBORG GROUP 7
bond (re-defined) /bänd/ verb
joined securely to another thing, esp. by an adhesive, a heat process, or pressure
passes the newly developed tap test (audible feedback must be in such a way as to not allow dead space sound in pre-defined areas outside of backplate features)
passes adhesive coverage (or disturbance?) test where the shim is removed and an approximated surface area determined by overlaying a circle dot matrix and counting the area that shows no visual adherence
2013-08-29 TRELLEBORG GROUP 9
Rubber (noise damping)
TRELLEBORG GROUP 10
Shim With Phenolic (1980’s – 1990’s)
Steel (structural integrity)
Phenolic Adhesive (Structural Bond)
2013-08-29
Rubber (noise damping)
TRELLEBORG GROUP 11
Shim With PSA (2000- present)
Steel (structural integrity)
Pressure Sensitive Adhesive (noise damping, not dependent on bond integrity)
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Temperature Effects on PSA’s
TRELLEBORG GROUP 12
Adhesive Temperature + -
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TRELLEBORG GROUP 13
Daily Operating Temperatures
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TRELLEBORG GROUP 14 2013-08-29
TRELLEBORG GROUP 15
0%
1%
2%
3%
4%
5%
6%
1980 - 2000 2000 - 2008 2008 - present
Acceptable Noise Percentage
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TRELLEBORG GROUP 16
Simple pad design • No insulator retention features • No insulator stress relief cuts • No bond surface area concerns • No pad/insulator shape concerns
Bonding substrate (backplate) • Sandblasted • Zinc coated • Liquid paint
Complex pad design • Large / multiple insulator retention features • Added insulator stress relief cuts • Bond surface area maximized • Shapes evaluated for bond integrity
Bonding substrate (backplate) • Liquid paint • Some powder paint
(1980’s – 1990’s)
(2000 – present)
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2012-12-06 TRELLEBORG GROUP 17
TRELLEBORG GROUP 18
Complex pad design
• Limited insulator retention features • Very few insulators with relief cuts • Bond surface area????? • Pad/Insulator shapes evaluated for bond integrity?????
Bonding Substrate (Backing Plate)
• 100% powder paint
(today)
2013-08-29
TRELLEBORG GROUP 19
Today’s end customers expect quieter brakes?
• Which is leading to warranty claims for even minor noise or potential noise.
• Is this leaving the investigation team puzzled, so they report all potential causes?
Lazy pad/insulator designs?
• Tighter packaging • Limited and/or poor retention features • Not utilizing relief slots • Limited bonding surface area • Poor pad/insulator shape
2013-08-29
2012-12-06 TRELLEBORG GROUP 20