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Kyoungin Kim

SGH-Q200 Service Training

R&D Group 3, Mobile Comm. Div.Samsung Electronics

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CONTENTS

General Information How to assemble the SGH-Q200 Block Diagram and Schematics Circuit Description Phone test

Download, Autocal, IMEI , Repair PGM.. Power Levels and Waveforms on PBA Troubleshooting Guide (Refer to SVC Manual)

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Frequency range:

General Information

EGSM DCS

TX 880~915MHz 1710~1785MHz

RX 935~960MHz 1805~1880MHz

Channel bandwidth: 200kHz

Fundamental frequency:13MHz

Intermediate frequenciesTx IF: 270MHz(G), 135MHz(D)

Rx IF: 1’st IF ->225Hz, 2’nd IF -> 45MHz

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General Information

Solution : Agere system(Lucent technology)

Design : Dual folder

LCD : 128 x 128

Memory : 48M/4M

Size and Weight :85(H)x47(W)x19.8(D), 90g

Funtion : GPRS Class 8, EFR/FR, WAP, GAME ..etc

Operating Time

Talk TIME Stand by TIME

SLIM(720mA) Up to 150min Up to 70 hr

STANDARD(900mA)

Up to 180min Up to 85 hr

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The chipset for SGH-Q200Trident : Baseband processorCSP : conversion signal processorPSC2005 : Power Management ICLRS1337 : Flash Memory(SRAM)Atmel : Flash MemoryAPCIC : Auto Power Control ICBRIGHT3 : Dual band Tranceiver

General Information

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Exploded View of SGH-Q200

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Top View of SGH-Q200

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Bottom View of SGH-Q200

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Block Diagram (Radio Part)

Antenna

FEM

LNA

LNA

RF

FILTER

RF

FILTER

LPF

LPF

RX

SAW

RX

SAW

MIXER 1

MIXER 2

IF

SAW

225MHz270MHz

LC

FILTER

1/2

1/2

IF VCO

RF

SYNTH

IF

SYNTH

RF VCO

TX VCO

LOOP

FILTERPD

I,Q

MODULATOR

1080MHz

GSM :1150MHz~1185MHz

DCS:RX:1580MHz~1655MHz

TX:1575MHz~1650MHz

DCS:270MHz

GSM:540MHzSWITCH

1/2

1/2

45MHz

PGAI,Q

DEMOD

SERIAL DATA

INTERFACE

1/6

GSM:270MHz

DCS:135MHz

GSM:270MHz

DCS:135MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

PAM

GSM:925MHz~960MHz

DCS:1805MHz~1880MHz

I,Q

I,Q

CSP1089

OCTL

SIGNALS

TRIDENT

RF

DRIVER

DSP JTAG

DAI

DSP16000

ARM7TDMI

UIAUDIO

SERIAL

DATA,

CLK,

LE

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Block Diagram (Baseband Part)

TRIDENT

B'D B'D con.

Audio

Keypad

LCD

Memory part

SIM0/1

X-TAL32.768KHz

RF SOLUTION

- RF IC : BRIGHT3- PAM- MAIN VCO- TX VCO- IF VCO

GPIO

POWER

(DC/DC,CHARGER)

X-TAL

13MHz

RS232CSP1089

Audio Part

LCD

KEYBOARD

SRAM

(4M)

FLASHROM

(16M*1)

EMI(External Memory

Interface)

TXIPTXINTXQPTXQNRXIPRXINRXQPRXQNSERCKSERLESERDARFOVLTXPOCTL

<RF DIRVER>TXI/QRX I/QTXPSERCKSERLESERDA

OCTL[1:11]

IORWN

AB[8:0]DB[15:0]INT1IRQxPAxRSTB

IORWN

AB[8:0]DB[15:0]INT1IRQxPAxRSTB

ARM

JTAG/ICE

DAICKDAIRNDAIDODAIDI

DAIDSPJTAG JTAG

DSPJTAG

IRDA

GPRS

ACC

PPI(ProgrammablePeripheral I/O)

RTC

SMART

CARD

JTAG/ICE

* ACC : Asynchronous Communications Controller

DSP16000

ARM7TDMI

FLASHROM

(32M*1)

RF PARTBase Band part

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Circuit Description: Front-End

1. Antenna (ANT1002) Transmitting and Receiving the information

desired from air interface.

2. RF Test Switch (CN1001) This is for adjusting and testing the

handset in conjunction with the test equipment such as HP8922M or HP8960.

3. Diplexer (U1006) It operates such like a combination of Rx

filter and Tx filter, and provides agreeable isolation between Tx and Rx.

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Circuit Description: Rx

1. LNA It amplifies weak signal by 14~20dB without

increasing the noise significantly. This provides “Step Gain AGC” of ~35dB so that it supplements narrow dynamic range of Rx AGC.

2. RF Rx SAW Filter (F901:GSM , F903:DCS) It has the bandwidth of Rx frequencies, and

suppresses interferers which can do affect the IF signal

3. 1st Down-conversion Mixer Received RF carrier is converted to 1st IF (225MHz).

Local signal is needed for frequency mixing. It has ~9dB conversion gain, in general.

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Circuit Description: Rx

1. IF SAW Filter (F902) Center frequency is 225MHz. It suppresses

unwanted image signals made in the 1st mixer

2. 2nd Down-conversion Mixer 1st IF is converted to 2nd IF of 45MHz..

3. 2nd IF LC Filter It has 200kHz bandwidth with 45MHz center

frequency. It attenuates images from the 2nd mixer

4. RSSI It produces DC voltage according to the received

signal strength.

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Circuit Description: Rx

1. PGA Sets the programmable gain array to one

of 50 values separated by 2dB [000000] ~[110001]

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Circuit Description: Rx - Digital1. Rx AGC

The purpose of Rx AGC is to maintain the Rx I/Q voltage level, regardless of the received signal strength. In general, Rx AGC has the dynamic range of around 70dB..

2. Rx I/Q Demodulator It generates both in-phase (I) and quadrature (Q) c

omponents of the signal while translating the IF signal to baseband.

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Circuit Description: Local1. VC-TCXO (OSC801)

13MHz fundamental frequency for PLLs and Baseband chipset (U601).2. RF VCO (OSC901)

It supplies Local source frequency higher than RF carrier by 225MHz in conjunction with PLL(GSM)

Lower than RF carrier by 225MHz in conjuntion with PLL(DCS) Higher than Tx RF carrier by 270MHz in conjuntion with PLL

3. IF VCO (OSC902) It generates 1080MHz frequency for up-converting Tx I/Q signal to Tx I

F and Rx signal to RxIF4. TX VCO (OSC903)

Frequency : 880~915MHz(G), 1710~1785MHz(D)

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Circuit Description: Tx

1.Tx I/Q modulator Tx I and Q signals are combined and up-converted

to 270(G),135(D)MHz frequency. I, Q voltage levels are 1Vp-p, respectively.

2.PAM (U1002) It increases Tx power level so that PA is capable

of transmitting the maximum power up to 35dBm High gain 3stage amplifier: 0dBm input Typ 2in/2out dual band amplifier One power control pin with one band switch

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Circuit Description: Tx

1. APCIC (U1001) Dual Band Power control IC for TX power Amp has ~55 dB dynamic range, Contains power detector and operantional Amp

converts RF power into DC level.

2. Coupler :F1001(G), F1002(D) The coupling factor is 14dB,20dB. That is, “P(PA

output) – 14dB,-20dB” is transmitted to the power detector circuitry

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Circuit Description: Logic

TRIDENT (U601) Baseband Engine Includes the DSP16000 core,ARM7TDMI microcontroller cor

e,and a standard sets of peripherals for the DSP and ARM communicates with Memory, Keypad, LCD, and other periph

erals DSP RAM :20k x 16 DSP ROM : 144k x 16 ARM RAM : 2k x 32 RAM(byte writable) ARM ROM : 4k x 32 ROM(mask-programmable) Processor Interface memory : 512 x 16 shared RAM

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Circuit Description: Logic

TRIDENT (U601) ARM7TDMI 32-bit microprocessor : main call processing. 32.768kHz X-tal Oscillator : the sleep mode The interface circuitry : reset circuit, address bus (A0-A20), d

ata bus (D0-D15), contrognals(CP_WEN,CP_OEN,EAR_EN,LED_CTL, etc), GPIOs, and the communication ports.

Communication ports : UART1 and 2, the JTAG etc. UART1 supports HP equipment interface, down loading, and da

ta service. UART2 and the JTAG are used for the software debugging.

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Circuit Description: Logic

CSP 1099 (U701) Baseband radio and voiceband audio interfaces Baseband receive path

Buffer, 10-bit ADC, PGA Baseband transmit path

Transmit buffer, GMSK modulator, 9-bit DAC ADC and DACs for Radio and Monitoring

10-bit ADC for sampling RSSI, TXP, and etc Voiceband Receive Path :speaker , mic Event timing and control register

To control both B/B receive and B/B transmit activity Power ramping control

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Circuit Description: Logic

PMIC(PSC2005:U101) Includes six low-dropout voltage regulator

LDO1-1.8v, LDO2:VCCD, LDO3:Vrf LDO4-Vapc,LDO5:Vosc/syn,LDO6:VCCA

250ms system reset generator To ensure proper initialization of the system controller

12bit monotonic DAC Pwr_sw1,Pwr_sw2,CS => active low.

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Circuit Description: Logic

Flash memory Flash ROM:U501(32M x 1),U1010(16M x1)

The 48Mbit FLASH ROM is used to store code of the application program. Using the down-loader program, this application program can be changed even after the mobile is fully assembled.

SRAM The 4Mbit SRAM is used to store the internal flag

information, call processing data, and timer data.

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Circuit Description: Logic Power On

Press of END key BATT and POW_ON signals are connected Q204 turn-on Q102 turn-on, that is, BATT is connected to VBAT VBAT is supplied to U101 VCCD and VCCA are applied to U101, U601 VCTCXO signal is enabled VC-TCXO (OSC801) is operating Once U601 runs without error, U601 enables POWER_KEEP signal

Power Off Press of END key Q204 turn-on U601

checks BB_PWR turns logic high to low Main application program enter to Power Off mode

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Circuit Description: Logic

Key Pad The Key Pad is belong to main board. For key-press r

ecognition, the structure of key is consisted of 5 x 5 matrix, which is used input signal key_col(0-4) and output signal key_row(0-4) of Trident.

LCD MODULE LCD module is connected to main board by FPCB. T

his contains an LCD controller. An LCD controller controls the information of displaying from the Trident (parallel 8-bit data) to the LCD.

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Test Interface Jig

Data cable

Test cable

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TE

ST

PA

CK

TDMA I/F TEST JIG

POWERON/OFF

TOA-IN

TOA-OUT

- +DC 4.0V

SAMSUNG

TO

.PC

TO

.HP

AUTOON/OFF

BOOTON/OFF

UARTU1-U2

COMPort

Downloading Setup

test

pack

SDS/

DL

PWR

ON

SDS

/SW

DEBU

G/SW

DSP

JTAG

GPRS TEST JIG

4V DC POWER

DEBUG

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Auto calibration Program Setting

TE

ST

PA

CK

TDMA I/F TEST JIG

POWERON/OFF

TOA-IN

TOA-OUT

- +DC 4.0V

SAMSUNG

TO

.PC

TO

.HP

AUTOON/OFF

BOOTON/OFF

UARTU1-U2

COMPort

test

pack

SDS/

DL

PWR

ON

SDS

/SW

DEBU

G/SW

DSP

JTAG

GPRS TEST JIG

4V DC POWER

DEBUG

HP8960

POWER

SUPPLY

GPIB CABLE

GPIB CARD

E3632A

HP

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Auto calibration Processing

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Auto calibration Processing

click

click

click

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Auto calibration Processing

click

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Auto calibration Processing

click

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IMEI Processing

1.execute winl108tQ200.exe file

2. Select country

3. Click

Change H/W ver

click

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IMEI Processing

1.write H/W ver

2.click write IMEI

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IMEI Processing

1.click

2.write imei

3.click

4.click

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Repair program Processing

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Repair program Processing

click

click

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Repair program Processing

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Repair program Processing

click

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Phone Test Setup

TE

ST

PA

CK

GPRS TEST JIG

POWERON

SDSS/W

- +DC 4.0V

SAMSUNG

DE

BU

GSD

S D/L

DEBUGS/W

DSPJTAG

HP8960

Power SupplyRF Test Cable

GPIB CABLE

PC

Com1 port

Gpib cardt

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Test Information Test Equipment is HP8960 or CMD55. Mode : Test mode

(Tx : BCH+TCH, Rx : CW generator)

Tx power level pass/fail limit have to be modified to allow calibrated Tx power levels of SGH-Q200

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Test ModeCont Rx on

HP Setup: RF Generator ScreenRF input = -50dBm, RF Gen Freq = 947MHz, (Channel is 60)RF Gen Band =GSM

Power Level & Voltage Waveform Rx Chain – Analog: Measurement Environment

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nPower Level & Voltage Waveform

Rx ChainAntenna

FEM

LNA

LNA

RF

FILTER

RF

FILTER

LPF

LPF

RX

SAW

RX

SAW

MIXER 1

MIXER 2

IF

SAW

225MHz270MHz

LC

FILTER

1/2

1/2

IF VCO

RF

SYNTH

IF

SYNTH

RF VCO

TX VCO

LOOP

FILTERPD

I,Q

MODULATOR

1080MHz

GSM :1150MHz~1185MHz

DCS:RX:1580MHz~1655MHz

TX:1575MHz~1650MHz

DCS:270MHz

GSM:540MHzSWITCH

1/2

1/2

45MHz

PGAI,Q

DEMOD

SERIAL DATA

INTERFACE

1/6

GSM:270MHz

DCS:135MHz

GSM:270MHz

DCS:135MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

PAM

GSM:925MHz~960MHz

DCS:1805MHz~1880MHz

I,Q

I,Q

CSP1089

OCTL

SIGNALS

TRIDENT

RF

DRIVER

DSP JTAG

DAI

DSP16000

ARM7TDMI

UIAUDIO

SERIAL

DATA,

CLK,

LE

Ant s/w In

LNA In LNA out

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nPower Level & Voltage Waveform

Rx ChainAntenna

FEM

LNA

LNA

RF

FILTER

RF

FILTER

LPF

LPF

RX

SAW

RX

SAW

MIXER 1

MIXER 2

IF

SAW

225MHz270MHz

LC

FILTER

1/2

1/2

IF VCO

RF

SYNTH

IF

SYNTH

RF VCO

TX VCO

LOOP

FILTERPD

I,Q

MODULATOR

1080MHz

GSM :1150MHz~1185MHz

DCS:RX:1580MHz~1655MHz

TX:1575MHz~1650MHz

DCS:270MHz

GSM:540MHzSWITCH

1/2

1/2

45MHz

PGAI,Q

DEMOD

SERIAL DATA

INTERFACE

1/6

GSM:270MHz

DCS:135MHz

GSM:270MHz

DCS:135MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

PAM

GSM:925MHz~960MHz

DCS:1805MHz~1880MHz

I,Q

I,Q

CSP1089

OCTL

SIGNALS

TRIDENT

RF

DRIVER

DSP JTAG

DAI

DSP16000

ARM7TDMI

UIAUDIO

SERIAL

DATA,

CLK,

LE

Mixer In

IF SAW

Out

Mixer out

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nPower Level & Voltage Waveform

Rx ChainAntenna

FEM

LNA

LNA

RF

FILTER

RF

FILTER

LPF

LPF

RX

SAW

RX

SAW

MIXER 1

MIXER 2

IF

SAW

225MHz270MHz

LC

FILTER

1/2

1/2

IF VCO

RF

SYNTH

IF

SYNTH

RF VCO

TX VCO

LOOP

FILTERPD

I,Q

MODULATOR

1080MHz

GSM :1150MHz~1185MHz

DCS:RX:1580MHz~1655MHz

TX:1575MHz~1650MHz

DCS:270MHz

GSM:540MHzSWITCH

1/2

1/2

45MHz

PGAI,Q

DEMOD

SERIAL DATA

INTERFACE

1/6

GSM:270MHz

DCS:135MHz

GSM:270MHz

DCS:135MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

PAM

GSM:925MHz~960MHz

DCS:1805MHz~1880MHz

I,Q

I,Q

CSP1089

OCTL

SIGNALS

TRIDENT

RF

DRIVER

DSP JTAG

DAI

DSP16000

ARM7TDMI

UIAUDIO

SERIAL

DATA,

CLK,

LE

2’nd mixer out

46SG

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Tx Chain Active Cell mode

HP Setup RF input = -50dBm,

TCH Channel = 60CHRF Gen Band = GSM

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nPower Level & Voltage Waveform

Tx ChainAntenna

FEM

LNA

LNA

RF

FILTER

RF

FILTER

LPF

LPF

RX

SAW

RX

SAW

MIXER 1

MIXER 2

IF

SAW

225MHz270MHz

LC

FILTER

1/2

1/2

IF VCO

RF

SYNTH

IF

SYNTH

RF VCO

TX VCO

LOOP

FILTERPD

I,Q

MODULATOR

1080MHz

GSM :1150MHz~1185MHz

DCS:RX:1580MHz~1655MHz

TX:1575MHz~1650MHz

DCS:270MHz

GSM:540MHzSWITCH

1/2

1/2

45MHz

PGAI,Q

DEMOD

SERIAL DATA

INTERFACE

1/6

GSM:270MHz

DCS:135MHz

GSM:270MHz

DCS:135MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

GSM:880MHz~915MHz

DCS:1710MHz~1785MHz

PAM

GSM:925MHz~960MHz

DCS:1805MHz~1880MHz

I,Q

I,Q

CSP1089

OCTL

SIGNALS

TRIDENT

RF

DRIVER

DSP JTAG

DAI

DSP16000

ARM7TDMI

UIAUDIO

SERIAL

DATA,

CLK,

LE

TxIP

TXEN1

Tx locking

0.8~2.5V

48SG

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Voltage Waveforms: Local

OSC901RF Local @ 62CH

OSC902IF Local

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Voltage Waveforms: Logic

OSC801.413MHz TCXO Out

osc60132.768kHz clock

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Repair Examplesproblems Reason

call fail

Vrf tantal osillation

C973,C974 open

ant path 0ohm open

AFC fail

VC- TCXO crack (abnormal operation)

CSP1099 chip problem

broken CN1001

GSM RX gain fail poorly made RF SAW(F1003):4dB loss

no buzzer sound poor soldering of AU501

no speaker sound

LCD FPCB 16,18pin short

speaker wire open

poorly made speaker

no mic sound contact problem(not connect)

power on fail

OSC801(VC- TCXO)

OSC601(32.768KHz)

poorly made U601(Trident) &poorly

soldering

U1010(atmel memory)problem & crack

collapse batt pin

no rssi bar poorly made OSC801(vc- tcxo)

no vibration be folded motor wire

no key toneOSC601 crack

poorly made key pad

RTC x- tal(32.768KHz) crack

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Baseband Problems

Power-On Failure

Abnormal Operation of Charging and EL

Backlight

Abnormal Operation of Vibrator and Buzzer

Abnormal Operation of Key, MIC, and LED

RF Part : Refer to SVC manual

52SG

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Checkpoints: Power-On Failure

1.Press END Key or Turn On Auto Power on SW of interface test jig2.check following

Name Node Value

VBAT VCON2.1 >3.3V?

VCCD U101.4 >2.85V?NO=>check U101,C112

Vrf,Vosc,Vsyn U101.31,35,36 =3.0V?No=>U101.1=1.8V?No=>check U101,C103,C104,C120

Check clock signal U801.4 Freq=13MHz?Vrms>300mV?900mVpp?No=>check u801,osc801

3. Memory check

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Checkpoints: Charging and EL Backlight

Charging

EL BacklightName Node

DesirableValue

LED_CTL Q301.1 highQ301.3 low

BAKLIGHT CN202.12 low

Name NodeDesirable

Value

VEXT CN301.17,18around 4.5V? No=>

replace TA

Q205.3

lowno=>check

Q201,U201,C203,R203

CHG_ON U202.2,5,6high

no=>change u202

U202.3 low

U201.53.2V~4.2V?

No=>change201

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Checkpoints: Vibrator and Buzzer

Name NodeDesirable

ValueRINGER R508,Q502.3 PWM SignalVBAT C506 >3.3V

Au501.3 PWM SignalBuzzer Impedance AU501.3 to 4 ~15 Ohm

Name NodeDesirable

ValueMotor_en Q503.2 3V

VBAT Q501.2 3V- CN202.5 3V

Vibrator

Buzzer

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Checkpoints: Key, MIC, and LED

Key recognition check1. Metal Dome Array2. CN202 pin#1,2,3, and 43. VCTCXO_IN (C807)

MIC check1. MIC400 contact2. U401 pin#1,2,and5

LED check1. Control signal =>keypad LED: LED_CTL, =>SVC_LED:

SVC_LED(Q601.2:high,Q601.3:low)

1. VCC

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Thank you!!