sfh 4235 - osram · group total radiant flux 1) total radiant flux 1) i f = 1000 ma; t p = 10 ms i...
TRANSCRIPT
SFH 4235
1 Version 1.6 | 2019-07-16
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dProduktdatenblatt | Version 1.1 www.osram-os.com
Applications
SFH 4235
Platinum DRAGON® High Power Infrared Emitter (850 nm)
— CCTV Surveillance
— Headlamps, LED & Laser & Night Vision
— Industrial Automation (Machine Controls, Light Barriers, Vision Controls) — Safety and Security, CCTV
Features: — Package: clear silicone
— Corrosion Robustness Class: 3B
— Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— IR lightsource with high efficiency — Double stack emitter — Low thermal resistance (Max. 9 K/W) — Centroid wavelength 850 nm
Ordering Information
Type Total radiant flux 1) Total radiant flux 1) Ordering Codetyp.
IF = 1000 mA; tp = 10 ms IF = 1000 mA; tp = 10 msΦe Φe
SFH 4235-Z 630 ... 1250 mW 950 mW Q65110A8900
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Maximum RatingsTA = 25 °C
Parameter Symbol Values
Operating temperature Top min. max.
-40 °C125 °C
Storage temperature Tstg min. max.
-40 °C125 °C
Junction temperature Tj max. 145 °C
Forward current IF max. 1000 mA
Surge current tp ≤ 200 µs; D = 0
IFSM max. 5 A
Reverse current 2) IR max. 200 mA
Power consumption Ptot max. 3400 mW
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
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CharacteristicsIF = 1000 mA; tp = 10 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 860 nm
Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φ typ. 60 °
Dimensions of active chip area L x W typ. 1 x 1 mm x mm
Rise time (10% / 90%) IF = 5 A; RL = 50 Ω
tr typ. 7 ns
Fall time (10% / 90%) IF = 5 A; RL = 50 Ω
tf typ. 14 ns
Forward voltage IF = 1 A; tp = 100 µs
VF typ. max.
3 V3.4 V
Forward voltage IF = 5 A; tp = 100 µs
VF typ. max.
3.5 V4.5 V
Reverse voltage 2) IR = 20 mA
VR max. 1.2 V
Reverse voltage (ESD device) 2) VR ESD min. 45 V
Radiant intensity 3) IF = 1 A; tp = 100 µs
Ie typ. 320 mW/sr
Temperature coefficient of voltage TCV typ. -2 mV / K
Temperature coefficient of brightness TCI typ. -0.3 % / K
Temperature coefficient of wavelength TCλ typ. 0.3 nm / K
Thermal resistance junction solder point real 4) RthJS max. 9.0 K / W
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Brightness Groups TA = 25 °C
Group Total radiant flux 1) Total radiant flux 1)
IF = 1000 mA; tp = 10 ms IF = 1000 mA; tp = 10 msmin. max.Φe Φe
EA 630 mW 1000 mW
EB 800 mW 1250 mW Only one group in one packing unit (variation lower 1.6:1).
Relative Spectral Emission 5), 6)
Ie,rel = f (λ); IF = 1000 mA; tp = 10 ms
7000
nm
%
OHF04132
20
40
60
80
100
950750 800 850
Irel
λ
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Radiation Characteristics 5), 6)
Ie,rel = f (φ)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Forward current 5), 6)
IF = f (VF); single pulse; tp = 100 µsOHF04188
FI
V
A
2
FV
10-1
5
100
5
101
10-2
2.5 3 3.5 4
Relative Total Radiant Flux 5), 6)
Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs
OHF04187
IF
A10-15 10 05 10 1
110
-210
-310
5
10
10
5
-1
5
0
e
Φ(1 A)Φ
e
10-2
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Max. Permissible Forward CurrentIF,max = f (TS); Rthjs = 9K / Wsingle pulse
00
FI
TS
OHF041901.1
0.1
0.2
0.4
0.3
0.5
0.7
0.6
0.8
0.9
A
13010060 80 ˚C20 40
Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TS = 85°C
-5
FIA
tp
s
OHF04189
-410 -310 -210 -110 010 110 21010
Pt=D TT
tP
IF
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
0.5
0.20.33
0.1
0.020.05
D =
0.010.005
1
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Dimensional Drawing 7)
Further Information
Approximate Weight: 219.0 mg
Package marking: Cathode
Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.
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Recommended Solder Pad 7)
Solder resist
Freies KupferBare Copper
Lötpasten SchabloneSolder paste stencil
Lötstopplack
OHAY0681
0.3
(0.0
12)
KupferCopper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3
(0.0
91)
2.3
(0.0
91)
10 (0
.394
)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen3 solder points
Thermal enhanced PCBThermisch optimiertes PCB
ø4.0 (0.157)Heatsink attachø4.0 (0.157)
ø2.5 (0.098)
Anode and heatsink are electrically connected.
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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 7)
OHAY0508
1.55 (0.061) 2 (0.079)
4 (0.157)
6.35 (0.250)
8 (0.315)
1.75
(0.0
69)
11.5
(0.4
53)
12.4
(0.4
88)
24 (0
.945
)
0.3 (0.012)
0.3 (0.012)
1.9 (0.075)
7.35
(0.2
89)
Cathode/Collector Side
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Tape and Reel 8)
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
180 mm 24 + 0.3 / - 0.1 mm 60/100 mm 24.4 + 2 mm 30.4 mm 800
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 7)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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Schematic Transportation Box 7)
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or e
quivale
nt pro
cessing (p
eak package
2. Afte
r th
is b
ag is o
pened,
devices th
at will
be s
ubjecte
d to in
frare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body te
mp.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD-0
33 for bake p
rocedure
.
Floor
time s
ee belo
w
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Floor
time
1 Y
ear
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICONDUCTO
RS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
Dimensions of Transportation BoxWidth Length Height
195 ± 5 mm 195 ± 5 mm 42 ± 5 mm
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NotesDepending on the mode of operation, these devices emit highly concentrated visible and non visible light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Total radiant flux: Measured with integrating sphere.2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.3) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
6) Testing temperature: TA = 25°C (unless otherwise specified)7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.8) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.6 2019-07-15 Discontinued
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.