service engineeing & optimization level 3, rev.1.0 motorola u9 u9
TRANSCRIPT
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
U9
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Generic Overview
Market Name: U9
Manufacturer: Motorola
Form Factor: Clam Bands/Modes: GSM Quad Band 850/ 900/ 1800/ 1900MHz
Memory Internal: 20MB (user)
Memory External: up to 4GB
Expected SA Date : Sep 2007
Displays: 2.0” internal 320x240 - 262k color TFT 1.45” external 128x160 - 65k color OLED
Antenna: Internal
TT/SB Time: BX40 Battery - TT up to 374min, SBT up to 388 hours
Customer Sync. SW: Mobile Phone ToolsAvailable at: Customer Stores
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Generic Overview
Service SW: RSD, Repiar Studio, GPGate, Moto TriageAvailable at: http://md-service.corp.mot.com/login.aspx
Connectivity: Micro USBData Cable avail. At: http://62.214.1.200 (Micro USB to USB A, Micro USB Data Cable)
Battery Eliminator: actual new design (BX40)Available at: http://62.214.1.200
Flex Flash File Type: 1FF SuperfileRequired SW: RSD
Required Tools: Torx 5 Size, Tweezer, Plastic disassembly Tool, Hinge Shaft Tool (recommended)
MandatoryRepair Fixture: Lens press FixtureAll Tools available at:http://62.214.1.200
How to update SW: start up RSD, power up Moblie and connect via Micro USB cable, Select required 1FF Superfile and start Flash/Flex process
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
KEY FEATURES> Small, curvaceous, seamless form> Combination of metallic gloss finish and soft
feel for a visually and tactile rich experience > Floating graphics on CLI> 2 MP camera> Music player with dedicated touch sensor
buttons> Bluetooth > A2DP for BT stereo headset support> Touch sensor for wake-up (TBD)> Micro SD – up to 4 GB> Internal user memory – 20 MB
SERVER/CARRIER ENABLERS> FOTA> Screen 3> Mega SIM> Branded Services
>Vodafone >CMCC>Orange>MyFaves
SPECIFICATIONSBand / modes: Quad Band /
GPRS Class 12, EDGE Class 12Size: approx. 55-60 ccDisplay: Main: 2.0” QVGA 262K TFT
CLI: 1.45” 128 x 160 65K OLEDAntenna: InternalPlatform: SCM-A11UI Platform: ChameleonBattery: BX40TT/SB Time: Up to 374min TT/ Up to 388hrs SB
ENABLERS> Audio CODECs: MP3, WMA, AAC, AAC+enhanced> DRM: OMA v2, JANUS> Browser: WAP 2.0> Messaging: MMS, WVIM, EMS 5.0, SMS> IM: Embedded - WVIM> Bluetooth: Class 2> J2METM: MIDP 2.0> Connectivity: Bluetooth Class 2, USB 2.0 Full speed> Video: WMV v10, WMV v9, RV v9, H.264, H.263,
MPEG4
One Slider
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
U9 Z6
Memory
Display
Antenna
Connectivity
Alert Speaker
Others
RF
Baseband Chipsets
Camera
GSM/Edge Tranceiver IC “TRANSAAM”
PA “RAPTOR”
SCMA11
Atlas V3,5
1GB Flash/ 512MB SDRAM
Micro USB
Navigation keypad
Main 2.0“Color 262K,CLI 1.45” Color 64K
Quad-Band Internal Antenna
2,0 Mega pixel Main Housing mounted
Serializer IC
10 x 16mm oval Polyphonice Speaker
MegaSIM Cardreader
GSM/Edge Tranceiver IC “TRANSAAM”
PA “RAPTOR”
SCMA11
Atlas UL
1GB Flash / 64MB SRAM
Camera Flash
Mini USB
Vibrator Motor
Navigation keypad
2“TFT, 320x240/ 262K Color Display
Quad-Band Internal Antenna
2,0 Mega pixel Main Housing mounted
Serializer IC
10 x 16mm oval Polyphonice Speaker
SIM + T-Flash Cardreader on Daughter Board
Linux/Java platform productLinux/Java platform product
U9 vs. Z6
Vibrator Motor
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Top Side
Sidekey MylarKeypad MylarEL film
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Bottom Side
J902Micro USB
J1 Ext. Antenna
U903 Vibrator
J650 Flip Con.
J903 Battery Con.
J620 T-Flash Con.
Coin Cell M610 MM-Sim Con.
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
U900Atlas
U700Memory
U800SCMA11
U301Bluetooth
U50Raptor (PA)
Bottom Side
Underfilm
U100TransAAM
FL100Saw Filter
U901EL driver
MK900MIC
U650Serializer
U600Light Sens.
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Main Chipsets
U50 “PA + Antenna Switch” – (RAPTOR)(RX/TX Switch, PA + Matching)
U100 “GSM /EDGE Tranceiver IC” – (TRANSAM)(Frontend IC, RX/TX VCO)
U800 “SCMA11”(DSP, De/ Modulation, VCO driver, Graphic, Memory Card,
Cam)U700 “Flash”
(1GB (20MB User Memory) plus 512MB SDRAM)
U900 “Atlas 3,5”(Audio Stereo ,Power Supl., over Voltage interface, Charger
interface, Backlight Sink circuit, USB interface)
U650 Serializer(converts the parallel ATI graphic Display Data into serial)
U301 Bluetooth
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 RF System Block Diagram
BluetoothTI 6035
Supply LinesControl LinesRF Signal LinesLF Analogue
B+PM (Atlas)
VRFREF(2.775V) VRF1
(2.775V)VRF2(2.775V)
VRFCP(2.775V)
VRDIG(1.875V)
TOUT7
Raptor
TransAAM
Quadband SAW Filter
AntennaSwitch
US_EUROLB_HBTX_ENTX_ANT_ENIPC_BCM
HB_OUTLB_OUT
CELEGSMDCSPCS
VRAMPVDETECT
RESETB
SYSCLKSYSCLKEN
STROBE
RXTXDATARXTXEN
CTRLCLKCTRLDATA
CTRLENDBG_DATA
BTCLKBTCLKEN
DIGRF_TXDDIGRF_TXE
DIGRF_CCLKDIGRF_CDATDIGRF_CEN
BB Processor
SCM-A11
VBTRF
VIOLO
BT_RESET_B
26MHz
XT
AL
EX
TA
L
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
Discrete RF main components:•TransAAM from Freescale (pn:5188450M37)
•Raptor from Freescale* (pn:5188995Y01)
•Saw Filter from SAWTEK* (pn:9188668L11)
•LPF filter (pn:9109403K08)
•26MHz crystal (pn:4809612J53)
•Antenna switch* (temp pn:5170200A95)
•BT EDR IC from TI BRF6300* (pn:5103535B06)
*Component to be qualified
RF Main Components
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Schematic - Raptor
PA output match Notch filter
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
1. PA output match• PA output impedance is sensitive and affect the following RF
performance.
ORFS due to switching (output RF spectrum)
Current drain
Conducted Harmonic
• Optimization is expected between PA and Antenna during bench measurement.
2. Notch filter added at PA output• Possible spurious emitted at LB 3fo and DCS 2fo under radiation mode
due to load impedance change.
Lesson Learn
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 U50
GSM PA – Low/ High BandThe Raptor module is a input/output, quad-band, dual-mode, GMSK/8PSK(EDGE) PA module + integrated Antenna swith circuit, intended for 2.75G radio applications. The module consists of a dual line-up power amplifier, harmonic filter, logarithmic power detector, and analog power control circuit. This PA module is used in the final amplification stages in a GSM portable telephone operating in either GMSK or EDGE mode.· EDGE Class 12 operation· GMSK power class 4 operation in the GSM850 and EGSM900 bands· GMSK power class 1 operation in the DCS1800 and PCS1900 bands· EDGE power class E2 operaton
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 U500
GSM Tranceiver Circuit „TransAAM“Quad band GSM/EDGE transceiver solution consisting of Fractional-N synthesizer, VLIF (122,7kHz) RX front end, GSM/EDGE TX modulator, power amplifier control circuitry, auto calibration functions, signal processing and auto sequencing functions. The TX modulator functions are completely contained within the module. The RX circuitry includes all circuitry required to convert RF inputs into digital I and Q signals. The baseband interface consists of a serial control and serial data configuration that can function in both full DigRF and Neptune compatible modes. The module requires the Raptor or Ophee PA and Saw filters to complete the RF solution.
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
SCMA11
MMSI M/SI M CARD
FlashNAND x16
128MB
SDRAMSDR x16
64MB
Stacked Memory(Toshiba)
J TAG Connector
J TAG Signals
Linux Console (UART2)
EL Driver(SuperTex HV837)
Transflash
1 Enable Signals Base Keypad
((NAV, Center, Send, End, Carrier, Clear,
Soft Left, Soft Right)0- 9,*,#)
Side Keys( PTT, VA,
Vol Up, Vol Down)
BluetoothTI BRF 6300
Camera(2.0 Mpixel
Micron MI2020SOC)
TransAAMv4.2
Raptorv4.3
26MHz
Atlasv3.2
Display(2.0 I nch
18- bit color, Dumb+SPI interface)
Serializer/Deserializer
(Fairchild 668C)
SPI Control
Data
CSI and I2C
IPU
UART1
MI C Speaker Loud Speaker
Vibrator Motor
Power Key
EMU Connector
32KHz
VBUS
D-
D+
ID
CSPI2ASAP(Audio)
MMSAP(Audio)
Main Battery
Backup Coin Cell
5 Row6 Col
OLED Display(1.45 I nch
SPI interface)
Music Button & Touch
LEDs Controller
I2C
Baseband Block Diagram
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
Transceiver Board- RF chipset (TranAAM/Raptor)- SCMA11 + Memory- Altas- Micro SD holder- MMSIM/SIM card holder- EMU connector- Battery connector- BT- Keypad- EL circuit- Hall Effect sensor- Ambient Light sensor- Main Display Serilizer- Antenna Switch- Vibrator- Loudspeaker-Mic
50 pin BTB (Flex)
Camera2MP camera on socket
24 pin BTB Receiver flex- Receiver
4 pin ZIF
Side Key flex
- Vol up , Vol Down
- PTT, VA
Pad ACF
Main Display module
39 pin ZIF OLED secondary display
17 pin ZIF
Connection Plan
Flip Board- Main Display Deserilizer- LEDs controller- Music and Activation IC
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 OLED Module spec
Display Type Emissive PMOLED Display
Size of Display 1.45”
Module Dimension28.68mmx35.5mmx 1.515mm
Active Area 23.015mm x 28.78mm
Pixel resolution 128(RGB) x 160
Number of colors 262K/ 65K based on software setting
Driver IC LD50T6160 128x160 262K Color PM OLED Driver
Display Interface 4 bit SPI Interface
Connector 17-pins ZIF connector
Backlight Do not need LEDs for backlight
Maximum Brightness ~ 110 cd/mm2
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
PM OLED Display128x160
17P
in
Ziff
C
onn
ecto
r
PM OLED Driver LD50T6160
DC/DC Converter MP1541
OLED Module Block DiagramOLED Module Block Diagram
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Music and Activation Button
Same as LIDO for Music button but have an extra activation button
VCC
RST (29)
TOUCH (16)
PWM (14)(19) I2C_A0
(22) I2C_A1
GND
SNS3A
SNS3BSNS2A
SNS2B
VIOHI (2.775V)
I2C_DAT
I2C_CLK
TOUCH_INTB
SDA (27)
SCL (28)
<< > / || >>
Si1034X
1 6
25
4 3
VDIG_1.8V
SCMA11
SNS1A
SNS1B
AtmelMega48
UH2_RXDP
AMP EN (13)
VDIG_1.8V
SNS4A
SNS4B
OLEDDisplay
Activation Button
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Audio Design Architecture
Right Ch. DAC
Left Ch. DAC
PGAst
PGAst
Mixer, Mono,
Balance
PGArx
Stereo DAC
ArxoutR
Asp
Alsp
PGArx
PGAst
PGAst ArxoutL
ArxoutR
ALSP
ASP
USB XCVR
B+
Amc1R
Atxin
0.1uF
HandsetMicrophone
AccessoryMicrophone
AccessorySpeaker
Loudspeaker
HandsetEarpieceReceiver
LSPL
SPI
UART1
SSI1
SSI2
SAP
StarCore
ARM11
PriSPI
SecSPI
AUDMUX
Output Selector
InputSelector
Voice Codec
TX1
RX1
BCL1
FS1
TX2
RX2
BCL2
FS2
AD1_TXD
AD1_RXD
AD1_TXC
AD1_TXFS
AD2_TXD
AD2_RXD
AD2_TXC
AD2_TXFS
PCM_IN
PCM_OUT
PCM_CLK
PCM_SYNC
Microphone
Speaker
BLUETOOTHMODULE
SCM-A11
ATLAS (Audio)
UART
IPC
1
2
3
4
6
5
7
USB-OTG
PGAtxR
Bluetooth Headset
EMU/MicroUSB Accessory
ASAP Lines
MMSAP Lines
UART2
TX
RX
BCL
FS
DAI Test Points
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Power Management System
PICO POWER TREE
VBUS B+
COIN
CELL
ID VATLASVoltage 2.775V
SCMA-11
- DVDD[1:38]
ID SW 1A + BVoltage 1.2 VMax. Load 1000 mA
VCORE
Main Display LCD backlight
Secondary Display OLED
DC-DC
Keypad Backlight EL
DC-AC
ID VUSBVoltage 3.3 VMax. Load 50 mA
ID SW3Voltage 5.0 VMax. Load 350 mA
VBOOSTID SW 2A + BVoltage 1.8 VMax. Load 1000 mA
VDIG_1.8V
IMAGER
-VDD
-VDD_IO
ID VIOHIVoltage 2.775 VMax. Load 200 mA
ID VIOLOVoltage 1.8 VMax. Load 200 mA
Primary and SecondaryDISPLAY
DRIVER IO
FLIP DETECT
CAPACITIVE SENSOR
BT
-VDD_IO
ID VRFDIGVoltage 1.8 VMax. Load 200 mA
TRANSAM
-JVDD
-QVDD_1P8
-VDD_UART2
-VDD_USB2
-VDD_BC
SCMA-11
-VDD_IPU[1:4]
-VDD_L1T
-VDD_BBP[1:6]
-VDD_BC
SERIALIZER / DESERIALIZER
-CKSEL_RT180
-M_S
-VDDP, VDDS,VDDAJ
ID VGENVoltage 2.775 VMax. Load 200 mA
VTFLASH
SCMA-11
- VDD_SDIO1
EXTERNAL TFLASH
Pull up for
-SD1_DATA[0:2]
-SD1_CMD
ATLAS
-PRIVCC
-SECVCC
SCMA-11
-QVDD_FUSEBOX, QVDD_VREG
-VDD_MQSPI, VDDMQSPI1
-VDD_UART[1:2]
-VDD_AUD
-VDD_COM_[1:2]
-URST_B
-VDD_KPP[1:2]
-VDD_CSI[1:2]
-VDD_INT
-GP_AP_C15
-VDD_DDR[1:5]
-VDD_WEIM[1:9]
-VDD_NAND_[1:2]
-I2CLK, I2DAT
FLASH MEMORY
-VCC_N
-VCC_SD[1:3], VCCQ_SD[1:2]
-NC35
IMAGER
-VAA, VAAPIX
-VDDPLL
ID VCAMVoltage 2.80 VMax. Load 150 mA
ID VRFCPVoltage 2.775 VMax. Load 50 mA
SCMA-11
- QVDD
TRANSAM
- VDDA
ID VRF1Voltage 2.7 VMax. Load 350 mA
External Pass Device
External Pass Device
ID VRF2Voltage 2.7 VMax. Load 350 mA
TRANSAM
-VDDA_CP_2P7
-VDDA_ACE_2P7
RAPTOR
-VREG[1:2]
External Pass Device
ID VMMC1Voltage 1.8 / 3.0 VMax. Load 350 mA
MEGA_SIM
-SIM_PWR
TRANSAM
-LVDD
-VDD_TXRX_2P7
ANT_SWITCH
ID VESIMVoltage 1.80VMax. Load 60mA
VBTRF
BT
-VDD_IN
RAPTOR
-VCC_FINAL_HB
-VCC_FINAL_LB
-VCC_DVR_HB
- VCC_DVR_LB
USB INTERFACE
VIBRATOR
LED CONTROLLER
RTC
32 kHZinternal
RC
ID VVIBVoltage 2.0 VMax. Load 200 mA
PICO POWER TREE
VBUS B+
COIN
CELL
ID VATLASVoltage 2.775V
SCMA-11
- DVDD[1:38]
ID SW 1A + BVoltage 1.2 VMax. Load 1000 mA
VCORE
Main Display LCD backlight
Secondary Display OLED
DC-DC
Keypad Backlight EL
DC-AC
ID VUSBVoltage 3.3 VMax. Load 50 mA
ID SW3Voltage 5.0 VMax. Load 350 mA
VBOOSTID SW 2A + BVoltage 1.8 VMax. Load 1000 mA
VDIG_1.8V
IMAGER
-VDD
-VDD_IO
ID VIOHIVoltage 2.775 VMax. Load 200 mA
ID VIOLOVoltage 1.8 VMax. Load 200 mA
Primary and SecondaryDISPLAY
DRIVER IO
FLIP DETECT
CAPACITIVE SENSOR
BT
-VDD_IO
ID VRFDIGVoltage 1.8 VMax. Load 200 mA
TRANSAM
-JVDD
-QVDD_1P8
-VDD_UART2
-VDD_USB2
-VDD_BC
SCMA-11
-VDD_IPU[1:4]
-VDD_L1T
-VDD_BBP[1:6]
-VDD_BC
SERIALIZER / DESERIALIZER
-CKSEL_RT180
-M_S
-VDDP, VDDS,VDDAJ
ID VGENVoltage 2.775 VMax. Load 200 mA
VTFLASH
SCMA-11
- VDD_SDIO1
EXTERNAL TFLASH
Pull up for
-SD1_DATA[0:2]
-SD1_CMD
ATLAS
-PRIVCC
-SECVCC
SCMA-11
-QVDD_FUSEBOX, QVDD_VREG
-VDD_MQSPI, VDDMQSPI1
-VDD_UART[1:2]
-VDD_AUD
-VDD_COM_[1:2]
-URST_B
-VDD_KPP[1:2]
-VDD_CSI[1:2]
-VDD_INT
-GP_AP_C15
-VDD_DDR[1:5]
-VDD_WEIM[1:9]
-VDD_NAND_[1:2]
-I2CLK, I2DAT
FLASH MEMORY
-VCC_N
-VCC_SD[1:3], VCCQ_SD[1:2]
-NC35
IMAGER
-VAA, VAAPIX
-VDDPLL
ID VCAMVoltage 2.80 VMax. Load 150 mA
ID VRFCPVoltage 2.775 VMax. Load 50 mA
SCMA-11
- QVDD
TRANSAM
- VDDA
ID VRF1Voltage 2.7 VMax. Load 350 mA
External Pass Device
External Pass Device
ID VRF2Voltage 2.7 VMax. Load 350 mA
TRANSAM
-VDDA_CP_2P7
-VDDA_ACE_2P7
RAPTOR
-VREG[1:2]
External Pass Device
ID VMMC1Voltage 1.8 / 3.0 VMax. Load 350 mA
MEGA_SIM
-SIM_PWR
TRANSAM
-LVDD
-VDD_TXRX_2P7
ANT_SWITCH
ID VESIMVoltage 1.80VMax. Load 60mA
VBTRF
BT
-VDD_IN
RAPTOR
-VCC_FINAL_HB
-VCC_FINAL_LB
-VCC_DVR_HB
- VCC_DVR_LB
USB INTERFACE
VIBRATOR
LED CONTROLLER
RTC
32 kHZinternal
RC
ID VVIBVoltage 2.0 VMax. Load 200 mA
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
ATLAS Block overview
Atlas
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 U900
The Atlas is designed as Power Control Audio Power IC used in cellular transceivers.Atlas will handle the audio and power management requirements for the system such like USB, Regulators, Charger Interface, Audio Codec; LED Sink circuit, RTC Interface.The Circuit is in a 247 pin 0.5mm pitch 10x10 Ball Grid Array (BGA) Package.
Atlas 3.5 Power Control - Audio Power
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Charger
Charge Control InterfaceBattery ConnectorESD Protection
Dual Charge TransistorCurret Sense ResistorBattery to B+ SwitchVBUS to B+ SwitchESD ProtectionMicro USB Connector
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 SCMA11 / MXC91231
ARGON-LVMXC91321
SCMA11MXC91231
• 2.75G baseband processor• Targeted for Single Core Modem Architecture• key additional features include USB high-speed
• ARM1136JFS • 400 MHz / 532 MHz in turbo mode• 16 kB L1 Instruction / 16 kB Data L1 Cache + 128 kB unified L2 cache
• Starcore SC140 • 204MHz / 250MHz in turbo mode. • 16 kB L1 Instruction / 32 kB L1 Data
• SDMA • 133 MHz
CMOS90 15x15 468 MBGA15x15 468 MBGA PoP
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 SCMA11 block
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 ARM11 platform features
• Industry standard ARM1136JF-S CPU• L1-cache: 16 KByte inst. and 16 KByte data • L2-cache: 128 KByte combined @ 133 MHz• M2 RAM: 16 KByte on-chip @ 133 MHz• M2 ROM: 32 KByte (Boot)• MAX: Multi Advanced High-Performance (AHB)
Crossbar switch• Two clock domains bridged by L2CC
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 SC140 platform
SC140e– 208MHz (250MHz in turbo mode)– Interrupt Controller
Cache– 32 kB L1 D cache– 16 kB L2 I cache– 128 kB L2 unified cache– 32 kB M1 RAM
On-chip memory• 32 kB M1 RAM• 1 MB M2 ROM• 640 kB M2 RAM
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 U650
Serializer
Low voltage/ Low current High Speed Serial interface• 26 bit dual strobe ultra low power serializer/deserializer• Dual Power Supplies: Core Supply: 2.5 to 3.0V Parallel I/O Supply 1.6 to 3.0V• Single device to operate as serializer or deserializer• Standby Power-Down mode support• Package: 42uBGA 3.5mm x 4.5mm with 0.5mm Ball Grid Pitch
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 U300
Bluetooth Class 2.0
The BRF6300 chip is a highly integrated single-chip CMOS (CO27 process) Bluetooth device that formsa complete standalone Bluetooth wireless communication system. The BRF6300 is based on theBRF6150 and is pin-to-pin backwards compatible with the BRF6150 device when VDD_IO of 1.8V isused and not using crystal. The BRF6300 is the third generation of Texas Instruments' single chip BTdevice, succeeding the BRF6150 and the BRF6100 devices.This device implements an advanced solution for the Bluetooth protocol with easy interfacing to a hostsystem.
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9 Test requirements
Service Test Issue: RFMD Prime Impact
In 2007 and 2008 Motorola plans to ship 21.5 million EDGE capable phones with the RFMD RF chip globally. When these phones are returned to Motorola service only two test sets will be capable of EDGE phasing. After a level 3/4 board repair, all phones must be re-phased to ensure the phone meets factory specifications. Only supporting two test sets may cause some regions to reroute level 3 or level 4 repairs for phones using RFMD Prime to service centers which have capable test equipment.
Bulletin: LVCCFSB2007 - 203
Service Engineeing & Optimization
Level 3 , Rev.1.0
MOTOROLA U9
•1. When will the service solution be available • Right now the project is in the coding phase, which is scheduled from June 1 to July 12. After testing is finished, deployment should begin around August 23. The main bottleneck in the process is the web service. The client tool will most likely be finished well before that date, but the client will not be able to be used in the service centers until the web service is up and accessible.
•2. What phone types are infected by in moment •At the moment the only released phone that supports DBS is the Z6 and V8, and I'm not sure when the next one is scheduled to SA. The last I had heard, all LinuxJava platform phones will support DBS.
•3. What data will be handled by the process (IMEI, Lock Codes, ...?) •I think the Z6 supports IMEI only, but Subsidy Lock DBS blocks should also be supported soon for new models. I have seen documentation that mentioned that Factory State, Bootloader, and Secure Test Command may be the next types of DBS data after those two, but I'm not sure of what the status is for those new data types.
•4. What kind of applications will support that? (RadioCom, Repair Studio....?) •As far as I know, the only tool currently developed to use the DBS web service is my own standalone tool. The RSD team is currently working on adding web service support for the Device Unlock web service, but I don't think they are planning to add support for the DBS web service yet. Also, any STE framework UIs will have access to the DBS functionality through the framework, so MotoGate or MotoAnalyzer could easily add DBS once my standalone tool is deployed.
•5. Does any Service Centre need a Hardware Token to run a PKI Server?•To do Data Block Signing, a service center needs three things: a hardware token, a software certificate, and an LDAP account that is registered on the DBS web service. These are the same as the requirements of the existing secure web services, such as the DRM web service and the Device Unlock web service
Data Block Signing