semiconductor materials markets & supply-chains€¦ · growing cagr ~4%, 2015-2020 . total...
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Semiconductor Materials Markets & Supply-Chains
CMC Conference 2017Lita Shon-Roy
President / CEOMay 2016
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Analyze, Prepare, and Move Forward –
The World is Changing
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A Semiconductor Materials Markets & Supply Chain Advisory Firm
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3Techcet CA LLC Copyright 2017 all rights reserved. www.techcet.com
For more info go to : www.cmcfabs.org
TECHCET started in 2000 to support the CMC hosted by Sematech / ISMI and the materials supply chain.
Supporting the CMC / SEMATECH for > 15 years
CMCFabs now include:BroadcomCypressInfineonIntelGlobalFoundriesMicronNXPQorvoSamsungSematechST MicroelectronicsTexas InstrumentsTowerJazzPanasonic& Other tbd
A Fab Centric Organization
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Disclaimer This presentation represents the interpretation and analysis of information
generally available to the public or released by responsible agencies or individuals. Data was obtained from sources considered reliable. However, accuracy or completeness is not guaranteed. This report contains information generated by Techcet by way of primary and secondary market research methods.
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TECHCET MegaTrendsUnprecedented uncertainty in global politics and economic alignments –Active Political Environment – impacting trade and regulations
Continued Shift Toward Asia / China
Raw Material Supply Chain Issues Continue to Increase
Innovation in Efficiency and Material Handling will be of Increased Focus
Semiconductor industry maturing with pockets of materials development
Specialty Materials – high value, low volumeLarge Materials Companies Continue to Search for innovation / IP entities
Advanced lithography challenges being solved, i.e. DSA and EUV
Micro level concerns for Leading Edge
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Top 5 Suppliers per Process Materials Segment
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$- $2,000.00 $4,000.00 $6,000.00 $8,000.00
Dielectric Precursors
Hi K precursors
Metal Chemicals
Targets
Quartz
SiC / Ceramics
Wet Chemicals
CMP
Photoresist
Gases
SiWafers
Process Materials
Materials Market TrendsGrowing CAGR ~4%, 2015-2020 . Total $26.7 B in 2016
Needs for improved process control, cost reduction driving • Multi patterning• Planar to 3D (3D NAND, FinFET)
Increase in number and volume of materials for advanced devices.
Little need for novel materials until <10nm; • cobalt although not novel was new to semi processing -
barrier.
Small Form Factor, Multi-Die and SiP applications are driving Advanced Packaging , i.e. 2.5/3D stacking, InFO, TSV, WLP, PoP
Increasing Concerns regarding Waste Management / Handling of Materials, Sustainability.
Source: TECHCET Critical Materials Reports™ commissioned by the CMC
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0.00
20.00
40.00
60.00
80.00
100.00
120.00
2015 2016 2017 2018 2019 2020
Wafer Starts 300mm Equiv.5 & 7nm Logic
7nm RAM
3D NAND G2
10-11nm Logic
10-11nm RAM
3D NAND G1
14nm Intel
14-16nm RAM
1x-z NV
22,16nm Logic
22-20nm RAM
2x-z NV
32,28,20nm Logic
32-28nm RAM
45nm Logic
65/45 nm RAM
65 nm Logic
90 nm Logic
130 nm Logic
180-150 nm L
>180nm
< 2.5% estimated growth for 2016
The global supply and demand balance for silicon wafers has increasingly tightened due in part to:
• Growing 300mm diameter demand for memory production and foundry logic;
• Recovering / expanding small diameter demand for automotive, industrial and IoT; and
• Lack of “brick and mortar” expansion in wafer supply into 2016
Allocation of 300mm will continue, as prices continue to rise
Investment needed to increase capacity and “Break the log-jam” – but suppliers hesitant
Wafer Starts AnalysisFrom TECHCET’s Critical Materials Report™ on Silicon Wafers
120 M
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For more information on TECHCET’s Wafer reports please go to www.techcet.com
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NF3 Supply/Demand 2016
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
2014 2015 2016 2017 2018 2019 2020
NF3 Forecast
Supply Demand
From TECHCET’s Critical Materials Report™ on Gases 2017
Total demand likely outpace supply by 2019
Possibility of NF3 shortage starting in 2018Pricing expected to increase in 2017 and 2018
3d NAND market growing at >40% CAGR thru 2018This combined with display demand will push total growth up into the double digits
Capacity is tight in both NF3 and WF6
3,250 TPY of new capacity were added in 2016Need over 2,500 TPY of additional capacity by 2018SK Materials and Hyosung may investPeric?
Manufacturers have been hesitant to invest
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3DNAND XeF2 usage expected to climb >40% over the next 2-3 years
Leading to possible shortage by 2018
Satellite usage for ElectonicPropulsion growting 56%/yrover the next few years further straining supply
May 2017 10
~ 9,500 Nm3
Xenon Shared Among IndustriesFrom TECHCET’s Critical Materials Report™ on Xenon & Neon
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3DNAND XeF2 usage expected to climb >40% over the next 2-3 years
Leading to possible shortage by 2018
Satellite usage for ElectonicPropulsion growting 56%/yrover the next few years further straining supply
May 2017 11
~13,200 Nm3
Xenon Shared Among IndustriesFrom TECHCET’s Critical Materials Report™ on Xenon & Neon
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EUV Litho StatusAfter 10+ years of plans and postures, EUVL will begin limited production use in 2018 at Intel, Samsung, and TSMC - GF and possibly at a leading US memory manufacturer
Resi
st M
arke
t ($M
M U
SD)
From TECHCET’s Critical Materials Report™ on Photoresist, Extensions & Ancillaries
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SummaryGlobal politics coming into play with regard to commerce and environmental regulations
China advancing in materials competency and market share
Raw material supply-chain issues will be an increasing concern
EHS Issues will continue to be important
Innovation still alive and well but coming from smaller entities
Materials Supply Segments will continue growing 4% CAGR with sweet spots >12% thru 2020
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TECHCET Critical Materials Report Advisories
1 Ceramics & SiC - Equipt Components2 CMP Slurries and Pads Consumables3 CMP Consumable Equipment Components4 CVD / ALD Dielectric Precursors5 CVD / ALD Metal Precursors6 Device Technology Trends and Materials Requirements7 Electronic Gases8 Neon Supply & Demand9 Photoresists and Ancillaries
10 Quartz -Equipment Components11 Silicon Wafers12. Metal Chemicals (ECD, ELP, AgSn, etc.)13. Sputtering Targets14. Wet Process Chemicals
TECHCET’s Critical Materials Reports™ & Services
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TECHCET’s Services
Training: Materials Markets & Technology
Custom Consulting Projects
Critical Materials Council (CMC)
CMC Fabs Membership
CMC Associate Membership
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Jonas, Sundqvist, Ph.D. – Sr. Technology Analyst• Fraunhofer, Quimonda
Bruce Adams – Sr. Market Analyst• Matheson Gas, Air Products, & Chemicals, Honeywell
Terry Francis – Sr. Technology Analyst• Matheson Gases, Applied Materials, Air Products
Brooks Hurd– Sr. Technology Analyst• Quantum Clean, Matheson Gas, SAES Getters, Air Products
Sue Davis – Sr. Market Analysts• Sematech, Rohm & Haas, Rodel, Texas Instruments
► Kuang-Han Ke – Sr. Market Analyst• Gransystems, Applied Materials
► Tim Dyer – Sr. Technology Analyst• Elcon, Matsci, Morgan Ceramics, IPEC/Speedfam
Techcet Group Analysts (& Experience)
Lita Shon-Roy – President / CEO• Rasirc/Matheson Gas, IPEC/Athens, Air Products, Rockwell/
Brooktree, Hughes Aircraft
► Karey Holland, Ph.D. – Chief Technical Officer• MegaFluid Systems, FEI, NexPlanar, IPEC, Motorola, IBM
► Mike Walden – Director, Business Development / Sr. Analyst
• SunEdison, SUMCO, IBM
► Ed Korczynski – Director, Marketing / Sr. Analyst• Solid State Technology, Intermolecular, Nanomarkets, Applied
Materials
► Diane Scott, Ph.D. – Manager, Technical Accounts, Sr. Technology Analyst
• Nexplanar, CMP Solutions, Rohm & Haas / Dow
► Yu Bibby, Ph. D. – Sr. Technology Analyst• UV Global, ipCapital Group, Wilkes University
► H.T. Jeong – Korea Technical Accounts Manager• Renotek, Seojin Electronics
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