screening of passive components · 3 12) the vendor submitting the proposal shall have a minimum of...

ANNEXURE 1

Screening of Passive Components

March 2016

ISRO Satellite Centre Bangalore

1

CONTENTS PAGE NOS.

1. Request for Proposal 2

2. Section 1: General guidelines 4

3. Section 2: Responsibilities of ISAC/VENDOR 6

4. Section 3: Test Matrices for different components

- Screening Test Matrix for Leaded Capacitors 9

- Screening Test Matrix for Chip Capacitors 10

- Relifing/Incoming Inspection Matrix for Leaded & Chip Capacitors 11

- Screening Test Matrix for Leaded Resistors 12

- Screening/Relifing Test Matrix for RCR Resistors 13

- Screening Test Matrix for Chip Resistors 14

- Screening Test Matrix for Heaters 15

- Relifing/Incoming Inspection Test Matrix for Resistors/Heaters 16

- Screening Test Matrix for Leaded Inductors 17

- Screening Test Matrix for Chip Inductors 18

- Relifing/Incoming Inspection Test Matrix for Leaded & Chip Inductors 19

- Screening/Relifing/Incoming Inspection Test Matrix for Cores 20

- Screening Test Matrix for other Passive Components 21

- Relifing/Incoming Inspection Test Matrix for other Passive Components 22

- Relifing/Incoming Inspection Test Matrix for Relays 23

- Relifing/Incoming Inspection Test Matrix for Connectors & Fuses 24

5. Section 4: Illustrative Test Procedure for different components

- Illustrative Test Procedure for Leaded Resistors 25

- Illustrative Test Procedure for Leaded Capacitors 27

6. Total Qty of Passive Components for Screening/Relifing 29

7. Annexure - Compliance Matrix 30

2

REQUEST FOR PROPOSAL

1) Proposals are invited from Qualified vendors for testing of Space grade electronic passive components at ISAC. The scope of work mainly consists of two types of testing as given below:

i. Screening ii. Relifing/Incoming Inspection

2) The total workload under this RFP shall be executed by two Vendors simultaneously.

The sharing of workload shall be decided by ISAC based on quotes. 3) The contract shall be valid for a period of 3 years from the date of release of P.O.

extendable for another one year under mutual consent. However, ISAC reserves the right to short close the contract without specifying any reasons.

4) ISAC reserves the right to short close or terminate contract without providing reasons or

if the requirement of screened components is considered sufficient to meet Centre need.

5) Enhancement of upto 50% of the total quantity is likely and can be agreed upon by mutual consent at a later date if required.

6) ISAC reserves the right to enhance/reduce the manpower as and when required. 7) Various requirements to be met to perform these tests are explained in different sections

as given below. Section 1: General requirements/mode of testing, related guidelines, mode of

Billing/payment etc. Section 2: Responsibilities of ISAC/Vendor. Section 3: Test matrices for different components with illustrative examples.

8) The proposal shall clearly explain their compliance to various requirements specified

here in. Point-wise compliance shall be provided by the vendors.

9) The approximate quantity of components tested is expected to be about 30000 nos. per month.

10) Each vendor shall deploy a technical team to meet the throughput of 15000 components

per month. To meet this work load, approximately 1700 man hours is required per month. The skills required for the personnel to execute this work shall be Diploma / ITI in Electronics.

11) The technical team of Diploma/ITI Holders shall have a minimum of 2 years experience

of Screening and Relifing of Space Grade components. Necessary proof shall be enclosed along with the quotation.

3

12) The vendor submitting the proposal shall have a minimum of 5 years experience of Screening and Relifing of Space Grade Components in ISRO or any other Government organization. Relevant Purchase orders shall be enclosed along with the quotation. Quotations not meeting this criteria will not be considered.

13) The Test equipments/ tools required for testing of components (Refer Section 2) shall

be the responsibility of the vendor.

14) Vendor is responsible for the Calibration / maintenance / safe keeping of their test equipments/ tools.

15) Vendor shall provide the list of personnel deployed along with the details like period of

experience, organizations served in the related area.

16) Vendors shall be capable to start the activity immediately on placement of order. Required resources must be available with vendor for verification/inspection before placement of order.

17) Vendor shall have all the required resources like equipments, manpower, accessories,

etc for verification/inspection at the time of quotation.

4

SECTION-1: GENERAL GUIDELINES

1) Testing of the components shall be performed in ISITE/ISAC premises.

2) Components issue is through Work Orders. Work instructions for Screening/Relifing of components will be provided by ISAC.

3) The tests shall be conducted as per the test matrices provided in Section 3.

4) The test equipments shall not be older than 5 years at the time of quotation. Any change

from this requirement must be clearly indicated in the quotation and needs the concurrence of ISRO.

5) Components meant for testing are Hi-rel components for space applications. Hence.

utmost care shall be taken while handling.

6) ESD precautions as per document ISRO-ISAC-TR-0231 shall be followed.

7) Appropriate test instruments shall be used for electrical parameter measurements.

8) Calibration of the test instruments shall be carried out once a year, by the vendor and the calibration certificate shall be provided.

9) In case, components are damaged due to negligence/mishandling, the cost thereof will be recovered from the vendor.

10) It is the responsibility of the vendor to comply with all statutory obligations/rules arising out of this contract.

11) Working hours is from 8:30 AM to 5:00PM with half an hour lunch break.

12) Canteen and Transport facility will not be available under this contract.

13) Test reports

a. The results of screening shall be recorded by the vendor in the prescribed format. b. The deviation(s) observed either in the parameters or the drift shall be highlighted

in the report. c. Reports shall be submitted in soft copy.

14) Packing

Subsequent to completion of screening, the components shall be suitably packed in such a way that they are physically secured.

5

15) Verification of testing and test results

a) The vendor’s focal point identified shall be responsible for the overall activity. He/she shall verify the recorded reading and provide the remarks w.r.t pass/fail of the components tested.

b) ISAC reserves the right to make random checks of any of the works associated with the test activities.

c) ISAC shall review the data provided by the Vendor while receiving the tested components.

d) ISAC shall cross check the test results of the returned lots. If any anomaly is found, the reason for the same shall be established by the vendor. If the anomaly reveals any deficiency in testing, the test activity may have to be suspended immediately until corrective action is taken to the satisfaction of ISAC.

16) Payment

Payments will be made on a pro-rata monthly basis after satisfactory completion of testing and certification by the contract manager.

6

SECTION 2: RESPONSIBILITIES OF ISAC/ VENDOR

Sl. No. TASKS

RESPONSIBILITIES I INFRASTRUCTURE:

1.

Providing necessary work area, work tables, electrical power, environmental test facilities.

ISAC

EQUIPMENTS QTY

VENDOR

a. Digital Multi meter 6 ½ digits, ( to measure 0.1 ohm to 300 Mohm) Model: HP 34401A or equivalent

1 each

b. LCR Meter (120 Hz to1 Khz, Signal: 100 mV to 5V p-p) Model: ANDO AG4311 or equivalent

1 each

c. LCR Meter (1 Mhz, Signal 100 mV to 5V p-p) Model : AGILENT 4284A or equivalent

1 each

d. Milli Ohm Meter (2mΩ to 20Ω) Make : Agilent/Digital Converter or equivalent

1 each

e.

Insulation Resistance Meter Range 106 to 1011 Ω, DC settable in steps upto 1000 V) Model: HP4339A or equivalent

1 each

f. Hand held DMM Make: Keithley 196 or equivalent

1 each

g. Dielectric Voltage Tester (Range upto 5 KV DC) Model: RM215GMK1V or equivalent

1 each

h. Magnifier 10X and 30X Model: MANTIS or equivalent

1 each

i. Surge Current test equipment 1 each

j.

Regulated Power supplies, Make: APLAB or equivalent (a) With safety features like current limit, crow bar, fold back (b) With Surge Current Protection (c) voltage capabilities as given below:

Maximum of 50 volts DC 1 each




7

SECTION 2: RESPONSIBILITIES OF ISAC/ VENDOR

I TEST FIXTURES RESPONSIBILITIES

1. Test fixtures adaptable to the above given equipment to test

(a) Leaded components and (b) Chip components

VENDOR

2. Calibration of Equipment VENDOR

3. Burn – in boards with necessary clips and fuses VENDOR

4. Maintenance of equipments while usage VENDOR

II MATERIALS

a. Serialization tapes ISAC

b. Wrist bands ISAC

c. General tools like tweezers, pliers etc VENDOR

d. ESD safe covers for packing of components ISAC

e. Providing the formats for recoding the test data ISAC

III WORK METHOD

a. Components issue through Work Orders ISAC

b. Generation/review Test Reports VENDOR

c. Return of components with test results in specified formats. VENDOR

d. Monitoring the test activities. VENDOR

e. Responsibility for any damage/loss suffered by ISAC due to the misapplication and/or negligence of vendor’s staff

VENDOR

f. Audit of Test ISAC

g. Final Report Review ISAC

8

SECTION 3 SCREENING TEST MATRIX FOR LEADED CAPACITORS

Notes:

1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours. 3. The burn-in conditions/voltage to be applied during Burn-in test shall be crosschecked and

countersigned by the concerned in-charge before starting the Burn-in or voltage conditioning. 4. The Burn-in shall be monitored at regular intervals of 4 hours. In case of power interruption,

the time elapsed shall be noted and correspondingly the test schedule shall be extended. 5. The post Burn-in electrical tests shall be made within 24 hours of completion of burn-in.

Sl. No. INSPECTION/TEST TEST CONDITIONS

1. Decoding of Component Marking

2. Serialisation All components have to be serialized before screening

3. Visual Inspection Magnification : 10X 4. Temperature Cycling Temp: –550C +250C +1250C, +250C

Duration : 15 min, 5 min, 15 min, 5 min No. of cycles : 5 cycles

5. Voltage Conditioning As per MIL Specifications

6.

Electrical Parameter Meas: a. Capacitance & Dissipation

Factor

As per MIL Specifications

b. Dielectric Withstanding Voltage

FOR CKR 2.5times rated voltage for 5 secs between leads. FOR CRH & CMR: 2 times rated voltage for 60 secs between leads

c. Insulation Resistance/ Leakage Current

At rated voltage for 30 secs, between leads.

7. Seal Leak Test (For CSR, CLR & CRH only)


8. Surge Current Test (For CSR only)

At Rated Voltage

9. Lead Tinning (For CSR only) Temp: 250°C to 260°C

10. Radiography Test (For CSR only) As per MIL Specifications

11. BMLT Test for 50V rated CKR Capacitors on samples Temp: 85°C, Humidity: 85%RH, Duration 240 hrs

12. Review of Test Reports

13. Segregation of Components wrt Pass/Fail

14. Packing

9

SCREENING TEST MATRIX FOR CHIP CAPACITO RS

Notes:

1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours.

Sl. No. INSPECTION/TEST TEST CONDITIONS


2. Visual Inspection Magnification : 30X

3. Temperature Cycling

Temp: –550C +250C +1250C, +250C Duration : 15 min, 5 min, 15 min, 5 min No. of cycles : 5 cycles

4.

Electrical Parameter Measurements: a. Capacitance & Dissipation Factor


b. Dielectric Withstanding Voltage for CDR

2.5 times the rated voltage for 5 secs between leads.

c. Insulation Resistance / Leakage Current


5. Surge Current Test for CWR capacitors At Rated Voltage

6. BMLT Test for 50V rated CDR capacitors on samples

Temp: 85°C, Humidity: 85%RH, Duration : 240 hrs



9. Packing

10

RELIFING/INCOMING INSPECTION TEST MATRIX FOR

LEADED & CHIP CAPACITORS

Sl. No.

INSPECTION/TEST TEST CONDITIONS

1. Visual Inspection

Mag: 10X for leaded components Mag: 30X for Chip Components

2.

Electrical Parameter Measurements: a. Capacitance & Dissipation Factor


b. Insulation Resistance/

Leakage Current


3.

Review of Test Reports


5. Packing

11

SCREENING TEST MATRIX FOR LEADED RESISTORS Sl. No. INSPECTION TEST TEST CONDITION




4.

Temperature Cycling

Temp: -650C +250C +1500C +250C Duration: 15min 5min 15min 5min No. of cycles : 5 cycles

5. Voltage Conditioning

a. RNR/RNC55: 5X rated power at room temp. for 1 hr. b. RLR: 1.5Xrated power at room temperature 24 hrs. c. RWR/RER: Rated power at room temperature for 100

hrs with 1.5 hrs ON and 0.5 hrs OFF.

6. Electrical Parameter Measurements

DC Resistance 4 wire measurement for low values


8.

Segregation of Components wrt Pass/Fail

9.

Packing

Notes:

1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours. 3. The burn-in conditions/voltage to be applied during Burn-in test shall be crosschecked and



12

SCREENING/RELIFING TEST MATRIX FOR RCR RESISTOR S Sl. No. INSPECTION TEST TEST CONDITION



Magnification : 10X

3. High Temperature Storage Temp: 125°C




6.


7.

Packing

Notes:

1. Same equipment shall be used for initial & final or pre and post Storage measurements.

13

SCREENING TEST MATRIX FOR CHIP RESISTORS Sl. No. INSPECTION TEST TEST CONDITION



3.

Temperature Cycling

Temp: -650C +250C +1500C +250C Duration: 15min, 5min, 15min, 5min No. of cycles : 5 cycles




6.


7.

Packing

Notes: 1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours.

14

SCREENING TEST MATRIX FOR HEATERS Sl. No. INSPECTION TEST TEST CONDITION



3. Visual Inspection Magnification: 10X

4.

Temperature Cycling

Temp: -650C, + 250C + 1500C, + 250C Duration: 15min, 5min, 15min, 5min No. of cycles : 5 cycles

5. Voltage Conditioning

At Rated Power for 168 hours at room temperature.

6.

Electrical Parameter Measurements a. DC Resistance b. Dielectric Withstanding Voltage c. Insulation Resistance




9.

Packing

Notes: 1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours. 3. The burn-in conditions/voltage to be applied during Burn-in test shall be crosschecked and



15

RELIFING/INCOMING INSPECTION TEST MATRIX FOR LEADED & CHIP RESISTORS/HEATERS

Sl. No. INSPECTION TEST TEST CONDITION


Mag 10X for leaded Resistors/Heaters Mag 30X for Chip Resistors

2.

Electrical Parameter Measurements

DC Resistance 4 wire ohm measurement for low values of resistors.


4.


5.

Packing

16

SCREENING TEST MATRIX FOR LEADED INDUCTORS Sl. No. INSPECTION TEST TEST CONDITION


2.

Serialisation

All components have to be serialized before screening


4.

Temperature Cycling

Temp: -650C, +250C +1500C, +250C Duration: 15min, 5min, 15min, 5min No. of cycles : 5 cycles

5. Burn-in

At rated current Duration : 48 hrs Temp: Class A: 105°C, Class B: 125°C

7.

Electrical Parameter Measurments a. Inductance b. Quality Factor c. DC Resistance d. Dielectric Withstanding Voltage e. Insulation Resistance




10.

Packing




17

SCREENING TEST MATRIX FOR CHIP INDUCTORS




3.

Temperature Cycling

Temp: -650C, +250C +1500C, +250C Duration: 15min, 5min, 15min, 5min No. of cycles : 5 cycles

4.

Electrical Parameter Measurements a. Inductance b. Quality Factor c. DC Resistance d. Dielectric Withstanding Voltage e. Insulation Resistance



6.


7.

Packing

Notes: 1. Same equipment shall be used for initial & final or pre and post burn-in measurements. 2. Post temperature cycling measurements shall be made within 24 hours.

18

RELIFING/INCOMING INSPECTION TEST MATRIX FOR LEADED & CHIP INDUCTORS



Mag 10X for leaded Resistors Mag 30X for Chip Resistors

2.

Electrical Parameter Measurements a. Inductance b. Quality Factor c. DC Resistance d. Dielectric Withstanding Voltage e. Insulation Resistance



4.


5.

Packing

19

SCREENING/ RELIFING/INCOMING INSPECTION TEST MATRIX FOR CORES




3.


4.

Packing

20

SCREENING TEST MATRIX FOR OTHER PASSIVE COMPONENTS

(Thermistors, PRTs, Filters, Microswitches)



2.

Serialisation

All components have to be serialized before screening


4. High Temperature Storage

Temp: 125°C

5.

Temperature Cycling

Temp: -650C, + 250C + 1500C, + 250C Duration: 15min, 5min, 15min, 5min No. of cycles : 5 cycles

6. Overload Cycling Test As per MIL Specifications

7. Burn-in


8. Electrical Parameter Measurments



10.


11.

Packing




21

RELIFING/INCOMING INSPECTION TEST MATRIX FOR OTHER PASSIVE COMPONENTS

(Thermistors, PRTs, Filters, Microswitches)



2.

Electrical Parameter Measurements



4.


5.

Packing

22

RELIFING/INCOMING INSPECTION TEST MATRIX FOR

ELECTROMECHANICAL RELAYS


1. Visual Inspection Mag 10X



3. Seal Leak Tests (Fine & Gross)



5.

Packing

23

RELIFING/INCOMING INSPECTION TEST MATRIX FOR CONNECTORS

Sl. No.

INSPECTION TEST TEST CONDITION





4.

Packing

RELIFING/INCOMING INSPECTION TEST MATRIX FOR FUSES

Sl. No.

INSPECTION TEST TEST CONDITION


2. Serialization For FM08 only




4.

Packing

24

SECTION 4

ILLUSTRATIVE TEST PROCEDURE FOR LEADED RESISTORS

(METAL FILM RESISTOR – RNC55) The detailed procedures for screening tests to be performed on Metal film resistors of RNC55 style manufactured as per MIL-PRF–55182 is given here under. The screening tests are to be performed on 100% of the components. 1. Visual Inspection

a. Typographical information

Check the following ii. Style iii. Resistance Value iv. Tolerance, failure rate, lead type & “JAN” marking v. Date Code/Lot code/Source code vi. Manufacturer

b. Workmanship Inspect using illuminating magnifier of 10X magnification and look for the following: • Cuts on the leads – Leads shall have no cuts, nicks or scrapes exceeding 10% of

their diameter. • Damage to the body – There shall be no physical damage like dents, scratches, pin

holes, chip offs, cracks etc. on the body. 2. Serialization:

Fix the Serialization tapes on the component body in the direction of the marking such that none of the information specified under “Typographical checks” above is covered.

3. Electrical measurements: Measure the DC resistance

4. Thermal Shock

STEP TRANSITION TEMP. IN deg.c TRANSITION TIME

DWELL TIME* FROM TO

1. +25 -65* <5 minutes <5 minutes 2. -65 +25* <5 minutes <15 minutes 3. +25 +150* <5 minutes <5 minutes 4. +150 +25* <5 minutes <15 minutes

The above 4 steps constitute one cycle. The components shall be subjected to 5 cycles.

25

ILLUSTRATIVE TEST PROCEDURE FOR LEADED RESISTORS (Contd.)

5. Voltage Conditioning:

Dissipate 5 X rated power at room temperature for a period of 1 hour. While staring, apply the voltage gradually. Once the required voltage is reached, retain it during the complete duration of conditioning.

6. Electrical Measurements:

Repeat Electrical measurements as per Para 3 using the same meter.

7. Drift Calculation:

Calculate the drift in percent between the initial and the final resistance value measured, for all resistors.

(INITIAL RESISTANCE – FINAL RESISTANCE) X 100 INITIAL RESISTANCE

8. Visual and Mechanical Examination

Repeat Typographical check (Sl. No. 1). Verify the following • The markings are still readable and not faded. • The colour of body and lead has not changed. • There is no evidence of physical damages like dents, bulges, deformations, cracks etc on

the body.

9. Lot Acceptance/Rejection

The lot acceptance rejection will be decided based on Percent Defect allowance (PDA). The lot will be accepted only if the rejected components are less than 5% of the lot size. Visual failures are not considered in PDA criteria.

26

ILLUSTRATIVE TEST PROCEDURE FOR LEADED CAPACITORS

FIXED, ELECTROLYTIC (NON-SOLID ELECTROLYTE), TANTAL UM (STYLE CLR79)

This section gives detailed procedures for screening tests to be performed on Tantalum capacitors of CLR79 style manufactured as per MIL-PRF-39006. the screening tests are to be performed on 100% of the components unless specified. 1. Visual Inspection

6. Typographical information

Check for the marking/correctness of the following information i. MIL identification number ii. “JAN” marking iii. Part number (including MIL, slash, dash number) iv. Capacitance, Rated Voltage & tolerance v. Polarity marking vi. Date code/Lot code/Source code vii. Manufacturer

7. Workmanship

Inspect using illuminating magnifier of 10X magnification and look for the following:

• Cuts on the leads – Leads shall have no cuts, nicks or scrapes exceeding 10% of their diameter.

• Foreign material – All terminals and end seals shall be free of grease or other foreign material.

• Insulating Sleeves – Insulating sleeves shall fit the container case in such a manner that there are no loose seams or ragged ends.

• Damage to the body – There shall be no physical damage like dents, scratches etc. on the body.

2. Serialization:

Fix the Serialization tapes on the component body in the direction of the marking such that none of the information specified under “Typographical checks” above is covered.

27

ILLUSTRATIVE TEST PROCEDURE FOR LEADED CAPACITORS (Contd.)

3. Electrical measurements:

PARAMETERS TEST CONDITION MEASUREMENT ACCURACY

Capacitance Test frequency : 120Hz ± 5Hz Amplitude : 1 Vrms Dc bias : 2.1 to 2.2V

± 2%

Dissipation Factor Test frequency : 120Hz ± 5Hz Amplitude : 1 Vrms DC bias : 2.2V + 0V/-1V

±2%

DC Leakage Current Apply DC rated voltage for <5 minutes. ± 0.6%

4. Thermal Shock

STEP TRANSITION TEMP. IN deg.c TRANSITION TIME

DWELL TIME* FROM TO

1. +25 -55* <5 minutes <5 minutes 2. -55 +25* <5 minutes <15 minutes 3. +25 +125* <5 minutes <5 minutes 4. +125 +25* <5 minutes <15 minutes

*The above 4 steps constitute one cycle. The components shall be subjected to 5 cycles. 5. Fine leak measurements:

Perform the fine leak measurements as per the table given below

For Case size Bombing condition Limit T1, T2 30 PSI – 4 hours <1 X 10-7 atm cc/sec T3, T4 60 PSI – 2 hours <1 X 10-8 atm cc/sec

• Place the component inside a sealed chamber • Evacuate the chamber. • Pressurize the chamber with a tracer gas (Helium) for a period mentioned in the above

table, so that the gas is forced into the specimen if there is a defect in its seal.

28

Total qty for Screening/Relifing (Period : 3 Years)

Sl. No. DESCRIPTION QTY

(nos.) SCREENING

1. Screening of Leaded Capacitors 50000

2. Screening of Chip Capacitors(CDR & CWR) 150000

3. Screening of CSR Capacitors 50000

4. Screening of Leaded Resistors 120000

5. Screening of Chip Resistors 260000

6. Screening of RCR Resistors 50000

7. Screening of Heaters 10000

8. Screening of Cores 15000

9. Screening of Inductors 7000

10. Screening of Other Passive Components 10000

RELIFING/INCOMING INSPECTION

1. Relifing/Incoming inspection of Leaded Capacitors 24000

2. Relifing/Incoming inspection of Chip Capacitors (CDR & CWR) 66000

3. Relifing/Incoming inspection of CSR Capacitors 8000

4. Relifing/Incoming inspection of Leaded Resistors 40000

5. Relifing/Incoming inspection of Chip Resistors 80000

6. Relifing/Incoming inspection of RCR Resistors 70000

7. Relifing/Incoming inspection of Heaters 5000

8. Relifing/Incoming inspection of Cores 15000

9. Relifing/Incoming inspection of Inductors 2000

10. Relifing/Incoming Inspection of Other Passive Components 5000

11. Relifing/Incoming Inspection of Relays, Connectors & Fuses 60,000

Components for Screening : 7,22,000 Components for Relifing : 3,75,000 Total : 10,97,000

29

Annexure – COMPLIANCE MATRIX

Sl. No Specification/Requirement Compliance

1. Work mainly consists of Screening and Relifing/Incoming Inspection of Space grade Electronic passive components

2. The total workload under this RFP shall be executed by two vendors simultaneously. The sharing of workload shall be decided by ISAC based on quotes.

3. The contract shall be valid for a period of 3 years from the date of release of P.O. extendable for another one year under mutual consent.

4. ISAC reserves the right to short close or terminate contract without providing reasons or if the requirement of screened components is considered sufficient to meet Centre need.

5. Enhancement of upto 50% of the total quantity is likely and can be agreed upon by mutual consent at a later date if required.

6. ISAC reserves the right to enhance/reduce the manpower as and when required.

7. Point-wise compliance shall be provided by the vendors.

8. Throughput of the tested components is around 30000 nos. per month.

9. Each vendor shall deploy a technical team to meet the throughput of 15000 components per month. (1700 man hours approx.).

10. Diploma/ITI holders shall have a minimum of 2 years experience of Screening/Relifing of Space grade components.

11. Vendor shall have a minimum of 5 years experience of Screening and Relifing of Mil/Space Grade components.

12. The test equipments/tools required for testing of components shall be the responsibility of the vendor.

13. Vendor is responsible for the calibration/maintenance/safe keeping of their test equipments/tools.

14. Vendor shall provide the list of personnel deployed with details like period of experience, organizations served in the related area.

15. Vendor shall be capable of starting activity immediately after placement of order.

16. Vendor shall have all the required resources like equipments, manpower, accessories, etc for verification/inspection at the time of quotation.

17. Testing shall be at ISAC/ISITE premises.

18. Tests shall be performed as per the screening matrices in Section 3.

30

ANNEXURE – COMPLIANCE MATRIX


19. Test equipments shall not be older than 5 years at the time of quotation.

20. Handling/ESD precautions as per ISRO-ISAC-TR-0231 shall be followed.

21. Appropriate test instruments shall be used for electrical measurements.

22. Calibration of the test instruments shall be carried out once a year.

23. Cost of damaged components due to negligence/mishandling shall be recovered from the vendor.

24. Vendor shall comply with the statutory obligations of the manpower deployed.

25. Working hours is from 8.30a.m to 5.00p.m with half an hour lunch break.

26. Canteen and Transport facility will not be available.

27. Test reports to be submitted in soft copy

28. Components shall be suitably packed after screening.

29. Focal point identified shall be responsible for the overall activity.

30. ISAC reserves the right to make random checks.

31. If any anomoly is found during cross check in testing, the test activity will have to be suspended immediately.

32. If samples fail in electrical/visual inspection during acceptance of a batch the entire lot has to be retested again.

33. Payments on pro-rata monthly basis.

31

ANNEXURE - COMPLIANCE MATRIX


34. Equipments as per the details given below shall be available for the test activity.

a. Digital Multi meter 6 ½ digits, Model : HP34401A or equivalent. ( to measure 0.1 ohm to 300Mohm) - 1 each

b. LCR Meter , Model: Ando AG4311 or equivalent – 1 each (120 Hz to1 Khz, Signal 100 mV to 5V p-p)

c. LCR Meter, Model: Agilent 4284A or equivalent - 1 each (1 Mhz, Signal 100 mVto 5 V p-p)

d. Milli Ohm meter, Make:Agilent/Digital Converter or equivalent (2 mΩ to 20Ω) – 1 each

e. Insulation Resistance Meter, Model: HP4339A or equivalent -1 each Range 10 6 to 10 11 Ω, DC settable in steps up to 1000 V)

f. Hand held DMMs, Model: Keithley 196 or equivalent -1 each

g. Dielectric voltage Testers , Model: RM215GMK1V or equivalent (Range upto 5 KV DC) – 1 each

h. Magnifier 10X & 30X, Make: Mantis or equivalent – 1 each

i. Surge Current test equipment - 1 each.

j. Data acquisition systems

k.

Regulated Power supplies Make: Aplab (a) with safety features like current limit, crow bar, fold back (b) With Surge Current Protection (c) voltage capabilities as given below.

Maximum of 50 volts DC – 1 each




32



35. Test fixtures adaptable to the above given equipment to test

(a) Leaded components and (b) Chip components

36. Calibration of Equipment

37. Interfacing the test equipment with data acquisition system for data recording and processing

38. Burn – in boards with necessary clips and fuses

39. Maintenance of equipments while usage.

40. Wrist bands & General tools like tweezers, pliers etc

41. Generation/review tests reports

42. Return of components with test results in specified formats.

43. Monitoring the test activities.

44. Leaded Capacitors shall be Screened as per given matrix

45. Chip Capacitors shall be Screened as per given matrix

46. Leaded & Chip Capacitors shall be relifed/Incoming Inspected as per given matrix

47. Leaded Resistors shall be Screened as per given matrix

48. RCR Resistors shall be Screened as per given matrix

49. Chip Resistors shall be Screened as per given matrix

50. Heaters shall be Screened as per given matrix

51. Resistors/Heaters shall be relifed/Incoming Inspected as per given matrix.

52. Leaded Inductors shall be Screened as per given matrix

53. Chip Inductors shall be Screened as per given matrix

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54. Leaded & Chip Inductors shall be relifed/Incoming Inspected as per given matrix

55. Cores shall be Screened/relifed/Incoming Inspected as per given matrix

56. Other passive components shall be Screened as per given matrix

57. Other passive components shall be relifed/Incoming Inspected as per given matrix

58. Relays shall be relifed/Incoming Inspected as per given matrix

59. Connectors shall be relifed/Incoming Inspected as per given matrix

60. Fuses shall be relifed/Incoming Inspected as per given matrix

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Sl. No Specification/Requirement Quantity (nos.)

Compliance

61. Total number of components as per the details given below shall be screened/relifed/incoming inspected by each contractor:

a. Screening of leaded Capacitors 50000

b. Screening of Chip capacitors (CDR & CWR) 150000

c. Screening of CSR Capacitors 50000

d. Screening of Leaded Resistors 120000

e. Screening of Chip Resistors 260000

f. Screening of RCR Resistors 50000

g. Screening of Heaters 10000

h. Screening of Cores 15000

i. Screening of Inductors 7000

j. Screening of Other Passive Components 10000

k. Relifing/Incoming Inspection of Leaded Capacitors 24000

l. Relifing/Incoming Inspection of Chip Capacitors (CDR & CWR)

66000

m. Relifing/Incoming Inspection of CSR Capacitors 8000

n. Relifing/Incoming Inspection of Leaded Resistors 40000

o. Relifing/Incoming Inspection of Chip Resistors 80000

p. Relifing/Incoming Inspection of RCR Resistors 70000

q. Relifing/Incoming Inspection of Heaters 5000

r. Relifing/Incoming Inspection of Cores 15000

s. Relifing/Incoming Inspection of Inductors 2000

t. Relifing/Incoming Inspection of Other Passive Components

5000

u. Relifing/Incoming inspection of Relays & Connectors 60,000

screening of passive components · 3 12) the vendor submitting the proposal shall have a minimum of...

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