scotle hr6000 manual

Shenzhen SCOTLE Technology ----------------------------------------------------------------------- Email:[email protected] Tel:8675589378931 http://www.scotle.com/

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深圳市玉海源科技有限公司SHENZHEN SCOTLE TECHNOLOGY LTD


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Scotle-HR6000 BGA Rework Station Manual

Catalog

1. Company Profile

2. Installations

3. Safety Cautions

4. Structures and Specifications

5. Operations

6. Touch Screen

7. Tips for Operation

Appendix: Packing list

ADD: First Floor, A# Dormitory, Nankeng First Industry Park,Bantian,Longgang District,

Shenzhen, China

Website: www.scotle.com

Tel: 8675589378931

E-mail: [email protected]

mailto:[email protected]


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1. Company Profile

SCOTLE Technology LTD is a manufacturer which specialized in design and research,

test and manufacture, sales and service of BGA Rework stations, BGA rework peripheral

accessories such as BGA pre-heaters, BGA reballing stations, BGA reballing stencil kits,

SMT/SMD stencils, different kinds of main board rework jigs, BGA solder fluxes, BGA

solder balls, BGA soldering wires, high temperature tapes and so on.

SCOTLE owns its own brand and trademark .SCOTLE BGA rework stations

using imported high quality ceramic and other precision material, and they are working

steady with high performance. Now, they are widely used in more than 80% BGA rework

areas such as mobile phones, computers, laptops, Switches, game consoles like Wii, Xbox,

PS3…

SCOTLE products passed the quality management system ISO9001:2000, obtained CE

certification and they are mainly exported to Europe, America, Mexico, Brazil, Australia,

South Africa and Southeast Asia, covering different countries and regions all over the world.

And has agents in some countries like America, Brazil, Spain, Mexico and gets high praise

from customers.

SCOTLE always insists the concept of using leading technology, providing top quality,

customers -oriented, and best service for all over the world. Its core value is integrity,

innovation, cooperation, and win-win situation.

SCOTLE never stops to learn from domestic and foreign industry development experience

and hear from customers and users’ good suggestions to improve and develop new

products to satisfy customers with better products. It is looking for long-term business

partner all over the world.

2. Installation of BGA Rework Station

（1）Place for installation

To ensure the rework station's useful life, installation should according to conditions

under below:

1. Away from combustibles and explosion-prone objects;

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2. Place won't be splashed with water or other liquids；

3. Dry place with good ventilation；

4. Stable and even place where not easy to be shaken;

5. Place with less dust；

6. Above control box heavy object is strictly prohibited；

7. Place won't be influenced directly by air flow of air conditioner, air heater or fan；

8. Reserve more than 30cm's place at the back of rework station, for move the machine

around.

（2）Power Requirements

Use a smaller power supply voltage fluctuation

Voltage fluctuations: 220V±10/ 110V±10

Frequency fluctuations: 50Hz±3

3. Safety Cautions 1、 Don't blow the rework station by fans or other devices directly when it is working, or

there will be a negative difference from the surface of the heating board, thus some parts

will be burnt out.

2、 After it is started, the high temperature area should not touch any objects, or it will lead

to a fire or explosion. The PCB and other parts should be put on the PCB bracket.

3、 No vibration. Handle it gently.

4、 Don't touch the heaters with your hands when it is working, or you will get hurt .

5、 Don't use combustible spray, liquefied and flammable gas near the rework station after

it is started.

6、 Don't try to re-equip the machine, or there may be a fire or an electric shock.

7、 There are high-pressure parts in the circuit box. Don't disassemble it.

8、 If some metals fall in the rework station when it is working, turn off the power

immediately. After it is cooled down, get the metal our, and clean the machine. If not, there

may a smell when the machine starts working next time.

9、 When the rework station's temperature rises abnormally or smokes, turn off the power

and inform the service technicians to repair it. Turn off the power of the circuit box and the

machine while moving the rework station. Hold the plug when we remove the wire, or it will

lead to a poor contact then the machine can't work very well.

10、Don't put the rework station on the wires, or there may be a failure, a fire, or an electric

shock.

11、Before you use the machine, you must read the instructions attentively.

4.Scotle-HR6000 Specification：


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Total power 2000W

Top heater power 800W

Bottom heater power 1200W

Power voltage and

frequency AC220V±10％ 50/60Hz

Dimensions L470×W370×H500 mm

Positioning V-groove, PCB support can be adjusted in

X,Ydirection with external universal fixture

Temperature control K thermocouple （K Sensor）Closed loop

Temp accuracy ±2 degree

PCB size Max 280mmⅹ280mm Min20mmⅹ20mm

BGA chip 5*5~55*55

Minimum chip spacing 0.15mm

Net weight About 14.5KG

Description： 1. This machine designed with 2 temperature zones , the upper heated by hot air and the

lower part by IR, the upper and lower temperature are controlled separately, collocated with

high-precision temperature control instrument, which can set 8 heating and cooling

temperature segment, and store 10 groups of temperature meanwhile.

2. It uses high precise k-type thermocouple closed-loop control and automatic temperature

compensation system, with PLC and temperature module to enable precise temperature

deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement

connector enables temperature diction and accurate analysis of real time temperature

curve.

3. The PCB layer board uses an external movable stand, very flexible and convenient.

V-groove PCB works for rapid, convenient and accurate positioning, which can meet all

kinds of PCB board of positioning.

4. Flexible and convenient removable fixture on the PCB board can protect the PCB fringe

devices from damaging and transmuting. It can also adapt to various BGA chip’s repaired.

5. Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily

installation and replacement. Overflow launder on the top of to prevent components around

BGA chip from damaged by blow hot during heating.

6. 8 liters (down) and 8 segments constant temperature control. External lighting,

convenient for work and observation

7. After demolition and completion of welding, operators should make relevant preparations

as hearing the warning voice; meanwhile it should use a large flow cross-flow fan by auto /

manual to cooling of the PCB board, to prevent the deformation of PCB board to ensure the


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welding results.

8. It approved CE certification, and this appliance was equipped with emergency stop

switch and automatic power-off protection device when emergency happens.

5. Operations:

1、Preheat

Preheat the PCB board and BGA chip, and the temperature of constant temperature oven

is set at 80 ℃ -100 ℃, for 4-8 hours to remove internal moisture of the PCB and BGA, to

prevent the burst phenomenon when heating.

2、Remove

Place the PCB board into the bracket on the repair station, and select the appropriate hot

air reflow nozzle, and set the appropriate soldering curve, press the open button until it

finishes, and then move the hot air manually, to suck the BGA chip away with the vacuum

suction pen.

3、Clean-up welding

The BGA pad clean-up , one is to use desoldering line to drag flat, one is by iron; Best to

remove the tin a short time after the BGA removed , then BGA has not completely cooled ,

and the temperature difference make less damage to the pad; use the flux can improve the

activity of soldering tin, better to clean the soldering tin. Particular attention not to damage

the PCB pad, and in order to ensure the reliability of BGA solder, when the cleaning pad to

make use of some of the solder paste residues with more volatile solvents , such as plate

washer water, industrial alcohol.

4、BGA reballing

Wipe the paste flux equably with the brush pen on the BGA pad, choose the right steel

mesh, and then plant tin beads by the re-balling kit on the right pad.

5、BGA tin beads welding

Heat the bottom heating zone of BGA re-balling station and then weld the tin beads on the

pad.

6、Brush flux

Wipe the paste flux with the brush pen on the PCB pad. If you wipe so much, it will cause

connected welding, on the contrary, it will cause null welding. In order to wipe off dust and

impurity of tin balls, and enhance welding effect, the welding paste must be wiped equally.

7、Place the BGA chip


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Place the BGA chip on the PCB board with manual alignment and silk-screen borders,

meanwhile the tension of the solder joint when melt will have a good self- alignment effect.

8、Soldering

First, put the PCB board which is pasted with BGA chip on the positioning stand, and then

move the hot wind head to the working place. Second, choose the appropriate backflow

nozzle and set right welding temperature curve, start heating, open the switch, and then run

the welding process. Besides, after the welding process is finished, you have to cool the

BGA by the cooling fan. Hoist the upper hot wind head and make the bottom of hot wind

nozzle apart from the surface of BGA 3-5mm, and stay 30-40 seconds, or, you can move

the hot wind head after the starting switch is put out, withdraw the hot wind head. Finally,

take away the PCB board from the heating zones.

(1) Empty soldering：

Because of counterpoint by hand will cause deviation between chip and welding plate,

surface tension of tin ball will make BGA chip and welding plate in the process of automatic

correction. Once heating, BGA falls not evenly, which cause the chip drops not evenly. If

stop reflowing at this time, the chip will not fall normally, which will cause the phenomenon

of empty welding and false welding. So you need to extent time of the third and fourth

temperature zones or adds the bottom pre-heating temperature to make, the tin balls

meltdown and drop evenly.

(2) short circuit：

When the ball reached the melting point, it is in a liquid state , if too long or too high

temperature and pressure, it will destroy surface tension of solder balls and the supporting

role, resulting in short-circuit phenomenon when reflows, the chips fall entirely on the PCB

pads the , so we need to appropriately reduce the heating section of the third and fourth

soldering temperature and time , or reduce the bottom of the preheat temperature.

Note: In normal use rework station it will produce small quantities of bad smelly, in order to

ensure comfortable, safe and healthy operating environment, pls keep indoor and outdoor

air flow.

6. Touch screen

1. Open the control power, the BGA rework station can connect with electricity. Upper

temperature control instruments will be showing the following screen:


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Note：

SV: setting temperature ，PV: test temperature

PTN: which group of storage temperture

The upper meter shows the case of upper heating

2. Set the temperature by pressing the button , when it shows the

screen , it means we can set the rate of the first heating speed.

3. After finishing setting the first heating speed we can press the ,and then into the

next step to set the fist highest temperature with the screen .

4. After the first highest temperature’s setting, press the button again to set the

first constant time, and the screen will change to

5. The setting of the first heating process is finished after the first constant time setting.

When presses the button again, to go on the following process, and operation is

same with the first process setting.


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6. Set the lower heating temperature. Press the button in the second meter, then

press the button to adjust the temperature, and also to press and

to get the target temperature.

7. After setting is done, click "Start" button start heating, when it finishes, you can start the

cooling fan on the right bottom to cool the PCB.

NOTE:

When it alarm because of stoppage, all function buttons are in

locked state! After managing the stoppage and starting up, it can

recover to normal state!

Usual Temperature Parameters：

Lead temperature curve welding

41*41 BGA chip welding temperature setting

First Second Third Fourth Fifth

Upper

heating 160 185 210 220 225

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 20

IR

preheatin

g

180

Constant

time 300


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Above is lead type BGA chip reference temperature.

Lead-free temperature curve welding



Upper

heating 160 185 210 215 220

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 20

IR

preheatin

g

180

Constant

time 300


Upper

heating 160 180 200 210 215

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 20

IR

preheatin

g

180

Constant

time 300


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31*31 BGA

chip welding temperature setting


Upper

heating 165 190 225 245 255

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 40

IR

preheatin

g

180 1

Constant

time 300


Upper

heating 165 190 225 245 250

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 40

IR

preheatin

g

180

Constant

time 300


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Above is

lead-free

type BGA

reference temperature.

7. Handling Precautions

1. After openi ng the power, firs t ly you should check whe the r the upper and

bottom hot air nozzles have cold wind. If not, starting the power is strictly prohibited. or the

heaters will be burnt. The bottom infrared heating areas are all controlled by switch, and

you can choose the bottom heating areas depend on the PCB board si ze .

2. You should set different temperature curves when repair different BGA,each temperature

should not higher than 300℃；Lead-free rework setting can refer to welding temperature

curve of BGA tin bead.

3. When demount BGA,the cooling fan and vacuum should be setted to automatic

transmission, the buzzer will warn automatically when temperature curve runs to the end.

Meanwhile, remove the BGA from PCB board with vacuum pen, and then remove the PCB

board from the positioning frame.

4.When welding the BGA chip, set the cooling fan to manual grade、close vaccum. After the

temperature curve runs to the end, the buzzer will alarm automatically, the cooling fan

begins to cooling the BGA chip and bottom heating zone,meanwhile,the warm heating head

will blow a cold wind. Then elevate the upper heater, make the gap has 3-5mm space

between the bottom of nozzle and the upper surface of BGA chip and keep cooling for

30-40 seconds, or move away the main heater after the starting light is off, finally take away

the PCB board from the support.

5. Be fo re i ns ta l lation o f B GA chip, i t is necessary to check that i f the PCB pad

and B GA ti n bead are a l l i n good condition. A fte r weldi ng , i t have to check the


Upper

heating 165 190 220 240 245

Speed

rate 3 3 3 3 3

Constant

time 30 30 35 40 40

IR

preheatin

g

180

Constant

time 300


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exte rior appearance by piece , i f i t is unusua l, i t should stop the BGA chip

installation and test the temperature, and it has to be adjusted properly before welding,

otherwise it will be damage the BGA chip or PCB board.

6. The machine surface needs to be clean at regular time, especially the infrared heating

board.

Avoid the dirt stay on the board, because the dirt can lead to heat radiation unnormally, bad

welding quality and shorten the using time of infrared heating element.

If the heating element was burn out because of these,

our company is not responsible for free change!

Packing list: NO Item Specification Unit Qty

1 BGA rework s tation

SCOTLE -HR6000

Set 1

2 Instruction manual

SCOTLE -HR6000

Copy 1

3 Hot-air nozzle 31*31 -41*41 Pcs 3

4 Shaped clip Pcs 6

5 Plum knob Pcs 6

6

Cross-flow cooling fan

Pc 1

7 Supporting screw Pcs 8


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Scotle other famous ho t sell ing B GA rework sta tions:

Scotle i r360

Scolte i r360 pro

Scot le HR460C

Scot le HR360


http://www.scotle.com/en/infrared-bga-rework-station/18-scotle-ir360-bga-rework-station.html

http://www.scotle.com/en/infrared-bga-rework-station/23-scotle-ir360-pro-bga-rework-station.html

http://www.scotle.com/en/19-scotle-hr460c-bga-rework-station.html

http://www.scotle.com/en/2-scotle-hr360-bga-rework-station.html

scotle hr6000 manual

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