Scaling the Compute and High Speed Networking Needs of the Data Center with Silicon PhotonicsECOC 2017

September 19, 2017

Robert Blum

Director, Strategic Marketing and Business Development

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2

Data Center TrafficIs doubling

every 12 months

2Source: Estimates based on Facebook and Google publications

Other names and brands may be claimed as the property of othersSource: Estimates from Facebook, Google, Cisco publications, and Intel network model

Optical Connectivity as % of Networking Spend

45%+

Facebook Data Center Network Design

>200K Servers10K+ switches

>$1B

Facebook Data Center Fort Worth, TexasGoogle Data Center

Worldwide Annual Data Center Traffic

(~5X global internet traffic)

5 ZB

Emergence of Hyper Scale Data CentersData center networks are struggling to keep up with exponential data growth

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$2.5B

$0.7B

2016 2018 2020

$4.6B

Data Center 100G+ TAM

Data center connectivity TAM

Data Center total spend on 100G and 400G interconnects

Connected world, machine-to-machine traffic, data analytics &

machine learning driving exponential data growth

Continual innovation needed to support data growth

Between DC

Across DC

Across Row

In Rack

Source: Intel 2016 Market Model based in part on Crehan and Dell’Oro reports

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DEPLOYED TODAY

NEW DEPLOYMENTS

Inter DataCenter10km-metro

10G/40G/100G DWDM

100/200/400GDWDM

Spine-Core500m-2km

40G SMF

100G SMFLeaf-Spine300m-2km

40G MMF or SMF

TOR-Leaf100m-500m

40G MMF or SMF

Server-Top of Rack (TOR)1m-30m

10GCu or AOC

25GCu or AOC

Silicon Photonics FOR 100G DATA CENTER Upgrades

MMF = Multi mode fiber; SMF = Single mode fiber; AOC = active optical cableDWDM = Dense Wavelength Division Multiplexing

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Intel® Silicon Photonics Product Overview100G PSM4 QSFP 100G CWDM4 QSFP

Up to 2 km reach on parallel single mode fiber Fully MSA compliant

In volume production

500m, 2 km and 10km reach on duplexsingle mode fiber

Fully MSA compliant

In volume production NOW

On-die hybrid lasers Single die CWDM4 transmitter

4 fibers for 100G

Single fiber for 100G

Silicon (device) wafer

InP substrate removal: Only active epi layersremain on device wafer

Wafer level bonding

Laser fabrication through wafer level processing

Silicon

InP

Plasma activation and bonding process: InP die arebonded & transferred in parallel to device wafer

HYBRID SILICON LASER FABRICATION

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Indium phosphide die

Lithographically defined laserNo critical alignment steps

Low coupling loss

CMOS processIntegratable with other

silicon photonic components

Bonded InP bulk EPILarge arrays of lasers w/ high density

Scalable to multiple wavelengths

HYBRID LASER: BENEFITS OF WAFER SCALE PROCESSING

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Single die CWDM4 transmitterMach-Zehnder modulator

4.8T Switch demoCisco NCS 5502-SE

Intel® Silicon Photonics PSM4 and CWMD4 for 500m, 2km & 10km reach

9Other names and brands may be claimed as the property of others

Ethernet Switch Bandwidth Transitions

2016 2017 2018 2019 2020

25.6

12.8

3.2

6.4

Sw

itch

Si

Co

re C

ap

aci

ty (

Tb

ps)

Projections based on vendor disclosures, public announcements, and Intel estimates

Possible optics integration

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128x 25G SERDES

256x 50G SERDES

256x 25G SERDES

BEYOND 100G - NEXT GENERATION INTERFACES for 400G+

Same faceplate density as QSFP (32/36 ports per 1RU) but with eight lane electrical interface and improved ability to dissipate power http://www.qsfp-dd.com/http://osfpmsa.org/

COBOConsortium for On-Board Optics Developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boardshttp://cobo.azurewebsites.net/

QSFP-DD FOUNDERS/PROMOTERS

FOUNDING MEMBERS

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Intel Optical Engine

QSFP-DD image from: http://www.qsfp-dd.com/. Intel Optical Engine photo is for representative purposes only.Other names and brands may be claimed as the property of others

QSFP-DD

400G CWDM8 Optical PMD Block diagram

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Tx1

Tx2

Tx3

Tx4

Tx5

Tx6

Tx7

Tx8

Rx8

Rx7

Rx6

Rx5

Rx4

Rx3

Rx2

Rx1

8x50G PAM4to

8x50G NRZCDR

Optical transmitter 1

Optical transmitter 8

8:1

MU

X

l1…8

Optical receiver 8

Optical receiver 1

1:8

DE

MU

Xl1…8

Switch ASIC400GAUI-8

Interface

Duplex LC

connectors

https://www.cwdm8-msa.org/Other names and brands may be claimed as the property of others

FOUNDING MEMBERS

8x50G NRZ optical transmission on CWDM gridStandard 8x50G PAM4 electrical interface2km and 10km over standard single mode fiber

QSFP-DD/OSFP/OBO module

Demonstration of 8 lasers on a single die

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-70

-60

-50

-40

-30

-20

-10

1260 1280 1300 1320 1340 1360 1380 1400 1420

Po

ut

(dB

)

Wavelength (nm)

0

5

10

15

20

25

0 20 40 60 80 100 120

Po

we

r (m

W)

Current (mA)

80C output power

C1 1291nm

C3 1331nm

C5 1371nm

C7 1411nm

Multicolor CWDM transmitter using 8 wavelengths Uniform performance from 1270nm to 1410nm

Wafer bonding enables different lasers on the same chip

Possible 400G implementation

Engineering data only. See relevant product data sheet for complete performance specifications

HYBRID LASER: Performance across temperature

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Excellent electro-optic performance of Intel III-V/Si wafer bonded hybrid laser Laser emission up to 150C 10mW at 80C for 60mA (100G applications) 25mW at 80C for 100mA (400G applications) Operating voltage less than 2Volts

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

0 20 40 60 80 100 120 140 160 180 200

Vo

lta

ge

(V

)

Current (mA)

150C

20C

0

5

10

15

20

25

0 20 40 60 80 100 120 140 160 180

Ou

tpu

t P

ow

er

(mW

)

Drive Current (mA)

150C

140C

130C

120C

110C

100C20C 90C80C1310nm

Engineering data only. See relevant product data sheet for complete performance specifications

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Reliability of HYBRID III-V/Si wafer bonded laser

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15,000 hours at 80C and 2x typical operating current

Excellent long-term stability

Shows that III-V/Si hybrid laser can meet stringent reliability requirements

-25

-20

-15

-10

-5

0

5

10

15

20

25

0 2000 4000 6000 8000 10000 12000 14000

10

mW

Ib

ias

Ch

an

ge

(%

)

Aging time (hrs)

III-V/Si Hybrid Laser 80C, 150mA

EOL limit

EOL limit

30 parts

See product data sheet for complete performance specifications

Examples of Disaggregation of resources

16Source: M. Kumar, M. Nachimuthu, Intel, Next Generation Rack Scale Design, IDF 2016

Source: U. Hölzle, “Ubiquitous cloud requires a revolution in optics”, OFC 2017 plenaryhttps://www.youtube.com/watch?v=n9zEiGyvJ-AOther names and brands may be claimed as the property of others

High bandwidth low latency optical connectivity is key to enable resource disaggregation

Core Network / Inter Data CenterCore Network / Inter Data Center

Super Spine/Core

Leaf

Spine

ToR

Servers

TODAY FUTURE

Possible network architecture evolution

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2020+2016/2017100G MSA Pluggable High density integrated

2018/2019400/800G embedded 400G MSA Pluggable

Enabling transition to100G switch-to-switch

connectivity with 25G I/O

Address electrical I/O constraintsHighest density

Lowest system power

Embedded optics for density, signal integrity,

and power

Supporting next-generation switches

12.8Tb/s and 50G I/O

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Future of optical connectivity in Data centersform factor and Bandwidth evolution

QSFP-DD image from: http://www.qsfp-dd.com. Intel Optical engine photo is for representative purposes only.Other names and brands may be claimed as the property of others

Available/announced switch ASICs

3.2/6.4 Tb/s 6.5Tb/s 12.8Tb/s 12.8Tb/s or 25.6Tb/s

Thank you!Intel.com/siliconphotonics

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