say goodbye to conventional power electronics · the key requirements for power electronics and...
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Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
ChinaPhone +86 21 3357 5457 [email protected]
Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
Lay
out:
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rt_HET-MarCom_HET23002-0317-3
The
data
giv
en h
ere
is v
alid
. We
rese
rve
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ake
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Heraeus mAgic Sinter Paste for Power Electronics
Say Goodbye to conventional Power Electronics
107.86
Microbond Silver Interconnect
ic47
A family of high achievers
mAgic Sinter Pastes The ASP-Series consists of several products, tailored to customer requirements.
All Microbond ASP products provide max. operation temperatures up to 250°C and do not leave residues. mAgic sinter Pastes are lead free and RoHS conform.
mAgic Silver Sintering – enhancing power electronic performance
Demanding applications like power converters for e-mobility and renewable energy require high power DCB circuits. The key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature.
The Microbond Ag Interconnect product family utilizes the sintering technology to fulfi ll these challenges. mAgic materials are currently used in high volume production and demonstrate their outstanding performance in high power converters every day.
High reliability in tough conditions Special material formulation of mAgic sinter pastes allow a wide process and application window. Due to their excep-tional electrical and thermal performance sinter pastes are suitable for application requiring highest power density.
The properties of mAgic sinter materials enable an increase in life time for power electronic devices, up to ten times compared to soldered devices.
Compare the values
mAgic – the reliable connection for Die Attach and Heat Sink Attach
Thermal Performance of DCB Modules in DC operation
ASP043 Series - 10MPa Sinter Pressure SnAg3.5 Solder Vacuum SolderingASP016 Series - 20MPa Sinter Pressure
mAgic Paste
SeriesmAgic Paste
Microbond ASP SeriesSolder
(SnAg3.5)
Process Temperature 230 – 280°C 250°C
Max. Operation Temperature > 250 150
Electrical Resistivity (mΩ∙cm) ≤ 0.008 0.01 – 0.03
Thermal Conductivity (W/mK) > 200 20 – 50
CTE (ppm/K) ≤ 19 25 – 30
E-Modulus @ 25°C (GPa) > 35 ~ 30
PlatzhalterPackshotsPlatzhalterPackshots
Microbond ASP 016-Series:
high thermal performance
Microbond ASP 043-Series:10 times higher life time compared to solder high thermal performance
Microbond ASP 131-Series:very low sintering pressureprintable and dispensable
Microbond ASP 338-Series:compatible with Cu surfaceshigh thermal performance
Conventional SolderConventional Solder
mAgic PasteMicrobond ASP 016-Series
Excellent NiAu Finishing
mAgic PasteMicrobond ASP 043-Series
Pressure Assisted
Application
Die Attach + +
Component Attach n/a n/a
Process
Dispensing n/a n/a
Printing + +
Properties
Halogen free + +
Lead free + +
Recom. Sinter Pressure* ≥ 20 MPa ≥ 10 MPa
Sintering in Air + +
Sintering in N2n/a n/a
Cleaning not needed not needed
100% 100%Metal content after processing (by weight)
Compatible Surface Finishes
Ag + +
Au + +
Cu
mAgic PasteMicrobond ASP 131-Series
Very Low Pressure
+
n/a
+
+
+
≥ 1 MPa
+
n/a
not needed
100%
+
+
mAgic PasteMicrobond ASP 338-Series
Cu Surface Compatible
+
n/a
n/a
+
+
+
≥ 10 MPa
+
not needed
100%
+
+
n/a
+
Pd + + n/a n/a
n/a n/a +
+
excellent performance with NiAu finishing
* Depending on customer's application
A family of high achievers
mAgic Sinter Pastes The ASP-Series consists of several products, tailored to customer requirements.
All Microbond ASP products provide max. operation temperatures up to 250°C and do not leave residues. mAgic sinter Pastes are lead free and RoHS conform.
mAgic Silver Sintering – enhancing power electronic performance
Demanding applications like power converters for e-mobility and renewable energy require high power DCB circuits. The key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature.
The Microbond Ag Interconnect product family utilizes the sintering technology to fulfi ll these challenges. mAgic materials are currently used in high volume production and demonstrate their outstanding performance in high power converters every day.
High reliability in tough conditions Special material formulation of mAgic sinter pastes allow a wide process and application window. Due to their excep-tional electrical and thermal performance sinter pastes are suitable for application requiring highest power density.
The properties of mAgic sinter materials enable an increase in life time for power electronic devices, up to ten times compared to soldered devices.
Compare the values
mAgic – the reliable connection for Die Attach and Heat Sink Attach
Thermal Performance of DCB Modules in DC operation
ASP043 Series - 10MPa Sinter Pressure SnAg3.5 Solder Vacuum SolderingASP016 Series - 20MPa Sinter Pressure
mAgic Paste
SeriesmAgic Paste
Microbond ASP SeriesSolder
(SnAg3.5)
Process Temperature 230 – 280°C 250°C
Max. Operation Temperature > 250 150
Electrical Resistivity (mΩ∙cm) ≤ 0.008 0.01 – 0.03
Thermal Conductivity (W/mK) > 200 20 – 50
CTE (ppm/K) ≤ 19 25 – 30
E-Modulus @ 25°C (GPa) > 35 ~ 30
PlatzhalterPackshotsPlatzhalterPackshots
Microbond ASP 016-Series:
high thermal performance
Microbond ASP 043-Series:10 times higher life time compared to solder high thermal performance
Microbond ASP 131-Series:very low sintering pressureprintable and dispensable
Microbond ASP 338-Series:compatible with Cu surfaceshigh thermal performance
Conventional SolderConventional Solder
mAgic PasteMicrobond ASP 016-Series
Excellent NiAu Finishing
mAgic PasteMicrobond ASP 043-Series
Pressure Assisted
Application
Die Attach + +
Component Attach n/a n/a
Process
Dispensing n/a n/a
Printing + +
Properties
Halogen free + +
Lead free + +
Recom. Sinter Pressure* ≥ 20 MPa ≥ 10 MPa
Sintering in Air + +
Sintering in N2n/a n/a
Cleaning not needed not needed
100% 100%Metal content after processing (by weight)
Compatible Surface Finishes
Ag + +
Au + +
Cu
mAgic PasteMicrobond ASP 131-Series
Very Low Pressure
+
n/a
+
+
+
≥ 1 MPa
+
n/a
not needed
100%
+
+
mAgic PasteMicrobond ASP 338-Series
Cu Surface Compatible
+
n/a
n/a
+
+
+
≥ 10 MPa
+
not needed
100%
+
+
n/a
+
Pd + + n/a n/a
n/a n/a +
+
excellent performance with NiAu finishing
* Depending on customer's application
Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com
AmericasPhone +1 610 825 6050 [email protected]
Asia PacificPhone +65 6571 7677 [email protected]
ChinaPhone +86 21 3357 5457 [email protected]
Europe, Middle East and Africa Phone +49 6181 35 3069
+49 6181 35 3627 [email protected]
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
Lay
out:
D&B,
Fra
nkfu
rt_HET-MarCom_HET23002-0317-3
The
data
giv
en h
ere
is v
alid
. We
rese
rve
the
right
to m
ake
tech
nica
l alte
ratio
ns.
Heraeus mAgic Sinter Paste for Power Electronics
Say Goodbye to conventional Power Electronics
107.86
Microbond Silver Interconnect
ic47