satish dhawan, oliver baker, hunter smith, paul tipton, yale university

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Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale Univer ucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL Marc Weber, RAL Chris Musso, Allen Mincer NYU Plug In Card with Commercial Buck Converters ATLAS Tracker Upgrade Workshop, Amsterdam 03 - 07 November, 2008

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Plug In Card with Commercial Buck Converters. Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University Hucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL Marc Weber, RAL Chris Musso, Allen Mincer NYU. - PowerPoint PPT Presentation

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Page 1: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale UniversityHucheng Chen, James Kierstead, David Lynn, Sergio Rescia, BNL

Marc Weber, RALChris Musso, Allen Mincer NYU

Plug In Cardwith Commercial Buck Converters

ATLAS Tracker Upgrade Workshop, Amsterdam 03 - 07 November, 2008

Page 2: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Load0.25 µm Technology Test ASIC 2.5 V @ ~ 3 amps0.13 µm Technology ASIC 1.3 V @

Monolithic Commercial ConvertersST 1S10 18V 3 ampsMax8654 12V 8 amps

Following To be available early in 2009

ST L5988 18V 4 ampsTI TPS54620 17V 6 amps 0.35 µm BCDAD21xx 20V 3 amps 0.35 µm CMOSNational 20V 3 amps 0.25 µm CMOSEnpirion 12V 6 amps 0.25 µm CMOS

Vin = 2.5 – 17 VVout = 2.5 / 1.3 V

Enable

29 October, 08 Plug in Card – Power

GNDGND

Power Good

RequirementsVoltage Ratio > 8For Good Efficiency Iout >3 ampsAir Coil / MagneticsRadiation Hardness

Small Plug-in Card

Page 3: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

3 Sizes of Spiral Coils Coil with Ferrite

Silicon Chip Size 0.3x 0.3 cm

Page 4: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

17 V

5 V

Enable

Power Good

PWM Controller

Buck Converter

Controller : Low VoltageHigh Voltage: On Switches- LDMOS, Drain Extension, Deep Diffusion etc

30 mΩ Switch

20 mΩ Switch

Noise Pick-up with Vin / Vout > 8 Previously studies done with Vin ~ 5.5 V

Page 5: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Coil Spacing 100kHzFar – 1.5” L 0.976 μH

R 0.183 ΩNear – 0.006” L 1.751 μH

R 0.184 ΩTouching – <0.001” L 2.150 μH

R 0.185 Ω

Medium Coils

Large Coils

2 oz copper for coils,

6 mill spacing with Kapton

Proximity Effect

For Larger Inductanceconnect coils in series

LCR Meter of Teaching LabCalibrator disappeared !!!

Page 6: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

A proximity effect is seen in the spiral coils

30

40

50

60

70

80

Effi

cien

cy (%

)

0 0.5 2.51.51.0 2.0Output Current (amps)

3.0

Page 7: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Not Enough Inductance

Page 8: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

MAX8654: Ser. #1

Vout=3.3 V

0

10

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40

50

60

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80

90

100

0 1 2 3 4 5 6 7 8 9

Output current (amps)

Effic

ien

cy (

%)

MAX8654 #1, Vin = 14.1 V

MAX8654 #1, Vin = 12.0 V

MAX8654 #1, Vin = 10.0 V

MAX8654 #1, Vin = 8.0 V

MAX8654 #1, Vin = 5.8 V

Vin / Vout = 4.3

Page 9: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Pin Comment33,35,37,39 Digital Power In34,36,38,40 Digital Return (Hybrid Ground)41,43 Auxiliary Analogue Power In42,44 Auxiliary Analogue Return45 HVRet52 HV (Sensor Bias)

Size= 10 x 10 mm or Smaller

Version of Plug in Cards1. Coil: magnetic / Air2. Heat Removal3. High Voltage Ratio4. Al Power Conductors

GoalA Component that can be wire bonded

To Hybrid ( Like ABCD Chips)

SILICON

CoilCoil

ConnectorPlug-in Card

Shirking of Power Packages by 3D

SOC Package

Page 10: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Efficiency versus Output Current Vout = 1.8V

0

10

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60

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80

90

100

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5

Output current (amps)

Eff

icie

ncy

(%

)

EN5360 #2, Vin = 5.4 V

EN5360 #1, Vin = 5.4 V

EN5365 #1, Vin = 5.5 V

EN5360IHP Foundry

EN5365Korean Foundry

Both are can be used for Space Applications IHP Foundry for HEP

Page 11: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

Visit IHP Microelectronics, Frankfurt (Oder)03 November 2008

Aachen (Lutz Feld +3) + Yale (Satish Dhawan)

IHP Prof Bernd Tillack- Deputy Scientific Director Dieter Knoll – Technology Head Roland Sorge – Device Engineer Ulrich Jagdhold Systems Engineer

85 % Public Funds 250 people. 50 Wafers / week. Capacity 150 Wafers Up to 80 GHz Circuits Try to understand why Hard IHP made devices are Radiation LDMOS Lateral Diffused MOS Transistor Switches. Use N & P Channel Sending above Devices for Radiation Testing Developing New Device Structure for 12 Volts 0.25 m Technology Test New LDMOS Devices with Buck Controller

Page 12: Satish Dhawan, Oliver Baker, Hunter Smith, Paul Tipton, Yale University

The End Lonely @ Top of the World