santa barbara, california call for papers · susanne stemmer, university of california (805)...
TRANSCRIPT
ELECTRONIC MATERIALS CONFERENCE
June 25-27, 2008 • University of CaliforniaSanta Barbara, California
CALL FOR PAPERS
EMCElectronic Materials Conference
50thAnniversary
2008
Sponsored by
Electronic Materials Committee
www.tms.org/EMC.html
The Premier Annual Forum on the Preparation and Characterization of Electronic Materials for 50 Years
June 25-27, 2008 • Santa Barbara, California
For 50 years, the Electronic Materials Conference (EMC) has been presenting research and developments to advance the field as well as our attendees, who include:
ScientistsEngineersProfessorsResearchersTechniciansResearch and Development ManagersProduct ManagersStudents
You are invited to participate in this year’s event by submitting an abstract for any of the more than 30 topics being presented.
About the TopicsElectronic materials are defined as relating to, produced or operated by the controlled flow of electrons through a semiconductor, gas or free space along with those relating to devices, systems or circuits that employ components such as vacuum tubes, integrated circuits or transistors in their design. In practice, the field is much broader as we have tried to capture in the topics covered.
See the following pages for information on the technical topics and submit your abstract before February 1, 2008.
••••••••
LEARN • NETWORK • ADVANCELEARN • NETWORK • ADVANCE
EMCElectronic Materials Conference
50thAnniversary
2008
www.tms.org/EMC.html �
EMC 2008 will include both invited and contributed oral presentations, an exhibition of related products and
services, and special networking and social activities.
General ChairRobert Biefeld, Sandia National Laboratories
(505) 844-1556 • [email protected]
Program ChairMark Goorsky, University of California
(310) 206-0267 • [email protected]
EMC and DRCEMC is being coordinated with the Device Research Conference (DRC),
June 23-25, 2008, at the University of California. The coordinated efforts are made in recognition of the strong interaction between electronic materials and device research. This provides for maximum exchange of information
between attendees of both conferences.
DRC InquiriesSteven Koester, IBM TJ Watson Research Center
(914) 945-2189 • [email protected]
Abstracts submitted to DRC may not be submitted to EMC.
For more information about EMC, contact TMS.Meeting Services
(724) 776-9000, ext. 243 • (800) 759-4TMS • [email protected]
Table of ContentsInformation for Prospective Authors ...................................... 4Technical Program Topics ..................................................... 6
LEARN • NETWORK • ADVANCE�
Information for Prospective Authors
Abstract Submission
ABSTRACT DEADLINE: FEBRUARY 1, 2008
How to Submit an AbstractSubmit your 450-word abstract by February 1, 2008, using CMS-Plus, the online TMS conference management system, at http://cmsplus.tms.org. Conference organizers receive electronic notification of abstract submissions upon entry. Log in to CMS-Plus to begin.
Author RequirementsAbstracts submitted must reveal and demonstrate reasonable scientific content. Do not submit abstracts describing work that has not been released for public disclosure.Students should clearly mark abstracts as “Student Paper” and must also satisfy format guidelines.Authors are expected to present their papers in person at the conference. If an author must be absent or withdraw a paper, the author must notify the program chair well in advance.
Extended AbstractA one-page, additional abstract is also required to assist organizers in considering the material planned for presentation. The additional page (referred to as “extended abstract” in CMS-Plus) should be uploaded as a Microsoft Word or Portable Document Format (PDF) attachment when your initial abstract is submitted. (Only the required 450-word abstract will be printed in the program book).
“Late News” PapersLate news papers will be considered between February 2 and June 2, 2008. They should be submitted online at http://cmsplus.tms.org by selecting “Late News.” The same formatting instructions for abstract submission apply.
Questions about submitting your abstract? Contact TMS.Christina Raabe Eck, Technical Programming and Publications Manager(724) 776-9000, ext. 212 • (800) 759-4TMS • [email protected]
•
•
•
www.tms.org/EMC.html 5
Student Awards and AssistanceThe top 5 percent of student presentations, as voted upon by the EMC committee, will receive the EMC Best Student Paper Award at the 2009 conference. Papers are judged on both written abstract and oral presentation.
The EMC committee has allocated funds to assist students to attend the 2008 conference in order to make oral presentations. Those wishing to be considered to receive funds should e-mail Robert Biefeld at [email protected] no later than Monday, June 2, 2008.
Publication of PapersSelected technical sessions will be published in the Journal of Electronic Materials. You also are strongly encouraged to submit manuscripts of your work to the journal. Details on eligibility and manuscript submission will be included in the EMC advance program and are available on the Web at http://www.tms.org/jem.html.
LEARN • NETWORK • ADVANCE�
Technical Program Topics
ISSUES FOR WIDE BANDGAP MATERIALS
Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices
Andrew Allerman, Sandia National Laboratories(505) 845-3697 • [email protected]
Russell Dupuis, Georgia Institute of Technology(404) 385-6094 • [email protected]
Randy Feenstra, Carnegie Mellon University(412) 268-6961 • [email protected]
Jung Han, Yale University(203) 432-7567 • [email protected]
Michael Manfra, Bell Labs, Lucent Technologies(908) 582-1137 • [email protected]
Thomas Myers, West Virginia University(304) 293-3422, ext. 1469 • [email protected]
Zinc Oxide: Growth, Doping, Defects, Nanostructures and Devices
Julia Hsu, Sandia National Laboratories(505) 284-1173 • [email protected]
Tom Jackson, The Pennsylvania State University(814) 863-8570 • [email protected]
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • [email protected]
Yicheng Lu, Rutgers University(732) 445-3466 • [email protected]
Shelby Nelson, Eastman Kodak Company(585) 477-8417 • [email protected]
David Norton, University of Florida(352) 846-0525 • [email protected]
www.tms.org/EMC.html 7
Jamie Phillips, University of Michigan(734) 764-4157 • [email protected]
Silicon Carbide: Growth, Processing, Characterization, Theory and Devices
Michael Capano, Purdue University(765) 494-3563 • [email protected]
Stephen E. Saddow, University of South Florida(813) 974-4773 • [email protected]
Robert Stahlbush, Naval Research Laboratory(202) 767-3357 • [email protected]
Point Defects, Extended Defects and Doping in Wide Bandgap Materials
Leonard Brillson, The Ohio State University(614) 292-8015 • [email protected]
Shigefusa Chichibu, Tohoku University+81-22-217-5363 • [email protected]
James Speck, University of California(805) 893-8005 • [email protected]
Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • [email protected]
Huili Xing, University of Notre Dame(574) 631-9108 • [email protected]
LEARN • NETWORK • ADVANCE8
NANOSCALE SCIENCE AND TECHNOLOGY IN MATERIALS
Low-Dimensional Structures: Quantum Dots, Wires and Wells
Diana Huffaker, University of New Mexico(505) 272-7845 • [email protected]
Jim Merz, University of Notre Dame(574) 631-3111 • [email protected]
Mark Miller, University of Utah(801) 587-7718 • [email protected]
Akio Sasaki, Osaka Electro-Communication University+81-72-824-1131 • [email protected]
Ben Shanabrook, Naval Research Laboratory(202) 767-3693 • [email protected]
Glenn Solomon, Stanford University(650) 725-6910 • [email protected]
Nanoscale Characterization: Scanning Probes, Electron Microscopy and Other Techniques
Rachel Goldman, University of Michigan(734) 647-6821 • [email protected]
Julia Hsu, Sandia National Laboratories(505) 284-1173 • [email protected]
Susanne Stemmer, University of California(805) 893-6128 • [email protected]
Edward Yu, University of California(858) 534-6619 • [email protected]
Molecular Electronics: Devices, Materials and Contacts
Mark Hersam, Northwestern University(847) 491-2696 • [email protected]
Technical Program Topics
www.tms.org/EMC.html �
David Janes, Purdue University(765) 494-9263 • [email protected]
Gregory Lopinski, Steacie Institute for Molecular Sciences(613) 990-4155 • [email protected]
Theresa Mayer, The Pennsylvania State University(814) 863-8458 • [email protected]
Shalom Wind, Columbia University(212) 854-5122 • [email protected]
Nanotubes and Nanowires
Kris Bertness, National Institute of Standards and Technology(303) 497-5069 • [email protected]
Theresa Mayer, The Pennsylvania State University(814) 863-8458 • [email protected]
Hou T. Ng, Hewlett-Packard Company(650) 857-4169 • [email protected]
Timothy Sands, Purdue University(765) 496-6105 • [email protected]
Raymond Tsui, Motorola(480) 413-4182 • [email protected]
Chemical and Biological Sensors: Materials, Interfaces and Integration
April Brown, Duke University(919) 660-5442 • [email protected]
David Janes, Purdue University(765) 494-9263 • [email protected]
Laura Rea, U.S. Air Force Research Laboratory(937) 255-9871 • [email protected]
Albert Alec Talin, Sandia National Laboratories(925) 294-1445 • [email protected]
LEARN • NETWORK • ADVANCE10
Lloyd Whitman, Naval Research Laboratory(202) 404-8845 • [email protected]
William Wong, Palo Alto Research Center(650) 812-4660 • [email protected]
ADDITIONAL TOPIC AREAS
Contacts to Semiconductor Epilayers, Nanowires, Nanotubes and Organic Films
Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • [email protected]
Lisa Porter, Carnegie Mellon University(412) 268-4047 • [email protected]
Tae-Yeon Seong, Korea University+82-2-3290-3288 • [email protected]
Jerry Woodall, Purdue University(765) 494-3479 • [email protected]
Epitaxy
April Brown, Duke University(919) 660-5442 • [email protected]
Diana Huffaker, University of New Mexico(505) 272-7800 • [email protected]
Amy Liu, IQE Inc.(610) 861-6930 • [email protected]
Epitaxy for Devices
Archie Holmes, University of Virginia(434) 924-7770 • [email protected]
Technical Program Topics
www.tms.org/EMC.html 11
Kei-May Lau, Hong Kong University of Science and Technology+852-2358-7049 • [email protected]
Charles Lutz, Kopin Corporation(508) 824-6696, ext. 415 • [email protected]
Michael Tischler, Ocis Technologies(602) 317-6249 • [email protected]
Epitaxy: Configurable �-D, Metamorphic and Template Growth (Other Areas)
Ralph Dawson, University of New Mexico(505) 272-7820 • [email protected]
Alan Doolittle, Georgia Institute of Technology(404) 894-0631 • [email protected]
Steven Ringel, The Ohio State University(614) 292-6904 • [email protected]
Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • [email protected]
Point and Extended Defects in Mismatched Materials
Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • [email protected]
Steven Ringel, The Ohio State University(614) 292-6904 • [email protected]
Jerry Woodall, Purdue University(765) 494-3479 • [email protected]
LEARN • NETWORK • ADVANCE12
Nondestructive Testing and In Situ Monitoring and Control
Kurt Eyink, U.S. Air Force Research Laboratory(937) 656-5710 • [email protected]
Mark Goorsky, University of California(310) 206-0267 • [email protected]
Andrew Hoff, University of South Florida(813) 974-4958 • [email protected]
Semiconductor Processing: Oxidation, Passivation, Functionalization and Etching
Michael Capano, Purdue University(765) 494-3563 • [email protected]
Douglas Hall, University of Notre Dame(574) 631-8631 • [email protected]
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • [email protected]
Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • [email protected]
Materials Integration: Wafer Bonding and Engineered Substrates
Harry Atwater, California Institute of Technology(818) 395-2197 • [email protected]
Karl Hobart, Naval Research Laboratory(202) 404-8542 • [email protected]
Archie Holmes, University of Virginia(434) 924-7770 • [email protected]
Thomas Kuech, University of Wisconsin(608) 263-2922 • [email protected]
Peter Moran, Michigan Technological University(906) 487-3095 • [email protected]
Technical Program Topics
www.tms.org/EMC.html 1�
Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides and Metal Gates
Evgeni Gusev, Qualcomm MEMS Technologies(408) 546-2096 • [email protected]
Pat Lenahan, The Pennsylvania State University(814) 863-4630 • [email protected]
Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • [email protected]
Peter Moran, Michigan Technological University(906) 487-3095 • [email protected]
Shriram Ramanathan, Harvard University(617) 496-0358 • [email protected]
Susanne Stemmer, University of California(805) 893-6128 • [email protected]
Si-Based Heterojunctions
Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • [email protected]
Sarah Olsen, University of Newcastle-upon-Tyne+44-191-222-8552 • [email protected]
Michael Tischler, Ocis Technologies(602) 317-6249 • [email protected]
Ya-Hong Xie, University of California(310) 825-2971 • [email protected]
Narrow Bandgap Semiconductors: Antimonides and Other Materials
Brian Bennett, Naval Research Laboratory(202) 767-3665 • [email protected]
Robert Biefeld, Sandia National Laboratories(505) 844-1556 • [email protected]
LEARN • NETWORK • ADVANCE1�
Ralph Dawson, University of New Mexico(505) 272-7820 • [email protected]
Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • [email protected]
Indium Nitride: Growth, Processing, Characterization, Theory and Devices
Debdeep Jena, University of Notre Dame(574) 631-8835 • [email protected]
Yasushi Nanishi, Ritsumeikan University+81-77-561-2679 • [email protected]
Joan Redwing, The Pennsylvania State University(814) 865-8665 • [email protected]
William Schaff, Cornell University(607) 255-3974 • [email protected]
Spin-Dependent (or Spintronic) Electronic Materials
Michael Flatte, University of Iowa(319) 335-0201 • [email protected]
Xinyu Liu, University of Notre Dame(574) 631-9787 • [email protected]
Chris Palmstrom, University of California, Santa Barbara(805) 893-3618 • [email protected]
Nitin Samarth, The Pennsylvania State University(814) 863-0136 • [email protected]
Masaaki Tanaka, University of Tokyo+81-3-5841-6728 • [email protected]
Dilute Nitride Semiconductors
Rachel Goldman, University of Michigan(734) 647-6821 • [email protected]
Technical Program Topics
www.tms.org/EMC.html 15
Douglas Hall, University of Notre Dame(574) 631-8631 • [email protected]
Archie Holmes, University of Virginia(434) 924-7770 • [email protected]
Thomas Kuech, University of Wisconsin(608) 263-2922 • [email protected]
Charles Tu, University of California(858) 534-4687 • [email protected]
Flexible Thin-Film Electronics
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • [email protected]
Thomas Jackson, The Pennsylvania State University(814) 863-8570 • [email protected]
Thomas Kuech, University of Wisconsin(608) 263-2922 • [email protected]
William Wong, Palo Alto Research Center(650) 812-4660 • [email protected]
Organic Thin Film and Crystalline Transistors: Devices, Materials and Processing
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • [email protected]
Tom Jackson, The Pennsylvania State University(814) 863-8570 • [email protected]
Alberto Salleo, Palo Alto Research Center(650) 812-5065 • [email protected]
LEARN • NETWORK • ADVANCE1�
Organic-Inorganic Hybrid Photovoltaics
David Gundlach, National Institute of Standards and Technology(301) 975-2048 • [email protected]
Julia Hsu, Sandia National Laboratories(505) 284-1173 • [email protected]
Max Shtein, University of Michigan(734) 764-4312 • [email protected]
Materials and Novel Concepts for UV Detectors and Emitters
Laura Rea, U.S. Air Force Research Laboratory(937) 255-6316 • [email protected]
Jerry Woodall, Purdue University(765) 494-3479 • [email protected]
Mike Wraback, U.S. Army Research Laboratory(301) 394-1459 • [email protected]
OTHER/NEW AREAS
Compound Semiconductor Growth on Si Substrates
Ralph Dawson, University of New Mexico(505) 272-7820 • [email protected]
Gene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • [email protected]
Jerry Woodall, Purdue University(765) 494-3479 • [email protected]
Fuel Cell and Battery Materials
Stephen Hackney, Michigan Technological University(906) 487-2170 • [email protected]
Technical Program Topics
www.tms.org/EMC.html 17
Peter Moran, Michigan Technological University(906) 487-3095 • [email protected]
Solar Cell Materials and Devices
Mark Goorsky, University of California(310) 206-0267 • [email protected]
Debdeep Jena, University of Notre Dame(574) 631-8835 • [email protected]
Glen Solomon, Stanford University(650) 725-6910 • [email protected]
Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • [email protected]
Jerry Woodall, Purdue University(765) 494-3479 • [email protected]
Graphene and Carbon Nanotubes
Randy Feenstra, Carnegie Mellon University(412) 268-6961 • [email protected]
Tom Jackson, The Pennsylvania State University(814) 863-8570 • [email protected]
Debdeep Jena, University of Notre Dame(574) 631-8835 • [email protected]
Mark Miller, University of Utah(801) 587-7718 • [email protected]
Randy Sandhu, Northrop Grumman Space Technology(310) 813-4815 • [email protected]
Glen Solomon, Stanford University(650) 725-6910 • [email protected]
EMCElectronic Materials Conference
50thAnniversary
2008
LEARN • NETWORK • ADVANCE18
Technical Program Topics
Thermoelectrics and Thermionics
Mayank Bulsara, Massachusetts Institute of Technology(617) 258-7147 • [email protected]
Rachel Goldman, University of Michigan(734) 647-6821 • [email protected]
Timothy Sands, Purdue University(765) 496-6105 • [email protected]
Jeff Snyder, California Institute of Technology(626) 395-6220 • [email protected]
Joint Session with DRC
Steven Koester, IBM TJ Watson Research Center(914) 945-2189 • [email protected]
Submit your abstract online at http://cmsplus.tms.org.
www.tms.org/EMC.html 1�
EMC Exhibition
The 2008 EMC exhibition will feature electronic materials-related technology and services from worldwide companies. Exhibitors will
bring equipment, publications, software and services, relative to electronic materials applications and research, to the floor. More than
400 professionals from corporations, universities and government laboratories, interested in electronic materials, will be attending.
To find out how your company can participate in the exhibition, contact TMS no later than Friday, June 6, 2008:
Joe Rostan, Exhibit Sales Representative(724) 776-9000, ext. 231 • (800) 759-4TMS • [email protected]
For Your CalendarFebruary 1, 2008 – Abstract Submission Deadline
April 4, 2008 – Notification of AcceptanceJune 4, 2008 – Advance Registration Deadline
June 25, 2008 – Welcoming Reception
NO
N-P
RO
FIT
OR
GA
NIZ
AT
ION
U.S
. PO
STA
GE
PAID
WA
RR
EN
DA
LE, P
AP
ER
MIT
NO
. 16
EMC
2008
Cal
l for
Pap
ers