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©2018 by System Plus Consulting | Samsung Galaxy S9+ Processors: Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 1

22 Boulevard Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Samsung Galaxy S9 Processors PackagesSamsung Exynos 9810 vs. Qualcomm Snapdragon 845Packaging report by Stéphane ELISABETHJune 2018 – version 1

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT


Table of Contents

Overview / Introduction 4

o Executive Summary

o APE I/O vs.Footprint/Line-Space Comparison

o Reverse Costing Methodology

Company Profile 11

o Samsung

o Galaxy Series – Processors

o Galaxy Series – APE Die

o Qualcomm

o Samsung Exynos 9810 vs. Qualcomm Snapdragon 845 Specifications

o Package-on-Package Technology

o Samsung Galaxy S9+ Teardown – SM-965F/N & SM-965U

Physical Analysis (Exynos 9810 & Snapdragon 845) 26

o Summary of the Physical Analysis 27

o Packaging 30

Package Memory: X-Ray view & Marking

Package Views, Marking & Dimensions

Package PCB Deprocessing

Package Opening

Board Cross-Section: mSAP vs. Subtractive PCB, Dimensions

Package Cross-Section: TMV, Cu Core, Molding, Capacitors

Summary of Physical Data

o Application Processor 64

Die Views, Marking & Dimensions

Die Cross-Section

Die Process Characteristics

Physical Comparison 76

o Samsung Exynos 9810 vs. Snapdragon 845

o Samsung’s APE

o Qualcomm’s APE

o APE’s PoP Technology: iPoP, MCeP, inFO, HBW PoP

Manufacturing Process 82

o APE Die Front-End Process & Fabrication Unit

o Packaging Process Flow & Fabrication unit

Cost Analysis 117

o Summary of the cost analysis 118

o Yields Explanation & Hypotheses 119

o APE die 122

Wafer & Die Front-End Cost

Preparation Wafer Cost

o Packaging 130

Panel Cost

Front-End Cost per Process Steps

Component Cost

Customer Feedback 134

Company services 136


Overview / Introductiono Executive Summaryo APE Comparisono Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

About System Plus

Executive Summary

• Depending on the World region, the Samsung Galaxy S9 Plus has several differences. The international version features an Exynos 9810 chipset with mSAP technology for the main board PCB while the US version features the Snapdragon 845 Chipset with standard main board PCB.

• The Exynos 9810 is an embedded die package with in-house packaging technology, using two moldings to improve the well-known Through Molded Via (TMV) technology. In the previous generation of the 800 series, Qualcomm has always used Shinko’s MCeP packaging Technology. In this report, we will show the differences and the innovation of both packages, including molding compound, substrate, decoupling capacitors. The detailed comparison between both APE packages will give the pros and the cons of the PoP technologies.

• This report reviews the Exynos 9810 and the Snapdragon 845, including a complete package analysis, cost analysis, and price estimate for the chips. Also included is a physical and cost comparison of the different solutions. Finally, it features a technical and physical comparison between the previous generation of the Exynosand the Snapdragon Series, and the other APE packaging solution from Huawei and Apple.





Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Executive Summary

• Two references of application processors has been analyzed.

End-users OEM

Device Integration

Componentprovider

Packaging Assembly & test Services

Packaging Technology

Footprint(mm²)

DieManufacturer

Die Area(mm²)

I/ONumber

PCB/RDLMinimumL/S (µm)

Pitch (mm)

SamsungGalaxy S9

Series

Samsung Samsung FC-PoP14.9 x 13.4

(198)Samsung

11.5x10.5(121)

1,131 11/11 0.4

Qualcomm Shinko MCeP12.4 x 12.4

(154)9.77x9.14

(90)911 10/10 0.4





Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Application Processor I/O Count & Footprint


Overview / Introduction

Company Profile & Supply Chain o Samsungo Galaxy S – Processors o Galaxy S – APE Die o Qualcommo Exynos 9810 vs. S845o Galaxy S9+ Teardown

Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Samsung Galaxy S9 Plus Teardown

Samsung Galaxy S9+ Opened View©2018 by System Plus Consulting

Samsung Galaxy S9+ Opened View©2018 by System Plus Consulting

Copper Heatsink Pipe

Heat dissipation cover




Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Samsung Galaxy S9 Plus Teardown – EU Version – SM-G965F/N

Samsung Galaxy S9+ Main Board©2018 by System Plus Consulting

Front View

Back View

APE Exynos 8

RFFE

RF Transceiver

The Exynos 9810 application processor is under the SDRAM chip in PoP mode (Package on Package).




Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Samsung Galaxy S9 Plus Teardown – US Version – SM-G965U

Samsung Galaxy S9+ Main Board©2018 by System Plus Consulting

Front View

Back View

APE Snapdragon 845

RFFE

RF Transceiver

The Snapdragon 845 application processor is under the SDRAM chip in PoP mode (Package on Package).




Physical Analysis o Synthesiso SM-G965F/N

o Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary

o SM-G965Uo Board Overviewo Packagingo Board Cross-Sectiono Package Cross-Sectiono Summary

o Application Processor Dies

Physical Comparison


Cost Analysis

Feedbacks

About System Plus

APE Assembly©2018 by System Plus Consulting

Summary of the Physical Analysis








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Exynos 9810 – Package Views & Dimensions








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Exynos 9810 – Package Opening








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Exynos 9810 – Board Cross-section – PCB substrate








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Exynos 9810 – Package Cross-section








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Summary of Physical Data








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Snapdragon 845 – Package Cross-section








Physical Comparison


Cost Analysis

Feedbacks

About System Plus

Exynos 9810 – Die Cross-Section – CMOS Transistor




Physical Analysis

Physical Comparison o Exynos 9810 vs. S845o Samsung’s APEo Qualcomm’s APEo APE’s PoP Technology


Cost Analysis

Feedbacks

About System Plus

Package Comparison – Samsung’s APE




Physical Analysis

Physical Comparison o Exynos 9810 vs. S845o Samsung’s APEo Qualcomm’s APEo APE’s PoP Technology


Cost Analysis

Feedbacks

About System Plus

OEMs Package Comparison – PoP Technology




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chain o Yield hypothesiso APE Wafer & Die Costo Packaging Cost

Feedbacks

About System Plus

Packaging Cost




Physical Analysis

Physical Comparison


Cost Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

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