samsung galaxy s6 fingerprint sensor - new synaptics design 2015 teardown reverse costing report...
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]
May 2015 – Version 1 – Written by Elena Barbarini
Galaxy 6S Fingerprint Sensor
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Glossary
1. Overview / Introduction 4– Executive Summary
– Reverse Costing Methodology
2. Company Profile 8– Synaptics
– Samsung
3. Physical Analysis 12
– Synthesis of the Physical Analysis
– Galaxy S6 Fingerprint button disassembly 16
– Fingerprint Button Removal
– Fingerprint Button Assembly 21
– Fingerprint Button Assembly Views
– Fingerprint Button View
– Fingerprint Sensor Disassembly
– Fingerprint Sensor Packaging 26
– Package View & Dimensions
– Package Opening
– Package Cross-Section
– Fingerprint Sensor Patents
– Sensing PCB 36
– Sensing PCB View & Dimensions
– Sensing PCB Delayering
– Sensing PCB Cross-Section
– Sening PCB Process Characteristics
– ASIC Die 45
– ASIC Die View & Dimensions
– ASIC Die marking
– ASIC Die Delayering
– ASIC Die
– ASIC Die main Blocs
– ASIC Die Process
– ASIC Die Cross-Section
– ASIC Die Process Characteristic
– Bottom PCB 64
– Bottom PCB View & Dimensions
– Bottom PCB Cross-Section
– Bottom PCB Process Characteristics
4. Sensor Manufacturing Process 72– ASIC Front-End Process
– ASIC Front-End Wafer Fabrication Unit
– PCB Fabrication Unit
– Synthesis of the main parts
5. Cost Analysis 77– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Explanation
– Yields Hypotheses
– ASIC die 82
– ASIC Front-End Cost
– ASIC Probe Test, Thinning, Bumping & Dicing
– ASIC Wafer Cost
– ASIC Die Cost
– Sensing PCB Cost 88
– Home Button Assembly 91
– Assembled Components Cost
– Synthesis of the assembling
– Home Button Assembly Cost
6. Samsung’s gen 1 vs gen 2 fingerprint sensor 98
7. Samsung’s vs Apple’s vs Huawei’s fingerprint sensor 101
Contact
Galaxy 6S Fingerprint Sensor
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• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Samsung Galaxy S6 Fingerprint Sensor Assembly.
• This is the second generation of a fingerprint sensor in the Samsung Galaxy product line. The
Fingerprint Sensor technology has been developed by Synaptics Inc., world leader in capacitive
sensing human interface solutions for consumer electronics companies.
• With this new fingerprint Samsung’s is following the choices of Huawei and Apple to have a more
reliable sensor. The used technology concept is the same PCB capacitive but and innovative method
to detecting the presence of an object is implemented. Moreover the CMOS processing capability is
much more important and the sensing are is bigger, to optimize the detection and decrease reading
errors.
• The fingerprint sensor of the Galaxy S6 is located above the home button and it has the dimension
of 15.9x6.4 mm. The sensor is incorporated within a rectangular shaped housing composed of an
aluminum ring and a Aluminium base.
• The sensor is protected by a white plastic cover and supported by innovative assembly of rigid and
flex PCB.
Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Galaxy 6S Fingerprint Sensor
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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
• Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]
– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]
• Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]
– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]
• Financial services
– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
• General
– Email: [email protected]