ASIC System-on-Chip (SoC) Solutions

With the market moving to SoC technology, working with Samsung enables

customers to simplify and accelerate the creation of leading-edge products.

Samsung’s ASIC solutions are enhanced by the company’s system-level

knowledge and experience in deep sub-micron design methodologies. For

example, through Samsung’s unique embedded memory processes, engineers

can incorporate custom-sized DRAM and Flash memory blocks into their SoC

designs. With standard cell libraries from the Common Platform technology

alliance and ARM, Samsung takes the risk out of getting customers’ products to

market by providing high-performance, high-density or low-power expertise for

highly integrated ASIC SoCs.

Samsung Foundry: ASIC Design Solutions

Samsung takes the risk out of

getting products to market quickly.

Samsung continually advances its technology innovation, giving customers access to state-of-the-art logic processes that enrich and differentiate their products.

Samsung delivers the total solution, including 32/28nm design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging & testing capabilities. The result is a shortened design cycle, lower risk and first-pass design success for most products.

What Samsung Offers

Rich IP Portfolio, Standard Cell, I/O and Memory Libraries

Samsung offers the broadest selection

of ARM cores, along with embedded

DRAM and Flash and a wide range of

advanced mixed-signal IP solutions.

We also provide silicon-validated

SerDes and USB 2.0 IP cores for

various application.

State-of-the-Art Fabrication Facilities

When it comes to investing in the

most advanced production facilities,

Samsung is at the forefront of

the industry. Completely owned

by Samsung, the fabs have the

flexibility and back-end capacity to

accommodate the production of

customer’s ASIC solutions.

The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. Copyright © 2005. Samsung Semiconductor, Inc. is a registered trademark of Samsung Electronics Co. Ltd. All other names and brands may be claimed as the property of others. Microsoft® and Windows® are registered trademarks of Microsoft Corporation.

DS-10-SRAM-002 Printed 2/20

Samsung Semiconductor, Inc.

3655 North First St., San Jose, CA 95134-1713 TEL: 408-544-4000 FAX: 408-544-4950www.usa.samsungsemi.com

Regional Design Centers

Samsung’s ASIC Design Centers

are focused on delivering superior

services. These centers are staffed

by highly skilled ASIC design

engineers who understand complex

implementations. These regional

design centers offer complete

support of deep sub-micron design

methodologies, architectural analysis,

cost analysis and evaluation of system-

level trade offs.

Advanced Process Technology

Utilizing years of success as a top

semiconductor supplier, Samsung

has developed the process expertise

for high-volume manufacturing while

Advanced Process Technologies• 32/28nm• 45nm• 65nm• 90nm

CPU Cores• ARM Cortex A, R & M

Families• ARM 7, 9 & 11 families

DSP Cores• TeakLite• Teak• Oak

Peripheral Cores• 10/100 MAC Ethernet

Controllers• USB 1.1, USB 2.0, USB

OTG• IEEE 1394 Link Controllers• PCIe Controllers• IrDA• UART• Synchronous Serial I/F• Real-Time Clocks• Keyboard/Mouse I/F• General-purpose I/F• Smart Card/SIM I/F• Multimedia Card I/F• Asynchronous Static

Memory Controllers (SRAM, Flash ROM)

• Universal Memory Controllers (SDRAM, Synch Flash, SRAM)

• DMA Controllers• LCD Controllers• Watch-do Timers• Programmable Interrupt

Controllers

Interface IP• HDMI Tx v1.3• MiPi• SMIA (CCP2)

Multimedia IP• 820/1080i/1080p MFC• Audio Codec• JPEC Codec

Mixed Signal Cores• ADC: 6 to 14 bits, up to

450MHz• DAC: 8 to 16 bits, up to

300MHz• PLL: Up to 2GHz, Frequency

Synthesizer, De-skew, Pixel Clock, Dithered, Clock Recovery

• CODEC: 16-bit Audio, 14-bit Voice

• AFE

Embedded Memories• Embedded DRAM• Embedded Flash

also using this knowledge to increase

the capabilities of customers’ ASIC

designs.

Packaging & Testing Services

Samsung offers a full selection of

packaging options that accommodate

high-level integration and multiple

form factors. Samsung is one of the

pioneers in PoP and SiP technologies

for various applications. Also available

are increasing popular packaging

options such as fine-pitch BGA and

Flip Chip. In addition, Samsung

provides complete testing services in

the fabs.

Samsung’s Breadth of ASIC Solutions