saes packaging service introduction 2013.pdf
TRANSCRIPT
ma k i n g i n n o v a t i o n h a p p e n , t o g e t h e r
SAES Packaging service
m a k i n g i n n o v a t i o n h a p p e n , t o g e t h e r© SAES Group2MJM 25/01/2013
MEMS Packaging service descriptionFacility and operationsCapabilities and future prospective
Choose your type of service : Fast prototypingProcess developmentsPackaging foundry service
Add‐on servicesRGA (Residual Gas Analysis)Outgassing Leak rate measurements
Conclusions
Agenda
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SAES Packaging Service description
MEMS discrete (die‐level) vacuum packaging Ceramic packaging Metal packaging
Getter integrationGetter film deposition and pattering
Sealing methodsAu/Sn eutecticGlass frit soldering
m a k i n g i n n o v a t i o n h a p p e n , t o g e t h e r© SAES Group4MJM 25/01/2013
Facilities and operations
Equipment Independent outgassing/forming gas systemHigh vacuum sealing furnace Independent heating systemsRapid thermal annealing
OperationsClass 100 clean room High ThroughputFlexible sealing recipes
TestingUltrasonic microscope bonding line integrity testLeak rate measurements
Temperature: up to 1100°CHeated plates, up to 450 x 450 mmFast ramping of plate • Ramp up at > 3.5°C/second • Ramp down at > 2°C/second100 steps per programUltimate Vacuum: ~ 7 x 10‐7mbarHigh pressure atmosphere: up to 3 bar (abs)
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Capabilities and future prospectiveCurrent achievements :
Final packaging pressure down to 10‐3 – 10‐4 mbar range with getter integrationHermeticity level < 10‐16 mbar l /sFast sealing processDie attach materials selections
Future available services :Die attachWire bonding
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Choose your type of service
SAES is offering :
Fast prototypingProcess developmentsPackaging foundry service
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Fast prototyping
Need prototypes quickly?Here are the steps SAES follows:
Review packaging drawings and requirements Develop tools Perform bonding trials on empty packages Perform bonding on first prototypes Complete tests and characterizations
In a reasonably short time we can make your first prototypes a thing of realityNeed more fast? We can do that!We can provide effective and robust solutions
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Process developments
Step by step process developmentDiscussion and definition of the project goalsMaterial selections and analysisGetter integrationPreliminary packaging experimentsRecipe definition and testingRecipe improvementsTests on repeatabilityCpK definition and key control parameters
Process installationTests and fine tuning
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Packaging foundry service
High throughput capability Competitive costsFast delivery
Packaging components provided by customer :Ceramic container with die attached and wire bonded MEMSAu plated Kovar lidAu‐Sn Bonding preform
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Add‐on services
SAES also offers:
RGA (Residual Gas Analysis)Outgassing testsLeak rate measurements
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RGA
MEMS samples with internal volume down to nano liter rangeAnalysis sensitivity 10‐6 cc mbarTotal pressure and gas compositionService capability :
Two samples per dayStandard lead time 4 weeksFast lead time : 1 week
Q Factor (measured) 3000
Q Factor (calculated) 3220
Gas Pressure (mbar) Composition
H2 7.92E-01 81.7%CH4 8.92E-02 9.2%H2O 9.70E-04 0.1%CO 5.53E-02 5.7%N2 1.55E-02 1.6%
C2H6 5.82E-03 0.6%C3H8 7.76E-03 0.8%CO2 1.94E-03 0.2%
Noble gases (He,Ar,etc...) 7.76E-04 0.1%
Total 9.70E-01 100.0%
Mean Viscosity (10-5 Pa s)
0.984
Sample 1
Without getter
Q Factor (measured) 500000
Q Factor (calculated) 1.40E+07
Gas Pressure (mbar) Composition
H2
CH4 3.92E-05 9.8%H2O 2.28E-05 5.7%CON2
C2H6 1.52E-05 3.8%C3H8 3.36E-05 8.4%CO2
Noble gases (He,Ar,etc...) 2.89E-04 72.3%
Total 4.00E-04 100.0%
Mean Viscosity (10-5 Pa s)
1.911
Sample 5
With getter
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Outgassing testsMaterial studies on outgassing propertiesMaterial vacuum compatibility assessmentsMaterial selections Material comparisons
Service capability :Max sample size of 1”Max temperature treatment is 800°C
Methods :Static outgassing
to measure the outgassing rate from metals, glasses, ceramics, and other materials which release a relatively low amount of gas
Dynamic outgassingis very useful to make measurements on plastics, foams and other materials which show a high amount of gas evolved and mainly outgas water vapor
0 20 40 60 80 100 120 140 160 180
0
50
100
150
200
250
300
350
400
450
Bonding: 370 °C x 5 min
330 °C x 12 min
400 °C x 60 min
200 °C x 60 min
Tem
pera
ture
(°C
)Time (min)
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Leak rate measurementsThe detection and measurement of very small leaks is a key factor for the assessment of device lifetime
The method is able to :establish whether the device is affected by a leak or not quantitatively measure the leak rate
Service capabilities : Sensitivity : the minimum detectable air leak rate is about 1x10‐16 mbar l/s. Whenever the leak rate is close to the system sensitivity an upper limit will be providedStandard lead time: 4 weeks Fast service lead time : 2 weeks
ExampleTests performed on inertial sensors The producer observed Q‐factor degradation with time for some devices
Pa·m3/s Torr·l/sUltra fine < 1.0E-13 1.0E-14 7.5E-14Super fine < 1.0E-10 1.0E-11 7.5E-11Extra fine < 1.0E-08 1.0E-09 7.5E-09
Fine < 1.0E-06 1.0E-07 7.5E-07Moderate < 1.0E-04 1.0E-05 7.5E-05
Gross > 1.0E-04 1.0E-05 7.5E-05
mbar·l/s
Air leak rate
Device AccelerometerInitial presure 0.01 mbarTarget pressure 0.1 mbarVolume 0.1 mm3
PaGe® surface 2 mm2
Internal surface outgassing is neglected
No getter With getterMeasured
air leak rate (mbar·l/s)< 3.0E-16 10 y >30 y6.6E-16 4.8 y >30 y2.0E-14 57 days 15 y7.5E-14 15 days 4.2 y
Time to exceed 10 x target pressure
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Conclusions
Competitive advantages of SAES’ MEMS die packaging service
High vacuum encapsulationGetter integration for long term stabilityFlexibilityFast responseCompetitive costsEngineering capabilities
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