rutherford appleton laboratory particle physics department a novel cmos monolithic active pixel...
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Rutherford Appleton LaboratoryParticle Physics Department
A Novel CMOS Monolithic Active Pixel Sensor with Analog Signal Processing and 100% Fill factor
J.P. Crooks3, J.A. Ballin1, P.D. Dauncey1,A-M. Magnan1, Y. Mikami2, O. Miller2,M. Noy1, V. Rajovic2, M. Stanitzki3, K.D. Stefanov3, R. Turchetta3, M. Tyndel3, E.GiulioVillani3, N. K. Watson2, J. A. Wilson2
1:Imperial College London, 2:University of Birmingham, 3: STFC Rutherford Appleton Laboratory
Pixels small enough: at most one particle/pixel 1-bit ADC/pixel: Digital ECAL Example: ECAL – Terapixel APS for ILC
SORMA West 2008 Berkeley, California USA
INMAPS process: Deep P-Well implant to shield N-Well housing readout electronic Potential barrier between P++-Well and Epitaxial reflects back generated charge into the active layer Dramatic improvement in charge collection
New INMAPS process New INMAPS process
Pixel simulation standard processPixel simulation standard process
Detector Microphotograph and laser setup used for testing (right).Detector Microphotograph and laser setup used for testing (right).Laser test results on INMAPS and NO INMPAS test pixel (left).Laser test results on INMAPS and NO INMPAS test pixel (left).
Laser test resultsLaser test results Laser IR (1064nm, 2μm minimum shutter size, 4ns pulse) Laser scans clearly indicate that the INMAPS process increases charge collection efficiency Further investigations ongoing
Source test results Source test results Test with radioactive sources validate the usefulness of INMAPS process Further tests ongoing to understand unexpected threshold spread New sensor submission planned summer 08
Source test results: Source test results: 5555Fe (right) and Fe (right) and ββ source (left) on INMAPS test pixel source (left) on INMAPS test pixel
INMAPS test resultsINMAPS test resultsINMAPS test resultsINMAPS test results
Two different readout implemented at pixel level: Pre-shape andPre-sample (160 and 189 transistors respectively) Two different capacitor arrangements DC power consumption approximately 10μW 0.18μm CMOS process
≈ 144mV≈ 202mV
≈ 9.5μm
Study of optimal diodes location and size carried out on the new process 12μm epitaxial layer thickness
Rst
Vrst
Shaper
PreRst
Buffer
s.f
Cfb
CinBuffer
s.f
Vth+Vth-
Reset
Sample
Cstore
Preamp Shap
er
Rst
Cpre
Cfb
Rfb
RinCinVth+Vth-
Pre-Shape Pixel Analog Front End
Low gain / High Gain
Comparator
Pre-Sample Pixel Analog Front End
Low gain / High Gain
Comparator
Hit Logic
150ns
150ns
450ns
Hit Logic
Self Reset
Trim&Mask
SRAM SR
Trim&Mask
SRAM SR
Hit Output
Hit Output
Pixel Readout Topology AnalogPixel Readout Topology Analog
Each digital block serves 42 pixels from one row, split into groups of 6 pixels After a hit, for each row the logic stores timestamp, pattern number and pattern in SRAM 28224 pixels, approximatel6 8x106 transistors 1x1cm2 total surface Dead area 250μm / 2mm
Pixel Readout Topology Digital Pixel Readout Topology Digital
INMAPS simulation resultsINMAPS simulation results
In a complex pixel design a standard MAPS solution leads to low charge collection efficiency Approximately 50% of the generated charge is collected by the readout N-Wells
MAPS digital calorimeter conceptMAPS digital calorimeter concept
Pixel collection Charge (e-)
<Q> 87
Qmax 362
Qmin1 5
Qstdev 107
Pixel collection
Charge (e-)
<Q> 401
Qmax 656
Qmin1 261
Qstdev 95
Pre-shape (left) and pre-sample (right) pixel Pre-shape (left) and pre-sample (right) pixel layoutlayout
5050 μm2
MAPS pixels
SiD 16mm2 area cells
Contacts: [email protected]: [email protected]