rod r&d status k. johns, c. armijo, j. steinberg (u. arizona) h. chen, f. lanni, j. mead (bnl)...

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ROD R&D Status K. Johns, C. Armijo, J. Steinberg (U. Arizona) H. Chen, F. Lanni, J. Mead (BNL) L. Hervas (CERN) A. Meyer, A. Kielburg-Jeka, A. Straessner (Dresden) G. Perrot, A. Bazan, F. Bellachia, I. Wingerter-Seez (LAPP) M. Citterio (INFN, Milano) D. Schamberger (SUNY, Stony Brook)

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ROD R&D Status

K. Johns, C. Armijo, J. Steinberg (U. Arizona)H. Chen, F. Lanni, J. Mead (BNL)

L. Hervas (CERN) A. Meyer, A. Kielburg-Jeka, A. Straessner (Dresden)G. Perrot, A. Bazan, F. Bellachia, I. Wingerter-Seez

(LAPP)M. Citterio (INFN, Milano)

D. Schamberger (SUNY, Stony Brook)

Optical Link NotesCurrently we build with

Reflex Photonics SNAP12 Emcore SNAP12

Both specified @ 3.3 Gbps

Recent news/results Delivery date for Reflex Photonics SNAP12

@ 6.25 Gbps still +6 weeks First promised for July 1

Both RP and Emcore 3.3 Gbps versions can run at higher speeds Emcore shows better performance (up to 5

Gbps) based on measured BER

2

Optical Link Notes

Designing @ 6.25 Gbps and beyond Measurements with AZ test board

3

8 inches

8 inches

2x8 inchesand via

3.2 inches

Optical Link NotesDesigning @ 6.25 Gbps and

beyond Vias degrade eye pattern No difference in trace length or layer

4

Optical Link NotesIn order to move to higher optical

density we are now designing with Reflex Photonics LightABLE OE OE is an IC with 12 channel GaAs VCSEL or

12 channel GaAs PIN photodetector Connected electrically via wire bonds Connected optically via MT connector

Present speed @ 6.25 Gbps Designer provides an electrical footprint

on the PCB RP mounts (wirebonds) the OSA

OE part and mounting cost is ~$350 / die

5

Optical Link Notes

6

ATCA Sub-ROD Development (BNL)

Base Interface (Gigabit Ethernet)Fabric Interface (10Gig Ethernet)

Zone 3 (to transition module) LVL1 communication

Update ChannelGlobal Clocks

-48v Power Input and IPMI interface

12 fiber inputs on SNAP12 format

DDR2SODIMM Memory

Virtex-5 FXT FPGA

Power Conversion

Serial Debug Port

ATCA Sub-ROD Development AdvancedTCA 8U Module

With separated +5V power connector and Gigabit Ethernet connector on front panel, it allows testing of main functions without ATCA crate

IPMI development is underway, using development document and source code from DESY. Even though we use different processor, all the code is in C which helps software porting

One sub-ROD module was shipped to Dresden in late June/early July

High Speed Parallel Optical Links and FPGA SERDES Self loopback test works at 3.2Gbps on 12 channels, 40Gbps

total bandwidth Sub-ROD (and sub-ROD injector) still awaiting 75 Gbps

transceivers from Reflex Photonics Present plan is to do another round of sub-ROD and sub-

ROD injector integration tests in October using Emcore parts which can run over spec (~5 Gbps)

ATCA Sub-ROD Injector (AZ)

Sub-rod injector ATCA card also now available

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ATCA Sub-ROD Injector (AZ)

Testing with test ATCA backplane

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ATCA Sub-ROD Injector (AZ)

Details of test backplane

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ATCA Sub-ROD Injector (AZ)

Eventual testing in ATCA crate We received this demo model from

ASIS

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ROD in ATCA/AMC Form Factor

Present plan is to build processing units (ROD or ROD injectors) in AMC format on ATCA cards

ROBs would also reside in ATCA crate

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Up to 48 Fiber’s per AMC (4 - SNAP12)

LVL 1 Interface

Connection to ROB through ATCA

backplane using 10Gigabit Ethernet

AMC PU

AMC PU

AMC PU

AMC PU

ROD in ATCA/AMC Form Factor

AMC cards are Processing Units Contain optical receivers and FPGA based SERDES Perform energy calculations and partial Level-1 sums High speed, low latency connections for Level-1 sums

require communication between AMC modules and possibly between different ATCA carriers

Processing units can be developed independently of ATCA carrier board (using MicroTCA crate)

ATCA Carrier Board Provides connections between AMC modules and also

to ATCA backplane Low latency switching protocol Possible connection to ROB via 10G Ethernet Provides connections to rear transition board for Level-

1 sums14

AMC Card using LOB

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4 x 12 channels per AMC card Stratix IV has 48 transceiver channels

@ 8.5 Gbps

4 AMC cards per ATCA (ROD)

EPROM

DDR3

Flash Ethernet

PCI Express Driver

Microcontroller

AMC Card using LOB

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4 x 12 channels per AMC cardStratix IV has 48 transceiver channels @

8.5 Gbps

4 AMC cards per ATCA (ROD)

AMC Sub-ROD Two ATCA boards per half barrel FEC

2 SNAP12 connectors / AMC card x 1 FEB/SNAP12 x 4 AMC cards = 8 FEBs

Assumes 10 Gbps transmission

One ATCA board per half barrel FEC 4 optical connectors / AMC card x 1

FEB / SNAP12 x 4 AMC cards = 16 FEBs

This eliminates data transmission between different ATCA boards eases processing of the Level-1 trigger sum

The MTP connectors utilize the same MT ferrules and package them in a push-pull keyed connector housing for quick and easy connection

The width of MTP connector is ~15mm, which is more than twice of the width of MT connector

Molex high density optical MT connectors

Circular MT: single MT ferrule, 12 to 72 fibers per ferrule

1x6 Array: 6 MT ferrules, 12 fibers per ferrule

Both Molex and Tyco offer high density optical MT cable assemblies using 72-fiber MT ferrule in the industry standard MTP connector

MTP Connector

Disassembly of MTP Connector

MT Connector

sLHC LAr ROD Upgrade R&DMailing list

[email protected] espace

https://espace.cern.ch/slhc-atlas-lar-rodPhone meeting

First meeting was organized on Sept. 11th; people from Univ. of Arizona, BNL, Dresden, LAPP and Stony Brook Univ. were connected

Goal was to update what everybody’s been working on and discuss how to proceed

Plan to continue this phone meeting once a month