Robert Coleman – Senior Applications Engineer Space Products Jamie Gatt – Discrete Components Engineering Manager

Manufacturing Locations

China Welwyn Components

USA BI Technologies ECD BI Technologies MCD International Resistive Company (IRC WAFT) International Resistive Company of Texas (IRC AFD) Optek Technology

UK BI Technologies AB Connectors Semelab Welwyn Components

Mexico BI Technologies SA de CV Optron de Mexico

Austria AB Mikroelektronik

Japan BI Technologies

Malaysia BI Malaysia Singapore TT electronics Singapore

• Semelab has over 36 years experience in the design and manufacture of Electronic components

• Nearly all aspects of assembly, test and qualification take place within Semelab

• Thousands of international Jedec part numbers are manufactured • Continuity of supply. Semelab stores millions of die where possible to prevent obsolescence, • International accredited approvals, plus in house die element evaluation. • Key to Semelab success is tailoring product to meet the needs of customers and being highly flexible

Semelab Ltd A subsidiary of TT electronics plc

EFA

Fxx

Boeing / Airbus

JSF

Apache

V22 Osprey

Inmarsat

Globalstar

Altika

Galileo F.O.C

Ariane Vega

Space Station

SM2/3/6

Asraam

Hellfire

Storm Shadow

Patriot

Meteor

In Space In the Air Spearfish

Stingray

Global Marine

Oil Drill heads

Ships

Defence In the Sea

Over the last 36 years many projects have used Semelab parts:

Ceramic Surface Mount

TO257 hermetic package family

Traditional packages

Discrete Product families offering

Voltage range 20v-1200v

Current range 30mA -150A

Agencies Tags : K Radhakrishnan, ISRO Posted: Sun Apr 04 2010, 12:29 hrs Bangalore: India plans to cut satellite launch cost by half with the heavy-lift rocket that it is developing………………………………………….. GSLV-Mk III that ISRO is developing now would bring down the satellite launch cost at least by half, at present, the launch cost is pegged at around USD 20,000 per kilogram.

Today’s problem Launch costs

Lightweight, high integration example:

X 10 TO18 packages

Up to 10 parts now in 12 MCA’s

MCA’s ( Multi Chip Arrays)

Advantages of MCA technology

Real estate saving A true saving in PCB space while giving an easier P.C.B (circuit board) tracking layout

Bespoke circuit layout for improved manufacturing

Qualified die can be used if the project demands- through strategic die partnerships COTS die – Element Evaluation qualified die can be used – supplied through Semelab ready for Flight >25 years of experience with this model.

Mixed technology and manufacturer can be used, to customise circuit requirements, E.g. Rad FET, Diode and Bipolar chips in single package.

Customised design to reduce the number of wirebonds, reducing manufacturing costs and improving reliability.

Weight Saving:-

12 x TO18 = 3.6 g 12 x LCC1 (UA) = 0.48g

1 x MCA = 0.3g

Typical weight saving 400 MCA per board approx weight = 192 g (0.192kg)

The equivalent discrete 400 circuits X 10 components per circuit = 4000 devices Total weight TO18 = 1200g (1.20 kg)

Launch costs @ $20,000 / Kg

TO18 = $24,000

MCA = $2,400

Example based on Galileo F.O.C program

Improved reliability Using Mil-HDBK-217F notice 2 Calculations for a circuit of twelve 2N2222A transistors operating in an inhibited airborne environment with a case temperature of 60°C shows a failure rate of λp as follows:-

Plastic discrete Transistor system: λp=6.49 failures /106 operating hours

Hermetic Discrete (UA) solution system: λp=0.81 failures/ 106 operating hours

MCA system:

λp=0.22 FAILURES /106 OPERATING HOURS

M.C.A’S OFFER:-

• High density packaging options • Using standard flight proven packaging

• Easy interconnections • Simpler PCB board layouts

• Lower weight solutions • The equivalent circuit in a MCA weighs 2/3rd less than a UA equivalent and only 10% of the weight of a TO18 equivalent

•Higher reliability • MTBF is enhanced by a factor of 29 x compared with the use of discrete plastic parts

• Lower Cost • Typically 30 % saving over equivalent space grade discrete transistors

But what of Power devices ?

Si3N4 Via technology

Combining state of the art Via technology with Si3N4 substrates Semelab are pleased to offer a semi-customable multi chip array to the space and military equipment manufacturers • This package has undergone extensive space flight qualification for the TAS Altika , Senital3 programs The package offers the following advantages over conventional solutions:- • Increased circuit density/ current density • Lower weight • Increased reliability • Lower circuit costs

Flight proven Power M.C.A’s

Temperature Cycling

Source Kyocera Corporation

Diode Leadless Chip Carrier designed for improved manufacture

DLCC ... Diode Leadless Chip Carrier

Thermal via construction to meet MIL-STD Spec’s for surge & θJ-Amb

• Direct PCB replacement for MELF standard product with enhanced features • Lighter weight than equivalent MELF packaging • Optional deep dielectric discharge protection available • Optional international aerospace and space screening flows • Manufactured in accordance with MIL-19500 and ESA specifications • Built using established space packaging technology (LCC/MCA structure) • Castellated design to ensure solder meniscus between PCB and component is visible • Thermal via’s incorporated to enhance thermal performance

Features and benefits:-

DLCC ...MELF STYLE REPLACEMENT

D.L.C.C range offers a drop in replacement for the popular MELF style

New Semelab Package

Mass in g

Industry Standard Mass in g

Description Difference

DLCC2 0.09 B-MELF (D5A) 0.18 1N5806USJTX DLCC2 is half the mass

DLCC3 0.15 E-MELF (D5B) 0.539 1N5811US DLCC3 over 3.5 times less

Semelab supply drop in replacement for Industrial standard parts i.e. 1N5811,1N5806

However Semelab are please to announce the introduction of 600 volt and 1200 volt SiC diode to the DLCC range

Designed around our DLCC3 packaging ( E-MELF Size) • No Reverse Recovery Losses • Low forward losses • Low switching loses • Fully surge- current Stable • Lower system cost due to reduced cooling required • Elevated temperature ranges

Long Term Reliability Tests – 8,000 hour at 225°C, 1200V DLCC3 Diode SiC

1200V Leakage Current vs Time at 225°C Storage Bake

000.0E+0

1.0E-6

2.0E-6

3.0E-6

4.0E-6

5.0E-6

6.0E-6

0 1000 2000 3000 4000 5000 6000 7000 8000 9000

Hours

Cur

rent

(A) 1

234

Reverse Leakage Current Zth - ΔVF(mV) Vs Time at 225°C Storage Bake

58.5

59.0

59.5

60.0

60.5

61.0

61.5

0 1000 2000 3000 4000 5000 6000 7000 8000 9000

Hours

ΔVF

(mV)

1

2

3

4

Thermal Impedance

Zero Reverse Recovery – Junction Capacitance charge related effects only – constant over temperature

Improving the space weather forecast •As spacecrafts navigate the oceans of space, satellites encounter severe storms in a similar way as Earth-based ocean going vessels do • A documented phenomenon known as Deep Dielectric Discharge, associates high speed solar wind streams with the appearance of large numbers of highly energetic electrons in the magnetosphere •The buildup of charge occurs when the total amount of high velocity electrons exceed 1MeV (1 Million electron Volts) during the storm event. The charge continues to build until the dielectric strength of the material is exceeded • Once this happens an instantaneous electrical discharge occurs, which is similar to a miniature lightning strike. This is a hazardous event capable of damaging semiconductor and other sensitive devices. Part of the solution is to incorporate design improvements to mitigate the effects of Deep Dielectric Discharge

Semelab are the First European manufacturer to offer off the shelf solutions for this phenomenon

Power Products Power modules for Thrust Vector Actuation

Hermetic

• Arianne Vega, Arianne 5 ,MA5003ALP,

• IGBT, Diodes, MOSFET, Wideband gap

Hybrid Microcircuit for Orion Mars Program

Part of Inertial Navigation Unit.

High reliability chip & wire hermetically sealed hybrid.

Precision resistors in circuit.

Hermetic package.

Minimum weight and size.

Circuit Layout detail developed by TT electronics

Thank You