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RFID
The next Opportunity for Gravure
By: Walter Siegenthaler
RFID The next opportunity for Gravure
World Headquarters in Bleienbach/Switzerland
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RFID The next opportunity for Gravure
US Headquarters in Huntersville, NC
RFID The next opportunity for Gravure
Manufacturing Facilities and MDC Offices
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RFID The next opportunity for Gravure
MDC Product lines
CYLINDER PREPARATIONEQUIPMENT LASER TECHNOLOGY
DOCTOR BLADES
PLATING TECHNOLOGY
RFID The next opportunity for Gravure
• What is RFID?
– Radio Frequency Identification
– Identification of items with the use of Radio Frequency Wave Technology
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RFID The next opportunity for Gravure
• RFID will one day replace UPC Bar Codes
– Bar codes need line of sight to be read
– RFID does not need line of sight
RFID The next opportunity for Gravure
Reader
cereal
Productwith RFIDtag
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RFID The next opportunity for Gravure
Receipt
9.99
3.45
18.75
32.19
RFID The next opportunity for Gravure
• Where are we today?
– Wal-Mart requires as of January 2005
• Top 100 suppliers meet 100% readability for pallets and cases shipped to specific Distribution Centers
• 100% readability of cases moving on conveyors at up to 540 feet per minute
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RFID The next opportunity for Gravure
• Others are following the lead of Wal-Mart
– Home Depot– Albertson’s– CVS– Target– Lowes
RFID The next opportunity for Gravure
• The Other Driving Force
– Department of Defense (DoD)
• Specified its own UID (Unique Identification)
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RFID The next opportunity for Gravure
• Today’s RFID Tags
– Printed Antenna (printed with conductive ink)
– Inserted Chip (integrated Circuit)
RFID The next opportunity for Gravure
• Today’s RFID Tags limitations:
– Chip too expensive for item labeling
– Chip insertion accuracy
– Chip insertion speed
– Chip to Antenna connection critical
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RFID The next opportunity for Gravure
• Future RFID Tags
– Antenna and Electronics printed directly on Tag
RFID The next opportunity for GravureFlexible Substrate• Plastic• Paper
G
Conductors• PTF conductors• Conductive polymers• Organo-metallics• Nanoparticle inks• Metal foils
Dielectrics• PTF dielectrics• Polymer• Oxides
S D
Active
SubstrateDielectric
Conductor
Actives• Polymers• Oligomers• Inorganics
Courtesy of Motorola's Printed Electronics Technology Team
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RFID The next opportunity for Gravure
Gate
Source Drain
Dielectric
SemiconductorChannel
Courtesy of Motorola's Printed Electronics Technology Team
• Printed Transistor
RFID The next opportunity for Gravure
• Printed Transistor wish list
– Very small features (600 features per square inch)
– Gap less than 10 microns
– No pin holes in layers
– Very low failure rate
– Consistent ink layer thickness
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RFID The next opportunity for Gravure
• Which printing processes are considered?
– Offset– Flexo– Screen Printing– Gravure
RFID The next opportunity for Gravure
Gravure
Prin
ting
Thr
ough
put (
ft/hr
)
1 um 10 um 100 um
Printing Resolution
Offset
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103
102
104
105
106
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Screen Printing
Microcontact and Micromolding
Flexograph
Inkjet
Micro dispensing
Courtesy of Motorola's Printed Electronics Technology Team
Identify printing technology to achieve optimal OET device performance
•Available materials•Printing resolution•System registration•Film thickness
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RFID The next opportunity for Gravure
• Challenges/Opportunities for Gravure
– Sharp edges
– Gap without “bridges”
– Homogenous layers
RFID The next opportunity for Gravure
• Cylinder Engraving
– Electromechanical Engraving
– Direct Laser Engraving
– Indirect Laser Engraving
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RFID The next opportunity for Gravure
• Electromechanical Engraving• Conventional EM engraving does not create sharp edges
RFID The next opportunity for Gravure
• ElectromechanicalEngraving
New Technologies such as TranScribe or X-treme could possibly give the required results
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RFID The next opportunity for Gravure
• Direct Laser Engraving
– Laser Engraving directly into zinc
– Conventional mode is one shot = one cell
– Possibility to overlap shots to create smoother edges
RFID The next opportunity for Gravure
• Direct Laser Engraving
Conventional Master Screen
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RFID The next opportunity for Gravure
• Indirect Laser Engraving Process steps
–Coating with black lacquer• Ring coating or Spray coating
– Imaging with Laser (Laser ablation)
– Spray Etching
– Remove lacquer
RFID The next opportunity for Gravure
• Beam Size• 10 Microns for high Quality Gravure
10 µ
5 µ
135 µ 27 passes
Indirect Laser EngravingLaser imaging
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RFID The next opportunity for Gravure
Indirect Laser EngravingSuperior line detail
RFID The next opportunity for Gravure
Distinguishing between Gap and Wall?
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RFID The next opportunity for Gravure
• Once we have engraved a cylinder, the next challenge isto print the features
– What challenges do we face?
RFID The next opportunity for Gravure
• Inks
• Conductive inks are relatively new and are
continued to be developed
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RFID The next opportunity for Gravure
• Inks
Very little known about
• Print characteristics
• What result on what substrate
• Drying characteristics
RFID The next opportunity for Gravure
• In order to possibly reach the goal, we need thecooperation of:
• Cylinder engraver
• Printer
• Ink manufacturer
• Substrate manufacturer
• Doctor Blade manufacturer
• Printing Press manufacturer
• Designer of Electronics