rf power transistors hf/vhf/uhf n-channel mosfets - rbs...
TRANSCRIPT
1/12July 2004
SD2932RF POWER TRANSISTORS
HF/VHF/UHF N-CHANNEL MOSFETs
REV. 5
• GOLD METALLIZATION
• EXCELLENT THERMAL STABILITY
• COMMON SOURCE CONFIGURATION, PUSH PULL
• POUT = 300 W MIN. WITH 15 dB GAIN @ 175 MHz
DESCRIPTIONThe SD2932 is a gold metallized N-Channel MOSfield-effect RF power transistor. The SD2932 it isintended for use in 50 V dc large signalapplications up 250 MHz.
PIN CONNECTION1
3
2
1. Drain2. Gate
3. Source
2
3
1
M244epoxy sealed
ORDER CODES
ABSOLUTE MAXIMUM RATINGS (TCASE = 25 °C)
THERMAL DATA
Order Codes Marking Package Packaging
SD2932 SD2932 M244 Plastic Tray
Symbol Parameter Value Unit
V(BR)DSS Drain Source Voltage 125 V
VDGR Drain-Gate Voltage (RGS = 1MΩ) 125 V
VGS Gate-Source Volatge ±20 V
ID Drain Current 40 A
PDISS Power Dissipation 500 W
Tj Max. Operating Junction Temperature +200 °C
TSTG Storage Temperature -65 to +150 °C
Rth(j-c) Junction -Case Thermal Resistance 0.35 °C/W
SD2932
2/12
ELECTRICAL SPECIFICATION (TCASE = 25°C)
STATIC (Per Section)
DYNAMIC
IMPEDANCE DATA
Symbol Test Conditions Min. Typ. Max. Unit
V(BR)DSS VGS = 0 V IDS = 100 mA 125 V
IDSS VGS = 0 V VDS = 50 V 50 µA
IGSS VGS = 20 V VDS = 0 V 250 nA
VGS(Q) VDS = 10 V ID = 250 mA 1.5 4 V
VDS(ON) VGS = 10 V ID = 10 A 3 V
GFS VDS = 10 V ID = 5 A 5 mho
CISS VGS = 0 V VDS = 50 V f = 1 MHz 480 pF
COSS VGS = 0 V VDS = 50 V f = 1 MHz 190 pF
CRSS VGS = 0 V VDS = 50 V f = 1 MHz 18 pF
Symbol Test Conditions Min. Typ. Max. Unit
POUT VDD = 50 V IDQ = 500 mA f = 175 MHz 300 W
GPS VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHz 15 16 dB
ηD VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHz 50 60 %
Load Mismatch
VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHzAll Phase Angles
5:1 VSWR
Typical DrainLoad Impedance
Typical InputImpedance
GZin
ZDL
D
S
FREQ ZIN (Ω) ZDL (Ω)
175 MHz 0.92 - j 0.14 3.17 + j 4.34
Measured Gate to Gate and Drain to Drain, respectively.
3/12
SD2932
0 10 20 30 40 50
VDS, DRAIN-SOURCE VOLTAGE (V)
10
100
1000
10000
C, C
AP
AC
ITA
NC
E (
pF)
Ciss
Coss
Crss
2 2.5 3 3.5 4 4.5 5 5.5 6
VGS, GATE-SOURCE VOLTAGE (V)
0
5
10
15
20
ID, D
RA
IN C
UR
RE
NT
(A
) T=-20 °C
T=+25 °C
T=+80 °C
Vds=10 V
-25 0 25 50 75 100
Tcase, CASE TEMPERATURE (°C)
0.8
0.85
0.9
0.95
1
1.05
1.1
1.15
VG
S, G
AT
E-S
OU
RC
E V
OLT
AG
E (
NO
RM
ALI
ZE
D)
Id=.1 A
Id=.25 A
Id=1 AId=2 A
Id=4 A
Id=7 A
Id=5 AId=9 A
Id=10 A
Id=11 A
TYPICAL PERFORMANCEMaximum Thermal Resistance vs. Case Temperature
25 30 35 40 45 50 55 60 65 70 75 80 85
Tc, CASE TEMPERATURE (°C)
0.34
0.36
0.38
0.4
0.42
Rth
(j-c)
(ºC
/W)
Safe Operating Area
(1) Current in this area may be limited by Rds(on)
Two sides, each section equally loaded
1 10 100 1000
Vds, DRAIN SOURCE VOLTAGE (V)
1
10
100
Ids,
DR
AIN
CU
RR
EN
T (
A)
(1)
Capacitance vs. Drain-Source Voltage Drain Current vs. Gate Voltage
Gate Voltage vs. Case Temperature
SD2932
4/12
TYPICAL PERFORMANCE (175 MHz)Output Power vs. Input Power
0 2 4 6 8 10 12 14 16 18 20 22
Pin, INPUT POWER (W)
0
100
200
300
400
500
600
Pou
t, O
UT
PU
T P
OW
ER
(W
)
Vdd=50VIdq=2 x 250mAF=175Mhz
Vdd=40 V
Vdd=50 V
Output Power vs. Input Power
0 2 4 6 8 10 12 14 16 18 20 22
Pin, INPUT POWER(W)
0
100
200
300
400
500
600
Pou
t, O
UT
PU
T P
OW
ER
(W
)
Vdd=50VIdq=2 x 250mAF=175Mhz
T=-20 °C
T=+25 °C
T=+80 °C
Power Gain vs. Output Power
0 100 200 300 400 500
Pout, OUTPUT POWER (W)
10
11
12
13
14
15
16
17
18
Gp,
PO
WE
R G
AIN
(dB
)
Vdd=50VIdq=2 x 250mAF=175Mhz
Output Power vs. Gate Voltage
Efficiency vs. Output Power
Output Power vs. Supply Voltage
0 100 200 300 400 500
Pout, OUTPUT POWER (W)
10
20
30
40
50
60
70
80
Nc,
EF
FIC
IEN
CY
(%
)
Vdd=50VIdq=2 x 250mAF=175Mhz
24 26 28 30 32 34 36 38 40 42 44 46 48 50
Vdd,DRAIN VOLTAGE (V)
100
150
200
250
300
350
400
450
Pou
t,OU
TP
UT
PO
WE
R (
W)
Pin=3.9 W
Pin=7.8 W
Pin=15.6 W
Idq=2 x 250mAF=175Mhz
-3 -2 -1 0 1 2 3
VGS, GATE_SOURCE VOLTAGE (V)
0
100
200
300
400
Pou
t, O
UT
PU
T P
OW
ER
(W
)
Vdd=50VIdq=2 x 250mAF=175Mhz
T=-20 °C
T=+25 °C
T=+80 °C
5/12
SD2932
175 MHz Test Circuit Schematic (Production Test Circuit)
NOTES:1. DIMENSION AT COMPONENT SYMBOL ARE REFERENCE FOR COMPONENT PLACEMENT.
2. GAP BETWEEN GROUND & TRANSMISSION LINES IS + 0.0020.05 - O.OOO[0.00] TYP
REF. 1022256B
175 MHz Test Circuit Component Part ListR1,R2,R5,R6 470 Ohm 1 W, Surface Mount Chip ResistorR3,R4 360 Ohm 0.5 W, Carbon Comp. Axial Lead Resistor or EquivalentR7,R8 560 Ohm 2 W, Resistor Two Turn Wire Air-Wound Axial Lead ResistorR9,R10 20 K Ohm 3.09 W, 10 Turn Wirewound Precision PotentiometerC1,C4 680 pF ATC 130B Surface Mount Ceramic Chip CapacitorC2,C3,C7,C8,C17,C19,C20,C21 10000 pF ATC 200B Surface Mount Ceramic Chip CapacitorC5 75 pF ATC 100B Surface Mount Ceramic Chip CapacitorC6 ST40 25 pF - 115 pF Miniature variable TrimmerC9,C10 47 pF ATC 100B Surface Mount Ceramic Chip CapacitorC11,C12, C13 43 pF ATC 100B Surface Mount Ceramic Chip CapacitorC14,C15,C24,C25 1200 pF ATC 700B Surface Mount Ceramic Chip CapacitorC16,C18 470 pF ATC 700B Surface Mount Ceramic Chip CapacitorC22,C23 0.1 µF / 500 V Surface Mount Ceramic Chip CapacitorC26,C27 0.01 µF / 500 V Surface Mount Ceramic Chip CapacitorC28 10 µF / 63 Aluminum Eletrolytic Axial Lead Capacitor
B150 Ohm RG316 O.D 0.076[1.93] L = 11.80[299.72] Flexible Coaxial Cable 4 Turns thru Fair-rite Bead
B2 50 Ohm RG-142B O.D 0.165[4.19] L = 11.80[299.72] Flexible Coaxial Cable
T1R.F. Transformer 4:1, 25 Ohm O.D RG316-25 O.D 0.080[2.03] L = 5.90[149.86] Flexible Coaxial Cable 2 Turns thru Fair-rite Multi-Aperture Core
T2R.F. Transformer 1:4, 25 Ohm Semi-rigid Coaxial Cable O.D. 0.141[3.58] L = 5.90[149.86]
L1Inductor λ 1/4 Wave 50 Ohm O.D 0.165[4.19] L = 11.80 [299.72] Flexible Coaxial Cable 2 Turns thru Fair-rite Bead
FB1,FB5 Shield BeadFB2,FB6 Multi-aperture CoreFB3 Multilayer Ferrite Chip Bead (Surface Mount)FB4 Surface Mount Emi Shield Bead
PCBWoven Glass Reinforced PTFE Microwave Laminate 0.06”, 1 oz EDCu, Both sides, εr = 2.55
7/12
SD2932TYPICAL BROADBAND DATA (175 - 230 MHz)Input Power vs. Frequency
160 170 180 190 200 210 220 230 240
FREQUENCY (MHz)
2
4
6
8
10
12
Pin
, IN
PU
T P
OW
ER
(W
)
Vdd = 50VIdq = 300 mAPout = 250W
Power Gain vs. Frequency
160 170 180 190 200 210 220 230 240
FREQUENCY (MHz)
10
11
12
13
14
15
16
17
18
Gp
, PO
WE
R G
AIN
(dB
)
Vdd = 50VIdq = 300 mAPout = 250W
Efficiency vs. Frequency
160 170 180 190 200 210 220 230 240
FREQUENCY (MHz)
45
50
55
60
65
70
75
80
Nd
, DR
AIN
EF
FIC
IEN
CY
(%
)
Vdd = 50VIdq = 300 mAPout = 250W
Return Loss vs. Frequency
1 dB Compression Point vs. Frequency
160 170 180 190 200 210 220 230 240
FREQUENCY (MHz)
250
275
300
325
350
P1d
B ,
1dB
CO
MP
RE
SS
ION
(W
)
Vdd = 50VIdq = 300 mA
160 170 180 190 200 210 220 230 240
FREQUENCY (MHz)
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
RT
L , R
ET
UR
N L
OS
S (
dB)
Vdd = 50VIdq = 300 mAPout = 250W
SD2932
8/12
175 - 230 MHz Test Circuit Layout (Engineering Fixture)
175 - 230 MHz Circuit Layout Component Part ListPCB 1/32” Woven Fiberglass 0.030 Cu, sides, εr = 4.8T1 50 Ohm Flexible Coax Cable OD 0.06”, 3” Long. Ferrite Core NEOSIDET2,T3 9:1Transformer, 16.5 Ohm Flexible Coax Cable 0.1”, 3” LongT4,T5 4:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.06”, 5” LongC1 8.2 pF Ceramic CapC2,C3 100 pF Ceramic CapC4 2 - 18 pF Chip CapC5 47 pF Ceramic CapC6,C11 47 nF Ceramic CApC7 56 pF ATC Chip CapC8,C9,C13 470 pF ATC Chip CapC10 100 nF Ceramic CapC12 2 x 330 nF / 50 V CapC14 10 nF / 63 V Electrolityc CapR1,R3 47 Ohm ResistorR2 6.8 K Ohm Chip ResistorR4 4.7 K Ohm Multi Turns Trim ResistorR5 8.2 K Ohm / 5 W ResistorR6 3.3 K Ohm / 5 W ResistorD1 6.8 V Zener DiodeL1 20 nH InductorL2 70 nH InductorL3 30 nH InductorL4 10 nH InductorL5 15 nH Inductor
9/12
SD2932TYPICAL BROADBAND DATA (88 -108 MHz)Input Power vs. Frequency
85 90 95 100 105 110
FREQUENCY (MHz)
2.5
3
3.5
4
Pin
, IN
PU
T P
OW
ER
(W
) Vdd = 50VIdq = 200 mAPout = 300W
Power Gain vs. Frequency
85 90 95 100 105 110
FREQUENCY (MHz)
16
17
18
19
20
21
22
Gp
, PO
WE
R G
AIN
(dB
)
Vdd = 50VIdq = 200 mAPout = 300W
Efficiency vs. Frequency
85 90 95 100 105 110
FREQUENCY (MHz)
60
62
64
66
68
70
72
74
76
78
80
Nd
, EF
FIC
IEN
CY
(%
)
Vdd = 50VIdq = 200 mAPout = 300W
3rd Harmonic vs. Frequency (88 - 108 MHz
Return Loss vs. Frequency
2nd Harmonic vs. Frequency (88 - 108 MHz)
85 90 95 100 105 110
FREQUENCY (MHz)
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
RT
L , R
ET
UR
N L
OS
S (
dB)
Vdd = 50VIdq = 200 mAPout = 300W
85 90 95 100 105 110
FREQUENCY (MHz)
-36-34-32-30-28-26-24-22-20-18-16-14-12-10
H3
, 3rd
HA
RM
ON
IC (
dBc)
Vdd = 50VIdq = 200 mAPout = 300W
85 90 95 100 105 110
FREQUENCY (MHz)
-36-34-32-30-28-26-24-22-20-18-16-14-12-10
H2
, 2nd
HA
RM
ON
IC (
dBc)
Vdd = 50VIdq = 200 mAPout = 300W
SD2932
10/12
88 - 108 MHz Test Circuit Layout (Engineering Fixture)
88 - 108 MHz Circuit Layout Component Part ListPCB 1/32” Woven FiberGlass 0.030 Cu, 2 sides, εr = 4.8T1 50 Ohm Flexible Coax Cable OD 0.06”, 5” LongT2,T3 9:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.1”, 3.9”. Ferrite Core NEOSIDET4,T5 4:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.1”, 5” LongT6 50 Ohm Flexible Coax Cable OD 0.1”, 5” LongFB1 vk200C1 10 pF Ceramic CapC2,C3,C4,C7,C8 1 nF Chip CapC5,C6 1 nF ATC Chip CapC9 470 pF ATC Chip CapC10 100 nF Chip CapC11 100 mF / 63 V Electrolityc CapR1 56 Ohm ResistorR2,R4 10 Ohm Chip ResistorR3 10 K Ohm ResistorR5 5.6 Ohm ResistorR6 10 K Ohm, 10 Turn Trim ResistorR7 3.3 K Ohm / 5 W ResistorR8 15 Ohm / 5 W ResistorD1 6.6 V Zener DiodeL1 10 nH InductorL2 40 nH InductorL3 70 nH Inductor
11/12
SD2932
1020876BControlling Dimension: Inches
M244 (.400 x .860 4/L BAL N/HERM W/FLG) MECHANICAL DATA
mm Inch
MIN. TYP. MAX MIN. TYP. MAX
A 5.59 5.84 0.220 0.230
B 5.08 0.200
C 3.02 3.28 0.119 0.129
D 9.65 9.91 0.380 0.390
E 19.81 20.82 0.780 0.820
F 10.92 11.18 0.430 0.440
G 27.94 1.100
H 33.91 34.16 1.335 1.345
I 0.10 0.15 0.004 0.006
J 1.52 1.78 0.060 0.070
K 2.59 2.84 0.102 0.112
L 4.83 5.84 0.190 0.230
M 10.03 10.34 0.395 0.407
N 21.59 22.10 0.850 0.870
DIM.
SD2932
12/12
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