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1/12 July 2004 SD2932 RF POWER TRANSISTORS HF/VHF/UHF N-CHANNEL MOSFETs REV. 5 GOLD METALLIZATION EXCELLENT THERMAL STABILITY COMMON SOURCE CONFIGURATION, PUSH PULL P OUT = 300 W MIN. WITH 15 dB GAIN @ 175 MHz DESCRIPTION The SD2932 is a gold metallized N-Channel MOS field-effect RF power transistor. The SD2932 it is intended for use in 50 V dc large signal applications up 250 MHz. PIN CONNECTION 1 3 2 1. Drain 2. Gate 3. Source 2 3 1 M244 epoxy sealed ORDER CODES ABSOLUTE MAXIMUM RATINGS (T CASE = 25 ° C) THERMAL DATA Order Codes Marking Package Packaging SD2932 SD2932 M244 Plastic Tray Symbol Parameter Value Unit V (BR)DSS Drain Source Voltage 125 V V DGR Drain-Gate Voltage (R GS = 1M) 125 V V GS Gate-Source Volatge ±20 V I D Drain Current 40 A P DISS Power Dissipation 500 W T j Max. Operating Junction Temperature +200 °C T STG Storage Temperature -65 to +150 °C R th(j-c) Junction -Case Thermal Resistance 0.35 °C/W

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1/12July 2004

SD2932RF POWER TRANSISTORS

HF/VHF/UHF N-CHANNEL MOSFETs

REV. 5

• GOLD METALLIZATION

• EXCELLENT THERMAL STABILITY

• COMMON SOURCE CONFIGURATION, PUSH PULL

• POUT = 300 W MIN. WITH 15 dB GAIN @ 175 MHz

DESCRIPTIONThe SD2932 is a gold metallized N-Channel MOSfield-effect RF power transistor. The SD2932 it isintended for use in 50 V dc large signalapplications up 250 MHz.

PIN CONNECTION1

3

2

1. Drain2. Gate

3. Source

2

3

1

M244epoxy sealed

ORDER CODES

ABSOLUTE MAXIMUM RATINGS (TCASE = 25 °C)

THERMAL DATA

Order Codes Marking Package Packaging

SD2932 SD2932 M244 Plastic Tray

Symbol Parameter Value Unit

V(BR)DSS Drain Source Voltage 125 V

VDGR Drain-Gate Voltage (RGS = 1MΩ) 125 V

VGS Gate-Source Volatge ±20 V

ID Drain Current 40 A

PDISS Power Dissipation 500 W

Tj Max. Operating Junction Temperature +200 °C

TSTG Storage Temperature -65 to +150 °C

Rth(j-c) Junction -Case Thermal Resistance 0.35 °C/W

SD2932

2/12

ELECTRICAL SPECIFICATION (TCASE = 25°C)

STATIC (Per Section)

DYNAMIC

IMPEDANCE DATA

Symbol Test Conditions Min. Typ. Max. Unit

V(BR)DSS VGS = 0 V IDS = 100 mA 125 V

IDSS VGS = 0 V VDS = 50 V 50 µA

IGSS VGS = 20 V VDS = 0 V 250 nA

VGS(Q) VDS = 10 V ID = 250 mA 1.5 4 V

VDS(ON) VGS = 10 V ID = 10 A 3 V

GFS VDS = 10 V ID = 5 A 5 mho

CISS VGS = 0 V VDS = 50 V f = 1 MHz 480 pF

COSS VGS = 0 V VDS = 50 V f = 1 MHz 190 pF

CRSS VGS = 0 V VDS = 50 V f = 1 MHz 18 pF

Symbol Test Conditions Min. Typ. Max. Unit

POUT VDD = 50 V IDQ = 500 mA f = 175 MHz 300 W

GPS VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHz 15 16 dB

ηD VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHz 50 60 %

Load Mismatch

VDD = 50 V IDQ = 500 mA POUT = 300 W f = 175 MHzAll Phase Angles

5:1 VSWR

Typical DrainLoad Impedance

Typical InputImpedance

GZin

ZDL

D

S

FREQ ZIN (Ω) ZDL (Ω)

175 MHz 0.92 - j 0.14 3.17 + j 4.34

Measured Gate to Gate and Drain to Drain, respectively.

3/12

SD2932

0 10 20 30 40 50

VDS, DRAIN-SOURCE VOLTAGE (V)

10

100

1000

10000

C, C

AP

AC

ITA

NC

E (

pF)

Ciss

Coss

Crss

2 2.5 3 3.5 4 4.5 5 5.5 6

VGS, GATE-SOURCE VOLTAGE (V)

0

5

10

15

20

ID, D

RA

IN C

UR

RE

NT

(A

) T=-20 °C

T=+25 °C

T=+80 °C

Vds=10 V

-25 0 25 50 75 100

Tcase, CASE TEMPERATURE (°C)

0.8

0.85

0.9

0.95

1

1.05

1.1

1.15

VG

S, G

AT

E-S

OU

RC

E V

OLT

AG

E (

NO

RM

ALI

ZE

D)

Id=.1 A

Id=.25 A

Id=1 AId=2 A

Id=4 A

Id=7 A

Id=5 AId=9 A

Id=10 A

Id=11 A

TYPICAL PERFORMANCEMaximum Thermal Resistance vs. Case Temperature

25 30 35 40 45 50 55 60 65 70 75 80 85

Tc, CASE TEMPERATURE (°C)

0.34

0.36

0.38

0.4

0.42

Rth

(j-c)

(ºC

/W)

Safe Operating Area

(1) Current in this area may be limited by Rds(on)

Two sides, each section equally loaded

1 10 100 1000

Vds, DRAIN SOURCE VOLTAGE (V)

1

10

100

Ids,

DR

AIN

CU

RR

EN

T (

A)

(1)

Capacitance vs. Drain-Source Voltage Drain Current vs. Gate Voltage

Gate Voltage vs. Case Temperature

SD2932

4/12

TYPICAL PERFORMANCE (175 MHz)Output Power vs. Input Power

0 2 4 6 8 10 12 14 16 18 20 22

Pin, INPUT POWER (W)

0

100

200

300

400

500

600

Pou

t, O

UT

PU

T P

OW

ER

(W

)

Vdd=50VIdq=2 x 250mAF=175Mhz

Vdd=40 V

Vdd=50 V

Output Power vs. Input Power

0 2 4 6 8 10 12 14 16 18 20 22

Pin, INPUT POWER(W)

0

100

200

300

400

500

600

Pou

t, O

UT

PU

T P

OW

ER

(W

)

Vdd=50VIdq=2 x 250mAF=175Mhz

T=-20 °C

T=+25 °C

T=+80 °C

Power Gain vs. Output Power

0 100 200 300 400 500

Pout, OUTPUT POWER (W)

10

11

12

13

14

15

16

17

18

Gp,

PO

WE

R G

AIN

(dB

)

Vdd=50VIdq=2 x 250mAF=175Mhz

Output Power vs. Gate Voltage

Efficiency vs. Output Power

Output Power vs. Supply Voltage

0 100 200 300 400 500

Pout, OUTPUT POWER (W)

10

20

30

40

50

60

70

80

Nc,

EF

FIC

IEN

CY

(%

)

Vdd=50VIdq=2 x 250mAF=175Mhz

24 26 28 30 32 34 36 38 40 42 44 46 48 50

Vdd,DRAIN VOLTAGE (V)

100

150

200

250

300

350

400

450

Pou

t,OU

TP

UT

PO

WE

R (

W)

Pin=3.9 W

Pin=7.8 W

Pin=15.6 W

Idq=2 x 250mAF=175Mhz

-3 -2 -1 0 1 2 3

VGS, GATE_SOURCE VOLTAGE (V)

0

100

200

300

400

Pou

t, O

UT

PU

T P

OW

ER

(W

)

Vdd=50VIdq=2 x 250mAF=175Mhz

T=-20 °C

T=+25 °C

T=+80 °C

5/12

SD2932

175 MHz Test Circuit Schematic (Production Test Circuit)

NOTES:1. DIMENSION AT COMPONENT SYMBOL ARE REFERENCE FOR COMPONENT PLACEMENT.

2. GAP BETWEEN GROUND & TRANSMISSION LINES IS + 0.0020.05 - O.OOO[0.00] TYP

REF. 1022256B

175 MHz Test Circuit Component Part ListR1,R2,R5,R6 470 Ohm 1 W, Surface Mount Chip ResistorR3,R4 360 Ohm 0.5 W, Carbon Comp. Axial Lead Resistor or EquivalentR7,R8 560 Ohm 2 W, Resistor Two Turn Wire Air-Wound Axial Lead ResistorR9,R10 20 K Ohm 3.09 W, 10 Turn Wirewound Precision PotentiometerC1,C4 680 pF ATC 130B Surface Mount Ceramic Chip CapacitorC2,C3,C7,C8,C17,C19,C20,C21 10000 pF ATC 200B Surface Mount Ceramic Chip CapacitorC5 75 pF ATC 100B Surface Mount Ceramic Chip CapacitorC6 ST40 25 pF - 115 pF Miniature variable TrimmerC9,C10 47 pF ATC 100B Surface Mount Ceramic Chip CapacitorC11,C12, C13 43 pF ATC 100B Surface Mount Ceramic Chip CapacitorC14,C15,C24,C25 1200 pF ATC 700B Surface Mount Ceramic Chip CapacitorC16,C18 470 pF ATC 700B Surface Mount Ceramic Chip CapacitorC22,C23 0.1 µF / 500 V Surface Mount Ceramic Chip CapacitorC26,C27 0.01 µF / 500 V Surface Mount Ceramic Chip CapacitorC28 10 µF / 63 Aluminum Eletrolytic Axial Lead Capacitor

B150 Ohm RG316 O.D 0.076[1.93] L = 11.80[299.72] Flexible Coaxial Cable 4 Turns thru Fair-rite Bead

B2 50 Ohm RG-142B O.D 0.165[4.19] L = 11.80[299.72] Flexible Coaxial Cable

T1R.F. Transformer 4:1, 25 Ohm O.D RG316-25 O.D 0.080[2.03] L = 5.90[149.86] Flexible Coaxial Cable 2 Turns thru Fair-rite Multi-Aperture Core

T2R.F. Transformer 1:4, 25 Ohm Semi-rigid Coaxial Cable O.D. 0.141[3.58] L = 5.90[149.86]

L1Inductor λ 1/4 Wave 50 Ohm O.D 0.165[4.19] L = 11.80 [299.72] Flexible Coaxial Cable 2 Turns thru Fair-rite Bead

FB1,FB5 Shield BeadFB2,FB6 Multi-aperture CoreFB3 Multilayer Ferrite Chip Bead (Surface Mount)FB4 Surface Mount Emi Shield Bead

PCBWoven Glass Reinforced PTFE Microwave Laminate 0.06”, 1 oz EDCu, Both sides, εr = 2.55

SD2932

6/12

175 MHz Test Circuit Photomaster

8.50 inches

4 in

ches

175 MHz Test Fixture

7/12

SD2932TYPICAL BROADBAND DATA (175 - 230 MHz)Input Power vs. Frequency

160 170 180 190 200 210 220 230 240

FREQUENCY (MHz)

2

4

6

8

10

12

Pin

, IN

PU

T P

OW

ER

(W

)

Vdd = 50VIdq = 300 mAPout = 250W

Power Gain vs. Frequency

160 170 180 190 200 210 220 230 240

FREQUENCY (MHz)

10

11

12

13

14

15

16

17

18

Gp

, PO

WE

R G

AIN

(dB

)

Vdd = 50VIdq = 300 mAPout = 250W

Efficiency vs. Frequency

160 170 180 190 200 210 220 230 240

FREQUENCY (MHz)

45

50

55

60

65

70

75

80

Nd

, DR

AIN

EF

FIC

IEN

CY

(%

)

Vdd = 50VIdq = 300 mAPout = 250W

Return Loss vs. Frequency

1 dB Compression Point vs. Frequency

160 170 180 190 200 210 220 230 240

FREQUENCY (MHz)

250

275

300

325

350

P1d

B ,

1dB

CO

MP

RE

SS

ION

(W

)

Vdd = 50VIdq = 300 mA

160 170 180 190 200 210 220 230 240

FREQUENCY (MHz)

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

RT

L , R

ET

UR

N L

OS

S (

dB)

Vdd = 50VIdq = 300 mAPout = 250W

SD2932

8/12

175 - 230 MHz Test Circuit Layout (Engineering Fixture)

175 - 230 MHz Circuit Layout Component Part ListPCB 1/32” Woven Fiberglass 0.030 Cu, sides, εr = 4.8T1 50 Ohm Flexible Coax Cable OD 0.06”, 3” Long. Ferrite Core NEOSIDET2,T3 9:1Transformer, 16.5 Ohm Flexible Coax Cable 0.1”, 3” LongT4,T5 4:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.06”, 5” LongC1 8.2 pF Ceramic CapC2,C3 100 pF Ceramic CapC4 2 - 18 pF Chip CapC5 47 pF Ceramic CapC6,C11 47 nF Ceramic CApC7 56 pF ATC Chip CapC8,C9,C13 470 pF ATC Chip CapC10 100 nF Ceramic CapC12 2 x 330 nF / 50 V CapC14 10 nF / 63 V Electrolityc CapR1,R3 47 Ohm ResistorR2 6.8 K Ohm Chip ResistorR4 4.7 K Ohm Multi Turns Trim ResistorR5 8.2 K Ohm / 5 W ResistorR6 3.3 K Ohm / 5 W ResistorD1 6.8 V Zener DiodeL1 20 nH InductorL2 70 nH InductorL3 30 nH InductorL4 10 nH InductorL5 15 nH Inductor

9/12

SD2932TYPICAL BROADBAND DATA (88 -108 MHz)Input Power vs. Frequency

85 90 95 100 105 110

FREQUENCY (MHz)

2.5

3

3.5

4

Pin

, IN

PU

T P

OW

ER

(W

) Vdd = 50VIdq = 200 mAPout = 300W

Power Gain vs. Frequency

85 90 95 100 105 110

FREQUENCY (MHz)

16

17

18

19

20

21

22

Gp

, PO

WE

R G

AIN

(dB

)

Vdd = 50VIdq = 200 mAPout = 300W

Efficiency vs. Frequency

85 90 95 100 105 110

FREQUENCY (MHz)

60

62

64

66

68

70

72

74

76

78

80

Nd

, EF

FIC

IEN

CY

(%

)

Vdd = 50VIdq = 200 mAPout = 300W

3rd Harmonic vs. Frequency (88 - 108 MHz

Return Loss vs. Frequency

2nd Harmonic vs. Frequency (88 - 108 MHz)

85 90 95 100 105 110

FREQUENCY (MHz)

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

RT

L , R

ET

UR

N L

OS

S (

dB)

Vdd = 50VIdq = 200 mAPout = 300W

85 90 95 100 105 110

FREQUENCY (MHz)

-36-34-32-30-28-26-24-22-20-18-16-14-12-10

H3

, 3rd

HA

RM

ON

IC (

dBc)

Vdd = 50VIdq = 200 mAPout = 300W

85 90 95 100 105 110

FREQUENCY (MHz)

-36-34-32-30-28-26-24-22-20-18-16-14-12-10

H2

, 2nd

HA

RM

ON

IC (

dBc)

Vdd = 50VIdq = 200 mAPout = 300W

SD2932

10/12

88 - 108 MHz Test Circuit Layout (Engineering Fixture)

88 - 108 MHz Circuit Layout Component Part ListPCB 1/32” Woven FiberGlass 0.030 Cu, 2 sides, εr = 4.8T1 50 Ohm Flexible Coax Cable OD 0.06”, 5” LongT2,T3 9:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.1”, 3.9”. Ferrite Core NEOSIDET4,T5 4:1 Transformer, 25 Ohm Flexible Coax Cable OD 0.1”, 5” LongT6 50 Ohm Flexible Coax Cable OD 0.1”, 5” LongFB1 vk200C1 10 pF Ceramic CapC2,C3,C4,C7,C8 1 nF Chip CapC5,C6 1 nF ATC Chip CapC9 470 pF ATC Chip CapC10 100 nF Chip CapC11 100 mF / 63 V Electrolityc CapR1 56 Ohm ResistorR2,R4 10 Ohm Chip ResistorR3 10 K Ohm ResistorR5 5.6 Ohm ResistorR6 10 K Ohm, 10 Turn Trim ResistorR7 3.3 K Ohm / 5 W ResistorR8 15 Ohm / 5 W ResistorD1 6.6 V Zener DiodeL1 10 nH InductorL2 40 nH InductorL3 70 nH Inductor

11/12

SD2932

1020876BControlling Dimension: Inches

M244 (.400 x .860 4/L BAL N/HERM W/FLG) MECHANICAL DATA

mm Inch

MIN. TYP. MAX MIN. TYP. MAX

A 5.59 5.84 0.220 0.230

B 5.08 0.200

C 3.02 3.28 0.119 0.129

D 9.65 9.91 0.380 0.390

E 19.81 20.82 0.780 0.820

F 10.92 11.18 0.430 0.440

G 27.94 1.100

H 33.91 34.16 1.335 1.345

I 0.10 0.15 0.004 0.006

J 1.52 1.78 0.060 0.070

K 2.59 2.84 0.102 0.112

L 4.83 5.84 0.190 0.230

M 10.03 10.34 0.395 0.407

N 21.59 22.10 0.850 0.870

DIM.

SD2932

12/12

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