revolution and evolution in contactless rfid markets and ... · revolution and evolution in...
TRANSCRIPT
Revolution and Evolution in Contactless RFID Markets and Technologies
ICMA Card Manufacturing & Personalization Expo 2015
Market drivers for contactless card
Market development of Automated Fair Collection (AFC)
Market development of Finance
MSD
Core technologies leading to contactless cards
IC
Module
Antenna
Bonding
Lamination
OUTLINE
Page 2SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
7 April 2015 Page 3SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Industries that provided the business need for development of contactless technology Access
Kaba developed the proprietary HF Legic platform for a cost effective, secure and state-of-the-art contactless technology in 1993.
Alternative to the proprietary Wiegand, proximity technology
Automated Fare Collection (AFC) Mikron (now NXP) developed the proprietary—but open source
through licensing—HF Mifare Classic 1K platform for a convenient way of fare payment in public transit as an alternative to tokens and mag stripe cards and tickets
SONY developed the proprietary HF FeliCa platform for the Hong Kong Octopus system as a secure, multi-application card for paying fares in public transit, and to make purchases within the Octopus extended merchant network
Market drivers for contactless card
7 April 2015 Page 4SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Hardwired logic memory cards Mifare Classic 1K (NXP), commercially successful and provided the
basis for ISO/IEC 14443 Type A standards Legic (Kaba), proprietary design and first commercially successful
smart card using individual ASIC and single antenna for transmission of power and data
GO CARD (Cubic), first commercially available FRAM based contactless smart card, proprietary design, rolled out in USA
Microprocessor based contactless smart cards AT&T developed the first microprocessor based close coupling
contactless smart card, that was the basis for ISO/IEC 10536 standards, but was not commercially successful due to high manufacturing cost.
FeliCa (SONY), first microprocessor based contactless smart card with single ASIC, proprietary design but commercially successful in Asia
Automated Fair Collection Technologies and Standards
Page 5
AFC Evolution
Coins
Tokens
Mag Stripe Cards
Smart Cards
Mobile Ticketing
Open Payment
BiBo&
NFC Mobile Apps
1940’s 1950’s 1970’s 1990’s 2000’s 2010’s
Tech
nolo
gy
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED 7 April 2015
7 April 2015 Page 6SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Lufthansa Ticketless Travel Program, Germany: launched in 1995, Mifare Classic 1K (NXP), G&D card (hot laminated), first multi-function contactless card that can be used as check-in card as well as a credit card or loyalty card
Seoul Bus, South Korea: launched in 1996, Mifare Classic 1K (NXP), Gemplus cards (cold laminated)
Hong Kong (Octopus card): launched in 1996, FeliCa (SONY), SONY cards (hot laminated)
Goiânia Bus, Brazil: launched in 1997, Mifare Classic 1K (NXP), G&D cards (hot laminated)
Washington Metro SmarTrip, USA: launched in 1997, GO CARD (Cubic), Gemplus cards (cold laminated) but later switched to G&D cards (hot laminated)
Chicago Transit, USA: launched in 2000, GO CARD (Cubic), G&D cards (hot laminated)
SPTrans, Brazil: launched in 2004, Mifare Classic 1K (NXP)
First Projects and Contributors
Page 7
AFC Projects Powered by wire embedded Contactless cards
Public Transport Project Istanbul, Turkey
Cairo Metro, Egypt
Korea T-Money
Sky train Bangkok (BTS), Bangkok Metro (BMC)
Sao Paulo, Brazil(SPTrans)
Santiago de Chile
London Oyster Card
Translink Netherlands Moscow Metro, Russia
St. Petersburg Mass Transport, Russia
LTA EZ Link Card Singapore
Czech Railway Czech Republic
February 2009
RioCard, Rio de Janeiro, Brazil
Clipper Card, San Francisco, USA
RapidKL, Malaysia
Hong Kong Octopus
Auckland HOP Card,New Zealand
Wellington Snapper Card,New Zealand
Washington Metro, USA
Port Authority of NY & NJ, USA
Vancouver, CanadaToronto, Canada
Projects with significant volumes:
7 April 2015
REPUVE, Mexico
MBTA / Boston, USA
LA Metro / Los Angeles, USA
English National Concessionary Travel Card UK
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
7 April 2015 Page 8SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Starting around 2005, a major application of the technology has been contactless payment credit and debit cards. Some major examples include:
• ExpressPay - American Express• PayPass - MasterCard• Zip - Discover• payWave - Visa
Finance MSD cards
RFID STANDARDS
Page 10
RFID Band Bandwidth AverageRange
Standards Applications
Low FrequencyLF
120 – 135 kHz 1 cm Close CouplingISO/IEC 10536ISO/IEC 18000-2
Access Control, Animal Tagging, Car Immobilizers, Waste Managment
High FrequencyHF
13.56 MHz 10 cm ProximityISO/IEC 14443ISO/IEC 18000-3
eID, ePassport, Electronic Payment, Access Control Public Transportation
Ultra High FrequencyUHF
433 MHz > 1 m VicinityISO/IEC 15693ISO/IEC 18000-7
eID, Border Control, EPC, Product Identification
860 - 960 MHz > 1 m ISO/IEC 18000-6 License Plates, Containers, Palettes
2.45 GHz > 1 m ISO/IEC 18000-4 Automated Fare Collection
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
ISO/IEC JTC1 /SC17, Work Group 8:
ISO STANDARD TYPES AT 13.56 MHZ
Page 11
ISO 10536
ISO 14443
Close Coupling
Proximity CouplingType A
Type B
Type C
Type D
Type E
Mifare
Infineon,STM
Sony
Cubic
Inside
ISO 15695 Vicinity Coupling
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Ni/Au, Au and Palladium Bumping
Grinding
Polishing
Conventional Dicing
Dicing Before Grinding
Laser Dicing
IC packaging – module and strap
WAFER PROCESSING AND MODULE PACKAGING
Page 12SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED 7 April 2015
Antenna
Wire-Embedding
Etching
Coil Winding
Printing
Dual Interface Technology
Bonding
Thermo-Compression Bonding
Flip-Chip-Technology
Soldering
ANTENNA AND BONDING TECHNOLOGIES
Page 13SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED 7 April 2015
PALLADIUM BUMPING
Pd bumps
Unique and patented electro-less process on wafer level using palladium to create purpose-built metallic bumps with rough and shaped surface
These kind of bumps in combination with metallic surfaces provides extremely reliable connection,so-called „cold welding connection”
The Pd bump roughness destroys surface and oxide layers (e.g. aluminum) and allows flip chipinterconnections using unfilled adhesives
PROPERTY DIMENSION
Bump height Standard 20 µm (+8 / -5 µm)
Shear strength Typical 150 MPa (Pad size 100µm by 100µm)
Page 14
IC
Substrat
ElektrodenBumpACA
IC
Substrat
ElektrodenBumpNCA
Typical metallic bumps for adhesive flip chip connections – cross section views
PALLADIUM BUMPING
Electro-less Pd bump is well impressed into antenna track; cold welding inter-connection between to trackNCA is used for mechanical
Electro-less Ni-Au bump is partly connected to antenna track by particles contained in ACPACP is used for mechanical
Straight wall pure Au bump is partly connected to antenna track by particles contained in ACPACP is used for mechanical
connection between chip andsubstrate
connection between chip and substrate
connection between chip and substrate
Page 15
CHIP PACKAGING – THE MODULE
Page 17
mould
wire bondGold or Al
lead frameCuSn6
chip
module type manufacturerMOA2, MOA4, MOA8 NXPSMOA2, SMOA4, SMOB6 Smartrac
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
SMOA2
5.15x8.00 mm
370-390 um
SMOA4
5.15x8.00 mm
320-340 um
SMOB6
5.15 x 8.00 mm
240-260 um
CHIP PACKAGING – THE MODULE
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED Page 18
PRINTING
Page 22
UHF Clear Prelam
HF Prelam
US PRC
Manitoba eDL
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
OVERVIEW DUAL INTERFACE TECHNOLOGY
Page 23
BasicTechnologies
InterconnectionTechnology
AntennaTechnology
Direct Connect
DIFPrelamMill & Fill
Conductive Glue, Tape, Paste,
Polymer
EmbeddedWire
Etched Antenna
PrintedAntenna
InductiveCoupling
Thermo Compression
Bond (TC) None Soldering;
TC-Bonding
Embedded Wire & Pad
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Trend of DIF Antenna Technologies
% 2010
Cu-wireCu-etchedAl-etchedAg-printed
Page 24
% 2015
Cu-Wire %
Cu-Etched %
Al-Etched %
Ag-Printed %
Expected Trend
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Trend of DIF Interconnection Technologies
% 2010
conductive media
inductive coupling
direct soldering
DDI
4/7/2015 Page 25
% 2015
Conductive Media %
Inductive Coupling %
Direct Soldering / Bonding %
DIF-Prelam %
Expected Trend
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
Eitan AvniSegment Development Finance, Transport and Access, [email protected]
SMARTRAC TECHNOLOGY Fletcher Inc.267 Cane Creek RoadFletcher, NC 28732
U.S.
smartrac-group.com
MILL & FILL TECHNOLOGY
Page 28
Today most common technology
Medium to high equipment cost
Interconnection by - conductive glue / tape - conductive polymer (liquid or solid)
Main challenges:- process control - consumable cost - ageing interconnection media
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
INDUCTIVE COUPLING TECHNOLOGY
Page 29
Low cost on equipment side
Electrically very reliable
Now also with wire embedded antenna
Now also with:PVC, PC, PET-G, Teslin
mono-block structure
Main challenges:- manufacturing tolerances- supply chain with restrictions - IP challenges
Module (COM8.6)Coil on the module
Coil on antenna inlay
SMARTRAC TECHNOLOGY GROUP – ALL RIGHTS RESERVED
MANUAL & SEMI-AUTO SOLDERING
Page 30
●●● ●● ●
Very reliable interconnection
Low to high investment cost(depending on automation degree)
Current usage limited to certain regions
Main challenges:- high labor cost - human factor / process control
SMARTRAC TECHNOLOGY GROUP