revisions rev. eco. no description date by a 2268 …edge.rit.edu/edge/p17046/public/final...

PbRoHS COMPLIANT

.098 2.50

.025 0.64

A

.100 2.54

B .012[ 0.30]

.100 2.54

HEAD DIM.

TAIL DIM.

A

.100 2.54 .039 1.00

RECOMMENDED PCB LAYOUT

NOTES: 1. INSULATOR MATERIAL: SEE PART NUMBER CODING, UL 94V-0, BLACK. 2. CONTACT MATERIAL: SEE PART NUMBER CODING. 3. CONTACT PLATING: SEE PART NUMBER CODING. 4. CURRENT RATING: 3 AMPS PER CONTACT. 5. INSULATOR RESISTANCE: 5000 MEGOHMS MIN. 6. CONTACT RESISTANCE: 20 MILLIOHMS MAX. 7. DIELECTRIC WITHSTANDING: 1000 VAC. 8. OPERATING TEMPERATURE: SEE PART NUMBER CODING. 9. *PROCESSING TEMP.: SEE PART NUMBER CODING.

*INDICATED TEMPERATURE AND TIME IS FOR COMPONENT INSULATOR. HIGHER PROCESSING TEMPERATURES MAY BE USED, PROVIDED HEAT IS APPLIED FROM BACK SIDE OF PCB, AND INSULATOR DOES NOT EXCEED INDICATED TEMPERATURE AND TIME.

REVISIONS

REV. ECO. NO DESCRIPTION DATE BY

A 2268 INITIAL RELEASE 03/21/2011 LH

B 2422 ADD 'P' PLATING OPTION, OBSOLETE 11139 08/04/2011 LH

D

C

B

AA

B

C

D

12345678

8 7 6 5 4 3 2 1

E

F

E

F

UNLESS OTHERWISE SPECIFIED:DIMENSIONS ARE IN INCHES[MM]

TOLERANCES: ANGULAR: .XX= .012 [.30]

.XXX= .008 [.20].XXXX= .0040 [.100]

INTERPRET DIMENSIONS AND TOLERANCING

PER: ASME Y14.5M-2009

DATE NAMEDRAWN

CDWG. NO. REV

SHEET 1 OF 1SCALE: 5:1

LH

11635 B

THE INFORMATION HEREIN CONTAINSPROPIETARY INFORMATION OF

SULLINS ELECTRONICS AND IS NOTTO BE REPRODUCED, USED OR

DISCLOSED TO OTHERS FOR ANYPURPOSE EXCEPT AS SPECIFICALLY

AUTHORIZED IN WRITING BY ANOFFICER OF SULLINS ELECTRONICS.

HEADER MALE .100" PITCH, STRAIGHT

_ R_C_ _ _S_ _N-RC

FILE NAME: Z:\ECO PENDING\2422, TAIWAN HEADER 100 CC ADD P PLATING\11635, _ R_C_ _ _S_ _N-RC, ST PRINT: 8/26/2011

TITLE

03/21/2011

PART NUMBER

SIZE CAGE CODE

54453

TOP VIEW

SECTION B-BSIDE VIEW

SECTION A-AEND VIEW

INSIDE LID

INSIDE BOX

Natural Finish Enclosure 1590ABlack Textured Enclosure 1590ABK

Natural Finish Enclosure 1590WABlack Textured Enclosure 1590WABK

Stainless Steel Cover Screws (Pkg 100)[6-32 x 1/2" With O-Ring]

1590WMS100

Black Stainless Steel Cover Screws (Pkg 100) 1590WMS100BK

Plated Cover Screws (Pkg 100)[6-32 x 1/2"]

1590MS100

Black Cover Screws (Pkg 100)[6-32 x 1/2"] 1590MS100BK

Standard Cover Screws

ACCESSORIES

NOTEPurchased assembly includes box, lid and 4 cover screws.Box and lid are made from Diecast Aluminum Alloy.Silicone Gasket supplied with liquid resistant enclosure.

Recommended Torque with Gasket : 25-30 cN.m [36-43 ozf.in]Recommended Torque: 50-55 cN.m [71-78 ozf.in]

PART NUMBERS 1590A Enclosure

1590A Liquid Resistant Enclosure (Silicone Gasket)

Liquid Resistant Cover Screws

1590ADimensions:mm[inches] www.hammondmfg.com

®

B B

A

A

85.50[3.366]

31.50[1.240]

82.60[3.252]

28.50[1.122]

1.35[.053]

92.60[3.646] 82.60

[3.252]

28.50[1.122]

38.50[1.516]

31.00[1.220]

33.70[1.327]INSIDE WIDTH

27.40[1.079]INSIDEHEIGHT

27.00[1.063]

6.00[.236]

87.80[3.457]

INSIDE LENGTH 89.10[3.508]

35.00[1.378]

4X 6-32 UNC 10.00 3.90 2.70

76.65[3.018]

22.50[.886]

4.00[.157]

4X

Enclosures can be Factory Modified ( Milling, Drilling, Printing etc.)Contact Factory [email protected] for quotesSolid models of this enclosure available in STEP or IGES.(Part number and text placement/orientation on our products are subject to change,we do not recommend using them as a locating reference for modification purposes)

4.00[.157]

2.00[.079]

2.00[.079]

1.75[.069]

1.60[.063]

Stranded-Core Wire Spool - 25ft - 22AWG - BlackPRODUCT ID: 2976

DescriptionThis wire is flexible, strong, and super easy to solder, too!

Stranded core wire is best used for wiring jigs where theres bending or movement expected. Works well with terminal blocks as well. It's not great for use with breadboards (without tinning)

For prototyping with breadboards, perfboards, and terminal blocks check out our solid-core wires.

Comes with one 25ft spool of black wire. The wire is 22AWG stranded with an outer diameter of 1.6mm.

Technical Details

Length: 25 feet / 7.6mOuter Diameter: 1.6mm / 0.06"

Engineered in NYC Adafruit ®

http://nytm.org/made-in-nyc/

https://www.solid-run.com/

https://www.solid-run.com/

https://www.adafruit.com/

https://cdn-shop.adafruit.com/1200x900/2976-01.jpg

Stranded-Core Wire Spool - 25ft - 22AWG - OrangePRODUCT ID: 2978




orange wire. The wire is 22AWG stranded with an outer diameter of 1.6mm.

Technical DetailsLength: 25 feet / 7.6m

Outer Diameter: 1.6mm / 0.06"


Stranded-Core Wire Spool - 25ft - 22AWG - GreenPRODUCT ID: 2979




ggreen wire. The wire is 22AWG stranded with an outer diameter of 1.6mm.




Stranded-Core Wire Spool - 25ft - 22AWG - VioletPRODUCT ID: 2981




vviolet wire. The wire is 22AWG stranded with an outer diameter of 1.6mm.




Stranded-Core Wire Spool - 25ft - 22AWG - GrayPRODUCT ID: 2996

DescriptionThis wire is super-flexible, soft, strong, and super easy to solder, too!



ggray1.6mm.




Natasha

LN

...

The Arduino Uno is a microcontroller board based on the ATmega328 (datasheet). It has 14 digitalinput/output pins (of which 6 can be used as PWM outputs), 6 analog inputs, a 16 MHz crystal oscillator, aUSB connection, a power jack, an ICSP header, and a reset button. It contains everything needed to supportthe microcontroller; simply connect it to a computer with a USB cable or power it with a AC-to-DC adapter orbattery to get started.

The Uno differs from all preceding boards in that it does not use the FTDI USB-to-serial driver chip. Instead,it features the Atmega8U2 programmed as a USB-to-serial converter.

"Uno" means "One" in Italian and is named to mark the upcoming release of Arduino 1.0. The Uno andversion 1.0 will be the reference versions of Arduino, moving forward. The Uno is the latest in a series ofUSB Arduino boards, and the reference model for the Arduino platform; for a comparison with previousversions, see the index of Arduino boards.

Techinal Specifications

Microcontroller ATmega328Operating Voltage 5VSupply Voltage (recommended) 7-12VMaximum supply voltage (not recommended) 20VDigital I/O Pins 14 (of which 6 provide PWM output)Analog Input Pins 6DC Current per I/O Pin 40 mADC Current for 3.3V Pin 50 mAFlash Memory 32 KB (ATmega328) of which 0.5 KB used by bootloaderSRAM 2 KB (ATmega328)EEPROM 1 KB (ATmega328)Clock Speed 16 MHzIf you want to give a closer look to this board we advice you to visit the official Arduino UNO page in theHardware Section.

1

CLD

-CT1094.0

05

PRODUCT FAMILY DATA SHEET

Cree® 5-mm Blue and Green Round LEDC503B-BCS/BCN/GCS/GCN

WW

W.C

REE.C

OM

/HB

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

FEATURES

• Size (mm): 5

• Color and Typical Dominant Wavelength: Blue (470nm) Green(527nm)

• Luminous Intensity (mcd) C503B-BCS/BCN: (2130-12000) C503B-GCS/GCN: (5860-32900)

• Viewing angle: C503B-BCS/BCN/GCS/GCN: 30 degree

• Lead - Free

• RoHS Compliant

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

www.cree.com/xlamp

Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

APPLICATIONS

• Electronic Signs & Signals

(ESS)

• Motorway Signs

• Variable Message Sign (VMS)

• Advertising signs

• Petrol Signs

• Amusement

PRODUCT DESCRIPTION

Round LEDs offer superior light out-

put for excellent readability in sun-

light and dependable performance.

They provide extremely stable light

output over long periods of time.

These lamps are made with an ad-

vanced optical-grade epoxy offering

superior high-temperature and high-

moisture-resistance performance in

outdoor signal and sign applications.


2


2

Cree 5-mm Round LEDC503B-BCS/BCN/GCS/GCN

ABSOLUTE MAXIMUM RATINGS (TA = 25°C)

Items Symbol Absolute Maximum Rating Unit

Blue/Green

Forward Current IF 30 mA

Peak Forward Current Note1 IFP 100 mA

Reverse Voltage VR 5 V

Power Dissipation PD 120 mW

Operation Temperature Topr -40 ~ +95 °C

Storage Temperature Tstg -40 ~ +100 °C

Lead Soldering Temperature Tsol

Max. 260°C for 3 sec. max. (3 mm from the base of the epoxy bulb)

Note: 1. Pulse width ≤0.1 msec, duty ≤1/10.

TYPICAL ELECTRICAL & OPTICAL CHARACTERISTICS (TA = 25°C)

Characteristics Color Symbol Condition Unit Minimum Typical Maximum

Forward Voltage Blue/Green VF IF = 20 mA V 3.2 4.0

Reverse Current Blue/Green IR VR = 5 V μA 100

Dominant WavelengthBlue λD IF = 20 mA nm 465 470 480

Green λD IF = 20 mA nm 520 527 535

Luminous IntensityBlue C503B-BCS/BCN (30 degree) IV IF = 20 mA mcd 2130 4800

Green C503B-GCS/GCN (30 degree) IV IF = 20 mA mcd 5860 20000

50% Power Angle C503B-BCS/BCN/GCS/GCN 2θ½ IF = 20 mA deg 30


3


3


• Tolerance of measurement of luminous intensity is ±15%

COLOR BIN LIMIT (IF = 20 mA)

• Tolerance of measurement of dominant wavelength is ±1 nm

Blue Green

Blue

Bin Code Min.(nm) Max.(nm)

B4 465 470

B45 467.5 472.5

B5 470 475

B67 472.5 477.5

B6 475 480

Green

Bin Code Min.(nm) Max.(nm)

G7 520 525

G23 522.5 527.5

G8 525 530

G45 527.5 532.5

G9 530 535

C503B-BCS/BCN (30 degree)

Bin Code Min.(mcd) Max.(mcd)

V0 2130 3000

W0 3000 4180

X0 4180 5860

Y0 5860 8200

Z0 8200 12000

C503B-GCS/GCN (30 degree)

Bin Code Min.(mcd) Max.(mcd)

Y0 5860 8200

Z0 8200 12000

A0 12000 16800

B0 16800 23500

C0 23500 32900

INTENSITY BIN LIMIT (IF = 20 mA)


4


4


ORDER CODE TABLE*

Blue (30 degree)

Color Kit Number Viewing Angle

Luminous Intensity (mcd) Dominant Wavelength

Package StandoffMin. Max. Color

Bin Min.(nm)

Color Bin

Max.(nm)

Blue C503B-BCS-CV0Z0461 30 2130 12000 B4 465 B6 480 Bulk Yes

Blue C503B-BCS-CW0X0451 30 3000 5860 B4 465 B5 475 Bulk Yes

Blue C503B-BCS-CX0Y0451 30 4180 8200 B4 465 B5 475 Bulk Yes

Blue C503B-BCS-CV0Z0462 30 2130 12000 B4 465 B6 480 Ammo Yes

Blue C503B-BCS-CW0X0452 30 3000 5860 B4 465 B5 475 Ammo Yes

Blue C503B-BCS-CX0Y0452 30 4180 8200 B4 465 B5 475 Ammo Yes

Blue C503B-BCN-CV0Z0461 30 2130 12000 B4 465 B6 480 Bulk No

Blue C503B-BCN-CW0X0451 30 3000 5860 B4 465 B5 475 Bulk No

Blue C503B-BCN-CX0Y0451 30 4180 8200 B4 465 B5 475 Bulk No

Blue C503B-BCN-CV0Z0462 30 2130 12000 B4 465 B6 480 Ammo No

Blue C503B-BCN-CW0X0452 30 3000 5860 B4 465 B5 475 Ammo No

Blue C503B-BCN-CX0Y0452 30 4180 8200 B4 465 B5 475 Ammo No


5


5


ORDER CODE TABLE*

Green (30 degree)

Color Kit Number Viewing Angle

Luminous Intensity (mcd) Dominant Wavelength

Package StandoffMin. Max. Color

Bin Min.(nm)

Color Bin

Max.(nm)

Green C503B-GCS-CY0C0791 30 5860 32900 G7 520 G9 535 Bulk Yes

Green C503B-GCS-CA0B0781 30 12000 23500 G7 520 G8 530 Bulk Yes

Green C503B-GCS-CA0B0891 30 12000 23500 G8 525 G9 535 Bulk Yes

Green C503B-GCS-CB0C0781 30 16800 32900 G7 520 G8 530 Bulk Yes

Green C503B-GCS-CB0C0891 30 16800 32900 G8 525 G9 535 Bulk Yes

Green C503B-GCS-CY0C0792 30 5860 32900 G7 520 G9 535 Ammo Yes

Green C503B-GCS-CA0B0782 30 12000 23500 G7 520 G8 530 Ammo Yes

Green C503B-GCS-CA0B0892 30 12000 23500 G8 525 G9 535 Ammo Yes

Green C503B-GCS-CB0C0782 30 16800 32900 G7 520 G8 530 Ammo Yes

Green C503B-GCS-CB0C0892 30 16800 32900 G8 525 G9 535 Ammo Yes

Green C503B-GCN-CY0C0791 30 5860 32900 G7 520 G9 535 Bulk No

Green C503B-GCN-CA0B0781 30 12000 23500 G7 520 G8 530 Bulk No

Green C503B-GCN-CA0B0891 30 12000 23500 G8 525 G9 535 Bulk No

Green C503B-GCN-CB0C0781 30 16800 32900 G7 520 G8 530 Bulk No

Green C503B-GCN-CB0C0891 30 16800 32900 G8 525 G9 535 Bulk No

Green C503B-GCN-CY0C0792 30 5860 32900 G7 520 G9 535 Ammo No

Green C503B-GCN-CA0B0782 30 12000 23500 G7 520 G8 530 Ammo No

Green C503B-GCN-CA0B0892 30 12000 23500 G8 525 G9 535 Ammo No

Green C503B-GCN-CB0C0782 30 16800 32900 G7 520 G8 530 Ammo No

Green C503B-GCN-CB0C0892 30 16800 32900 G8 525 G9 535 Ammo No

Notes:1. The above kit numbers represent order codes that include multiple intensity-bin and color-bin codes. Only one

intensity-bin code and one color-bin code will be shipped on each bulk. Single intensity-bin code and single color-bin codes will not be orderable.

2. Please refer to the “Cree LED Lamp Reliability Test Standards” document for reliability test conditions.3. Please refer to the “Cree LED Lamp Soldering & Handling” document for information about how to use this LED

product safely.


6


6


GRAPHS

The above data are collected from statistical figures that do not necessarily correspond to the actualparameters of each single LED. Hence, these data will be changed without further notice.


7


7


MECHANICAL DIMENSIONS

All dimensions are in mm. Tolerance is ±0.25 mm unless otherwise noted.

An epoxy meniscus may extend about 1.5 mm down the leads.

Burr around bottom of epoxy may be 0.5 mm max.

C503B-BCN/GCN: C503B-BCS/GCS:

NOTES

RoHS Compliance

The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or other-wise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006.

Vision Advisory Claim

Users should be cautioned not to stare at the light of this LED product. The bright light can damage the eye.


8


8


KIT NUMBER SYSTEM

All dimensions in mm.Cree LED lamps are tested and sorted into performance bins. A bin is specified by ranges of color, forward voltage, and brightness. Sorted LEDs are packaged for shipping in various convenient options. Please refer to the “Cree LED Lamp Packaging Standard” document for more information about shipping and packaging options.

Cree LEDs are sold by order codes in combinations of bins called kits. Order codes are configured in the following man-ner:


9


9


PACKAGING

Features:

• The LEDs are packed in cardboard boxes after packaging in normal or anti-electrostatic bags.• Cardboard boxes will be used to protect the LEDs from mechanical shock during transportation.• The boxes are not water resistant, and they must be kept away from water and moisture.• The Bulk Pack types of packaging. • Max 500 pcs per bulk and Max 2500 pcs per ammo.

Bulk Pack Packaging Type:

20 bags/carton

Label

COLOR LED LAMP

JOWAXXXXX -XX-XXX

AXXXXXXXXXXX

(anti-electrostatic bag)

Hue

TYPE

QTY

RANK

LOT

Iv

xxx xxx

Vf

( )XX

( )

LXXXXXXXX-XXX

PCS

X

( )XX

R

Ammo Pack Packaging Type:

TYPE

LXXXXXXXX-XXX

PCS

X

QTY

RANK

LOT

Iv

JOWAXXXXX -XX-XXX

XX

AXXXXXXXXXXX

XX

Vf

Hue

( )

( )

( )

xxx xxx

COLOR LED LAMP

ANODE

PCB CONNECTORS

SERIES 801

801-PP-NNN-10-001101 Single row 2.54/5.08 mm, Straight solder tail, Mating pin Ø 0.76 mm

Socket connectors, solder tail

TECHNICAL SPECS.:

Insulator Black glass filled polyester PCT-GF30-FR

Flammability UL 94V-O

Sleeve Brass CuZn36Pb3 (C36000)

Contact Clip (6 finger): Beryllium copper (C17200)

Mating pin Ø 0.70 to 0.90 mm, 0.635 mm square

Insertion force 1.2 N typ.

Withdrawal force 0.6 N typ. (polished steel gauge Ø 0.76 mm)

Mechanical life Min. 500 cycles

Rated current 3 A

Contact resistance Max. 10 m

Dielectric strength Min. 1000 V RMS

ORDERING INFORMATION:

PP Plating code Sleeve Clip

87 Tin Gold flash

83 Tin Gold 0.75 µm

NNN number of poles. Replace NNN with the requested number of poles, e.g. 801-87-NNN-10-143101 for a singlerow version with 8 pins becomes 801-87-008-10-143101

PRECI-DIP SA Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland PHONE +41 (0)32 421 04 00 FAX +41 (0)32 421 04 01 E-MAIL [email protected] www.precidip.com

TECHNICAL ASSISTANCE

GENERAL SPECIFICATIONS:

The values listed below are general specs applying for PRECI-DIP socket and pin connectors. Please see individual catalog pagefor additional and product specific technical data.

Operating temperature range -55 ... +125 °C

Climatic category (IEC) 55/125/21

Operating humidity range annual mean 75 %

Max working voltage 100 VRMS/150 VDC (2.54 mm grid)

PRECI-DIP sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal,Control and Power Applications", File Nr. E174442

MECHANICAL CHARACTERISTICS:

Clip retention Min. 40 N (no displacement under axial force applied)

Contact (sleeve / clip) retention Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2

ELECTRICAL CHARACTERISTICS:

Insulation resistance between any two adjacent contacts Min. 10'000 M at 500 V AC

Capacitance between any two adjacent contacts Max. 1 pF

Air and creepage distances between any two adjacent contacts :

SERIES 3xx/4xx/7xx 80x 83x 85x 86x

mm 0.7 0.85 / 0.7 0.5 0.4 / 0.5 0.5

ENVIRONMENTAL CHARACTERISTICS:

The sockets withstand the following environmental tests without mechanical and electrical defects: - Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h - Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h - Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h - Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min - Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis - Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis During the above two tests no contact interruption >50 ns does appear. - Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7 - Resistance to soldering heat J-STD-0020C, 260°C, 20 s - Moisture sensitivity J-STD-020C level 1 - Resistance to corrosion : 1) Salt spray test IEC 60068-2-11.Ka: 48 h 2) Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH 3) Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH

SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS:

PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5 - Press-in force: 90 N max. (at min. hole dia.) / 65 N typ. - Push-out force: 30 N min. (at max. hole dia.) / 50 N typ. - Push-out 3rd cycle: 20 N min. (at max. hole dia.)


PCB HOLE DIMENSIONS - 2 mm grid: Finished hole Ø: 0.7 + 0.09/-0.06 mm | Drilled hole Ø: 0.8 ± 0.02 mm - 2.54 mm grid: Finished hole Ø: 1 + 0.09/-0.06 mm | Drilled hole Ø: 1.15 ± 0.02 mm PCB HOLE PLATING - PCB surface finish: Hole plating - Tin: 5-15 µm tin over min. 25 µm copper - Copper: min. 25 µm copper - Gold over nickel: 0.05-0.2 µm gold over 2.5-5 µm nickel over min. 25 µm copper


2

1

7

10

9

15

3

6

11

14

1A

1,2EN

2A

3A

3,4EN

4A

1Y

2Y

3Y

4Y

Product

Folder

Sample &Buy

Technical

Documents

Tools &

Software

Support &Community

L293, L293DSLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016

L293x Quadruple Half-H Drivers1 Features 3 Description

The L293 and L293D devices are quadruple high-1• Wide Supply-Voltage Range: 4.5 V to 36 V

current half-H drivers. The L293 is designed to• Separate Input-Logic Supply provide bidirectional drive currents of up to 1 A at• Internal ESD Protection voltages from 4.5 V to 36 V. The L293D is designed

to provide bidirectional drive currents of up to 600-mA• High-Noise-Immunity Inputsat voltages from 4.5 V to 36 V. Both devices are• Output Current 1 A Per Channel (600 mA for designed to drive inductive loads such as relays,L293D) solenoids, DC and bipolar stepping motors, as well as

• Peak Output Current 2 A Per Channel (1.2 A for other high-current/high-voltage loads in positive-L293D) supply applications.

• Output Clamp Diodes for Inductive Transient Each output is a complete totem-pole drive circuit,Suppression (L293D) with a Darlington transistor sink and a pseudo-

Darlington source. Drivers are enabled in pairs, with2 Applications drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4

enabled by 3,4EN.• Stepper Motor DriversThe L293 and L293D are characterized for operation• DC Motor Driversfrom 0°C to 70°C.• Latching Relay Drivers

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)L293NE PDIP (16) 19.80 mm × 6.35 mmL293DNE PDIP (16) 19.80 mm × 6.35 mm

(1) For all available packages, see the orderable addendum atthe end of the data sheet.

Logic Diagram

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

http://www.ti.com/product/l293?qgpn=l293

http://www.ti.com/product/l293d?qgpn=l293d

L293, L293DSLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016 www.ti.com

Table of Contents8.3 Feature Description................................................... 71 Features .................................................................. 18.4 Device Functional Modes.......................................... 82 Applications ........................................................... 1

9 Application and Implementation .......................... 93 Description ............................................................. 19.1 Application Information.............................................. 94 Revision History..................................................... 29.2 Typical Application ................................................... 95 Pin Configuration and Functions ......................... 39.3 System Examples ................................................... 106 Specifications......................................................... 4

10 Power Supply Recommendations ..................... 136.1 Absolute Maximum Ratings ...................................... 411 Layout................................................................... 146.2 ESD Ratings.............................................................. 4

11.1 Layout Guidelines ................................................. 146.3 Recommended Operating Conditions....................... 411.2 Layout Example .................................................... 146.4 Thermal Information .................................................. 4

12 Device and Documentation Support ................. 156.5 Electrical Characteristics........................................... 512.1 Related Links ........................................................ 156.6 Switching Characteristics ......................................... 512.2 Community Resources.......................................... 156.7 Typical Characteristics .............................................. 512.3 Trademarks ........................................................... 157 Parameter Measurement Information .................. 612.4 Electrostatic Discharge Caution............................ 158 Detailed Description .............................................. 712.5 Glossary ................................................................ 158.1 Overview ................................................................... 7

13 Mechanical, Packaging, and Orderable8.2 Functional Block Diagram ......................................... 7Information ........................................................... 15

4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (November 2004) to Revision D Page

• Removed Ordering Information table .................................................................................................................................... 1• Added ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes,

Application and Implementation section, Power Supply Recommendations section, Layout section, Device andDocumentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1

2 Submit Documentation Feedback Copyright © 1986–2016, Texas Instruments Incorporated

Product Folder Links: L293 L293D



http://www.ti.com

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLRS008D&partnum=L293



HEAT SINK AND

GROUNDHEAT SINK AND

GROUND

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1,2EN

1A

1Y

2Y

2A

VCC2

VCC1

4A

4Y

3Y

3A

3,4EN

L293, L293Dwww.ti.com SLRS008D –SEPTEMBER 1986–REVISED JANUARY 2016

5 Pin Configuration and Functions

NE Package16-Pin PDIP

Top View

Pin FunctionsPIN

TYPE DESCRIPTIONNAME NO.1,2EN 1 I Enable driver channels 1 and 2 (active high input)<1:4>A 2, 7, 10, 15 I Driver inputs, noninverting<1:4>Y 3, 6, 11, 14 O Driver outputs3,4EN 9 I Enable driver channels 3 and 4 (active high input)

Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multipleGROUND 4, 5, 12, 13 — solid viasVCC1 16 — 5-V supply for internal logic translationVCC2 8 — Power VCC for drivers 4.5 V to 36 V

Copyright © 1986–2016, Texas Instruments Incorporated Submit Documentation Feedback 3




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6 Specifications

6.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNITSupply voltage, VCC1

(2) 36 VOutput supply voltage, VCC2 36 VInput voltage, VI 7 VOutput voltage, VO –3 VCC2 + 3 VPeak output current, IO (nonrepetitive, t ≤ 5 ms): L293 –2 2 APeak output current, IO (nonrepetitive, t ≤ 100 µs): L293D –1.2 1.2 AContinuous output current, IO: L293 –1 1 AContinuous output current, IO: L293D –600 600 mAMaximum junction temperature, TJ 150 °CStorage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to the network ground terminal.

6.2 ESD RatingsVALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000ElectrostaticV(ESD) Vdischarge Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNITVCC1 4.5 7

Supply voltage VVCC2 VCC1 36VCC1 ≤ 7 V 2.3 VCC1 V

VIH High-level input voltageVCC1 ≥ 7 V 2.3 7 V

VIL Low-level output voltage –0.3 (1) 1.5 VTA Operating free-air temperature 0 70 °C

(1) The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltagelevels.

6.4 Thermal InformationL293, L293D

THERMAL METRIC (1) NE (PDIP) UNIT16 PINS

RθJA Junction-to-ambient thermal resistance (2) 36.4 °C/WRθJC(top) Junction-to-case (top) thermal resistance 22.5 °C/WRθJB Junction-to-board thermal resistance 16.5 °C/WψJT Junction-to-top characterization parameter 7.1 °C/WψJB Junction-to-board characterization parameter 16.3 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics applicationreport, SPRA953.

(2) The package thermal impedance is calculated in accordance with JESD 51-7.





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5

3

1

0

2

−50 0 50

4

100

TA − Ambient Temperature − °C

With Infinite Heat Sink

Free Air

Heat Sink With θJA = 25°C/W

150

PT

OT

−P

ow

er

Dis

sip

ati

on

−W


6.5 Electrical Characteristicsover operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

L293: IOH = −1 AVOH High-level output voltage VCC2 – 1.8 VCC2 – 1.4 V

L293D: IOH = − 0.6 A

L293: IOL = 1 AVOL Low-level output voltage 1.2 1.8 V

L293D: IOL = 0.6 A

VOKH High-level output clamp voltage L293D: IOK = –0.6 A VCC2 + 1.3 V

VOKL Low-level output clamp voltage L293D: IOK = 0.6 A 1.3 V

A 0.2 100IIH High-level input current VI = 7 V µA

EN 0.2 10

A –3 –10IIL Low-level input current VI = 0 µA

EN –2 –100

All outputs at high level 13 22

All outputs at low level 35 60ICC1 Logic supply current IO = 0 mAAll outputs at high 8 24impedance

All outputs at high level 14 24

All outputs at low level 2 6ICC2 Output supply current IO = 0 mAAll outputs at high 2 4impedance

6.6 Switching Characteristicsover operating free-air temperature range (unless otherwise noted) VCC1 = 5 V, VCC2 = 24 V, TA = 25°C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

L293NE, L293DNE 800Propagation delay time, low-to-tPLH nshigh-level output from A input L293DWP, L293N L293DN 750

L293NE, L293DNE 400Propagation delay time, high-to-tPHL nslow-level output from A input L293DWP, L293N L293DN 200CL = 30 pF,See Figure 2L293NE, L293DNE 300Transition time, low-to-high-leveltTLH nsoutput L293DWP, L293N L293DN 100

L293NE, L293DNE 300Transition time, high-to-low-leveltTHL nsoutput L293DWP, L293N L293DN 350

6.7 Typical Characteristics

Figure 1. Maximum Power Dissipation vs Ambient Temperature





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Output

CL = 30 pF

(see Note A)

VCC1

Input

3 V

TEST CIRCUIT

t tf r

3 V

0

tPHL

VOH

tTHL tTLH

VOLTAGE WAVEFORMS

tPLH

Output

Input

VOL

tw

NOTES: A. CL includes probe and jig capacitance.

B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω.

Pulse

Generator

(see Note B)

5 V 24 V

VCC2

A

EN

Y90% 90%

50%

10%

50%

10%

90% 90%

50%

10%

50%

10%


7 Parameter Measurement Information

Figure 2. Test Circuit and Voltage Waveforms





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1

0

3

4

5

6

7

89

10

11

12

13

14

15

161

21

0

1

1

0

2

4

3

M

M

M

1

0

1

0

1

0

VCC2

VCC1


8 Detailed Description

8.1 OverviewThe L293 and L293D are quadruple high-current half-H drivers. These devices are designed to drive a wide arrayof inductive loads such as relays, solenoids, DC and bipolar stepping motors, as well as other high-current andhigh-voltage loads. All inputs are TTL compatible and tolerant up to 7 V.

Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlingtonsource. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and inphase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and inthe high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversibledrive suitable for solenoid or motor applications.

On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. Onthe L293D, these diodes are integrated to reduce system complexity and overall system size. A VCC1 terminal,separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293 and L293Dare characterized for operation from 0°C to 70°C.

8.2 Functional Block Diagram

Output diodes are internal in L293D.

8.3 Feature DescriptionThe L293x has TTL-compatible inputs and high voltage outputs for inductive load driving. Current outputs can getup to 2 A using the L293.





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VCC2

Output

GND

VCC2

Output

GND

Input

VCC1

Current

Source

GND


8.4 Device Functional ModesTable 1 lists the fuctional modes of the L293x.

Table 1. Function Table (Each Driver) (1)

INPUTS (2)OUTPUT (Y)

A ENH H HL H LX L Z

(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off)(2) In the thermal shutdown mode, the output is in the high-impedance

state, regardless of the input levels.

Figure 3. Schematic of Inputs for the L293x

Figure 4. Schematic of Outputs for the L293 Figure 5. Schematic of Outputs for the L293D





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24 V5 V

10 kΩ

VCC1

VCC2

Control A

Control B

4, 5, 12, 13

GND

Thermal

Shutdown

Motor

16 8

3

6

11

14

4Y

3Y

2Y

1Y

1,2EN

1A

2A

3,4EN

3A

4A

15

10

9

7

2

1


9 Application and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

9.1 Application InformationA typical application for the L293 device is driving a two-phase motor. Below is an example schematic displayinghow to properly connect a two-phase motor to the L293 device.

Provide a 5-V supply to VCC1 and valid logic input levels to data and enable inputs. VCC2 must be connected to apower supply capable of supplying the needed current and voltage demand for the loads connected to theoutputs.

9.2 Typical Application

Figure 6. Two-Phase Motor Driver (L293)

9.2.1 Design RequirementsThe design techniques in the application above as well as the applications below should fall within the followingdesign requirements.

1. VCC1 should fall within the limits described in the Recommended Operating Conditions.2. VCC2 should fall within the limits described in the Recommended Operating Conditions.3. The current per channel should not exceed 1 A for the L293 (600mA for the L293D).

9.2.2 Detailed Design ProcedureWhen designing with the L293 or L293D, careful consideration should be made to ensure the device does notexceed the operating temperature of the device. Proper heatsinking will allow for operation over a larger range ofcurrent per channel. Refer to the Power Supply Recommendations as well as the Layout Example.





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24 V5 V

10 kΩ

VCC1 VCC2

16 8

1,2EN

1

1A

2

2A

7

3,4EN

9

3A

10

4A

15

Control A

Control B

4, 5, 12, 13

GND

ThermalShutdown

Motor

1Y

3

2Y

6

3Y

11

4Y

14

3

1

0

2

0 10 20

P

4

30

TO

T−

Po

wer

Dis

sip

ati

on

−W

60

20

0

40

80

θJA

−T

herm

al R

esis

tan

ce

−°C

/W

40

Side − mm

θJA

PTOT (TA = 70°C)

50


Typical Application (continued)9.2.3 Application CurveRefer to Power Supply Recommendations for additional information with regards to appropriate powerdissipation. Figure 7 describes thermal dissipation based on Figure 14.

Figure 7. Maximum Power and Junction vs Thermal Resistance

9.3 System Examples

9.3.1 L293D as a Two-Phase Motor DriverFigure 8 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to theRecommended Operating Conditions when considering the appropriate input high and input low voltage levels toenable each channel of the device.

Figure 8. Two-Phase Motor Driver (L293D)





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2 × SES5001

1/2 L293

4, 5, 12, 13

367

8

1

2

16

VCC2

2 × SES5001

2A 1A

VCC1

EN

M

GND

VCC2SES5001

1/2 L293

4, 5, 12, 13

10

SES5001

VCC1

EN

1511 14

16

9

M2

M1

3A 4A

8

GND


System Examples (continued)9.3.2 DC Motor ControlsFigure 9 and Figure 10 below depict a typical setup for using the L293 device as a controller for DC motors. Notethat the L293 device can be used as a simple driver for a motor to turn on and off in one direction, and can alsobe used to drive a motor in both directions. Refer to the function tables below to understand unidirectional vsbidirectional motor control. Refer to the Recommended Operating Conditions when considering the appropriateinput high and input low voltage levels to enable each channel of the device.

Connections to ground and to supply voltage

Figure 9. DC Motor Controls

Table 2. Unidirectional DC Motor ControlEN 3A M1 (1) 4A M2H H Fast motor stop H RunH L run L Fast motor stopL X Free-running motor stop X Free-running motor stop

(1) L = low, H = high, X = don’t care

Figure 10. Bidirectional DC Motor Control

Table 3. Bidrectional DC Motor ControlEN 1A 2A FUNCTION (1)

H L H Turn rightH H L Turn left

(1) L = low, H = high, X = don’t care





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3

4

5

6

7

8

1

2

9

10

11

12

13

14

15

16

+

+

+

+

D7

D8 D4

D3

L2 IL2

C1

D5 D1

D6 D2

VCC1L293

IL1/IL2 = 300 mA

0.22 µF

VCC2L1 IL1

D1−D8 = SES5001


Table 3. Bidrectional DC Motor Control (continued)EN 1A 2A FUNCTION (1)

H L L Fast motor stopH H H Fast motor stopL X X Free-running motor stop

9.3.3 Bipolar Stepping-Motor ControlFigure 11 below depicts a typical setup for using the L293D as a two-phase motor driver. Refer to theRecommended Operating Conditions when considering the appropriate input high and input low voltage levels toenable each channel of the device.

Figure 11. Bipolar Stepping-Motor Control





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11.9 mm

17.0 mm

38.0 mm


10 Power Supply RecommendationsVCC1 is 5 V ± 0.5 V and VCC2 can be same supply as VCC1 or a higher voltage supply with peak voltage up to 36V. Bypass capacitors of 0.1 uF or greater should be used at VCC1 and VCC2 pins. There are no power up orpower down supply sequence order requirements.

Properly heatsinking the L293 when driving high-current is critical to design. The Rthj-amp of the L293 can bereduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heatsink.

Figure 14 shows the maximum package power PTOT and the θJA as a function of the side of two equal squarecopper areas having a thickness of 35 μm (see Figure 14). In addition, an external heat sink can be used (seeFigure 12).

During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.

Figure 12. External Heat Sink Mounting Example (θJA = 25°C/W)





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Copper Area 35-µm Thickness

Printed Circuit Board

5V

TTL Logic

1 Ampere

TTL Logic

1 Ampere

GND

VIAS

TTL Logic

5V to 36V

1 Ampere

TTL Logic

1 Ampere

TTL Logic

TTL Logic

14

13

15

1

2

3

4

16

GND

0.1 μF

1,2EN

1A

1Y

VCC1

4A

4Y

10

9

11

12

7

8

6

5

2Y

2A

VCC2

3Y

3A

3,4EN

GND

1μF


11 Layout

11.1 Layout GuidelinesPlace the device near the load to keep output traces short to reduce EMI. Use solid vias to transfer heat fromground pins to ground plane of the printed-circuit-board.

11.2 Layout Example

Figure 13. Layout Diagram

Figure 14. Example of Printed-Circuit-Board Copper Area (Used as Heat Sink)





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12 Device and Documentation Support

12.1 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to sample or buy.

Table 4. Related LinksTECHNICAL TOOLS & SUPPORT &PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

L293 Click here Click here Click here Click here Click hereL293D Click here Click here Click here Click here Click here

12.2 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by the respectivecontributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaborationamong engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and helpsolve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

12.3 TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge CautionThese devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

12.5 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.





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PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

L293DNE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE

L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE

L293DWP OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70 L293DWP

L293DWPG4 OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70

L293DWPTR OBSOLETESO PowerPAD DWP 28 TBD Call TI Call TI 0 to 70

L293N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 L293N

L293NE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293NE

L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293NE

L293NG4 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

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(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.

Ratings

Part NumberCurrent Rating

(A)Housing

Material ColorTyp. Voltage Drop

(mV) Cold Resistance

(mΩ)I2t

(A²s)

0997002_ 2 171 55.60 2.8

0997003_ 3 153 33.75 9.4

0997004_ 4 121 23.48 17

0997005_ 5 129 17.75 25

099707.5_ 7.5 135 10.85 68

0997010_ 10 108 7.42 93

0997015_ 15 98 4.58 270

0997020_ 20 96 3.21 380

0997025_ 25 86 2.36 625

0997030_ 30 87 1.85 1130

ATOF® Blade Fuses Rated 32VDeveloped by Littelfuse for the automotive industry, the ATOF® fuse has become the original equipment circuit protection standard for foreign and domestic automobiles and trucks. Readily identifiable and easily replaced, this fuse can be specified for a variety of low voltage electronic applications.

Blade Fuses

ATO® Ag (Silver plated) Blade Fuses

ATOF® Blade Fuses

Ordering InformationPart Number Package Size

0287xxx.PXCN 2000

0287xxx.U 500

0287xxx.H 100

0287xxx.L 50

ATO® Ag Fuse

0287xxx.PXS 2000

Dimensions Dimensions in mm

Temperature Rerating Curve

Time-Current Characteristic Curves

Specification ATOF® ATO Ag (Tin Plated) (Silver Plated)Voltage Rating: 32 VDC 32 VDCInterrupting Rating: 1000A @ 32 VDC 1000A @ 32 VDC*Component Level Temperature Range: -40˚C to +105˚C -40˚C to +125˚C**System Level Temperature Range: -40˚C to +85˚C -40˚C to +105˚C 105°C and 85°C are typical system level temperature requirements.Terminals: Sn plated zinc alloy Ag plated zinc alloy Housing Material: PA66 PA66Complies with: SAE J1284,ISO 8820-3 SAE J1284,ISO 8820-3UL Listed: File AU1410 File AU1410CSA Certified: File No. 29862 File No. 29862

Ratings

Part NumberCurrent Rating

(A)Housing

Material ColorTyp. Voltage Drop

(mV)Cold Resistance

(mΩ)I2t

(A2s)0287001._ 1 176 123 0.4

0287002._ 2 141 53.5 1.4

0287003._ 3 137 31.1 7.4

0287004._ 4 136 22.8 14

0287005._ 5 128 17.85 26

028707.5_ 7.5 116 10.91 60

0287010._ 10 109 7.70 115

0287015._ 15 102 4.80 340

0287020._ 20 98 3.38 520

0287025._ 25 92 2.52 1080

0287030._ 30 84 1.97 1510

0287035._ 35 87 1.61 2280

0287040._ 40 96 1.44 3310

Time-Current Characteristics

% of RatingCurrent Rating

Opening Time Min / Max (s)

100 35A & 40A 360,000 s / –

110 1A-30A 360,000 s / –

1351A & 2A3A-40A

350 ms / 600 s0.750 s / 600 s

160 1A-40A 250 ms / 50 s

2001A & 2A3A-40A

100 ms / 5.0 s0.150 s / 5.0 s

3501A & 2A3A-40A

20 ms / 500 ms80 ms / 500 ms

6001A-30A

35A & 40A – / 100 ms – / 150 ms

*Component Level Temperature = the maximum ambient temperature that a single fuse will survive. This does not factor-in the heat from a populated fuse box, but does include the heat from the current load with the proper rerating. **System Level Temperature represents the ambient temperature of the fuse box at a location within the vehicle. The temperature within a populated fuse box (in a given location) will be higher. The limiting factor is the plating. Sn-plating’s temperature limit is ≈130°C, and Ag-plating allows up to 150°C at the terminal interface.