• Review of synthesis of super heavy elements: reactions, decays and characterization.

• Experimental Setup of MASHA.• Results of first experiments. study of

evaporation residua in the reactions 40Ar+natSm and 40Ar+166Er.

• Our time with MASHA.• Future development.

249Cf(48Ca,xn)297-x118

245,248Cm(48Ca,xn)293,296-x116 243Am(48Ca,xn)291-x115242,244Pu(48Ca,xn)290,292-x114 237Np(48Ca,xn)285-x113238U(48Ca,xn)286-x112

Number of observed decay chains Element 118 3 Element 117 6 Element 116 26 Element 115 4 Element 114 43 Element 113 2 Element 112 8

249249Bk + Bk + 4848CaCa

•Beam dose: 2.4x10Beam dose: 2.4x101919

•4848Ca energy: 252 MeVCa energy: 252 MeV

•Target thichness: 0.31 Target thichness: 0.31 mg/cmmg/cm22

•Beam current of 1-2µABeam current of 1-2µA

Beam (48Ca; 233-239 MeV)

Beam stop

SiO2-FilterTa metal850°C

Quartz column

Cryo On-line Detector (4Cryo On-line Detector (4 COLD)COLD)

Carrier gas He/Ar (70/30)

Teflon capillary

(32 pairs PIN diodes, one side gold covered)

PbPb Loop

Temperature gradient: 35°C to – 184 °C

T/C

RnRn111122Quartz

inlay

l

Window/Target (242Pu: 1.4 mg/cm2)

Recoil chamber

4 s

• 242Pu(48Ca;3n)287114 (0.5 s) → 4s 283112• Reasons

a) High cross section of 4 pb ( 3-times higher than via direct production with 238U as a target)

• b) Residence time in collection chamber and transport capillary 2 s

283112

9.54 MeV

4 s

4 s

Ds 279

0.2 s

2871140.5 s

1

D1 Q1 Q2D2

Q3S1

D3aD3b

S2

23 4

Пучок ионов

1 – Target block with hot catcher;2 – Ion source;3 – Mass separator;4 – DAQ in the focal plane.

Material of the catcher – flexible graphiteOperating temperature of hot catcher – 1800-2000оС Delivery time of nuclides to the ECR ion source ~ 2 s

ECR ion source

Hot catcher Target Beam line

Recoil transport

Heavy ionbeam

Target

Hot catcher(graphite)

1TO

12, 114 ECR

Heater

Separating foil

Focal plane silicon multi strip detector

•Configuration – well type•Number of the focal strips – 192 (step – 1.25 mm)•Number of the back side strips – 160 (step – 5 mm)•352 Channels

Temperature Control

Vacuum Control

Ion-source Control

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190

4,6

4,8

5,0

5,2

5,4

5,6

5,8

6,0

6,2

6,4

6,6

6,8

186Hg (1.4m)

185Hg (21s, 49s)

184Hg (30.6s)

180Hg (2.56s)181Hg (3.6s)

182Hg (10.8s)183Hg (8.8s)

40Ar+Sm, Ebeam

= 240 MeV

Strip

En

erg

y [ M

eV

]

2,000

6,000

10,00

14,00

18,00

22,00

26,00

30,00

34,00

38,00

42,00

46,00

50,00

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 1905,2

5,4

5,6

5,8

6,0

6,2

6,4

6,6

6,8

7,0

7,2

7,4

7,6

206Rn (5.67m)

205Rn (2.83m)

204Rn (1.24m)

203Rn (28s, 45s)

202Rn (9.85s)

201Rn (3.8s, 7s)

200Rn (1.06s)

40Ar+166Er, Ebeam

= 198 MeV, Tcatcher

=1600 oC

Strip number

Ene

rgy

of a

lpph

a de

cay

[ MeV

]

2,000

27,00

52,00

77,00

102,0

127,0

152,0

177,0

counts

40Ar5+, Beam Current = 1-2 uA , Ebeam = 5-6MeV/nucleon

40Ar+natSm -> Hg, Ebeam = 5-7 MeV/n40Ar+166Er -> Rn, Ebeam = 5-7 MeV/n

1

D1 Q1 Q2D2

Q3S1

D3aD3b

S2

23 4

Пучок ионов

• Short extraction times. Extraction times of 10ms or less would be ideal.

• A larger scope of reactions could be studied with a shorter half-life

• Applicability to all fragment beams.

• Faster Data transfer, 100 MB/s

• Less physical modules needed• Digital Control Environment• Synchronisation with MESHA

control system• Better Energy and Time

resolution• MESHA detector, 352

channels

• The device can operate as a multi-radiation camera

• Portable tracking detector• Frame-rate up to 5 fps • Room temperature & noiseless operation• Vacuum operation, no cooling• Plug&Play with any PC• Event by event measurement• Single particle tracking mode spectroscopy• Trigger and coincidence

• Selectivity & Sensitivity: enhanced in TimePix (ToT mode) Heavy charged particles (p,,t,

ions) Neutrons (equipped with

converter)

Soft X-rays MIPS (electrons, muons, , …)

Hybrid Semiconductor pixel detector

Semiconductor single photon pixel hybrid Semiconductor single photon pixel hybrid detector MEDIPIXdetector MEDIPIX

Detector chip

Medipix-2 chipBump-bonding

• Planar (300, 700, 1000 m thick) silicon pixel detector (also GaAs, CdTe, or n converter)

• Bump-bonded to Medipix readout chip containing amplifier, discriminator and counter for each pixel.