RESCOLL

Leading to competitiveness trough innovation in materials and processes

About RESCOLL

RescollA group of service companies performing R&D, manufacturing, analysis and characterisationto support the industry with competitive innovation

MARKET SEGMENTS

25% 10%

55% 10%

HEALTH

AEROSPACE ENERGY

OTHERS

Define specifications & suggest partners

Develop your product in laboratory

Validate materials, processes and products

Pilot & Manufacture

Quality control

3 TRL 9

Wich is our global offer?

RESCOLL GROUP

ADVANCEDCOATINGS AND GLUES

INNOVATIVE MACHINED PRODUCTS

Machining

Innovative formulations (high TRL)

Diversification in the medical field

TRL 3 TRL 6 TRL 9

MAINTENANCE AND ELECTRONICS

ONGOING MERGER

Increase the range of

characterizations

Industrialization internal R&D

RESCOLL IN FIGURES

7000m²

15 M€ 150

INVESTMENT / YEAR

TURNOVER ENGINEERS & TECHNICIANS

FACILITIES

1.5 M€

>15%

ANNUAL GROWTH

FOR THE LAST 3 YEARS

CAPACITIES

Synthesis lab

Extrusion, compounding, formulation

Composites prototypes manufacturing

Machining

Coatings & adhesives

Thermo-mechanical Analysis

Chromatography & TOC

Spectrometry

Components robustness

VibrationFire testing

Mechanical characterisation of coatings

Mechanical testing

CAPACITIES

Regulatory issues

LCA, Eco-design, ETV

CAPACITIES

CONFIDENTIAL 10

And CERTIFIED: ISO 9001 (all activities) ISO 17025 (for Analysis and Characterisation) ISO 13485 NADCAP ISO 17020 (for Environmental Technology Verification ETV)

QUALIFIED by:

QUALITY MANAGEMENT SYSTEM

Bonding Technologies Surfaces

Adhesives

FUNCTIONS

Process

Aging

Testing, and validation and qualification

Training

BONDING – CHALLENGING INNOVATIONS

Increasing use of joining of dissimilar materials in new industrial developments:

• Lightness• Better load distribution (compared to other joining techniques)• Less impact on substrates (curing temp, no drilling)• Good sealing

Bonding is a key solution identified in technological roadmaps of major aircraft manufacturers, since bonding means

But several challenges exist• E&T conduction• Debonding on Demand• Limited temperature resistance (polymeric materials)• NDT• Vibroacoustic damping• Surface treatments• Durability and roboustness

Anticorrosion

Bio-active

SURFACE Technologies -

COMPETENCES MAIN EQUIPMENT

Synthesis labFormulation and application labs20L double-walled thermostated reactorClean roomAutoclave reactorSchlenk linePlanetary mixerCoating characterization equipment(surface profilometry, nanoscratch, nanoindenter, hazemeter, surface thermodynamics, fire behavior, aging…)

Adhesion

RESEARCH AREAS

Protection

Deposition techniquesSurface pre-treatment (sanding, degreasing, plasma, laser …)Coating (spin-coating, dip coating, spraying)Polymerisation kinetics(temperature, IR, UV)

Surface functionalizationSurface treatmentVarnish and paint formulationSol-gel synthesisPrimers

Catalysis

Anti-fingerprint

Sustainable chemistry

Optics

Mechanics

Anti-scratch

Our core expertise

Top CoatChromated Primer

OAC

Hand operatingspraying

Electrostaticspraying

SURFACES TechnologiesCorrosion Protection coating

Why:- Be compliant with REACH and replace Chromium Cr(VI) based treatment- Ensure a corrosion protection of Aluminium/CFRP assemblies- Act as primer

Durability

Processes

ADHESIVES TEAM

COMPETENCES MAIN EQUIPMENTBonding and surface preparation labsTable-top surface treatment stations (chemical) and plasma activation systemsPlanetary mixers (2x250g and 2x830g capacity)Dissolvers equiped with vaccuum chamber3-roll millBonding jigsDosing and adhesives dispensing systemsCuring ovensUV Fusion benchDynamometers (static and fatigue, 100N to 250kN)METRAVIB DMA+150Climatic chambersUltrasonic NDT

Adhesion

RESEARCH AREAS

Biobasedmaterials

Benchmarking & Processdevelopment

Benchmark and selection of best bonding solutions

Production of bonded assemblies (test coupons and products)

Development & qualification of bondingsystems and processes

Formulation

Established expertise in debonding on demand

Development of customizedformulations (conductive, fireresistant, REACh compliant, biosourced)

Structural adhesives NDT

Debonding on demand Smart adhesives Structural Health

Monitoring

REFERENCES IN THE AUTOMOTIVE SECTORMICHELIN, VALEO, COOPER AUTOMOTIVE, PLASTIC OMNIUM AUTO EXT, FIAT AUTO

ADHESIVE TechnologiesConductive structural adhesives

Why? The increasing use of functionalised composites: ESDLightning protection, Heat dissipation

Rescoll developed structural adhesives ensuring the same functionality as those of the materials they have to assemble, i.e. electrical or thermal conductivity.

Industrial structural adhesives with disassembling function

3 Temperature ranges

Compliant with several adhesivenatures

INDAR (INnovative Dismantling Adhesives Research)

More details: JEC COMPOSITES MAGAZINE – ISSUE #46 –January-February 2009

Industrial structural adhesives with disassembling function

INDAR (INnovative Dismantling Adhesives Research)Development of a structural debondable adhesive for ground testing of GAIA SiC structuree

Thermal activation of the bonded

system

Training -Transfert Process qualification and ground testing

Industrial structural adhesives with disassembling function

Development of a structural debondable adhesive for: • LEAP (Leading Edge Aviation Propulsion) and • Open Rotor projects

Industrial structural adhesives with disassembling function

Debondable structural Assembly of Ti/Composite

BONDING – Electrical and/or Thermal conductivity

Adhesives : insulative materials

Formulation mandatory to get electrical or thermal conductivity

Numerous products available on the market but they are :• Expensive (costs of fillers)• Dense (fillers)• Not suitable for use in structural applications

There is a need for new cheap adhesives, with lower density and bettermechanical strength

THERMAL CONDUCTIVITY

BONDING – Electrical and/or Thermal conductivity

BONDING – KEY PROJECTS

E&T CONDUCTIVITY

24

BONDING – KEY PROJECTS

E&T CONDUCTIVITY - Requirements

2 adhesive formulations validated by end usersand now part of STRUCTIL’s port-folio

Electrical ConductivityS/cm

Thermal ConductivityW/mK

Lap Shear StrengthMPa

Specs for Thermal Adhesive 1.10E-5 to 1.10E-3 >4 >9

Base Material (unmodified adhesive) 1E-15 0.2 24

Thermal Adhesive 6 4.4 10

Electrical ConductivityS/cm

Thermal ConductivityW/mK

Lap Shear StrengthMPa

Specs for Structural Adhesive

>100 >0.8 > 15

Base Material (unmodified adhesive)

1E-15 0.2 24

Structural Adhesive 300 1 19

BONDING – LARGE SERVICE TEMPERATURE

Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp

Adhesives are polymers: limited high temperature resistanceGenerally , the higher the curing temperature the higher the thermal resistance (Tg)

However:• Several components of top class epoxy formulations may not be REACH compliant

in the near future• Many applications allow limited temp curing (<80°C), especially in ASD but wide

service temperature range (eg: -90 to +150°C)

Need for better understanding of the interaction between curingconditions, adhesive composition and final thermomechanicalproperties

New adhesive formulations based on up-to-date components (resins, hardeners, tougheners, etc.)

BONDING – KEY PROJECTS

Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp

Study on « Tougheners » :Core-Shell RubberBlock Copolymers (CTBN and others) Nanosilica

Relationship between network chemical structure and thermomechanical properties of the epoxy adhesives:

-Curing conditions: 23°C / Température impact on thermomechanical properties

-Components Resins : DGEBA, novolacs, … Hardeners : polyamidoamines, polyetheramines, …

0

5

10

15

20

25

-90°C 25°C 90°C

LSS

(in M

Pa)

Testing Temperature

LSS after 7 days @ 23°C

Non modifiéRenforcé

15

20

25

30

35

1,00 2,00 3,00 4,00

LSS

(in M

Pa)

Crosslinking Density (mol/kg)

Lap Shear Strength after 1h @ 150°C

BONDING – KEY PROJECTS

Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp

Example of Results

-Curing conditions: 23°C / Température (<80°C)

-Gel Time >60min @ Room Temp

- Typical peel resistance >50N/cm @ Room Temp

-LSS > 10MPa between -70 and +150°C (on chemically etched 2024 Al)

0

5

10

15

20

25

30

35

-100 -50 0 50 100 150 200

LSS

(in M

Pa)

Temperature (in °C)

Curing: 1h @ 80°C

Energy - H2 Storage & Oil Transport

Other Applications - Small Aircraft Transport

BONDING – Novel Quantitative NDT

Laser Shock NDTGeneration of localized traction loads• Quantitative NDT• Detection of kissing bonds

Time

COMPOSITE COMPOSITEJOINT

Shock

Traction

LASER

ShockWave

Free Surface

• Strong interface No damage• Weak interface Interface failure

Experiments

1. Identification of debondinglevels

2. Characterization of the assemblyresponse

SIMULATIONS

1. Validation of models

2. Complete understandingand control of phenomena

OPTIMISATION

1. Definition of optimum shock configurations per assembly

2. Definition of laser parameters

CONCLUSIONS

BONDING: a key technology for joining of dissimilar materials

But new assemblies need to optimize synergies of materials benefits (strength, lightness, conductivity, fatigue resistance, etc.), adhesives needs to be multifunctionnal

Stronger regulation pressure on materials manufacturers, especially adhesive formulators. Riskof obsolescence of old high performance formulas in the near future

More regulatory pressure on goods manufacturers regarding end of life• Needs for recycling, especially new and widespread dissimilar assemblies• Easier recovery/maintenance of parts is targeted to extend product life span

Debonding on command gives an open choice to engineers and designers for materialsassembling: adhesive may be considered for applications where lack of reversibility is a No-Go

In a few words, future multifunctionnal structural adhesives will bringmore service performance/reliability and complete loss of adhesion by thepush of a button!

For further information:

RESCOLL Research Company of Materials

Konstantin Sipos

e-mail: sipos@rescoll.fr

www.rescoll.fr