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Reliability SocietyN E W S L E T T E R

Vol. 45, No. 4, January 2000 (ISSN 1059-8642)

http://www.ieee.org/society/rs

President’s MessageRS Goes International Again

In response to an invitation from the Tokyo Chapter, the ReliabilitySociety AdCom held its October AdCom meeting in Kyoto, Japan. TheAdCom meeting was part of a program that also included a special lec-ture at Kyoto University and a reliability workshop atTokyo Metropolitan Institute of Technology. This wasthe second AdCom meeting held outside the U.S. and,like last year’s Zurich AdCom meeting, it was a com-plete success. Other articles in this newsletter will pro-vide more information about the program.

Those of you who have participated in multina-tional projects know the complexity that is associatedwith arranging international meetings. Special credit isgiven to Prof. Suichi Fukuda, chair of the Tokyo Chap-ter, and Prof. Koichi Inoue, past chair of the TokyoChapter, for converting that complexity into a highly stimulating andsuccessful series of events. Briefly, Prof. Fukuda and Prof. Inoue:many thanks!

In the meeting, the Tokyo chapter provided a special report on itsactivities. It was extremely gratifying to hear how the chapter in-creased its activity level since January 1997. Even more encouragingwas the increased interest by chapter members in participating in Reli-ability Society activities and management.

Meetings such as our 1998 Zurich meeting and our 1999 Kyotomeeting go a long way in supporting the IEEE globalization initiative.Through its AdCom and its technical committees, the Reliability Soci-ety truly is an international society. Its membership spans several con-tinents and has a spectrum of reliability interests. To all of ourmembers, regardless of the country in which you reside: participate ac-tively and enjoy the diversity and camaraderie of the society.

KenReliability Society President

Kenneth P. LaSala, Ph.D.President, IEEE Reliability Society

[email protected]

C O N T E N T S

President’s Message1

Editor’s Column2

Chapter Activities3

Special Section on Activities in Japan5

An Overview of Concurrent Engineering16

New Book Announcement17

Software Safety and TrustworthinessStudy

18

AdCom Meeting Minutes20

IEEE-SA Members20

IEEE Standards Process-At-A-Glance20

IEEE Standards Projects By Society21

Call for Papers RSP'200022

Meeting Notice: Third InternationalConference on Modeling andSimulation of Microsystems

23

Editor:Dave Franklin

Associate Editor:Dr. Robert J. Loomis, Jr.

2 Reliability Society Newsletter ■ January 2000

Editor’s Column ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■

Reliability Society Newsletter Inputs

All RS newsletter inputs should be sent to:Editor Associate EditorDave Franklin Dr. Robert J. Loomis, Jr.300 North Oak Hills Drive 15406 Bay Cove CourtOak Park, CA 91377 Houston, TX 77059Tel: +1 818 586 9683 Tel: +1 281 212 6046E-mail: [email protected] Fax: +1 281 212 6097

[email protected]

The schedule for submittals is: Newsletter Due Date

January October 8April January 8July April 8October July 8

Reliability Society Newsletter is published quarterly by the Reliability So-ciety of the Institute of Electrical and Electronic Engineers, Inc. Headquar-ters: 3 Park Avenue, 17th Floor, New York, NY 10016-5997. Sent at a cost of$1.00 per year to each member of the Reliability Society. Printed in U.S.A.Periodicals postage paid at New York, NY and at additional mailing offices.Postmaster: Send changes to Reliability Society Newsletter, IEEE, 445 HoesLane, Piscataway NJ 08854.

©2000 IEEE. Information contained in this newsletter may be copied with-out permission provided that copies are not used or distributed for directcommerical advantage, and the title of the publication and its date appearon each photocopy.

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RELIABILITYSOCIETY OFFICERSPresidentK. P. LaSala ([email protected])

Vice President – MembershipM. Abramo ([email protected])

Vice President – PublicationsD. R. Hoffman ([email protected])

Vice President – MeetingsR. Gauger ([email protected])

Vice President - Technical OperationsO. D. Trapp ([email protected])

SecretaryJ. Voas ([email protected])

TreasurerR. A. Kowalski ([email protected])AdCom Members

STANDING COMMITTEESStandards and DefinitionsT. Brogan([email protected])Y. Lord([email protected])

Meetings OrganizationR. Gauger ([email protected])

General MembershipM. Abramo ([email protected])

ChaptersM. Abramo ([email protected])

Academic Education CommitteeM. Abramo ([email protected])

Professional DevelopmentM. Abramo ([email protected])

Constitution and BylawsT. Fagan ([email protected])

Nominations and AwardsL. Arellano ([email protected])

FellowsT. L. Regulinski([email protected])

FinanceR. A. Kowalski ([email protected])

HistorianA. Plait ([email protected])

A Truly InternationalVisitBy Dennis R. Hoffman

Our visit to Japan was truly interna-tional. Our hosts, the leaders of Japan’sIEEE Reliability Society and of the To-kyo RS Chapter, met and dined with theAdCom in Kyoto and in Tokyo. At ourSeminar in Tokyo held at the Tokyo Met-ropolitan Institute of Technology, we metand spoke with Japanese students andforeign exchange students from Ger-many, Sweden, Macedonia, and Yugo-slavia. While trying to figure out how to

use the automated machines to get a to-ken for the subway, a young man fromAustralia came to my rescue. When try-ing to determine the right direction totake from the subway station to our hotel,I was helped by three young men on vaca-tion from Toulouse, France. While ad-miring the huge trees near the NikkoToshogu Shrine and commenting aboutthe trees to Ken LaSala, a voice out of theblue said, “You must be from Texas.” Iturned to see a Japanese man. I said yesthat I was from Texas, but how did heknow. He said, “Your voice.” He works

Continued on page 24

January 2000 ■ Reliability Society Newsletter 3

Chapter ActivitiesBoston Chapter

Jim FahyChair, Boston ChapterPhone: (978) 288-4778

Fax: (978) [email protected]

Correspondance to:Jim Fahy

20 Waldor DriveMansfield, MA 02048

Cleveland ChapterVincent Lalli, Chair

[email protected]

Dallas ChapterBest Regards,

Tim Rost, ChairPhone: (972) 995-9035e-mail: [email protected]

Denver

Tom Basso, TreasurerPhone 303-384-6765

[email protected]

Japan ChapterIntroducing the officers of theJapan Chapter

(The chapter changed its name fromTokyo Chapter to Japan Chapter re-cently)Shuichi Fukuda (Chair)

Shuichi Fukuda received his bache-lor’s, master’s and doctor’s degree in me-chanical engineering from the Universityof Tokyo in 1967, 1969 and 1972 respec-tively. He was with Department of Preci-sion Machinery, University of Tokyofrom 1972 to 1976. He moved to OsakaUniversity, Welding Research Institutein 1976 and from 1978 to 1991, he was anassociate professor there. From 1989 to1991, he was concurrently an associateprofessor at University of Tokyo, Insti-tute of Industrial Science. From 1991, hehas been professor at Tokyo Metropoli-tan Institute of Technology, Departmentof Production, Information and SystemsEngineering. He was a visiting scholar atEES, Stanford University in 1994, visit-ing professors at CERC, West VirginiaUniversity in 1996, at SLL, Stanford Uni-versity and at JWRI, Osaka University in1998. He has been and is very active ei-ther as chair or as board member for manycommittees related to reliability prob-lems in design, manufacturing and in-spection which lies in between electricaland mechanical sectors. He also teachesFuzzy Theory and Knowledge Engi-neering at Department of Electrical Engi-neering, Nihon University.

ProfessorTokyo Metropolitan Institute ofTechnologyDepartment of Production,Information and Systems

Engineering6-6, Asahigaoka, Hino, Tokyo,191-0065, JapanPhone :+81-42-585-8670Fax:+81-42-583-5119E-mail : [email protected]

Yoshinobu Sato (Vice Chair)Yoshinobu Sato is the chair of the PhD

course in system safety, Tokyo Universityof Mercantile Marine. He received his BSand MS in Mechanical Engineering fromWaseda University and his Doctorate insystems engineering from Kyoto Univer-sity. His main interests are reliability, sys-tem safety and risk analysis.

ProfessorTokyo University ofMercantile MarinePhone and Fax : +81-3-5245-7421E-mail: [email protected]

Toshiyuki Inagaki (Secretary)Toshiyuki Inagaki received his BS,

MS, and Doctor’s degrees in systems en-gineering from Kyoto University in1974, 1976, and 1979, respectively. From1979 to 1980 he was a Research Associ-ate at the University of Houston. Since1980 he has been with the University ofTsukuba, where he is a Professor at theInstitute of Information Sciences. From1990 to 1991 he was at the University ofKassel as a Research Fellow of the Alex-ander von Humboldt Foundation. Since

TECHNICAL OPERATIONS

Vice PresidentO. D. Trapp ([email protected])

Advanced Reliability Techniquesand R&DC. Hansen ([email protected])

CAD-Concurrent Engineering, ExpertSystemsD. Hoffman ([email protected])

Computers, Information Systems andTelecommunicationsH. Wolf ([email protected])

Emerging (New) TechnologiesD. Franklin ([email protected])

Energy Systems Reliability and En-ergy Technology AssessmentsN. Lively (301-428-3618)

Health Care and Medical Reliability(Vacant)

Human Performance ReliabilityK. P. LaSala ([email protected])

International ReliabilityJ. P. Rooney ([email protected])

MaintainabilityVacant

Mechanical ReliabilityR. L. Doyle ([email protected])

Nuclear ReliabilityJ. Zamanali ((561) 694-3857)

Quality Assurance TechnologyP. Luthra ([email protected])

Reliability PhysicsT. Rost ([email protected])

Reliability PredictionsS. J. Keene, Jr. ([email protected])

Software ReliabilityS. J. Keene, Jr. ([email protected])

Speakers BureauM. Abramo ([email protected])

Testing and ScreeningA. Chan ([email protected])

Vehicular Technology & Transporta-tion SystemsVacant

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1996, he has been a director of an interna-tional research project on human-cen-tered automation for system safety at theCenter for TARA (Tsukuba AdvancedResearch Alliance), University ofTsukuba. His research interests includedynamic function allocation between hu-man and machine and its effect on systemreliability and safety, human trust in anddistrust of automated warning systems,mathematical and experimental evalua-tion of human interface, modeling of situ-ation awareness, reasoning and decisionmaking under imperfect or possibly unre-liable information. He has been a SeniorMember of IEEE since 1988.ProfessorInstitute of Information Sciencesand Electronics Universityof Tsukuba,Tsukuba 305-8573 JAPANPhone: +81-298-53-5537Fax: +81-298-53-5206E-mail: [email protected]

Tohru Tsujide (Treasurer)Tohru Tsujide received Master and

Doctor of Engineering from Nagoya Uni-versity in1968 and 1977, respectively. Hehas been working for NEC. He is now ageneral manager of Device AnalysisTechnology Laboratories where he man-ages development of the failure analysisand diagnosis, testing and manufacturingtechnologies of LSI, LCD and PDP. Hewas a Vice Chairman of Reliability Engi-neering Association of Japan. He is nowcommittee member of IEEE-jointly-sponsored conferences such as IPFA(Singapore) an ASMC(USA) and otherconferences. He received Ishikawa Prizeand the outstanding paper award fromUnion Japanese Scientist and Engi-neering Association of Japan in 1991 and1995. He also received Remarkable Pat-ent Prize from the Chief Secretary theScience Technology Agency in 1996.General ManagerDevice Analysis TechnologyLaboratoriesNECPhone : +81-44-435-1435Fax : +81-44-435-1762Email : [email protected] Nitta (AdCom Member, Se-nior Past Chair)

Shuichi Nitta earned BSEE fromKyoto University and PhD from the Uni-versity of Tokyo, in 1960 and 1978, re-spectively. After working for electricindustry as a systems engineer and qual-ity assurance director in the area of pro-cess computer control since 1960, he iscurrently a professor of Tokyo Universityof Agriculture & Technology. His re-search interests are EMC and Systemsmaintenabitility and safety.

ProfessorTokyo University ofAgriculture & Technology2-24-16 Nakacho Koganei Tokyo184-8588 JapanPhone :81-42-388-7096Fax.:81-42-385-7205E-mail:[email protected]

Koichi Inoue (AdCom Member, Jr.Past Chair)

Dr. Inoue received his B.S., M.S. andPh.D. degrees all in Applied Mathemat-ics and Physics from Kyoto University in1963, 1965 and 1968, respectively. Since1986, he has been Professor of Controland Systems Engineering in the Depart-ment of Aeronautics and Astronautics,Graduate School of Engineering, KyotoUniversity. From 1969 to 1986, he was anAssociate Professor in the Department ofPrecision Mechanics, Kyoto University.From 1971 to 1973, he was with the De-partment of Chemical Engineering, Uni-versity of Houston, Houston, TX. wherehe began working on systems reliabilityand safety. He has published more than200 technical papers in renowned jour-nals, among them he authored orco-authored more than 20 papers in theIEEE Transactions on Reliability since1974. For many years, he served as a ref-eree to the Transactions. He receivedOutstanding Paper Awards five timesfrom the Society of Instrument and Con-trol Engineers (3 times), the Institute ofSystems, Control and Information Engi-neers and Japan Society for Safety Engi-neering, for his contributions in Controland Systems Engineering. From 1997 to1998, he was a Chair of Tokyo Chapter,and presently he is a member of AdCom,IEEE Reliability Society. Dr. Inoue isalso the President of Human Interface So-

ciety and is on the Board of Directors ofJapan Society for Safety Engineering.

ProfessorKyoto UniversityDepartment of Aeronautics andAstronautics,Graduate School of EngineeringYoshida-Honmachi, Sakyo-Ku,Kyoto, 606-8501, JapanPhone :+81-75-753-5795Fax: +81-75-753-4975E-mail :[email protected]

Shuichi Fukuda, [email protected]

Los Angeles ChapterDavid L Franklin

[email protected]

Minnesota ChapterJames McLinnChapter chair

[email protected]

Philadelphia ChapterFulvio E Oliveto

Philadelphia Section609-722-3147

San Diego ChapterRichard L. Doyle, PE

Secretary of Rel. [email protected]

Singapore Chapter(ED/Reliability/CPMT JointChapter)

For Information contact

Daniel Chan, Chairman,Singapore Reliability/ED/CPMT

[email protected]

SwitzerlandMauro Ciappa

Switzerland Chapter Chairemail:

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Special Section on Activities in Japan

A Challenge of TokyoChapterSummary Report of Activities(From January, 1997 toDecember, 1998)Koichi Inoue, Jr. Past Chairand AdCom [email protected]

When I took the responsibility ofChairmanship of Tokyo Chapter on Janu-ary 1997, I thought I would do as my pre-decessors did. Up to that time, the onlything the Chairperson had to do was tohave a general assembly meeting once ayear and to approve events proposed byother groups as our cooperative events.That is, we did almost nothing as our hostevents. The reason for that is: (1) the bud-get allotted to the Chapter from the TokyoSection was only \30,000 (equivalently$250) per year. Most of the money disap-peared in the mail to announce a meetingto the members. (2) The situation beingdifferent in the US from in Japan, most ofthe IEEE members in Japan think that theIEEE is a US institution and it is not ourown. For example, most of reliability en-gineers join the Reliability EngineeringAssociation of Japan or other reliabilityrelated technical society such as the Insti-tute of Electrical Engineers of Japan, orthe Institute of Electronics, Informationand Communication Engineers of Japan

and so on. Only a small portionof them joins the IEEE Reli-ability Society, and, to beworse, their objective to jointhe Reliability Society is onlyto collect technical informationin the US or to publish papers inthe Transact ions. I haveauthored more than twenty pa-pers in the Transactions of theReliability Society since 1974.Until recently this is the onlyway for me, or generally for us,members of Tokyo Chapter, tocontribute to the Society. (3)The geographical distance and the lan-guage barrier are also very difficult prob-lems to overcome.

It was in April 1997, when I changedmy mind from “do nothing” to “do asmuch as I can”. At that time I was invitedto participate the AdCom meeting at Ad-ams Mark Hotel in Denver, Colorado andto take part in the Chapter Award Ban-quet to receive the one hundred dollarprize, where I noticed that the AdCommembers discussed very eagerly and en-thusiastically the various problems in theSociety for better services to the mem-bers not only in the US but also in theworld including Japan. I strongly felt thatnow is the time for us to contribute di-rectly to the Society by other ways than topublish papers in the Transactions, forexample, by interchanging people and in-

formation with each other. It is still diffi-cult to come over to the US, but insteadwe can use electronic means such ase-mail, web and/or Internet to communi-cate with each other. Now the distance isno more major problem.

Soon after I returned to Japan, Iformed an Executive Committee with 6members in Tokyo Chapter, in which themembers were K. Inoue, Chair, S.Fukuda, Vice-Chair, Y. Sato, Secretary,Y. Suzuki, Treasurer, S. Nitta, Jr. PastChair and M. Horigome, Sr. Past Chair.We had an Executive Meeting in May,and established the following two Activ-ity Goals and the six Action Items toachieve the goals.

The two Chapter activity goals were:(1) To reform the Chapter for the pur-

pose of making it more active and(2) To make closer ties between the

headquarters (AdCom) of the Soci-ety and the Tokyo Chapter.

To achieve the above goals, the fol-lowing six action items (1) ~ (6) were setup. Usually action items are items to bedone and not necessary assured to bedone. To contrast the items to be done andwhat was actually done, what was done iswritten in italic in the following.

(1) To establish an E-mail networkamong members and the Chapter toreduce communication costs,1. An E-mail network was formed to

cover over 90 members out of thetotal of 167 members.

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Top row- from left: Dennis Hoffman, Philip Tsung, Yoshinobu Sato, Bob Gauger, KoichiInoue, Shuichi Nitta, Shuichi Fukuda, Tohru Tsujide, Takehisa Kohda, Bud TrappBottom row- Yasuko Inoue, Dick Doyle, Loretta Arellano, Ken LaSala, Mariam Helm,Onolee Trapp

Three most recent presidents enjoying a free morning ofsightseeing. Golden pavilion in the background.

continued on page 6


2. A Fax-mail network was formedto cover those who did not havee-mail.

3. A mailing list was formed betweenthe ExCom members.

(2) To create our own Internet Webhome page,1. Our own Web Site was created at

the URL:http://yang.kuaero.kyoto-u.ac.jp/index.html (in Japanese).http://yang.kuaero.kyoto-u.ac.jp/index_e.html (in English).Since then we have had more than20 hundreds accesses in a year.

2. Another Web Site was created inthe Tokyo Section home page.http://launcher.g-search.or.jp/ieeetokyo/r.htm (in Japanese)http://launcher.g-search.or.jp/ieeetokyo/r_e.htm (in English)

(3) To encourage possible volunteersand recommend them to take parts invarious activities going on in the So-ciety,1. Proposed to create a new TC on

Reliability-related System Safety,and recommended YoshinobuSato as the Chairman of this pro-posed TC, this is accepted andnow in preparation (see anotherdocument in this issue).

2. Recommended Takehisa Kohdaas a member of TC on HumanPerformance Reliability, this isaccepted.

3. Recommended Takehisa Kohdaas an Associate Editor of theTransactions, this is accepted.

4. Koichi Inoue was nominated as anAdCom member by the nominat-ing committee, he is elected.

(4) To launch a new series of seminarsdirected to graduate students as wellas college students by active use ofthe Society’s Tutorial Video series,

A new series of Video Seminarshave been created:No. 1: “Developing Reliable Soft-ware in the Shortest Cycle Time”Feb. 19, 1998, Kyoto University,12 participants.

No. 2: “Developing Reliable Soft-ware in the Shortest Cycle Time”Mar. 7, 1998, Tokyo Univ. of Mer-cantile Marine, 15 participants.No. 3: “Designing Systems forReliable Human Performance”Sept. 11, 1998, Kyoto University,17 participants.No. 4: “Designing Systems forReliable Human Performance”Oct. 2, 1998, Tokyo Univ. of Mer-cantile Marine, 6 participants.

(5) To realize two Special Lectures, onein Tokyo and the other in Kyoto, in-viting one of our Distinguished Lec-turers of the Society,

A new series of Special Lecturesinviting Society’s DistinguishedLecturers or Officers has beencreated: (thanks to Tokyo Sec-tion’s budgeting of \200,000($1,600) per year)No. 1: “Reliability, Maintainabil-ity, Supportability and SystemSafety (RMSS)-A Total Systems Approach” byLoretta Arellano.Dec. 2, 1997, Tokyo Univ. of

Mercantile Marine, 41 partici-pants.No. 2: “Reliability, Maintainabil-ity, Supportability and SystemSafety (RMSS)-A Total Systems Approach” byLoretta Arellano.Dec. 4, 1997, Kyoto University,

30 participants.No. 3: “Thermal Analysis of Elec-tronics” by Dick Doyle.Oct. 20, 1998, Tokyo Univ. of

Mercantile Marine, 34 partici-pants.No. 4: “Thermal Analysis of Elec-tronics” by Dick Doyle.Oct. 23, 1998, Kyoto University,

17 participants.No. 5: “Human Performance Re-liability” by Ken LaSala.Oct. 1, 1999, Kyoto University,

15 participants.No. 6: “Human Performance Re-liability” by Ken LaSala.Oct. 4, 1999, Tokyo MetropolitanInstitute of Technology.

(6) To submit Tokyo Chapter ActivityReports and News to every issue ofRS newsletter.

The Activity Report from TokyoChapter has been appeared in ev-ery issue of the Newsletter sinceJuly issue, 1997 except Octoberissue, 1998, when the input wase-mailed to the editor but he lost itin the process of editing.

To organize and to operate the abovementioned activities or meetings, theExCom members met more than 10 timesin Tokyo in the two years. I would like toexpress my sincerest thanks to the mem-bers for their cooperation and devotion.At last, but not at least, I would like to ex-press our heartiest thanks to the AdComand its members for their very friendlysupports towards us and towards TokyoChapter. Without their supports, weshould have been sleeping until now andnever wake up.

Human InterfaceSocietyKoichi Inoue, [email protected]

After 15-year activities as a section ofSICE (Society of Instrument and ControlEngineers), Human Interface Society hasstarted its own history since January 13,1999. Between IEEE Reliability Societyand our Society, I believe we have com-mon interests, so I hope we will cooperatetogether and exchange ideas and infor-mation for the mutual benefit. Some factsof the Society are to follow:

� Founded: January 13, 1999� Number of members: 913 including

105 student members. At the time ofestablishment, the numbers was546, so we obtained 367 new mem-bers in 9 months. I believe the estab-lishment of this new Society hasbeen welcomed and supported bythe academic and technical commu-nities related to Human ComputerInteraction, Man-Machine Systems,Human Performance and so on.

� Activities:1. Publication of the Journal of Human

Interface Society, 4 times in a year.2. Publication of the Transactions of

Human Interface Society, 4 times ina year.

3. Publication of the Proceedings of theHuman Interface Symposium, oncein a year.

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Special JapanSectioncontinued from page 5


4. Publication of the Correspondenceson Human Interface, 5 times in ayear.

5. Publication of the Texts on HumanInterface Tutorials, once in a year.

6. Publication of the International Jour-nal of Human Computer Interactiontogether with the International Ergo-nomics Association and The HumanFactors and Ergonomics Society.

7. Sponsoring the Human InterfaceSymposium, once in a year. On Oct.4 ~ 6, 1999, we had the Symposiumat Osaka University. The number ofparticipants was 390, 166 paperswere presented, and a Special Lec-ture “Universal Design and HumanInterface” was given by Ms. AstukoKamoshida. For the purpose of yourunderstanding what subjects werediscussed in the Symposium, I namea few examples of the session titles:Interface Design, Virtual Reality,Barrier Free Technology, Usability,Cognitive and Physiology, SignLanguage, Design Support, UserBehavior and Model, etc.

8. Sponsoring the Human InterfaceMeeting for Reading Papers, 5 timesin a year.

9. Sponsoring the Human InterfaceColloquium, several times in a year.

10. Sponsoring International Confer-ences. It was decided that the Soci-ety would sponsor the IFIPINTERACT 2001 Conference inTokyo in the summer of 2001.

11. Other activities are discussed andwill be developed in Technical Op-erations Committee.

� Scope of the Society: Inthe Founding Prospectus,it is said that, The 20thcentury is said as the cen-tury of the machine, andendlessly various ma-chines were invented andwere improved. Whiletechnically advanced sys-tems were developed, au-tomatic and businessmachines which make ageneral user the targetcame into wide use, andthe importance of hu-man-friendly machineswhich are easy to use and

easy to understand has been widelyrecognized, and then the so-called hu-man interface technology was givenbirth to. As the result, both young andold are coming to make use of auto-matic and business machines everyday in both the workplace and home,and in both the work and play. Themachines which people put on thebody such as a pager and a cellularphone have been increasing, too. Ac-quaintance with the automatic andbusiness machines spreads out all themore, and it is probably to become thething that the people enjoy as a part ofthe life environment from the cradleto the graveyard, not as a tool andmeans to achieve the purposes. Themachines included into a part of thehuman environment are asked to benot only convenient for the users butalso comfortable to non-users, andalso asked to be of cultural flavor andof spiritual latitude. It is the human in-terface that develops high-tech andhigh-touch machines and which fitthe human. The 21st century shouldbe the century of the human and thehuman interface is the key technologythat makes it happen. The human in-terface is learning about the relationsbetween the technology and the hu-man, and it provides useful technol-ogy to produce machines but also ittakes research from the user side. TheHuman Interface Society has decidedto give important contribution in thedevelopment of the learning of the21st century and the society throughvarious activities.

“Research andDevelopment ofLead-free Solder forStandardization”by Shuichi Fukuda

This project was started on January1999. The ministry of International Tradeand Industry supports this project, andNEDO (New Energy Development Orga-nization) entrusted the project to 2 orga-nizations, JWES (Japan WeldingEngineering Society) and JEIDA (JapanElectronic Industry Development Asso-ciation). The objective of JEIDA is thefeasibility study on specific solders. Thepurpose of JWES group is the basic studyto clarify the characteristics of promisingcandidate alloys and their solder jointsand the development of lead-free solderswith improved characteristics. The reli-ability of solder joints are mainly at issuein this project. In both organizations themembers from universities, electronicand electric companies, solder and fluxcompanies are included. Both groups willmake final reports until March 2000.

Committee onReliabilityEngineering, Societyof Material Science,Japan

The Committee on Reliability Engi-neering was constructed by 25 membersin the Society of Materials Science, Ja-pan(JSMS) in 1975. Professor ToshiroYamada in Kyoto University had acti-vated the construction of this new com-mittee, and he was the first chairman. Atthe beginning, committee members wereselected mainly from the limited area ofthe mechanical engineering according tosuch a background of JSMS. Thus appli-cation of the reliability engineering to themechanical engineering was the typicaltarget of the works in this committee.Professor Takao Nakagawa, ProfessorAkira Nishimura and Professor HiroshiIshikawa had played important roles inthe development of the reliability engi-neering in Japan as the chairmen of the

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Ken presenting Koichi Inoue and Shuichi Fukuda IEEEhats as a thank you for coordinating the Japan AdCommeeting and Workshop.

continued on page 8


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committee consecutively. I have beenworking as the fifth chairman since De-cember 3, in 1997.

In my opinion, the history and activityof this committee can be divided into threephases. Phase I was the first decade wherethe areas of committee members and workswere both concentrated to the mechanicalengineering. The most typical work inPhase I was publications of a Databook onFatigue Strength of Metallic Materialswhich was accomplished by cooperationwith the Committee on Fatigue in JSMS.Full contents of this databook was alsocompiled as machine-readable databaseand this project had activated the new trendin data supplying system for the materialsproperty in Japan.

Phase II was the second decade wherethe number of committee members wereremarkably expanded by welcomingnew researchers and engineers in thefield of civil engineering. Among manyprojects in the second phase, I canpointed out the most important work ofgDevelopment of Practical Reliability

Design of Bridge Structures h organizedby Professor Hiroshi Ishikawa and spon-sored by Hanshin Express Way PublicCorporation. This was a typical exampleof the successful joint project among in-dustries, universities and academic soci-eties in Japan.

I trust that the present stage of thecommittee is the beginning of Phase III.The third phase should be a new era inwhich scientists and engineers in the areaof electronics would be involved. Con-cept of the reliability engineering wasoriginally developed in this area as everyone knows. Fortunately a new committeeon Semiconductor Electronics was con-structed in JSMS last year. Thus newmembers in this field are expected to par-ticipate in the Committee on Reliability.These circumstances are very conve-nience to facilitate the activity of ourcommittee on reliability engineering. Inaddition, I hope that the mutual commu-nication between IEEE Reliability Soci-ety and the Committee on Reliability

Engineering in JSMS is established toeach other.

Nagatoshi OkabeProfessor

Ehime [email protected]

The JapanSociety ofNon-DestructiveInspection

The Japan Society of Non-DestructiveInspection was formed in 1952 and hasbeen actively pursuing reliability issuesin NDI. Not only reliability issues in NDIequipment, but also those associated withhuman performance are studied becausehuman aspects play a very important rolein NDI sector. Details can be found at theweb site

http://wwwsoc.nacsis.ac.jp/jsndi/index.html

FYI. http://wwwsoc.nacsis.ac.jp/ is anacademic society home village and itlinks you to any academic society youwould like to find in Japan.

Shuichi FukudaDr., Advisor to the President

Tokyo Metropolitan Institute ofTechnology

6-6, Asahigaoka, Hino, Tokyo,191-0065, Japan

Phone: +81-42-585-8670Fax: +81-42-583-5119

(Attn: Prof.Shuichi Fukuda)E-mail: [email protected]

ReliabilityEngineeringAssociation of Japan

Reliability Engineering Associationof Japan (REAJ) was established in 1991,with Reliability Technology Associationof Japan which was set up in 1978 as itsfounding body. The Honorary Presidentis Prof.Noboru Takagi, Emeritus Profes-sor of University of Tokyo, Dept. of EE.The President is Prof.Tohma of TokyoDenki Daigaku ([email protected])and one of the Vice President isProf.Horigome of Tokyo University ofMercant i le Marine ([email protected]) who was formerly

chair of IEEE RS, Tokyo Chapter. AndShuichi Fukuda , present chair of IEEERS, Japan Chapter is one of the boardmembers. And the present Vice ChairProf.Yoshinobu Satois heading a re-search committee as described later.Thus, REAJ has a close connection withIEEE RS, Japan Chapter.

The target area of REAJ is very broad,ranging from electronic hardwares, elec-tronic packaging, optoeletronics de-vices,CAD, simulation, joining, adhesion,corrosion, system, softwares, etc. There areseveral research committes such as equip-ment reliability chaired by Mr.Takahara(77001796 [email protected]), de-pendability chaired by Mr.Komori whichfocuses on application issues relating to IEC60300 seris, functional safety chaired byProf.Yoshinobu Sato, VC for IEEE RS, Ja-pan Chapter which focuses on issues relat-ing to TEC 61508, parametric data chairedby Mr.Seki and Information System Reli-ability chaired by Prof.Mukaidono whichfocuses on hardwares and softwares of com-puters and network reliability and safety.

They hold General Meeting in May toselect officers and special lectures aregiven at the meeting. And ReliabilitySymposium is held annually in autumnand there are many tours organized tovisit research facilities and industries.

The secretariat of REAJ can bereached by e-mail at [email protected] by fax at +81-3-5379-1393 and theirwebsite is

http://reaj.i-juse.or.jp/It should be also mentioned REAJ has a

strong tie with Technical Group on Reli-ability in The Institute of Electronics, Infor-mation and Communication Engineers.Information on IEICE can be found at thewebsite http://www.ieice.or.jp/

Although REAJ does not cover suchfield as ITS, IEICE has Technical Groupon ITS Technology or Technical Groupon Safety, which would be of interest toIEEE RS members. REAJ also has a con-nection with LSI Testing Symposium.For information, contact [email protected] or +81-6-6879-7812 by fax.

Other societies which is associatedwith REAJ include the Japan Society forQuality Control (http://jsqc.i-juse.or.jp/)JSQS is now trying to expand their activi-ties and quality in education or in hospital



and kansei engineering are their new ar-eas. Another society is EnvironmentalTesting Laboratory, Reliability Centerfor Electronic Components of Japan(http://www.rcj.or.jp) or they can bereached at rcj [email protected] Engineering Society is centeredaround the Taguchi Method and can bereached by fax at +81-3-3582-0698.

Shuichi Fukuda

“Recently PublishedSafety Standard ofIEC 61508”

Given at the Tokyo Chapter Seminar,Oct. 4, 1999, by Yoshinobu Sato,

Tokyo University of Mercantile MarineIn order to certify safety of a product,

an authorized body has checked the prod-uct using a certain class of safety applica-tions such as design guidelines, checklistsand expert opinions. Namely, productswere examined with predominantly quali-tative techniques. So far, the followingproblems were found out for such qualita-tive approaches: 1) more quantitativeinformations on the product like the prob-ability of failure is required, and 2) the oc-currence of failure depends not only onthe product itself but also on the particu-lar production environment.

Thus, new safety standards, ISA SP84and IEC 61508, have been developed andpublished. Those cover quantitative safetyanalyses and overall-lifecycle safety-re-quirements of the product, The latter stan-dard establishes performance-basedcriteria called safety-integrity levels(SILs) for the design, installation, opera-tion, and decommissioning of electri-

cal/electronic/programmable electronic(E/E/PE) safety-related systems (SRSs).

The SIL consists of four possible levelsfor specifying the safety integrity require-ments of the safety functions to be allocatedto SRSs. In order to select SILs the standardclassifies E/E/PE SRSs into two modes ofoperations, i.e., low demand and high-de-mand/continuous modes.

The standard defines the target failuremeasures of SRS for both modes of oper-ation: 1) the time-average probability offailure to perform the design function ondemand (for a low demand mode of oper-ation), and 2) the probability of a danger-ous failure per hour (for a high-demand/continuous mode of operation). The tar-get failure measures are linked to SILs inorder to specify the possible risk reduc-tion achieved by an SRS. Thus, the stan-dard is closely connected to the disciplineof reliability.

Special Lectures andWorkshop

In conjunction AdCom Meetingwhich was held in Kyoto, Saturday,Oct.2, the following Special Lectures anda Workshop were held in Kyoto and inTokyo.

The Special Lecture was given byDr.Ken LaSala, President of ReliabilitySociety in the Lecture Room No.1, De-partment of Aeronautics and Astronau-tics, Graduate School of Engineering,Kyoto University from 1:30 pm to 4 pm,Friday, Oct.1. The title of his talk was“Human Performance Reliability”, andProf.Koichi Inoue chaired. Although thenumber of attendance was 15, there was avery lively discussion.

Another Special Lecture wasgiven by Dr. LaSala under the sametitle in the Auditorium, Tokyo Met-ropolitan Institute of Technology,from 10:30 am to 12:30 pm, withthe opening address by TMIT Presi-dent Harashima and with Prof.Shuichi Fukuda as chair.

In the afternoon, there was aWorkshop “Reliability Engineeringin the 21st Century” from 1:30pm to5:30pm at the same place, chairedby Prof.Toshiyuki Inagaki, Univer-sity of Tsukuba. Sr Past PresidentRichard Doyle was the first speaker

and he talked on “Micro-mechanicalReliabity” and Mr.Philip Tsung , AdComMember, talked next on “Satellite SolarCell and Solar Panel Reliability”. Then atalk on “Y2K Preparations in the US”was given by VP Robert Gauger. VPDennis Hoffman gave “An Overview ofConcurrent Engineering”.

From the Japanese side, Prof.TakehisaKohda, Kyoto University talked about“System Safety and Reliability” and VC,Prof.Yoshinobu Sato, Tokyo Universityof Mercantile Marine, gave a talk on “Re-cently Published Safety Standard ofIEC61508-How Related to ReliabilityEngineering?”.

There are many attendees about 120 intotal and from many countries such as Ger-many, Sweden, Yugoslavia, Macedonia,etc. in addition to Japanese. This gave theSpecial Lecture and the Workshop the in-ternational flavor. Another point I wouldlike to address is that there are many peoplefrom industries. The wide variety of atten-dees makes the discussion very interactiveand informative to fully satisfy the atten-dees, which was even continued at the re-ception party at the university cafeteriaafter the Workshop.

Thanks to these Special Lectures andWorkshop, we are now fully aware of thegrowing importance of reliability in the 21stcentury and that we come to understandwhere we are heading for. I join all the atten-dees in thanking the AdCom Members inmaking efforts to bring these Special Lec-tures and Workshop into reality.

Shuichi Fukuda

Tokyo MetropolitanInstitute ofTechnology:Overview

Tokyo Metropolitan Institute of Tech-nology (TMIT) was originally founded in1954 as Tokyo Metropolitan IndustrialJunior College and in 1960 Tokyo Metro-politan Junior College of Aerospace wasfounded and these two junior collegesmerged into Tokyo Metropolitan Collegeof Industry. In 1986, Tokyo MetropolitanInstitute of Technology was started as

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continued on page 10Koichi giving a presentation of the Japan chapteractivities.


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four year university with four depart-ments and in 1990 two masters’ coursewere established. And in 1992 Doctoratedegree course was established.

So this is a very young university butwith great aspiration. The special featureof TMIT is an interdisciplinary combi-nation of four departments consisting ofElectronic Systems Engineering, Me-chanical Systems Engineering, Aero-space Systems Engineering, andProduction, Information and SystemsEngineering. The graduate school con-sists of two masters’ degree courses: Ap-plied Dynamic Systems Engineeringand Electronics and Information Sys-tems Engineering. The one Doctor’s De-gree course is offered as EngineeringSystems.

Our motto is “Stronger Ties with In-dustries ” and we have the Center forScience and Research Exchange whichwas established in 1994 for the purposeof conducting joint research with indus-tries. TMIT is located in the midst of aindustrial research park where such ma-jor companies as Toshiba, Fuji Electric,Fanuc, GE Medical, Olympus, Konica,Hino Motor, etc are really within walk-ing (not driving) distance from the uni-versity.

Our another motto is “Globalization”and we have signed up collaborativeagreements with Stanford University,National University of Singapore, Wash-ington University, Bogazizi University,Pusan University and University of Tech-nology, Sydney

Although the number of students isless than 2,000 in the physical sense, weare now going to expand our educationnot only within Japan, but also across thenational boundaries. We have alreadystarted shared class with Stanford Uni-versity and we are going to start anothershared class with KTH and National Uni-versity of Singapore.

We are very much interested in reli-ability issues in global product develop-ment which are also a major concernamong the industries located around

TMIT. This is one of the very few univer-sities where concurrent engineering istaught. And it also should be mentionedthat human performance is also taught atour university in addition to reliabilityengineering and quality engineering.Ouruniversity has a wide variety of excellentlaboratory facilities for conducting jointresearch with industries and government.In fact, we have a studio which can becompared with the regional TV station inthis area.

Final ly , our President FumioHarashima served as President of IEEEIndustrial Electronics Society in 1986-87and IEEE secretary in 1990, a member ofIEEE N&A Committee in 1991-1992 andIEEE Fellow Committee in1991-1993.He served as Editor in Chief ofIEEE/ASME Trans. on Mechatnorics in1995. He hopes to make TMIT a COE formechatronics research and education.

For inquiries, contactShuichi Fukuda

“Systems Safety andReliability”Takehisa KohdaDept. of Aeronautics and Astronautics,Kyoto University,Kyoto 606-8501, [email protected]

Current research results were pre-sented relating to “Systems Safety andReliability”. His talk is composed of twoparts: the first one is on “root cause analy-sis of accidents involving human errors”and the second one is on “ failure effectanalysis using system bond-graph”.

Most of accidents in technical systemssuch as airplanes and nuclear plants are dueto human errors. The training or educationto strengthen the operator performance isnot sufficient to prevent human errors andtheir root causes such as design error mustbe identified. A novel framework is pro-posed for the root cause analysis of acci-dents involving human errors. Since anaccident is caused by various interactionsamong system components including hu-mans, the method firstly describes an acci-dent sequence in chronological way withthe consideration of not only interactions,

but also environmental factors, CPC(Common Performance Conditions) suchas adequacy of organization and workingcondition. In this description, a human er-ror mode can be identified as a deviationfrom the normal/standard operation undereach condition. The relation among ob-served events including human errors andcomponent failure are represented as logi-cal relation causing the accident occur-rence. For human error modes, theCREAM (Cognitive Reliability and ErrorAnalysis Method) is applied, which can ob-tain root causes of a human erroneous ac-tion using cause-effect relations amonggenotypes (causal factors of human errone-ous actions). Genotypes are roughly di-vided into three types: (1) human-relatedone such as cognitive function, (2) sys-tem-related one such as equipment and pro-cedure, and (3) organization-related onesuch as communication and training. Allpossible relations among genotypes andphenotypes (human error modes) are repre-sented in terms of cause-effect relations.Based on these cause-effect relations, acausal sequence of genotypes leading to ahuman error mode can be obtained, whereits source genotype corresponds to its rootcause. Combining these results with thelogical relation, the entire causal relation ofgenotypes can be obtained in a more de-tailed form. The database of previous anal-ysis results expressed in general terms ofgenotypes and phenotypes also helps ana-lysts to obtain an appropriate causal rela-tion. An illustrative example of a collisionaccident of airplanes shows the details andmerits of the proposed method.

Summary of the second part: The effectof component failure on the system perfor-mance is essential information not only forsystem design, but also for failure diagnosis.This kind of information is conventionallyobtained through the FMEA (Failure ModeEffect Analysis) usually performed by sys-tem analysts. As the system gets larger andits complexity increases, system analystsmay make errors in the evaluation. Further,as a system is generally composed of me-chanical, electrical and hydraulic compo-nents, the system analyst must consider theirinteractions in a unified way. To solve theseproblems,a systembond-graph(SBG) isde-veloped based on the design assumptions,which can model various components in a



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unified way using the physical analogy fromthe viewpoint of energy flow. Assumedcomponent failure and disturbances can bealso modeled easily using physical analogy.From the system bond-graph, the systemstate equations can be obtained automati-cally which express the system behavior inthe time domain. To evaluate the effect ofcomponent failure or disturbance on the sys-tem behavior, the system state equations aretransformed into a tree graph, where a noderepresents output of a characteristic func-tion, state variable, or input variable, and abranch denotes an input-output relation be-tween nodes. By propagating componentfailure effect along the tree graph, deviationscaused on nodes can be obtained easily. Adeviation denotes the effect of componentfailure on the corresponding System State.Using the tree graph, deviations not only un-der the initial transient state condition, butalso under the steady state condition can beobtained in the same way. A simple illustra-tiveexampleofa two-tanksystemshows thedetails and merits of the proposed method.

Koichi Inoue,Professor of KyotoUniversity andAdCom [email protected]

President LaSala visited Departmentof Aeronautics and Astronautics, Gradu-ate School of Engineering, Kyoto Uni-versity on October 1, 1999 and he gave aSpecial Lecture “Human PerformanceReliability” to the members of TokyoChapter, Kyoto University colleaguesand students. An excellent overview ofKyoto University made by Dr. MakotoNagao, President of Kyoto University,and a famous scientist of machine trans-lation, is cited below from Kyoto Univer-sity Bulletin, 1998/1999 editions.

“Founded in 1897, Kyoto University cel-ebrated its centennial last year. As shown bythe fact that the University has producedfour Nobel laureates, the best record of anyJapanese university, it is first and foremost aworld-ranking research university.

With its ten faculties, thirteen graduateschools, thirteen affiliated research insti-tutes, and seventeen research and servicecenters, it is the second largest national

university in Japan. Its scale can beunderstood from the fact that it has 14,000undergraduate students, 7,000 graduatestudents, including about l, 000 from othercountries, 2,700 teachers and 2,500 ad-ministrative staff.

Kyoto University offers the highest qual-ity of education and research in this country,a fact which is widely recognized. Interna-tional activities are flourishing. Kyoto Uni-versity faculty members travel frequentlyfor research and meetings, and more than1,600 overseas researchers visit Kyoto Uni-versity each year. Kyoto University has es-tablished exchange agreements with variousuniversities in other countries with a view tointernational exchange and cooperation inboth educational and academic domains.

Kyoto University is prominent notonly in scientific research but also in thehumanities, including the well-knownand much-admired “Kyoto School”.

In recent years, Kyoto University hasbeen giving more and more importance toactivities at graduate level, and has estab-lished new graduate schools to cope withthe emerging problems which will confrontus in the next century. These new schoolsinclude the Graduate School of Human andEnvironmental Studies, Graduate Schoolof Energy Science, Graduate School of In-formatics, and the Graduate School ofAsian and African Area Studies. Severalfurther schools, including the GraduateSchool of Life Science, the Faculty ofHealth Science, and others, are in prepara-tion. The substantial nature of these re-forms has required reorganization oftraditional and long-established academicdomains into new academic disciplines tofit the coming century.

These activities show that Kyoto Uni-versity is always fresh and flexible in ed-ucation and research, a dynamism arisingfrom the traditional spirit of Kyoto Uni-versity’s academic freedom, which hasbeen cultivated through the University’shistory of one hundred years.”

For more information, please visitKyoto University Web Site at

http://www.kyoto-u.ac.jp/index-e.html(in English)

http://www.kyoto-u.ac.jp/(in Japanese).

Reliability WorkshopProceedingsHeld in conjunction withOctober AdCom

Y2K – ARE WE READY?Presented in Japan at the Workshop

on Reliability Engineeringin the 21st Century

October 4, 1999Though I had suggested several topics

for the Workshop on Reliability Engi-neering in the 21st Century, “Y2K Prepara-tions in the U.S.” was the subject that theJapanese audience wanted me to talk about.Actually, I would have preferred to hearabout Japan’s Y2K preparations. Therehave been a number of articles publishedlately that claim that Japan is a major Y2Krisk, and other articles explaining that thetypical Japanese computer-related applica-tions have many manual interventions orchecks that will allow human interventionand control. I checked on the use of the Jap-anese calendar and found that it was notsolving the problem.

I shared with the audience what I knewof the worldwide status, how our U.S. prep-arations were proceeding, and what I hadbeen doing for the past year in the Y2Kfield. From my viewpoint, Y2K failuresand their likelihood of occurrence are verymuch like any other reliability failures, ex-cept that we know when to expect them.Looking at a map of the world, I pointed outthe areas around the world that are of thegreatest concern to me: Russia, China, Af-ghanistan, Bangladesh, Cambodia, Indone-sia, Vietnam, Kenya, Morocco, andMozambique. Nepal, Nigeria, Uruguay,Costa Rica, Ecuador, and El Salvador. Forthe most part, these are third world nationsand have relatively few computers in-stalled. However, to the extent that theytake part in world trade and world banking,they will be seriously handicapped. At theother end of the scale, Australia, Belgium,the Netherlands, Switzerland, Denmark,Britain, Israel, Canada, and the U.S. seemto be well prepared.

I shared with the group the data that I hadon U.S. spending for Y2K preparations:

� Up to $150 billion by U.S. industry.

continued on page 14

RELEX CENTER SPREAD



� $8.6 billion by the Federal Govern-ment.

� $450millionby theStateofCalifornia.� $11 million by General Motors.� $5 million by a moderate-sized

wastewater plant.And all of this because the date was

shown as two digits, rather than four.I then showed the audience the recent

Year 2000 headlines for each major in-dustry, some predicting doom andgloom, but most presenting an increas-ingly positive outlook. For example, itwas reported that 75% of the U.S. com-panies have already experienced Year2000-related failures, yet only 2% ofthese failures have caused business in-terruption. The most prominent exampleis a nearby wastewater treatment plant,where 4 million gallons of sewagespilled into a park area during Y2K test-ing. The plant was remained operableand the sewage was quickly cleaned up.

I expect to be glued to the television,starting early Friday morning, as theclocks change over to 2000 around theworld. I will start with New Zealand andAustralia, then Japan, and on throughAsia. I will be watching for failurescaused by computers and other smart de-vices with microprocessors built in. Themost difficult to find and remedy aresmart devices with embedded circuits.These will be found recording time in el-evators, recorders, telemetry, and a widerange of automatic devices. Having justas much impact will be the embeddedsystems found in process control equip-ment in factories, power plants, andwastewater plants.

By the time you read this, it will al-most be too late. You can take a measureof personal preparation and readiness. Ifearthquakes are a possibility in you’rearea; this is the year to make up that earth-quake readiness kit. Then plan what youwill do and how you will cope with thepossible loss of water, power, phone, andother essential services.

Normally, for industry and utilities, Irecommend a plan that starts with inven-

torying all devices, then assessing themto determine how they could fail due toY2K and what the impact would be. If afull answer can not be obtained, they mayneed to be tested and/or replaced. There isno longer time for this. What I recom-mend now for industry, and for you, is todevelop contingency plans. Plan for theworst cases that you consider possibleand then develop plans to cope with them.Let’s hope you don’t need them and canmodify the plans and use them as the ba-sis for a training video for some other nat-ural disaster.

Bob [email protected]

Micro-MechanicalReliability AnalysisTokyo Chapter Workshop,4 Oct. 1999Richard L. Doyle, PEDoyle And Associates, 5677 Soledad Rd.,La Jolla, CA 92037-7050 USAInternet (e-mail): [email protected]

IntroductionMicro-Mechanical Reliability analysis

is a technique for predicting the life and re-liability of a small part. This document rec-ognizes that there are many problemsencountered in trying to predict the reliabil-ity of Micro-Mechanical components andsystems because of the unique characteris-tics of extremely small mechanical designs.Micro-Mechanical designs are often one ofa kind, therefore historical data from “simi-lar” equipment is not available for predict-ing performance reliability of the newequipment. This presentation will attemptto direct ones activities in an effort to re-solve these problems.

2.0 PurposeThe purpose of a Micro-Mechanical

Reliability analysis is to provide a realis-tic estimate of the reliability of a verysmall part. This estimate may be used as abasis for reliability improvementsthrough design changes or to predict if thedesired reliability of the system has beenachieved. It is difficult to establish a goodestimate of reliability without an orga-nized and proper approach. The intent ofthis presentation is to guide one throughthe analysis. However, it is left up to the

reader to chose which techniques to useand which probability function best fitsthe mechanical equipment.

As the analysis progresses, one shouldreevaluate reliability goals and modify theMicro-Mechanical design to ensure thatthese goals are met. If the product can notbe modified, then the prediction providesthe best estimate of the expected life and re-liability of the Micro-Mechanical system.

The following analysis applies to vari-ous types of devices, including: Trans-ducers, sensors, springs, bearings, gears,and motors.

3.0 General DescriptionThe following practices are used for

predicting the reliability of Micro-Me-chanical systems.

Reliability Calculations of IndividualParts

The Predicted Reliability values shallbe calculated for all major pieces in thesystem. The individual part failure rate isdetermined using the techniques de-scribed in this presentation. Summingthese values will provide the PredictedReliability values for the Micro-Mechan-ical system.

Environmental conditions in addi-tion to temperature become critical forthe Micro-Mechanical devices. This in-cludes such influences as moisture,thermal shock and vibration. For vibra-tion, it may be necessary to provide astrong support, including a three point(or more) mounting. It may be thatHALT testing provides the highestloads. If failures continue to occur,changing the design may be a solution.Or it may be necessary to obtain higherstrength materials.

3.2 Computing Micro-MechanicalReliability

The method of computing the reliabil-ity of a Micro-Mechanical system, eitherMTBF or probability of success will de-pend on personal preference. The reli-ability can normally be determined, indescending order of preference by:

1. Probabilistic Stress and StrengthAnalysis for each critical part (Sec-tion 3.6).

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2. Failure rate models developed inSection 3.5 (Product Multipliers /Stress Factors)

3. Parts Count Technique for all partsusing generic data (Section 3.4).

For critical Micro-Mechanical parts,technique 1 should be required. For themajority of the Micro-Mechanical sys-tems, techniques 1, 2 and 3 are usuallycombined.

3.3 General Solution, Micro-Mechani-cal Parts

There are various stress levels or loadson Micro-Mechanical systems. The lowerthe stress level with respect to capability orstrength, the better the reliability.

To date, no single method or techniquehas been accepted as the standard for com-puting the reliability of Micro-Mechanicalsystems. The following 3 different pro-cesses may be used in computing the reli-ability of a Micro-Mechanical system.They are: 1.) Using published data (partscount method), 2.) Using product multipli-ers, or 3.) Calculating the probabilisticstrength and stress of the part.

3.4 Parts Count Method, Micro-Mechanical Parts

The use of the parts count techniquegreatly simplifies the reliability computa-tions of Micro-Mechanical systems [3].This technique, basically, is to list all me-chanical pieces used, determine the ge-neric failure rate for each piece in aspecific environment, add up the failurerates (if no redundancy), and then com-pute the reliability, either MTBF or prob-ability of success.

One should realize that a predictedvalue is not a guarantee that the value willagree with actual test results, but it willprovide failure trends and will identifythe critical parts.

3.5 Reliability Predictions(Using Product Multipliers)

The first step in developing these fail-ure rate models was to derive equationsfor each failure mode based on design in-formation and experimental data con-tained in published technical reports andjournals. These equations when simpli-fied, retain those variables affecting reli-

ability as indicated from field data andfrom statistical analysis of the data. Thefailure rate models utilize the resultingparameters in the equations and includemodification factors. These factors werecompiled for each variable to reflect itseffect on the failure rate of each part. Thetotal failure rate of the part is the sum ofthe failure rates of each of the variablesaffecting reliability.

Failure rate models have been devel-oped by the Naval Surface Warfare Cen-ter - Carderock, MD [2].

Analytical Methods of DeterminingMicro-Mechanical Reliability

This section will present a Probabilis-tic Stress and Strength

Analysis [1]. This provides techniquesfor determining structural reliabilitythrough the computation of the probabil-ity of failure. Although this techniqueprovides a good reliability estimate basedon stress and strength, it is a ratherlengthy process.

The concept of relating mechanicalstress analysis to failure rate is based on:1.) Determining the critical failuremodes, and 2.) Limiting the stress analy-sis to those failure modes that are criticalto the proper operation of the equipment.

For those failure modes considered tobe critical, an evaluation of the stress andstrength of each part should be made.This evaluation may be entirely deter-ministic, entirely probabilistic, or a com-bination thereof depending on thecriticality of the failure event. One shouldtranslate stress/strength relationshipssuch as safety factors, into a reliabilityvalue during the analysis and probabilis-tic techniques should be used.

4. ReferencesChapters 18, 19 and 20 (By: Doyle,

Richard L), Handbook of Reliability En-gineering and Management, Publishedby McGraw-Hill, Inc. January 1996.

NSWC-94/L07, Handbook of Reli-ability Prediction Procedures for Me-chanical Equipment, By Naval SurfaceWarfare Center - Carderock Division,March 1994.

NPRD-95, NonElectronics Parts Reli-ability Data Notebook and PC Data Disk,By Reliability Analysis Center, 201 MillStreet , Rome, NY 13440, Ph.315-337-0900, dated 1995.

Solar Cell and SolarPanel Reliability andStatistical MethodsIntroduction

This paper describes how statistical toolsand reliability modeling techniques were in-troduced at TECSTAR Inc., a manufacturerof solar cells, solar panels, avionics commu-nication equipment, and aerospace actuationand control systems. Reliability modeling ofsolar panels and statistical analysis to sup-port solar cell qualification testing are ad-dressed in this paper.

Reliability ModelingA solar panel is comprised of solar cells

configured in circuit strings. The voltage ofeach string is kept constant at the satellitebus voltage, and each string contributescurrent. At the circuit string (comprised ofx number of cells in series) and solar panellevels (comprised of y number of strings inparallel), a new reliability model was de-veloped to ensure that solar panels were not“over-designed” in terms of reliability. Thepower margins that were designed into theproduct were factored into the reliabilitymodel at the solar panel level. The reliabil-ity model was based on active redundancywhere “m of n” solar cell strings have towork in order for the panel power require-ments to be met, with “n” being the totalnumber of cell strings and “m” being thenumber of cell strings that must work. Thereliability model is shown in Eq. (1).

n

R [n! / (k!(n k)!][R]

R

k = m

STRINGSk

n k

= −−

∑−[ ] ( )1 1

� R is the reliability of an individualstring consisting of cells, intercon-nects, and diodes (the reliability ofeach string in a panel is the same forpurposes of this analysis)

� m is the number of strings that mustwork to meet the reliability require-ment

� n is the total number of strings� Power Margin = n/mThis model supported the design func-

tion, power analysis function, and pro-posal preparation process. It was used toconduct trade studies of power margin

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with circuit string configuration andpanel reliability.

Statistical Tools And AnalysisStatistical tools and techniques are

used at TECSTAR to determine samplesizes sufficient to meet a 90% confidencelevel. A key application of these tech-niques was the qualification of a brandnew, high efficiency, multi-junction Gal-lium Arsenide (GaAs) solar cell.

The normal, beta, and binomial distri-butions are used to select sample sizes fora variety of solar cell qualification test ac-tivities, as described below.

Normal Distribution –The normal distribution can be used to

calculate sample size by applying Eq. (2):

N Z EConf= ×/ /22 2σ

N = sample sizeZ = normal probability distribution Z sta-tistic [ Z = (xbar – ?) / ? ]Conf = confidence level (Z Conf/2 de-notes a two-sided test and Z Conf denotesa one-sided test)

σ = standard deviationE = allowable measurement error

This calculation can be interpreted asfollows: N is the minimum sample sizerequired to ensure with a specified confi-dence (Conf) of obtaining test values(xbar) within + E of the true populationmean (?).

Beta Distribution –The Beta distribution is effective in

determining the lower bound on reliabil-ity at a given confidence interval. It isalso used to determine a sample size re-quired to ensure at a specific confidencelevel whether a reliability requirement ismet, provided that there are no failures.The sample size calculation is shown inEq. (3).

N = ln (1 – Conf) / ln R(3)N = sample size (no failures allowed)Conf = confidence level (between 0 and1.0)R = reliability (as a probability between 0and 1.0)

Binomial Distribution –The binomial distribution deals with

situations having only two possible out-comes, such as success or failure. At

TECSTAR, this distribution is used to es-timate the sample size to ensure with 90%probability that a defect, if present, willmanifest itself during the course of test-ing. For example, the probability of 0 orfewer occurrences of 10% corresponds tonp=2.3; conversely, this corresponds to a90% probability of there being one ormore occurrences. Given that np=2.3 inthis example, if the defect rate is 10%(p=0.10), then n=23. That is, 23 samplesare required to ensure with 90% probabil-ity that there will be one or more defectsmanifested, given a defect rate of 10%.

Author InformationPhilip W. Tsung is responsible for re-

liability engineering and statistics at thethree divisions of TECSTAR Inc., a man-ufacturer of solar cells, solar arrays, avi-onics communication equipment, andaerospace actuation and control systems.Mr. Tsung is currently a member of theIEEE Reliability Society NationalADCOM (1998-2000) and is a past chairof the Boston Chapter of the IEEE Reli-ability Society (1996-1997). He is anASQ Certified Reliability Engineer.

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An Overview of Concurrent Engineering

By Dennis R. Hoffman

Concurrent Engineering refers to thesimultaneous, parallel design processthat encompasses all aspects of a prod-uct’s development in a top-down fashionby a multi-disciplinary team. The goal ofConcurrent Engineering is to achievemutual optimization of critical charac-teristics of the product and its relatedprocesses. This approach is intended tocause the product developers, from theoutset, to consider all elements of theproduct life cycle from conception

through disposal. Concurrent Engi-neering is based on the realization that:“specialty” attributes of a product aremore effective when designed into theproduct rather than installed af-ter-the-fact; early design decisions mustconsider “specialty” attributes alongwith other performance characteristics;and quality products need a continuouslyevolving quality process.

Concurrent Engineering focuses onthree major concepts: 1) The integratedproduct development process needs tobe understood and modeled to be repeat-

able, ensuring systematic success; 2) Allrelevant perspectives, from customer re-quirements through internal constraints,must be considered in the definition anddesign of the product; 3) All perspec-tives need to be integrated to yield aglobal optimum, i.e., a cost effective, ro-bust design tolerant of manufacturingand use variations.

A relatively simple idea, ConcurrentEngineering is based on a fundamentallydifferent way to look at how products areconceived, engineered, manufactured,and supported. The idea is that people can


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do a better job when they cooperate toachieve a common goal. To implementthis concept successfully, members ofmanagement, engineering, test, manu-facturing, and product support must de-velop a profoundly different insight —the process insight. The process insight isthe realization that all the activities,which transform a collection of inputsinto a product satisfying a need, are a sin-gle “process’’. This process can be de-f ined, measured, managed, andcontinually improved. Improvements in-clude breakthroughs associated with newinventions and the small improvementsresulting from everyday suggestions.

Concurrent Engineering involves aproduct development infrastructure thatfosters a unified, collaborative approach tointegrate these business, engineering, andmanagement specialists’ inputs across tra-ditionally segregated product developmentphases — starting with requirements defi-nition and encompassing the design ofmanufacturing and support processeswithin product development. With this uni-fied infrastructure, companies are able toachieve more competitive products andeliminate predictable cost, schedule, qual-ity, and product functionality shortfalls thatare inherent in sequential, review-baseddevelopment practices.

Interdisciplinary process improve-ment and multi-disciplinary product de-velopment demand a new managementapproach — a different culture and view-point. What is required is now referred to

as multi-discipline teams. Empoweredteams have shown to be dramatically suc-cessful in shortening developmentphases, and doing so with fewer staff.Characteristics of an effective team in-clude: involvement of the members whoare essential to complete all aspects ofproduct design and process development;a sense of responsibility among all teammembers for total success of the product(product focus versus organizational);team authority and responsibility; a re-ward structure that emphasizes team suc-cess; and a team longevity correspondingto their project’s duration.

Concurrent Engineering requireslong-term commitment to process devel-opment and optimization. This requireslong-term commitment to the accumula-tion and application of knowledge. Les-sons learned from testing and fieldexperience must be evaluated to fix de-sign problems and to correct the pro-cess(es) to prevent future recurrence.Competitive benchmarking of companyand competitor products and processes isalso a valuable source of design knowl-edge. This knowledge repository must bemaintained and leveraged to ensure ef-fective application to future products.

Concurrent Engineering (despite itsfad or buzz-word connotation) is not justanother “improvement program”. As de-sign schedules continue to shorten andbudgets continue to tighten, companieswill be forced to eliminate the redesign,debug, repair, and rework cycles in order

to be competitive and continue to grow.Those who make the necessary changeswill remain in business. Concurrent En-gineering affects continuous improve-ment in products and processes ifeveryone in the enterprise buys into thephilosophy that the requirements formanufacturability, testability, reliabilityand supportability must be satisfied in theearly, conceptual stages of each new prod-uct development. Concurrent Engineering(CE), or Integrated Product Development(IPD), is applicable to any industry devel-oping products and wanting to remaincompetitive in today’s marketplace.

Excellence is elusive; however, thesuccess of an enterprise is determined byits ability to excel. Organizations can be-come complacent and thus reluctant to“fix” or change processes that work.Concurrent Engineering has a role in at-taining excellence and then avoidingcomplacency. The most powerful tool inbusiness today is change. Competitorsuse change to unseat industry leaders:they will change customer expectations,introduce superior technology, changegovernment regulations, and improve re-source management. Today, an enter-prise will remain successful only if allinternal processes are adaptable andpoised for rapid and unexpected changes.Iterative, frequent, evolutionary changesare necessary to sustain excellence.Proactive leaders encourage action andseek opportunities to tilt the competitiveplaying field rules in their favor.

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New Book AnnouncementSoftware Safety and Reliability: Techniques, Approaches and Standards of KeyIndustrial Sectors

by Debra S. Herrmann

IEEE Computer Society Press,Item # BP00299500 pages, 1999, ISBN 0-7695-0299-7

This book introduces the concepts,techniques, and approaches used to

achieve and assess software safety andreliability. Next, current software safetyand reliability standards from multipleindustrial sectors (transportation, aero-space, defense, nuclear power, biomedi-cal) are examined in terms of:

Implementation strategies, con-text relative to system safety and

general purpose software engineer-ing standards, strengths, areas forimprovement, and results observedto date from performing the recom-mended and required practices.



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Standards, which are not specific to anindustrial sector, are examined in thismanner as well. Lastly, observations,conclusions, and recommendations arederived from, similarities and differencesin the standards, and the current practiceof software safety and reliability engi-neering. Two annexes provide contact in-formation for: 1) organizations involvedin the development of software safetyand reliability standards; and 2) commer-cial products available to assist in per-forming software safety and reliabilityanalyses. The book is written for engi-neers, scientists, managers, regulators,and policy makers involved in the design,development, acquisition, and certifica-tion of safety-critical systems.

ContentsINTRODUCTION TO SOFTWARESAFETY AND RELIABILITY1 Introduction2 Software Safety and Reliability BasicsAPPROACHES PROMOTED BY KEYINDUSTRIAL SECTORS TO SOFT-WARE SAFETY AND RELIABILITY3 Transportation Industry

3.1 EN 50128: Software for RailwayControl and Protection Systems

3.2 MISRA (superscript: TM)(super-script: ) Development Guidelines forVehicle Based Software

3.3 Society of Automotive Engineers JA1002 Software Reliability ProgramStandard

4 Aerospace Industry4.1 Commercial Aircraft,

RTCA/DO-178B4.2 European Space Agency (ESA)4.3 National Aeronautics and Space Ad-

ministration (NASA)5 Defense Industry5.1 US DOD MIL-STD 882D, Mishap

Risk Management5.2 UK MOD DEF STAN 00-55, Re-

quirements for Safety Related Soft-ware in Defense Equipment

5.3 NATO COTS Software AcquisitionGuidelines

6 Nuclear Power Industry6.1 IEC 60880, Software for Computers

in Safety Systems of Nuclear Stations6.2 CE-1001-STD Rev. 1, Standard for

Software Engineering of Safety-Criti-cal Software

7 Biomedical IndustryIEC 601-1-4 , Requirements for Safety,Programmable Electrical Medical Sys-temsAPPROACHES PROMOTED BYNON-INDUSTRY SPECIFIC SOFT-

WARE SAFETY AND RELIABILITYSTANDARDS

8 IEC Dependability Standards

8.1 IEC 61508-3:1998, FunctionalSafety of Electrical/Electronic/Pro-grammable Electronic Safety-RelatedSystems

8.2 IEC 300-3-9:1995, Risk Analysis ofTechnological Systems

8.3 ISO/IEC 15026:1998, System andSoftware Integrity Levels

9 IEE SEMSPLC Guidelines, Safety-Related Application Software for Pro-grammable Logic Controllers

10 ANSI/IEEE Std. 982.1 and 982.2,Measures to Produce Reliable Soft-ware

11 IEEE Std. 1228-1994, Standard forSoftware Safety Plans

OBSERVATIONS ANDCONCLUSIONS

12 Software Safety and Reliability Tech-niques, Approaches and Standards:Observations and Conclusions

Annex A - Organizations Involved inSoftware Safety and Reliability Stan-dards

Annex B - Commercial Products Avail-able to Assist in Performing SoftwareSafety and Reliability Analyses

Software Safety and Trustworthiness Study

The Reliability Society is teamingwith the Computer Society to developproposed procedures to certify safetycritical software and systems. Systemsafety critical problems are most oftenrooted in logic or software. Software in-cludes firmware, embedded complexlogic as well as application and systemsoftware.

Admittedly safety is a system attrib-ute but the safety root causal area issoftware based.

A related focus area is in “SystemsManagement” including:

1). requirements and2). interfaces.

This is typically the largest problemsector for trustworthy systems. I am in-cluding this exposure area in Software.It could be treated separately, or itcould be included in software as hasbeeen implicitly done in this proposal.

This effort is in the proposal stages.The study will:

� Research and size the currentproblem or opportunity

� Catalog problem exposures

� Identify initiatives to be explored inCertification of people, processes,and products

� Cross map probable initiatives vsproblem areas

� Identify key personnel and teams tolead development of new standardsand practices

If you would like to participate in thisstudy, which will run over more than ayear, please advised the author below.

Samuel Keenes. [email protected]

New BookAnnouncementcontinued from page 17


PU Full pageConcurrent

engineering ad fromJuly 99 page 24


Reliability Society AdCom MeetingSaturday, October 2, 1999Coop Hotel, Kyoto, Japan

Meeting was called to order at 9:00am. A quorum existed.

The agenda was approved and theminutes were approved as amended.

President report:Ken reported that the new financial

model could impact RS. He and Dick Kare closely monitoring. The RS budgetwas submitted according to IEEE recom-mended guidelines, but could be im-pacted with the new financial model.

Past action items: Dennis presentedstatus on several of his former AI’s. Dis-cussion on the cost comparisons for pub-lications resulted in action for DickDoyle to provide Dennis with cost ele-ments for him to include in comparisons.On-line publishing is due to start for RSin January.

Treasurers report (Ken LaSala)Ken and Dick K to research past meet-

ing minutes to the agreed amount of RScontribution to the History center andDick K to send check. Projection is $40ksurplus for 2000. Dick will clarify budgetitem 1.2 – SMT periodical.

Meetings report: (Bob Gauger)Bob eliminated the Sunday AdCom in

January and March to eliminate conflicts.AdCom meetings will be the previousSaturdays to the conferences. Bob ex-plained the sponsorship type and respon-sibilities. There was a desire to have aliaison to every conference. Bob to getactive contacts for all conferences that weco-sponsor. He will clarify new rules forlife members reduced rates for IEEE con-ferences. Bob is to provide a table identi-fying all RS sponsored conferences,points of contacts, etc and provide at theupcoming ExCom meeting. Bob reportedthat the budgets for RAMS, IRPS, andIRW were approved. There is still a needto evaluate the status of conference close-outs. Bob will arrange to get a room forTech op meeting to be held Sunday pre-

ceding RAMS. Bob mentioned that theEDS annual conference training will beheld in December in Wash DC.

Membership report: (Marsh Abramo)Marsha will determine which societ-

ies qualify for affiliate membership.

Publications: (Dennis Hoffman)Dennis will determine what Bob

Loomis needs in order to upload News-letter onto Web. He reported that we mustissue 4 Newsletters per year in order tomaintain our Postage Permit. Dave is re-questing input for 4th issue. AdCom rec-ommended that a special issue be madehighlighting the Japan AdCom and work-shop meetings. All came up with anagenda and actions. Dennis to coordinatewith Dave and all Japan participants.

Tech Op report:Bud sent email request for articles in

RSN on their areas of specialties.

Jr Past President report:Loretta will send Wash/DC RS mem-

bers listing to Ken in order to rejuvenatethe chapter

RS Display reportPhil reported that in order to have the

display available for RAMS, we muststart the order process by Dec 1. Philshowed examples of the proposed dis-play and material to be posted. Motion:

Expend up to $7K, continue working de-tails with vendor, but start order no earlierthan Dec 1. Phil plans to start paperworkNov 10, to meet the Dec1 order date.

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IEEE STANDARDSPROCESS-AT-A-GLANCE

IEEE Standards has developed a one-stop guide, IEEE Standards Pro-cess-at-a-Glance," that walks you through the process and paperwork needed todevelop a standard. This guide is an invaluable tool to new working group chairs,IEEE Sponsor chairs, and standards developers. Please view http://stan-dards.ieee.org/resources/glance.html.

IEEE-SAMembers

To assist you in keeping abreastof IEEE Standards Activities, wehave compiled a list of new and re-vised standards projects, listed bysponsoring IEEE Society, thathave been recently approved bythe IEEE-SA Standards Board.

If you have any questions con-cerning the list below, please con-tact Jodi Haasz at [email protected] or +1 732 562 6367.

Sincerely,

Ronni RubensteinIEEE-SA Membership

Marketing Administrator445 Hoes Lane

Piscataway, NJ 08855 USATel: +1 732 562 6381Fax: +1 732 562 1571

[email protected]


IEEE Standards Projects By Society

NEWAerospace & Electronic Systems Soci-ety, Gyro Accelerometer Panel

P1554 Recommended Practice for Iner-tial Sensor Test Equipment, Instrumenta-tion, Data Acquisition and Analysis

COMPUTER SOCIETY, Local andMetropolitan Area Networks

P802.5z Supplement to - InformationTechnology Telecommunications andInformation Exchange Between Systems0 Local and Metropolitan Area Networks- Specific Requirements - Part 5: TokenRing Access Method and Physical LayerSpecifications - Aggregation of MultipleLink Segments

P802.16.2 Telecommunications and In-formation Exchange Between Systems -LAN/MAN Specific Requirements - Co-existence of Broadband Wireless AccessSystems

REVISED

P802.5w Corrigenda to - InformationTechnology Telecommunications andInformation Exchange Between Systems- Local and Metropolitan Area Networks0 Part 5: Token Ring Access Method andPhysical Layer Specification PortableApplications

NEW

P1003.1s Standard for Information Tech-nology - Portable Operating System Inter-face (POSIX) - Part 1: System ApplicationProgram Interface (API) - Amendments:Synchronized Clock (C Language)

P1003.5h Standard for InformationTechnology - Portable Operating SystemInterface (POSIX) - Ada Language Inter-faces - Part 1: Binding for System Appli-cation Program Interface (API) -Amendment h: Synchronized Clock

REVISED

P1003.1j Information Technology - Porta-ble Operating System Interface (POSIX) -Part 1: System Application Program Inter-face (API) - Amendment: AdvancedRealtime Extensions (C Language)

Standards Coordinating CommitteeNEW

P2002 Internet Security Practices

INDUSTRY APPLICATIONS, Indus-trial Power ConverterNEW

P519 Recommended Practices and Re-quirements for Harmonic Control inElectrical Power Systems

NON-IONIZING RADIATION(SCC28)NEW

P1555 Standard for Maximum Levels ofHuman Exposure to ElectromagneticFields, 0 to 3 kHz

Nuclear and Plasma Sciences, Nuclear In-struments & DetectorsNEW

P1557 Standard Test Procedures for Cad-mium-Zinc-Telluride (CZT) and OtherWide Bandgap Semiconductor RadiationDetectors

POWER ENGINEERING, ElectricMachineryREVISION

P112 Standard Test Procedure for Poly-phase Induction Motors and Generators

P666 Design Guide for Electric PowerService Systems for Generating StationsSubstations

P1264 Guide for Animal Deterrents forElectric Power Supply Substations

P1379 Recommended Practice for DataCommunications Between IntelligentElectronic Devices and Remote TerminalUnits in a Substation Surge ProtectiveDevices

PC62.35 Standard Test Specifications forAvalanche Junction SemiconductorSurge Protective Devices Switchgear

PC37.21 Standard for Control Switch-boards

PC37.24 Guide for Evaluating the Effectof Solar Radiation on Outdoor Metal-En-closed Switchgear Transformers

NEW

PC57.123 Guide for Transformer LossMeasurement

PC57.140 Guide for Life Extensions ofPower Transformers

REVISED

PC57.113 Partial Discharge Measure-ment in Liquid-Filled Power Trans-formers and Shunt Reactors

PC57.129 Trial-Use General Require-ments and Test Code for Oil-ImmersedHVDC Converter Transformers Trans-mission & Distribution

P824 Standard for Series CapacitorBanks in Power Systems

STATIONARY BATTERIES (SCC29)REVISED

P535 Standard for Qualification of Class1E Lead Storage Batteries for NuclearPower Generating Stations

TEST AND DIAGNOSIS FOR ELEC-TRIC SYSTEMS (SCC20)NEW

P1552 Structured Architecture for TestStandards

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Call for Papers

RSP’2000Paris, France,

June 21-23 2000http://www-src.lip6.fr/rsp

Important Dates

■ Papers due: January 28, 2000■ Notification of Acceptance: Feb-

ruary 25, 2000■ Final Camera Ready Manuscript

due: March 24, 2000

The Best papers will be selected fora publication in a special issue of aSoftware Engineering journal.

GeneralDescription

The IEEE International Workshopon Rapid System Prototyping (RSP)presents and explores the trends inrapid prototyping of Computer BasedSystems including, but not limited to,distributed, communication, informa-tion, and manufacturing systems. Itaims to bring together researchersfrom both hardware and softwarecommunities to share their experiencewith rapid prototyping and relatedwork. The 11th annual workshop aimsto be opened to various visions andtechniques related to Prototyping andto facilitate sharing of new vision andinnovative techniques related toPrototyping. It will focus on improvedapproaches to resolve prototyping is-sues and problems raised by incom-plete specifications, increased systemcomplexity and reduced time to mar-ket requirements for a multitude of

products. The workshop will includekeynote presentations and formal pa-per sessions with a wide range of sys-tem prototyping topics including, butnot limited to:

■ System Emulation■ System Specification■ Tools for Software Prototyping■ Tools for Hardware Prototyping■ Methodologies for Software

Prototyping■ Methodologies for Hardware

Prototyping■ Prototyping in an engineering

process■ Prototyping of embedded sys-

tems■ Prototyping Case Studies■ Very Large Scale System Engi-

neering■ Integrated telecommunications

systems■ Hardware/Configware Codesign

and tradeoff■ Hardware-Software Codesign■ Very Large Scale System Engi-

neering■ Hardware/Software Tradeoffs■ System Verification/Validation■ Prototype to Product Transition■ Prototyping of Real-Time Sys-

tems■ The Role of FPGAs in System

Prototyping■ Virtual Prototyping

The IEEE Rapid SystemsPrototyping Workshop is co-spon-sored by the IEEE Computer SocietyTechnical Committees on: DesignAutomation, Simulation, Test Tech-nology

SubmissionInstruction

The program committee invitesauthors to submit a full paper. Papersshould clearly describe the nature ofthe work, explain its significance,highlight its novel features, and stateits current status. Authors of selectedpapers will be requested to prepare amanuscript for the workshop proceed-ings. Papers length should not exceed6 pages in the standard IEEE format.For more details see the RSP’2000web site (http://www-src.lip6.fr/rsp).

Electronically submit all papers using:http://www-src.lip6.fr/cgi-bin/review_submit.cgi

Exceptionally, submission may besent via regular mail toDr. Jian GuoSoftware Engineering Group,Naval Postgraduate School,Monterey, CA 93943,Tel: (+1) 831-656-2180Fax: (+1) [email protected]


Meeting Notice

FINAL ANNOUNCEMENT AND CALL FOR PAPERS

Third International Conference on Modelingand Simulation of Microsystems

MSM 2000

US Grant hotel, San DiegoCalifornia, U.S.A.

March 27-29, 2000http://www.cr.org/MSM2000

Abstract Deadline: October 15, 1999

The largest gathering in the fieldworldwide, MSM is the premier tech-nical forum for presenting the latestresearch and development in model-ing and simulation applications andtools in the micro- system, microelec-tronic, semiconductor, sensor, materi-als and biotechnology fields.

MSM 2000 will be held at the U.S.Grant hotel, located in the heart ofdowntown San Diego’s business andcultural district, across from the GasLamp Quarter, and the world famousHorton Plaza, walking distance to The-aters, Restaurants and Harbor, and min-utes from the famed San Diego Zoo,Balboa Park and Seaworld.

The conference will start Sundaylate afternoon with registration and re-ception, and adjourn Wednesday af-ternoon. The Technical Sessions, andvendor exhibition run Monday

through Wednesday. Conference reg-istration and housing will officiallyopen October 15, 1999. Requiredforms and instructions are posted onthe conference web site.

The conference Technical Pro-ceedings, consisting of articles sub-mitted by authors of both oral andposter presentations will be distrib-uted to participants at registration.

In addition to the Technical Pro-gram, an exciting series of SocialEvents are being prepared to allow at-tendees ample opportunity to interactsocially and enjoy the sights andsounds of San Diego.

Visit the WWW-site http://www.cr.org/MSM2000 for informationabout registration, lodging, abstractsubmission, and deadlines. Exhibitoris available. Please address all inqui-ries to [email protected].

Sponsored By:

■ IEEE Electron Devices Society■ Applied Computational Re-

search Society■ CFD Research Corporation■ MemsCap, S.A.■ Microcosm Technologies, Inc.■ Molecular Simulation, Inc.■ Motorola■ Swiss Federal Institute of Tech-

nology of Lausanne■ TIMA-CMP Laboratory, France■ Ibero-American Science and

Technology Education Consor-tium

International Association of Math-ematical and Computer Modelling


in New York and talks regularly with theTelecommunication industry people inRichardson and Plano, Texas. He said Isounded just like them. Remember, Idon’t have an accent. Everyone elsedoes!

Many Thanks

18 October 1999Dear Dr. Fukuda:

On behalf of the IEEE Reliability So-ciety, I would like to thank the TokyoSection and the Tokyo Chapter of theIEEE Reliability Society for hosting ourOctober 1999 AdCom meeting and asso-ciated events in Kyoto and Tokyo. I com-mend both you and Prof. Koichi Inoue forarranging an outstanding program of

meetings and lectures and for providingexcellent hospitality. The visitingAdCom members and I thoroughly en-joyed meeting with the Tokyo Chapterofficers. We were impressed with the en-ergy that the chapter now exhibits. Iwould like to send my special thanks toyou and Prof. Inoue for the extensive per-sonal efforts that both of you made tomake the program the success it was.

Please convey my appreciation to thePresident of Kyoto University and to Dr.Harashima, President of Tokyo Metropoli-tan Institute of Technology, and their staffsfor the excellent special lecture and work-shop arrangements. The visiting AdCommembers and I enjoyed our brief discussionwith Dr. Harashima very much.

Finally, I want to thank the TokyoSection and Tokyo Chapter for taking an-other successful step in the globalizationof IEEE and, in particular, the IEEE Reli-ability Society. As one who as worked ininternational technical projects before, I

recognize the value of including theviews from around the world into the op-erations of the Reliability Society. I lookforward to active participation by you,Prof. Inoue, and other Japanese membersin Reliability Society projects and man-agement.

Sincerely,

Kenneth P. LaSala, Ph.D.

President

IEEE Reliability Society

Share YourKnowledge

Send your articles for the April issueby January 8 2000.

Thanks

Dave Franklin

Editor

From the EditorContinued from page 2

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PU DEVELOPING SOFTWARE 1/2 page adFROM OCT. 99 p 16

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