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    Parametric Study of Microchannel Fabricated

    by Laser Beam Machining

    As part of

    (Flow Boiling Heat Transfer in Microchannels)

    Submitted By

    Harshit Kumar Gupta

    Roll No: 2010078

    Supervisor

    Prof.TanujaSheorey

    MECHANICAL ENGINEERING DESCIPLINE

    INDIAN INSTITUTE OF INFORMATION TECHNOLOGY,

    DESIGN AND MANUFACTURING JABALPUR

    (July 22- August 6 ,2013 )

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    1. IntroductionOver the past few years, laser technology has emerged as a powerful tool in area of

    micromachining [1]. A key advantage of laser micromachining over other conventional

    patterning or etching techniques is the ability to remove materials ranging from ceramics and

    metals to semiconductors and polymers without the need to change tooling or chemicalprocessing. Other notable qualities include lesser thermal distortion i.e. smaller heat affected

    zone (HAZ), better cutting edge, better surface morphology, etc. Amongst available lasers,

    pulsed laser is being used more extensively for micromachining because it enables large

    degree of flexibility in terms of process parameters. Laser pulse may be varied by variation in

    traverse velocity, laser power, pulse frequency, spot size, to name a few. To obtained

    microchannel of requisite depth, width, surface roughness above parameters need to be

    chosen judiciously [2, 3]. In the present work effect of process parameters on fabricated

    microchannel has been shown.

    2. Present InvestigationIn this phase, primary focus was on fabrication of microchannel of designed dimensions with

    EPILOG laser cutting machine and characterization of its process parameters to obtain desired

    microchannel. To get proper understanding of process parameters, experiment were

    performed based upon design of experiments (DOE) made in last stage, which is shown

    below in table 1.

    2.1 Design of Experiments (DOE)

    Material: Plexiglas

    Desired dimensions of cut: 2cm x 50 x75

    Profile Required

    S.No Velocity

    Settings

    (%)

    Power

    Settings

    (%)

    Frequency

    Settings

    (Hz)

    Spot

    settings

    (inches)

    Aim of study

    1 20% 10 % 2500 0.002" Effect of power

    2 20% 30% 2500 0.002 Effect of power

    3 20 15 2500 0.002 Effect of power

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    Table 1: Design of expeiments

    The microchannels fabricated were then analysed regarding their shape, accuracy of the

    dimensions with the use of SEM at PDPM IIITDM Jabalpur. Results for which are shown in

    next section alongwith the discussion on emerging effects.

    3. Results and Disscussions

    S.No SEM Image Remarks

    In this a reference was created for

    benchmarking further results.

    Material is being removed form of

    spherical cavity thats why channel

    formed is having spherical cross

    section, making it more useful.

    Fig 1. SEM image of microchannel with 20% Velocity/20% Power/

    2500 Hz Freq/ 0.002 spot size settings

    4 15 20 2500 0.002 Effect of velocity

    5 25 20 2500 0.002 Effect of velocity

    6 20 20 3500 0.002 Effect of pulse frequency

    7 20 20 1500 0.002 Effect of pulse frequency

    8 20 20 2500 0.003 Effect of spot size on width of cut (kerf

    width)and depth

    9 20 20 20 0.002 Effect of traversing twice the same

    section on surface morphology

    10 15 25 2500 0.002 Combined effect

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    1a. Channel is having reasonable surfacefinish but it is having material

    deposition at the centre of

    microchannel due to melting and

    resolidification. Material removal in

    LBM is by two mechanisms namely

    melting and/or vapourization. Due to

    improper cooling, molten metal getsolidified before getting vapourized,

    leading to material deposition hence

    degrading surface finish. Also kerf

    width obtained is within desired

    accuracy.

    Fig 1a. SEM image of microchannel with 20% Velocity/20% Power/

    2500 Hz Freq/ 0.002 spot

    2. With increase in power input ,depth of increases from 163 m to

    360 m because larger power

    leads more concentrated energyhence more penetration. But cross

    section of channel is not purely

    circular .There is increase in melting

    of neighborhood region as well due

    to increase in power which can be

    seen in

    Fig 2. SEM image of microchannel with 20% Velocity/30% Power/

    2500 Hz Freq/ 0.002 spot

    3. In this effect of reduction of powerwas analysed. With reduction in

    power input, smaller depth along

    with smaller HAZ region has been

    obtained.

    Fig 3. SEM image of microchannel with 20% Velocity/15 % Power/

    2500 Hz Freq/ 0.002 spot

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    4. In this effect of reduction in traversevelocity was analysed. Comparing

    with fig 1 with reduction in traverse

    velocity, laser will be concentrating

    at a point for larger time, hence leads

    to more penetration. Smaller HAZ is

    obtained in comparison with fig 2

    due to lesser intensity.

    Fig 4. SEM image of microchannel with 15% Velocity/20% Power/

    2500 Hz Freq/ 0.002 spot

    5. In this effect of increase in traverse

    velocity was analysed. Due toincrease in velocity, material is

    reaching to molten state but not

    vaporizing as the exposure time to

    the laser light at each position

    becomes shorter. There is not

    enough time for temperature rise

    and/or photon-matter interaction,

    leading to degradation of surface

    finish [4].

    Fig 5. SEM image of microchannel with 25% Velocity/20% Power/

    2500 Hz Freq/ 0.002 spot

    6. In this effect of increase in pulsefrequency was analysed. By

    increasing the pulse frequency of the

    laser during cutting, a smoother cut

    was created. Partly this is due to the

    increased pulse frequency taking

    smaller bites out of the material likea fine tooth saw blade. The more

    frequent laser pulses also create

    more localized heat which melts the

    area smooth. There is almost no

    change in depth [4].

    Fig 6. SEM image of microchannel with 20% Velocity/20% Power/

    3500 Hz Freq/ 0.002 spot

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    7.

    Fig7. SEM image of microchannel with 20% Velocity/20% Power/

    1500 Hz Freq/ 0.002 spot8 In this effect of increase in spot size

    was analyzed. With increase in spotsize, intensity decreases leading to

    decrease in depth and smaller HAZ.

    Also change in kerf width need to be

    analyzed by taking top view SEM

    image of channel.

    Fig 8. SEM image of microchannel with 20% Velocity/20% Power/

    2500 Hz Freq/ 0.003 spot

    9a. In this effect of traversing the sameprofile twice was analysed.When

    laser was allowed to traverse same

    path twice, deposited material was

    drained off during second stroke,

    leading to no central deposition and

    hence smoother channel (Fig9b).However increase in depth was

    found because same amount of

    power was given twice.

    In comparision with fig 1 HAZ

    obtained is very small.

    Fig 9a. SEM image of microchannel with Traversing Twice 20%

    Velocity/20% Power/ 2500 Hz Freq/ 0.002 spot

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    9b.

    Fig 9b. SEM image of microchannel with Traversing Twice 20%

    Velocity/20% Power/ 3500 Hz Freq/ 0.002 spot

    10. In this combined effect of velocity

    and power is analysed. With increasein velocity and reduction in power

    depth reduces by larger factor as

    both the factors are leading to

    decrease in intensity at a point.

    Fig 9. SEM image of microchannel with 25% Velocity/15% Power/

    3500 Hz Freq/ 0.002 spot

    4. Conclusiona) For any given traverse velocity, spot size and frequency, increasing power

    increases depth but also increases unwanted HAZ.

    b) Variation in traverse velocity van control depth without affecting much HAZ. Sotraverse velocity can control depth better than power.

    c) Microchannel with best surface finish can be obtained by increasing pulsefrequency and by cutting channel with two strokes repeating one over other and

    power and velocity settings to cut almost up to half depth

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    d) Increase in power, decrease in velocity, and decrease in spot size leads to increasein depth while opposite change leads to reduction in depth while depth is almost

    independent of pulse frequency.

    e) Kerf width increases with increase in spot size while it is almost independent ofother parameters.

    4.2 Futuristic Direction

    In the next phase the task is to fabricate requisite microchannel by fixing process parameters

    along with two reservoirs to make it flow .

    4.3 References

    [1] N Prabhat, D Gupta, Fabrication and Analysis of microchannels Department of

    Mechanical Engineering, Indian Institute of Technology Bombay.

    [2] Dr. V.K Jain Laser Beam Machining, Advanced Machining Processes, Allied

    Publishers Mumbai, 2002

    [3] B. Pratap, C.B. Arnold and A. Piqu, Depth And Surface Roughness Control On Laser

    Micromachined Polyimide For Direct-Write Deposition, SPIE MF 2003, Jan 20-24, 2003,

    San Jose CA, Proceedings Vol. 4979, 217-226(2003)

    [4] Xianghua Wang, Giuseppe Yickhong Mak and Hoi Wai Choi,Laser Micromachining and

    Micro-Patterning with a Nanosecond UV Laser, Micromachining Techniques for Fabrication

    of Micro and Nano Structures.