r4_2010078
TRANSCRIPT
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Parametric Study of Microchannel Fabricated
by Laser Beam Machining
As part of
(Flow Boiling Heat Transfer in Microchannels)
Submitted By
Harshit Kumar Gupta
Roll No: 2010078
Supervisor
Prof.TanujaSheorey
MECHANICAL ENGINEERING DESCIPLINE
INDIAN INSTITUTE OF INFORMATION TECHNOLOGY,
DESIGN AND MANUFACTURING JABALPUR
(July 22- August 6 ,2013 )
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1. IntroductionOver the past few years, laser technology has emerged as a powerful tool in area of
micromachining [1]. A key advantage of laser micromachining over other conventional
patterning or etching techniques is the ability to remove materials ranging from ceramics and
metals to semiconductors and polymers without the need to change tooling or chemicalprocessing. Other notable qualities include lesser thermal distortion i.e. smaller heat affected
zone (HAZ), better cutting edge, better surface morphology, etc. Amongst available lasers,
pulsed laser is being used more extensively for micromachining because it enables large
degree of flexibility in terms of process parameters. Laser pulse may be varied by variation in
traverse velocity, laser power, pulse frequency, spot size, to name a few. To obtained
microchannel of requisite depth, width, surface roughness above parameters need to be
chosen judiciously [2, 3]. In the present work effect of process parameters on fabricated
microchannel has been shown.
2. Present InvestigationIn this phase, primary focus was on fabrication of microchannel of designed dimensions with
EPILOG laser cutting machine and characterization of its process parameters to obtain desired
microchannel. To get proper understanding of process parameters, experiment were
performed based upon design of experiments (DOE) made in last stage, which is shown
below in table 1.
2.1 Design of Experiments (DOE)
Material: Plexiglas
Desired dimensions of cut: 2cm x 50 x75
Profile Required
S.No Velocity
Settings
(%)
Power
Settings
(%)
Frequency
Settings
(Hz)
Spot
settings
(inches)
Aim of study
1 20% 10 % 2500 0.002" Effect of power
2 20% 30% 2500 0.002 Effect of power
3 20 15 2500 0.002 Effect of power
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Table 1: Design of expeiments
The microchannels fabricated were then analysed regarding their shape, accuracy of the
dimensions with the use of SEM at PDPM IIITDM Jabalpur. Results for which are shown in
next section alongwith the discussion on emerging effects.
3. Results and Disscussions
S.No SEM Image Remarks
In this a reference was created for
benchmarking further results.
Material is being removed form of
spherical cavity thats why channel
formed is having spherical cross
section, making it more useful.
Fig 1. SEM image of microchannel with 20% Velocity/20% Power/
2500 Hz Freq/ 0.002 spot size settings
4 15 20 2500 0.002 Effect of velocity
5 25 20 2500 0.002 Effect of velocity
6 20 20 3500 0.002 Effect of pulse frequency
7 20 20 1500 0.002 Effect of pulse frequency
8 20 20 2500 0.003 Effect of spot size on width of cut (kerf
width)and depth
9 20 20 20 0.002 Effect of traversing twice the same
section on surface morphology
10 15 25 2500 0.002 Combined effect
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1a. Channel is having reasonable surfacefinish but it is having material
deposition at the centre of
microchannel due to melting and
resolidification. Material removal in
LBM is by two mechanisms namely
melting and/or vapourization. Due to
improper cooling, molten metal getsolidified before getting vapourized,
leading to material deposition hence
degrading surface finish. Also kerf
width obtained is within desired
accuracy.
Fig 1a. SEM image of microchannel with 20% Velocity/20% Power/
2500 Hz Freq/ 0.002 spot
2. With increase in power input ,depth of increases from 163 m to
360 m because larger power
leads more concentrated energyhence more penetration. But cross
section of channel is not purely
circular .There is increase in melting
of neighborhood region as well due
to increase in power which can be
seen in
Fig 2. SEM image of microchannel with 20% Velocity/30% Power/
2500 Hz Freq/ 0.002 spot
3. In this effect of reduction of powerwas analysed. With reduction in
power input, smaller depth along
with smaller HAZ region has been
obtained.
Fig 3. SEM image of microchannel with 20% Velocity/15 % Power/
2500 Hz Freq/ 0.002 spot
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4. In this effect of reduction in traversevelocity was analysed. Comparing
with fig 1 with reduction in traverse
velocity, laser will be concentrating
at a point for larger time, hence leads
to more penetration. Smaller HAZ is
obtained in comparison with fig 2
due to lesser intensity.
Fig 4. SEM image of microchannel with 15% Velocity/20% Power/
2500 Hz Freq/ 0.002 spot
5. In this effect of increase in traverse
velocity was analysed. Due toincrease in velocity, material is
reaching to molten state but not
vaporizing as the exposure time to
the laser light at each position
becomes shorter. There is not
enough time for temperature rise
and/or photon-matter interaction,
leading to degradation of surface
finish [4].
Fig 5. SEM image of microchannel with 25% Velocity/20% Power/
2500 Hz Freq/ 0.002 spot
6. In this effect of increase in pulsefrequency was analysed. By
increasing the pulse frequency of the
laser during cutting, a smoother cut
was created. Partly this is due to the
increased pulse frequency taking
smaller bites out of the material likea fine tooth saw blade. The more
frequent laser pulses also create
more localized heat which melts the
area smooth. There is almost no
change in depth [4].
Fig 6. SEM image of microchannel with 20% Velocity/20% Power/
3500 Hz Freq/ 0.002 spot
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7.
Fig7. SEM image of microchannel with 20% Velocity/20% Power/
1500 Hz Freq/ 0.002 spot8 In this effect of increase in spot size
was analyzed. With increase in spotsize, intensity decreases leading to
decrease in depth and smaller HAZ.
Also change in kerf width need to be
analyzed by taking top view SEM
image of channel.
Fig 8. SEM image of microchannel with 20% Velocity/20% Power/
2500 Hz Freq/ 0.003 spot
9a. In this effect of traversing the sameprofile twice was analysed.When
laser was allowed to traverse same
path twice, deposited material was
drained off during second stroke,
leading to no central deposition and
hence smoother channel (Fig9b).However increase in depth was
found because same amount of
power was given twice.
In comparision with fig 1 HAZ
obtained is very small.
Fig 9a. SEM image of microchannel with Traversing Twice 20%
Velocity/20% Power/ 2500 Hz Freq/ 0.002 spot
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9b.
Fig 9b. SEM image of microchannel with Traversing Twice 20%
Velocity/20% Power/ 3500 Hz Freq/ 0.002 spot
10. In this combined effect of velocity
and power is analysed. With increasein velocity and reduction in power
depth reduces by larger factor as
both the factors are leading to
decrease in intensity at a point.
Fig 9. SEM image of microchannel with 25% Velocity/15% Power/
3500 Hz Freq/ 0.002 spot
4. Conclusiona) For any given traverse velocity, spot size and frequency, increasing power
increases depth but also increases unwanted HAZ.
b) Variation in traverse velocity van control depth without affecting much HAZ. Sotraverse velocity can control depth better than power.
c) Microchannel with best surface finish can be obtained by increasing pulsefrequency and by cutting channel with two strokes repeating one over other and
power and velocity settings to cut almost up to half depth
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d) Increase in power, decrease in velocity, and decrease in spot size leads to increasein depth while opposite change leads to reduction in depth while depth is almost
independent of pulse frequency.
e) Kerf width increases with increase in spot size while it is almost independent ofother parameters.
4.2 Futuristic Direction
In the next phase the task is to fabricate requisite microchannel by fixing process parameters
along with two reservoirs to make it flow .
4.3 References
[1] N Prabhat, D Gupta, Fabrication and Analysis of microchannels Department of
Mechanical Engineering, Indian Institute of Technology Bombay.
[2] Dr. V.K Jain Laser Beam Machining, Advanced Machining Processes, Allied
Publishers Mumbai, 2002
[3] B. Pratap, C.B. Arnold and A. Piqu, Depth And Surface Roughness Control On Laser
Micromachined Polyimide For Direct-Write Deposition, SPIE MF 2003, Jan 20-24, 2003,
San Jose CA, Proceedings Vol. 4979, 217-226(2003)
[4] Xianghua Wang, Giuseppe Yickhong Mak and Hoi Wai Choi,Laser Micromachining and
Micro-Patterning with a Nanosecond UV Laser, Micromachining Techniques for Fabrication
of Micro and Nano Structures.