quality assurance and certification

QUALITY SYSTEM OVERVIEW–LYNNWOOD AND KAOHSIUNG• Our Lynnwood and Kaohsiung facilities are on the Defense Logistics Agency’s (DLA) Qualified Manufacturers List (QML) of hybrid microcircuits with products compliant up to Class H (Lynnwood and Kaohsiung) and Class K (Lynnwood) of MIL-PRF-38534. Our manufacturing facilities are audited by a US government organization with customer participation. Classes H and K, MIL-PRF-38534 Certificate, Hybrid Microcircuits, FSC 5962, VQ(VQH-21-035667) for Lynnwood.

• The quality management system of Crane Electronics, Inc., Lynnwood and Crane Electronics Corporation, Kaohsiung have been certified to ISO 9001:2015 and AS9100D on certificates 1655 and 1657 by the International Standards Authority, Inc. (www.isaregistrar.com)

• Standard Microcircuit Drawings (SMD) of our DC-DC converters are available to Class H and K of MIL-PRF-38534. DLA Drawing EMI filters are available to Class H and K of MIL-PRF-38534. The government documents may be viewed at https://landandmaritimeapps.dla.mil/programs/smcr/.

• Components and materials used in product assembly are purchased against published revision controlled source control drawings (SCD). Characteristics and allowed suppliers are controlled by specific SCDs. A system is in place to review components and materials prior to stocking. Instruments such as the X-ray fluorescence (XRF) are used to ensure that supplier certifications accurately describe the material. Our high reliability QML products comply with MIL-PRF-38534 specifications, which do not allow the use of pure tin. Our other products may have pure tin. Refer to our “Lead and Other RoHS Materials” letter for more information.

• Documented revision controlled procedures and work instructions are in use for all operations that affect quality.

• Radiation hardness assurance (RHA) levels available referenced to MIL-PRF-38534. Our Lynnwood facility has a DLA approved RHA plan for Interpoint power products. Our SMD products with RHA “P,” “L”, “R” and “H” levels meet DLA RHA requirements.

• Travelers are used to sequence and control operations at in-process, final and special inspection situations.

• Quality documents are specifically identified and retained as specified in our document control procedure. The standard retention period for critical documents is 15 years.

• Quality manual QA-040 (www.interpoint.com/012) is the controlling document for the quality system.

• Personnel performing quality functions are given the responsibility, authority and organizational freedom to identify and evaluate quality concerns as well as to initiate corrective action.

• Contracts are reviewed to identify and make timely provisions for special or unusual circumstances.

• As a minimum, self audits of the quality system are completed annually.

The application note is an overview of the Crane quality system for Interpoint® products. It includes a list of certifications and qualifications, an explanation of our model numbering system and tables of the screening levels offered.

Lynnwood CLass H and K CertifiCate KaoHsiung CLass H dLa Letter

MIL-PRF-38534

IS HEREBY AWARDED TO

THIS CERTIFICATION IS VALID UNTIL TERMINATED BY WRITTEN NOTIFICATION FROM DLA LAND AND MARITIME. REFERENCE DLA LAND AND MARITIME LETTER VQ(VQH-21-035667) FOR DETAILS PERTAINING TO THIS CERTIFICATION.

Crane Electronics, Inc. 16700 13th Avenue West

Lynnwood, Washington 98037

EUGENE WILLIAMS JR. Director Engineering & Technical Support Directorate (V) DLA, Land & Maritime

HYBRID MICROCIRCUIT CERTIFICATION FOR

CLASSES H and K

WILLIAMS.EUGENE.1180650748

Digitally signed by WILLIAMS.EUGENE.1180650748Date: 2020.11.17 15:21:30 -05'00'

DDEEFFEENNSSEE LLOOGGIISSTTIICCSS AAGGEENNCCYY LAND AND MARITIME

POST OFFICE BOX 3990 COLUMBUS, OH 43218-3990

Mr. Dale Fakkema September 4, 2018Crane Electronics, Inc.P.O. Box 97005Redmond, WA 98073-9705

Dear Mr. Fakkema:

Re: Class H Manufacturer Certification, Hybrid Microcircuits, MIL-PRF-38534, FSC 5962,VQ(VQH-18-032974) , CN 064074

Your hybrid facility at No.198, Xinsheng Rd., Qianzhen Dist., Kaohsiung City 80672, Taiwan (R.O.C.) was sample audited the week of March 21-23, 2018 for compliance with the requirements of MIL-PRF-38534.

An acceptable level of confidence has been established that the compliance with these requirements exists. Therefore, Crane Electronics Corporation is considered a certified Classes H manufacturer (certificate enclosed) effective August 30, 2018 retaining a Certification effective date of September 10, 1997.

This certification is for the following:

a. Product Assurance Program Plan: QA-083 Rev. AL.

b. Conversion of Customer Requirements: ENG-002 Rev. AT.

c. Controlled documentation baseline for processing MIL-PRF-38534 devices: QA-039 Rev. AP.

This certification is valid until terminated by written notification from the qualifying activity. The normal period of certification is two years from the date of the audit and, if warranted, may be withdrawn by DLA Land and Maritime-VQ at any time. Your facility may be re-audited on a drop-in basis at any time.

All screening, qualification, conformance, and periodic inspection must be performed at a facility, which has a DLA Land and Maritime-VQ letter of Laboratory Suitability for the applicable test method and condition.

If you have any questions, please contact Mr. Barker at (614) 692-0596.

Sincerely,

ALAN WILLChiefSourcing and Qualifications Division

WILL.ALAN.J.1230187076

Digitally signed by WILL.ALAN.J.1230187076 Date: 2018.09.06 13:11:21 -04'00'

Crane Aerospace & Electronics Power Solutions

Quality Assurance and Certification

APP-009 Rev AN - 2021.03.29Crane Aerospace & ElectronicsPower Solutions – Interpoint® Products16706 13th Avenue West, Lynnwood, WA 98037+1 425-882-3100 • [email protected]/interpoint

of 21

AppLICATION NOTE fOR INTERpOINT® pRODUCTS

QUALITY ASSURANCE CERTIfICATIONS AND STANDARDS LYNNWOOD AND KAOHSIUNG• ANSI/ESD S20.20—Electrostatic Discharge Control Program. We use a multi-level ESD damage prevention approach including operator training, continuously monitoring wrist grounding-straps, static dissipative smocks for personnel, static dissipative work surfaces and floors, air ionizers at work stations and faraday cages for parts movement.

• ANSI/IPC-A-600—Acceptability of Printed Boards

• ANSI/IPC-A-610—Acceptability of Electronic Assemblies. The Lynnwood facility has IPC-610 certified operators.

• ANSI-Z540—Calibration Laboratories and Measuring and Test Equipment—General Requirements

• ASQC-Z1.4—Procedures, Sampling and Tables for Inspection by Attributes

• ISO 9001/AS9100 Quality Systems—Model for quality assurance in design, development, production, installation, and servicing. Lynnwood and Kaohsiung facilities are registered with International Standards Authority (ISA) accredited by ANAB.

• ISO 14644—Cleanrooms and Controlled Environments. Particle count monitoring, laminar flow benches and contamination preventing smocks for personnel all contribute to maintaining the required levels of cleanliness.

• MIL-STD-883—Test Method Standard for Microcircuits

• MIL-PRF-38534—Hybrid Microcircuits, General Specifications for

• Quality Certification—Employees who work with products are individually certified in the required skills. Training and certification are documented and records are maintained. Inspectors are tested for color vision and visual acuity.

• QML-38534—Qualified Manufacturer’s List of Products Qualified under Performance Specification MIL-PRF-38534 Hybrid Microcircuits, General Requirements for

• Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment (WEEE) and Registration, Evaluation, and Authorization of Chemicals (REACh) are addressed in “Lead and Other RoHS Materials”.




of 21APP-009 Rev AN - 2021.03.29

www.craneae.com/interpoint

pART NUMBERING Our part numbering indicates the series (family), input voltage, output voltage, number of outputs, package configu-ration and screening level. The screening and RHA levels found in this Quality Assurance document appear at the right end of the part number. Products with standard screening do not have a screening level in the part number: e.g. MTR2812D is the MTR Series™ 28 volt input (nominal), ±12 volt outputs, flanged package and standard screening. Refer to individual datasheets to determine what screening options are available for a particular product. Screening methods are referenced to MIL-STD-883 per MIL-PRF-38534.

MTR 28 12 D F /883 Base Model

Input Voltage

Output Voltage

Screening

Number of Outputs

Case/Lead Option(Standard case has no designator in thisposition. F=flanged model; U, V, W, Y and Zrefer to various options on select products. See individual products for more information.)

(S = single, D = dual, T = triple)

(Main and aux. VOUT for triple models)

(Standard screening has no designatorin this position. See screening levels at right.)

The example shows an MTR, 28 Vin, ±12 Vout, flanged case with /883 (Class H) screening. MTR2812D/883 is a model in the MTR Series™.

SMHF 28 05 S F / K RBase Model

Input Voltage

Output Voltage

Environmental Screening

Number of Outputs(S = single, D = dual)

Radiation HardnessAssurance (RHA)

Case Option(Non-flanged case has no designator in this position)

The example below shows an SMHF, 28 Vin, +5 Vout, flanged case, Class K screening and RHA level R. SMHF2805SF/KR is a model in the SMHF Series™.

Notes1. RHA “H” applies to filters only. Our EMI filters are designed with passive

components providing maximum tolerance for space environment requirements. RHA “H” is defined as radiation tolerant up to 1000 krad(Si) total dose.

2. Non-QML products “O” may not meet all of the requirements of MIL-PRF-38534.

If ordering by model number add a “-Q” to request solder dipped leads (e. g. SMHF2805SF/KR-Q).

Table 1: environmenTal Screening (non Space)

Screening (/) DeScripTion

883 Class H, QML, has an SMD number, marked with “QML”. Class H, QML, products that do not have an SMD number, marked with “CH”. Qualified by similarity.

SX 1, 2 MIL-STD-883 screening, non QML, marked with “SX”.

ES 2 Extended screening, per the product’s datasheet.

Standard 2 Standard screening, per the product’s datasheet.

1. “SX’” screening is only available on specific models. Refer to the Series’ datasheet. 2. Non-compliant products may not meet all of the requirements of

MIL-PRF-38534.

Table 2: Screening anD rHa levelS, Space proDucTS

level DeScripTion of levelS

KR Class K, QML, RHA level R, 100 krad(Si)

KL Class K, QML, RHA level L, 50 krad(Si)

KP Class K, QML, RHA level P, 30 krad(Si)

HR Class H, QML, RHA level R, 100 krad(Si)

HL Class H, QML, RHA level L, 50 krad(Si)

HP Class H, QML, RHA level P, 30 krad(Si)

KH Class K, QML, filters only RHA level H 1

HH Class H, QML, filters only RHA level H 1

BR Class K screening, non-QML2, RHA level R, 100 krad(Si)

BL Class K screening, non-QML2, RHA level L, 50 krad(Si)

BP Class K screening, non-QML2, RHA level P, 30 krad(Si)

AR Class H screening, non-QML2, RHA level R, 100 krad(Si)

AL Class H screening, non-QML2, RHA level L, 50 krad(Si)

AP Class H screening, non-QML2, RHA level P, 30 krad(Si)

OO Space prototype, screening (non-QML2) per the product’s datasheet. “O” in the RHA designator position in Interpoint model numbers indicates DLA RHA “-” defined as no RHA.




of 21APP-009 Rev AN - 2021.03.29


SCREENING TABLES

“Table 3: Environmental Screening Space DC-DC Converters Prototype, Class H and K” ................page 5

“Table 4: Space Radiation Hardness Assurance DC-DC Converters Class H and K, RHA P, L and R” ..........................................................................................................................................................page 6

“Table 5: Environmental Screening Space DC-DC Converters Prototype, A and B” .........................page 7

“Table 6: Space Radiation Hardness Assurance DC-DC Converters A and B non-QML RHA P, L and R” ..........................................................................................................................................................page 8

“Table 7: Environmental Screening Space EMI Filters Prototype, Class H and K, RHA H” ...............page 9

“Table 8: Environmental Screening High Reliability DC-DC Converters and EMI Filters Standard, /ES, /SX and /883 (Class H)” .................................................................... page 10

Appendix A: Element Evaluation Tables 1 ......................................................................................... page 11

“Table A: Microcircuit Dice Evaluation Requirements” (Table C-II) ......................................... page 12

“Table B: Semiconductor Dice Evaluation Requirements” (Table C-II-1) ................................ page 13

“Table C: Wire Bondable and Surface Mount Resistors” (Table C-III) ..................................... page 16

“Table D: Chip Capacitors, Solid Tantalum” (Table C-III-2) ................................................ page 18

“Table E: Coils, Transformers” (Table C-III-4)2 ............................................................................. page 20

1. Referenced MIL-PRF-38534 table is listed in parentheses. 2, Table E applies to purchased magnetics. It does not apply to magnetics made in-house by Crane which are made on a qualified line and do

not require additional Element Evaluation.




of 21APP-009 Rev AN - 2021.03.29


Table is for reference only. See individual Series' datasheets for specific screening.

Table 3: environmenTal Screening Space Dc-Dc converTerS proToType, claSS H anD K


environmentaL sCreening spaCe dC-dC Converters prototype, CLass H and K

non-QmL 1 QmL 2, 3

test performed prototype (/o) 4 CLass H (/H) CLass K (/K)

Non-destruct wire bond pull, Method 2023 ■ 5 ■

pre-cap Inspection, Method 2017, 2032 ■ ■ ■

Temperature Cycle (10 times)

Method 1010, Cond. C, -65°C to +150°C, ambient ■ ■ ■

Constant Acceleration

Method 2001, 3000 g ■ ■ ■

pIND, Test Method 2020, Cond. A ■ 5 ■

pre burn-in test, Group A, Subgroups 1 and 4 ■ ■ 5 ■

Burn-in Method 1015, +125°C case, typical 6

96 hours ■

160 hours ■

2 x 160 hours (includes mid-BI test) ■

final Electrical Test, MIL-pRf-38534, Group A,

Subgroups 1 and 4: +25°C case ■

Subgroups 1 through 6, -55°C, +25°C, +125°C case ■ ■

Hermeticity Test, Method 1014

Gross Leak, Cond. B2, Kr85 ■

Gross Leak, Cond. C1, fluorocarbon ■ ■

Fine Leak, Cond. B1, Kr85 ■

Fine Leak, Cond. A2, helium ■ ■

Radiography, Method 2012 ■

post Radiography Electrical Test, +25°C case ■ 5

final visual inspection

Method 2009 of MIL-STD-883 ■ ■

Magnification 1X 7 ■

Test methods are referenced to MIL-STD-883 as determined by MIL-PRF-38534.

Notes1. Non-QML prototype products may not meet all of the requirements of

MIL-PRF-38534.2. All processes are QML qualified and performed by certified operators. 3. Class H or K QML products that have no SMD number are marked “CHP, CHL, CHR,

CKP, CKL or CKR” per MIL-PRF-38534, Table III instead of “QML”.4. “O” in the RHA designator position in Interpoint model numbers indicates DLA RHA “-”

defined as no RHA.

5. Not required by DLA but performed to assure product quality.6. Burn-in temperature designed to bring the case temperature to +125°C minimum.

Burn-in is a powered test. 7. Visual inspection is performed per an internal document. Product may contain

cosmetic irregularities such as dents, dings, scratches, etc. that do not affect form, fit or function.

Table 2: environmenTal Screening Space Dc-Dc converTerS proToType, claSS H anD K



of 21APP-009 Rev AN - 2021.03.29




Table 4: Space raDiaTion HarDneSS aSSurance Dc-Dc converTerS claSS H anD K, rHa p, l anD r


spaCe radiation Hardness assuranCe dC-dC Converters CLass H and K, rHa 1 p, L and r

QmL 2

CLass H CLass K

QuaLifiCation per miL-std /Hp /HL /Hr /Kp /KL /Kr

RHA p: 30 krad(Si) total dose 3, 4 ■ ■

RHA L: 50 krad(Si) total dose 3, 4 ■ ■

RHA R: 100 krad(Si) total dose 3, 4 ■ ■

SEE, LET 86 MeV cm2/mg 5 ■ ■ ■ ■ ■ ■


Notes1. DLA has approved the RHA plan for Interpoint power products. Our SMD products with

RHA “P”, “L” or “R” code meet DLA requirements. 2. Class H or K QML products that have no SMD number are marked “CHP, CHL, CHR,

CKP, CKL or CKR” per MIL-PRF-38534, Table III instead of “QML”.3. Radiation sensitive components internal to the devices are procured with radiation

guarantees or undergo radiation lot acceptance testing (RLAT) performed per condition A, method 1019 of MIL-STD-883.

4. Representative devices were initially High Dose Rate (HDR) tested using condition A of method 1019 of MIL-STD 883 to ensure RHA designator levels. Representative devices have also been Low Dose Rate (LDR) tested using condition D of method 1019 of MIL-STD-883 to the RHA designator levels. Representative devices will also be re-tested after design or process changes that can affect RHA response of this device.

5. Single event testing was performed on a converter to 86 MeV-cm2/mg using 15 MeV/nucleon gold ions with no latch-up, burn-out, functional interrupts, or gate ruptures exhibited. Single event upsets (output voltage transients) may be present up to 86 MeV-cm2/mg.

Table 3: Space raDiaTion HarDneSS aSSurance Dc-Dc converTerS claSS H anD K, rHa p, l anD r



of 21APP-009 Rev AN - 2021.03.29




Table 5: environmenTal Screening Space Dc-Dc converTerS proToType, a anD b

environmentaL sCreening spaCe dC-dC Converters prototype, a and B.

non-Qml 1, 2

proToType a b

TeST performeD /oo 3 /a /b

Non-destruct wire bond pull, Method 2023 n 4 n

Pre-cap Inspection, Method 2017, 2032 n n n


Method 1010, Cond. C, -65°C to +150°C, ambient n n n


Method 2001, 3000 g n n n

PIND, Test Method 2020, Cond. A n 4 n

Pre burn-in test, Group A, Subgroups 1 and 4 n n 4 n


96 hours n

160 hours n

2 x 160 hours (includes mid-BI test) n

Final Electrical Test, MIL-PRF-38534, Group A,

Subgroups 1 and 4: +25°C case n

Subgroups 1 through 6, -55°C, +25°C, +125°C case n n


Gross Leak, Cond. B2, Kr85 n

Gross Leak, Cond. C1, fluorocarbon n n

Fine Leak, Cond. B1, Kr85 n

Fine Leak, Cond. A2, helium n n

Radiography, Method 2012 n

Post Radiography Electrical Test, +25°C case n 4

Final visual inspection, Method 2009

Method 2009 of MIL-STD-883 n n

Magnification 1X 6 n


Notes1. Non-QML prototype products may not meet all of the requirements of

MIL-PRF-38534.2. All processes are QML qualified and performed by certified operators. A and B are

only available on select models.3. “O” in the RHA designator position in Interpoint model numbers indicates DLA RHA “-”

defined as no RHA.


Burn-in is a powered test. 6. Visual inspection is performed per an internal document. Product may contain




of 21APP-009 Rev AN - 2021.03.29




spaCe radiation Hardness assuranCe sCreening dC-dC Converters a and B, rHa 1 p, L and r

non-Qml 2

a b

QualificaTion per mil-STD /ap /al /ar /bp /bl /br

RHA P: 30 krad(Si) total dose 3,4 n n

RHA L: 50 krad(Si) total dose 3,4 n n

RHA R: 100 krad(Si) total dose 3,4 n n

SEE, LET 86 MeV cm2/mg 5 n n n n n n


Table 6: Space raDiaTion HarDneSS aSSurance Dc-Dc converTerS a anD b non-Qml rHa p, l anD r


RHA “P”, “L” or “R” code meet DLA requirements. 2. Non-QML products may not meet all of the requirements of

MIL-PRF-38534.3. Radiation sensitive components internal to the devices are procured with radiation

guarantees or undergo radiation lot acceptance testing (RLAT) performed per condition A, method 1019 of MIL-STD-883.

4. Representative devices were initially High Dose Rate (HDR) tested using condition A of method 1019 of MIL-STD 883 to ensure RHA designator levels. Representative devices have also been Low Dose Rate (LDR) tested using condition D of method 1019 of MIL-STD-883 to the RHA designator levels. Representative devices will also be re-tested after design or process changes that can affect RHA response of this device.

5. Single event testing was performed on a converter to 86 MeV-cm2/mg using 15 MeV/nucleon gold ions with no latch-up, burn-out, functional interrupts, or gate ruptures exhibited. Single event upsets (output voltage transients) may be present up to 86 MeV-cm2/mg.



of 21APP-009 Rev AN - 2021.03.29




Table 7: environmenTal Screening Space emi filTerS proToType, claSS H anD K, rHa H


Table 5: environmenTal Screening Space emi filTerS proToType, claSS H anD K, rHa H


RHA “H” code meet DLA requirements. 2. Non-QML products, prototype (OO), may not meet all of the requirements of MIL-PRF-

38534. 3. All processes are QML qualified and performed by certified operators.4. Class H or K QML products that have no SMD number are marked “CHH, CKH” per

MIL-PRF-38534, Table III instead of “QML”.5. “O” in the RHA designator position in Interpoint model numbers indicates DLA RHA “-”

defined as no RHA6. Our EMI filters are designed exclusively with passive components providing maximum

tolerance for space environment requirements.


Burn-in is a powered test.9. Visual inspection is performed per an internal document. Product may contain


10. Interpoint EMI filters are designed exclusively with passive components providing maximum tolerance for space environment requirements. RHA level H is guaranteed to 1000 krad(Si).

environmentaL sCreening spaCe emi fiLters prototype, CLass H and K, rHa 1 Hnon-QML 2 QmL 3, 4

prototype 5 CLass H CLass K

test performed /oo 6 /HH 6 /KH 6

pre-cap Inspection, Method 2017, 2032 ■ ■ ■


Method 1010, Cond. C, -65°C to +150°C, ambient ■ ■ ■

Constant Acceleration, Method 2001, 3000 g ■ ■ ■

pIND, Test Method 2020, Cond. A ■ 7 ■

pre burn-in test, Group A, Subgroups 1 and 4 ■ ■ ■


96 hours ■

160 hours ■

2 x 160 hours (includes mid-BI test) ■


Subgroups 1 and 4: +25°C case ■



Gross Leak, Cond. B2, Kr85 ■

Gross Leak, Cond. C1, fluorocarbon ■ ■

Fine Leak, Cond. B1, Kr85 ■

Fine Leak, Cond. A2, helium ■ ■

Radiography, Method 2012 ■

post Radiography Electrical Test, +25°C case ■ 7

final visual inspection

Method 2009 of MIL-STD-883 ■ ■

Magnification 1X 9 ■

Radiation tolerance 1, 10

Passive components, radiation tolerant ■ ■




of 21APP-009 Rev AN - 2021.03.29




Table 8: environmenTal Screening HigH reliabiliTy Dc-Dc converTerS anD emi filTerS STanDarD, /eS, /SX anD /883 (claSS H)


environmentaL sCreening HigH reLiaBiLity dC-dC Converters and emi fiLters standard, /es, /sX and /883 (CLass H)

non-QmL 1 CLass H QmL 2, 3

test performed standard /es /sX 4 /883

pre-cap Inspection, Method 2017, 2032 ■ ■ ■ ■


Method 1010, Cond. C, -65°C to +150°C, ambient ■ ■

Method 1010, Cond. B, -55°C to +125°C, ambient ■


Method 2001, 3000 g ■ ■

Method 2001, 500 g ■

pIND, Test Method 2020, Cond. A ■ 5 ■ 5


96 hours ■

160 hours ■ ■



Subgroups 1 and 4, +25°C case ■ ■


Gross Leak, Cond. C1, fluorocarbon ■ ■ ■

Fine Leak, Cond. A2, helium ■ ■ ■

Gross Leak, Dip ■

final visual inspection, Method 2009 ■ ■ ■ ■


Notes1. Non-QML products may not meet all of the requirements of MIL-PRF-38534.2. All processes are QML qualified and performed by certified operators.3. A QML products which has an SMD number is marked “QML”. A QML product which does not SMD number is marked

per MIL-PRF-38534 table III. 4. “SX” screening is performed per MIL-PRF-38534, MIL-STD-883, Class H for non-QML devices. 5. Not required by DLA but performed to assure product quality.6. Burn-in temperature designed to bring the case temperature to +125°C minimum. Burn-in is a powered test.

for preLiminary miL-std produCts not QuaL’d, no smd numBer [mfX Has it’s own taBLe in its datasHeet)



of 21APP-009 Rev AN - 2021.03.29



APPENDIX A - ELEMENT EVALUATION TABLES

THe following TableS are from mil-prf-38534 l aS THey apply To inTerpoinT proDucTS.

MIL-PRF-38534 L, Section C.3.1 NOTE: Elements used in compliant hybrid microcircuits with element evaluation successfully completed prior to the implementation date (3 Jun 2020) of this specification are permitted and shall follow the element evaluation requirements in MIL-PRF-38534 at the time element evaluation was initiated.

The Element Evaluation tables are referenced to MIL-PRF-38534 L tables which are listed in parentheses.

Appendix A: Element Evaluation Tables 1

“Table A: Microcircuit Dice Evaluation Requirements” (Table C-II) ......................................... page 12

“Table B: Semiconductor Dice Evaluation Requirements” (Table C-II-1) .........................................page 13

“Table C: Wire Bondable and Surface Mount Resistors” (Table C-III) ........................................................page 16

“Table D: Chip Capacitors, Solid Tantalum” (Table C-III-2) .................................................................... page 18

“Table E: Coils, Transformers” (Table C-III-4) 2 ............................................................................ page 20

1. Referenced MIL-PRF-38534 table is listed in parentheses. 2, Table E applies to purchased magnetics. It does not apply to magnetics made in-house by Crane which are made on a qualified line

and do not require additional Element Evaluation.




of 21APP-009 Rev AN - 2021.03.29


APPENDIX A - ELEMENT EVALUATION TABLESSu

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IL-S

TD-8

83

1015

24

0hrs

Min

. at T

c or

Ta

= 12

5o C M

in.

X Po

st-B

I Ele

ctric

al

3/

Per A

cqui

sitio

n D

ocum

ent

25°C

, -55

°C, 1

25°C

R

ecor

d D

ata

C.3.

3.4.

3

X St

eady

Sta

te L

ife

2/

MIL

-STD

-883

10

05

1000

hrs

at

Tc o

r Ta

=12

5°C

Min

. or

500h

rs a

t Tc=

150°

C M

in.

X X

Fina

l Ele

ctric

al

3/

Per A

cqui

sitio

n D

ocum

ent

25°C

, -55

°C, 1

25°C

R

ecor

d D

ata

C.3.

3.4.

3

5 X

X W

irebo

nd E

valu

atio

n 4/

M

IL-S

TD-8

83

2011

B

ake

for 1

hou

r m

inim

um

@ +

300º

C (B

imet

allic

bo

nds

only

)

10(0

) or

20(1

) w

ires

C.3.

3.3

C.3.

3.5

6 X

SEM

5/

MIL

-STD

-883

20

18

See

5/

C.3.

3.6

Tab

le a

: mic

ro

cir

cuiT

Dic

e ev

alu

aTio

n r

eQu

irem

enTS

1/Ei

ther

test

met

hod

is a

pplic

able

.2/

Hig

h po

wer

dev

ices

may

be

test

ed a

t Max

Tj w

hen

Ta/T

c w

ould

cau

se T

j to

exce

ed m

ax o

pera

ting

tem

pera

ture

. 3/

Per

form

Del

ta L

imit

Calc

ulat

ion

resu

lts a

gain

st th

e pr

evio

us e

lect

rical

te

st p

erfo

rmed

whe

n re

quire

d by

the

acqu

isiti

on d

ocum

ent.

4/B

ond

wire

s m

ust b

e se

lect

ed to

acc

urat

ely

refle

ct th

e w

ire b

ond

syst

em u

sed

on th

e hy

brid

.5/

The

quan

tity

acce

pt (r

ejec

t) re

quire

men

ts s

peci

fied

here

in fo

r el

emen

t eva

luat

ion

supe

rsed

e th

e sa

mpl

e si

ze a

nd s

elec

tion

requ

irem

ents

of m

etho

d 20

18 o

f MIL

-STD

-883

. If t

he d

ie a

re

from

a k

now

n ho

mog

eneo

us s

ingl

e w

afer

, the

n th

e sa

mpl

e si

ze s

hall

be 4

dev

ices

ran

dom

ly s

elec

ted

from

the

waf

er.

If th

e di

e ar

e fr

om a

non

- hom

ogen

eous

waf

er lo

t (tr

acea

bilit

y is

un

know

n or

no

obje

ctiv

e ev

iden

ce is

ava

ilabl

e fo

r ve

rific

atio

n), t

hen

the

sam

ple

size

sha

ll be

8 d

evic

es r

ando

mly

sel

ecte

d fr

om th

e po

pula

tion.

If t

he d

ie a

re fr

om k

now

n ho

mog

eneo

us

mul

tiple

(tw

o or

mor

e) w

afer

s, th

en th

e sa

mpl

e si

ze s

hall

be 4

dev

ices

ran

dom

ly s

elec

ted

from

eac

h of

two

waf

ers

in th

e lo

t, 8

devi

ces

tota

l. If

any

waf

er fr

om th

e lo

t fai

ls, a

ll re

mai

ning

w

afer

s in

the

lot m

ust b

e te

sted

(4 d

evic

es r

ando

mly

sel

ecte

d fr

om e

ach

waf

er) t

o be

ver

ified

as

acce

ptab

le fo

r us

e.

(Tab

le C

-II o

f MIL

-PR

F-38

534

L)




of 21APP-009 Rev AN - 2021.03.29



Tab

le b

: Sem

ico

nD

ucT

or D

ice

eval

uaT

ion

reQ

uir

emen

TS

(Tab

le C

-II-1

of M

IL-P

RF-

3853

4 L)

Subgroup

Class

Test

Transistor -Signal

Transistor -Power

Diode -Zener

Diode -Power,Rectifier

MOSFET -Power

SCR *

Spec

ifica

tion

or S

tand

ard

Met

hod

Condition

Com

men

ts

Quantity(Accept number)

Ref

eren

ce

para

grap

h M

IL-P

RF

-38

534

K

H

1 X

X El

emen

t El

ectri

cal

X X

X X

X X

Per A

cqui

sitio

n D

ocum

ent

25°C

10

0%

C.3.

3.1

2 X

X El

emen

t Vi

sual

X

MIL

-STD

-750

20

69

100%

C.

3.3.

2

X X

X 20

70

X X

X X

X 20

72

X X

X X

2073

3

X X

Inte

rnal

Vi

sual

X

MIL

-STD

-750

20

69

10(0

) C.

3.3.

3

C.3.

3.4.

2 X

X X

2070

X

X X

X X

2072

X

X X

X 20

73

4 X

Initi

al

Elec

trica

l 1/

X

X X

X X

X Pe

r Acq

uisi

tion

Doc

umen

t 25

°C

Rec

ord

Dat

a 10

(0)

X Te

mpe

ratu

re

Cycl

e 2/

X

X X

X X

X M

IL-S

TD-8

83

1010

C

20 C

ycle

s C.

3.3.

3

X X

X X

X X

X M

IL-S

TD-7

50

1051

C

20 C

ycle

s X

Surg

e X

MIL

-STD

-750

40

66

B

X X

A

See

foot

note

s at

end

of t

able

.

*Int

erpo

int P

rodu

cts

do n

o ha

ve S

CR c

ompo

nent

s




of 21APP-009 Rev AN - 2021.03.29



Tab

le b

: Sem

ico

nD

ucT

or D

ice

eval

uaT

ion

reQ

uir

emen

TS (c

on

Tin

ueD

)

(Tab

le C

-II-1

of M

IL-P

RF-

3853

4 L)

Subgroup

Class

Test

Transistor -Signal

Transistor -Power

Diode – Zener


MOSFET -Power

SCR

Spec

ifica

tion

or S

tand

ard

Met

hod

Condition

Com

men

ts


Ref

eren

ce

para

grap

h M

IL-P

RF

-38

534

K

H

4 X

Mec

hani

cal

Stre

ss 2

/ X

X X

X X

X M

IL-S

TD-8

83 -

Cons

tant

Ac

cele

ratio

n

2001

A

Y1 D

irect

ion

5000

g 10

(0)

MIL

-STD

-750

-Co

nsta

nt

Acce

lera

tion

2006

X X

X X

X X

X M

IL-S

TD-8

83 -

Mec

hani

cal S

hock

20

02

B

Y1 D

irect

ion

MIL

-STD

-750

-M

echa

nica

l Sho

ck

2016

Y1

Dire

ctio

n 15

00g

X In

terim

El

ectri

cal

1/

X X

X X

X Pe

r Acq

uisi

tion

Doc

umen

t 25

°C

Rec

ord

Dat

a C.

3.3.

4.3

X H

igh

Tem

pera

ture

R

ever

se B

ias

(HTR

B)

3/

X X

MIL

-STD

-750

10

39

A 80

% M

in. o

f rat

ed

VCB

(b

ipol

ar),

as

appl

icab

le.

C.3.

3.3

X X

MIL

-STD

-750

-B

urn

-in (P

ower

M

OSF

ET)

MIL

-STD

-750

-G

ate

Bia

s (IG

BT)

1042

B

80

% M

in. o

f rat

ed

VGS.

X X

X M

IL-S

TD-7

50 -

Bur

n-in

(Pow

er)

MIL

-STD

-750

-R

ever

se B

ias

(Zen

er, R

ectif

ier)

1038

A

80%

Min

. of r

ated

VR

or V

RWM

whe

n D

C co

nditi

ons

are

spec

ified

. 95

-100

%

of V

RWM

, whe

n ha

lf si

ne c

ondi

tion

is s

peci

fied.

See

foot

note

s at

end

of t

able

.

*Int

erpo

int P

rodu

cts

do n

o ha

ve S

CR c

ompo

nent

s




of 21APP-009 Rev AN - 2021.03.29



Tab

le b

: Sem

ico

nD

ucT

or D

ice

eval

uaT

ion

reQ

uir

emen

TS (c

on

Tin

ueD

)

(Tab

le C

-II-1

of M

IL-P

RF-

3853

4 L)

Subgroup

Class

Test

Transistor -Signal

Transistor -Power

Diode -Zener


MOSFET -Power

SCR

Spec

ifica

tion

or S

tand

ard

Met

hod

Condition

Com

men

ts


Ref

eren

ce

para

grap

h M

IL-P

RF

-38

534

K

H

4 X

Inte

rim

Elec

trica

l 1/

3/

X X

X X

X X

Per A

cqui

sitio

n D

ocum

ent

25°C

R

ecor

d D

ata

10(0

) C.

3.3.

4.3

X B

urn

-In

X X

MIL

-STD

-750

10

39

B

240h

rs M

in a

t Tj

=M

ax ra

ted,

+

0°C,

-25°

C X

X M

IL-S

TD-7

50

1042

A

240h

rs M

in a

t Tj

=M

ax ra

ted,

+

0°C,

-25°

C X

X X

MIL

-STD

-750

10

38

B

240h

rs M

in a

t Tj

=M

ax ra

ted,

+

0°C,

-25°

C X

X M

IL-S

TD-7

50

1040

B

24

0hrs

Min

at

Tj=

Max

rate

d,

+0°

C, -2

5°C

X Po

st B

I El

ectri

cal

1/ 4

/

X X

X X

X X

Per A

cqui

sitio

n D

ocum

ent

25°C

, -55

°C,

125°

C R

ecor

d D

ata

C.3.

3.4.

3

See

foot

note

s at

end

of t

able

. 1/

Tes

t par

amet

ers

chos

en fr

om a

pplic

able

MIL

-PR

F-19

500

slas

h sh

eet,

appl

icab

le m

anuf

actu

rer’s

dat

a sh

eet,

and/

or a

cqui

stio

n do

cum

ent.

2/ E

ither

test

met

hod

is a

pplic

able

.3/

Whe

n H

igh

Tem

p R

ever

se B

ias

(HTR

B) i

s pe

rfor

med

, lea

kage

cur

rent

sha

ll be

mea

sure

d on

eac

h de

vice

bef

ore

any

othe

r sp

ecifi

ed p

aram

etric

test

is p

erfo

rmed

and

com

plet

ed w

ithin

16

hour

s of

HTR

B c

ompl

etio

n.4/

Whe

n re

quire

d by

the

acqu

isiti

on d

ocum

ent,

perf

orm

del

ta li

mit

calc

ulat

ions

. 5/

Se

lect

bon

d w

ires

that

rep

rese

nt th

e w

ire b

ond

proc

ess

used

in th

e hy

brid

.6/

SEM

is n

ot r

equi

red

for

sem

icon

duct

or d

ice

with

out e

xpan

ded

met

alliz

atio

n (r

efer

ence

met

hod

2077

of M

IL-S

TD-7

50).

7/ T

he q

uant

ity a

ccep

t (re

ject

) req

uire

men

ts s

peci

fied

here

in fo

r el

emen

t eva

luat

ion

supe

rsed

e th

e sa

mpl

e si

ze a

nd s

elec

tion

requ

irem

ents

of m

etho

d 20

18 o

f MIL

-STD

-883

and

met

hod

2077

of M

IL-S

TD-7

50. I

f the

die

are

from

a k

now

n ho

mog

eneo

us s

ingl

e w

afer

, the

n th

e sa

mpl

e si

ze s

hall

be 4

dev

ices

ran

dom

ly s

elec

ted

from

the

waf

er.

If th

e di

e ar

e fr

om a

non

- ho

mog

eneo

us w

afer

lot (

trac

eabi

lity

is u

nkno

wn

or n

o ob

ject

ive

evid

ence

is a

vaila

ble

for

verif

icat

ion)

, the

n th

e sa

mpl

e si

ze s

hall

be 8

dev

ices

ran

dom

ly s

elec

ted

from

the

popu

latio

n. I

f the

di

e ar

e fr

om k

now

n ho

mog

eneo

us m

ultip

le (t

wo

or m

ore)

waf

ers,

then

the

sam

ple

size

sha

ll be

4 d

evic

es r

ando

mly

sel

ecte

d fr

om e

ach

of tw

o w

afer

s in

the

lot,

8 de

vice

s to

tal.

If a

ny w

afer

fr

om th

e lo

t fai

ls, a

ll re

mai

ning

waf

ers

in th

e lo

t mus

t be

test

ed (4

dev

ices

ran

dom

ly s

elec

ted

from

eac

h w

afer

) to

be v

erifi

ed a

s ac

cept

able

for

use.

*Int

erpo

int P

rodu

cts

do n

o ha

ve S

CR c

ompo

nent

s




of 21APP-009 Rev AN - 2021.03.29



Tab

le c

: wir

e b

on

Dab

le a

nD

Su

rfa

ce m

ou

nT

reS

iSTo

rS

(Tab

le C

-III o

f MIL

-PR

F-38

534

L)

1/ 2

/

Subg

roup

Cl

ass

Test

W

ire

Bon

dabl

e R

esis

tors

Surf

ace

Mou

nt

Res

isto

rs

Stan

dard

or

Spec

ifica

tion

Met

hod

/ Pa

ragr

aph

Cond

ition

Co

mm

ents

Q

uant

ity

(acc

ept n

umbe

r)

Ref

Par

a M

IL-

PRF

-38

534

K

H

Clas

s K

Sa

mpl

es

Clas

s H

Sa

mpl

es

1 X

X El

emen

t El

ectri

cal

X X

MIL

-PR

F-

5534

2 3.

8 25

C 10

0%

100%

C.

3.4.

1

2 X

Visu

al

Insp

ectio

n X

X M

IL-S

TD-

883

2032

H

22

(0)

C.3.

4.2

X X

X M

IL-S

TD-

883

2032

K

10

0%

X X

Dev

ice

Fini

sh

3/

X M

IL-P

RF

-38

534

2 (0

) 2

(0)

3 X

Elem

ent

Elec

trica

l X

X M

IL-P

RF

-55

342

3.8

Mea

sure

&

Rec

ord

DC

Res

ista

nce

@ 2

5C

10(0

) C.

3.4.

4

X Th

erm

al

Shoc

k or

Te

mpe

ratu

re

Cycl

e

X X

MIL

-STD

-20

2 10

7 F

-65C

to

+15

0C, 1

0 Cy

cles

10(0

) C.

3.4.

3

MIL

-STD

-88

3 10

10

C -6

5C to

+

150C

, 10

Cycl

es

X M

echa

nica

l Sh

ock

or

Cons

tant

Ac

cele

ratio

n

X X

MIL

-STD

-88

3 20

02

B

Y1 D

irect

ion

10(0

)

2001

A

Y1 D

irect

ion

See

foot

note

s at

end

of t

able

.




of 21APP-009 Rev AN - 2021.03.29



Tab

le c

: wir

e b

on

Dab

le a

nD

Su

rfa

ce m

ou

nT

reS

iSTo

rS

(co

nTi

nu

eD)

(Tab

le C

-III o

f MIL

-PR

F-38

534

L)

1/ 2

/

Subg

roup

C

lass

Te

st

Wire

Bo

ndab

le

Res

isto

rs

Surfa

ce

Mou

nt

Res

isto

rs

Stan

dard

or

Spec

ifica

tion

Met

hod

/ Pa

ragr

aph

Con

ditio

n C

omm

ents

Q

uant

ity

(acc

ept n

umbe

r) R

ef P

ara

MIL

-PR

F-38

534

K H

C

lass

K

Cla

ss H

Sa

mpl

es

Sam

ples

3

X Po

wer

C

ondi

tioni

ng

X X

MIL

-PR

F-55

342

3.10

4.

8.4

100

hour

s @

70

°C, 1

.5X

Rat

ed

Pow

er

10(0

)

X El

emen

t El

ectri

cal

X X

Acqu

isiti

on

Doc

umen

t or

M

IL-P

RF-

5534

2

3.8

Mea

sure

&

Rec

ord

DC

R

esis

tanc

e @

25C

10(0

) C

.3.4

.4

X El

emen

t El

ectri

cal 4

/ X

X M

IL-P

RF-

5534

2 3.

8 M

easu

re &

R

ecor

d D

C

Res

ista

nce

@ 2

5C

Tole

ranc

e an

d D

elta

R.

10(0

) C

.3.4

.4

4 X

X W

irebo

nd

Eval

uatio

n X

MIL

-PR

F-55

342

3.19

.3

10 (0

) or

20

(1) w

ires

10 (0

) or

20

(1) w

ires

C.3

.4.3

C

.3.4

.6

X M

IL-S

TD-

883

2011

See

foot

note

s at

end

of t

able

. 1/

Sam

ples

sha

ll be

take

n fr

om e

ach

prod

uctio

n lo

t for

eac

h re

sist

ance

val

ue.

2/ P

arts

pro

cure

d as

mil-

prf-3

8534

pro

duct

leve

l T o

r w

ith E

stab

lishe

d R

elia

bilit

y (E

R) f

ailu

re r

ate

R, S

, U, o

r V

are

acce

ptab

le fo

r us

e as

is.

3/ U

sing

a r

ecog

nize

d m

etho

dolo

gy (e

.g. m

etho

d 20

37 o

f MIL

-STD

-883

, JES

D21

3) v

erify

that

fini

shes

con

tain

ing

Tin

(Sn)

hav

e a

min

imum

of 3

% le

ad (P

b) b

y w

eigh

t per

MIL

-PR

F-38

534.

4/ D

elta

R s

hall

not e

xcee

d +/

-0.5

% a

fter

com

plet

ion

of te

st(s

), un

less

oth

erw

ise

spec

ified

in a

cqui

sitio

n do

cum

ent.




of 21APP-009 Rev AN - 2021.03.29


APPENDIX A - ELEMENT EVALUATION TABLESSu

bgro

up

Clas

s Te

st

Stan

dard

or

Spec

ifica

tion

Met

hod

Cond

ition

Co

mm

ents

Q

uant

ity

(acc

ept n

umbe

r)

Ref

eren

ce

Para

grap

h M

IL-P

RF

-38

534

K

H

1 X

X El

emen

t Ele

ctric

al

MIL

-PR

F-3

8534

25

C Pe

r Aqu

isiti

on

Doc

umen

t 10

0%

C.3.

4.1

2 X

X D

evic

e Fi

nish

2/

M

IL-S

TD-8

83

2037

Fo

r ter

min

atio

ns

cont

aini

ng S

n 5

(0)

X Vi

sual

Insp

ectio

n M

IL-S

TD-8

83

2032

10

0%

C.3.

4.2

X 22

(0)

3 X

Ref

low

Con

ditio

ning

M

IL-P

RF

-553

65

Para

. 4.7

.10

100%

X Th

erm

al S

hock

(U

nmou

nted

) M

IL-S

TD-2

02

Test

Met

hod

107

A 3/

-5

5 to

125

C, 5

cy

cles

10

0%

X Su

rge

Curr

ent (

SC)

MIL

-PR

F-5

5365

Pa

ra. 4

.7.1

8 C

100%

X W

eibu

ll FR

L G

radi

ng

MIL

-PR

F-5

5365

Pa

ra. 4

.7.2

0 C

Ret

ain

test

re

sults

Rea

d &

R

ecor

d D

ata

100%

X D

C Le

akag

e M

IL-P

RF

-553

65

Para

. 4.7

.6

100%

X 10

(0)

See

foot

note

s at

end

of t

able

.

Tab

le D

: cH

ip c

apac

iTo

rS,

So

liD

Tan

Talu

m

(Tab

le C

-III-2

of M

IL-P

RF-

3853

4 L)

1/ Crane Aerospace & Electronics Power Solutions



of 21APP-009 Rev AN - 2021.03.29



Tab

le D

: cH

ip c

apac

iTo

rS,

So

liD

Tan

Talu

m (c

on

Tin

ueD

) 1/

(Tab

le C

-III-2

of M

IL-P

RF-

3853

4 L)

Subg

roup

Cl

ass

Test

St

anda

rd o

r Sp

ecifi

catio

n M

etho

d Co

nditi

on

Com

men

ts

Qua

ntity

(a

ccep

t num

ber)

R

efer

ence

Pa

ragr

aph

MIL

-PR

F-

3853

4 K

H

3 X

Capa

cita

nce

MIL

-PR

F-5

5365

an

d

MIL

-STD

-202

Para

. 4.7

.7

305

Ret

ain

test

re

sult

s R

ead

&

Rec

ord

Dat

a

100%

X 10

(0)

X D

issi

patio

n Fa

ctor

M

IL-P

RF

-553

65

Para

. 4.7

.8

100%

X 10

(0)

X ES

R

MIL

-PR

F-5

5365

Pa

ra. 4

.7.1

4 10

0%

X 10

(0)

X +

3 si

gma

cull

requ

ired

for D

F, E

SR, D

C Le

akag

e

MIL

-PR

F-5

5365

M

IL-P

RF

-553

65

1.2.

1.6

Tabl

e III

R

emov

e pa

rts

that

fail

+3

sigm

a cu

ll.

100%

4 X

Rad

iogr

aphi

c In

spec

tion

MIL

-PR

F-5

5365

Pa

ra. 3

.5

100%

5 X

Stab

ility

at l

ow a

nd h

igh

tem

pera

ture

M

IL-P

RF

-553

65

Para

. 3.1

9 22

(0)

6 4/

X

X W

ire B

ond

Eval

uatio

n M

IL-S

TD-8

83

2011

Fo

r wire

bon

ding

ap

plic

atio

ns

10 (0

) wire

s or

20

(1) w

ires

C.3.

4.3

C.3.

4.6

X X

Sold

erab

ility

M

IL-S

TD-2

02

208

For s

olde

ring

appl

icat

ions

5(

0)

X D

estr

uctiv

e Ph

ysic

al

Anal

ysis

M

IL-S

TD-1

580

5 (0

)

7 X

Life

Tes

t M

IL-P

RF

-553

65

Para

. 4.7

.19

Per T

able

VI

2000

Hrs

at 1

25C

24 (1

)

1/ F

or C

lass

H h

ybrid

dev

ices

, ele

men

t eva

luat

ion

in a

ccor

danc

e w

ith th

is ta

ble

is n

ot r

equi

red

for

capa

cito

rs th

at a

re c

ompl

iant

to M

IL-P

RF-

5536

5 an

d ar

e lis

ted

on th

e Q

PL. F

or C

lass

K

hybr

ids,

ele

men

t eva

luat

ion

in a

ccor

danc

e w

ith th

is ta

ble

is n

ot r

equi

red

for

capa

cito

rs p

rocu

red

as Q

PL M

IL-P

RF-

5536

5 pr

oduc

t lev

el T

or

prod

uct l

evel

M w

ith m

inim

um W

eibu

ll FR

L C

com

bine

d w

ith s

urge

cur

rent

opt

ion

C.2/

Usi

ng a

rec

ogni

zed

met

hodo

logy

(e.g

. met

hod

2037

of M

IL-S

TD-8

83, J

ESD

-213

) ve

rify

that

fini

shes

con

tain

ing

Tin

(Sn)

hav

e a

min

imum

of 3

% L

ead

(Pb)

by

wei

ght p

er M

IL-P

RF-

3853

4.

Dev

ice

finis

h te

st m

ay b

e co

nduc

ted

by h

ybrid

man

ufac

ture

r up

on r

ecei

pt o

f com

pone

nts.

Dev

ice

finis

h te

st m

ay b

e co

nduc

ted

follo

win

g vi

sual

insp

ectio

n at

the

disc

retio

n of

the

capa

cito

r m

anuf

actu

rer.

3/ M

etho

d 10

7 of

MIL

-STD

-202

Con

ditio

n A

mod

ified

to a

djus

t upp

er te

mpe

ratu

re li

mit

to +

125

4/ S

ubgr

oup

6 te

sts

may

be

cond

ucte

d in

any

ord

er.

4/ S

ubgr

oup

6 te

sts

may

be

cond

ucte

d in

any

ord

er.




of 21APP-009 Rev AN - 2021.03.29



Tab

le e

: co

ilS,

Tr

anSf

or

mer

S

Subg

roup

Cl

ass

Test

St

anda

rd o

r Sp

ecifi

catio

n M

etho

d Co

nditi

on

Com

men

ts

Qua

ntity

(acc

ept n

umbe

r)

Ref

eren

ce

para

grap

h M

IL-P

RF

-38

534

K

Clos

ed

K

Ope

n 1/

H O

pen

and

Clos

ed

1/

1 X

X X

Elem

ent

Elec

trica

l Ac

quis

ition

D

ocum

ent

25°C

10

0%

C.3.

4.1

2 X

X Vi

sual

In

spec

tion

MIL

-STD

-88

3 an

d M

IL-

STD

-981

2032

M

IL-S

TD-9

81:

5.5.

3, 5

.5.9

, 5.5

.12

100%

C.

3.4.

2

X Vi

sual

In

spec

tion

MIL

-STD

-88

3 20

32

22(0

)

3 X

Tem

pera

ture

Cy

cle

MIL

-STD

-88

3 10

10

C 10

cyc

les

10(0

) C.

3.4.

3

X M

echa

nica

l Sh

ock

or

Cons

tant

Ac

cele

ratio

n 2/

MIL

-STD

-88

3 20

02

B

Y1 d

irect

ion

10(0

)

2001

A

Y1 d

irect

ion

X B

urn

-In

MIL

-STD

-98

1 Se

ctio

n 5.

6.7.

3.4

Clas

s S

T =

Max

Rat

ing,

96

hrs,

Max

Loa

d 10

(0)

X X

X Vi

sual

In

spec

tion

MIL

-STD

-88

3 an

d M

IL-

STD

-981

2032

M

IL-S

TD-9

81:

5.5.

3, 5

.5.9

, 5.5

.12

10(0

) C.

3.4.

3 C.

3.4.

5

X X

X El

emen

t El

ectri

cal

Acqu

isiti

on

Doc

umen

t 10

(0)

C.3.

4.3

C.3.

4.4

See

foot

note

s at

end

of t

able

.

(Tab

le C

-III-4

of M

IL-P

RF-

3853

4 L)

Tabl

e E

appl

ies

to p

urch

ased

mag

netic

s. It

doe

s no

t app

ly to

mag

netic

s m

ade

in-h

ouse

by

Cran

e w

hich

are

mad

e on

a q

ualif

ied

line

and

do n

ot r

equi

re a

dditi

onal

Ele

men

t Eva

luat

ion.




of 21APP-009 Rev AN - 2021.03.29



Tab

le e

: co

ilS,

Tr

anSf

or

mer

S (c

on

Tin

ueD

)

(Tab

le C

-III-4

of M

IL-P

RF-

3853

4 L)

Tabl

e E

appl

ies

to p

urch

ased

mag

netic

s. It

doe

s no

t app

ly to

mag

netic

s m

ade

in-h

ouse

by

Cran

e w

hich

are

mad

e on

a q

ualif

ied

line

and

do n

ot r

equi

re a

dditi

onal

Ele

men

t Eva

luat

ion.

Subg

roup

Cl

ass

Test

St

anda

rd o

r Sp

ecifi

catio

n M

etho

d Co

nditi

on

Com

men

ts

Qua

ntity

(acc

ept n

umbe

r)

Ref

eren

ce

para

grap

h M

IL-P

RF

-38

534

K

Clos

ed

K

Ope

n 1/

H O

pen

and

Clos

ed

1/

4 3/

X

X X

Dev

ice

Fini

sh

MIL

-STD

-88

3 or

JES

D

213

2037

N

ot re

quire

d fo

r co

mpo

nent

s th

at

cont

ain

no s

olde

r or

tin (e

.g.,

ferr

ite

mag

netic

s w

ith

copp

er w

ires)

.

5(0)

X X

X W

ire

bond

abili

ty

MIL

-STD

-88

3 20

11

Whe

re A

pplic

able

H

-5(0

) K

-10(

0) o

r 20(

1)

C.3.

4.3

C.3.

4.6

X X

X So

lder

abili

ty

MIL

-STD

-88

3 20

03

Whe

re A

pplic

able

H

-2(0

), K

-5(0

)

X X

X Te

rmin

al

Stre

ngth

M

IL-S

TD-

981

Para

. 5.

6.7.

4 W

here

App

licab

le

H-2

(0),

K-5

(0)

C.3.

4.6

1/M

agne

tic e

lem

ents

bui

lt in

hou

se b

y th

e hy

brid

man

ufac

ture

r m

ay b

e te

sted

per

the

Clas

s K

ope

n co

nstr

uctio

n re

quire

men

ts o

r Cl

ass

H r

equi

rem

ents

, as

appl

icab

le. E

lem

ents

mus

t be

qual

ified

with

the

hybr

id a

nd n

ot m

anuf

actu

red

for

sale

as

a se

para

te q

ualif

ied

com

pone

nt. C

onst

ruct

ion

tech

niqu

es a

nd m

ater

ials

mus

t mee

t or

exce

ed th

at o

f MIL

-STD

-981

(whe

re

appl

icab

le).

2/Ei

ther

test

met

hod

is a

ccep

tabl

e.3/

Gro

up 4

test

s m

ay b

e co

nduc

ted

in a

ny o

rder

.



Quality Assurance and Certification APP-009 Rev AN - 2021.03.29 All information is believed to be accurate, but no responsibility is assumed for errors or omissions. Crane Electronics, Inc. reserves the right to make changes that do not affect form, fit or function of Class H or K products or specifications without notice. Interpoint is a registered trademark of Crane Co. The product series names are trademarks of Crane Electronics, Inc. Copyright © 1999 - 2021 Crane Electronics, Inc. All rights reserved. www.craneae.com/interpoint

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