qml-38534-29, qualified manufacturers list of custom ... · non-smd product dated after...

QUALIFIED MANUFACTURERS LIST

OF

CUSTOM HYBRID MICROCIRCUITS

QUALIFIED UNDER MILITARY SPECIFICATION

MIL-PRF-38534

CUSTOM HYBRID MICROCIRCUITS

GENERAL REQUIREMENTS FOR

Qualifications Validated Annually

CUSTOM HYBRIDMICROCIRCUITS

SUPERSEDING

QML-38534-2930-Jun-99

QML-38534-2831-Mar-99

This list has been prepared for use by or for the Government in the acquisition of products covered by Specification MIL-PRF-38534. Listing of a product is not intended to, and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a product, process, or material does not, in any way, release the supplier from the responsibility to comply with the individual item specification requirements.

THE DEFENSE SUPPLY CENTER COLUMBUS (DSCC-V) IS THE PREPARING ACTIVITY (PA) FOR MIL-PRF-38534, AND IS THEREFOR RESPONSIBLE FOR QUALIFICATION. DSCC-VQ IS THE ORGANIZATIONAL ELEMENT, WITHIN THE PA, WHICH PERFORMS THE ADMINISTRATIVE AND TECHNICAL FUNCTIONS NECESSARY FOR QUALIFICATION OF PRODUCTS, PROCESSES AND MATERIAL. Mailing Address: Defense Supply Center Columbus (DSCC-VQ), P.O. Box 3990, Columbus, Ohio 43216-5000.

In order for a manufacturer to have test data considered for qualification, the manufacturer must perform all required qualification tests; produce the qualification sample under a valid authorization to test with DSCC certified materials and manufacturing construction techniques; and comply with the requirements specified in MIL-PRF-38534.

The listing of custom hybrid microcircuit materials and manufacturing construction techniques in QML-38534 applies only to products produced on the MIL-PRF-38534 certified line(s) at the plant(s) specified on the QML.

Custom hybrid microcircuits manufactured, assembled, and tested in accordance with MIL-PRF-38534 shall bear the "certification mark" for SMD controlled hybrid Microcircuits, or the "compliant hybrid" certification mark for non-SMD controlled hybrid microcircuits as follows:

SMD product, for all classes, shall have the certification mark "QML" or "Q" for small devices. Non-SMD product dated after MIL-PRF-38534D, for Class K shall have the certification mark "CK." Non-SMD product dated after MIL-PRF-38534D, for Class H shall have the certification mark "CH."Non-SMD product dated after MIL-PRF-38534D, for Class G shall have the certification mark "CG."Non-SMD product dated after MIL-PRF-38534D, for Class E shall have the certification mark "CE."Non-SMD product dated after MIL-PRF-38534D, for Class D shall have the certification mark "CD."Non-SMD dated prior to MIL-PRF-38534D, for all classes, shall have the certification mark "CH" or "C" for small devices.

These certification marks or the abbreviations "Q" or "C" shall not be used, on product that does not meet all requirements of MIL-PRF-38534 except as allowed in 3.7.5 of MIL-PRF-38534.

Products manufactured, assembled, and tested for Class K, Class H, Class G, Class E, or Class D, with all the provisions of MIL-PRF-38534, and with DSCC qualified materials and manufacturing construction techniques, can be represented as being compliant to the appropriate product assurance levels as listed herein.

The information contained in this QML reflects the general material and manufacturing techniques of the particular test sample(s). In order to protect the manufacturers' proprietary processes and materials, only the generic process and material are listed. The user must contact the manufacturer for any detail information on specific materials (i.e., such as epoxy, getter, solder-type), or process details. Processes and materials, not listed, may be considered qualified by similarity to those demonstrated for the qualification (e.g., different wire, package, or die sizes). See Appendix D of MIL-PRF-38534, Class l, major changes paragraph, for a baseline of qualification limits.

Any product, represented as being compliant to MIL-PRF-38534, must be built using qualified processes and materials. The user shall be responsible for determining if the qualification baseline for a given class level is adequate to demonstrate capability for the intended application.

To obtain MIL-PRF-38534 qualified hybrid microcircuits, the user should specify in the procurement document that the product be manufactured to MIL-PRF-38534, and be comprised of materials and manufacturing construction techniques listed herein. Acquisition requirements are contained in paragraph 6.2 of MIL-PRF-38534. Microcircuit devices represented as being built, tested and shipped under the QML provision of MIL-PRF-38534, must be built using qualified manufacturing materials and construction listed in this QML.

Contractor acquiring activities, military program offices, and other government representatives can determine if hybrid microcircuits meet the requirements of MIL-PRF-38534 by:a. For SMD controlled product: Product listed in the product eligibility section herein and marked with "QML" or "Q".

-1-

AMSC N/A. DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimitedQML-38534-29 FSC 5962

QPL/QML InformationIf you are using the latest version of the Adobe Acrobat Reader, version 3.0, you may notice that the text of the QPLs and QMLs appears light. This is due to the anti-aliasing features of the version 3.0 Reader software. Short of the font style and size being changed in all of the QPLs and QMLs to a combination that won't be anti-aliased, the problem with light text can be "corrected" with the Reader software. Choose File/Preferences from the menu bar. Then choose "General" from the menu pop-up. De-select the "Smooth Text and Monochrome Images" checkbox.

NEW SERVICE from VQ (http://www.dscc.dla.mil/offices/sourcing_and_qualification/): An automated QPL/QML notification system is now available. The Master Index of QPLs and QMLs web page (http://www.dscc.dla.mil/programs/qmlqpl/) will continue to be the delivery mechanism for the QPLs and QMLs, but if you wish to receive an e-mail message to indicate the changes to this page, please e-mail your name, telephone number, e-mail address, and the list of QPLs and QMLs you wish to be informed of to the VQ Web Team ([email protected]). Your list can consist of only one document or it can consist of all of the QPLs and QMLs that DSCC-VQ publishes. Alternatively, you can visit http://www.dscc.dla.mil/programs/qmlqpl/QPLRequest.asp. Please keep in mind that not all QPLs and QMLs that VQ publishes are on the Web at this point in time.

b. For non-SMD controlled Product: The part will not be listed on the QML. However, the part will be marked with "C" plus the Class Level designator".

Warning! If products were not purchased to, and identified as MIL-PRF-38534 QML, do not assume they have been manufactured on the DSCC certified line, with qualified materials and processes, or that all other MIL-PRF-38534 requirements were performed.

To determine whether new SMD controlled products are in accordance with MIL-PRF-38534, or to verify any new process/material qualifications, you may call the qualifying activity (DSCC-VQ).

Only DSCC-VQ ISO Registrations are listed herein. Therefore, QML listed manufacturers may have ISO registrations from other registrars.

This Qualified Manufacturers List (QML) is available from the DSCC-VQ World Wide Web pages. The web pages are accessed at the address http://www.dscc.dla.mil/offices/sourcing_and_qualification/index.html or http://www.dscccols.com/offices/sourcing_and_qualification/index.html.

Notes:

1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order for complaint product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.

2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.

3/ Package lead counts are listed by maximum number of leads covered by qualification.

4/ Caution. Do not use this number for item acquisition. Item acquired to this number may not satisfy the performance requirements of the listed SMD.

5/ Inactive for new design, no longer available from manufacturer.

6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.

-2-QML-38534-29

Defense Supply Center, Columbus Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH

MIL-PRF-38534 QML Program Status

Aeroflex Circuit Technology (CAGE Code: 88379)35 South Service Road, Plainview, NJ 11803-4193, US

Company Contact: Mr. Joe Mazzotta, Phone: 516-694-6700, Fax: 516-694-6715, E-mail: [email protected] Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: Non-TRBPeriodic Inspection System: Options 1 and 2ISO 9000 System: ISO 9001 approved by DSCC-VQH

Technologies: Linear, Analog, Digital, Power

Class K, Class H, Class E

Qualification Letters: EQ(EQC-90-616), EQ(EQC-91-896), EQ(EQC-92-001), EQ(EQC-93-019), EQ(EQC-94-032), ELS(ELSH-94-0342), ELS(ELSH-95-0042), ELS(ELSH-95-0395), ELS(ELSH-96-0130), ELS(ELSH-96-176), VQ(VQH-98-0001), VQ(VQH-99-0028)

Substrate Fabrication Flows: QAP21-240, QAP21-225Substrate Fabrication: Thick Film on Alumina, 6 Conductor Level(s), Resistors; Thick Film on Beryllia, 2 Conductor Level(s), Resistors

Substrate Fabrication Information: See Note 1/

Assembly Information: See Note 1/

Assembly Flows: QAP21-241, QAP21-337Substrate Attach: Solder, Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip ResistorsWire Bonding: Gold, Aluminum

Package Information: See Notes 1/ 2/ 3/

Package Information: Metal Package, Axial Leads, Seam Weld, 7.94 Seal Perimeter, 90 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 3.72 Seal Perimeter, 24 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 7.01 Seal Perimeter, 88 Leads, Gold/Solder Lead Finish; Metal Package, TO can, Projection Weld, 2.6 Seal Perimeter, 2 Leads, Gold Lead Finish; Metal Package, Platform, Projection Weld, 3.93 Seal Perimeter, 24 Leads, Gold Lead Finish; Ceramic Cofire Package, Axial Leads, Seam Weld, 7.66 Seal Perimeter, 90 Leads, Gold Lead Finish

Class Level Information: See Note 6/

-3-QML-38534-29



Analog Devices Incorporated (CAGE Code: 24355)Assembled Products Division, 7910 Triad Center Drive, Greensboro, NC 27409-9605, US

Company Contact: Ms. Elaine Trotter, Phone: 910-605-4234, Fax: 910-605-4347, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: TRBPeriodic Inspection System: Option 1ISO 9000 System: ISO 9001 approved by DSCC-VQH

Technologies: AD/DA Converters, Buffer, Op-Amp, Track and Hold, Voltage Reference, Signal Processor, Data Acquisition Systems, DC/DC Converters

Class H, Class E

Qualification Letters: EQ(EQC-92-025), EQ(EQC-92-119), EQ(EQC-92-476), EQ(EQC-93-047), EQ(EQC-93-115), EQ(EQC-93-116), EQ(EQC-93-450), EQ(EQC-93-633), EQ(EQC-93-678), ELS(ELSH-94-172), ELS(ELSH-94-222), VQ(VQH-98-0252)

Substrate Fabrication Flows: QAP 3060Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: QAP 3060Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers, InductorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, TO can, Projection Weld, 1.91 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 7.94 Seal Perimeter, 46 Leads, Gold/Solder Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 7.31 Seal Perimeter, 88 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 7.31 Seal Perimeter, 88 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.4 Seal Perimeter, 17 Leads, Gold/Solder Lead Finish


-4-QML-38534-29



Apex Microtechnology Corporation (CAGE Code: 60024)5980 North Shannon Road, Tucson, AZ 85741-5247, US

Company Contact: Mr. Rick Reed, Phone: 520-690-8695, Fax: 520-888-3329, E-mail: [email protected] Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: Non-TRBPeriodic Inspection System: Option 1ISO 9000 System: ISO 9001 approved by DSCC-VQH

Technologies: Power Op-Amp

Class H, Class E

Qualification Letters: EQ(EQC-91-347), EQ(EQC-92-410), EQ(EQC-92-416), EQ(EQC-93-028), EQ(EQC-93-595), ELS(ELSH-94-0354), ELS(ELSH-95-0070)

Substrate Fabrication Flows: Flow 01Substrate Fabrication: Thick Film on Beryllia, 1 Conductor Level(s), Resistors



Assembly Flows: Flow 10, Flow 99Substrate Attach: SolderElement Attach: Conductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Aluminum


Package Information: Metal Package, TO can, Projection Weld, 2.67 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish


-5-QML-38534-29



Austin Semiconductor, Inc. (CAGE Code: 0EU86)8701 Cross Park Drive, Austin, TX 78754-4566, US

Company Contact: Mr. Clem Murdzak, Phone: 512-339-1188, Fax: 512-339-6641, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: TRBPeriodic Inspection System: Option 1

Technologies: Memory

Class H, Class E

Qualification Letters: VQ(VQH-99-0144)

Substrate Fabrication Flows: N/ASubstrate Fabrication: N/A



Assembly Flows: 2/ASI-H/512K32F1/ASubstrate Attach: N/AElement Attach: Ag Cyanyte EsterAdd-on Elements: Unpackaged die, Chip CapacitorsWire Bonding: Gold


Package Information: Ceramic Co-fire Package, Quad Flat Pack, Solder Seal, 1.76 Seal Perimeter, 68 Leads, Gold Lead Finish


-6-QML-38534-29



BI Technology (CAGE Code: 73138)4200 Bonita Place, Fullerton, CA 92635-1080, US

Company Contact: Ms. Chris Deleon, Phone: 714-447-2647, Fax: 714-447-2315, E-mail: [email protected] Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: Non-TRBPeriodic Inspection System: Options 1 and 2

Technologies: Voltage Regulator, Data Converters, Analog

Class H, Class E

Qualification Letters: EQ(EQC-89-071), EQ(EQC-91-718), EQ(EQC-92-382), EQ(EQC-92-383), VQH-97-0081

Substrate Fabrication Flows: 800-403-2Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors



Assembly Flows: 800-403-03Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Peripheral Leads, Seam Weld, 5.86 Seal Perimeter, 61 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 6.87 Seal Perimeter, 44 Leads, Gold Lead Finish; Ceramic Co-fire Package, Flatpack, Seam Weld, 1.04 Seal Perimeter, 10 Leads, Gold Lead Finish


-7-QML-38534-29



Boeing Defense and Space Group (CAGE Code: 81205)P.O. Box 3999, Seattle, WA 98124-2499, US

Company Contact: Mr. Ronald St. Pierre, Phone: 253-773-1414, Fax: 253-773-9498, E-mail: [email protected] Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Custom

Class H, Class E

Qualification Letters: EQ(EQM-87-2947), EQ(EQC-91-046), EQ(EQC-92-079), EQ(EQC-91-228), EQ(EQC-91-630), EQ(EQC-91-672), EQ(EQC-91-624), EQ(EQC-91-438)

Substrate Fabrication Flows: D900-10476-1-2Substrate Fabrication: Thick Film on Alumina, 10 Conductor Level(s), Resistors; Thick Film on Beryllia, 5 Conductor Level(s)



Assembly Flows: D900-10476-1-2Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, TabsWire Bonding: Gold, Ribbon


Package Information: Metal Package, Axial Leads, Seam Weld, 5.86 Seal Perimeter, 30 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 9.16 Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified


-8-QML-38534-29



C-MAC Microcircuits Limited (CAGE Code: U4388)South Denes, Great Yarmouth, Norfolk NR30 3PX, England

Company Contact: Mr. David Lawn, Phone: 0493-856122, Fax: 0493-858536, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: Non-TRBPeriodic Inspection System: Option 1

Technologies: 1553 Transceiver, High Voltage Drivers

Class H, Class E

Qualification Letters: EQ(EQC-91-835), EQ(EQC-92-084), EQ(EQC-93-139), ELS(ELSH-96-0054), ELS(ELSH-96-0161), VQ(VQH-98-0227), VQ(VQH-99-0192), VQ(VQH-99-0196)

Substrate Fabrication Flows: FCES 6301:15Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s)



Assembly Flows: FCES 6301:15Substrate Attach: Conductive Epoxy, Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Gold


Package Information: Metal Package, Axial Leads, Seam Weld, 5.3 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.3 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish; Ceramic Package, Pin Grid Array, Seam Weld, 5 Seal Perimeter, 101 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.13 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish


-9-QML-38534-29



Canadian Marconi Company (CAGE Code: 90073)600 Dr. Frederik Philips Boulevard, Ville Saint Laurent, Quebec, Canada H3P 1Y9

Company Contact: Mr. Gino Pisano, Phone: 514-748-3000, Fax: 514-748-3100DSCC Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Voltage Regulator

Class H, Class E

Qualification Letters: EQ(EQC-91-720), EQ(EQC-92-427), VQ(VQH-98-0133)

Substrate Fabrication Flows: 411-146425-000Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors



Assembly Flows: 411-146425-000Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Axial Leads, Seam Weld, 3.61 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, Bathtub, Seam Weld, 4.3 Seal Perimeter, 24 Leads, Gold Lead Finish


-10-QML-38534-29



Cincinnati Electronics Corporation (CAGE Code: 80045)7500 Innovation Way, Mason, OH 45040-9699, US

Company Contact: Mr. Emil Paquette, Phone: 973-573-6243, Fax: 973-573-6290, E-mail: [email protected] Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Custom, Analog, Amplifier, Linear

Class D


Substrate Fabrication Flows: 637140Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s)



Assembly Flows: 637143Substrate Attach: Nonconductive EpoxyElement Attach: Conductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Radial Leads, Laser Seal, 8 Seal Perimeter, 69 Leads, Gold Lead Finish


Class H, Class E

Qualification Letters: EQ(EQC-93-113), EQC-93-197, ELS(ELSH-94-417)

Substrate Fabrication Flows: 637140Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s)



Assembly Flows: 637143Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Axial Leads, Seam Weld, 3.48 Seal Perimeter, 18 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, 20 Leads, Gold Lead Finish


-11-QML-38534-29



CTS Microelectronics (CAGE Code: 23223)1201 Cumberland Avenue, West Lafayette, IN 47906-1388, US

Company Contact: Mr. Duane Ringeisen, Phone: 765-463-2565, Fax: 765-497-5399, E-mail: [email protected] Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Analog Converter

Class H, Class E

Qualification Letters: EQ(EQC-92-787), EQ(EQC-93-015), ELS(ELSH-94-0054), VQ(VQH-97-0223)

Substrate Fabrication Flows: STD-THINFLM-BD1, STD-RC-HIRELSubstrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina Nitride, 2 Conductor Level(s), Resistors



Assembly Flows: STD-C&W-1772Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, TO can, Projection Weld, 2.75 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 2.35 Seal Perimeter, 4 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.4 Seal Perimeter, 30 Leads, Gold Lead Finish


-12-QML-38534-29



Datel Incorporated (CAGE Code: 50721)11 Cabot Boulevard, Mansfield, MA 02048-1194, US

Company Contact: Mr. Tim Brown, Phone: 508-339-3000, Fax: 508-339-6356, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Digital

Class H, Class E

Qualification Letters: EQ(EQC-90-626), EQ(EQC-90-677), EQ(EQC-91-029), EQ(EQC-92-446), ELS(ELSH-95-0356), VQ(VQH-97-0084), VQ(VQH-98-0261)

Substrate Fabrication Flows: D-4552Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s)



Assembly Flows: D-4552Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.24 Seal Perimeter, 62 Leads, Gold Lead Finish


-13-QML-38534-29



DDC Ireland LTD. (CAGE Code: S7631)Cork Business and Technology Park, Model Farm Road, Cork, Ireland

Company Contact: Ms. Caroline Dynan, Phone: 353-21-341065, Fax: 353-21-341568, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]


Technologies: 1553 Bus, Data Converters

Class H, Class E

Qualification Letters: EQ(EQM-94-0109), ELS(ELSH-94-0163), ELS(ELSH-94-0463), ELS(ELSH-95-0019), ELS(ELSH-95-0116), ELS(ELSH-95-0148), ELS(ELSH-95-0361), ELS(ELSH-96-0038), ELS(ELSH-96-0053), ELS(ELSH-96-0071), VQ(VQH-97-0112), VQ(VQH-98-0182), VQ(VQH-99-0149), VQ(VQH-99-0133)

Substrate Fabrication Flows: ILC DDC (Bohemia, NY): 41637, ILC DDC (Bohemia, NY): 41638Substrate Fabrication: Thick Film on Alumina, 5 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: 60005Substrate Attach: Conductive Epoxy, Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Daughter BoardWire Bonding: Gold


Package Information: Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.8 Seal Perimeter, 70 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5.34 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish, Getter Qualified


-14-QML-38534-29



EMS Technologies Incorporated (CAGE Code: 31395)P.O. Box 7700, Norcross, GA 30091-7700, US

Company Contact: Mr. Kevin Lane, Phone: 770-263-9200, Fax: 770-441-3757, E-mail: [email protected] Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Analog, Digital


Qualification Letters: ELS(ELSH-94-109), ELS(ELSH-95-171), ELS(ELSH-95-172), ELS(ELSH-95-0212), ELS(ELSH-96-0019)

Substrate Fabrication Flows: 171771Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s); Purchased Thin Film



Assembly Flows: 171773Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 34 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-fire Package, Flatpack, Seam Weld, 3.94 Seal Perimeter, 40 Leads, Gold Lead Finish, Getter Qualified


-15-QML-38534-29



Film Microelectronics Incorporated (CAGE Code: 27851)530 Turnpike Street, North Andover, MA 01845, US

Company Contact: Mr. Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Low Power

Class H, Class E

Qualification Letters: ELS(ELSH-95-0183), VQ(VQH-98-0177), VQ(VQH-98-0232), VQ(VQH-99-0176), VQ(VQH-99-0204)

Substrate Fabrication Flows: 52-0069Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s)



Assembly Flows: 52-0015Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip ResistorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.65 Seal Perimeter, 12 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 6 Seal Perimeter, 12 Leads, Nickel Lead Finish


-16-QML-38534-29



General Microcircuits Corporation (CAGE Code: 67294)780 Boston Road, Billerica, MA 08121-5925, US

Company Contact: Mr. John Gerrior, Phone: 978-663-9101, Fax: 978-63-9132, E-mail: [email protected] Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Custom

Class H, Class E

Qualification Letters: EQ(EQC-89-235), EQ(EQC-93-587), VQH-97-0082

Substrate Fabrication Flows: 10000Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: 10000Substrate Attach: Conductive Epoxy, Nonconductive EpoxyElement Attach: Conductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.45 Seal Perimeter, 22 Leads, Gold Lead Finish


-17-QML-38534-29



Hewlett-Packard Company (CAGE Code: 50434)Optical Communications Division, 370 West Trimble Road, San Jose, CA 95131-1008, US

Company Contact: Ms. Ann Harding, Phone: (408) 435-6707, Fax: (408) 435-6547, E-mail: [email protected] Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Optocoupler


Qualification Letters: EQ(EQM-87-2594), EQ(EQM-88-1265), EQ(EQC-90-0754), EQ(EQC-93-271), EQ(EQC-93-591), ELS(ELSH-95-271), VQ(VQH-97-047)

Substrate Fabrication Flows: N/ASubstrate Fabrication: Purchased Thick Film



Assembly Flows: ICPI-9001-3Substrate Attach: Eutectic, Solder, Silver GlassElement Attach: Eutectic, Silver GlassAdd-on Elements: Unpackaged DieWire Bonding: Gold, Aluminum


Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.28 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Chip Carrier, Solder Seal, 0.92 Seal Perimeter, 20 Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Solder Seal, 1.32 Seal Perimeter, 16 Leads, Gold Lead Finish


-18-QML-38534-29



Honeywell Incorporated (CAGE Code: 58960)21111 North Nineteenth Avenue, Phoenix, AZ 85027-2700, US

Company Contact: Mr. Mark Glancy, Phone: 602-436-3135, Fax: 602-436-1310, E-mail: [email protected] Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Analog, Digital, Drive Controller

Class H, Class E

Qualification Letters: EQ(EQM-87-1933), EQ(EQC-90-0768)

Substrate Fabrication Flows: 51549Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors



Assembly Flows: 51550Substrate Attach: EutecticElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged DieWire Bonding: Gold




-19-QML-38534-29



Hycomp Incorporated (CAGE Code: 34707)165 Cedar Hill Street, Marlborough, MA 01752-3035, US

Company Contact: Mr. Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506DSCC Contact: Mr. Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Analog, Voltage Reference

Class H, Class E

Qualification Letters: EQ(EQC-89-421), ELS(ELSH-94-0252), ELS(ELSH-94-0253), ELS(ELSH-94-0254)

Substrate Fabrication Flows: EMA-75Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s); Thin Film on Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: EMA-75Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Ceramic Package, Single-in-line, Seam Weld, 2.9 Seal Perimeter, 10 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 2.57 Seal Perimeter, 14 Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier, Seam Weld, 1.62 Seal Perimeter, 28 Leads, Solder Lead Finish


-20-QML-38534-29



Hytek Microelectronics Incorporated (CAGE Code: OANM4)400 Hot Springs Road, Carson City, NV 89706-1609, US

Company Contact: Mrs. Kathy Cano, Phone: 702-883-0820, Fax: 702-883-0827, E-mail: [email protected] Contact: Mr. Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Active Delay Line

Class H, Class E

Qualification Letters: EQ(EQC-91-859), EQ(EQM-94-0023)

Substrate Fabrication Flows: RN1005-002Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)



Assembly Flows: RN1005-002Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, InductorsWire Bonding: Gold


Package Information: Metal Package, Platform, Projection Weld, 2.94 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 2.94 Seal Perimeter, 30 Leads, Gold Lead Finish


-21-QML-38534-29



ILC Data Device Corporation (CAGE Code: 19645)105 Wilbur Place, Bohemia, NY 11716-2482, US

Company Contact: Mr. Michael Green, Phone: 516-567-5600, Fax: 516-567-7358, E-mail: [email protected] Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: TRBPeriodic Inspection System: Options 1 and 2

Technologies: 1553 Bus, Data Converters, Power

Class H, Class E

Qualification Letters: EQ(EQC-90-657), EQ(EQC-91-606), EQ(EQC-93-625)

Substrate Fabrication Flows: 41639, 41638Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors; Thin Film on

Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: 41634, 45552Substrate Attach: Nonconductive Epoxy, Conductive Epoxy, SolderElement Attach: Nonconductive Epoxy, Conductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, TransformersWire Bonding: Gold, Aluminum, Copper/Tin Solder


Package Information: Metal Package, Axial Leads, Seam Weld, 4.1 Seal Perimeter, 24 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8.8 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified

Engineering Line


Class H, Class E

Qualification Letters: EQ(EQC-90-220), EQ(EQC-91-104), EQ(EQC-91-306), EQ(EQC-91-308), EQ(EQC-91-386), EQ(EQC-91-667), EQ(EQC-93-055), EQ(EQC-93-199), EQ(EQC-93-599), ELS(ELSH-94-0327), ELS(ELSH-94-0392), ELS(ELSH-94-0399), ELS(ELSH-95-0140), ELS(ELSH-95-0266), VQ(VQH-96-0203), VQ(VQH-98-0101), VQ(VQH-99-0033)

Substrate Fabrication Flows: 41637, 41638Substrate Fabrication: Thick Film on Alumina, 5 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s)



Assembly Flows: 36070, 36071Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, TransformersWire Bonding: Gold, Aluminum


Package Information: Metal Package, Axial Leads, Seam Weld, 10.26 Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, 5.38 Seal Perimeter, 32 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 7.58 Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.8 Seal Perimeter, 70 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 5.8 Seal Perimeter, 70 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified

Manufacturing Line


-22-QML-38534-29



Interpoint Corporation (CAGE Code: 50821)10301 Willows Road, P.O. Box 97005, Redmond, WA 98073-9705, US

Company Contact: Mr. Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: [email protected] Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Linear Amplifier, Signal Processor, Data Converters, DC/DC Converters, Analog, Digital, EMI Filters


Qualification Letters: EQ(EQM-87-2838), EQ(EQM-89-0439), EQ(EQC-92-174), EQ(EQC-92-300), EQ(EQC-93-056), EQ(EQC-93-031), EQ(EQC-93-196), EQ(EQC-93-221), EQ(EQC-93-280), EQ(EQC-93-550), EQC-93-624, EQ(EQM-94-043), EQ(EQM-94-0111), ELS(ELSH-94-0297), ELS(ELSH-94-0336), ELS(ELSH-94-0364), ELS(ELSH-95-0036), ELS(ELSH-95-0375), ELS(ELSH-96-0139), ELS(ELSH-96-0095), VQ(VQH-96-0214), VQ(VQH-98-0253), VQ(VQH-99-0013), VQ(VQH-99-0070)

Substrate Fabrication Flows: QA-039Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors; Thick Film on

Beryllia, 1 Conductor Level(s)



Assembly Flows: QA-039Substrate Attach: Solder, Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, ToroidsWire Bonding: Gold, Aluminum, Copper


Package Information: Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 6.4 Seal Perimeter, 5 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 6 Seal Perimeter, 38 Leads, Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 32 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.26 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish


-23-QML-38534-29



Interpoint Taiwan Corporation (CAGE Code: 50821)2-1 West First Street, KEPZ, Kaohsiung, Taiwan, R.O.C

Company Contact: Mr. Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: [email protected] Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: [email protected]


Technologies: DC-DC Converter

Class H, Class E

Qualification Letters: VQ(VQH-97-0266), VQ(VQH-99-0134), VQ(VQH-99-0200)

Substrate Fabrication Flows: QA-039Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors



Assembly Flows: QA-039Substrate Attach: SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, ToroidsWire Bonding: Gold, Aluminum, Copper


Package Information: Metal Package, Axial Leads, Projection Weld, 5.14 Seal Perimeter, 8 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 20 Leads, Gold Lead Finish


-24-QML-38534-29



Lambda Advanced Analog Incorporated (CAGE Code: 52467)2270 Martin Avenue, Santa Clara, CA 95050-2781, US

Company Contact: Mr. James Mazzuco, Phone: 408-998-4930, Fax: 408-988-2702, E-mail: [email protected] Contact: Mr. Ray Crothers, Phone: 614-692-0583, Fax: 614-692-6942, E-mail: [email protected]


Technologies: AD/DA Converters, Sample and Hold, Amplifier, DC/DC Converters

Class H, Class E

Qualification Letters: EQ(EQC-93-553), EQ(EQC-93-658), ELS(ELSH-94-0173), ELS(ELSH-94-0211), ELS(ELSH-94-0212), ELS(ELSH-94-0272), ELS(ELSH-94-0482), ELS(ELSH-94-0483), VQ(VQH-98-0100), VQ(VQH-98-0231), EQ(EQC-89-065), EQ(EQC-90-652), EQ(EQC-92-103), EQ(EQC-93-204), EQ(EQC-93-403)

Substrate Fabrication Flows: 8002-0044Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thick Film on Beryllia, 6 Conductor Level(s), Resistors; Purchased Direct

Bonded Copper



Assembly Flows: 8002-0044Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, TransformerWire Bonding: Gold, Aluminum, Copper


Package Information: Ceramic Package, Dual-in-line, Seam Weld, 3.69 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 6.58 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 10.1 Seal Perimeter, 58 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, TO Can, Projection Weld, 1.64 Seal Perimeter, 7 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish, Getter Qualified


-25-QML-38534-29



Lockheed Martin Electronics and Missiles (CAGE Code: 04939)5600 Sand Lake Road, Orlando, FL 32819-8907, US

Company Contact: Mr. Joe Agosta, Phone: 407-356-3434, Fax: 407-356-6808DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Analog, Digital

Class H, Class E

Qualification Letters: EQ(EQC-91-402), EQ(EQC-91-764), EQ(EQC-92-112), EQ(EQC-92-312), EQ(EQC-92-412), VQ(VQH-99-0164)




Assembly Flows: 72301772Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors, InductorsWire Bonding: Gold, Aluminum


Package Information: Ceramic Package, Leadless Chip Carrier, Solder Seal, 3.8 Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Solder Seal, 2.88 Seal Perimeter, 18 Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 5.76 Seal Perimeter, 44 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 11.8 Seal Perimeter, 140 Leads, Gold Lead Finish


-26-QML-38534-29



M.S. Kennedy Corporation (CAGE Code: 51651)8170 Thompson Road, Cicero, NY 13039-9393, US

Company Contact: Mr. Daniel Miller, Phone: 315-699-9201, Fax: 315-699-8023, E-mail: [email protected] Contact: Ms. Binh Tonnu, Phone: 614-692-0586, Fax: 614-692-6942, E-mail: [email protected]


Technologies: High Power, DC Amplifier, PWB H-Bridge, Custom


Qualification Letters: EQ(EQC-90-451), EQ(EQC-90-507), EQ(EQC-92-417), EQ(EQC-93-141), EQ(EQC-93-242), EQ(EQC-93-346), EQ(EQC-93-488), EQ(EQC-93-554), EQ(EQC-93-682), EQ(EQC-93-687), EQ(EQM-94-084), EQ(EQM-94-093), ELS(ELSH-94-0400), ELS(ELSH-94-0401), ELS(ELSH-94-0402), ELS(ELSH-94-0470), ELS(ELSH-95-0020), ELS(ELSH-95-0216), ELS(ELSH-95-0304), ELS(ELSH-96-0073), ELS(ELSH-96-0086), VQ(VQH-96-0206), VQ(VQH-97-0046), VQ(VQH-97-0073), VQ(VQH-97-0089), VQ(VQH-97-0223), VQ(VQH-97-0228), VQ(VQH-97-0238), VQ(VQH-97-0243), VQ(VQH-98-0246), VQ(VQH-99-0145)

Substrate Fabrication Flows: 2422-1563Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, 4 Conductor Level(s); Purchased

Alumina/Copper; Thick Film on Beryllia, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)



Assembly Flows: 2422-1518Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, InductorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, TO Can, Projection Weld, 3.14 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Platform, Projection Weld, 2.6 Seal Perimeter, 14 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam Weld, 5 Seal Perimeter, 44 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6.95 Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Brazed Leads, Solder Seal, 2.06 Seal Perimeter, 28 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Brazed Leads, Solder Seal, 2.1 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.4 Seal Perimeter, 20 Leads, Gold Lead Finish, Getter Qualified


-27-QML-38534-29



Micro Networks Company (CAGE Code: 50507)324 Clark Street, Worchester, MA 01606-1298, US

Company Contact: Ms. Abbie Hartmaier, Phone: 508-852-5400, Fax: 508-853-8296, E-mail: [email protected] Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Data Converters, Track and Hold Amp

Class H, Class E

Qualification Letters: EQ(EQM-88-0709), EQ(EQC-91-235), EQ(EQC-91-894), EQ(EQC-92-062), EQ(EQC-93-162), EQ(EQC-94-008), ELS(ELSH-95-0269)

Substrate Fabrication Flows: FC-23Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s), Resistors



Assembly Flows: FC-25Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.13 Seal Perimeter, 22 Leads, Solder Lead Finish


-28-QML-38534-29



Micropac Industries, Incorporated (CAGE Code: 31757)905 East Walnut Street, Garland, TX 75040-6696, US

Company Contact: Ms. Shirley Large, Phone: 972-272-3571, Fax: 972-494-2281DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Custom, Power, Optocouplers


Qualification Letters: EQ(EQC-91-178), EQ(EQC-91-647), EQ(EQC-92-183), EQ(EQC-92-258)




Assembly Flows: 90138Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Axial Leads, Seam Weld, 5 Seal Perimeter, 28 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 5 Seal Perimeter, 46 Leads, Gold/Solder Lead Finish, Getter Qualified

Custom Line



Qualification Letters: EQ(EQC-90-624), EQ(EQC-91-188), EQ(EQC-91-466), EQ(EQC-92-120), ELS(ELSH-95-0057), ELS(ELSH-95-0444)

Substrate Fabrication Flows: 90138Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, 1 Conductor Level(s)



Assembly Flows: 90138Substrate Attach: Conductive Epoxy, Nonconductive EpoxyElement Attach: Conductive EpoxyAdd-on Elements: Unpackaged DieWire Bonding: Gold


Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.89 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.6 Seal Perimeter, 24 Leads, Solder Lead Finish, Getter Qualified; Metal Package, TO Can (dual base), Projection Weld, 0.54 Seal Perimeter, 7 Leads, Gold/Solder Lead Finish, Getter Qualified

Opto Line


-29-QML-38534-29



Micropac Industries, Incorporated (CAGE Code: 31757)905 East Walnut Street, Garland, TX 75040-6696, US


Qualification Letters: EQ(EQC-90-625), EQ(EQC-91-328), EQ(EQC-91-338), EQ(EQC-92-183), EQ(EQC-92-258), ELS(ELSH-94-0496)

Substrate Fabrication Flows: 90138Substrate Fabrication: Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Beryllia, 2 Conductor Level(s), Resistors



Assembly Flows: 90138Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, TO Can, Projection Weld, 2.27 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish, Getter Qualified

Power Line


-30-QML-38534-29



MPC Products Corporation (CAGE Code: 19170)7426 North Linder Avenue, Skokie, IL 60077-3219, US

Company Contact: Mr. Keith Stoddard, Phone: (847) 673-8300, Fax: (847) 673-9789, E-mail: [email protected] Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Motor Drive, Analog Power, Custom

Class H, Class E


Substrate Fabrication Flows: 6H95903044A, Sheet 27Substrate Fabrication: Thick Film on Beryllia, 2 Conductor Level(s), Resistors



Assembly Flows: 6H95903044A, Sheet 27Substrate Attach: Conductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, Peripheral, Seam Weld, 5.5 Seal Perimeter, 12 Leads, Gold Lead Finish


-31-QML-38534-29



Natel Engineering Company, Inc. (CAGE Code: 09059)4550 Runway Street, Simi Valley, CA 93063-3493, US

Company Contact: Ms. Betty May, Phone: 818-734-6500, Fax: 818-734-6540, E-mail: [email protected] Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Synchro/Digital Converters

Class H, Class E

Qualification Letters: EQ(EQC-91-714), EQ(EQC-92-048), EQ(EQC-92-039), EQ(EQC-92-202), EQ(EQC-93-261), ELS(ELSH-95-0154), ELS(ELSH-95-0314)

Substrate Fabrication Flows: NHPS-01.001Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s)



Assembly Flows: NHPS-01.001Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Ceramic Posts, Daughter BoardWire Bonding: Gold




-32-QML-38534-29



National Hybrid, Incorporated (CAGE Code: 57363)2200 Smithtown Avenue, Ronkonkama, NY 11779-7359, US

Company Contact: Mr. Don Sartorius, Phone: 516-981-2400, Fax: 516-981-2445DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Linear, Data Converters, Digital, Sample and Hold, Data Bus, Amplifier, Custom

Class H, Class E

Qualification Letters: EQ(EQC-90-557), EQ(EQC-92-035), EQ(EQC-92-291), EQ(EQM-94-0127), ELS(ELSH-94-255), ELS(ELSH-94-274), ELS(ELSH-94-359), ELS(ELSH-94-475), VQ(VQH-97-0093), VQ(VQH-97-0098)

Substrate Fabrication Flows: FL1772A7THKSubstrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)



Assembly Flows: FL883500834Substrate Attach: Conductive Epoxy, Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Inductors, Daughter Board, Chip Thermistor, InductorsWire Bonding: Gold


Package Information: Metal Package, Axial Leads, Seam Weld, 6.32 Seal Perimeter, 66 Leads, Gold Lead Finish; Metal (2 piece) Package, Peripheral Leads, Seam Weld, 7.1 Seal Perimeter, 78 Leads, Gold Lead Finish; Metal (1 piece) Package, Peripheral Leads, Seam Weld, 5.74 Seal Perimeter, 112 Leads, Gold/Solder Lead Finish; Ceramic Package, Side Brazed Leads, Seam Weld, 2.42 Seal Perimeter, 20 Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Pin Grid Array, Seam Weld, 4.4 Seal Perimeter, 66 Leads, Gold/Solder Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.26 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish


-33-QML-38534-29



Northrop Grumman Corporation (CAGE Code: 26916)Electronic Sensors and Systems Sector, Defensive Systems Division, 600 Hicks Road, Rolling Meadows, IL 60008-1098, US

Company Contact: Mr. Joseph Sowka, Phone: 847-259-9600, Fax: 847-870-5746DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Digital, Linear

Class D

Qualification Letters: ELS(ELSH-94-452)

Substrate Fabrication Flows: Custom(BVM)-Process(182) 058-006501-001Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s)



Assembly Flows: Custom(BVM)-Process(182) 058-006501-001Substrate Attach: Nonconductive EpoxyElement Attach: Conductive EpoxyAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Gold




-34-QML-38534-29



Omnirel Corporation (CAGE Code: 69210)205 Crawford Street, Leominster, MA 01453-2353, US

Company Contact: Mr. Martin Enright, Phone: 978-534-5776, Fax: 978-537-4246, E-mail: [email protected] Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Voltage Regulator, Power

Class H, Class E

Qualification Letters: EQ(EQC-91-408), EQ(EQC-91-807), EQ(EQC-91-838), EQ(EQM-94-0029), ELS(ELSH-94-0388), VQ(VQH-98-0014)

Substrate Fabrication Flows: D070002GSubstrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors



Assembly Flows: D050015GSubstrate Attach: SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip ResistorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.47 Seal Perimeter, 8 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 8.8 Seal Perimeter, 20 Leads, Gold Lead Finish; Metal Package, TO Can, Projection Weld, 2.64 Seal Perimeter, 8 Leads, Nickel Lead Finish


-35-QML-38534-29



Q-Bit Corporation (CAGE Code: 55027)2575 Pacific Avenue N.E., Palm Bay, FL 32905-2699, US

Company Contact: Mr. Robert Novak, Phone: 407-727-1838, Fax: 407-727-3729, E-mail: [email protected] Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: [email protected]


Technologies: RF Amplifier


Qualification Letters: EQ(EQC-93-252), EQ(EQC-93-529), ELS(ELSH-94-278), ELS(ELSH-94-325), ELS(ELSH-95-0025), ELS(ELSH-96-0074)

Substrate Fabrication Flows: QB 500011Substrate Fabrication: Thin Film on Beryllia, 1 Conductor Level(s); Thin Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina, 1

Conductor Level(s), Resistors



Assembly Flows: QB 801805Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, TransformersWire Bonding: Gold, Copper


Package Information: Metal Package, TO Can, Projection Weld, 1.57 Seal Perimeter, 4 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, Brazed Leads, Seam Weld, 1.18 Seal Perimeter, 4 Leads, Gold Lead Finish


-36-QML-38534-29



Raytheon Company (CAGE Code: 94144)Missile Systems Division, 465 Centre Street, Quincy, MA 02169-7530, US

Company Contact: Mr. Joseph Gennari, Phone: 617-984-4109, Fax: 617-984-4195DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Amplifier

Class H, Class E

Qualification Letters: EQ(EQM-87-1031), EQ(EQC-91-668), EQ(EQC-91-669), EQ(EQC-92-327), EQ(EQC-92-372)




Assembly Flows: 42771Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip ResistorsWire Bonding: Gold




-37-QML-38534-29



Raytheon TI Systems, Inc. (CAGE Code: 96214)P.O. Box 655012, Dallas, TX 75265-5012, US

Company Contact: Ms. Linda Muniz, Phone: 972-995-1096, Fax: 972-995-6206, E-mail: [email protected] Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Linear, A/D Converter, Amplifier, Squib Driver, Digital, Regulator

Class H, Class E

Qualification Letters: EQ(EQC-91-031), EQ(EQC-92-392), ELS(ELSH-94-0140), ELS(ELSH-95-0092), ELS(ELSH-95-421), ELS(ELSH-95-422), ELS(ELSH-95-423), ELS(ELSH-95-424), ELS(ELSH-95-425), ELS(ELSH-95-426), ELS(ELSH-95-427), ELS(ELSH-95-428), ELS(ELSH-95-434), ELS(ELSH-95-435), ELS(ELSH-96-0085), ELS(ELSH-96-0113), ELS(ELSH-96-0116), ELS(ELSH-96-0117), ELS(ELSH-96-0149), VQ(VQH-97-0111), VQ(VQH-97-0151)

Substrate Fabrication Flows: All-HYB-005Substrate Fabrication: Purchased Thick Film



Assembly Flows: All-HYB-005Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip ResistorsWire Bonding: Gold, Aluminum


Package Information: Metal Package, Axial Leads, Seam Weld, 7.88 Seal Perimeter, 64 Leads, Gold Lead Finish; Metal Package, Single-in-line, Seam Weld, 4.62 Seal Perimeter, 6 Leads, Gold Lead Finish; Metal Package, Axial Leads, Projection Weld, 2.43 Seal Perimeter, 8 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.78 Seal Perimeter, 10 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 3.3 Seal Perimeter, 32 Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier, Seam Weld, 2.76 Seal Perimeter, 18 Leads, Gold Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.06 Seal Perimeter, 28 Leads, Gold Lead Finish


-38-QML-38534-29



RDL Corporation (CAGE Code: 16478)West Seventh Avenue and Freedley Street, Conshohocken, PA 19428-1699, US

Company Contact: Mr. Daniel Mieczkowski, Phone: 610-825-3750, Fax: 610-825-3530DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Microwave, Amplifier

Class H, Class E


Substrate Fabrication Flows: N/ASubstrate Fabrication: Purchased Thick Film



Assembly Flows: 476038, 376189Substrate Attach: Conductive EpoxyElement Attach: Conductive Epoxy, Eutectic, SolderAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Gold


Package Information: Metal Package, TO Can, Projection Weld, 0.5 Seal Perimeter, 20 Leads, Gold Lead Finish


-39-QML-38534-29



REMEC Incorporated (CAGE Code: 65628)9404 Chesapeake Drive, San Diego, CA 92123, US

Company Contact: Mr. Bradford Born, Phone: 619-505-3294, Fax: 619-569-7364, E-mail: [email protected] Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: [email protected]

Quality Management (QM) Program: TRBPeriodic Inspection System: Option 1ISO 9000 System: ISO 9001 approved by DSCC-VQH

Technologies: Microwave Amplifier, Microwave Filter, Microwave Custom (IMAs)

Class H, Class E

Qualification Letters: ELS(ELSH-94-199), VQ(VQH-96-226), VQ(VQH-96-227), VQ(VQH-97-0180), VQ(VQH-97-0181)

Substrate Fabrication Flows: N/ASubstrate Fabrication: Purchased Thin Film; Purchased Duriod; Purchased Polyimide/PWB Copper



Assembly Flows: 001775Substrate Attach: Conductive Epoxy, Eutectic, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, SolderAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Toroids, Coils, Thermcon, InductorsWire Bonding: Gold, Copper, Ribbon


Package Information: Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 16 Leads, Gold Lead Finish; Aluminum/Stainless Steel Package, DC/Microwave Leads, Laser Weld, 12.5 Seal Perimeter, 6 Leads; Aluminum/Stainless Steel Package, DC/Microwave Leads (Dual-Sided, Multi-Cavity), Laser Weld, 24 Seal Perimeter, 4 Leads


-40-QML-38534-29



Sipex Corporation (CAGE Code: 33256)Hybrid Systems Division, 22 Linnell Circle, Billerica, MA 01821-3985, US

Company Contact: Mr. Herb Shifres, Phone: 978-667-8700, Fax: 978-667-8310, E-mail: [email protected] Contact: Mr. Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: [email protected]


Technologies: A/D Converter, D/A Converter, Data Acquisition Systems, Sample and Hold, Voltage Reference

Class H, Class E

Qualification Letters: EQ(EQC-90-506), EQ(EQC-91-781), EQ(EQC-91-813), EQ(EQC-92-052), EQ(EQC-92-438), EQ(EQC-93-524), ELS(ELSH-94-0329), ELS(ELSH-94-477), ELS(ELSH-95-0075), ELS(ELSH-95-0215), VQ(VQH-99-0177)

Substrate Fabrication Flows: 239-0232Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s); Purchased Thick Film



Assembly Flows: 239-0458Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Seam Weld, 5.78 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Dual-in-line, Seam Weld, 4.17 Seal Perimeter, 24 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.53 Seal Perimeter, 64 Leads, Gold/Solder Lead Finish; Ceramic Package, Axial Leads, Seam Weld, 2.88 Seal Perimeter, 68 Leads, Gold/Solder Lead Finish


-41-QML-38534-29



Solitron Devices, Incorporated (CAGE Code: 21845)3301 Electronics Way, West Palm Beach, FL 33407-4697, US

Company Contact: Mr. Ed Roman, Phone: 407-848-4311, Fax: 407-863-5946, E-mail: [email protected] Contact: Mr. Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Linear, Power, Voltage Regulator

Class H, Class E

Qualification Letters: ELS(ELSH-94-0316), ELS(ELSH-94-0433), ELS(ELSH-95-0079), ELS(ELSH-95-0210), VQ(VQH-99-0180), VQ(VQH-99-0195)

Substrate Fabrication Flows: H1043Substrate Fabrication: Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors



Assembly Flows: H1040Substrate Attach: Eutectic, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, EutecticAdd-on Elements: Unpackaged Die, Chip Capacitors, TabsWire Bonding: Gold, Aluminum


Package Information: Metal Package, Peripheral Leads, Seam Weld, 4.64 Seal Perimeter, 6 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, TO Can, Projection Weld, 2.86 Seal Perimeter, 3 Leads, Gold/Solder Lead Finish, Getter Qualified


-42-QML-38534-29



Teledyne Electronic Technologies (CAGE Code: 16170)12964 Panama Street, Los Angeles, CA 90066-6534, US

Company Contact: Mr. Steve Thompson, Phone: 310-574-2047, Fax: 310-574-2093, E-mail: [email protected] Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Data Converters, Linear, Microwave

Class H, Class E

Qualification Letters: EQ(EQM-87-1898), EQ(EQC-91-897), EQ(EQM-94-0085), EQ(EQM-94-0098), EQ(EQM-94-138), ELS(ELSH-94-313)

Substrate Fabrication Flows: 7700530 Exhibit 2.5, 7700530 Exhibit 2.4Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s); Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thin Film on Alumina, 1

Conductor Level(s), Resistors



Assembly Flows: 7700530 Exhibit 2.6Substrate Attach: Nonconductive Epoxy, SolderElement Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, EutecticAdd-on Elements: Unpackaged Die, Chip CapacitorsWire Bonding: Gold, Aluminum, Ribbon


Package Information: Metal Package, Peripheral Leads, Seam Weld, 8.75 Seal Perimeter, 94 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 5 Seal Perimeter, 24 Leads, Gold Lead Finish


-43-QML-38534-29



White Electronic Design Corporation (CAGE Code: 54230)3601 East University Drive, Phoenix, AZ 85043-7217, US

Company Contact: Ms. Marlene Maat, Phone: 602-437-1520, Fax: 602-437-9120, E-mail: [email protected] Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: [email protected]


Technologies: Linear (Oscillator), Digital Memory

Class H, Class E

Qualification Letters: EQ(EQC-92-070), EQ(EQC-92-138), EQC-93-457, EQ(EQC-93-508), ELS(ELSH-94-0256), ELS(ELSH-95-0107), ELS(ELSH-95-0365), ELS(ELSH-95-0014), ELS(ELSH-96-0184), ELS(ELSH-96-0186), VQ(VQH-96-0210), VQ(VQH-96-0211), VQ(VQH-97-0016), VQ(VQH-97-0170), VQ(VQH-98-0172)

Substrate Fabrication Flows: 106A00006Substrate Fabrication: Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina, 6 Conductor Level(s)



Assembly Flows: 106A00006Substrate Attach: Nonconductive EpoxyElement Attach: Conductive Epoxy, Nonconductive EpoxyAdd-on Elements: Unpackaged Die, Chip Capacitors, Chip ResistorsWire Bonding: Gold


Package Information: Metal Package, Platform, Projection Weld, 3.53 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-fire Package, Brazed Leads, Seam Weld, 5.36 Seal Perimeter, 68 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4.58 Seal Perimeter, 66 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Package, Pin Grid Array, Seam Weld, 4.1 Seal Perimeter, 66 Leads, Gold Lead Finish, Getter Qualified


-44-QML-38534-29

Standardized Microcircuit Drawing (SMD) Approved Source Master Product Listing: Table 1, Table 2, Table 3, and Table 4

PRODUCT ELIGIBILITY: The manufacturers listed in tables 1, 2, 3 and 4 have certified that the Hybrid Microcircuits are built, tested, and shipped using MIL-PRF-38534 CERTIFIED FLOW/QUALIFIED MATERIALS and MANUFACTURING TECHNIQUES and are in FULL COMPLIANCE with MIL-PRF-38534 requirements.

Approved Source Master Product Listing


Standard MicrocircuitDrawing

ManufacturerSimilar Part Number /4

ESDSClass

Product Type/Description

CAGE Code

Sorted by Standard Microcircuit Drawing

Approved Source

Table 1

51651MSKCURRENT AMPLIFIER1MSK0002H7801301XC

27851FMICURRENT AMPLIFIER1FLH0002H/8837801301XA

No SourceCURRENT AMPLIFIERLH00027801301GA

51651MSKCURRENT AMPLIFIER1MSK0002H7801301XA

27851FMIOP AMP1FLH0032G/8838001301ZA

51651MSKOP AMP1MSK0032B8001301ZC

51651MSKOP AMP1MSK0032B8001301ZA

51651MSKVOLT. FOLLOWER/BUFFER1MSK0033B8001401ZC

51651MSKVOLT. FOLLOWER/BUFFER1MSK0033B8001401ZA

27851FMIVOLT. FOLLOWER/BUFFER1FLH0033G/8838001401ZA

50434HPOPTOCOUPLER, DUAL36N134/883B#1008102801UA

31757MicropacOPTOCOUPLER, DUAL166013-0018102801EC

50434HPOPTOCOUPLER, DUAL36N134/883B#1008102801UC

31757MicropacOPTOCOUPLER, DUAL166013-0018102801EA

50434HPOPTOCOUPLER, DUAL36N134/883B#3008102801TA

50434HPOPTOCOUPLER, DUAL36N134/883B#2008102801EA

31757MicropacOPTOCOUPLER, DUAL166072-001/883B8102801XA

31757MicropacOPTOCOUPLER, DUAL166072-001/883B8102801XC

50434HPOPTOCOUPLER, DUAL36N134/883B8102801EC

50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE AND GROUND CONNECTIONS

3HCPL-5631#3008102802ZA


3HCPL-56318102802PC


3HCPL-5631#1008102802YA

31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE AND GROUND CONNECTIONS

166056-1038102802PA


3HCPL-5631#2008102802PA

31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY VOLTAGE AND GROUND CONNECTIONS

166056-1038102802PC


3HCPL-5631#1008102802YC

50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE AND GROUND CONNECTIONS

3HCPL-663181028032A

31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE AND GROUND CONNECTIONS

166123-00181028032A

31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE SUPPLY VOLTAGE AND GROUND CONNECTIONS

166123-00181028032C

50434HPOPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY VOLTAGE AND GROUND CONNECTIONS

3(4)HCPL-66518102804FC


3(4)HCPL-56518102805PC


3(4)HCPL-5651#2008102805PA

24355AnalogD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT

1DAC87CBI8300201JC

24355AnalogD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT

1DAC87CBI8300201JA

No SourceD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE VOLTAGE OUTPUT

DAC878300201XA

31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A/883B8302401EC

31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A/883B8302401EA

31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A8302401XA

-45-QML-38534-29

Approved Source Master Product Listing


Standard MicrocircuitDrawing

ManufacturerSimilar Part Number /4

ESDSClass

Product Type/Description

CAGE Code

Sorted by Standard Microcircuit Drawing

Approved Source

Table 1

50434HPOPTOCOUPLER, 4-CHANNEL3(>4)HCPL-67518302401FC

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B8302401EC

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#6008302401ZC

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#6008302401ZA

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#2008302401EA

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#1008302401YA

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#1008302401YC

50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#3008302401XA

No SourceVOLT. REFERENCE, +10.000V, PRECISION27008503001XA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD/883B8503001CA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503001YC

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503001YA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD/883B8503001CC

34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700SLCC/883B85030013A

34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700SD/883B8503001YA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503002YC

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503002YA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700UD/883B8503002CA

No SourceVOLT. REFERENCE, +10.000V, PRECISION2700U8503002XA

33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700UD/883B8503002CC

34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700ULCC/883B85030023A

34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700UD/883B8503002YA

34707HycompVOLT. REFERENCE, 10.000V, PRECISION1HC2702SD/883B8503003YA

33256SipexVOLT. REFERENCE, 10.000V

qml-38534-29, qualified manufacturers list of custom ... · non-smd product dated after...

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