prototyping with surface mount technology · prototyping strategies divide and conquer approach...
TRANSCRIPT
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Prototyping with SurfaceMount Technology
Take your Design to the Market
Well before Sunset
Ajith Narayanan
Zoid Labs
28 Feb 2019
Zoid Labs IEW 2019 1
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From Idea to Product
Idea Proto-1
Proto-2
. . .Proto-N
Product
Zoid Labs IEW 2019 2
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Context:
• Limited Resources
• Budgetary constraints
• Desire to in-source• e.g to protect IP
• e.g to build technology base
• Non-trivial level of complexity
• Time to Market
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 4
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 5
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 6
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 7
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 8
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 9
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 10
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Overview
1 Introduction
2 Prototyping – Strategies, Activities,
Bottlenecks
3 SMT PCB Assembly process & Tips
4 Challenges in prototyping with SMT
5 Reducing cycle time with in-house assembly
6 Streamlining with DFP (Design for
Prototyping)
7 Equipment and Process
8 ConclusionZoid Labs IEW 2019 11
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Introduction: SMT Basics
SMTchip
Zoid Labs IEW 2019 12
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Introduction: SMT Basics
SMTboard
Zoid Labs IEW 2019 13
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Introduction: SMT Basics
SMTMayhem
Zoid Labs IEW 2019 14
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Introduction: SMT Basics
MoreMayhem
Zoid Labs IEW 2019 15
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Introduction: SMT Basics
0201=0.6 x0.3mm,20 x10mil,0.02 x0.01”
Zoid Labs IEW 2019 16
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Introduction: SMT Basics
0080048x4mil=0.2 x0.1mm
Zoid Labs IEW 2019 17
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Section 2
Prototyping:Strategies,Activities,Bottlenecks
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 19
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 20
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 21
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 22
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 23
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 24
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 25
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Prototyping Strategies
• Divide and Conquer approach• E.g. Build and test a sub-circuit• More common towards early stages of
prototyping• Partial assembly → Full assembly
• Big Bang approach
• Build and test completely assembled PCB• Typically for product-intent PCBs• More common towards later stages of
prototyping
Zoid Labs IEW 2019 26
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Activities in Prototyping
Design
Circuit
SchematicDesign
PCB
Layout
Fabricate
PCBAssemble
PCB
Test
Zoid Labs IEW 2019 27
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Activities (in successive steps)
(?) ModifySchematic
(?) ModifyLayout
(?) Refab/rework PCB(?) Replace
parts/Reassemble
PCB
Test
Zoid Labs IEW 2019 28
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Iterative process
• Say 5 iterations
• If a typ. iteration takes 1 day ⇒ 5 days
• If it takes 4 weeks ⇒ 5 months!
• ⇒ Critical to have fast turn-around
• ⇒ Cycle time can make it or break it!
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Iterative process
• Say 5 iterations
• If a typ. iteration takes 1 day ⇒ 5 days
• If it takes 4 weeks ⇒ 5 months!
• ⇒ Critical to have fast turn-around
• ⇒ Cycle time can make it or break it!
Zoid Labs IEW 2019 30
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Iterative process
• Say 5 iterations
• If a typ. iteration takes 1 day ⇒ 5 days
• If it takes 4 weeks ⇒ 5 months!
• ⇒ Critical to have fast turn-around
• ⇒ Cycle time can make it or break it!
Zoid Labs IEW 2019 31
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Iterative process
• Say 5 iterations
• If a typ. iteration takes 1 day ⇒ 5 days
• If it takes 4 weeks ⇒ 5 months!
• ⇒ Critical to have fast turn-around
• ⇒ Cycle time can make it or break it!
Zoid Labs IEW 2019 32
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Iterative process
• Say 5 iterations
• If a typ. iteration takes 1 day ⇒ 5 days
• If it takes 4 weeks ⇒ 5 months!
• ⇒ Critical to have fast turn-around
• ⇒ Cycle time can make it or break it!
Zoid Labs IEW 2019 33
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 35
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 36
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 37
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 38
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 39
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Bottlenecks
• Modify schematic design • Modify the PCB Layout • Re-fab PCB • Rework (modify/hack) PCB • Replace part(s) . . . • Assemble new PCB . . . • Test
Zoid Labs IEW 2019 40
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Section 3
SMT Assembly Process&Process Tips
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SMT PCB Assembly – PCBs, Stencils
Unframed or “cut” stencil
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SMT PCB Assembly – PCBs, Stencils
PCB after placing and reflow
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SMT PCB Assembly – PCBs, Stencils
Assembled PCB, with minor rework
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SMT PCB Assembly Process (1/3)
PCB, Stencil, Paste . . . Action!
• Lay the PCB right side up, for stencilling
• Overlay with stencil, adjust until
registration is good
• Apply solder paste, squeegee through
• Examine solder paste coverage
• Remove stencil without smudging
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SMT PCB Assembly Process (1/3)
PCB, Stencil, Paste . . . Action!
• Lay the PCB right side up, for stencilling
• Overlay with stencil, adjust until
registration is good
• Apply solder paste, squeegee through
• Examine solder paste coverage
• Remove stencil without smudging
Zoid Labs IEW 2019 46
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SMT PCB Assembly Process (1/3)
PCB, Stencil, Paste . . . Action!
• Lay the PCB right side up, for stencilling
• Overlay with stencil, adjust until
registration is good
• Apply solder paste, squeegee through
• Examine solder paste coverage
• Remove stencil without smudging
Zoid Labs IEW 2019 47
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SMT PCB Assembly Process (1/3)
PCB, Stencil, Paste . . . Action!
• Lay the PCB right side up, for stencilling
• Overlay with stencil, adjust until
registration is good
• Apply solder paste, squeegee through
• Examine solder paste coverage
• Remove stencil without smudging
Zoid Labs IEW 2019 48
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SMT PCB Assembly Process (1/3)
PCB, Stencil, Paste . . . Action!
• Lay the PCB right side up, for stencilling
• Overlay with stencil, adjust until
registration is good
• Apply solder paste, squeegee through
• Examine solder paste coverage
• Remove stencil without smudging
Zoid Labs IEW 2019 49
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
Zoid Labs IEW 2019 54
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
Zoid Labs IEW 2019 55
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SMT PCB Assembly Process (2/3)
On their pads, get set. . . Go!• Pick and place components on wet PCB
• Ensure parts are correct• Ensure polarity/orientation• Don’t let solder paste dry up• If doing manually with tweezers, don’t let
parts fly!
• Put loaded PCB into oven
Run appropriate cooking profile
• Remove, Inspect, Re-heat if necessary
Zoid Labs IEW 2019 56
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SMT PCB Assembly Process (3/3)
Finishing up!• Brush & clean with Iso-Propyl Alcohol (IPA)
• Test for power shorts
• . . . Go on to power up test
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SMT PCB Assembly Process (3/3)
Finishing up!• Brush & clean with Iso-Propyl Alcohol (IPA)
• Test for power shorts
• . . . Go on to power up test
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SMT PCB Assembly Process (3/3)
Finishing up!• Brush & clean with Iso-Propyl Alcohol (IPA)
• Test for power shorts
• . . . Go on to power up test
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Process Tips
PCB & Stencil Fabrication
• Usually outsourcing is good.- $ and encourage outsourcing- Standard materials and spec, specialized job,chemical hazards, equipment/skills.
• But inspect results carefully.• “100% tested” may not be so! /• “Cut stencils” are cheap and good X
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Process Tips
PCB & Stencil Fabrication
• Usually outsourcing is good.- $ and encourage outsourcing- Standard materials and spec, specialized job,chemical hazards, equipment/skills.
• But inspect results carefully.• “100% tested” may not be so! /• “Cut stencils” are cheap and good X
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Process Tips
PCB & Stencil Fabrication
• Usually outsourcing is good.- $ and encourage outsourcing- Standard materials and spec, specialized job,chemical hazards, equipment/skills.
• But inspect results carefully.• “100% tested” may not be so! /• “Cut stencils” are cheap and good X
Zoid Labs IEW 2019 62
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Process Tips
PCB & Stencil Fabrication
• Usually outsourcing is good.- $ and encourage outsourcing- Standard materials and spec, specialized job,chemical hazards, equipment/skills.
• But inspect results carefully.• “100% tested” may not be so! /• “Cut stencils” are cheap and good X
Zoid Labs IEW 2019 63
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Paste and Cooking tips
Pasta!
• Use good “Lead Free” paste.Right Type (grain size - e.g. Type 3, Type 4)
• Store paste in fridgeLet it warm up before applying
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Paste and Cooking tips
Pasta!
• Use good “Lead Free” paste.Right Type (grain size - e.g. Type 3, Type 4)
• Store paste in fridgeLet it warm up before applying
Zoid Labs IEW 2019 65
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Section 4
ChallengesinPrototyping
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 68
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 69
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 70
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 71
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 72
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Typical Challenges/Errors/Mistakes
• Design/Layout issues: /$$$
• Sufficient test access?
• Sufficient rework/repair access?
• Components used as per design?
• Correct placement done? (C12 in place
of R12?)
• Correct polarity / orientation?
• Correctly rated part used?
Zoid Labs IEW 2019 73
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Some actual errors (mistakes)
Problem: Board worked for 3 days, then stopped.
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Some actual errors (mistakes)
Problem: Board worked for 3 days, then stopped.
Culprit: Rating!
PCB with many decoupler caps (0.1 µF 10V)
Had a charge pump using one 0.1 µF 50V.
Assembly used the same capacitor for all.
Cap failed (dielectric punch through).
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A fab error
Power board with fab error, a Vout shorted to GND
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A Reflow soldering slip-up
Soldering defect revealed by careful inspection
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Section 5
Reducing Cycle TimewithIn-house Assembly
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Impact of errors
• Assembly error: rework 1 or entire batch
• PCB fabrication error: re-fab PCB, ...
• Schematic error: Re layout, re-fab, ...
• Fix and repeat tests
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Impact of errors
• Assembly error: rework 1 or entire batch
• PCB fabrication error: re-fab PCB, ...
• Schematic error: Re layout, re-fab, ...
• Fix and repeat tests
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Impact of errors
• Assembly error: rework 1 or entire batch
• PCB fabrication error: re-fab PCB, ...
• Schematic error: Re layout, re-fab, ...
• Fix and repeat tests
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Impact of errors
• Assembly error: rework 1 or entire batch
• PCB fabrication error: re-fab PCB, ...
• Schematic error: Re layout, re-fab, ...
• Fix and repeat tests
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Hardware-Software Co-Design
(Micheli & Gupta, Proc. IEEE, Vol.85, No.3, March 1997)
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Partial Assembly & Incremental prototyping (1/2)
Examples:
• to test 1-channel in a 6-channel board
• for sub-circuit level prototyping
• for minimum h/w to get s/w dev started
• to skip some expensive parts (when not
immediately needed), e.g. connectors, some
peripherals
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Partial Assembly & Incremental prototyping (1/2)
Examples:
• to test 1-channel in a 6-channel board
• for sub-circuit level prototyping
• for minimum h/w to get s/w dev started
• to skip some expensive parts (when not
immediately needed), e.g. connectors, some
peripherals
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Partial Assembly & Incremental prototyping (1/2)
Examples:
• to test 1-channel in a 6-channel board
• for sub-circuit level prototyping
• for minimum h/w to get s/w dev started
• to skip some expensive parts (when not
immediately needed), e.g. connectors, some
peripherals
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Partial Assembly & Incremental prototyping (1/2)
Examples:
• to test 1-channel in a 6-channel board
• for sub-circuit level prototyping
• for minimum h/w to get s/w dev started
• to skip some expensive parts (when not
immediately needed), e.g. connectors, some
peripherals
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
Zoid Labs IEW 2019 90
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
Zoid Labs IEW 2019 91
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
Zoid Labs IEW 2019 92
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Partial Assembly & Incremental prototyping (2/2)
• Speeds up initial bring-up of proto and
test boards
• Allows Hw/Sw Co-Design during proto
• Reduces unpredictability arising from
external factors
• Reduces overall product development
time & cost
Have some in-house capability for h/w assembly!
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Assembly – Pick & Place
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Assembly – on the desktop
Goals set for Zoid Labs’ Placerbot:
Placerbot
XTo fit desktopXBe portableXHandletypical partsXAccuracyXRepeatabilityXHandle cut tapesXAlso feed from trayXBe flexibleXEasy to use
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Why have SMT proto capability in-house?
• To leverage Partial Assembly
• To reduce cycle time per iteration
• To reduce overall dev time and cost
• To reduce errors (e.g. below)
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Why have SMT proto capability in-house?
• To leverage Partial Assembly
• To reduce cycle time per iteration
• To reduce overall dev time and cost
• To reduce errors (e.g. below)
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Why have SMT proto capability in-house?
• To leverage Partial Assembly
• To reduce cycle time per iteration
• To reduce overall dev time and cost
• To reduce errors (e.g. below)
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Why have SMT proto capability in-house?
• To leverage Partial Assembly
• To reduce cycle time per iteration
• To reduce overall dev time and cost
• To reduce errors (e.g. below)
Zoid Labs IEW 2019 99
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Why have SMT proto capability in-house?
• To leverage Partial Assembly
• To reduce cycle time per iteration
• To reduce overall dev time and cost
• To reduce errors (e.g. below)
(from Placerbot UI)
Zoid Labs IEW 2019 100
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Other benefits of in-house SMT prototyping
• Increased visibility / Early visibility into
all aspects of design
e.g. Mechanical issues, Thermal design
• Prepares for DFM and productization
• Total Control over IntellectualProperty
• Design and BOM optimization
Zoid Labs IEW 2019 101
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Other benefits of in-house SMT prototyping
• Increased visibility / Early visibility into
all aspects of design
e.g. Mechanical issues, Thermal design
• Prepares for DFM and productization
• Total Control over IntellectualProperty
• Design and BOM optimization
Zoid Labs IEW 2019 102
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Other benefits of in-house SMT prototyping
• Increased visibility / Early visibility into
all aspects of design
e.g. Mechanical issues, Thermal design
• Prepares for DFM and productization
• Total Control over IntellectualProperty
• Design and BOM optimization
Zoid Labs IEW 2019 103
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Other benefits of in-house SMT prototyping
• Increased visibility / Early visibility into
all aspects of design
e.g. Mechanical issues, Thermal design
• Prepares for DFM and productization
• Total Control over IntellectualProperty
• Design and BOM optimization
Zoid Labs IEW 2019 104
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Section 6
StreamliningwithDFP(DesignforPrototyping)
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Basic Approach
DFM (Design for Manufacture) – Design Rules
DFP (Design for Prototyping) – Stricter RulesZoid Labs IEW 2019 106
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Some DFP Tips (1/3)
(As practised at Zoid Labs)
General
• Provision fuses.(Final product may or may not include these)
• Use 0R’s (0Ω) or fuses to isolate power paths.• Have all DFP additions (0Ω etc) with 0805
footprints(smaller size ⇒ / / for tweezers)
Zoid Labs IEW 2019 107
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Some DFP Tips (1/3)
(As practised at Zoid Labs)
General
• Provision fuses.(Final product may or may not include these)
• Use 0R’s (0Ω) or fuses to isolate power paths.• Have all DFP additions (0Ω etc) with 0805
footprints(smaller size ⇒ / / for tweezers)
Zoid Labs IEW 2019 108
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Some DFP Tips (1/3)
(As practised at Zoid Labs)
General
• Provision fuses.(Final product may or may not include these)
• Use 0R’s (0Ω) or fuses to isolate power paths.• Have all DFP additions (0Ω etc) with 0805
footprints(smaller size ⇒ / / for tweezers)
Zoid Labs IEW 2019 109
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More DFP Tips (2/3)
Testability
• Add testpoints liberally- say 0.5 x 0.5mm pad for occasional probing- Where needed to hook up a probe often, adda thru-hole pin pad.
• Provision configuration 0R’s- For intercepting signals- To provide alternate paths (mux/demuxing)- Strapping options
(e.g. mode inputs, I2C addresses)• Allow space for test/probe access
Zoid Labs IEW 2019 110
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More DFP Tips (2/3)
Testability
• Add testpoints liberally- say 0.5 x 0.5mm pad for occasional probing- Where needed to hook up a probe often, adda thru-hole pin pad.
• Provision configuration 0R’s- For intercepting signals- To provide alternate paths (mux/demuxing)- Strapping options
(e.g. mode inputs, I2C addresses)• Allow space for test/probe access
Zoid Labs IEW 2019 111
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More DFP Tips (2/3)
Testability
• Add testpoints liberally- say 0.5 x 0.5mm pad for occasional probing- Where needed to hook up a probe often, adda thru-hole pin pad.
• Provision configuration 0R’s- For intercepting signals- To provide alternate paths (mux/demuxing)- Strapping options
(e.g. mode inputs, I2C addresses)• Allow space for test/probe access
Zoid Labs IEW 2019 112
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 113
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 114
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 115
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 116
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 117
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More DFP Tips (3/3)
Footprints, Layout, Stencil
• Use rounded pads in footprints- For small passives- Less likely to ’tombstone’- Better for IC’s too
• Careful with big thermal pads (belly pads)!• Prefer non-BGA packages if possible
- More leeway with solder reflow profile• Include fiducial marks (local,global)• Include fiducial marks in Stencil for easy
registration visually• Undersize stencil openings slightly
Zoid Labs IEW 2019 118
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Equipment and Process Support
What Equipment?Process supportetc
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 120
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 121
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 122
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 123
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 124
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 125
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 126
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 127
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 128
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Equipment• PCB mill? Evaluate use vs. $
• Stencilling machines??
• Inspection capability X• Auto Pick and Place: X
• Ensures correct parts, polarity,orientation. Faster than manual process;else paste may dry up
• Easier to repeat the run (than manual)• Should do 0402, cut tape, fine pitch ICs
• PCB Oven: X• Verify temp. profiles for Pb & Pb-free• Verify heat distribution
Zoid Labs IEW 2019 129
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Process Support
• Managing components: e.g. cut tapes
• Managing part numbers• HPN – House Part No, MPN – Mfr Part No,
DPN – Distributor Part No, DPN2 –Alternate
Distributer Part No. . . . etc and equivalences
between these part numbers.
Zoid Labs IEW 2019 130
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 131
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 132
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 133
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 134
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 135
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Conclusions
1 SMT Prototyping can be challenging
2 To cut cycle-time/cost, have in-house
assembling capability
3 Use DFP (Design For Prototyping)
guidelines
4 Appropriate Equipment and Process
Thank You! [email protected]
Zoid Labs IEW 2019 136