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OptiX BWS 1600G Backbone DWDM Optical Transmission System V100R006 Product Description Issue 03 Date 2008-08-30 Part Number 31401504 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd.

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Page 1: Product Description - ucitel.sps-prosek.czjakes/4T/3T_2015_16/OMS/HUAWEI... · Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For

OptiX BWS 1600G Backbone DWDM Optical Transmission System

V100R006

Product Description

Issue 03

Date 2008-08-30

Part Number 31401504

Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Page 2: Product Description - ucitel.sps-prosek.czjakes/4T/3T_2015_16/OMS/HUAWEI... · Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For anyassistance, please contact our local office or company headquarters.

Huawei Technologies Co., Ltd.Address: Huawei Industrial Base

Bantian, LonggangShenzhen 518129People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Copyright © Huawei Technologies Co., Ltd. 2008. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions

and other Huawei trademarks are the property of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders. NoticeThe information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but the statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

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Contents

About This Document.....................................................................................................................1

1 Network Application.................................................................................................................1-11.1 Position in Networks.......................................................................................................................................1-21.2 Classification of System Types.......................................................................................................................1-3

1.2.1 Type I System.........................................................................................................................................1-31.2.2 Type II System.......................................................................................................................................1-41.2.3 Type III System......................................................................................................................................1-51.2.4 Type IV System......................................................................................................................................1-71.2.5 Type V System.......................................................................................................................................1-71.2.6 Type VI System......................................................................................................................................1-81.2.7 Type VII System....................................................................................................................................1-91.2.8 Type VIII System...................................................................................................................................1-91.2.9 Type IX System....................................................................................................................................1-10

1.3 Classification of Bands..................................................................................................................................1-101.3.1 80-Channel System in C Band/L Band................................................................................................1-111.3.2 96-Channel System in C-Band.............................................................................................................1-111.3.3 192-Channel System in C-Band...........................................................................................................1-11

1.4 Networking and Applications........................................................................................................................1-111.4.1 Point-to-Point Network........................................................................................................................1-121.4.2 Chain Network.....................................................................................................................................1-121.4.3 Ring Network.......................................................................................................................................1-12

2 Product Functions.......................................................................................................................2-12.1 Transmission Ability.......................................................................................................................................2-2

2.1.1 Transmission Capacity...........................................................................................................................2-22.1.2 Transmission Distance...........................................................................................................................2-4

2.2 Service Access.................................................................................................................................................2-52.3 Guaranteed Reliability.....................................................................................................................................2-7

2.3.1 Equipment-Level Protection..................................................................................................................2-72.3.2 Network Level Protection......................................................................................................................2-7

2.4 Clock Transmission.........................................................................................................................................2-82.5 Performance Monitoring.................................................................................................................................2-9

2.5.1 Performance Monitory of Access Services............................................................................................2-9

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2.5.2 Performance Monitoring of Network.....................................................................................................2-92.6 Network Management System......................................................................................................................2-10

2.6.1 T2000...................................................................................................................................................2-112.6.2 Simple Network Management Protocol...............................................................................................2-11

2.7 Transmission of Network Management Information....................................................................................2-11

3 Product Features.........................................................................................................................3-13.1 Technical Features...........................................................................................................................................3-2

3.1.1 WB Mode ROADM...............................................................................................................................3-33.1.2 WSS Mode ROADM.............................................................................................................................3-53.1.3 40G Transmission System....................................................................................................................3-153.1.4 192-Channel System in C Band...........................................................................................................3-173.1.5 OTN Signal Processing........................................................................................................................3-183.1.6 Supervisory Channel............................................................................................................................3-193.1.7 FEC Function.......................................................................................................................................3-203.1.8 SuperWDM Technology......................................................................................................................3-203.1.9 ODB Technology.................................................................................................................................3-213.1.10 Tunable Wavelengths.........................................................................................................................3-213.1.11 EDFA Technology.............................................................................................................................3-213.1.12 Raman Amplification.........................................................................................................................3-213.1.13 Automatic Laser Shutdown................................................................................................................3-213.1.14 LPT Protocol Check...........................................................................................................................3-253.1.15 Optical Power Management...............................................................................................................3-253.1.16 Independent OLA Subrack.................................................................................................................3-273.1.17 2.5G ADM Technology......................................................................................................................3-273.1.18 GE ADM Technology........................................................................................................................3-283.1.19 NTP Technology................................................................................................................................3-303.1.20 DCN Management..............................................................................................................................3-323.1.21 Automatic Monitoring........................................................................................................................3-36

3.2 Features of Upgrade and Maintenance..........................................................................................................3-373.2.1 Software Package Loading...................................................................................................................3-373.2.2 PRBS Error Detection Function...........................................................................................................3-383.2.3 Small Form-Factor Pluggable (SFP) Module.......................................................................................3-39

4 Hardware Architecture..............................................................................................................4-14.1 Cabinet............................................................................................................................................................4-2

4.1.1 Structure.................................................................................................................................................4-24.1.2 Configuration of the Integrated Cabinet.................................................................................................4-4

4.2 Enhanced Subrack...........................................................................................................................................4-44.2.1 Structure.................................................................................................................................................4-54.2.2 Slot Distribution.....................................................................................................................................4-6

4.3 Independent OLA Subrack..............................................................................................................................4-64.3.1 Structure.................................................................................................................................................4-64.3.2 Slot Distribution.....................................................................................................................................4-7

Contents

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Product Description

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4.4 Function Boards..............................................................................................................................................4-84.4.1 Optical Transponder Board....................................................................................................................4-94.4.2 Optical Multiplexer and Demultiplexer Board.....................................................................................4-224.4.3 Optical Add/Drop Multiplexer Board..................................................................................................4-254.4.4 Optical Amplifier Board.......................................................................................................................4-274.4.5 System Control, Supervision and Communication Board...................................................................4-294.4.6 Optical Supervisory Channel and Timing Transmission Board...........................................................4-304.4.7 Optical Protection Board......................................................................................................................4-324.4.8 Spectrum Analyzer Board....................................................................................................................4-334.4.9 Variable Optical Attenuator Board.......................................................................................................4-344.4.10 Optical Fiber Automatic Monitoring Board.......................................................................................4-354.4.11 Optical Power and Dispersion Slope Equalizing Board.....................................................................4-36

5 Software Architecture................................................................................................................5-15.1 Overview.........................................................................................................................................................5-25.2 Communication Protocols...............................................................................................................................5-25.3 Board Software................................................................................................................................................5-35.4 NE Software....................................................................................................................................................5-35.5 Network Management System........................................................................................................................5-4

6 System Configuration...............................................................................................................6-16.1 OTM (C Band)................................................................................................................................................6-2

6.1.1 C400G/C800G System...........................................................................................................................6-26.1.2 C480G/C960G System...........................................................................................................................6-76.1.3 C1600G/C1920G system......................................................................................................................6-106.1.4 40G Transmission System....................................................................................................................6-15

6.2 OTM (L Band)..............................................................................................................................................6-176.2.1 C+L1600G system................................................................................................................................6-186.2.2 C+L800G system..................................................................................................................................6-226.2.3 L400G system......................................................................................................................................6-23

6.3 OTM (LHP)...................................................................................................................................................6-246.4 OLA...............................................................................................................................................................6-266.5 FOADM........................................................................................................................................................6-31

6.5.1 Serial OADM.......................................................................................................................................6-326.5.2 Parallel OADM....................................................................................................................................6-36

6.6 ROADM........................................................................................................................................................6-416.6.1 C400G system (WB mode)..................................................................................................................6-416.6.2 C400G system (WSS mode)................................................................................................................6-446.6.3 C800G system (WB mode)..................................................................................................................6-526.6.4 C800G system (WSS mode)................................................................................................................6-52

6.7 REG...............................................................................................................................................................6-556.8 OEQ...............................................................................................................................................................6-56

6.8.1 Optical Power Equalizer.......................................................................................................................6-576.8.2 Optical Dispersion Equalizer...............................................................................................................6-60

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7 Protection.....................................................................................................................................7-17.1 Equipment Level Protection............................................................................................................................7-2

7.1.1 DC Input Protection............................................................................................................................... 7-27.1.2 Secondary Power Protection.................................................................................................................. 7-27.1.3 Centralized Power Protection.................................................................................................................7-2

7.2 Network Level Protection............................................................................................................................... 7-37.2.1 Overview................................................................................................................................................7-37.2.2 Optical Line Protection.......................................................................................................................... 7-77.2.3 1+1 Wavelength Protection at Client...................................................................................................7-117.2.4 Inter-Board Wavelength Protection......................................................................................................7-157.2.5 Inter-Subrack 1+1 Optical Channel Protection....................................................................................7-197.2.6 WXCP..................................................................................................................................................7-237.2.7 1:N Optical Channel Protection...........................................................................................................7-29

7.3 Network Management Channel.....................................................................................................................7-337.3.1 Protection of Network Management Information Channel..................................................................7-337.3.2 Interconnection of Network Management Channel.............................................................................7-35

8 Management of Optical Power................................................................................................8-18.1 Intelligent Power Adjustment..........................................................................................................................8-2

8.1.1 Function Description..............................................................................................................................8-28.1.2 Function Implementation....................................................................................................................... 8-38.1.3 Networking Application.........................................................................................................................8-48.1.4 Configuration Principle..........................................................................................................................8-5

8.2 Intelligent Power Adjustment of Raman System............................................................................................8-68.2.1 Function Description..............................................................................................................................8-68.2.2 Function Implementation....................................................................................................................... 8-88.2.3 Networking Application.......................................................................................................................8-108.2.4 Configuration Principle........................................................................................................................8-11

8.3 Automatic Level Control...............................................................................................................................8-128.3.1 Function Description............................................................................................................................8-138.3.2 Function Implementation.....................................................................................................................8-138.3.3 Networking of Application...................................................................................................................8-238.3.4 Configuration Principle........................................................................................................................8-24

8.4 Automatic Power Equilibrium......................................................................................................................8-248.4.1 Function Description............................................................................................................................8-248.4.2 Function Implementation.....................................................................................................................8-258.4.3 Networking Application.......................................................................................................................8-268.4.4 Configuration Principle........................................................................................................................8-27

8.5 Enhanced Automatic Power Equilibrium (EAPE)........................................................................................8-288.5.1 Function Description............................................................................................................................8-288.5.2 Function Implementation.....................................................................................................................8-298.5.3 Networking Application.......................................................................................................................8-308.5.4 Configuration Principle........................................................................................................................8-31

Contents

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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9 Operation, Administration and Maintenance......................................................................9-19.1 System Operation............................................................................................................................................9-29.2 Administration and Maintenance....................................................................................................................9-2

9.2.1 Supervision and Administration Module...............................................................................................9-39.2.2 Optical Supervisory Channel Administration........................................................................................9-49.2.3 Optical Fiber Line Automatic Monitoring.............................................................................................9-69.2.4 Networking Management.....................................................................................................................9-129.2.5 System Maintenance............................................................................................................................9-12

9.3 NE Security Management Features...............................................................................................................9-139.3.1 Basic and Advanced ACL Access Control..........................................................................................9-149.3.2 Query of Security Log..........................................................................................................................9-149.3.3 NE User Management..........................................................................................................................9-159.3.4 Syslog Protocol....................................................................................................................................9-159.3.5 Control of Logical Ports.......................................................................................................................9-169.3.6 Control of Physical Ports......................................................................................................................9-169.3.7 Setting Warning Screen Information....................................................................................................9-179.3.8 SSL Protocol........................................................................................................................................9-179.3.9 Username and Password Encryption....................................................................................................9-179.3.10 NTP Authentication............................................................................................................................9-17

10 Networking and Design Considerations...........................................................................10-110.1 Dispersion Limited Distance.......................................................................................................................10-210.2 Signal Power...............................................................................................................................................10-210.3 Optical Signal-to-Noise Ratio.....................................................................................................................10-310.4 Non-Linear Effects and Other Effects.........................................................................................................10-4

11 Technical Specifications.......................................................................................................11-111.1 General Specifications.................................................................................................................................11-3

11.1.1 Cabinet Specifications........................................................................................................................11-311.1.2 Power Box Specifications..................................................................................................................11-411.1.3 Enhanced Subrack Specifications......................................................................................................11-411.1.4 Independent OLA Subrack Specifications.........................................................................................11-511.1.5 Auxiliary Interface.............................................................................................................................11-511.1.6 DCM and DCM Frame Specifications...............................................................................................11-711.1.7 HUB and HUB Frame Specifications................................................................................................11-9

11.2 Main Optical Path......................................................................................................................................11-1011.2.1 Type I System...................................................................................................................................11-1011.2.2 Type II System.................................................................................................................................11-1111.2.3 Type III System................................................................................................................................11-1711.2.4 Type IV System................................................................................................................................11-2411.2.5 Type V System.................................................................................................................................11-2511.2.6 Type VI System................................................................................................................................11-2711.2.7 Type VII System..............................................................................................................................11-3111.2.8 Type VIII System.............................................................................................................................11-40

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11.2.9 Type IX System................................................................................................................................11-4211.3 Wavelength and Frequency of Optical Channels......................................................................................11-44

11.3.1 Nominal Central Wavelengths of C-Band System...........................................................................11-4411.3.2 Nominal Central Wavelengths of L-Band System...........................................................................11-48

11.4 Laser Class................................................................................................................................................11-5011.5 Optical Transponder Board Specifications................................................................................................11-51

11.5.1 ELOG Board Specifications.............................................................................................................11-5411.5.2 ELOGS Board Specifications...........................................................................................................11-5811.5.3 ETMX Board Specifications............................................................................................................11-6211.5.4 ETMXS Board Specifications..........................................................................................................11-6711.5.5 FCE Board Specifications................................................................................................................11-7211.5.6 FDG Board Specifications...............................................................................................................11-7511.5.7 IMX4 Board Specifications..............................................................................................................11-7911.5.8 IMX4S Board Specifications...........................................................................................................11-8211.5.9 LBE Board Specifications................................................................................................................11-8411.5.10 LBES Board Specifications............................................................................................................11-8811.5.11 LBF Board Specifications..............................................................................................................11-9111.5.12 LBFS Board Specifications............................................................................................................11-9711.5.13 LDG Board Specifications...........................................................................................................11-10211.5.14 LOG Board Specifications...........................................................................................................11-10611.5.15 LOGS Board Specifications.........................................................................................................11-10911.5.16 LOM Board Specifications...........................................................................................................11-11211.5.17 LOMS Board Specifications........................................................................................................11-11711.5.18 LQM Board Specifications...........................................................................................................11-12111.5.19 LR40 Board Specifications..........................................................................................................11-12711.5.20 LRF Board Specifications............................................................................................................11-12911.5.21 LRFD Board Specifications.........................................................................................................11-13111.5.22 LRFS Board Specifications..........................................................................................................11-13311.5.23 LU40 Board Specifications..........................................................................................................11-13511.5.24 LU40S Board Specifications........................................................................................................11-13711.5.25 LW40 Board Specifications.........................................................................................................11-14011.5.26 LWC1 Board Specifications.........................................................................................................11-14211.5.27 LWF Board Specifications...........................................................................................................11-14711.5.28 LWFS Board Specifications.........................................................................................................11-15211.5.29 LWM Board Specifications..........................................................................................................11-15711.5.30 LWMR Board Specifications.......................................................................................................11-16111.5.31 LWX Board Specifications..........................................................................................................11-16311.5.32 LWXR Board Specifications........................................................................................................11-16711.5.33 TMR Board Specifications...........................................................................................................11-16911.5.34 TMRS Board Specifications.........................................................................................................11-17111.5.35 TMX Board Specifications...........................................................................................................11-17411.5.36 TMXS Board Specifications........................................................................................................11-177

Contents

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Product Description

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11.5.37 TMX40 Board Specifications.......................................................................................................11-18011.5.38 TMX40S Board Specifications....................................................................................................11-18511.5.39 TRC1 Board Specifications..........................................................................................................11-19011.5.40 TRC2 Board Specifications..........................................................................................................11-19211.5.41 Jitter Transfer Characteristics.......................................................................................................11-19411.5.42 Input Jitter Tolerance...................................................................................................................11-19511.5.43 Output Jitter..................................................................................................................................11-196

11.6 Optical Multiplexer and Demultiplexer Board Specifications................................................................11-19711.6.1 D40 Board Specifications...............................................................................................................11-19711.6.2 D48 Board Specifications...............................................................................................................11-19811.6.3 FIU Board Specifications...............................................................................................................11-20011.6.4 ITL Board Specifications...............................................................................................................11-20111.6.5 M40 Board Specifications..............................................................................................................11-20411.6.6 M48 Board Specifications..............................................................................................................11-20511.6.7 V40 Board Specifications...............................................................................................................11-20611.6.8 V48 Board Specifications...............................................................................................................11-207

11.7 Optical Add and Drop Multiplexing Board Specifications.....................................................................11-20811.7.1 DWC Board Specifications............................................................................................................11-20911.7.2 EDWC Board Specifications..........................................................................................................11-21111.7.3 MR2 Board Specifications.............................................................................................................11-21211.7.4 MR8 Board Specifications.............................................................................................................11-21411.7.5 RMU9 Board Specifications..........................................................................................................11-21511.7.6 WSD5 Board Specifications...........................................................................................................11-21611.7.7 WSD9 Board Specifications...........................................................................................................11-21811.7.8 WSM5 Board Specifications..........................................................................................................11-21911.7.9 WSM9 Board Specifications..........................................................................................................11-22111.7.10 WSMD4 Board Specifications.....................................................................................................11-22311.7.11 WSMD2 Board Specifications.....................................................................................................11-224

11.8 Optical Amplifier Board Specifications..................................................................................................11-22511.8.1 HBA Board Specifications.............................................................................................................11-22511.8.2 OAU Board Specifications.............................................................................................................11-22711.8.3 OBU Board Specifications.............................................................................................................11-23711.8.4 OPU Board Specifications.............................................................................................................11-24111.8.5 RPA Board Specifications..............................................................................................................11-24311.8.6 RPC Board Specifications..............................................................................................................11-245

11.9 System Control, Supervision and Communication Board Specifications...............................................11-24711.9.1 SCC Board Specifications..............................................................................................................11-24711.9.2 PMU Board Specifications.............................................................................................................11-248

11.10 Optical Supervisory Channel and Timing Transmission Board Specifications....................................11-24811.10.1 SC1 Board Specifications.............................................................................................................11-24911.10.2 SC2 Board Specifications.............................................................................................................11-25011.10.3 ST1 Board Specifications.............................................................................................................11-251

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11.10.4 ST2 Board Specifications.............................................................................................................11-25211.11 Optical Protection Board Specifications...............................................................................................11-253

11.11.1 DCP Board Specifications............................................................................................................11-25311.11.2 OCP Board Specifications............................................................................................................11-25411.11.3 OLP Board Specifications............................................................................................................11-25511.11.4 PBU Board Specifications............................................................................................................11-25711.11.5 SCS Board Specifications............................................................................................................11-257

11.12 Spectrum Analyzer Board Specifications..............................................................................................11-25811.12.1 MCA Board Specifications..........................................................................................................11-25811.12.2 WMU Board Specifications.........................................................................................................11-260

11.13 Variable Optical Attenuator Board Specifications................................................................................11-26011.13.1 VA2 Board Specifications............................................................................................................11-26111.13.2 VA4 Board Specifications............................................................................................................11-26211.13.3 VOA Board Specifications...........................................................................................................11-262

11.14 Optical Fiber Automatic Monitoring Board Specifications..................................................................11-26311.14.1 FMU Board Specifications...........................................................................................................11-26411.14.2 MWA Board Specifications.........................................................................................................11-26511.14.3 MWF Board Specifications..........................................................................................................11-266

11.15 Optical Power and Dispersion Slope Equalizing Board Specifications................................................11-26811.15.1 DGE Board Specifications...........................................................................................................11-26811.15.2 DSE Board Specifications............................................................................................................11-26911.15.3 GFU Board Specifications...........................................................................................................11-270

A Equipment Specifications and Environment Requirements...........................................A-1A.1 Performance Specifications for Optical Interfaces........................................................................................A-2A.2 Power Supply Requirements.........................................................................................................................A-2A.3 Electromagnetic Compatibility (EMC).........................................................................................................A-2A.4 Environment Requirement.............................................................................................................................A-3

A.4.1 Storage Environment............................................................................................................................A-4A.4.2 Transport Environment.........................................................................................................................A-6A.4.3 Operation Environment........................................................................................................................A-8

B Power Consumption, Weight and Slots of Boards.............................................................B-1

C Technical Fundamental...........................................................................................................C-1C.1 OTN Technology...........................................................................................................................................C-2

C.1.1 Technical Background..........................................................................................................................C-2C.1.2 OTN Standard System..........................................................................................................................C-2C.1.3 Features of OTN Technology...............................................................................................................C-3C.1.4 Frame Structure of OTN.......................................................................................................................C-4C.1.5 Optical Layer Supervisory....................................................................................................................C-5

C.2 FEC and AFEC..............................................................................................................................................C-8C.3 Erbium-Doped Fiber Amplifier.....................................................................................................................C-9C.4 Raman Amplification.....................................................................................................................................C-9

Contents

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Product Description

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C.5 Jitter Suppression.........................................................................................................................................C-10

D Complied Criteria....................................................................................................................D-1D.1 ITU-T Recommendations..............................................................................................................................D-2D.2 IEEE Standards..............................................................................................................................................D-4D.3 Laser Security Standards...............................................................................................................................D-4D.4 Security Standards.........................................................................................................................................D-5D.5 Environment Related Standards....................................................................................................................D-5D.6 International Standards..................................................................................................................................D-5

E Glossary.......................................................................................................................................E-1

F Acronyms and Abbreviations..................................................................................................F-1

Index.................................................................................................................................................i-1

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Figures

Figure 1-1 OptiX BWS 1600G in a transmission network.................................................................................. 1-2Figure 1-2 Point-to-Point network.....................................................................................................................1-12Figure 1-3 Chain network...................................................................................................................................1-12Figure 1-4 Ring network....................................................................................................................................1-13Figure 3-1 Configuration of an ROADM station (WB).......................................................................................3-4Figure 3-2 Schematic diagram of the WSS-based ROADM node.......................................................................3-6Figure 3-3 Configuration of an ROADM station (WSS: WSD9 + WSM9)........................................................ 3-6Figure 3-4 Configuration of an ROADM station (WSS: WSD9 + RMU9).........................................................3-7Figure 3-5 Configuration of an ROADM station (WSS: WSMD4 + WSMD4)..................................................3-8Figure 3-6 Configuration of an ROADM station (WSS: WSMD2 + WSMD2)..................................................3-9Figure 3-7 Networking for inter-ring grooming.................................................................................................3-10Figure 3-8 ROADM station for inter-ring grooming (WSD9 + WSM9)...........................................................3-11Figure 3-9 ROADM station for inter-ring grooming (WSD9 + RMU9)...........................................................3-12Figure 3-10 ROADM node with inter-ring grooming (WSMD4 + WSMD4)...................................................3-13Figure 3-11 ROADM node with inter-ring grooming (WSMD2 + WSMD2)...................................................3-14Figure 3-12 Typical application of 40 channels x 40G system..........................................................................3-16Figure 3-13 Typical application of 40G inverse multiplexing system...............................................................3-16Figure 3-14 Typical structure of the 192-channel system in C band it an OTM station....................................3-18Figure 3-15 ALS functional diagram (OTU board without service convergence function)..............................3-23Figure 3-16 ALS functional diagram (OTU board with service convergence function)...................................3-24Figure 3-17 ALS function diagram (OTU board with service cross-connect function).....................................3-24Figure 3-18 ALS functional diagram (OTU board with service reverse multiplexing function).......................3-25Figure 3-19 Functionality of the 2.5G ADM.....................................................................................................3-28Figure 3-20 Functionality of the GE ADM........................................................................................................3-29Figure 3-21 Principle of the NTP.......................................................................................................................3-31Figure 3-22 Synchronization of the network......................................................................................................3-32Figure 3-23 Networking environment with the extended ECC..........................................................................3-33Figure 3-24 NM information transparently transmitted by the third party equipment (IP)...............................3-34Figure 3-25 NM information of the third-party equipment is transparently transmitted (IP)............................3-34Figure 3-26 Transparent transmission of NM information by the third party equipment (OSI)........................3-36Figure 3-27 Transparent transmission of NM information of the third party equipment (OSI)........................3-36Figure 3-28 PRBS detection functional diagram...............................................................................................3-39Figure 4-1 Appearance of ETSI 300 mm cabinet.................................................................................................4-3

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Figure 4-2 Structure of the enhanced subrack......................................................................................................4-5Figure 4-3 Slot distribution of enhanced subrack of the system..........................................................................4-6Figure 4-4 Structure of an independent OLA subrack.........................................................................................4-7Figure 4-5 Slot distribution of the independent OLA subrack of the system.......................................................4-8Figure 4-6 Positions of the boards in the system..................................................................................................4-9Figure 5-1 Software architecture..........................................................................................................................5-2Figure 6-1 OTM signal flow................................................................................................................................6-3Figure 6-2 Structure of OM, OD, OA of the C400G system ..............................................................................6-4Figure 6-3 Structure of OM, OD, OA of the C800G system ..............................................................................6-4Figure 6-4 Configuration of the C400G OTM ....................................................................................................6-5Figure 6-5 Configuration of the C800G OTM.....................................................................................................6-6Figure 6-6 Structure of OM, OD, OA of the C480G system ..............................................................................6-7Figure 6-7 Structure of OM, OD, OA of the C960G system ..............................................................................6-8Figure 6-8 Configuration of the C480G OTM ....................................................................................................6-8Figure 6-9 Configuration of the C960G OTM ....................................................................................................6-9Figure 6-10 Structure of OM, OD, OA of the C 1600G/C 1920G system ........................................................6-12Figure 6-11 Configuration of the 1920 Gbit/s OTM (C band)...........................................................................6-13Figure 6-12 Configuration of the 1920 Gbit/s OTM (C_PLUS band)...............................................................6-14Figure 6-13 Structure of the OM, OD and OA of per-channel 40 Gbit/s system (40 channels) .......................6-16Figure 6-14 Structure of the OM, OD and OA of per-channel 40 Gbit/s system (80 channels) .......................6-16Figure 6-15 Typical configuration of the per-channel 40 Gbit/s system (20 channels).....................................6-17Figure 6-16 Structure of the OM, OD and OA of C+L1600G system...............................................................6-19Figure 6-17 Configuration of the C-band 800 Gbit/s OTM...............................................................................6-20Figure 6-18 Configuration of the L-band 800 Gbit/s OTM...............................................................................6-21Figure 6-19 Structure of OM, OD, OA of the C+L800G system.......................................................................6-22Figure 6-20 Configuration of the C+L800G OTM (C band).............................................................................6-23Figure 6-21 Structure of OM, OD, OA of the L400G system............................................................................6-24Figure 6-22 Configuration of the LHP system OTM (40 channels)..................................................................6-25Figure 6-23 Configuration of the LHP system OTM (80 channels)..................................................................6-25Figure 6-24 Configuration of the LHP system OTM (10 channels)..................................................................6-26Figure 6-25 OLA signal flow.............................................................................................................................6-27Figure 6-26 Configuration of the C+L band OLA in standard subrack.............................................................6-28Figure 6-27 Configuration of the C+L band OLA in independent OLA subrack..............................................6-29Figure 6-28 Configuration of the C-band OLA in the standard subrack............................................................6-30Figure 6-29 Configuration of the C-band OLA in the independent OLA subrack............................................6-30Figure 6-30 Signal flow of the serial OADM.....................................................................................................6-32Figure 6-31 Structure of the serial OADM in type I ,type II C800G, type VII C960G and type VIIIsystem.............................................................................................................................................................................6-33Figure 6-32 Structure of the serial OADM in type II system (C+L 800G)........................................................6-34Figure 6-33 Structure of the serial OADM in type III and type V system.........................................................6-34Figure 6-34 Configuration of the C-band serial OADM equipment..................................................................6-35Figure 6-35 Signal flow of the parallel OADM.................................................................................................6-37Figure 6-36 Structure of the parallel OADM in type II system (C800G)..........................................................6-38

Figures

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Figure 6-37 Structure of the parallel OADM in type III system........................................................................6-39Figure 6-38 Configuration of the C-band parallel OADM equipment...............................................................6-40Figure 6-39 Signal flow of the ROADM with WB mode..................................................................................6-42Figure 6-40 Structure of the ROADM in C 400G system (WB mode)..............................................................6-43Figure 6-41 Typical configuration of C-band of the ROADM (type III system, WB mode)............................6-43Figure 6-42 Signal flow of the ROADM with WSS mode 1.............................................................................6-45Figure 6-43 Signal flow of the ROADM with WSS mode 2.............................................................................6-46Figure 6-44 Structure of the ROADM in C 400G system (WSS mode 1).........................................................6-47Figure 6-45 Structure of the ROADM in C 400G system (WSS mode 2).........................................................6-48Figure 6-46 Structure of the ROADM in C 400G system (WSS mode 3).........................................................6-48Figure 6-47 Structure of the ROADM in C 400G system (WSS mode 4).........................................................6-49Figure 6-48 Typical configuration of C-band of the ROADM (type III system, WSS mode 1)........................6-49Figure 6-49 Typical configuration of C-band of the ROADM (type III system, WSS mode 2, from east to west).............................................................................................................................................................................6-50Figure 6-50 Typical configuration of C-band of the ROADM (type III system, WSS mode 2, from south to north).............................................................................................................................................................................6-51Figure 6-51 Structure of the ROADM in a C 800G system (WB mode) ..........................................................6-52Figure 6-52 Structure of the ROADM in a C 800G system (WSS mode 1)......................................................6-53Figure 6-53 Structure of the ROADM in a C 800G system (WSS mode 2)......................................................6-53Figure 6-54 Structure of the ROADM in a C 800G system (WSS mode 3)......................................................6-54Figure 6-55 REG signal flow.............................................................................................................................6-55Figure 6-56 Signal flow of optical power equalizer...........................................................................................6-57Figure 6-57 Optical power equalization through the DGE................................................................................6-58Figure 6-58 Optical power equalization through the VMUX (the V40 board)..................................................6-59Figure 6-59 Configuration of optical power equalizer.......................................................................................6-60Figure 6-60 The signal flow of dispersion equalizer..........................................................................................6-61Figure 6-61 Signal flow of dispersion equalizer in OTM..................................................................................6-61Figure 6-62 Composition of dispersion equalizer..............................................................................................6-62Figure 6-63 Configuration of dispersion equalizer............................................................................................6-63Figure 6-64 Configuration of dispersion equalizer in the independent OLA subrack.......................................6-64Figure 7-1 Centralized power protection for OTUs in enhanced subrack............................................................7-3Figure 7-2 Working principle of optical line protection (Application 1).............................................................7-8Figure 7-3 Working principle of optical line protection (Application 2).............................................................7-9Figure 7-4 Application of optical line protection (normal)................................................................................7-10Figure 7-5 Application of optical line protection (switching)............................................................................7-10Figure 7-6 Working principle of 1+1 wavelength protection at client...............................................................7-12Figure 7-7 Application of 1+1 wavelength protection at client (normal)..........................................................7-14Figure 7-8 Application of 1+1 wavelength protection at client (switching)......................................................7-14Figure 7-9 Working principle of the inter-board wavelength protection...........................................................7-17Figure 7-10 Application of inter-board wavelength protection (normal)...........................................................7-18Figure 7-11 Application of inter-board wavelength protection (switching)......................................................7-19Figure 7-12 Working principle of inter-subrack 1+1 optical channel protection...............................................7-21Figure 7-13 Application of inter-subrack 1+1 optical channel protection (normal)..........................................7-23

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Figure 7-14 Application of inter-subrack 1+1 optical channel protection (switching)......................................7-23Figure 7-15 Working principle of WXCP (two sources, one sink)....................................................................7-25Figure 7-16 Working principle of the WXCP (two sources, two sinks) Networking mode (1).........................7-26Figure 7-17 Working principle of the WXCP (two sources, two sinks) networking mode (2)......................... 7-27Figure 7-18 Application of the WXCP (normal)................................................................................................7-28Figure 7-19 Application of the WXCP (switching)........................................................................................... 7-29Figure 7-20 Working principle of 1:N (N≤8) optical channel protection........................................................ 7-30Figure 7-21 Application of 1:N (N≤8) optical channel protection (normal)....................................................7-32Figure 7-22 Application of 1:N (N≤8) optical channel protection (switching)................................................7-32Figure 7-23 Network management protection in ring network (a certain section fails).................................... 7-33Figure 7-24 Network management through the normal supervisory channel....................................................7-34Figure 7-25 Network management through the DCN supervisory channel.......................................................7-35Figure 7-26 Supervision over OptiX transmission network...............................................................................7-36Figure 8-1 Function description of the IPA..........................................................................................................8-2Figure 8-2 IPA networking...................................................................................................................................8-5Figure 8-3 Function description of the IPA (Backward Raman).........................................................................8-7Figure 8-4 Function description of the IPA (Forward Raman)............................................................................8-7Figure 8-5 IPA networking in a Raman system.................................................................................................8-11Figure 8-6 System power with ALC inactivated................................................................................................8-13Figure 8-7 System power with ALC activated...................................................................................................8-13Figure 8-8 Optical power relationship of nodes.................................................................................................8-15Figure 8-9 Flow chart of NE abnormity checking (Link attenuation adjustment mode)...................................8-16Figure 8-10 ALC exception detection flow (channel amount detection and reference power detection)..........8-17Figure 8-11 Flow chart of ALC link pre-adjustment(link attenuation adjustment mode)................................. 8-19Figure 8-12 Flow chart of ALC link adjustment(link attenuation adjustment mode)........................................8-20Figure 8-13 ALC adjustment flow(channel amount detection and reference power detection)........................ 8-21Figure 8-14 Networking of ALC application.....................................................................................................8-23Figure 8-15 Flatness of the optical power at the receive site when APE is not activated..................................8-25Figure 8-16 Flatness of the optical power at the receive site when APE is activated........................................8-25Figure 8-17 APE networking (VMUX mode)....................................................................................................8-27Figure 8-18 APE networking (VMUX and DGE mode)....................................................................................8-27Figure 8-19 Networking diagram of the basic EAPE application mode............................................................8-30Figure 8-20 Networking diagram of the system configured with OLP + OTU boards......................................8-31Figure 9-1 Signal flow of the OSC between three stations in chain networking.................................................9-5Figure 9-2 Timeslot assignment diagram of the OSC overhead..........................................................................9-5Figure 9-3 Unidirectional test diagram................................................................................................................9-7Figure 9-4 Bidirectional test diagram...................................................................................................................9-7Figure 9-5 Embedded OAMS architecture (online monitoring)..........................................................................9-8Figure 9-6 Embedded OAMS architecture (standby fiber monitoring)...............................................................9-9Figure 9-7 Schematic diagram of Syslog protocol transmitting.........................................................................9-16Figure 10-1 Trunk loss calculation principle..................................................................................................... 10-3Figure 11-1 Jitter transfer characteristics.......................................................................................................11-195

Figures

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Figure 11-2 Input jitter tolerance....................................................................................................................11-196Figure C-1 OTN layer structure..........................................................................................................................C-4Figure C-2 OTN optical-layer overhead structure...............................................................................................C-4Figure C-3 End-to-end management diagram.....................................................................................................C-6Figure C-4 Example of fiber connection management........................................................................................C-7Figure C-5 Raman amplifier gain spectrum........................................................................................................C-9Figure C-6 Raman amplification application......................................................................................................C-9

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Tables

Table 1-1 Networking capability of type I system (160-channel, NRZ)..............................................................1-4Table 1-2 Networking capability of type II system (C+L 80-channel)................................................................1-5Table 1-3 Networking capability of type II system (C, 80-channel)....................................................................1-5Table 1-4 Networking capability of type III system (40-channel, SSMF fiber, NRZ)........................................1-5Table 1-5 Networking capability of type III system (40-channel, LEAF fiber, NRZ).........................................1-6Table 1-6 Networking capability of type III system (40-channel, SuperDRZ)....................................................1-6Table 1-7 Networking capability of type III system (G.653 fiber, NRZ).............................................................1-6Table 1-8 Networking capability of type III system (G.653 fiber, DRZ).............................................................1-7Table 1-9 Networking capability of type IV system (40-channel, L band)..........................................................1-7Table 1-10 Networking capability of type V system (40-channel, NRZ)............................................................1-7Table 1-11 Networking capability of type VI system (8-channel, forward Raman+ backward Raman).............1-8Table 1-12 Networking capability of type VI system (10-channel, HBA+ Raman)............................................1-8Table 1-13 Networking capability of type VI system (40-channel, HBA+ Raman)............................................1-8Table 1-14 Networking capability of type VI system (80-channel, HBA+ Raman)............................................1-8Table 1-15 Networking capability of type VII system (C-band, 48-channel)......................................................1-9Table 1-16 Networking capability of type VII system (C-band, 96-channel)......................................................1-9Table 1-17 Networking capability of type VIII system for 40 Gbit/s transmission solution (SSMF/LEAF fiber).............................................................................................................................................................................1-10Table 1-18 Networking capability of type IX system (SSMF&LEAF fiber).....................................................1-10Table 2-1 Transmission capacity and expansion ability of the system................................................................2-2Table 2-2 Transmission capacity and expansion ability of the system (continued).............................................2-3Table 2-3 Service types supported by the system.................................................................................................2-5Table 2-4 Network level protection modes supported by the system...................................................................2-8Table 2-5 Performance monitoring of accessed services.....................................................................................2-9Table 2-6 Network performance monitoring......................................................................................................2-10Table 4-1 Specifications of ETSI 300 mm cabinet of the system........................................................................4-4Table 4-2 Full configuration of 300 mm deep cabinets of different heights........................................................4-4Table 4-3 Specifications of the enhanced subrack...............................................................................................4-5Table 4-4 Specifications of the independent OLA subrack..................................................................................4-7Table 4-5 Board name and category of the optical transponder board.................................................................4-9Table 4-6 Application and description of optical transponder board (40G bit/s) ..............................................4-12Table 4-7 Application and description of optical transponder board (10 Gbit/s)...............................................4-14Table 4-8 Application and description of optical transponder unit (2.5 Gbit/s or lower)..................................4-16Table 4-9 Application and description of convergent optical transponder unit.................................................4-18

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Table 4-10 Board name and category of the optical multiplexer and demultiplexer board...............................4-22Table 4-11 Application and description of the optical multiplexer and demultiplexer board............................4-23Table 4-12 Board name and category of the optical add and drop multiplexing board.....................................4-25Table 4-13 Application and description of the optical add and drop multiplexing board..................................4-26Table 4-14 Board name and category of the optical amplifier board.................................................................4-27Table 4-15 Application and description of the EDFA boards............................................................................4-28Table 4-16 Application and description of the Raman amplifier boards............................................................4-29Table 4-17 Board name and category of the system control, supervision and communication board...............4-30Table 4-18 Application and description of the system control, supervision and communication board............4-30Table 4-19 Board name and category of optical supervisory channel and timing transmission board..............4-31Table 4-20 Application and description of optical supervisory channel and timing transmission board...........4-31Table 4-21 Board name and category of the optical protection board...............................................................4-32Table 4-22 Application and description of optical protection board..................................................................4-32Table 4-23 Board name and category of the spectrum analyzer board..............................................................4-33Table 4-24 Application and description of spectrum analyzer board.................................................................4-34Table 4-25 Board name and category of the variable optical attenuator board..................................................4-34Table 4-26 Application and description of variable optical attenuator board....................................................4-35Table 4-27 Board name and category of the optical fiber automatic monitoring board.....................................4-35Table 4-28 Application and description of the fiber Automatic Monitoring System.........................................4-35Table 4-29 Board name and category of the optical power and dispersion slope equalizing board..................4-36Table 4-30 Application and description of optical power and dispersion slope equalizing board.....................4-37Table 6-1 Division of the 192 channels in the type IX system...........................................................................6-11Table 6-2 Distribution of 160 channels..............................................................................................................6-18Table 7-1 Protection types and solutions..............................................................................................................7-3Table 7-2 Network level protection types supported by the system.....................................................................7-4Table 7-3 Corresponding relations of switching states and channel states of the system....................................7-6Table 7-4 Boards used to achieve the optical line protection...............................................................................7-8Table 7-5 Boards used to achieve the 1+1 wavelength protection at client.......................................................7-11Table 7-6 Boards used to achieve the inter-board wavelength protection..........................................................7-15Table 7-7 Alarms relevant to SD switching conditions and the Ports................................................................7-16Table 7-8 Boards used to achieve the inter-subrack 1+1 optical channel protection.........................................7-19Table 7-9 Boards used to achieve the WXCP....................................................................................................7-24Table 7-10 Boards used to achieve the 1:N optical channel protection.............................................................7-29Table 8-1 Related alarms of the detection board/auxiliary detect board that trigger the IPA .............................8-3Table 8-2 Related alarms of the detection board/auxiliary detect board that trigger the IPA .............................8-9Table 8-3 Related alarms of the Raman amplifier that trigger the IPA................................................................8-9Table 8-4 Definition of parameters for the calculation of the standard output power.......................................8-18Table 9-1 Description of the functional interfaces of the SCC in the system......................................................9-3Table 9-2 Functions of the timeslots in the E1 frame of the OSC........................................................................9-6Table 9-3 Introduction of boards in embedded OAMS........................................................................................9-8Table 9-4 Applications of embedded OAMS.......................................................................................................9-9Table 9-5 OAMS configuration specification of online monitoring....................................................................9-9

Tables

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Table 9-6 OAMS configuration specification of standby fiber monitoring.......................................................9-10Table 10-1 Methods to minimize non-linear effects.......................................................................................... 10-6Table 11-1 Technical specifications of the cabinet............................................................................................ 11-3Table 11-2 Technical specifications of the cabinet (continued).........................................................................11-4Table 11-3 Technical specifications of the power box.......................................................................................11-4Table 11-4 Technical parameters of the enhanced subrack................................................................................11-4Table 11-5 Technical parameters of the independent OLA subrack..................................................................11-5Table 11-6 Parameters of the 64 kbit/s interface ...............................................................................................11-5Table 11-7 Parameters of the RS-232 interface..................................................................................................11-6Table 11-8 Parameters of the RS-422 interface..................................................................................................11-6Table 11-9 Parameters of the orderwire interface.............................................................................................. 11-6Table 11-10 Dimensions and weight of a DCM.................................................................................................11-7Table 11-11 Performance requirement of dispersion compensation optical fiber of C-band (G.652 fiber)...... 11-7Table 11-12 Performance requirement of dispersion compensation optical fiber of L-band (G.652 fiber).......11-8Table 11-13 Performance requirement of dispersion compensation optical fiber of C-band (G.655 LEAF fiber).............................................................................................................................................................................11-9Table 11-14 Dimensions of a DCM frame.........................................................................................................11-9Table 11-15 Dimensions and weight of HUB....................................................................................................11-9Table 11-16 Dimensions of a HUB frame........................................................................................................11-10Table 11-17 Main optical path parameters of the OptiX BWS 1600G-I system (SSMF/G.655 fiber)............11-10Table 11-18 Main optical path parameters of the OptiX BWS 1600G-II system (C+L, SSMF fiber)............11-12Table 11-19 Main optical path parameters of the OptiX BWS 1600G-II system (C band, SSMF fiber, NRZ)...........................................................................................................................................................................11-13Table 11-20 Main optical path parameters of the OptiX BWS 1600G-II system (C band, LEAF fiber, NRZ)...........................................................................................................................................................................11-14Table 11-21 Main optical path parameters of the OptiX BWS 1600G-II (SSMF fiber, DRZ) .......................11-16Table 11-22 Main optical path parameters of the OptiX BWS 1600G-II (LEAF fiber, DRZ) .......................11-17Table 11-23 Main optical path parameters of the OptiX BWS 1600G-III system (SSMF fiber, NRZ) .........11-18Table 11-24 Main optical path parameters of the OptiX BWS 1600G-III system (LEAF fiber, NRZ) ..........11-19Table 11-25 Main optical path parameters of the OptiX BWS 1600G-III (SSMF fiber, DRZ) ......................11-20Table 11-26 Main optical path parameters of the OptiX BWS 1600G-III (LEAF fiber, DRZ) ......................11-21Table 11-27 Main optical path parameters of the OptiX BWS 1600G-III system (G.653 fiber, DRZ) ..........11-22Table 11-28 Main optical path parameters of the OptiX BWS 1600G-III system (G.653 fiber, NRZ) ..........11-23Table 11-29 Main optical path parameters of the OptiX BWS 1600G-IV system (G.653 fiber, L band) ......11-24Table 11-30 Main optical path parameters of the OptiX BWS 1600G-V system (G.652/G.655 fiber) ..........11-25Table 11-31 Main optical path parameters of the OptiX BWS 1600G-VI system (G.652, 8-channel, forward Raman+ backward Raman) .........................................................................................................................................11-27Table 11-32 Main optical path parameters of the OptiX BWS 1600G-VI system (G.652/G.655 fiber, 10-channel,HBA+Raman) ...................................................................................................................................................11-28Table 11-33 Main optical path specifications of the OptiX BWS 1600G-VI system (G.652/G.655 fiber, 40-channel,HBA+Raman) ...................................................................................................................................................11-29Table 11-34 Main optical path specifications of the OptiX BWS 1600G-VI system (G.652/G.655 fiber, 80-channel,HBA+Raman) ...................................................................................................................................................11-30

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Table 11-35 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels, SSMF fiber, NRZ)...........................................................................................................................................................................11-31Table 11-36 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels, LEAF fiber, NRZ)...........................................................................................................................................................................11-32Table 11-37 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels, SSMF fiber, DRZ)...........................................................................................................................................................................11-33Table 11-38 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels, LEAF fiber, DRZ)...........................................................................................................................................................................11-34Table 11-39 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel, SSMF fiber, NRZ)...........................................................................................................................................................................11-35Table 11-40 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel, LEAF fiber, NRZ)...........................................................................................................................................................................11-37Table 11-41 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel, SSMF fiber, DRZ)...........................................................................................................................................................................11-38Table 11-42 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel, LEAF fiber, DRZ)...........................................................................................................................................................................11-39Table 11-43 40 x 40G system specification (SSMF/LEAF fiber, DRZ)..........................................................11-40Table 11-44 80 x 40G system specification (SSMF/LEAF fiber, ODB).........................................................11-41Table 11-45 Main optical path parameters of the OptiX BWS 1600G-IX system (192 channel, SSMF&LEAF fiber,DRZ)..................................................................................................................................................................11-42Table 11-46 Main optical path parameters of the OptiX BWS 1600G-IX system (160 channel, SSMF&LEAF fiber,DRZ)..................................................................................................................................................................11-43Table 11-47 C-band channel allocation XE "C-band channel allocation" (96 channels with 50GHz spacing)...........................................................................................................................................................................11-45Table 11-48 C plus-band channel allocation XE "C-band channel allocation" (96 channels with 50GHz spacing)...........................................................................................................................................................................11-46Table 11-49 L-band channel allocation XE "L-band channel allocation" (80 channels with 50 GHz spacing)...........................................................................................................................................................................11-48Table 11-50 Laser class....................................................................................................................................11-50Table 11-51 Specifications of optical module on the client side of the ELOG (GE).......................................11-54Table 11-52 Specifications of optical module on the client side of the ELOG (FC100 and FC200)...............11-55Table 11-53 Specifications of fixed wavelength optical module on the WDM side of the ELOG..................11-56Table 11-54 Specifications of tunable wavelength optical module on the WDM side of the ELOG..............11-57Table 11-55 Specifications of optical module on the client side of the ELOGS (GE).....................................11-58Table 11-56 Specifications of optical module on the client side of the ELOGS (FC100 and FC200)............11-59Table 11-57 Specifications of fixed wavelength optical module on the WDM side of the ELOGS................11-60Table 11-58 Specifications of tunable wavelength optical module on the WDM side of the ELOGS............11-61Table 11-59 Specifications of optical module on the client side of the ETMX (SDH/SONET)......................11-63Table 11-60 Specifications of optical module on the client side of the ETMX (OTU1).................................11-64Table 11-61 Specifications of fixed wavelength optical module on the WDM side of the ETMX.................11-65Table 11-62 Specifications of tunable wavelength optical module on the WDM side of the ETMX..............11-66Table 11-63 Specifications of optical module on the client side of the ETMXS (SDH/SONET)...................11-67Table 11-64 Specifications of optical module on the client side of the ETMXS (OTU1)...............................11-68Table 11-65 Specifications of fixed wavelength optical module on the WDM side of the ETMXS...............11-70Table 11-66 Specifications of tunable wavelength optical module on the WDM side of the ETMXS...........11-71Table 11-67 Specifications of optical module on the client side of the FCE...................................................11-72

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Table 11-68 Specifications of fixed wavelength optical module on the WDM side of the FCE.....................11-73Table 11-69 Specifications of tunable wavelength optical module on the WDM side of the FCE..................11-74Table 11-70 Specifications of optical module on the client side of the FDG...................................................11-75Table 11-71 Specifications of fixed wavelength optical module on the WDM side of the FDG.....................11-77Table 11-72 Specifications of tunable wavelength optical module on the WDM side of the FDG.................11-77Table 11-73 Specifications of optical module on the client side of the IMX4.................................................11-79Table 11-74 Specifications of fixed wavelength optical module on the WDM side of the IMX4...................11-80Table 11-75 Specifications of tunable wavelength optical module on the WDM side of the IMX4...............11-80Table 11-76 Specifications of optical module on the client side of the IMX4S...............................................11-82Table 11-77 Specifications of tunable wavelength optical module on the WDM side of the IMX4S.............11-83Table 11-78 Specifications of optical module on the client side of the LBE...................................................11-84Table 11-79 Specifications of fixed wavelength optical module on the WDM side of the LBE.....................11-85Table 11-80 Specifications of tunable wavelength optical module on the WDM side of the LBE.................11-86Table 11-81 Specifications of optical module on the client side of the LBES.................................................11-88Table 11-82 Specifications of fixed wavelength optical module on the WDM side of the LBES...................11-89Table 11-83 Specifications of tunable wavelength optical module on the WDM side of the LBES...............11-90Table 11-84 Specifications of optical module on the client side of the LBF (SDH/SONET)..........................11-91Table 11-85 Specifications of optical module on the client side of the LBF (OTU2).....................................11-93Table 11-86 Specifications of optical module on the client side of the LBF (10GE-LAN).............................11-94Table 11-87 Specifications of fixed wavelength optical module on the WDM side of the LBF.....................11-95Table 11-88 Specifications of tunable wavelength optical module on the WDM side of the LBF..................11-95Table 11-89 Specifications of optical module on the client side of the LBFS (SDH/SONET).......................11-97Table 11-90 Specifications of optical module on the client side of the LBFS (OTU2)...................................11-98Table 11-91 Specifications of optical module on the client side of the LBFS (10GE-LAN)..........................11-99Table 11-92 Specifications of fixed wavelength optical module on the WDM side of the LBFS.................11-100Table 11-93 Specifications of tunable wavelength optical module on the WDM side of the LBFS.............11-101Table 11-94 Specifications of optical module on the client side of the LDG................................................11-103Table 11-95 Specifications of fixed wavelength optical module on the WDM side of the LDG..................11-104Table 11-96 Specifications of tunable wavelength optical module on the WDM side of the LDG...............11-105Table 11-97 Specifications of optical module on the client side of the LOG (GE).......................................11-106Table 11-98 Specifications of fixed wavelength optical module on the WDM side of the LOG..................11-107Table 11-99 Specifications of tunable wavelength optical module on the WDM side of the LOG...............11-108Table 11-100 Specifications of optical module on the client side of the LOGS (GE)...................................11-109Table 11-101 Specifications of tunable wavelength optical module on the WDM side of the LOGS...........11-110Table 11-102 Specifications of optical module on the client side of the LOM (GE).....................................11-112Table 11-103 Specifications of optical module on the client side of the LOM (FC and FICON).................11-113Table 11-104 Specifications of fixed wavelength optical module on the WDM side of the LOM................11-114Table 11-105 Specifications of tunable wavelength optical module on the WDM side of the LOM............11-115Table 11-106 Specifications of optical module on the client side of the LOMS (GE)..................................11-117Table 11-107 Specifications of optical module on the client side of the LOMS (FC and FICON)...............11-118Table 11-108 Specifications of tunable wavelength optical module on the WDM side of the LOMS..........11-119Table 11-109 Specifications of optical module on the client side of the LQM (GE).....................................11-121

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Table 11-110 Specifications of optical module on the client side of the LQM (SDH/SONET)....................11-122Table 11-111 Specifications of optical module on the client side of the LQM (FC).....................................11-123Table 11-112 Specifications of optical module on the client side of the LQM (ESCON and other services).........................................................................................................................................................................11-124Table 11-113 Specifications of fixed wavelength optical module on the WDM side of the LQM................11-125Table 11-114 Specifications of tunable wavelength optical module on the WDM side of the LQM............11-126Table 11-115 Specifications of optical module on the WDM side of the LR40............................................11-127Table 11-116 Specifications of fixed wavelength optical module on the WDM side of the LRF.................11-129Table 11-117 Specifications of tunable wavelength optical module on the WDM side of the LRF..............11-130Table 11-118 Specifications of fixed wavelength optical module on the WDM side of the LRFD..............11-131Table 11-119 Specifications of tunable wavelength optical module on the WDM side of the LRFD...........11-132Table 11-120 Specifications of tunable wavelength optical module on the WDM side of the LRFS...........11-134Table 11-121 Specifications of optical module on the client side of the LU40.............................................11-135Table 11-122 Specifications of optical module on the WDM side of the LU40............................................11-136Table 11-123 Specifications of optical module on the client side of the LU40S...........................................11-137Table 11-124 Specifications of optical module on the WDM side of the LU40S..........................................11-138Table 11-125 Specifications of optical module on the client side of the LW40............................................11-140Table 11-126 Specifications of optical module on the WDM side of the LW40...........................................11-141Table 11-127 Specifications of optical module on the client side of the LWC1 (SDH/SONET)..................11-142Table 11-128 Specifications of optical module on the client side of the LWC1 (OTU1)..............................11-143Table 11-129 Specifications of fixed wavelength optical module on the WDM side of the LWC1..............11-144Table 11-130 Specifications of tunable wavelength optical module on the WDM side of the LWC1..........11-145Table 11-131 Specifications of optical module on the client side of the LWF..............................................11-147Table 11-132 Specifications of optical module on the client side of the LWF (10GE).................................11-148Table 11-133 Specifications of fixed wavelength optical module on the WDM side of the LWF................11-149Table 11-134 Specifications of tunable wavelength optical module on the WDM side of the LWF.............11-150Table 11-135 Specifications of optical module on the client side of the LWFS............................................11-152Table 11-136 Specifications of optical module on the client side of the LWFS (10GE)...............................11-153Table 11-137 Specifications of fixed wavelength optical module on the WDM side of the LWFS..............11-155Table 11-138 Specifications of tunable wavelength optical module on the WDM side of the LWFS..........11-155Table 11-139 Specifications of optical module on the client side of the LWM.............................................11-157Table 11-140 Specifications of fixed wavelength optical module on the WDM side of the LWM...............11-158Table 11-141 Specifications of tunable wavelength optical module on the WDM side of the LWM...........11-159Table 11-142 Specifications of fixed wavelength optical module on the WDM side of the LWMR............11-161Table 11-143 Specifications of tunable wavelength optical module on the WDM side of the LWMR.........11-162Table 11-144 Specifications of optical module on the client side of the LWX.............................................11-163Table 11-145 Specifications of fixed wavelength optical module on the WDM side of the LWX...............11-164Table 11-146 Specifications of tunable wavelength optical module on the WDM side of the LWX............11-165Table 11-147 Specifications of fixed wavelength optical module on the WDM side of the LWXR.............11-167Table 11-148 Specifications of tunable wavelength optical module on the WDM side of the LWXR.........11-168Table 11-149 Specifications of fixed wavelength optical module on the WDM side of the TMR................11-169Table 11-150 Specifications of tunable wavelength optical module on the WDM side of the TMR............11-170Table 11-151 Specifications of fixed wavelength optical module on the WDM side of the TMRS..............11-171

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Table 11-152 Specifications of tunable wavelength optical module on the WDM side of the TMRS..........11-172Table 11-153 Specifications of optical module on the client side of the TMX..............................................11-174Table 11-154 Specifications of fixed wavelength optical module on the WDM side of the TMX................11-175Table 11-155 Specifications of tunable wavelength optical module on the WDM side of the TMX............11-176Table 11-156 Specifications of optical module on the client side of the TMXS...........................................11-177Table 11-157 Specifications of tunable wavelength optical module on the WDM side of the TMXS..........11-178Table 11-158 Specifications of optical module on the client side of the TMX40 (SDH/10GE-WAN).........11-180Table 11-159 Specifications of optical module on the client side of the TMX40 (OTU2)............................11-181Table 11-160 Specifications of optical module on the client side of the TMX40 (10GE-LAN)...................11-182Table 11-161 Specifications of tunable wavelength optical module on the WDM side of the TMX40........11-183Table 11-162 Specifications of optical module on the client side of the TMX40S (SDH/10GE-WAN)......11-185Table 11-163 Specifications of optical module on the client side of the TMX40S (OTU2)..........................11-186Table 11-164 Specifications of optical module on the client side of the TMX40S (10GE-LAN).................11-187Table 11-165 Specifications of tunable wavelength optical module on the WDM side of the TMX40S......11-188Table 11-166 Specifications of fixed wavelength optical module on the WDM side of the TRC1...............11-190Table 11-167 Specifications of tunable wavelength optical module on the WDM side of the TRC1...........11-191Table 11-168 Specifications of fixed wavelength optical module on the WDM side of the TRC2...............11-192Table 11-169 Specifications of tunable wavelength optical module on the WDM side of the TRC2...........11-193Table 11-170 Jitter transfer characteristics specifications..............................................................................11-195Table 11-171 Input jitter tolerance specifications..........................................................................................11-195Table 11-172 Output jitter specifications.......................................................................................................11-196Table 11-173 Optical interface parameter specifications of the D40.............................................................11-198Table 11-174 Optical interface parameter specifications of the D48.............................................................11-199Table 11-175 Optical interface parameter specifications of the FIU-03/06 (C+1510)..................................11-200Table 11-176 Optical interface parameter specifications of the E3ITL01.....................................................11-201Table 11-177 Optical interface parameter specifications of the E3ITL02.....................................................11-201Table 11-178 Optical interface parameter specifications of the E3ITL03.....................................................11-202Table 11-179 Optical interface parameter specifications of the E3ITL05.....................................................11-203Table 11-180 Optical interface parameter specifications of the M40............................................................11-204Table 11-181 Optical interface parameter specifications of the M48............................................................11-205Table 11-182 Optical interface parameter specifications of the V40.............................................................11-206Table 11-183 Optical interface parameter specifications of the V48.............................................................11-207Table 11-184 Optical interface parameter specifications of the E1DWC......................................................11-209Table 11-185 Optical interface parameter specifications of the E2DWC......................................................11-210Table 11-186 Optical interface parameter specifications of the EDWC........................................................11-211Table 11-187 Optical interface parameter specifications of the MR2............................................................11-213Table 11-188 Optical specifications of the MR8............................................................................................11-214Table 11-189 Rules of adding/dropping wavelength of the MR8..................................................................11-215Table 11-190 Optical interface parameter specifications of the RMU9.........................................................11-216Table 11-191 Optical interface parameter specifications of the E1WSD5.....................................................11-216Table 11-192 Optical interface parameter specifications of the E2WSD5.....................................................11-217Table 11-193 Optical interface parameter specifications of the E1WSD9.....................................................11-218

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Table 11-194 Optical interface parameter specifications of the E2WSD9.....................................................11-219Table 11-195 Optical interface parameter specifications of the E1WSM5....................................................11-220Table 11-196 Optical interface parameter specifications of the E2WSM5....................................................11-220Table 11-197 Optical interface parameter specifications of the E1WSM9....................................................11-221Table 11-198 Optical interface parameter specifications of the E2WSM9C9WSM9....................................11-222Table 11-199 Optical interface parameter specifications of the WSMD4.....................................................11-223Table 11-200 Optical interface parameter specifications of the WSMD2.....................................................11-224Table 11-201 Optical specifications of the HBA01.......................................................................................11-225Table 11-202 Optical specifications of the HBA02.......................................................................................11-226Table 11-203 Optical specifications of the E2OAU01 for L-band.................................................................11-227Table 11-204 Optical specifications of the E5OAUC00................................................................................11-228Table 11-205 Optical specifications of the E5OAUC01................................................................................11-229Table 11-206 Optical specifications of the E5OAUC03................................................................................11-230Table 11-207 Optical specifications of the E5OAUC05................................................................................11-231Table 11-208 Optical specifications of the E4OAUC00................................................................................11-232Table 11-209 Optical specifications of the E4OAUC01................................................................................11-233Table 11-210 Optical specifications of the E4OAUC03................................................................................11-234Table 11-211 Optical specifications of the E4OAUC05................................................................................11-235Table 11-212 Optical specifications of the E2OBU04 for L-band.................................................................11-237Table 11-213 Optical specifications of the E5OBUC03................................................................................11-237Table 11-214 Optical specifications of the E5OBUC05................................................................................11-238Table 11-215 Optical specifications of the E4OBUC03................................................................................11-239Table 11-216 Optical specifications of the E4OBUC05................................................................................11-240Table 11-217 Optical specifications of the E5OPU.......................................................................................11-241Table 11-218 Optical specifications of the E4OPU.......................................................................................11-242Table 11-219 Optical specifications of the RPA............................................................................................11-244Table 11-220 Optical specifications of the E1RPC02....................................................................................11-245Table 11-221 Optical specifications of the E2RPC01....................................................................................11-245Table 11-222 Optical specifications of the E2RPC03....................................................................................11-246Table 11-223 Optical interface parameter specifications of the SC1.............................................................11-249Table 11-224 Optical interface parameter specifications of the SC2.............................................................11-250Table 11-225 Optical interface parameter specifications of the ST1.............................................................11-251Table 11-226 Optical interface parameter specifications of the ST2.............................................................11-252Table 11-227 Optical interface parameter specifications of the DCP01 (single-mode).................................11-253Table 11-228 Optical interface parameter specifications of the DCP02 (multi-mode)..................................11-254Table 11-229 Optical interface parameter specifications of the OCP............................................................11-255Table 11-230 Optical interface parameter specifications of the E2OLP01 (multi-mode)..............................11-255Table 11-231 Optical interface parameter specifications of the E2OLP02 (single-mode)............................11-256Table 11-232 Optical interface parameter specifications of the E2OLP03 (single-mode)............................11-256Table 11-233 Optical interface parameter specifications of the SCS.............................................................11-257Table 11-234 Optical specifications of the E1MCA......................................................................................11-258Table 11-235 Optical specifications of the E2MCA......................................................................................11-259

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Table 11-236 Optical specifications of the WMU..........................................................................................11-260Table 11-237 Optical interface parameter specifications of the VA2............................................................11-261Table 11-238 Optical interface parameter specifications of the VA4............................................................11-262Table 11-239 Optical interface parameter specifications of the VOA...........................................................11-263Table 11-240 Optical specifications of the FMU...........................................................................................11-264Table 11-241 Optical specifications of the MWA..........................................................................................11-265Table 11-242 Optical specifications of the MWF..........................................................................................11-266Table 11-243 Optical interface parameter specifications of the DGE............................................................11-268Table 11-244 Optical specifications of the DSE01........................................................................................11-269Table 11-245 Optical specifications of the DSE02 .......................................................................................11-269Table 11-246 Optical specifications of the DSE03........................................................................................11-270Table 11-247 Optical specifications of the GFU03 (used with Raman amplifier).........................................11-270Table 11-248 Optical specifications of the GFU04 (used with ROP amplifier)............................................11-271Table A-1 Requirements for climate environment..............................................................................................A-4Table A-2 Requirements for the density of mechanical active substance...........................................................A-5Table A-3 Requirements for the density of chemical active substance...............................................................A-5Table A-4 Requirements for mechanical stress...................................................................................................A-6Table A-5 Requirements for climate environment..............................................................................................A-6Table A-6 Requirements on the density of mechanical active substance............................................................A-7Table A-7 Requirements for the density of chemical active substance...............................................................A-7Table A-8 Requirements for mechanical stress...................................................................................................A-8Table A-9 Requirements for temperature, humidity............................................................................................A-9Table A-10 Other requirements for climate environment...................................................................................A-9Table A-11 Requirements for the density of mechanical active substance.......................................................A-10Table A-12 Requirements for the density of chemical active substance...........................................................A-10Table A-13 Requirements for mechanical stress...............................................................................................A-10Table B-1 OptiX BWS 1600G equipment board information.............................................................................B-1Table C-1 Abbreviations of the overheads at the OTN optical layer..................................................................C-5

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About This Document

PurposeThis document describes the functions, features, specifications and network application of theequipment.

Related VersionsThe following table lists the product versions related to this document.

Product Name Version

OptiX BWS 1600G V100R006

OptiX iManager T2000 V200R006C03

Intended AudienceThe intended audiences of this document are:

l Network Planning Engineer

l Data Configuration Engineer

l System Maintenance Engineer

OrganizationThis document consists of following chapters and is organized as follows.

Chapter Description

1 Network Application This chapter describes the market target and the features of theOptiX BWS 1600G. It also introduces the classification of ninesystem types of the system.

2 Product Functions This chapter describes the functions of the product.

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Chapter Description

3 Product Features This chapter describes the features of the product.

4 Hardware Architecture This chapter describes the hardware structure of the product. Forhardware structure, the subracks and units are described.

5 Software Architecture This chapter describes the software structure of the product. Forsoftware structure, the communication protocol and thefunctional principle are described.

6 System Configuration This chapter describes NE composition and NE configuration ofthe system.

7 Protection This chapter describes the protection mechanism of the product.This includes power protection, service protection, and theprotection of network management.

8 Management of OpticalPower

This chapter describes the principle and application of the APE,ALC and IPA.

9 Operation,Administration andMaintenance

This chapter describes the principle and the scheme of theoperation, administration and maintenance of the product.

10 Networking and DesignConsiderations

This chapter also describes factors to be considered innetworking. This helps the network planners and designers tounderstand the basic methods of network design.

11 TechnicalSpecifications

This chapter describes the technical specifications and indicesof the functional units of the system.

Appendix A EnvironmentRequirements

This chapter describes the environment requirement of theproduct.

Appendix B PowerConsumption, Weight andSlots of Boards

This chapter lists the power consumption, weight and slots ofboards.

Appendix C TechnicalFundamental

This chapter describes the advanced technologies of the product,including the OTN, SuperWDM and the Raman amplification.

Appendix D CompliedCriteria

This chapter lists the standards that the OptiX BWS 1600G iscompliant with.

Appendix E Glossary This chapter lists the glossary mentioned in this manual.

Appendix F Acronymsand Abbreviations

This chapter lists the abbreviations and acronyms mentioned inthis manual.

About This Document

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Conventions

Symbol ConventionsThe following symbols may be found in this document. They are defined as follows

Symbol Description

DANGERIndicates a hazard with a high level of risk which, if notavoided, will result in death or serious injury.

WARNINGIndicates a hazard with a medium or low level of risk which,if not avoided, could result in minor or moderate injury.

CAUTIONIndicates a potentially hazardous situation that, if notavoided, could cause equipment damage, data loss, andperformance degradation, or unexpected results.

TIP Indicates a tip that may help you solve a problem or saveyou time.

NOTE Provides additional information to emphasize orsupplement important points of the main text.

General ConventionsConvention Description

Times New Roman Normal paragraphs are in Times New Roman.

Boldface Names of files, directories, folders, and users are in boldface. Forexample, log in as user root.

Italic Book titles are in italics.

Courier New Terminal display is in Courier New.

Command ConventionsConvention Description

Boldface The keywords of a command line are in boldface.

Italic Command arguments are in italic.

[ ] Items (keywords or arguments) in square brackets [ ] areoptional.

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Convention Description

{ x | y | ... } Alternative items are grouped in braces and separated byvertical bars. One is selected.

[ x | y | ... ] Optional alternative items are grouped in square bracketsand separated by vertical bars. One or none is selected.

{ x | y | ... } * Alternative items are grouped in braces and separated byvertical bars. A minimum of one or a maximum of all canbe selected.

GUI ConventionsConvention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titles are inboldface. For example, click OK.

> Multi-level menus are in boldface and separated by the ">" signs. Forexample, choose File > Create > Folder.

Keyboard OperationFormat Description

Key Press the key. For example, press Enter and press Tab.

Key 1+Key 2 Press the keys concurrently. For example, pressing Ctrl+Alt+A means thethree keys should be pressed concurrently.

Key 1, Key 2 Press the keys in turn. For example, pressing Alt, A means the two keysshould be pressed in turn.

Mouse OperationAction Description

Click Select and release the primary mouse button without moving the pointer.

Double-click Press the primary mouse button twice continuously and quickly withoutmoving the pointer.

Drag Press and hold the primary mouse button and move the pointer to a certainposition.

About This Document

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Update HistoryUpdates between document versions are cumulative. Therefore, the latest document versioncontains all updates made to previous versions.

Updates in Issue 03 (2008-08-30) Based on Product Version V100R006The update of contents is described as follows.

Chapter Description

2 System Functions The service access is updated.

3 Product Features The descriptions of WSMD2 board are add in the ROADM(WSS mode), The descriptions of the 40G transmissionsystem are updated.

4 Hardware Architecture The hardware version information and function descriptionsof the LWF and LWFS, LBF and LBFS, LBE and LBES, TMRand TMRS, ETMX and ETMXS, ELOG and ELOGS boardsare updated.The function descriptions of the LU40, LU40S, TMX40,TMX40S, LRFD, LWFD, MR8 and WSMD2 boards areadded.The function descriptions of the LRF and LRFS boards aredeleted.The hardware version information and function descriptionsof the optical multiplexer and demultiplexer and opticalamplier board are updated.The hardware version information and function descriptionsof the MR2, GFU, SCS, WMA, WMF and DSE board areupdated.

11 Technical Specifications The specifications of E3OAUC03 board are updated.The specifications of the LU40, LU40S, TMX40, TMX40S,LRFD, LWFD, MR8 and WSMD2 boards are added.The specifications of the LWF and LWFS, LBF and LBFS,LBE and LBES, TMR and TMRS, ETMX and ETMXS,ELOG and ELOGS boards are updated.The specifications of the LRF and LRFS boards are deleted.

Updates in Issue 02 (2008-02-29) Based on Product Version V100R006The update of contents is described as follows.

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Chapter Description

2 System Functions The types of FC services are updated, and the description onthe service convergence function of the LOM and LOMSboards is added.

3 Product Features The overview of the GE ADM technology is added.

4 Hardware Architecture The function descriptions of the LOM, LOMS, E2LOG,E2LOGS, VA2 and E4OAUC00 boards is added. Thefunction descriptions of the LBF and LBFS boards is updated.The hardware version information of the WSM9, WSM5,WSD9 and WSD5 boards is updated. The functiondescriptions of the WSM9 and WSD9 are updated. Thehardware version information of the VOA and VA4 boards isupdated.

8 Management of OpticalPower

The function description of the EAPE board is added. Thedescription of IPA and the networking application of the IPAwith the Raman function is added.

11 Technical Specifications The specifications of the LBF and LBFS boards, thespecifications of the LOM, LOMS, VA2 and E4OAUC00boards, and the specifications of the VOA and VA4 boardsare updated.

Appendix C TechnicalFundamental

The overview of the OTN technology is added.

Updates in Issue 01 (2007-11-30) Based on Product Version V100R006The update of contents is described as follows.

Chapter Description

2 System Functions The transmission capacity of the system is updated.The descriptions of the transmission of network managementinformation are revised.

3 Product Features The descriptions of WSS mode ROADM type are revised. Therealization scheme about WSMD4 boards is added.The descriptions of 40 G transmission systems are revised.The descriptions of OTN signal processing are added.The descriptions of PRBS error detection function are added.The descriptions of DCN management are revised.The descriptions of software package loading are added.The descriptions of NTP technology are added.The descriptions of the supervisory function at the opticallayer are added.

About This Document

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Chapter Description

4 System Structure The descriptions of the LW40, LR40, IMX4, IMX4S, ELOG,ELOGS, EDWC, and WSMD4 are added.The versions of the LWF, LWFS, LBE, LBES, LBF, LBFS,TMX, TMXS, ETMX, ETMXS, TMR, and TMRS areupdated.

5 System Configuration The structures and typical configurations of OTM in type VIIIsystem are updated.The structures and typical configurations of ROADM type areupdated. The descriptions of EDWC and WSMD4 boards areadded.

6 Protection The descriptions of two OTUs of different type that forms aprotection group of mutual backup are added.The descriptions of the signal degraded (SD) condition thatcan be set on the T2000 are added.Fixed some bugs in the earlier version.

7 Operation, Administrationand Maintenance

The descriptions of the NE security management feature areadded.

9 Networking and DesignConsiderations

The specifications of type VII, VIII and IX systems and thespecifications of the G.653 fiber of type III are updated.

10 Technical Specifications The specifications of type VII, VIII and IX systems and thespecifications of the G.653 fiber of type III are updated.The specifications of the OTU are updated.The specifications of the LW40, LR40, IMX4, IMX4S,ELOG, ELOGS, EDWC and WSMD4 are added.The specifications of the DCM module are updated.The system and board-level CRZ specifications are deleted.

A EnvironmentRequirement.doc

The specifications of the environment requirement areupdated.

Appendix C The description of the power consumption and weight of theboard is updated.

Updates in Issue 03 (2007-09-30) Based on Product Version V100R005The update of contents is described as follows.

Chapter Update description

2 System Functions The transmission distance of the system is updated. Thedescriptions of the clock transportation are updated.

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Chapter Update description

4 System Structure The description of the WMU board is updated in the section"Functional Board".The descriptions of the VA2 are deleted.The board descriptions of the E2OLP01, E2OLP02 areupdated.

5 System Configuration The structure of ROADM type is updated.

6 Protection The descriptions of the switching time are added.

7 Operation, Administrationand Maintenance

The descriptions of the Ethernet2 of the standard subrack thatis used as the backup interface for inter subrackcommunication are added.

8 APE, ALC and IPAApplication

The descriptions of the boards providing the IPA function arerevised.

9 Networking and DesignConsiderations

The indexes of the type VI system are updated.

10 Technical Specifications The indexes of the type VI system are updated.The indexes boards such as LBE, LBES, LBF, LBFS, HBAand WMU are updated.

Updates in Issue 02 (2007-05-30) Based on Product Version V100R005The update of contents is described as follows.

Chapter Update description

2 System Functions The transmission distance of the type VII system is updated.The descriptions of the clock transportation and systemperformance monitoring are added.The descriptions of the network management system arerevised.

3 Product Features The descriptions of the ROADM node by WSS boards arerevised.The descriptions of the ROADM node comprising the RMU9and WSD9 boards are added.The descriptions of the 2.5 G ADM technology are added.

4 System Structure The descriptions and versions of the OTU boards such asLWF, LWFS, LBE, LBES, LBF, LBFS, LWC1, TRC1 andLQM are updated in the section "Functional Board".The descriptions of the forward Raman boards VA2, ST1,ST2, WMU, RMU9, E3OAUC00 and TRC2 are added.

About This Document

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Chapter Update description

5 System Configuration The structure of each NE type is updated according to the newboard list.

6 Protection The descriptions of the trigger conditions of the protectionswitching are revisedFor each protection type, the descriptions of the triggerconditions of the alarm, switching time and dependent alarmsare added.

8 APE, ALC and IPAApplication

The descriptions of the boards providing the IPA function arerevised.

9 Networking and DesignConsiderations

The specifications of the type VII system are updated.

10 Technical Specifications The specifications of the type VII system are updated.The specifications of OTU boards such as LWF, LWFS, LBE,LBES, LBF, LBFS, LWC1, TRC1 and LQM are updated.The specifications of the V40, V48 and MR2 are updated. Theindexes of the forward Raman boards VA2, ST1, ST2, WMU,RMU9, E3OAUC00 and TRC2 are added.The wavelength list and the frequency list of the system areupdated.

Appendix C The descriptions of the power consumption and weight of theboard are revised.

Updates in Issue 01 (2007-01-20) Based on Product Version V100R005The section titled System Description has been modified and has been renamed as ProductDescription.

The update of contents is described as follows.

Chapter Update description

1 Network Application The descriptions of the C-band 192-wavelength system (IX),parameters and specifications and the signal flow chart, areadded.

3 Product Features The descriptions and the signal flow chart of the ROADMconstituted by the WSS board have been added.The descriptions of the C-band 192-wavelength system (IX)are added.The descriptions of the optimized ALS function are added.The descriptions of the IP OVER DCC function are added.

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Chapter Update description

4 System Structure The descriptions of the ETMX, LBF, LQM, M48, D48, M40(C_ODD_PLUS, C_EVEN_PLUS), D40 (C_ODD_PLUS,C_EVEN_PLUS), V40 (C_ODD_PLUS, C_EVEN_PLUS),E2ITL, WSD9, WSD5, WSM9 and WSM5 are added.

5 System Configuration The descriptions of the C-band 192-wavelength system (IX),its parameters and specifications, and the signal flow chart areadded.The description and the signal flow chart of the ROADMconstituted by the WSS board have been added.

6 Protection The descriptions of protection are optimized; some examplesare added; the descriptions of WXCP are added.

8 APE, ALC and IPAApplication

The descriptions of the link attenuation adjustment mode usedto adjust the gain adopted by the ALC function are added.

9 Networking and DesignConsiderations

The description of the networking specifications of the C-band 192-wavelength system (IX) has been added.

10 Technical Specifications The descriptions of the system specifications of the C-band192-wavelength system (IX) and the board specifications ofthe new boards have been added.

Appendix B TechnologyIntroduction

The descriptions of the Super DRZ encoding technology areadded.

Updates in Issue 01 (2007-01-20) Based on Product Version V100R005

One new chapter is added: Chapter 8 APE, ALC and IPA Application

The update of contents is described as follows.

Chapter Update description

10 Technical Specifications The specifications of the 40G OTU are added.

Updates in Issue 01 (2006-05-30) Based on Product Version V100R004

The earlier version of the manual is T2-040284-20060530-C-1.40

The updated contents are as follows:

The section previously titled Technical Descriptionhas been modified and has been renamed asSystem Description.

Two new chapters are added: Chapter 7 Operation, Administration and Maintenance andAppendix C Compliant Standards.

The update of contents is described as follows.

About This Document

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Chapter Update description

1 Network Application Extended C band system and 40G transmission system havebeen added. Now there are eight system types. Relatedcontents have been updated.

2 System Functions Extended C band system and 40G transmission system havebeen added. Now there are eight system types. Relatedcontents have been updated.

3 Product Features The descriptions of the ROADM, 40 G Transmission System,OSC and ESC have been added. The descriptions of the ALC,IPA and APE are updated.

4 System Structure The following descriptions are newly added:l Descriptions of the M08, D08, V48, and the DCP

l Description of boards for extended wavelengths

l Description of the independent OLA subrack

l Description of the 40G transmission

The introductions to the following boards are deleted: theTWC, OCU, OCUS, LQS, AP8, AS8, WBA, RPL, TC1,TC2, and the SCE.

5 System Configuration Extended C band system and 40G transmission system areadded. Now there are eight system types. Related contentsare updated.The configuration principles of the independent OLA areadded.

8 Networking and DesignConsiderations

Extended C band system and 40G transmission system havebeen added. Now there are eight system types. Relatedcontents are updated.

9 Technical Specifications Extended C band system and 40G transmission system havebeen added. Now there are eight system types. Relatedcontents are updated.Board and system parameters are updated

Updates in Issue 03 (2006-06-30) Based on Product Version V100R003The earlier version of the manual is T2-040269-20060630-C-1.32.

The updated contents are as follows:

Fix some bugs in version 1.31.

The specifications of the system and the board have been updated.

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1 Network Application

About This Chapter

This chapter describes the system position and application in networks.

1.1 Position in NetworksThe OptiX BWS 1600G Backbone DWDM Optical Transmission System, the OptiX BWS1600G for short, is a large capacity and long haul backbone transmission product. It is designedin line with the present conditions and the future development of optical networks, with inheritedflexible configuration and good compatibility of OptiX series.

1.2 Classification of System TypesTo meet the requirements of different areas, users and investing environments, the system isavailable in nine types.

1.3 Classification of BandsThe system splits wavelength into different bands according to a certain principle. Systems ofdifferent types use different bands.

1.4 Networking and ApplicationsThe product can apply to the following networking topologies: point-to-point network, chainnetwork, ring network.

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1.1 Position in NetworksThe OptiX BWS 1600G Backbone DWDM Optical Transmission System, the OptiX BWS1600G for short, is a large capacity and long haul backbone transmission product. It is designedin line with the present conditions and the future development of optical networks, with inheritedflexible configuration and good compatibility of OptiX series.

With the modular design that enables rich configurations and flexible protection features, theOptiX BWS 1600G plays a leading role in a transmission network. The access capacity of anoptical fiber can be smoothly expanded from 10 Gbit/s to 1920 Gbit/s (192 × 10 Gbit/s). Duringthe expansion, there is no need to shut off the equipment or interrupt the service. You need toonly insert new hardware or add new nodes.

The OptiX BWS 1600G system can be deployed in point-to-point, linear and ring networks. Asa piece of equipment used at the backbone layer, it connects main cities to carry heavy trafficof optical switching equipment, metropolitan area network (MAN) DWDM equipment, SDHequipment or routers. It provides transmission channels with large capacity for services andnetwork outlets. The position of an OptiX BWS 1600G system in a network is shown in Figure1-1.

Figure 1-1 OptiX BWS 1600G in a transmission network

OptiXBWS 1600G OptiX

OSN 9500

160Channels 32 Channels

OptiXBWS 320G

OptiXBWS 1600G

STM-16

OptiXMetro 3000

STM-4/1STM-4

OptiXMetro 500

STM-4/1

STM-4/1

OptiXMetro 1000

OptiXMetro 6100

40 ChannelsSTM-16 STM-64

OptiXMetro 3000

OptiXMetro 6100

OptiXMetro 6100

OptiXMetro 6100

OptiXMetro 3000

OptiXMetro 3000

OptiXMetro 1000

OptiXMetro 2050

OptiXMetro 2050

OptiXMetro 3000

OptiXMetro 5000

OptiXMetro 5000

Backbone Layer

Access Layer

Convergence Layer

Currently, the OptiX BWS 1600G can multiplex up to 192 service channels in a single fiber.That is, it can transmit 192 carrier signals of different wavelengths. Maximum rate of each signal

1 Network Application

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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is 10 Gbit/s. In this way, the OptiX BWS 1600G realizes 1920 Gbit/s transmission in twodirections with two fibers.

The maximum rate of a single channel reaches 40 Gbit/s.

The OptiX BWS 1600G transmits the unidirectional services over a single fiber, that is, a bi-directional transmission is achieved by two optical fibers. One is for the transmitting. The otheris for receiving.

The OptiX BWS 1600G is highly reliable in performance. It also supports topologies such aschain topology, ring topology and so on. The flexible networking is realized by using:

l Reliable multiplexer/demultiplexer

l Erbium-doped optical fiber amplifier

l Raman amplifier

l Channel equalization technology

l SuperWDM technology

l Dispersion compensation technology

l Universal and centralized network management system

l Reconfigurable Optical Add/Drop Multiplexer technology

l Extended C band technology

1.2 Classification of System TypesTo meet the requirements of different areas, users and investing environments, the system isavailable in nine types.

NOTE

In later sections, the OptiX BWS 1600G-I is referred to as the type I system for short, and other types arethe type II, type III, type IV, type V, type VI, type VII, type VIII and type IX systems. If there is no typeidentity, for example, the OptiX BWS 1600G, it refers to all system types.

1.2.1 Type I System

1.2.2 Type II System

1.2.3 Type III System

1.2.4 Type IV System

1.2.5 Type V System

1.2.6 Type VI System

1.2.7 Type VII System

1.2.8 Type VIII System

1.2.9 Type IX System

1.2.1 Type I SystemThe type I system features the follows:

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l Adopts the non return to zero (NRZ) encoding.

l Adopts the SSMF fiber or the G.655 fiber.

Table 1-1 shows the networking capability of type I system.

Table 1-1 Networking capability of type I system (160-channel, NRZ)

Classification Specification

With FEC 1×28 dB

2×24 dB

5×20 dB

CAUTIONl In section 1.2 , the span attenuation is the actual attenuation of fiber, that is, the difference

between the output optical power of the local station and the input optical power of thedownstream station. The span attenuation does not include the attenuation of the FIU board.

l In section 1.2 , the typical distances in the networking specifications are calculated on thebasis that the fiber attenuation coefficient is 0.275 dB/km.

The Raman amplifier serves to:

l Suppress the OSNR from degrading.

l Support more spans.

l Transmit signals further.

With a Raman amplifier, the type I system supports a transmission distance of 640 km (400 mi.)without any REG. The type I system that adopts the AFEC can transmit signals even furtherwithout any REG.

1.2.2 Type II SystemThe type II system supports the C+L 800G and the C 800G.

C+L 800G

The C+L 800G system features the follows:

l Adopts the NRZ encoding.

l Adopts the SSMF fiber.

Table 1-2 shows the networking capability of C+L 800G system.

1 Network Application

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Table 1-2 Networking capability of type II system (C+L 80-channel)

Classification Specification

With FEC, NRZ 1×32 dB

4×25 dB

7×22 dB

If the type II system adopts a Raman amplifier, the OSNR is greatly enhanced. As a result, thesystem can transmit signals for long haul without any REG.

C 800GThe C 800G system features the follows:

l Adopts the NRZ and the DRZ encoding (SuperWDM technology).

l Adopts the SSMF fiber or the LEAF fiber.

Table 1-3 shows the networking capability of the C 800G system.

Table 1-3 Networking capability of type II system (C, 80-channel)

Classification Specification

SSMF (with FEC, NRZ) 8×27 dB

16×22 dB

LEAF (with FEC, NRZ) 7×27 dB

14×22 dB

SSMF and LEAF (DRZ) 20×22 dB

1.2.3 Type III SystemTable 1-4 and Table 1-5 show the networking capability of type III system.

When the type III system features the follows:

l Adopts the NRZ encoding.

l Adopts the SSMF fiber or the LEAF fiber.

Table 1-4 Networking capability of type III system (40-channel, SSMF fiber, NRZ)

Classification Specification

With FECWithout Raman amplification

8×30 dB

16×25 dB

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Classification Specification

20×22 dB

Table 1-5 Networking capability of type III system (40-channel, LEAF fiber, NRZ)

Classification Specification

With FECWithout Raman amplification

8×30 dB

16×25 dB

Table 1-6 shows the networking capability of type III system that adopts the SuperWDMtechnology (DRZ encoding) and adopts the SSMF/LEAF fiber.

Table 1-6 Networking capability of type III system (40-channel, SuperDRZ)

Classification Specification

With FECWithout Raman amplification

25×22 dB

NOTE

l In ultra-long haul transmission, the optical power and the dispersions of each channel are uneven. Ifthere are more than 12 optical amplification spans, the system has to adopt the OEQs. If the fiber ofmultiplex section exceeds 1000 km (620 mi.), the system has to adopt the dispersion compensators.

l If the system adopts a Raman amplifier or an AFEC, the system performance is improved. As a result,the network transmission capability over single hop is enhanced.

For the G.653, the proper wavelengths and input optical power must be selected in C-band toavoid mixing of the four wavelengths.Table 1-7 and Table 1-8 show the network capability oftype III system that adopts the G.653 fiber.

Table 1-7 Networking capability of type III system (G.653 fiber, NRZ)

Classification Specification

With FEC22-wavelength system

10×23 dB

With FEC40-wavelength system

8×22 dB

1 Network Application

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

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Table 1-8 Networking capability of type III system (G.653 fiber, DRZ)

Classification Specification

With FEC22-wavelength system

14×23 dB

With FEC40-wavelength system

11×23 dB

1.2.4 Type IV SystemThe type IV system features the follows:

l Adopts the NRZ encoding.

l Adopts the L-band signal.

l Adopts the G.653 fiber.

Table 1-9 shows the networking capability of type IV system.

Table 1-9 Networking capability of type IV system (40-channel, L band)

Classification Specification

With FEC 1×30 dB

3×25 dB

5×22 dB

1.2.5 Type V SystemThe type V system features the follows:

l Adopts the NRZ encoding.

l Adopts the G.652 fiber or the G.655 fiber.

Table 1-10 shows the networking capability of type V system.

Table 1-10 Networking capability of type V system (40-channel, NRZ)

Classification Specification

With FEC 1×39 dB

6×27 dB

8×22 dB

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The type V system supports transmission of 640 km (400 mi.) without using REG or anydispersion compensators.

The type V system does not need the Raman amplifier.

1.2.6 Type VI SystemThe type VI system features the follows:

l Is a Long Hop (LHP) system.

l Adopts the G.652 or the G.655 fiber.

The LHP system is configured with point-to-point OTMs without any optical or electrical REGs.Table 1-11, Table 1-12, Table 1-13 and Table 1-14 shows the networking capability of typeVI system.

Table 1-11 Networking capability of type VI system (8-channel, forward Raman+ backwardRaman)

Classification Specification

With G.652 fiber (10Gbit/s, DRZ) 1×66 dB

Table 1-12 Networking capability of type VI system (10-channel, HBA+ Raman)

Classification Specification

With G.652/G.655 fiber (2.5Gbit/s, NRZ) 1×64 dB

With G.652 fiber (10Gbit/s, DRZ) 1×63 dB

With G.655 fiber (10Gbit/s, DRZ) 1×61 dB

Table 1-13 Networking capability of type VI system (40-channel, HBA+ Raman)

Classification Specification

With G.652/G.655 fiber (2.5Gbit/s, NRZ) 1×53 dB

With G.652 fiber (10Gbit/s, DRZ) 1×52 dB

With G.655 fiber (10Gbit/s, DRZ) 1×50 dB

Table 1-14 Networking capability of type VI system (80-channel, HBA+ Raman)

Classification Specification

With G.652 fiber (10Gbit/s, DRZ) 1×48 dB

With G.655 fiber (10Gbit/s, DRZ) 1×46 dB

1 Network Application

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1.2.7 Type VII SystemType VII system (C-band) features the follows:

l Adopts the NRZ and DRZ encoding.

l Adopts the SSMF fiber or the LEAF fiber.

Table 1-15 shows the networking capability of Type VII system (C-band, 480G). Table 1-16shows the networking capability of Type VII system (C-band, 960G).

Table 1-15 Networking capability of type VII system (C-band, 48-channel)

Classification Specification

SSMF fiber, NRZWith FECWithout Raman amplification

20×22 dB

16×25 dB

8×30 dB

LEAF fiber, NRZWith FECWithout Raman amplification

16×25 dB

8×30 dB

SSMF/LEAF fiber, DRZWith FECWithout Raman amplification

25×22 dB

Table 1-16 Networking capability of type VII system (C-band, 96-channel)

Classification Specification

SSMF fiber, NRZWith FECWithout Raman amplification

8×27 dB

16×22 dB

LEAF fiber, NRZWith FECWithout Raman amplification

7×27 dB

14×22 dB

SSMF/LEAF fiber, DRZWith FECWithout Raman amplification

20×22 dB

1.2.8 Type VIII SystemThe type VIII system features the follows:

l Supports 40 wavelengths x 40G and 80 wavelengths x 40G transmission.

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l Adopts the SSMF fiber or the LEAF fiber.

Table 1-17 shows the networking capability of type VIII system.

Table 1-17 Networking capability of type VIII system for 40 Gbit/s transmission solution(SSMF/LEAF fiber)

Classification Specification

DRZ encoding, SSMF fiber40-wavelength system

15×22 dB

DRZ encoding, LEAF fiber40-wavelength system

12×22 dB

ODB encoding, SSMF fiber80-wavelength system

10×22 dB

ODB encoding, LEAF fiber80-wavelength system

10×22 dB

1.2.9 Type IX SystemThe type IX 192-channel and 160-channel system in C-band supports the DRZ encoding andthe SSMF&LEAF fibers. Table 1-18 shows it networking capabilities.

Table 1-18 Networking capability of type IX system (SSMF&LEAF fiber)

Classification Specification

DRZ encoding192-wavelength system

10×22 dB (SSMF)

6×22 dB (LEAF)

DRZ encoding160-wavelength system

10×22 dB (SSMF)

6×22 dB (LEAF)

1.3 Classification of BandsThe system splits wavelength into different bands according to a certain principle. Systems ofdifferent types use different bands.

1.3.1 80-Channel System in C Band/L BandExcept for type VII and type IX systems, the other systems use C band and L band of the fibercommunication window. The C band and L band provide 80 channels with a minimum of 50GHz channel spacing.

1.3.2 96-Channel System in C-BandAmong the nine types of systems, only the type VII system uses 96 channels of the extended C-band (including the general C-band) with a minimum of 50 GHz channel spacing.

1 Network Application

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1.3.3 192-Channel System in C-BandThe type IX system uses 192 channels of the extended C-band (including the general C-band)with a minimum of 25 GHz channel spacing.

1.3.1 80-Channel System in C Band/L BandExcept for type VII and type IX systems, the other systems use C band and L band of the fibercommunication window. The C band and L band provide 80 channels with a minimum of 50GHz channel spacing.

For convenience, the C band and L band are divided into C_ODD, C_EVEN, L_ODD andL_EVEN as follows:

l C_EVEN: 192.10 THz–196.00 THz (1529.55 nm–1560.61 nm)

l C_ODD: 192.15 THz–196.05 THz (1529.16 nm–1560.20 nm)

l L_EVEN: 186.95 THz–190.85 THz (1570.82 nm–1603.57 nm)

l L_ODD: 187.00 THz–190.90 THz (1570.42 nm–1603.17 nm)

1.3.2 96-Channel System in C-BandAmong the nine types of systems, only the type VII system uses 96 channels of the extended C-band (including the general C-band) with a minimum of 50 GHz channel spacing.

The extended C-band is also divided into odd channels and even channels as follows:

l C_EVEN: 191.30 THz–196.00 THz (1529.55 nm–1567.13 nm)

l C_ODD: 191.35 THz–196.05 THz (1529.16 nm–1566.72 nm)

1.3.3 192-Channel System in C-BandThe type IX system uses 192 channels of the extended C-band (including the general C-band)with a minimum of 25 GHz channel spacing.

The extended C-band is divided into four sections as follows:

l C_EVEN: 191.300 THz–196.000 THz (1529.5534 nm–1567.1326 nm)

l C_ODD: 191.350 THz–196.050 THz (1529.1633 nm–1566.7231 nm)

l C_EVEN_PLUS: 191.325 THz–196.025 THz (1529.3583 nm–1566.9278 nm)

l C_ODD_PLUS: 191.375 THz–196.075 THz (1528.9683 nm–1566.5184 nm)

1.4 Networking and ApplicationsThe product can apply to the following networking topologies: point-to-point network, chainnetwork, ring network.

Through the above topologies, the product achieves the following applications:

l Long haul transmission

l Ultra long haul transmission

l Ultra long haul plus long hop transmission

1.4.1 Point-to-Point Network

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It is composed of OTM and OLA stations, and it is the most prevalent networking mode adoptedby the system.

1.4.2 Chain NetworkA chain network may comprise OTM, OLA, OADM, REG and OEQ stations and can be regardedas the extension of a point-to-point network.

1.4.3 Ring NetworkRing network may comprise OADMs or back-to-back OTMs depending on the practicalsituation.

1.4.1 Point-to-Point NetworkIt is composed of OTM and OLA stations, and it is the most prevalent networking mode adoptedby the system.

The typical point-to-point network is shown in Figure 1-2.

Figure 1-2 Point-to-Point network

mdB

n X m dB

Client OTM OLA OLA OLA OTM Client

Point to point network

m dB: m indicates the attenuation value of the span

1.4.2 Chain NetworkA chain network may comprise OTM, OLA, OADM, REG and OEQ stations and can be regardedas the extension of a point-to-point network.

The typical chain network is shown in Figure 1-3.

Figure 1-3 Chain network

Drop Add

Client OTM OLA OEQ OTM Client

Chain network

OADM

1.4.3 Ring NetworkRing network may comprise OADMs or back-to-back OTMs depending on the practicalsituation.

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It is largely used in regional networks. In practice, one OADM in the DWDM ring network maybe composed of back-to-back OTMs to remove the accumulated noise caused by the amplifier.The typical ring network is shown in Figure 1-4.

Figure 1-4 Ring network

Back to back OTM

Ring network

OADM

OADM

Back to back OTM

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2 Product Functions

About This Chapter

This chapter describes the functions of the product.

2.1 Transmission AbilityThe transmission distance and capacity vary with the system type.

2.2 Service AccessThe system can access services of different types by different optical transponder units (OTUs).

2.3 Guaranteed ReliabilityThe system provide equipment level protection and network level protection.

2.4 Clock TransmissionThe system provides the PDH-level clock transmission channels that are accessed by theelectrical interfaces in the subrack interface area. It provides two clock input channels and fourclock output channels.

2.5 Performance MonitoringPerformance monitoring based on access services and that based on the network of the system.

2.6 Network Management SystemBy using the Qx and CORBA interfaces, the NM system manages alarm, performance,configuration, communication, security, and topology of the entire optical transmission system.

2.7 Transmission of Network Management InformationThere are three communication modes: HWECC, IP over DCC and OSI over DCC.

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2.1 Transmission AbilityThe transmission distance and capacity vary with the system type.

2.1.1 Transmission CapacityThe transmission capacity varies with the system type.

2.1.2 Transmission DistanceThe product supports extra long haul transmission without electrical regeneration.

2.1.1 Transmission CapacityThe transmission capacity varies with the system type.

The system meets the demands for bandwidth of operators to the best extent by accessing:

l 192 channels with 10 Gbit/s rate of each channel

l 80 channels with 40 Gbit/s rate of each channel

The system adopts of modular design. The access capacity can be expanded easily. The systemexpansion from 40->80->120->160 wavelengths can be realized. The super C band can also beused to obtain extra 20% transmission capacity. In this case, a maximum of 192 wavelengthsare available. The system upgrade is achieved by increasing the number of wavelengths easily.This design enables carriers to invest and construct the backbone transmission network phaseby phase according to the actual needs.

Table 2-1 and Table 2-2 show the transmission capacity and the expansion ability of all typesof the system.

Table 2-1 Transmission capacity and expansion ability of the system

Type I II III IV

Maximumcapacity(Gbit/s)

1600 800 800 400

Workingwavelengthband

C band and Lband

C_EVENand L_ODDa

C band C_EVEN a L_ODD a

Channelspacing(GHz)

50 100 50 100 100

Maximumnumber ofchannels

160 80 80 40 40

Maximumaccessingrate (Gbit/s)

10 10 10 10 10

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Type I II III IV

Maximumnumbers ofadd/dropchannels b

160 80 80 40 40

Expansionability(Systemupgrade)

Transmission capacity can be upgraded byadding modules of 400 Gbit/s capacity.

-- --

Expansionability(Per-channelupgrade)

In a module of 400 Gbit/s capacity, thecapacity can get increments with 10 Gbit/s.

In the Cband, thecapacity cangetincrementswith 10 Gbit/s.

In the Lband, thecapacity cangetincrementswith 10 Gbit/s.

a: C_EVEN indicates the 40 even channels in C band. L_ODD indicates 40 odd channels inL band.b: The maximum numbers of add/drop channels refer to the channels added/dropped inOADM stations by back to back OTMs. Besides, with the dynamic wavelength control (DWC)unit and wavelength selective switch (WSS) unit, the channels are added/droppeddynamically. This is how the OptiX 1600G forms a dynamic ROADM that can be restructured.

Table 2-2 Transmission capacity and expansion ability of the system (continued)

Type V VI VII VIII IX

Maximumcapacity(Gbit/s)

100 800 480 960 3200 1600 1920

Workingwavelength band

C_EVEN a

C-band ExtendedC_EVEN

Extended C-band

C-band C-band Extended C-band

Channelspacing(GHz)

100 50 100 50 50 25 25

Maximumnumberofchannels

40 80 48 96 80 160 192

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Type V VI VII VIII IX

Maximumaccessing rate(Gbit/s)

2.5 10 10 10 40 10 10

Maximumnumbersof add/dropchannelsb

40 NA 48 96 80 160 192

Expansionability(Systemupgrade)

-- Transmissioncapacitycan beupgraded byaddingmodulesof 400Gbit/scapacity.

Transmissioncapacity can beupgraded by addingmodules of 480 Gbit/s capacity.

-- Thecapacityof thesystemcan beupgraded to 1920Gbit/s.

--

Expansionability(Per-channelupgrade)

In the Cband, thecapacitycan getincrements with2.5 Gbit/s.

In the Cband, thecapacitycan getincrements with10 Gbit/s.

In the C band, thecapacity can getincrements with 10Gbit/s.

In the Cband, thecapacitycan getincrements with2.5, 10 or40 Gbit/s.

Supports theupgrading of a singlechannel with the rateof 10 Gbit/s of the C-band and theextended C-band.

a: C_EVEN indicates the 40 even channels in C-band. L_ODD indicates 40 odd channels inL-band.b: The maximum numbers of add/drop channels refer to the channels added/dropped inOADM stations by back to back OTMs. Besides, with the dynamic wavelength control (DWC)unit and wavelength selective switch (WSS) unit, the channels are added/droppeddynamically. This is how the OptiX 1600G forms a dynamic ROADM that can be restructured.

2.1.2 Transmission DistanceThe product supports extra long haul transmission without electrical regeneration.

The system chooses to adopt FEC, SuperWDM, dispersion compensation or optical equalizationtechnology based on the actual fiber line type. It supports the transmission of extra long distancewithout electrical regenerators. The maximum transmission distance without electricalregenerators reaches 50×22 dB, that is, 4000 km.

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NOTE

The system is of three types based on the channel spacing: 25-GHz system, 50-GHz system, and 100-GHzsystem.

2.2 Service AccessThe system can access services of different types by different optical transponder units (OTUs).

Table 2-3 lists the supported service types.

Table 2-3 Service types supported by the system

Classification Service Types Service Transmission Mode

Standard SDH service STM-256 standard service Transponder b: 1xSTM-256-->OTU3

IMUX c: 1xSTM-256-->4xOTU2

STM-64 standard orconcatenation service

Transponder: 1xSTM-64-->OTU2

TMUX d: 4xSTM-64 -->1xOTU3/OTU3e

STM-16 standard orconcatenation service

Transponder: 1xSTM-16-->STM-16/OTU1

TMUX d: 4xSTM-16--> 1xOTU2

STM-4 standard orconcatenation service

Transponder: 1xSTM-4--> 1xSTM-4TMUX: 4xSTM-4-->1xSTM-16/OTU1

STM-1 standard service Transponder: 1xSTM-1-->1xSTM-1TMUX: 4xSTM-1-->1xOTU1

Standard SONETservice

OC-768 standard service Transponder b: 1xOC-768-->OTU3

IMUX c: 1xOC-768-->4xOTU2

OC-192 standard orconcatenation service

Transponder: 1xOC-192-->OTU2

TMUX d: 4xOC-192 -->1xOTU3/OTU3e

OC-48 standard orconcatenation service

Transponder: 1xOC-48-->OC-48/OTU1

TMUX d: 4xOC-48--> 1xOTU2

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Classification Service Types Service Transmission Mode

OC-12 standard orconcatenation service

Transponder: 1xOC-12-->1xOC-12TMUX: 4xOC-12-->1xOTU1

OC-3 standard service Transponder: 1xOC-3-->1xOC-3TMUX: 4xOC-3-->1xOC-48/OTU1

OTN service a OTU1 service Transponder: 1xOTU1-->1xOTU1TMUX: 4xOTU1--> 1xOTU2

OTU2 service Transponder: 1xOTU2-->1xOTU2

TMUX d: 4xOTU2/OTU2e -->1xOTU3/OTU3e

OTU3 service Transponder b: 1xOTU3-->1xOTU3

FC (Fiber Channel)service

FC100 service TMUX: 8xFC100 --> 1xOTU2TMUX: 2xFC100 -->1xSTM-16Transponder: 1xFC100 -->1xFC100

FC200 service TMUX: 4xFC200 --> 1xOTU2Transponder: 1xFC200 -->1xFC200

FC400 service TMUX: 2xFC400 --> 1xOTU2

FC 10G service Transponder: 1xFC 10G -->1xOTU2

POS service Packet Over SDH/SONETservice

Transponder: 1xPOS -->1xPOSTMUX: 4x POS--> 1xOTU1

Ethernet service Gigabit Ethernet (GE) service TMUX: 2xGE--> 1xSTM-16/OTU1TMUX: 8xGE--> 1xOTU2TMUX: 4xFC200/FC100/GE--> 1xOTU2

10 GE service Transponder: 1x 10GE -->1xOTU2

TMUX d: 4x10GE --> 1xOTU3/OTU3e

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Classification Service Types Service Transmission Mode

Any 34 Mbit/s–2.7Gbit/s service

Enterprise Systems Connection(ESCON) service

TMUX: 4 x 100 Mbit/s–2.5Gbit/s service signals in anyprotocol --> 1 x OTU1Transponder: transparenttransmission of 100 Mbit/s–2.5Gbit/s service signals in anyprotocol

Fiber Channel (FC) service

Fiber Connection (FICON)service

Fiber Distributed Data Interface(FDDI) service

PDH (34M/45M/140M) service

Fast Ethernet (FE)

Digital Video Broadcasting -Asynchronous Serial Interface(DVB-ASI)

a: OTU1 and OTU2 indicate the optical channel transport unit defined by the ITU-T G.709.b: Transponder features transparent transmission.c: IMUX indicates inverse multiplexing transmission.d: TMUX indicates low speed service convergence transmission.

2.3 Guaranteed ReliabilityThe system provide equipment level protection and network level protection.

2.3.1 Equipment-Level ProtectionThe system provides an advanced equipment-level protection mechanism.

2.3.2 Network Level ProtectionThe system provides a perfect network level protection mechanism

2.3.1 Equipment-Level ProtectionThe system provides an advanced equipment-level protection mechanism.

The system is supplied with two external working power supplies to realize mutual protection.Key functional boards are protected by dual power supply and hot backup. The OTUs havedistributed power supplies and centralized protection.

For the realization and methods of equipment-level protection in the system, refer to 7Protection.

2.3.2 Network Level ProtectionThe system provides a perfect network level protection mechanism

The network level protection include optical line protection, 1+1 optical channel protection,wavelength cross-connection protection, 1:N (N≤8) optical channel protection and networkmanagement channel protection, as shown in Table 2-4.

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Table 2-4 Network level protection modes supported by the system

Protection Type Solution (Name on the T2000)

Optical line protection Optical line protection

Optical channel protection 1+1 wavelength protection at client side

Inter-board wavelength protection

Inter-subrack 1+1 optical channel protection

WXCP Protection Wavelength cross-connection protection

1:N optical channel protection 1:N optical channel protection

Network management channelprotection

Network management channel protection

For the realization and methods of network level protection in the system, refer to 7Protection.

2.4 Clock TransmissionThe system provides the PDH-level clock transmission channels that are accessed by theelectrical interfaces in the subrack interface area. It provides two clock input channels and fourclock output channels.

Two clock transmission channels are provided in a single direction. Through configuration,either channel can access clock signals at 2048 kbit/s or 2048 kHz. The clock signals can beadded/dropped at the OTM station. At the other station, the clock signals can be added/droppedor transparently transmitted.

The system makes use of its own supervisory channel to transmit the clock signalssynchronously. The ST1/ST2 board is used to achieve this function. The ST1/ST2 transmits twochannels of 2048 kbit/s clock signals transparently.

The DWDM system adopts the PDH multiplexing technology to transmit the clock signalstogether with the supervisory overheads. Compared with the current technologies, the clocktransmission of the DWDM equipment has the following advantages:

l The synchronous timing signals are transmitted without the addition of extra transmittingchannels.

l In terms of performance, this function inherits the merits of the PDH technology to thegreat extent. The inherent defects of the SDH technology in terms of clock transmissionare avoided.

l This function can make use of the newly built DWDM equipment on the existingtransmission network. It is not required to build the PDH private line. This makes thenetwork management and maintenance easier and reduces the costs in networkconstruction.

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2.5 Performance MonitoringPerformance monitoring based on access services and that based on the network of the system.

2.5.1 Performance Monitory of Access ServicesThe system provides performance monitoring based on access services.

2.5.2 Performance Monitoring of NetworkThe system provides the performance monitoring based on the network.

2.5.1 Performance Monitory of Access ServicesThe system provides performance monitoring based on access services.

Table 2-5 lists the performance monitoring of accessed services provided by the system.

Table 2-5 Performance monitoring of accessed services

Service Category Monitored Item Service Type

Data services RMON statistics of Ethernetperformanc

GE10GEFE

Statistics of FC performance FC

SDH/SONET B1 bit parity error STM-1/STM-4/STM-16/STM-64/STM-256OC-3/OC-12/OC-48/OC-192/OC-768

OTN SM-BIP8 bit parity errorPM-BIP8 bit parity error

OTU1/OTU2/OTU3

SAN services 8B/10B code violation FC100/FC200/FC400ESCONFICON/FICON Express

2.5.2 Performance Monitoring of NetworkThe system provides the performance monitoring based on the network.

Table 2-6 shows the performance monitoring of the network provided by the system.

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Table 2-6 Network performance monitoring

Type Monitored Item Implementation Board

OTS a/OMS b opticalsignal performancemonitoring

Optical power Optical amplifier unit, opticalmultiplexer, demultiplexer unitand protection unit provide real-time detection.

OTS/OMS signal in-service spectrum analysis

Wavelength value, opticalpower of each wavelength,ONSR c

Optical amplifier unit, opticalmultiplexer and demultiplexerunit, provide MON port. Thespectrum analyzer unit can beconnected to this port to monitorthe spectrum of the main path.

OCH doptical signalperformance monitoring

Input/Output optical power,laser temperature, biascurrent, cooling current,ambient temperature

Line-side optical interfaces of allOTUs provide real-timedetection.

OTN electrical layersignal detection

SM-BIP8 bit error, PM-BIP8bit error

OTUs with OTN line interfacesprovide real-time detection.

a: Optical Transmission Sectionb: Optical Multiplex Sectionc: Optical Signal-to-Noise Ratiod: Optical channel

2.6 Network Management SystemBy using the Qx and CORBA interfaces, the NM system manages alarm, performance,configuration, communication, security, and topology of the entire optical transmission system.

The NM system also provides end-to-end management according to the requirements of the user.The NM system improves the network quality, lowers the maintenance cost, and ensuresreasonable utilization of the network resource.

The NM system provides user friendly interfaces and comprehensive functions. Its softwaresystem adopts assembly technology and object technology so that the application sub-systemscan be tailored according to the requirements of the user. This facilitates system expansion.

2.6.1 T2000OptiX iManager T2000 (T2000 for short) is a subnetwork management system (SNMS).Subnetmanagement system of the new generation can manage and control NEs and the area network.In the telecommunication management network (TMN) architecture, SNMS is located betweenthe NE level and network level. Therefore, the T2000 supports all functions of NE-level andpart of the network-level management functions.

2.6.2 Simple Network Management ProtocolThe system provides the simple network management protocol (SNMP).

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2.6.1 T2000OptiX iManager T2000 (T2000 for short) is a subnetwork management system (SNMS).Subnetmanagement system of the new generation can manage and control NEs and the area network.In the telecommunication management network (TMN) architecture, SNMS is located betweenthe NE level and network level. Therefore, the T2000 supports all functions of NE-level andpart of the network-level management functions.

The T2000 provides the users with single-layer management network solutions to small andmedium-sized transmission networks. The T2000 can assist network layer management systemand service layer management system in managing large-scale transmission networks togetherwith the upper-level network management system (through the standard external interfaces).

2.6.2 Simple Network Management ProtocolThe system provides the simple network management protocol (SNMP).

The SNMP is a standard protocol based on user datagram protocol (UDP). With an SNMPcompatible management interface, any NM system can access and manage the equipment.

2.7 Transmission of Network Management InformationThere are three communication modes: HWECC, IP over DCC and OSI over DCC.

l HWECC: The management information is transferred by using the HWECC protocolsharing method.

l IP over DCC: The management information is transferred by using the IP protocol sharingmethod.

l OSI over DCC: The management information is transferred by using the OSI protocolsharing method.

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3 Product Features

About This Chapter

This chapter describe the technical features and the features of upgrade and maintenanceof thesystem.

3.1 Technical FeaturesThe product is characterized by the following technical features: ROADM, 40G transmission,192-channel transmission at C band, and OTN signals processing.

3.2 Features of Upgrade and MaintenanceThe product has the following upgrade and maintenance features: software package loading, thePRBS function, and pluggable optical modules.

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3.1 Technical FeaturesThe product is characterized by the following technical features: ROADM, 40G transmission,192-channel transmission at C band, and OTN signals processing.

3.1.1 WB Mode ROADMThe ROADM is reconfigurable optical add/drop multiplexer. When the ROADM works withtunable lasers, flexible grooming of wavelengths can be achieved. In this way, capacityexpansion without interrupting services can be realized. The ROADM can be realized byconfiguring the wavelength blocker (WB) boards.

3.1.2 WSS Mode ROADMThe ROADM is reconfigurable optical add/drop multiplexer. When the ROADM works withtunable lasers, flexible grooming of wavelengths can be achieved. In this way, capacityexpansion without interrupting services can be realized. The ROADM can be realized byconfiguring the wavelength selective switch (WSS) boards.

3.1.3 40G Transmission SystemThe system provides the 80 x 40G and 40G inverse multiplex transmission solution, meetingoperators' requirements for large capacity and high performance of the network.

3.1.4 192-Channel System in C BandThe system provides two high-capacity transmission solutions: 160 channels in C band or 192channels in C band.

3.1.5 OTN Signal ProcessingOTN is the new generation optical transmission system specified by the InternationalTelecommunication Union (ITU). The OTN integrates the capacity advantages of the WDMnetwork, with the flexibility of SDH/ SONET network and the convenience of Ethernet. Itsupports all existing services. Through OTN, various networks and services can be integratedinto a universal future-oriented architecture.

3.1.6 Supervisory ChannelNEs in the system exchanges supervisory signals by supervisory channels.

3.1.7 FEC FunctionThe OTU of the system uses FEC and AFEC (Advanced FEC) technology.

3.1.8 SuperWDM TechnologyThe SuperWDM is a key technology for high-capacity, ultra long-haul, and reconfigurabletransmission solution.The system uses Super DRZ light source coding and special phasemodulation technology to effectively suppress the impact of non-linear effect on the long haultransmission system and increase the tolerance of the system against the optical noise. Using theSuperWDM technology achieves low-cost long haul transmission with a common DWDMsystem.

3.1.9 ODB TechnologyThe 40 Gbit/s optical wavelength conversion unit supports the optical duobinary (ODB)technology.

3.1.10 Tunable WavelengthsThe system supports tunable wavelengths. It adopts 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s OTUsthat support tunable wavelengths.

3.1.11 EDFA Technology

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The system uses mature erbium-doped fibre amplifier (EDFA) technology for the amplificationof C-band and L-band signals, and the implement of long haul transmission without REG.

3.1.12 Raman AmplificationThe system adopts both the Raman amplifier and the erbium-doped fiber amplifier (EDFA). Inthis way, the flat broadband gain is achieved. In addition, the noise in the system and thedisturbance of non-linear effects on the system are decreased effectively, and the transmissiondistance is extended.

3.1.13 Automatic Laser ShutdownThe OTU board in the system provides the automatic laser shutdown (ALS) function.

3.1.14 LPT Protocol CheckWhen the overhead byte supporting the link state pass through (LPT) protocol is added to theframe format of the WDM side signals, the system can monitor the running status of the networkaccess point or the service network.

3.1.15 Optical Power ManagementThe system provides APE, ALC and IPA functions, realizing the management of optical power.

3.1.16 Independent OLA SubrackThe system supports independent OLA subracks with independent power supply.

3.1.17 2.5G ADM TechnologyThe system provides the add/drop multiplexing (ADM) function for 2.5Gbit/s service andsupports cross grooming for 2.5Gbit/s service granules.

3.1.18 GE ADM TechnologyThe system provides the add/drop multiplexing (ADM) function for GE service and supportscross grooming for GE service granules.

3.1.19 NTP TechnologyThe system supports the Network Time Protocol (NTP). The NTP is used to synchronize thedistributed time server and the client.

3.1.20 DCN ManagementThe system supports HWECC, IP over DCC, or OSI over DCC to realize the DCN management.

3.1.21 Automatic MonitoringThe system provides the optical fiber line automatic monitoring system (OAMS) and opticalperformance monitoring interface. In this way, automatic monitoring of the system is realized.

3.1.1 WB Mode ROADMThe ROADM is reconfigurable optical add/drop multiplexer. When the ROADM works withtunable lasers, flexible grooming of wavelengths can be achieved. In this way, capacityexpansion without interrupting services can be realized. The ROADM can be realized byconfiguring the wavelength blocker (WB) boards.

Basic ConceptThe WB-mode ROADM is mainly used on a OADM node in a single ring to add/drop opticalwavelengths. With the application of ROADM, the wavelength services can be deployed in aflexible manner and wavelengths can be configured remotely.It is mainly characterized by thefollowing features:

l Expansion with no interruption

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The ROADM can choose any channel at any station to realize ending or passing through.Services of any channel can be added or dropped at any station. This does not interrupt theexisting services. No channel planning is need. No service is interrupted in expansion. Allthese guarantee high quality of services.

l Rapid wavelength modificationIt is possible that when the bandwidth distribution changes, channels need to be added/deleted or the station for adding/dropping need to be changed. In these cases, with theROADM, remote modification can be done on the NM. Adding and dropping of channelscan be adjusted rapidly and conveniently. You do not need to redo the engineering budgetor the manual maintenance. This lowers the costs.

l Built-in power equalizationThe ROADM has built-in power equalization to realize subtle power equalization atchannel level. The ROADM can adjust passing though channels better than ordinarydynamic gain equalizer (DGE) at band level. Networks with ROADM need no DGE.

Function ImplementationThe ROADM (WB mode) can be realized by configuring the dynamic wavelength control(DWC/EDWC) boards. The difference between the ROADM formed by DWCs and EDWCs asfollows:

l DWCs add and drop extended C band wavelengths at 100 GHz channel spacing.

l EDWCs add and drop extended C band wavelengths at 50 GHz channel spacing.

ApplicationTake DWC as an example. Figure 3-1 shows the typical configuration of ROADM stations.

Figure 3-1 Configuration of an ROADM station (WB)

DCM

DCM

DWC

OAU

DWC

Add(W)

E input

W inputOAU

DEMUX

……

DEMUX

……

MUX

……

MUX

……

VOA

OAU OAU

W West

E East

1 2

W output

E output

Drop(W)

Add(E)

Drop(E)

Taking the signal flow from west to east for example, the ROADM is realized by steps as follows:

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l The No.1 DWC divides the west input signal into two groups of multi-wavelength signals.The two groups are the same. One of them is to be dropped; the other is to pass through.

l The wavelength (W) to be dropped is dumultiplexed into individual wavelengths by theDEMUX.

l Signals to pass through go through the No.1 DWC. Wavelengths to be dropped are blocked.Wavelengths to pass through directly pass through the No.2 DWC and are output eastward.

l The MUX unit multiplexes the east added wavelength (E). Then the added wavelengthenters the multiplex module of the No.2 DWC and is multiplexed with the pass-throughmulti-wave signals. In the end, all signals enter the amplifier and reach the E line end.

ROADM for signals from east to west is the same. Two cascaded DWCs realize adding anddropping for any channel in two directions. The DWC can block channels of any wavelength.Any station in ring or chain networks can end any channel.

NOTE

l When the DWC is used to achieve the ROADM, each wavelength cannot be configured as the adding/dropping wavelength and the pass-through wavelength at the same time.

l When the DWC is used to achieve the ROADM, the channel for passing through is independent of thechannel for adding/dropping. In the case that the power difference caused by the switching betweenthe added wavelength and the pass-through wavelength is adjusted in advance or balanced by thedynamic equilibrium of the ROADM, the adjustment of adding/dropping wavelength does not affectthe main optical path. Power budget of the line does not need to be redone after the change of wavelengthdistribution.

3.1.2 WSS Mode ROADMThe ROADM is reconfigurable optical add/drop multiplexer. When the ROADM works withtunable lasers, flexible grooming of wavelengths can be achieved. In this way, capacityexpansion without interrupting services can be realized. The ROADM can be realized byconfiguring the wavelength selective switch (WSS) boards.

Basic ConceptThe WSS-mode ROADM can be used for intra-ring and inter-ring grooming. ROADM workswith tunable lasers to realize the flexible grooming of wavelengths.The ROADM realizedthrough WSS is mainly characterized by the following features:

l Any wavelength can be cross-connected flexibly to any interface. Intra-ring dynamicadding/dropping control is realized.

l Each port of WSS can be used for adding/dropping wavelengths or can serve as the multi-directional multiplex section port.It can connect to WSS boards in other directions to realizesmooth dimension expansion. This achieves MESH expansion and inter-ring dynamicwavelength grooming.

l WSS can work with WSS or couplers to form the ROADM.

l The upgrading of the number of service channels does not affect the existing services. It isnot necessary to adjust the existing power budget. The smooth service upgrade is realized.

l Power attenuation can be performed to ensure that the optical spectrum waveform of thesignals within the working bandwidth is flat.

l WSS realizes colorless add/drop. Users can set the add/drop or passthrough state ofwavelengths on the T2000. In addition, the dynamic wavelength status can be adjustedremotely and the services can be provisioned in a fast manner.

Figure 3-2 is the schematic diagram of the WSS-based ROADM node.

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Figure 3-2 Schematic diagram of the WSS-based ROADM node

WSSOAU WSS

WSS

……

……

……

……

4/8

WSSOAU OAU

OAU-WSSs can form an ROADM.-The WSS can realizing the colorlessadd/drop.-The WSS can realize blocking.-The WSS can work with the MUX andDMUX to add/drop wavelengths.

4/8

4/8 4/8

Function Implementation for Intra-Ring GroomingThe combination of different ROADM boards can realize multidimensional inter-ring dynamicwavelength grooming. For example:

l The combination of the WSD9 and WSM9 boards or the combination of the WSD5 andWSM5 boards can add/drop a maximum of 80 channels with 50 GHz channel spacing inC band;

l The combination of the WSD9 and RMU9 boards or the combination of the WSD5 andRMU5 boards can add/drop a maximum of 80 channels with 50 GHz channel spacing inC band;

l The combination of the WSMD4 boards can add/drop 80 channels with 50 GHz channelspacing in C band.

Application for Intra-Ring Groomingl WSDx + WSMx mode

Figure 3-3 takes WSD9/WSM9 as an example to show the typical configuration ofROADM stations.

Figure 3-3 Configuration of an ROADM station (WSS: WSD9 + WSM9)

E

W

OAU

OAU OAU

WSM9

WSM9

…… ……

…… ……

DROP

DROP

ADD

ADD

W

E

1

1

2

2

output

output input

inputOAUWSD9

WSD9

At an ROADM station, the WSD9 + WSM9 or WSD5 + WSM5 can be configured to realizethe adding/dropping or passthrough of optical signals. Any wavelength can pass through

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the board or be added/dropped at an interface of this board. However, each wavelengthcannot function as the pass-through wavelength and the wavelength to be added/droppedat the same time. Neither can one wavelength be added/dropped at two ports at the sametime.

NOTE

l One interface used for adding/dropping wavelengths can add/drop one or more than one arbitrarywavelength at the same time.

l For the E1WSD5 board, except for the DM4 optical interface, when other optical interfaces usedfor dropping wavelengths only drop one wavelength, the demultiplexer board needs to beconfigured before the optical interface is connected to the OTU.

Taking the signal flow from west to east for example, the ROADM is realized by steps asfollows:

– The west input wavelength to be dropped passes through the No.1 WSD9 and is selectedto be dropped at an arbitrary output interface.

– The pass-through signals pass through the No.1 WSD9 directly.

– The wavelength to be added and output eastward is added through the input interfaceof the No.2 WSM9 and multiplexed with the pass-through multi-wave signals. In theend, all the signals are input to the power amplifier and sent to the line end.

ROADM for signals from east to west is the same. Four WSS boards realize adding/dropping of any wavelengths in the west and east directions.

l WSDx + RMU9 mode

The ROADM station formed by the WSDx + RMU9 boards provides the intra-ring dynamicwavelength grooming. The RMU9 is used to add wavelengths; the WSDx is used to dropwavelengths. The station configuration and realization scheme are the same as the previousmode. The difference is that the TOA optical interface of the RMU9 can be cascaded withthe OAU to amplify the added optical signals. If the OAU is not needed, directly input theoptical signals to the ROA optical interface by a fiber jumper. The WSD9 + RMU9 isconsidered an example to describe the configuration and connections in a typical ROADMstation shown in Figure 3-4.

Figure 3-4 Configuration of an ROADM station (WSS: WSD9 + RMU9)

OAUWSD9 outputE

W

inputOAU

OAU OAU

RMU9

RMU9 WSD9

…… ……

…… ……

DROP

DROP

ADD

ADD

W

E

TOA

ROA

TOA

ROA

inputoutput

l WSMD4 + WSMD4 mode

The ROADM node that provides the dynamic wavelength grooming function can also beformed by two WSMD4 boards, as shown in Figure 3-5. Each WSMD4 adds and drops

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wavelengths. The WSMD4 + WSMD4 combination supports the adding/dropping of 40wavelengths with 100 GHz spacing.

Figure 3-5 Configuration of an ROADM station (WSS: WSMD4 + WSMD4)

OAU

WSMD4

outputE

inputoutputW

inputOAU

OAU OAU

WSMD4

DROP

DROP

ADD

ADD

W

E

1 2

The signal flow from west to east is considered an example to describe the realization ofthe ROADM function:– The signals from west are input to No.1 WSMD4 for optical demultiplexing. The

demultiplexed signals are output through the pass-through and drop interfaces.– The drop wavelengths can be output through one output interface of the demultiplexing

board that is accordingly configured.– The pass-through signals from No.1 WSMD4 pass No.2 WSMD4 directly.

– Each add wavelength to be output to east is added through an input interface selectedby an optical switch on No.2 WSMD4. Such add wavelengths are multiplexed with thepass-through multi-wavelength signals into one multiplexed signal. This signal is inputto an optical amplifier; the amplified signal is output to the line side.

The realization of the ROADM function in the signal flow from east to west is the same asthat from west to east. The two WSMD4s are combined to add/drop any 40 wavelengthsin the east and west directions.

NOTE

The drop and pass-through interfaces of the WSMD4 board output four equal multiplexed opticalsignals. In the drop channel, even when there is only one wavelength signal, the WSMD4 need beconnected to a demultiplexing board and then to the OTU.

l WSMD2 + WSMD2 modeThe ROADM node that provides the dynamic wavelength grooming function can also beformed by two WSMD2 boards, as shown in Figure 3-6. Each WSMD2 adds and dropswavelengths. The WSMD2 + WSMD2 combination supports the adding/dropping of 40wavelengths with 100 GHz spacing.

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Figure 3-6 Configuration of an ROADM station (WSS: WSMD2 + WSMD2)

OAU

WSMD2

outputE

inputoutputW

inputOAU

OAU OAU

WSMD2

DROP

DROP

ADD

ADD

W

E

1 2

The signal flow from west to east is considered an example to describe the realization ofthe ROADM function:– The signals from west are input to No.1 WSMD2 for optical demultiplexing. The

demultiplexed signals are output through the pass-through and drop interfaces.– The drop wavelengths can be output through output interface of the demultiplexing

board that is accordingly configured.– The pass-through signals from No.1 WSMD2 pass No.2 WSMD2 directly.

– Each add wavelength to be output to east is added through input interface selected byan optical switch on No.2 WSMD2. Such add wavelengths are multiplexed with thepass-through multi-wavelength signals into one multiplexed signal. This signal is inputto an optical amplifier; the amplified signal is output to the line side.

The realization of the ROADM function in the signal flow from east to west is the same asthat from west to east. The two WSMD2s are combined to add/drop any 40 wavelengthsin the east and west directions.

NOTE

l The WSMD2 board has one add optical interface and one drop optical interface.

l The drop and pass-through interfaces of the WSMD2 board output two equal multiplexed opticalsignals. In the drop direction, even when there is only one wavelength, the WSMD2 must beconnected to a demultiplexing board and then to the OTU.

Function Implementation for Inter-Ring Grooming

The ROADM stations formed by different combinations of boards realize differentmultidimensional inter-ring dynamic wavelength grooming. For example:

l The ROADM station formed by the WSD9 + WSM9 realizes eight-dimensional inter-ringdynamic wavelength grooming.

l The ROADM station formed by the WSD5 + WSM5 or WSD5 + RMU9 realizes four-dimensional inter-ring dynamic wavelength grooming.

l The ROADM station formed by the WSD9 + RMU9 realizes eight-dimensional inter-ringdynamic wavelength grooming.

l The ROADM station formed by the WSMD4 + WSMD4 realizes four-dimensional inter-ring dynamic wavelength grooming.

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They can also remotely and dynamically adjust the status of wavelength adding/dropping andpassthrough using network management system.

Application for Inter-Ring GroomingWSS supports the wavelength grooming in multiple directions and multi-dimensional ROADMstructure. With WSS, the wavelength resources of multi-directional node in ring with chain orinter-secting rings network can be reconfigurable.

Figure 3-7 shows the networking for inter-ring grooming. The engineering project is a tangentring network by station A, B, C, D, E, G and F. Station A is an ROADM station formed by theWSD9 + WSM9, WSD9 + RMU9 or WSMD4 + WSMD4.

Figure 3-7 Networking for inter-ring grooming

A

BD

C

F

E

G

WS

S

WS

S

WS

S

WS

S

WS

S

WS

S

WS

S

WS

S

From west to south

From west to north

From west to east

West

South North

East

East South

NorthWest

l WSDx + WSMx mode

Figure 3-8 shows the configuration of an ROADM station with grooming in four directions asan example. The ROADM station consists of four WSD9 boards and four WSM9 boards, asshown in Figure 3-8. The signal grooming from west to east, south, and north is taken forexample. Grooming of the signals from the east, south, and north are the same.

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Figure 3-8 ROADM station for inter-ring grooming (WSD9 + WSM9)

WSM9O AIN

EXPO

WSD9

INO A

IN

WSM9

O A

OUT

IN

WSM9

IN

OUT

O A

DM1

AM1

DM3 AM7

IN WSD9

DM1

DM7WSD9

DM1

DM8

AM1

AM8

AM1

AM8

O A

WSM9

O A

EXPI

OUT

AM1

AM7

WSD9

OUT

DM1

DM7

O A

O A

O A

DM2 AM8

AM8 DM8

DM8

DM7

AM7 AM7

EXPO EXPO

EXPI

EXPO

EXPI EXPI

westward eastward

northwardsouthward

From west to east

From west to north

From west to south

The arrow in black in Figure 3-8 indicates the direction of service grooming. Main path signalsfrom west are amplified and input through the IN port of the WSD9 board. Wavelengths to begroomed are output through the EXPO port or any of the DM1 to DM8 of the WSD9 board.

If the service signals need to be output eastward, the signals from west are input through theEXPI of the eastward WSM9 board. The input optical signals are multiplexed by the WSM9board and output through the OUT port. The signals are amplified and output eastward.

If the service signals need to be output southward, the signals from west are input through anyof the AM1 to AM8 of the south WSM9 board. The input optical signals are multiplexed by theWSM9 board and output through the OUT port. The signals are amplified and output southward.

If the service signals need to be output northward, the signal flow is the same with those that areoutput southward.

l WSDx + RMU9 mode

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The ROADM station consists of four WSD9 boards and four RMU9 boards as shown in Figure3-9. The signal grooming from west to east, south, and north is taken for example. Grooming ofthe signals from the east, south, and north are the same.

Figure 3-9 ROADM station for inter-ring grooming (WSD9 + RMU9)

WSD9O AIN

WSD9IN

O AIN

RMU9

O A

OUT

IN

RMU9

IN

OUT

O A

DM1 DM1

DM7 DM7

IN WSD9

DM1

DM7 WSD9

DM1

DM8

AM1

AM8

AM1

AM8

O A

RMU9

O A

OUT

AM1

AM7

RMU9

OUT

AM1

AM7O A

O A

O A

DM8 DM8

AM8 AM8

DM8

DM7

AM7 AM7

EXPO EXPO

EXPO EXPO

ROA

TOA

ROA

TOA

ROA

TOA

ROA

TOA

EXPI EXPI

EXPI EXPI

West East

NorthSouth

From west to east

From west to north

From west to south

The arrow in black in Figure 3-9 indicates the direction of service grooming. Main path signalsfrom west are amplified and input through the IN port of the WSD9 board. Wavelengths to begroomed are output through the EXPO port or any of the DM1 to DM8 of the WSD9 board.

If the service signals need to be output eastward, the signals from west are input through any ofthe AM1 to AM8 of the east RMU9 board. The input optical signals are multiplexed by theRMU9 board and output through the TOA port. The signals are amplified and output eastward.

If the service signals need to be output southward or northward, the signal flow is the same withthose that are output eastward.

l WSMD4 + WSMD4 mode

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Figure 3-10 shows an ROADM station formed by four WSMD4s. The signal grooming fromwest to east, from west to south and from west to north is considered an example. Grooming ofthe signals from the east, south, and north are the same.

Figure 3-10 ROADM node with inter-ring grooming (WSMD4 + WSMD4)

O AIN

DM4

WSMD4

INO A

IN

O A

OUT

IN IN

OUT

O A

DM1

AM1

DM3 AM2

INDM4

DM3

DM4

DM2

AM1

AM4

AM2

AM3

O A

OA

AM1

OUT

AM2

AM3

OUT

DM3

DM2

O A

O A

O A

West East

South North

DM2 AM3

AM4 DM1

DM2

DM3

AM3

AM4

AM4

DM4

AM1

WSMD4

WSMD4 WSMD4DM1DM1

AM2

From west to east

From west to north

From west to south

The arrows in Figure 3-10 indicate the service grooming flow directions. The OA amplifies themain-path optical signals input from west and feeds them to the WSMD4 through the IN opticalinterface. The optical signals to be groomed are output through any of the DM1–DM4 opticalinterfaces of the WSMD4.

If the service signals need be output to east, the signals from west should be input to the eastWSMD4 through any of the AM1–AM4 optical interfaces. The WSMD4 multiplexes the inputsignals and output them through the OUT optical interface. The signals are amplified and outputeastward.

The signal flow of the service signals output to south or north is the same as that to east.

l WSMD2 + WSMD2 mode

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Figure 3-11 shows an ROADM station formed by four WSMD2s. The signal grooming fromwest to east and from west to north is considered an example. Grooming of the signals from theeast, south, and north are the same.

Figure 3-11 ROADM node with inter-ring grooming (WSMD2 + WSMD2)

O AIN

DM

WSMD2

INO A

IN

O A

OUT

IN IN

OUT

O A

EXPO

INDM

EXPO

O A

O AOUT

OUTO A

O A

O A

AM

AM DM

EXPIWSMD2

WSMD2 WSMD2

EXPI EXPO

DM

EXPO

AM

EXPIAM

EXPI

From west to east

From west to north

West East

South North

The arrows in Figure 3-11 indicate the service grooming flow directions. The OA amplifies themain-path optical signals input from west and feeds them to the WSMD2 through the IN opticalinterface. The optical signals to be groomed are output through any of the DM and EXPO opticalinterfaces of the WSMD2.

If the service signals need be output to east, the signals from west should be input to the eastWSMD2 through the EXPI optical interfaces. The WSMD2 multiplexes the input signals andoutput them through the OUT optical interface. The signals are amplified and output eastward.

The signal flow of the service signals output to north is the same as that to east.

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3.1.3 40G Transmission SystemThe system provides the 80 x 40G and 40G inverse multiplex transmission solution, meetingoperators' requirements for large capacity and high performance of the network.

Basic Conceptl 40/80 channels x 40G transmission solution

The 40G transmission system directly accesses signals from the 40G OTU board based onthe existing system platform, which meets operators' requirements for expandingtransmission capacity and configuring high performance of the optical network. Thissystem realizes seamless expansion of the transmission capacity on a 40G basis withoutaffecting the existing low rate services. Thus, the capacity expansion cost is reduced byutilizing the existing investment. The 40G transmission system is mainly characterized bythe following features:– Supports the hybrid transmission of C-band 40/80 channels x 40G/10G.

– Accesses 1 x 40G (STM-256/OTU3) service on the client side of the 40G OTU.

– Accesses 4 x 10G (STM-64/OTU2) service on the client side of the 40G OTU.

– Supports DRZ, ODB and DQPSK modulation on the WDM side of the 40G OTU.

– Provides an advanced modulation format to ensure that the optical spectrum can passthe existing filter (10G MUX/DMUX maintained).

– In the case of DQPSK modulation, the system supports a maximum of 1500 kmtransmission without regeneration. The system capacity is 3.2T.

– In the case of ODB modulation, the system supports a maximum of 1000 kmtransmission without regeneration. The system capacity is 3.2T.

– In the case of DRZ modulation, the system supports a maximum of 1500 kmtransmission without regeneration. The system capacity is 1.6T.

– Supports smooth upgrade from the 10G DWDM system to the 40G DWDM systemthrough the plug-and-play mode without interrupting existing services.

– Provides high receiver sensitivity (power level and OSNR tolerance of the system keepthe same as those of the 10G system).

l 40G inverse multiplexing transmission solutionThe system provides the 40G inverse multiplexing transmission solution. The 40G inversemultiplexing board demultiplexes the one channel of 40 Gbit/s signals accessed from theclient side into four channels of 10 Gbit/s signals, realizing the transmission of 40G servicesover a 10G WDM network. The 40G inverse multiplexing transmission system has thefollowing features:– Accesses 1 x 40G (STM-256) service on the client side of the 40G inverse multiplexing

OTU.– Supports DRZ modulation on the WDM side of the 40G inverse multiplexing OTU.

– Supports a maximum of 1600 km transmission without regeneration. The systemcapacity is 1.92T.

– The high PMD tolerance solution is applicable to old fiber systems.

Function Implementationl 40/80 channels x 40G transmission solution

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The 40G OTU provides optical interfaces of tunable wavelength on the WDM side to outputG.694.1-compliant wavelengths. With fiber jumpers, the output signals of the 40G OTUcan be directly accessed into multiplex/demultiplex unit. In addition, the system supportssimultaneous access of 2.5 Gbit/s, 10 Gbit/s and 40 Gbit/s signals. The system supports thetransmission of a maximum of 80 channels of the 40 Gbit/s signals.

l 40G inverse multiplexing transmission solution

The 40G inverse multiplexing board is used to demultiplex the one channel 40 Gbit/s signalsaccessed from the client side into four channels of 10 Gbit/s signals for transmission overthe 10G WDM network.

Applicationl 40/80 channels x 40G transmission solution

Figure 3-12 shows the typical application of the 40G transmission solution (40 channelsx 40G system).

Figure 3-12 Typical application of 40 channels x 40G system

10G

40GMux 50GHz

10G

40G

Demux 50GHz

DCMDCM DCM

The 40G transmission system of the OptiX BWS 1600G provides flexible hardware/software interfaces of WDM solution. The 40 Gbit/s OTU and the 10 Gbit/s OTU adoptthe same EDFA, dispersion compensation module and multiplex/demultiplex unit. The 40Gbit/s services can be added/dropped at OTMs and OADMs/ROADMs and are managedby the same NM system as the 2.5 Gbit/s and 10 Gbit/s services.

l 40G inverse multiplexing transmission solution

Figure 3-13 shows the typical application of the 40G inverse multiplexing transmissionsolution.

Figure 3-13 Typical application of 40G inverse multiplexing system

40G40G

DCMDCM DCM

Mux DemuxIMUX IMUX

In the figure, IMUX is the inverse multiplexing OTU. It demultiplexes the accessed 40Gbit/s signals into four channels of 10 Gbit/s signals for transmission over the 10 Gbit/ssystem and for unified management.

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3.1.4 192-Channel System in C BandThe system provides two high-capacity transmission solutions: 160 channels in C band or 192channels in C band.

Basic ConceptThe channel spacing of the system is 25 GHz. The service transmission rate reaches 10 Gbit/s.Thus, the total capacity in C band can reach 1600 Gbit/s or 1920 Gbit/s.

The 192-Channel System:

l Adopts Super DRZ transmission technology to enhance the utilization of C band.

l Reduces the costs and complexity of system operation, administration, and maintenance(OAM).

l The transmission rated at 10 Gbit/s does not have extra requirements on the fibers used onthe existing networks.

The 192-channel system in C band, formed by band expansion on the basis of the160-channelsystem in C band, is compatible with the 160-channel system in C band.

Function ImplementationThe introduction of the 10 Gbit/s Differential Phase Return to Zero (DRZ) technology and theapplication of mature wavelength interleaving technology ensure the application of the 160- or192-channel system.

Figure 3-14 shows the three-level optical interleaving solution provided by the 192-channelsystem. The signals with the channel spacing of 100 GHz are multiplexed into the signals withthe channel spacing of 50 GHz. Then, the signals with the channel spacing of 50 GHz are furthermultiplexed into the signals with the channel spacing of 25 GHz.

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Figure 3-14 Typical structure of the 192-channel system in C band it an OTM stationOA

V48/M48(C-ODD)

ITL-C

OA-C

OA-C

FIU

OM & OD

50/25GHz

ITL-C

ITL-C

100/50GHz

100/50GHz

D48

V48/M48

V48/M48

V48/M48

D48

D48

D48

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

(C-EVEN)

(C-ODD)

(C-EVEN)

(C-ODD-PLUS)

(C-EVEN-PLUS)

(C96)

(C96 PLUS)

(C-ODD-PLUS)

(C-EVEN-PLUS)

3.1.5 OTN Signal ProcessingOTN is the new generation optical transmission system specified by the InternationalTelecommunication Union (ITU). The OTN integrates the capacity advantages of the WDMnetwork, with the flexibility of SDH/ SONET network and the convenience of Ethernet. Itsupports all existing services. Through OTN, various networks and services can be integratedinto a universal future-oriented architecture.

Basic ConceptThe product provides the following OTN features:

l Provides OTNk high-speed interfaces at rates of 2.67 Gbit/s, 10.71 Gbit/s and 43.02 Gbit/s.

l Support end-to-end service performance monitoring.

l Support complete transparent transmission of customer services.

l Provide excellent forward compatibility, allowing smooth upgrade of the existing networkto support OTN attributes.

l Provide Advanced Forward Error Correction (FEC) function to achieve optimaltransmission performance. This lowers the requirement of the system on per-channelOSNR; stretches the optical regeneration distance; reduces the number of stations requiredfor the system; and lowers the total cost for network construction.

l Support in-band monitor information through GCC overhead.

l The end-to-end management of the wavelengths at the optical layer is realized through thesupervisory overheads at the OTSn, OMSn, and OCh layers.

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l Provide excellent compatibility with equipment of other suppliers, reducing networkoperation expenditure.

Function Implementation

The system supports the OTN technologies by using the following realization schemes:

l Provides the OTN WDM-side interfaces for the operation, administration and maintenance(OAM) of the transport line.

Most OTUs of the product provide WDM-side interfaces for OTU1, OTU2 and OTU3services. Hence, the product supports the ITU-T G.709-defined management overheads forthe following functions:

– Uses the general communication channel (GCC) byte as the channel for transportingmanagement information to realize ESC management.

– Supports the performance monitoring and reporting of section monitoring (SM) andpath monitoring (PM).

– Supports the reporting of FEC and BIP8 detection results.

l The OTU client side directly accesses OTN services.

The client side of some OTU boards of the product can directly access the OTN servicesof OTU1 and OTU2 signal levels. This realizes the transparent transport or convergenceof client-side OTN services.

l End-to-end management of wavelengths at the optical layer is realized.

The system defines the supervisory overheads at the OTSn, OMSn and OCh layersaccording to the OTN standard. The working status of the network can be monitored byprocessing of these supervisory overheads. In this manner, the supervisory function at theOTN optical layer is achieved.

The supervisory function at the optical layer mainly involves the following aspects:

– Fiber connection management

– Supervisory of the continuity at the optical layer

– Supervisory of the maintenance signals at the optical layer

3.1.6 Supervisory ChannelNEs in the system exchanges supervisory signals by supervisory channels.

Two kinds of supervisory channel are available:

l OSC (Optical Supervisory Channel)

l ESC (Electric Supervisory Channel)

Principle of the OSC

The OSC mainly carries orderwire and network management information. The OptiX BWS1600G transmits supervisory signals at 1510 nm or 1625 nm, with the rate of 2.048 Mbit/s.

The SC1/SC2 board can provide the supervisory channel rated at 2 Mbit/s. The ST1/ST2 boardcan provide not only the supervisory channel rated at 2 Mbit/s but also the clock transmissionchannel rated at 2 Mbit/s or 1.5Mbit/s and the transmission channel for FE signals.

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Principle of the ESC

In this mode, the OTU multiplexes the supervisory information into the service channel fortransmission. The 2.5 Gbit/s OTU realizes ESC transmission by DCC bytes. The 10 Gbit/s OTUrealizes ESC transmission by associated GCC bytes that are compliant to ITU-T G. 709.

NOTE

l The ESC reduces the investment of the OSC. It also deletes the insertion loss of the FIU. This lowersthe cost and the power budget of optical channels

l ESC applies to the LHP system or the occasion when no OSC is used.

3.1.7 FEC FunctionThe OTU of the system uses FEC and AFEC (Advanced FEC) technology.

In fact, the FEC technology is the error correction technology. The OTU adopts Reed-SolomonCoding. It can correct eight byte errors at most in any location per 255 bytes, and has a fairlypowerful capability of error correction. Due to redundancy codes added, the digital rate isincreased. The FEC employed in the system is in compliance with the ITU-T G.975.1 or G.975and supports the processing of overhead as stated in the ITU-T G.709.

The FEC technology perform the following functions:

l Decrease the requirements on the receiver optical signal-to-noise ratio (OSNR) in order toextend the transmission distance between optical amplifiers or between REGs.

l Provide a greater system margin and guarantee a lower BER rate in the line transmissionto improve the quality of service (QoS) in the DWDM network.

The AFEC is a new error correction technique. It adopts two-level encoding, increases encodinggain, and equally distributes the burst errors. AFEC is more powerful than FEC.

3.1.8 SuperWDM TechnologyThe SuperWDM is a key technology for high-capacity, ultra long-haul, and reconfigurabletransmission solution.The system uses Super DRZ light source coding and special phasemodulation technology to effectively suppress the impact of non-linear effect on the long haultransmission system and increase the tolerance of the system against the optical noise. Using theSuperWDM technology achieves low-cost long haul transmission with a common DWDMsystem.

The SuperDRZ (Differential Phase Return to Zero) adopts RZ coding. On one hand, it inheritsthe excellent features of SuperCRZ and introduces chirp to RZ pulse. On the other hand, itintroduces differential phase control. With the improvement, DWDM systems based onSuperDRZ provide excellent transmission performance and support reconfigurable optical layerthat is suitable for new services.

Compared with ordinary point-to-point ultra long-haul transmission, ultra long-haultransmission in reconfigurable optical layer networks requires that one wavelength can passthrough multiple ROADM nodes, in addition to requirements in non-linear effect and OSNR.However, cascading of multiple ROADMs brings obvious filtering effect. Broad frequencyspectrum of signals can considerably degrade the signal quality and affect the transmissiondistance. The less broad frequency spectrum of SuperDRZ can effectively reduce the impactupon transmission signals. This leads to less electrical regenerators, lower network investment,and more flexibility in network planning and service scheduling.

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The internal phase feature of the SuperDRZ endows it with better tolerance of inter-symbolinterference. As a result, good pulses remain when accumulated dispersion is large; signaldistortion caused by dispersion is mild. This realizes the optimal balance between capacity andtransmission distance to be a key technology for more powerful next generation DWDMsystems.

The SuperDRZ furthers the compressing of side mode in the frequency spectrum. As a result,SuperDRZ signals have more tolerance of non-linear effect (SBS and FWM). DRZ can alsorealize the 10G super compact DWDM systems.

3.1.9 ODB TechnologyThe 40 Gbit/s optical wavelength conversion unit supports the optical duobinary (ODB)technology.

The input signals are provided with pre-coding. Then, the three status code (–1, 0, 1) sequenceis output. The code sequence drive modulator is used to convert electrical signals to opticalsignals. On the receive side, a common light intensity detector is used to receive the signals.

The 3 dB bandwidth of ODB is about 25% of the 3 dB bandwidth of NRZ. The spectral efficiencyof ODB is higher than that of NRZ. Hence, it is suitable for WDM transmission with high density.

3.1.10 Tunable WavelengthsThe system supports tunable wavelengths. It adopts 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s OTUsthat support tunable wavelengths.

The 10 Gbit/s OTU supports tunable wavelengths in up to 192 channels with 25 GHz spacing.The 40 Gbit/s and 2.5 Gbit/s OTUs support tunable wavelengths in up to 80 channels with 50GHz spacing.

Besides function as service boards, the tunable-wavelength OTUs also function as spare partsto substitute OTUs of different wavelengths. This reduces the amount of OTUs and lowers thecost.

3.1.11 EDFA TechnologyThe system uses mature erbium-doped fibre amplifier (EDFA) technology for the amplificationof C-band and L-band signals, and the implement of long haul transmission without REG.

EDFA adopts gain locking technology and transient control technology to make the gain of eachchannel independent of the number of channels. Bit error bursts in the existing channels are alsoavoided during adding or dropping channels.

3.1.12 Raman AmplificationThe system adopts both the Raman amplifier and the erbium-doped fiber amplifier (EDFA). Inthis way, the flat broadband gain is achieved. In addition, the noise in the system and thedisturbance of non-linear effects on the system are decreased effectively, and the transmissiondistance is extended.

3.1.13 Automatic Laser ShutdownThe OTU board in the system provides the automatic laser shutdown (ALS) function.

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Basic Concept

With the ALS function, the OTU board can automatically shut down or turn on the laser basedon the condition of the input optical signals.

Function Implementation

The ALS function is realized through the following manners:

l OTU board without service convergence function

When no signals are input to the client side of the opposite OTU board, the output opticalinterface at the WDM side of the OTU board is not shut down the laser. The informationabout optical signal loss is sent to the local OTU board through overhead bytes. Then thelocal OTU board automatically shuts down the laser on its output optical interface at theclient side. See Figure 3-15 (a).

When no signals are input to the WDM side of the OTU board, the OTU board automaticallyshuts down laser of the output optical interfaces at the client side with ALS function enabled.See Figure 3-15 (b).

l OTU board with service convergence function

When no signals are input to the client side of the opposite OTU board, the output opticalinterface at the WDM side of the OTU board is not shut down the laser. The informationabout optical signal loss is sent to the local OTU board through overhead bytes. Then thelocal OTU board automatically shuts down the laser on its output optical interface at theclient side. See Figure 3-16 (a).

When no signals are input to the WDM side of the OTU board, the OTU board automaticallyshuts down all the lasers of the output optical interfaces at the client side with ALS functionenabled. See Figure 3-16 (b).

When the OTU board that supports cross-connect function is configured with inter-boardor intra-board cross-connections, customers need to confirm which interface of the clientside of the opposite station connects to the client side of the local station according to theactual signal flow, and therefore to locate the signal source and the signal sink.

As shown in Figure 3-17, an upstream node is configured with two cross-connections: Oneis an intra-board cross-connection from RX in channel 1 at optical interface 4 on board Ato OUT in channel 5 at optical interface 1 on board A; the other is an inter-board crossconnection from RX in channel 1 at optical interface 3 on board C to OUT in channel 6 atoptical interface 1 on board A.

Signals received from RX in channel 1 at optical interface 4 on board A at the upstreamnode are sent to IN in channel 5 at optical interface 1 on board B at a downstream node.Signals received from RX in channel 1 at optical interface 3 of board C at the upstreamnode are sent to IN in channel 6 at optical interface 1 of board B at a downstream node.When no optical signals are input to the client side of the opposite OTU board, the localOTU board automatically shuts down the laser for the output optical interface on thecorresponding client side.

l OTU board with service reverse multiplexing function

When no signals are input to the client side of the opposite OTU board, the output opticalinterface at the WDM side of the OTU board is not shut down the laser. The informationabout optical signal loss is sent to the local OTU board through overhead bytes. Then thelocal OTU board automatically shuts down the laser on its output optical interface at theclient side. See Figure 3-18 (a).

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When no signals are input to the WDM side of the OTU board, the OTU board automaticallyshuts down the lasers of the output optical interfaces at the client side with ALS functionenabled. See Figure 3-18 (b).

CAUTIONl When the system adopts the ESC, the ALS function for the WDM side of each OTU board

must be disabled, because the supervisory signals have already been multiplexed into thetransmission channel for service signals by the OTU boards.

l As for the OTU boards with OTN line interfaces at the WDM side, the ALS function for theWDM side is disabled by default.

Figure 3-15 ALS functional diagram (OTU board without service convergence function)

ALS enabled

ALS

IN

OUT

OUT

IN

ALS

ALS

ALS

ALS

IN

OUT

OUT

IN

ALS

ALS

No input optical

OTU OTU

OTU OTU

Tx

TxRx

Rx

Tx

Rx Tx

Rx

enabled

enabled enabled

Automatic lasershutdown

(a) No signals received on theclient side of the far end

client side client sideWDM side WDM side

(b) No signals receivedon the WDM side

enabled

enabled

enabled

enabled

No input optical

Automatic lasershutdownclient side client sideWDM side WDM side

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Figure 3-16 ALS functional diagram (OTU board with service convergence function)

ALS

ALS

IN

OUT

Tx

Rx

TxTxTx

RxRxRx

OUT

IN

ALS

ALSTxTxTxTx

Rx

RxRxRx

ALS

ALS

IN

OUT

Tx

Rx

TxTxTx

RxRxRx

OUT

IN

ALS

ALSTxTxTxTx

Rx

RxRxRx

OTU OTU

OTU OTU

enabled

enabled

enabled

enabled

enabled

enabled

enabled

enabled

client side client side

client sideclient side

WDM side WDM side

WDM side WDM side

No input optical

No input optical

Automatic lasershutdown

Automatic lasershutdown

(a) No signals received on theclient side of the far end

(b) No signals receivedon the WDM side

Figure 3-17 ALS function diagram (OTU board with service cross-connect function)

ALS IN

OUT

OUT

IN

ALS

ALS IN

OUT

OTU OTU

OTU

3-14-15-16-1

1-31-41-51-6

3-14-15-16-1

1-31-41-51-6

1-31-41-51-6

3-14-15-16-1

A B

C

TxTxTxTx

TxTxTxTx

TxTxTxTx

RxRxRxRx

Rx

RxRxRx

RxRxRxRx

enabled

enabled

enabled

client side client side

client side

WDM side WDM side

WDM side

Automatic lasershutdown

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Figure 3-18 ALS functional diagram (OTU board with service reverse multiplexing function)

ALS

OTU

ALS

OTU

ALS

OTU

ALS

OTU

enabled

enabled

enabled

enabled

client side client side

client side client side

WDM side WDM side

WDM sideWDM side

No input optical

No input optical

Automatic lasershutdown

Automatic lasershutdown

(a) No signals received on theclient side of the far end

(b) No signals receivedon the WDM side

InInInIn

InInInIn

InInInIn

InInInIn

OutOutOutOut

OutOutOutOut

OutOutOutOut

OutOutOutOut

Tx

Tx

Tx

Tx

Rx

Rx

Rx

Rx

NOTE

The ALS function provided by the OptiX WDM products has no any relationship with the ALS mentionedin ITU-T G.664. The repetition in terms of name and acronym is just a coincidence.

3.1.14 LPT Protocol CheckWhen the overhead byte supporting the link state pass through (LPT) protocol is added to theframe format of the WDM side signals, the system can monitor the running status of the networkaccess point or the service network.

Normally, the OTU board at the upstream station transmits the LPT protocol information thatindicates normal WDM side transmission line to the OTU board at the downstream station. Whenthe status of the upstream WDM side transmission line changes, for example, a fault occurs ora fault is removed, the OTU board at the upstream station transmits the LPT packet that indicatesnetwork status change to the OTU board at the downstream station. When the downstream stationknows that the status of the transmission line changes, it enables or disables the standbytransmission line to ensure that services on the transmission line are available.

3.1.15 Optical Power ManagementThe system provides APE, ALC and IPA functions, realizing the management of optical power.

Intelligent Power Adjustment (IPA)In the DWDM system, optical fiber break, equipment failure or optical connector removal maylead to the loss of optical signals including on the main optical channel and on the opticalauxiliary channels. To prevent exposed optical fibers hurting human body, especially eyes, andto avoid surge of the optical amplifier, the system provides the IPA functions. Where the loss

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of optical power signals happens on one or more optical trunk sections on the main opticalchannel and the optical supervisory channels, the system can detect the loss of optical signalson the link and instantly reduce the optical power of the amplifier to a safety level. When theoptical signals are restored to normal, the optical amplifier will work again.

If the system adopts Raman amplifier(s), shut it down upon any fiber break to lower the opticalpower of the entire system to a safe level because the optical power of the reverse pump is high.

NOTE

In the DWDM system, the IPA function is started only when optical signals of the active optical path arelost. When this function is executed, only the lasers on the main path are shut down. No operation will beimplemented on the optical supervisory channel. Hence the functions of all optical supervisory channelswill not be affected.

For the detailed description of the principle and application of the IPA, refer to 8 Managementof Optical Power.

Automatic Level Control (ALC)

In a DWDM system, optical fiber aging, optical connector aging or manual factors might leadto the abnormal attenuation of transmission lines. In case the attenuation on a line segmentincreases, all input and output power will be reduced on all downstream amplifiers. The systemOSNR will get worse. At the same time, the received optical power will also be reduced.Receiving performance will be greatly affected.

If the automatic level control (ALC) function is activated, this effect can be minimized. As theattenuation on a line segment is increased, the input power on the amplifier will be reduced. Butdue to ALC, the output power as well as the input and output powers of other downstreamamplifiers will not be changed. Hence there will be much less influence on OSNR. The opticalpower received by the receiver will not be changed.

There are three ways to achieve the ALC function: channel amount detection, reference power,and link attenuation adjustment mode.

For the detailed description of the principle and application of the ALC, refer to 8 Managementof Optical Power.

Automatic Power Equilibrium (APE)

In a DWDM system, the variety of the optical fiber conditions during the operation of the systemmay change the flatness of a channel's power from that in the commissioning, and degrade theOptical Signal Noise Ratio (OSNR) of signals at the receive end. With the Automatic Powerpre-Equilibrium (APE) function provided by the system, you can enable the system toautomatically adjust the optical power of the transmit end of each channel to keep the flatnessof the optical power of the receive end close to that in the commissioning and to maintain theOSNR.

The application of the APE streamlines the operation of the DWDM system commissioning andsubsequent network maintenance for the operator. The design of starting regulation manuallyfacilitates you to determine whether to adjust the optical power according to the network actualstatus.

For the detailed description of the principle and application of the APE, refer to 8 Managementof Optical Power.

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Enhanced Automatic Power Equilibrium (EAPE)

Automatic power pre-equilibrium (EAPE) can be enabled to ensure that the receive-end signalquality of each channel meets the preset requirement and that the services are available. Inpractice of WDM system operation, the optical power flatness of each channel, compared withthat during deployment commissioning, greatly changes due to fiber condition variation.As aresult, the quality of received signals does not meet the requirement. When the OTU at the receiveend detects that the quality of the signals does not meet the design requirement, if the opticalpower of the OTU at the receive end does not cross the threshold and no BIP8 bit error exists,EAPE adjustment can be enabled to ensure that the receive-end signal quality of each channelmeets the preset requirement and that the services are available.

For the detailed description of the principle and application of the EAPE, refer to 8 Managementof Optical Power.

3.1.16 Independent OLA SubrackThe system supports independent OLA subracks with independent power supply.

With all features of the existing 1600G ordinary subracks in amplifier stations, independent OLAsubracks are mainly used in optical amplifier stations. Those subracks support power supply tosingle subracks. To adapt to different situations of customers, they can be installed in:

l 300 mm/600 mm (11.8 in./23.6 in.) ETSI cabinet

l 19-inch/23-inch cabinet

l 19-inch open rack

3.1.17 2.5G ADM TechnologyThe system provides the add/drop multiplexing (ADM) function for 2.5Gbit/s service andsupports cross grooming for 2.5Gbit/s service granules.

Basic Concept

The system provides data services with flexible and reliable networking solution in the network,with powerful service convergence and grooming capability. The system realizes the 2.5G ADMfunction by the E2ETMX and E2ETMXS boards.

Function Implementation

For the enhanced subrack of the product, there are three groups of slots that support inter-boardcross-connection protection:

l Slot 1, slot 2, slot 3, and slot 4 are in one group.

l Slot 5 and slot 8 are in one group.

l Slot 9, slot 10, slot 11, and slot 12 are in one group.

Within those groups, arbitrary wavelength cross-connection can be realized. The E2ETMX/E2ETMXS must be installed in any slot of IU1–IU4, IU9–IU12 or IU5 and IU8 when it isconfigured with cross-connections of 2.5Gbit/s services.

Figure 3-19 shows the 2.5G ADM functionality.

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Figure 3-19 Functionality of the 2.5G ADM

4 x 2.5G

4 x 2.5G

10 Gbit/s

10 Gbit/s

Client side

WDM side

ETMX 1

ETMX 2

4 x 2.5G

ApplicationFeatures and advantages of 2.5G ADM technology are:

l Lower Expansion CostThe cross grooming function of the 2.5G ADM technology allows smooth upgrade for datanetwork expansion, thus lowering the expansion cost.

l Dynamic Network Configuration and Fast Service ProvisionThe 2.5G ADM technology supports the grooming of sub-wavelength services. It canconfigure the network and routes dynamically based on the network resources, developingthe DWDM network from a static one to a dynamic one.If there are preserved network resources, once the source and sink ports are designated onNM, the system can set up an optimal route to provide services as soon as possible.

l High Wavelength UtilizationThe 2.5G ADM technology allows the bandwidth sharing of a wavelength among stationsto improve the bandwidth utilization.

l RegenerationThe 2.5G ADM technology helps to pass through sub-wavelength services at the electricallayer and achieve 3R function during this process. Therefore, the regeneration unit is notneeded, and the initial investment decreases accordingly.

3.1.18 GE ADM TechnologyThe system provides the add/drop multiplexing (ADM) function for GE service and supportscross grooming for GE service granules.

Basic ConceptThe system provides data services with flexible and reliable networking solution in the network,with powerful service convergence and grooming capability. The system realizes the GE ADMfunction by the OTU boards which support GE service cross-connections.

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Function Implementation

For the enhanced subrack of the product, there are three groups of slots that support inter-boardcross-connection protection:

l Slot 1, slot 2, slot 3, and slot 4 are in one group.

l Slot 5 and slot 8 are in one group.

l Slot 9, slot 10, slot 11, and slot 12 are in one group.

Within those groups, arbitrary wavelength cross-connection can be realized. The OTU must beinstalled in any slot of IU1–IU4, IU9–IU12 or IU5 and IU8 when it is configured with cross-connections of GE services.

NOTE

The valid slots for the LOG/LOGS boards are the slots on the left, that is, slots 1 and 3, or slots 9 and 11.The valid slots for the LOM/LOMS boards are the slots on the right, that is, slots 2 and 4, or slots 10 and12. When the LOM/LOMS and E1ELOG/E1ELOGS boards are used together for cross-connection, theLOM/LOMS board can be inserted in slot 5.

Take E1ELOG as an example. Figure 3-20 shows the functionality of the GE ADM.

Figure 3-20 Functionality of the GE ADM

8 x GE

8 x GE

10 Gbit/s

10 Gbit/s

Client side WDM side

ELOG 1

ELOG 2

8 x GE

Application

Features and advantages of GE ADM technology are:

l Lower Expansion CostThe cross grooming function of the GE ADM technology allows smooth upgrade for datanetwork expansion, thus lowering the expansion cost.

l Dynamic Network Configuration and Fast Service ProvisionThe GE ADM technology supports the grooming of sub-wavelength services. It canconfigure the network and routes dynamically based on the network resources, developingthe DWDM network from a static one to a dynamic one.

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If there are preserved network resources, once the source and sink ports are designated onNM, the system can set up an optimal route to provide services as soon as possible.

l High Wavelength UtilizationThe GE ADM technology allows the bandwidth sharing of a wavelength among stationsto improve the bandwidth utilization.

l RegenerationThe GE ADM technology helps to pass through sub-wavelength services at the electricallayer and achieve 3R function during this process. Therefore, the regeneration unit is notneeded, and the initial investment decreases accordingly.

3.1.19 NTP TechnologyThe system supports the Network Time Protocol (NTP). The NTP is used to synchronize thedistributed time server and the client.

Basic ConceptThe NTP defines the data formats, algorithms, entities and protocols used during the realizationof the protocol:

l The NTP is based on Internet Protocol (IP) and User Datagram Protocol (UDP). It can alsobe used by other protocols.

l The NTP develops from time protocol and Internet Control Message Protocol (ICMP)timestamp message. It has special design for correctness and robustness.

l The NTP defines the mechanism of time synchronization. In theory, the accuracy can reachbillionth second.

l The NTP specifies the features of the local clock, time server, and the method used toestimate the time difference between the local clock and time server.

l The NTP describes the clock-filter algorithm and clock select algorithm during therealization of the protocol. When there are multiple time servers in the network, the systemselects the algorithm to calculate the time offset of each time server to improve the accuracyof the local clock.

Function ImplementationFor the working principle of the NTP, see Figure 3-21.

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Figure 3-21 Principle of the NTP

Client

Network

Client

Client

Server

Server

Server

Server

Network

Network

Network

Client

NTPmessage am

NTPmessage 10:00:00am

10:00:05am

NTPmessage 10:00:00am

10:00:05am

10:00:08am

NTPmessage 10:00:00am

10:00:05am

10:00:05am

10:00:14am

10:00:00

The process of the system synchronization is as follows:

l The client sends an NTP message to the server. The message capsule has a timestamp thatrecords the time when the capsule leaves the client. The timestamp is 10:00:00 am.

l When the NTP message capsule reaches the server, the server adds its own timestamp tothe message capsule. This timestamp is 10:00:05 am.

l When the NTP message capsule leaves the server, the server adds its own timestamp to themessage capsule once again. This timestamp is 10:00:08 am.

l Receiving the returned message capsule, the client adds a new timestamp. This timestampis 10:00:14 am.

After this process, the client has enough information to calculate two important parameters:

l Round trip delays of an NTP message

l Clock offsets between the client and the server

Thus, the client can set its own clock and keep synchronization with the server based on theinformation.

ApplicationFor the synchronization of the network, see Figure 3-22.

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Figure 3-22 Synchronization of the network

Other time server

NM server

NE 1

NE 5

NE 4

NE 3

NE 2

The highest leveltime server

Clients

The middle leveltime server

As shown in Figure 3-22, the equipment in the synchronized network can be classified into threecategories:

l The highest level time server, referring to the 0-level time server.

l The middle level time server, referring to the 1- or 2-level time server that obtain time fromthe higher-level time server and provide time services for the lower-level time server.

l Clients, obtaining time without providing time services.

In application, choose the server and the client in the following way:

l Choose the network management server as the time server for the NE equipment. The servercan be Windows 2000 Server or Solaris 10. The network management server can be set asthe highest-level time server or set to obtain time from other time servers.

l The 1600G NE can be only the client, obtaining time from the specified time server.

3.1.20 DCN ManagementThe system supports HWECC, IP over DCC, or OSI over DCC to realize the DCN management.

HWECC

The Huawei embedded control channel (HWECC) protocol is mainly used for transmitting themanagement information between Huawei optical network equipment.

HWECC is a communication protocol developed for the DCN networking of Huawei opticalnetwork equipment. HWECC is easy to configure and apply. With HWECC, the user can usethe existing DCC resources to manage equipment on a centralized manner.

The HWECC protocol has the following features:

l The protocol provides a flexible networking environment.

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l NEs can be connected through optical interfaces or Ethernet interfaces for embeddedcontrol channel (ECC) communication.

l The protocol provides transparent transmission for the OAM information between Huaweioptical network equipments.

When the network management information is transmitted between Huawei optical networkequipment, there must be a gateway NE that communicates with the T2000. The T2000 isconnected to the gateway NE through a Qx interface. Hence, you can test, manage and maintainthe entire network.

The use of the T2000 elevates the quality of services (QoS) in the network and lowers the costfor maintenance. This ensures the rational use of network resources. Non-gateway NEs areconnected to the gateway NE through the ECC. This realizes the information transmissionbetween the T2000 and the non-gateway NEs.

In addition, the extended ECC communication between NEs can be performed through networkinterfaces, as shown in Figure 3-23.

Figure 3-23 Networking environment with the extended ECC

Network cable

HUB1 HUB2GNE1

NE2

NE3 NE4

NE5

NE6T2000NE7

NE8

NE9 NE10

NE11

NE12

FiberSubnet 1 Subnet 2

IP over DCCOptiX BWS 1600G products support remote operation and maintenance through the IP overDCC.

The IP over DCC follows TCP/IP standards and controls remote NEs through the Internet. Ituses the D-byte in overheads for communication. The default D-byte is D1–D3. At present,1600G products support dynamic and static routing functions.

The scheme of IP over DCC uses the network layer protocol for NM information transmission.It is required that the gateway NE, external DCN and element management system (EMS) allsupport IP. Thus, the network composed of the third party equipment and that composed ofHuawei equipment (such as the OptiX BWS 1600G) can form a DCN based on IP protocol.

The features of the NM information interworking in IP over DCC mode are:

l Low cost: It does not require additional channels for DCN.

l The IP over DCC mode is free from restriction of complex networking and can providemultiple transparent transmission paths, featuring great flexibility.

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l The IP over DCC mode is independent of the physical path, so it is easy to realizeinformation interworking.

l It supports automatic rerouting for protecting the NM information path.

IP over DCC has two networking topologies:

l NM information transparently transmitted by the third party equipment

The NM information of the OptiX BWS 1600G is transmitted transparently through IP overDCC by the third party equipment, as shown in Figure 3-24.

Figure 3-24 NM information transparently transmitted by the third party equipment (IP)

Third partyequipment

Third partyequipment

IP Over DCC

l NM information of the third-party equipment is transparently transmitted

The NM information of the third party is transmitted transparently through IP over DCC by theOptiX BWS 1600G, as shown in Figure 3-25.

Figure 3-25 NM information of the third-party equipment is transparently transmitted (IP)

Third partyequipment

IP Over DCC

Third partyequipment

Third partyequipment

Third partyequipment

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NOTE

The related equipment is required to support the same network layer protocol.

IP over DCC provides two methods for remote access:

l Gateway NE modeThe Embedded Control Channel (ECC) protocol is used. For remote access, log in to thegateway NE (GNE) that is connected directly to the computer. Then other NEs can beaccessed through the NE ID. After the IP over DCC feature is added, this mode can still beused to access remote NEs.

l Direct connection modeThe IP over DCC feature is used, and the remote NE can be connected directly through theIP address. You just need to enter the destination IP address in the login interface. For thismode, however, you need to add in advance the static route or default gateway in thenetwork NM and the NE that needs to be accessed directly.

OSI Over DCCOSI over DCC adopts standard OSI protocols (also called TP4) to transmit NM information atnetwork layer.

For OSI over DCC, there are two networking modes. They are explained below:

l When a transmission network is formed by the OptiX products and the third partyequipment, the OptiX products can transparently transmit management information at thenetwork layer without being affected by such a hybrid networking. Thus, the networkingis more flexible.

l Customers need not establish extra DCN channels. The existing DCC channels can be usedto achieve the unified management of the equipment from different suppliers.

Based on different networking, OSI over DCC is typically applied in the following two scenarios:

l Transparent transmission of NM information by the third party equipment

The NM information of the OptiX BWS 1600G is transparently transmitted by the third partyequipment through OSI over DCC, as shown in Figure 3-26. Huawei equipment is located atthe network edge, and the third party equipment is located in the backbone network. Themanagement information data between Huawei T2000 and equipment need be forwarded by thethird party equipment. In this case, at least one gateway NE must be used in each subnetworkformed by Huawei equipment.

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Figure 3-26 Transparent transmission of NM information by the third party equipment (OSI)

Third partyequipment

OSI Over DCCThird partyequipment

OSIprotocal stack

OSIprotocal stack

OSIprotocal stack

l Transparent transmission of NM information of the third party equipment

The NM information of the third party equipment is transparently transmitted by the OptiX BWS1600G, as shown in Figure 3-27. Huawei equipment is located in the backbone network, andthe third party equipment is located at the network edge. The management information databetween the third party NM and equipment need be forwarded by Huawei equipment.

NOTE

In practical application, the networking is more complex, and hybrid networking of equipment fromdifferent suppliers at the network edge and in the backbone networks is frequently adopted.

Figure 3-27 Transparent transmission of NM information of the third party equipment (OSI)

Third partyequipment

OSI Over DCC

Third partyequipment

Third partyequipment

Third partyequipment

OSIprotocal stack

OSIprotocal stack

OSIprotocal stack

3.1.21 Automatic MonitoringThe system provides the optical fiber line automatic monitoring system (OAMS) and opticalperformance monitoring interface. In this way, automatic monitoring of the system is realized.

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Optical Fiber Line Automatic Monitoring

The system provides the optical fiber line automatic monitoring system (OAMS) to alert fiberaging, fiber alarm, and to locate the fault. The OAMS realizes the monitoring on the fiber link.As an embedded system, OAMS is optional depending on the requirement of users.

In-Service Optical Performance Monitoring

There are optical monitoring interfaces on some boards, such as multiplexer/demultiplexer andoptical amplifier. Optical spectrum analyzer or multi-wavelength meter can be connected tothese monitoring interfaces, to measure performance parameters at reference points while notinterrupting the service.

These monitoring interfaces can also connect to built-in optical multi-channel spectrum analyzerunit (MCA) by using optical fibers. With the help of an MCA, optical spectral features includingthe optical power, central wavelength and OSNR can be observed from a network managementsystem (NM).

3.2 Features of Upgrade and MaintenanceThe product has the following upgrade and maintenance features: software package loading, thePRBS function, and pluggable optical modules.

3.2.1 Software Package LoadingThe software package loading is performed to upgrade and manage the NE-level software in amass manner.

3.2.2 PRBS Error Detection FunctionSome OTUs of the system provide the pseudo random bit sequence (PRBS) error detectionfunction.

3.2.3 Small Form-Factor Pluggable (SFP) ModuleThere are two types of pluggable optical modules: the small form-factor pluggable (SFP) andthe 10 Gbit/s small form-factor pluggable (XFP).

3.2.1 Software Package LoadingThe software package loading is performed to upgrade and manage the NE-level software in amass manner.

The NE-level software then can be loaded and activated in a mass manner to simplify theoperations to upgrade the NE-level software. Also, you can check if the board software versionsmatch when the board is in service. Once a board is in service, the board software versions canbe automatically updated.

The software package loading has the following features:

l Users load the software in a uniform operation interface.

l The complete software package is stored on the SCC board. The NE software is directlyplaced in the target directory while the board software is buffered in the CF. In this way,the board software can be automatically updated after a new board is inserted. If the boardsoftware files are lost, these files can be restored from the SCC board.

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l The NE can be automatically managed. If the board that is newly inserted does not matchthe software of the NE, an auto-update is performed.

l The software package loading is an incremental scheme and is performed to load only therequired files.

l The software package loading supports the rollback function. When the software orhardware of the system is faulty, the loading fails and the NE software is restored to thestate before loading.

The software package loading is applied in the following scenarios:

l Upgrade of software of an NE

l Replacement of service boards

l Replacement of the SCC board

3.2.2 PRBS Error Detection FunctionSome OTUs of the system provide the pseudo random bit sequence (PRBS) error detectionfunction.

Basic ConceptBy starting or stopping on the T2000 a PRBS bit error test at the client-side interface of the OTU,the bit error test of the transmission link can be performed without attaching an extra meter tothe equipment during equipment deployment.

Function ImplementationThis function can be realized by using the combination of the PRBS signal generator and PRBSsignal monitor. The PRBS signal generator of the OTU that supports PRBS bit error detectiongenerates and transmits PRBS signals. The PRBS signal monitor monitors the PRBS codestransmitted from the PRBS signal generator and the PRBS codes looped back from the oppositestation. In other words, the PRBS signal monitor compares the transmitted signals with thelooped-back signals and determines whether the equipment or transmission line is normal.

ApplicationFigure 3-28 shows the PRBS detection functional diagram.

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Figure 3-28 PRBS detection functional diagram

Configuring PRBStest status

WDM network

PRBS test signaltransmitting and

monitoring

Testboard

Testedboard

NE A NE B

Testedboard

RX

RX

RX

TX

TX

TX

IN

IN

OUT

OUT

Configuring PRBStest status

WDM network

PRBS test signaltransmitting and

monitoring

Testboard

Testedboard

NE A NE B

Testedboard

RX

RX

TX

TX

IN

IN

OUT

OUT

Mode 1

Mode 2

: fixed optical attenuator

For the method to configure the PRBS detection function on the T2000, refer to the ConfigurationGuide.

3.2.3 Small Form-Factor Pluggable (SFP) ModuleThere are two types of pluggable optical modules: the small form-factor pluggable (SFP) andthe 10 Gbit/s small form-factor pluggable (XFP).

Because they are pluggable, when you need to adjust the type of accessed services or replacesuch a faulty optical module, you just need to directly replace it without replacing its dominantboard.

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4 Hardware Architecture

About This Chapter

The hardware of the system includes the cabinet, subracks and functional boards.

4.1 CabinetThe system adopts the ETSI 300 mm (11.8 in.) standard cabinet, which is in compliance withthe ETSI300-119-3 standard.

4.2 Enhanced SubrackThe system provides enhanced subracks.

4.3 Independent OLA SubrackThe system provides an independent OLA subrack.

4.4 Function BoardsThe system provides different types of functional units.

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4.1 CabinetThe system adopts the ETSI 300 mm (11.8 in.) standard cabinet, which is in compliance withthe ETSI300-119-3 standard.

4.1.1 StructureThis section describes the appearance of the cabinet and system parameters.

4.1.2 Configuration of the Integrated CabinetThis section describes the configuration principle of the integrated cabinet.

4.1.1 StructureThis section describes the appearance of the cabinet and system parameters.

OverviewFigure 4-1 shows the appearance of the cabinet. For the structure of the cabinet, refer toHardware Description.

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Figure 4-1 Appearance of ETSI 300 mm cabinet

A power box is mounted at the top of an cabinet. The system is powered by–48 V DC or –60 VDC. Two power supplies are provided as mutual backup. It also provides 16-channel externalalarm input interfaces and 4-channel cabinet alarm output interfaces, easing the management ofthe equipment.

The cabinet has the following features:

l The cabinet leaves much space for routing and managing optical fibers.

l Two movable side doors are installed at both sides of the cabinet. Each side door can movein or move out along the top and bottom slide rails.

l Air vents are provided at the front door of the subrack, the rear door and upper enclosureframe of the cabinet to ensure heat dissipation.

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SpecificationsFor the specifications of the cabinet, refer to Table 4-1:

Table 4-1 Specifications of ETSI 300 mm cabinet of the system

Height Width Depth WeightSubracks

Maximum SystemPowerConsumption (W)

Type1

2600 mm(102 in.)

600 mm(24 in.)

300 mm(12 in.)

80 kg a(176 lb.)

3 2000 b

Type2

2200 mm(87 in.)

600 mm(24 in.)

300 mm(12 in.)

69 kg a(152 lb.)

3 2000 b

Type3

2000 mm(79 in.)

600 mm(24 in.)

300 mm(12 in.)

64 kg a(141 lb.)

2 1300 b

Type4

1800 mm(71 in.)

600 mm(24 in.)

300 mm(12 in.)

58 kg a(128 lb.)

2 1300 b

a: The value including the weight of the power box and the empty cabinet.b: The value is measured when the cabinet is fully loaded.

4.1.2 Configuration of the Integrated CabinetThis section describes the configuration principle of the integrated cabinet.

The system mechanical structure design is reflected in high integration. Table 4-2 lists the fullconfiguration of ETSI 300 mm (11.8 in.) cabinets of different heights. When the cabinet is notfully configured, configure the work subracks from bottom to top.

Table 4-2 Full configuration of 300 mm deep cabinets of different heights

CabinetHeight

Amount ofPower Boxes

Amount ofSubracks

Amount ofDCM Frames

Amount ofHUB Frames

1.8 m (5.9 ft.) 1 2 1 1

2.0 m (6.6 ft.) 1 2 1 1

2.2 m (7.2 ft.) 1 3 1 1

2.6 m (8.5 ft.) 1 3 2 1

4.2 Enhanced SubrackThe system provides enhanced subracks.

4.2.1 Structure

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4.2.2 Slot Distribution

4.2.1 Structure

StructureThe OptiX BWS 1600G enhanced subrack consists of three parts. The upper part is the interfacearea where all types of electrical signals are accessed. The middle part is the board area whereDWDM boards are installed and the lower part comprises the fiber cabling area and fan trayassembly area.

The structure of the subrack is shown in Figure 4-2.

Figure 4-2 Structure of the enhanced subrack

1

2

3

4

5

6 7 8 9

1. PFU module 2. Interface area 3. Beam 4. Board area5. Fiber spool 6. Fiber laying area 7. Fan tray assembly 8. Subrack front door9. VOA adjusting screw

SpecificationsTable 4-3 shows the specifications of the enhanced subrack.

Table 4-3 Specifications of the enhanced subrack

Item Parameter

Size (Height × Width × Depth) 625 mm × 495 mm × 291 mm (24.6 in. × 19.5 in. × 11.5in.)

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Item Parameter

Weight 18 kg (40 lb.) (with the backplane but without boardsor fan tray assembly)

Maximum system powerconsumption (fully loaded)

650 W

For more details, refer to Hardware Description.

4.2.2 Slot Distribution

There are 13 slots in the board area of the enhanced subrack. (When you face the front of cabinet,the slots from the left to the right are slot 1 to slot 13.) IU 7 is for the SCC. IU 13 is optional forthe power backup unit (PBU). Figure 4-3 shows the slot distribution in the board area of asubrack.:

Figure 4-3 Slot distribution of enhanced subrack of the system

IU2

IU1

IU4

IU3

IU6

IU5

SC

C

IU9

IU8

IU11

IU10

IU13

IU12

4.3 Independent OLA SubrackThe system provides an independent OLA subrack.

4.3.1 Structure

4.3.2 Slot Distribution

4.3.1 Structure

Structure

The independent OLA subrack of the system is dedicated for optical amplifier stations. The OLAsubrack supports independent power supply.

Figure 4-4 shows the structure of an independent OLA subrack of the system.

4 Hardware Architecture

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Figure 4-4 Structure of an independent OLA subrack

1

23

4

5

7

10

89 6

11D

H

W

1. Subrack interface area 2. DC power filter unit (DPFU) 3. Beam 4. Board area5. Subrack front door 6. VOA adjusting screw 7. Cabling area 8. Fan tray assembly9. Air filter 10. Fiber spool box 11. Subrack mounting ear

SpecificationsTable 4-4 shows the specifications of the independent OLA subrack.

Table 4-4 Specifications of the independent OLA subrack

Item Parameter

Size (Height × Width × Depth) 665.0 mm × 435.9 mm × 290.9 mm(26.2 in. × 17.2 in. × 11.5 in.)

Weight 19 kg (42 lb.) (with the backplane but without boardsor fan tray assembly)

Maximum system powerconsumption (fully loaded)

380 W

For more details, refer to the Hardware Description.

4.3.2 Slot Distribution

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There are 12 slots in the board area of the independent OLA subrack. (When you face the frontof cabinet, from the left to the right are slot 1 to slot 12.) IU 7 is for the SCC. IU 12 is for thepower and environment monitoring unit (PMU). Figure 4-5 shows the slot distribution in theboard area of the independent OLA subrack.

Figure 4-5 Slot distribution of the independent OLA subrack of the system

IU2

IU1

IU4

IU3

IU6

IU5

SC

C

IU9

IU8

IU11

IU10

PM

U

4.4 Function BoardsThe system provides different types of functional units.

By functions, the boards can be categorized as follows:

l Optical transponder board

l Optical multiplexer and demultiplexer board

l Optical add and drop multiplexing board

l Optical amplifier board

l Optical supervisory channel and timing transmission board

l Spectrum analyzer board

l Variable optical attenuator board

l Optical power and dispersion slope equalizing board

l Optical fiber automatic monitoring board (optional, not depicted in Figure 4-6)

l Protection board (optional, not depicted in Figure 4-6)

l System control and communication board (not depicted in Figure 4-6)

Consider the 160-channel type I system for example. Figure 4-6 shows the positions of theboards in the system, illustrating only the unidirectional signal flow.

4 Hardware Architecture

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Figure 4-6 Positions of the boards in the system

FIU

OTU

D40

D40

ITL

ITL

(B)

MCA

D40

D40 OTU

OTU

OTU

RPC

OAU

OAU40

1

40

1

40

1

40

1

(E)

(D)

C-band

L-band

(E)

(A)(B)

FIU

OAU

OTU

MR2 OBU

OAUL-band

C-band

(F)

(B)(B)

(C)

VOA

(G)

FIU

C-EVEN

M40

M40

M40

M40

ITL

ITL

40

40

40

40

C-ODD

L-EVEN

L-ODD

C-band

L-band

OAU

OAU

OTU

OTU

OTU

OTU

1

1

1

1

(A) (B)

(E)

ST1

FIU

(B)

ST1

OTM OTMOADM

ST2

ClientSide

ClientSide

(A) Optical transponder unit (B) Optical multiplexer and demultiplexer unit

(E) Optical amplifier unit (G) Optical supervisory channel and timing transmission unit(D) Spectrum analyzer unit

(C) Optical add and drop multiplexing unit

(F) Variable optical attenuator unit

4.4.1 Optical Transponder Board

4.4.2 Optical Multiplexer and Demultiplexer Board

4.4.3 Optical Add/Drop Multiplexer Board

4.4.4 Optical Amplifier Board

4.4.5 System Control, Supervision and Communication Board

4.4.6 Optical Supervisory Channel and Timing Transmission Board

4.4.7 Optical Protection Board

4.4.8 Spectrum Analyzer Board

4.4.9 Variable Optical Attenuator Board

4.4.10 Optical Fiber Automatic Monitoring Board

4.4.11 Optical Power and Dispersion Slope Equalizing Board

4.4.1 Optical Transponder Board

Table 4-5 Board name and category of the optical transponder board

Board Name Board Description RegeneratingBoard

E1LU40 40Gbit/s wavelength conversion board with AFECfunction

-

E1LU40S 40Gbit/s wavelength conversion board with AFECfunction (Super WDM)

-

E1TMX40 40G tributary multiplexing/demultiplexing wavelengthconversion board with AFEC function

-

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Board Name Board Description RegeneratingBoard

E1TMX40S 40G tributary multiplexing/demultiplexing wavelengthconversion board with AFEC function (Super WDM)

-

E1LW40 40G wavelength conversion board E1LR40

E1LR40 40G Line regenerating wavelength conversion board -

E1IMX4 STM-256/OC-768 inverse multiplex board E3TMRE3TMRS

E1IMX4S STM-256/OC-768 inverse multiplex board(SuperWDM)

E3TMRE3TMRS

E6LWF STM-64 transmit-receive line wavelength conversionunit with FEC function

E4TMRE4TMRS

E7LWF STM-64 transmit-receive line wavelength conversionunit with AFEC function

E4TMRE4TMRS

E7LWFS STM-64 transmit-receive line wavelength conversionunit with AFEC function (Super WDM)

E4TMRE4TMRS

E1LWFD 2-port STM-64 transmit-receive line wavelengthconversion unit with FEC function

E1LRFD

E4TMR 10.71G line regenerating wavelength conversion boardwith AFEC and G.709

-

E4TMRS 10.71G line regenerating wavelength conversion boardwith AFEC and G.709 (Super WDM)

-

E1LRFD 2-port 10G line regenerating wavelength conversion unitwith FEC function

-

E4LBE Transmit-receive line wavelength conversion board for10GE (LAN)

E4TMRE4TMRS

E4LBES Transmit-receive line wavelength conversion board for10GE (LAN) (Super WDM)

E4TMRE4TMRS

E3LBF 10G universal transmit-receive line wavelengthconversion board

E4TMRE4TMRS

E3LBFS 10G universal transmit-receive line wavelengthconversion board (SuperWDM)

E4TMRE4TMRS

E3TMX 4-channel STM-16 asynchronous MUX OTU-2wavelength conversion board

E4TMRE4TMRS

E3TMXS 4-channel STM-16 asynchronous MUX OTU-2wavelength conversion board (Super WDM)

E4TMRE4TMRS

4 Hardware Architecture

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Board Name Board Description RegeneratingBoard

E2ETMXE3ETMX

4 channels STM-16/OTU1 asynchronism MUX OTU-2wavelength conversion unit with AFEC

E4TMRE4TMRS

E2ETMXSE3ETMXS

4 channels STM-16/OTU1 asynchronism MUX OTU-2wavelength conversion unit with AFEC (SuperWDM)

E4TMRE4TMRS

E2LOG 8-port Gigabit Ethernet multiplex optical wavelengthconversion board

E4TMRE4TMRS

E2LOGS 8-port Gigabit Ethernet multiplex optical wavelengthconversion board (Super WDM)

E4TMRE4TMRS

E1ELOGE2ELOG

Enhanced 8-ports Gigabit Ethernet multiplex opticalwavelength conversion board (AFEC)

E4TMRE4TMRS

E1ELOGSE2ELOGS

Enhanced 8-ports Gigabit Ethernet multiplex opticalwavelength conversion board (AFEC SuperWDM)

E4TMRE4TMRS

E1LOM 8-port multi-service multiplexing & optical wavelengthconversion unit (AFEC)

E4TMRE4TMRS

E1LOMS 8-port multi-service multiplexing & optical wavelengthconversion unit (AFEC, SuperWDM, Tunable)

E4TMRE4TMRS

E3LWC1 STM-16/OTU1 Transmit-receive line wavelengthconversion board

E3TRC1E1TRC2

E3TRC1 STM-16/OTU1 line regenerating wavelength conversionboard

-

E1TRC2 STM-16/OTU1 bidirectional line regeneratingwavelength conversion board

-

E3LWM Multi-rate optical wavelength conversion board E3LWMR

E3LWMR Multi-rate optical wavelength conversion relay board -

E3LWX Arbitrary bit rate wavelength conversion unit E3LWXR

E3LWXR Arbitrary bit rate regenerating board -

E5LDG 2 x Gigabit Ethernet unit E3LWMR

E2FDG 2-port GE wavelength conversion board with FEC E3TRC1E1TRC2

E1FCE Fiber channel distance extension board E3LWMR

E1LQM 4 x Multi-rate ports wavelength conversion board E3TRC1E1TRC2

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The optical transponder unit (OTU) converges or converts one or multiple services accessed atthe client side and then outputs ITU–T G.694.1-compliant DWDM wavelengths, whichfacilitates the multiplexing unit to realize the wavelength division multiplexing of the opticalsignals. Because all OTUs are transceiver boards, they can achieve the reverse process.

The following table provides the application and functions of the above boards. For more details,refer to Hardware Description.

Table 4-6 Application and description of optical transponder board (40G bit/s)

BoardName

Function Feature Client-/WDM-SideOptical Signal

E1LU40 l Wavelength conversionb

c

l Channel spacing: 50GHz, 100 GHz

l Line code: ODB, DRZ

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:1xSTM-256/OTU3

l WDM-side opticalsignals:OTU3

E1LU40S l Wavelength conversionb

c

l Channel spacing: 50GHz

l Line code: DQPSK

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:1xSTM-256/OTU3

l WDM-side opticalsignals:OTU3

E1TMX40

l Wavelength conversionb

c

l Channel spacing: 50GHz, 100 GHz

l Line code: ODB, DRZ

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:4xSTM-64/OC-192/10GE-WAN/10GE-LAN/OTU2/OTU2e

l WDM-side opticalsignals:– OTU3

– OTU3e

E1TMX40S

l Wavelength conversionb

c

l Channel spacing: 50GHz

l Line code: DQPSK

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:4xSTM-64/OC-192/10GE-WAN/10GE-LAN/OTU2/OTU2e

l WDM-side opticalsignals:– OTU3

– OTU3e

4 Hardware Architecture

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Product Description

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BoardName

Function Feature Client-/WDM-SideOptical Signal

E1LW40 l Wavelength conversionb

c

l Channel spacing: 50GHz, 100 GHz

l Line code: ODB, DRZ

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:1xSTM-256

l WDM-side opticalsignals:OTU3

E1LR40 l 3R (reshaping, retimingand regeneration)b c

l Channel spacing: 50GHz, 100 GHz

l Line code: ODB, DRZ

l Supports thetunablewavelengths

l Supports FEC,AFEC a

l Client-side opticalsignals:NA

l WDM-side opticalsignals:OTU3

E1IMX4 l Inverse multiplexing

l Demultiplexes one 40Gbit/s signal into four 10Gbit/s signals, realizingthe transmission of 40Gbit/s services in the 10Gbit/s WDM system. b c

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports thetunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC,AFEC a

l Client-side opticalsignals:1xSTM-256/40Gbit/s POS

l WDM-side opticalsignals:OTU2

E1IMX4S l The Functions of theIMX4S board are thesame as those of theIMX4 board.b c

l Channel spacing: 50GHz, 100 GHz

l Line code: DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports FEC,AFEC a

l Client-side opticalsignals:1xSTM-256/40Gbit/s POS

l WDM-side opticalsignals:OTU2

a: The default working mode of the board is AFEC, which can be set or modified on the T2000.b: The decoding and encoding of the signals comply with ITU-T G.975.1.c: The overhead processing of the signals comply with ITU-T G.709.

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Table 4-7 Application and description of optical transponder board (10 Gbit/s)

BoardName

Function Feature Client-/WDM-SideOptical Signal

E6LWF l Wavelength conversionc e

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports thetunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:1xSTM-64/10GE-WAN

l WDM-side opticalsignals:OTU2

E1LWFD l Inter-independent dualchannel wavelengthconversionc e

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports thetunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:1xSTM-64/10GE-WAN

l WDM-side opticalsignals:OTU2

E1LRFD l Inter-independent dualchannel 3R functions(reshaping, retiming andregeneration)c e

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:NA

l WDM-side opticalsignals:OTU2

E7LWF l Wavelength conversionc d

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports thetunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC,AFEC a

l The client side ofthe E7LWFsupport the XFPinterface.

l Client-side opticalsignals:1xSTM-64/10GE-WAN

l WDM-side opticalsignals:– OTU2

– OTU2v

E7LWFS l Wavelength conversionc d

l Channel spacing: 25 GHz,50 GHz, 100 GHz

l Line code: RZ, DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports FEC,AFEC a

l The client side ofthe E7LWFSprovide the XFPinterface.

l Client-side opticalsignals:1xSTM-64/10GE-WAN

l WDM-side opticalsignals:– OTU2

– OTU2v

4 Hardware Architecture

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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BoardName

Function Feature Client-/WDM-SideOptical Signal

E4TMR l 3R functions (reshaping,retiming andregeneration)c d

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC,AFEC b

l Client-side opticalsignals:NA

l WDM-side opticalsignals:– OTU2

– OTU2v

E4TMRS l 3R functions (reshaping,retiming andregeneration)c d

l Channel spacing: 25 GHz,50 GHz, 100 GHz

l Line code: RZ, DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports FEC,AFEC b

l Client-side opticalsignals:NA

l WDM-side opticalsignals:– OTU2

– OTU2v

E4LBE l Wavelength conversionc d

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l The client side ofthe LBE providesthe XFP interface.

l Client-side opticalsignals:1x10GE-LAN

l WDM-side opticalsignals:OTU2

E4LBES l Wavelength conversionc d

l Channel spacing: 25 GHz,50 GHz, 100 GHz

l Line code: RZ, DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l The client side ofthe LBE supportsthe XFP interface.

l Client-side opticalsignals:1x10GE-LAN

l WDM-side opticalsignals:OTU2

E3LBF l Wavelength conversionc d

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC,AFEC a

l The client side ofthe LBE providesthe XFP interface.

l Client-side opticalsignals:– 1x10GE-LAN/

10GE-WAN/STM-64/OTU2

– 1xFC 10G

l WDM-side opticalsignals:– OTU2

– OTU2v

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BoardName

Function Feature Client-/WDM-SideOptical Signal

E3LBFS l Wavelength conversionc d

l Channel spacing: 25 GHz,50 GHz, 100 GHz

l Line code: RZ, DRZ

l Supports thetunablewavelengths

l SupportsSuperWDM

l Supports FEC,AFEC a

l The client side ofthe LBE supportsthe XFP interface.

l Client-side opticalsignals:– 1x10GE-LAN/

10GE-WAN/STM-64/OTU2

– 1xFC 10G

l WDM-side opticalsignals:– OTU2

– OTU2v

a: The default working mode of the board is AFEC, which can be set or modified on the NM.b: The working mode of the board is adaptive to the FEC mode of the accessed signals.c: The overhead processing of the signals comply with ITU-T G.709.d: The decoding and encoding of the signals comply with ITU-T G.975.1.e: The decoding and encoding of the signals comply with ITU-T G.975.

Table 4-8 Application and description of optical transponder unit (2.5 Gbit/s or lower)

Boardname

Function Feature Client-/WDM-SideOptical Signal

E3LWC1 l Wavelength conversiona b

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:1xSTM-16/OTU1

l WDM-side opticalsignals:OTU1

E3TRC1 l 3R (reshaping, retimingand regeneration)a b

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:NA

l WDM-side opticalsignals:OTU1

E1TRC2 l Performs the 3R(reshaping, retiming andregeneration) function as abidirectional electricalregeneration board.a b

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:NA

l WDM-side opticalsignals:OTU1

4 Hardware Architecture

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E3LWM l Wavelength conversion

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l It does not supportsFEC

l Client-side opticalsignals:– 1xSTM-1/

STM-4/STM-16– All types of

concatenatedSDH/SONETservices

l WDM-side opticalsignals:2.5 Gbit/s

E3LWMR

l 3R (reshaping, retimingand regeneration)functions

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l It does not supportsFEC

l Client-side opticalsignals:– 1xSTM-1/

STM-4/STM-16– All types of

concatenatedSDH/SONETservices

l WDM-side opticalsignals:2.5 Gbit/s

E3LWX l Wavelength conversion

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l It does not supportsFEC

l Client-side opticalsignals:– 1xPDH (34 Mbit/

s, 45 Mbit/s, 140Mbit/s opticalinterface)/ESCON (200Mbit/s)/FiberChannel (1.06Gbit/s)

– Optical signals atany rate within therange from 34Mbit/s to 2.7 Gbit/s in the 1280–1565 nmwavelengths

l WDM-side opticalsignals:2.5 Gbit/s

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E3LWXR

l 3R (reshaping, retimingand regeneration)functions

l Channel spacing: 50 GHz,100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l It does not supportsFEC

l Client-side opticalsignals:NA

l WDM-side opticalsignals:2.5 Gbit/s

a: The decoding and encoding of the signals comply with ITU-T G.975.b: The overhead processing of the signals comply with ITU-T G.709.

Table 4-9 Application and description of convergent optical transponder unit

Boardname

Function Feature Client-/WDM-SideOptical Signal

E2LOG l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:8xGE

l WDM-side opticalsignals:OTU2

E2LOGS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz

l Line code: DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:8xGE

l WDM-side opticalsignals:OTU2

E1ELOG l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:– 8xGE/FC100

– 4xGE/FC100/FC200

l WDM-side opticalsignals:OTU2

E2ELOG l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:8xGE

l WDM-side opticalsignals:– OTU2

– OTU2v

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E1ELOGS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz

l Line code: DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:– 8xGE/FC100

– 4xGE/FC100/FC200

l WDM-side opticalsignals:OTU2

E2ELOGS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz, 100 GHz

l Line code: RZ, DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:8xGE

l WDM-side opticalsignals:– OTU2

– OTU2v

E1LOM l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:– 8xGE/FC100/

FICON– 4xFC200/FICON

EXPRESS– 2xFC400

– Can accesshybrid services.The totalbandwidth of theservices accessedat the client sideshould be lessthan 10 Gbit/s.

l WDM-side opticalsignals:OTU2

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E1LOMS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz

l Line code: DRZ

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:– 8xGE/FC100/

FICON– 4xFC200/FICON

EXPRESS– 2xFC400

– Can accesshybrid services.The totalbandwidth of theservices accessedat the client sideshould be lessthan 10 Gbit/s.

l WDM-side opticalsignals:OTU2

E3TMX l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l It supports transparenttransmission of clocks infour tributary signals.

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:4xSTM-16

l WDM-side opticalsignals:OTU2

E3TMXS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz

l Line code: DRZ

l It supports transparenttransmission of clocks infour tributary signals.

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:4xSTM-16

l WDM-side opticalsignals:OTU2

E2ETMXE3ETMX

l Convergence,wavelength conversiona b

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l It supports transparenttransmission of clocks infour tributary signals.

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports AFEC

l Client-side opticalsignals:4xSTM-16/OTU1

l WDM-side opticalsignals:– OTU2

– OTU2v (only forE3ETMX)

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E2ETMXS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz

l Line code: DRZ

l It supports transparenttransmission of clocks infour tributary signals.

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:4xSTM-16/OTU1

l WDM-side opticalsignals:OTU2

E3ETMXS l Convergence,wavelength conversiona b

l Channel spacing: 25GHz, 50 GHz, 100 GHz

l Line code: RZ, DRZ

l It supports transparenttransmission of clocks infour tributary signals.

l Supports tunablewavelengths

l SupportsSuperWDM

l Supports AFEC

l Client-side opticalsignals:4xSTM-16/OTU1

l WDM-side opticalsignals:– OTU2

– OTU2v

E5LDG l Convergence,wavelength conversionc

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l It does notsupports FEC

l Client-side opticalsignals:2xGE

l WDM-side opticalsignals:STM-16

E2FDG l Convergence,wavelength conversiona

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:2xGE

l WDM-side opticalsignals:OTU1

E1FCE l Convergence,wavelength conversionc

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports the extensionfunction of the FCservices.

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:– 2xFC100

– 1xFC200

l WDM-side opticalsignals:STM-16

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Boardname

Function Feature Client-/WDM-SideOptical Signal

E1LQM l Convergence,wavelength conversiona

l Channel spacing: 50GHz, 100 GHz

l Line code: NRZ

l Supports tunablewavelengths

l It does not supportthe SuperWDM

l Supports FEC

l Client-side opticalsignals:– 4xSTM-1/

STM-4/FE/ESCON/DVB-ASI

– 2xGE/FC100/FICON/DVB-ASI

– 1xFC200/STM-16/FICONEXPRESS

– Can accesshybrid services(the totalmaximumbandwidth is 2.5Gbit/s)

l WDM-side opticalsignals:OTU1

a: The overhead processing of the signals comply with ITU-T G.709.b: The decoding and encoding of the signals comply with ITU-T G.975.1.c: The overhead processing of the signals comply with ITU-T G.783.

4.4.2 Optical Multiplexer and Demultiplexer Board

The optical boards related with optical multiplexer and demultiplexer board of the system areincluded in Table 4-10.

Table 4-10 Board name and category of the optical multiplexer and demultiplexer board

Service Type Board Board Description

Optical multiplexerand demultiplexerboard

E1M40E3M40

40-channel optical multiplexer

E1M48E3M48

48-channel optical multiplexer

E1D40E3D40

40-channel optical demultiplexer

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Service Type Board Board Description

E1D48E3D48

48-channel optical demultiplexer

E1V40E3V40

40-channel optical multiplexer with VOA

E1V48E3V48

48-channel multiplexing unit with VOA

E3FIU Fiber interface unit

E1ITL, E3ITL Interleaver unit

Table 4-11 briefs the application and functions of the above boards. For more details, refer toHardware Description.

Table 4-11 Application and description of the optical multiplexer and demultiplexer board

BoardName

Application Functions

E1M40E3M40

The E1M40 board is available in sixtypes in terms of wavebands:M40 (C_EVEN), M40 (C_ODD),M40 (C_EVEN_PLUS), M40(C_ODD_PLUS), M40 (L-EVEN),M40 (L-ODD)The E3M40 board is available infour types in terms of wavebands:M40 (C_EVEN), M40 (C_ODD),M40 (C_EVEN_PLUS), M40(C_ODD_PLUS)

At the transmit end, the M40 multiplexes40 optical signals from OTUs into onesignal and sends it to a single fiber fortransmission. That is, it has the functionof multiplexing 40 channels.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

E1D40E3D40

The E1D40 board is available in sixtypes in terms of wavebands:D40 (C_EVEN), D40 (C_ODD),D40 (C_EVEN_PLUS), D40(C_ODD_PLUS), D40 (L-EVEN),D40 (L-ODD)The E3D40 board is available infour types in terms of wavebands:D40 (C_EVEN), D40 (C_ODD),D40 (C_EVEN_PLUS), D40(C_ODD_PLUS)

At the receive end, the D40demultiplexes the main path opticalsignal transmitted over a single fiber into40 optical signals of differentwavelengths and sends them to thecorresponding OTUs.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

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BoardName

Application Functions

E1M48E3M48

The M48 board is available in fourtypes in terms of wavebands:M48 (C_EVEN), M48 (C_ODD),M48 (C_EVEN_PLUS), M48(C_ODD_PLUS)

At the transmit end, the M48 multiplexes48 optical signals from OTUs into onesignal and sends it to a single fiber fortransmission. That is, it has the functionof multiplexing 48 channels.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

E1D48E3D48

The D48 board is available in fourtypes in terms of wavebands:D48 (C_EVEN), D48(C_ODD),D48 (C_EVEN_PLUS), D48(C_ODD_PLUS)

At the receive end, the D48demultiplexes the main path opticalsignal transmitted over a single fiber into48 optical signals of differentwavelengths and sends them to thecorresponding OTUs.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

E1V40E3V40

The E1V40 is available in six typesin terms of wavebands:V40 (C_EVEN), V40 (C_ODD),V40 (C_EVEN_PLUS), V40(C_ODD_PLUS) ,V40 (L_EVEN),V40 (L_ODD)The E3V40 is available in four typesin terms of wavebands:V40 (C_EVEN), V40 (C_ODD),V40 (C_EVEN_PLUS), V40(C_ODD_PLUS)

At the transmit end, the V40 adjusts theoptical input power of the 40 channelsand multiplexes these channels into asingle fiber for transmission.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

E1V48E3V48

The V48 is available in four types interms of wavebands:V48 (C_EVEN), V48 (C_ODD),V48 (C_EVEN_PLUS), V48(C_ODD_PLUS)

The V48 has the same function as theV40. The difference is that the V48 canmultiplex up to 48 channels and adjuststhe power of signals in 48 channels. TheV48 can be applied to systems ofextended C-band.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main optical path withoutinterrupting the traffic.

4 Hardware Architecture

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BoardName

Application Functions

E3FIU The FIU is available in two types interms of different systems:FIU-03: Supports the C andextended C-band, supervisorychannel multiplexer anddemultiplexer.FIU-06: Supports the C andextended C-band, supervisorychannel multiplexer anddemultiplexer. Applicable for highpower situation.

The FIU multiplexes or demultiplexesthe signals over the main path and theoptical supervisory channel.In the transmit direction, the FIUaccesses the optical supervisory signal.In the receive direction, it extracts theoptical supervisory signals.Provides the in-service monitoring ofoptical interfaces to monitor thespectrum of the main path withoutinterrupting the traffic.

E1ITLE3ITL

The E1ITL is available in one types:ITL-L.The E3ITL is of four types fordifferent applications:E3ITL01: symmetrical 100 GHz/50GHz conversion, applying to systemin C_EVEN and C_ODD band.E3ITL02: symmetrical 100 GHz/50GHz conversion, applying to systemin C_EVEN_PLUS andC_ODD_PLUS band.E3ITL03: symmetrical 50 GHz/25GHz conversion, applying to 192channels system.E3ITL05: symmetrical 100 GHz/50GHz conversion, applying to systemin C_EVEN and C_ODD band.

The E1ITL board achieves the mutualconversion between the DWDM systemswith the 100 GHz channel spacing andthat with the 50 GHz channel spacing inL band.The E3ITL enables the mutualconversion between the DWDM systemswith the channel spacing of 100 GHz, 50GHz, or 25 GHz in C band.

4.4.3 Optical Add/Drop Multiplexer Board

The optical boards related with optical add and drop multiplexing board of the system areincluded in Table 4-12.

Table 4-12 Board name and category of the optical add and drop multiplexing board

Service Type Board Board Description

Optical add anddropmultiplexingboard

E3MR2 2-channel optical add/drop unit

E1MR8 8-channel optical add/drop multiplexingunit

E1DWC, E2DWC Dynamic wavelength control unit

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Service Type Board Board Description

E2EDWC Enhanced Dynamic Wavelength Add/DropControl Board

E1WSM9, E2WSM9 9-port wavelength selective switchingmultiplexing unit

E1WSD9, E2WSD9 9-port wavelength selective switchingdemultiplexing unit

E1WSM5, E2WSM5 5-port wavelength selective switchingmultiplexing unit

E1WSD5, E2WSD5 5-port wavelength selective switchingdemultiplexing unit

E1RMU9 9-port ROADM multiplexing unit

E1WSMD4 4-port wavelength selective switchingdemultiplexing/multiplexing unit

E1WSMD2 2-port wavelength selective switchingdemultiplexing/multiplexing unit

Table 4-13 briefs the application and functions of the above boards. For more details, seeHardware Description.

Table 4-13 Application and description of the optical add and drop multiplexing board

BoardName

Application Functions

E3MR2 The board mainlyapplies to OADM.

The MR2 board adds/drops two channels of serviceswith the fixed wavelength in the OADM.

E1MR8 The board mainlyapplies to OADM.

The MR8 board adds/drops eight channels of serviceswith the fixed wavelength in the OADM.

E1DWCE2DWC

The board mainlyapplies to ROADM. Itprovides a function ofdynamicconfigurable.

Compared to the E1DWC, the E2DWC extends therange of available wavelengths and can be applied tosystem of extended C-band.The DWC board adds/drops any channel of serviceswith 100 GHz spacing in the ROADM.

E2EDWC The board mainlyapplies to ROADM. Itprovides a function ofdynamicconfigurable.

The EDWC board adds/drops any channel of serviceswith 50 GHz spacing in the ROADM.

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BoardName

Application Functions

E1WSM9,E2WSM9E1WSD9,E2WSD9E1WSM5,E2WSM5E1WSD5,E2WSD5E1RMU9E1WSMD4E1WSMD2

The board mainlyapplies to ROADM. Itprovides amultiplexing functionthat is dynamic andconfigurable. With it,any wavelength can beconfigured to any port.

The E1WSM9/WSD9 provides eight add/drop opticalinterfaces and supports adding/dropping of C_EVEN40 wavelengths with 100 GHz spacing.The E2WSM9/WSD9 provides eight add/drop opticalinterfaces and supports adding/dropping a maximumof C-band 80 wavelengths with 50 GHz spacing.The WSM5/WSD5 provides four add/drop opticalinterfaces and supports adding/dropping of C-band 80wavelengths with 50 GHz spacing.The RMU9 realizes the dynamic input of eight signals.The combination of RMU9 and WSD9/WSD5 can addeight single-channel signals or multi-channel signals tothe main path and supports adding/dropping amaximum of C-band 80 wavelengths with 50 GHzspacing.By applicable band, the WSMD4 is classified into twotypes: One applies to the C_EVEN band and the otherapplies to the C_ODD band. Both types of boardssupport the adding/dropping of 40 wavelengths with100 GHz spacing.By applicable band, the WSMD2 is classified into twotypes: One applies to the C_EVEN band and the otherapplies to the C_ODD band. Both types of boardssupport the adding/dropping of 40 wavelengths with100 GHz spacing.

4.4.4 Optical Amplifier Board

The EDFA is an essential component of the system. It is used to compensate for signal attenuationcaused by optical components and optical fibers to extend the signal transmission distance.

The system also adopts the Raman amplification technology. The combination of EDFA andRaman amplifier can reduce the system noise and effectively suppress the deterioration ofOSNR, thereby optimizing the system performance.

The optical amplifier unit are included in Table 4-14.

Table 4-14 Board name and category of the optical amplifier board

ServiceType

Board Board Description

Opticalamplifierboard

E2OAUE4OAUE5OAU

Optical amplifier unit

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ServiceType

Board Board Description

E2OBUE4OBUE5OBU

Optical booster unit

E4OPUE5OPU

Optical preamplifier unit

E1HBA High-power optical booster amplifier unit

E2RPC Raman pump amplifier unit for C-band

E1RPA C+L band Raman processing (driving) & C band ROPAprocessing (driving) unit

Table 4-15 and Table 4-16 brief the application and functions of the EDFA board and the Ramanamplifier board. For more details, refer to the Hardware Description.

Table 4-15 Application and description of the EDFA boards

BoardName

Application Functions

E2OAUE4OAUE5OAU

The E2 version provides the OAU01 board.The OAU01 amplifies signals at L band.The E4 version provides four types of OAUs:OAUC00, OAUC01, OAUC03 and OAUC05 toamplify signals in C-band and in extended bandThe E5 version provides four types of OAUs:OAUC00, OAUC01, OAUC03, and OAUC05 toamplify signals in C-band

The OAU board canamplify the input opticalsignal, compensate forthe fiber loss, andincrease the receive-endsensitivity budget.The OAU board uses theautomatic gain controltechnique to realize thegain locking function.The E5OAU supportsthe automaticadjustment of the gainslope.

E2OBUE4OBUE5OBU

The OBU of E2 version includes the OBU04 toamplify signals in L bandThe OBU of E4 version includes OBUC03 andOBUC05.The OBU of E5 version includes two types ofboards: OBUC03 and OBUC05

The OBU board canamplify the opticalsignal power.The OBU board uses theautomatic gain controltechnique to realize thegain locking function.

4 Hardware Architecture

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BoardName

Application Functions

E4OPUE5OPU

Used alone or together with the OBU and applied tothe C-band.The E4 version is applied to systems of extended C-band.The E5 version is applied to systems of C-band.

Features small noisefigure, used to improvethe receiver sensitivitybudget.Uses the automatic gaincontrol technique forgain locking.

E1HBA Applicable for the transmitter of the OTM station inlong hop (LHP) application. Applicable for the C-band.

Amplifies the opticalsignal to high-power inthe transmit direction tomeet the requirementsfor LHP application.

Table 4-16 Application and description of the Raman amplifier boards

BoardName

Application Functions

E1RPCE2RPC

RPC is the Raman pump amplifier unit for C-band.Always used together with the EDFA.E1RPC has one type of board:RPC02 is used for forward pump.E2RPC has two types of boards:RPC01 is used for backward pump.RPC03 is used for forward pump of high power.

Used at the receive endor transmit end of theDWDM system, itamplifies signals duringtransmission by sendinghigh-power pump lightto the transmission fiber.

Raman pump amplifierunits realize long-haul,broad bandwidth, lownoise, and distributedonline optical signalamplification.

These units canautomatically lock thepump power, receive theSCC command to switchon/off the pump source,separate the signal light,report performances andalarms, and protect thepump laser.

E1RPA RPA is the Raman pump amplifier unit for C-bandand L-band.Always used together with the EDFA.

4.4.5 System Control, Supervision and Communication Board

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The system control, supervision and communication board is the control and supervision centerof the entire system. They are included in Table 4-17

Table 4-17 Board name and category of the system control, supervision and communicationboard

Service Type Board Board Description

System control,supervision andcommunication board

E2SCC System control and communication unit

E1PMU Power and environment monitoring unit

Table 4-18 briefs the application and functions of the system control, supervision andcommunication unit. For more details, refer to Hardware Description.

Table 4-18 Application and description of the system control, supervision and communicationboard

BoardName

Application Functions

E2SCC Applicable for every NE. Accomplishes NE management, overheadprocessing and the communication betweenequipments, and provides the interfacebetween the 1600G system and the NM. Itis the control center of the entire OptiXBWS 1600G.The board supports SCC data backup in CFcard mode. As a result, NEs do not need tobe configured after SCC replacement. Youcan insert the CF card of the replaced SCCto the new SCC and restore from the CF cardthe backup data of NE configurationthrough operations in the NM system.

E1PMU Monitors the voltage of twopower supplies of the OLAsubrack.

The PMU is mainly used to monitor thevoltage of two power supplies of the OLAsubrack, and report overvoltage andundervoltage alarms and detected voltagevalue to the SCC.

4.4.6 Optical Supervisory Channel and Timing Transmission Board

The optical supervisory channel board implements overhead processing and transport. Opticalsupervisory channel and timing transmission board are mainly used for overhead processing andclock transmission. The boards of the optical supervisory channel and timing transmission unitare included in Table 4-19.

4 Hardware Architecture

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Table 4-19 Board name and category of optical supervisory channel and timing transmissionboard

Service Type Board Board Description

Optical supervisorychannel and timingtransmission board

E1SC1 Unidirectional optical supervisory channel

E1SC2 Bidirectional optical supervisory channel

E1ST1 Unidirectional optical supervisory channel andtiming transmission unit

E1ST2 Bidirectional optical supervisory channel andtiming transmission unit

Table 4-20 briefs the application and functions of the above boards. For more details, refer toHardware Description.

Table 4-20 Application and description of optical supervisory channel and timing transmissionboard

BoardName

Application Functions

E1SC1 The SC1 is used inOTM.

Processes one channel of optical supervisory signal,receives and sends optical supervisory signal inOTM.The carrier wavelength of the optical supervisorychannel is 1510 nm or 1625 nm.

E1SC2 The SC2 is used inOLA, OADM, REG,and OEQ.

Receives and sends bidirectional optical supervisorychannel signals.The carrier wavelength of the optical supervisorychannel is 1510 nm or 1625 nm.

E1ST1 The ST1 is used inOTM.

Receives and sends one supervisory channel, two2048kbit/s clock channels, and one FE (encapsulatingthe FE services whose interface is 10M/100M intoone channel of E1 signals for transmission) servicechannel.The carrier wavelength of the optical supervisorychannel is 1510 nm or 1625 nm.

E1ST2 The ST2 is used inOLA, OADM, REG,and OEQ.

In each direction (the east and the west), receives andsends one supervisory channel, two 2048kbit/s clocksignals clock channels, and one FE (encapsulating theFE services whose interface is 10M/100M into onechannel of E1 signals for transmission) servicechannel.The carrier wavelength of the optical supervisorychannel is 1510 nm or 1625 nm.

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4.4.7 Optical Protection Board

The protection board helps to realize optical line protection, inter-subrack 1+1 optical channelprotection, client-side 1+1 optical channel protection, inter-board 1+1 optical channelprotection, 1:N (N≤8) channel protection, WXCP and OTU secondary power backup. They areincluded in Table 4-21:

Table 4-21 Board name and category of the optical protection board

ServiceType

Board Board Description

Opticalprotectionboard

E2OLP01 Separate subrack channel protection unit (client wavelength:multimode 850 nm)

E2OLP02 Separate subrack channel protection unit (client wavelength:single-mode 1310 nm & 1550 nm)

E2OLP03 Optical line protection unit

E1DCP Double channel protection unit

E1OCP Optical channel protection unit

E2SCS Sync optical channel separator unit

E1PBU Power backup unit

Table 4-22 briefs the application and functions of the above boards. For more details, refer toHardware Description.

Table 4-22 Application and description of optical protection board

BoardName

Application Functions

E2OLP For line protection, located betweenthe FIU and the line, or between themultiplexer/demultiplexer board andthe optical amplifier board (theE2OLP03 can be used in lineprotection).For inter-subrack 1+1 optical channelprotection, located between the client-side device and the OTU (theE2OLP02 and E2OLP01 can be usedin inter-subrack 1+1 optical channelprotection).

Performs dual-fed selective receivingof one channel of optical signals.Usesthe OLP board for optical lineprotection. Able to automaticallyswitch the traffic to the standby fiberwhen the performance of the activefiber degrades.( E2OLP03).Realizes inter-subrack 1+1 opticalchannel protection. The signalsautomatically switch to protectionchannel when the working channeldegrades. (E2OLP02 and E2OLP01).

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BoardName

Application Functions

E1DCP Located between the client-side deviceand the OTU.

Performs dual-fed selective receivingof two channels of optical signals.Realizes inter-subrack 1+1 opticalchannel protection. The signalsautomatically switch to protectionchannel when the working channeldegrades.

E1OCP Located between the client equipmentand the OTU.

Helps to realize the 1:N (N≤8)channel protection.

E2SCS Located between the client equipmentand the OTU.

Achieves dual-fed for optical signals.Helps to realize the inter-board 1+1channel protection and the client-side1+1 optical channel protection. Is ableto automatically switch the traffic tothe standby fiber when the signalquality in the active fiber degrades.

E1PBU Serves as the secondary power backupunit of the OTU.

Achieves centralized protection for thepower supplies of the OTU boards inthe same subrack, and supports the 3.3V, 5 V and –5.2 V power supplies onthe two OTU boards simultaneouslywhen power fails.

4.4.8 Spectrum Analyzer Board

The spectrum analyzer board is used to monitor the optical spectrum characteristics and opticalpower. They are included in Table 4-23:

Table 4-23 Board name and category of the spectrum analyzer board

Service Type Board Board Description

Spectrumanalyzer board

E1MCAE2MCA

Multi-channel spectrum analyzer unit

E1WMU Wavelength monitor unit

Table 4-24 briefs the application and functions of the above boards. For more details, refer toHardware Description.

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Table 4-24 Application and description of spectrum analyzer board

Board andModuleName

Application Functions

E1MCAE2MCA

There are two types of MCA available:MCA-8: in-service monitoring of eightoptical channels.MCA-4: in-service monitoring of fouroptical channels.

Provides the built-in in-servicemonitoring and spectrumanalysis function to onlinemonitor such parameters as thecentral wavelength, opticalpower, and OSNR of the opticalsignals at 8/4 different points ofthe system.

E1WMU The WMU detects the signals output from theMON optical interface of the opticalamplifier board to realize the bidirectionalcentralized wavelength detection.

The WMU is used to performcentralized detection to theOTU board at the transmit endof the system in terms of thewavelength precision.The WMU board reports thewavelength deviation to theSCC board.

4.4.9 Variable Optical Attenuator Board

The variable optical attenuator board is used to adjust the optical power. They are included inTable 4-25:

Table 4-25 Board name and category of the variable optical attenuator board

Service Type Board Board Description

Variableopticalattenuatorboard

E2VOA Variable optical attenuator unit

E2VA4 4-channel variable optical attenuator unit

E2VA2 2-channel variable optical attenuator unit

Table 4-26 briefs the application and functions of the above boards. For more details, seeHardware Description.

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Table 4-26 Application and description of variable optical attenuator board

BoardandModuleName

Application Functions

E2VOA Adjusts the optical power of the line signal. Adjusts the optical powerof one optical channelaccording to the commandfrom the SCC.

E2VA4 Adjust the power of the add/drop channel opticalsignal, ensuring power equalization for the mainpath signal.

Adjusts the optical powerof four optical channelsaccording to the commandfrom the SCC.

E2VA2 Adjust the power of the add/drop channel opticalsignal, ensuring power equalization for the mainpath signal.

Adjusts the optical powerof two optical channelsaccording to the commandfrom the SCC.

4.4.10 Optical Fiber Automatic Monitoring Board

The optical fiber automatic monitoring board monitors a fiber (cable). It has features such asfiber aging pre-warning, fiber link alarming and initial fiber fault locating. They are included inTable 4-27:

Table 4-27 Board name and category of the optical fiber automatic monitoring board

Service Type Board Board Description

optical fiberautomaticmonitoring board

E1FMU Fiber monitoring unit

E2MWA Monitoring wavelength access unit

E2MWF Monitoring wavelength filtering unit

Table 4-28 briefs the application and functions of the boards involved in the OAMS. For moredetails, refer to Hardware Description.

Table 4-28 Application and description of the fiber Automatic Monitoring System

BoardName

Application Functions

E1FMU Applicable for the embedded OAMS as its coreunit.

Measures the time domainreflection of four fibers.

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BoardName

Application Functions

E2MWA Applicable for the embedded OAMS, includingtwo types:MWA-I: Accesses two channels of monitoringoptical signals.MWA-II: Accesses four channels of monitoringoptical signals.

During the in-servicemonitoring, it multiplexesthe service signal of theDWDM system and the testsignal wavelength.

E2MWF Applicable for the embedded OAMS, includingtwo types:MWF-I: Filters out two channels of monitoringoptical signals.MWF-II: Filters out four channels of monitoringoptical signals.

In in-service monitoring, itfilters out the test signalwavelength to eliminate itseffect on the transmissionsystem.Used when the service signaland the test signal are co-directional.

4.4.11 Optical Power and Dispersion Slope Equalizing Board

The optical power and dispersion slope equalizing unit is used to adjust the optical power anddispersion. They are included in Table 4-29:

Table 4-29 Board name and category of the optical power and dispersion slope equalizing board

Service Type Board Board Description

Optical powerand dispersionslopeequalizingboard

E1DGEE2DGE

Dynamic gain equalizer unit

E2DSE Dispersion slop equilibrium unit

E3GFU Gain flatness unit

Table 4-30 briefs the application and functions of the above boards. For more details, seeHardware Description.

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Table 4-30 Application and description of optical power and dispersion slope equalizing board

Board andModuleName

Application Functions

E1DGEE2DGE

The E1DGE applied to the opticalequilibrium (OEQ) station.The E2DGE applied to the opticalequilibrium (OEQ) station. Compared withthe E1DGE, the E2DGE extends the range ofavailable wavelengths.

Equalizes the optical power ofall channels by adjusting itsown insertion loss spectrum.

E2DSE There are three types of DSE boards:DSE01, DSE02 and DSE03.The DSE01 and DSE03 compensate for thedispersion slop in three wavebands.The DSE02 compensate for the dispersionslop in five wavebands, applied to systems ofextended C-band.

Provides the dispersion slopecompensation optical interface,used together with thedispersion compensationmodule (combination ofDCMs), for dispersionequalization andcompensation.

E3GFU The GFU03 applies to the scenario where theRaman amplifier is used.The GFU04 applies to the scenario where theROPA subsystem is used.

Uses the gain flattening filter(GFF) for static compensationon uneven gains caused byoptical Raman amplifierconcatenation or ROPamplifier.

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5 Software Architecture

About This Chapter

5.1 OverviewThe entire software is distributed in three modules including board software, NE software andNM system.

5.2 Communication ProtocolsComplete protocol stack and messages of Qx interface are described in ITU-T G.773, Q.811 andQ.812.

5.3 Board SoftwareThe board software runs on each board and it manages, monitors and controls the operation ofthe board.

5.4 NE SoftwareNE software manages, monitors and controls the board operations in NE.

5.5 Network Management SystemThe NM system implements a unified management over the optical transmission network, andmaintains all SDH, Metro and DWDM NE equipment in the network.

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5.1 OverviewThe entire software is distributed in three modules including board software, NE software andNM system.

The software resides respectively on functional boards, the SCC, and NM computer. Hierarchicalstructure ensures that it is highly reliable and efficient. Each layer performs specific functionsand provides service for the upper layer.

The system software architecture is shown in Figure 5-1.

In the diagram, all modules are NE software except "Network Management System" and"Board Software".

Figure 5-1 Software architecture

High LevelCommunication Module

Communication Module

Equipment ManagementModule

Databasemanagement

module

Real-timemulti-taskoperatingsystem

NE Software

Network ManagementSystem

Board Software

5.2 Communication ProtocolsComplete protocol stack and messages of Qx interface are described in ITU-T G.773, Q.811 andQ.812.

Qx interface is mainly used to connect mediation device (MD), Q adaptation (QA) and NE (NE)equipment through local communication network (LCN).

Currently,QA is provided by NE management layer. MD and operating system (OS) are providedby NM layer. They are connected to each other through Qx interface.

According to the Recommendations, Qx interface provided by the system is developed on thebasis of TCP/IP connectionless network layer service (CLNS1) protocol stack.

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In addition, to support remote access of the NM through Modem, IP layer uses serial line internetprotocol (SLIP).

5.3 Board SoftwareThe board software runs on each board and it manages, monitors and controls the operation ofthe board.

It receives the command issued from the NE software and reports the board status to the NEsoftware through performance events and alarm.

The specific functions include:

l Alarm management

l Performance management

l Configuration management

l Communication management

It directly controls the functional circuits in the corresponding boards and implements ITU-Tcompliant specific functions of the NE.

5.4 NE SoftwareNE software manages, monitors and controls the board operations in NE.

It also assists NMS to facilitate the centralized management over WDM network.

According to ITU-T M.3010, NE software is at the unit management layer in the telecommanagement network, performing NE function (NEF), partial mediation function (MF) and OSfunction at network unit layer.

Data communication function (DCF) provides communication channel between NE and otherequipment (including NM and other NEs).

l Real-time multi-task operating systemThe NE software offers real-time multi-task operating system to manage public resourcesand support application programs.It isolates the application programs from the processor and provides an application programexecution environment, which is independent of the processor hardware.

l Communication moduleThe communication module is the interface module between NE software and boardsoftware.According to related protocol, communication function between the NE software and theboard software is for information exchange and maintenance of the equipment.The board maintenance and operation commands from the NE software are sent to theboards through the communication. On the other hand, the state, alarm and performanceevents of the board are reported to the NE software.

l Equipment management moduleThe equipment management module is the core of the NE software for the NE management.It includes administrator and agent.

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Administrator can send NM operation commands and receive events.Agent can respond to the NM operation commands sent by the administrator, implementthe operations of the managed object, and send events according to the change of status ofthe managed object.

l High-level communication moduleThe high-level communication module exchanges management information among NEsand between the NM system and the NE.It consists of network communication module, serial communication module and ECCcommunication module.

l Database management moduleThe database management module is a part of the NE software.It includes two independent parts: data and program.The data is organized in the form of databases, including network database, alarm database,performance database and equipment database.The program manages and accesses the data in the database.

5.5 Network Management SystemThe NM system implements a unified management over the optical transmission network, andmaintains all SDH, Metro and DWDM NE equipment in the network.

It is an NM system, which complies with the ITU-T Recommendations, that integrates standardmanagement information model as well as object-oriented management technology.

It exchanges information with the NE software through the communication module to monitorand manage the network equipment.

The NM software runs on a workstation or PC, managing the equipment and the transmissionnetwork to help operate, maintain and manage the transmission equipment.

The management functions of the NM software include:

l Alarm management: collects, prompts, filters, browses, acknowledges, checks, clears, andcounts in real time; achieves alarm insertion, alarm correlation analysis and fault diagnosis.

l Performance management: sets performance monitoring; browses, analyzes and printsperformance data; forecasts medium-term and long-term performance; and resetsperformance register.

l Configuration management: configures and manages interfaces, clocks, services, trails,subnets and time.

l Security management: provides NM user management, NE user management, NE loginmanagement, NE login lockout, NE setting lockout and local craft terminal (LCT) accesscontrol of the equipment.

l Maintenance management: provides loopback, board resetting, automatic laser shutdown(ALS) and optical fiber power detection, and collects equipment data to help themaintenance personnel in troubleshooting.

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6 System Configuration

About This Chapter

The system offers five types of NEs: OTM, OLA, OADM, OEQ and REG. The OADM includesFOADM and ROADM.

6.1 OTM (C Band)The OTM (C Band) is a terminal station of a DWDM network. An OTM is divided into thetransmit end and the receive end.

6.2 OTM (L Band)The OTM (L Band) is a terminal station of a DWDM network. An OTM is divided into thetransmit end and the receive end.

6.3 OTM (LHP)The OTM (LHP) is a terminal station of a DWDM network. An OTM is divided into the transmitend and the receive end.

6.4 OLAThe OLA amplifies bidirectional optical signals and compensates for the fiber link attenuationto extend the transmission distance without regeneration.

6.5 FOADMThe FOADM equipment adds/drops optical wavelength signals at the intermediate node.

6.6 ROADMThe ROADM equipment dynamically adds/drops and cross-connects optical wavelength signalsat the intermediate node.

6.7 REGThe REG equipment is an electrical regenerator and is used to further extend the opticaltransmission distance.

6.8 OEQIn the ELH system the OEQ equipment need be configured to realize optical power equalizationand dispersion compensation.

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6.1 OTM (C Band)The OTM (C Band) is a terminal station of a DWDM network. An OTM is divided into thetransmit end and the receive end.

At the transmit end, the OTM receives optical signals from multiple client equipment (forexample, SDH equipment), converts these signals, multiplexes, amplifies and sends them on asingle optical fiber.

At the receive end, the OTM demultiplexes the signals into individual channels and distributesthem to the corresponding client equipment.

An OTM consists of:

l Optical transponder unit (OTU)

l Optical multiplexer (OM)

l Optical demultiplexer (OD)

l Optical amplifier (OA)

l Raman pump amplifier unit (RAU)

l Optical supervisory channel unit or optical supervisory channel and timing transmissionunit (OSC/OTC)

l Fiber interface unit (FIU)

l Dispersion compensation module (DCM)

l Optical protection unit (OP)

l Multi-channel spectrum analyzer unit (MCA)

l System control & communication unit (SCC)

l Power backup unit (PBU)

6.1.1 C400G/C800G SystemThis section describes the signal flow, formation method, typical configurations, andconfiguration principles of the OTM equipment in the C400G/C800G system.

6.1.2 C480G/C960G SystemThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OTM equipment in the C480G/C960G system.

6.1.3 C1600G/C1920G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C1600G/C1920G system.

6.1.4 40G Transmission SystemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the per-channel 40 Gbit/s system.

6.1.1 C400G/C800G SystemThis section describes the signal flow, formation method, typical configurations, andconfiguration principles of the OTM equipment in the C400G/C800G system.

By type, the C400G and C800G systems are classified into the type III and type II systems,respectively.

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Signal Flow

Figure 6-1 is the signal flow diagram of the OTM equipment in the type III system (C400Gsystem)

Figure 6-1 OTM signal flow

OM

OTU01

OTU02

OTUn

OTU01

OTU02

OTUn

λ01

λ02

λn

λ01

λ02

λn

Client-side equipm

ent

OD OA

OA

FIUOSC/OTC

DCM

DCM

MCA

RAU

Line-side fiber

OM: optical multiplexer OD: optical demultiplexer OA: optical amplifierOTU: optical transponder unit MCA: multi-channel spectrum

analyzer unitDCM: dispersion compensationmodule

OSC: optical supervisory channelunit

OTC: optical supervisory channeland timing transmission unit

RAU: raman pump amplifier unit

At the transmit end, client-side signals are received at OTU boards, where these signals areconverted into standard DWDM signals in compliance with ITU-T G.694.1. The OMmultiplexes these signals and sends them to the OA for amplification. Meanwhile, the DCMimplements dispersion compensation. Finally, the amplified main path signal and supervisorysignal are multiplexed, through the FIU, and are sent to the optical fiber for transmission.

At the receive end, the RAU (optional), a low-noise pump amplifier, amplifies the received mainpath signal. Then the main path signal is separated into supervisory signal and service signal.After amplification and dispersion compensation, the service signal is sent to the OD anddemultiplexed by the OD. The supervisory signal is directly processed by the OSC/OTC.

The OM, OD and OA provide optical performance monitoring port, through which the MCA isaccessed for monitoring the central wavelength, optical power and OSNR of multiple channelsof optical signals.

The integrated OTM can work without any OTU at the transmit end. Therefore, n channels ofsignals can be directly multiplexed into DWDM main optical path.

Structure

Figure 6-2 shows the structure of the C400G system, which is applied to only the C_EVENband. Figure 6-3 shows the structure of the C800G system, which is applied to the C_EVENand C_ODD bands.

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Figure 6-2 Structure of OM, OD, OA of the C400G system

OA

M40(C-EVEN)

D40(C-EVEN)

OAU

FIU

OM

OD

OAU

Figure 6-3 Structure of OM, OD, OA of the C800G system

OA

M40(C-ODD)

M40(C-EVEN)

D40(C-ODD)

D40(C-EVEN)

ITL-C

OA-C

OA-C

FIU

OM & OD

Typical ConfigurationsThe typical configurations of the C400G OTM are shown in Figure 6-4. The single channelaccesses 10 Gbit/s signals.

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Figure 6-4 Configuration of the C400G OTM

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M40

SCC

D40

OAU(C)

MCA(C)

FIU

SC1

SCC

OAU(C)

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

Note: All OTUs work at C_EVEN band. The "(C)" indicates the C band.

The typical configurations of the C800G OTM are shown in Figure 6-5.

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Figure 6-5 Configuration of the C800G OTM

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M40

SCC

D40

OAU

MCA

ITL

SC1

SCC

FIU

RPC

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

SCC

SCC

Power

HUB/1

M40

SCC

D40

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

C-EVEN OTU C-ODD OTU

(CE) (CE)

(CO) (CO)

(C) (C)

Note: OTUs work at either C_EVEN band or C_ODD band. HUB/1 indicates one 8-port HUB is configuredin the HUB frame.

NOTE

l If OTUs need be configured with centralized power protection, a PBU board must be configured inslot 13 of the enhanced subrack to hold the OTUs.

l If the system provides the line protection function, the OLP board needs to be configured. In this case,the Raman amplifier unit cannot be used.

Configuration Principlel Configuration of M40, V40 and VA4

– If the number of optical channels is more than 16, and if there is a need for powerequalization, use the V40. If the number of optical channels is less than 16, and if thereis a need for power equalization, install one M40 along with several VA4s.

– If there is no need for power equalization, install the M40.

l Configuration of OTU

– In a system of C-Band 80 channels, when you install the OTU, first configure theC_EVEN module, and then C_ODD in general C band.

– Do this from the bottom subrack to top subrack and left to right in the subrack.

l Configuration of SCC

Generally, the SCC board is required in the every subrack to process the overhead andorderwire of the system.

l Configuration of Amplifier Unit

– Raman amplifier unit is to be used with the OAU.

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– Amplifier units of the transmit end and the receive end are installed in the leftmost slotsor the rightmost slots.

l Configuration of Supervisory Channel Unit– If clock transmission for Ethernet (FE) data services is required, use the ST1. Otherwise

use the SC1. Note that the ST1 cannot be used with the SC1.– Slot 6 is preferred when you configure the board of supervisory channel unit.

l Configuration of Protection Group– In 1:8 OTU protection, all the boards in a protection group, including the working OTU

boards, the protection OTU and the OCP, should be installed in one subrack.– The OLP is used for the purpose of optical line protection. It is not used with the Raman

amplifier unit.– When you configure the inter-subrack 1+1 protection, the working OTU, the protection

OTU and the OLP/DCP can be configured in different subracks. The OLP/DCP supportsprotection against subrack power failure. In this case, the protection OTU and the OLP/DCP should not be in the same subrack.

– The SCS board is configured when the system adopts the inter-OTU 1+1 protection.The working path and the protection path are in different transmission directions. Thering network structure is adopted. The protection OTU and the working OTU shouldbe in the same subrack.

6.1.2 C480G/C960G SystemThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OTM equipment in the C480G/C960G system.

By type, the C480G and C960G systems are classified into type VII system.

Signal FlowFor the signal flow of the OTM equipment in the C480G/C960G system, refer to section "SignalFlow of OTM Equipment in the C480G/C960G System".

StructureFigure 6-6 shows the structure of the C480G system, which is applied to only the C_EVENband. Figure 6-7 shows the structure of the C960G system, which is applied to the C_EVENand C_ODD bands.

Figure 6-6 Structure of OM, OD, OA of the C480G system

OA

M48(C-EVEN)

D48(C-EVEN)

OAU

FIU

OM

OD

OAU

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Figure 6-7 Structure of OM, OD, OA of the C960G system

OA

M48(C-ODD)

M48(C-EVEN)

D48(C-ODD)

D48(C-EVEN)

ITL-C

OA-C

OA-C

FIU

OM & OD

Typical Configurations

The typical configurations of the C480G OTM are shown in Figure 6-8 The single channelaccesses 10 Gbit/s signals.

Figure 6-8 Configuration of the C480G OTM

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M48

SCC

D48

OAU(C)

MCA(C)

FIU

SC1

SCC

OAU(C)

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

OTU

SCC

OTU

OTU

U

OT

U

OT

U

OTU

OT

OTU

Note: All OTUs work at C_EVEN band. The "(C)" indicates the C band.

The typical configurations of the C960G OTM are shown in Figure 6-9.

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Figure 6-9 Configuration of the C960G OTM

C-EVEN OTU C-ODD OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M48

SCC

D48

OAU

MCA

ITL

SC1

SCC

FIU

RPC

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

SCC

Power

HUB/1

M48

SCC

D48

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

(CE) (CE)

(CO) (CO)

(C) (C)

OTU

OTU

OTU

SCC

OTU

OTU

OTU

Power

OTU

OTU

OTU

OTU

OTU

OTU

SCC

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

O

UT

OTU

OTU

Note: OTUs work at either C_EVEN band or C_ODD band. HUB/1 indicates one 8-port HUB is configuredin the HUB frame.

NOTE

l If OTUs need be configured with centralized power protection, a PBU board must be configured inslot 13 of the enhanced subrack to hold the OTUs.

l If the system provides the line protection function, the OLP board needs to be configured. In this case,the Raman amplifier unit cannot be used.

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NOTE

When you configure a type VII system, give priority to OTUs of the general C-bands. When you configureOTUs of extended C-bands, configure the M48 and the D48. This is to multiplex and demultiplex channelsof the extended C-bands.

Configuration Principlel Configuration of M48, V48 and VA4

– If the number of optical channels is more than 16, and if there is a need for powerequalization, use the V48. If the number of optical channels is less than 16, and if thereis a need for power equalization, install one M48 along with several VA4s.

– If there is no need for power equalization, install the M48.

l Configuration of OTU– In a system of extended C-Band 96 channels, when you install the OTU, first configure

the C_EVEN module, and then C_ODD in general C band, C_EVEN and C_ODDmodules in extended C band.

– Do this from the bottom subrack to top subrack and left to right in the subrack.

l Configuration of SCCGenerally, the SCC board is required in the every subrack to process the overhead andorderwire of the system.

l Configuration of Amplifier Unit– Raman amplifier unit is to be used with the OAU.

– Amplifier units of the transmit end and the receive end are installed in the leftmost slotsor the rightmost slots.

l Configuration of Supervisory Channel Unit– If clock transmission for Ethernet (FE) data services is required, use the ST1. Otherwise

use the SC1. Note that the ST1 cannot be used with the SC1.– Slot 6 is preferred when you configure the board of supervisory channel unit.

l Configuration of Protection Group– In 1:8 OTU protection, all the boards in a protection group, including the working OTU

boards, the protection OTU and the OCP, should be installed in one subrack.– The OLP is used for the purpose of optical line protection. It is not used with the Raman

amplifier unit.– When you configure the inter-subrack 1+1 protection, the working OTU, the protection

OTU and the OLP/DCP can be configured in different subracks. The OLP/DCP supportsprotection against subrack power failure. In this case, the protection OTU and the OLP/DCP should not be in the same subrack.

– The SCS board is configured when the system adopts the inter-OTU 1+1 protection.The working path and the protection path are in different transmission directions. Thering network structure is adopted. The protection OTU and the working OTU shouldbe in the same subrack.

6.1.3 C1600G/C1920G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C1600G/C1920G system.

By system type, the C1600G/C1920G system is of type IX.

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Type IX system uses extended C-band to access 160 or 192 channels with the channel spacingof 25 GHz. Thus, the system capacity reaches a maximum of 1920G. Table 6-1 shows thedivision of the 192 channels of type IX system.

Table 6-1 Division of the 192 channels in the type IX system

AbbreviationRange ofFrequency (THz)

Range of Wavelength(nm) Channel Spacing

C_EVEN 191.300–196.000 1529.55–1567.13 25 GHz

C_ODD 191.350–196.050 1529.16–1566.72

C_EVEN_PLUS 191.325–196.025 1529.35–1566.92

C_ODD_PLUS 191.375–196.075 1528.96–1566.51

Note: The 160-channel system uses only the frequencies that range within 192.10–196.00 and192.15–196.05.

Signal FlowFor the signal flow of the OTM equipment in the C1600G/C1920G system, refer to the signalflow of the OTM equipment in the C400G/C800G system.

StructureThe type IX system adopts three-level optical interleaving solution. First, the channels with thechannel spacing of 100 GHz are multiplexed. Then, the channels are interleaved into the opticalwavelengths with the channel spacing of 50 GHz. At last, the wavelengths are further interleavedinto the optical wavelengths with the channel spacing of 25 GHz. Figure 6-10 shows the structureof the OM, OD, and OA of type IX system.

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Figure 6-10 Structure of OM, OD, OA of the C 1600G/C 1920G systemOA

V48/M48(C-ODD)

ITL-C

OA-C

OA-C

FIU

OM & OD

50/25GHz

ITL-C

ITL-C

100/50GHz

100/50GHz

D48

V48/M48

V48/M48

V48/M48

D48

D48

D48

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

100GHz OTU

(C-EVEN)

(C-ODD)

(C-EVEN)

(C-ODD-PLUS)

(C-EVEN-PLUS)

(C96)

(C96 PLUS)

(C-ODD-PLUS)

(C-EVEN-PLUS)

Typical ConfigurationFigure 6-11 and Figure 6-12 show the typical configuration of the OTM equipment in theC1600G/C1920G system (with a 10 Gbit/s single-wavelength access rate).

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Figure 6-11 Configuration of the 1920 Gbit/s OTM (C band)

C-EVEN OTU C-ODD OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M48

SCC

D48

OAU

MCA

ITL

SC1

SCC

FIU

RPC

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

SCC

Power

HUB/1

M48

SCC

D48

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCE

OTU

OTU

OTU

OTU

(CE) (CE)

(CO) (CO)

(C) (C01)

SCC

Power

OTU

OTU

OTU

OTU

OTU

OTU

SCC

SCC

U

OT

O OT

U

OTU

O

UT

O OT TU U

OT

U UT

U

ITL

(C03)

O O O OT T T TU U U U

Note: The explanatory text in the figure indicates whether the corresponding wavelength of the wavelengthconversion board belongs to the C_EVEN or the C_ODD band. HUB/1 indicates that the HUB frame isconfigured with an 8-port HUB. C01 indicates that the ITL is used for the interleaving of the standardwavelengths with the channel spacing of 50 GHz/100 GHz in the C_EVEN and the C_ODD band. C03 indicatesthat the ITL is used for the interleaving of all wavelengths with the channel spacing of 25 GHz/50 GHz.

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Figure 6-12 Configuration of the 1920 Gbit/s OTM (C_PLUS band)

C-EVEN-PLUS OTU C- OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

SCC

ITL

SCC

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

HUB/1

SCC

Power

HUB/1

M48

SCC

D48

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCE

OTU

(CEP) (CEP)

(COP) (COP)

(C02)

OTU

OTU

OTU

OTU

OTU

OTU

SCC

SCC

O

UT

O OT TU U

ODD-PLUS

84M

84D

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Note: The explanatory text in the figure indicates whether the corresponding wavelength of the wavelengthconversion board belongs to C_EVEN_PLUS or C_ODD_PLUS waveband. HUB/1 indicates that the HUBframe is configured with one 8-port HUB. C02 indicates that the ITL is used for the interleaving ofC_EVEN_PLUS/C_ODD_PLUS wavelengths with the channel spacing of 50 GHz/100 GHz. CEP representsa board used to multiplex or demultiplex the C_EVEN_PLUS wavelengths. COP represents a board used tomultiplex or demultiplex the C_ODD_PLUS wavelengths.

NOTE

l If OTUs need be configured with centralized power protection, a PBU board must be configured inslot 13 of the enhanced subrack to hold the OTUs.

l If the system provides the line protection function, the OLP board needs to be configured. In this case,the Raman amplifier unit cannot be used.

NOTE

As for the configuration of the type IX system, the OTU for general wavelengths and the OTU for C_EVEN,C_ODD, C_EVEN_PLUS and C_ODD_PLUS wavelengths are preferred so as to realize the applicationof a maximum of 160 channels in C-band. If an expansion in capacity is required, OTUs for wavelengthsin extended band can be configured so as to realize the application of 192 channels in C-band.

Configuration Principlel Configuration of M48, V48 and VA4

– If the number of optical channels is more than 16, and if there is a need for powerequalization, use the V48. If the number of optical channels is less than 16, and if thereis a need for power equalization, install one M48 along with several VA4s.

– If there is no need for power equalization, install the M48.l Configuration of OTU

– In a system of extended C-Band 192 channels, when you install the OTU, first configurethe C_EVEN module, and then C_ODD in general C band, C_EVEN_PLUS and

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C_ODD_PLUS modules in general C band, C_EVEN module, and then C_ODD inextended C band, C_EVEN_PLUS and C_ODD_PLUS modules in extended C band.

– Do this from the bottom subrack to top subrack and left to right in the subrack.

l Configuration of SCC

Generally, the SCC board is required in the every subrack to process the overhead andorderwire of the system.

l Configuration of Amplifier Unit

– Raman amplifier unit is to be used with the OAU.

– Amplifier units of the transmit end and the receive end are installed in the leftmost slotsor the rightmost slots.

l Configuration of Supervisory Channel Unit

– If clock transmission for Ethernet (FE) data services is required, use the ST1. Otherwiseuse the SC1. Note that the ST1 cannot be used with the SC1.

– Slot 6 is preferred when you configure the board of supervisory channel unit.

l Configuration of Protection Group

– In 1:8 OTU protection, all the boards in a protection group, including the working OTUboards, the protection OTU and the OCP, should be installed in one subrack.

– The OLP is used for the purpose of optical line protection. It is not used with the Ramanamplifier unit.

– When you configure the inter-subrack 1+1 protection, the working OTU, the protectionOTU and the OLP/DCP can be configured in different subracks. The OLP/DCP supportsprotection against subrack power failure. In this case, the protection OTU and the OLP/DCP should not be in the same subrack.

– The SCS board is configured when the system adopts the inter-OTU 1+1 protection.The working path and the protection path are in different transmission directions. Thering network structure is adopted. The protection OTU and the working OTU shouldbe in the same subrack.

6.1.4 40G Transmission SystemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the per-channel 40 Gbit/s system.

By system type, the per-channel 40 Gbit/s system is of type VIII.

Signal Flow

For the signal flow of the OTM equipment in the the per-channel 40 Gbit/s system, refer to thesignal flow of the OTM equipment in the C400G/C800G system.

Structure

Type VIII system is a per-channel 40 Gbit/s system that can access a maximum of 80 channelsat the C_EVEN and C_ODD bands with channel spacing of 50 GHz. The system capacity reachesa maximum of 3200G. Figure 6-14 shows the structure of the system. When the system accesses40 channels with channel spacing of 100 GHz, it applies to the C_EVEN band only. The systemcapacity reaches a maximum of 1600G. Figure 6-13 shows the structure of the system.

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Figure 6-13 Structure of the OM, OD and OA of per-channel 40 Gbit/s system (40 channels)

OA

M40(C-EVEN)

D40(C-EVEN)

OAU

FIU

OM

OD

OAU

Figure 6-14 Structure of the OM, OD and OA of per-channel 40 Gbit/s system (80 channels)

OA

M40(C-ODD)

M40(C-EVEN)

D40(C-ODD)

D40(C-EVEN)

ITL-C

OA-C

OA-C

FIU

OM & OD

Typical ConfigurationThe type VIII system can transmit 40 Gbit/s services. The system accesses up to 80 OTUs. Thetype VIII supports hybrid accessing of 2.5 Gbit/s, 10 Gbit/s and 40 Gbit/s services. Figure6-15 shows the typical configuration of a 20-channel system.

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Figure 6-15 Typical configuration of the per-channel 40 Gbit/s system (20 channels)

SCC

FIU

SC1

SCC

Power

DCMHUB/1

SCC

OTU

OTU

OTU

OTU

Power

SCC

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OAU(C)

OAU(C)

D40

M40

OTU

OTU

(

MC

C)A

OTU

OTU

Note: OTUs are either in C_EVEN band. HUB/1 indicates one 8-port HUB is configured in the HUB frame.

Configuration Principle

The board configuration principles of the OTM equipment in the the per-channel 40 Gbit/ssystem are the same as those in the C400G/C800G system.

6.2 OTM (L Band)The OTM (L Band) is a terminal station of a DWDM network. An OTM is divided into thetransmit end and the receive end.

The functions and the classification of functional units of the L-band OTM equipment are thesame as those of the C-band OTM equipment. The operating wavelength range of the boards ofall functional units of the L-band OTM equipment applies to the L band, whereas that of the C-band OTM equipment apply to the C band.

6.2.1 C+L1600G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C+L1600G system.

6.2.2 C+L800G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C+L800G system.

6.2.3 L400G system

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This section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the L400G system.

6.2.1 C+L1600G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C+L1600G system.

By system type, the C+L1600G system is of type I.

The type I system (1600G capacity) uses four 400 Gbit/s modules together to access 160channels. Refer to Table 6-2.

Table 6-2 Distribution of 160 channels

GroupFrequency Range(THz)

Wavelength Range(nm)

Channel Spacing(GHz)

C_EVEN 192.10–196.00 1529.16–1560.61 50

C_ODD 192.15–196.05

L_EVEN 186.95–190.85 1570.42–1603.57 50

L_ODD 187.00–190.90

Signal FlowFor the signal flow of the OTM equipment in the C+L1600G system, refer to the signal flow ofthe OTM equipment in the C400G/C800G system.

StructureThe structure of the OM, OD and OA of the type I system is shown in Figure 6-16. Each ofthem has different specifications to process signals of different bands. For example, the M40(C_ODD) multiplexes signals of C_ODD channels, while the M40 (C_EVEN) multiplexessignals of C_EVEN channels.

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Figure 6-16 Structure of the OM, OD and OA of C+L1600G system

OA

M40(C-ODD)

M40(C-EVEN)

D40(C-ODD)

D40(C-EVEN)

M40(L-ODD)

M40(L-EVEN)

D40(L-ODD)

D40(L-EVEN)

ITL-C

ITL-L

OA-C

OA-C

OA-L

OA-L

FIU

OM & OD

ITL-C: C-band interleaver ITL-L: L-band interleaver OA-C: C-band optical amplifier unitOA-L:L-band optical amplifier unit M40: 40-channel multiplexing unit D40: 40-channel demultiplexing unitFIU: fiber interface unit

The four 400 Gbit/s optical modules multiplex optical signals of each band and send themultiplexed signal to the ITL for L band and ITL for C band. In the ITL, the multiplexed signalsare multiplexed again into 80-channel multiplexed signal in C-band and 80-channel multiplexedsignal in L-band, with channel spacing of 50 GHz. After amplification and dispersioncompensation, the signals of two bands, with the optical supervisory signal or optical supervisorysignal & clock signal, are sent to the optical fiber for transmission.

NOTE

l The channel spacing within each group is 100 GHz, that is, the channel spacing at each multiplexer/demultiplexer is 100 GHz. However, the spacing between two adjacent channels, for example channel1 and channel 2, is 50 GHz. Therefore, the interleaver can be used to realize 50 GHz channel spacingfor the 1600G transmission system.

l For example, the frequencies of a multiplexed signal are 192.1 THz, 192.2 THz …196.0 THz, totally40 channels. Those of another multiplexed signal are 192.15 THz, 192.25 THz …196.05 THz, totally40 channels. After passing through the interleaver, the output frequencies change to 192.1 THz, 192.15THz, 192.2 THz, 192.25 THz…196.05 THZ, with channel spacing of 50 GHz. In this way, theinterleaver multiplexes or demultiplexes odd channels and even channels.

Typical ConfigurationIn full configuration, an open OTM of the type I system needs seven cabinets and 19 subracks.

The configuration of OTM is based on the system capacity and upgrading mode. Typically, thetype I system adopts smooth expansion by adding the C_EVEN module, C_ODD module,

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L_EVEN module, and then the L_ODD module. Each module has a maximum capacity of 400Gbit/s (40 channels) and smooth expansion from 1 channel to 40 channels can be enabled withineach module. Figure 6-17 shows the typical C-band 800 Gbit/s OTM configuration and Figure6-18 shows the typical L-band 800 Gbit/s OTM configuration.

Figure 6-17 Configuration of the C-band 800 Gbit/s OTM

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M40

SCC

D40

OAU

MCA

ITL

SC1

SCC

FIU

RPA

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

SCC

SCC

Power

HUB/1

M40

SCC

D40

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

C-EVEN OTU C-ODD OTU

(CE) (CE)

(CO) (CO)

(C) (C)

Note: All plug-in OTUs belong to C_EVEN/C_ODD band. HUB/1 indicates one 8-port HUB is configured inthe HUB frame.

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Figure 6-18 Configuration of the L-band 800 Gbit/s OTM

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M40

SCC

D40

ITL

OAU

MCA

OTU

OTU

SCC

OTU

OTU

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/2

SCC

SCC

Power

HUB/1

M40

SCC

D40

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

L-EVEN OTU L-ODD OTU

(L)(L)

(LE) (LE)

(LO) (LO)

Note: All plug-in OTUs belong to L_EVEN/L_ODD band. HUB/1 indicates one 8-port HUB is configured inthe HUB frame, and HUB/2 indicates that two 8-port HUBs are configured in the HUB frame.

Configuration Principlel Configuration of M40, V40 and VA4

– If the number of optical channels is more than 16, and if there is a need for powerequalization, use the V40. If the number of optical channels is less than 16, and if thereis a need for power equalization, install one M40 along with several VA4s.

– If there is no need for power equalization, install the M40.

l Configuration of OTU– In a system of C-Band 80 channels and L-Band 80 channels, when you install the OTU,

first configure the C_EVEN module, and then C_ODD, L_EVEN and L_ODD modulesin general C band.

– Do this from the bottom subrack to top subrack and left to right in the subrack.

l Configuration of SCCGenerally, the SCC board is required in the every subrack to process the overhead andorderwire of the system.

l Configuration of Amplifier Unit– Raman amplifier unit is to be used with the OAU.

– Amplifier units of the transmit end and the receive end are installed in the leftmost slotsor the rightmost slots.

l Configuration of Supervisory Channel Unit– If clock transmission for Ethernet (FE) data services is required, use the ST1. Otherwise

use the SC1. Note that the ST1 cannot be used with the SC1.– Slot 6 is preferred when you configure the board of supervisory channel unit.

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l Configuration of Protection Group

– In 1:8 OTU protection, all the boards in a protection group, including the working OTUboards, the protection OTU and the OCP, should be installed in one subrack.

– The OLP is used for the purpose of optical line protection. It is not used with the Ramanamplifier unit.

– When you configure the inter-subrack 1+1 protection, the working OTU, the protectionOTU and the OLP/DCP can be configured in different subracks. The OLP/DCP supportsprotection against subrack power failure. In this case, the protection OTU and the OLP/DCP should not be in the same subrack.

– The SCS board is configured when the system adopts the inter-OTU 1+1 protection.The working path and the protection path are in different transmission directions. Thering network structure is adopted. The protection OTU and the working OTU shouldbe in the same subrack.

6.2.2 C+L800G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the C+L800G system.

By system type, the C+L800G system is of type II.

Signal Flow

For the signal flow of the OTM equipment in the C+L800G system, refer to the signal flow ofthe OTM equipment in the C400G/C800G system.

Structure

The channel spacing of the C+L 800G system is 100 GHz. The OM, OD and OA of the C+L800G system operate at C_EVEN and L_ODD bands. See Figure 6-19.

Figure 6-19 Structure of OM, OD, OA of the C+L800G system

OA

FIU

OM & OD

D40(C-EVEN) OA-C

D40(L-ODD) OA-L

M40(L-ODD) OA-L

M40(C-EVEN) OA-C

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Typical Configuration

The configuration of C+L OTM can be upgraded from the initial C-band 400G to C+L 800G.See Figure 6-20.

Figure 6-20 Configuration of the C+L800G OTM (C band)

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

M40

SCC

D40

OAU

MCA

SC1

SCC

FIU

RPA

OAU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Power Power

DCMHUB/1

SCC

Power

HUB/1

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

C-EVEN L-ODD

(CE) (CE)

(C)

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

M40

OAU

MCA

SCC

OAU

D40

(LO)(LO) (L)

Note: OTUs are either in C-EVEN or L-ODD band. HUB/1 indicates one 8-port HUB is configured in the HUBframe.

Configuration Principle

The board configuration principles of the OTM equipment in the C+L800G system are the sameas those in the C+L1600G system.

6.2.3 L400G systemThis section describes the signal flow, structure, typical configuration and configurationprinciples of the OTM equipment in the L400G system.

By system type, the L400G system is of type IV.

Signal Flow

For the signal flow of the OTM equipment in the L400G system, refer to the signal flow of theOTM equipment in the C400G/C800G system.

Structure

The type IV system operates at L_ODD band only. Figure 6-21 shows the structures of the OM,OD and OA.

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Figure 6-21 Structure of OM, OD, OA of the L400G system

OA

M40(L-ODD)

D40(L-ODD)

OA-L

FIU

OM

OA-L

OD

Typical ConfigurationThe typical configuration of the L-ODD-band 400G OTM equipment in type IV system is similarto that in the C400G system. Type IV system, however, uses various L-ODD-band boards.

Configuration PrincipleThe configuration principles of the boards of the OTM equipment in the L400G system are thesame as those in the C+L1600G system. The L400G system, however, uses only L-ODD-bandboards.

6.3 OTM (LHP)The OTM (LHP) is a terminal station of a DWDM network. An OTM is divided into the transmitend and the receive end.

Signal FlowFor the signal flow of the OTM equipment in the LHP system, refer to the signal flow of theOTM equipment in the C400G/C800G system.

StructureBy system type, the LHP system is of type VI.

Type VI system operates in the C_EVEN or C_ODD band. Figure 6-22 and Figure 6-23 showthe structures of the OM, OD and OA.

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Figure 6-22 Configuration of the LHP system OTM (40 channels)

OA

M40(C-EVEN)

D40(C-EVEN)

HBA

FIU

OM

OAU

OD

Figure 6-23 Configuration of the LHP system OTM (80 channels)

OA

M40(C-ODD)

M40(C-EVEN)

D40(C-ODD)

D40(C-EVEN)

ITL-C

HBA

OA-C

FIU

OM & OD

Typical ConfigurationBeing an LHP, the configuration of type VI system does not vary with the number ofwavelengths, which has similar configuration, except the number of OTUs. Figure 6-24 showsthe configuration of the 10-channel system.

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Figure 6-24 Configuration of the LHP system OTM (10 channels)

OTU

OTU

SCC

M40

OTU

D40

HBA

MCA(C)

FIU

SC1

SCC

OAU(C)

OTU

OTU

OTU

SCC

OTU

OTU

Power

DCMHUB/1

OTU

OTU

Note: All OTUs belong to C-EVEN band. The "(C)" indicates the C band.

The OTM of the type VI system is configured with a high booster amplifier (HBA) at the transmitend and optical amplifier units (OAU) at the receive end.

Configuration Principle

The board configuration principles of the OTM equipment in the LHP system are the same asthose in the C400G/C800G system.

6.4 OLAThe OLA amplifies bidirectional optical signals and compensates for the fiber link attenuationto extend the transmission distance without regeneration.

Signal Flow

The OLA consists of:

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Dispersion compensation module (DCM)

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l System control & communication unit (SCC)

The OLA flow signal is shown in Figure 6-25.

Figure 6-25 OLA signal flow

West line fiber

OA-C

FIU

OSC/OTC

DCM

DCM

East line fiber

FIU

DCM

OA-C

DCM

OA-L

OA-L

L band

C band

C band

L band

RAU

RAU

OA: optical amplifier OSC: optical supervisory channelunit

DCM: dispersion compensationmodule

OTC: optical supervisory channeland timing transmission unit

At the receive end, the FIU separates the line optical signals into service signals and supervisorysignal.

Then all the service signals are sent to the OA, where these signals are amplified according toC-band and L-band. Meanwhile, the DCM implements the dispersion compensation to theservice signals. Optical supervisory signals are sent to the OSC for overhead processing(overhead).

At the transmit end, the amplified service signals and supervisory signal are sent, through theFIU, to the optical fiber for transmission.

StructureIn the case of each type of system, the function units of each type of OLA NEs consist of differentboards or board groups.

NOTE

The type VI system is a long hop system with no need for the OLA.

Typical ConfigurationIn full configuration, the OLA only needs one cabinet. In engineering configuration, whether touse OAU, OBU, OPU or the combination of them is dependent on the actual line loss and powerbudget.

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NOTE

In DWDM equipment, the definition about west and east is:

l In a chain network, the left is west and the right is east.

l In a ring network, the counter-clockwise (outer ring) is the primary ring, in the direction from west toeast.

west east

west

west

west

west

east

east

easteast

The OLA equipment achieves the bidirectional main path optical signal amplification in C-bandand L-band. In each direction, two optical amplifiers are needed, which amplify optical signalsin C-band and L-band respectively. The configuration is shown in Figure 6-26 and Figure6-27.

Figure 6-26 Configuration of the C+L band OLA in standard subrack

Power

DCM

OAU

(C)

OAU

(L)

FIU

SC2

SCC

FIU

OAU

(L)

OAU

(C)west east

from westto east

from eastto west

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Figure 6-27 Configuration of the C+L band OLA in independent OLA subrack

DCMwest east

OAU

(C)

FIU

SC2

SCC

FIU

OAU

SCC

OAU

PMU

PMU

(C)

(L)

OAU(L)

from eastto west

from westto east

If the system needs a Raman amplifier unit, configure two RPA boards in the middle subrackthat is added later. If the system needs to configure the optical line protection, configure twoOLP boards in the new middle subrack. Note that RPA and OLP can not be configured at thesame time.

In the type II system (C800G system), the type III, type V, type VII, type VIII, and type IXsystems, the main optical channel in C band needs to be amplified in two directions. Oneamplifier is needed in each direction. Figure 6-28 and Figure 6-29 shows the typicalconfigurations.

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Figure 6-28 Configuration of the C-band OLA in the standard subrack

Power

DCM

OAU

(C)

FIU

SC2

SCC

FIU

OAU

(C)west east

OLP

OLP

from eastto west

from westto east

Figure 6-29 Configuration of the C-band OLA in the independent OLA subrack

DCM

OAU

(C)

FIU

SC2

SCC

FIU

west east

OLP

OLP

OAU

(C)

PMU

from westto east

from eastto west

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The case shown in Figure 6-28 and Figure 6-29 are configured with optical line protection,which can be disabled by removing the OLP board. If the system needs a Raman amplifier unit,configure two RPC boards in the lower subrack. Note that the Raman amplification function andline protection function are exclusive.

Usually, the type V system does not need the DCM unit.

The configuration of the type IV system is similar to that of the type III system, except that theOA units of the type IV system are used in L band.

Configuration Principlel Configuration of Amplifier Unit

– Raman amplifier unit is to be used with the OAU.

– If the OAU, OBU and Raman amplifier unit are to be configured from west to east,install them at the left side (slot 1 or 3) of the standard subrack. If they are to beconfigured from east to west, install them at the right side (slot 12 or 10) of the standardsubrack.

– In an independent OLA, the OAU, OBU, and the Raman amplifier board from west toeast are on the left of the subrack (slot 1 and slot 3). The OAU, OBU, and the Ramanamplifier board from east to the west are on the right of the subrack (slot 10).

– If the power budget of the system is not adequate, the OBU can be used besides OAU.Install the OBU in slot 3 (from west to east) or slot 10 (from east to west).

– The OBU is preferential than the Raman amplifier unit when installed in the slots abovementioned. Raman amplifier units can also be installed in other idle slots.

l Configuration of SCC

Generally, the SCC board is required in the every subrack for processing the overhead andorderwire of the system.

l Configuration of Optical Supervisory Channel Unit

– If clock transmission for Ethernet (FE) data services is required, use the ST2. Otherwiseuse the SC2. Note that the ST2 cannot be used with the SC2.

– Slot 6 is preferred when you configure the board of supervisory channel unit.

l Configuration of Protection Group

The OLP is used for the purpose of optical line protection, but not used with the Ramanamplifier unit.

6.5 FOADMThe FOADM equipment adds/drops optical wavelength signals at the intermediate node.

6.5.1 Serial OADMThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OADM equipment in serial.

6.5.2 Parallel OADMThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OADM equipment in parallel.

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6.5.1 Serial OADMThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OADM equipment in serial.

Signal FlowIt consists of:

l Optical add/drop multiplexer (OADM)l Optical transponder unit (OTU)l Optical amplifier (OA)l Raman pump amplifier unit (RAU)l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/

OTC)l Fiber interface unit (FIU)l Dispersion compensation module (DCM)l Multi-channel spectrum analyzer unit (MCA)l System control & communication unit (SCC)l Power backup unit (PBU)

Figure 6-30 shows the signal flow of the serial OADM.

Figure 6-30 Signal flow of the serial OADM

FIU

FIU

OADMunit

OA

OAOA

OA

OTU

OTU

Westclient-sideequipment

OA

OA

C band

C band

L band

L band

OSC/OTC

MCA

West line fiber

East line fiber

λ1 λn

West East

OADMunit

OTU

OTU

λn λ1

East client-sideequipment

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The OADM unit in Figure 6-30 is formed by the MR2, and can support full add/drop at C band.

At the receive end, the RAU (optional), a low-noise pump amplifier, amplifies line opticalsignals. The FIU demultiplexes the line optical signals into service signals and supervisorysignal.

The supervisory signal is sent to the OSC/OTC for processing. The C-band service signals areadded/dropped some channels in the OADM. Note that the service signals may need to beamplified before they enter or after they go out of the OADM unit. The L-band service signalsare also amplified through the OA. Finally, C-band and L-band service signals are combinedwith supervisory signal and sent to the optical fiber.

Structure

In the case of each type of system, the function units of each type of serial OADM NEs consistof different boards or board groups.

NOTE

The type VI system is a long hop system with no need for the OADM.

In Figure 6-31, type I, type II C800G, type VII C960G and type VIII systems add/drop servicesonly in C_EVEN band. The OADM includes the ITL, which divides the service signals intoeven channels (C_EVEN) and odd channels (C_ODD). Through the MR2, the equipment adds/drops a maximum of 16 channels in C_EVEN band in west and east directions respectively.Thus, the OADM can add/drop a maximum of 32 channels locally.

Figure 6-31 Structure of the serial OADM in type I ,type II C800G, type VII C960G and typeVIIIsystem

ITL

ITL

OADMunit

OADM unit

FIU

FIU

C-ODD

C-EVEN

C-EVEN

OTU

OTU

OTU

OTU

C-ODD

C-EVEN

C-EVEN

EastWest

West Eastλ1 λn λn λ1

Westclient-sideequipment

East client-sideequipment

The C+L OADM does not include ITL. It supports full adding/dropping by cascading OADMunits. It can add/drop up to 32 channels. See Figure 6-32.

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Figure 6-32 Structure of the serial OADM in type II system (C+L 800G)

OADMunit

OADMunit

OADMunit

OADM unit

FIU

FIU

C-EVEN

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

C-EVENEastWest

West East

λ1 λn λn λ1

λ1 λn λn λ1

C-EVENC-EVEN

L-ODD

L-ODD

L-ODD

L-ODD

Westclient-sideequipment

East client-sideequipment

Westclient-sideequipment

East client-sideequipment

The OADM unit in type III and type V system does not include the ITL either. It can add/dropa maximum of 16 wavelengths in east and west directions respectively through the MR2 inC_EVEN band or the cascaded MR2s in C_EVEN band, as shown in Figure 6-33.

Figure 6-33 Structure of the serial OADM in type III and type V system

OADMunit

OADMunit

FIU

FIU

C-EVEN

C-EVEN

C-EVEN

C-EVEN

λ1

OTU

OTU

OTU

OTU

West Eastλn λn λ1

Westclient-sideequipment

East client-sideequipment

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The OADM unit in type IV system does not contain an ITL. It can add/drop a maximum of 16wavelengths in east and west directions respectively through the MR2 in L_ODD band or thecascaded MR2s in L_ODD band.

Typical ConfigurationTaking the type III system as an example, 16 channel services can be added/dropped at OADM(eight in east and another eight in west). Other wavelengths pass through. The configuration isshown in Figure 6-34.

Figure 6-34 Configuration of the C-band serial OADM equipment

Power

DCMHUB

OAU

(C)

OBU

(C)

FIU

SC2

SCC

FIU

OBU

(C)

OAU

(C)west east

eastsubrack

westsubrack

MB2

OTU

OTU

OTU

SCC

MB2

MR2

MR2

OTU

OTU

OTU

OTU

OTU

MB2

OTU

OTU

OTU

SCC

MB2

MR2

MR2

OTU

OTU

OTU

OTU

OTU

from westto east

If the system needs the Raman amplifier unit, the RAU is installed in the new subrack. If thesystem needs the optical line protection, two OLP boards are installed in the new subrack andcabinet.

If OTUs need centralized power protection, a PBU board must be configured in slot 13 of eachenhanced subrack holding OTUs. And all OTU boards are placed from left to right.

The configurations of OADM of other systems are similar to that of the type III system. For thetype I system, the ITL board and L-band OAU must be added.

For the type II system, the L-band OAU must be added for C+L 800G and the ITL board addedfor C 800G system.

For the type VII system, the ITL board must be added.

For the type IV system, the L-band OAU and OADM unit must be added.

For the type V system, the DCM is not needed.

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Configuration Principlel Configuration of Amplifier Unit

– C or L below the OAU, OBU, MCA, and ITL indicates their working bands.

– Raman amplifier unit is to be used with the OAU.

– Serial OADM: If the OAU, OBU, Raman amplifier unit and ITL are to be configuredfrom west to east, install them at the left side of the subrack. If they are to be configuredfrom east to west, install them at the right side of the subrack.

l Configuration of MR2If the number of MR2 boards configured to the system is more than four, respectivelyconfigure the boards to the west subrack and east subrack. If the number of MR2 boardsconfigured to the system is less than four, configure the westward MR2 and OTU on theleft side and the eastward MR2 and OTU on the right side.

l Configuration of SCCGenerally, the SCC board is required in every subrack for processing the overhead andorderwire of the system.

l Configuration of Optical Supervisory Channel Unit– If clock transmission for Ethernet (FE) data services is required, use the ST2. Otherwise

use the SC2. Note that the ST2 cannot be used with the SC2.– Slot 6 is preferential to configure the board of supervisory channel unit.

l Configuration of Protection GroupThe OLP is used for the purpose of optical line protection. It is exclusive with the Ramanamplifier unit in the configuration.

6.5.2 Parallel OADMThis section describes the signal flow, construction method, typical configurations, andconfiguration principles of the OADM equipment in parallel.

Signal FlowIt consists of:

l Optical transponder unit (OTU)

l Optical multiplexer (OM)

l Optical demultiplexer (OD)

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Dispersion compensation module (DCM)

l Multi-channel spectrum analyzer unit (MCA)

l System control & communication unit (SCC)

l Power backup unit (PBU)

Figure 6-35 shows the signal flow of the parallel OADM. (The 40-channel system is taken asan example.)

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Figure 6-35 Signal flow of the parallel OADM

OMOA

OA OA

OAOD

FIU

OSC/OTC

West line fiber

East line fiber

IN

OUT IN

OUT

λP

λPλP

λDλD

λAλA

λAλA

λP

λPλP

λDλD

OM

OD

λ1~40

λ1~40 λ1~40

λ1~40

FIU

MCA

OTU

OTU

OTU

OTU

West East

Westclient-sideequipment

East client-sideequipment

The parallel OADM is formed by back-to-back OTMs. The parallel OADM can add and dropchannels through the OD (for example D40) and the OM (for example M40) while regeneratingor passing through other channels.

When more than 32 add/drop channels are required in one station, the parallel OADM is usuallyused. In addition, it can be upgraded to 192 channels as needed.

Sturcture

In the case of each type of system, the function units of each type of parallel OADM NEs consistof different boards or board groups.

NOTE

The type VI system is a long hop system with no need for the OADM.

Type I systems, type II C 800G systems, type VII 96-wavelength systems, type VIII systemsand type IX systems have parallel OADMs in similar structures. Those systems need ITL boardsto multiplex and demultiplex signal wavelengths for adding and dropping of all servicewavelengths.

Figure 6-36 shows the structure of the OADM in the C800G system (type II system), which isused as an example in this manual for illustration. In addition to the adding and dropping of C-Band signals, type I systems need L-Band multiplexers and demultiplexers to add and dropservice wavelengths in two bands.

If extended band services need to be added or dropped in a type VII system, the cooperation ofM48 and D48 can be adopted to add and drop all the 96 service wavelengths.

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Type IX systems need ITL processing twice to multiplex and demultiplex service wavelengthswith 25 GHz spacing to add and drop all service wavelengths in C-Band.

NOTE

Parallel OADM equipment can be referred to as back-to-back OTMs. For structures of the parallel OADMsof various systems, refer to OTM part Structure.

Figure 6-36 Structure of the parallel OADM in type II system (C800G)

OM

OD

C-EVEN

λP

λPλP

λDλD λA

λA

λAλA

λPλP

λP

λD

λD

OM

OD

ITL

OTU

OTU

OTU

OTU

OM

OD

λP

λPλP

λDλD

λAλA

λAλA

λP

λPλP

λDλD

OM

OD

OTU

OTU

OTU

OTU

West

FIU

FIU

C-ODD

East

ITL

Westclient-sideequipment

East client-sideequipment

Westclient-sideequipment

East client-sideequipment

Type II C+L 800G systems, type III systems, type IV systems and type V systems have parallelOADMs in similar structures. Those systems do not need ITL boards to multiplex anddemultiplex signal wavelengths for adding and dropping of all service wavelengths.

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Figure 6-37 shows the structure of the OADM in the type III system.In addition to the addingand dropping of C-Band signals, type II C+L 800G systems need L-Band multiplexers anddemultiplexers to add and drop service wavelengths in two bands.

Type IV systems are L-Band systems and need L-Band multiplexers and demultiplexers to addand drop service wavelengths in L-Band.

Figure 6-37 Structure of the parallel OADM in type III system

OM

OD

FIU

λP

λPλP

λDλD

λAλA

λAλA

λP

λPλP

λDλD

OM

OD

FIU

OTU

OTU

OTU

OTU

West East

Westclient-sideequipment

East client-sideequipment

Typical ConfigurationTake the type III system as an example. 20 channels of services can be added/dropped at OADM(10 in east and 10 in west), and other wavelengths pass through. The configuration is shown inFigure 6-38.

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Figure 6-38 Configuration of the C-band parallel OADM equipment

OAU(C)

FIU

SC2

SCC

MCA

OAU(C)

Power

DCMHUB/1

West cabinet East cabinet

SCC

OTU

OTU

OTU

OTU

OTU

OTU

D40

OTU

SCC

OTU

M40

OTU

OTU

OAU(C)

FIU

SC2

SCC

OAU(C)

Power

DCMHUB/1

SCC

OTU

OTU

OTU

OTU

OTU

OTU

D40

OTU

SCC

OTU

M40

OTU

OTU

Configuration Principlel Configuration of Amplifier Unit

– C or L below the OAU, OBU, MCA, and ITL indicates their working bands.

– Raman amplifier unit is to be used with the OAU.

– As for the parallel OADM, the east and west boards are installed in different cabinets.The following principle is obeyed to place the optical amplifiers in the cabinets fortransmission in different directions: The optical amplifier in transmit direction shouldbe placed in the left part of a subrack, while the optical amplifier in the receive directionshould be placed in the right part of a subrack.

l Configuration of SCC

Generally, the SCC board is required in every subrack for processing the overhead andorderwire of the system.

l Configuration of Optical Supervisory Channel Unit

– If clock transmission for Ethernet (FE) data services is required, use the ST2. Otherwiseuse the SC2. Note that the ST2 cannot be used with the SC2.

– Slot 6 is preferential to configure the board of supervisory channel unit.

l Configuration of Protection Group

The OLP is used for the purpose of optical line protection. It is exclusive with the Ramanamplifier unit in the configuration.

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6.6 ROADMThe ROADM equipment dynamically adds/drops and cross-connects optical wavelength signalsat the intermediate node.

The ROADM consists of the following functional units:

l Optical add/drop multiplexer (OADM)

l Optical transponder unit (OTU)

l Optical multiplexer (OM)

l Optical demultiplexer (OD)

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Dispersion compensation module (DCM)

l Multi-channel spectrum analyzer unit (MCA)

l System control and communication unit (SCC)

l OTU power backup unit (PBU)

6.6.1 C400G system (WB mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WB mode) in the C400G system.

6.6.2 C400G system (WSS mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WSS mode) in the C400G system.

6.6.3 C800G system (WB mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WB mode) in the C800G system.

6.6.4 C800G system (WSS mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WSS mode) in the C800G system.

6.6.1 C400G system (WB mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WB mode) in the C400G system.

Signal FlowFigure 6-39 shows the signal flow of the ROADM with WB mode. (C400G system for example)

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Figure 6-39 Signal flow of the ROADM with WB mode

FIU

FIUDWC

OA

OAOA

OA

OTU

OTU

OSC/OTC

MCA

West line fiber

East line fiber

λ1~40

λ1~40

DWC

1 2λPλA

λPλA

λP

λP

λ1~40

λ1~40

OM

OTU

OTU

OD

OTU

OTU

OM

OTU

OTU

OD

λA λA λD λDλA λA λD λD

West East

Westclient-sideequipment

East client-sideequipment

λp: pass-through wavelength λA: added wavelength λD: dropped wavelength

The ROADM adds and drops any channel of the C-band in both directions by two cascadedDWCs.

From west to east, the No.1 DWC divides the signals into two same groups of multi-wave signals.One is to pass through and another is to be dropped.

The optical demultiplexer (OD) connect with No.1 DWC demultiplexes signals to be droppedinto single channels.

Channels to pass through enter the No.1 DWC. Then channels to be dropped are blocked. Thoseto pass through directly pass through.

Channels to be added are multiplex by the optical multiplexer (OM) of fixed wavelength (connectwith No.2 DWC). Then the signals enter the No.2 DWC and are multiplexed with the passingthrough multi-wave signals. Finally, the multiplexed signals enter the amplifier and reach theline end.

Signals from east to west are the same.

Sturcture

Type III C 400G systems adopt DWC boards to add and drop wavelengths with 100 GHz spacingin C EVEN band. Figure 6-40 show the structure of a C 400G system ROADM.

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Figure 6-40 Structure of the ROADM in C 400G system (WB mode)

DWC

C band

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

FIU

FIU

DWC

C band

C band

C band

Westclient-sideequipment

East client-sideequipment

Typical ConfigurationTaking the 40-channel type III system for example, 20 channels are added/dropped in the OADMstation, 10 channels for east and another 10 for west. The other channels pass through. Figure6-41 shows the typical configuration of WB mode.

Figure 6-41 Typical configuration of C-band of the ROADM (type III system, WB mode)

DWC

OAU(C)

FIU

SC2

SCC

MCA

OAU(C)

Power

DCMHUB/1

West cabinet East cabinet

SCC

OTU

OTU

OTU

OTU

OTU

V40

SCC

OTU

O

UT

OTU

D40

OTU

OTU

DWC

OAU(C)

FIU

SC2

SCC

OAU(C)

Power

SCC

OTU

OTU

OTU

OTU

OTU

V40

SCC

OTU

O

UT

OTU

D40

OTU

OTU

DCM

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Configuration Principlel Configuration of Amplifier Unit

– C or L below the OAU, OBU, MCA, and ITL indicates their working bands.

– Raman amplifier unit is to be used with the OAU.

– As for the ROADM, the east and west boards are installed in different cabinets. Thefollowing principle is obeyed to place the optical amplifiers in the cabinets fortransmission in different directions: The optical amplifier in transmit direction shouldbe placed in the left part of a subrack, while the optical amplifier in the receive directionshould be placed in the right part of a subrack.

l Configuration of SCCGenerally, the SCC board is required in every subrack for processing the overhead andorderwire of the system.

l Configuration of Optical Supervisory Channel Unit– If clock transmission for Ethernet (FE) data services is required, use the ST2. Otherwise

use the SC2. Note that the ST2 cannot be used with the SC2.– Slot 6 is preferential to configure the board of supervisory channel unit.

l Configuration of Protection GroupThe OLP is used for the purpose of optical line protection. It is exclusive with the Ramanamplifier unit in the configuration.

6.6.2 C400G system (WSS mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WSS mode) in the C400G system.

Signal FlowFigure 6-42 shows the signal flow of the ROADM realized by the WSS mode (C400G systemfor example).

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Figure 6-42 Signal flow of the ROADM with WSS mode 1

WSM9WSD9OA

OA

OA

OA

OTU

OTU

OTU

OTU

OM OD

WSM9

OTU

OTU

OTU

OTU

OTU

OTU

OSC/OTC

OTU

OTU

OTU

WSD9

OTU

OTU

OTU

West line fiber

East line fiber

FIU

FIU

OD OM

λP

λP

λA λA λA

λAλAλA

λA

λAλD

λDλD

λDλD

λD

λD λD

MCA

West East

Westclient-sideequipment

East client-sideequipment

Westclient-sideequipment

East client-sideequipment

λP: pass-through wavelength λA: added wavelength λD: dropped wavelength

In the direction from west to east, as for the west input signals, the wavelength selective switchdivision unit (WSD9) selects to let the signals pass through or just drop the signals through theoptical switch. The wavelength to be dropped can be output at any output interface after passingthrough the WSD9. After equilibrium, the pass-through signals can directly pass through theWSD9. The wavelength to be output eastward is added through the input interface of thewavelength selective switch multiplexer unit (WSM9). The added signals are multiplexed withthe pass-through multi-wave signals. Then all the signals enter the power amplifier and are outputto the line end.

As for the signals transmitted from east to west, ROADM is realized in the same way. The fourcascaded WSM9/WSD9 boards can realize add and drop of wavelengths in east and westdirections.

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NOTE

l A WSM5/WSD5 board with the channel spacing of 50 GHz has four optical interfaces to add/dropwavelengths. A WSM9/WSD9/RMU9 board with the channel spacing of 100 GHz has eight opticalinterfaces to add/drop wavelengths. One interface used for adding/dropping wavelengths can add/dropone or more than one arbitrary wavelength at the same time.

l For the E1WSD5 board, except for the DM4 optical interface, when other optical interfaces used fordropping wavelengths only drop one wavelength, the demultiplexer board needs to be configured beforethe optical interface is connected to the OTU.

l The demultiplexer board needs to be configured before the DM4 optical interface of the E1WSD9 isconnected to the OTU.

l For structure of the ROADM station by the WSD9 and RMU9 boards, only replace the WSM9 boardin the diagram with the RMU9 board. The TOA optical interface of the RMU9 can be cascaded withthe OAU to amplify the added optical signals. If the OAU is not needed, directly input the opticalsignals to the ROA optical interface by the fiber jumper.

Figure 6-43 Signal flow of the ROADM with WSS mode 2

FIU

FIUWSMD4

OA

OAOA

OA

OTU

OTU

OSC/OTC

MCA

West line fiber

East line fiber

λ1~40

λ1~40

WSMD4

1 2λPλA

λPλA

λP

λP

λ1~40

λ1~40

OM

OTU

OTU

OD

OTU

OTU

OM

OTU

OTU

OD

λA λD λA λD

West East

OTU

OTU

OTU

OTU

Westclient-side equipment

East client-side equipment

λP: pass-through wavelength λA: added wavelength λD: dropped wavelength

The ROADM uses two WSMD4s to add/drop any service in any channel of the two directionsat C band.

In the direction from west to east, the signals from west are input to WSMD4 board 1 for opticaldemultiplexing. The demultiplexed signals are output through the pass-through and dropinterfaces. The drop wavelengths can be output through one output interface of thedemultiplexing board that is accordingly configured. Each add wavelength to be output to eastis added through an input interface selected by an optical switch on WSMD4 board 2. Such addwavelengths are multiplexed with the pass-through multi-wavelength signals into one

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multiplexed signal. This signal is input to an optical amplifier, the amplified signal is output tothe line side.

The realization of the ROADM function in the signal flow from east to west is the same as thatfrom west to east. Two WSMD4s are cascaded to add/drop any 40 wavelengths in the east andwest directions.

NOTE

The drop and pass-through interfaces of the WSMD4 board output four equal multiplexed optical signals.In the drop channel, even when there is only one wavelength signal, the WSMD4 need be connected to ademultiplexing board and then to the OTU.

StructureType III C 400G systems adopt WSD9/WSM9/RMU9/WSMD4 boards to add and dropwavelengths with 100 GHz spacing in C EVEN band. Figure 6-44, Figure 6-45, Figure 6-46and Figure 6-47 show the structure of a C 400G system ROADM.

Figure 6-44 Structure of the ROADM in C 400G system (WSS mode 1)

WSD9 WSM9C band

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

FIU

FIU

WSM9 WSD9C band

C band

C band

Westclient-sideequipment

East client-sideequipment

NOTE

The combination of the WSD9 and WSM9 boards or the combination of the WSD9 and RMU9 boards canbe chosen to form the ROADM station. The structure in two modes is the same. The structure diagramsFigure 6-44 take the combination of the WSD9 and WSM9 boards as an example. For structure of theROADM station by the WSD9 and RMU9 boards, only replace the WSM9 board in the diagram with theRMU9 board.

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Figure 6-45 Structure of the ROADM in C 400G system (WSS mode 2)

WSD9 RMU9C band

EastWest

FIU

FIU

WSD9C band

C band

C band

WSD9C band

FIU

FIUWSD9

C band

C band

C band

South North

RMU9

RMU9

RMU9

Figure 6-46 Structure of the ROADM in C 400G system (WSS mode 3)

WSMD4

C band

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

FIU

FIU

WSMD4

C band

C band

C band

Westclient-sideequipment

East client-sideequipment

NOTE

The structure of the ROADM unit of the WSMD2 board is the same as that of the WSMD4 board.

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Figure 6-47 Structure of the ROADM in C 400G system (WSS mode 4)

WSMD4 WSMD4

C band

EastWest

FIU

FIUC band

C band

C band

WSMD4

C band

FIU

FIU

C band

C band

C band

South North

WSMD4

Typical ConfigurationTaking the 40-channel type III system for example, 20 channels are added/dropped in the OADMstation, 10 channels for east and another 10 for west. The other channels pass through. Figure6-48 shows the typical configuration of WSS mode.

Figure 6-48 Typical configuration of C-band of the ROADM (type III system, WSS mode 1)

WS

9

OAU(C)

FIU

SC2

SCC

MCA

OAU(C)

WS

9

Power

DCMHUB/1

West cabinet East cabinet

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

M D

WS

9

OAU(C)

FIU

SC2

SCC

OAU(C)

WS

9

Power

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

M D

DCM

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The type III 40-channel system is considered an example. Figure 6-49 and Figure 6-50 illustratethe typical configuration for the four-dimensional grooming. In this example, the OADM stationadds/drops 40 wavelengths, 10 of which are distributed in east, west, south and northrespectively. Wavelength grooming exists in each direction. Figure 6-49 illustrate the typicalconfiguration of the station from east to west, and Figure 6-50 illustrate the typical configurationof the station from south to north.

Figure 6-49 Typical configuration of C-band of the ROADM (type III system, WSS mode 2,from east to west)

OAU(C)

FIU

SCC

OAU(C)

WS

9

Power

DCMHUB/1

West cabinet East cabinet

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

D

OAU(C)

FIU

SC2

SCC

OAU(C)

WS

9

Power

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

D

SC2

SC1

RM

9U

MCA

RM

9U

DCM

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Figure 6-50 Typical configuration of C-band of the ROADM (type III system, WSS mode 2,from south to north)

OAU(C)

FIU

SCC

OAU(C)

WS

9

Power

DCMHUB/1

South cabinet North cabinet

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

D

OAU(C)

FIU

SC2

SCC

OAU(C)

WS

9

Power

SCC

OTU

OTU

OTU

OTU

SCC

OTU

O

UT

OTU

D40

OTU

OTU

M40

OTU

D

SC2

SC1

RM

9U

MCA

RM

9U

DCM

Configuration Principlel Configuration of Amplifier Unit

– C or L below the OAU, OBU, MCA, and ITL indicates their working bands.

– Raman amplifier unit is to be used with the OAU.

– As for the ROADM, the east and west boards are installed in different cabinets. Thefollowing principle is obeyed to place the optical amplifiers in the cabinets fortransmission in different directions: The optical amplifier in transmit direction shouldbe placed in the left part of a subrack, while the optical amplifier in the receive directionshould be placed in the right part of a subrack.

l Configuration of SCC

Generally, the SCC board is required in every subrack for processing the overhead andorderwire of the system.

l Configuration of Optical Supervisory Channel Unit

– If clock transmission for Ethernet (FE) data services is required, use the ST2. Otherwiseuse the SC2. Note that the ST2 cannot be used with the SC2.

– Slot 6 is preferential to configure the board of supervisory channel unit.

l Configuration of Protection Group

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The OLP is used for the purpose of optical line protection. It is exclusive with the Ramanamplifier unit in the configuration.

6.6.3 C800G system (WB mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WB mode) in the C800G system.

Signal FlowFigure 6-39 shows the signal flow of the ROADM with WB mode. In the case of the C800Gsystem, just replace the DWC board shown in the figure with the EDWC board.

SturctureA type II C800G system adopts the EDWC boards to add and drop C-band wavelengths with50 GHz channel spacing. Figure 6-51 show the structure of the ROADM in a C800G system.

Figure 6-51 Structure of the ROADM in a C 800G system (WB mode)

EDWC

C band

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

FIU

FIU

EDWC

C band

C band

C band

Westclient-sideequipment

East client-sideequipment

Typical ConfigurationFor the typical configuration of the WB-mode ROADM equipment in the C800G system, referto Figure 6-41. Just replace the DWC board shown in the figure with the EDWC board.

Configuration PrincipleThe board configuration principles of the boards of the WB-mode ROADM equipment in theC800G system are the same as those in the C400G system.

6.6.4 C800G system (WSS mode)This section describes the signal flow, structure, typical configuration and configurationprinciples of the ROADM equipment (WSS mode) in the C800G system.

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Signal Flow

Figure 6-42 shows the signal flow of the ROADM with WSS mode. In the case of the C800Gsystem, just replace the WSD9 board shown in the figure with the WSD5 board, and the WSM9with the WSM5.

Structure

A type II C 800G system adopts the WSD9/WSM9/WSD5/WSM5/RMU9 boards to add anddrop wavelengths with 50 GHz spacing in C-Band. The system can also combines the C_EVEN-and C_ODD-band WSMD4s to add and drop C-band wavelengths with 50 GHz channel spacing.Figure 6-52, Figure 6-53 and Figure 6-54 show the structure of the ROADM in C 800G system.

Figure 6-52 Structure of the ROADM in a C 800G system (WSS mode 1)

WSD5 WSM5C band

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

FIU

FIU

WSM5 WSD5C band

C band

C band

Westclient-sideequipment

East client-sideequipment

Figure 6-53 Structure of the ROADM in a C 800G system (WSS mode 2)

WSD5 WSM5C band

EastWest

FIU

FIU

WSD5C band

C band

C band

WSD5C band

FIU

FIUWSD5

C band

C band

C band

South North

WSM5

WSM5

WSM5

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NOTE

l The combination of the WSD5 and WSM5 boards or the combination of the WSD5 and RMU9 boardscan be chosen to form the ROADM station. The structure in two modes is the same. The structurediagrams in this section take the combination of the WSD5 and WSM5 boards as an example. Forstructure of the ROADM station by the WSD5 and RMU9 boards, only replace the WSM5 board inthe diagram with the RMU9 board.

l Based on the actual network situation, you can select the WSD9+WSM9 or WSD9+RMU9 combinationto form an ROADM station. The structures of the two schemes are the same. This section considersthe WSD5+WSM5 combination as an example.

l If the ROADM station is formed by the WSD9+RMU9 combination, just replace the WSM5 shownin the figure with the RMU9, and the WSD5 the WSD9.

l If the ROADM station is formed by the WSD9+WSM9 combination, just replace the WSM5 shownin the figure with the WSM9, and the WSD5 the WSD9.

Figure 6-54 Structure of the ROADM in a C 800G system (WSS mode 3)

WSMD4 WSMD4

C EVEN

OTU

OTU

OTU

OTU

EastWest

λ1 λn λn λ1

ITL

FIU

ITL

FIU

C EVEN

C EVEN C EVEN

WSMD4 WSMD4

C ODD C ODD

C ODD C ODD

Westclient-sideequipment

East client-sideequipment

NOTE

The structure of the ROADM unit of the WSMD2 board is the same as that of the WSMD4 board.

Typical Configuration

For the typical configuration of the WSS-mode ROADM equipment in the C800G system, referto Figure 6-41. In that case, just replace the WSD9 board shown in the figure with the WSD5board, and the WSM9 with the WSM5.

Configuration Principle

The board configuration principles of the boards of the WSS-mode ROADM equipment in theC800G system are the same as those in the C400G system.

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6.7 REGThe REG equipment is an electrical regenerator and is used to further extend the opticaltransmission distance.

Signal Flow

We have already discussed that the OLA can extend the optical transmission distance withoutregeneration. However, when the distance is longer, such factors as dispersion, optical noise,non-linear effect, or PMD will affect the transmission performance. In this case, we need toregenerate the original signals. An REG implements the 3R function: reshaping, re-timing andregenerating. This is to improve the signal quality and to extend the transmission distance.

An REG station contains:

l Optical transponder unit (OTU)

l Optical multiplexer (OM)

l Optical demultiplexer (OD)

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Multi-channel spectrum analyzer unit (MCA)

l System control & communication unit (SCC)

l Power backup unit (PBU)

Figure 6-55 shows the block diagram of the REG signal flow.

Figure 6-55 REG signal flow

OM

OTU01

OTU02

OTUn

OTU01

OTU02

OTUn

λ01

λ02

λn

OD OA

OA

FIU

DCM

DCM

East line fiber

MCAλ01

λ02

λn

OM

ODOA

DCM

OA

DCM

FIU

OSC/OTC

West line fiber

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The signal flow of the REG is similar to that of back-to-back OTMs, except that no signal isadded/dropped. Signals are regenerated through the regenerating OTU.

StructureFor the eight systems of the system where the electrical regeneration is needed, each functionalunit of the systems consists of boards of different types or a combination of the boards of thesame type.

The structure of the OM, OD, and OA of the eight systems is the same as that of the OTMequipment.

Typical ConfigurationThe configuration of the REG is basically equivalent to that of two back-to-back OTMs,following the same configuration rule.

Difference:

l The REG needs to be configured with a bidirectional OSC/OTC.

l The REG needs to be configured with two FIU boards.

l The REG needs the regenerating OTU.

The configuration of the REG of 20-channel application in type III system is the same as thatshown in Figure 6-38.

Configuration PrincipleThe configuration principle of the REG is the same as that of the OTM.

6.8 OEQIn the ELH system the OEQ equipment need be configured to realize optical power equalizationand dispersion compensation.

In the extra long haul (ELH) application, as the transmission distance without the regenerator ismuch longer than that in the long haul application, the following problems may occur.

l Accumulation of non flatness of optical amplifier gain spectrum and fiber attenuationspectrum causes disequilibrium of both the optical power and signal-to-noise ratio at thereceive end.

l The dispersion slope of DCM does not match with optical fibers completely. As a result,all wavelengths cannot be compensated completely, and the dispersion at the receive endfails to meet the requirement of the system.

The OEQ equipment consists of the optical power equalizer and the dispersion equalizer.

6.8.1 Optical Power EqualizerThis section describes the signal flow, structure, typical configuration and configurationprinciples of the optical power equalizer.

6.8.2 Optical Dispersion EqualizerThis section describes the signal flow, structure, typical configuration and configurationprinciples of the optical dispersion equalizer.

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6.8.1 Optical Power EqualizerThis section describes the signal flow, structure, typical configuration and configurationprinciples of the optical power equalizer.

Signal FlowOptical power equalizer consists of:

l Optical power equalizer (OPE)

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Multi-channel spectrum analyzer unit (MCA)

l System control & communication unit (SCC)

Figure 6-56 shows the signal flow of the optical power equalizer.

Figure 6-56 Signal flow of optical power equalizer

FIU

OA

OA

OPE

OPE

OSC/OTC

OA

OA

FIU

West line fiber

East line fiber

MCA

StructureTwo solutions are available: use of the dynamic gain equalizer unit (DGE) and use of the VMUXunit, as shown in Figure 6-57 and Figure 6-58.

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Figure 6-57 Optical power equalization through the DGE

FIU

MCA

OAU

DGE+DCM

OAU

DGE+DCM

FIU

C-EVEN

C-EVEN

DGE: Dynamic gain equalizerunit

OAU: Optical amplifier unit DCM: Dispersion compensationmodule

FIU: Fiber interface unit SC2: Bidirectional opticalsupervising channel unit

As shown in Figure 6-57, the optical power equalizer unit consists of the DGE and DCM. TheDGE realizes optical power equilibrium of each channel by adjusting insertion loss spectrum ofthe DGE board. The DCM is used to realize dispersion compensation of the system.

This solution has all the functions of the OLA. In addition, optical power equilibrium isimplemented to make the multiplexed signals meet the requirement for optical power flatness,and to extend the transmission distance without regeneration.

CAUTIONFor DGE solution, note whether the power margin of the OAU meets the insertion lossrequirement of the DCM and the DGE. If the margin cannot meet the requirement, OAU+OBUshould be adopted. DCM and DGE are placed between two amplifiers.

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Figure 6-58 Optical power equalization through the VMUX (the V40 board)

OBU

OAU D40

V40

V40

D40

OBU

OAU

FIU

FIU

C-EVEN

C-EVEN

V40: 40-channel multiplexing unitwith VOA

D40: 40-channel demultiplexing unit OBU: Optical booster unit

FIU: Fiber interface unit SC2: Bidirectional optical supervisorychannel unit

OAU: Optical amplifier unit

In Figure 6-58, the VMUX is adopted. The V40 is used as the VMUX unit to adjust opticalpower of each channel, so as to equalize optical power.

The user can select one of the solutions according to the actual requirement.

NOTE

In ultra-long haul transmission, the configuration of the optical equalizer should follow the principlesbelow.

l In the case of "8 ≤ number of optical amplification sections ≤ 12", and without configuration of theOEQ, the VMUX must be configured at the transmit end for equalization.

l In the case of "number of optical amplification sections ≥ 12", the OEQ must be configured. Thesubsequent optical amplification sections will be configured differently according to OEQ solution.

l D40+V40/D48/V48 solution: An OEQ is added when 8 optical amplification sections are added.

l DGE solution: An OEQ is added when 5 optical amplification sections are added.

Typical ConfigurationFigure 6-59 shows the configuration of the optical power equalizer in the type III system.

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Figure 6-59 Configuration of optical power equalizer

Power

DCMHUB

MCA

SCC

OAU

DGE

FIU

SC2

SCC

FIU

DGE

OAU

Power

DCMHUB

V40

MCA

SCC

V40

OAU

OBU

FIU

SC2

SCC

FIU

OBU

OAU

D40

D40

Solution 1: DGE Solution 2: V40+D40

(C) (C) (C) (C)

(C)

(C) (C)

(C)

Configuration PrincipleThe configuration principles of the OEQ is the same as that of the OLA.

6.8.2 Optical Dispersion EqualizerThis section describes the signal flow, structure, typical configuration and configurationprinciples of the optical dispersion equalizer.

Signal FlowDispersion equalizer consists of:

l Dispersion equalizer (DE)

l Optical amplifier (OA)

l Optical supervisory channel unit or supervisory channel and timing transmission unit (OSC/OTC)

l Fiber interface unit (FIU)

l Dispersion compensation module (DCM)

l Multi-channel spectrum analyzer unit (MCA)

l System control & communication unit (SCC)

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Figure 6-60 shows the signal flow of dispersion equalizer.

Figure 6-60 The signal flow of dispersion equalizer

FIU

OA

OA

DE

DE

OA

OA

FIU

West line fiber

East line fiber

MCA

OSC/OTC

The dispersion equalizer and the optical power equalizer can be placed in the same station. Thedispersion equalizer is often placed at the receive end of the OTM for dispersion equalization,as shown in Figure 6-61. It is suggested that you place it at the receive end of the last station inthe optical multiplexing section.

Figure 6-61 Signal flow of dispersion equalizer in OTM

OM

OTU01

OTU02

OTUn

OTU01

OTU02

OTUn

λ01

λ02

λn

λ01

λ02

λn

Client-side equipm

ent

OD OA

OA

FIUOSC/OTC

DCM

DE

MCA

RPU

East line fiber

StructureThe dispersion equalizer realizes equalized compensation of dispersion for multiplexed signals,as shown in Figure 6-62.

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Figure 6-62 Composition of dispersion equalizer

OAU

OBU OAU

OBUDSE

DSE

DCM

DCM

FIU

FIU

DSE: Dispersion slope equalizer unit OAU: Optical amplifier unit OBU: Optical booster unitSC2: Bidirectional optical supervisingchannel unit

FIU: Fiber interface unit DCM: Dispersion compensation module

With the dispersion slope equalizer (DSE), the system sends the multiplexed signals to the DCMfor equalized compensation for dispersion.

NOTE

In ultra-long haul transmission, the configuration of the optical equalizer should follow the principlesbelow.

Dispersion equalization : Dispersion equalization is needed when DRZ technologies are adopted in G.655fibers. For DRZ technology, DSE is needed when the system distance is longer than 1500 km (932 mi.).

Typical ConfigurationFigure 6-63 and Figure 6-64 show the configuration of the dispersion equalizer in the type IIIsystem.

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Figure 6-63 Configuration of dispersion equalizer

Power

DCMHUB

SCC

OAU

OBU

DSE

SC2

SCC

DSE

OBU

OAU

MCA

FIU

FIU

(C)(C)(C)(C)

(C)

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Figure 6-64 Configuration of dispersion equalizer in the independent OLA subrack

DCM

SCC

FIU

FIU

MCA

(C)

BO

U(C)

PMU

OBU

(C)

OAU

DSE

SC2

SCC

DSE

AU(C)(C)

O PMU

Configuration PrincipleThe configuration principles of the OEQ is the same as that of the OLA.

The OEQ (DGE and DSE) is inserted following "west on the left and right on the east".

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7 Protection

About This Chapter

System provides equipment level protection and network level protection.

7.1 Equipment Level ProtectionThe system offers three types of equipment level protection: DC input protection, secondarypower protection and centralized power protection for OTUs.

7.2 Network Level ProtectionThe system offers six types of network level protection: optical line protection, inter-boardwavelength protection, inter-subrack 1+1 optical channel protection, 1+1 wavelength protectionat client, wavelength cross-connection protection and 1:N (N≤8) optical channel protection.

7.3 Network Management ChannelThe system provides protection of network management information channel andinterconnection of network management information.

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7.1 Equipment Level ProtectionThe system offers three types of equipment level protection: DC input protection, secondarypower protection and centralized power protection for OTUs.

7.1.1 DC Input ProtectionThe system provides input power protection.

7.1.2 Secondary Power ProtectionThe system provides secondary power protection for some boards.

7.1.3 Centralized Power ProtectionThe system provides distributed power supply and centralized protection for the secondarypower of the OTU board.

7.1.1 DC Input ProtectionThe system provides input power protection.

The power supply system supports two –48 V/–60 V DC power inputs for mutual backup.Therefore, the equipment keeps running normally in case either of the two DC inputs is faulty.

7.1.2 Secondary Power ProtectionThe system provides secondary power protection for some boards.

Some boards adopt two power modules for 1+1 power hot backup to avoid system breakdownby the damage of one power module. For the boards supporting this function, refer to theHardware Description.

7.1.3 Centralized Power ProtectionThe system provides distributed power supply and centralized protection for the secondarypower of the OTU board.

The system uses power backup unit (PBU) to provide centralized power protection for thesecondary power of all OTUs on each subrack, including:

l +3.3 V power supply of the OTU

l +5 V power supply of the OTU

l –5.2 V power supply of the OTU

When detecting the power of the OTU fails (under/above-voltage), the system switches to thePBU for power supply in 600μs. The PBU can supply power for two OTUs at the same time.

The PBU is inserted in slot 13 in a enhanced subrack, providing power backup for all OTUs inthe subrack, as shown in Figure 7-1.

7 Protection

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Figure 7-1 Centralized power protection for OTUs in enhanced subrack

SCC

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Centralized power protection

PBU

Enhanced subrack

7.2 Network Level ProtectionThe system offers six types of network level protection: optical line protection, inter-boardwavelength protection, inter-subrack 1+1 optical channel protection, 1+1 wavelength protectionat client, wavelength cross-connection protection and 1:N (N≤8) optical channel protection.

The system provides various service protection schemes, as shown in Table 7-1.

Table 7-1 Protection types and solutions

Protection Type Solution (Name on the T2000)

Optical line protection Optical line protection

Optical channel protection Inter-board wavelength protection

Inter-subrack 1+1 optical channel protection

1+1 wavelength protection at client

WXCP Protection Wavelength cross-connection protection

1:N (N≤8) optical channelprotection

1:N (N≤8) optical channel protection

7.2.1 Overview

7.2.2 Optical Line Protection

7.2.3 1+1 Wavelength Protection at Client

7.2.4 Inter-Board Wavelength Protection

7.2.5 Inter-Subrack 1+1 Optical Channel Protection

7.2.6 WXCP

7.2.7 1:N Optical Channel Protection

7.2.1 Overview

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Table 7-2 shows the different types of network level protection. The user can choose one ofthem according to the actual application.

Table 7-2 Network level protection types supported by the system

ProtectionType Switching Precondition

RestorationType

SwitchingProtocol

Optical lineprotection

It protects the entire fiber line. Non-revertiveRevertive

None

Inter-boardwavelengthprotection

It provides 1+1 channel protection for singlewavelengths. The working OTU and the protectionOTU should be in the same subrack.

Non-revertiveRevertive

None

Inter-subrack1+1 opticalchannelprotection

For the OTU board with service convergencefunction, it provides 1+1 protection for services ona single client side. The working OTU and theprotection OTU can be in different subracks.For the OTU board without service convergencefunction, it provides 1+1 channel protection forsingle wavelengths. The working OTU and theprotection OTU can be in different subracks.

Non-revertiveRevertive

None

1+1wavelengthprotection atclient

An OTU board with convergence and reversemultiplexing function can protect a single client-sideservice. It is acceptable that the OTU board does notsupport cross-connection.

Non-revertiveRevertive

None

WXCPprotection

l An OTU board with convergence and cross-connection function can provide cross-connectionand protect for a single client-side service.

l Two-source one sink mode does not require anySCS board. The OTU board needs to supportcross-connection and to meet the requirement ofslot configuration. The switching is fast.

l Two-source two-sink mode requires SCS board.In some networking modes, cross connectionprotection can be realized when the OTU boarddoes not meet the requirement of slotconfiguration. a

Non-revertiveRevertive

None

1:N (N≤8)opticalchannelprotection

One wavelength channel can realize 1: N protectionfor N channels.

Revertive

APSprotocol

a: For the working principles and applications of the two-source one sink mode and the two-source two-sink mode, refer to 7.2.6 WXCP.

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Protection Mode

The system supports the following protection modes:

l One general OTU and one OTU with the SuperWDM function form a protection group ofmutual backup. Such OTU pairs are listed as follows:LWF, LWFS; LBE, LBES; LBF, LBFS; LOG, LOGS; ELOG, ELOGS; LOM, LOMS;IMX4, IMX4S; TMX, TMXS; ETMX, ETMXS.

l Two OTUs of different types form a protection group of mutual backup. Such OTU pairsare listed as follows:FDG, LDG; LBE, LBF; LBE, LBFS; LBES, LBF; LBES, LBFS; ELOG, LOG; ELOG,LOGS; ELOGS, LOG; ELOGS, LOGS; LWF, LBF; LWF, LBFS; LWFS, LBF; LWFS,LBFS.

Protection Switching Triggering Condition

There are five protection switching commands, clear switching, locked switching, forcedswitching, automatic switching and manual switching, arranged by priority from high to low.

Automatic switching is automatically triggered by the system upon internal switchingconditions. Locked switching, forced switching and manual switching are externally issued onthe T2000 as means to test and maintain the system. A clear switching command can be issuedon the T2000 to clear the preceding three external switching commands.

NOTE

The priorities of the protection switching functions are as follows:

l A protection switching fails to carry out if another protection switching of higher priority is in process.

l A protection switching succeeds to carry out if only the protection switching of lower priority is inprocess and the protection switching of lower priority is cleared.

l Protection switching commands of the same priority cannot be carried out at the same time. The currentcommand must be cleared before the desired command is issued.

When the system is in the automatic switching state, a clear switching command cannot be issued. Whenthe system is in the wait-to-restore (WTR) state, however, externally issuing a clear switching commandcan end the WTR state at once and services are switched back to the working channel.

The protection switching commands are described as follows:

NOTE

The working mode can be set to either revertive mode or non-revertive mode.

l Revertive mode: If services are switched from the working channel to the protection channel, theservices are switched back to the working channel when a certain WTR time taken to confirm that theworking channel is still normal after restoration.

l Non-Revertive mode: If services are switched from the working channel to the protection channel, theservices remain working in the protection channel when the working channel is restored. The servicesare switched back to the working channel only when a fault occurs in the protection channel.

l Automatic switchingIf the working channel is faulty while the protection channel is normal, the services areswitched from working channel to the protection channel. If both channels are faulty, theservices remains in the channel to which the fault occurs in a later time.

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l Locked switching

This protection switching command locks the services on the working channel, no matterthe working or protection channel is normal or not.

l Forced switching

Services are switched from the current one channel to the other regardless whether theworking and protection channels functions normally. Services are either forcibly switchedfrom the working channel to the protection channel or from the protection channel to theworking channel.

l Manual switching

A manual switching command is issued to manually switch services from the workingchannel to the protection channel or from the latter to the former. Because the priority ofmanual switching is lower than that of automatic switching, the manual switching is validonly when both the working and protection channels are normal.

l Clear switching

A clear switching command is issued to clear any of the preceding three external commandsor clear the WTR time of automatic switching state. After a clear switching command isissued, the system re-determines the working channel and protection switching state uponthe states of the working and protection channels and the restoration mode set for theprotection group.

NOTE

l The automatic switching can be triggered by SD or SF conditions. The SF is the switching conditionof the system by default. You can enable/disable the SD switching condition when creating theprotection group through the T2000.

l In the revertive mode, the forced switching and manual switching can switches services only from theworking channel to the protection channel.

l In the revertive mode, when both the working and protection channels are normal services are switchedback to the working channel after a clear switching command is issued.

l In the non-revertive mode, when both the working and protection channels are normal, after a clearswitching command is issued, services remain working in the channel before the command is issued.

l When both the working and protection channels are faulty, services remain working in the originalchannel after a clear switching command is issued.

l When the SCC is reset, the external switching command is cleared and the switch state is the automaticswitching control state. At that time, if the working and protection channels are normal or faulty, theservices works in the working channel. If the working channel is faulty and the protection channel isnormal, the services works in the protection channel.

Protection Switching Status

Table 7-3 lists the corresponding relations of switching states and channel states of the systemin T2000.

Table 7-3 Corresponding relations of switching states and channel states of the system

Switching State Channel StateService OperatingChannel

Idle The working and protection channelsare normal.

Working channel

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Switching State Channel StateService OperatingChannel

Idle (the protectionchannel is working)

The working and protection channelsare normal.

Protection channel

SF (SD) Switching The working channel is normal and theprotection channel is faulty.

Working channel

Auto Switching The working channel is faulty and theprotection channel is normal.

Protection channel

The working and protection channelsare faulty.

Channel in which thefault occurs in a latertime

Lockout No matter the working and protectionchannels are normal or not.

Working channel

Forced Switchinga No matter the working and protectionchannels are normal or not.

Protection channel

Manual Switchinga The protection channel must benormal.

Protection channel

Forced to Workingb No matter the working and protectionchannels are normal or not.

Working channel

Forced to Protectionb No matter the working and protectionchannels are normal or not.

Protection channel

Manual to Workingc The working channel must be normal. Working channel

Manual to Protectionc The protection channel must benormal.

Protection channel

a: When the working mode is revertive, services can be switched only from the workingchannel to the protection channel in the forced switching or the manual switching mode.b: In the non-revertive mode, the two switching commands for forced switching have the samepriority. If one command is issued, the other command cannot be issued. The current commandmust be cleared before the new switching command is issued.c: In the non-revertive mode, the two switching commands for manual switching have thesame priority. If one command is issued, the other command cannot be issued. The currentcommand must be cleared before the new switching command is issued.

7.2.2 Optical Line Protection

FunctionalityThe optical line protection scheme adopts two pairs of fibers, one pair as the working path andthe other as the protection path, to protect the line signals.

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Related Boards

Table 7-4 lists the boards used to achieve the optical line protection.

Table 7-4 Boards used to achieve the optical line protection

Board Name Function

E2OLP03 Splits and couples the line signals.Detects the optical power.Performs the switching when detecting abnormal optical signals.

Trigger Conditions

The trigger conditions for the optical line protection automatic switching are as follows:

l An MUT_LOS alarm occurs.

l The power difference between the working and the protection channels exceeds thethreshold (5 dB) and causes POWER_DIFF_OVER alarm.

For the description of MUT_LOS alarm, refer to the OptiX BWS 1600G Backbone DWDMOptical Transmission System Alarm and Performance Reference.

Working Principle

This protection scheme adopts dual-fed signal selection and unidirectional switching. As shownin Figure 7-2 and Figure 7-3, the RI1 and TO1 optical ports are connected by the working linefibers, and the RI2 and TO2 optical ports are connected by the protection line fibers.

For the description of the working principle of the OLP board, refer to the OptiX BWS 1600GBackbone DWDM Optical Transmission System Hardware Description.

Figure 7-2 Working principle of optical line protection (Application 1)

MUX

DMUX

OA

OA

FIU

OLP

DMUX

MUX

OA

OA

FIU

OTU1

OLP

OTUn

OTU1

OTUn

OTU1

OTUn

OTU1

OTUn

SC1 SC1

RO

TI

TO2

RI2

TO1

RI1

RI1

TO1RO

RI2

TO2

TI

: Direction of the working signal flow : Direction of the protection signal flow

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NOTE

An OTU in the transmit direction and the corresponding OTU in the receive direction at the same station,as shown in Figure 7-2, are actually one physical OTU.

l The OLP at the transmit end sends signals to the working line fiber and the protection linefiber at the same time. The OLP at the receive end detects the optical power of line signals,makes comparison, and sends the line signals transmitted over the working line fiber fromthe RI1 optical port to the FIU.

l When the OLP at the receive end detects that the optical power of the line signals transmittedover the working line fiber is abnormal, it sends the signals transmitted from the RI2 opticalport to the FIU. The line signals are automatically switched to the protection line fiber.Although the working line fiber is abnormal, services are not interrupted.

l After the recovery of the working line fiber, the OLP at the receive end detects that theoptical power of the line signals transmitted over the working line fiber is normal. Basedon the pre-configuration made on the T2000, the line signals can be switched back to theworking line fiber, or still remain in the protection line fiber.

The Figure 7-3 shows the other application of the optical line protection. The optical lineprotection in Application 2 has similar principle as that in Application 1. The difference is thatthe working and protection signals are divided by the OLP unit before they are sent to the opticalamplifying unit and the OLP is not directly connected to the fiber line. In this application mode,the FIU and the OA unit on the optical line can be protected in case of failure.

Figure 7-3 Working principle of optical line protection (Application 2)

OLP

OLP

MUX

DMUX

OA

DMUX

MUX

OTU1

OTUn

OTU1

OTUn

OTU1

OTUn

OTU1

OTUn

RO

TI

TO2

RI2

TO1

RI1

OA

OA

OA

FIU

OA

RO

TITO2

RI2

TO1

RI1

OA

OA

OA

FIUFIU

FIU

FIU

FIU

FIU

FIU

: Direction of the working signal flow : Direction of the protection signal flow

NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-3, are actually one physical OTU.

l The switching of the OLP is performed based on the judgment on the optical power of the paths. Thus,before using this protection function, it is required to ensure that the difference in the input opticalpower of the optical interfaces of the working and the protection paths is less than 3 dB. If the powerdifference is more than 3 dB and less than 5 dB, the POWER_DIFF_DEFECT alarm is reported. If thepower difference is more than 5 dB, the POWER_DIFF_OVER alarm is reported and the switching istriggered.

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Dependent AlarmsWhen the optical line protection successfully switches services to the protection channel, thealarm reported by the system is as follow:

The OLP board reports the PS alarm.

ApplicationAs shown in Figure 7-4, station A and station B form a point-to-point network in project T.Both A and B are OTM stations. The optical line protection is adopted between the two stations.Each station is configured with an OLP board.

Figure 7-4 Application of optical line protection (normal)

OLP

OLP

OTM A OTM B

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-4. When signals are transmitted from station A to station B, the OLP in station Asends signals over the working line fiber and the protection line fiber at the same time. The OLPin station B selects the signals transmitted over the working line fiber.

When signals are transmitted from station B to station A, the OLP in station B sends signalsover the working line fiber and the protection line fiber at the same time. The OLP in station Aselects the signals transmitted over the working line fiber.

Figure 7-5 Application of optical line protection (switching)

OLP

OLP

OTM A OTM B

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-5. In the direction from station A to station B:

When the working line fiber breaks, the OLP in station B detects that there are no signals in theworking receive direction. The board performs the switching. It selects the signals transmittedover the protection line fiber.

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In the direction from station B to station A:

There is no switching because the optical power is normal, and the route of signals remains thesame.

NOTE

The equipment monitors the protection line fiber in real time. When the protection line fiber breaks ordegrades in performance, the equipment can detect it in time and the trouble can be shot immediately.

7.2.3 1+1 Wavelength Protection at Client

NOTE

The channel protection pair should be set by using the T2000 to achieve the 1+1 wavelength protection atclient.

The board with service cross-connect function must be fully configured with pass-through cross-connections when configured with 1+1 channel protection on the client side.

Functionality

The 1+1 wavelength protection at client adopts two OTUs that have the convergence functionto protect client services. One is the working OTU, and the other is the protection OTU. TheOptiX BWS 1600G provides some OTUs that have the capability to converge services. TheseOTUs include the TMX, TMXS, ETMX, ETMXS, LOG, LOGS, ELOG, ELOGS, IMX4,IMX4S, LDG, FDG, LQM and FCE.

Related Boards

Table 7-5 lists the boards used to achieve the 1+1 wavelength protection at client.

Table 7-5 Boards used to achieve the 1+1 wavelength protection at client

Board Name Function

SCS Splits and couples the service signals.

OTU Detects optical signals.Reports the information of the detected optical signals to the SCC.Turns on or shuts down the client-side laser under the control of the SCC.

SCC Communicates with the OTU, and controls the OTU to turn on or shut downthe client-side laser.

Trigger Conditions

The trigger conditions for the client-side 1+1 wavelength protection automatic switching are asfollows:

l The board is offline, including the following situations:Removing or cold resetting the board.

l There is a signal failure (SF) condition. SF includes the following board-side alarms:

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R_LOS, R_LOF, MS_AIS, OTU_AIS, OTU_LOF, ODU_AIS, ODU_OCI, ODU_LCKand REM_SF alarms.

l There is a signal degraded (SD) condition. SD includes the following board-side alarms:B1_OVER, SM_BIP8_OVER, PM_BIP8_OVER and REM_SD alarms.The alarms against certain optical interface and channels of the OTU can be set on theT2000 as SD switching conditions. Table 7-7 lists the alarms, against the optical interfaceand channels, which can be set as SD switching conditions of each OTU.

The different OTUs would report different alarms. For details of the above alarms, refer to theAlarm and Performance Reference.

NOTE

If the switching is triggered by an SF condition, the switching time is 50 ms.

If the switching is triggered by an SD condition, the switching time is 50ms. The time required for detectingSD errors are as follows:

l 90 ms when the BER is 10e-3.

l 180 ms when the BER is 10e-4.

l 1080 ms when the BER is 10e-5.

Working PrincipleThis protection scheme adopts dual-fed signal selection and unidirectional switching. Theswitching of any client service does not affect other client services of the same OTU. Theworking OTU and the protection OTU are required to be installed in the same subrack. For theworking principle diagram of the 1+1 wavelength protection at client, see Figure 7-6.

For the description of the working principle of the SCS, refer to the OptiX BWS 1600G BackboneDWDM Optical Transmission System Hardware Description.

Figure 7-6 Working principle of 1+1 wavelength protection at client

MUX

DMUX

OA

OA

FIU

DMUX

MUX

OA

OA

FIU

SC1SCC SCC

OTU1

OTU2

SCSSC1

OTU1

OTU2

a

ba

b

a

ba

ba

b

OTU1

OTU2

SCS

OTU1

OTU2

a

ba

b

a

ba

ba

b

: Direction of the working signal flow : Direction of the protection signal flow

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NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-6, are actually one physical OTU. An SCS in the transmit direction andthe corresponding SCS in the receive direction at the same station, as shown in the same figure, areactually one physical SCS.

l The SCC communicates with the OTU through the backplane. This communication is not indicated inFigure 7-6.

l Normally, the SCS at the transmit end splits each signal into two channels. Then it sendsthem to the working OTU (OTU1) and the protection OTU (OTU2).

l The services transmitted by the working and the protection wavelength routes reach thereceive end at the same time. The SCC at the receive end controls the OTU1 and the OTU2based on the detection information reported by the OTU. All the client-side lasers of theOTU1 function normally. All the client-side lasers of the OTU2 are shut down. Only thesignals transmitted by the working wavelength channel are sent to the client-side equipmentthrough the SCS.

l When a certain signal on the client side of the OTU1 is faulty, the switching is only uponthe faulty signal instead of the WDM side. The client-side laser of the OTU1 for this channelis shut down. Thus, for this channel of services, only the signals transmitted by theprotection wavelength route are sent to the SCS. All the other channels of signals are notswitched to the protection wavelength route. They are still transmitted by the workingwavelength route.

l After the recovery of the working wavelength route, service signals transmitted by theprotection wavelength route can be switched back to the OTU1 or not based on the pre-configuration made on the T2000.

The 1+1 wavelength protection at client can be regarded as one type of inter-board wavelengthprotection, switching only some, instead of all, client-side services to the protection OTU.

Dependent Alarmsl When the client-side 1+1 wavelength protection is successful, the alarm reported by the

system is as follow:The SCC reports the OPS_PS_INDI alarm.

l If the service type or auto-negotiation attributes of the working and protection ports of theclient-side 1+1 wavelength protection group are different, the alarm reported by the systemis as follow:The SCC board reports the OPS_MAIN_BAK_ATTR_DIFF alarm.

ApplicationAs shown in Figure 7-7, station A and station B form a point-to-point network in project T.Both A and B are OTM stations. The 1+1 wavelength protection at client is adopted betweenthe two stations. Each station is configured with one SCS and two OTUs that have theconvergence function.

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Figure 7-7 Application of 1+1 wavelength protection at client (normal)

OTM A

OTU1S

CS

Client a

OTM B

Client a

OTU2

Client bClient b

OTU1 S

CSO

TU2

a

b

b

a

a

b

b

a

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-7. When signals are transmitted from station A to station B, the SCS in station Asends signals to the working OTU (OTU1) and the protection OTU (OTU2) at the same time.When signals reach the OTU1 and OTU2 in station B, only the signals sent from the OTU1 aretransmitted to the client-side equipment through the SCS.

When signals are transmitted from station B to station A, the SCS in station B sends signals tothe OTU1 and the OTU2 at the same time. In station A, only the signals sent from the OTU1are transmitted to the client-side equipment through the SCS.

Figure 7-8 Application of 1+1 wavelength protection at client (switching)

OTM A

OTU1S

CS

Client a

OTM B

Client aOTU2

Client b Client b

OTU1 S

CSO

TU2

a

b

b

a

a

b

b

a

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-8. In the direction from station A to station B:

In station A, the fiber (used to transmit client service a) between the SCS and the input port ofthe OTU1 breaks. After detection and control, only the OTU2 in station B sends the client-sidesignals to the client-side equipment through the SCS. Client service b is still transmitted by theoriginal route.

In the direction from station B to station A:

There is no switching because the working wavelength route is normal, and the route of signalsremains the same.

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7.2.4 Inter-Board Wavelength Protection

NOTE

The channel protection pair should be set by using the T2000 to achieve the inter-board wavelengthprotection.

The board with service cross-connect function must be fully configured with pass-through cross-connections when configured with 1+1 channel protection.

Functionality

The inter-board wavelength protection scheme adopts two wavelengths: one is the workingwavelength, and the other is the protection wavelength. The two wavelengths adopt differentroutes to transmit signals to protect the client services.

Related Boards

Table 7-6 lists the boards used to achieve the inter-board wavelength protection.

Table 7-6 Boards used to achieve the inter-board wavelength protection

Board Name Function

SCS Splits and couples the service signals.

OTU Detects the optical signals.Reports the information of the detected optical signals to the SCC.Turns on or shuts down the client-side laser under the control of the SCC.

SCC Communicates with the OTU, and controls the OTU to turn on or shut downthe client-side laser.

Trigger Conditions

The trigger conditions for the inter-board wavelength protection automatic switching are asfollows:

l The board is offline, including the following situations:

Removing or cold resetting the board.

l There is a signal failure (SF) condition. SF includes the following board-side alarms:

R_LOS, R_LOF, MS_AIS, OTU_AIS, OTU_LOF, ODU_AIS, ODU_OCI, ODU_LCKand REM_SF alarms.

l There is a signal degraded (SD) condition. SD includes the following board-side alarms:

B1_OVER, SM_BIP8_OVER, PM_BIP8_OVER, REM_SD and TF alarms.

The alarms against certain optical interface and channels of the OTU can be set on theT2000 as SD switching conditions. Table 7-7 lists the alarms, against the optical interfaceand channels, which can be set as SD switching conditions of each OTU.

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Table 7-7 Alarms relevant to SD switching conditions and the Ports

Board

Alarms

B1_SD SM_BIP8_SD PM_BIP8_SD

LWC1 Port 1 and 2 Port 1 and 2 Port 1 and 2

LBF/LBFS/LWF/LWFS/FDG/LW40

Port 1 Port 1 Port 1

FCE/LWC Port 1 - -

LWX/LWM Port 1–3 - -

LDG Port 1 and 2 - -

ELOG/ELOGS/LBE/LBES/LOG/LOGS

- Port 1 Port 1

TMX/TMXS Port 3–6a Port 1 Port 1

ETMX/ETMXS Port 3–6a Port 1 and 3–6a Port 1 and 3–6a

LQM Port 3–6a Port 1 Port 1

IMX4/IMX4S Port 1 Port 3–6 Port 3–6

Note: If the same port supports various services, all the three alarms can be set as the SDswitching conditions. When the service type is changed, the board automatically countsthe corresponding bit errors and reports an SD alarm according to the actual service type.a: This SD switching condition only apply to 1+1 wavelength protection at client.

The different OTUs would report different alarms. For details of the above alarms, refer to theAlarm and Performance Reference.

NOTE

If the switching is triggered by an SF condition, the switching time is 50 ms.If the switching is triggered by an SD condition, the switching time is 50ms. The time required for detectingSD errors are as follows:

l 90 ms when the BER is 10e-3.

l 180 ms when the BER is 10e-4.

l 1080 ms when the BER is 10e-5.

Working PrincipleThis protection scheme adopts dual-fed signal selection. The working OTU and the protectionOTU are required to be installed in the same subrack. For the working principle diagram of theinter-board wavelength protection, see Figure 7-9. The signals carried by the workingwavelength and those carried by the protection wavelength can reach the receive end by differentroutes.

For the description of the working principle of the SCS, refer to the OptiX BWS 1600G BackboneDWDM Optical Transmission System Hardware Description.

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Figure 7-9 Working principle of the inter-board wavelength protection

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: Direction of the working signal flow : Direction of the protection signal flow

NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-9, are actually one physical OTU. An SCS in the transmit direction andthe SCS in the receive direction at the same station, as shown also in this figure, are actually one physicalSCS.

l The SCC communicates with the OTU through the backplane. This communication is not indicated inFigure 7-9.

l In normal conditions, the SCS at the transmit end divides the incoming client signals andfeeds the signals into the working OTU (OTU1) and the protection OTU (OTU2).

l The signals carried by the working wavelength and those carried by the protectionwavelength reach the receive end at the same time. The SCC at the receive end controlsthe OTU1 and OTU2 based on the detection information reported by the OTU. The client-side laser of the OTU1 works normally. The client-side laser of the OTU2 is shut down.Only the signals carried by the working wavelength are transmitted to the SCS. The SCSsends the working signals to the client-side equipment.

l When the OTU1 at the receive end detects the failure of the signals carried by the workingwavelength, the SCC directs the OTU2 to turn on its client-side laser if the trigger conditionis met. The client-side laser of the OTU1 is shut down. Only the signals carried by the

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protection wavelength are transmitted to the SCS. The SCS sends the protection signals tothe client-side equipment.

l After the recovery of the working wavelength route, service signals can be switched backto the OTU1 or not based on the pre-configuration made on the T2000.

Dependent Alarmsl When the Inter-board wavelength protection switching is successful, the alarm reported by

the system is as follow:The SCC board reports the OPS_PS_INDI alarm.

l If the service type or auto-negotiation attributes of the working and protection ports of theInter-board wavelength protection group are different, the alarm reported by the system isas follow:The SCC board reports the OPS_MAIN_BAK_ATTR_DIFF alarm.

ApplicationThe inter-board wavelength protection applies to ring and point-to point networks.

Take that the signals carried by the working wavelength and those carried by the protectionwavelength reach the receive end by different routes as an example to introduce the inter-boardwavelength protection. As shown in Figure 7-10, station A and station B form a point-to-pointnetwork in project T. Both A and B are OTM stations. The inter-board wavelength protectionis adopted between the two stations. Each station is configured with one SCS board and twoOTUs.

Figure 7-10 Application of inter-board wavelength protection (normal)

OTM A

OTU1SCS OTU2

OTM B

SCS

OTU1

OTU2

ClientClient

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-10. When signals are transmitted from station A to station B, the SCS in stationA sends signals to the working OTU (OTU1) and the protection OTU (OTU2) at the same time.When signals are received by the OTU1 and the OTU2 in station B, only the signals transmittedby the OTU1 are sent to the client-side equipment by the SCS.

When signals are transmitted from station B to station A, the SCS in station B sends the signalsto the OTU1 and the OTU2 at the same time. In station A, only the signals transmitted by theOTU1 are sent to the client-side equipment by the SCS.

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Figure 7-11 Application of inter-board wavelength protection (switching)

OTM A

OTU1SCS OTU2

OTM B

SCS

OTU1

OTU2

Client Client

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-11. In the direction from station A to station B:

When a fiber cut occurs to the working route from station A to Station B, only the OTU2 on theprotection route in station B sends the client-side signals to the client-side equipment throughthe SCS unit.

In the direction from station B to station A:

There is no switching because the working wavelength route is normal, and the route of signalsremains the same.

7.2.5 Inter-Subrack 1+1 Optical Channel Protection

NOTE

The channel protection pair should be set by using the T2000 to achieve the inter-subrack 1+1 opticalchannel protection.

The board with service cross-connect function must be fully configured with pass-through cross-connections when configured with inter-subrack 1+1 channel protection.

Functionality

The inter-subrack 1+1 optical channel protection scheme adopts two wavelengths: one is theworking wavelength, and the other is the protection wavelength. The two wavelengths adoptdifferent routes to transmit signals to protect the client services. The working OTU and theprotection OTU can be in different subracks. One client-side service is the smallest unit of theprotection service granules. For the OTU boards that have the convergence function, theprotection switching is only performed to client-side services.

Related Boards

Table 7-8 lists the boards used to achieve the inter-subrack 1+1 optical channel protection.

Table 7-8 Boards used to achieve the inter-subrack 1+1 optical channel protection

Board Name Function

E2OLP02/E2OLP01,DCP

Splits and couples the service signals.Detects the optical power.Performs the switching when detecting abnormal optical power.

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Board Name Function

OTU Detects optical signals.Reports the information of the detected optical signals to the SCC.Turns on or shuts down the client-side laser under the control of theSCC.

SCC Communicates with the OTU, and controls the OTU to turn on orshut down the client-side laser.

Trigger Conditions

The trigger conditions for the inter-subrack 1+1 optical channel protection automatic switchingare as follows:

l The board is offline, including the following situations:

Removing or cold resetting the board.

l There is a signal failure (SF) condition. SF includes the following board-side alarms:

R_LOS, R_LOF, MS_AIS, OTU_AIS, OTU_LOF, ODU_AIS, ODU_OCI, ODU_LCKand REM_SF alarms.

l There is a signal degraded (SD) condition. SD includes the following board-side alarms:

B1_OVER, SM_BIP8_OVER, PM_BIP8_OVER, REM_SD and TF alarms.

The alarms against certain optical interface and channels of the OTU can be set on theT2000 as SD switching conditions. Table 7-7 lists the alarms, against the optical interfaceand channels, which can be set as SD switching conditions of each OTU.

l The power difference between the working and the protection channels exceeds thethreshold (5 dB) and causes POWER_DIFF_OVER alarm.

The different OTUs would report different alarms. For details of the above alarms, refer to theAlarm and Performance Reference.

NOTE

If the switching is triggered by an SF condition, the switching time is 50 ms.

If the switching is triggered by an SD condition, the switching time is 50ms. The time required for detectingSD errors are as follows:

l 90 ms when the BER is 10e-3.

l 180 ms when the BER is 10e-4.

l 1080 ms when the BER is 10e-5.

Working Principle

This protection scheme adopts dual-fed signal selection. The working OTU and the protectionOTU can be installed in different subracks.

With either the OLP or the DCP, the working principle of the protection is the same. Thedifference is that, the OLP protects one channel of signals; the DCP protects two channels ofsignals at the same time.

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For the description of the working principle of the OLP and that of the DCP, refer to the OptiXBWS 1600G Backbone DWDM Optical Transmission System Hardware Description.

In the following example of the inter-subrack 1+1 optical channel protection, the OLP is adopted.See Figure 7-12. At that time, the working OTU and the protection OTU can be in differentsubracks. The signals carried by the working wavelength and those carried by the protectionwavelength can reach the receive end by different routes.

Figure 7-12 Working principle of inter-subrack 1+1 optical channel protection

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: Direction of the working signal flow : Direction of the protection signal flow

NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-12, are actually one physical OTU. An OLP in the transmit direction andits corresponding OLP in the receive direction at the same station, as shown in the same figure, areactually one physical OLP.

l The SCC unit communicates with the OTU through the backplane. This communication is not indicatedin Figure 7-12.

l Normally, the OLP at the transmit end divides the incoming client signals and feeds thesignals into the working OTU (OTU1) and the protection OTU (OTU2).

l Signals transmitted by the working and the protection wavelength routes reach the receiveend. The OTU detects the signals. If the signals are normal, both the working and theprotection OTUs send signals to the OLP. The OLP compares the optical power of the

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signals, and then transmit the signals sent from the working OTU to the client-sideequipment.

l When the OTU1 at the receive end detects abnormal signals, the information is reported tothe SCC. The SCC controls the OTU1 and the OTU2. The client-side laser of the OTU1 isshut down. The client-side laser of the OTU2 functions normally. Only the signalstransmitted by the protection wavelength route are sent to the OLP unit. The OLP unitcompares the optical power of signals and detects that no signals are transmitted by theworking wavelength route. Thus, only the signals transmitted by the protection wavelengthroute are sent to the client-side equipment.

l After the recovery of the working wavelength route, service signals can be switched backto the OTU1 or not based on the pre-configuration made on the T2000.

NOTE

l For the configuration of the inter-subrack 1+1 optical channel protection for the OTU boards that carrythe GE services (such as the LDG, FDG, LOG, and LOGS), the optical ports of these OTU boards atthe local and the opposite ends do not support the auto-negotiation function. The Auto-negotiationattribute must be disabled.

l The switching of the DCP or the OLP is performed based on the judgment on the optical power of thepaths. Thus, before using this protection function, it is required to ensure that the difference in the inputoptical power of the optical interfaces of the working and the protection paths is less than 3 dB. If thepower difference is more than 3 dB and less than 5 dB, the POWER_DIFF_DEFECT alarm is reported.If the power difference is more than 5 dB, the POWER_DIFF_OVER alarm is reported and theswitching is triggered.

l The optical interface 1 of a DCP or OLP is corresponding to the working channel while the opticalinterface 2 to the protection channel. This principle should be strictly followed in fiber connectionbetween the working OTU and the protection OTU.

l As for the configuration of the inter-subrack 1+1 optical channel protection, the working OTU,protection OTU and OLP/DCP can be configured in different subracks. At the same time, the accessof third-party equipment or services is also supported.

l The OLP and the DCP support the subrack power protection. It is recommended to configure theworking OTU and the OLP/DCP in the same subrack and configure the protection OTU in anothersubrack.

l One client-side service is the smallest unit of the protection service granules. For the OTU boards thathave the convergence function, the protection switching is only performed to some client-side services.

Dependent Alarmsl When the inter-subrack wavelength protection successfully switches services to the

protection channel, the alarm reported by the system is as follow:The OLP or the DCP board reports the PS alarm.

l If the working and protection OTU are on the same subrack, however, the service type orauto-negotiation attributes of the working and protection ports of the inter-subrackwavelength protection group are different, the alarm reported by the system is as follow:The SCC board reports the OPS_MAIN_BAK_ATTR_DIFF alarm.

ApplicationTake that the signals carried by the working wavelength and those carried by the protectionwavelength reach the receive end by different routes as an example to introduce the inter-subrackwavelength protection. As shown in Figure 7-13, station A and station B form a point-to-pointnetwork in project T. Both A and B are OTM stations. The inter-subrack 1+1 optical channelprotection is adopted between the two stations. Each station is configured with one OLP andtwo OTUs. The two OTUs are installed in different subracks.

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Figure 7-13 Application of inter-subrack 1+1 optical channel protection (normal)

OTM A

OTU1

OLP

Client

OTU2

OTM B

OLP

Client

OTU1

OTU2

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-13. When signals are transmitted from station A to station B, the OLP in stationA sends signals to the working OTU (OTU1) and the protection OTU (OTU2) at the same time.When signals reach station B, only the signals sent from the OTU1 are transmitted to the client-side equipment through the OLP.

When signals are transmitted from station B to station A, the OLP in station B sends signals tothe OTU1 and the OTU2 at the same time. In station A, only the signals sent from the OTU1are transmitted to the client-side equipment through the OLP.

Figure 7-14 Application of inter-subrack 1+1 optical channel protection (switching)

OTM A

OTU1

OLP

Client

OTU2

OTM B

OLP

Client

OTU1

OTU2

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-14. In the direction from station A to station B:

When a fiber cut occurs to the working route from station A to Station B, only the OTU2 on theprotection route in station B sends the client-side signals to the client-side equipment throughthe OLP.

In the direction from station B to station A:

There is no switching because the working wavelength route is normal, and the route of signalsremains the same.

7.2.6 WXCP

FunctionalityThe wavelength cross-connection protection (WXCP) scheme adopts two OTUs with thecapability to cross-groom services to protect client services. One is the working OTU, and theother is the protection OTU. The OptiX BWS 1600G provides some OTUs that have thecapability to cross-groom services. These OTUs include the E2ETMX and E2ETMXS, E1ELOG

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and E1ELOGS, LOG and LOGS, LOM and LOMS. There are three groups of slots in enhancedsubrack that support inter-board cross-connection protection:

l Slot 1, slot 2, slot 3, and slot 4 are in one group.

l Slot 5 and slot 8 are in one group.

l Slot 9, slot 10, slot 11, and slot 12 are in one group.

Within those groups, arbitrary wavelength cross-connection protection can be realized.

NOTE

The valid slots for the LOG/LOGS boards are the slots on the left, that is, slots 1 and 3, or slots 9 and 11.The valid slots for the LOM/LOMS boards are the slots on the right, that is, slots 2 and 4, or slots 10 and12. When the LOM/LOMS and E1ELOG/E1ELOGS boards are used together for cross-connection, theLOM/LOMS board can be inserted in slot 5.

Related BoardsTable 7-9 lists the boards used to achieve the WXCP.

Table 7-9 Boards used to achieve the WXCP

Board Name Function

SCS Splits and couples the service signals.

OTU Cross-connects signals.Detects optical signals.Reports the information of the detected optical signals to the SCC.Turns on or shuts down the client-side laser under the control of the SCC.

SCC Communicates with the OTU, and controls the OTU to turn on or shut downthe client-side laser.

NOTE

The wavelength cross-connection protection scheme provides two modes. The SCS is used only in the twosources, two sinks mode. For details of the two protection modes, refer to the description of the workingprinciple.

Trigger ConditionsThe trigger conditions for the WXCP automatic switching are as follows:

l The board is offline, including the following situations:Removing or cold resetting the board.

l There is a signal failure (SF) condition. SF includes the following board-side alarms:R_LOS, R_LOF, MS_AIS, OTU_AIS, OTU_LOF, ODU_AIS, ODU_OCI, ODU_LCKand REM_SF alarms.

l There is a signal degraded (SD) condition. SD includes the following board-side alarms:B1_OVER, SM_BIP8_OVER, PM_BIP8_OVER and REM_SD alarms.

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The alarms against certain optical interface and channels of the OTU can be set on theT2000 as SD switching conditions. Table 7-7 lists the alarms, against the optical interfaceand channels, which can be set as SD switching conditions of each OTU.

The different OTUs would report different alarms. For details of the above alarms, refer to theAlarm and Performance Reference.

NOTE

If the switching is triggered by an SF condition, the switching time is 50 ms.

If the switching is triggered by an SD condition, the switching time is 50ms. The time required for detectingSD errors are as follows:

l 90 ms when the BER is 10e-3.

l 180 ms when the BER is 10e-4.

l 1080 ms when the BER is 10e-5.

Working PrincipleThe wavelength cross-connection protection scheme provides two modes:

l Two sources, one sink.

l Two sources, two sinks.

The switching of one client service does not affect other client services of the same OTU.

NOTE

The source interface should be a WDM interface. The sink interface should be a client-side interface.

l Two sources, one sinkThe services are from two source interfaces but destined for the same sink interface. Theclient service is protected through the switch of the cross-connection between the workingOTU and the protection OTU. See Figure 7-15. The E2ETMX is illustrated.

Figure 7-15 Working principle of WXCP (two sources, one sink)

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NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-15, are actually one physical OTU.

l The SCC communicates with the OTU through the backplane. This communication is notindicated in Figure 7-15.

The client service that requires protection is always accessed by the working OTU. Theprotection OTU and the corresponding client-side laser do not function. Two service cross-connect resources are reserved in configuration.In normal conditions, signals are transmitted on the working path. At the receive end, onlythe cross-connection for the working OTU takes effect. The cross-connection of theprotection path is disconnected. When the working path fails, the cross-connection of theworking path is disconnected. The cross-connection for the protection OTU takes effect,and signals are transmitted on the protection path. After the recovery of the working channelroute, service signals can be switched back to the OTU1 or not based on the pre-configuration made on the T2000.

l Two sources, two sinksThe Figure 7-16 and Figure 7-17 the show the two common networking modes to introducethe WXCP function in the two sources two sinks mode.When the OTU does not be configured with cross-connection or does not meet therequirement of slot configuration, the client service is protected by the combination of theSCS and the OTU to realize the dual fed selective receiving of the client side service andto realize WXCP together. The services are from two source interfaces and destined fortwo sink interfaces. See Figure 7-16. The E2ETMX is taken as an example.

Figure 7-16 Working principle of the WXCP (two sources, two sinks) Networking mode(1)

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NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-16, are actually one physical OTU.

l The SCC communicates with the OTU through the backplane. This communication is notindicated in Figure 7-16.

The Figure 7-17 shows the other common networking mode in two sources two sinks mode.The SCS board sends the services of the client side to the two input optical interfaces ofthe working OTU. One channel of signals is cross-connected to the protection OTU throughbackplane of the subrack to realize the WXCP protection of the client side service. Theworking OTU and the protection OTU should meet the requirements of slot configurationfor inter-board cross-connection in this networking mode.

Figure 7-17 Working principle of the WXCP (two sources, two sinks) networking mode(2)

ETMX2

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ETMX1

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ETMX1

ETMX1

ETMX2

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: Direction of the working signal flow : Direction of the protection signal flow

NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-17, are actually one physical OTU.

l The SCC communicates with the OTU through the backplane. This communication is notindicated in Figure 7-17.

This protection mode is similar to the 1+1 wavelength protection at client. Both of themcan protect client-side services. The difference is that, in this protection mode, therelationship between the client-side lasers and services are set through the configuration ofthe cross-connection. However, in 1+1 wavelength protection at client, the relationshipbetween the client-side lasers and services are set when the fibers are connected. In addition,client-side 1+1 protection applies to OTU boards that do no support inter-board cross-connection.

For the working principle of client-side 1+1 protection, refer to 7.2.3 1+1 WavelengthProtection at Client.

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Dependent Alarmsl If the WXCP switching succeeds, the alarm reported by the system is as follow:

The SCC board reports the OPS_PS_INDI alarm.l If the WXCP switching fails, the alarm reported by the system is as follow:

The SCC board reports the OPS_PS_FAIL alarm. If the alarm anti-jitter function is enabled(by default enabled), this alarm is filtered.

l If the service type or auto-negotiation attributes of the active and standby ports of the WXCPgroup are different, the alarm reported by the system is as follow:The SCC board reports the OPS_MAIN_BAK_ATTR_DIFF alarm.

ApplicationAs shown in Figure 7-18, station A and station B form a point-to-point network in project T.Both A and B are OTM stations. The WXCP is adopted for the client service d. Each station isconfigured with two E2ETMX boards. The two E2ETMXs are installed in the same subrack.

Figure 7-18 Application of the WXCP (normal)

Client a

Client b

Client c

Client d

Client e

Client f

Client g

OTM A

ETMX1

OTM B

ETMX2

ETMX1

Client a

Client b

Client c

Client d

ETMX2

Client e

Client f

Client g

: Direction of the working signal flow

See Figure 7-18. Two cross-connect routes are reserved for client service d. In normal situations,the cross-connect route in the OTU1 corresponding to client service d is in use. Signals aretransmitted on the working path.

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Figure 7-19 Application of the WXCP (switching)

Client a

Client b

Client c

Client d

Client e

Client f

Client g

OTM A

ETMX1

OTM B

ETMX2

ETMX1

Client a

Client b

Client c

Client d

ETMX2

Client e

Client f

Client g

: Direction of the protection signal flow

See Figure 7-19. When the working path fails, the cross-connect route for client service d in theOTU1 is not used. Instead, the cross-connect route in the OTU2 is used. The signals are switchedto the protection path.

7.2.7 1:N Optical Channel Protection

FunctionalityThe 1:N (N≤8) optical channel protection scheme adopts one wavelength to protect N (N≤8)working wavelengths to protect client services. The OptiX BWS 1600G provides some OTUsthat support the 1:N (N≤8) optical channel protection. These OTUs are the LWF, LWFS, LBE,LBES, LBF, LBFS and LWC1.

Related BoardsTable 7-10 lists the boards used to achieve the 1:N (N≤8) optical channel protection.

Table 7-10 Boards used to achieve the 1:N optical channel protection

Board Name Function

OCP Splits and couples the service signals.

OTU Detects optical signals.Reports the information of the detected optical signals to the SCC.Turns on or shuts down the client-side laser under the control of the SCC.

SCC Communicates with the OTU, and controls the OTU to turn on or shut downthe client-side laser.

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Trigger Conditions

The trigger conditions for the 1:N (N≤8) optical channel protection automatic switching are asfollows:

l The board is offline, including the following situations:Removing or cold resetting the board.

l There is a signal failure (SF) condition. SF includes the following board-side alarms:R_LOS, R_LOF, MS_AIS, OTU_AIS, OTU_LOF, ODU_AIS, ODU_OCI and ODU_LCKalarms.

l There is a signal degraded (SD) condition. SD includes the following board-side alarms:B1_OVER, SM_BIP8_OVER and PM_BIP8_OVER alarms.The alarms against certain optical interface and channels of the OTU can be set on theT2000 as SD switching conditions. Table 7-7 lists the alarms, against the optical interfaceand channels, which can be set as SD switching conditions of each OTU.

The different OTUs would report different alarms. For details of the above alarms, refer to theAlarm and Performance Reference.

NOTE

The switching time for the 1:N (N≤8) optical channel protection is 200 ms.

Working Principle

This protection scheme adopts the single-fed and single receiving mode. In this protection mode,the switching is performed at both the transmit end and the receive end. The network protectionswitching protocol is required. The working OTUs and the protection OTU should be installedin the same subrack. For the working principle diagram of the 1:N optical channel protection,see Figure 7-20.

For the working principle of the OCP, refer to the Hardware Description.

Figure 7-20 Working principle of 1:N (N≤8) optical channel protection

MUX

DMUX

OA

OA

FIU

DMUX

MUX

OA

OA

FIU

A B

SC1 SC1SCC SCC

OTU1

OTU2OCP

OTU9

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OTU2OCP

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1

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9

1

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1

2

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9

: Direction of the working signal flow : Direction of the protection signal flow

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NOTE

l An OTU in the transmit direction and the corresponding OTU in the receive direction at the samestation, as shown in Figure 7-20, are actually one physical OTU. An OCP in the transmit direction andthe corresponding OCP in the receive direction at the same station, as shown in the same figure, areactually one physical OCP.

l The SCC unit communicates with the OTU through the backplane. This communication is not indicatedin Figure 7-20.

l In normal conditions, N channels of client signals are sent by the OCP to N working OTUs.The first working channel is selected to be sent to the protection OTU at the same time.Thus, N+1 wavelengths carry signals in the transmission.

l When the signals carried by the N+1 wavelengths reach the receive end, only N workingOTUs send signals to the OCP. The SCC directs the protection OTU to shut down the client-side laser. Thus, the protection OTU does not send signals to the OCP. The OCP sends thesignals carried by N working wavelengths to the client-side equipment.

l When one working OTU at the receive end detects a signal failure of the workingwavelength route, it informs the SCC. After confirmation, the SCC initiates the protectionswitching and sends switching request to the transmit end through the OTU in the reverseprotection path. The SCC at the transmit end receives the request sent by the receive end,and then it sends the confirmation information to the receive end by the protection path.

l The receive end receives the confirmation information. Under the control of the SCC, theOCP switches the protected client service to the protection OTU; the client-side laser ofthe protection OTU is turned on; and the client-side laser of the protected OTU is shutdown. At the same time, the SCC unit sends information to the transmit end through theOTU in the reverse protection path to confirm the switching.

l The SCC at the transmit end receives the confirmation information. Under the control ofthe SCC at the transmit end, the client-side laser of the protected OTU is shut down; theclient-side laser of the protection OTU is turned on; and the OCP switches the protectedclient service to the protection OTU.

l When the protected OTU at the receive end detects the recovery of signals, it restoresservices to the protected OTU. The process of recovery is similar to the process ofswitching. All 1:N optical channel protection is revertive.

NOTE

l N (N≤8) working OTUs and one protection OTU form a protection group. However, each board withinthis protection group must be inserted in the same subrack with the OCP board. Besides, the OTUs inthe protection group should be of the same type.

l The common OTU boards and the OTUs that have the Super WDM function can form a protectiongroup to protect each other.

l The protection pair should be set by using the T2000 to achieve the 1: N (N≤8) optical channelprotection.

l When two or more service channel need protection, the protection switching is performed accordingto the protection priority level set beforehand. Only the service in one channel can be protected at onetime. With the same priority level, the channel with smaller channel number is protected.

Dependent Alarmsl If the 1:N (N≤8) optical channel protection successfully switches services to the protection

channel, the alarms reported in the system are as follows:

– The OCP board reports the PS alarm.

– The SCC board reports the OPS_PS_INDI alarm.

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l If the 1:N (N≤8) optical channel protection fails to switch services to the protection channelbecause of a fault in the switching board, the alarms reported in the system are as follows:The SCC reports the K1_K2_M and K2_M alarms.

l If the 1:N (N≤8) optical channel protection fails to switch services to the protection channelbecause the configurations of the receive and transmit ends of the switching board aredifferent, the alarms reported in the system are as follows:The SCC reports the PATH_VERIFY_ALM and PRIORITY_VERIFY_ALM alarms.

ApplicationAs shown in Figure 7-21, station A and station B form a point-to-point network in project T.Both A and B are OTM stations. The 1:N optical (N≤8) channel protection is adopted betweenthe two stations. Each station is configured with one OCP and nine OTUs (one is the protectionOTU, and the other eight are working OTUs). At a station, these units are installed in the samesubrack.

Figure 7-21 Application of 1:N (N≤8) optical channel protection (normal)

OTM A

OTU1OCP

OTU8

1

8

OTU9

1

9

8

OTU1OCP

OTU8

1

8

OTU9

1

9

8

Client 1

Client 8

Client 1

Client 8

OTM B

: Direction of the working signal flow : Direction of the protection signal flow

As shown in Figure 7-21, in normal conditions, the eight channels of client services betweenstation A and station B occupy working wavelengths, the corresponding working OTUs areOTU1–OTU8. The protection OTU (OTU9) at the receive end does not output signals at theclient side.

Figure 7-22 Application of 1:N (N≤8) optical channel protection (switching)

OTM A

OTU1OCP

OTU8

1

8

OTU9

1

9

8

OTU1OCP

OTU8

1

8

OTU9

1

9

8

Client 1

Client 8

Client 1

Client 8

OTM B

: Direction of the working signal flow : Direction of the protection signal flow

See Figure 7-22. In the direction from station A to station B:

The output fiber of the OTU1 at station A breaks. After detection, station B shuts down theclient-side laser of the OTU1 and turns on the client-side laser of the OTU9. At the same time,

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the OCP performs the switching of service signals from the working channel to the protectionchannel. Client service 1 is switched to the OTU9.

In the direction from station B to station A:

After detection, station A shuts down the client-side laser of the OTU1 and turns on the client-side laser of the OTU9. Client service 1 is switched to the OTU9.

7.3 Network Management ChannelThe system provides protection of network management information channel andinterconnection of network management information.

7.3.1 Protection of Network Management Information Channel

7.3.2 Interconnection of Network Management Channel

7.3.1 Protection of Network Management Information Channel

In a DWDM system, network management information is transmitted over an optical supervisorychannel, which shares the same physical channel with the working path. Any anomaly or failurein the working path can affect the supervisory channel. Therefore, a backup supervisory channelmust be provided.

In a ring network, when fiber cut occurs in a certain direction, network management informationis automatically switched to the optical supervisory channel in the other direction of the ring, asshown in Figure 7-23. This does not affect the management of the entire network.

Figure 7-23 Network management protection in ring network (a certain section fails)

NM

GNEManagement information

NE A NE B

NE CNE D

Network cableOptical fiber

Normal supervisory channel

Normal supervisory channel

Management information

With data communication network (DCN), the system also provides network managementinformation channel. The user can choose a method to use the channel based on the networkingand spanning. In the point-to-point networking and chain networking, when both the fibertransmission and the supervisory channel fail, the network becomes unmanageable. This can beprevented by the network management information channel in DCN mode. The system NE canprovide network management information channel by the DCN.

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To set up a DCN network management channel, access the DCN between the two NEs througha router. With initial configuration, network management information is transmitted over thenormal supervisory channel when the network is normal. See Figure 7-24.

Figure 7-24 Network management through the normal supervisory channel

DCN

HUB

HUB

HUB

DCN

HUB

HUB

DCN

DCN

NM

GNENM GNE

GNE GNE

Router Router

RouterRouter

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normal supervisorychannel

normal supervisorychannel

Managementinformation

Managementinformation

DCN supervisory channel

DCN supervisory channel

(1) The NM and the GNE at the same station

(2) The NM and the GNE at the different station

Network cableOptical fiber 2M

When the normal supervisory channel fails, network elements automatically switch themanagement information to the DCN supervisory channel to ensure the supervision andoperation on the entire network, as shown in Figure 7-25.

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Figure 7-25 Network management through the DCN supervisory channel

DCN

HUB

HUB

HUB

DCN

HUB

HUB

DCN

DCN

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GNENM GNE

GNE GNE

Router Router

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Managementinformation

Managementinformation

DCN supervisory channel

DCN supervisory channel

(1) The NM and the GNE at the same station

(2) The NM and the GNE at the different station

Network cableOptical fiber 2M

It is important to select different routes for the DCN supervisory channel and normal channelduring network planning. Otherwise, the backup function does not take effect.

7.3.2 Interconnection of Network Management Channel

The system provides various data interfaces (for example Ethernet interface) for theinterconnection of network management channels among different DWDM networks, orbetween a DWDM network and a SONET network, as shown in Figure 7-26. It enables unifiedmanagement of different transmission equipment.

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Figure 7-26 Supervision over OptiX transmission network

ADM

ADM

ADM

ADM

ADM

ADM

ADM

ADMOADM

OADM

OADM

OADM

Networkmanagement

center

Networkmanagement

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channel

Networkmanagement

channel

SDH/SONETnetwork

SDH/SONETnetwork

WDM network

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8 Management of Optical Power

About This Chapter

Optical power management consists of intelligent optical power adjustment, automatic opticalpower control, and automatic optical power equalization.

8.1 Intelligent Power AdjustmentThe system provides the intelligent power adjustment (IPA) function. When there is a fiber breakon the line, the downstream optical amplifier is shutdown to prevent exposed optical fibershurting human body.

8.2 Intelligent Power Adjustment of Raman SystemThe power of the pump light from Raman amplifiers is very high. Before you turn on a Ramanamplifier, you must configure and enable IPA function. After a fiber cut is detected, shut downthe Raman amplifier, so that the optical power of the entire line is on a safety level.

8.3 Automatic Level ControlThe system provides the automatic level control (ALC) function. As the attenuation on a linesegment is increased, the output power as well as the input and output powers of otherdownstream amplifiers will not be changed. Hence there will be much less influence on OSNR.The optical power received by the receiver will not be changed.

8.4 Automatic Power EquilibriumThe system provides the automatic power equilibrium (APE). With the APE function, you canenable the system to automatically adjust the optical power of the transmit end of each channelto keep the flatness of the optical power of the receive end to maintain the OSNR.

8.5 Enhanced Automatic Power Equilibrium (EAPE)The system provides the enhanced automatic power pre-equilibrium (EAPE). EAPE adjustmentcan be enabled to ensure that the receive-end signal quality of each channel meets the presetrequirement and that the services are available.

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8.1 Intelligent Power AdjustmentThe system provides the intelligent power adjustment (IPA) function. When there is a fiber breakon the line, the downstream optical amplifier is shutdown to prevent exposed optical fibershurting human body.

8.1.1 Function DescriptionTo prevent exposed optical fibers hurting human body, especially eyes, the system provides theIPA functions.8.1.2 Function ImplementationIPA function is implemented by various boards with different functions.8.1.3 Networking ApplicationThis section describes an example of the networking application of the IPA function.8.1.4 Configuration PrincipleThe IPA function can be configured according to customers' requirements.

8.1.1 Function DescriptionTo prevent exposed optical fibers hurting human body, especially eyes, the system provides theIPA functions.

In the DWDM system, optical fiber break, equipment failure or optical connector removal maylead to the loss of optical signals on the main optical channel and on the optical auxiliarychannels. To prevent exposed optical fibers hurting human body, especially eyes, and to avoidsurge of the optical amplifier, the system provides the IPA functions. Where the loss of opticalpower signals happens on one or more optical trunk sections on the main optical channel andthe optical supervisory channels, the system can detect the loss of optical signals on the link andinstantly shut down the upstream optical amplifier.

Figure 8-1 shows how to achieve the IPA function. When there is a fiber break on the line, theamplifier 3 and 1 are shut down. Then all the downstream optical amplifiers have no opticalpower output due to the amplifier feature.

Figure 8-1 Function description of the IPA

1 2

34

Site A Site B

fiber break

When the optical signals are restored to normal, the optical amplifier works again. Amplifiers3 and 1 are restarted.

After being shut down, the laser is restarted in pulse restart mode. After IPA determines a fiberbreak, the laser on the control implementation board is shut down. Then, restart the laser on the

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control implementation board to check if the line is recovered. There are three modes in pulserestart.

l Automatic

Set Restart Mode to Automatic. The control implementation board tests if the line isrecovered by restarting the laser every Off Period. If the line is normal, IPA state iscancelled. If the line remains abnormal, the laser shuts down after On Period. Thepreviously mentioned operation is repeated until the line becomes normal.

l Manual

It is valid only when Restart Mode is set to Manual. Click Manual Reboot. After OffPeriod, the laser is turned on to test if the line becomes normal. If the line is normal, IPAstate is cancelled. If the line is abnormal, the laser shuts down after On Period.

l Start to Test

It is valid only when Restart Mode is set to Manual. Click Start to Test. The laser of thecontrol implementation board is turned on immediately to test if the line becomes normal.If the line is normal, IPA state is cancelled. If the line is abnormal, the laser shuts downafter Testing Period.

NOTE

In the DWDM system, the IPA function is started only when optical signals of the active optical path arelost. When this function is executed, only the lasers on the main path are shut down. No operation will beimplemented on the optical supervisory channel. Hence the functions of all optical supervisory channelswill not be affected.

8.1.2 Function ImplementationIPA function is implemented by various boards with different functions.

Fiber Break Detection

There are two methods used to detect the fiber break to achieve the IPA function.

l Detect the LOS of the optical amplifier board

l Detect the signals of the auxiliary detection boardunit

Through a combination of these methods, the fiber break can be judged more correctly.Following is the logic of problem handling.

l If all the configured detection items meet the fiber break condition at the same time, initiatethe shut down process of the IPA.

l If one of the detection conditions recovers to normality, initiate the recovery process of theIPA.

Table 8-1 lists the related alarms of the detection board/auxiliary detect board that trigger theIPA:

Table 8-1 Related alarms of the detection board/auxiliary detect board that trigger the IPA

Detection Board/Auxiliary DetectBoard Alarm Trigger Condition of the IPA

OAU, OBU, OPU MUT_LOS

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Detection Board/Auxiliary DetectBoard Alarm Trigger Condition of the IPA

LWF, LWFS, TMX, TMXS, ETMX,ETMXS, LBF, LBFS, LBE, LBES, TMR,TMRS, LOG, LOGS, LWC, LWC1, TRC,TRC1, FDG, LQM, TRC2, ELOG, ELOGS,IMX4, IMX4S, LW40, LR40, LOM, LOMS

R_LOS, R_LOC, R_LOF, OTU_LOF,FEC_LOF

FCE, LWM, LWMR, LWX, LWXR, LDG R_LOS, R_LOC, R_LOF

SC1, SC2, ST1, ST2 R_LOS, R_LOF, OSC_RDI

FIU MUT_LOS

D40, D48 MUT_LOS

Involved Boardsboards of the following types are involved in realizing the IPA:l Detection board (optional)

– The detection board detects whether the optical power received by each station isnormal.

– boards supporting this function include: OAU, OBU, OPU.

NOTE

If the system has been configured with an auxiliary detection board to determine fiber cuts, thedetection board here can be set to Null on the T2000.

l Control implementation board (required)– The Control implementation board only performs the shut-down function. The detection

board and the control implementation board cannot physically be the same board nomatter if they are in the same IPA pair or not.

– Boards supporting this function include: OAU, OBU, OPU, HBA.l Auxiliary detection board (optional)

– These boards detect the service signals, which can be regarded as one condition of theIPA fiber-break detection. The user can configure a maximum of four auxiliarydetection condition. The alarms of boards are not directly reported. Instead, they aresummarized according to the logic relationship to be one of the criteria for IPA fiberbreak.

– Boards supporting this function include: Various OSC and OTU boards, OTC, D48D40.

8.1.3 Networking ApplicationThis section describes an example of the networking application of the IPA function.

Figure 8-2 is the typical networking application diagram of the IPA function. The transmit endOA in each station serves as a control implementation board, and the receive end OA in eachstation serves as a detection board. The control implementation board and detection board ineach station form an IPA pair. The FIU, OSC, OTU and D40 boards in each station can serveas the auxiliary detection boards which facilitate the accurate determination of fiber cuts.

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Figure 8-2 IPA networking

V40 OA

FIU

SC1

OTU

FIU

OA

OTM OLA

D40 OAOTU

FIU

OA

OA

OTM

D40OA

FIU

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V40OA OTU

receive end OAOAtransmit end OA OA

OA

SC2

8.1.4 Configuration PrincipleThe IPA function can be configured according to customers' requirements.

Configuration Descriptionl When the amplifiers are configured as detection board independently, IPA must only be

configured at the first site and the last site of the link. When there is a fiber break, theamplifier at the first site and the last site of the link are shut down.

l To fulfill the IPA function and judge the fiber break more correctly, detection board andauxiliary detection board must be configured at the same time. IPA must be configured atevery site section by section. When there is a fiber break, the amplifier before and after thefiber break will be shut down.

l To make sure the reliability of the detecting, the auxiliary boardunit should avoid beingconfigured as detection board independently.

l The optical signals of the auxiliary detect board should be in the same direction as theoptical signals transmitted by the main optical path. This is the condition of auxiliarydetection.

NOTE

Each channel of the OTU with multiple optical interfaces on the WDM side can serve as an auxiliary detectionsource.

CAUTIONThe boards involved in the same IPA protection pair must be placed in the same subrack.

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Suggestion on SettingSuggestions about the setting of the IPA are as follows:

l For basic application, the user only needs to configure:– One optical amplifier board as the detection board

– Another optical amplifier as the shutdown board (control executive board)

– Corresponding control parameters

l For complex application, add auxiliary detection board (service signal detection).

l After the configuration of one IPA pair, create other IPA pairs at the opposite end of theline or at the other sites to complete the entire IPA process. Ensure that the IPAs are in pair.

8.2 Intelligent Power Adjustment of Raman SystemThe power of the pump light from Raman amplifiers is very high. Before you turn on a Ramanamplifier, you must configure and enable IPA function. After a fiber cut is detected, shut downthe Raman amplifier, so that the optical power of the entire line is on a safety level.

8.2.1 Function DescriptionTo prevent exposed optical fibers hurting human body, especially eyes, the system provides theIPA functions.

8.2.2 Function ImplementationIPA function is implemented by various boards with different functions.

8.2.3 Networking ApplicationThis section describes an example of the networking application of the IPA function.

8.2.4 Configuration PrincipleIPA function can be configured according to customers' requirements.

8.2.1 Function DescriptionTo prevent exposed optical fibers hurting human body, especially eyes, the system provides theIPA functions.

In the DWDM system, optical fiber break, equipment failure or optical connector removal maylead to the loss of optical signals of the optical channel. To prevent exposed optical fibers hurtinghuman body, especially eyes, and to avoid surge of the optical amplifier, the system providesthe IPA functions. Where the loss of optical power signals happens on one or more optical trunksections on the main optical channel and the optical supervisory channels, the system can detectthe loss of optical signals on the link and instantly shut down the upstream optical amplifier.

The power of the pump light from Raman amplifiers is very high. Hence, in a system configuredwith Raman amplifiers, you must configure and enable IPA function before you turn on a Ramanamplifier. After a fiber cut is detected, shut down the Raman amplifier. Then, there is no strongpump light sent from the LINE interface on the amplifier and thus the optical power of the entireline is on a safety level. After the optical signals in the system become normal, make the amplifierwork normally.

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NOTE

In the first deployment, the lasers of Raman amplifiers are disabled. Users need to configure IPA function onthe T2000. Otherwise, the lasers of Raman amplifiers cannot be enabled.

For a link with Raman amplifiers, it is not allowed that you disable or delete IPA function. During thecommissioning, maintenance and replacement of a Raman amplifier, when you need to remove the fiber fromthe LINE interface on the amplifier, you can shut down the Raman amplifier on the T2000 and then disable IPAfunction.Before removing the fiber, make sure that the Raman amplifier is shut down.

Only NM users that are assigned to the Device Operation Set have the authority to manage Raman amplifiersand IPA function.

If the Raman board is rebooted while the IPA function is working (enabled), and this configuration waspreviously saved on the SCC board, then IPA function is recovered to its original status (enabled) once the rebootprocess finishes.

Figure 8-3 and Figure 8-4 shows how to achieve the IPA function. When there is a fiber breakon the line, the amplifier 3 and 1 are shut down. And the system adopts Raman amplifier(s), shutit down upon any fiber break to lower the optical power of the entire system to a safe levelbecause the optical power of the pump is high.

In some applications, forward and backware Raman amplifiers are used at the same time. IPAis able to shut down all Raman amplifiers.

Figure 8-3 Function description of the IPA (Backward Raman)

fiber break

1 2

34

Site A Site B

RamanAmplifier

RamanAmplifier

Figure 8-4 Function description of the IPA (Forward Raman)

fiber break

1 2

34

Site A Site B

RamanAmplifier

RamanAmplifier

When the optical signals are restored to normal, the optical amplifier will work again. And theamplifier 3 and 1 will be restarted. The Raman amplifier will be restarted also.

After being shut down, the laser is restarted in pulse restart mode. After IPA determines a fiberbreak, the laser on the control implementation board is shut down. Then, restart the laser on thecontrol implementation board to check if the line is recovered. There are three modes in pulserestart.

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l AutomaticSet Restart Mode to Automatic. The control implementation board tests if the line isrecovered by restarting the laser every Off Period. If the line is normal, IPA state iscancelled. If the line remains abnormal, the laser shuts down after On Period. Thepreviously mentioned operation is repeated until the line becomes normal.

l ManualIt is valid only when Restart Mode is set to Manual. Click Manual Reboot. After OffPeriod, the laser is turned on to test if the line becomes normal. If the line is normal, IPAstate is cancelled. If the line is abnormal, the laser shuts down after On Period.

l Start to TestIt is valid only when Restart Mode is set to Manual. Click Start to Test. The laser of thecontrol implementation board is turned on immediately to test if the line becomes normal.If the line is normal, IPA state is cancelled. If the line is abnormal, the laser shuts downafter Testing Period.

NOTE

During the restarting of IPA, Raman amplifiers are shut down. Raman amplifiers are enabled automaticallyafter the link is recovered and IPA returns into the normal working state.

NOTE

In the DWDM system, the IPA function is started only when optical signals of the active optical path arelost. When this function is executed, only the lasers on the main path are shut down. No operation will beimplemented on the optical supervisory channel. Hence the functions of all optical supervisory channelswill not be affected.

8.2.2 Function ImplementationIPA function is implemented by various boards with different functions.

Fiber Break DetectionThere are three methods used to detect the fiber break to achieve the IPA function:

l Detect the optical power of the optical amplifier unit

l Detect the signals of the auxiliary detection unit

l Detect the optical power of the Raman amplifier

Through a combination of these methods, the fiber break can be judged more correctly.Following is the logic of problem handling.l If all the configured detection items meet the fiber break condition at the same time, initiate

the shut down process of the IPA.l If one of the detection conditions recovers to normality, initiate the recovery process of the

IPA.

NOTE

In a system with Raman amplifier(s) or ROP boards, do not use the optical amplifier as the only detectiontool. The backward pump of the Raman amplifier has so much optical scattering power that the downstreamreceive site still detects some noise input power even if there is complete fiber break. This brings difficultto the judgment on optical fiber break. Especially when there are limited signal channels, it is not possibleto determine fiber break only by the detection of the power of the optical amplifier.

Table 8-2 lists the related alarms of the detection board/auxiliary detect board that trigger theIPA:

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Table 8-2 Related alarms of the detection board/auxiliary detect board that trigger the IPA

Detection Board/Auxiliary DetectBoard Alarm Trigger Condition of the IPA

OAU, OBU, OPU MUT_LOS

LWF, LWFS, TMX, TMXS, ETMX,ETMXS, LBF, LBFS, LBE, LBES, TMR,TMRS, LOG, LOGS, LWC, LWC1, TRC,TRC1, FDG, LQM, TRC2, ELOG, ELOGS,IMX4, IMX4S, LW40, LR40, LOM, LOMS

R_LOS, R_LOC, R_LOF, OTU_LOF,FEC_LOF

FCE, LWM, LWMR, LWX, LWXR, LDG R_LOS, R_LOC, R_LOF

SC1, SC2, ST1, ST2 R_LOS, R_LOF, OSC_RDI

FIU MUT_LOS

D40, D48 MUT_LOS

Table 8-3 lists the related alarms of the Raman amplifier that trigger the IPA:

Table 8-3 Related alarms of the Raman amplifier that trigger the IPA

Raman amplifier Alarm Trigger Condition of the IPA

RPC The board detects the input optical power ofthe Raman board. If the optical power is lessthan the lower threshold, a LOS event isreported to the SCC board. The SCC boarddetermines whether to enable IPA function.

Involved Units

Boards of the following types are involved in realizing the IPA:

l Detection board (optional)

– The detection board detects whether the optical power received by each station isnormal. The threshold of the detection board is adjustable to Raman systems. For Ramansystems, thresholds of detection boards need to be re-set. For how to set the thresholdof the detection board, refer to the Configuration Guide.

– Boards supporting this function include: OAU, OBU, OPU.

l Control implementation board (required)

– The Control implementation board only performs the shut-down function. The detectionboard and the control implementation board cannot physically be the same board nomatter if they are in the same IPA pair or not.

– Boards supporting this function include: OAU, OBU, OPU, HBA.

l Auxiliary detection board (optional)

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– These boards detect the service signals, which can be regarded as one condition of theIPA fiber-break detection. The user can configure a maximum of four auxiliarydetection condition. The alarms of boards are not directly reported. Instead, they aresummarized according to the logic relationship to be one of the criteria for IPA fiberbreak.

– Boards supporting this function include: Various OSC and OTU boards, OTC, D48D40.

l Raman amplifier (required)– The Raman amplifier has the shutdown function. Raman amplifier E2RPC01 by

hardware supports optical power loss detection, the optical power detected by theRaman detection unit can be used to judge whether there is IPA fiber break or not afterthe threshold of the Raman amplifier is set and the alarm engagement of the Ramanamplifier is configured. For how to set the threshold of the Raman amplifier, refer tothe Configuration Guide.

– BoardUnits supporting this function include: RPC, RPA, ROP.

l Auxiliary Raman board/ROP board (optional)– This board has only the shutdown function and is needed only when more than one

Raman board/ROP board needs to be shut down. It is allowed to configure one AuxiliaryRaman board and an ROP board.

– Boards supporting this function include: RPA, RPC, ROP.

NOTE

l If there is only one Raman board in one IPA pair, the IPA pair can be configured as Raman amplifier andit has the shutdown and fiber-break detection functions at the same time.

l If there are several Raman boards in one IPA pair, the IPA pair can be configured as one auxiliary Ramanboard and one ROP board other than the Raman amplifier. The board configured as the Auxiliary Ramanboard or ROP board only has the shutdown function.

l The ROP board does not have the detection function. Even if the ROP board is configured as the Ramanamplifier, it can only used as the shutdown board.

8.2.3 Networking ApplicationThis section describes an example of the networking application of the IPA function.

Figure 8-5 is the typical networking application diagram of the IPA function. The west-to-eastOA in each station serves as a control implementation board, and the east-to-west OA in eachstation serves as a detection board. The control implementation board and detection board ineach station form an IPA pair. The RPC board at an endpoint of the line can also be set to performthe shutdown and detection function. The FIU, OSC and D40 boards in each station can serveas the auxiliary detection boards which facilitate the accurate determination of fiber cuts.

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Figure 8-5 IPA networking in a Raman system

V40 OA

FIU

SC1

OTU

FIU

FIU

OA

OA

SC2

OTM OLA

D40 OAOTU

FIU

FIU

OA

OA

SC2

OLA OTM

D40OA

FIU

SC1

OTU

V40OA OTU

RPC

8.2.4 Configuration PrincipleIPA function can be configured according to customers' requirements.

Configuration Descriptionl When the amplifiers are configured as detection board independently, IPA must only be

configured at the first site and the last site of the link. When there is a fiber break, theamplifier at the first site and the last site of the link are shut down.

l To fulfill the IPA function and judge the fiber break more correctly, detection board andauxiliary detection board must be configured at the same time. IPA must be configured atevery site section by section. When there is a fiber break, the amplifier before and after thefiber break will be shut down.

l To make sure the reliability of the detecting, the auxiliary boardunit should avoid beingconfigured as detection board independently.

l The optical signals of the auxiliary detect board should be in the same direction as theoptical signals transmitted by the main optical path. This is the condition of auxiliarydetection.

NOTE

Each channel of the OTU with multiple optical interfaces on the WDM side can serve as an auxiliary detectionsource.

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CAUTIONl Only the board configured as Raman amplifier can be configured in other subracks with

inter-subrack communication. Except this board, the boards involved in the same IPAprotection pair must be placed in the same subrack.

l When you configure the IPA, ensure that the communication between NEs is normal.Otherwise, alarms may occur when you configure the inter-NE IPA. When the IPA is enabled,the IPA ends abnormally if the communication between NEs is abnormal. The IPA returnsactive after the communication returns normal.

l Versions of the NE software involved in the inter-NE communication should be the same.This is to ensure that the communication between NEs is normal. Mixed NE software ofdifferent versions can cause abnormal reset of the SCC.

l When the Raman amplifier functions as the detection board of fiber break, the applicationwavelengths of the system need to be within the range that can be detected by a Ramanamplifier.

Suggestion on SettingSuggestions about the setting of the IPA are as follows:

l For application with a Raman amplifier/ROP board, add Raman amplifier as the detectionboard. Appoint the NE ID and slot ID of the board in the configuration parameter.

l For complex application, add auxiliary detect board (service signal detection) or add morethan one shutdown configuration of auxiliary Raman board/ROP board.

l After the configuration of one IPA pair, create other IPA pairs at the opposite end of theline or at the other sites to complete the entire IPA process. Ensure that the IPAs are in pair.

8.3 Automatic Level ControlThe system provides the automatic level control (ALC) function. As the attenuation on a linesegment is increased, the output power as well as the input and output powers of otherdownstream amplifiers will not be changed. Hence there will be much less influence on OSNR.The optical power received by the receiver will not be changed.

8.3.1 Function DescriptionWhen ALC function is enabled, the increase in the line loss in a section causes the decrease inthe input power of the amplifier in that section. Its output power and the input and output powerof the downstream amplifiers remain the same.

8.3.2 Function ImplementationALC function is implemented by various boards with different functions.

8.3.3 Networking of ApplicationIt requires creating ALC link on the line to perform the adjustment of the ALC.

8.3.4 Configuration PrincipleALC is optional and configured according to users' requirement.

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8.3.1 Function DescriptionWhen ALC function is enabled, the increase in the line loss in a section causes the decrease inthe input power of the amplifier in that section. Its output power and the input and output powerof the downstream amplifiers remain the same.

In a DWDM system, optical fiber aging, optical connector aging or manual factors may lead toabnormal loss of transmission lines. In case the loss on a line segment increases, all input andoutput power is reduced on all downstream amplifiers. The system OSNR deteriorates. At thesame time, the received optical power will also be reduced. Receiving performance will begreatly affected. The closer the attenuated segment is to the transmission end, the greater is theinfluence on OSNR, as shown in Figure 8-6.

If ALC function is activated, this effect can be minimized. As the loss on a line segment isincreased, the input power on the amplifier is reduced. But due to ALC, the output power as wellas the input and output powers of other downstream amplifiers will not be changed. Hence therewill be much less influence on OSNR. The optical power received by the receiver will not bechanged. Figure 8-7 shows the power changes on optical line amplification regenerators in theALC mode in case of abnormal loss on optical fiber lines.

Figure 8-6 System power with ALC inactivated

High line losses

Attenuated outputAttenuated input

Normal output

Figure 8-7 System power with ALC activated

High line losses

Normal inputAttenuated input

Normal output

NOTE

Normally, two elements might cause the input power change in the optical amplifier:

l The addition/reduction of access channels (multiple channels might be added or dropped at the sametime).

l The abnormal loss in the physical media.

8.3.2 Function ImplementationALC function is implemented by various boards with different functions.

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Realization PrincipleThere are three ways to achieve the ALC function: link attenuation adjustment mode, referencepower detection and channel amount detection. The realization principle of the channel amountdetection mode is relatively simple, and the multichannel spectrum analyzer unit (MCA) needsto be configured. Although the reference power detection mode does not need to be configuredwith MCA, the realization principle of it is complicated because many parameters need to beset. The link attenuation adjustment mode is optimized on the basis of the reference powerdetection mode.

l Link attenuation adjustment modePrerequisite: The reference node (generally the first node) sends its output optical powervalue and the gain offset value to its downstream every ten seconds. Then the upstreamnode sends the output optical power value and the accumulative offset value to itsdownstream node. Each node queries the parameters every three seconds. If the downstreamnode does not receive the parameter values sent from its upstream node, the downstreamnode sends queries to the upstream node.Realization: The ALC compares the line attenuation with the gain of the amplifier, nodegain compensation offset and gets the gain offset value. The ALC adjusts the nominal gainof the optical amplifier board or Attenuation adjusting board. The attenuation and gain ofthe link can be adjusted to the same to ensure the power budget of the entire link.

l Channel amount detectionPrerequisite: One MCA needs to be configured on the ALC link.Realization: The optical amplifier works in automatic gain control (AGC) mode andrealizes ALC function with the MCA. The MCA analyzes the amount of working channels.Based on the amount of channels and the output power, the optical amplifier determinesthe working status and adjusts the attenuation to keep the output power stable (the absolutevalue of total power remains unchanged).

l Reference power detectionPrerequisite: The output optical power of the first node on the ALC link is taken as areference value.Realization: The optical amplifier works in AGC mode, by adjusting the attenuation to keepthe output optical power stable. (The absolute value of total power remains unchanged.)ALC detects gain exceptions for a reference node to check whether the output power isabnormal. The input and output power of the reference node are checked in a scheduledmanner, to obtain the actual gain value. The gain value is compared with the configuredstandard gain. If the gain change exceeds the exception threshold, a gain exception isreported to the T2000 to prompt the user to start ALC adjustment.

Single-Site ALC Detection Flowl Link attenuation adjustment mode

The realization of single-site ALC function is described in the following sections. Figure8-8 shows the relationship between upstream and downstream nodes. Figure 8-9 showsthe single-site ALC abnormity detection flow in this mode.

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Figure 8-8 Optical power relationship of nodes

P 1out P 2in P 2out

Gain

(Reference node)Node 2Node 1

Upstream

(Detection node)

Span lossDownstream

– The first node initiates queries regularly. After the ALC detection begins, an upstreamnode sends its output optical power value (Pout1) and the offset value between gain andattenuation (Paccumulate offset1) to its downstream every ten seconds. To receive theparameter values sent from its upstream node, the downstream node will send queriesto the upstream node.

– The detection node queries the Pin2 and gain of itself.

– The node calculates the line attenuation.Line Attenuation = Pout1 – Pin2

– Compare the gain with the link attenuation on the local node. Take the gain offset ofthe amplifier for compensating for line noises into account. Then, calculate the gainoffset Poffset2 of the local node:

Poffset2=Node Gain - Line Attenuation + Pcompensation offset

NOTE

l In the link, the gain offset of all nodes except for the first node can be obtained through theabove formula. Pcompensation offset takes the value when optical power commissioning in thelink is normal, that is, when the gain offset Poffset2 of the node is 0.

l Pcompensation offset of the first node is 0.

– With Paccumulate offset1 of the upstream node and Poffset2 of the local node, you can obtainthe accumulated offset by the following formula:Paccumulate offset = Poffset2 + Paccumulate offset1

– Check if the accumulated offset is within the preset range (that is, Power AbnormityDetection Threshold). If the offset exceeds the threshold, check whether the numberof threshold crossing actions is more than 3 or not. If not, clear P1out and Paccumulate

offset1 of the upstream node that are stored in the local node. Query the value of theupstream node again, and make offset calculation and comparison. If the number ofthreshold crossing actions is more than 3, an abnormity is reported and the first nodeinitiates adjustment.

NOTE

The following show the relation between parameters in the formula and those on the T2000.

l Pcompensation offset: Node gain compensation offset

Figure 8-9 shows the ALC abnormity checking flow of the gain adjustment.

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Figure 8-9 Flow chart of NE abnormity checking (Link attenuation adjustment mode)

Initiate the detection.

Start

Receive the Pout1 andPoffset1 sent by the

adjacent upstream node.

Query the Pin2 and gainof this node.

Calculate the loss of thisnode.

Compare the gain andloss and adjust the gain

compensation.

Calculate the offset.

Does the offset exceed thethreshold?

Report the anomaly.

The first node initiatestheadjustment.

End

Wait for the nextdetection.

Query the Pout1 andPoffset1 of the upstream

node.

Clear the Pout1 and Poffset1of the upstream node thatare saved by this node.

No

Yes

Yes

No

Has the threshold beenexceeded for more than

three times?

l Channel amount detection and reference power detection

Figure 8-10 shows the ALC exception detection flow of channel amount detection andreference power detection. To implement the ALC at a single site, follow the steps below:

– The output optical power of the first site on the ALC link is taken as a reference value.

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– The SCC periodically checks the output optical power of the optical amplifier unit, andcompares it with the standard output power.

– If the difference between them is beyond a certain range, and it is not power fluctuationcaused by adding or dropping wavelengths, output power exceptions are reported to theT2000.

– User can manually restart or the system can automatically triggers the ALC poweradjustment process according to the configuration.

Figure 8-10 ALC exception detection flow (channel amount detection and reference powerdetection)

Node configuration finished

Timing detection of outputof the power detection unit

Compared to reference value of theoptical amplifer to judge threshold-crossing or not

Reporting to user after confirming exception

No

Yes

Calculation of the standard output power is as follows. For the detailed definitions of theparameters, refer to Table 8-4.– Channel Amount Detection

P = StdPower + Offset + 10lgNN = number of channels

– Reference Power Detection + Noise compensationWhen Pref ≥14dBm:P = Pref + offset + Poffset (1)When Pref<14dBm:P = Pref + offset + Poffset + (14 – Pref) x Pase/ (14- StdPower) (2)

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Table 8-4 Definition of parameters for the calculation of the standard output power

Symbol Definition Description Value

P Standardoutput power

The ALC function judges whetherthe output optical power at a nodeis normal by comparing it with thestandard output optical power. Ifthe detected output optical powervalue is not within the standardoutput optical power range, theoutput power value is consideredabnormal.

Measured value(the output opticalpower of the opticalamplifier unit whenthe system operatesnormally)

Pref Output powerof thereferencenode

Detected output optical power ofthe reference node (usually the firstnode of the ALC link).

Measured value(the output opticalpower at thereference point)

Offset Standardpower offset

The difference between thestandard optical power of a singlewavelength of the amplifier at thedetection point and that of theamplifier at the reference point.

Counted value a

Poffset c Overalloptical poweroffsetcompensationrate

When the total power of the systemreaches a certain value, theaccumulated noise can be regardedfixed. Adopt a fixed Poffset tocompensate for it.

Counted value(formula 1, 2)

Pase c Single-wavelengthASE noisecompensationrate

Pase mainly applies to the situationwhere there are only a few systemwavelengths. The noise caused bythe amplifier is rather big andrequires extra compensation.

Counted value(formula 1, 2)

StdPower

Standardoutput powerfor singlewavelength

The standard output optical powerof a single wavelength of the opticalamplifier (noise influence is notconsidered).

1 dBm–7 dBm(parameter of theoptical amplifierunit) b

a: For channel amount detection, when you decide the value of the Offset, take intoconsideration the power difference caused by noise compensation besides the single-channel standard optical power difference. The deviation caused by noise also needs tobe set because the output optical power of the optical amplifier board can be differentfrom the standard output. For instance, the output optical power can be raised a bitconsidering the ASE noise of the optical amplifier. The user can set it based on the actualsituation. The deviation range is from –3 dB to 5 dB.b: The value of Stdpower can be selected from 1 dBm to 7 dBm for different systems.c: The value of the Poffset and the Pase can be calculated according to formula.

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ALC Link Adjustment Flow(Link Attenuation Adjustment Mode)The ALC adjustment is divided into two flows: ALC pre-adjustment and ALC adjustment. Thesystem begins the ALC adjustment after the ALC pre-adjustment is completed.

Figure 8-11 shows the following flow of ALC pre-adjustment.l When one node in the link is abnormal, it sends an abnormity notice to the first node. Then

the first node sends a pre-adjustment command to the downstream nodes.l Each node on the ALC link checks whether the MUT_LOS, R_LOS or BD_STATUS alarm

happens on the corresponding interface of the relative board. If no alarm exists, the nodeturns into the wait-to-adjust state and sends the pre-adjustment command to its downstreamnode. The system terminates the ALC adjustment of the node if any of the previous threealarms exists.

l When the last node turns into the wait-to-adjust state, it sends the pre-adjustment endingcommand to the first node. The ALC pre-adjustment is completed.

Figure 8-11 Flow chart of ALC link pre-adjustment(link attenuation adjustment mode)

End

The node turns intothe waiting state.

The node sends thepre-adjustment

ending message tothe first node.

Start

The first nodereceives the

message of anomaly.

Yes

No

Yes

Does the node hasalarms?

No

Does the node hasalarms?

Do not perform theALC adjustment.

NoIs the node the last

node?

Yes

The node turns intothe waiting state.

No

The node sends thepre-adjustmentcommand to the

downstream node.Yes

The systemterminates the link

adjustment.

No

Yes

The systemterminates the link

adjustment.

Is the link set tobe automaticall adjusted?

Is the node thefirst node?

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Figure 8-12 shows the following flow of ALC link adjustment.l After the first node receives the pre-adjustment ending command, the system performs the

ALC adjustment.l Each node checks whether any alarm exists. If any alarm exists, the system terminates the

ALC adjustment and broadcasts the termination of ALC adjustment to all the links.l If no alarm exists, check whether the node state is abnormal. If the node is normal, check

whether the node is the last node. If the node is not the last node, it sends the adjustmentcommand to its downstream node.

l If the node is abnormal, check whether the current node needs to be adjusted after twiceadjustments. If that is the case, the node reports the adjustment failure message to the systemand broadcasts the message to all the links.

l After the last node completes the adjustment, it sends the ALC adjustment ending message.

Figure 8-12 Flow chart of ALC link adjustment(link attenuation adjustment mode)

The first node receivesthe preadjustment

ending event.

Start

The first node reportsthe link adjustment

starting event.

Does the node havealarms?

The node reports theadjustment failure

message andbroadcasts the

message to all the links.

The node terminatesthe link adjustment.

Does the node receive theadjustment command?

The system does notperform the ALC

adjustment.

The node reports the adjustmentfailure message and broadcasts

the message to all the links.

The ALC adjustment isperformed at this

node.

The system judges thestate of each node for

the second time.

Is the state of the nodeabnormal?

The system does notperform the ALC

adjustment.

End

The node sends theadjustment command tothe downstream node.

The node sends the linkadjustment ending message to

the first node.

Does the current nodeneed to be adjusted after

twice adjustments?

Is the node the last node?

Yes

Yes

Yes

Yes No

No

Yes

No

No

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ALC Link Adjustment Flow(Channel Amount Detection and Reference PowerDetection)

Figure 8-13 ALC adjustment flow(channel amount detection and reference power detection)

The system reports abnormal ending ofALC adjustement, protocol frames are

broadcast to all links. Nodes then clear theALC state when receive the protocol frames

Whether to implementALC adjustment?

Deliver refreshexception command in

a hidden way

Is the informationthe same before the

refresh?

Deliver the ALCadjustment command

No

Yes

NoYesFirst node?

Enter into theadjustment status

Receive the adjustmentcommand

Enter into theadjustment-waiting

status

Check the outputpower

Powerabnormal?

optical amplifier

Adjust theattenuation rate of the

Adjust success?

Last node?

Report the end ofadjustment event to T2000

Deliver theadjustment flag to

the next stationYes

No

Yes

NoYes

No

The T2000, after receiving the power exception events reported by the NE software, performsthe adjustment as shown in Figure 8-13.

l After the T2000 reports the ALC power exceptions, the service channel can determinewhether to execute the ALC adjustment command by referring to other system information.

l When the ALC adjustment command is executed on the T2000, the T2000 delivers acommand to update the ALC exception information in a hidden way. Then, the NE software,after receiving the command to update the exception information from the T2000, checksthe link reference. After that, each node directly judges if the output optical power isabnormal based on the latest reference obtained (namely, with no need to confirm). If yes,the exceptions are reported to the T2000. Otherwise, no processing is made.

l If the exception information returned from the host is consistent with that before the userdelivers the adjustment command, the T2000 formally delivers the ALC adjustmentcommand. If the exception information returned changes, the event indicating the end of

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adjustment is reported. Thus, it can be ensured what the system adjusts after the user startsthe ALC adjustment is what the user can see and wants to adjust.

l During the ALC adjustment on the ALC link, the first site reports the ALC adjustment startevent when the ALC adjustment begins and the last site reports the ALC adjustment endevent when the ALC adjustment ends. Each site reports the VOA adjustment event whenthe VOA adjustment begins on it or ends on it.

l During the adjustment, in case of an abnormal event (for example, the adjustment scope ofthe system exceeds the adjustable scope of VOA) that stops the normal ALC adjustmentan ALC abnormal pause event is reported. Besides, a protocol frame is broadcasted to theentire link, requiring the link nodes that receive the protocol frame to clear their ALC states.

Involved Boards and Ports

Boards of the following types are involved in realizing the ALC.

l Reference Unit

– For the wavelength count detection mode: Detects signals in each channel on the receiveend and provides ALC with the wavelength count information.

– Boards supporting this function include: MCA.

– For the power reference mode or the link attenuation adjustment mode: Provides theoutput power of the node as reference for the downstream node.

– Boards supporting this function include: OAU, OBU, OPU.

l Power Monitoring Unit

– The power monitoring unit detects the output power to judge whether the link is normal.

– Boards supporting this function include: OAU (The OAU is an optical amplifier unitbut can function as an adjusting unit because of its VOA), VOA, VA4, VA2.

l Power Regulating Unit

– The power regulating board adjusts the optical power.

– Boards supporting this function include: OAU, VOA, VA4 (The OAU is an opticalamplifier unit but can function as an regulating unit because of its built-in VOA).

l Optical Supervisory Channel Unit

– The supervisory channel unit provides supervisory channel connection and the physicalchannel to transmit protocol frames.

– Boards supporting this function include: SC1, SC2, ST1, ST2.

l System Control and Communication Unit

– Functions as the executive board for the ALC function.

– Boards supporting this function include: SCC.

l Ethernet port

The Ethernet port enables inter-subrack communication, and realizes the communicationwith the subrack where the supervisory channel board is located. It also transmits ALCprotocol frames. The Ethernet port is used for the connection between subracks.In standardsubracks, it must be the ETHERNET1 in the interface area.

NOTEThe OAU board must be gain adjustable in the link attenuation adjustment mode.

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8.3.3 Networking of ApplicationIt requires creating ALC link on the line to perform the adjustment of the ALC.

To fulfill the ALC application, the ALC link must be created first. Take the ALC networking asan example. See Figure 8-14.

Figure 8-14 Networking of ALC application

OTM OLA OLA OLA OTM

OTM OLA OLA OLA OTM

A C D E

westeast

B

OTM OLA OLA OLA OTM

Adjusting Direction of ALC Link in East Transmisson

ALC NE 5 ALC NE 4 ALC NE 3 ALC NE 2

ALC NE 2 ALC NE 3 ALC NE 4 ALC NE 5

protocol channel direction

ALC NE 1

east east eastwestwestwest

Link 1

Link 2

ALC NE 1

Adjusting Direction of ALC Link in West Transmission

Creating the ALC Protocol Channel

The information exchange between ALC link nodes needs to be conducted by using the ALCprotocol frames transmitted on the supervisory channel. Configuring a protocol channel is theprecondition for providing the normal ALC adjustment function. The units that can provide thesupervisory channel are SC1/SC2/ST1/ST2. The track direction of the protocol channel can beset to eastward or westward.

NOTE

The direction configured for the ALC protocol channels must be correct, and consistent with the physicalcabling direction of the supervisory channel unit. If you do it the opposite way, the protocol channels maywork normally, but the protocol frames are transceived in the wrong direction. Thus, normal informationexchange cannot be implemented, as well as the ALC function.

Creating ALC Link

It requires creating ALC link on the line to perform the adjustment of the ALC. The ALC linkincludes the nodes that take part in the adjustment of the ALC. To determine the ALC linkdirection, refer to Figure 8-14. For link 1, as its direction is consistent with the protocol channel

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direction, it is in the forward direction. For link 2, as its direction is contrary to the protocolchannel direction, it is in the backward direction.

NOTE

As for the line that has the OADM stations, regard the transmit end and the receive end of the OADM astwo ALC links. The optical amplifier at the receive end of the OADM site is regarded as the last node inthe former ALC link. The optical amplifier at the transmit end of the OADM site is regarded as the firstnode in the next ALC link.

8.3.4 Configuration PrincipleALC is optional and configured according to users' requirement.l To implement the ALC function, configure the power regulating board on the adjusting

site, and configure the optical amplifier board on the reference site(the first node of theALC link in reference power detection mode or any node in channel amount detectionmode).

l The last node should not be configured to be the reference node. The first node should beconfigured with a reference unit.

l When you configure the first node, one board as a detection unit or that as a reference unitshould not be configured with the same optical port.

l Nodes that have wavelength adding and dropping are recommended to be configured asreference nodes.

l For the optical amplifier unit, it is allowed that the node without optical amplifiers servesas the pass-through node. The node provides only the protocol channel.

l To implement the ALC function, install the optical amplifier unit, power regulating unitand OSC unit in one subrack. If OSC unit are not in one subrack, use the ETHERNET forinter-subrack communication

8.4 Automatic Power EquilibriumThe system provides the automatic power equilibrium (APE). With the APE function, you canenable the system to automatically adjust the optical power of the transmit end of each channelto keep the flatness of the optical power of the receive end to maintain the OSNR.

8.4.1 Function DescriptionWith the APE function, you can retain the flatness of the optical power of the receive end andto maintain the OSNR.

8.4.2 Function ImplementationThe APE function is implementation by the service unit and the SCC unit.

8.4.3 Networking ApplicationIntroduces the networking for this application, illustrating only the unidirectional APE pair.

8.4.4 Configuration PrincipleAPE is optional and configured according to users' requirement.

8.4.1 Function DescriptionWith the APE function, you can retain the flatness of the optical power of the receive end andto maintain the OSNR.

In a DWDM system, the variety of the optical fiber condition in the running of the system maychange the flatness of a channel' s power from that in the commissioning, and degrade the optical

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signal noise ratio (OSNR) of signals at the receive end, as shown in Figure 8-15. With the APEfunction provided by the system, you can enable the system to automatically adjust the opticalpower of the transmit end of each channel to retain the flatness of the optical power of the receiveend close to that in the commissioning and to maintain the OSNR, as shown in Figure 8-16.

Figure 8-15 Flatness of the optical power at the receive site when APE is not activated

OTM OTMOLAOADMOLA

flatness of the optical power at the recieve site

Figure 8-16 Flatness of the optical power at the receive site when APE is activated

OTM OTMOLAOADMOLA

flatness of the optical power at the recieve site

The application of the APE streamlines the operation of the DWDM system commissioning andsubsequent network maintenance for the operator. The design of starting regulation manuallyfacilitates you to determine whether to adjust the optical power according to the actual status ofthe network.

When new wavelengths are added, the system supports the automatic handling of these addedwavelengths and fits the deviation curve for the added wavelengths automatically to avoid theinconvenience caused by manual adjustment.

8.4.2 Function ImplementationThe APE function is implementation by the service unit and the SCC unit.

Implementation Principles

To implement the APE, follow the steps below:l During the commissioning, apply manual adjustment on the power regulating unit to ensure

that each channel is working normally and that bit error rate and OSNR meet therequirement.

l After the commissioning, save the power curve of the receive end as the standard powercurve.

l Detect optical power of every channel received by the power monitoring unit through theoptical port at the receive end.

l According to the detected optical power of every channel, adjust the attenuation rate of theaccording channel of the power regulating unit, so as to maintain the optical signal-to-noiseratio (OSNR) of every channel at the receive end by keeping the flatness of the opticalpower of every channel.

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NOTE

During the running of the equipment, the power monitoring unit analyzes the data scanned in a spectralscanning period, which is set in the power monitoring unit configuration and is not provided in the APE.If the power offset exceeds the threshold configured, the system reports the event of optical powerunbalance. The user can enable the automatic adjustment or determine whether to adjust it based on thenetwork condition.

Involved BoardsThe APE functions through the service board and the SCC board. The APE involves boards ofthe following types:l Power monitoring unit

– It detects the signal power of the channels at the receive end and reports an APE unevenevent.

– boards supporting this function include: MCA.

l Power regulating unit– It is the adjusting entity of the APE and adjusts the attenuation of channels.

– boards supporting this function include: V40, V48 or DGE.

l System control and communication board– It is the executive entity of the APE.

– boards supporting this function include: SCC.

NOTE

As for the APE function, the APE protocol frames can be transmitted to each node once the physicalcommunications route is available. Besides the OSC, the APE protocol frames can be transmitted alsothrough ESC, interconnection of Ethernet interfaces or DCN.

8.4.3 Networking ApplicationIntroduces the networking for this application, illustrating only the unidirectional APE pair.

The optical power adjustment is realized in two ways: VMUX mode and DGE mode. However,there is a difference between the two modes. The DGE performs the adjustment of the opticalpower of the optical channel with spacing of 50 GHz. In VMUX mode, the channels in oddnumber and in even number with spacing of 100 GHz are adjusted by the VMUX boards in oddnumber and in even number respectively.

VMUX Adjusting ModeFigure 8-17 shows the networking for this application, illustrating only the unidirectional APEpair.

As for the APE function, the optical interface of the MCA at the receive site detects the opticalpower equilibrium of each channel. Then the VMUX (V40/V48) at the transmit end adjusts theoptical power attenuation value to balance the OSNR of each channel according to the detection.The communication between sites is achieved through the supervisory channel.

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Figure 8-17 APE networking (VMUX mode)

V40

D40

OA

OA

FIU

D40

V40

OA

OA

FIU

Detection Station

SC1 SC1

OTU

OTU

OTU

OTU

MCA

Adjustment Station

DGE Adjusting Mode

When there is an OEQ site on the line, enable the APE function by configuring a DGE in theOEQ site. The implementing principle is similar as that of the VMUX (V40/V48). Usually, theAPE function is performed in two sections:

l The VMUX (V40/V48) at the transmit-end OTM site and the MCA at the OEQ site forman APE pair

l The DGE at the OEQ site and the MCA at the receive-end OTM site form an APE pair

Figure 8-18 shows the network for this application, illustrating only the unidirectional APE pair.

Figure 8-18 APE networking (VMUX and DGE mode)

V40 OA

FIU

SC1

OTU

FIU

FIU

OA OADGE

OAOA DGE

SC2

MCA

OTM OEQ OTM

D40 OAOTU

D40OA

FIU

SC1

OTU

V40OA OTU

MCA

8.4.4 Configuration PrincipleAPE is optional and configured according to users' requirement.l It is recommended not to configure the APE pair that cross spans to avoid errors during

regulation.

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l To implement the APE function, make sure that the regulating site at the transmit end isconfigured with the regulating board , and the monitoring site at the receive end should beconfigured with the monitoring board. In a DWDM two-fiber bidirectional system, onemonitoring board and one regulating board should be configured at the two ends of an APEpair.

l To implement the APE function in a system adopting OSC communication mode, it isrequired to install the supervisory channel unit and the monitoring unit in one subrack. Ifnot, the communication is realized with the ETHERNET interface of the subrack.

l To implement the APE function in a system adopting OSC communication mode, it isrequired to install the supervisory channel unit and the regulating unit in one subrack. Ifnot, the communication is realized with the ETHERNET interface of the subrack.

l The system adopts master slave control. The detecting node is the master node and performsdetecting, judging, calculating, and communicating. The adjusting node only performschannel adjusting according to protocol frames. The user needs to configure at the detectingnode only. The user needs to configure at the MCA node only. The user needs to appointonly the VMUX odd node (for adjusting of the odd channels), VMUX even node (foradjusting of the even channels), the monitoring subrack at the receive end and at the transmitend to "null" as the default value.

l To enable the APE function for all channels by installing a DGE board on the OEQ station,select the DGE board in the Power Regulating Subrack of EVEN wavelength and PowerRegulating Unit of EVEN wavelength drop-down lists of the Create APE Pair tab.

l To start the APE function, the adjusting board and one of optical interfaces of the monitoringunit should be first configured as an APE function pair, and enable APE function.

l OADM stations may exist between an adjustment station and a detection station. ThoseOADM stations usually have wavelengths added and dropped locally. In such as case, theAPE cannot equalize the optical power of the wavelengths added and dropped at the OAMDstation. Therefore, disable the monitoring flag of the wavelengths to be added and droppedat the OAMD station.

8.5 Enhanced Automatic Power Equilibrium (EAPE)The system provides the enhanced automatic power pre-equilibrium (EAPE). EAPE adjustmentcan be enabled to ensure that the receive-end signal quality of each channel meets the presetrequirement and that the services are available.

8.5.1 Function DescriptionEAPE adjustment can be enabled to ensure that the receive-end signal quality of each channelmeets the preset requirement and that the services are available.

8.5.2 Function ImplementationEAPE function is implementation by the OTU unit, power adjustment unit and SCC board.

8.5.3 Networking ApplicationThe EAPE function can be applied in two typical scenarios.

8.5.4 Configuration PrincipleThe EAPE function is optional at the customer's requirement.

8.5.1 Function DescriptionEAPE adjustment can be enabled to ensure that the receive-end signal quality of each channelmeets the preset requirement and that the services are available.

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EAPE adjustment can be enabled to ensure that the receive-end signal quality of each channelmeets the preset requirement and that the services are available. In practice of WDM systemoperation, the optical power flatness of each channel, compared with that during deploymentcommissioning, greatly changes due to fiber condition variation.As a result, the quality ofreceived signals does not meet the requirement. When the OTU at the receive end detects thatthe quality of the signals does not meet the design requirement, if the optical power of the OTUat the receive end does not cross the threshold and no BIP8 bit error exists, EAPE adjustmentcan be enabled to ensure that the receive-end signal quality of each channel meets the presetrequirement and that the services are available.

8.5.2 Function ImplementationEAPE function is implementation by the OTU unit, power adjustment unit and SCC board.

Implementation PrinciplesTo implement the EAPE, follow the principles below:

l During deployment commissioning, manually adjust the optical power of each channel toobtain signal quality that meet the requirement. This ensures that each channel normallyoperates.

l During system operation, the OTU at the receive end detects the signal quality of eachchannel.

l When the OTU at the receive end detects that the quality of the signals does not meet thedesign requirement, if the optical power of the OTU at the receive end does not cross thethreshold and no BIP8 bit error exists, adjust the optical power attenuation ratio of thecorresponding channel according to the actual situation. This ensures that the receive-endsignal quality of each channel meets the preset requirement and that the services areavailable.

Involved UnitsThe EAPE functions through the service board and SCC board. The EAPE involves boards ofthe following types:l OTU detection unit

– Detects the receive-end signal quality of each channel and reports any EAPE unbalanceevent detected.

– Boards supporting this function include: ELOG, ELOGS, ETMX, ETMXS, FDG,IMX4, IMX4S, LBE, LBES, LBF, LBFS, LOG, LOGS, LOM, LQM, LOMS, LR40,LWC1, LW40, LWF, LWFS, TMX, TMXS, TMR, TMRS, LRF, LRFS, TRC1 andTRC2.

l Power adjustment unit– It is the EAPE adjustment entity that adjusts the optical power of each channel.

– Boards supporting this function include: WSM9, WSD9, WSM5, WSD5, WSMD4,DWC, EDWC, V40, V48, VA2, VA4 and VOA.

NOTE

These units contain VOA modules, which realizes the optical power adjustment on a wavelengthlevel.

l Received signal selection unit

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– The system determines the optical power of which channel (working or protectionchannel) to be adjusted according to the channel information provided by the OLP orDCP board.

– Boards supporting this function include: OLP, DCP.

l System control and communication unit– The executive entity of the EAPE.

– Board supporting this function include: SCC.

NOTE

For the EAPE function, EAPE protocol frames can be sent to each node as long as the physicalcommunication route is reachable. The EAPE protocol frames can be sent in modes such as the OSC andESC.

8.5.3 Networking ApplicationThe EAPE function can be applied in two typical scenarios.l Basic application mode

l OLP/DCP + OTU configuration mode

NOTE

This section takes the V40 unit as an example of the power adjustment unit to describe the EAPEapplication.

Basic application modeBasic application mode in which only one EAPE pair need be configured. Figure 8-19 showsthe networking diagram of this application mode. The figure illustrates only the unidirectionalEAPE pair.

In this scenario, when the sink OTU detects an anomaly, the OTU reports to SCC, then anexceptional EAPE event is reported to and displayed on the NM system. This event prompts theuser to start EAPE adjustment so that the corresponding power adjustment unit at the source endfinely tunes the optical power at the transmit end.

Figure 8-19 Networking diagram of the basic EAPE application mode

V40 OAFIU

D40OAFIU

Detection Station

SC1 SC1

OTU1

Adjustment Station

OTUn

OTU1

OTUn

SinkSource

OLP/DCP + OTU Configuration modeIn the case that the system is configured with OLP/DCP + OTU boards to realize optical channelprotection, only one EAPE pair needs to be configured. Figure 8-20 shows the networking

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diagram of this application mode. The figure considers the OLP unit as an example to illustrateonly the unidirectional EAPE pair.

In this scenario, working and protection signals are accessed to different power adjustment units.When the sink OTU detects an anomaly, the OTU queries the sink OLP to determine the opticalpower of which channel to be adjusted. Then the OTU reports to the SCC, and an exceptionalEAPE event is reported to and displayed on the NM system. This event prompts the user to startEAPE adjustment so that the corresponding power adjustment unit at the source end finely tunesthe optical power at the transmit end.

Figure 8-20 Networking diagram of the system configured with OLP + OTU boards

V40 OA FIU

D40

D40

OA

OA

Detection Station

SC1 SC1

Adjustment Station

OTUn OTUn

OTUn

V40 OA FIU

SC1

OTUn

FIU

FIU

OTU1Source

Source

OTU1Sink

OLP

Sink

SC1

OLP

8.5.4 Configuration PrincipleThe EAPE function is optional at the customer's requirement.

l EAPE requires that the monitored channel is a complete end-to-end wavelength channelwithout any intermediate add or drop wavelength.

l An OCh path with electrical regeneration stations equals to two independent wavelengthsand thus need be configured with two EAPE pairs.

l EAPE requires that the adjustment board is configured in the station at the transmit endand the OTU detection board is configured in the station at the receive end .

l For the basic application scenario, you just need to specify the source OTU, sink OTU andworking adjustment board.

l When the system comprises OTU and OLP/DCP boards, the following configurationprinciples need be satisfied:

– Besides specifying the source OTU and sink OTU, you also need to specify the OLP orDCP board and the working and protection adjustment boards.

– The source OTU, adjustment board, OLP/DCP, sink OTU can be installed on differentNEs. Note that the source OTU and sink OTU cannot be installed on the same NE.

– The working and protection adjustment boards can be configured in different slots ofthe same NE.

– For the OLP, the working adjustment board is connected to interface 1 of the OLP, theprotection adjustment board is connected to interface 2 of the OLP.

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– For the DCP, the working adjustment boards are connected to interface 1 or 3 of theDCP, the protection adjustment boards are connected to interface 2 or 4 of the DCP.

l For precatution of the OTU configuration, follow the description below:– The FEC function of the source OTU and sink OTU should be enabled.

– The FEC mode of the source OTU and sink OTU should be the same.

– After EAPE is configured, the FEC working mode and status of the OTU must not bechanged.

l After EAPE is configured, the NE ID must not be changed.

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9 Operation, Administration and Maintenance

About This Chapter

The product supports every type of functions that ensure the normal operation, propermanagement, and proper maintenance of the system.

9.1 System OperationThis section describes technologies and methods to ensure normal system running.

9.2 Administration and MaintenanceThe design of the cabinet and boards and the configuration of the system embody therequirements on easy and effective operation, administration and maintenance of the equipment.

9.3 NE Security Management FeaturesSecurity management is to prevent illegal users from logging in to the network. It is an importantfeature to ensure the network security.

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9.1 System OperationThis section describes technologies and methods to ensure normal system running.

In order to improve the WDM system, the system adopts various technologies to control, adjustand manage the system. This is to ensure the normal and effective running of the system.

l The system provides the automatic power equilibrium (APE) function. With this, the systemcan automatically adjust the launched optical power of each channel. In this way, powerequilibrium at the receive end is achieved and the optical signal-to-noise ratio (OSNR) isimproved.

l The system provides the enhanced automatic power equilibrium (EAPE) function. Basedon the signal quality of each channel that the OTU at the receive end monitors, the systemautomatically adjust the launched optical power of each channel. This ensures that thereceive-end signal quality of each channel meets the preset requirement and that the servicesare available.

l The system provides the automatic level control (ALC) function. This keeps the opticalsignal at a normal level and prevents the input and output power of the downstream opticalamplifiers from declining. This improves the quality of the signals.

l The system provides the intelligent power adjustment (IPA) function. Where the loss ofoptical power signals happens on one or more optical trunk sections on the main opticalchannel and the optical supervisory channels, the system can detect the loss of opticalsignals on the link and instantly shut down the upstream optical amplifier. Then, all thedownstream optical amplifiers have no optical power output due to the amplifier feature.This protects the human body from the exposure to the laser emitted from any open interfaceof fiber cracks.

l The system fully considers the demands for optical fiber management. Various cablingchannels are available to facilitate the fiber management in a cabinet and between cabinets.

l The system is designed with intelligent system for ambient temperature monitoring,reporting and alarming. This ensures that the normal running of the system is under a stabletemperature.

9.2 Administration and MaintenanceThe design of the cabinet and boards and the configuration of the system embody therequirements on easy and effective operation, administration and maintenance of the equipment.

9.2.1 Supervision and Administration ModuleThe system control and communication (SCC) board monitors and manages the system NE. Thepower monitoring unit (PMU) in the power box of the system fulfills the input of externalenvironment alarms and the output and concatenation of various alarms.

9.2.2 Optical Supervisory Channel AdministrationThe management information of the stations in the system is transmitted through the opticalsupervisory channel (OSC).

9.2.3 Optical Fiber Line Automatic MonitoringThe OptiX BWS 1600G provides the Optical fiber line Automatic Monitoring System (OAMS)to alert fiber aging, fiber alarm, and locate the fault.

9.2.4 Networking Management

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The system supports the management of the network management tool over equipment.

9.2.5 System MaintenanceThe system uses the alarm and performance event monitoring function for administration andmaintenance.

9.2.1 Supervision and Administration ModuleThe system control and communication (SCC) board monitors and manages the system NE. Thepower monitoring unit (PMU) in the power box of the system fulfills the input of externalenvironment alarms and the output and concatenation of various alarms.

SCCThe SCC collects the state information, alarm and performance parameters from the functionalmodules of each board. Then the SCC converts, processes and stores the information andparameters. At the same time, it sends the control and administration information to otherfunctional modules of the equipment. The SCC provides functional interfaces to facilitate thecommunication between the functional modules of each board and the network management(NM), as shown in Table 9-1.

Table 9-1 Description of the functional interfaces of the SCC in the system

FunctionalInterface Description

F&f a Connects the RS-232 interface to a PC or a workstation forcommissioning by the manufacture.

Ethernet a The TMN interface, local NE management interface, and internalcommunication interface, used for commissioning.

OAM a The operation, administration and maintenance interface. The RS-232interface is provided to communicate with the terminal through thepublic packet switched network.

F1 a Provides a 64 kbit/s co-directional data channel.

PHONE a Provides three orderwire phones channel. (Provides two orderwirephones channel for dependentant OLA subrack.)

F2 a Uses the F2 byte of the supervisory channel and possesses the featuresof both RS-232 and RS-422 serial interfaces. This interface can be usedfor express orderwire. The maximum rate is 19.2 kbit/s.

F3 a Uses the F3 byte of the supervisory channel and possesses the featuresof both RS-232 and RS-422 serial interfaces. This interface can be usedfor express orderwire. The maximum rate is 19.2 kbit/s.

RS485 Communicates with other boards in the subrack. (reserved)

DCCcommunication

Provides the data communication channel (DCC) of the supervisorylink.

Communicationmodule

Communicates with other boards in the subrack, collects performancedata, and delivers the configuration.

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FunctionalInterface Description

Qx The network management communication interface.

a: To fulfill the functions of the SCC board, corresponding physical interfaces are providedin the interface area of the system standard subrack and the independent OLA subrack andon the front panel of the PMU. For detailed description, refer to the Hardware Description.

The SCC monitors the running status of the boards in the system NE. The main monitoringparameters are as follows:

l Input optical power

l Output optical power

l Laser temperature

l Current of the laser

l B1 performance parameter

l FEC performance parameter

l Ethernet performance parameter

l OTN performance parameter

External Alarm Monitoring

In the power box, the PMU board implements functions such as alarm input, alarm output andalarm cascading. The ALARM on the PMU is an external alarm interface, used for the input andoutput of alarm and Boolean value between the cabinet and users' centralized alarm system. Upto 16 alarms can be input to the cabinet, while four alarms can be output. Output alarms fromdifferent cabinets can be concatenated.

For detailed description of alarm interfaces, refer to the Hardware Description.

NOTE

External alarm input includes door access, smoke and other environment factors. In other words, theexternal alarm input accesses the environmental alarms in the equipment room for centralized monitoring.

Before displaying an external alarm on the T2000 server, you may process the alarm with software programto determine whether the alarm is valid.

The OptiX BWS 1600G provides four alarm output interfaces. One is used to output critical alarms; oneis used to output major alarms; the other two are used to output auxiliary alarms.

9.2.2 Optical Supervisory Channel AdministrationThe management information of the stations in the system is transmitted through the opticalsupervisory channel (OSC).

l Functions of the OSC

The optical supervisory channel (OSC) and the optical supervisory channel unit orsupervisory channel and timing transporting unit (OTC) serve to transmit the monitoringand management information among the stations in the system.

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The wavelengths being used by the OSC is at 1510 nm or 1625 nm. The optical supervisorychannel unit is SC1/SC2. The wavelengths being used by the OTC is at 1510 nm or 1625nm. The optical supervisory channel unit is ST1/ST2.

l Working of the OSC

Figure 9-1 shows the signal flow of the OSC between three stations. The signals of theOSC and the service signals are independent from each other. The OSCs are not amplified.They are terminated and regenerated in a station.

Take the communication between the optical terminal multiplexer (OTM) and the opticalline amplifier (OLA) as an example to explain the communication process of the OSC. TheSC1 and SC2 boards of the OSC are used in the example.

Figure 9-1 Signal flow of the OSC between three stations in chain networking

M40OA

FIUSC1

OTU

FIU

FIU

OA

OA

OA

OA

SC2

OTM OLA OTM

D40OA

OTU

D40OA

FIU SC1

OTU

M40OA

OTU

In the east direction, the SC1 in OTM1 receives the overhead data frames from the SCC.After processing of the signals, E/O conversion is performed by the optical transmit moduleso as to modulate the supervisory data frames to the wavelength of the OSC (1510 nm or1625 nm). The wavelength of the OSC is multiplexed with the service signals by themultiplexer of the FIU.

Then signals are transmitted to the OLA. The demultiplexer of the FIU demultiplexes thesignals into service signals and OSC signals. The service signals are transmitted to the eastafter being regenerated and amplified by the optical amplifier unit (OAU).

The optical receive module of the SC2 in the OLA performs O/E conversion on the OSCsignals and the supervisory data frames are recovered. After being processed, thesupervisory data frames are sent to the SCC of the OLA to exchange data.

In the west direction, the SCC in the OLA transmits the data to the SCC in OTM1 in asimilar process. The OSC is divided in sections. The communication between the OLA andOTM2 is the same as that between the OLA and OTM1.

l Frame Structure of OSC Signals

Figure 9-2 shows the timeslots of the E1 frame adopted by the OSC signals. There are 32timeslots in a frame, numbered 0 to 31.

Figure 9-2 Timeslot assignment diagram of the OSC overhead

0 1 2 3 14 15 16 31... ...

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For the definition and functions of the timeslots in the E1 frame of the OSC, refer to Table9-2.

Table 9-2 Functions of the timeslots in the E1 frame of the OSC

TimeslotNumber Name Function

0 Frame alignmentsignal

Locates the starting point of each E1 frame.

1 E1 byte Provides the path for orderwire phone.

2 F1 byte The co-directional 64 Kbit/s data interface.

3–13, 15 D1–D12 bytes The DCC channel, used to transmit the OAMdata information, such as the issued commandsand the data of the queried alarms andperformances. The OSC board extracts relevantbytes and sends them to the SCC for processing.

14 ALC byte Provides the channel for the transmission ofALC protocol byte.

17 F2 byte Reserved for the user (usually, the networkprovider) for temporary orderwirecommunication with the purpose of specificmaintenance.

18 F3 byte Reserved for the user (usually, the networkprovider) for temporary orderwirecommunication with the purpose of specificmaintenance.

19 E2 byte Provides the path for orderwire phone.

Other Reserved -

9.2.3 Optical Fiber Line Automatic MonitoringThe OptiX BWS 1600G provides the Optical fiber line Automatic Monitoring System (OAMS)to alert fiber aging, fiber alarm, and locate the fault.

The OAMS realizes the monitoring on the fiber link.

As an embedded system, OAMS is optional depending on the requirement of users.

Monitor and Testl OAMS provides two monitoring modes

– On-line (light fiber) monitoring: To monitor and test a working optical fiber (cable). Inthis case, the wavelength of test signal is 1310 nm.

– Standby fiber (dark fiber) monitoring: To monitor and test a standby optical fiber(cable). In this case, the wavelength of test signal is 1550 nm.

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l OAMS provides two test modes

– Unidirectional test: To monitor and test a span with unidirectional test signal.

In this case, two adjacent spans share an independent remote test unit (RTU). As a result,the RTU number is greatly reduced and OAMS cost decreases.

Figure 9-3 Unidirectional test diagram

RTUOAMS

RTU: Remote test unit

DWDM Node

RTU

DWDM Node DWDM NodeDWDM NodeDWDM Node

Service signal Test signal

– Bidirectional test: In the case of one span, signals need be tested bidirectionally tomonitor the span.

Due to the limitation of dynamic test range of the built-in optical time domainreflectometer (OTDR), the unidirectional test fails when measuring a long span withmuch attenuation. Here the monitoring and test can be implemented from both ends ofthe span by two OTDR modules.

Figure 9-4 Bidirectional test diagram

OAMS

Service signal Test signal RTU: Remote test unit

DWDM Node DWDM NodeDWDM NodeDWDM NodeDWDM Node

RTURTURTU RTU RTU

Time-shared bidirectional test: To monitor and test a span with bidirectional test signals.

In the bidirectional test, configure a RTU module at each end of a span, and the twoRTUs will report their test results to NM for combination. Then the performanceparameter of this span will be obtained by analyzing and processing the test results.

System Architecture

The OAMS structure of online monitoring differs with that of standby fiber monitoring.

l Online monitoring

The RTU shown in Figure 9-3 and Figure 9-4 consists of three boards and their functionsare listed in Table 9-3.

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Table 9-3 Introduction of boards in embedded OAMS

Board Name Function

FMU Fiber Measure UnitBoard

It is the core of OAMS to implement the time-domain reflection measurement of fibers. It canmeasure four lines of fibers.

MWA Measure WavelengthAccess Board

In online monitoring, it is used to multiplex theservice signal of DWDM system with the test signal.

MWF Measure WavelengthFilter Board

In online monitoring, it is used to filter thewavelength of test signals, to eliminate the effect tothe transmission system. The board is used onlywhen the service signal and the test signal are in thesame direction.

The embedded OAMS system comprises of FMU, MWA and MWF, as shown in Figure9-5.

Figure 9-5 Embedded OAMS architecture (online monitoring)

FMU

MWF

OAMS

MWFMWA

DWDM DWDM DWDM

In the Figure 9-5, the DWDM node can be OTM, OLA, OADM, OEQ or REG. The OTDRmodule in FMU emits the optical test pulse, and receives, collects, processes and reportsthe reflection signal, thus monitoring the running status of the fiber in real time. FMU canmonitor at most four lines of optical fibers.The coupler on MWA multiplexes the service signal and test signal in one fiber fortransmission. When the test signal and service signal are transmitted in the same direction,the filter on MWF can filter the test signal at the receive node to eliminate the effect to thesystem.The structure and configuration of OAMS vary with network specifications. The figurehere only shows the OAMS of unidirectional test.

l Standby fiber monitoringCompared with online monitoring, standby fiber monitoring is easier to be implemented,that is, directly access the test wavelength (1550 nm) into the standby fiber for test, asshown in Figure 9-6.

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Figure 9-6 Embedded OAMS architecture (standby fiber monitoring)

Standbyfilter

Standbyfilter

DWDM Node DWDM Node DWDM Node

FMU

The performance monitoring and test to the standby fiber can be achieved by using theFMU board, NE software and the NM. The structure and configuration of OAMS vary withnetwork specifications. Figure 9-6 only shows the OAMS of unidirectional test.

Configuration Plan

The Raman amplification and optical fiber attenuation will affect the embedded OAMS to someextent. Table 9-4 lists the OAMS applications with and without Raman amplification.

Table 9-4 Applications of embedded OAMS

System Type Fiber Attenuation Supported Monitoring

With Raman amplification NA Standby fiber monitoring

Without Raman amplification ≤ 45 dB Standby fiber monitoring and onlinemonitoring

> 45 dB Standby fiber monitoring a

a: The 1310-nm test signal is of great attenuation in fiber, resulting in limited monitoringdistance, so the spans more than 45 dB are only provided with standby fiber monitoring.

Table 9-5 and Table 9-6 list the configuration of OAMS in various system specifications of theOptiX BWS 1600G in two monitoring modes.

Table 9-5 OAMS configuration specification of online monitoring

SystemSpecification

SpanAttenuation(dB)

MonitoringSignalWavelength(nm)

OTDRDynamicTestRange(dB)

OpticalFiberLengtha Test Mode

Long distancetransmission

22 1310 42 80 km(50 mi.)

Unidirectionaltest

28 42 100 km(62 mi.)

Time-sharedbidirectionaltest

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SystemSpecification

SpanAttenuation(dB)

MonitoringSignalWavelength(nm)

OTDRDynamicTestRange(dB)

OpticalFiberLengtha Test Mode

33 42 120 km(75 mi.)

Time-sharedbidirectionaltest

LHP 38–45 42 138–163km (86–101 mi.)

Time-sharedbidirectionaltest

Long distancetransmission

22 1550 40 80 km(50 mi.)

Unidirectionaltest

28 40 100 km(62 mi.)

Unidirectionaltest

33 40 120 km(75 mi.)

Time-sharedbidirectionaltest

LHP 38–45 40 138–163km (86–101 mi.)

Time-sharedbidirectionaltest

45–56 40 163–200km (101–124 mi.)

Time-sharedbidirectionaltest

a: The optical fiber length is calculated on condition that the attenuation coefficient is 0.275dB/km.

Table 9-6 OAMS configuration specification of standby fiber monitoring

SystemSpecification

SpanAttenuation(dB)

MonitoringSignalWavelength(nm)

OTDRDynamicTestRange(dB)

OpticalFiberLengtha Test Mode

Long distancetransmission

22 1310 42 80 km(50 mi.)

Unidirectionaltest

28 42 100 km(62 mi.)

Time-sharedbidirectionaltest

33 42 120 km(75 mi.)

Time-sharedbidirectionaltest

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SystemSpecification

SpanAttenuation(dB)

MonitoringSignalWavelength(nm)

OTDRDynamicTestRange(dB)

OpticalFiberLengtha Test Mode

LHP 38–45 42 138–163km (86–101 mi.)

Time-sharedbidirectionaltest

Long distancetransmission

22 1550 40 80 km(50 mi.)

Unidirectionaltest

28 40 100 km(62 mi.)

Unidirectionaltest

33 40 120 km(75 mi.)

Time-sharedbidirectionaltest

LHP 38–45 40 138–163km (86–101 mi.)

Time-sharedbidirectionaltest

45–56 40 163–200km (101–124 mi.)

Time-sharedbidirectionaltest

a: The optical fiber length is calculated on condition that the attenuation coefficient is 0.275dB/km.

System FunctionNOTE

Events in the OAMS system refer to the physical conditions reflecting the fiber (cable) link status whenthe OTDR is used for testing. The events can be classified into reflection events and non-reflection events.For example, the fiber reflection events include fiber connector, mechanical connection point, and fiberend; the non-reflection events include the fiber soldering point, fiber break, fiber bend, and fiber macrobend.

l On-line monitoring of optical power of fiber linkQuery the input and output optical power of the optical fiber link between nodes, that is,the output optical power of one station and the input optical power of the next station.Obtain the attenuation over the link between two adjacent nodes through the NM andcompare the result with the pre-set data. Take the difference of the optical power as thetrigger to enable the test. When the difference exceeds the pre-set value or the thresholdset by the user through NM, the OAMS will be enabled to test the performance of opticalfiber link.

l Multiple test modesThe system provides two ways to test fibers according to the priority.– On-demand test: Generate through NM manually, select and control a RTU to test a

certain fiber in the monitored optical fiber line.

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– Periodical test: Conventional test, namely the test is started upon the previously arrangedconditions are satisfied. The equipment will report the result as an event to NM afterthe test.

The test requirement of higher priority can stop that of lower priority to start a new testqueue.

l Analysis of test eventsBesides the tests, the OAMS system also provides analysis of the test result and then reportsthe corresponding test curve and event list to NM.

l Fiber alarmThe equipment reports alarms depending on the analysis of the test curve. The alarms fallinto three levels.– Critical alarm: Burst of event over 5 dB, including fiber break. The terminal shows red

and gives audible and visible prompt.– Major alarm: The difference between the attenuation of the whole path and the

acceptance value (or original data) is no less than 3 dB; or the attenuation increase event(new or not) is no less than 2 dB. The terminal shows orange and gives visible prompt.

– Minor alarm: The difference between the attenuation of the whole path and theacceptance value (or original data) is no less than 1 dB, while less than 3 dB; or theattenuation increase event (new or not) is no less than 1 dB. The terminal shows yellowand gives visible prompt.

9.2.4 Networking ManagementThe system supports the management of the network management tool over equipment.

Any NM tool in compliance with the ITU-T Recommendations can be used to manage thesystem. Through the connection between the NM tool and the SCC of the NE, the user can:

l Perform a centralized management of multiple systems at a station.

l Monitor the state of the equipment and the network by fault reports and alarm monitoring.

l Configure and plan multiple NEs.

9.2.5 System MaintenanceThe system uses the alarm and performance event monitoring function for administration andmaintenance.

System Alarm FunctionThe system supports the alarm management function. This enables the set and query of alarmlevel, automatic report of alarms, and clearance of history alarms. These help the user to simplifythe monitor and maintain the system in real time.

It records all the alarms that have happened, including the alarms that have been cleared or notand all the performance events.

System Performance Monitoring FunctionPerformance event is a key parameter that reflects the working performance

The knowledge of the causes that lead to the performance events, the relevant boards, and alarmshelps locate the faults during routine maintenance and analyze the faults when they occur.

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The performance events are related with the alarms. If the performance event value exceeds thepre-set threshold value, relevant alarm will be generated. Thus, when a performance eventoccurs, check whether the relevant alarm is generated. For information on how to handle theperformance event, refer to the method for handling alarms.

System Monitoring ItemsThe system provides the following system monitoring information.

l Temperature of the running board

l In-position status of the physical board

l Management function of the boards in different functional units

l Management function of the fan module

l Management function of the power module

l Input/Output optical power of the OTU

l Input/Output optical power of the OAU

l Current of the laser in the amplifier

l Temperature of the laser in the amplifier

l Temperature of the transmitting laser

9.3 NE Security Management FeaturesSecurity management is to prevent illegal users from logging in to the network. It is an importantfeature to ensure the network security.

9.3.1 Basic and Advanced ACL Access ControlThe system supports basic and advanced access control list (ACL) to realize access control.

9.3.2 Query of Security LogThe system supports the query of all security events and logs. The security events and logs of aspecified NE can be uploaded to the T2000.

9.3.3 NE User ManagementThe system supports the security management to the NE user that has logged in to the NE.

9.3.4 Syslog ProtocolThe system log service (Syslog service) is used for the security management on an NE. For aunified control by maintenance engineers, all types of information are transmitted to the logserver in the format complying with the system log (Syslog) protocol.

9.3.5 Control of Logical PortsThe system supports the disabling of idle logical ports (including management ports, signalingports and client-side ports).

9.3.6 Control of Physical PortsThe system supports the disabling of idle physical ports (including commissioning network portsand commissioning serial ports).

9.3.7 Setting Warning Screen InformationThe system supports to set and query the Warning Screen information.

9.3.8 SSL Protocol

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The Secure Socket Layer (SSL) protocol is a kind of security communication protocol. The datapacket sent by the NE to the network management system can be verified in terms of integrityand encrypted by using the SSL protocol. Integrity verification ensures that the user data is notaltered maliciously. Data encryption prevents the transmitted information from un-authorizedcapture. In this manner, security communication is achieved.

9.3.9 Username and Password EncryptionThe system supports encryption of the username and password for an NE. The username andpassword is in the form of encrypted messages during transmission. On the T2000, the systemencrypts the username and password, and then issues them to the corresponding NE.

9.3.10 NTP AuthenticationThe system supports the NTP authentication. When using the NTP, the equipment needs toperform NTP authentication.

9.3.1 Basic and Advanced ACL Access ControlThe system supports basic and advanced access control list (ACL) to realize access control.

ACL provides basic data stream filtering function. The NE configured with ACL can determinewhether to filter the IP packet when the packet passes the NE. ACL determines that a specifieddata stream can be transmitted into or out from a network..

ACL is configured to ensure network security. If ACL is configured properly, a network hashigh security even when it is under attack. ACL provides basic traffic control function.

ACL determines whether an NE receives specified IP packets. The NE configured with ACLchecks each IP packet arrived and determines whether to receive the IP packet based on theACL.

The OptiX BWS 1600G supports basic and advanced ACL to ensure the security of each NE

l Basic ACLIt realizes the access control through source IP. The NE requiring normal security level canbe configured with basic ACL, which enables the NE to check the source address of IPpackets. Basic ACL occupies less resources.

l Advanced ACLIt realizes the access control through source IP, destination IP, source port, destination portand ICMP protocol type. The NE requiring high security level can be configured withadvanced ACL, which enables the NE to check the source address, destination address,source port, destination port and protocol type of IP packets. Advanced ACL occupies alot of resources. When advanced ACL and basic ACL coexist, the system performsverification based on advanced ACL rules.

For detailed ACL configuration procedures, see Configuring NE Security Management in theConfiguration Guide.

9.3.2 Query of Security LogThe system supports the query of all security events and logs. The security events and logs of aspecified NE can be uploaded to the T2000.

The following are the security logs that can be queried:l Start and stop events of the system and applications

l Successful login and logout records of an NE user

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l Failed login records

l New user and user authority change records

l Security strategy and configuration change records of an NE

l NE and board software upgrade (local or remote upgrade) records

NOTE

After the NE software or board software is upgraded, an event is reported to the T2000.

9.3.3 NE User ManagementThe system supports the security management to the NE user that has logged in to the NE.

CAUTIONl When there is only one user with the authority of administrator on the NE, the user cannot

be deleted, and the authority level and valid period of the user cannot be changed.l When there is only one user with the authority of administrator on the NE, the password of

the user can be changed. Keep the user account and password safe. Without the password oruser account, the operations corresponding to the authority level cannot be performed. Theinitialization of the password can only be realized by replacing the SCC board.

The management covers:l Creation and authority assignment of an NE user

l Change of an NE user password

l Query of NE security parameters, including the user expiration date and password changetime

l Management to all NE users by using the T2000, including the display of users, the changeof passwords and the setting of security log query authority

l Cancellation and deletion of long term unused user accounts

9.3.4 Syslog ProtocolThe system log service (Syslog service) is used for the security management on an NE. For aunified control by maintenance engineers, all types of information are transmitted to the logserver in the format complying with the system log (Syslog) protocol.

The system supports:

l Enabling and disabling of Syslog protocol

l Setting of Syslog protocol transmit modes :UDP (by default) and TCP

l Adding and deletion of Syslog servers

l Coexisting of multiple Syslog servers and the sending of logs to multiple servers at thesame time

l Reporting of alarms upon the communication disconnection between the Syslog server andthe NE

Figure 9-7 shows how the Syslog protocol is transmitted in a network. To ensure the securityof system logs, make sure that at least two system log servers are available in a network.

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Normally, IP protocol is used for the communication between the NE and the system log servers.The communication between NEs can be realized through several methods, for example, ECCmode or IP OVER DCC mode.

Figure 9-7 Schematic diagram of Syslog protocol transmitting

Syslog Server A

NMS

ONE D

ONE C(client)

ONE A(client)

TCP/IP

ECC/IP OVER DCC

ONE C

real timesecurity log

Syslog Server B

NOTE

Normally, a system log server is a workstation or server that is dedicated to storing the system logs of allNEs in a network.

A forwarding gateway NE receives the system logs of other NEs and forwards the logs to the system logserver. In Figure 9-7, ONE A and ONE C are forwarding gateway NEs.

When IP protocol is adopted on each NE for communication, every NE can directly communicatewith the two system log servers through the IP protocol. Hence, configure the IP addresses andport numbers on the NE, and the system is able to transmit the NE logs to the two Syslog serversthrough the auto addressing function of IP protocol. No forwarding gateway NE is required.

When ECC mode is adopted on each NE for communication, the NE that does not directlyconnect to the Syslog servers cannot communicate with the servers. The logs of the NE must betransmitted to a gateway NE that directly communicates with the Syslog servers through ECC.Then, the logs are forwarded to the Syslog servers by the gateway NE. Hence, the forwardinggateway NE must be configured, for example, configure NE A as the forwarding gateway NEfor NE D.

For detailed Syslog configuration procedures, see Configuring NE Security Management in theConfiguration Guide.

9.3.5 Control of Logical PortsThe system supports the disabling of idle logical ports (including management ports, signalingports and client-side ports).

9.3.6 Control of Physical PortsThe system supports the disabling of idle physical ports (including commissioning network portsand commissioning serial ports).

The commissioning network ports and serial ports in the system are disabled by default.

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9.3.7 Setting Warning Screen InformationThe system supports to set and query the Warning Screen information.

You can issue tip information to the NE by properly setting the Warning Screen informationof the NE on the T2000 LCT. If the Warning Screen is enabled, the system collects and reportsthe Warning Screen information at the time you access the NE on the T2000 LCT. The WarningScreen information is displayed in the T2000 LCT login interface. Warning Screen informationsetting involves the following operations:

l User sets and queries the Warning Screen information.

l User sets and queries the switch status of the Warning Screen.

For the configuration steps of the Warning Screen information in details, refer to OptiX iManagerT2000 LCT User Guide.

9.3.8 SSL ProtocolThe Secure Socket Layer (SSL) protocol is a kind of security communication protocol. The datapacket sent by the NE to the network management system can be verified in terms of integrityand encrypted by using the SSL protocol. Integrity verification ensures that the user data is notaltered maliciously. Data encryption prevents the transmitted information from un-authorizedcapture. In this manner, security communication is achieved.

The system supports the following protocol or functions:

l SSL protocol. The system communicates with other NEs through the security channel ofthe SSL protocol.

l Users to enable or disable the security channel of the SSL protocol on the T2000.

l Users to query how the NE is connected to the T2000 on the T2000. Two connection waysare supported: Security SSL/Common.

For the SSL protocol configuration steps, refer to the Configuration Guide.

9.3.9 Username and Password EncryptionThe system supports encryption of the username and password for an NE. The username andpassword is in the form of encrypted messages during transmission. On the T2000, the systemencrypts the username and password, and then issues them to the corresponding NE.

9.3.10 NTP AuthenticationThe system supports the NTP authentication. When using the NTP, the equipment needs toperform NTP authentication.

When adding an NTP server, you must set the IP address and key of the NTP server on theT2000.In addition, you need to configure and start the NTP authentication function. Set the IDauthentication key and specify it as a reliable key. Configure on the T2000 that the key createdby you previously is reliable by default. The T2000 client is synchronous to the NTP server thatprovides reliable key. Otherwise, the T2000 client is not synchronous to the NTP server.

For the NTP authentication configuration steps, refer to the Configuration Guide.

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10 Networking and Design Considerations

About This Chapter

The following factors must be considered in networking and design phases: dispersion-limiteddistance, power limitation, optical-to-noise ratio, and non-linear effects.

10.1 Dispersion Limited DistanceChromatic dispersion is a major factor that limits the transmission distance. Such dispersionsare caused by the traits of the transmit source and transmit media (fiber).

10.2 Signal PowerLong haul transmission of the optical signals requires that the signal power be enough to offsetthe fiber loss.

10.3 Optical Signal-to-Noise RatioThe accumulation of ASE noises affects the OSNR of the system. Hence, the OSNR need beconsidered during WDM network design.

10.4 Non-Linear Effects and Other EffectsThe non-linear effect is a physical phenomenon which is closely dependent on light intensity inan optical communication system. Non-linear effects in a fiber might cause the cross-talkbetween channels. Hence, the influence of non-linear effects must be eliminated when a WDMsystem is being designed.

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10.1 Dispersion Limited DistanceChromatic dispersion is a major factor that limits the transmission distance. Such dispersionsare caused by the traits of the transmit source and transmit media (fiber).

l Transmission LimitationIn fiber systems, the transmission rate and the EDFAs cascade level are ascending. As aresult, the overall dispersion and related dispersion cost in the transmission link becomehigher. Currently, dispersion limitation has become a vital factor in deciding many systemregeneration section distances.In the single module fiber, the dispersion mainly includes material dispersion and wave-guide dispersion. Such dispersions cause different time delays in different frequencies andextend the optical pulses. As a result, the optical pulses interfere with each other and thetransmitted signals degrade.

l Effect-Reducing MethodIn some optical amplification sub-systems, the passive dispersion compensation device canbe combined with the optical amplifier. This sub-system adds limited chromatic dispersionto the system to:– Reverse the dispersion coefficient with the original one.

– Reduce the system chromatic dispersion.

The device can also be combined with the EDFA to compensate for the loss caused by thepassive dispersion compensation.In addition, the use of G.655 and G.653 fibers also helps to minimize the chromaticdispersion.

l Network Design ConsiderationDuring the DWDM network design, the whole network falls into several regenerationsections. Each section distance must be less than that restricted by the optical source. Inthis way, the dispersion of the whole network can be tolerated.

NOTE

In dispersion calculation, for G.652 fibers, the typical dispersion coefficient in 1550-nm window is 17 ps/nm•km. In engineering design, the budget should be 20 ps/nm•km.

10.2 Signal PowerLong haul transmission of the optical signals requires that the signal power be enough to offsetthe fiber loss.

With the distance increasing, the optical power attenuates. The attenuation coefficient of the G.652 fiber in the 1550-nm window is about 0.25 dB/km. In view of the optical connectors, fiberredundancy and other factors, the composite fiber attenuation coefficient is less than 0.275 dB/km.

In some cases, the power budget is calculated between two adjacent devices in network. Thedistance (loss) between two adjacent devices in network, is called the trunk distance (loss).

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Figure 10-1 Trunk loss calculation principle

Node ARS

Pout PinNode B

If Pout is the output power (dBm) of a single channel at point S, and Pin is the minimum allowedinput power (dBm) of a single channel at point R, then

Regenerator distance = (Pout - Pin)/a

Where "a" is the cumulative attenuation of optical cables (dB/km) per km (according to the ITU-T, a = 0.275 dB/km).

Power budget calculations serve to determine distance between regeneration sections.

10.3 Optical Signal-to-Noise RatioThe accumulation of ASE noises affects the OSNR of the system. Hence, the OSNR need beconsidered during WDM network design.

Noise Generation PrincipleThe optical amplifier also generates the light signals with broad bandwidth, called the amplifiedspontaneous emission (ASE). In a transmission system with several cascaded EDFAs, similarto the original signals, the ASE noise can also be attenuated or amplified. As the entered ASEnoise in each optical amplifier is amplified and overlapped, the total ASE noise power isincreased in proportion to the number of optical amplifiers. The ASE noise power might behigher than the signal power.

The ASE noise spectrum varies with the system length. When the ASE noise from the first opticalamplifier is sent to the second one, the gain spectrum of the second one also causes ASE noisebecause of gain saturation. As a result, the gain spectrum varies. Similarly, the valid gainspectrum of the third one also varies. Such an effect is passed to the next and next onedownstream.

Even the narrow band filters cannot avoid the ASE noise, because the ASE noise exists in thesame band where the original signal exists.

The OSNR is defined as:

OSNR = Signal optical power per channel/Noise optical power per channel

Transmission LimitationASE noise accumulation affects the OSNR of system, because the OSNR deterioration at thereceive end is mainly related to ASE beat noises. Beat noises are increased linearly with theincrease of optical amplifier number. As a result, the error rate is degraded at the same time. Inaddition, noises are cumulated exponentially with the gain range of amplifiers.

The optical amplifier gain incurs spontaneous emission effect. As a result, the ASE noisespectrum with the cumulated ASE noises from optical amplifiers has a wavelength peak. Aclosed full optical loop network system is equivalent to countless optical amplifiers cascaded.As a result, ASE noises are infinitely cumulated.

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In the system with narrow band filters, the ASE accumulation is reduced. The in-band ASEhowever, is increased with the increase of optical amplifiers. Therefore, the OSNR is smallerfor more optical amplifiers.

Consideration of OSNR in DWDM Network Design

For different network applications, the OSNR requirements are similar.

OSNR is a major factor of DWDM system error performance. For a DWDM system with manycascaded line optical amplifiers, the optical power of noises are mainly affected by the ASEnoises of the amplifiers.

In an actual DWDM system, different EDFA gains might cause different output power perchannel and different EDFA noise coefficients. Therefore, in designing, OSNR of the worstchannel should be considered to stretch the working limits.

10.4 Non-Linear Effects and Other EffectsThe non-linear effect is a physical phenomenon which is closely dependent on light intensity inan optical communication system. Non-linear effects in a fiber might cause the cross-talkbetween channels. Hence, the influence of non-linear effects must be eliminated when a WDMsystem is being designed.

The above three factors must be considered in DWDM networking. In addition, many non-lineareffects might affect the system performance, such as:

l Stimulated Brillouin Scattering (SBS)

l Stimulated Raman Scattering (SRS)

l Self Phase Modulation (SPM)

l ex-Phase Modulation (XPM)

l Four-Wave Mixing (FWM).

There are also some other minor factors which are not considered in network designing, suchas:

l Polarized Mode Dispersion (PMD)

l Polarization Dependent Loss (PDL)

In case of an unusual response of system, however, these minor factors should also be checkedcarefully.

Brief Description of Non-Linear Effects

The non-linear effects are physical effects related to the optical intensity of an opticalcommunications system. Only when the optical intensity of the system reaches a certain limit,such effects rise. The non-linear effects in fiber may lead to crosstalk between channels, that is,optical intensity. As a result, the phase of a channel is affected by its adjacent channel. Theimpact of the non-linear effects on the system depends on the optical power density in fiber andthe transmission distance.

l Self phase modulation (SPM)

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l Because the refractive index of a fiber depends on the optical intensity of the signal, thetemporal variation of the optical intensity of the signal induces an SPM. The SPM thenturns into intensity modulation through the dispersion effects of the fiber.

l Cross phase modulation (XPM)This modulation rises between two impulses of different wavelengths when the fluctuationof the optical power of one wavelength changes the fiber refractive index of its adjacentwavelength. In a DWDM system, the XPM embodies the crosstalk between two channels.The XPM depends on the following factors: optical power input to the fiber, modulationmode and fiber type.

l Four-wave mixing (FWM)If the channel spacing and fiber dispersion are small enough to reach the phase matchingcondition of the FWM, different combinations of new frequencies rise. As a result, thecrosstalk between channels occurs. The FWM depends on the following factors:– Dispersion (including dispersion slope)

– Optical power entering the fiber

– Channel spacing

– Length of transmission fiber

– Number of channels

l Stimulated Raman scattering (SRS)The SRS is resulted from the photons stolen away from the pump light in fiber. Thegenerated energy is transferred to longer waves, which obeys the conservation of energyand momentum. The SRS effect in a DWDM system depends on the following factors:– Number of channels

– Channel spacing

– Fiber type

– Optical power entering the fiber

– Fiber length

l Stimulated Brillouin scattering (SBS)The SBS is also a non-linear scattering process that happens in fiber. When the opticalpower that enters the fiber is high enough, the input optical power (pump beams) causesthe crystal lattice vibration and is scattered from acoustic phonons. In this case, the beamsare converted into stokes emissions that are transmitted backward. The service signalstransmitted forward interact with the backward stokes. As a result, the interaction attenuatesthe energy of the signal optical power non-linearly and degrades the system OSNR sharply.The SBS depends on the following factors:– Fiber type

– Fiber length

– Spectrum width of the signal

– Power of signals

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Methods to Minimize Non-Linear Effects

Table 10-1 Methods to minimize non-linear effects

Non-linear Effects Methods

SBS l Reduce the optical power of a single wavelength.

l Interfere at low frequencies.

SRS l Reduce the total optical power and the optical power of asingle wavelength.

l Equalize the optical power.

SPM Reduce the optical power of a single wavelength.

XPM Check the following factors:l Optical power entering the fiber

l Dispersion compensation

l Raman amplification

FWM l Break the symmetry of the channel spacing.

l Increase the channel spacing.

l Reduce the optical power of a single wavelength.

Note: When reducing the optical power of a single wavelength, consider the rate of the channeland the requirement of the system on the received optical power to maintain the expected biterror rate.

Other Technologies to Extend the Transmission Distance of a DWDM Systeml The signals transmitted are in CRZ format, which suppresses the non-linear effects and

extends the transmission distance (mainly for the SPM).

l The quantity of spans is limited, which reduces the accumulation of non-linear effects.

l The Pilot tone modulation is adopted to suppress the SBS.

l The transmission with uneven channel spacing is adopted, which reduces the impact ofFWM (mainly for the transmission link of G.653 fiber).

l The FEC encoding is adopted, which reduces the requirement on the OSNR of the receiver.

Suppression of Non-Linear Effects by Dispersion Compensation Technology

The SPM and XPM are converted into intensity modulations through the system dispersion.Therefore, SPM and XPM cannot affect the system when the system dispersion is compensatedand the total dispersion is reduced to zero. At present, it is the most commonly adopted measureto suppress the SPM and the XPM.

In a WDM system, a single span reserves certain dispersion, which can effectively suppress theFWM.

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11 Technical Specifications

About This Chapter

Technical specifications include general specifications, main optical path, wavelength andfrequency of optical channels, laser class and board specifications.

11.1 General SpecificationsGeneral specifications include cabinet specifications, power box specifications, standardsubrack specifications, independent OLA subrack specifications, auxiliary interface, DCM andDCM frame specifications and HUB and HUB frame specifications.

11.2 Main Optical PathThe characteristic of the optical interface at points MPI-S or S' and MPI-R or R' as well as themain optical path parameters are shown in the following tables. In this section, the spanspecifications are provided when FEC technology is adopted and the Raman technology is notused.

11.3 Wavelength and Frequency of Optical ChannelsThe system uses the frequencies and wavelengths in the C band and L band.

11.4 Laser ClassEach type of boards of the product has a different laser class.

11.5 Optical Transponder Board SpecificationsThe specifications of the OTU boards include the specifications of the optical modules at theclient and WDM sides, mechanical specifications, and power consumption.

11.6 Optical Multiplexer and Demultiplexer Board SpecificationsThe specifications of optical multiplexers and demultiplexers include the optical specifications,mechanical specifications, and power consumption of the M40/M48/V40/V48 and D48/D40boards.

11.7 Optical Add and Drop Multiplexing Board SpecificationsThe specifications of optical add/drop multiplexing boards include the optical specifications,mechanical specifications, and power consumption of the MR2 board, DWC/EDWC boards,and RMU9/WDM9/WSD9/WDM5/WSD5/WSMD4 boards.

11.8 Optical Amplifier Board SpecificationsThe specifications of optical amplifier boards include the optical specifications, mechanicalspecifications, and power consumption of the HBA/OAU/OBU/OPU/RPA/RPC boards.

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11.9 System Control, Supervision and Communication Board SpecificationsThe specifications of system control, supervision and communication boards include themechanical specifications and power consumption of the SCC and PMU boards.

11.10 Optical Supervisory Channel and Timing Transmission Board SpecificationsThe specifications of optical supervisory channels and timing transmission boards include theoptical specifications, mechanical specifications, and power consumption of the SC1/SC2/ST1/ST2 boards.

11.11 Optical Protection Board SpecificationsThe specifications of protection boards include the optical specifications, mechanicalspecifications, and power consumption of the DCP/OLP/OCP/PBU/SCS boards.

11.12 Spectrum Analyzer Board SpecificationsThe specifications of spectrum analyzer boards include the optical specifications, mechanicalspecifications, and power consumption of the MCA and WMU boards.

11.13 Variable Optical Attenuator Board SpecificationsThe specifications of variable optical attenuator boards include the optical specifications,mechanical specifications, and power consumption of the VA2/VA4/VOA boards.

11.14 Optical Fiber Automatic Monitoring Board SpecificationsThe specifications of optical fiber automatic monitoring boards include the opticalspecifications, mechanical specifications, and power consumption of the FMU/MWA/MWFboards.

11.15 Optical Power and Dispersion Slope Equalizing Board SpecificationsThe specifications of optical power and dispersion slope equalizing boards include the opticalspecifications, mechanical specifications, and power consumption of the DGE/DSE/GFUboards.

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11.1 General SpecificationsGeneral specifications include cabinet specifications, power box specifications, standardsubrack specifications, independent OLA subrack specifications, auxiliary interface, DCM andDCM frame specifications and HUB and HUB frame specifications.

11.1.1 Cabinet SpecificationsThe technical specifications of the cabinet include dimensions, weight, power consumption andvoltage range.

11.1.2 Power Box SpecificationsThe technical specifications of the power box include dimensions, weight and input rated current.

11.1.3 Enhanced Subrack SpecificationsSpecifications include dimensions, power consumption, current and working voltage.

11.1.4 Independent OLA Subrack SpecificationsSpecifications include dimensions, power consumption, current and working voltage.

11.1.5 Auxiliary InterfaceAuxiliary interface specifications includes 64k bit/s interface, RS-232 interface, RS-422interface and orderwire interface specifications.

11.1.6 DCM and DCM Frame SpecificationsDCM and DCM frame specifications include DCM mechanical specifications, DCMperformance specifications and DCM frame specifications.

11.1.7 HUB and HUB Frame SpecificationsHUB and HUB frame specifications include dimensions and weight.

11.1.1 Cabinet SpecificationsThe technical specifications of the cabinet include dimensions, weight, power consumption andvoltage range.

Table 11-1 Technical specifications of the cabinet

Item 2.2-m High Cabinet 2.6-m High Cabinet

Dimensions (Height× Width × Depth)

2200 mm × 600 mm × 300 mm(86.6 in. × 23.6 in. × 11.8 in.)

2600 mm × 600 mm × 300 mm(102.3 in. × 23.6 in. × 11.8 in.)

Weight (Includes theempty cabinet andpower box.)

69 kg (152 lb.) 80 kg (176 lb.)

Maximum powerconsumption

2000 W 2000 W

Nominal workingvoltage

–48 V DC/–60 V DC –48 V DC/–60 V DC

Working voltagerange

–38.4 V to –57.6 V DC/–48 V to–72 V DC

–38.4 V to –57.6 V DC/–48 V to–72 V DC

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Table 11-2 Technical specifications of the cabinet (continued)

Item 1.8-m High Cabinet 2-m High Cabinet

Dimensions (Height× Width × Depth)

1800 mm × 600 mm × 300 mm(70.9 in. × 23.6 in. × 11.8 in.)

2000 mm × 600 mm × 300 mm(78.8 in. × 23.6 in. × 11.8 in.)

Weight 58 kg (128 lb.) 64 kg (141 lb.)

Maximum powerconsumption

1300 W 1300 W

Nominal workingvoltage

–48 V DC/–60 V DC –48 V DC/–60 V DC

Working voltagerange

–38.4 V to –57.6 V DC/–48 V to–72 V DC

–38.4 V to –57.6 V DC/–48 V to–72 V DC

11.1.2 Power Box SpecificationsThe technical specifications of the power box include dimensions, weight and input rated current.

Table 11-3 Technical specifications of the power box

Item Technical Specifications of the Power Box

Dimensions (Height ×Width × Depth)

100 mm × 400 mm × 258 mm (3.9 in. × 15.7 in. × 10.2 in.)

Input rated current 65 A

Weight 9 kg (20 lb.)

11.1.3 Enhanced Subrack SpecificationsSpecifications include dimensions, power consumption, current and working voltage.

Table 11-4 Technical parameters of the enhanced subrack

Item Parameter

Dimensions (Height x Width x Depth) 625 mm × 495 mm × 291 mm (24.6 in. × 19.5in. × 11.5 in.)

Weight (empty subrack not installed withboards or the fan tray assembly)

18 kg (40 lb.)

Maximum power consumption of thesubrack (full configuration)

650 W

Rated current 18 A

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Item Parameter

Nominal working voltage –48 V DC/–60 V DC

Working voltage range –38.4 V to –57.6 V DC/–48 V to –72 V DC

11.1.4 Independent OLA Subrack SpecificationsSpecifications include dimensions, power consumption, current and working voltage.

Table 11-5 Technical parameters of the independent OLA subrack

Item Parameter

Dimensions 665 mm (H) × 436 mm (W) × 291 mm (D)

Weight (empty subrack not installed withboards or the fan tray assembly)

19 kg

Maximum power consumption of thesubrack (full configuration)

380 W

Rated current 16 A

Nominal working voltage –48 V DC/–60 V DC

Working voltage range –38.4 V to –57.6 V DC/–48 V to –72 V DC

11.1.5 Auxiliary InterfaceAuxiliary interface specifications includes 64k bit/s interface, RS-232 interface, RS-422interface and orderwire interface specifications.

64k bit/s Interface

Table 11-6 shows the parameters of the 64 kbit/s interface. The 64 kbit/s interface refers to theF1 interface on the interface area of standard subrack or on the PMU board of the independentOLA subrack.

Table 11-6 Parameters of the 64 kbit/s interface

Parameter Description

Bit rate 64 kbit/s

Timing signals From RX

Coding style ITU-T G.703

Outgoing pulse shape ITU-T G.703

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Parameter Description

Output interface characteristics ITU-T G.703

Incoming interface characteristics ITU-T G.703

RS-232 InterfaceTable 11-7 shows the parameters of the RS-232 interface. The RS-232 interface refers to theF&f, Serial1 and Serial2 interfaces on the interface area of standard subrack or on the PMUboard of the independent OLA subrack.

Table 11-7 Parameters of the RS-232 interface

Parameter Description

Bit rate 19.2 kbit/s to the maximum

Mode RS-232 Tx & Rx data only

Electrical levels ±5 V to ±15 V

RS-422 InterfaceTable 11-8 shows the parameters of the RS-422 interface. The RS-422 interface refers to theSerial1 and Serial2 interfaces on the interface area of standard subrack or on the PMU board ofthe independent OLA subrack.

Table 11-8 Parameters of the RS-422 interface

Parameter Description

Bit rate 19.2 kbit/s to the maximum

Mode RS-422 Tx & Rx data only

Electrical levels ±2.0 V

Orderwire InterfaceTable 11-9 shows the parameters of the orderwire interface.

Table 11-9 Parameters of the orderwire interface

Parameter Description

Speech channel interface

Handset impedance 600 ohms

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Parameter Description

Bandwidth 300 to 3400 Hz

Handset operating current 18 mA

Input Tx gain –4/0/0 dB

Output Rx gain 0/–7/0 dB

Signaling DTMF compliant with ITU-T Rec. Q.23

Analog EOW extension

Impedance 600 ohms

Bandwidth 300 to 3400 Hz

Tx level –3.5 dBr ± 1 dB

Rx level –3.5 dBr ± 1 dB

11.1.6 DCM and DCM Frame SpecificationsDCM and DCM frame specifications include DCM mechanical specifications, DCMperformance specifications and DCM frame specifications.

DCM Mechanical Specifications

Table 11-10 Dimensions and weight of a DCM

Module Dimensions (Height x Width x Depth) Weight

DCM 44 mm × 238 mm × 266 mm (1.7 in. × 9.4 in. × 10.5 in.) 3.5 kg (7.7 lb)

DCM Performance Specifications

Table 11-11 Performance requirement of dispersion compensation optical fiber of C-band (G.652 fiber)

Type Distance

Max.Insertion Loss(dB) DSCR

PMD(ps)

PDL(dB)

Max. AllowPower(dBm)

OperationWavelength (nm)

DCM(A)

20 km(12 mi.)

3.3 90%–110%

0.4 0.1 20 1525–1568

DCM(B)

40 km(25 mi.)

4.7 0.5 0.1 20

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Type Distance

Max.Insertion Loss(dB) DSCR

PMD(ps)

PDL(dB)

Max. AllowPower(dBm)

OperationWavelength (nm)

DCM(C)

60 km(37 mi.)

6.4 0.6 0.1 20

DCM(D)

80 km(50 mi.)

8 0.7 0.1 20

DCM(E)

100 km(62 mi.)

9 0.8 0.1 20

DCM(F)

120 km(74 mi.)

9.8 0.8 0.1 20

DCM(S)

5 km(3.1 mi.)

2.3 0.3 0.1 20

Table 11-12 Performance requirement of dispersion compensation optical fiber of L-band (G.652 fiber)

TypeDistance

Max.Insertion Loss(dB) DSCR

PMD(ps)

PDL(dB)

Max. AllowPower(dBm)

OperationWavelength (nm)

DCM(A)

20 km(12 mi.)

4 90%–110%

0.6 0.1 20 1570–1605

DCM(B)

40 km(25 mi.)

5.3 0.9 0.1 20

DCM(C)

60 km(37 mi.)

7 1.0 0.1 20

DCM(D)

80 km(50 mi.)

8.4 1.0 0.1 20

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OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Table 11-13 Performance requirement of dispersion compensation optical fiber of C-band (G.655 LEAF fiber)

TypeDistance

Max.insertion loss(dB) DSCR

PMD(ps)

PDL(dB)

Max.allowpower(dBm)

Operationwavelength(nm)

DCM(A) 20 km(12 mi.)

4 90%–110%

0.4 0.3 24 1525–1568

DCM(B) 40 km(25 mi.)

5 0.5 0.3 24

DCM(C) 60 km(37 mi.)

5.9 0.7 0.3 24

DCM(D) 80 km(50 mi.)

6.9 0.8 0.3 24

DCM(E) 100 km(62 mi.)

7.8 0.9 0.3 24

DCM(F) 120 km(74 mi.)

8.8 1 0.3 20

DCM Frame Specifications

Table 11-14 Dimensions of a DCM frame

Module Dimensions (Height x Width x Depth)

DCM frame 48 mm × 530 mm × 282 mm (1.9 in. × 20.9 in. × 11.1 in.)

11.1.7 HUB and HUB Frame SpecificationsHUB and HUB frame specifications include dimensions and weight.

HUB Specifications

Table 11-15 Dimensions and weight of HUB

Module Dimensions (Height x Width x Depth) Weight

HUB 34 mm × 150 mm × 110 mm (1.3 in. × 5.9 in. ×3.4 in.)

0.30 kg (0.66 lb.)

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HUB Frame Specifications

Table 11-16 Dimensions of a HUB frame

Module Dimensions (Height x Width x Depth)

HUB frame 43 mm × 434 mm × 255 mm (1.7 in. × 17.1 in. × 10 in.)

11.2 Main Optical PathThe characteristic of the optical interface at points MPI-S or S' and MPI-R or R' as well as themain optical path parameters are shown in the following tables. In this section, the spanspecifications are provided when FEC technology is adopted and the Raman technology is notused.

11.2.1 Type I System

11.2.2 Type II System

11.2.3 Type III System

11.2.4 Type IV System

11.2.5 Type V System

11.2.6 Type VI System

11.2.7 Type VII System

11.2.8 Type VIII System

11.2.9 Type IX System

11.2.1 Type I System

Table 11-17 Main optical path parameters of the OptiX BWS 1600G-I system (SSMF/G.655fiber)

Item Unit Performance Parameter

Span of line - 5 × 20 dB 2 × 24 dB 1 × 28 dB

Number of channels - 160 160 160

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm +1.0 +1.0 +1.0

Maximum dBm +3.0 +3.0 +3.0

Minimum dBm –3.0 –3.0 –3.0

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Item Unit Performance Parameter

Maximum total output power dBm +20.0 +20.0 +20.0

Maximum output loss at points Sand S'(FIU insertion loss)

dB ≤ 1.5 ≤ 1.5 ≤ 1.5

Maximum channel powerdifference at point MPI-S

dB 6 6 6

Optical path (MPI-S - MPI-R)

Maximum optical path penalty dB 2 2 2

Maximum dispersion ps/nm

7500/2250 a 3600/1080 a 2100/630a

Maximum discrete reflectance dB –27 –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel inputpower (inputport ofamplifiers)

Average dBm –22 –26 –31

Maximum dBm –18 –22 –29

Minimum dBm –26 –30 –33

Maximum total input power(input port of amplifiers)

dBm –3 –7 –12

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 20 20 20

Maximum channel powerdifference at point MPI-R

dB 8 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1.5 ≤ 1.5 ≤ 1.5

Maximum insertion loss of ITL atthe point MPI-R

dB 3 3 3

a: The value before "/" is for the G.652 fiber, and the value after "/" is for the G.655 fiber.

11.2.2 Type II System

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Table 11-18 Main optical path parameters of the OptiX BWS 1600G-II system (C+L, SSMFfiber)

Item Unit Performance Parameter

Span of line - 7 × 22 dB 4 × 25 dB 1 × 32 dB

Number of channels - 80 80 80

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm +4.0 +4.0 +4.0

Maximum

dBm +7.0 +7.0 +7.0

Minimum

dBm +1.0 +1.0 +1.0

Maximum total output power dBm +20.0 +20.0 +20.0

Maximum output loss atpoints S and S' (FIU insertionloss)

dB +1.5 +1.5 +1.5

Maximum channel powerdifference at point MPI-S (Cband and L band areindependent)

dB 6 6 6

Optical path (MPI-S – MPI-R)

Maximum optical pathpenalty

dB 2 2 2

Maximum dispersion ps/nm

11200 7600 2400

Maximum discretereflectance

dB –27 –27 –27

Maximum averagedifferential group delay(DGD)

ps 15 15 15

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers)

Average

dBm –21 –24 –31

Maximum

dBm –17 –20 –28

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Item Unit Performance Parameter

Minimum

dBm –25 –28 –34

Maximum total input power(input port of amplifiers)

dBm –5 –8 –15

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 20 20 20

Maximum channel powerdifference at point MPI-R

dB 8 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1.5 ≤1.5 ≤1.5

Table 11-19 Main optical path parameters of the OptiX BWS 1600G-II system (C band, SSMFfiber, NRZ)

Item Unit Performance Parameter

Span of line - 16 × 22dB 8 × 27dB

Number of channels - 80 80

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifiers)

Average

dBm +1 +1

Maximum

dBm +5 +4

Minimum

dBm -3 -2

Maximum total output power dBm 20 20

Maximum output loss atpoints S and S' (FIU insertionloss)

dB ≤1 ≤1

Maximum channel powerdifference at point MPI-S (Cband and L band areindependent)

dB 8 6

Optical path (MPI-S – MPI-R)

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Item Unit Performance Parameter

Maximum optical pathpenalty

dB ≤2 ≤2

Maximum dispersion ps/nm

25600 16000

Maximum discretereflectance

dB -27 -27

Maximum averagedifferential group delay(DGD)

ps 15 15

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers)

Average

dBm -23 -28

Maximum

dBm -19 -24

Minimum

dBm -27 -32

Maximum total input power(input port of amplifiers)

dBm -3 -8

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.5 15

Maximum channel powerdifference at point MPI-R

dB 8 8

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1 ≤1

Maximum insertion loss ofITL at the point MPI-R

dB 3 3

Table 11-20 Main optical path parameters of the OptiX BWS 1600G-II system (C band, LEAFfiber, NRZ)

Item Unit Performance Parameter

Span of line - 14 × 22 dB 7 × 27 dB

Number of channels - 80 80

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

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Item Unit Performance Parameter

Channeloutputpower(output portofamplifiers)

Average dBm +1 +1

Maximum dBm +5 +4

Minimum dBm -3 -2

Maximum total output power dBm 20 20

Maximum output loss atpoints S and S' (FIU insertionloss)

dB ≤1 ≤1

Maximum channel powerdifference at point MPI-S (Cband and L band areindependent)

dB 8 6

Optical path (MPI-S – MPI-R)

Maximum optical pathpenalty

dB ≤2 ≤2

Maximum dispersion ps/nm

6720 8640

Maximum discretereflectance

dB -27 -27

Maximum averagedifferential group delay(DGD)

ps 15 15

Optical interface at points MPI-R and R'

Channelinput power(input portofamplifiers)

Average dBm -23 -28

Maximum dBm -19 -24

Minimum dBm -27 -32

Maximum total input power(input port of amplifiers)

dBm -3 -8

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.8 15.7

Maximum channel powerdifference at point MPI-R

dB 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1 ≤1

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Table 11-21 Main optical path parameters of the OptiX BWS 1600G-II (SSMF fiber, DRZ)

Item Unit Performance Parameter

Span of line - 20 × 22 dB

Number of channels - 80

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm 1

Maximum dBm 4

Minimum dBm -2

Maximum total output power dBm +20.0

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤1

Maximum channel power difference atpoint MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB -27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 32000

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers)

Average dBm -23

Maximum dBm -19

Minimum dBm -27

Maximum total input power (input portof amplifiers)

dBm -3

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power difference atpoint MPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤1

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Table 11-22 Main optical path parameters of the OptiX BWS 1600G-II (LEAF fiber, DRZ)

Item Unit Performance Parameter

Span of line - 20 × 22 dB

Number of channels - 80

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm 1

Maximum dBm 4

Minimum dBm -2

Maximum total output power dBm +20.0

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤1

Maximum channel power difference atpoint MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB -27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 9600

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers)

Average dBm -23

Maximum dBm -19

Minimum dBm -27

Maximum total input power (input portof amplifiers)

dBm -3

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power difference atpoint MPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤1

11.2.3 Type III System

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Table 11-23 Main optical path parameters of the OptiX BWS 1600G-III system (SSMF fiber,NRZ)

Item Unit Performance Parameter

Span of line - 20 × 22 dB 16 × 25dB 8 × 30dB

Number of channels - 40 40 40

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm +4.0 +4.0 +4.0

Maximum

dBm +7.0 +7.0 +7.0

Minimum dBm +1.0 +1.0 +1.0

Maximum total output power dBm +20.0 +20.0 +20.0

Maximum output loss at pointsS and S' (FIU insertion loss)

dB ≤1 ≤1 ≤1

Maximum channel powerdifference at point MPI-S

dB 6 6 6

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB ≤2 ≤2 ≤2

Maximum dispersion ps/nm

32000 32000 17600

Maximum discrete reflectance dB -27 -27 -27

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel inputpower (inputport ofamplifiers)

Average dBm -20 -23 -28

Maximum dBm -16 -19 -25

Minimum dBm -24 -27 -31

Maximum total input power(input port of amplifiers)

dBm -3 -6 -11

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 17.5 16 15

Maximum channel powerdifference at point MPI-R

dB 8 8 6

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Item Unit Performance Parameter

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1 ≤1 ≤1

Table 11-24 Main optical path parameters of the OptiX BWS 1600G-III system (LEAF fiber,NRZ)

Item Unit Performance Parameter

Span of line - 16 × 25 dB 8 × 30dB

Number of channels - 40 40

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm +4.0 +4.0

Maximum dBm +7.0 +7.0

Minimum dBm +1.0 +1.0

Maximum total output power dBm +20.0 +20.0

Maximum output loss at pointsS and S' (FIU insertion loss)

dB ≤1 ≤1

Maximum channel powerdifference at point MPI-S

dB 6 6

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB ≤2 ≤2

Maximum dispersion ps/nm

8760 5280

Maximum discrete reflectance dB -27 -27

Maximum average differentialgroup delay (DGD)

ps 15 15

Minimum return loss dB 24 24

Optical interface at points MPI-R and R'

Channel inputpower (inputport ofamplifiers)

Average dBm -23 -28

Maximum dBm -19 -25

Minimum dBm -27 -31

Maximum total input power(input port of amplifiers)

dBm -6 -11

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Item Unit Performance Parameter

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.5 15

Maximum channel powerdifference at point MPI-R

dB 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1 ≤1

Table 11-25 Main optical path parameters of the OptiX BWS 1600G-III (SSMF fiber, DRZ)

Item Unit Performance Parameter

Span of line - 25 × 22 dB

Number of channels - 40

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifiers)

Average dBm 4

Maximum dBm 7

Minimum dBm 1

Maximum total output power dBm +20.0

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤1

Maximum channel power difference atpoint MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB -27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 40000

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifiers)

Average dBm -20

Maximum dBm -16

Minimum dBm -24

Maximum total input power (input portof amplifiers)

dBm -3

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Item Unit Performance Parameter

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power difference atpoint MPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤1

Table 11-26 Main optical path parameters of the OptiX BWS 1600G-III (LEAF fiber, DRZ)

Item Unit Performance Parameter

Span of line - 25 × 22 dB

Number of channels - 40

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifiers)

Average dBm 4

Maximum dBm 7

Minimum dBm 1

Maximum total output power dBm +20.0

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤1

Maximum channel power difference atpoint MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB -27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 12000

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifiers)

Average dBm -20

Maximum dBm -16

Minimum dBm -24

Maximum total input power (input portof amplifiers)

dBm -3

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Item Unit Performance Parameter

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power difference atpoint MPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤1

Table 11-27 Main optical path parameters of the OptiX BWS 1600G-III system (G.653 fiber,DRZ)

Item Unit Specifications

Number of spans and attenuation - 14 × 23 dB 11 × 23 dB

Number of channels - 22 40

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s

System wavelength range THz 192.10 to 196.00

Optical interface parameters at points MPI-S and S'

Channel outputpower a

Average dBm –3.0 –5.0

Maximum dBm 0 –2.0

Minimum dBm –6.0 –8.0

Maximum total output power dBm +10.4 +11.0

Maximum insertion loss at S andS' (FIU)

dB +1 +1

Maximum channel power differenceat point MPI-S

dB 6 6

Optical path (from MPI-S to MPI-R)

Maximum optical path penalty dB 2 2

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15

Minimum return loss dB 24 24

Optical interface parameters at points MPI-R AND R'

Channel input power Average dBm –21 –21

Maximum dBm –18 –18

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Item Unit Specifications

Minimum dBm –24 –24

Maximum total input power (inputport of amplifier)

dBm –13.6 –13

Minimum optical signal-to-noiseratio at point MPI-R

dB 15.5 14.5

Maximum channel power differenceat point MPI-R

dB 8 8

Maximum insertion loss at MPI-Rand MPI-R' (FIU)

dB ≤1 ≤1

a: The channel output power is the input optical power of the system at point S, including FIUloss at the transmit end.

NOTE

The split-band dispersion compensation is needed when the transmission distance exceeds 300 km (186mi.) on G.653 fiber for C-band signal.

Table 11-28 Main optical path parameters of the OptiX BWS 1600G-III system (G.653 fiber,NRZ)

Item Unit Specifications

Number of spans and attenuation - 10 × 23 dB 8 × 22 dB

Number of channels - 22 40

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s

System wavelength range THz 192.10 to 196.00

Optical interface parameters at points MPI-S and S'

Channel outputpower a

Average dBm –3.0 –5.0

Maximum dBm 0 –2.0

Minimum dBm –6.0 –8.0

Maximum total output power dBm +10.4 +11.0

Maximum insertion loss at S andS' (FIU)

dB +1 +1

Maximum channel power differenceat point MPI-S

dB 6 6

Optical path (from MPI-S to MPI-R)

Maximum optical path penalty dB 2 2

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Item Unit Specifications

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15

Minimum return loss dB 24 24

Optical interface parameters at points MPI-R AND R'

Channel input power Average dBm –21 –20

Maximum dBm –18 –17

Minimum dBm –24 –23

Maximum total input power (inputport of amplifier)

dBm –13.6 –12

Minimum optical signal-to-noiseratio at point MPI-R

dB 17.0 16.5

Maximum channel power differenceat point MPI-R

dB 8 8

Maximum insertion loss at MPI-Rand MPI-R' (FIU)

dB ≤1 ≤1

a: The channel output power is the input optical power of the system at point S, including FIUloss at the transmit end.

11.2.4 Type IV System

Table 11-29 Main optical path parameters of the OptiX BWS 1600G-IV system (G.653 fiber,L band)

Item Unit Performance Parameter

Span of line - 5 × 22 dB 3 × 25 dB 1 × 30 dB

Number of channels - 40 40 40

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S' a

Channel outputpower b

Average dBm +1.0 +1.0 +1.0

Maximum dBm +2.0 +2.0 +2.0

Minimum dBm –4.0 –4.0 –4.0

Maximum total output power dBm +17.0 +17.0 +17.0

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Item Unit Performance Parameter

Maximum insertion loss at S andS' (FIU)

dB ≤ 1 ≤ 1 ≤ 1

Maximum channel powerdifference at point MPI-S

dB 6 6 6

Optical path (MPI - S - MPI –R)

Maximum optical path penalty dB 2 2 2

Maximum dispersion ps/nm

1600 1080 440

Maximum discrete reflectance dB –27 –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel inputpower (input port ofamplifiers)

Average dBm –21 –24 –29

Maximum dBm –18 –21 –26

Minimum dBm –24 –27 –32

Maximum total input power(input port of amplifiers)

dBm –5 –8 –13

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 20 20 20

Maximum channel powerdifference at point MPI-R

dB 6 6 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1 ≤ 1

a: The pre-equilibrium should be performed to the optical power input into the transmit end.b: The channel output power is the input optical power of the system at point S, includingFIU loss at the transmit end.

11.2.5 Type V System

Table 11-30 Main optical path parameters of the OptiX BWS 1600G-V system (G.652/G.655fiber)

Item Unit Performance Parameter

Span of line - 8 × 22 dB 6 × 27 dB 1 × 39 dB

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Item Unit Performance Parameter

Number of channels - 40 40 40

Maximum bit rate of per channel - 2.5 Gbit/s 2.5 Gbit/s 2.5 Gbit/s

Optical interface at points MPI-S AND S'

Channel outputpower (output port ofamplifiers)

Average dBm +4.0 +4.0 +4.0

Maximum dBm +7.0 +7.0 +6.0

Minimum dBm +1.0 +1.0 +2.0

Maximum total output power dBm +20.0 +20.0 +20.0

Maximum output loss at points Sand S' (FIU insertion loss)

dB ≤ 1 ≤ 1 ≤ 1

Channel signal-to-noise ratio atpoint MPI-S

dB > 35 > 35 > 35

Maximum channel powerdifference at point MPI-S

dB 6 6 4

Optical path (MPI - S - MPI –R)

Maximum optical path penalty dB 2 2 2

Maximum dispersion ps/nm 12800/3840 12000/3600 3000/900

Maximum discrete reflectance dB –27 –27 –27

Maximum average differentialgroup delay (DGD)

ps 40 40 40

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifiers)

Average dBm –20 –25 –37 a

Maximum dBm –16 –21 –34

Minimum dBm –24 –39 –40

Maximum total input power (inputport of amplifiers)

dBm –4 –9 –20

minimum channel optical signal-to-noise ratio at point MPI-R

dB 20 20 20

Maximum channel powerdifference at point MPI-R

dB 8 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1 ≤ 1

a: The number of operating wavelengths should be not less than 8.

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11.2.6 Type VI System

Table 11-31 Main optical path parameters of the OptiX BWS 1600G-VI system (G.652, 8-channel, forward Raman+ backward Raman)

Item Unit Performance Parameter

Fiber type - SSMF

Span of line - 1 × 66 dB

Number of channels - 8

Maximum bit rate of per channel - 10 Gbit/s

Line code format DRZ

Optical interface at points MPI-S and S'a

Channel output power(output port of amplifiers)

Average dBm +2

Maximum dBm +7

Minimum dBm –3

Maximum total output power dBm +11

Channel signal-to-noise ratio at point MPI-S

dB >30

Maximum channel power difference atpoint MPI-S

dB 10

Optical path (MPI - S - MPI –R)

Maximum optical path penalty dB ≤ 2

Maximum dispersion ps/nm 6000

Maximum discrete reflectance dB –27

Maximum average differential group delay(DGD)

ps 15

Optical interface at points MPI-R and R'

Channel input power(input port of amplifiers,Raman amplifier is open)

Average dBm –45

Maximum dBm –42

Minimum dBm –48

Maximum channel power difference atpoint MPI-R

dB 6

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Item Unit Performance Parameter

a: When adopt forward pumping Raman unit, the MPI-S point is at the SYS port of the Ramanunit.

Table 11-32 Main optical path parameters of the OptiX BWS 1600G-VI system (G.652/G.655fiber, 10-channel, HBA+Raman)

Item Unit

Performance Parameter

Fiber type - G.652/G.655 G.652 G.655

Span of line - 1 × 64 dB 1 × 63 dB 1 × 61 dB

Number of channels - 10 10 10

Maximum bit rate of perchannel

- 2.5 Gbit/s 10 Gbit/s 10 Gbit/s

Line code format NRZ DRZ DRZ

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifiers)

Average dBm +16 +16 +16

Maximum

dBm +17 +17 +17

Minimum

dBm +13 +13 +13

Maximum total output power dBm +26 +26 +26

Channel signal-to-noise ratio atpoint MPI-S

dB >30 >30 >30

Maximum channel powerdifference at point MPI-S

dB 4 4 4

Optical path (MPI - S - MPI –R)

Maximum optical path penalty dB ≤ 2 ≤ 2 ≤ 2

Maximum dispersion ps/nm

5800 5600 1700

Maximum discrete reflectance dB –27 –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Optical interface at points MPI-R and R'

Channel inputpower (input port

Average dBm –38 –35 –35

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Item Unit

Performance Parameter

of amplifiers,Raman amplifier isopen)

Maximum

dBm –35 –22 –22

Minimum

dBm –41 –38 –38

Maximum channel powerdifference at point MPI-R

dB 6 6 6

Table 11-33 Main optical path specifications of the OptiX BWS 1600G-VI system (G.652/G.655 fiber, 40-channel, HBA+Raman)

Item Unit Performance Parameter

Fiber type - G.652/G.655 G.652 G.655

Span of line - 1 × 53 dB 1 × 52 dB 1 × 50 dB

Number of channels - 40 40 40

Maximum bit rate of perchannel

- 2.5 Gbit/s 10 Gbit/s 10 Gbit/s

Line code format NRZ DRZ DRZ

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifiers)

Average dBm +10 +10 +10

Maximum

dBm +13 +13 +13

Minimum

dBm +7 +7 +7

Maximum total output power dBm +26 +26 +26

Channel signal-to-noise ratio atpoint MPI-S

dB >30 >30 >30

Maximum channel powerdifference at point MPI-S

dB 6 6 6

Optical path(MPI - S - MPI –R)

Maximum optical path penalty dB ≤ 2 ≤ 2 ≤ 2

Maximum dispersion ps/nm

4800 4700 1400

Maximum discrete reflectance dB –27 –27 –27

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Item Unit Performance Parameter

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers,Raman amplifieris open)

Average dBm –36 –35 –33

Maximum

dBm –33 –32 –30

Minimum

dBm –39 –38 –36

Maximum channel powerdifference at point MPI-R

dB 8 8 8

Table 11-34 Main optical path specifications of the OptiX BWS 1600G-VI system (G.652/G.655 fiber, 80-channel, HBA+Raman)

Item Unit Performance Parameter

Fiber type - G.652 G.655

Span of line - 1 × 48 dB 1 × 46 dB

Number of channels - 80 80

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Line code format DRZ DRZ

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifiers)

Average dBm +7 +7

Maximum

dBm +10 +10

Minimum

dBm +4 +4

Maximum total output power dBm +26 +26

Channel signal-to-noise ratioat point MPI-S

dB >30 >30

Maximum channel powerdifference at point MPI-S

dB 6 6

Optical path(MPI - S - MPI –R)

Maximum optical path penalty dB ≤ 2 ≤ 2

Maximum dispersion ps/nm 4300 1200

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Item Unit Performance Parameter

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers,Raman amplifieris open)

Average dBm –35 –33

Maximum

dBm –32 –30

Minimum

dBm –38 –36

Maximum channel powerdifference at point MPI-R

dB 8 8

11.2.7 Type VII System

Table 11-35 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels,SSMF fiber, NRZ)

Item Unit Performance Parameter

Span of line - 20 × 22 dB 16 × 25 dB 8 × 30 dB

Number of channels - 48 48 48

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifier)

Average dBm +4.0 +4.0 +4.0

Maximum

dBm +7.0 +7.0 +7.0

Minimum dBm +1.0 +1.0 +1.0

Maximum total output power dBm +20.8 +20.8 +20.8

Maximum output loss at points Sand S' (FIU insertion loss)

dB ≤ 1 ≤ 1 ≤ 1

Maximum channel powerdifference at point MPI-S

dB 6 6 6

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB 2 2 2

Maximum dispersion ps/nm 32000 32000 17600

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Item Unit Performance Parameter

Maximum discrete reflectance dB –27 –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15 15

Minimum return loss dB 24 24 24

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifier)

Average dBm –20 –23 –28

Maximum

dBm –16 –19 –25

Minimum dBm –24 –27 –31

Maximum total input power(input port of amplifier)

dBm –2.2 –5.2 –10.2

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 17.5 16 15

Maximum channel powerdifference at point MPI-R

dB 8 8 6

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1 ≤ 1

Table 11-36 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels,LEAF fiber, NRZ)

Item Unit Performance Parameter

Span of line - 16 × 25 dB 8 × 30 dB

Number of channels - 48 48

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifier)

Average dBm +4.0 +4.0

Maximum

dBm +7.0 +7.0

Minimum dBm +1.0 +1.0

Maximum total output power dBm +20.8 +20.8

Maximum output loss at pointsS and S' (FIU insertion loss)

dB ≤ 1 ≤ 1

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Item Unit Performance Parameter

Maximum channel powerdifference at point MPI-S

dB 6 6

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB 2 2

Maximum dispersion ps/nm 8760 5280

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 15 15

Minimum return loss dB 24 24

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifier)

Average dBm –23 –28

Maximum

dBm –19 –25

Minimum dBm –27 –31

Maximum total input power(input port of amplifier)

dBm –5.2 –10.2

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.5 15

Maximum channel powerdifference at point MPI-R

dB 8 8

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤1 ≤1

Table 11-37 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels,SSMF fiber, DRZ)

Item Unit Performance parameter

Span of line - 25 × 22 dB

Number of channels - 48

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifier)

Average dBm 4

Maximum dBm 7

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Item Unit Performance parameter

Minimum dBm 1

Maximum total output power dBm 20.8

Maximum output loss at points S and S' (FIUinsertion loss)

dB ≤ 1

Maximum channel power difference at pointMPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB –27

Maximum average differential group delay(DGD)

ps 15

Maximum dispersion ps/nm 40000

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifier)

Average dBm –20

Maximum dBm –16

Minimum dBm –24

Maximum total input power (input port ofamplifiers)

dBm –2.2

Minimum channel optical signal-to-noise ratioat point MPI-R

dB 14.5

Maximum channel power difference at pointMPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤ 1

Table 11-38 Main optical path parameters of the OptiX BWS 1600G-VII system(48 channels,LEAF fiber, DRZ)

Item Unit Performance parameter

Span of line - 25 × 22 dB

Number of channels - 48

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifier)

Average dBm 4

Maximum dBm 7

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Item Unit Performance parameter

Minimum dBm 1

Maximum total output power dBm 20.8

Maximum output loss at points S and S' (FIUinsertion loss)

dB ≤1

Maximum channel power difference at pointMPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB –27

Maximum average differential group delay(DGD)

ps 15

Maximum dispersion ps/nm 12000

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifier)

Average dBm –20

Maximum dBm –16

Minimum dBm –24

Maximum total input power (input port ofamplifiers)

dBm –2.2

Minimum channel optical signal-to-noise ratioat point MPI-R

dB 14.5

Maximum channel power difference at pointMPI-R

dB 8

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤ 1

Table 11-39 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel,SSMF fiber, NRZ)

Item Unit Performance Parameter

Span of line - 16 × 22 dB 8 × 27 dB

Number of channels - 96 96

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channeloutput

Average dBm +1 +1

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Item Unit Performance Parameter

power(output portofamplifiers)

Maximum dBm +5 +4

Minimum dBm -3 -2

Maximum total output power dBm 20.8 20.8

Maximum output loss at pointsS and S' (FIU insertion loss)

dB ≤ 1 ≤ 1

Maximum channel powerdifference at point MPI-S

dB 8 6

Optical path (MPI-S – MPI-R)

Maximum optical path penalty dB ≤ 2 ≤ 2

Maximum dispersion ps/nm 25600 16000

Maximum discrete reflectance dB -27 -27

Maximum average differentialgroup delay (DGD)

ps 15 15

Optical interface at points MPI-R and R'

Channelinput power(input portofamplifiers)

Average dBm -23 -28

Maximum dBm -19 -24

Minimum dBm -27 -32

Maximum total input power(input port of amplifiers)

dBm -2.2 -7.2

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.5 15

Maximum channel powerdifference at point MPI-R

dB 8 8

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1

Maximum insertion loss ofITL at the point MPI-R

dB 3 3

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Table 11-40 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel,LEAF fiber, NRZ)

Item Unit Performance Parameter

Span of line - 14 × 22 dB 7 × 27 dB

Number of channels - 96 96

Maximum bit rate of perchannel

- 10 Gbit/s 10 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (outputport ofamplifiers)

Average dBm +1 +1

Maximum

dBm +5 +4

Minimum dBm -3 -2

Maximum total output power dBm 20.8 20.8

Maximum output loss at pointsS and S' (FIU insertion loss)

dB ≤ 1 ≤ 1

Maximum channel powerdifference at point MPI-S

dB 8 6

Optical path (MPI-S – MPI-R)

Maximum optical path penalty dB ≤ 2 ≤ 2

Maximum dispersion ps/nm 6720 4180

Maximum discrete reflectance dB -27 -27

Maximum average differentialgroup delay (DGD)

ps 15 15

Optical interface at points MPI-R and R'

Channel inputpower (input portof amplifiers)

Average dBm -23 -28

Maximum

dBm -19 -24

Minimum dBm -27 -32

Maximum total input power(input port of amplifiers)

dBm -2.2 -7.2

Minimum channel opticalsignal-to-noise ratio at pointMPI-R

dB 16.8 15.7

Maximum channel powerdifference at point MPI-R

dB 8 6

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Item Unit Performance Parameter

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1

Table 11-41 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel,SSMF fiber, DRZ)

Item Unit Performance parameter

Span of line - 20 × 22 dB

Number of channels - 96

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifier)

Average dBm 1

Maximum dBm 4

Minimum dBm –2

Maximum total output power dBm 20.8

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤ 1

Maximum channel power differenceat point MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB –27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 32000

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifier)

Average dBm –23

Maximum dBm –19

Minimum dBm –27

Maximum total input power (inputport of amplifiers)

dBm –2.2

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power differenceat point MPI-R

dB 8

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Item Unit Performance parameter

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤ 1

Table 11-42 Main optical path parameters of the OptiX BWS 1600G-VII system (96 channel,LEAF fiber, DRZ)

Item Unit Performance parameter

Span of line - 20 × 22 dB

Number of channels - 96

Maximum bit rate of per channel - 10 Gbit/s

Optical interface at points MPI-S and S'

Channel output power(output port ofamplifier)

Average dBm 1

Maximum dBm 4

Minimum dBm –2

Maximum total output power dBm 20.8

Maximum output loss at points S andS' (FIU insertion loss)

dB ≤ 1

Maximum channel power differenceat point MPI-S

dB 6

Optical path (MPI - S - MPI - R)

Maximum discrete reflectance dB –27

Maximum average differential groupdelay (DGD)

ps 15

Maximum dispersion ps/nm 9600

Optical interface at points MPI-R and R'

Channel input power(input port ofamplifier)

Average dBm –23

Maximum dBm –19

Minimum dBm –27

Maximum total input power (inputport of amplifiers)

dBm –2.2

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 14.5

Maximum channel power differenceat point MPI-R

dB 8

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Item Unit Performance parameter

Input loss at points MPI-R and R' (FIUinsertion loss)

dB ≤ 1

11.2.8 Type VIII System

Table 11-43 40 x 40G system specification (SSMF/LEAF fiber, DRZ)

Item Unit Performance Parameter

Fiber - SSMF LEAF

Span of line - 15 × 22 dB 12 × 22 dB

Number of channels - 40 40

Maximum bit rate of per channel - 40 Gbit/s 40 Gbit/s

Optical interface at points MPI-S and S'

Channel outputpower (output portof amplifier)

Average dBm +4 +4

Maximum dBm +7.0 +7.0

Minimum dBm +1.0 +1.0

Maximum total output power dBm 20 20

Maximum output loss at points Sand S' (FIU insertion loss)

dB ≤ 1.0 ≤ 1.0

Maximum channel powerdifference at point MPI-S

dB 4 4

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB ≤ 2 ≤ 2

Maximum dispersion ps/nm 24000 5760

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 4 4

Optical interface at points MPI-R and R'

Channel inputpower (input port ofamplifier)

Average dBm –20 –20

Maximum dBm –16 –16

Minimum dBm –24 –24

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Item Unit Performance Parameter

Maximum total input power (inputport of amplifier)

dBm –3 –3

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 19.5 19.5

Maximum channel powerdifference at point MPI-R

dB 8 8

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1.0 ≤ 1.0

Table 11-44 80 x 40G system specification (SSMF/LEAF fiber, ODB)

Item Unit Performance Parameter

Fiber - SSMF LEAF

Span of line - 10 × 22 dB 10 × 22 dB

Number of channels - 80 80

Maximum bit rate of per channel - 40 Gbit/s 40 Gbit/s

Optical interface at points MPI-S and S'

Channeloutput power(output portof amplifier)

Average dBm +1 +1

Maximum dBm +4 +4

Minimum dBm –2 –2

Maximum total output power dBm 20 20

Maximum output loss at points Sand S' (FIU insertion loss)

dB ≤ 1 ≤ 1

Maximum channel powerdifference at point MPI-S

dB 4 4

Optical path (MPI - S - MPI - R)

Maximum optical path penalty dB ≤ 2 ≤ 2

Maximum dispersion ps/nm 16000 4800

Maximum discrete reflectance dB –27 –27

Maximum average differentialgroup delay (DGD)

ps 2.5 2.5

Optical interface at points MPI-R and R'

Channelinput power

Average dBm –20 –20

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Item Unit Performance Parameter

(input port ofamplifier)

Maximum dBm –16 –16

Minimum dBm –24 –24

Maximum total input power (inputport of amplifier)

dBm –3 –3

Minimum channel optical signal-to-noise ratio at point MPI-R

dB 20.5 20.5

Maximum channel powerdifference at point MPI-R

dB 8 8

Input loss at points MPI-R andR' (FIU insertion loss)

dB ≤ 1 ≤ 1

11.2.9 Type IX System

Table 11-45 Main optical path parameters of the OptiX BWS 1600G-IX system (192 channel,SSMF&LEAF fiber, DRZ)

Item Unit Performance Parameter

Type of fiber - SSMF LEAF

Span of line - 10 × 22 dB 6 × 22 dB

Number of channels - 192 192

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s

Optical interfaces at points MPI-S and S'

Channel outputpower (the outputof the amplifier)

Average dBm -2 -4

Maximum dBm 0 -2

Minimum dBm -4 -6

Maximum total output power dBm +20.8 +18.8

Maximum insertion loss at points Sand S' (FIU)

dB ≤1 ≤1

Maximum channel power differenceat point MPI-S

dB 4 4

Optical path (from MPI-S to MPI-R)

Maximum discrete reflectance dB -27 -27

Maximum average differential groupdelay (DGD)

ps 18 18

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Item Unit Performance Parameter

Maximum dispersion ps/nm 16000 2880

Optical interfaces at points MPI-R and R'

Channel inputpower (the input ofthe amplifier)

Average dBm -26 -28

Maximum dBm -23 -25

Minimum dBm -29 -31

Maximum total input power (inputport of amplifiers)

dBm -2.2 -4.2

Minimum optical signal-to-noiseratio at point MPI-R

dB 14.5 14.5

Maximum channel power differenceat point MPI-R

dB 6 6

Maximum insertion loss at pointsMPI-R and R' (FIU)

dB ≤1 ≤1

Table 11-46 Main optical path parameters of the OptiX BWS 1600G-IX system (160 channel,SSMF&LEAF fiber, DRZ)

Item Unit Performance Parameter

Type of fiber - SSMF LEAF

Span of line - 10 × 22 dB 6 × 22 dB

Number of channels - 160 160

Maximum bit rate of per channel - 10 Gbit/s 10 Gbit/s

Optical interfaces at points MPI-S and S'

Channeloutput power(the output oftheamplifier)

Average dBm -2 -4

Maximum dBm 0 -2

Minimum dBm -4 -6

Maximum total output power dBm +20 +18

Maximum insertion loss at points Sand S' (FIU)

dB ≤ 1 ≤ 1

Maximum channel power differenceat point MPI-S

dB 4 4

Optical path (from MPI-S to MPI-R)

Maximum discrete reflectance dB -27 -27

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Item Unit Performance Parameter

Maximum average differential groupdelay (DGD)

ps 18 18

Maximum dispersion ps/nm 16000 2880

Optical interfaces at points MPI-R and R'

Channelinput power(the input oftheamplifier)

Average dBm -26 -28

Maximum dBm -23 -25

Minimum dBm -29 -31

Maximum total input power (inputport of amplifiers)

dBm -3 -5

Minimum optical signal-to-noiseratio at point MPI-R

dB 14.5 14.5

Maximum channel power differenceat point MPI-R

dB 6 6

Maximum insertion loss at pointsMPI-R and R' (FIU)

dB ≤ 1 ≤ 1

NOTE

Among the main optical path parameters of all types of systems mentioned above, the values in the"Minimum optical signal-to-noise ratio at point MPI-R" row refer to the typical OSNR values in a givennetworking. The actual OSNR values may be different from the values in the table because of variousfactors

11.3 Wavelength and Frequency of Optical ChannelsThe system uses the frequencies and wavelengths in the C band and L band.

11.3.1 Nominal Central Wavelengths of C-Band SystemIn the C-band system, the central frequency of channels cover the 192 wavelengths from 196.05THz to 191.30 THz.

11.3.2 Nominal Central Wavelengths of L-Band SystemIn the L-band system, the central frequency of channels cover the 80 wavelengths from 190.90THz to 186.95 THz.

11.3.1 Nominal Central Wavelengths of C-Band SystemIn the C-band system, the central frequency of channels cover the 192 wavelengths from 196.05THz to 191.30 THz.

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Table 11-47 C-band channel allocation XE "C-band channel allocation" (96 channels with50GHz spacing)

CentralFrequency (THz)

Central Wavelength(nm)

CentralFrequency (THz)

CentralWavelength (nm)

196.050 1529.163 193.650 1548.115

196.000 1529.553 193.600 1548.515

195.950 1529.944 193.550 1548.915

195.900 1530.334 193.500 1549.315

195.850 1530.725 193.450 1549.715

195.800 1531.116 193.400 1550.116

195.750 1531.507 193.350 1550.517

195.700 1531.898 193.300 1550.918

195.650 1532.290 193.250 1551.319

195.600 1532.681 193.200 1551.721

195.550 1533.073 193.150 1552.122

195.500 1533.465 193.100 1552.524

195.450 1533.858 193.050 1552.926

195.400 1534.250 193.000 1553.329

195.350 1534.643 192.950 1553.731

195.300 1535.036 192.900 1554.134

195.250 1535.429 192.850 1554.537

195.200 1535.822 192.800 1554.940

195.150 1536.216 192.750 1555.343

195.100 1536.609 192.700 1555.747

195.050 1537.003 192.650 1556.151

195.000 1537.397 192.600 1556.555

194.950 1537.792 192.550 1556.959

194.900 1538.186 192.500 1557.363

194.850 1538.581 192.450 1557.768

194.800 1538.976 192.400 1558.173

194.750 1539.371 192.350 1558.578

194.700 1539.766 192.300 1558.983

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CentralFrequency (THz)

Central Wavelength(nm)

CentralFrequency (THz)

CentralWavelength (nm)

194.650 1540.162 192.250 1559.389

194.600 1540.557 192.200 1559.794

194.550 1540.953 192.150 1560.200

194.500 1541.349 192.100 1560.606

194.450 1541.746 192.050 1561.013

194.400 1542.142 192.000 1561.419

194.350 1542.539 191.950 1561.826

194.300 1542.936 191.900 1562.233

194.250 1543.333 191.850 1562.640

194.200 1543.730 191.800 1563.047

194.150 1544.128 191.750 1563.455

194.100 1544.526 191.700 1563.863

194.050 1544.924 191.650 1564.271

194.000 1545.322 191.600 1564.679

193.950 1545.720 191.550 1565.087

193.900 1546.119 191.500 1565.496

193.850 1546.518 191.450 1565.905

193.800 1546.917 191.400 1566.314

193.750 1547.316 191.350 1566.723

193.700 1547.715 191.300 1567.133

Note: The odd number wavelengths belong to the C-ODD band and the even numberwavelengths belong to the C-EVEN band. 192.05~191.30 are the central frequencies of thechannels of the C extended wave band.

Table 11-48 C plus-band channel allocation XE "C-band channel allocation" (96 channels with50GHz spacing)

Central Frequency(THz)

CentralWavelength (nm)

Central Frequency(THz)

CentralWavelength (nm)

196.075 1528.968 193.675 1547.915

196.025 1529.358 193.625 1548.315

195.975 1529.748 193.575 1548.715

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Central Frequency(THz)

CentralWavelength (nm)

Central Frequency(THz)

CentralWavelength (nm)

195.925 1530.139 193.525 1549.115

195.875 1530.529 193.475 1549.515

195.825 1530.920 193.425 1549.916

195.775 1531.311 193.375 1550.317

195.725 1531.702 193.325 1550.717

195.675 1532.094 193.275 1551.119

195.625 1532.485 193.225 1551.520

195.575 1532.877 193.175 1551.922

195.525 1533.269 193.125 1552.323

195.475 1533.661 193.075 1552.725

195.425 1534.054 193.025 1553.128

195.375 1534.446 192.975 1553.530

195.325 1534.839 192.925 1553.933

195.275 1535.232 192.875 1554.335

195.225 1535.625 192.825 1554.739

195.175 1536.019 192.775 1555.142

195.125 1536.412 192.725 1555.545

195.075 1536.806 192.675 1555.949

195.025 1537.200 192.625 1556.353

194.975 1537.594 192.575 1556.757

194.925 1537.989 192.525 1557.161

194.875 1538.383 192.475 1557.566

194.825 1538.778 192.425 1557.970

194.775 1539.173 192.375 1558.375

194.725 1539.568 192.325 1558.780

194.675 1539.964 192.275 1559.186

194.625 1540.359 192.225 1559.591

194.575 1540.755 192.175 1559.997

194.525 1541.151 192.125 1560.403

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Central Frequency(THz)

CentralWavelength (nm)

Central Frequency(THz)

CentralWavelength (nm)

194.475 1541.548 192.075 1560.809

194.425 1541.944 192.025 1561.216

194.375 1542.341 191.975 1561.622

194.325 1542.737 191.925 1562.029

194.275 1543.135 191.875 1562.436

194.225 1543.532 191.825 1562.844

194.175 1543.929 191.775 1563.251

194.125 1544.327 191.725 1563.659

194.075 1544.725 191.675 1564.067

194.025 1545.123 191.625 1564.475

193.975 1545.521 191.575 1564.883

193.925 1545.920 191.525 1565.292

193.875 1546.318 191.475 1565.700

193.825 1546.717 191.425 1566.109

193.775 1547.116 191.375 1566.518

193.725 1547.516 191.325 1566.928

Note: The odd number wavelengths belong to the C-ODD-PLUS band and the even numberwavelengths belong to the C-EVEN-PLUS band. 192.075~191.325 are the central frequenciesof the channels of the C extended wave band.

11.3.2 Nominal Central Wavelengths of L-Band SystemIn the L-band system, the central frequency of channels cover the 80 wavelengths from 190.90THz to 186.95 THz.

Table 11-49 L-band channel allocation XE "L-band channel allocation" (80 channels with 50GHz spacing)

CentralFrequency (THz)

Central Wavelength(nm)

CentralFrequency (THz)

CentralWavelength (nm)

190.900 1570.420 188.900 1587.040

190.850 1570.830 188.850 1587.460

190.800 1571.240 188.800 1587.880

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CentralFrequency (THz)

Central Wavelength(nm)

CentralFrequency (THz)

CentralWavelength (nm)

190.750 1571.650 188.750 1588.300

190.700 1572.060 188.700 1588.730

190.650 1572.480 188.650 1589.150

190.600 1572.890 188.600 1589.570

190.550 1573.300 188.550 1589.990

190.500 1573.710 188.500 1590.410

190.450 1574.130 188.450 1590.830

190.400 1574.540 188.400 1591.260

190.350 1574.950 188.350 1591.680

190.300 1575.370 188.300 1592.100

190.250 1575.780 188.250 1592.520

190.200 1576.200 188.200 1592.950

190.150 1576.610 188.150 1593.370

190.100 1577.030 188.100 1593.790

190.050 1577.440 188.050 1594.220

190.000 1577.860 188.000 1594.640

189.950 1578.270 187.950 1595.060

189.900 1578.690 187.900 1595.490

189.850 1579.100 187.850 1595.910

189.800 1579.520 187.800 1596.340

189.750 1579.930 187.750 1596.760

189.700 1580.350 187.700 1597.190

189.650 1580.770 187.650 1597.620

189.600 1581.180 187.600 1598.040

189.550 1581.600 187.550 1598.470

189.500 1582.020 187.500 1598.890

189.450 1582.440 187.450 1599.320

189.400 1582.850 187.400 1599.750

189.350 1583.270 187.350 1600.170

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CentralFrequency (THz)

Central Wavelength(nm)

CentralFrequency (THz)

CentralWavelength (nm)

189.300 1583.690 187.300 1600.600

189.250 1584.110 187.250 1601.030

189.200 1584.530 187.200 1601.460

189.150 1584.950 187.150 1601.880

189.100 1585.360 187.100 1602.310

189.050 1585.780 187.050 1602.740

189.000 1586.200 187.000 1603.170

188.950 1586.620 186.950 1603.570

Note: The odd number wavelengths belong to L-ODD band and the even number wavelengthsbelong to L-EVEN band.

11.4 Laser ClassEach type of boards of the product has a different laser class.

NOTE

The power shown in Table 11-50 refers to the reference output power of the laser. It is achieved when themode-field diameter of fiber is 10 um at the 1550 nm wavelength.

Table 11-50 Laser class

Reference OpticalPower Range Laser Class Board Type

Under 10 dBm Class 1 D40, M40, V48, V40, DCP, OLP, FCE, FDG, LBE,LBES, LDG, LOG, LOGS, ELOG, ELOGS,LWC1, TRC1, LWC, TRC, TMX, TMXS, TMR,TMRS, LWF, LWFS, LWM, LWX, LWMR,LWXR, MCA, OCP, SC1, SC2, ST1, ST2, SCS,MWF, LBF, LBFS, ETMX, ETMXS, LQM, M48,D48, LOM, LOMS, LW40, LR40, IMX4, IMX4S,LWFD, LRFD, LU40, LU40S, TMX40, TMX40S

10 - 21.3 dBm Class 1M DGE, DSE, DWC, EDWC, FIU, GFU, ITL, MR2,MR8, OPU, VA4, VA2, VOA, FMU, E2OAU, E5/E4OAUC00, E5/E4OAUC01, E5/E4OAUC03, E5/E4OBUC03, WSM9, WSM5, WSD9, WSD5RMU9, WSMD4, WSMD2

21.3 - 27 dBm Class 3B HBA, E5OAUC05, E4OAUC05, E5OBUC05,E4OBUC05, MWA

Above 27 dBm Class 4 RPA, RPC

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11.5 Optical Transponder Board SpecificationsThe specifications of the OTU boards include the specifications of the optical modules at theclient and WDM sides, mechanical specifications, and power consumption.

The OTU, optical transponder unit, converts client signals into a standard G.692-compliantDWDM wavelength. Its interface parameter specifications meet the requirements that are givenin the following tables. All the specifications provided by Huawei assume the worst case, thatis, these specifications can meet the requirements under the permitted worst working conditionsat EOL (end of life).

11.5.1 ELOG Board SpecificationsELOG board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.2 ELOGS Board SpecificationsELOGS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.3 ETMX Board SpecificationsETMX board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.4 ETMXS Board SpecificationsETMXS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.5 FCE Board SpecificationsFCE board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.6 FDG Board SpecificationsFDG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.7 IMX4 Board SpecificationsIMX4 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.8 IMX4S Board SpecificationsIMX4S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.9 LBE Board SpecificationsLBE board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.10 LBES Board SpecificationsLBES board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.11 LBF Board SpecificationsLBF board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.12 LBFS Board Specifications

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LBFS Board Specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.13 LDG Board SpecificationsLDG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.14 LOG Board SpecificationsLOG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.15 LOGS Board SpecificationsLOGS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.16 LOM Board SpecificationsLOM board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.17 LOMS Board SpecificationsLOMS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.18 LQM Board SpecificationsLQM board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.19 LR40 Board SpecificationsLR40 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.20 LRF Board SpecificationsLRF board specifications include specifications of optical module on the WDM side, laser safetylevel, mechanical specifications and power consumption.

11.5.21 LRFD Board SpecificationsLRFD board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.22 LRFS Board SpecificationsLRFS board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.23 LU40 Board SpecificationsLU40 board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.24 LU40S Board SpecificationsLU40S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.25 LW40 Board SpecificationsLW40 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.26 LWC1 Board SpecificationsLWC1 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

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11.5.27 LWF Board SpecificationsLWF board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.28 LWFS Board SpecificationsLWFS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.29 LWM Board SpecificationsLWM board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.30 LWMR Board SpecificationsLWMR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.31 LWX Board SpecificationsLWX board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.32 LWXR Board SpecificationsLWXR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.33 TMR Board SpecificationsTMR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.34 TMRS Board SpecificationsTMRS board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.35 TMX Board SpecificationsTMX board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

11.5.36 TMXS Board SpecificationsTMXS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.37 TMX40 Board SpecificationsTMX40 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.38 TMX40S Board SpecificationsTMX40S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

11.5.39 TRC1 Board SpecificationsTRC1 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.40 TRC2 Board SpecificationsTRC2 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

11.5.41 Jitter Transfer CharacteristicsSpecifications include jitter transfer characteristics specifications of OTU.

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11.5.42 Input Jitter ToleranceSpecifications include input jitter tolerance specifications of OTU.

11.5.43 Output JitterSpecifications include output jitter specifications of OTU.

11.5.1 ELOG Board SpecificationsELOG board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-51 and Table 11-52 list the specifications of optical module on the client side of theELOG.

Table 11-51 Specifications of optical module on the client side of the ELOG (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Table 11-52 Specifications of optical module on the client side of the ELOG (FC100 and FC200)

Parameters Unit Specifications

Optical Interfacetype

- FC100/FC200 FC100/FC200

Line code format - - -

Target distance 0.5 km (0.3 mi.) 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 770–860 1266–1360

Maximum meanlaunched power

dBm –2.5 –3

Minimum meanlaunched power

dBm –9.5 –10

Maximum -20 dBspectrum width

nm NA NA

Minimum side-modesuppression ratio(SMSR)

dB NA NA

Eye pattern mask NA Compliant with the parameter template ofFiber Channel physical interface (FC-PI-2)

Receiver parameter specifications at point R

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Parameters Unit Specifications

Receiver type - PIN PIN

Operatingwavelength range

nm 770–860 1270–1580

Receiver sensitivity dBm –17 –18

Receiver overload dBm 0 –3

Maximumreflectance

dB NA NA

Specifications of Optical Module on the WDM Side

Table 11-53 and Table 11-54 list the specifications of optical module on the WDM side of theELOG.

Table 11-53 Specifications of fixed wavelength optical module on the WDM side of the ELOG

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05 191.30 – 196.00,191.35 – 196.05

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

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Parameter Unit Specification

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-54 Specifications of tunable wavelength optical module on the WDM side of the ELOG

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

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Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 54.0 W

l Maximum power consumption at 55°C (131°F): 58.0 W

11.5.2 ELOGS Board SpecificationsELOGS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-55 and Table 11-56 list the optical module specifications on the client side of theELOGS.

Table 11-55 Specifications of optical module on the client side of the ELOGS (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Table 11-56 Specifications of optical module on the client side of the ELOGS (FC100 andFC200)

Parameters Unit Specifications

Optical Interfacetype

- FC100/FC200 FC100/FC200

Line code format - - -

Target distance 0.5 km (0.3 mi.) 2 km (1.2 mi.)

Transmitter parameter specifications at point S

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Parameters Unit Specifications

Operatingwavelength range

nm 770–860 1266–1360

Maximum meanlaunched power

dBm –2.5 –3

Minimum meanlaunched power

dBm –9.5 –10

Maximum -20 dBspectrum width

nm NA NA

Minimum side-modesuppression ratio(SMSR)

dB NA NA

Eye pattern mask NA Compliant with the parameter template ofFiber Channel physical interface (FC-PI-2)

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 770–860 1270–1580

Receiver sensitivity dBm –17 –18

Receiver overload dBm 0 –3

Maximumreflectance

dB NA NA

Specifications of Optical Module on the WDM Side

Table 11-57 and Table 11-58 list the specifications of optical module on the WDM side of theELOGS.

Table 11-57 Specifications of fixed wavelength optical module on the WDM side of the ELOGS

Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

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Parameter Unit Specification

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

Maximum reflectance dB -27 -27

Table 11-58 Specifications of tunable wavelength optical module on the WDM side of theELOGS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

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Parameters Unit Specification

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 54.0 W

l Maximum power consumption at 55°C (131°F): 58.0 W

11.5.3 ETMX Board SpecificationsETMX board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

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Specifications of Optical Module on the Client SideTable 11-59 and Table 11-60 list the specifications of optical module on the client of the ETMX.

Table 11-59 Specifications of optical module on the client side of the ETMX (SDH/SONET)

Parameters Unit Specifications

Optical interfacetype

- I-16 S-16.1 L-16.1 L-16.2

Line code format - NRZ NRZ NRZ NRZ

Optical source type - MLM SLM SLM SLM

Target distance – 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266 – 1360 1260 – 1360 1280 – 1335 1500 – 1580

Maximum meanlaunched power

dBm –3 0 +3 +3

Minimum meanlaunched power

dBm –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +8.2 +8.2 +8.2

Maximum –20 dBspectrum width

nm NA 1 1 1

Minimum SMSR dB NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point R

Receiver type - PIN PIN APD APD

Operatingwavelength range

nm 1200 – 1650 1200 – 1650 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiver overload dBm –3 0 –9 –9

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Parameters Unit Specifications

Maximumreflectance

dB –27 –27 –27 –27

Table 11-60 Specifications of optical module on the client side of the ETMX (OTU1)

Parameter Unit Specification

Opticalinterfacetype

- P1I1-1D1 P1S1-1D1 P1L1-1D1 P1L1-1D2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

– 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Operatingwavelengthrange

nm 1266–1360 1260–1360 1280–1335 1500–1580

Maximummeanlaunchedpower

dBm –3 0 +3 +3

Minimummeanlaunchedpower

dBm –10 –5 –2 –2

Minimumextinctionratio

dB 8.2 8.2 8.2 8.2

Maximum –20 dBspectralwidth

nm NA 1 1 1

MinimumSMSR

dB NA 30 30 30

Maximumdispersion

ps/nm NA NA NA 1600

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Parameter Unit Specification

Eye patternmask

- Compliant with G.959.1

Receivertype

- PIN PIN APD APD

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200–1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiveroverload

dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-61 and Table 11-62 list the specifications of optical module on the WDM side of theETMX.

Table 11-61 Specifications of fixed wavelength optical module on the WDM side of the ETMX

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

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Parameter Unit Specification

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-62 Specifications of tunable wavelength optical module on the WDM side of theETMX

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

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Parameter Unit Specification

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 32.2 W

l Maximum power consumption at 55°C (131°F): 35.4 W

11.5.4 ETMXS Board SpecificationsETMXS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-63 and Table 11-64 list the specifications of optical module on the client side of theETMXS.

Table 11-63 Specifications of optical module on the client side of the ETMXS (SDH/SONET)

Parameters Unit Specifications

Optical interfacetype

- I-16 S-16.1 L-16.1 L-16.2

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Parameters Unit Specifications

Line code format - NRZ NRZ NRZ NRZ

Optical source type - MLM SLM SLM SLM

Target distance – 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266 – 1360 1260 – 1360 1280 – 1335 1500 – 1580

Maximum meanlaunched power

dBm –3 0 +3 +3

Minimum meanlaunched power

dBm –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +8.2 +8.2 +8.2

Maximum –20 dBspectrum width

nm NA 1 1 1

Minimum SMSR dB NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point R

Receiver type - PIN PIN APD APD

Operatingwavelength range

nm 1200 – 1650 1200 – 1650 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiver overload dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Table 11-64 Specifications of optical module on the client side of the ETMXS (OTU1)

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Parameter Unit Specification

Opticalinterfacetype

- P1I1-1D1 P1S1-1D1 P1L1-1D1 P1L1-1D2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

– 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Operatingwavelengthrange

nm 1266–1360 1260–1360 1280–1335 1500–1580

Maximummeanlaunchedpower

dBm –3 0 +3 +3

Minimummeanlaunchedpower

dBm –10 –5 –2 –2

Minimumextinctionratio

dB 8.2 8.2 8.2 8.2

Maximum –20 dBspectralwidth

nm NA 1 1 1

MinimumSMSR

dB NA 30 30 30

Maximumdispersion

ps/nm NA NA NA 1600

Eye patternmask

- Compliant with G.959.1

Receivertype

- PIN PIN APD APD

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200–1650

Receiversensitivity

dBm –18 –18 –27 –28

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Parameter Unit Specification

Receiveroverload

dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-65 and Table 11-66 list the specifications of optical module on the WDM side of theETMXS.

Table 11-65 Specifications of fixed wavelength optical module on the WDM side of the ETMXS

Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

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Parameter Unit Specification

Maximum reflectance dB -27 -27

Table 11-66 Specifications of tunable wavelength optical module on the WDM side of theETMXS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

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Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.3 kg (2.9 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 34.5 W

l Maximum power consumption at 55°C (131°F): 37.9 W

11.5.5 FCE Board SpecificationsFCE board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-67 lists the specifications of optical module on the client side of the FCE.

Table 11-67 Specifications of optical module on the client side of the FCE

Parameters Unit Specifications

Optical Interfacetype

- FC100/FC200 FC100/FC200

Line code format - - -

Target distance 0.5 km (0.3 mi.) 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 770–860 1266–1360

Maximum meanlaunched power

dBm –2.5 –3

Minimum meanlaunched power

dBm –9.5 –10

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Parameters Unit Specifications

Maximum -20 dBspectrum width

nm NA NA

Minimum side-modesuppression ratio(SMSR)

dB NA NA

Eye pattern mask NA Compliant with the parameter template ofFiber Channel physical interface (FC-PI-2)

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 770–860 1270–1580

Receiver sensitivity dBm –17 –18

Receiver overload dBm 0 –3

Maximumreflectance

dB NA NA

Specifications of Optical Module on the WDM SideTable 11-68 and Table 11-69 list the specifications of optical module on the WDM side of theFCE.

Table 11-68 Specifications of fixed wavelength optical module on the WDM side of the FCE

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-69 Specifications of tunable wavelength optical module on the WDM side of the FCE

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

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Parameters Unit Specification

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weigh: 1.1 kg (2.4 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 32.0 W

l Maximum power consumption at 55°C (131°F): 35.2 W

11.5.6 FDG Board SpecificationsFDG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-70 lists the specifications of optical module on the client side of the FDG.

Table 11-70 Specifications of optical module on the client side of the FDG

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Specifications of Optical Module on the WDM SideTable 11-71 and Table 11-72 list the specifications of optical module on the WDM side of theFDG.

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Table 11-71 Specifications of fixed wavelength optical module on the WDM side of the FDG

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-72 Specifications of tunable wavelength optical module on the WDM side of the FDG

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Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power Consumption

The power consumption of the board is as follows:

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l Maximum power consumption at 25°C (77°F): 28.0

l Maximum power consumption at 55°C (131°F): 30.8

11.5.7 IMX4 Board SpecificationsIMX4 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-73 lists the specifications of optical module on the client side of the IMX4.

Table 11-73 Specifications of optical module on the client side of the IMX4

Parameters Unit Specifications

Optical Interface type - VSR2000-3R2

Line code format - NRZ

Target distance - 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operating wavelength range nm 1530–1565

Maximum mean launchedpower

dBm +3

Minimum mean launchedpower

dBm 0

Minimum extinction ratio dB 8.2

Maximum -20 dB spectrumwidth

nm 1

Minimum side-modesuppression ratio (SMSR)

dB 35

Eye pattern mask NA Compliant with G.693

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1290–1570

Receiver sensitivity dBm –6

Receiver overload dBm +3

Maximum reflectance dB –27

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Specifications of Optical Module on the WDM SideTable 11-74 and Table 11-75 list the specifications of optical module on the WDM side of theIMX4.

Table 11-74 Specifications of fixed wavelength optical module on the WDM side of the IMX4

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05 191.30 – 196.00,191.35 – 196.05

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-75 Specifications of tunable wavelength optical module on the WDM side of the IMX4

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Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weight: 4.5 kg (9.9 lb.)

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Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 120.0 W

l Maximum power consumption at 55°C (131°F): 132.0 W

11.5.8 IMX4S Board SpecificationsIMX4S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-76 lists the specifications of optical module on the client side of the IMX4S.

Table 11-76 Specifications of optical module on the client side of the IMX4S

Parameters Unit Specifications

Optical Interface type - VSR2000-3R2

Line code format - NRZ

Target distance - 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operating wavelength range nm 1530–1565

Maximum mean launchedpower

dBm +3

Minimum mean launchedpower

dBm 0

Minimum extinction ratio dB 8.2

Maximum -20 dB spectrumwidth

nm 1

Minimum side-modesuppression ratio (SMSR)

dB 35

Eye pattern mask NA Compliant with G.693

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1290–1570

Receiver sensitivity dBm –6

Receiver overload dBm +3

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Parameters Unit Specifications

Maximum reflectance dB –27

Specifications of Optical Module on the WDM SideTable 11-77 lists the specifications of optical module on the WDM side of the IMX4S.

Table 11-77 Specifications of tunable wavelength optical module on the WDM side of theIMX4S

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

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Parameters Unit Specification

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weight: 4.7 kg (10.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 120.0 W

l Maximum power consumption at 55°C (131°F): 132.0 W

11.5.9 LBE Board SpecificationsLBE board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-78 lists the specifications of optical module on the client side of the LBE.

Table 11-78 Specifications of optical module on the client side of the LBE

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

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Parameters Unit Specifications

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM SideTable 11-79 and Table 11-80 list the specifications of optical module on the WDM side of theLBE.

Table 11-79 Specifications of fixed wavelength optical module on the WDM side of the LBE

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Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-80 Specifications of tunable wavelength optical module on the WDM side of the LBE

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

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Parameter Unit Specification

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.2 kg (2.6 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 43.7 W

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l Maximum power consumption at 55°C (131°F):: 48.1 W

11.5.10 LBES Board SpecificationsLBES board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-81 lists the specifications of optical module on the client side of the LBES.

Table 11-81 Specifications of optical module on the client side of the LBES

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

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Parameters Unit Specifications

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-82 and Table 11-83 list the specifications of optical module on the WDM side of theLBES.

Table 11-82 Specifications of fixed wavelength optical module on the WDM side of the LBES

Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

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Parameter Unit Specification

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

Maximum reflectance dB -27 -27

Table 11-83 Specifications of tunable wavelength optical module on the WDM side of the LBES

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

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Parameters Unit Specification

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.5 kg (3.3 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 52.1 W

l Maximum power consumption at 55°C (131°F):: 57.3 W

11.5.11 LBF Board SpecificationsLBF board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-84, Table 11-85, and Table 11-86 list the specifications of optical module on the clientside of the LBF.

Table 11-84 Specifications of optical module on the client side of the LBF (SDH/SONET)

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

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Parameters Unit Specifications

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

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Parameters Unit Specifications

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-85 Specifications of optical module on the client side of the LBF (OTU2)

Parameters Unit Specification

Optical interface type – P1I1-2D1 P1S1-2D2b P1L1-2D2

Line code format – NRZ NRZ NRZ

Optical source type – SLM SLM SLM

Target distance – 2 km (1.2 mi.) 40 km (25 mi.) 80 km (50 mi.)

Transmitter parameter specifications at point S

Operating wavelengthrange

nm 1290 – 1330 1530 – 1565 1530 – 1565

Maximum meanlaunched power

dBm –1 +2 +4

Minimum meanlaunched power

dBm –6 –1 0

Minimum extinctionratio

dB 6 8.2 9

Maximum –20 dBspectral width

nm 1 0.3 0.3

Minimum SMSR dB 30 30 30

Eye pattern mask – Compliant with G.959.1

Receiver parameter specifications at point R

Receiver type – PIN PIN APD

Receiver sensitivity dBm –11 –14 –24

Receiver overload dBm –1 –1 –7

Maximum reflectance dB –27 –27 –27

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Table 11-86 Specifications of optical module on the client side of the LBF (10GE-LAN)

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

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Specifications of Optical Module on the WDM Side

Table 11-87 and Table 11-88 list the specifications of optical module on the WDM side of theLBF.

Table 11-87 Specifications of fixed wavelength optical module on the WDM side of the LBF

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-88 Specifications of tunable wavelength optical module on the WDM side of the LBF

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Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.95 kg (2.1 lb.)

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Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 22.0 W

l Maximum power consumption at 55°C (131°F): 26.0 W

11.5.12 LBFS Board SpecificationsLBFS Board Specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-89, Table 11-90, and Table 11-91 list the specifications of optical module on the clientside of the LBFS.

Table 11-89 Specifications of optical module on the client side of the LBFS (SDH/SONET)

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

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Parameters Unit Specifications

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-90 Specifications of optical module on the client side of the LBFS (OTU2)

Parameters Unit Specification

Optical interface type – P1I1-2D1 P1S1-2D2b P1L1-2D2

Line code format – NRZ NRZ NRZ

Optical source type – SLM SLM SLM

Target distance – 2 km (1.2 mi.) 40 km (25 mi.) 80 km (50 mi.)

Transmitter parameter specifications at point S

Operating wavelengthrange

nm 1290 – 1330 1530 – 1565 1530 – 1565

Maximum meanlaunched power

dBm –1 +2 +4

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Parameters Unit Specification

Minimum meanlaunched power

dBm –6 –1 0

Minimum extinctionratio

dB 6 8.2 9

Maximum –20 dBspectral width

nm 1 0.3 0.3

Minimum SMSR dB 30 30 30

Eye pattern mask – Compliant with G.959.1

Receiver parameter specifications at point R

Receiver type – PIN PIN APD

Receiver sensitivity dBm –11 –14 –24

Receiver overload dBm –1 –1 –7

Maximum reflectance dB –27 –27 –27

Table 11-91 Specifications of optical module on the client side of the LBFS (10GE-LAN)

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

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Parameters Unit Specifications

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-92 and Table 11-93 list the specifications of optical module on the WDM side of theLBFS.

Table 11-92 Specifications of fixed wavelength optical module on the WDM side of the LBFS

Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

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Parameter Unit Specification

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

Maximum reflectance dB -27 -27

Table 11-93 Specifications of tunable wavelength optical module on the WDM side of the LBFS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

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Parameters Unit Specification

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.95 kg (2.1 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 26.0 W

l Maximum power consumption at 55°C (131°F): 28.6 W

11.5.13 LDG Board SpecificationsLDG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-94 lists the specifications of optical module on the client side of the LDG.

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Table 11-94 Specifications of optical module on the client side of the LDG

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

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Specifications of Optical Module on the WDM SideTable 11-95 and Table 11-96 list the optical specifications on the WDM side of the LDG.

Table 11-95 Specifications of fixed wavelength optical module on the WDM side of the LDG

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

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Table 11-96 Specifications of tunable wavelength optical module on the WDM side of the LDG

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

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Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 28.0 W

l Maximum power consumption at 55°C (131°F): 30.8 W

11.5.14 LOG Board SpecificationsLOG board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-97 list the specifications of optical module on the client side of the LOG.

Table 11-97 Specifications of optical module on the client side of the LOG (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Specifications of Optical Module on the WDM SideTable 11-98 and Table 11-99 list the optical specifications on the WDM side of the LOG.

Table 11-98 Specifications of fixed wavelength optical module on the WDM side of the LOG

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

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Parameter Unit Specification

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-99 Specifications of tunable wavelength optical module on the WDM side of the LOG

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

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Parameter Unit Specification

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.5 kg (3.3 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 38.0 W

l Maximum power consumption at 55°C (131°F): 42.9 W

11.5.15 LOGS Board SpecificationsLOGS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-100 list the specifications of optical module on the client side of the LOGS.

Table 11-100 Specifications of optical module on the client side of the LOGS (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Specifications of Optical Module on the WDM Side

Table 11-101 lists the specifications of optical module on the WDM side of the LOGS.

Table 11-101 Specifications of tunable wavelength optical module on the WDM side of theLOGS

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Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.5 kg (3.3 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 43.2 W

l Maximum power consumption at 55°C (131°F): 47.5 W

11.5.16 LOM Board SpecificationsLOM board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-102 and Table 11-103 list the specifications of optical module on the client side ofthe LOM.

Table 11-102 Specifications of optical module on the client side of the LOM (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

11 Technical Specifications

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Table 11-103 Specifications of optical module on the client side of the LOM (FC and FICON)

Parameters Unit

Specification

FC400 FC100/FICONFC200/FICON EXPRESS

Line codeformat

- 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

km 0.3 km (0.18mi.)

10 km (6 mi.) 0.5 km (0.3mi.)

2 km (1.2mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 830-860 1270-1355 770–860 1266-1360

Maximummeanlaunchedpower

dBm -1 -2 -2.5 -3

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Parameters Unit

Specification

FC400 FC100/FICONFC200/FICON EXPRESS

Minimummeanlaunchedpower

dBm -9 -8 -9.5 -10

Maximum-20 dBspectrumwidth

nm NA NA NA NA

Minimumside-modesuppressionratio(SMSR)

dB NA NA NA NA

Eye patternmask

- Compliant with the parameter template of Fiber Channelphysical interface (FC-PI-2)

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 770-860 1260-1600 770-860 1270-1580

Receiversensitivity

dBm -14 -16 -17 -18

Minimumreceiveroverload

dBm 0 0 0 –3

Maximumreflectance

dB -12 -12 NA NA

Specifications of Optical Module on the WDM SideTable 11-104 and Table 11-105 list the specifications of optical module on the WDM side ofthe LOM.

Table 11-104 Specifications of fixed wavelength optical module on the WDM side of the LOM

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Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05 191.30 – 196.00,191.35 – 196.05

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-105 Specifications of tunable wavelength optical module on the WDM side of theLOM

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

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Parameter Unit Specification

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.8 kg (4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 71.6 W

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l Maximum power consumption at 55°C (131°F): 78.8 W

11.5.17 LOMS Board SpecificationsLOMS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-106 and Table 11-107 list the specifications of optical module on the client side ofthe LOMS.

Table 11-106 Specifications of optical module on the client side of the LOMS (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Table 11-107 Specifications of optical module on the client side of the LOMS (FC and FICON)

Parameters Unit

Specification

FC400 FC100/FICONFC200/FICON EXPRESS

Line codeformat

- 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

km 0.3 km (0.18mi.)

10 km (6 mi.) 0.5 km (0.3mi.)

2 km (1.2mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 830-860 1270-1355 770–860 1266-1360

Maximummeanlaunchedpower

dBm -1 -2 -2.5 -3

Minimummeanlaunchedpower

dBm -9 -8 -9.5 -10

Maximum-20 dBspectrumwidth

nm NA NA NA NA

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Parameters Unit

Specification

FC400 FC100/FICONFC200/FICON EXPRESS

Minimumside-modesuppressionratio(SMSR)

dB NA NA NA NA

Eye patternmask

- Compliant with the parameter template of Fiber Channelphysical interface (FC-PI-2)

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 770-860 1260-1600 770-860 1270-1580

Receiversensitivity

dBm -14 -16 -17 -18

Minimumreceiveroverload

dBm 0 0 0 –3

Maximumreflectance

dB -12 -12 NA NA

Specifications of Optical Module on the WDM SideTable 11-108 lists the specifications of optical module on the WDM side of the LOMS.

Table 11-108 Specifications of tunable wavelength optical module on the WDM side of theLOMS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

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Parameters Unit Specification

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.8 kg (4 lb.)

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Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 71.6 W

l Maximum power consumption at 55°C (131°F): 78.8 W

11.5.18 LQM Board SpecificationsLQM board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-109, Table 11-110, Table 11-111 and Table 11-112 list the specifications of opticalmodule on the client side of the LQM.

Table 11-109 Specifications of optical module on the client side of the LQM (GE)

Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Line codeformat

– 8B/10B 8B/10B 8B/10B 8B/10B

Targetdistance

- 0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Maximummeanlaunchedpower

dBm –2.5 –3 3 5

Minimummeanlaunchedpower

dBm –9.5 –11.5 –4.5 –2

Minimumextinctionratio

dB 9 9 9 9

Eye patternmask

– IEEE802.3z-compliant

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Parameters Unit

Specifications

1000BASE-SX-0.5 km

1000 BASE-LX-10 km

1000 BASE-LX-40 km

1000 BASE-ZX-80 km

Receiver parameter specifications at point R

Receivertype

– PIN PIN PIN PIN

Operatingwavelengthrange

nm 770 to 860 1270 to 1355 1270 to 1355 1500 to 1580

Receiversensitivity

dBm –17 –19 –21 –21

Minimumreceiveroverload

dBm 0 –3 –3 –3

Table 11-110 Specifications of optical module on the client side of the LQM (SDH/SONET)

Parameters Unit Specifications

Optical Interfacetype

- S-4.1 L-4.1 I-16 S-16.1 L-16.1 L-16.2

Line code format - NRZ NRZ NRZ NRZ NRZ NRZ

Optical sourcetype

- MLM SLM MLM SLM SLM SLM

Target distance - 15 km(9 mi.)

40 km(25mi.)

2 km(1.2mi.)

15 km (9mi.)

40 km(25mi.)

80 km(50 mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1274–1356

1280–1335

1266–1360

1260–1360

1280–1335

1500–1580

Maximum meanlaunched power

dBm –8 +2 –3 0 +3 +3

Minimum meanlaunched power

dBm –15 –3 –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +10 +8.2 +8.2 +8.2 +8.2

Maximum –20 dBspectrum width

nm NA 1 NA 1 1 1

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Parameters Unit Specifications

Minimum SMSR dB NA 30 NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA NA NA 1600

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point R

Receiver type - APD APD PIN PIN APD APD

Operatingwavelength range

nm 1200–1650

1200–1650

1200–1650

1200–1650

1200–1650

1200–1650

Receiversensitivity

dBm –28 –28 –18 –18 –27 –28

Receiver overload dBm –8 –8 –3 0 –9 –9

Maximumreflectance

dB –27 –14 –27 –27 –27 –27

Remark - - - The optical interface type is just used asa reference to the physical parameters ofthe optical interface. It does not indicatethat the optical interface supports onlythe service of this type.This module can compatibly accessservices such as the STM-16/OC-48 andHDTV services.

Table 11-111 Specifications of optical module on the client side of the LQM (FC)

Parameters Unit Specifications

Optical Interfacetype

- FC100/FC200 FC100/FC200

Line code format - - -

Target distance 0.5 km (0.3 mi.) 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 770–860 1266–1360

Maximum meanlaunched power

dBm –2.5 –3

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Parameters Unit Specifications

Minimum meanlaunched power

dBm –9.5 –10

Maximum -20 dBspectrum width

nm NA NA

Minimum side-modesuppression ratio(SMSR)

dB NA NA

Eye pattern mask NA Compliant with the parameter template ofFiber Channel physical interface (FC-PI-2)

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 770–860 1270–1580

Receiver sensitivity dBm –17 –18

Receiver overload dBm 0 –3

Maximumreflectance

dB NA NA

Table 11-112 Specifications of optical module on the client side of the LQM (ESCON and otherservices)

Parameters Unit Specifications

Target distance - 2 km (1.2 mi.) 15 km (9 mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266–1360 1266–1360

Maximum meanlaunched power

dBm –14 –8

Minimum meanlaunched power

dBm –19 –15

Minimum extinctionratio

dB 10 8.2

Maximum -20 dBspectrum width

nm NA NA

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Parameters Unit Specifications

Minimum side-modesuppression ratio(SMSR)

dB NA NA

Eye pattern mask NA Compliant with G.957

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 1200–1650 1270–1650

Receiver sensitivity dBm –27 –28

Receiver overload dBm –14 –8

Maximumreflectance

dB NA NA

Remark This module can compatibly access servicessuch as the ESCON, DVB-ASI and FEservices.

Specifications of Optical Module on the WDM SideTable 11-113 and Table 11-114 list the specifications of optical module on the WDM side ofthe LQM.

Table 11-113 Specifications of fixed wavelength optical module on the WDM side of the LQM

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-114 Specifications of tunable wavelength optical module on the WDM side of theLQM

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

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Parameters Unit Specification

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 63.4 W

l Maximum power consumption at 55°C (131°F): 66.5 W

11.5.19 LR40 Board SpecificationsLR40 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM SideTable 11-115 lists the specifications of optical module on the WDM sides of the LR40.

Table 11-115 Specifications of optical module on the WDM side of the LR40

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Parameters Unit Specifications

Line code format - ODB DRZ

Channel spacing GHz 50 100

Transmitter parameter specifications at point S

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimum extinctionratio

dB 8.0 8.0

Nominal Centralfrequency

THz 192.10–196.05 192.10–196.00

Central frequencydeviation

GHz ±2.5 ±5

Maximum -20dBspectral width

nm 0.6 0.95

Minimum SMSR dB 30 30

Maximumdispersion

ps/nm 400 400

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 1529–1561 1529–1561

Receiver sensitivity(with FEC open)EOL

dBm –16 –16

Receiver overload(with FEC open)

dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):

345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weight: 3.3 kg (7.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 92.0 W

l Maximum power consumption at 55°C (131°F): 103.0 W

11.5.20 LRF Board SpecificationsLRF board specifications include specifications of optical module on the WDM side, laser safetylevel, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-116 and Table 11-117 list the specifications of optical module on the WDM side ofthe LRF.

Table 11-116 Specifications of fixed wavelength optical module on the WDM side of the LRF

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

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Parameter Unit Specification

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-117 Specifications of tunable wavelength optical module on the WDM side of the LRF

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

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Parameter Unit Specification

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.3 kg (2.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 25.0 W

l Maximum power consumption at 55°C (131°F): 27.5 W

11.5.21 LRFD Board SpecificationsLRFD board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM SideTable 11-118 and Table 11-119 list the specifications of optical module on the WDM side ofthe LRFD.

Table 11-118 Specifications of fixed wavelength optical module on the WDM side of the LRFD

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

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Parameter Unit Specification

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05 191.30 – 196.00,191.35 – 196.05

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-119 Specifications of tunable wavelength optical module on the WDM side of theLRFD

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

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Parameter Unit Specification

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.58 kg (3.49 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 51.65 W

l Maximum power consumption at 55°C (131°F): 56.82 W

11.5.22 LRFS Board SpecificationsLRFS board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM SideTable 11-120 lists the specifications of optical module on the WDM side of the LRFS.

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Table 11-120 Specifications of tunable wavelength optical module on the WDM side of theLRFS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

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Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.3 kg (2.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 33.0 W

l Maximum power consumption at 55°C (131°F): 36.3 W

11.5.23 LU40 Board SpecificationsLU40 board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-121 lists the specifications of optical module on the client side of the LU40.

Table 11-121 Specifications of optical module on the client side of the LU40

Parameters Unit Specifications

Optical Interface type - VSR2000-3R2

Line code format - NRZ

Target distance - 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operating wavelength range nm 1530–1565

Maximum mean launchedpower

dBm +3

Minimum mean launchedpower

dBm 0

Minimum extinction ratio dB 8.2

Maximum -20 dB spectrumwidth

nm 1

Minimum side-modesuppression ratio (SMSR)

dB 35

Eye pattern mask NA Compliant with G.693

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Parameters Unit Specifications

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1290–1570

Receiver sensitivity dBm –6

Receiver overload dBm +3

Maximum reflectance dB –27

Specifications of Optical Module on the WDM SideTable 11-122 lists the specifications of optical module on the WDM side of the LU40.

Table 11-122 Specifications of optical module on the WDM side of the LU40

Parameters Unit Specifications

Line code format - ODB DRZ

Channel spacing GHz 50 100

Transmitter parameter specifications at point S

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimum extinctionratio

dB 8.0 8.0

Nominal Centralfrequency

THz 192.10–196.05 192.10–196.00

Central frequencydeviation

GHz ±2.5 ±5

Maximum -20dBspectral width

nm 0.6 0.95

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 500 400

Receiver parameter specifications at point R

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Parameters Unit Specifications

Receiver type - PIN PIN

Operatingwavelength range

nm 1529–1567 1529–1567

Receiver sensitivity(with FEC open)EOL

dBm –16 –16

Receiver overload(with FEC open)

dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 3.89 kg (8.5 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 70.0 W

l Maximum power consumption at 55°C (131°F):77.0 W

11.5.24 LU40S Board SpecificationsLU40S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-123 lists the specifications of optical module on the client side of the LU40S.

Table 11-123 Specifications of optical module on the client side of the LU40S

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Parameters Unit Specifications

Optical Interface type - VSR2000-3R2

Line code format - NRZ

Target distance - 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operating wavelength range nm 1530–1565

Maximum mean launchedpower

dBm +3

Minimum mean launchedpower

dBm 0

Minimum extinction ratio dB 8.2

Maximum -20 dB spectrumwidth

nm 1

Minimum side-modesuppression ratio (SMSR)

dB 35

Eye pattern mask NA Compliant with G.693

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1290–1570

Receiver sensitivity dBm –6

Receiver overload dBm +3

Maximum reflectance dB –27

Specifications of Optical Module on the WDM Side

Table 11-124 lists the specifications of optical module on the WDM side of the LU40S.

Table 11-124 Specifications of optical module on the WDM side of the LU40S

Parameter Unit Specification

Channel spacing GHz 50

Line code format - DQPSK

Transmitter parameter specifications at point S

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Parameter Unit Specification

Maximum mean launched power dBm 0

Minimum power dBm -5

Minimum extinction ratio dB NA

Nominal central frequency THz 192.10 - 196.05

Central frequency deviation GHz ±2.5

Maximum –20 dB spectral width nm NA

Minimum SMSR dB 35

Maximum dispersion ps/nm 500

Eye pattern mask - NA

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1529 - 1567

Receiver sensitivity dBm -16

Receiver overload dBm 0

Maximum reflectance dB -27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 4.55 kg (1.0 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 84.0 W

l Maximum power consumption at 55°C (131°F): 92.4 W

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11.5.25 LW40 Board SpecificationsLW40 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-125 lists the specifications of optical module on the client side of the LW40.

Table 11-125 Specifications of optical module on the client side of the LW40

Parameters Unit Specifications

Optical Interface type - VSR2000-3R2

Line code format - NRZ

Target distance - 2 km (1.2 mi.)

Transmitter parameter specifications at point S

Operating wavelength range nm 1530–1565

Maximum mean launchedpower

dBm +3

Minimum mean launchedpower

dBm 0

Minimum extinction ratio dB 8.2

Maximum -20 dB spectrumwidth

nm 1

Minimum side-modesuppression ratio (SMSR)

dB 35

Eye pattern mask NA Compliant with G.693

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1290–1570

Receiver sensitivity dBm –6

Receiver overload dBm +3

Maximum reflectance dB –27

Specifications of Optical Module on the WDM SideTable 11-126 lists the specifications of optical module on the WDM side of the LW40.

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Table 11-126 Specifications of optical module on the WDM side of the LW40

Parameters Unit Specifications

Line code format - ODB DRZ

Channel spacing GHz 50 100

Transmitter parameter specifications at point S

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimum extinctionratio

dB 8.0 8.0

Nominal Centralfrequency

THz 192.10–196.05 192.10–196.00

Central frequencydeviation

GHz ±2.5 ±5

Maximum -20dBspectral width

nm 0.6 0.95

Minimum SMSR dB 30 30

Maximumdispersion

ps/nm 400 400

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 1529–1561 1529–1561

Receiver sensitivity(with FEC open)EOL

dBm –16 –16

Receiver overload(with FEC open)

dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

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Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weight: 4.9 kg (10.8 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 112.6 W

l Maximum power consumption at 55°C (131°F): 123.8 W

11.5.26 LWC1 Board SpecificationsLWC1 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-127 and Table 11-128 list the specifications of optical module on the client side ofthe LWC1.

Table 11-127 Specifications of optical module on the client side of the LWC1 (SDH/SONET)

Parameters Unit Specifications

Optical interfacetype

- I-16 S-16.1 L-16.1 L-16.2

Line code format - NRZ NRZ NRZ NRZ

Optical source type - MLM SLM SLM SLM

Target distance – 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266 – 1360 1260 – 1360 1280 – 1335 1500 – 1580

Maximum meanlaunched power

dBm –3 0 +3 +3

Minimum meanlaunched power

dBm –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +8.2 +8.2 +8.2

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Parameters Unit Specifications

Maximum –20 dBspectrum width

nm NA 1 1 1

Minimum SMSR dB NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point R

Receiver type - PIN PIN APD APD

Operatingwavelength range

nm 1200 – 1650 1200 – 1650 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiver overload dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Table 11-128 Specifications of optical module on the client side of the LWC1 (OTU1)

Parameter Unit Specification

Opticalinterfacetype

- P1I1-1D1 P1S1-1D1 P1L1-1D1 P1L1-1D2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

– 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Operatingwavelengthrange

nm 1266–1360 1260–1360 1280–1335 1500–1580

Maximummeanlaunchedpower

dBm –3 0 +3 +3

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Parameter Unit Specification

Minimummeanlaunchedpower

dBm –10 –5 –2 –2

Minimumextinctionratio

dB 8.2 8.2 8.2 8.2

Maximum –20 dBspectralwidth

nm NA 1 1 1

MinimumSMSR

dB NA 30 30 30

Maximumdispersion

ps/nm NA NA NA 1600

Eye patternmask

- Compliant with G.959.1

Receivertype

- PIN PIN APD APD

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200–1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiveroverload

dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Specifications of Optical Module on the WDM SideTable 11-129 and Table 11-130 list the specifications of optical module on the WDM side ofthe LWC1.

Table 11-129 Specifications of fixed wavelength optical module on the WDM side of the LWC1

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-130 Specifications of tunable wavelength optical module on the WDM side of theLWC1

Parameters Unit Specification

Channel spacing GHz 50

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Parameters Unit Specification

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 21.5 W

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l Maximum power consumption at 55°C (131°F): 23.6 W

11.5.27 LWF Board SpecificationsLWF board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-131 and Table 11-132 list the optical specifications on the client side of the LWF.

Table 11-131 Specifications of optical module on the client side of the LWF

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

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Parameters Unit Specifications

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-132 Specifications of optical module on the client side of the LWF (10GE)

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

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Parameters Unit Specifications

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM SideTable 11-133 and Table 11-134 list the optical specifications on the WDM side of the LWF.

Table 11-133 Specifications of fixed wavelength optical module on the WDM side of the LWF

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

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Parameter Unit Specification

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-134 Specifications of tunable wavelength optical module on the WDM side of theLWF

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

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Parameter Unit Specification

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight:– E2LWF: 1.6 kg (3.5 lb.)

– E3LWF: 1.4 kg (3.1 lb.)

– E4LWF: 1.2 kg (2.6 lb.)

– E5LWF: 1.6 kg (3.5 lb.)

– E6LWF/E7LWF: 0.95 kg (2.1lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):

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– E2LWF: 32.9 W

– E3LWF: 27.1 W

– E4LWF: 43.7 W

– E5LWF: 38.0 W

– E6LWF: 22.0 W

– E7LWF: 22.0 W

l Maximum power consumption at 55°C (131°F):

– E2LWF: 36.2 W

– E3LWF: 29.8 W

– E4LWF: 48.1 W

– E5LWF: 38.0 W

– E6LWF: 26.0 W

– E7LWF: 26.0 W

11.5.28 LWFS Board SpecificationsLWFS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-135 and Table 11-136 list the specifications of optical module on the client side ofthe LWFS.

Table 11-135 Specifications of optical module on the client side of the LWFS

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

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Parameters Unit Specifications

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-136 Specifications of optical module on the client side of the LWFS (10GE)

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Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM SideTable 11-137 and Table 11-138 list the optical specifications on the WDM side of the LWFS.

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Table 11-137 Specifications of fixed wavelength optical module on the WDM side of the LWFS

Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

Maximum reflectance dB -27 -27

Table 11-138 Specifications of tunable wavelength optical module on the WDM side of theLWFS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

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Parameters Unit Specification

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

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345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight:

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 26.0 W

l Maximum power consumption at 55°C (131°F): 28.6 W

11.5.29 LWM Board SpecificationsLWM board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-139 lists the specifications of optical module on the client side of the LWM.

Table 11-139 Specifications of optical module on the client side of the LWM

Parameters Unit Specifications

OpticalInterfacetype

- - I-16 S-16.1 L-16.2

Line codeformat

- - NRZ NRZ NRZ

Opticalsource type

- MLM MLM SLM SLM

Targetdistance

0.5 km (0.3mi.)

2 km (1.2mi.)

15 km (9 mi.) 80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 770–860 1266–1360 1260–1360 1500–1580

Maximummeanlaunchedpower

dBm –2.5 –3 0 +3

Minimummeanlaunchedpower

dBm –9.5 –10 –5 –2

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Parameters Unit Specifications

Minimumextinctionratio

dB +9 +8.2 +8.2 +8.2

Maximum –20 dBspectrumwidth

nm NA NA 1 1

Minimumside-modesuppressionratio

dB NA NA 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye patternmask

- Compliant with G.957

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN APD

Operatingwavelengthrange

nm 770–860 1200–1650 1200–1650 1200–1650

Receiversensitivity

dBm –17 –18 –18 –28

Receiveroverload

dBm 0 –3 0 –9

Maximumreflectance

dB NA –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-140 and Table 11-141 list the optical specifications on the WDM side of the LWM.

Table 11-140 Specifications of fixed wavelength optical module on the WDM side of the LWM

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-141 Specifications of tunable wavelength optical module on the WDM side of theLWM

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

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Parameters Unit Specification

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.9 kg (2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 32.0 W

l Maximum power consumption at 55°C (131°F): 35.5 W

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11.5.30 LWMR Board SpecificationsLWMR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-142 and Table 11-143 list the specifications of optical module on the WDM side ofthe LWMR.

Table 11-142 Specifications of fixed wavelength optical module on the WDM side of theLWMR

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-143 Specifications of tunable wavelength optical module on the WDM side of theLWMR

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

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The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 43.0

l Maximum power consumption at 55°C (131°F): 47.5

11.5.31 LWX Board SpecificationsLWX board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-144 lists the specifications of optical module on the client side of the LWX.

Table 11-144 Specifications of optical module on the client side of the LWX

Parameters Unit Specifications

Optical interface rate - I-16 S-16.1 L-16.2 1000BASE-SX

Line code format - NRZ NRZ NRZ 8B/10B

Optical source type - MLM SLM SLM -

Target distance 2 km (1.2mi.)

15 km (9 mi.) 80 km (50mi.)

0.5 km (0.3mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266–1360 1260–1360 1500–1580 770–860

Maximum meanlaunched power

dBm –3 0 +3 –2.5

Minimum meanlaunched power

dBm –10 –5 –2 –9.5

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Parameters Unit Specifications

Minimum extinctionratio

dB +8.2 +8.2 +8.2 +9

Maximum –20 dBspectrum width

nm NA 1 1 NA

Minimum side-modesuppression ratio

dB NA 30 30 NA

Dispersion tolerance ps/nm

NA NA 1600 NA

Eye pattern mask - Compliantwith G.957

Compliantwith G.957

Compliantwith G.957

IEEE802.3z-compliant

Receiver parameter specifications at point R

Receiver type - PIN PIN APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650 1200–1650 770–860

Receiver sensitivity dBm –18 –18 –28 –17

Receiver overload dBm –3 0 –9 0

Maximumreflectance

dB –27 –27 –27 NA

Remark - This module can compatibly access 2.5 Gbit/s or services at a lower rate such as theSTM-16/OC-48, FC200, FC100, STM-4/OC-12, ESCON, STM-1/OC-3, DVB-ASIand FE services.

Thismodule cancompatiblyaccessFC100 andFC200services.

Specifications of Optical Module on the WDM Side

Table 11-145 and Table 11-146 list the specifications of optical module on the WDM side ofthe LWX.

Table 11-145 Specifications of fixed wavelength optical module on the WDM side of the LWX

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-146 Specifications of tunable wavelength optical module on the WDM side of theLWX

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

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Parameters Unit Specification

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.9 kg (2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 32.0 W

l Maximum power consumption at 55°C (131°F): 35.5 W

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11.5.32 LWXR Board SpecificationsLWXR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-147 and Table 11-148 list the specifications of optical module on the WDM side ofthe LWXR.

Table 11-147 Specifications of fixed wavelength optical module on the WDM side of the LWXR

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-148 Specifications of tunable wavelength optical module on the WDM side of theLWXR

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

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The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 43.0

l Maximum power consumption at 55°C (131°F): 47.5

11.5.33 TMR Board SpecificationsTMR board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM SideTable 11-149 and Table 11-150 list the specifications of optical module on the WDM side ofthe TMR.

Table 11-149 Specifications of fixed wavelength optical module on the WDM side of the TMR

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

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Parameter Unit Specification

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-150 Specifications of tunable wavelength optical module on the WDM side of theTMR

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

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Parameter Unit Specification

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.85 kg (1.9 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 19.5 W

l Maximum power consumption at 55°C (131°F): 21.5 W

11.5.34 TMRS Board SpecificationsTMRS board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-151 and Table 11-152 list the specifications of optical module on the WDM side ofthe TMRS.

Table 11-151 Specifications of fixed wavelength optical module on the WDM side of the TMRS

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Parameter Unit Specification

Channel spacing GHz 100 100

Line code format - RZ RZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm -5 -5

Minimum extinction ratio dB 12 12

Nominal central frequency THz 192.10 - 196.00 192.15 - 196.05

Central frequency deviation GHz ±10 ±10

Maximum -20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 500 500

Eye pattern mask - NA NA

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operating wavelength range nm 1200 - 1650 1200 - 1650

Receiver sensitivity dBm -16 -16

Receiver overload dBm 0 0

Maximum reflectance dB -27 -27

Table 11-152 Specifications of tunable wavelength optical module on the WDM side of theTMRS

Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

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Parameters Unit Specification

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.85 kg (1.9 lb.)

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Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 23.5 W

l Maximum power consumption at 55°C (131°F): 25.5 W

11.5.35 TMX Board SpecificationsTMX board specifications include specifications of optical module on the client and WDM sides,laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-153 lists the specifications of optical module on the client side of the TMX.

Table 11-153 Specifications of optical module on the client side of the TMX

Parameters Unit Specifications

Optical interfacetype

- I-16 S-16.1 L-16.1 L-16.2

Line code format - NRZ NRZ NRZ NRZ

Optical source type - MLM SLM SLM SLM

Target distance – 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266 – 1360 1260 – 1360 1280 – 1335 1500 – 1580

Maximum meanlaunched power

dBm –3 0 +3 +3

Minimum meanlaunched power

dBm –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +8.2 +8.2 +8.2

Maximum –20 dBspectrum width

nm NA 1 1 1

Minimum SMSR dB NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye pattern mask - Compliant with G.957

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Parameters Unit Specifications

Receiver parameter specifications at point R

Receiver type - PIN PIN APD APD

Operatingwavelength range

nm 1200 – 1650 1200 – 1650 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiver overload dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-154 and Table 11-155 list the specifications of optical module on the WDM side ofthe TMX.

Table 11-154 Specifications of fixed wavelength optical module on the WDM side of the TMX

Parameter Unit Specification

Channel spacing GHz 50 100

Line code format – NRZ NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0 0

Minimum mean launchedpower

dBm –5 –5

Minimum extinction ratio dB +10 +10

Nominal central frequency THz 191.30 – 196.05186.95 – 190.90

191.30 – 196.00,191.35 – 196.05187.00 – 190.90

Central frequency deviation GHz ±5 ±10

Maximum –20 dB spectralwidth

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximum dispersion ps/nm 800 800

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Parameter Unit Specification

Eye pattern mask – Compliant with G.691

Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN PIN

Operating wavelength range nm 1200 – 1650 1200 – 1650

Receiver sensitivity dBm –16 –16

Receiver overload dBm 0 0

Maximum reflectance dB –27 –27

Table 11-155 Specifications of tunable wavelength optical module on the WDM side of theTMX

Parameter Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launchedpower

dBm 0

Minimum mean launchedpower

dBm –5

Minimum extinction ratio dB +10

Nominal central frequency THz 191.30 – 196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectralwidth

nm 0.3

Minimum SMSR dB 35

Maximum dispersion ps/nm 800

Eye pattern mask – Compliant with G.691

Receiver parameter specifications at point R

Receiver type – PIN

Operating wavelength range nm 1200 – 1650

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Parameter Unit Specification

Receiver sensitivity dBm –16

Receiver overload dBm 0

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.2 kg (2.6 lb)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 24.7 W

l Maximum power consumption at 55°C (131°F): 27.2 W

11.5.36 TMXS Board SpecificationsTMXS board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client SideTable 11-156 lists the specifications of optical module on the client side of the TMXS.

Table 11-156 Specifications of optical module on the client side of the TMXS

Parameters Unit Specifications

Optical interfacetype

- I-16 S-16.1 L-16.1 L-16.2

Line code format - NRZ NRZ NRZ NRZ

Optical source type - MLM SLM SLM SLM

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Parameters Unit Specifications

Target distance – 2 km (1.2mi.)

15 km (9 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelength range

nm 1266 – 1360 1260 – 1360 1280 – 1335 1500 – 1580

Maximum meanlaunched power

dBm –3 0 +3 +3

Minimum meanlaunched power

dBm –10 –5 –2 –2

Minimumextinction ratio

dB +8.2 +8.2 +8.2 +8.2

Maximum –20 dBspectrum width

nm NA 1 1 1

Minimum SMSR dB NA 30 30 30

Dispersiontolerance

ps/nm NA NA NA 1600

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point R

Receiver type - PIN PIN APD APD

Operatingwavelength range

nm 1200 – 1650 1200 – 1650 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –18 –18 –27 –28

Receiver overload dBm –3 0 –9 –9

Maximumreflectance

dB –27 –27 –27 –27

Specifications of Optical Module on the WDM SideTable 11-157 lists the specifications of optical module on the WDM side of the TMXS.

Table 11-157 Specifications of tunable wavelength optical module on the WDM side of theTMXS

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Parameters Unit Specification

Channel spacing GHz 50 25

Line code format – DRZ DRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimumextinction ratio

dB +13 +13

Central frequency THz 191.30 – 196.05 191.30 – 196.075

Central frequencydeviation

GHz ±3 ±2.5

Maximum –20dBspectral width

nm 0.3 0.3

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 1000 1000

Eye pattern mask – NA NA

Receiver parameter specifications at point Rn

Receiver type – PIN PIN

Operatingwavelength range

nm 1200 – 1650 1200 – 1650

Receiversensitivity

dBm –16 –16

Receiver overload dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.5 kg (3.3 lb)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 34.5 W

l Maximum power consumption at 55°C (131°F): 37.9 W

11.5.37 TMX40 Board SpecificationsTMX40 board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-158, Table 11-159 and Table 11-160 list the specifications of optical module on theclient side of the TMX40.

Table 11-158 Specifications of optical module on the client side of the TMX40 (SDH/10GE-WAN)

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

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Parameters Unit Specifications

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-159 Specifications of optical module on the client side of the TMX40 (OTU2)

Parameters Unit Specification

Optical interface type – P1I1-2D1 P1S1-2D2b P1L1-2D2

Line code format – NRZ NRZ NRZ

Optical source type – SLM SLM SLM

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Parameters Unit Specification

Target distance – 2 km (1.2 mi.) 40 km (25 mi.) 80 km (50 mi.)

Transmitter parameter specifications at point S

Operating wavelengthrange

nm 1290 – 1330 1530 – 1565 1530 – 1565

Maximum meanlaunched power

dBm –1 +2 +4

Minimum meanlaunched power

dBm –6 –1 0

Minimum extinctionratio

dB 6 8.2 9

Maximum –20 dBspectral width

nm 1 0.3 0.3

Minimum SMSR dB 30 30 30

Eye pattern mask – Compliant with G.959.1

Receiver parameter specifications at point R

Receiver type – PIN PIN APD

Receiver sensitivity dBm –11 –14 –24

Receiver overload dBm –1 –1 –7

Maximum reflectance dB –27 –27 –27

Table 11-160 Specifications of optical module on the client side of the TMX40 (10GE-LAN)

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

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Parameters Unit Specifications

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-161 lists the specifications of optical module on the WDM side of the TMX40.

Table 11-161 Specifications of tunable wavelength optical module on the WDM side of theTMX40

Parameters Unit Specifications

Line code format - ODB DRZ

Channel spacing GHz 50 100

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Parameters Unit Specifications

Transmitter parameter specifications at point S

Maximum meanlaunched power

dBm 0 0

Minimum meanlaunched power

dBm –5 –5

Minimum extinctionratio

dB 8.0 8.0

Nominal Centralfrequency

THz 192.10–196.05 192.10–196.00

Central frequencydeviation

GHz ±2.5 ±5

Maximum -20dBspectral width

nm 0.6 0.95

Minimum SMSR dB 35 35

Maximumdispersion

ps/nm 500 400

Receiver parameter specifications at point R

Receiver type - PIN PIN

Operatingwavelength range

nm 1529–1567 1529–1567

Receiver sensitivity(with FEC open)EOL

dBm –16 –16

Receiver overload(with FEC open)

dBm 0 0

Maximumreflectance

dB –27 –27

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 4.75 kg (10.45 lb)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 85 W

l Maximum power consumption at 55°C (131°F): 93.5 W

11.5.38 TMX40S Board SpecificationsTMX40S board specifications include specifications of optical module on the client and WDMsides, laser safety level, mechanical specifications and power consumption.

Specifications of Optical Module on the Client Side

Table 11-162, Table 11-163 and Table 11-164 list the specifications of optical module on theclient side of the TMX40S.

Table 11-162 Specifications of optical module on the client side of the TMX40S (SDH/10GE-WAN)

Parameters Unit Specifications

Opticalinterfacetype

- I-64.1 - S-64.2b L64.2

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- SLM SLM SLM SLM

Targetdistance

2 km (1.2mi.)

10 km (6 mi.) 40 km (25mi.)

80km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 1290–1330 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1 –1 +2 +4

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Parameters Unit Specifications

Minimummeanlaunchedpower

dBm –6 –6 –1 0

Minimumextinctionratio

dB 6 6 +8.2 +10

Maximum-20 dBspectrumwidth

nm 1 1 0.3 0.3

Minimumside-modesuppressionratio(SMSR)

dB 30 30 30 30

Eye patternmask

NA Compliant with G.691

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Operatingwavelengthrange

nm 1200–1650 1200–1650 1200–1650 1200-1650

Receiversensitivity

dBm –11 –11 –14 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –27 –27 –27 –27

Table 11-163 Specifications of optical module on the client side of the TMX40S (OTU2)

Parameters Unit Specification

Optical interface type – P1I1-2D1 P1S1-2D2b P1L1-2D2

Line code format – NRZ NRZ NRZ

Optical source type – SLM SLM SLM

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Parameters Unit Specification

Target distance – 2 km (1.2 mi.) 40 km (25 mi.) 80 km (50 mi.)

Transmitter parameter specifications at point S

Operating wavelengthrange

nm 1290 – 1330 1530 – 1565 1530 – 1565

Maximum meanlaunched power

dBm –1 +2 +4

Minimum meanlaunched power

dBm –6 –1 0

Minimum extinctionratio

dB 6 8.2 9

Maximum –20 dBspectral width

nm 1 0.3 0.3

Minimum SMSR dB 30 30 30

Eye pattern mask – Compliant with G.959.1

Receiver parameter specifications at point R

Receiver type – PIN PIN APD

Receiver sensitivity dBm –11 –14 –24

Receiver overload dBm –1 –1 –7

Maximum reflectance dB –27 –27 –27

Table 11-164 Specifications of optical module on the client side of the TMX40S (10GE-LAN)

Parameters Unit Specifications

OpticalInterfacetype

- 10G Base -SR

10G Base -LR

10G Base -ER

10G Base -ER

Opticalinterface bitrate

Gbit/s 10.3125 10.3125 10.3125 10.3125

Line codeformat

- NRZ NRZ NRZ NRZ

Opticalsource type

- MLM SLM SLM SLM

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Parameters Unit Specifications

Targetdistance

0.5 km (0.3mi.)

10 km (6 mi.) 40 km (25mi.)

80 km (50mi.)

Transmitter parameter specifications at point S

Operatingwavelengthrange

nm 840-860 1290–1330 1530–1565 1530–1565

Maximummeanlaunchedpower

dBm –1.3 –1 +2 +4

Minimummeanlaunchedpower

dBm –7.3 –6 –4.7 0

Minimumextinctionratio

dB +3 +6 +8.2 +10

Receiver parameter specifications at point R

Receivertype

- PIN PIN PIN PIN

Receiversensitivity

dBm –7.5 –14.4 –15.8 –24

Receiveroverload

dBm –1 –1 –1 –7

Maximumreflectance

dB –12 –27 –27 –27

Specifications of Optical Module on the WDM Side

Table 11-165 lists the specifications of optical module on the WDM side of the TMX40S.

Table 11-165 Specifications of tunable wavelength optical module on the WDM side of theTMX40S

Parameter Unit Specification

Channel spacing GHz 50

Line code format - DQPSK

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Parameter Unit Specification

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum power dBm -5

Minimum extinction ratio dB NA

Nominal central frequency THz 192.10 - 196.05

Central frequency deviation GHz ±2.5

Maximum –20 dB spectral width nm NA

Minimum SMSR dB 35

Maximum dispersion ps/nm 500

Eye pattern mask - NA

Receiver parameter specifications at point R

Receiver type - PIN

Operating wavelength range nm 1529 - 1567

Receiver sensitivity dBm -16

Receiver overload dBm 0

Maximum reflectance dB -27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 4.75 kg (10.45 lb)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 85 W

l Maximum power consumption at 55°C (131°F): 93.5 W

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11.5.39 TRC1 Board SpecificationsTRC1 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-166 and Table 11-167 list the specifications of optical module of fixed wavelengthoptical module on the WDM side of the TRC1.

Table 11-166 Specifications of fixed wavelength optical module on the WDM side of the TRC1

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-167 Specifications of tunable wavelength optical module on the WDM side of theTRC1

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

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The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 21.5 W

l Maximum power consumption at 55°C (131°F): 23.0 W

11.5.40 TRC2 Board SpecificationsTRC2 board specifications include specifications of optical module on the WDM side, lasersafety level, mechanical specifications and power consumption.

Specifications of Optical Module on the WDM Side

Table 11-168 and Table 11-169 list the specifications of optical module of fixed wavelengthoptical module on the WDM side of the TRC2.

Table 11-168 Specifications of fixed wavelength optical module on the WDM side of the TRC2

Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Channel spacing GHz 100

Line code format - NRZ

Transmitter parameter specifications at point Sn

Maximum meanlaunched power

dBm 0

Minimum meanlaunched power

dBm –10

Minimum extinctionratio

dB +10

Central frequency THz 191.30–196.00 192.10–196.00

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Parameters Unit

Specifications

12800 ps/nm-APD 12800 ps/nm-PIN

Central frequencydeviation

GHz ±10

Maximum –20dBspectral width

nm 0.2

Minimum SMSR dB 35

Maximumdispersion

ps/nm 12800

Eye pattern mask - Compliant with G.957

Receiver parameter specifications at point Rn

Receiver type - APD PIN

Operatingwavelength range

nm 1200–1650 1200–1650

Receiver sensitivity dBm –28 –18

Receiver overload dBm –9 0

Maximumreflectance

dB –27 –27

Table 11-169 Specifications of tunable wavelength optical module on the WDM side of theTRC2

Parameters Unit Specification

Channel spacing GHz 50

Line code format – NRZ

Transmitter parameter specifications at point S

Maximum mean launched power dBm 0

Minimum mean launched power dBm –10

Minimum extinction ratio dB +10

Central frequency THz 192.10–196.05

Central frequency deviation GHz ±5

Maximum –20 dB spectral width nm 0.2

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Parameters Unit Specification

Minimum SMSR dB 35

Maximum dispersion ps/nm 12800

Eye pattern mask – Compliant with G.957

Receiver parameter specifications at point R

Receiver type – APD

Operating wavelength range nm 1200 – 1650

Receiver sensitivity dBm –26

Receiver overload dBm –9

Maximum reflectance dB –27

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weigh: 1.0 kg (2.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 21.5 W

l Maximum power consumption at 55°C (131°F): 23.6 W

11.5.41 Jitter Transfer CharacteristicsSpecifications include jitter transfer characteristics specifications of OTU.

The OTU has the jitter transfer characteristics. Its jitter transfer function should be under thecurve. See Figure 11-1. For its specifications, refer to Table 11-170.

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Table 11-170 Jitter transfer characteristics specifications

STM Level fc(k Hz) P(dB)

STM-1(A) 130 0.1

STM-4(A) 500 0.1

STM-16(A)/OTU1 2000 0.1

STM-64(A)/OTU2 1000 0.1

STM-256(A)/OTU3 FFSa FFS

a: Currently, no standard is produced to support the jitter transfer characteristics specificationsof the STM-256/OTU3.

Figure 11-1 Jitter transfer characteristics

11.5.42 Input Jitter ToleranceSpecifications include input jitter tolerance specifications of OTU.

The OTU is able to tolerate the input jitter pattern that is shown in Figure 11-2. The specificationsare given in Table 11-171.

Table 11-171 Input jitter tolerance specifications

STM Level f0(kHz) f1(kHz) A1(UIp-p) A2(UIp-p)

STM-1(A) 6.5 65 0.15 1.5

STM-4(A) 25 250 0.15 1.5

STM-16(A)/OTU1

100 1000 0.15 1.5

STM-64(A)/OTU2

400 4000 0.15 1.5

STM-256(A)/OTU3

FFSa FFS FFS FFS

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STM Level f0(kHz) f1(kHz) A1(UIp-p) A2(UIp-p)

a: Currently, no standard is produced to support the input jitter tolerance specifications of theSTM-256/OTU3.

Figure 11-2 Input jitter tolerance

11.5.43 Output JitterSpecifications include output jitter specifications of OTU.

The specifications of OTU output jitter are given in Table 11-172.

Table 11-172 Output jitter specifications

STM Level

Interface Measurement BandPeak-PeakAmplitude (UI)High-Pass (KHz) Low-Pass (MHz)

STM-1 0.5 1.3 0.3

65 1.3 0.1

STM-4 1 5 0.3

250 5 0.1

STM-16/OTU1 5 20 0.3

1000 20 0.1

STM-64/OTU2 20 80 0.3

4000 80 0.1

STM-256/OTU3 FFSa FFS FFS

16000 320 0.10

a: no standard is produced to support the output jitter specifications of the STM-256/OTU3.

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11.6 Optical Multiplexer and Demultiplexer BoardSpecifications

The specifications of optical multiplexers and demultiplexers include the optical specifications,mechanical specifications, and power consumption of the M40/M48/V40/V48 and D48/D40boards.

The parameter specifications of the optical multiplexer M40/V40/V48/M48 and thedemultiplexer D40/D48 provided by Huawei comply with ITU-T G.671, ITU-T G.692 andrelated recommendations.

11.6.1 D40 Board SpecificationsD40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.2 D48 Board SpecificationsD48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.3 FIU Board SpecificationsFIU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.4 ITL Board SpecificationsITL board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.5 M40 Board SpecificationsM40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.6 M48 Board SpecificationsM48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.7 V40 Board SpecificationsV40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.8 V48 Board SpecificationsV48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.6.1 D40 Board SpecificationsD40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-173 lists the optical specifications the D40.

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Table 11-173 Optical interface parameter specifications of the D40

Parameter Unit Specification

Channel spacing GHz 100

Insertion loss dB < 8

Reflectance dB < -40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1560.61

Isolation (adjacent channels) dB > 25

Isolation (non-adjacent channels) dB > 25

Polarization dependent loss (PDL) dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertion lossdifference

dB < 3

–1 dB spectral width nm > 0.2

–20 dB spectral width nm < 1.4

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.6 kg (3.5 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 20.0 W

l Maximum power consumption at 55°C (131°F): 22.0 W

11.6.2 D48 Board SpecificationsD48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

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Optical SpecificationsTable 11-174 lists the optical specifications the D48.

Table 11-174 Optical interface parameter specifications of the D48

Parameters Unit Specifications

Channel spacing GHz 100

Insertion loss dB < 8

Reflectance dB < -40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1567.13

Isolation (adjacent channels) dB > 25

Isolation (non-adjacentchannels)

dB > 25

Polarization dependent loss(PDL)

dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertionloss difference

dB < 3

–1dB spectral width nm > 0.2

–20dB spectral width nm < 1.4

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.3 kg (2.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 24.2 W

l Maximum power consumption at 55°C (131°F): 26.6 W

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11.6.3 FIU Board SpecificationsFIU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-175 list the optical specifications the FIU.

Table 11-175 Optical interface parameter specifications of the FIU-03/06 (C+1510)

Parameters Unit Specifications

Operating wavelength range(Comply with ITU-T Grid)

nm C band: 1528.96 to 1567.13 / 1529.16 to1560.61 a

Supervisory channel in C band: 1500 to1520

Insertion loss dB IN to TC (@ λC): ≤ 1.0

RC to OUT (@ λC): ≤ 1.0

IN to TM (@λM): < 1.5 b

RM to OUT (@λM): < 1.5

Isolation dB IN to TM (@ λC): > 40 c

IN to TC (@ λM): > 12

Return loss dB > 40

Directivity dB > 55

Polarization dependent loss (PDL) dB < 0.2

a: The value before "/" is for the FIU03; the value after "/" is for the FIU06.b: @λM, indicates the measured value of the 1510-nm optical supervisory signals.c: @λC, indicates the measured value of the C-band optical signals.

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

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l Weight: 0.9 kg (2.0 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 2.1 W

l Maximum power consumption at 55°C (131°F): 2.5 W

11.6.4 ITL Board SpecificationsITL board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-176, Table 11-177, Table 11-178 and Table 11-179 list the optical specifications theE3ITL01, E3ITL02, E3ITL03 and E3ITL05.

Table 11-176 Optical interface parameter specifications of the E3ITL01

Parameters Unit Specifications

Operating wavelength range nm C band: 1528.96 to 1567.13

Input channel spacing a GHz 100

Output channel spacing a GHz 50

Insertion loss dB < 2.5

Maximum channel insertion lossdifference

dB < 1

Isolation dB > 25

Return loss dB > 45

Directivity dB > 45

Polarization mode dispersion(PMD)

ps < 0.5

Polarization dependent loss (PDL) dB < 0.5

Input optical power range dBm ≤ 26

a: Input and output are defined according to the multiplexing process of the ITL.

Table 11-177 Optical interface parameter specifications of the E3ITL02

Parameters Unit Specifications

Operating wavelength range nm C band: 1528.96 to 1567.13

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Parameters Unit Specifications

Input channel spacing a GHz 100

Output channel spacing a GHz 50

Insertion loss dB < 2.5

Maximum channel insertion lossdifference

dB < 1

Isolation dB > 22

Return loss dB > 40

Directivity dB > 45

Polarization mode dispersion(PMD)

ps < 0.5

Polarization dependent loss (PDL) dB < 0.5

Input optical power range dBm ≤ 26

a: Input and output are defined according to the multiplexing process of the ITL.

Table 11-178 Optical interface parameter specifications of the E3ITL03

Parameters Unit Specifications

Operating wavelength range nm C band: 1528.96 to 1567.13

Input channel spacing a GHz 50

Output channel spacing a GHz 25

Insertion loss dB < 3.5

Maximum channel insertion lossdifference

dB < 1

Isolation dB > 20

Return loss dB > 40

Directivity dB > 45

Polarization mode dispersion(PMD)

ps < 0.5

Polarization dependent loss (PDL) dB < 0.5

Input optical power range dBm ≤26

a: Input and output are defined according to the multiplexing process of the ITL.

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Table 11-179 Optical interface parameter specifications of the E3ITL05

Parameters Unit Specifications

Operating wavelength range nm C band: 1528.96 to 1567.13

Input channel spacing a GHz 100

Output channel spacing a GHz 50

Insertion loss RE-OUTRO-OUT

dB < 4

IN-TEIN-TO dB < 2.5

Maximumchannelinsertion lossdifference

RE/RO-OUT dB < 1

IN-TE/TO dB < 1

Isolation IN-TEIN-TO dB > 25

Return loss dB > 45

Directivity dB > 45

Polarization mode dispersion(PMD)

ps < 0.5

Polarization dependent loss (PDL) dB < 0.5

Input optical power range dBm ≤ 26

a: Input and output are defined according to the multiplexing process of the ITL.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 8.0 W

l Maximum power consumption at 55°C (131°F): 8.8 W

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11.6.5 M40 Board SpecificationsM40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-180 lists the optical specifications the M40.

Table 11-180 Optical interface parameter specifications of the M40

Parameters Unit Specifications

Channel spacing GHz 100

Insertion loss dB < 8

Reflectance dB < –40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1560.61

Isolation (adjacent channels) dB > 22

Isolation (non-adjacent channels) dB > 25

Polarization dependent loss (PDL) dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertion lossdifference

dB < 3

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.6 kg (3.5 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 20.0 W

l Maximum power consumption at 55°C (131°F): 22.0 W

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11.6.6 M48 Board SpecificationsM48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-181 lists the optical specifications the M48.

Table 11-181 Optical interface parameter specifications of the M48

Parameters Unit Specifications

Channel spacing GHz 100

Insertion loss dB < 8

Reflectance dB < -40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1567.13

Isolation (adjacent channels) dB > 22

Isolation (non-adjacentchannels)

dB > 25

Polarization dependent loss(PDL)

dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertionloss difference

dB < 3

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.3 kg (2.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 24.2 W

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l Maximum power consumption at 55°C (131°F): 26.6 W

11.6.7 V40 Board SpecificationsV40 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-182 lists the optical specifications the V40.

Table 11-182 Optical interface parameter specifications of the V40

Parameters Unit Specifications

Channel spacing GHz 100

Insertion loss dB < 8 a

Reflectance dB < - 40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1560.61

Attenuation range dB 0 to 15

Isolation (adjacent channels) dB > 22

Isolation (non-adjacentchannels)

dB > 25

Polarization dependent loss(PDL)

dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertionloss difference

dB < 3

a: Tested value when the attenuation of the VOA is set to 0 dB. Before delivery, the VOAvalue of each channel in the V40 is set as 3 dB. Thus, the value of insertion loss may be 11dB in testing.

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

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345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)l Weight: 2.2 kg (4.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 46.0 W

l Maximum power consumption at 55°C (131°F): 50.6 W

11.6.8 V48 Board SpecificationsV48 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-183 lists the optical specifications the V48.

Table 11-183 Optical interface parameter specifications of the V48

Parameters Unit Specifications

Channel spacing GHz 100

Insertion loss dB < 8 a

Reflectance dB < -40

Operating wavelength range(Comply with ITU-T Grid)

nm 1528.96 to 1567.13

Attenuation range dB 0 to 15

Isolation (adjacent channels) dB > 22

Isolation (non-adjacentchannels)

dB > 25

Polarization dependent loss(PDL)

dB < 0.5

Temperature characteristics pm/°C < 2

Maximum channel insertionloss difference

dB < 3

a: Tested value when the attenuation of the VOA is set to 0 dB. Before delivery, the VOAvalue of each channel in the V48 is set as 3 dB. Thus, the value of insertion loss may be 11dB in testing.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

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The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 2.2 kg (4.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 46.0 W

l Maximum power consumption at 55°C (131°F): 50.6 W

11.7 Optical Add and Drop Multiplexing BoardSpecifications

The specifications of optical add/drop multiplexing boards include the optical specifications,mechanical specifications, and power consumption of the MR2 board, DWC/EDWC boards,and RMU9/WDM9/WSD9/WDM5/WSD5/WSMD4 boards.

11.7.1 DWC Board SpecificationsDWC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.2 EDWC Board SpecificationsEDWC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.3 MR2 Board SpecificationsMR2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.4 MR8 Board SpecificationsMR8 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.5 RMU9 Board SpecificationsRMU9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.6 WSD5 Board SpecificationsWSD5 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.7 WSD9 Board SpecificationsWSD9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.8 WSM5 Board Specifications

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WSM5 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.9 WSM9 Board SpecificationsWSM9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.10 WSMD4 Board SpecificationsWSMD4 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.11 WSMD2 Board SpecificationsWSMD2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.7.1 DWC Board SpecificationsDWC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-184 and Table 11-185 lists the optical specifications the DWC.

Table 11-184 Optical interface parameter specifications of the E1DWC

Parameters Unit Specifications

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.53 to 1560.61

Operating wavelength number - 40

Attenuation range dB 0 to 15

Insertion loss IN-DROP dB ≤ 8.0

IN-MO a dB ≤ 12.0

MI-OUT dB ≤ 4.0

ADD-OUT dB ≤ 4.0

Insertion loss uniformity dB 1.0

–0.5 dB bandwidth(Passbandwidth)

GHz > 50

Block extinction ratio dB > 35

PMD ps < 0.5

PDL dB < 0.7

Return loss dB > 40

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Parameters Unit Specifications

Maximum input optical power dBm 25

Module response time ms < 50

a: This is the insertion loss when the build-in VOA is set to 0.

Table 11-185 Optical interface parameter specifications of the E2DWC

Parameters Unit Specifications

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.53 to 1567.13

Operating wavelength number - 48

Attenuation range dB 0 to 15

Insertionloss

IN-DROP dB ≤ 8.0

IN-MOa dB ≤ 12.0

MI-OUT dB ≤ 4.0

ADD-OUT dB ≤ 4.0

Insertion loss uniformity dB 1.0

–0.5 dB bandwidth(Passbandwidth)

GHz > 50

Block extinction ratio dB > 35

PMD ps < 0.5

PDL dB < 0.7

Return loss dB > 40

Maximum input optical power dBm 25

Maximum input optical power(perchannel)

dBm 17

Module response time ms < 50

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

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Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 0.9 kg (2.0 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 16.0 W

l Maximum power consumption at 55°C (131°F): 17.6 W

11.7.2 EDWC Board SpecificationsEDWC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-186 lists the optical specifications the EDWC.

Table 11-186 Optical interface parameter specifications of the EDWC

Parameters Unit Indices

Channel spacing GHz 50

Operatingwavelength range(Comply with ITU-TGrid)

nm 1529.16 to 1567.13

Operatingwavelength number

- 96

Attenuation range dB 0 - 15

Insertion loss IN-DROP dB ≤ 8.0

IN-MO a dB ≤ 12.0

MI-OUT dB ≤ 4.0

ADD-OUT dB ≤ 4.0

Insertion lossuniformity

dB 1.0

–0.5 dB bandwidth(Pass bandwidth)

GHz > 22

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Parameters Unit Indices

Block extinctionratio

dB > 35

PMD ps < 0.5

PDL dB < 0.7

Return loss dB > 35

Maximum inputoptical power

dBm 25

Module responsetime

ms < 50

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weight: 3.8 kg (8.3 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 23.7 W

l Maximum power consumption at 55°C (131°F): 26.1 W

11.7.3 MR2 Board SpecificationsMR2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-187 lists the optical specifications the MR2.

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Table 11-187 Optical interface parameter specifications of the MR2

Parameters Unit Specifications

Channel spacing GHz 100

Central wavelength nm Comply with ITU-T Grid

Operating wavelength range nm C band: 1529.53 to 1560.61

–1 dB spectral width nm > 0.2

Insertion loss of Add/Dropchannels

dB < 2

IN-MOMI-OUT

Insertion loss dB ≤ 1.0

Isolation dB > 13

Isolation of Add/Drop adjacentchannels

dB > 25

Return loss dB ≥ 40

Polarization dependent loss (PDL) dB < 0.2

Polarization mode dispersion(PMD)

ps ≤ 0.15

Maximum input power dBm 24

Working temperature – –5°C to +55°C (23°F to 131°F)

Temperature characteristics pm/°C < 2

Insertion variation withtemperature

dB/°C < 0.006

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power Consumption

The power consumption of the board is as follows:

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l Maximum power consumption at 25°C (77°F): 2.1 W

l Maximum power consumption at 55°C (131°F): 2.5 W

11.7.4 MR8 Board SpecificationsMR8 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-188 lists the optical specifications of the MR8.

Table 11-188 Optical specifications of the MR8

Item Unit Value

Adjacent channel spacing GHz 100

Central wavelength nm Comply with ITU-T Grid

Operating wavelength range nm 1529-1561

IN-D1IN-D2IN-D3IN-D4IN-D5IN-D6IN-D7IN-D8

0.5 dB spectral width nm ≥±0.11

Drop channel insertion loss dB ≤4

Adjacent channel isolation dB >25

Non-adjacent channel isolation dB >35

A1-OUTA2-OUTA3-OUTA4-OUTA5-OUTA6-OUTA7-OUTA8-OUT

0.5 dB spectral width nm ≥±0.11

Add channel insertion loss dB ≤4

IN-MOMI-OUT

Insertion loss dB ≤3.5

Isolation dB >13

Optical return loss dB >40

Rules of Adding/Dropping WavelengthThe MR8 adds/drops and multiplexes eight signals to/from the multiplexed signals. There arefive groups of wavelengths:

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Table 11-189 Rules of adding/dropping wavelength of the MR8

Group Wavelength (nm)

A1/D1 A2/D2 A3/D3 A4/D4 A5/D5 A6/D6 A7/D7 A8/D8

1 1560.61

1559.79

1558.98

1558.17

1557.36

1556.55

1555.75

1554.94

2 1554.13

1553.33

1552.52

1551.72

1550.92

1550.12

1549.32

1548.51

3 1547.72

1546.92

1546.12

1545.32

1544.53

1543.73

1542.94

1542.14

4 1541.35

1540.56

1539.77

1538.98

1538.19

1537.40

1536.61

1535.82

5 1535.04

1534.25

1533.47

1532.68

1531.90

1531.12

1530.33

1529.55

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 2.20 lb (1.0 kg)

Power Consumptionl The maximum power consumption at 25℃: 2.1 W

l The maximum power consumption at 55℃: 2.5 W

11.7.5 RMU9 Board SpecificationsRMU9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-190 lists the optical specifications the RMU9.

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Table 11-190 Optical interface parameter specifications of the RMU9

Parameters Unit Specifications

Insertion loss EXPI-OUT dB < 8.5

AMx a-TOA dB < 12.5 b

ROA-OUT dB < 1.5

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.53 to 1560.61

Optical return loss dB > 40

Attenuation range dB 0 to 15

Polarization dependence loss dB < 0.5

Attenuation accuracy dB < 1

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.1 kg (2.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 7.2 W

l Maximum power consumption at 55°C (131°F): 7.9 W

11.7.6 WSD5 Board SpecificationsWSD5 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-191 and Table 11-192 list the optical specifications the WSD5.

Table 11-191 Optical interface parameter specifications of the E1WSD5

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Parameters Unit Specifications

Channel spacing GHz 50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 80

Channel attenuation range dB 0 to 15

Insertion loss a dB < 8.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Table 11-192 Optical interface parameter specifications of the E2WSD5

Parameters Unit Specifications

Channel spacing GHz 50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 80

Channel attenuation range dB 0 to 15

Insertion loss a dB < 9.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

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Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight:– E1WSD5: 4.6kg (10.1 lb)

– E2WSD5: 2.7kg (5.9 lb)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):– E1WSD5: 13.4 W

– E2WSD5: 23.2 W

l Maximum power consumption at 55°C (131°F):– E1WSD5: 14.7 W

– E2WSD5: 25.5 W

11.7.7 WSD9 Board SpecificationsWSD9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-193 and Table 11-194 list the optical specifications the WSD9.

Table 11-193 Optical interface parameter specifications of the E1WSD9

Parameters Unit Specifications

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529 to 1561

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion loss a dB < 8.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

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Table 11-194 Optical interface parameter specifications of the E2WSD9

Parameters Unit Specifications

Channel spacing GHz 100/50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529 to 1561

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion loss a dB < 9.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 2.8 kg (6.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):– E1WSD9: 12.4 W

– E2WSD9: 23.2 W

l Maximum power consumption at 55°C (131°F):– E1WSD9: 13.6 W

– E2WSD9: 25.5 W

11.7.8 WSM5 Board SpecificationsWSM5 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

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Optical Specifications

Table 11-195 and Table 11-196 list the optical specifications the WSM5.

Table 11-195 Optical interface parameter specifications of the E1WSM5

Parameters Unit Specifications

Channel spacing GHz 50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 80

Channel attenuation range dB 0 to 15

Insertion loss a dB < 8.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Table 11-196 Optical interface parameter specifications of the E2WSM5

Parameters Unit Specifications

Channel spacing GHz 50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 80

Channel attenuation range dB 0 to 15

Insertion loss a dB < 9.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

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Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight:– E1WSM5: 4.6kg (10.1 lb)

– E2WSM5: 2.7kg (5.9 lb)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):– E1WSM5: 13.4 W

– E2WSM5: 23.2 W

l Maximum power consumption at 55°C (131°F):– E1WSM5: 14.7 W

– E2WSM5: 25.5 W

11.7.9 WSM9 Board SpecificationsWSM9 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-197 and Table 11-198 list the optical specifications the WSM9.

Table 11-197 Optical interface parameter specifications of the E1WSM9

Parameters Unit Specifications

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529 to 1561

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion lossa dB < 8.0

Insertion loss uniformity dB 1.5

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Parameters Unit Specifications

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Table 11-198 Optical interface parameter specifications of the E2WSM9C9WSM9

Parameters Unit Specifications

Channel spacing GHz 100/50

Operating wavelength range(Comply with ITU-T Grid)

nm 1529 to 1561

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion loss a dB < 9.0

Insertion loss uniformity dB 1.5

Return loss dB > 35

Maximum input optical power dBm 24

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 2.8 kg (6.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):

– E1WSM9: 12.4 W

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– E2WSM9: 23.2 W

l Maximum power consumption at 55°C (131°F):– E1WSM9: 13.6 W

– E2WSM9: 25.5 W

11.7.10 WSMD4 Board SpecificationsWSMD4 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-199 lists the optical specifications the WSMD4.

Table 11-199 Optical interface parameter specifications of the WSMD4

Parameters Unit Indices

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion loss AMxa-OUT dB ≤ 8b

IN-DMxa dB ≤ 8

Insertion loss uniformity dB 1.0

Return loss dB > 35

Maximum input optical power dBm 23

a: AMx represents the AM1–AM4 interface. DMx represents the DM1–DM4 interface.b: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

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l Weight: 2.7 kg (6.0 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 11.7 W

l Maximum power consumption at 55°C (131°F): 12.9 W

11.7.11 WSMD2 Board SpecificationsWSMD2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-200 lists the optical specifications the WSMD2.

Table 11-200 Optical interface parameter specifications of the WSMD2

Parameters Unit Indices

Channel spacing GHz 100

Operating wavelength range(Comply with ITU-T Grid)

nm 1529.16 to 1560.61

Operating wavelength number - 40

Channel attenuation range dB 0 to 15

Insertion loss AM-OUTEXPI-OUT

dB ≤ 7 a

IN-DMIN-EXPO

dB ≤ 4

Insertion loss uniformity dB 1.0

Return loss dB > 35

Maximum input optical power dBm 23

a: This is the insertion loss when the build-in VOA is set to 0.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0kg (2.2lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 15.0 W

l Maximum power consumption at 55°C (131°F): 16.5 W

11.8 Optical Amplifier Board SpecificationsThe specifications of optical amplifier boards include the optical specifications, mechanicalspecifications, and power consumption of the HBA/OAU/OBU/OPU/RPA/RPC boards.

11.8.1 HBA Board SpecificationsHBA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.2 OAU Board SpecificationsOAU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.3 OBU Board SpecificationsOBU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.4 OPU Board SpecificationsOPU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.5 RPA Board SpecificationsRPA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.6 RPC Board SpecificationsRPC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.8.1 HBA Board SpecificationsHBA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-201 and Table 11-202 list the optical specifications of the HBA.

Table 11-201 Optical specifications of the HBA01

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Item Unit Performance parameters

Operating wavelength range nm 192.10 - 196.05 THz

Total input power range dBm -19 to -3

Noise figure (NF) dB < 8.0

Output reflectance dB < -45

Output power range dBm 10 - 26

Gain response time to add/drop the channel ms < 10

Channel gain dB 29

Gain flatness dB ≤ 2.5

Polarization dependent loss (PDL) dB < 0.5

Polarization mode dispersion (PMD) ps < 0.5

Table 11-202 Optical specifications of the HBA02

Item Unit Performance parameters

Operating wavelength range nm 192.10 - 194.00 THz

Total input power range dBm -19 to -9

Noise figure (NF) dB < 8.0

Output reflectance dB < -45

Output power range dBm 16 to 26

Gain response time to add/drop the channel ms < 10

Channel gain dB 35

Gain flatness dB ≤ 2.5

Polarization dependent loss (PDL) dB < 0.5

Polarization mode dispersion (PMD) ps < 0.5

Laser Safety LevelThe laser safety level of the optical interface is CLASS 3B.

The maximum output optical power of each optical interface ranges from 21.3 dBm to 27 dBm.

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Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 2.6 kg (5.7 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 24.0 W

l Maximum power consumption at 55°C (131°F): 26.4 W

11.8.2 OAU Board SpecificationsOAU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-203, Table 11-204, Table 11-205, Table 11-206, Table 11-207, Table 11-208, Table11-209, Table 11-210, and Table 11-211 list the optical specifications of the OAU.

Table 11-203 Optical specifications of the E2OAU01 for L-band

Item Unit Performance parameter

Nominal gain - 23 dB 28 dB 33 dB

Operating wavelength range nm 1570.42 -1603.57

1570.42 -1603.57

1570.42 -1603.57

Total input power range dBm -32 to -3 -32 to -8 -32 to -13

Singlechannelinputpowerrange

40 channels dBm -32 to -19 -32 to -24 -32 to -29

80 channels dBm -32 to -22 -32 to -27 -32

Noisefigure (NF)

PA dB < 5.5 < 5.5 < 5.5

BA dB < 6 < 6 < 6

Input reflectance dB < -40 < -40 < -40

Output reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

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Item Unit Performance parameter

Maximum reflectance tolerableat input end

dB -27 -27 -27

Maximum reflectance tolerableat output end

dB -27 -27 -27

Maximum total output power dBm 20 20 20

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Channel gain dB 21 - 26 26 - 31 31 - 36

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

Table 11-204 Optical specifications of the E5OAUC00

Item Unit Performance parameter

Nominal gain - 16 dB 22 dB 25.5 dB

Operating wavelength range nm 1529.16 -1560.61

1529.16 -1560.61

1529.16 -1560.61

Total input power range dBm -20 to 2 -26 to -4 -32 to -7.5

Singlechannelinputpowerrange

40 channels dBm -32 to -14 -32 to -20 -32 to -23.5

80 channels dBm -32 to -17 -32 to -23 -32 to -26.5

160 channels dBm -32 to -20 -32 to -26 -32 to -29.5

Noise figure (NF) a dB < 8 < 5.5 < 5.5

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectance tolerableat input end

dB -27 -27 -27

Maximum reflectance tolerableat output end

dB -27 -27 -27

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Item Unit Performance parameter

Maximum total output power dBm 18 18 18

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 14.5 - 17.5 20.5 - 23.5 24 - 27

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E5OAUC00 amplifier, the total gain is 27.5 dB. The internal insertion loss rangesfrom 2 dB to 11.5 dB, and thus the gain varies from 16 dB to 25.5 dB.

Table 11-205 Optical specifications of the E5OAUC01

Item Unit Performance parameter

Nominal gain - 20 dB 26 dB 31 dB

Operating wavelength range nm 1529.16 -1560.61

1529.16 -1560.61

1529.16 -1560.61

Total input power range dBm -32 to 0 -32 to -6 -32 to -11

Singlechannelinputpowerrange

40 channels dBm -32 to -16 -32 to -22 -32 to -27

80 channels dBm -32 to -19 -32 to -25 -32 to -30

160 channels dBm -32 to -22 -32 to -28 -32

Noise figure (NF) a dB < 9 < 7 < 6

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectance tolerableat input end

dB -27 -27 -27

Maximum reflectance tolerableat output end

dB -27 -27 -27

Maximum total output power dBm 20 20 20

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 20 - 23 23 - 29 29 - 31

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E5OAUC01 amplifier, the total gain is 33 dB. The internal insertion loss rangesfrom 2 dB to 13 dB. Thus, the gain varies from 20 dB to 31 dB.

Table 11-206 Optical specifications of the E5OAUC03

Item Unit Performance parameter

Nominal gain - 24 dB 29 dB 36 dB

Operating wavelength range nm 1529.16 -1560.61

1529.16 -1560.61

1529.16 -1560.61

Total input power range dBm -32 to -4 -32 to -9 -32 to -16

Singlechannelinputpowerrange

40 channels dBm -32 to -20 -32 to -25 -32

80 channels dBm -32 to -23 -32 to -28 -32

160 channels dBm -32 to -26 -32 to -31 -32

Noise figure (NF) a dB < 7.0 < 6.0 < 6.0

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectance tolerableat input end

dB -27 -27 -27

Maximum reflectance tolerableat output end

dB -27 -27 -27

Maximum total output power dBm 20 20 20

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 24 - 28 28 - 30 30 - 36

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E5OAUC03 amplifier, the total gain is 38 dB. The internal insertion loss rangesfrom 2 dB to 14 dB. Thus, the gain varies from 24 dB to 36 dB.

Table 11-207 Optical specifications of the E5OAUC05

Item Unit Performance parameter

Nominal gain - 23 dB 30 dB 34 dB

Operating wavelength range nm 1529.16 -1560.61

1529.16 -1560.61

1529.16 -1560.61

Total input power range dBm -32 to 0 -32 to -7 -32 to -11

Singlechannelinputpowerrange

40 channels dBm -32 to -16 -32 to -23 -32 to -27

80 channels dBm -32 to -19 -32 to -26 -32 to -30

160 channels dBm -32 to -22 -32 to -29 -32

Noise figure (NF) a dB < 9 < 7 < 6

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectance tolerableat input end

dB -27 -27 -27

Maximum reflectance tolerableat output end

dB -27 -27 -27

Maximum total output power dBm 23 23 23

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 23 - 26 26 - 33 33 - 34

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E5OAUC05 amplifier, the total gain is 36 dB. The internal insertion loss rangesfrom 2 dB to 13 dB. Thus, the gain varies from 23 dB to 34 dB.

Table 11-208 Optical specifications of the E4OAUC00

Item Unit Performance parameter

Nominal gain - 16 dB 22 dB 25.5 dB

Operating wavelength range nm 1528.96 -1567.13

1528.96 -1567.13

1528.96 -1567.13

Total input power range dBm -20 to +2.8 -26 to -3.2 -32 to -6.7

Singlechannelinputpowerrange

48 channels dBm -32 to -14 -32 to -20 -32 to -23.5

96 channels dBm -32 to -17 -32 to -23 -32 to -26.5

192 channels dBm -32 to -20 -32 to -26 -32 to -29.5

Noise figure (NF) a dB < 8.5 < 6 < 6

Output reflectance dB < -40 < -40 <-40

Input reflectance dB < -40 <-40 <-40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectancetolerable at input end

dB -27 -27 -27

Maximum reflectancetolerable at output end

dB -27 -27 -27

Maximum total output power dBm 18.8 18.8 18.8

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 14.5 - 17.5 20.5 - 23.5 24 - 27

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E4OAUC00 amplifier, the total gain is 27.5 dB. The internal insertion loss rangesfrom 2 dB to 11.5 dB. Thus, the gain varies from 16 dB to 25.5 dB.

Table 11-209 Optical specifications of the E4OAUC01

Item Unit Performance parameter

Nominal gain - 20 dB 26 dB 31 dB

Operating wavelength range nm 1528.96 -1567.13

1528.96 -1567.13

1528.96 -1567.13

Total input power range dBm -32 to +0.8 -32 to -5.2 -32 to -10.2

Singlechannelinputpowerrange

48 channels dBm -32 to -16 -32 to -22 -32 to -27

96 channels dBm -32 to -19 -32 to -25 -32 to -30

192 channels dBm -32 to -22 -32 to -28 -32

Noise figure (NF) a dB < 9 < 7 < 6

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectancetolerable at input end

dB -27 -27 -27

Maximum reflectancetolerable at output end

dB -27 -27 -27

Maximum total output power dBm 20.8 20.8 20.8

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 20 - 23 23 - 29 29 - 31

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E4OAUC01 amplifier, the total gain is 33 dB. The internal insertion loss rangesfrom 2 dB to 13 dB. Thus, the gain varies from 20 dB to 31 dB.

Table 11-210 Optical specifications of the E4OAUC03

Item Unit Performance parameter

Nominal gain - 24 dB 29 dB 36 dB

Operating wavelength range nm 1528.96 -1567.13

1528.96 -1567.13

1528.96 -1567.13

Total input power range dBm -32 to -3.2 -32 to -8.2 -32 to -15.2

Singlechannelinputpowerrange

48 channels dBm -32 to -20 -32 to -25 -32

96 channels dBm -32 to -23 -32 to -28 -32

192 channels dBm -32 to -26 -32 to -31 -32

Noise figure (NF) a dB < 7.5 < 6.5 < 6

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectancetolerable at input end

dB -27 -27 -27

Maximum reflectancetolerable at output end

dB -27 -27 -27

Maximum total output power dBm 20.8 20.8 20.8

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 24 - 28 28 - 30 30 - 36

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E4OAUC03 amplifier, the total gain is 38 dB. The internal insertion loss rangesfrom 2 dB to 14 dB. Thus, the gain varies from 24 dB to 36 dB.

Table 11-211 Optical specifications of the E4OAUC05

Item Unit Performance parameter

Nominal gain - 23dB 30dB 34dB

Operating wavelength range nm 1528.96 -1567.13

1528.96 -1567.13

1528.96 -1567.13

Total input power range dBm -32 to +0.8 -32 to -6.2 -32 to -10.2

Singlechannelinputpowerrange

48 channels dBm -32 to -16 -32 to -23 -32 to -27

96 channels dBm -32 to -19 -32 to -26 -32 to -30

192 channels dBm -32 to -22 -32 to -29 -

Noise figure (NF)a dB < 8.5 < 7 < 6

Output reflectance dB < -40 < -40 < -40

Input reflectance dB < -40 < -40 < -40

Pump leakage at input end dBm < -30 < -30 < -30

Maximum reflectancetolerable at input end

dB -27 -27 -27

Maximum reflectancetolerable at output end

dB -27 -27 -27

Maximum total output power dBm 23.8 23.8 23.8

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Item Unit Performance parameter

Gain response time to add/dropthe channel

ms < 10 < 10 < 10

Maximum channel gain b dB 23 - 26 26 - 33 33 - 34

Gain flatness dB ≤ 2 ≤ 2 ≤ 2

Multi-channel gain tilt dB/dB ≤ 2 ≤ 2 ≤ 2

Polarization dependent loss(PDL)

dB ≤ 0.5 ≤ 0.5 ≤ 0.5

a: The value for noise figure is varying with the gain which can be tunable. Only the typicalvalue is given here.b: As for the E4OAUC05 amplifier, the total gain is 36 dB. The internal insertion loss rangesfrom 2 dB to 13 dB. Thus, the gain varies from 23 dB to 34 dB.

Laser Safety Levell E5OAUC05 and E4OAUC05

The laser safety level of the optical interface is CLASS 3B.The maximum output optical power of each optical interface ranges from 21.3 dBm to 27dBm.

l Other OAU boardsThe laser safety level of the optical interface is CLASS 1M.The maximum output optical power of each optical interface ranges from 10 dBm to 21.3dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 2.4 kg (5.3 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):– E2OAU: 42.0 W

– E4OAU: 30.0 W

– E5OAU: 40.0 W

l Maximum power consumption at 55°C (131°F):– E2OAU: 70.0 W

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– E4OAU: 50.0 W

– E5OAU: 44.0 W

11.8.3 OBU Board SpecificationsOBU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-212, Table 11-213, Table 11-214,Table 11-215 and Table 11-216 list the opticalspecifications of the OBU.

Table 11-212 Optical specifications of the E2OBU04 for L-band

Item Unit Performance parameter

Operating wavelength range nm 1570.42 - 1603.57

Total input power dBm -22 to -3

Single channel input powerrange

40 channels dBm -22 to -19

80 channels dBm -22

Noise figure (NF) dB < 6

Input reflectance dB < -40

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 20

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range 21 - 26

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB ≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

Table 11-213 Optical specifications of the E5OBUC03

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Item Unit Performance parameter

Operating wavelength range nm 1529.16 - 1560.61

Total input power dBm -24 to -3

Single channelinput powerrange

40 channels dBm -24 to -19

80 channels dBm -24 to -22

160 channels dBm -24

Noise figure (NF) dB < 6

Input reflectance dB < -40

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 20

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB

≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

Table 11-214 Optical specifications of the E5OBUC05

Item Unit Performance parameter

Operating wavelength range nm 1529.16 - 1560.61

Total input power dBm -24 to 0

Single channelinput powerrange

40 channels dBm -24 to -16

80 channels dBm -24 to -19

160 channels dBm -24 to -22

Noise figure (NF) dB < 7

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Item Unit Performance parameter

Input reflectance dB < -40

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 23

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB

≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

Table 11-215 Optical specifications of the E4OBUC03

Item Unit Performance parameter

Operating wavelength range nm 1528.96 - 1567.13

Total input power dBm -24 to -2.2

Single channelinput powerrange

48 channels dBm -24 to -19

96 channels dBm -24 to -22

192 channels dBm -24

Noise figure (NF) dB < 6

Input reflectance dB < -40

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 20.8

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Item Unit Performance parameter

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB

≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

Table 11-216 Optical specifications of the E4OBUC05

Item Unit Performance parameter

Operating wavelength range nm 1528.96 - 1567.13

Total input power dBm -24 to 0.8

Single channelinput powerrange

48 channels dBm -24 to -16

96 channels dBm -24 to -19

192 channels dBm -24 to -22

Noise figure (NF) dB < 7

Input reflectance dB < -40

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 23.8

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB

≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

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Laser Safety Levell E5OBUC05 and E4OBUC05

The laser safety level of the optical interface is CLASS 3B.The maximum output optical power of each optical interface ranges from 21.3 dBm to 27dBm.

l Other OBU boardsThe laser safety level of the optical interface is CLASS 1M.The maximum output optical power of each optical interface ranges from 10 dBm to 21.3dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 2.2 kg (4.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F):– E2OBU: 35.0 W

– E4OBU: 23.0 W

– E5OBU: 20.0 W

l Maximum power consumption at 55°C (131°F):– E2OBU: 50.0 W

– E4OBU: 30.0 W

– E5OBU: 22.0 W

11.8.4 OPU Board SpecificationsOPU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-217 and Table 11-218 list the optical specifications of the OPU.

Table 11-217 Optical specifications of the E5OPU

Item Unit Performance parameter

Operating wavelength range nm 1529.16 - 1560.61

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Item Unit Performance parameter

Total input power dBm -32 to -8

Single channelinput power range

40 channels dBm -32 to -24

80 channels dBm -32 to -27

160 channels dBm -32 to -30

Noise figure (NF) dB < 5.5

Input reflectance dB <-40

Output reflectance dB <-40

Pump leakage at input end dBm <-30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 15

Gain response time to add/drop the channel ms <10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤2

Multi-channel gain tilt dB/dB

≤2

Polarization dependent loss (PDL) dB ≤0.5

Table 11-218 Optical specifications of the E4OPU

Item Unit Performance parameter

Operating wavelength range nm 1528.96 - 1567.13

Total input power dBm -32 to -7.2

Single channelinput power range

48 channels dBm -32 to -24

96 channels dBm -32 to -27

192 channels dBm -32 to -30

Noise figure (NF) dB < 5.5

Input reflectance dB < -40

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Item Unit Performance parameter

Output reflectance dB < -40

Pump leakage at input end dBm < -30

Maximum reflectance tolerable at input end dB -27

Maximum reflectance tolerable at output end dB -27

Maximum total output power dBm 15.8

Gain response time to add/drop the channel ms < 10

Channel gain dB 23

Channel gain range dB 21 - 25

Gain flatness dB ≤ 2

Multi-channel gain tilt dB/dB

≤ 2

Polarization dependent loss (PDL) dB ≤ 0.5

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 2.0 kg (4.4 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 20.0 W

l Maximum power consumption at 55°C (131°F): 22.0 W

11.8.5 RPA Board SpecificationsRPA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-219 lists the optical specifications of the RPA.

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Table 11-219 Optical specifications of the RPA

Item Unit Performance parameter

Pump wavelength range nm 1400 - 1500

Maximum pump power dBm 30

Channel gain on G.652 fiber a dB > 10

Channel gain on LEAF fiber a dB > 10

Channel gain on TW RS fiber a dB > 10

Channel gain on G.653 fiber a dB NA

Effective noise figure on G.652 fiber dB ≤ 1

Effective noise figure on LEAF fiber dB ≤ 0.5

Effective noise figure on TW RS fiber c dB ≤ 0

Effective noise figure on G.653 fiber dB NA

Polarization dependent loss (PDL) dB ≤ 0.5

Temperature characteristic nm/°C ≤ 1

Output connector type - LSH / APC

a: This gain refers to on-off gain, that is, the power difference between RPA ON and RPAOFF.

Laser Safety Level

The laser safety level of the optical interface is CLASS 4.

The maximum output optical power of each optical interface is higher than 27 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 4.3 kg (9.5 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 90.0 W

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l Maximum power consumption at 55°C (131°F): 99.0 W

11.8.6 RPC Board SpecificationsRPC board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-220, Table 11-221, and Table 11-222 list the optical specifications of the RPC.

Table 11-220 Optical specifications of the E1RPC02

Item Unit Performance parameter

Pump wavelength range nm 1400 - 1500

Maximum pump power dBm 29

Channel gain on G.652 fiber a dB NA

Channel gain on LEAF fiber a dB NA

Channel gain on TW RS fiber a dB > 16

Channel gain on G.653 fiber a dB > 16

Effective noise figure on G.652 fiber dB NA

Effective noise figure on LEAF fiber dB NA

Effective noise figure on TW RS fiber dB NA

Effective noise figure on G.653 fiber dB NA

Polarization dependent loss (PDL) dB ≤ 0.5

Temperature characteristic nm/°C ≤ 1

Output connector type - LSH / APC

a: This gain refers to on-off gain, that is, the power difference between RPC ON and RPCOFF.

Table 11-221 Optical specifications of the E2RPC01

Item Unit Performance parameter

Pump wavelength range nm 1400 - 1500

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Item Unit Performance parameter

Maximum pump power dBm 29

Channel gain on G.652 fiber a dB > 10

Channel gain on LEAF fiber a dB > 12

Channel gain on TW RS fiber a dB > 13

Channel gain on G.653 fiber a dB NA

Effective noise figure on G.652 fiber dB ≤ 0

Effective noise figure on LEAF fiber dB ≤ - 1

Effective noise figure on TW RS fiber dB ≤ - 1.5

Effective noise figure on G.653 fiber dB NA

Polarization dependent loss (PDL) dB ≤ 0.5

Temperature characteristic nm/°C ≤ 1

Output connector type - LSH / APC

a: This gain refers to on-off gain, that is, the power difference between RPC ON and RPCOFF.

Table 11-222 Optical specifications of the E2RPC03

Item Unit Performance parameter

Pump wavelength range nm 1400 - 1500

Maximum pump power dBm 29.5

Channel gain on G.652 fiber a dB > 10

Channel gain on LEAF fiber a dB NA

Channel gain on TW RS fiber a dB NA

Channel gain on G.653 fiber a dB NA

Effective noise figure on G.652 fiber dB NA

Effective noise figure on LEAF fiber dB NA

Effective noise figure on TW RS fiber dB NA

Effective noise figure on G.653 fiber dB NA

Polarization dependent loss (PDL) dB ≤ 0.5

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Item Unit Performance parameter

Temperature characteristic nm/°C ≤ 1

Output connector type - LSH / APC

a: This gain refers to on-off gain, that is, the power difference between RPC ON and RPCOFF.

Laser Safety LevelThe laser safety level of the optical interface is CLASS 4.

The maximum output optical power of each optical interface is higher than 27 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weigh: 4.2 kg (9.3 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 70.0 W

l Maximum power consumption at 55°C (131°F): 77.0 W

11.9 System Control, Supervision and CommunicationBoard Specifications

The specifications of system control, supervision and communication boards include themechanical specifications and power consumption of the SCC and PMU boards.

11.9.1 SCC Board SpecificationsSCC board specifications include mechanical specifications and power consumption.

11.9.2 PMU Board SpecificationsPMU board specifications include optical specifications, mechanical specifications and powerconsumption.

11.9.1 SCC Board SpecificationsSCC board specifications include mechanical specifications and power consumption.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

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l Dimensions (Height × Width × Depth):345.0 mm × 24.0 mm × 218.5 mm (13.6 in. × 0.9 in. × 8.6 in.)

l Weight: 0.8 kg (1.8 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 10.5 W

l Maximum power consumption at 55°C (131°F): 11.5 W

11.9.2 PMU Board SpecificationsPMU board specifications include optical specifications, mechanical specifications and powerconsumption.

Optical SpecificationsThe PMU does not provide any optical interface.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 24.0 mm × 218.5 mm (13.6 in. × 0.9 in. × 8.6 in.)

l Weight: 2.2 kg (4.9 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 12.0 W

l Maximum power consumption at 55°C (131°F): 13.2 W

11.10 Optical Supervisory Channel and TimingTransmission Board Specifications

The specifications of optical supervisory channels and timing transmission boards include theoptical specifications, mechanical specifications, and power consumption of the SC1/SC2/ST1/ST2 boards.

11.10.1 SC1 Board SpecificationsSC1 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.10.2 SC2 Board SpecificationsSC2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.10.3 ST1 Board Specifications

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ST1 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.10.4 ST2 Board SpecificationsST2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.10.1 SC1 Board SpecificationsSC1 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-223 lists the optical specifications the SC1.

Table 11-223 Optical interface parameter specifications of the SC1

Parameters Unit Specifications

Normal power High power

Operating wavelengthrange

nm C band: 1500–1520 or Lband: 1615–1635

C band: 1500–1520

Signal rate Mbit/s 2.048 a 2.048 a

Line code format NA CMI CMI

Launched power dBm –7 to 0 5 to 10

Optical source type NA MLM LD MLM LD

Minimum receiversensitivity(BER=1x10-11)

dBm –48 –48

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.9 kg (2.1 lb.)

Power ConsumptionThe power consumption of the board is as follows:

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l Maximum power consumption at 25°C (77°F): 4.0 W

l Maximum power consumption at 55°C (131°F): 4.4 W

11.10.2 SC2 Board SpecificationsSC2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-224 lists the optical specifications the SC2.

Table 11-224 Optical interface parameter specifications of the SC2

Parameters Unit Specifications

Normal power High power

Operating wavelengthrange

nm C band: 1500–1520 or Lband: 1615–1635

C band: 1500–1520

Signal rate Mbit/s 2.048 a 2.048 a

Line code format NA CMI CMI

Launched power dBm –7 to 0 5 to 10

Optical source type NA MLM LD MLM LD

Minimum receiversensitivity(BER=1x10-11)

dBm –48 –48

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 7.0 W

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l Maximum power consumption at 55°C (131°F): 7.7 W

11.10.3 ST1 Board SpecificationsST1 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-225 lists the optical specifications of the ST1.

Table 11-225 Optical interface parameter specifications of the ST1

Parameters Specifications

Type Normal power

Operating wavelength range (nm) C band: 1500–1520 or L band: 1615–1635

Signal rate (Mbit/s) 8.448 a

Line code format CMI

Launched power (dBm) –7 to 0

Optical source type MLM LD

Minimum receiver sensitivity (dBm)(BER=1x10-11)

–48

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 28.5 W

l Maximum power consumption at 55°C (131°F): 31.4 W

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11.10.4 ST2 Board SpecificationsST2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-226 lists the optical specifications the ST2.

Table 11-226 Optical interface parameter specifications of the ST2

Parameters Specifications

Type Normal power

Operating wavelength range (nm) C band: 1500–1520 or L band: 1615–1635

Signal rate (Mbit/s) 8.448 a

Line code format CMI

Launched power (dBm) –7 to 0

Optical source type MLM LD

Minimum receiver sensitivity (dBm)(BER=1x10-11)

–48

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.2 kg (2.6 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 31.5 W

l Maximum power consumption at 55°C (131°F): 43.7 W

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11.11 Optical Protection Board SpecificationsThe specifications of protection boards include the optical specifications, mechanicalspecifications, and power consumption of the DCP/OLP/OCP/PBU/SCS boards.

11.11.1 DCP Board SpecificationsDCP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.11.2 OCP Board SpecificationsOCP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.11.3 OLP Board SpecificationsOLP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.11.4 PBU Board SpecificationsPBU board specifications include mechanical specifications and power consumption.

11.11.5 SCS Board SpecificationsSCS board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.11.1 DCP Board SpecificationsDCP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-227 lists the optical specifications of the DCP01.

Table 11-227 Optical interface parameter specifications of the DCP01 (single-mode)

Parameters Unit Specifications

Insertion loss at the transmit end(single-mode)

TI1–TO11,TI1–TO12,TI2–TO21,TI2–TO22

dB < 4

Insertion loss at the receive end (single-mode)

RI11–RO1,RI12–RO1,RI21–RO2,RI22–RO2

dB < 1.5

Range of the input optical power dBm –35 to 7

Alarm threshold of optical power difference dB 3

Switching threshold of optical power difference dB 5

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Table 11-228 lists the optical specifications the DCP02.

Table 11-228 Optical interface parameter specifications of the DCP02 (multi-mode)

Parameters Unit Specifications

Insertion loss at the transmit end (multi-mode)

TI1–TO11,TI1–TO12,TI2–TO21,TI2–TO22

dB < 4.5

Insertion loss at the receive end (multi-mode)

RI11–RO1,RI12–RO1,RI21–RO2,RI22–RO2

dB < 5.3

Range of the input optical power dBm –28 to 7

Alarm threshold of optical power difference dB 3

Switching threshold of optical power difference dB 5

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 6.0 W

l Maximum power consumption at 55°C (131°F): 6.6 W

11.11.2 OCP Board SpecificationsOCP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-229 lists the optical specifications the OCP.

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Table 11-229 Optical interface parameter specifications of the OCP

Parameters Unit Specifications

Range of wavelength nm 1290–13301530–1565

Insertion loss (working channel) dB < 4.0

Insertion loss (protection channel) dB < 5.5

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.7 kg (3.7 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 8.0 W

l Maximum power consumption at 55°C (131°F): 8.8 W

11.11.3 OLP Board SpecificationsOLP board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-230, Table 11-231 and Table 11-232 lists the optical specifications the OLP.

Table 11-230 Optical interface parameter specifications of the E2OLP01 (multi-mode)

Parameters Unit Specifications

Insertion loss at the transmitend (multi-mode)

TI-TO1TI-TO2

dB < 4.5

Insertion loss at the receiveend (multi-mode)

RI1-RORI2-RO

dB < 5.3

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Parameters Unit Specifications

Range of the input optical power dBm –28 to 7

Alarm threshold of optical power difference dB 3

Switching threshold of optical power difference dB 5

Table 11-231 Optical interface parameter specifications of the E2OLP02 (single-mode)

Parameters Unit Specifications

Insertion loss at the transmitend (single-mode)

TI–TO1TI–TO2

dB < 4

Insertion loss at the receiveend (single-mode)

RI1–RORI2–RO

dB < 1.5

Range of the input optical power dBm –35 to 7

Alarm threshold of optical power difference dB 3

Switching threshold of optical power difference dB 5

Table 11-232 Optical interface parameter specifications of the E2OLP03 (single-mode)

Parameters Unit Specifications

Insertion loss at the transmitend (single-mode)

TI–TO1TI–TO2

dB < 4.0

Insertion loss at the receiveend (single-mode)

RI1–RORI2–RO

dB < 1.5

Range of the input optical power dBm –30 to 23

Alarm threshold of optical power difference dB 3

Switching threshold of optical power difference dB 5

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

11 Technical Specifications

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.8 kg (1.8 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 6.0 W

l Maximum power consumption at 55°C (131°F): 6.6 W

11.11.4 PBU Board SpecificationsPBU board specifications include mechanical specifications and power consumption.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.0 kg (2.2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 145.0 W

l Maximum power consumption at 55°C (131°F): 160.0 W

11.11.5 SCS Board SpecificationsSCS board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-233 lists the optical specifications the E1SCS.

Table 11-233 Optical interface parameter specifications of the SCS

Parameters Unit Specifications

Single-mode insertion loss dB < 4.0

Multi-mode insertion loss dB < 4.5

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

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The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.7 kg (1.5 lb.)

Power Consumptionl Maximum power consumption at 25°C (77°F): 4.3 W

l Maximum power consumption at 55°C (131°F): 4.7 W

11.12 Spectrum Analyzer Board SpecificationsThe specifications of spectrum analyzer boards include the optical specifications, mechanicalspecifications, and power consumption of the MCA and WMU boards.

11.12.1 MCA Board SpecificationsMCA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.12.2 WMU Board SpecificationsWMU board specifications include optical specifications, mechanical specifications and powerconsumption.

11.12.1 MCA Board SpecificationsMCA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-234 and Table 11-235 lists the optical specifications of the MCA.

Table 11-234 Optical specifications of the E1MCA

Parameters Unit Specifications

Operating wavelength range nm C band: 1529 - 1561L band: 1570 - 1604

Detect range for single channeloptical power

dBm -10 to -30

Detect accuracy for optical power dBm ±1.5

OSNR accuracy (OSNR between 13dB and 19dB)

dB ±1.5

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Parameters Unit Specifications

OSNR accuracy (OSNR between 19dB and 23dB)

dB ±2.0

Detect accuracy for centralwavelength

nm ±0.1

Table 11-235 Optical specifications of the E2MCA

Parameters Unit Specifications

Operating wavelength range nm C band: 1529 - 1568

Detect range for single channeloptical power

dBm -10 to -35

Detect accuracy for optical power dBm ±1.5

OSNR accuracy (OSNR between 13dB and 19dB)

dB ±1.5

OSNR accuracy (OSNR between 19dB and 23dB)

dB ±2.0

Detect accuracy for centralwavelength

nm ±0.1

Laser Safety Level

The laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

l Weight: 1.7 kg (3.7 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 7.0 W

l Maximum power consumption at 55°C (131°F): 7.7 W

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11.12.2 WMU Board SpecificationsWMU board specifications include optical specifications, mechanical specifications and powerconsumption.

Optical SpecificationsTable 11-236 lists the optical specifications of the WMU.

Table 11-236 Optical specifications of the WMU

Parameters Unit Specifications

Operating wavelength range nm 1529.16 - 1567.13

Channel spacing - Supports the wavelength monitoringof the system with the wavelengthspacing of 50 GHz.

Detect accuracy for centralfrequency

GHz ±2.5

Single channel input power range dBm -14 to -28

Detect accuracy for single channeloptical power

dBm ±1.5

Detect range for single channelwavelength deviation

GHz ±10

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.8 kg (1.8 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 27.0 W

l Maximum power consumption at 55°C (131°F): 29.7 W

11.13 Variable Optical Attenuator Board SpecificationsThe specifications of variable optical attenuator boards include the optical specifications,mechanical specifications, and power consumption of the VA2/VA4/VOA boards.

11.13.1 VA2 Board Specifications

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VA2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.13.2 VA4 Board SpecificationsVA4 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.13.3 VOA Board SpecificationsVOA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.13.1 VA2 Board SpecificationsVA2 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-237 lists the optical specifications of the VA2.

Table 11-237 Optical interface parameter specifications of the VA2

Parameters Unit Specifications

Attenuation range dB 1.5 – 20

Adjustment accuracy dB 0.7 (attenuation ≤ 10 dB)1.0 (attenuation ≤ 15 dB)1.5 (attenuation ≤ 20 dB)

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.4 kg (3.1 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 9.0 W

l Maximum power consumption at 55°C (131°F): 9.9 W

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11.13.2 VA4 Board SpecificationsVA4 board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-238 lists the optical specifications of the VA4.

Table 11-238 Optical interface parameter specifications of the VA4

Parameters Unit Specifications

Attenuation range dB 1.5 - 20

Adjustment accuracy dB 0.7 (attenuation ≤ 10 dB)1.0 (attenuation ≤ 15 dB)1.5 (attenuation ≤ 20 dB)

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 1.5 kg (3.3 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 10.0 W

l Maximum power consumption at 55°C (131°F): 11.0 W

11.13.3 VOA Board SpecificationsVOA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-239 lists the optical specifications of the VOA.

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Table 11-239 Optical interface parameter specifications of the VOA

Parameters Unit Specifications

Attenuation range dB 1.5 - 20

Adjustment accuracy dB 0.7 (attenuation ≤ 10 dB)1.0 (attenuation ≤ 15 dB)1.5 (attenuation ≤ 20 dB)

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.8 kg (1.8 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 6.5 W

l Maximum power consumption at 55°C (131°F): 7.2 W

11.14 Optical Fiber Automatic Monitoring BoardSpecifications

The specifications of optical fiber automatic monitoring boards include the opticalspecifications, mechanical specifications, and power consumption of the FMU/MWA/MWFboards.

11.14.1 FMU Board SpecificationsFMU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.14.2 MWA Board SpecificationsMWA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.14.3 MWF Board SpecificationsMWF board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

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11.14.1 FMU Board SpecificationsFMU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-240 lists the optical specifications of the FMU.

Table 11-240 Optical specifications of the FMU

Item Unit Index

Online monitor Standby fiber monitor

Test wavelength nm 1310±25 1550±25

OTDR dynamic range dB 39.5 a 38.5 a

Event dead zone 10 m (33 ft.) b

Attenuation dead zone 30 m (98 ft.) c

Pulse width 10ns, 30ns, 100ns, 300ns,1μs, 3μs, 10μs, 20μs

10ns, 30ns, 100ns, 300ns,1μs, 3μs, 10μs, 20μs

Pulse output power dBm ≤20

Distance accuracy m ±1m (3.3 ft.) ±5 x 10-5 x test distance ± spacing betweenthe sample points (not including the group index error)

Readout resolution dB 0.001

Reflection measurementresolution

dB ±2.0

Linearity dB/dB ±0.05

Group index 1.400 to 1.700

Working temperature -5°C to +55°C (23°F to 131°F)

a: The loss incurred by online optical switch and the coupler is considered for the FMU. Thedynamic value is 1–2 dB smaller than the value of the OTDR component. Besides, the OTDReffective dynamic range in online monitor mode is different from that in standby fiber monitormode.

b: Test conditions: The pulse width of the test signal is 10ns, and the return loss is not more than–35 dB.

c: Test conditions: The pulse width of the test signal is 10ns, and the return loss is not more than–35 dB.

11 Technical Specifications

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 114.0 mm × 218.5 mm (13.6 in. × 4.5 in. × 8.6 in.)

l Weigh: 2.5 kg (5.5 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 25.0 W

l Maximum power consumption at 55°C (131°F): 27.5 W

11.14.2 MWA Board SpecificationsMWA board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-241 lists the optical specifications of the MWA.

Table 11-241 Optical specifications of the MWA

Item Unit Index

Wavelength range of the transmission channel nm 1500 to 1635

Wavelength range of the reflection channel nm 1280 to 1340

Insertion loss of the transmission channel(including that of the connector)

dB 1.2

Insertion loss of the reflection channel (includingthat of the connector)

dB 1.0

Flatness (whole operating wavelength range) dB 0.4

Isolation (transmission channel versus reflectionchannel)

dB ≥40

Isolation (reflection channel versus transmissionchannel)

dB ≥40

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Item Unit Index

Return loss dB ≥45

Polarization dependent loss dB ≤0.1

Polarization mode dispersion ps ≤0.1

Maximum input power dBm 27

Working temperature -5°C to +55°C (23°F to 131°F)

Laser Safety Level

The laser safety level of the optical interface is CLASS 3B.

The maximum output optical power of each optical interface ranges from 21.3 dBm to 27 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weigh: 0.8 kg (1.8 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 2.0 W

l Maximum power consumption at 55°C (131°F): 2.2 W

11.14.3 MWF Board SpecificationsMWF board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-242 lists the optical specifications of the MWF.

Table 11-242 Optical specifications of the MWF

Item Unit Index

Passband wavelength range nm 1500 to 1635

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Item Unit Index

Stopband wavelength range nm 1280 to 1340

Passband insertion loss (including that of theconnector)

dB 1.2

Stopband insertion loss (including that of theconnector)

dB 1.0

Flatness (whole operating wavelength range) dB 0.4

Isolation (passband versus stopband) dB ≥40

Return loss dB ≥40

Directivity dB ≥55

Polarization dependent loss dB ≤0.1

Polarization mode dispersion ps ≤0.1

Maximum input power dBm 27

Working temperature -5°C to +55°C (23°F to 131°F)

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1.

The maximum output optical power of each optical interface is lower than 10 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weigh: 0.8 kg (1.8 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 2.0 W

l Maximum power consumption at 55°C (131°F): 2.2 W

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11.15 Optical Power and Dispersion Slope Equalizing BoardSpecifications

The specifications of optical power and dispersion slope equalizing boards include the opticalspecifications, mechanical specifications, and power consumption of the DGE/DSE/GFUboards.

11.15.1 DGE Board SpecificationsDGE board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.15.2 DSE Board SpecificationsDSE board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.15.3 GFU Board SpecificationsGFU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

11.15.1 DGE Board SpecificationsDGE board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-243 lists the optical specifications of the DGE.

Table 11-243 Optical interface parameter specifications of the DGE

Parameters Unit Specifications

Operating wavelength range nm 1529–1561/1529–1567.13 a

Dynamic attenuation range dB 6–21

Fixed insertion loss dB < 6

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 76.0 mm × 218.5 mm (13.6 in. × 3.0 in. × 8.6 in.)

11 Technical Specifications

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l Weight: 2.4 kg (5.3 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 20.0 W

l Maximum power consumption at 55°C (131°F): 22.0 W

11.15.2 DSE Board SpecificationsDSE board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical SpecificationsTable 11-244, Table 11-245 and Table 11-246 list the optical specifications of the DSE.

Table 11-244 Optical specifications of the DSE01

Parameters Unit Specifications

Operating wavelengthrange

Band 1 (BA1–BD1) THz 196.00–194.10

Band 2 (BA2–BD2) THz 194.00–193.70

Band 3 (BA3–BD3) THz 193.60–192.10

Insertion loss dB 2.0

Maximum input optical power dBm 26

Table 11-245 Optical specifications of the DSE02

Parameters Unit Specifications

Operating wavelengthrange

Band 1 (BA1–BD1) THz 196.00–195.20

Band 2 (BA2–BD2) THz 195.10–192.80

Band 3 (BA3–BD3) THz 192.70–192.10

Band 4 (BA4–BD4) THz 192.00–191.70

Band 5 (BA5–BD5) THz 191.60–191.30

Insertion loss dB 2.5

Maximum input optical power dBm 26

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Table 11-246 Optical specifications of the DSE03

Parameters Unit Specifications

Operatingwavelength range

Band 1 (BA1–BD1) THz 196.00–195.20

Band 2 (BA2–BD2) THz 195.10–192.80

Band 3 (BA3–BD3) THz 192.70–192.10

Insertion loss dB 2.0

Maximum input optical power dBm 26

Laser Safety Level

The laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical Specifications

The mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):

345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.9 kg (2 lb.)

Power Consumption

The power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 4.3 W

l Maximum power consumption at 55°C (131°F): 4.8 W

11.15.3 GFU Board SpecificationsGFU board specifications include optical specifications, laser safety level, mechanicalspecifications and power consumption.

Optical Specifications

Table 11-247 and Table 11-248 lists the optical specifications of the GFU.

Table 11-247 Optical specifications of the GFU03 (used with Raman amplifier)

Parameters Unit Specifications

Operating wavelength range nm 1529–1561

Channel insertion loss dB 1.0–5.0

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Parameters Unit Specifications

Polarization dependent loss(PDL)

dB ≤ 0.5

Table 11-248 Optical specifications of the GFU04 (used with ROP amplifier)

Parameters Unit Specifications

Operating wavelength range nm 1529–1561

Channel insertion loss dB 0.5–6.0

Polarization dependent loss(PDL)

dB ≤ 0.5

Laser Safety LevelThe laser safety level of the optical interface is CLASS 1M.

The maximum output optical power of each optical interface ranges from 10 dBm to 21.3 dBm.

Mechanical SpecificationsThe mechanical specifications of the board are as follows:

l Dimensions (Height × Width × Depth):345.0 mm × 38.0 mm × 218.5 mm (13.6 in. × 1.5 in. × 8.6 in.)

l Weight: 0.9 kg (2 lb.)

Power ConsumptionThe power consumption of the board is as follows:

l Maximum power consumption at 25°C (77°F): 4.3 W

l Maximum power consumption at 55°C (131°F): 4.8 W

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A Equipment Specifications andEnvironment Requirements

Equipment specifications and environment requirements include: performance specificationsfor optical interfaces, power supply requirements, electromagnetic compatibility andenvironment requirement.

A.1 Performance Specifications for Optical InterfacesThe product complies with the related optical interface regulations.

A.2 Power Supply RequirementsThe power supply must meet certain requirements to ensure the normal operation of the product.

A.3 Electromagnetic Compatibility (EMC)The electromagnetic compatibility of the product complies with many standards.

A.4 Environment RequirementThe environment requirements consists of the following factors: storage environment, transportenvironment, and operation environment.

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A.1 Performance Specifications for Optical InterfacesThe product complies with the related optical interface regulations.

The product complies with the following specifications for optical interfaces:

The optical interfaces on the client end comply with ITU-T G.957 and G.691.

STM–64 optical interface: I-64.1, I–64.2, S–64.2b

STM–16 optical interface: I-16, S-16.1, L-16.2, L-16.1

STM–4 optical interface: S-4.1, L-4.2

GE: 1000 BASE-SX, 1000 BASE-LX-10 km, 1000 BASE-LX-40 km, 1000 BASE-ZX-80 km

10GE: 10G BASE-LR, 10G BASE-ER

ESCON, FC: ANSI X3.230, X3.296

Laser safety: In compliance with ITU-T Recommendation G.664

Fiber connector: LC/PC, SC/FC, FC/PC, LSH/APC

A.2 Power Supply RequirementsThe power supply must meet certain requirements to ensure the normal operation of the product.

DC input voltage:–48V DC/–60V DC

Voltage range: –38.4 V to –57.6 V DC or –48.0 V to –72.0 V DC

A.3 Electromagnetic Compatibility (EMC)The electromagnetic compatibility of the product complies with many standards.

Strictly followed international standards and EMC measures, the product is suitable for any kindsof networks and markets.

Electromagnetic Safety StandardsCSA C22.2 No. 950

UL 1950

EN 60950, Safety of Information Technology Equipment

EN 60825-1 Safety of Laser Products - Part 1: Equipment Classification, Requirements andUser's Guide

EN 60825-2 Safety of Laser Products - Part 2: Safety of Optical Fibre Communication Systems.

EMC StandardsETSI EN300 386 - 1.2.1 (2000) -

A Equipment Specifications and Environment Requirements

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CISPR55022 (1999) -

FCC PART 15 including: -

Radiation emission (RE): CISPR22, ETSI EN 300 127 (V1.2.1)

Conduction emission (CE): CISPR22, ETSI EN 300 386--1.2.1

Electric static discharge (ESD): IEC61000-4-2

Fast transient pulse string (EFT/B): IEC61000-4-4

Conductive susceptibility (CS): IEC61000-4-6

Radiation sensitivity (RS): IEC61000-4-3

Surge: IEC61000-4-5

Voltage drop (DIP): IEC61000-4-29 (DC)

Power induction (PI): ITU K.20

Power magnetic field sensitivity (PMS): IEC61000-4-8

These standards are applied for communication equipment production:

IEC 61000-4-6 (1996) -

IEC 61000-4-3 (1995) -

IEC 61000-4-2 (1995) -

IEC 61000-4-5 (1995) -

IEC 61000-4-8 (1993) -

IEC 61000-4-29 (2000) -

IEC 61000-4-4 (1995) -

IEC 61000-3-2 (1995) -

IEC 61000-3-3 (1995) -

ETSI EN 300 127 (V1.2.1) -

ITU k.20 -

A.4 Environment RequirementThe environment requirements consists of the following factors: storage environment, transportenvironment, and operation environment.

This environment requirement is set by referring to the following international standards:

l ETS 300 019-1-3: Class 3.2 Partly temperature-controlled locations

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l NEBS GR-63-CORE: Network Equipment-Building System (NEBS) Requirements:Physical Protection

A.4.1 Storage EnvironmentThe storage environment consists of the following factors: climate environment, waterproofrequirement, biologic environment, clarity of air, and mechanical stress.

A.4.2 Transport EnvironmentThe transport environment consists of the following factors: climate environment, waterproofrequirement, biologic environment, clarity of air, and mechanical stress.

A.4.3 Operation EnvironmentThe operation environment consists of the following factors: climate environment, biologicenvironment, clarity of air, mechanical stress, noise specification, and shockproof performance.

A.4.1 Storage EnvironmentThe storage environment consists of the following factors: climate environment, waterproofrequirement, biologic environment, clarity of air, and mechanical stress.

Climate Environment

Table A-1 Requirements for climate environment

Item Range

Altitude ≤4000 m (13123 ft.)

Air pressure 70 kPa to 106 kPa

Temperature -40°C (–40°F) to +70°C (+158°F)

Temperature change rate ≤1°C/min

Relative Humidity 5 % to 100 %

Solar radiation ≤1120 W/s2

Heat radiation ≤600 W/s2

Wind speed ≤20 m/s

Waterproof Requirementl Equipment storage requirements at the customer site: Generally the equipment is stored

indoors.

l Where there is no water on the floor and no water leakage on the packing boxes of theequipment. The equipment should not be stored in places where leakage is probable, suchas near the auto firefighting and heating facilities.

l If the equipment is required to be stored outdoors, the following four conditions should bemet at the same time:

– The packing boxes are intact.

A Equipment Specifications and Environment Requirements

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Product Description

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– Necessary rainproof measures should have been taken to prevent rainwater fromentering the packing boxes.

– There is no water on the ground where the packing boxes are stored, let alone waterentering into the packing boxes.

– The packing boxes are not directly exposed to the sun.

Biologic Environmentl Avoiding the reproduction of animalcule, such as epiphyte and mildew.

l Getting rid of rodent (such as mouse).

Clarity of Airl No explosive, conductive, magnetic conductive nor corrosive dust.

l The density of mechanical active substance complies with the requirements of Table A-2

l The density of chemical active substance complies with the requirements of Table A-3

Table A-2 Requirements for the density of mechanical active substance

Mechanical Active Substance Content

Suspending dust ≤5.00 mg/m3

Precipitable dust ≤20.0 mg/m2·h

Sand ≤300 mg/m3

Table A-3 Requirements for the density of chemical active substance

Chemical Active Substance Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCl ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

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Mechanical Stress

Table A-4 Requirements for mechanical stress

Item Subitem Range

Randomvibration

Accelerationspectrumdensity

- 0.02 m2/s3 -

Frequencyrange

5 Hz to 10 Hz 10 Hz to 50 Hz 50 Hz to 100 Hz

dB/oct +12 a - -12 b

a: Indicates that the acceleration spectrum density in each frequency range increases by 12dB.b: Indicates that the acceleration spectrum density in each frequency range decreases by 12dB.

A.4.2 Transport EnvironmentThe transport environment consists of the following factors: climate environment, waterproofrequirement, biologic environment, clarity of air, and mechanical stress.

Climate Environment

Table A-5 Requirements for climate environment

Item Range

Altitude ≤4000 m (13123 ft.)

Air pressure 70 kPa to 106 kPa

Temperature -40°C (-40°F) to +70°C (+158°F)

Temperature change rate ≤1°C/min

Relative Humidity 5 % to 100 %

Solar radiation ≤1120 W/s2

Heat radiation ≤600 W/s2

Wind speed ≤20 m/s

Waterproof Requirement

The following conditions should be met during the transportation:

l The packing boxes are intact.

A Equipment Specifications and Environment Requirements

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Product Description

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l Necessary rainproof measures should be taken for the means of transport to preventrainwater from entering the packing boxes.

l There is no water in the means of transportation.

Biologic Environmentl Avoiding the reproduction of animalcule, such as epiphyte and mildew.

l Getting rid of rodent (such as mouse).

Clarity of Airl No explosive, conductive, magnetic conductive nor corrosive dust.

l The density of mechanical active substance complies with the requirements of TableA-6.

l The density of chemical active substance complies with the requirements of Table A-7.

Table A-6 Requirements on the density of mechanical active substance

Mechanical Active Substance Content

Suspending dust No requirement

Precipitable dust ≤3.0 mg/m2·h

Sand ≤100 mg/m3

Table A-7 Requirements for the density of chemical active substance

Chemical Active Substance Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3

NH3 ≤1.00 mg/m3

Cl2 ≤0.10 mg/m3

HCl ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

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Mechanical Stress

Table A-8 Requirements for mechanical stress

Item Subitem Range

Random vibration Accelerationspectrum density

1 m2/s3 –3 dB

Frequency range 5 Hz to 20 Hz 20 Hz to 200Hz

Collision Impact responsespectrum I (sampleweight >50 kg)

100 m/s2, 11ms, 100 times each direction

Impact responsespectrum II (sampleweight ≤50 kg)

180 m/s2, 6ms, 100 times each direction

Drop Weight Height

<10 kg 1.0 m

<15 kg 1.0 m

<20 kg 0.8 m

<30 kg 0.6 m

<40 kg 0.5 m

<50 kg 0.4 m

<100 kg 0.3 m

>100 kg 0.1 m

NOTE:Impact response spectrum: the curve of the maximum acceleration response generated by theequipment under the stipulated impact motivation.Static load: The pressure from upside, that the equipment with package can endure when theequipment is piled as per stipulation.

A.4.3 Operation EnvironmentThe operation environment consists of the following factors: climate environment, biologicenvironment, clarity of air, mechanical stress, noise specification, and shockproof performance.

A Equipment Specifications and Environment Requirements

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Climate Environment

Table A-9 Requirements for temperature, humidity

Temperature Relative Humidity

Long-TermOperation

Short-TermOperation

Long-TermOperation

Short-TermOperation

0°C (32°F) to 45°C(113°F)

-5°C (23°F) to 55°C(131°F)

10 % to 90 % 5 % to 95 %

NOTETesting point of product temperature and humidity: when the cabinet of the product has noprotection board in the front and at the back, the value is tested 1.5 meter (5 feet) above thefloor and 0.4 meter (1.3 feet) in front of the cabinet.Short-term working condition means that the successive working time does not exceed 96hours and the accumulated time every year does not exceed 15 days.

Table A-10 Other requirements for climate environment

Item Range

Altitude ≤4000 m (13000 ft.)

Air pressure 70 kPa to 106 kPa

Temperature change rate ≤30°C/h

Solar radiation ≤700 W/s2

Heat radiation ≤600 W/s2

Wind speed ≤5 m/s

Biologic Environmentl Avoiding the reproduction of animalcule, such as epiphyte and mildew.

l Getting rid of rodent (such as mouse).

Clarity of Airl No explosive, conductive, magnetic conductive nor corrosive dust.

l The density of mechanical active substance complies with the requirements of TableA-11.

l The density of chemical active substance complies with the requirements of Table A-12.

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Table A-11 Requirements for the density of mechanical active substance

Chemical ActiveSubstance Content

Dust particle ≤3 × 105/m3

Suspending dust ≤0.2 mg/m3

Precipitable dust ≤15 mg/m2·h

Sand ≤100 mg/m3

Table A-12 Requirements for the density of chemical active substance

Chemical Active Substance Content

SO2 ≤0.3 mg/m3

H2S ≤0.1 mg/m3

NH3 ≤3.0 mg/m3

Cl2 ≤0.1 mg/m3

HCl ≤0.1 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

NOX ≤0.5 mg/m3

Mechanical Stress

Table A-13 Requirements for mechanical stress

Item Subitem Range

Sinusoidal vibration Speed 5 mm/s -

Acceleration - 2 m/s2

Frequency range 5 Hz to 62 Hz 62 Hz to 200 Hz

Non-steady impact Impact responsespectrum II

Half-sine wave, 30 m/s2, 1ms, times eachdirection

Static load 0

A Equipment Specifications and Environment Requirements

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Item Subitem Range

NOTE:Impact response spectrum: the curve of the maximum acceleration response generated by theequipment under the stipulated impact motivation.Static load: The pressure from upside, that the equipment with package can endure when theequipment is piled as per stipulation.

Noise SpecificationThe maximum noise is 72 dB (A) when a cabinet is installed with the maximum of three subracks,which complies with ETS 300 753.

Shockproof PerformanceComplies with ETS300-019-2-3-AMD.

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B Power Consumption, Weight and Slots ofBoards

This chapter describes the power consumption, weight and slots of boards.

Table B-1 lists the power consumption and weight of boards. Note that the power consumptionvalues are measured in normal working conditions (25°C [77°F]) and under temperature of 55°C (131°F).

Table B-1 OptiX BWS 1600G equipment board information

Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E6LWF 22.0 26.0 0.95 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E7LWF 22.0 26.0 0.95 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E1LWFD 51.65 56.82 1.58 kg(3.49 lb)

1 IU1–IU6,IU8–IU13

E7LWFS 26.0 28.6 0.95 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E1LRFD 51.65 56.82 1.58 kg(3.49 lb)

1 IU1–IU6,IU8–IU13

E3TMX 32.2 35.4 1.2 kg (2.6lb.)

2 IU1–IU5,IU8–IU12

E3TMXS 34.5 37.9 1.5 kg (3.3lb.)

2 IU1–IU5,IU8–IU12

E2ETMXE3ETMX

32.2 35.4 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E2ETMXSE3ETMXS

34.5 37.9 1.3 kg (2.9lb.)

1 IU1–IU6,IU8–IU13

E4TMR 27.4 30.0 0.85 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E4TMRS 26.0 28.6 0.85 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E4LBE 43.7 48.1 1.2 kg (2.6lb.)

1 IU1–IU6,IU8–IU13

E4LBES 52.1 57.3 1.2 kg (2.6lb.)

1 IU1–IU6,IU8–IU13

E3LBF 22.0 26.0 0.95 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E3LBFS 26.0 28.6 0.95 kg(2.1 lb.)

1 IU1–IU6,IU8–IU13

E2LOG 38.0 42.9 1.5 kg (3.3lb.)

2 IU1–IU5,IU8–IU12

E2LOGS 43.2 47.5 1.5 kg (3.3lb.)

2 IU1–IU5,IU8–IU12

E1ELOGE2ELOG

54.0 58.0 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E1ELOGSE2ELOGS

57.0 62.0 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E3LWX 32.0 35.5 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E3LWXR 43.0 47.5 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E3LWM 32.0 35.5 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E3LWMR 43.0 47.5 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E3LWC1 21.5 23.6 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E3TRC1 20.0 22.0 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

B Power Consumption, Weight and Slots of Boards

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E5LDG 28.0 30.8 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E2FDG 28.0 30.8 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E1TRC2 21.5 23.6 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E1FCE 32.0 35.2 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E1LQM 63.4 66.5 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E1LOM 71.6 78.8 1.8 kg (4lb.)

2 IU2–IU6,IU9–IU13

E1LOMS 71.6 78.8 1.8 kg (4lb.)

2 IU2–IU6,IU9–IU13

E1IMX4 120.0 132.0 4.5 kg (9.9lb.)

3 IU2–IU5,IU9–IU12

E1IMX4S 120.0 132.0 4.7 kg(10.4 lb.)

3 IU2–IU5,IU9–IU12

E1LR40 92.0 103.0 3.3 kg (7.2lb.)

3 IU3–IU6,IU10–IU13

E1LW40 112.6 123.8 4.9 kg(10.8 lb.)

3 IU3–IU6,IU10–IU13

E1TMX40 85.0 93.5 4.75 kg(10.5 lb)

2 IU1–IU5,IU8–IU12

E1TMX40S

85.0 93.5 4.75 kg(10.5 lb)

2 IU1–IU5,IU8–IU12

E1LU40 70.0 77.0 3.89 kg(8.6 lb)

2 IU1–IU5,IU8–IU12

E1LU40S 84.0 92.4 4.55 kg(10.0 lb)

2 IU1–IU5,IU8–IU12

E3M40 20.0 22.0 1.6 kg (3.5lb.)

2 IU2–IU6,IU9–IU13

E3V40 46.0 50.6 2.2 kg (4.9lb.)

2 IU2–IU6,IU9–IU13

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E3D40 20.0 22.0 1.6 kg (3.5lb.)

2 IU2–IU6,IU9–IU13

E3M48 24.2 26.6 1.3 kg (2.9lb.)

2 IU2–IU6,IU9–IU13

E3V48 46.0 50.6 2.2 kg (4.9lb.)

2 IU2–IU6,IU9–IU13

E3D48 24.2 26.6 1.3 kg (2.9lb.)

2 IU2–IU6,IU9–IU13

E3MR2 2.1 2.5 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E1MR8 2.1 2.5 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E3ITL 8.0 8.8 1.1 kg (2.4lb.)

1 IU1–IU6,IU8–IU13

E3FIU 2.1 2.5 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E1DWC 16.0 17.6 0.9 kg (2lb.)

2 IU1–IU5,IU8–IU12

E2DWC 16.0 17.6 0.9 kg (2lb.)

2 IU1–IU5,IU8–IU12

E2EDWC 23.7 26.1 3.8 kg (8.3lb.)

3 IU1–IU4,IU8–IU11

E1WSD9 12.4 13.6 2.8 kg (6.5lb.)

2 IU2–IU6,IU9–IU13

E2WSD9 23.2 25.5 2.8 kg (6.5lb.)

2 IU2–IU6,IU9–IU13

E1WSM9 12.4 13.6 2.8 kg (6.5lb.)

2 IU2–IU6,IU9–IU13

E2WSM9 23.2 25.5 2.8 kg (6.5lb.)

2 IU2–IU6,IU9–IU13

E1WSD5 13.4 14.7 4.6 kg(10.1 lb.)

2 IU2–IU6,IU9–IU13

E2WSD5 23.2 25.5 2.7 kg (5.9lb)

2 IU2–IU6,IU9–IU13

B Power Consumption, Weight and Slots of Boards

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E1WSM5 13.4 14.7 4.6 kg(10.1 lb.)

2 IU2–IU6,IU9–IU13

E2WSM5 23.2 25.5 2.7 kg (5.9lb)

2 IU2–IU6,IU9–IU13

E1RMU9 7.2 7.9 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E1WSMD2 15.0 16.5 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E1WSMD4 11.7 12.9 2.7 kg (6.0lb.)

2 IU1–IU5,IU8–IU12

E2OAU 42.0 70.0 2.4 kg (5.3lb.)

2 IU1–IU5,IU8–IU12

E4OAU 30.0 50.0 2.4 kg (5.3lb.)

2 IU1–IU5,IU8–IU12

E5OAU 40.0 44.0 2.4 kg (5.3lb.)

2 IU1–IU5,IU8–IU12

E2OBU 35.0 50.0 2.2 kg (4.9lb.)

2 IU1–IU5,IU8–IU12

E4OBU 23.0 30.0 2.2 kg (4.9lb.)

2 IU1–IU5,IU8–IU12

E5OBU 20.0 22.0 2.2 kg (4.9lb.)

2 IU1–IU5,IU8–IU12

E4OPUE5OPU

20.0 22.0 2.0 kg (4.4lb.)

2 IU1–IU5,IU8–IU12

E1HBA 24.0 26.4 2.6 kg (5.7lb.)

2 IU1–IU5,IU8–IU12

E1RPC 70.0 77.0 4.2 kg (9.3lb.)

2 IU1–IU5,IU8–IU12

E2RPC 70.0 77.0 4.2 kg (9.3lb.)

2 IU1–IU5,IU8–IU12

E1RPA 90.0 99.0 4.2 kg (9.3lb.)

2 IU1–IU5,IU8–IU12

E1MCA 7.0 7.7 1.7 kg (3.7lb.)

2 IU1–IU5,IU8–IU12

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E2MCA 7.0 7.7 1.7 kg (3.7lb.)

2 IU1–IU5,IU8–IU12

E1WMU 27.0 29.7 0.8 kg (1.8lb.)

1 IU1–IU6,IU8–IU13

E2VA2 9.0 9.9 1.4 kg (3.1lb.)

1 IU1–IU6,IU8–IU13

E2VA4 10.0 11.0 1.5 kg (3.3lb.)

1 IU1–IU6,IU8–IU13

E2VOA 6.5 7.2 0.8 kg (1.8lb.)

1 IU1–IU6,IU8–IU13

E1DGE 20.0 22.0 2.4 kg (5.3lb.)

2 IU1–IU5,IU8–IU12

E2DSE 4.3 4.8 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E2GFU 4.3 4.8 0.9 kg (2lb.)

1 IU1–IU6,IU8–IU13

E1PMU 12.0 13.2 1.1 kg (2.4lb.)

1 IU12

E1FMU 25.0 27.5 2.5 kg (5.5lb.)

3 IU1–IU4,IU8–IU11

E2MWA 2.0 2.2 0.8 kg (1.8lb.)

1 IU1–IU6,IU8–IU13

E2MWF 2.0 2.2 0.8 kg (1.8lb,)

1 IU1–IU6,IU8–IU13

E1SC1 4.0 4.4 0.9 kg (2lb.)

1 IU6, IU8

E1SC2 7.0 7.7 1.0 kg (2.2lb.)

1 IU6, IU8

E1ST1 28.5 31.4 1.0 kg (2.2lb.)

1 IU6, IU8

E1ST2 31.5 34.7 1.2 kg (2.6lb.)

1 IU6, IU8

E2SCC 10.5 11.5 0.8 kg (1.8lb.)

1 IU7

B Power Consumption, Weight and Slots of Boards

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

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Board MaximumPowerConsumption at 25°C (77°F) (W)

MaximumPowerConsumption at 55°C(131°F) (W)

Weight SlotsOccupied

AvailableSlots

E1OCP 8.0 8.8 1.7 kg (3.7lb.)

2 IU2–IU6,IU9–IU13

E1DCP 6.0 6.6 1.0 kg (2.2lb.)

1 IU1–IU6,IU8–IU13

E2OLP 6.0 6.6 0.8 kg (1.8lb.)

1 IU1–IU6,IU8–IU13

E2SCS 4.3 4.7 0.7 kg (1.5lb.)

1 IU1–IU6,IU8–IU13

E1PBU 145.0 159.5 1.0 kg (2.2lb.)

1 IU13

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description B Power Consumption, Weight and Slots of Boards

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C Technical Fundamental

The following technologies are widely used: OTN technology, erbium doped fiber amplificationtechnology, Raman amplification technology, and jitter suppression technology.

C.1 OTN TechnologyOptical transport network (OTN) is a brand-new optical transport technical system defined byRecommendations such as ITU-T G.872, G.798, and G.709.

C.2 FEC and AFECThe optical wavelength conversion units have forward error correction (FEC) function andadvanced forward error correction (AFEC).

C.3 Erbium-Doped Fiber AmplifierThe system uses an advanced erbium-doped fiber amplifier (EDFA) technology to amplify C-band optical signals and thus achieves long haul transmission without electrical regenerators.

C.4 Raman AmplificationThe Raman amplifier is an important application of stimulated Raman scattering (SRS).

C.5 Jitter SuppressionThe optical transponder unit (OTU) of the system employs the jitter suppression and clockextraction technology.

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C.1 OTN TechnologyOptical transport network (OTN) is a brand-new optical transport technical system defined byRecommendations such as ITU-T G.872, G.798, and G.709.

C.1.1 Technical BackgroundIn the OTN, the operability and manageability of the SDH/SONET are applied to the WDMsystem. As a result, the OTN integrates the advantages of the SDH/SONET and WDM.

C.1.2 OTN Standard SystemThe OTN system must comply with certain standards.

C.1.3 Features of OTN TechnologyThe OTN technology involves several types of technology.

C.1.4 Frame Structure of OTNThe OTN consists of optical layers (OTSn, OMSn and OCh) and electrical layers (OTUk, ODUkand OPUk) according to network layer definition.

C.1.5 Optical Layer SupervisoryThe product defines the supervisory overheads at the OTSn, OMSn and OCh layers accordingto the OTN standard. The working status of the network can be monitored by processing of thesesupervisory overheads. In this manner, the supervisory function at the OTN optical layer isachieved.

C.1.1 Technical BackgroundIn the OTN, the operability and manageability of the SDH/SONET are applied to the WDMsystem. As a result, the OTN integrates the advantages of the SDH/SONET and WDM.

The SDH/SONET and WDM are the major and advanced technologies used in current transportnetwork. The SDH/SONET mainly helps to process the electrical layer of services, whichfeatures VC cross-connect grooming, synchronization, and single-channel line. The SDH/SONET provides access, multiplexing, transport, flexible grooming, management and protectionfor sub-rate services such as E1, T1, E3, T3 and STM-N. The WDM mainly serves to processthe optical layer of services, which features multichannel multiplexing and demultiplexing andlong haul transmission, and thus provides low-cost transport for services of wavelength level.

The SDH/SONET network based on VC grooming lacks expandability, whereas therequirements for network bandwidth increase continuously. The traditional WDM technologyuses a method where client signals are directly mapped to an optical path and thus is limited tothe point-to-point application.

Then, the OTN emerges as the times require. The OTN is based on the SDH/SONET (mapping,multiplexing, flexible cross-connection, embedded overhead, concatenation, protection, andFEC). The operability and manageability of the SDH/SONET are applied to the WDM system.As a result, the OTN combines the advantages of SDH/SONET and WDM. In addition, the OTNdefines complete system architecture. In an OTN, each network is specified with a managementand monitoring mechanism; both the optical and electrical layers have network survivabilitymechanism. This completely meets the operators' requirements for operation and maintenance.

C.1.2 OTN Standard SystemThe OTN system must comply with certain standards.

C Technical Fundamental

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The OTN standard system is mainly based on the following ITU-T Recommendations:

l G.805: General functional structure of a transport network, applicable to the SDH and OTN.

l G.806: Equipment feature description methods and general functions, applicable to theSDH and OTN.

l G.872: Defines networks at three layers including the OCh, OMS and OTS and describesthe functions of network at each layer. G.872 also divides the OCh layer into three sublayersincluding OTU, ODU and OPU.

l G.798: Specifies each atomic functional module of OTN; specifies the processing of eachlayer of OTN, including the adaption function of customer/service layer and terminationand connection functions of each layer of OTN. G.798 plays a similar role to that of G.783.

l G.709: Defines the OTN frame structure and the overhead function of each layer; definesthe mapping processing of client services into OTN, including VC mapping and OTNmultiplexing processing. G.709 plays a similar role to that of G.707.

l G.7710: General equipment management function requirements that apply to the SDH andOTN.

l G.874: OTN management information model and function requirements that describesbased on G.7710 the five special management functions of OTN (FCAPS).

l G.808.1: General protection switching that applies to the SDH and OTN.

l G.873.1: Defines the linear ODUk protection in OTN domain.

l ITU-T Recommendations such as G.959.1 and G.664 specify the physical-layercharacteristics of OTN. Some other recommendations are under establishment, such as G.808.2 (general protection switching) and G.873.2 (OTN domain ring network ODUkprotection).

C.1.3 Features of OTN TechnologyThe OTN technology involves several types of technology.

The OTN technology has the following features:

l The OTN uses the OPUk container to transparently adapt and transport any client servicewithout changing any of the payload or overhead information; provides effectivemanagement and QoS monitoring; and is compatible with any new services in the future.

l The OTN adopts asynchronous mapping and multiplexing so that networkwidesynchronization is no longer required. This eliminates the limitation from synchronizationand simplifies the system design.

l By cross-connecting and multiplexing the ODU1 channel, the OTN enables sub-rateservices to be flexibly groomed between the OCh and client-side port, which balances thehigh utilization of wavelength bandwidth and flexible end-to-end grooming.

l The OTN provides the standard FEC function to achieve a maximum coding gain of 6.2dB (BER = 10E – 15). This decreases the OSNR tolerance of optical channels; stretchesthe electrical regeneration distance; reduces the number of system stations; and lowers thetotal cost for networking.

l With different TCM monitoring initiation points, different carriers and customers canmonitor the transmission quality of the same service. This enables easy maintenance andfault locating.

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C.1.4 Frame Structure of OTNThe OTN consists of optical layers (OTSn, OMSn and OCh) and electrical layers (OTUk, ODUkand OPUk) according to network layer definition.

Figure C-1 shows the OTN layer structure.

Figure C-1 OTN layer structure

Client

Dig

ital e

nvel

op

Cha

nnel

-as

soci

ated

over

head

OTM- nOTM- n.m: n OSC

Non

-cha

nnel

-as

soci

ated

ove

rhea

d

Electrical layer

Optical layer

ODUk FECOH OTUk

OPUkOH ODUk

ClientOH OPUk

OOSOSC

OH

OH

OCh Payload OCh

OCC OCC OCC

E/O

OMSn

OTSn

OMSn

OTSn

OH

Figure C-2 shows the structure of the overheads at the OTN optical layer. Table C-1 providesthe abbreviations of the overheads.

Figure C-2 OTN optical-layer overhead structure

PMIOTS

n

OM

Sn

General Management Communications

BDI-P

BDI-O

TTI

PMI

APS

BDI-P

BDI-O

FDI-P

FDI-O

OCIOC

h

FDI-P

FDI-O

12

3n

C Technical Fundamental

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Table C-1 Abbreviations of the overheads at the OTN optical layer

Abbreviation Expansion Name

OTSn Optical Transmission Section with n wavelengths

OMSn Optical Multiplex Section with n wavelengths

OCh Optical Channel

TTI Trail Trace Identifier

BDI-P Backward Defect Identifier-Payload

BDI-O Backward Defect Identifier-Overhead

FDI-P Forward Defect Identifier-Payload

FDI-O Forward Defect Identifier-Overhead

PMI Payload Mismatch Identifier

OCI Open Connection Identifier

APS Automatic Protection Switching

Note: The OTSn layer is the server layer of the OMSn layer, whereas the OMSn layer is theserver layer of the OCh layer.

C.1.5 Optical Layer SupervisoryThe product defines the supervisory overheads at the OTSn, OMSn and OCh layers accordingto the OTN standard. The working status of the network can be monitored by processing of thesesupervisory overheads. In this manner, the supervisory function at the OTN optical layer isachieved.

In the conventional WDM system, the supervisory function at the electrical layer is achieved byusing channel-associated overheads. The supervisory function at the optical layer, however, isachieved by using supervisory overheads that are carried by the out-of-band OSC channel. Withthe wide application of the ROADM, only optical layer-level processing is required at the nodeswhere no services are added or dropped. If the optical layer-level supervisory mechanism is notprovided, the network working status cannot be monitored. The product defines the supervisoryoverheads at the OTSn, OMSn and OCh layers according to the OTN standard. The workingstatus of the network can be monitored by processing of these supervisory overheads. In thismanner, the supervisory function at the OTN optical layer is achieved.

The supervisory function at the OTN optical layer is mainly to achieve end-to-end managementof the wavelengths at the optical layer. Figure C-3 illustrates the end-to-end management of thewavelengths. In this figure, two end-to-end channels are included: A to F and F to I.

The OCh layer starts and terminates at the point where O-E-O conversion of wavelengths isperformed, for example from A to F as shown in Figure C-3. The O-E-O conversion involvesmapping of the OTU client services and 3R (reshaping, retiming and regeneration) operations.

The OMSn layer starts and terminates at the point where single wavelengths are multiplexedand demultiplexed, for example, from A to D as shown in Figure C-3.

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The OTSn layer starts and terminates at the point where the multiplexed signals are regeneratedby an optical regenerator, for example, from A to B as shown in Figure C-3.

Figure C-3 End-to-end management diagram

B C ED F G IA H

OTS OTS OTS OTS OTS OTS OTS OTSOMS OMS OMS OMS

OCh OCh

End to end

OTM OLA OLA REGOLAROADM OLA OTMROADM

The supervisory function at the optical layer mainly involves the following aspects:

l Fiber connection management

l Supervisory of the continuity at the optical layer

l Supervisory of the maintenance signals at the optical layer

Fiber Connection ManagementIn the conventional WDM system, the connections between NEs are established through manualconfiguration. In this manner, you cannot observe whether the fiber connections between NEsare properly established. In the system, automatic fiber connection management is achievedthrough OTN optical layer-supervisory. That is, the automatic fiber connection management isachieved by monitoring the Trail Trace Identifier (TTI) at the OTSn layer.

In the networking application, the TTI at the OTSn layer transmitted between two NEs containsthe node identifiers of the source and sink NEs. The node identifier is sent to the far end NEthrough the transmission of TTI to broadcast the node identifier. At the same time, the nodereceives the node identifier of the far end NE. According to the received node identifier, eachNE judges whether the far end NE is the right neighbor NE. In this manner, the system canmonitor whether the fiber is wrongly connected.

Figure C-4 illustrates a tangent ring network. In this figure, the connection between NE C andthe neighbor NEs and the TTI information are presented. Each TTI string contains the nodeidentifiers of the source and sink NEs. NE C judges whether the fiber connection between itselfand its neighbor NEs are properly connected by observing the received and transmitted TTIstrings of the neighbor NEs.

C Technical Fundamental

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Figure C-4 Example of fiber connection management

TTI 3

TTI 4 TTI 1

TTI 2

C

Supervisory of the Continuity at the Optical LayerThis function is provided to monitor the integrity of service trail. At the OTN optical layer,services and overheads are separate from each other. In this case, separate continuity supervisoryof services and overheads is required. The loss of continuity alarm is defined as Loss of Signal(LOS).

l Continuity supervisory at the OTSn layerIn the case of the OTSn layer, continuity supervisory involves monitoring the loss of signalsin the payloads (OTSn_LOS-P) and loss of signals in the overheads (OTSn_LOS-O). TheOTSn_LOS-P refers to the loss of OTM-n.m signals in the main services, and OTSn_LOS-O refers to the loss of signals of the OSC channel.The loss of continuity defect at the OTSn layer mainly involves amplifier faults, OSC laserfault or fiber line fault. User judges whether there is a fault at the OTSn layer by queryingthe supervisory information of the continuity at the OTSn layer.

l Continuity supervisory at the OMSn layerIn the case of the OMSn layer, continuity supervisory involves monitoring the loss ofsignals in the payloads (OMSn_LOS-P), that is, the loss of multiplexed signals.The loss of continuity defect at the OMSn layer mainly involves multiplex/demultiplexerfault and fiber line fault. User judges whether there is fault at the OMSn layer by queryingthe supervisory information of the continuity at the OMSn layer.

l Continuity supervisory at the OCh layerIn the case of the OCh layer, the continuity supervisory involves monitoring the loss of onechannel signals (OCh_LOS-P).The loss of continuity defect at the OCh layer mainly involves transmitter fault and opticalchannel transmission fault. User judges whether there is fault at the OCh layer by queryingthe supervisory information of the continuity at the OCh layer.

Supervisory of the Maintenance Signals at the Optical LayerWith the maintenance signals monitoring function available, the system sends the faultinformation at the optical layer of the network to upstream or downstream stations, and locatesnetwork faults very fast.

Maintenance signals monitoring involves the following operations:

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FDI-P: Sends the status of the payload signals at the OMSn/OCh layer to the downstreamstations.

FDI-O: Sends the status of the overhead signals at the OMSn/OCh layer to the downstreamstations.

BDI-P: Sends the status of the faulty payload signals at OTSn/OMSn layer that is detected inthe downstream sink station back to the upstream source station.

BDI-O: Sends the status of the faulty overhead signals at OTSn/OMSn layer that is detected inthe downstream sink station back to the upstream source station.

l Supervisory of the maintenance signals at the OTSn layerUser can monitor the fault information at the OTSn layer by querying the following alarms.– OTSn_BDI-P alarm: User can judge whether the downstream sink station has detected

payload fault through this alarm.– OTSn_BDI-O alarm: User can judge whether the downstream sink station has detected

overhead fault through this alarm.l Supervisory of the maintenance signals at the OMSn layer

User can monitor the fault information at the OMSn layer by querying the following alarms.– OMSn_BDI-P alarm: User can judge whether the downstream sink station has detected

payload failure through this alarm.– OMSn_BDI-O alarm: User can judge whether the downstream sink station has detected

overhead fault through this alarm.– OMSn_FDI-P alarm: User can judge whether the server layer OTSn has detected

payload fault through this alarm.– OMSn_FDI-O alarm: User can judge whether the server layer OTSn has detected

overhead fault through this alarm.l Supervisory of the maintenance signals at the OCh layer

User can monitor the fault information at the OCh layer by querying the following alarms.– OCh_FDI-P alarm: User can judge whether the server layer OMSn has detected payload

fault through this alarm.– OCh_FDI-O alarm: User can judge whether the server layer OMSn has detected

overhead fault through this alarm.

For the causes and handling of the alarms at the optical layer, refer to the Alarms andPerformance Events Reference.

C.2 FEC and AFECThe optical wavelength conversion units have forward error correction (FEC) function andadvanced forward error correction (AFEC).

The FEC technology is the error correction technology. The OTU adopts Reed-Solomon Coding.It can correct eight byte errors at most in any location for 255 bytes, and has a fairly powerfulcapability of error correction. Because the redundancy codes are added, the digital rate isincreased. The FEC complies with the ITU-T G.975.1 or G.975 and supports the processing ofoverhead as stated in the ITU-T G.709.

The FEC function can improve the OSNR budget of the DWDM transmission system andincrease the transmission distance. In addition, the FEC function can reduce bit error rate in line

C Technical Fundamental

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transmission, and alleviate the effects on the signal transmission quality caused by the agingcomponents or deterioration of fiber performance, thus improving the communication qualityof the DWDM transmission network.

The AFEC is a new error correction technique. It adopts two-level encoding, increases encodinggain, and equally distributes the burst errors. AFEC is more powerful than FEC.

C.3 Erbium-Doped Fiber AmplifierThe system uses an advanced erbium-doped fiber amplifier (EDFA) technology to amplify C-band optical signals and thus achieves long haul transmission without electrical regenerators.

The EDFA integrates a gain lock technology and a transient control technology to disassociatethe signal gain of each channel with the total number of channels in a fiber. In addition, theEDFA prevents the burst bit errors from occurring in the existing channels when channels areincreased or decreased.

C.4 Raman AmplificationThe Raman amplifier is an important application of stimulated Raman scattering (SRS).

Quartz fiber has a very broad SRS gain spectrum. It has a broad peak near the frequency of 13THz. If a weak signal and a strong pump light are transmitted in the fiber simultaneously, andtheir frequency difference is within the range of Raman gain spectrum, the weak signal beamcan be amplified. The gain spectrum of the fiber Raman amplifier is shown in the Figure C-5.

Figure C-5 Raman amplifier gain spectrum

Pump light Gain

30nm13THz(70 nm-100 nm)

The fiber Raman amplifier is always used with the EDFA amplifier at the receive end. It adoptsdistributed amplification mechanism for extra long haul and extra long span applications, asshown in Figure C-6.

Figure C-6 Raman amplification application

Transmitting end

EDFA

Pump light

Receiving end

Signal light

Laser

EDFA Pump light

Fiber

Raman amplifier

Coupler

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Usually the optical fiber Raman amplifier is used at the receive end of DWDM system to amplifyoptical signals. The Raman amplifier, which is mainly composed of pumping lasers, works bycounter pumping.

NOTE

Counter pumping means the pump light is injected at the fiber end and the direction is opposite to the mainsignals. This kind of pumping achieves a big phase difference between the main signals and the pump light.The Raman pump power vibration is leveled in the direction opposite to signal transmission, thus effectivelysuppressing the noise created by the pump.

C.5 Jitter SuppressionThe optical transponder unit (OTU) of the system employs the jitter suppression and clockextraction technology.

Hence, the jitter performance of the system is better than the related DWM technology standard.The OTU extracts the B1, B2 and J0 byte to locate the bit errors. It determines that the bit errorsare on the client side or on the DWDM side, and then analyses the cause of bit errors. The jittersuppression function is very important when the system is connected to SDH equipment of othervendors.

C Technical Fundamental

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D Complied Criteria

The product complies with the related standards and regulations.

D.1 ITU-T Recommendations

D.2 IEEE Standards

D.3 Laser Security Standards

D.4 Security Standards

D.5 Environment Related Standards

D.6 International Standards

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D.1 ITU-T Recommendations

Recommendation Describes

G.692 Optical interfaces for multichannel systems with optical amplifiers

G.694.1 Spectral grids for WDM applications: DWDM frequency grid

G.694.2 Spectral grids for WDM applications: CWDM frequency grid

G.696.1 Intra-Domain DWDM applications

G.702 Digital hierarchy bit rates

G.703 Physical/electrical characteristic of hierarchical digital interfaces

G.704 Synchronous frame structures used at 1544, 6312, 2048, 8448 and44736kbit/s hierarchical levels

G.707 Network node interface for the synchronous digital hierarchy (SDH)

G.709 Interfaces for the Optical Transport Network

G.7710 Equipment Management Function (EMF) requirements that arecommon to multiple transport technologies

G.775 Loss of signal (LOS) and alarm indication signal (AIS) defectdetection and clearance criteria

G.773 Protocol suites for Q-interfaces for management of transmissionsystems

G.774 1G.774 2G.774 3G.774 4G.774 5

Synchronous Digital Hierarchy (SDH) management informationmodel for the network element view

G.783 Characteristics of Synchronous Digital Hierarchy (SDH) equipmentfunctional blocks

G.784 Synchronous Digital Hierarchy (SDH) management

G.798 Characteristics of optical transport network hierarchy equipmentfunctional blocks

G.803 Architectures of transport networks based on the SynchronousDigital Hierarchy (SDH)

G.808.1 The generic functional models, characteristics and processesassociated with various linear protection schemes for connection-oriented layer networks

G.813 Timing characteristics of SDH equipment slave clocks (SEC)

D Complied Criteria

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Recommendation Describes

G.823 The control of jitter and wander within digital networks which arebased on the 2048kbit/s hierarchy

G.824 The control of jitter and wander within digital networks which arebased on the 1544kbit/s hierarchy

G.825 The control of jitter and wander within digital networks which arebased on the Synchronous Digital Hierarchy (SDH)

G.826 Error performance parameters and objectives for international,constant bit rate digital paths at or above the primary rate

G.831 Management capabilities of transport networks based on theSynchronous Digital Hierarchy (SDH)

G.841 Types and characteristics of SDH network protection architectures

G.842 Cooperation of the SDH network protection structures

G.870 Terms and definitions for Optical Transport

G.871 Framework for optical transport network (OTN)

G.872 The functional architecture of optical transport networks using themodelling methodology described in ITU-T Rec. G.805

G.873.1 The APS protocol and protection switching operation for the linearprotection schemes for the Optical Transport Network at the OpticalChannel Data Unit (ODUk) level

G.874 Management aspects of the Optical Transport Network Elementcontaining transport functions of one or more of the layer networksof the optical transport network.

G.875 Optical transport network (OTN) management information modelfor the network element view

G.957 Optical interfaces of equipments and systems relating to thesynchronous digital hierarchy

G.691 Optical interfaces for single channel STM-64 and other SDHsystems with optical amplifiers

G.693 Optical interfaces for intra-office systems

G.697 Optical monitoring for DWDM systems

G.671 Transmission characteristics of optical components and subsystems

G.959.1 Optical transport network physical layer interfaces

G.975 Forward error correction for submarine systems

G.975.1 Forward error correction for high bit rate DWDM submarinesystems

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Recommendation Describes

M.2401 Error Performance Limits and Procedures for Bringing-Into-Serviceand Maintenance of multi-operator international paths and sectionswithin Optical Transport Networks

M.3010 Principles for a telecommunication management network

G.661 Definition and test methods for the relevant generic parameters ofoptical fiber amplifiers

G.662 Generic characteristics of optical fiber amplifier devices and sub-systems

G.663 Application related aspects of optical fiber amplifier devices andsub-systems

G.664 Optical safety procedures and requirements for optical transportsystems

G.665 Definitions and Test Methods for Generic Characteristics of RamanAmplifiers and Raman Amplified Subsystems

G.8201 Error performance parameters and objectives for multi-operatorinternational paths within the Optical Transport Network (OTN)

G.8251 The control of jitter and wander within the optical transport network(OTN) Series

D.2 IEEE Standards

Standard Description

IEEE Std802.3

Carrier sense multiple access with collision detection (CSMA/CD) accessmethod and physical layer specification

IEEE 802.3z Media Access Control (MAC) parameters, physical Layer, repeater andmanagement parameters for 1000 Mb/s operation

IEEE802.3ae Media Access Control (MAC) parameters, physical Layer, and managementparameters for 10Gb/s operation

D.3 Laser Security Standards

Standard Description

IEC 60825-1 Safety of laser products-Part 1: Equipment classification, requirementsand user's guide

D Complied Criteria

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Standard Description

IEC 60825-2 Safety of laser products-Part2: Safety of optical fiber communicationsystems

D.4 Security Standards

Standard Description

IEC 215 Safety requirements for radio transmitting equipment

EN 60950 Safety of Information Technology Equipment. Including ElectricalBusiness Equipment

IEC 950 Safety of Information Technology Equipment. Including ElectricalBusiness Equipment

CAN/CSA-C22.2No 950-95

Safety of Information Technology Equipment Including ElectricalBusiness Equipment

UL 1950 3:rd edition Safety of Information Technology Equipment IncludingElectrical Business Equipment

D.5 Environment Related Standards

Standard Description

IEC 61000 Electromagnetic compatibility(EMC)

ETSI EN 300 386 Electromagnetic compatibility and Radio spectrum Matters(ERM);Telecommunication network equipment; Electro MagneticCompatibility (EMC) requirements

ETS 300 019-1-3: Class 3.2 Partly temperature-controlled location

NEBS GR-63-CORE

Network Equipment-Building System (NEBS) Requirements: PhysicalProtection

D.6 International Standards

Standard Description

IEC 61291-1 Optical amplifiers – Part 4: Multichannel Applications Performancespecification Template

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Standard Description

CAN/CSA-C22.2No 1-M94

Audio, Video and Similar Electronic Equipment

73/23/EEC Low Voltage Directive

IEC 529 Classification of degrees of protection provided by enclosures (IPCode)

D Complied Criteria

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E Glossary

A

Add/Dropmultiplexer

A multiplexer capable of extracting and inserting lower-rate signals froma higher-rate multiplexed signal without completely demultiplexing thesignal.

Add/dropwavelength

In the OADM equipment, the MR2 board carries the wavelength thatdirectly adds or drops services.

ADM See add/drop multiplexer.

Administrator A user who has authority to access all the Management Domains of theEML Core product. He has access to the whole network and to all themanagement functionalities.

AIS Alarm Indication Signal. A signal sent downstream in a digital networkif an upstream failure has been detected and persist for a certain time.

Alarm cascading The shunt-wound output of the alarm signals of several subracks orcabinets.

Alarm correlationanalysis

A process where in alarm is raised within five seconds after alarm israised, and alarm complies with the conditions defined in the alarmcorrelation analysis rule, you can either suppress the alarm or raise itsseverity level according to the behavior defined in the alarm correlationrule.

Alarm indicationsignal

A code sent downstream in a digital network as an indication that anupstream failure has been detected. It is associated with multipletransport layers.

Alarm indication On the cabinet of an NE, there are three indicators with different colorsindicating the current status of the NE. You can stop the NE alarmindication through the T2000.

Alarm A visible or an audible indication to notify the person concerned that afailure or an emergency has occurred. See also Event.

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ALC link A piece of end-to-end configuration information, which exists in theequipment (single station) as an ALC link node. Through the ALCfunction of each node, it fulfils optical power control on the line thatcontains the link.

ALC Automatic Level Control. The technique supports the adjustment ofoptical power aimed to restrain the output power to be inferior on thedownstream and keep the optical power to be within a certain workingrange.

APD Avalanche Photodiode. A semiconductor photodetector with integraldetection and amplification stages. Electrons generated at a p/n junctionare accelerated in a region where they free an avalanche of otherelectrons. APDs can detect faint signals but require higher voltages thanother semiconductor electronics.

Asynchronous A network where transmission system payloads are not synchronizedand each network terminal runs on its own clock.

Attenuation Reduction of signal magnitude or signal loss, usually expressed indecibels.

Attenuator A passive component that attenuates an electrical or optical signal.

Automatic gaincontrol

A technique which is used to adjust the gain of each wavelength signalwithin allowed range.

Auto-negotiation The rate/work mode of the communication party set as self-negotiationis specified through negotiation according to the transmission rate of theopposite party.

B

Back up A method to copy the important data into a backing storage in case thatthe original is damaged or corrupted.

Backplane A PCB circuit board in the subrack, which is connected with all theboards in position.

Bandwidth Information-carrying capacity of a communication channel. Analogbandwidth is the range of signal frequencies that can be transmitted bya communication channel or network.

Bit error rate The number of coding violations detected in a unit of time, usually onesecond. Bit error rate (BER) is calculated with this formula:BER = errored bits received/total bits sent

Bit error An error occurs to some bits in the digital code stream after beingreceived, judged, and regenerated, thus damaging the quality of thetransmitted information.

bit/s The number of bits passing a point every second. The transmission ratefor digital information.

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C

Cabling The methods to route the cables or fibers.

Centralized alarmsystem

The system that gathers all the information about alarms into a certainterminal console.

Chain network One type of network that all network nodes are connected one after oneto be in series.

Client A kind of terminal (PC or workstation) connected to a network that cansend instructions to a server and get results through a user interface. Seealso server.

Configurationmanagement

Configuration management enables inventory query of networkconfiguration resources, including relevant configuration of NMS orSNMS, NE, subnet, links, SNC, route, TP, edge point, equipment, andso on. Real-time inventory change report can also be provided throughthis resource, it will be timely reported to the upper NMS to notify thecarrier of the current network operation status and ensure dataconsistency of the upper NMSs.

Configure To set the basic parameters of an operation object.

Connection point A reference point where the output of a trail termination source or aconnection is bound to the input of another connection, or where theoutput of a connection is bound to the input of a trail termination sink oranother connection. The connection point is characterized by theinformation which passes across it. A bidirectional connection point isformed by the association of a contradirectional pair.

Connection A "transport entity" which consists of an associated pair of"unidirectional connections" capable of simultaneously transferringinformation in opposite directions between their respective inputs andoutputs.

D

DCF Dispersion Compensation Fiber. A kind of fiber which uses negativedispersion to compensate for the positive dispersion of transmitting fiberto maintain the original shape of the signal pulse.

DCM Dispersion Compensation Module. A module, which contains dispersioncompensation fibers to compensate for the positive dispersion oftransmitting fiber.

DCN Data Communication Network. A communication network within aTMN or between TMNs which supports the data communicationfunction (DCF).

Defect A limited interruption in the ability of an item to perform a requiredfunction.

Demultiplexing A process applied to a multiplex signal for recovering signals combinedwithin it and for restoring the distinct individual channels of the signals.

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Dense wavelengthDivisionmultiplexing

The higher capacity version of WDM, which is a means of increasingthe capacity of fiber-optic data transmission systems through themultiplexing of multiple wavelengths of light. Commercially availableDWDM systems support the multiplexing of from 8 to 40 wavelengthsof light.

Distributedservice

The transmitting services are distributed between each neighboringnodes connected over a ring network.

Domain The domain of the T2000 specifies the scope of address or functionswhich are available to a certain user.

Dual-Fed A description of a ring that has entry nodes that add traffic to the ringthrough the bridging function.

DWDM Dense Wavelength Division Multiplexing. The technology utilizes thecharacteristics of broad bandwidth and low attenuation of single modeoptical fiber, employs multiple wavelengths with specific frequencyspacing as carriers, and allows multiple channels to transmitsimultaneously in the same fiber.

E

ECC Embedded Control Channel. An ECC provides a logical operationschannel between SDH NEs, utilizing a data communications channel(DCC) as its physical layer.

EDFA Erbium-Doped Fiber Amplifier. The optical amplifier that its fiber dopedwith the rare earth element erbium, which can amplify at 1530 to 1610nm when the optical amplifier is pumped by an external light source.

ESC Electric Supervisory Channel. A technology realizes the communicationamong all the nodes and transmits the monitoring data in the opticaltransmission network. The monitoring data of ESC is introduced intoDCC service overhead and is transmitted with service signals.

ESCON Enterprise System Connection. A path protocol which connects the hostwith various control units in a storage system. It is a serial bit streamtransmission protocol. The transmission rate is 200 Mbit/s.

ESD Electrostatic Discharge. The phenomena the energy being produced byelectrostatic resource discharge instantly.

Ethernet A data link level protocol comprising the OSI model's bottom two layers.It is a broadcast networking technology that can use several differentphysical media, including twisted pair cable and coaxial cable. Ethernetusually uses CSMA/CD. TCP/IP is commonly used with Ethernetnetworks.

ETSI European Telecommunications Standards Institute

Eye pattern A graphic presentation formed by the superimposition of the waveformsof all possible pulse sequences.

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F

F1 byte The user path byte, which is reserved for the user, but is typically specialfor network providers. The F1 byte is mainly used to provide thetemporary data or voice path for special maintenance objectives. Itbelongs to the regenerator section overhead byte.

Fan tray assembly A module which contains fans used for heat dissipation.

Fault A fault is the inability of a function to perform a required action. Thisdoes not include an inability due to preventive maintenance, lack ofexternal resources, or planned actions.

FC Fiber Channel. A standard of data storage network for transmittingsignals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.

FDDI Fiber Distributed Data Interface. A standard for a 100 Mbit/s fiber-opticlocal-area network.

Fiber channel The channel which is used for fiber routing.

Fiber connector A device mounted on the end of a fiber-optic cable, light source, receiver,or housing that mates to a similar device to couple light into and out ofoptical fibers. A connector joins two fiber ends, or one fiber end and alight source or detector.

Fiber jumper The fiber which is used to connect the subrack with the ODF.

Fiber spool box A box which is used to spool the fiber.

Fiber spool The spool on the side of a subrack which is used for fiber routing.

FICON Fiber Connect. A new generation connection protocol which connectsthe host with various control units. It carries single byte commandprotocol through the physical path of fiber channel, and provides higherrate and better performance than ESCON.

Frame A cyclic set of consecutive time slots in which the relative position ofeach time slot can be identified.

G

Gain spectrum-shape pre-tilt

The technology to keep the gain into being a basically fixed value.

Gain The ratio between the optical power from the input optical interface ofthe optical amplifier and the optical power from the output opticalinterface of the jumper fiber, which expressed in dB.

H

History alarms Alarms that have been cleared and acknowledged.

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Historyperformance data

The performance data that is stored in the history register and the auto-report performance data that is stored on the T2000.

I

Input jittertolerance

For STS-N electrical interfaces input jitter tolerance is the maximumamplitude of sinusoidal jitter at a given jitter frequency, which whenmodulating the signal at an equipment input port, results in no more thantwo errored seconds cumulative, where these errored seconds areintegrated over successive 30 second measurement intervals.

IP over DCC The IP Over DCC follows TCP/IP telecommunications standards andcontrols the remote NEs through the Internet. The IP Over DCC meansthat the IP over DCC uses overhead DCC byte (the default is D1-D3) forcommunication.

IPA Intelligent Power Adjustment. The technology that the system reducesthe optical power of all the amplifiers in an adjacent regeneration sectionin the upstream to a safety level if the system detects the loss of opticalsignals on the link. The loss of optical signals may due to the fiber isbroken, the performance of equipments trend to be inferior or theconnector is not plugged well. Thus, the maintenance engineers are nothurt by the laser being sent out from the slice of broken fiber.

J

Jitter tolerance For STS-N electrical interfaces, input jitter tolerance is the maximumamplitude of sinusoidal jitter at a given jitter frequency, which results inno more than two errored seconds cumulative, when the signal ismodulated at an equipment input port. These errored seconds areintegrated over successive 30 second measurement intervals.Requirements on input jitter tolerance as just stated, are specified interms of compliance with a jitter mask, which represents a combinationof points. Each point corresponds to a minimum amplitude of sinusoidaljitter at a given jitter frequency which results in two or fewer erroredseconds in a 30 second measurement interval when the signal ismodulated at the equipment input port. For the OC-N optical interface,it is defined as the amplitude of the peak-to-peak sinusoidal jitter appliedat the input of an OC-N interface that causes a 1 dB power penalty.

Jitter transfer The physical relationship between jitter applied at the input port and thejitter appearing at the output port.

Jitter Short waveform variations caused by vibration, voltage fluctuations,control system instability, and so on.

L

E Glossary

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Laser The device that generates the directional light covering a narrow rangeof wavelengths. Laser light is more coherent than ordinary light.Semiconductor diode lasers are the used light source in fiber-opticsystem.

Layer A concept used to allow the transport network functionality to bedescribed hierarchically as successive levels; each layer being solelyconcerned with the generation and transfer of its characteristicinformation.

Link A "topological component" that provides transport capacity between twoendpoints in different subnetworks through a fixed (that is inflexiblerouting) relationship. The endpoints are "subnetwork termination pointpools" for SONET, and link termination points for ATM. Multiple linksmay exist between a pair of subnetworks. A link also represents a set of"link connections".

Loopback The fault of each path on the optical fiber can be located by settingloopback for each path of the line. There are three kinds of loopbackmodes: No loopback, Outloop, Inloop.

Lower subrack The subrack close to the bottom of the cabinet when a cabinet containsseveral subracks.

M

MAC Media Access Control. The data link sublayer that is responsible fortransferring data to and from the Physical Layer.

MAN Metropolitan Area Network. An IEEE-approved network that supportshigh speeds over a metropolitan area.

Mean launchedpower

The average power of a pseudo-random data sequence coupled into thefiber by the transmitter.

MF Mediation Function. A function that routes or acts on informationpassing between network elements and network operations intelecommunications network management.

Mounting ear A component on the side of a subrack, which is used to install the subrackin a cabinet.

Multiplex To transmit two or more signals over a single channel.

Multiplexer An equipment which combines a number of tributary channels onto afewer number of aggregate bearer channels, the relationship between thetributary and aggregate channels being fixed.

Multiplexing A procedure by which multiple lower order path layer signals are adaptedinto a higher order path or the multiple higher order path layer signalsare adapted into a multiplex section.

N

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NE ID A unique identifier to which each NE corresponds in a network. In theOptiX transmission equipment, it is specified that the NE ID is a 24-bitbinary digit, that is, three bytes. The DIP switch on the SCC board of theNE constitutes the lower 16 bits of the NE ID. The higher eight bits ofthe NE ID is the extended ID (default value: 9), which is also called thesubnet number. The extended ID is typically used to identify differentsubnets.

Noise figure The specification to scale the random signal in the system presenting inaddition to any wanted signal.

NRZ Non Return to Zero. A digital code in which the signal level is low for0 bit and high for 1 bit and dose not return to 0 between successive 1bits.

O

OADM Optical Add/Drop Multiplexer. A device that can be used to add theoptical signals of various wavelengths to one channel and drop theoptical signals of various wavelengths from one channel.

OCP Optical Channel Protection. A protection mechanism supports workingchannels with multiple wavelengths and protection one in order to beagainst the situation that there is any fault in the working channel.

OLA Optical Line Amplifier. A device that amplifies an optical signal in thetransmitting link without converting it into electrical form.

OLP Optical Line Protection. A protection mechanism supports a workingpath and a protection path with dual-fed signal selection function.Normally, the working path carries the traffic. The protection path willwork to be against the situation that there is any fault in the working link.

ONE Optical Network Element. A stand-alone physical entity in an opticaltransmission network that supports at least network element functions.

Online help An indexed collection of information on all aspects of the T2000. Theycan be accessed at any time from the Help menu or by pressing the F1key.

Optical amplifier A device or subsystem in which optical signals can be amplified bymeans of stimulated emission taking place in a suitable active medium.It is used to amplify the optical signal of the optical transmission system.

Optical connector A component normally attached to an optical cable or piece of apparatusfor the purpose of providing frequent optical interconnection/disconnection of optical fibers or cables.

Opticaldemultiplexer

A device which performs the inverse operation of a wavelengthmultiplexer, where the input is an optical signal comprising two or morewavelength ranges and the output of each port is endowed with thedifferent and preselected wavelength.

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Optical interface A device to allow two or more corresponding optical transmitting unitsto be connected.

Opticalmultiplexer

A branching device with two or more input ports and one output portwhere the light in each input port is restricted to a preselected wavelengthrange and the output is the combination of light from the input ports.

Optical spectrumanalyzer

An instrument that scans the spectrum to record power, measures thevalue of loss insertion and tests the performance of the wavelength andoptical signal noise ratio (OSNR) of each channel.

Optical switch A passive component possessing two or more ports which selectivelytransmits, redirects, or blocks optical power in an optical fibertransmission line.

OSC Optical Supervisory Channel. A technology realizes communicationamong nodes in optical transmission network and transmits themonitoring data in a certain channel (the wavelength of the workingchannel for it is 1510 nm and that of the corresponding protection one is1625 nm).

OSNR Optical Signal-to-Noise Ratio. Ratio of the optical power of thetransmitted optical signal to the noise on the received signal.

OTDR Optical Time Domain Reflectometer. An instrument that measurestransmission characteristics by sending a short pulse of light down a fiberand observing backscattered light.

OTM Optical Terminal Multiplexer. A device that multiplex or demultiplexoptical signals into a transmission link or into the client side.

OTU Optical Transponder Unit. A device that access service signals compliantwith standards at the client side and convert them into standard DWDMor CWDM wavelengths.

Output opticalpower

The ranger of optical energy level of output signals.

Overhead Extra bits in a digital stream used to carry information besides trafficsignals. Orderwire, for example, would be considered overheadinformation.

P

Path A logical connection between the point at which a standard frame formatfor the signal at the given rate is assembled, and the point at which thestandard frame format for the signal is disassembled.

PDH Plesiochronous Digital Hierarchy. PDH is the digital networkinghierarchy that was used before the advent of SONET/SDH.

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Performancethreshold

Performance events usually have upper and lower thresholds. When theperformance event count value exceeds the upper threshold, aperformance threshold-crossing event is generated; when theperformance event count value is below the upper threshold for a periodof time, the performance threshold-crossing event is ended. In this way,performance jitter caused by some sudden events can be shielded.

PIN Photodiode. A semiconductor detector with an intrinsic regionseparating the p- and n-doped regions. It has fast linear response and isused in fiber-optic receivers.

Plesiochronous A network with nodes timed by separate clock sources with almost thesame timing.

PMU Power Monitor Unit. One type of power and environment monitoringunit.

Polarizationdependence loss

The maximum variation of loss result from a variation of the state ofpolarization of the input signal at nominal operating conditions.

Power andenvironmentmonitoring unit

The power and environment monitoring unit is installed at the top of thecabinet of the SDH equipment and is used to monitor the environmentvariables, such as the power supply and temperature. With externalsignal input through the relay, fire alarm, smoke alarm, burglary alarm,and so on. can be monitored as well.

Power box A direct current power distribution box at the upper part of a cabinet,which supplies power for the subracks in the cabinet.

Procedure A generic term for an action.

Process A generic term for a collection of actions.

R

Receiver overload Receiver overload is the maximum acceptable value of the receivedaverage power at point R to achieve a 1 x 10-10 BER.

Receiversensitivity

Receiver sensitivity is defined as the minimum acceptable value ofaverage received power at point R to achieve a 1 x 10-10 BER.

Reflectioncoefficient

The difference between the amount of light incident and the amount thatis reflected back from a surface.

REG A device that performs regeneration.

Regeneration The process of receiving and reconstructing a digital signal so that theamplitudes, waveforms and timing of its signal elements are constrainedwithin specified limits.

Regeneratorsection overhead

The regenerator section overhead comprises rows 1 to 3 of the SOH ofthe STM-N signal.

Ring network One type of network that all network nodes are connected one after oneto be a cycle.

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S

SDH Synchronous Digital Hierarchy. A hierarchical set of digital transportstructures, standardized for the transport of suitably adapted payloadsover physical transmission networks.

Service protection The measures to make sure the service transmitting not to be damagedor corrupted.

Severity See Alarm severity.

Side modesuppression ratio

The ratio of the largest peak of the total source spectrum to the secondlargest peak.

Span The set of SONET lines between two adjacent nodes on a ring.

Splitter A device that divides incident light into two separate beams.

Star network Network of several nodes where each terminal is linked individually toa central node.

STM-N Synchronous Transport Module. An STM is the information structureused to support section layer connections in the SDH. It consists ofinformation payload and Section Overhead (SOH) information fieldsorganised in a block frame structure which repeats every 125 ms. Theinformation is suitably conditioned for serial transmission on the selectedmedia at a rate which is synchronised to the network. A basic STM isdefined at 155.520kbit/s.

SuperWDM A technical solution can extend effectively the transmitting distance ofDWDM system with the application of Super CRZ encoding and theadvanced phase modulation capability.

Support The frame on the bottom of a cabinet, when installing the cabinet on theantistatic floor.

Synchronousdigital hierarchy

A hierarchical set of digital transport structures, standardized for thetransportation of suitably adapted payloads over physical (primarilyoptical) transmission networks.

Synchronous A network where transmission system payloads are synchronized to amaster (network) clock and traced to a reference clock.

T

T2000 The T2000 is a subnet management system (SNMS). In thetelecommunication management network architecture, the T2000 islocated between the NE level and network level, which can supports allNE level functions and part of the network level management functions.See also NM.

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TCP/IP Transmission Control Protocol/Internet Protocol. Common name for thesuite of protocols developed to support the construction of worldwideinternetworks.

Telecommanagementnetwork

The entity which provides the means used to transport and processinformation related to management functions for thetelecommunications network.

Timeslot Single timeslot on an E1 digital interface—that is, a 64-kbps,synchronous, full-duplex data channel, typically used for a single voiceconnection.

TL1 Transaction Language 1, A Telcordia Technologies machine-to-machine communications language that is a subset of ITU-TSS, formerlyCCITT's, human-machine language.

TMN Telecommunications Management Network. The entity which providesthe means used to transport and process information related tomanagement functions for the telecommunications network.

Tray A discal component in the cabinet, which is used to place the chassis orother equipment.

U

Unit managementlayer

Designates the management functions performed on units assembled ina network.

Unprotected Services transmitted through an ordinary way, once a failure orinterruption occurs, the data cannot be restored for lack of protectionmechanism.

User The user of the T2000 client, and the user and password define thecorresponding authority of operation and management of the T2000.

V

VOA Variable Optical Attenuator. An attenuator in which the attenuation canbe varied.

W

Wander The long-term variations of the significant instants of a digital signalfrom their ideal position in time (where long-term implies that thesevariations are of frequency less than 10Hz).

Wavelengthdivisionmultiplexing

A means of increasing the capacity of fiber-optic data transmissionsystems through the multiplexing of multiple wavelengths of light.WDM systems support the multiplexing of as many as four wavelengths.

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WDM Wavelength-Division Multiplexing. WDM technology utilizes thecharacteristics of broad bandwidth and low attenuation of single modeoptical fiber, employs multiple wavelengths as carriers, and allowsmultiple channels to transmit simultaneously in a single fiber.

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F Acronyms and Abbreviations

A

ADM Add and drop multiplexer

AGC Automatic gain control

ALC Automatic level control

ALS Automatic laser shutdown

APE Automatic power equilibrium

APS Automatic protection switching

ASE Amplified spontaneous emission

AWG Arrayed waveguide grating

B

BA Booster amplifier

BER Bit error ratio

C

CLNS Connectionless network service

CMI Coded mark inversion

CPU Central processing unit

CRC Cyclical redundancy check

CRZ Chirped return to zero

CSES Continuous severely errored second

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description F Acronyms and Abbreviations

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D

DCC Data communication channel

DCF Dispersion compensation fiber

DCM Dispersion compensation module

DCN Data communication network

DDN Digital data network

DFB Distributed feedback

DSP Digital signal processing

DSCR Dispersion slope compensation rate

DWDM Dense wavelength division multiplexing

DRZ Differential phase return to zero

E

ECC Embedded control channel

EDFA Erbium-doped fiber amplifier

EFEC Enhanced forward error correction

ELH Extra long haul

EMC Electromagnetic compatibility

ETSI European Telecommunication Standards Institute

F

FEC Forward error correction

FWM Four-wave mixing

G

GE Gigabit Ethernet

GFF Gain flattening filter

GUI Graphic user interface

I

IEEE Institute of Electrical and Electronic Engineers

F Acronyms and Abbreviations

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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IPA Intelligent power adjustment

ITU-T International Telecommunication Union-TelecommunicationStandardisation Sector

L

LAN Local area network

LCN Local communication network

LCT Local craft terminal

LD Laser diode

LHP Long Hop

M

MCF Message communication function

MD Mediation device

MPI-R Main path interface at the receiver

MPI-S Main path interface at the transmitter

MQW Multi-quantum well

N

NE Network element

NF Noise figure

NRZ Non return to zero

O

OA Optical amplifier

OADM Optical add and drop multiplexer

OAM Operation, administration and maintenance

OAMS Optical fiber line automatic monitoring system

OD Optical demultiplexing

ODF Optical distribution frame

OEQ Optical equaliser

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description F Acronyms and Abbreviations

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OHP Overhead processing

OLA Optical line amplifier

OM Optical multiplexing

OMS Optical multiplex section

ORL Optical return loss

OS Operations system

OSI Open systems interconnection

OSNR Optical signal to noise ratio

OTDR Optical time domain reflectometer

OTM Optical terminal multiplexer

OTS Optical transmission section

OTT Optical tunable transponder

OTU Optical transponder unit

P

PDH Plesiochronous digital hierarchy

PDL Polarization dependent loss

PIN Positive intrinsic negative

PMD Polarization mode dispersion

POS Packet Over SDH/SONET

R

RS Reed-Solomon

RTU Remote test unit

Q

QA Q adaptation

S

SBS Stimulated Brillouin Scattering

SCC System control & communication

F Acronyms and Abbreviations

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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SDH Synchronous digital hierarchy

SLIP Serial line internet protocol

SLM Single longitudinal mode

SONET Synchronous optical network

SPM Self phase modulation

SRS Stimulated Raman Scattering

STM Synchronous transport module

Super CRZ Super chirped return to zero

T

TCP/IP Transport control protocol / Internet protocol

TDM Time division multiplexing

TEC Thermoelectric cool

TMN Telecommunication management network

TTL Transistor-transistor logic

X

XPM Cross phase modulation

W

WDM Wavelength division multiplexing

WS Work station

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Index

Symbols/Numerics192-channel system in C Band, 3-172.5G ADM technology, 3-2740G transmission system, 3-15Aadministration and maintenance

network management, 9-12optical fiber line automatic monitoring, 9-6optical supervisory channel administration, 9-4supervision and administration module, 9-3system maintenance, 9-12

AFEC, C-8automatic laser shutdown, 3-21automatic monitoring, 3-36auxiliary interface, 11-5

Bboard

power consumption, B-1slot, B-1weight, B-1

board software, 5-3

Ccabinet

configuration, 4-4specifications, 11-3structure, 4-2

classification of bands, 1-10classification of system types, 1-3clock transmission, 2-8communication protocol, 5-2compliant standard

environment related, D-5IEEE, D-4IETF, D-5international standard, D-5ITU-T, D-2laser security standards, D-4

DD40

application and description, 4-22dimension, 11-197laser safety level, 11-197power consumption, 11-197specification, 11-197weight, 11-197

D48application and description, 4-22dimension, 11-198laser safety level, 11-198power consumption, 11-198specification, 11-198weight, 11-198

DCM and DCM frame specifications, 11-7DCN management, 3-32DCP

application and description, 4-32dimension, 11-253laser safety level, 11-253power consumption, 11-253specification, 11-253weight, 11-253

DGEapplication and description, 4-36dimension, 11-268laser safety level, 11-268power consumption, 11-268specification, 11-268weight, 11-268

DSEapplication and description, 4-36dimension, 11-269laser safety level, 11-269power consumption, 11-269specification, 11-269weight, 11-269

DWCapplication and description, 4-25dimension, 11-209laser safety level, 11-209

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power consumption, 11-209specification, 11-209weight, 11-209

EEDWC

application and description, 4-25dimension, 11-211laser safety level, 11-211power consumption, 11-211specification, 11-211weight, 11-211

ELOGapplication and description, 4-9dimension, 11-54laser safety level, 11-54power consumption, 11-54specification, 11-54weight, 11-54

ELOGSapplication and description, 4-9dimension, 11-58laser safety level, 11-58power consumption, 11-58specification, 11-58weight, 11-58

EMC, A-2enhanced subrack

slot distribution, 4-6specifications, 11-4structure, 4-5

environment related standard, D-5environment requirement

operation environment, A-8storage environment, A-4transport environment, A-6

Erbium-doped fiber amplifier, C-9ETMX

application and description, 4-9dimension, 11-63laser safety level, 11-63power consumption, 11-63specification, 11-63weight, 11-63

ETMXSapplication and description, 4-9dimension, 11-67laser safety level, 11-67power consumption, 11-67specification, 11-67weight, 11-67

FFCE

application and description, 4-9dimension, 11-72

laser safety level, 11-72power consumption, 11-72specification, 11-72weight, 11-72

FDGapplication and description, 4-9dimension, 11-75laser safety level, 11-75power consumption, 11-75specification, 11-75weight, 11-75

FEC, C-8FEC function, 3-20FIU

application and description, 4-22dimension, 11-200laser safety level, 11-200power consumption, 11-200specification, 11-200weight, 11-200

FMUapplication and description, 4-35dimension, 11-264laser safety level, 11-264power consumption, 11-264specification, 11-264weight, 11-264

FOADMparallel OADM

configuration principle, 6-36signal flow, 6-36structure, 6-36typical configurations, 6-36

serial OADMconfiguration principle, 6-32signal flow, 6-32structure, 6-32typical configurations, 6-32

forward error correction, C-8

GGE ADM technology, 3-28GFU

application and description, 4-36dimension, 11-270laser safety level, 11-270power consumption, 11-270specification, 11-270weight, 11-270

guaranteed reliabilityequipment-level protection, 2-7network level protection, 2-7

HHBA

application and description, 4-27

Index

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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dimension, 11-225laser safety level, 11-225power consumption, 11-225specification, 11-225weight, 11-225

HUB and HUB frame specifications, 11-9

IIEEE standard, D-4IETF standard, D-5IMX4

application and description, 4-9dimension, 11-79laser safety level, 11-79power consumption, 11-79specification, 11-79weight, 11-79

IMX4Sapplication and description, 4-9dimension, 11-82laser safety level, 11-82power consumption, 11-82specification, 11-82weight, 11-82

independent OLA subrack, 3-27slot distribution, 4-7specifications, 11-5structure, 4-6

international standard, D-5ITL

application and description, 4-22dimension, 11-201laser safety level, 11-201power consumption, 11-201specification, 11-201weight, 11-201

ITU-T standard, D-2

Llaser class, 11-50laser security standards, D-4LBE

application and description, 4-9dimension, 11-84laser safety level, 11-84power consumption, 11-84specification, 11-84weight, 11-84

LBESapplication and description, 4-9dimension, 11-88laser safety level, 11-88power consumption, 11-88specification, 11-88weight, 11-88

LBF

application and description, 4-9dimension, 11-91laser safety level, 11-91power consumption, 11-91specification, 11-91weight, 11-91

LBFSapplication and description, 4-9dimension, 11-97laser safety level, 11-97power consumption, 11-97specification, 11-97weight, 11-97

LDGapplication and description, 4-9dimension, 11-102laser safety level, 11-102power consumption, 11-102specification, 11-102weight, 11-102

LOGapplication and description, 4-9dimension, 11-106laser safety level, 11-106power consumption, 11-106specification, 11-106weight, 11-106

LOGSapplication and description, 4-9dimension, 11-109laser safety level, 11-109power consumption, 11-109specification, 11-109weight, 11-109

LOMapplication and description, 4-9dimension, 11-112laser safety level, 11-112power consumption, 11-112specification, 11-112weight, 11-112

LOMSapplication and description, 4-9dimension, 11-117laser safety level, 11-117power consumption, 11-117specification, 11-117weight, 11-117

LPT protocol check, 3-25LQM

application and description, 4-9dimension, 11-121laser safety level, 11-121power consumption, 11-121specification, 11-121weight, 11-121

LR40application and description, 4-9

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description Index

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dimension, 11-127laser safety level, 11-127power consumption, 11-127specification, 11-127weight, 11-127

LRFdimension, 11-129laser safety level, 11-129power consumption, 11-129specification, 11-129weight, 11-129

LRFDapplication and description, 4-9dimension, 11-131laser safety level, 11-131power consumption, 11-131specification, 11-131weight, 11-131

LRFSdimension, 11-133laser safety level, 11-133power consumption, 11-133specification, 11-133weight, 11-133

LU40application and description, 4-9dimension, 11-135laser safety level, 11-135power consumption, 11-135specification, 11-135weight, 11-135

LU40Sapplication and description, 4-9dimension, 11-137laser safety level, 11-137power consumption, 11-137specification, 11-137weight, 11-137

LW40application and description, 4-9dimension, 11-140laser safety level, 11-140power consumption, 11-140specification, 11-140weight, 11-140

LWC1application and description, 4-9dimension, 11-142laser safety level, 11-142power consumption, 11-142specification, 11-142weight, 11-142

LWFapplication and description, 4-9dimension, 11-147laser safety level, 11-147power consumption, 11-147specification, 11-147

weight, 11-147LWFD

application and description, 4-9LWFS

application and description, 4-9dimension, 11-152laser safety level, 11-152power consumption, 11-152specification, 11-152weight, 11-152

LWMapplication and description, 4-9dimension, 11-157laser safety level, 11-157power consumption, 11-157specification, 11-157weight, 11-157

LWMRapplication and description, 4-9dimension, 11-161laser safety level, 11-161power consumption, 11-161specification, 11-161weight, 11-161

LWXapplication and description, 4-9dimension, 11-163laser safety level, 11-163power consumption, 11-163specification, 11-163weight, 11-163

LWXRapplication and description, 4-9dimension, 11-167laser safety level, 11-167power consumption, 11-167specification, 11-167weight, 11-167

MM40

application and description, 4-22dimension, 11-204laser safety level, 11-204power consumption, 11-204specification, 11-204weight, 11-204

M48application and description, 4-22dimension, 11-205laser safety level, 11-205power consumption, 11-205specification, 11-205weight, 11-205

main optical path specificationstype I system, 11-10type II system, 11-11

Index

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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type III system, 11-17type IV system, 11-24type IX system, 11-42type V system, 11-25type VI system, 11-27type VII system, 11-31type VIII system, 11-40

management of optical powerALC

configuration principle, 8-24function description, 8-13function implementation, 8-13networking application, 8-23

APEconfiguration principle, 8-26, 8-27function description, 8-24function implementation, 8-25networking application, 8-26

EAPEconfiguration principle, 8-31function description, 8-29function implementation, 8-29networking application, 8-30

IPAconfiguration principle, 8-5function description, 8-2function implementation, 8-3networking application, 8-4

IPA of Raman systemconfiguration principle, 8-11function description, 8-6function implementation, 8-8networking application, 8-10

MCAapplication and description, 4-33dimension, 11-258laser safety level, 11-258power consumption, 11-258specification, 11-258weight, 11-258

MR2application and description, 4-25dimension, 11-212laser safety level, 11-212power consumption, 11-212specification, 11-212weight, 11-212

MR8application and description, 4-25dimension, 11-214laser safety level, 11-214power consumption, 11-214specification, 11-214weight, 11-214

MWAapplication and description, 4-35dimension, 11-265laser safety level, 11-265

power consumption, 11-265specification, 11-265weight, 11-265

MWFapplication and description, 4-35dimension, 11-266laser safety level, 11-266power consumption, 11-266specification, 11-266weight, 11-266

NNE security management features, 9-13NE software, 5-3network management channel, 7-33

interconnection, 7-35protection information, 7-33

network management systemT2000, 2-11

networking and applicationschain network, 1-12point-to-point network, 1-12ring network, 1-12

networking and design considerations, 10-1NTP technology, 3-30

OOAU

application and description, 4-27dimension, 11-227laser safety level, 11-227power consumption, 11-227specification, 11-227weight, 11-227

OBUapplication and description, 4-27dimension, 11-237laser safety level, 11-237power consumption, 11-237specification, 11-237weight, 11-237

OCPapplication and description, 4-32dimension, 11-254laser safety level, 11-254power consumption, 11-254specification, 11-254weight, 11-254

OEQoptical dispersion equalizer

configuration principle, 6-60signal flow, 6-60structure, 6-60typical configurations, 6-60

optical power equalizerconfiguration principle, 6-57

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description Index

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signal flow, 6-57structure, 6-57typical configurations, 6-57

OLAconfiguration principle, 6-26signal flow, 6-26structure, 6-26typical configurations, 6-26

OLPapplication and description, 4-32dimension, 11-255laser safety level, 11-255power consumption, 11-255specification, 11-255weight, 11-255

optical power management, 3-25OPU

application and description, 4-27dimension, 11-241laser safety level, 11-241power consumption, 11-241specification, 11-241weight, 11-241

OTM40G transmission system

configuration principle, 6-15signal flow, 6-15structure, 6-15typical configurations, 6-15

C+L1600G systemconfiguration principle, 6-18signal flow, 6-18structure, 6-18typical configurations, 6-18

C+L800G systemconfiguration principle, 6-22signal flow, 6-22structure, 6-22typical configurations, 6-22

C1600G/C1920G systemconfiguration principle, 6-10signal flow, 6-10structure, 6-10typical configurations, 6-10

C400G/C800G systemconfiguration principle, 6-2signal flow, 6-2structure, 6-2typical configurations, 6-2

C480G/C960G systemconfiguration principle, 6-7signal flow, 6-7structure, 6-7typical configurations, 6-7

L400G systemconfiguration principle, 6-23signal flow, 6-23structure, 6-23

typical configurations, 6-23LHP system

configuration principle, 6-24signal flow, 6-24structure, 6-24typical configurations, 6-24

OTN, C-2features, C-3technical advantage, C-2technical background, C-2

OTN signal processing, 3-18

PPBU

application and description, 4-32dimension, 11-257power consumption, 11-257specification, 11-257weight, 11-257

performance monitoringperformance monitoring of network, 2-9performance monitory of access services, 2-9

PMUapplication and description, 4-29dimension, 11-248power consumption, 11-248specification, 11-248weight, 11-248

position in networks, 1-2power box specifications, 11-4power consumption, B-1PRBS error detection function, 3-38protection

equipment level protectioncentralized power protection, 7-2DC input protection, 7-2secondary power protection, 7-2

network level protection1+1 wavelength protection at client, 7-111:N optical channel protection, 7-29inter-board wavelength protection, 7-15inter-subrack 1+1 optical channel protection,7-19optical line protection, 7-7WXCP, 7-23

RRaman amplifier, C-9

working principle, C-9REG

configuration principle, 6-55signal flow, 6-55structure, 6-55typical configurations, 6-55

RMU9application and description, 4-25

Index

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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dimension, 11-215laser safety level, 11-215power consumption, 11-215specification, 11-215weight, 11-215

ROADMC400G system (WB mode)

configuration principle, 6-41signal flow, 6-41structure, 6-41typical configurations, 6-41

C400G system (WSS mode)configuration principle, 6-44signal flow, 6-44structure, 6-44typical configurations, 6-44

C800G system (WB mode)configuration principle, 6-52signal flow, 6-52structure, 6-52typical configurations, 6-52

C800G system (WSS mode)configuration principle, 6-52signal flow, 6-52structure, 6-52typical configurations, 6-52

WB Mode, 3-3WSS Mode, 3-5

RPAapplication and description, 4-27dimension, 11-243laser safety level, 11-243power consumption, 11-243specification, 11-243weight, 11-243

RPCapplication and description, 4-27dimension, 11-245laser safety level, 11-245power consumption, 11-245specification, 11-245weight, 11-245

SSC1

application and description, 4-30dimension, 11-249laser safety level, 11-249power consumption, 11-249specification, 11-249weight, 11-249

SC2application and description, 4-30dimension, 11-250laser safety level, 11-250power consumption, 11-250specification, 11-250

weight, 11-250SCC

application and description, 4-29dimension, 11-247power consumption, 11-247specification, 11-247weight, 11-247

SCSapplication and description, 4-32dimension, 11-257laser safety level, 11-257power consumption, 11-257specification, 11-257weight, 11-257

service accesstypes of service access, 2-5

SFP, 3-39slot, B-1snmp, 2-11software architecture overview, 5-2software package loading, 3-37ST1

application and description, 4-30dimension, 11-251laser safety level, 11-251power consumption, 11-251specification, 11-251weight, 11-251

ST2application and description, 4-30dimension, 11-252laser safety level, 11-252power consumption, 11-252specification, 11-252weight, 11-252

supervisory channel, 3-19system operation, 9-2

TTMR

application and description, 4-9dimension, 11-169laser safety level, 11-169power consumption, 11-169specification, 11-169weight, 11-169

TMRSapplication and description, 4-9dimension, 11-171laser safety level, 11-171power consumption, 11-171specification, 11-171weight, 11-171

TMXapplication and description, 4-9dimension, 11-174laser safety level, 11-174

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power consumption, 11-174specification, 11-174weight, 11-174

TMX40application and description, 4-9dimension, 11-180laser safety level, 11-180power consumption, 11-180specification, 11-180weight, 11-180

TMX40Sapplication and description, 4-9dimension, 11-185laser safety level, 11-185power consumption, 11-185specification, 11-185weight, 11-185

TMXSapplication and description, 4-9dimension, 11-177laser safety level, 11-177power consumption, 11-177specification, 11-177weight, 11-177

transmission abilitytransmission capacity, 2-2transmission distance, 2-4

TRC1application and description, 4-9dimension, 11-190laser safety level, 11-190power consumption, 11-190specification, 11-190weight, 11-190

TRC2application and description, 4-9

tunable wavelengths, 3-21

VV40

application and description, 4-22dimension, 11-206laser safety level, 11-206power consumption, 11-206specification, 11-206weight, 11-206

V48application and description, 4-22dimension, 11-207laser safety level, 11-207power consumption, 11-207specification, 11-207weight, 11-207

VA2application and description, 4-34dimension, 11-261laser safety level, 11-261

power consumption, 11-261specification, 11-261weight, 11-261

VA4application and description, 4-34dimension, 11-262laser safety level, 11-262power consumption, 11-262specification, 11-262weight, 11-262

VOAapplication and description, 4-34dimension, 11-262laser safety level, 11-262power consumption, 11-262specification, 11-262weight, 11-262

Wwavelength and frequency of optical channels, 11-44weight, B-1WMU

application and description, 4-33dimension, 11-260laser safety level, 11-260power consumption, 11-260specification, 11-260weight, 11-260

WSD5application and description, 4-25dimension, 11-216laser safety level, 11-216power consumption, 11-216specification, 11-216weight, 11-216

WSD9application and description, 4-25dimension, 11-218laser safety level, 11-218power consumption, 11-218specification, 11-218weight, 11-218

WSM5application and description, 4-25dimension, 11-219laser safety level, 11-219power consumption, 11-219specification, 11-219weight, 11-219

WSM9application and description, 4-25dimension, 11-221laser safety level, 11-221power consumption, 11-221specification, 11-221weight, 11-221

WSMD2

Index

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystem

Product Description

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application and description, 4-25dimension, 11-224laser safety level, 11-224power consumption, 11-224specification, 11-224weight, 11-224

WSMD4application and description, 4-25dimension, 11-223laser safety level, 11-223power consumption, 11-223specification, 11-223weight, 11-223

OptiX BWS 1600G Backbone DWDM Optical TransmissionSystemProduct Description Index

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i-9