product change notification - future electronics
TRANSCRIPT
PCN Template- BlankDocument No. 001-12089 Rev. *H Page 1 of 2
Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600
PRODUCT CHANGE NOTIFICATION
PCN: PCN174402 Date: December 12, 2017
Subject: Qualification of NiPdAu Lead Finish for 88-Lead QFN CYUSB3312 Product To: FUTURE ELECTRONICS FUTURE ELE [email protected] Change Type: Major Description of Change: Cypress announces the qualification of NiPdAu leadfinish for 88-Lead QFN devices CYUSB3312-88LTXC/T and CYUSB3312-88LTXI/T. This will be in addition to the current qualification of the parts with Matte Sn lead finish. This qualification is part of the flexible manufacturing initiatives which allow Cypress to meet its delivery commitments in dynamic and changing market conditions. CYUSB3312-88LTXC/T and CYUSB3312-88LTXI/T will use the following Bill of Materials (BOM):
Material Current BOM Additional BOM for Qualification
Mold Compound Sumitomo G770HCD Sumitomo G770HCD
Lead Finish Matte Sn NiPdAu
Die Attach Epoxy Henkel 8600 Henkel 8600
Bond Wire 0.8 mil CuPd 0.8 mil CuPd
There are no changes to ordering part numbers. Product datasheets remain the same and can be downloaded from Cypress website (www.cypress.com). Benefit of Change: Cypress will have the added capability to meet market demand with any of the above type of lead finishes. Part Numbers Affected: 4 See the attached ‘Affected Parts List’ file for the part numbers affected by this change.
Document No. 001-12089 Rev. *H Page 2 of 2
Qualification Status: The changes listed in this PCN have been qualified through a series of tests documented in the Qualification Test Plan (QTP) report 154702. The qualification report can be found as attachments to this notification or by visiting www.cypress.com and typing the QTP number in the keyword search window. Sample Status: Qualification samples are built ahead of time for the part numbers affected by this change. Please review the attached file for the affected part numbers with their associated sample ordering part numbers. The same sample ordering part number will be available for all marketing part numbers covered by this PCN. Please contact your Sales Representative as soon as possible, but within 30 days of the date of this PCN, to place any sample orders. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of the affected part numbers in the attached file will be supplied with any of the lead finishes. Anticipated Impact: Products manufactured with NiPdAu lead finish are completely compatible with existing products from a functional, parametric, and quality performance perspective. Cypress recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application. Method of Identification: There will be no changes to the part number. Cypress maintains traceability of product to wafer level, including wafer fabrication location and assembly location through the lot number marked on the package. There will be no changes to the ordering codes or marking on production material after the change implementation date. Response Required: No response is required. For additional information regarding this change, contact your local sales representative or contact the PCN Administrator at [email protected]. Sincerely, Cypress PCN Administration
CYUSB3312-88LTXC 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXCT 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXI 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXIT 88-pin QFN CYUSB3312-88LTXCKU
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 1 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Cypress Package Code LT Body Size (mil/mm) 10x10x1.0 mm
Package Weight – Site 1 299.7483 mg Package Weight – Site 2 B1: 297.3003 mg B2: 297.3001 mg
Package Weight – Site 3 288.5703 mg Package Weight – Site 4 B1: 306.2256 mg B2: 285.6470 mg
SUMMARY
The 88L – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Seoul Korea Package Qualification Report # 113802 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88-Amkor Seoul
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 2 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Phosphorus (P) 7723-14-0 0.0540 0.0300 180 0.0180
Zinc(Zn) 7440-66-6 0.2150 0.1200 717 0.0717
Frame Plating Frame Plating
Gold-Silver (Au-Ag)
7440-57-5 7440-22-4
t-Butyl phenyl glycidyl ether
Phenolic hardener A
Phenolic hardener B
Butyl cellosolve acetate
Silver (Ag) 7440-22-4 2.4100 84.0000 8040 0.8040
Die Circuit Silicon 7440-21-3 14.4500 100.0000 48207 4.8207
Wire Interconnect Gold (Au) 7440-57-5 2.3500 99.0000 7840 0.7840
Palladium (Pd) 7440-05-3 0.0200 1.0000 67 0.0067
Mold Compound
Silica, vitreous (SiO2)
Carbon black 1333-86-4 0.2968 0.3000 990 0.0990
Package Weight (mg): 299.7483 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 3 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Type Material Lead PPM
Others
Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R
Protective Band < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PROB-R
Shipping and inner/ pizza box
< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R
Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R
Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-BUBP-R
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 4 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report #113804 & 113803 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88- CML
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 5 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Lead Finish External Plating
Die Attach
Carbocyclic Acrylate Trade Secret 0.2037 20.0000 685 0.0685
Bismaleimide Resin Trade Secret 0.0204 2.0000 69 0.0069
Additive Trade Secret 0.0204 2.0000 69 0.0069
Acrylate ester Trade Secret 0.0204 2.0000 69 0.0069
Die Circuit Silicon 7440-21-3 14.2567 100.0 47,954 4.7954
Wire Interconnect Gold 7440-57-5 7.3809 99.0000 24,826 2.4826
Palladium 7440-05-3 0.0746 1.0000 251 0.0251
Mold Compound
Phenol Resin Trade Secret 6.0135 5.0000 20,227 2.0227
Epoxy Resin Trade Secret 8.4189 7.0000 28,318 2.8318
Carbon Black 1333-86-4 0.3007 0.2500 1,011 0.1011
Package Weight (mg): 297.3003 % Total: 100.0000
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 6 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Lead Finish External Plating
Die Attach
Carbocyclic Acrylate Trade Secret 0.2037 20.0000% 685 0.0685%
Bismaleimide Resin Trade Secret 0.0204 2.0000% 69 0.0069%
Additive Trade Secret 0.0204 2.0000% 69 0.0069%
Acrylate ester Trade Secret 0.0204 2.0000% 69 0.0069%
Die Circuit Silicon 7440-21-3 14.2567 100.0000% 47,954 4.7954%
Wire Interconnect Gold 7440-57-5 7.3809 99.0000% 24,826 2.4826%
Palladium 7440-05-3 0.0746 1.0000% 251 0.0251%
Mold Compound
Phenol Resin Trade Secret 5.8962 5.0000% 19,832 1.9832%
Epoxy Resin Trade Secret 8.2547 7.0000% 27,766 2.7766%
Carbon Black 1333-86-4 0.2948 0.2500% 992 0.0992%
Package Weight (mg): 297.3001 % Total: 100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type Material Lead PPM
Others
Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R
Protective Band < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PROB-R
Shipping and inner/ pizza box
< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R
Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R
Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-BUBP-R
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 7 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 3: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 124301 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88-ASE Taiwan
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 8 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3) Using copper LF and CuPd Wire
Material Purpose of
material
Phosphorus (P) 7723-14-0 0.0400 0.0300 127 0.0127
Zinc(Zn) 7440-66-6 0.1500 0.1200 510 0.0510
Frame Plating Frame Plating
Polybutadiene Derivitive
Butadiene copolymer
Acrylate Trade Secret 0.0600 6.0000 268 0.0268
Peroxide Trade Secret 0.0100 1.0000 36 0.0036
Additive Trade Secret 0.0100 1.0000 45 0.0045
Silver (Ag) 7440-22-4 0.7200 72.0000 2,498 0.2498
Die Circuit Silicon 7440-21-3 6.7500 100.0000 23,390 2.3390
Wire Interconnect Copper (Cu) 7440-50-8 1.3100 99.9800 4,538 0.4538
Palladium (Pd) 7440-05-3 0.0003 0.0200 9,095 0.9095
Mold Compound
Silica, vitreous (SiO2)
Carbon black 1333-86-4 0.4600 0.2993 1,598 0.1598
Package Weight (mg): 288.5703 % Total: 100.0000
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 9 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Type Material Lead PPM
Tray Tray < 5.0 < 5.0 < 5.0 < 10.0 <50.0 <45.0 CoA-TRAY-R CoA-TRAY-M
Others Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 CoA-SBAG –R
CoA-SBAG –M
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 10 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 4: UTAC Thailand (UTL) Package Qualification Report # 141304 & 154702 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88- UTAC
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 11 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Material Purpose Substance
Composition CAS Number
Weight by mg
material
PPM
Leadfinish External Plating Tin 7440-31-5 7.3666 100.0000 24,056 2.4056
Die Attach Adhesive
7534-94-3
1.2850
42594-17-2
1.2850
Palladium 7440-05-3 0.0400 1.7500 131 0.0131
Mold compound
Epoxy resin Trade secret 4.8847 4.7000 15,951 1.5951
Phenol resin Trade secret
Package Weight (mg): 306.2256 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 12 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Material Purpose Substance
Composition CAS Number
Weight by mg
material
PPM
Leadfinish External Plating
Die Attach Adhesive
7534-94-3
1.2850
42594-17-2
1.2850
Palladium 7440-05-3 0.0400 1.7500 140 0.0140
Mold compound
Epoxy resin Trade secret 4.8847 4.7000 17,100 1.7100
Phenol resin Trade secret
Package Weight (mg): 285.6470 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 13 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Type Material Lead PPM
Tray Tray < 2.0 < 2.0 < 2.0 < 2.0 --------- --------- CoA-TRAY-R
Others
Moisture Barrier bag
Protective Band
Shipping and Inner Box
Dessicant < 10.0 < 2.0 < 2.0 < 1.0 < 3.0 < 3.0 CoA-DESS-R
Bubble Pack < 2.0 < 2.0 < 2.0 < 2.0 < 100.0 < 90.0 CoA-BUBP-R
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 14 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Document History Page
Document Title: 88L - QFN 10X10X1.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number: 001-70265
Description of Change
** 3287169 HLR/ JSO
*A 3428782 MAHA Added data for B2 – Assembly site 2.
*B 3544010 JARG Corrected header from 10x101.0mm to 10x10x1.0mm. Corrected Body Size from 8x8x1.0mm to 10x10x1.0mm.
*C 4066937 YUM Added assembly site name in the assembly heading in site 1and 2. Changed assembly code to assembly site name in site 1 and 2.
*D 4132519 MLA Add assembly site 3.
*E 4444285 MLA Add assembly site 4.
*F 4962956 HLR AVE
Changed the substances with “-------------“to “Trade Secret”. Removed distribution and posting from the document history page.
*G 5052137 JVP Added data for B2 for Assembly site 4
*H 5484443 HLR Changed Cypress Logo. Changed the substances with Proprietary to “Trade Secret". Corrected the CAS Number for Palladium substance.
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
88 QFN (10x10x1.0mm)
UTL-Thailand (UT)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE
Prepared By: Josephine Pineda (JYF)
Reviewed By: Rene Rodgers (RT)
Sr. Reliability Engineer Sr. MTS Reliability Engineer
Approved By: Don Darling (DCDA) Reliability Director
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
154702
Qualification of 88 QFN (LT88B, 10x10x1.0mm) using EME- G770 mold compound, 8600 die attach epoxy, NiPdAu leadfinish, 0.8 mil CuPd wire at UTL-Thailand (UT) , with MSL 3, 260°C reflow temperature
Dec. 2015
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Package Designation: LT88B
Package Outline, Type, or Name: 88 QFN (Quad Flat No Lead), 10x10x1.0mm
Mold Compound Name/Manufacturer: EME- G770/Sumitomo
Mold Compound Flammability Rating: UL-94 V-0
Oxygen Rating Index: 54%
Lead Frame Material: Copper
Die Attach Supplier: Henkel
Die Attach Material: 8600
Bond Diagram Designation 002-03571
Wire Bond Method: Thermosonic
Wire Material/Size: CuPd/0.8 mil
Package Cross Section Yes/No: No
Assembly Process Flow: 002-10511
MSL Level 3
Reflow Profile 260C
ELECTRICAL TEST/FINISH DESCRIPTION
Note: Please contact a Cypress Representative for other packages availability.
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
Stress/Test Test Condition (Temp/Bias)
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Ball Shear JESD22-B116 P
Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package
P
Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack P
Final Visual JESD22-B101 P
High Accelerated Saturation Test (HAST)
JEDEC STD 22-A110: 130°C, 85%RH, 1.32/3.63V Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Internal Visual MIL-STD-883-2014 P
Pressure Cooker JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
X-Ray MIL-STD-883 - 2012 P
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Reliability Test Data QTP #: 154702
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
STRESS: CROSS SECTION
STRESS: DYE PENETRANT TEST
STRESS: FINAL VISUAL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 951 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand COMP 940 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand COMP 973 0
CS8481AA (7CP07510C) 9422015 611533500 UT-Thailand COMP 955 0
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63/1.32V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 96 28 0
STRESS: INTERNAL VISUAL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 5 0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 168 80 0
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 288 80 0
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Reliability Test Data QTP #: 154702
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: SOLDERABILITY
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 6 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand COMP 6 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand COMP 6 0
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 500 80 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand 500 80 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand 500 79 0
STRESS: X-RAY
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Reliability Test Data ER #: 162041
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 96 25 0
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 300 25 0
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 200 25 0
Document No.002-10571 Rev. *A ECN # 5322241
Document History Page
Document Title: QTP# 154702: 88 QFN (10X10X1.0MM) NIPDAU LEADFINISH, CUPD WIRE, MSL3, 260C REFLOW, UTL-THAILAND (UT)
Document Number: 002-10571
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
** 5066035 JYF Initial spec release.
Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600
PRODUCT CHANGE NOTIFICATION
PCN: PCN174402 Date: December 12, 2017
Subject: Qualification of NiPdAu Lead Finish for 88-Lead QFN CYUSB3312 Product To: FUTURE ELECTRONICS FUTURE ELE [email protected] Change Type: Major Description of Change: Cypress announces the qualification of NiPdAu leadfinish for 88-Lead QFN devices CYUSB3312-88LTXC/T and CYUSB3312-88LTXI/T. This will be in addition to the current qualification of the parts with Matte Sn lead finish. This qualification is part of the flexible manufacturing initiatives which allow Cypress to meet its delivery commitments in dynamic and changing market conditions. CYUSB3312-88LTXC/T and CYUSB3312-88LTXI/T will use the following Bill of Materials (BOM):
Material Current BOM Additional BOM for Qualification
Mold Compound Sumitomo G770HCD Sumitomo G770HCD
Lead Finish Matte Sn NiPdAu
Die Attach Epoxy Henkel 8600 Henkel 8600
Bond Wire 0.8 mil CuPd 0.8 mil CuPd
There are no changes to ordering part numbers. Product datasheets remain the same and can be downloaded from Cypress website (www.cypress.com). Benefit of Change: Cypress will have the added capability to meet market demand with any of the above type of lead finishes. Part Numbers Affected: 4 See the attached ‘Affected Parts List’ file for the part numbers affected by this change.
Document No. 001-12089 Rev. *H Page 2 of 2
Qualification Status: The changes listed in this PCN have been qualified through a series of tests documented in the Qualification Test Plan (QTP) report 154702. The qualification report can be found as attachments to this notification or by visiting www.cypress.com and typing the QTP number in the keyword search window. Sample Status: Qualification samples are built ahead of time for the part numbers affected by this change. Please review the attached file for the affected part numbers with their associated sample ordering part numbers. The same sample ordering part number will be available for all marketing part numbers covered by this PCN. Please contact your Sales Representative as soon as possible, but within 30 days of the date of this PCN, to place any sample orders. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of the affected part numbers in the attached file will be supplied with any of the lead finishes. Anticipated Impact: Products manufactured with NiPdAu lead finish are completely compatible with existing products from a functional, parametric, and quality performance perspective. Cypress recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application. Method of Identification: There will be no changes to the part number. Cypress maintains traceability of product to wafer level, including wafer fabrication location and assembly location through the lot number marked on the package. There will be no changes to the ordering codes or marking on production material after the change implementation date. Response Required: No response is required. For additional information regarding this change, contact your local sales representative or contact the PCN Administrator at [email protected]. Sincerely, Cypress PCN Administration
CYUSB3312-88LTXC 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXCT 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXI 88-pin QFN CYUSB3312-88LTXCKU
CYUSB3312-88LTXIT 88-pin QFN CYUSB3312-88LTXCKU
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 1 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Cypress Package Code LT Body Size (mil/mm) 10x10x1.0 mm
Package Weight – Site 1 299.7483 mg Package Weight – Site 2 B1: 297.3003 mg B2: 297.3001 mg
Package Weight – Site 3 288.5703 mg Package Weight – Site 4 B1: 306.2256 mg B2: 285.6470 mg
SUMMARY
The 88L – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Seoul Korea Package Qualification Report # 113802 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88-Amkor Seoul
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 2 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Phosphorus (P) 7723-14-0 0.0540 0.0300 180 0.0180
Zinc(Zn) 7440-66-6 0.2150 0.1200 717 0.0717
Frame Plating Frame Plating
Gold-Silver (Au-Ag)
7440-57-5 7440-22-4
t-Butyl phenyl glycidyl ether
Phenolic hardener A
Phenolic hardener B
Butyl cellosolve acetate
Silver (Ag) 7440-22-4 2.4100 84.0000 8040 0.8040
Die Circuit Silicon 7440-21-3 14.4500 100.0000 48207 4.8207
Wire Interconnect Gold (Au) 7440-57-5 2.3500 99.0000 7840 0.7840
Palladium (Pd) 7440-05-3 0.0200 1.0000 67 0.0067
Mold Compound
Silica, vitreous (SiO2)
Carbon black 1333-86-4 0.2968 0.3000 990 0.0990
Package Weight (mg): 299.7483 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 3 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Type Material Lead PPM
Others
Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R
Protective Band < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PROB-R
Shipping and inner/ pizza box
< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R
Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R
Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-BUBP-R
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 4 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report #113804 & 113803 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88- CML
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 5 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Lead Finish External Plating
Die Attach
Carbocyclic Acrylate Trade Secret 0.2037 20.0000 685 0.0685
Bismaleimide Resin Trade Secret 0.0204 2.0000 69 0.0069
Additive Trade Secret 0.0204 2.0000 69 0.0069
Acrylate ester Trade Secret 0.0204 2.0000 69 0.0069
Die Circuit Silicon 7440-21-3 14.2567 100.0 47,954 4.7954
Wire Interconnect Gold 7440-57-5 7.3809 99.0000 24,826 2.4826
Palladium 7440-05-3 0.0746 1.0000 251 0.0251
Mold Compound
Phenol Resin Trade Secret 6.0135 5.0000 20,227 2.0227
Epoxy Resin Trade Secret 8.4189 7.0000 28,318 2.8318
Carbon Black 1333-86-4 0.3007 0.2500 1,011 0.1011
Package Weight (mg): 297.3003 % Total: 100.0000
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 6 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Material Purpose of
material
Lead Finish External Plating
Die Attach
Carbocyclic Acrylate Trade Secret 0.2037 20.0000% 685 0.0685%
Bismaleimide Resin Trade Secret 0.0204 2.0000% 69 0.0069%
Additive Trade Secret 0.0204 2.0000% 69 0.0069%
Acrylate ester Trade Secret 0.0204 2.0000% 69 0.0069%
Die Circuit Silicon 7440-21-3 14.2567 100.0000% 47,954 4.7954%
Wire Interconnect Gold 7440-57-5 7.3809 99.0000% 24,826 2.4826%
Palladium 7440-05-3 0.0746 1.0000% 251 0.0251%
Mold Compound
Phenol Resin Trade Secret 5.8962 5.0000% 19,832 1.9832%
Epoxy Resin Trade Secret 8.2547 7.0000% 27,766 2.7766%
Carbon Black 1333-86-4 0.2948 0.2500% 992 0.0992%
Package Weight (mg): 297.3001 % Total: 100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type Material Lead PPM
Others
Shielding bag < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R
Protective Band < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-PROB-R
Shipping and inner/ pizza box
< 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-ABOX-R
Desiccant < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R
Bubble Pack < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-BUBP-R
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 7 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 3: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 124301 (See Note 1)
I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88-ASE Taiwan
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 8 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3) Using copper LF and CuPd Wire
Material Purpose of
material
Phosphorus (P) 7723-14-0 0.0400 0.0300 127 0.0127
Zinc(Zn) 7440-66-6 0.1500 0.1200 510 0.0510
Frame Plating Frame Plating
Polybutadiene Derivitive
Butadiene copolymer
Acrylate Trade Secret 0.0600 6.0000 268 0.0268
Peroxide Trade Secret 0.0100 1.0000 36 0.0036
Additive Trade Secret 0.0100 1.0000 45 0.0045
Silver (Ag) 7440-22-4 0.7200 72.0000 2,498 0.2498
Die Circuit Silicon 7440-21-3 6.7500 100.0000 23,390 2.3390
Wire Interconnect Copper (Cu) 7440-50-8 1.3100 99.9800 4,538 0.4538
Palladium (Pd) 7440-05-3 0.0003 0.0200 9,095 0.9095
Mold Compound
Silica, vitreous (SiO2)
Carbon black 1333-86-4 0.4600 0.2993 1,598 0.1598
Package Weight (mg): 288.5703 % Total: 100.0000
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 9 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
Type Material Lead PPM
Tray Tray < 5.0 < 5.0 < 5.0 < 10.0 <50.0 <45.0 CoA-TRAY-R CoA-TRAY-M
Others Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 <5.0 CoA-SBAG –R
CoA-SBAG –M
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 10 of 14
88L – QFN (10x10x1.0mm) (Saw Version)
Pb-Free Package
ASSEMBLY Site 4: UTAC Thailand (UTL) Package Qualification Report # 141304 & 154702 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds Weight by mg PPM Analysis Report
(Note 2)
CoA-LT88- UTAC
Lead and Lead Compounds 0 < 5.0
Mercury and Mercury Compounds 0 < 5.0
Polybrominated Biphenyls (PBB) 0 < 5.0
Polybrominated Diphenylethers (PBDE) 0 < 5.0
Asbestos 0 0 As per MSDS
Azo colorants 0 0 As per MSDS
Ozone Depleting Substances 0 0 As per MSDS
Polychlorinated Biphenyls (PCBs) 0 0 As per MSDS
Polychlorinated Napthalenes 0 0 As per MSDS
Radioactive Substances 0 0 As per MSDS
Shortchain Chlorinated Paraffins 0 0 As per MSDS
Tributyl Tin (TBT) and Triphenyl Tin (TPT) 0 0 As per MSDS
Tributyl Tin Oxide (TBTO) 0 0 As per MSDS
Formaldehyde 0 0 As per MSDS
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 11 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Material Purpose Substance
Composition CAS Number
Weight by mg
material
PPM
Leadfinish External Plating Tin 7440-31-5 7.3666 100.0000 24,056 2.4056
Die Attach Adhesive
7534-94-3
1.2850
42594-17-2
1.2850
Palladium 7440-05-3 0.0400 1.7500 131 0.0131
Mold compound
Epoxy resin Trade secret 4.8847 4.7000 15,951 1.5951
Phenol resin Trade secret
Package Weight (mg): 306.2256 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 12 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Material Purpose Substance
Composition CAS Number
Weight by mg
material
PPM
Leadfinish External Plating
Die Attach Adhesive
7534-94-3
1.2850
42594-17-2
1.2850
Palladium 7440-05-3 0.0400 1.7500 140 0.0140
Mold compound
Epoxy resin Trade secret 4.8847 4.7000 17,100 1.7100
Phenol resin Trade secret
Package Weight (mg): 285.6470 % Total: 100.0000
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 13 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Type Material Lead PPM
Tray Tray < 2.0 < 2.0 < 2.0 < 2.0 --------- --------- CoA-TRAY-R
Others
Moisture Barrier bag
Protective Band
Shipping and Inner Box
Dessicant < 10.0 < 2.0 < 2.0 < 1.0 < 3.0 < 3.0 CoA-DESS-R
Bubble Pack < 2.0 < 2.0 < 2.0 < 2.0 < 100.0 < 90.0 CoA-BUBP-R
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70265 Rev. *H Page 14 of 14
88L – QFN 10x10x1.0 mm (Saw Version)
Pb-Free Package
Document History Page
Document Title: 88L - QFN 10X10X1.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number: 001-70265
Description of Change
** 3287169 HLR/ JSO
*A 3428782 MAHA Added data for B2 – Assembly site 2.
*B 3544010 JARG Corrected header from 10x101.0mm to 10x10x1.0mm. Corrected Body Size from 8x8x1.0mm to 10x10x1.0mm.
*C 4066937 YUM Added assembly site name in the assembly heading in site 1and 2. Changed assembly code to assembly site name in site 1 and 2.
*D 4132519 MLA Add assembly site 3.
*E 4444285 MLA Add assembly site 4.
*F 4962956 HLR AVE
Changed the substances with “-------------“to “Trade Secret”. Removed distribution and posting from the document history page.
*G 5052137 JVP Added data for B2 for Assembly site 4
*H 5484443 HLR Changed Cypress Logo. Changed the substances with Proprietary to “Trade Secret". Corrected the CAS Number for Palladium substance.
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
88 QFN (10x10x1.0mm)
UTL-Thailand (UT)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE
Prepared By: Josephine Pineda (JYF)
Reviewed By: Rene Rodgers (RT)
Sr. Reliability Engineer Sr. MTS Reliability Engineer
Approved By: Don Darling (DCDA) Reliability Director
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
154702
Qualification of 88 QFN (LT88B, 10x10x1.0mm) using EME- G770 mold compound, 8600 die attach epoxy, NiPdAu leadfinish, 0.8 mil CuPd wire at UTL-Thailand (UT) , with MSL 3, 260°C reflow temperature
Dec. 2015
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Package Designation: LT88B
Package Outline, Type, or Name: 88 QFN (Quad Flat No Lead), 10x10x1.0mm
Mold Compound Name/Manufacturer: EME- G770/Sumitomo
Mold Compound Flammability Rating: UL-94 V-0
Oxygen Rating Index: 54%
Lead Frame Material: Copper
Die Attach Supplier: Henkel
Die Attach Material: 8600
Bond Diagram Designation 002-03571
Wire Bond Method: Thermosonic
Wire Material/Size: CuPd/0.8 mil
Package Cross Section Yes/No: No
Assembly Process Flow: 002-10511
MSL Level 3
Reflow Profile 260C
ELECTRICAL TEST/FINISH DESCRIPTION
Note: Please contact a Cypress Representative for other packages availability.
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
Stress/Test Test Condition (Temp/Bias)
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Ball Shear JESD22-B116 P
Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package
P
Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack P
Final Visual JESD22-B101 P
High Accelerated Saturation Test (HAST)
JEDEC STD 22-A110: 130°C, 85%RH, 1.32/3.63V Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Internal Visual MIL-STD-883-2014 P
Pressure Cooker JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH, 260C Reflow) P
X-Ray MIL-STD-883 - 2012 P
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Reliability Test Data QTP #: 154702
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
STRESS: CROSS SECTION
STRESS: DYE PENETRANT TEST
STRESS: FINAL VISUAL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 951 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand COMP 940 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand COMP 973 0
CS8481AA (7CP07510C) 9422015 611533500 UT-Thailand COMP 955 0
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63/1.32V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 96 28 0
STRESS: INTERNAL VISUAL
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 5 0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 168 80 0
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 288 80 0
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Reliability Test Data QTP #: 154702
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: SOLDERABILITY
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand COMP 6 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand COMP 6 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand COMP 6 0
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CS8481AA (7CP07510C) 9422015 611533222 UT-Thailand 500 80 0
CS8481AA (7CP07510C) 9422015 611533224 UT-Thailand 500 80 0
CS8482AA (7CP07510C) 9422015 611533225 UT-Thailand 500 79 0
STRESS: X-RAY
Document No.002-10571 Rev. *A ECN # 5322241
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Reliability Test Data ER #: 162041
Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 96 25 0
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 300 25 0
STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C
CS8482AA (7CP07510DO) 9516003 611605307 UT-Thailand 200 25 0
Document No.002-10571 Rev. *A ECN # 5322241
Document History Page
Document Title: QTP# 154702: 88 QFN (10X10X1.0MM) NIPDAU LEADFINISH, CUPD WIRE, MSL3, 260C REFLOW, UTL-THAILAND (UT)
Document Number: 002-10571
Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
** 5066035 JYF Initial spec release.