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Delivering Quality Since 1952.

TECHNICAL ENGINEERING GUIDE

PRINTEDCIRCUIT BOARDS

PRINTED CIRCUIT BOARDS

1

DELIVERING QUALITY SINCE 1952.

TECHNOLOGY OVERVIEW

ENGINEERING OVERVIEW

Epec Engineered Technologies designs and manufactures customized, built-to-print, performance-critical products for all sectors of the electronics industry.

At Epec, we have a powerful story to tell – a history of great achievements, world class talent, and innovative breakthroughs, but most importantly, a story of helping our customers deliver their high quality products to market, faster.

Epec has a sixty year history of reliability, on time delivery, and financial stability. Our continuous investment in people, technology, and new ideas are making it easier for our customers to do great work.

We have built the industry’s leading supply chain platform and technology team, with Epec UL certified manufacturing operations in Shenzhen, Taipei, and North America, to seamlessly manage the needs of our customers’ product life cycles.

With more than 100 dedicated employees throughout North America and Asia, Epec EngineeredTechnologies has become one of the fastest growing companies in the Industry.

Epec has built one of the Industry’s leading global supply chain and engineering platforms.

As one of North America’s leading PCB and built-to-print engineered product companies, Epec’s annual capital expenditures are consistently among the highest in the industry.

Our investments are focused on world class engineering design systems, such as EpecDFx™, and on continually improving our global technology platform, to accelerate our customer’s time to market.

Epec's technical engineering and manufacturing solutions have helped thousands of leading companies reduce their time to market.

With 24/7 North American engineering support we provide our customers the most in-depth feedback, with exact accuracy, eliminating delays and quality problems.

Epec can provide complete engineering and design services on all our engineered products, from concept through production in a quick and efficient time frame. With over sixty years of experience and knowledge across diverse industries, Epec has the ability to think outside the box and create innovative designs and solid manufacturing solutions.

Our technical staff will work with you to generate material specifications, product renderings, complete documentation and prototypes.


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STANDARD LEAD TIME - 20 Working DayTechnology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day

1 - 4 Layers x x x x x x

6 - 10 Layers x x x x

> 10 Layers x x

* Prototype and Production Quantities Available

Solder Mask..........Green, Blue, Red, Black, Clear

Min Solder Mask Web................................... .004”

Max Board Thickness................................... .250”

Maximum Board Size............................. 22” x 42”

Max Copper Weight....................................... 6 oz

Standard SMD Pitch..................................... .016”

PCB LEAD TIMES

PRINTED CIRCUIT BOARD CAPABILITIES

STANDARD PCB FEATURES

Materials• FR-4 – ALL Types• CEM-1 & CEM-3• Heavy Copper• RF and High Speed Materials• MixedMaterials/FR-4Teflon• Metal Backed Boards• Polyimide

Surface Finishes• ENIG• HASL• Pb Free HASL• Immersion Silver & Tin• ENEPIG• Hard Body Gold• Soft Bondable Gold• OSP

Plating• Conductive Via Fill• Edge Plating• Castellations• Plated Slots• Gold Tabs• Plasma Etch Back• Peelable Solder Mask

Drill & Rout• Jump Score• Counter Sinks / Counter Bores• Control Depth & Laser Drilling• 12:1 Aspect Ratio• Depth Controlled Milling

Design• 1 to 18 Layers• 3 Mil Lines & Spaces• IPC Class 2 / Class 3• Impedance Control +/-10%• Down to .006” Holes• Blind & Buried Vias• Silver Thru Hole• Via in Pad• Laser Direct Imaging• MicroVia’s

PRINTED CIRCUIT BOARD CAPABILITIES•MIL-PRF-55110•Sequential Lamination•Net List Compare• Ionic Cleanliness•Free DFx File Check

•Design Services•Flex & Rigid Flex• ITAR Registered•Thermal Management•High Density Interconnects


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TECHNOLOGY ROAD MAP

Standard AdvancedMechanicalMaximum Layer Count 18 26Maximum Board Thickness .250" .287"Maximum Board Size 20" x 23" 20" x 24"Smallest Hole Size (Finished) .006" .005"Aspect Ratio 11:01 12:01Minimum Component Pitch .020" (soldermask between pins) .016" (gang masked)

Minimum Core Thickness .003" .002"Jump Scoring Yes YesCountersinks/Counterbores Yes YesPlated Hole Tolerance +/- .003" +/- .002Warpage 1% 0.75%

Copper WeightInner Layers 4 ounces 4 ouncesOuter Layers 6 ounces 8 ounces

TechnologyImpedance Control +/- 10% +/- 5%Via Technology Blind/Buried Blind/BuriedLaser Drilling (Microvias) Yes YesPlasma Etching Yes YesLaser Direct Imaging Yes YesVia Filling Non-Conductive Conductive

Available Surface FinishesHASL Immersion SilverENIG OSP

Pb Free HASL Immersion GoldImmersion Tin Electroplated Gold

MaterialsFR-4 (140-220 Tg) Teflon

Polyimide ThermagonCEM-1 ArlonRogers Getek

Agency QualificationsUL (File #E86319)

ISO-9001:2008 TS-16949

IPC-6012 Class 3Standard - Everyday CapabilityAdvanced - Everyday Capability with a small premium.


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PROCESS CAPABILITIES

Standard AdvancedAnnular RingInternal Minimum Pad Size .016"largerthanfinished

hole size.014"largerthanfinished hole size with teardrop

External Minimum Pad Size .016"largerthanfinished hole size

.014"largerthanfinished hole size with teardrop

• Increase pad size accordingly for annular ring requirements greater than .001". Vias may use pad .010" larger than Finished Hole Size• Holes requiring greater than .001" copper (i.e. 1 oz plated to 3 oz Finish) require and additional .004 pad diameter.

Plane Layer ClearancePTH & NPTH Hole Clearance to Plane .030"largerthanfinishedholesize .024"largerthanfinishedholesize

PTH & NPTH Hole to Inner Layer Trace .015" Spacing .012" Spacing

Line Width and SpaceInner Layer Line width on Hoz copper Minimum -.004" Minimum - .004"

Inner Layer Line width on 1oz copper Minimum-.005" Minimum-.005"

Inner Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"

Inner Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"

Outer Layer Line width on H ounce base copper Minimum-.004" Minimum-.004"

Outer Layer Line width on 1oz base copper Minimum -.005" Minimum - .005"

Outer Layer Line width on 2 oz copper Minimum -.008" Minimum -.008"

Outer Layer Line width on 3 oz base copper or greater Minimum -.012" Minimum -.012"

Inner layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"

Inner layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"

Inner layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"

Outer layer Feature to Feature on 1 oz or less base copper Minimum -.005" Minimum - .004"

Outer layer Feature to Feature on 2 oz Base Copper Minimum -.008" Minimum -.008"

Outer layer Feature to Feature on 3 oz copper or greater Minimum -.012" Minimum -.012"

Trace to Plane Spacing Minimum -.008" Minimum -.008"

Feature to Board Edge *does not include tabs Minimum -.010" Minimum -.008"

Feature to Score Edge Minimum -.020" Minimum -.015"

Solder MaskLPI Conductor Overlap .005" Larger Than Feature Size .004" Larger Than Feature Size

LPI Mask Clearance .003" Minimum .002" Minimum

LPI Mask Web .005" Minimum .004" Minimum

• Less than 4 mil web between component pins may result in loss of mask between SMT pads.

SilkscreenSilk Screen Ink .008" minimum aperture .006" minimum aperture

Copper Features (ETCHED TEXT) .010" minimum aperture .010" minimum aperture

Font Height .065" minimum height .045" minimum height

Distance from Feature (clipping) .006" minimum from feature .006" minimum from feature

Ifthespecificationsofaboarddesignfallintotheadvancedcategoryitmaybesubjecttoadditionalcharges.


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LAMINATE INFORMATION

Arc

Res

ista

nce

Min

imum

(sec

.)

Elec

tric

al S

tren

gth

Min

imum

(vol

ts/m

il.)

Flam

mab

ility

UL9

4

Gla

ss T

rans

ition

Tem

pera

ture

“Tg

”(C

elsi

us)

Deg

rada

tion

Tem

pera

ture

by

TGA

(Cel

sius

)

Die

lect

ric C

onst

ant

(1 M

Hz)

Die

lect

ric C

onst

ant

(1 G

Hz)

Loss

Tan

gent

at

(1 M

Hz)

Loss

Tan

gent

at

(1 G

Hz)

Vendor Product Type IPC 4101ASHENGYI S1000 Low CTE FR4 /24 100 - V-0 175 335 4.8 - 0.013 -

S1130 FR4 /21 115 - V-0 135 - 4.6 - 0.016 -

S1141 FR4 /21 115 - V-0 140 - 4.5 - 0.016 -

S1155 FR4/Halogen Free /21 115 - V-0 135 - 4.7 - 0.01 -

S1165 FR4/Halogen Free /94 127 - V-0 170 260 4.8 - 0.007 -

S1170 FR4 /24 123 - V-0 175 340 4.6 - 0.012 -

S1600 High CTI FR4 /21 126 - V-0 135 - 4.7 - 0.016 0.008

S1860 FR4 /29 90 - V-0 210 - 3.6 - 0.008

S1440 FR4/UV Block /97 125 - V-0 140 - 4.7 - 0.0015 -

S2130 CEM-3 - 115 - V-0 132 - 4.6 - 0.0016 -

S3110 CEM-1 - 118 - V-0 110 - 4.4 - 0.022 -

HONG TAI HTE-420 FR4 - 120 - V-0 145 - 4.2-4.8 - 0.019 -

HTE-740 FR4 - 120 - V-0 175 - 4.2-4.8 - 0.019 -

ISOLA ED130UV FR4 /21 100 - V-0 135 - 4.7 4.34 0.02 0.016

FR406 FR4 /24, /26, /28 60 1000 - 170 295 - - - -

FR408 FR4 /24 120 1400 - 180 370 - 3.63 - 0.013

P95 Polymide /41 131 1200 V-0 260 4.4 4.2 0.016 0.014

Policlad 370HR FR4 /24, /26, /98 115 54 V-0 180 350 4.7 4.5 0.016 0.017

Getek PPO /25 >60 1200 V-0 175-185 - 3.6-4.2 - .010-.015 -

IS-410 FR4 /24, /26, /28 129 1100 V-0 180 350 - - - -

ITEQ IT140 FR4 /21 60 - V-0 135 305 5.4 - 0.035 -

IT140G FR4/Halogen Free /21 90 760 V-0 155 365 4.5 - 0.015 -

IT158 Low CTE FR4 /24 125 - V-0 155 345 4.6 - 0.016 -

IT170G FR4/Halogen Free /24 100 - V-0 180 380 4.5 - 0.009 -

IT180 FR4 /24, /99 60 760 V-0 170 340 4.4 - 0.016 -

IT600 High CTI FR4 /21 60 - V-0 140 305 4.8 - 0.018 -

NAN YA NP-140 FR4 /21 - - V-0 140 311 - 4.2 - 0.015

NP-170TL FR4 /24 - - V-0 175 312 - 4.22 - 0.013

NPG-170 FR4/Halogen Free /94 90 - V-0 170 355 - 4.3 - 0.012

NP-180 FR4 /24 120 - V-0 180 359 - 4.36 - 0.019

NPG-180 FR4/Halogen Free - - - V-0 180 380 - 4.8 - 0.016


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LAMINATE INFORMATION

Arc

Res

ista

nce

Min

imum

(sec

.)

Elec

tric

al S

tren

gth

Min

imum

(vol

ts/m

il.)

Flam

mab

ility

UL9

4

Gla

ss T

rans

ition

Tem

pera

ture

“Tg

”(C

elsi

us)

Deg

rada

tion

Tem

pera

ture

by

TGA

(Cel

sius

)

Die

lect

ric C

onst

ant

(1 M

Hz)

Die

lect

ric C

onst

ant

(1 G

Hz)

Loss

Tan

gent

at

(1 M

Hz)

Loss

Tan

gent

at

(1 G

Hz)

Vendor Product Type IPC 4101A

NELCO N4000-13 PPE /29 123 1200 - 210-240 350 3.8 3.7 - 0.014

N4000-13 SI PPE /29 123 1000 - 210-240 350 - 3.5 - 0.009

N4000-2 FR4 /21 65 1250 V-0 130-140 300 4.4 - 0.027 -

N4000-6 FR4 High Temp /24, /26 65 1300 V-0 170-175 300 4.3 4.1 0.027 -

N4000-7 FR4 /24 124 1100 V-0 155 317 4.5 4 0.017 0.017

N5000 BT /30 118 1200 - 185-220 334 3.8 3.6 - 0.014

N7000-1 Polymide /40, /41 136 1350 V-1 250-260 389 3.9 3.9 - 0.015

ROGERS 3003 PTFE - - - V-0 - 500 - 3 - 0.0013

4003C Ceramic - - 650 - 280 425 - 3.38 - 0.0027

4350B Ceramic - - 800 V-0 280 390 - 3.48 - 0.0037

4450B Ceramic - - 1000 V-0 >280 - - 3.54 - 0.004

TMM3 Ceramic - - 650 - >280 425 - 3.27 - 0.002

TMM4 Ceramic - - 650 - >280 425 - 4.5 - 0.002

Ultralam 2000 PTFE - 185 - V-0 - - - 2.6 - 0.0022

ARLON 25N Ceramic /10 - - - 260 - - 3.38 - 0.0025

25FR Ceramic /11 - - V-0 260 - - 3.58 - 0.0035

85N Polyimide /40 - - - 260 - 4.39 - 0.008 -

TACONIC TLC PTFE - >180 - V-0 - - - 3.2 - 0.003

TLE PTFE - >180 - V-0 - - - 2.95 - 0.0028

TLT PTFE - >180 - V-0 - - - 2.5 - 0.0006

TLX PTFE - >180 - V-0 - - - 2.5 - 0.0019

DUPONT PYRALUX AC Polyimide - - - V-0 - - 3.7 - 0.014 -

PYRALUX AP Polyimide - - - V-0 220 - 3.4 - 0.003 -

TAIFLEX 2LPSE 1005 Polyimide - - - V-0 - - 3.65 - 0.009 -

THKD050513 Polyimide - - - V-0 - - 3.65 - 0.009 -

For more information on Laminates, visit the following websites.SHENG YI - www.syst.com.cn ROGERS - www.rogerscorp.com

ISOLA - www.isola-group.com ARLON - www.arlon-med.comITEQ - www.iteq.com.tw TACONIC - www.taconic-add.com

NAN YA - www.npc.com.tw DUPONT - www.dupont.comNELCO - www.parkelectro.com TAIFLEX - www.taiflex.com


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PCB DESIGN SERVICES

A Manufacturing MentalityFor more than 60 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.

We pride ourselves on providing high quality design and layout services, but it is equally important that our customers can manufacturer their parts in the most cost effective manner. Our goal is to reduce the overall cost of our customer’s product by designing a circuit board that can be easily manufactured by Epec or anyone else in our industry.

REVERSE ENGINEERING AND SCANNING

With the consolidation of the printed circuit board industry over the last few years, many of our customers find themselves needing to order boards but they have no electronic data. Their previous supplier may have gone out of business and the only copies of the artwork or electronic data have been discarded.

At EPEC, we can create electronic data from virtually anything, including, films, drawings (DXF), 1 to 1 paper plots, and even boards themselves.

We have over 10 years of experience in creating electronic data from all types of media using our state of the art scanning equipment and software. We have developed a systematic process to make sure that all of the board features are double checked to ensure that everything has been replicated properly. We understand how important it is to get even the smallest details right when it comes to our customers circuit boards.

Please contact your sales representative for more specific details around our design and manufacturing guidelines.

PCB DESIGN CAPABILITIES

Design Capabilities:• Single and Double Sided• Multi-layer (up to 20-Layers)• Flex and Rigid–Flex• High Density Surface Mount

(BGA, CGA…)• Analog, Digital & Mixed Designs• Impedance Control• Matched Line Lengths• Differential Pairs• Auto routing for dense

multi-layer designs

PCB Software:• PADS• AutoCAD• CADSTAR• ORCAD• Accel• PCAD

Design Service:• Gerber completion in

as few as 5 days

PCB Layout:• Complete assembly

drawings for fabrication• In-Circuit Test Data Generation• Pick and Place

Data Generation• Panelization Drawings• Gerber Editing• Scanning


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EpecDFx™ ENGINEERING PLATFORM

EpecDFx™ is a whole new quality and manufacturability platform, combining the industry's latest, most advanced technology and engineering expertise.

• Prototypethroughproduction • Reducesoverallcosts • Acceleratestime-to-market

EpecDFx™ IN ACTION

Typical example of a subtle, yet crucial engineering and design problem discovered before fabrication; EpecDFx™andEpec’sengineeringteamdetectsanddevelops“must-fix”through“optimal”solutions.

Experience EpecDFx™, and how our engineering support gives customers the most in-depth feedback, with exact accuracy, available anywhere in the printed circuit board Industry, eliminating delays and quality problems.

EpecDFx™ issue shows:

•IsolatedconnectioncausedbyoversizedplaneclearancesnotcaughtbyCADsystemresultinginnetlistviolation.

•Reducedthermalconnectionduetoproximitytolargesplitplaneline.

Impact:

•Electricalintegrityofthedesignisinvalid,resultinginscrappedboard.

•Compromisedthermalconnectionresultsinpoorsolderabilitytoconnectorpin.

EpecDFx™“Critical/Must Fix”

•Suggestion:Reduceplaneclearancesforholestoallowconnection.

•Result:Netlistintegrityisrestored.

EpecDFx™ “Better”

•Suggestion:Reduceplaneclearancesforholestoallowconnection.Plusrotatethermalrelief45degrees.

•Result:Netlistintegrityisrestored,andthermalpropertiesareimproved.

EpecDFx™ “Best”

•Suggestion:Reduceplaneclearancesforholestoallowconnection.Plusrotatethermalrelief45degreesandreduceplaneclearanceline.

•Result:Netlistintegrityisrestored,andthermalpropertiesaremaximized.


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HEAVY COPPER PCBS

Epec has been building heavy copper circuit boards with traces and copper planes of up to 6 ounces or over 20 years. Our expertise is in producing at a reasonable cost, heavy copper PCB’s that are of proven designs. Our engineering team can work with you to review your design to make sure that they can be manufactured with the highest quality at the best overall cost.

Industries Served Using Heavy Copper:

• Welding Equipment• Solar Panel Manufacturers• Power Supplies• Automotive• Electrical Power Distribution• Power Converters

Heavy Copper PCB Capabilities:

• Maximum Number of Layers = 16• Laminate – FR-4 (All Tg Ranges), Teflon, Ceramic• Finished Thickness = .020” - .275”• Green, Blue, Red, Black, Clear & White Solder Masks & Legend Inks• Minimum Soldermask Clearance – 6 mils• Minimum Solder dam Width – 5.5 mils• Hot Air Solder Leveling (HASL)• Immersion Gold (ENIG) & Immersion Silver• Blind & Buried Vias• Minimum Drill Bit Hole Size = .012”• Minimum Holes Size - .008” +.005”/-.008”• Maximum Hole Aspect Ratio = 10:1• Maximum Copper Weight = 6 oz. (UL Approved)• Controlled Impedance +/- 10%• Minimum Silkscreen Line Width – 8 mils

Production MinimumsMeasured in Inches H oz 1 oz 2 oz 3 oz 4 oz 5 oz 6 oz

Min. Conductor Width 0.004 0.005 0.006 0.007 0.008 0.009 0.10

Min. Conductor Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. Pad to Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. Conductor-to-Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.020

Min. PTH Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014

Min. VIA Annular Ring 0.006 0.006 0.008 0.009 0.011 0.013 0.014

Min. Distance - Hole to Board Edge 0.010 0.010 0.010 0.010 0.010 0.010 0.010


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THERMAL CLAD AND METAL BACKED PCBS

Epec offers Thermal Clad PCB’s which is a dielectric metal base with a bonded copper circuit layer. This creates superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics. Thermal clad is a unique layered system comprised of the follow layers:

Circuit Layer: Printed circuit foil with thickness of 1 oz to 5 oz.

Dielectric Layer: Many different options which offer electrical isolation with minimum thermal resistance. Also used to bond the circuit layer and base material together. Each specific dielectric has its own UL recognition.

Base Layer: Most often Aluminum, but can also be copper. The most commonly used thickness is 0.040” (1.0 mm) although many thicknesses are available.

THERMAL CLAD PCB APPLICATIONS

Power Conversion: Thermal clad offers a variety of thermal performances is compatible with mechanical fasteners and is highly reliable.

LED’s: Using Thermal Clad PCB’s assures the lowest possible operating temperatures and maximum brightness, color and life.

Motor Drives: Thermal Clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements.

Solid State Relays: Thermal clad offers a very thermally efficient and mechanically robust substrate.

Automotive: The automotive industry uses Thermal clad boards as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization.

Improve the durability and performance of your product by using Thermal Clad PCB’s. Simple designs and low thermal impedance of the dielectric out performs all other PCB insulators for power and high-operating temperature components.

Thermal Clad PCB Materials:• Bergquist• Thermagon• Arlon• Denka

Thermal Clad PCB Specifications:• 1 & 2 Layer Dielectrics• HASL, ENIG & Pb Free HASL finish• Up to 5 oz finished Cu• Al & CU base material up

to .250” thick

Thermal Clad PCB Benefits:• Lower Operating Temperatures• Improved Product Durability• Increased Power Density• Increased Thermal Efficiency• Reduced Number of Interconnects• Lower Junction Temperatures• Reduced PCB Size• Eliminates Older Hardware• Minimizes Labor Required for Assembly• Wide Variety of Form Factors• Minimize Thermal Impedance


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HDI – HIGH DENSITY INTERCONNECT PCB

HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boardsmay have blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards using less layer construction.

Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.

HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.

Key HDI BenefitsAs consumer demands change, so must technology. By using HDI technology, designers now have theoption to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

Via in Pad ProcessInspiration from surface mount technologies from the late 1980's has pushed the limits with BGA's, COBand CSP into smaller square surface inches. The via in pad process allows for vias to be placed within thesurface of the flat lands while using eight additional steps to complete this unique process. Specialty equipment and trained technicians follow the process closely to achieve the perfect hidden via.

Quality remains the most important factor for the consumer second to price. Using HDI technology during design, it is possible to reduce an 8 layer through-hole PCB to a 4 layer HDI microvia technology packed PCB. The wiring capabilities of a well-designed HDI 4 layer PCB can achieve the same or better functions as that of a standard 8 layer PCB.

Via-in-Pad technology shown .005 laser drill within .015 BGA capped and plated pads.

.005 via holes within .014 copper pads are filled, capped and plated over allowing for

small component placement.


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HDI – HIGH DENSITY INTERCONNECT PCB (continued)

Why Build Non-Conventional HDI BoardsWith 60 years of experience in the printed circuit board industry, Epec has always made its top focus to be our customer needs. With technology increases every day and devices get smaller, we are always increasing our capabilities to exceed the demands of our customers, ensuring we deliver the highest quality engineered products available.

With our engineering knowledge we welcome the opportunity to expand our HDI circuit board product offering to our customers helping them stay on top in their market.

Our teams of engineers are always available 24/7 to help our customers design and manufacture state of the art products for their respected industry. Whether you need a quick turn or a prototype order, design help, or require ITAR or special certifications, we will meet your schedule to get your products to market faster.

Industries That Utilize HDI:• Automotive Industry• Medical Industry• Aerospace & Military• Consumer Electronics

Products That Benefit From HDI:• Portable Devices • Mobile Devices• Hand Held Computing• Scanning Devices & Printers

Our HDI Technology Includes:• Prototype & Production Size Orders• Quick Turns & Standard Lead Times• Blind & Buried Micro-Vias • Sequential Lamination• Exotic Materials• Extreme Thicknesses• Stacked Micro-Vias• Staggered Micro-Vias• Thin Lines & Spacing• ITAR / Military


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MANUFACTURING PROCESS CAPABILITIES

Category Description Sym. Capability1. Microvia Diameter 1.1

Microvia Diameter at Target Land A 100 um0.004”

1.2Microvia Diameter at Capture Land B 125 um

0.005”1.3Microvia Target Land Size C 0.012”

1.4Microvia Target Land Size D 450 um

0.0177”2. Stagger & Stack 2.1

Min. Staggered Via Pitch Staggered Via Pitch

A 560 um0.022”

2.2RCC Thickness RCC

B 50 um0.002”

2.3Blind Via Layers N 2

3. Material & Construction 3.1Finished Board Thickness H 0.012” - 0.250”

3.2Min. Inner Layer Thickness H1 0.075 mm

0.003”3.3Min. Dielectric Thickness H2 0.05 mm

0.002”3.4Max. Inner Layer Copper T1 10 oz

3.5Max. Outer Layer Copper T2 6 oz

4. Warp

4.1Warp and Twist (Max.) A B < 0.75%

5. Pad 5.1Min. Finish Hole Size H 0.005”

5.2Min. Land Size H 0.018”

5.3Min. Annual Ring for Via R1 IPC Class 2

5.4Min. Annual Ring for Component R1

0.05 mm 0.002”, provided designed per IPC


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Category Description Sym. Capability6. Drill

6.1Tolerance for PTH Hole A 0.08 mm

0.003”

6.2NPTH Hole Tolerance B 0.05 mm

0.002”

7. Registration for S/M7.1Registration for S/M to Pattern S1-S2 0.0024”

7.2Registration for Legend to S/M NA 0.005”

8. Registration for Drill 8.1Registration for Drill to Inner Layer S 0.075 mm

0.003”

8.2Registration for Drill to Datum S 0.05 mm

0.002”

8.3Registration for First Drill to Second Drill

NA 0.005”

9. Registration for Layers 9.1Layer to Layer for 4 layers S 0.08 mm

0.003”

9.2Layer to Layer for 6 layers S 0.10 mm

0.004”

9.3Layer to Layer for 8 layers S 0.13 mm

0.005”

10. Line Width10.1I/L Min. Width (0.5 oz) W2 0.003”

10.2O/L Min. Width (0.5 oz) W1 0.003”


15


Category Description Sym. Capability11. Line Space

11.1I/L Min. Space S2 0.003”

11.2O/L Min. Space (0.5 oz) S 0.003”

12. Drill Capability 12.1Max. Aspect Ratio(Board Thickness 0.063”)

H/T 12.0

12.2Min. Drill Hole Size (Board Thickness 0.063”, After Plating)

H 0.0083

13. S/M Thickness13.1Max. Thickness on Copper H1 0.025 mm

0.001”

13.2Max. Thickness at Shoulder H2 0.0075 mm

0.0003”

14. S/M Capability14.1Min. SMD Space for Dam W2 0.0078”

14.2Min. Dam Size W1 0.0003”

15. Carbon Capability 15.1Max. Contact Resistance NA 30Ω/sq

15.2Max. Primary Resistance NA 30Ω

15.3Min. Thickness NA 0.0004”

15.4Min. Space A 0.015”

15.5Max. Space for Registration B 0.007”


16


Category Description Sym. Capability16. HAL Capability 16.1

Min. PCB Thickness for HAL H2 0.6 mm0.0236”

16.2Min. Pad Width/Space for HAL W 0.25 mm

0.0098”

16.3HAL Thickness for any point H1 0.001 mm ~ 0.025 mm

40 micro-inch ~ 0.001”

16.4Thickness on QFP Pad (0.05” Wide Quad)

A 0.015 mm ~ 0.030 mm0.0006” ~ 0.0012”

17. HAL Capability

17.1Outline Tolerance-Punching AB NA

17.2Outline Tolerance-Routing AB 0.005”

18. Beveling Capability18.1Beveling Angle B 200-600

18.2Tolerance for Outline of Bevel A + - 0.005”

19. V-Cut Capability 19.1V-Cut Angle V-Cut C 30˚

19.2Range of Board Thickness H 0.030” ~ 0.125”

19.3Tolerance of V-Cut Residual B 0.05 mm

0.003”

19.4V-Cut Off Line V-Cut D 0.125 mm

0.005”


17


Category Description Sym. Capability20. Test Capability 20.1

Voltage NA 5-500 VDC

20.2Isolation NA 500MΩ

20.3Continuity NA 20Ω~100KΩ

20.4Min. SMD PAD Pitch SMD P 0.3 mm

0.0118”

21. Impedance Control Capability

21.1ImpedanceControl>50Ω NA +/- 10%

21.2ImpedanceControl<50Ω NA +/- 10%

22. Differential Impedance Capability

22.1Differential Impedance Control>50Ω

NA +/- 10%

22.2Differential Impedance Control<50Ω

NA +/- 10%

22. Coplanar Impedance Capability

22.1Coplanar Impedance Control>50Ω

NA +/- 10%

22.2Coplanar Impedance Control<50Ω

NA +/- 10%


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PCB PLUG VIA PROCESS

Epec offers a variety of printed circuit board manufacturing solutions for Plug Via Process requirements. Whether you require vias flooded with mask, selective plugging in BGA areas, conductive and non-conductive epoxy fill, or fully plugged and via in pad, we have you covered.

Our experienced engineering team will help you to get your product to market faster, while eliminating delays and quality issues.

Feature Symbol 1.27mm/ 50mils

1.00mm/ 0.3937mils

0.8mm/ 0.031496 Discrete

BGA Pad bp 24 19 14

BGA Mask Must Be Avoided Should Be Avoided Should Be Avoided Must Be Avoided Must Be Avoided

(Cu defined) bm bp+5 (4 min) bp+5 (4 min) bp+5 (4 min) pad+5 (4 min)

BGA Pad Dia. Dist. pd 70.71 55.67 44.54

Via Pad VP 22-25 22 20

Via Hole VH 10-12 10 8-10

Via Mask (Zit via) VM VH+5 (4 min) VH+5 (4 min) VH+5 (4 min)

BGA Mask Dam d 14.35-12.35 min 9.33-8.33 7.27-5.27

Via Button Print VB VH+15 (10 min) VH+15 (10 min) VH+15 (10 min)

d1 4 min

d2 10 min

* Based on 0.062 thick board, non solder mask defined BGA pads and plastic BGA packages.* Cu defined pad infers no mask will be present on the capture pad.

d2

d1

VH VM VB VP

bp

bm

d

pd


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ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

The perfect electronic product device should be as small and light as possible, while containing the maximum amount of electronic functionality and operating at the highest possible speed. To meet these needs, the electronic packaging industry has been driven to develop more and more advanced packaging methods, both by increasing the density of integrated circuits on a single PCB and also by combining multiple functionalities into single, dense packages.

Increased package and interconnection density have driven the evolution of assembly methods from through-hole technology (THT) to surface mount technology (SMT) and have led an increased use of wire bonding to attach devices to PCB substrates. Decreased interconnect pitch and the use of chip scale packaging (CSP) have enabled the increases in device density, while multichip modules (MCM) / system in package (SiP) approaches have allowed integration of functionalities that would be difficult to produce on a single wafer substrate.

When the semiconductor industry has concentrated for many years on increasing the performance of devices by reduction in critical dimensions, until recently, there has been less consideration of the fact that devices in an electronic system must communicate with each other through the packages that contain them. Large I/O requirements and signal transmission quality have emerged as key considerations for the semiconductor packaging industry, as have the assembly process requirements and the final finish of PCB substrates used to achieve reliable interconnections both within IC packages and for the second level packaging of devices onto PCB substrates.

The below describes the key factors affecting interconnection reliability, especially focusing on the performance of finishes for gold wirebonding applications.

ADVANTAGES OF ENEPIG

The key advantages of ENEPIG, combining both excellent solder joint and gold wire bonding reliability can be summarized in the following points:

• "Black Nickel" free – no possibility of grain boundary corrosion of nickel surface by immersion gold

• Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability

• Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic

• Withstands multiple lead-free reflow soldering cycles

• Demonstrates excellent gold wire bondability

• Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold

Rohm and Haas Electronic Materials LLC is a global supplier of a comprehensive range of final finishes including pretreatment chemistries, electroless nickel, electroless palladium and immersion gold and tin products.


20

ENEPIG - SURFACE FINISH OPTIONS FOR WIREBONDING

While electrolytic nickel gold provides excellent gold wirebonding performance, it suffers from three major deficiencies, each of which is a major barrier to its use in leading edge applications:

1.The process cost is high, driven by to the relatively high gold thickness required

2.At the higher gold thicknesses normally used, solder joint reliability may be reduced due to the formation of tin-gold intermetallics. Should the finish be combined with a second final finish, more suitable for soldering applications, additional costs from secondary imaging operations are also incurred

3.The electrical bussing required to make connections to the features during the plating process limit the feature densities that can be achieved

These limitations have provided an opening for electroless process options. These include electroless nickel immersion gold (ENIG), electroless nickel electroless gold (ENEG) and electroless nickel electroless palladium immersion gold (ENEPIG).

Of these three options, ENIG is not generally considered to have an acceptable process window for high reliability gold wire bonding (although it has been used for some lower end consumer applications) and ENEG suffers from many of the same process cost issues as electrolytic nickel gold, with additional challenges from operating more complex electroless gold processes.

While electroless nickel electroless palladium immersion gold (ENEPIG) first emerged in the late 1990's, its market acceptance was delayed by the very volatile price of palladium metal around 2000. However, in more recent years, the market demand has shown strong growth as users have begun to appreciate the potential of ENEPIG to address many of the new packaging reliability needs, while also meeting lead free / ROHS requirements.

Apart from the advantage of packaging reliability, the cost of ENEPIG has now become a positive consideration. With recent increases in the price of gold price to levels above US$800 per troy oz, the production cost of electronic device that required thick gold electroplating becomes extremely difficult to control. Since the cost of palladium metal (US$300 per troy oz) has remained relatively low in comparison to gold, an opportunity for cost saving by replacement of gold with palladium is now available.

ENEPIG - COMPARISON OF FINAL FINISHES

In the existing market, there are 4 primary lead-free final finishes for PCBs which are suitable for assembly of fine pitch QFP / BGA devices:

• Immersion Tin• Immersion Silver• Organic Solder Preservatives (OSP)• Electroless Nickel Immersion Gold (ENIG)


21

ENEPIG - COMPARISON OF FINAL FINISHES (continued)

The table below shows a comparison between these four final finishes and ENEPIG. None of the four primary final finish options is perfect for lead-free assembly, due to a variety of different concerns including multiple reflow cycle capability, shelf life before assembly and wire bond capability. In contrast, ENEPIG shows substantial advantages combining excellent shelf life, solder joint reliability, gold wire bondability and usage as a contact surface.

The protection of the electroless nickel interface with the formation of a thin electroless palladium layer, prior to immersion gold, eliminates the potential for excessive gold attack on the electroless nickel surface.

Characteristics OSP ENIG ENEPIG Immersion Silver

Immersion Tin

Shelf Life (Controlled Conditions) < 12 Months > 12 Months > 12 Months < 12 Months 3 – 6 Months

Handling / Contact With Soldering Surfaces

Must Be Avoided Should Be Avoided Should Be Avoided Must Be Avoided Must Be Avoided

SMT Land Surface Planarity Flat Flat Flat Flat Flat

Multiple Soldering Cycles Fair To Good Good Good Fair To Good Fair To Good

No Clean Flux Usage Pth/Via Fill Concerns No Concerns No Concerns No Concerns No Concerns

Solder Joint Reliability Good Good Process

Control Required To Avoid "Black Pad"

Good Interfacial Microvoid Concerns Good

Gold Wire Bonding No No Yes No No

Electrical Test Probing Poor,

Unless Solder Applied During Assembly

Good Good Good Good

Corrosion Risk After Assembly Yes No No No Yes

Contact Surface Applications No Yes Yes No No

Total Coating Thickness (Micron)

> 0.15 u 0.08 – 0.13Ni 3.0 – 6.0

Soldering:Au 0.03 – 0.05Pd 0.05 – 0.1Ni 3.0 – 5.0

Wirebonding:Au 0.07 – 0.15Pd 0.1 – 0.15Ni 3.0 – 5.0

0.05 – 0.5 typical 1.0 – 1.1

When we consider the final finish performance in a variety of different assembly methods, it can be seen that ENEPIG is suitable for a wide range of assembly requirements.


22

PCB DESIGN AND LAYOUT

At Epec, we specializes in high-performance Printed Circuit Board physical design (layout) utilizing high-end software programs complemented by leading edge hardware.

Our Capabilities Encompass The Full Design Flow From Start To Finish Including:• Micro BGA / Micro Via / Blind & Buried Vias• Rules Driven Designs• Schematic Capture• Library Development• Database Construction and Verification• Signal Integrity/Design Verification• EMI Checking• Full Document Package Creation

We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition, Mentor’s PADS, Altium, Valor for DFM Analysis. We customize and develop software in-house to improve quality and compliment our design tools.

ELECTRICAL ENGINEERING

We have the experience required to consistently meet the highest standards in the industry. Our experience spans multiple market segments, including Telecom, Datacom, Computer & Storage, Medical, Mil/Aero, Industrial, and consumer products.

Our expertise lies in High-Speed Circuitry Design up to 40GHz and Mesh Networking (Optical: OC-48, OC-192, T1, E1, and Infiniband).

Other capabilities include Thermal Engineering, Signal Integrity Analysis, Software and Firmware Design, including software integration and API design.

Digital/High-Speed and Analog Design Capabilities Include:• Circuit Design and Analysis• FPGA to ASIC Conversion• Component Analysis & Evaluation• Compliance and Value Engineering• Pulsed Circuits• Analog Circuit Simulation and much more!• Embedded Microprocessors & Chipsets for

Power PC, Intel x86, TI DSP, Mellanox, Broadcom and various other chipsets used in Server, Telecom, Industrial, and Commercial market segments


23

MECHANICAL ENGINEERING

Our Engineers have 30 years experience in Mechanical Engineering. We are capable of supporting any part of the product lifecycle across multiple market segments. We utilize leading CAD platforms such as AutoCAD Inventor, SolidWorks, and Pro/ENGINEER Wildfire.

Our Capabilities Include:• Packaging, Enclosure, and Industrial Design• Product/System Architecture• Detailed Mechanical Design• Stress Analysis (FEA) Shock/Vibration Simulation• Thermal Simulation• Material and Component Selection• Solid Modeling• PCB Linkage DFM / DFA & Cost reduction

PCB FABRICATION

For over 60 years Epec has been your reliable PCB manufacture. From prototype to production runs our engineers can support you in all your PCB needs 24/7. Why look elsewhere, from the simplest single sided PCB to HDI, sequential laminated multilayers with multiple blind and buried vias we’ve got you covered. Via in pad, silver filled, copper filled, epoxy, conductive, non-conductive via fill, Aluminum, RF, ENEPIG, our specialty is customer service. As we continue to expand our PCB supply chain we have one goal in mind, to provide our valued customers what they need when they need it. Supporting domestic 1, 2, 3 day quick turns, 5 day turns from Asia and our guarantee to satisfy.

PCB FABRICATION

Our SI experts have years of experience in pre-design and post-design verification and analysis. This experience and expertise, combined with powerful state-of-the-art software, helps ensure your design will work the way you expect it to the first time and all the time. Although we can customize services to meet your unique needs, we have included a list below of the services we provide.

Capabilities Include:• Up Front SI Risk Analysis• Pre and Post Route Simulations• Frequency Domain & Time Domain Modeling• 3D Via Field Modeling and Optimization• Optimization of AC Coupling Cap Launches• Optimization of Connector Launches• Infiniband, PCIe (Gen 1 & 2), XAUI link Analysis• IEEE 802.3ap KR Compliance to 10 Gbps• StatEye Time Domain Analysis• DDR2 and DDR3 Optimization• Crosstalk and Timing Analysis• Detailed SI CAD Guidelines Generation• Real Time SI Support Throughout the CAD Layout Process

Epec Can Provide:• Concept Sketches/Rendering• Product Specifications• Mock Ups• 3D Rendering• Full Documentation


24

ITAR COMPLIANT

What is ITAR?The International Traffic in Arms Regulations (ITAR) is a set of regulations that govern the export and re-export of certain controlled commodities, services, and, most importantly, technologies. In order to be controlled under ITAR as a defense article, a given component, subcomponent, part, assembly, subassembly, or integrated system must have been specifically designed, developed, configured, adapted, or modified for a military application controlled under the United States Munitions List.

It also restricts sensitive information and technologies to only to be shared with US Citizens unless special approval is granted. In summary, this regulation makes sure that anything to do with US proprietary defense secrets are not shared with anyone that our government has deemed not authorized to see or be in possession of. Including non-US citizens in the US.

ITAR Compliance vs. ITAR RegisteredITAR requires that any person (company) who engages in the business of manufacturing defense articles or furnishing defense services is required to register and keep their registration current with the United States Department of State. Epec Engineered Technologies is registered with the Department of State.

Many companies claim that they are ITAR compliant, but haven’t taken the proper steps to register with the Department of State. If you manage ITAR materials, it is your responsibility to assure that all of your suppliers have the proper registrations and follow the ITAR procedures. The Department of State interprets and enforces ITAR. Its goal is to safeguard US national security and further US foreign policy objectives.

Epec’s ITAR CommitmentBeing a global manufacturer of build to print products, ITAR compliance requires a significant commitment from management and a substantial investment in systems. Epec’s management has committed by investing in separate and secure IT resources that ensure that all of our ITAR data is stored in a manner that far exceeds the ITAR requirement.

Epec’s ITAR PCB ManufacturingBecause our roots are in PCB manufacturing, we have traditionally focused most of our ITAR work in printed circuit boards as printed circuit boards fall under Item 14-Category II of the United States Munitions List. Our factory located in Detroit, MI focuses solely on quick turn, ITAR and military work. This focus has allowed us to be profitable and to invest in the right equipment and people to allow us to exceed our customers’ expectations.

Understanding ITAR & Your Supply ChainEpec has long been an industry leader in supply chain management and we have used our many years of experience to develop processes and procedures that assure ITAR compliance today and well into the future. As a company that deals in ITAR articles it is our responsibility to make sure that all of our subcontractors, employees, directors and sales representatives understand the compliance is not optional.

Our auditing process allows us to systematically check all of the effected parties to assure compliance. This is another way that we add value to our customers.


25

ITAR COMPLIANT (continued)

What happens if you are not in compliance with ITAR?The Arms Export Control Act (AECA) provides for criminal penalties of up to 10 years in prison and $1 million in fines for each violation. In addition, the AECA provides for civil penalties of up to $500,000 per violation and debarment from future exports. In FY 2006, law enforcement agencies initiated criminal actions pursuant to the AECA and International Traffic in Arms Regulations (ITAR) that resulted in 119 arrests, 92 indictments and 60 convictions.

Epec is serious about ITARWe spent over 7 months reviewing and developing our ITAR management plan to assure that we did not miss any of these details.

INVENTORY STOCKING SOLUTIONS

Epec offers its customers a variety of customized stocking and consigned inventory management programs that support their individual logistic objectives. There are 4 Main Inventory Programs that Epec utilizes, and each is customized to your particular objectives.

• Owned Inventory: Customer places an order with Epec, we will bring the product into our inventory until you require it. We will ship based upon your delivery requirements, and invoice with the shipment.

• Consigned Inventory: Placing finished goods in the hands of the customer, but Epec retains ownership until the goods are used. Can be invoiced weekly or monthly.

• Kanban Inventory: Customer provides Epec with a forecast for us to build to. Customer then pulls from Inventory and will be billed upon the pull. Epec will then replenish inventory based on the next forecast.

• Blanket Orders: Customer places an order with Epec that contains multiple delivery dates, scheduled over a period of time, at predetermined pricing. Having a blanket order saves the customer from holding large inventories and avoids the administrative expense of processing frequent purchase orders, while favoring discount pricing through volume commitments.

Each of the inventory programs has a different level of cost associated with increased operating expenses and working capital requirements.

Epec is one of the few companies in the industry with the financial capability to offer the flexibility of inventory management programs.

It is our goal to help our customers create a competitive advantage for themselves by improving product lead times while at the same time reducing inventory requirements.

Visit Our Website @ www.epectec.com

AMERICA'S OLDEST. A HISTORY OF INNOVATION.

CONTACT US

The 60-year story of Epec is connected to the development of the PCB and the electronics industry.

Epec, through the merger of Electralab and Printed Electronics Corp (EPEC), are proudly two of the five founding members of the IPC, the 2,900 member trade association supporting the $1.5 trillion global electronics industry.

From pioneering innovation in the PCB Industry with R & D, training and setting professional core values, the legacy of Epec has now passed to a new generation of very bright young people, but still continues the great tradition of imagination.

In incubating new technologies, the Epec team continue breaking new frontiers in engineering, and enjoying exponential growth in related sectors of electronics, with custom battery packs, membrane switches, rubber keypads, and EC fans and drives.

Our knowledgeable staff has many years of experience in the industry. We welcome the opportunity to put our skills to work for you! Please contact us with any questions or requests.

North American Headquarters174 Duchaine Blvd.New Bedford, MA 02745Toll Free: (888) 995-5171Tel: (508) 995-5171Fax: (508) 998-8694

Contact Us By Email:Sales [email protected] [email protected] [email protected] [email protected]

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