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PRESENTS INTERNATIONAL SUMMIT FOR PACKAGING INDUSTRY INDIAN INSTITUTE OF PACKAGING RESEARCH CONCLAVE During Knowledge Partner 27th- 28th October, 2017 at Hotel Eros, Nehru Place, New Delhi, India Supported by Department of Commerce Ministry of Commerce and Industry Government of India 2017 The Asian Packaging Federation

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PRESENTS

INTERNATIONAL SUMMIT FOR PACKAGING INDUSTRY

INDIAN INSTITUTE OF PACKAGING

RESEARCHCONCLAVEDuring

Knowledge Partner

27th-28thOctober,2017atHotelEros,NehruPlace,

NewDelhi,India

Supported by

Department of CommerceMinistry of Commerce and Industry

Government of India

2017

The Asian Packaging Federation

AbouttheInstitute

WorldPackagingOrganisation

TheAsianPackagingFederation

ISPI

2017 R

esearc

h C

on

cla

ve

AboutResearchConclaveResearch Conclave will be organised as Parallel Session

concurrently with International summit for Packaging

Industries(ISPI)whichwillbeheldduring27-28October,2017.

ThemainobjectiveoftheResearchConclaveistoencouragethe

youngscientistsfromtheAcademic/ResearchInstitutionsand

Industries,whoareInvolvedininnovativePackagingResearch.

ItisbelievedthattheResearchconclavewouldattracttheyoung

scientistsfromIndiaaswellasoverseastooneplatformduring

the summit. This would definitely motivate the young

researchers and scientists to enhance the credibility

ofresearchinthefieldofpackaging.

PosterPresentationItisplannedtohaveaPosterPresentationSessionondifferent ResearchTopicswhichwillbeinauguratedon27thOctober,2017bytheChiefguest.The students from various National and International Universities/Colleges/Institutions&IndustriesinvolvedinNovelResearchrelatedtoPackagingmaterialManufacturing,Conversionprocesses,&Technologiesanduserswillparticipate.

PaperPresentationThePaperPresentationSessionwillbeopenedimmediateaftertheinauguralCeremonyofISPIon27October,2017.DuringtheResearchConclave,YoungScholarsandScientists fromvariousNationalandInternational InstitutionsincludingIndustriesareinvitedtopresenttheirNovelResearchworkrelatedtothePackaging. Fourparallel sessionswillbe conductedduring theConclavecoveringthetopicsi.e.PackagingInnovation,PackagingResearch&Technology,NewGenerationPackagingetc.

(IIP)isanationalapexbodywhich

was se t up in 1966 by the

packaging and allied industries and the Ministry of

Commerce, Government of India, with the specific objective of

improvingthepackagingstandardsinthecountry.TheInstituteisan

autonomousbodyworkingundertheadministrativecontrolofthe

Ministry of Commerce. The Institute endeavors to improve the

standardofpackagingneededforthepromotionofexportsandcreate

infrastructuralfacilitiesforoverallpackagingimprovementinIndia.

ThisisachievedthroughtheInstitute'smultifariousactivitieswhich

aretoday,inlinewiththoseofpremierpackaginginstitutestheworld

over.ThediversifiedactivitiesoftheInstituteencompassestheentire

spectrum of packaging which includes research & development,

education, training, testing, information, consultancy, exhibitions,

designs,publication, libraryanddatabaseservices.TheInstitute is

havingitsHeadQuartersatMumbaiandbrancheslocatedatDelhi,

Kolkata, Hyderabad and Chennai. Upcoming centres at Guwahati,

Bangaluru, Ahmedabad and Kakinada, are in the process of

establishment.TheInstitutehasrecentlycompleted.

Founded on 6th September, 1968 in Tokyo by visionary

leaders from the global packaging community, theWorld

Packaging Organisation (WPO) is a non-profit non-

governmental,internationalfederationofNationalpackaging

institutesandassociations,regionalpackagingfederationand

otherinterestedpartiesincludingcorporationsandtradeassociations.

TheAsianPackagingFederation(APF),anon-

profitorganisationestablishedinTokyo,Japan

in1967,unitesthepackaginginterestsofalltrade andindustriesin

theAsia-Pacificregionandbeyondunderonco-operativeumbrella.

TheAPFSecretariatrotatesamongst themembercountriesandis

currentlyhostedbytheIndianInstituteofPackaging.

ConcurrentEvents

The International Packaging Exhibition under

the banner of INDIAPACK pacprocess will be

jointly organized by Indian Institute of

PackagingandMesseDusseldorfIndiaatPragati

Maidan,NewDelhiduring26th-28thOctober,2017.

INDIASTAR&PACMACHINEAwardCeremony

TheINDIASTAR&PACMACHINEawardsdistributionceremonywill

be held to recognize the excellence in packaging innovation and

designofpackagingmaterialsaswellaspackagingmachinery.

AboutJournalofPackagingTechnologyand

Research(JPAC):

TheIndianInstituteofPackaginghastakenagreatinitiativetopublish

theInternationalJournalofPackagingTechnologyandResearchthrough

the reputed publishing company i.e., Springer Nature. The main

objective of this journal to publish the original high quality research

papers, reviews, research articles and IPR (patent) related notes on

packagingscienceandtechnologytohighlightabouttheinnovationsin

different types of primary packagingmaterials like paper and paper

board, plastic films and laminates, aluminium foils,metal containers,

glass and composite containers, plastic rigid containers etc., The

secondarypackagingmaterialslikewoodencontainers,corrugatedfibre

boardboxes,fibredrum,naturalfabricmaterialslikejute,plasticwoven

sack, intermediate bulk containers (IBC) and the ancillary packaging

materials like caps and closures, labels, printing inks and adhesives,

coatingsetc., and theirapplications inpackagingofdifferent typesof

commodity goods like food, pharmaceuticals, cosmetics, toiletries,

chemicals, cements etc., either to enhance the shelf life of perishable

goodsortoincreasethefunctionalpropertiesofpackagingmaterialsto

provideadequateprotectiontonon-perishablegoodsandthustoreduce

thedamagesofgoodsduringhandling,storageandtransportation.

Keepinginviewofthisobjective,theinstitutepublishedthe“synopsis”of

Journal of Packaging Technology and Research (JPAC) which was

releasedon14thMay,2016tocommemoratetheclosingceremonyof

GoldenJubileeCelebrationoftheInstitute.Thesynopsiswashighlighted

abouttheobjectiveofthejournal,topicstobecovered,instructionfor

authorsandtheprofilesoftheesteemedmembersofEditorialBoard.

Inaddition,thefistissueofthisjournalhasalreadybeenpublishedin

March,2017bySpringerNatureasopenaccessmodelistoaddressthe

needofresearchersinpackagingtomaximizethedisseminationandalso

theimpactontheirresearch.Theopenaccessjournalwillprovidethe

numberofadvantagestotheresearcherslikemorevisibility,usageand

citationfortheirresearchwork.Moreover,thisopenaccessmodelwill

increasemoreopportunityforcollaboration,fasterandeasieraccessof

informationtotheresearchers.

Itisalsoexpectedthattherewillbeanadequatenumberofqualitative

researchpaperwhichwillbeselectedeitherfromtheoralpresentation

ortheposterpresentationduringthisresearchconclaveandtheselected

researchpaperwillbeconsideredtopublishinthenextissueofJournal

ofPackagingTechnologyandResearch.

SpringerNaturewillsponsorthreeprizesforPosterPresentation

aswellasforOralPresentation

DignitariesatOpeningSession

RegistrationDetail

The registration fee forparticipatinginResearchConclaveduring InternationalPackaging Summit is as follows:

- Discounted Fee for Indian Presenters/Scholars- 2,000/-(Inclusive of all taxes).

- Discounted Fee for Foreign Presenters/Scholars- $100/- each (Inclusive of all taxes).

Eminent Speakers

Prof.AbdellahAjjiDepartmentofChemicalEngineering

EcolePolyTechnique,UniversityofMontreal,Canada

Prof.HariNiwasMishraProfessor,Agricultural&Food

EngineeringDepartmentIIT,Kharagpur

Prof.KuruvillaJosephSr.ProfessorandDean(SA)DepartmentofChemistry,IndianInstituteofSpace

ScienceandTechnology(IIST),

Dr.VirendraKumarGuptaRelianceResearch&Development

Centre,Mumbai

Prof.V.P.SharmaSeniorPrincipalScientist,Head,QualityAssurance&

Prof.AcSIRatCSIR-IndianInstituteofToxicologyResearch,Lucknow.

Prof.SuprakasSinhaRayDirectorandChiefResearcher,

PolymerNanocomposites,CSIR,SouthAfrica

Prof.(Dr.)S.S.MishraChairman

EducationCommittee,IIP

Prof.(Dr.)A.K.GhoshChairman-R&DandEdu.

Committee-IIPCo-Chairman-ISPI

Mr.SubodhGuptaChairman

IndianInstituteofPackaging

Prof.(Dr.)N.C.SahaDirector,

IndianInstituteofPackaging

Dr.IndranilManna,Director

IIT,Kanpur

Mr.AshokGoelChairman&

ManagingDirectorEsselPropackLtd.

DAY -1 27.10.2017 (Friday) Business Day DAY -2 28.10.2017 (Saturday) Technology Day

Opening Session

SESSION I :

PACKAGE INNOVATION

Ÿ Sealability in Packaging: Effect of Materials and Process parameters

Ÿ Fabrication of slow-release system with prolonged antibacterial activity

Ÿ Development of Lightweight Microcellular PC/ABS boards for Packaging

Applications

Ÿ Impact of Package Design on the Handloom products by using the Design

Process to Influence Consumer Perceptions

Summing-up

SESSION II :

PACKAGING RESEARCH & TECHNOLOGY

Ÿ Bridging the Innovation Chasm “Research to Industry”

Ÿ Biodegradable material based on carbon dioxide plastics for packaging

applications

Ÿ Time temperature indicating active chitosan film with anthocyanin from

Brassica oleraceae (Red Cabbage) and Beta Vulgaris (Beetroot) for intelligent

food packaging application.

Ÿ Mechanical, barrier, antimicrobial and migration properties of Pectin/

Laponite RD/ AgNPS nanocomposite coating on surface modified

polypropylene

Ÿ Development and Performance Evaluation of Active Corn Starch Film

incorporated with Green Tea Extracts and Palm Oil

Summing-up

Visit to Poster Session

FOLLOWED BY NETWORKING DINNER & INDIASTAR STUDENT AWARD

CEREMONY

FOCUS SESSION: Innovations For SustainabilityŸ Interactive Packaging and its relevance

SESSION III : NEW GENERATION PACKAGING Ÿ Nanotechnology for packaging applicationsŸ Quality assessment of broccoli under MAP storageŸ Development of PCM based Packaging material for Thermal BufferingŸ Gelatin based composite films: studies on thermal mechanical barrier and

antibacterial properties for food packaging applicationŸ Innovative child resistant packaging for solid dosage form

Summing-up

Presentation by: Ms. Swati Meherishi, Executive Editor, Springer Nature

SESSION-IV: RECENT DEVELOPMENTS IN PACKAGING Ÿ Novel and Emerging Technologies for Food Packaging & Self Life ExtensionŸ Plastics Packaging: Innovations and Sustainability Approaches for Improved

Management PracticesŸ Effect of packaging conditions on quality of high fiber reduced calorie

biscuits during storage and development of shelf life prediction modelsŸ Study of Load Carrying Capacity of 3D Printed Pallet using FDMŸ Multivariate accelerated shelf life test (MASLT) of Jamun (Syzygium cumini)

based functional confection packaged in metallized BOPPŸ Development of polylactic acid/ nano-chitosan films for packaging of Indian

White Prawn

Summing-up

Panel Discussion: Innovative Packaging through Research – A Need of the Hour for consumer goods

Award Ceremony for Poster & Oral Presentation

Concluding Session

TECHNICALPROGRAMME

Mr.VimalKatiyarAssociateProfessor,

DepartmentofChemicalEngineering,IIT,Guwahati

For Further Details, Please Contact

Dr. Tanweer Alam, Convener ISPI-2017 & Joint Director

Indian Institute of Packaging

Plot No. 21, FIE, Patparganj, Delhi - 110 092 INDIA

Tel : 91 - 011 - 2216 6703 / 4 / 5, Mob. : +91 - 93106 01300

Email : [email protected], [email protected] , Website: www.ispi2017.in

Head office/IIP-Mumbai

Plot E-2, Road No. 8,MIDC Area, Andheri East,

Post Box No. 9432,

IIP-Chennai

Plot no. 169, Industrial

Estate, 2nd Main Road,Burma Colony Perungudi

Chennai – 600096

[email protected]

IIP-Kolkata

Block C. P. - 10,

Sector – V, Salt Lake, Bidhan Nagar,

Kolkata – 700091

[email protected]

IIP-Hyderabad

Lux - 3,

Industrial Estate, Sanath Nagar,

Hyderabad - 500 018.

[email protected]

IIP-Ahmedabad

1st Floor, CFC Building,

Apparel Park, GIDC,

Khokhra,

Ahmedabad - 380021

[email protected]

[email protected]

AKSHARDHAM TEMPLE INDIA GATE LOTUS TEMPLE RASHTRAPATI BHAVAN RED FORT

DELHI TOURIST SPOT

--------------------------------------------------------------------------------------------------------

GlimpsesofIIPResearchConclave-2015

Dr. Tanweer Alam

Joint Director, IIP-Delhi

CONVENER CO-CONVENERS

Mr. Madhab Chakraborty

Joint Director, IIP-Hyderabad

Dr. R. Ranga Prasad

Joint Director, IIP-Mumbai

Mr. Bidhan Das

Deputy Director, IIP-Kolkata

Director

Indian Institute of Packaging

Chairman Research Conclave, ISPI

Dr. A.K. Ghosh

Chairman-R&D and Edu. Committee- IIP Delhi

Prof. Polymer Science- IIT Delhi & Co-Chairman-ISPI

Prof. (Dr.) N.C. Saha Dr. S.S. Mishra

RESEARCH CONCLAVE COMMITTEE

COMMITTEE FOR RESEARCH CONCLAVE FOR PACKAGING INDUSTRY 2017

MEMBERS

Dr. Ashutosh Upadhyay

Prof. & Head, Dept of Food Tech.

Dean Academic, NIFTEM

Dr. Abhijit KarPrincipal Scientist,

Division of Food Sci. and Post Harvets Tech.

IARI, Pusa

Dr. P. Narender Raju

Scientist (Food ScI. & Tech.)

Dairy Tech. Division NDRI,Haryana

Dr.(Ms) Sampa Saha

Assist. Prof., Centre of Polymer

Sci. and Eng. IIT, Delhi

Dr. (Ms.) Sushmita

Assist. Prof., BA CAS

Delhi University