presentation_file_511d701e-9124-4324-be59-06acac104df2

7/29/2019 presentation_file_511d701e-9124-4324-be59-06acac104df2

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J.GaylordGasque

CeramicComponentTechnologies,Inc.(CCT)

1487Poinsettia

Avenue,

Suite

127

Vista,CA92081,USA

Phone:(760)2953180

[email protected]

MichaelS.Randall

AlmegacyLLC

313RiverWalkDrive

Simpsonville,SC

29681

USA

Phone: (864)6081047

[email protected]

WilliamR.Harrell,GithinAlapatt

ClemsonUniversity

HolcombeDept.ofElectrical&ComputerEngineering

205Riggs

Hall,

Box

340915

Clemson,SC 296340915

Phone: (864)6565918

[email protected]

[email protected]

CARTSInternational2012,March2629,LasVegasNevada

Ceramic Component Technologies, Inc.

1


2/11


Abstract: Paper3.3

Accurateandconsistentimpedancebasedmeasurementsaredifficulttoachieveinthe

caseof

very

low

or

very

high

impedance

situations

(e.g.,

near

1nF capacitors

at

1MHz).

Forthesesituations,itisimportanttouseshielded,Kelvintypecontacts,andthe

fixturingusedshouldbeoptimizedtocontactthedeviceundertest(DUT)inamanner

thatconsistentlyminimizescontactresistancewithoutdamagingtheterminalsofthe

DUT. NotallKelvintypefixturesarecreatedequally,however. Inthisstudythebenefit

ofthe

application

of

proprietary

fixturing

technology

to

high

precision

test

and

measurementapplicationsisdiscussed. Severalexamplesareusedtoillustratethe

benefitofsaidproprietarydesignsovercommerciallyavailablealternatives. Thedata

indicatethatuseofthistechnology resultsinmeasurementsthataremoreaccurate,

consistent,andstable. Theseproprietarycontacttechnologiesenableseveralsignificant

benefitsto

the

user,

including

more

consistent

contact

with

reduced

contact

resistance,

moreaccurateandstablemeasurementsthatenablereducedguardbandingand

superiorcontactlongevitythatenablesreducedpreventivemaintenanceaswellas

reduceddowntime. Thestudyindicatesthatthesenewandproprietarycontact

technologiesenablecheaper,betterandfastermeasurementofkeyimpedancebased

deviceparameters.


2


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DesignDiscussion:TweezersTypeFixturing

U.S.

Patent

7,456,642


CurrentStateoftheArt

DesignedforPurpose

3


4/11


DesignDiscussion: AutomatedTestFixturing

U.S.

Patents

6,756,798,

7,005,869


CurrentStateoftheArt

DesignedforPurpose

4


5/11


DesignDiscussion: Other

(Pogopinforflyingprobeofbedofnails,etc.)U.S.6,957,005


DesignedforPurpose

5


6/11


Experimental


Fixture

TypeSupplier Model

Number

A Agilent 16034B(StandardDesign)

B SMD SMDClip4BNC

(Standard

Design)

C CCT MulticontactTestTweezer (Designed

forPurpose,PatentedDesign)

TweezersTypeFixturesEvaluated

6

CCTPatented

Technology


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ResultsandDiscussion:

DataSummary,

Tweezers

Type

Fixturing


Average St.Dev.P Average St.

Dev.P Average St.

Dev.P Average St.

Dev.P Average St.

Dev.P Average St.

Dev.P

1 0.1pF0603C0G+/0.1pFMLCC(pF) 0.194 0.00131 0.012% 0.0026% 1.744 0.03951 11.993% 7.3566% 0.129 0.00042 0.029% 0.0209%2 1.0pF1206C0G+/0.25pFMLCC(pF) 1.017 0.00056 0.017% 0.0009% 2.635 0.06036 3.290% 8.4016% 1.005 0.00049 0.006% 0.0025%3 10pF1206C0G+/ 5%MLCC(pF) 10.109 0.00082 0.036% 0.0003% 12.485 0.13680 1.093% 3.0565% 10.085 0.00037 0.015% 0.0003%4 100pF1206C0G+/ 5%MLCC(pF) 101.07 0.00114 0.055% 0.0019% 110.90 0.06898 0.068% 0.1186% 100.88 0.00066 0.021% 0.0003%5 1000pF1206C0G+/ 5%MLCC(pF) 1,003.0 0.01966 0.198% 0.0066% 1,084.5 0.25169 0.023% 0.0172% 994.3 0.01296 0.068% 0.0010%6 10F1206X7R+/ 10%MLCC(F) 10.01 0.00656 3.783% 0.5999% 9.85 0.12427 12.377% 4.4646% 9.958 0.02586 3.167% 0.0736%7 100F1206X5R+/20%MLCC(F)

83.51

0.026716.184% 0.0501% 81.230 2.54010

15.893% 8.8410%83.365 0.06636

5.789% 0.0148%8 1000F2917 5m ESR +/20%Ta(F) 989.1 0.10112 11.940% 7.8607% 997.4 2.08947 9.408% 18.3893% 990.2 0.47232 2.661% 0.6511%

SampleSample# A B C

Capacitance DF(%) Capacitance DF(%) Capacitance DF(%)

TweezersType

7

Overallbestperformancewithpatentedtweezersdesign(C)

TypeBresultedinoutofspecmeasurementsforallsamplesevaluated

Type

A

results

in

out

of

spec

measurements

for

2

of

8

samples

evaluated


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ResultsandDiscussion:Timeseries,Samples1and2


8

99.0%

99.5%

100.0%

100.5%

101.0%

0 20 40 60 80 100

NormalizedCapacitance(%)

NormalizedCapacitanceTimeSeries

ProbeA ProbeB ProbeC

60%

70%

80%

90%

100%

110%

120%

130%

140%

0 20 40 60 80 100

NormalizedCapacitance(%)

NormalizedDFTimeSeries


99.2%

99.4%

99.6%

99.8%

100.0%

100.2%

100.4%

100.6%

100.8%

0 20 40 60 80 100

NormalizedCapacitance

(%)

NormalizedCapacitanceTimeSeries


60%

70%

80%

90%

100%

110%

120%

130%

140%

150%

0 20 40 60 80 100

NormalizedCapacitance

(%)

NormalizedDFTimeSeries


Cexhibits

highest

stability

in

all

cases

Sample1(0.1pF)

Sample2(1pF)


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ResultsandDiscussion:

DataSummary,

Automated

Fixturing


Average St.Dev.P Average St.Dev.P Average St.Dev.P Average St.Dev.P

9 1.0pF1206C0G+/0.25pFMLCC(pF) 0.989 0.00066 0.018% 0.005% 0.970 0.00803 0.036% 0.009%10 10pF1206C0G+/ 5%MLCC(pF) 9.955 0.0019 0.005% 0.001% 9.909 0.0276 0.056% 0.021%11 1000pF1206C0G+/ 5%MLCC(pF) 1,014.72 0.0020 0.003% 0.001% 1,014.88 0.0326 0.016% 0.003%12 10F1206X7R+/ 10%MLCC(F) 9.89 0.0086 3.13% 0.010% 9.86 0.0104 3.06% 0.016%

Sample#

Sample

AutomatedFixturing Type

WellShielded Poorly

Shielded

Capacitance DF(%) Capacitance DF(%)

9

Wellshieldedoutperformspoorlyshieldedinallbutonecomparison


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Conclusion: TweezersTypeFixturing


Kelvin4PointConvergenceNeartheDUTTerminal

MeasurementAccuracy

MeasurementPrecision

MultipleContactsperDUTTerminal(lower,moreconsistentESR)

OrthogonalDUTterminalcontact(MechanicallyRobust,Consistency)

LongLastingContactConfiguration/Finish

SmallCase

Size

Component

Capable

(


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Conclusion: AutomatedChipTestFixturing

Kelvin4PointConvergenceNeartheDUTTerminal

MeasurementAccuracy

MeasurementPrecision

MultipleContact

per

Terminal

(lower,

more

consistent

ESR)

LongLastingContactConfiguration/Finish

Category WellShielded

Poorly

Shielded/

Rolling

Contact

AutomtatedFixtureType


11

Designedforpurpose,wellshieldedautomatedtestfixturingoffers

numerousperformanceadvantagesoverpoorlyshieldedandrolling

contacttype

state

of

the

art

fixture

designs

for

automated

chip

testing

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