practical method for modeling conductor surface roughness ......practical method for modeling...
TRANSCRIPT
![Page 1: Practical Method for Modeling Conductor Surface Roughness ......Practical Method for Modeling Conductor Surface Roughness Using Close Packing of Equal Spheres Bert Simonovich Lamsim](https://reader034.vdocuments.us/reader034/viewer/2022042515/5f66ccbbf54cce52b7655565/html5/thumbnails/1.jpg)
Practical Method for Modeling Conductor
Surface Roughness Using Close Packing
of Equal Spheres
Bert Simonovich Lamsim Enterprises Inc. [email protected]
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2
Acknowledgements
David Dunham, Molex Inc.
Scott McMorrow, Teraspeed Consulting. -A Division of Samtec
Dr. Yuriy Shlepnev, Simberian Software Corp.
Dr. Alexandre Guterman
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Outline
Overview
Conductor loss
Copper foil fabrication
Modeling roughness
Hexagonal Close-packing of Equal Spheres Model
Practical method to determine rough conductor loss
Case study
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With just -3.5dB delta @12.5 GHz => ½ the eye height with rough copper
4
Failure To Model Roughness Can Ruin You Day
Rough Copper Smooth Copper
Simulated with Keysight ADS
25Gb/s
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Current distribution at DC is uniform through cross-sectional area of conductor
5
DC Current Distribution Through a Rectangular Conductor
t
w
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DC resistance is proportional resistivity and inversely proportional to the cross sectional area
6
DC Resistance
t
w
_ / mDC condRt w
ρ = Bulk resistivity of the material in Ω-m
X-sectional Area
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Above ~10MHz current flows mainly along “skin” of the conductor
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Skin Effect
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δ
Skin depth (δ) is effective thickness where AC current flows
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Skin Depth
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Skin Depth vs Frequency
μ0 = Permeability of free space in H/m σ = Conductivity in S/m.
0
1
f
δ
Skin depth inversely proportional to 𝑓
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AC Resistance
δ
w
_ / m2
AC condRw
Effective X-sectional Area
Reduced cross-sectional area causes AC resistance to increase proportional to 𝑓
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High frequency currents concentrated mostly along surface facing reference plane due to proximity effect
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Current Distribution Microstrip
Reference Plane
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Current Distribution Stripline
Reference Plane
Symmetrical
Reference Plane
Reference Plane
Asymmetrical
Reference Plane
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Return current on respective reference plane ≈ +/-3H from signal conductor center
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Return Current Distribution
H
3H 3H
H2
H1
3H1
3H2 3H2
3H1
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RAC_microstrip = RAC_trace + RAC_ref
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AC Resistance Microstrip
H
w
t
2
0_ 2
1 1 40.94 0.132 0.0062 ln /m ; when 0.5 10
5.8 0.03AC microstrip
wf w w w wHR f
w Hw H H t H
H w
Reference [1]
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1. Determine RAC_microstrip1
2. Determine RAC_microstrip2
3. Combine both in parallel
4. Determine Insertion Loss:
15
Stripline Conductor Loss
_ 1 _ 2
_ 1 _ 2
_ /mAC microstrip AC microstrip
AC microstrip AC
AC str
microstrip
ipline
R f RR
f
R Rf
f f
_
10( ) 20log dB/m( )
AC stripline
smooth
R fIL f e
Zo f
H2
H1
w2
w1
t
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Conductor Loss Model Validation
4 in
Excellent correlation!
_
10( ) 20log dB/m( )
AC stripline
smooth
R fIL f e
Zo f
VS
Keysight ADS Momentum
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No such thing as a perfectly smooth PCB conductor surface
Roughness is always applied to promote adhesion to the dielectric material
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Conductor Roughness
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Copper Foil Manufacturing Processes
VS
Rolled Electro-deposited (ED)
Lower Cost Smoother
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Copper bar fed through a series of progressively smaller rollers to achieve final thickness
Roller smoothness determines final smoothness of foil
19
Rolled Copper Foil Fabrication Process
Copper Foil
Reducing Rollers
Copper Bar
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Drum speed controls foil thickness
Matte side always rougher than drum side
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Electrodeposited Copper Foil Fabrication Process
Cathode
Drum Side
Matte Side
Anode
Drum
Untreated Foil
Cu Sulfate
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Common Roughness Profiles
IPC Standard Profile IPC Very Low Profile(VLP) Ultra Low Profile (ULP)Class
SEM Photos Courtesy [6]
No min/max spec < 5.2 μm max -Other names: HVLP, VSP -No IPC spec -Typically < 2 μm max
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Electro-deposited Copper Foil Nodulation Treatment
Drum Side Untreated
Matte Side Untreated
Drum Side Treated
Matte Side Treated
Untreated Foil
Nodulation Treatment
Treated Foil
Drum Side
Matte Side Matte Side
Drum Side
SEM Photos Courtesy [2]
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Profilometers are often used to measure surface roughness
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Measuring Surface Roughness
Stylus Tip
Surface Profile
Stylus Sample
Motor Drive and Processing Unit
Measured Profile
Stylus Pickup Unit
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3D Scan Profile
Faster
More reliable
More accurate
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Optical Profilometer
Sample
Measured Profile
Optics
CCD
Processing Unit
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Average roughness (Ra) typically specified for drum side on data sheet
Ra = Arithmetic average of the absolute values of deviations Yi
25
Average Roughness Parameter
N
a i
i
R YN
1
1
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Ten-point mean roughness (Rz) typically specified for matte side on data sheet
Rz= Sum of the average of the five highest peaks and the five lowest valleys over the sample length
26
Ten-point Mean Roughness Parameter
z Pi Vi
i i
R Y Y
5 5
1 1
1 1
5 5
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Modeling Copper Roughness
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Assumes 2D corrugated surface
Based on mathematical fit to S.P. Morgan Power Loss Data (1948)
Lose accuracy above 5GHz for rough copper
28
Hamerstad & Jenson Model
22
1 arctan 1.4rough
HJ
flat
PK
P
RMS tooth height in meters
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SF = scaling factor representing the ratio of the length of the rough surface (Lrough )to the spatial length (Lspatial) –Ref [2]
Impractical from first principles perspective – Lrough not published in data sheets
29
Modified Hamerstad & Jenson Model
2
21 arctan 1.4 1
rough
HJM
flat
PK SF
P
Lspatial
Lrough
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𝐴𝑚𝑎𝑡𝑡𝑒
𝐴𝑓𝑙𝑎𝑡 = relative area of the matte base compared to a flat surface
ai = radius of the copper sphere (snowball) of the ith size, in meters
𝑁𝑖
𝐴𝑓𝑙𝑎𝑡 = number of copper spheres of the ith size per unit flat area in
sq. meters
δ (f) = skin-depth, as a function of frequency, in meters
30
Huray “snowball” Model
SEM Photo Courtesy [3]
1
2 2
21
43 ( ) ( )1
2 2
jrough matte i i
SRH
iflat flat flat i i
P A N a f fK f
P A A a a
Reference [2]
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Huray Model Prior Art
11 spheres min; 38 spheres max of radius 1μm to fit within hex tile area and height of 5.8μm
Fit equation parameters to measured data
Assumes stacked “snowballs” arranged in hexagonal lattice
SEM Photo Courtesy [3] Plot Courtesy [2]
VNA Measurement
Model
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Benefits:
Practical
Accurate
Issues:
Expertise Required
Time
Money
32
Design Feedback Method*
*Reference [2]
Design Product Channel Simulation
Dk
Df
Roughness
Extract Parameters
Fit
Model Test Design Coupon
X-section Data
Fab
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Hexagonal Close-packing of Equal Spheres (HCPES) Model
33
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Why Bother?
Helps make informed decision sooner - “Sometimes an OK answer NOW! is more important than a good answer late” – Eric Bogatin
Fast simulation time - Practical for what-if spreadsheet analysis
Minimal expertise required
Useful to sanitize CAD tools
Useful to gain intuition on what to expect with measurements and help determine root cause of differences
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Similar to Huray Model
Based on close-packing of 11 equal sized spheres
Does not require SEM analysis to determine stack height (HRMS ) or hexagonal tile area
35
HCPES Model
Reference [5]
Hexagonal Tile Area
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Assumes nodule treatment applied
to perfect flat surface
Sphere radius and hex tile area
determined solely on published
roughness parameters from
manufacturer’s data sheet
36
HCPES Correction Factor
2
2
2
1 66( ) ( )
12
rough Hex
HCPES
flat
r
P AK f
P f f
r r
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HCPES lattice structure loosely resembles the actual SEM photo
37
HCPES Model Lattice Structure
SEM Photo Courtesy [3]
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Lattice structure scales inversely to the square of the height
38
HCPES Model Scalability
H H/2
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Total of 11 equal sized spheres
HRMS = height of 2 tetrahedrons plus 2 sphere radii
Hexagonal tile perimeter surrounds 7 base spheres exactly
39
HCPES Model Anatomy
Hexagonal Tile
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Determine Height of Single Tetrahedron
40
H
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1. Determine DE
Given: Each side of the tetrahedron = 2r Using Pythagorean theorem:
2
3DE DF
2 2
2 2
2
3
22
3
23
3
DE DB BF
r r
r
A
D
B
F
C E
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2. Determine Height (AE)
Therefore:
2 2
22 2
2 33
26
3
AE AD DE
r r
r
A
D
B
F
C E
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Since HRMS = height of 2 tetrahedrons + sphere dia.
Therefore sphere radius is:
43
Determine HCPES Sphere Radius
2 2
22 6 1
3
RMSH AE r
r
22 6 1
3
RMSHr
r
r
A
E
HRMS
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AHex = 6 x area of equilateral triangle ADG
44
Determine Hexagonal Tile Area
2
2
6
1 16 1 3 1
3 3
16 3 1
3
HexA DF AF
r r
r
Hexagonal Tile Area
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Method to Determine Rough Conductor Loss
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Typically:
Must consider roughness of each side when determining AC resistance
Matte sides bonded to core
Drum sides bonded to prepreg
Drum sides roughened with oxide or etch treatment prior to lamination
46
Stripline Geometry with Surface Roughness Example
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Dual Triangular Sawtooth Profile (DTSP) Model
Used to approximate RMS height of matte and drum side
2 3
aRMSa
RH
2 3
zRMSz
RH
Matte Side Rz
Drum Side Ra
PCB Conductor DTSP
Mean
Mean
Not to Scale
Ra
Rz
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1. Determine RMS Tooth Height of Matte and Drum Sides
_2 3
zRMS matte
RH
_2 3
aRMS drum
RH
*Use Micro-etch Roughness for Drum Side
*
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2. Determine HCPES Matte & Drum Correction Factors
_
22 6 1
3
RMS matte
matte
Hr
2
2
_
16 3 1
3Hex matte matteA r
_
22 6 1
3
RMS drum
drum
Hr
2
2
_
16 3 1
3Hex drum drumA r
2
_
_2
2
1 66( ) ( )
12
matte
Hex matte
HCPES matte
matte matte
r
AK f
f f
r r
2
_
_2
2
1 66( ) ( )
12
drum
Hex drum
HCPES drum
drum drum
r
AK f
f f
r r
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3. Determine AC Resistances of Each Surface
Reference [1]
1
2
0 1 1 1_ 2
1 1 1
41 1ln 0.94 0.132 0.0062 /mAC w
f w w wR f
w t H H
2
2
0 2 2 2_ 2
2 2 2
41 1ln 0.94 0.132 0.0062 /mAC w
f w w wR f
w t H H
1
0 1_ _1
1 1 1
1 1
/m
5.8 0.03
AC ret
w
f HR f
w w H
H w
2
0 2_ _ 2
2 2 2
2 2
/m
5.8 0.03
AC ret
w
f HR f
w w H
H w
* when 0.5 10n
n
w
H
*
*
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4. Determine Stripline Rough Conductor Loss
2 2_ _ _ _ /mAC drum HCPES drum AC w AC retR f K f R f R f
1 1_ _ _ _ /mAC matte HCPES matte AC w AC retR f K f R f R f
_ _
_ _
_ _
/mAC matte AC drum
AC stripline rough
AC matte AC drum
R f R fR f
R f R f
_ _
10( ) 20log dB/m( )
AC stripline rough
rough
o
R fIL f e
Z f
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Case Study
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Test Platform
Case 1 Megtron-6
HVLP Cu
Case 2 N4000-13EP
VLP Cu
Photos courtesy [2]
12 Layer test boards designed, built and tested by Molex Inc., courtesy of David Dunham
Generalized Modal S-parameters (GMS) data courtesy Scott McMorrow, Teraspeed Consulting Group
Generalized Modal S-parameters (GMS) data courtesy Yuriy Shlepnev, Simberian Software Corp
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Parameter Case 1 Megtron-6 Case 2 N4000-13EP
Dk 3.62 @50GHz 3.6-3.7 @10GHz[i]
Df 0.006 @ 50GHz 0.008-0.009 @ 10GHz[ii]
Rz HVLP 1.50 μm -
Rz VLP - 2.50 μm
Ra w/Micro-etch [iii] 1.44 μm 1.44 μm
Trace Thickness, t 15.23 μm 15.23 μm
Trace Widths w1, w2 251 μm, 236 μm 251 μm, 236 μm
Dielectric Heights, H1,H2 249 μm, 231 μm 249 μm, 231 μm
GMS trace length 10.15 cm (4.00 in) 10.15 cm (4.00 in)
Zo(fo) ohms [iv] 52.29 @ 50GHz 52.07 @ 10GHz
[i] Dk = 3.65 used [ii] Df = 0.0085 used [iii] CO-BRA BOND® SM is an example of a hydrogen peroxide/sulfuric acid micro-etch treatment often used by PCB
fabricators to improve the adhesion of copper surface to dielectric materials. [iv] Zo(fo) = Characteristic impedance determined by 2D field solver at frequency fo
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Board Parameters From Data Sheets and Design
Stripline Geometry Reference
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Determining Total Insertion Loss
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_ Total diel cond roughIL f IL f IL f
Keysight ADS
• Svensson/Djordjevic wideband Debye model used to ensure causality for dielectric loss
• Conductivity parameter set to a value much-much greater than the normal conductivity of copper ensures the conductor is lossless for the simulation
_ _
10( ) 20log dB/m( )
AC stripline rough
rough
o
R fIL f e
Z f
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Simulation Correlation Results
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Excellent correlation!
VLP HVLP
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Model Comparisons
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2
2
2
1 66( ) ( )
12
rough Hex
HCPES
flat
r
P AK f
P f f
r r
HCPES HJ
22
1 arctan 1.4rough
HJ
flat
PK
P
HJM
2
21 arctan 1.4 1
rough
HJM
flat
PK SF
P
Tuned SF=1.65
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Correction Factor Comparisons (Ra = 1.44μm; Rz =2.5 μm)
58 KHJM SF = 1.65 KHJM SF = 1.65
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Summary and Conclusions
1. Using the concept of hexagonal close-packing of equal spheres, a novel method to accurately calculate sphere size and hexagonal tile area was devised for use in the Huray model.
2. By using published roughness parameters and dielectric properties from manufacturers’ data sheets, we show the need for further SEM analysis or experimental curve fitting, may no longer be required for preliminary design and analysis.
3. HCPES model looks promising as a practical alternative to previous modeling methods.
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Ongoing Research
Test the HCPES model to see how well this method applies to other material and copper roughness
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References [1] S. Hall, H. Heck, “Advanced Signal Integrity for High-Speed Digital Design”, John Wiley & Sons, Inc., Hoboken, NJ, USA., 2009.
[2] E. Bogatin, D. DeGroot, P. G. Huray, Y. Shlepnev, “Which one is better? Comparing Options to Describe Frequency Dependent Losses”, DesignCon2013 Proceedings, Santa Clara, CA, 2013.
[3] Huray, P.G.; Hall, S.; Pytel, S.; Oluwafemi, F.; Mellitz, R.; Hua, D.; Peng Ye, "Fundamentals of a 3-D “snowball” model for surface roughness power losses," Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on , vol., no., pp.121,124, 13-16 May 2007 doi: 10.1109/SPI.2007.4512227.
[4] Huray, P. G. (2009) “The Foundations of Signal Integrity”, Chapter 6, John Wiley & Sons, Inc., Hoboken, NJ, USA., 2009
[5] L. Simonovich, “Method for Modeling Conductor Surface Roughness”, Provisional Patent Application # US 61/977,138
[6] ISOLA-Group, “Copper Foil 102 Presentation”, 2012