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A

Presentation

On

3D ICs

Presented in partial fulfillment of Bachelors Degree in Technology

Electronics & Communication Engineering

Session: 2012-2013

PRESENTED TO: PRESENTEDBY:

Ms Smriti Sachan Shubham Manglik

Mr Amit kumar Jain (EC/09/50)

Department of Electronics and Communication EngineeringPoornima College Engineering, Jaipur

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CONTENTS

INTRODUCTION

IDEA FOR 3D IC

LIMITED PERFORMANCE OF 2D IC

3D ARCHITECTURE

MANUFACTURING TECHNOLOGY OF 3D ICs

ADVANTAGES OF 3D ARCHITECTURE

PERFORMANCE CHARACTERISTICS

CONCERNS IN 3D CIRCUITS

PRESENT SCENARIO IN 3D IC INDUSTRY

CONCLUSION

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INTRODUCTION

In electronics, a three-dimensional integrated circuit is a

chip in which two or more layers of active electronic components

are integrated both vertically and horizontally into a single circuit.

In contrast, a 3D IC is a single chip in which all components on

the layers communicate using on-chip signaling, whether

vertically or horizontally.

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IDEA FOR 3D IC

The large growth of computer and informationtechnology industry is depending on VLSI circuitswith increasing functionality and performance atminimum cost and power dissipation and 2D ICs

generate various gate delays and interconnectiondelay.

So to reduce these delays and total power

consumption,3D IC technology is introduced.

Intel introduced 80 core chip in 2007 which run on

the frequency of 1.4GHz.4

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LIMITED PERFORMANCE OF 2D ICs

As we try to increase the performance and

efficiency of chip, the complexity of chip design

increases and this requires more and more

transistors. So the final size of the circuit and

delays increases.

The losses increases with large interconnection

because the capacitance and resistances are

generated in between the clad and copper.

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3D IC ARCHITECTURE

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3D IC is a concept that can significantly :-

Improve interconnect performance,

Increase transistor packing density,

Reduce chip area

Power dissipation

In 3D design structure the entire chip Si is divided by

number of layers of oxide and metal, to form

transistors.

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MANUFACTURING TECHNOLOGY OF 3D ICs

There are four ways to built 3D ICs :-

1. Monolithic

2. Wafer on wafer3. Die on wafer

4. Die on die

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1. Monolithic

Electronic components and their connections

(wiring) are built in layers on a single

semiconductor wafer, which is then diced into 3D

ICs. There is only one substrate, hence no needfor aligning, thinning, bonding, or through-silicon

vias.

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2. Wafer on wafer

Electronic components are built on two or more

semiconductor wafers, which are then aligned,

bonded, and diced into 3D ICs.

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3. Die on wafer

Electronic components are built on two

semiconductor wafers. One wafer is diced aligned

and bonded onto die sites of the second wafer.

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4.Die on die

Electronic components are built on multiple dice,

which are then aligned and bonded.

One advantage of die-on-die is that eachcomponent die can be tested first, so that one

bad die does not ruin an entire stack

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AVANTAGES OF 3D ARCHITECTURE

3D integration can reduce the wiring, thereby

reducing the capacitances, power dissipation and

chip area improves performance.

Digital and analog circuits can be formed with

better noise performance.

It more cost effective then 2D integration.

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PERFORMANCE CHARACTERISTICS

1. TIMING

2. ENERGY

With shorter interconnects in 3D ICs, both

switching energy and cycle time are

expected to be reduced

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1. TIMING

The graph shows the

results of a reduction in

wire length due to 3Drouting.

Reduction in the

interconnect lengthsreduces RC delays and

increase chip timing

performance

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2. ENERGY PERFOMANCE

The graph shows

the reduction in a

normalized energyconsumption with

number of wire

layers.

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CONCERNS IN 3D CIRCUIT

Thermal Issues in 3D-circuits

Reliability Issues

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PRESENT SCENARIO IN 3D IC INDUSTRY

Many companies like MIT (USA), IBM are doing

research on 3D IC technology and they are going

to introduce cheaper chips for certain

applications, like memory used in digital cameras,

cell phones, handheld gaming devices etc.

The original cost will be 10 times lesser than the

current ones.18

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FUTURE OF THE 3-D IC INDUSTRY

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Matrix is working with partners including Microsoft

Corp, Thomas Multimedia, Eastman Kodak and

Sony Corp. three product categories are planned:

bland memory cards: cards sold preloaded with

content, such as software or music ; and standard

memory packages.

Thomson electronics, the European electronic

giant, will begin to incorporate 3-D memory chipsfrom matrix semiconductor in portable storage

cards, a strong endorsement for the chip start

up.

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CONCLUSION

3D ICs will be the first of a new generation of

dense, inexpensive chips having less delay and

interconnection losses that will replace the

conventional storage and recording media. We

can understand that 3-D ICs are an attractive

chip architecture, that can alleviate the

interconnect related problems such as delay and

power dissipation and can also facilitate

integration of heterogeneous technologies in one20

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QUERIES???

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