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Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

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Page 1: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Power in the Data Center:Future Trends in Computer Efficiency

Jon Haas

Enterprise Marketing Group

Intel Corporation

May 2007

Page 2: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 2

Legal Disclaimers*Other names and brands may be claimed as property of others. System Configuration details in backup. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104.

All dates and products specified are for planning purposes only and are subject to change without notice.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.

Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.

Performance per watt calculated as the benchmark result divided by the average system watts measured with an Extech* or like meter at the wall under “steady-state” load unless otherwise noted.

SPECint2000 and SPECfp2000 benchmark tests reflect the performance of the microprocessor, memory architecture and compiler of a computer system on compute-intensive, 32-bit applications. SPEC benchmark tests results for Intel microprocessors are determined using particular, well-configured systems. These results may or may not reflect the relative performance of Intel microprocessor in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information, including system benchmarks; to evaluate the performance of systems they are considering purchasing.

Page 3: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 3

Agenda

Future Computing Demands

Datacenter Computing Challenges

Enterprise Computing: Quadcore, multi-core and beyond

Page 4: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 4

Moore’s Law

Doubling the # of Transistors per chip about every 24 months

• 40 years of innovation

• Over 1 Billion transistors per chip

• Quad core is here

Increased Performance and Density

More functionality at

roughly the same cost

Multi-core and ThreadingPower efficiency

VirtualizationReliability

Security and manageability

Doubling Performance Every 24months.

Page 5: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 5

Energy Efficient Performance

Performance & Utilization

Power & Costs

1H/2006: Dual Core Xeon 5100 (Woodcrest) 2x performance @ 40% less power

1H/2007: Quad-Core, Clovertown2x Woodcrest in a single 5100 skt

Page 6: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 6

HPC Top500: An Example of Moore’s Law

1993 2017

10 PFlops

1 PFlops

100 TFlops

10 TFlops

1 TFlops

100 GFlops

10 GFlops

1 GFlops

100 MFlops1999 2005 2011

#1SUM

Top500

1 Server Today is Yesterday’s top HPC Machine

Typical Server2006: Dual Processor = 50 GFlop

2007: Dual Processor = ~ 100 GFlop

Source: HPC - www.top500.org, June 2006; PC - Intel

Page 7: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 7

Moore’s Law … Alive and Well in the Data Center

2002• 3.7 TFlops• 25 racks• 512 Servers• 1000 sq ft• 128 kW

2007• 3.7 TFlops• 1 rack• 53 Servers• 40 sq ft• 21 kW

Where would YOU rather be?

Page 8: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 8

Data Center Trends

Increasing power density and demand

Page 9: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 9

Eco-Regulation is Everywhere

Mercury Ban

Batteries

WEEE

RoHS

Batteries

Battery law

20002007

Lead ban, e-waste, and packaging law

27 states draft e-waste bills

E-waste & packaging laws, Carbon-neutral

E-waste

Battery law

E-waste , Dfe product &Packaging

E-waste

EuP

REACH

E-waste & Energy

E-waste

China RoHS

Energy law

Energy E-waste, RoHS,

Packaging

EPA: Energy Star, Carbon-emission reduction

IPP25 EU States – WEEE & RoHS

RoHS study

E-waste, RoHS

E-waste, RoHSDraft Dfe, Take-back,

Packaging

Draft RoHS, Battery

Page 10: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 10

Data Center Computing Challenges• With increasing Computing densities how does the user determine

what’s efficient?– Without the right metric and tools, users have to over provision based

upon worst case estimates

• Individual companies have some of the tools for some of the pieces but where is the complete solutions approach?– The computing Industry sees the problem and is creating Forums to

address this such as ASHRAE, ACEEE and The Green Grid…– Multi- step process. Measure, instrument and implement efficiency

policies

• How can we provide incentives for users to deploy power efficiency solutions?– Increasing energy costs and Regional Utilities constraining Data Center

expansion– PGE’s server efficiency rebate program is a good start. – Work with the Utilities to make it easy for customers to qualify for them.

Industry, government and utilities work together to help end users deploy power efficiency solutions into the data center

Page 11: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 11

Datacenter Overview

Chiller CWpum

p

CRAC

Cooling air to the Data Center

Heat rejected to the outdoors

ServerRack

PDUPDU

VR

VR

VR

VR

VR

5V

3.3V

1~2VCPUs, CPUs,

MemoryMemory, ,

Chip Chip set, set, etc.etc.

HDD, HDD, FansFans

, , I/O, I/O, etc.etc.

UPS

AC/DC DC/AC

PSU

12VDC/DCAC/DC

The Data Center is comprised of 3 Major Subsystems. Should be Optimally Balanced for Best Operation

Power

Cooling

BLDG

PWRInpu

tAC

Com

pute

Page 12: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 12

Data Center Power by Category

Loads Power delivery Cooling

Cumulative Power

Load Chiller PSU VRs UPS Serverfans

CRAC fan PDU CW pump Totalbaseline

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

Po

we

r p

er

co

mp

on

en

t

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Cu

mu

lati

ve

po

we

r

Understand the broad power usage

Page 13: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 13

Powering a Data Center

BLDG

PWR

ServerRackPDUPDU

PSU

VR

VR

12V

LoadLoadss

AC/DC

UPS

AC/DC DC/AC

Fans

DC/DC

88% x 93% x 79% x 75% = 48%

Cumulative inefficiencies are significant

This model assumes 100% utilized load

Todays Standard design

52% of power is lost in transmission

Page 14: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 14

The Effect of Efficient Airflow Management

BEFORE

Typical “room” cooling design, with poor hot air evacuation. Leads to overheated servers, damaged equipment and potential for service disruption. 4kw per cabinet is difficult to support.

AFTER

With proper airflow isolation design combined with balancing of under-floor static pressure,

the same data center may now support 12-14kw racks with no change to facilities

infrastructure capacity.

Hot air Contamination‘vena contracta’

Isolation driving efficiency

More density for the same power or Same density for less power

Page 15: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 15

Virtualization Saving PowerServer ConsolidationServer Consolidation

10:1 in many cases

HWHWHWHW

HWHW

VMMVMM

Disaster RecoveryDisaster Recovery

HWHWVMMVMM

HWHWVMMVMM

Upholding high-levels of business continuity.

One Standby for many production servers.

……OSOS

AppApp

OSOS

AppApp

OSOS

AppApp ……OSOS

AppApp

HWHWVMMVMM

HW HW VMMVMM

Balancing utilization with head room

Dynamic Load BalancingDynamic Load Balancing

OSOS

AppApp11

OSOS

AppApp22

OSOS

AppApp33

OSOS

AppApp44

CPU Usage

30%CPU Usage

90%

CPU Usage CPU Usage

Enables rapid deployment,reducing number of idle, staged servers

R&D ProductionR&D Production

HWHW

VMMVMM

OSOS

AppApp

All scenarios make more efficient use of server hardware, which saves power in the data center.

ConsolidateConsolidate

Page 16: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 16

An Industry Perspective

Efficiency in Box

Efficient Processor

Designing Data Center Power

Improved Consolidation

Efficiency in Box

Efficient Processor

Designing Data Center Power

Improved Consolidation

Intelligent control of platform power consumption

Enhanced levels of density

Intelligent control of platform power consumption

Enhanced levels of density

Efficiency across Data Center

Policy-based workload rebalancing

Ultra efficient facilities

Detailed Power Metering

Efficiency across Data Center

Policy-based workload rebalancing

Ultra efficient facilities

Detailed Power Metering

Efficiency in Rack

2006 2010

Facilities and IT working together

Page 17: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 17

The Green GridIndustry and user organization focused on Energy Efficient Data Centers and Enterprise IT• Launched April 26th with 11 companies

• AMD, APC, Dell, HP, IBM, Intel, Microsoft, Rackable Systems, SprayCool, Sun Microsystems, and VMware

• Now at 40+ companies.

Mission Statement:

A global consortium dedicated to advancing energy efficiency in data centers and business computing ecosystems.

In furtherance of its mission, the Green Grid, in consultation with end-users, will:

- Define meaningful, end-user-centric models and metrics;

- Develop standards, measurement methods, processes and new technologies to improve performance against the defined metrics; and

- Promote the adoption of the energy efficient standards, processes, measurements and technologies.

Intel sees a need for industry collaboration

• Metrics, best practices and technology specs for energy efficiency

To Join the Green Grid: www.thegreengrid.org* Other names and brands may be claimed as the property of others.

Page 18: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 18

Intel Breakthrough Technologies: Increasing Business Value

IT V

alu

eB

usin

ess V

alu

e

Time

Dynamic Reso

urce Poolin

g

Quad-core

Virtualiza

tion

Multi-Core, E

thernet Advance

s

VTD, VT2

Data Intensiv

e Computing

Quad-core, IBA

QuickData, 10GBE

Itanium archite

cture

Geneseo

Multi-core / M

ulti-threaded

XML Acceleration

PCIe gen 2

Core™ μArch

Data Center Optim

izatio

n

Core μArch

Quad-core @ 80W

Demand Based

Switching

Page 19: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 19

2 Y

EA

RS

65nm

45nm

2 Y

EA

RS

2 Y

EA

RS

32nm

Cadence for Product Innovation

TockIntel® Core™ microarchitecture

Tick45nm Next Generation Intel® Core™

microarchitecture (Penryn)

TockNext Generation Intel®

microarchitecture (NEHALEM)

TickFuture Derivative Product

TockFuture Intel® microarchitecture (GESHER)

TickIntel® Pentium™ 4 processors

Page 20: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.  * Other names and brands may be claimed as the property of others.  All products, dates, and figures are preliminary and are subject to change without any notice.  Copyright © 2006, Intel Corporation. 20

Call to Action

Recognize that the data center and the IT Equipment are becoming an integrated system

Leverage industry organizations, such as the Green Grid and ASHRAE for Data Center Best Practices

Remove the wall between IT and Facilities, partnerships must be in place to be successful

Demand and buy IT equipment that uses high efficiency components

Design data center facilities systems to use energy efficient designs in power delivery and cooling

And, enjoy the benefits of Moore’s Law!

Understand data center metricsand optimize the right ones

Page 21: Power in the Data Center: Future Trends in Computer Efficiency Jon Haas Enterprise Marketing Group Intel Corporation May 2007