power in the data center: future trends in computer efficiency jon haas enterprise marketing group...
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Power in the Data Center:Future Trends in Computer Efficiency
Jon Haas
Enterprise Marketing Group
Intel Corporation
May 2007
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 2
Legal Disclaimers*Other names and brands may be claimed as property of others. System Configuration details in backup. Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104.
All dates and products specified are for planning purposes only and are subject to change without notice.
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.
Performance per watt calculated as the benchmark result divided by the average system watts measured with an Extech* or like meter at the wall under “steady-state” load unless otherwise noted.
SPECint2000 and SPECfp2000 benchmark tests reflect the performance of the microprocessor, memory architecture and compiler of a computer system on compute-intensive, 32-bit applications. SPEC benchmark tests results for Intel microprocessors are determined using particular, well-configured systems. These results may or may not reflect the relative performance of Intel microprocessor in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information, including system benchmarks; to evaluate the performance of systems they are considering purchasing.
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 3
Agenda
Future Computing Demands
Datacenter Computing Challenges
Enterprise Computing: Quadcore, multi-core and beyond
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 4
Moore’s Law
Doubling the # of Transistors per chip about every 24 months
• 40 years of innovation
• Over 1 Billion transistors per chip
• Quad core is here
Increased Performance and Density
More functionality at
roughly the same cost
Multi-core and ThreadingPower efficiency
VirtualizationReliability
Security and manageability
Doubling Performance Every 24months.
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 5
Energy Efficient Performance
Performance & Utilization
Power & Costs
1H/2006: Dual Core Xeon 5100 (Woodcrest) 2x performance @ 40% less power
1H/2007: Quad-Core, Clovertown2x Woodcrest in a single 5100 skt
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 6
HPC Top500: An Example of Moore’s Law
1993 2017
10 PFlops
1 PFlops
100 TFlops
10 TFlops
1 TFlops
100 GFlops
10 GFlops
1 GFlops
100 MFlops1999 2005 2011
#1SUM
Top500
1 Server Today is Yesterday’s top HPC Machine
Typical Server2006: Dual Processor = 50 GFlop
2007: Dual Processor = ~ 100 GFlop
Source: HPC - www.top500.org, June 2006; PC - Intel
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 7
Moore’s Law … Alive and Well in the Data Center
2002• 3.7 TFlops• 25 racks• 512 Servers• 1000 sq ft• 128 kW
2007• 3.7 TFlops• 1 rack• 53 Servers• 40 sq ft• 21 kW
Where would YOU rather be?
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 8
Data Center Trends
Increasing power density and demand
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 9
Eco-Regulation is Everywhere
Mercury Ban
Batteries
WEEE
RoHS
Batteries
Battery law
20002007
Lead ban, e-waste, and packaging law
27 states draft e-waste bills
E-waste & packaging laws, Carbon-neutral
E-waste
Battery law
E-waste , Dfe product &Packaging
E-waste
EuP
REACH
E-waste & Energy
E-waste
China RoHS
Energy law
Energy E-waste, RoHS,
Packaging
EPA: Energy Star, Carbon-emission reduction
IPP25 EU States – WEEE & RoHS
RoHS study
E-waste, RoHS
E-waste, RoHSDraft Dfe, Take-back,
Packaging
Draft RoHS, Battery
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 10
Data Center Computing Challenges• With increasing Computing densities how does the user determine
what’s efficient?– Without the right metric and tools, users have to over provision based
upon worst case estimates
• Individual companies have some of the tools for some of the pieces but where is the complete solutions approach?– The computing Industry sees the problem and is creating Forums to
address this such as ASHRAE, ACEEE and The Green Grid…– Multi- step process. Measure, instrument and implement efficiency
policies
• How can we provide incentives for users to deploy power efficiency solutions?– Increasing energy costs and Regional Utilities constraining Data Center
expansion– PGE’s server efficiency rebate program is a good start. – Work with the Utilities to make it easy for customers to qualify for them.
Industry, government and utilities work together to help end users deploy power efficiency solutions into the data center
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 11
Datacenter Overview
Chiller CWpum
p
CRAC
Cooling air to the Data Center
Heat rejected to the outdoors
ServerRack
PDUPDU
VR
VR
VR
VR
VR
5V
3.3V
1~2VCPUs, CPUs,
MemoryMemory, ,
Chip Chip set, set, etc.etc.
HDD, HDD, FansFans
, , I/O, I/O, etc.etc.
UPS
AC/DC DC/AC
PSU
12VDC/DCAC/DC
The Data Center is comprised of 3 Major Subsystems. Should be Optimally Balanced for Best Operation
Power
Cooling
BLDG
PWRInpu
tAC
Com
pute
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 12
Data Center Power by Category
Loads Power delivery Cooling
Cumulative Power
Load Chiller PSU VRs UPS Serverfans
CRAC fan PDU CW pump Totalbaseline
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
Po
we
r p
er
co
mp
on
en
t
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Cu
mu
lati
ve
po
we
r
Understand the broad power usage
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 13
Powering a Data Center
BLDG
PWR
ServerRackPDUPDU
PSU
VR
VR
12V
LoadLoadss
AC/DC
UPS
AC/DC DC/AC
Fans
DC/DC
88% x 93% x 79% x 75% = 48%
Cumulative inefficiencies are significant
This model assumes 100% utilized load
Todays Standard design
52% of power is lost in transmission
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 14
The Effect of Efficient Airflow Management
BEFORE
Typical “room” cooling design, with poor hot air evacuation. Leads to overheated servers, damaged equipment and potential for service disruption. 4kw per cabinet is difficult to support.
AFTER
With proper airflow isolation design combined with balancing of under-floor static pressure,
the same data center may now support 12-14kw racks with no change to facilities
infrastructure capacity.
Hot air Contamination‘vena contracta’
Isolation driving efficiency
More density for the same power or Same density for less power
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 15
Virtualization Saving PowerServer ConsolidationServer Consolidation
10:1 in many cases
HWHWHWHW
HWHW
VMMVMM
Disaster RecoveryDisaster Recovery
HWHWVMMVMM
HWHWVMMVMM
Upholding high-levels of business continuity.
One Standby for many production servers.
……OSOS
AppApp
OSOS
AppApp
OSOS
AppApp ……OSOS
AppApp
HWHWVMMVMM
HW HW VMMVMM
Balancing utilization with head room
Dynamic Load BalancingDynamic Load Balancing
OSOS
AppApp11
OSOS
AppApp22
OSOS
AppApp33
OSOS
AppApp44
CPU Usage
30%CPU Usage
90%
CPU Usage CPU Usage
Enables rapid deployment,reducing number of idle, staged servers
R&D ProductionR&D Production
HWHW
VMMVMM
OSOS
AppApp
All scenarios make more efficient use of server hardware, which saves power in the data center.
ConsolidateConsolidate
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 16
An Industry Perspective
Efficiency in Box
Efficient Processor
Designing Data Center Power
Improved Consolidation
Efficiency in Box
Efficient Processor
Designing Data Center Power
Improved Consolidation
Intelligent control of platform power consumption
Enhanced levels of density
Intelligent control of platform power consumption
Enhanced levels of density
Efficiency across Data Center
Policy-based workload rebalancing
Ultra efficient facilities
Detailed Power Metering
Efficiency across Data Center
Policy-based workload rebalancing
Ultra efficient facilities
Detailed Power Metering
Efficiency in Rack
2006 2010
Facilities and IT working together
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 17
The Green GridIndustry and user organization focused on Energy Efficient Data Centers and Enterprise IT• Launched April 26th with 11 companies
• AMD, APC, Dell, HP, IBM, Intel, Microsoft, Rackable Systems, SprayCool, Sun Microsystems, and VMware
• Now at 40+ companies.
Mission Statement:
A global consortium dedicated to advancing energy efficiency in data centers and business computing ecosystems.
In furtherance of its mission, the Green Grid, in consultation with end-users, will:
- Define meaningful, end-user-centric models and metrics;
- Develop standards, measurement methods, processes and new technologies to improve performance against the defined metrics; and
- Promote the adoption of the energy efficient standards, processes, measurements and technologies.
Intel sees a need for industry collaboration
• Metrics, best practices and technology specs for energy efficiency
To Join the Green Grid: www.thegreengrid.org* Other names and brands may be claimed as the property of others.
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 18
Intel Breakthrough Technologies: Increasing Business Value
IT V
alu
eB
usin
ess V
alu
e
Time
Dynamic Reso
urce Poolin
g
Quad-core
Virtualiza
tion
Multi-Core, E
thernet Advance
s
VTD, VT2
Data Intensiv
e Computing
Quad-core, IBA
QuickData, 10GBE
Itanium archite
cture
Geneseo
Multi-core / M
ulti-threaded
XML Acceleration
PCIe gen 2
Core™ μArch
Data Center Optim
izatio
n
Core μArch
Quad-core @ 80W
Demand Based
Switching
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 19
2 Y
EA
RS
65nm
45nm
2 Y
EA
RS
2 Y
EA
RS
32nm
Cadence for Product Innovation
TockIntel® Core™ microarchitecture
Tick45nm Next Generation Intel® Core™
microarchitecture (Penryn)
TockNext Generation Intel®
microarchitecture (NEHALEM)
TickFuture Derivative Product
TockFuture Intel® microarchitecture (GESHER)
TickIntel® Pentium™ 4 processors
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Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All products, dates, and figures are preliminary and are subject to change without any notice. Copyright © 2006, Intel Corporation. 20
Call to Action
Recognize that the data center and the IT Equipment are becoming an integrated system
Leverage industry organizations, such as the Green Grid and ASHRAE for Data Center Best Practices
Remove the wall between IT and Facilities, partnerships must be in place to be successful
Demand and buy IT equipment that uses high efficiency components
Design data center facilities systems to use energy efficient designs in power delivery and cooling
And, enjoy the benefits of Moore’s Law!
Understand data center metricsand optimize the right ones
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