Porous Ceramic Chuck Tables

Main Function of Chuck TableMainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation and so on.

Silicon WaferChuck table

Classification by applicationsThinning Chucks Dicing Chucks Cleaning Chucks Film Uncovered ChucksTransportation ChucksGrinding Chucks

Photos wafer Chuck Table Thinning Chucks Dicing Chucks Clearance Chucks

Chucks and silicon photosTransportation Chucks

Transportation ChucksFace side

Characteristics

High flatness and parallelism.Compact and uniform microstructure with high strength.Good permeability and uniform adsorption affinity.Long life time.Dressing easily.

Thinning chucks and machinesDisco company

Disco 81083H/682IF800series8000 seriesG&N company

G&N 300400500700940Multi Nano 3-300Strasbaugh company

7AFOkamoto company

VG401VG502ACCREFECH -Tokyo Seimitsu PG200PG300 AM company

VRG250S

Disco machinesDGP 8760Polishing machine DFP 8140 DFP 8160DFG 8540DFG 8560DAG 810DFG 830DFE 8060DFG 81H/6DFG 83H/6DFG 82IF/88000 series800 seriesSilicon thinning machinesSilicon polishing machines

IF seriesCreep series

DFG 841

Note: our chucks can match with the machines marked with red characters.

Disco 83H/6

Thinning chucks with Disco machine Grinding processes on Disco dicing machine In-feedDisco DFG 82IF/8 used this kind of process.Front side matched with DFG82IF/8Back side matched with DFG 82IF/8

Thinning chucks matched with Disco machineCreep: Disco DFG 83H/6 used this kind of processFront sidematched with Disco 83H/6

It can suck 3-8 silicon wafer.

Disco thinning machines

Silicon thinning machine seriestypesMaximum process sizeChucks amount grinding process800 series DAG8108"1

In-feed:DFG8308"28000seriesDFG 85408"2DFG 8560300mm3IF seriesDFG82IF/88" 4 Creep seriesDFG83H/66"8Creep:

G&N silicon thinning machinesG&N 300 seriesG&N 400 series G&N 500 seriesG&N 700 series

G&N 300series MPS 2R 300 S MPS 2R 300 DS MPS 2R 300 DCS 300 series

program300series parametersGrinding processComposite feed300S300DCSChucks specification 4"5"6"8"Chucks number 5 3 2 1300 DSspecification 4"5"6"8"Chucks number 8 5 4 1 34

G&N 400 series

Machine typeG&N MPS 2R 400DSGrinding modeComposite feed

Wafer size4 5 6 8Chucks number8 5 4 1

G&N 500series

Machine typeG&N MPS T500Grinding modeVertical feed and creepWafer size46Chucks number2

G&N 700

Machine typeG&N MPS R700SGrinding modeWork table rotate, while the spindle vertical feedWafer size456 8 12Chucks number3020 147 3

Korea AM thinning machine 6 thinning chuck VRG-250S

Basic process of wafer cutting

Precision parameter of dicing chuckNote: We can make the precision according to the customers requirements.

Materialchuck sizeparallelism

Stainless steel and porous ceramic4"2m6"2m8"3m12"10m

Dicing machinesDisco company

automatic machine600series6000series semi-automatic300series500series600series 3000series ADT company ADT 7100series7200seriesACCREFECH -Tokyo Seimitsu company ACCREFECH A-WD series

Disco machines automatic dicing machines 600seriesDFD 641DFD 651DFD 681DFD 691 6000seriesDFD 6240DFD 6340DFD6450 semi-automatic 300seriesDAD321DAD322DAD341DAD351 3000seriesDAD3230DAD3350Note: our chucks have matched with the red character machinesDAD321DAD341DFD3350DFD6340

Chucks matched with DAD 321

DAD 341 machine

DFD 3350 machine and chucks

DFD 6340 machine and chuck

ADT machinesADT 7100 chuck

Tokyo Seimitsu companyA-WD-100Achuck

Contact UsWerlchem LLCWilson.wu@aol.comhttp://www.chuck-table.comSan Leandro, California