pmeg060v030epd - rs components · 2019. 10. 13. · pmeg060v030epd 60 v, 3 a low vf mega schottky...

PMEG060V030EPD60 V, 3 A low VF MEGA Schottky barrier rectifier12 August 2016 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a CFP15 (SOT1289) power and flatlead Surface-Mounted Device (SMD) plastic package.

2. Features and benefits• Average forward current: IF(AV) ≤ 3 A• Reverse voltage: VR ≤ 60 V• Extremely low forward voltage• High power capability due to clip-bonding technology and heat sink• Small and thin SMD power plastic package, typical height 0.78 mm• AEC-Q101 qualified

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Freewheeling application• Reverse polarity protection• Low power consumption application

4. Quick reference data

Table 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

IF(AV) average forwardcurrent

square wave; δ = 0.5 ; f = 20 kHz;Tsp ≤ 165 °C

- - 3 A

VR reverse voltage Tj = 25 °C - - 60 V

VF forward voltage IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 460 530 mV

VR = 10 V; Tj = 25 °C; pulsed [1] - 5 30 µAIR reverse current

VR = 60 V; Tj = 25 °C; pulsed [1] - 75 200 µA

[1] Very short test pulse to prevent junction self heating

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG060V030EPD60 V, 3 A low VF MEGA Schottky barrier rectifier

PMEG060V030EPD All information provided in this document is subject to legal disclaimers.

Product data sheet 12 August 2016 2 / 13

5. Pinning information

Table 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 A anode

2 A anode

3 K cathode

1

23

CFP15 (SOT1289)

aaa-009063

AK A

6. Ordering information

Table 3. Ordering informationPackageType number

Name Description Version

PMEG060V030EPD CFP15 plastic, thermal enhanced ultra thin SMD package; 3 leads;body: 5.8 x 4.3 x 0.78 mm

SOT1289

7. Marking

Table 4. Marking codesType number Marking code

PMEG060V030EPD 060V U03E





8. Limiting values

Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 60 V

IF forward current Tsp ≤ 163 °C; δ = 1 - 4.2 A

IF(AV) average forward current square wave; δ = 0.5 ; f = 20 kHz; Tsp ≤ 165 °C

- 3 A

IFSM non-repetitive peakforward current

square wave; tp = 8 ms; Tj(init) = 25 °C - 120 A

[1] - 1.66 WPtot total power dissipation Tamb ≤ 25 °C

[2] - 2.15 W

Tj junction temperature - 175 °C

Tamb ambient temperature -55 175 °C

Tstg storage temperature -65 175 °C

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

9. Thermal characteristics

Table 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1][2] - - 90 K/WRth(j-a) thermal resistancefrom junction toambient

in free air

[1][3] - - 70 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[4] - - 3 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are asignificant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[4] Soldering point of cathode tab.





aaa-022836

tp (s)10-3 102 10310110-2 10-1

10

1

102

Zth(j-a)(K/W)

10-1

duty cycle = 0

0.750.5

0.330.25

0.2

0.10.05

0.02 0.01

1

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesaaa-022837

tp (s)10-3 102 10310110-2 10-1

10

1

102

Zth(j-a)(K/W)

10-1

duty cycle = 0

0.750.5

0.330.25

0.2

0.10.05

0.02 0.01

1

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





10. Characteristics

Table 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 3 mA; Tj = 25 °C; pulsed [1] 60 - - V

IF = 0.1 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 285 330 mV

IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 375 440 mV

IF = 1.5 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 400 470 mV

IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 420 500 mV

IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 460 530 mV

IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = -40 °C

- 505 - mV

VF forward voltage

IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 125 °C

- 400 - mV

VR = 5 V; Tj = 25 °C; pulsed; pulsed [1] - 4 15 µA

VR = 10 V; Tj = 25 °C; pulsed [1] - 5 30 µA

VR = 60 V; Tj = 25 °C; pulsed [1] - 75 200 µA

IR reverse current

VR = 60 V; Tj = 125 °C; pulsed [1] - 34 - mA

VR = 1 V; f = 1 MHz; Tj = 25 °C - 350 - pF

VR = 4 V; f = 1 MHz; Tj = 25 °C - 195 - pF

Cd diode capacitance

VR = 10 V; f = 1 MHz; Tj = 25 °C - 120 - pF

reverse recovery timestep recovery

IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A;Tj = 25 °C

- 12 - nstrr

reverse recovery timeramp recovery

dIF/dt = 200 A/µs; Tj = 25 °C; IF = 6 A;VR = 26 V

- 11 - ns

[1] Very short test pulse to prevent junction self heating





aaa-024135

10-1

10-2

1

10

IF(A)

10-3

VF (V)0 0.70.5 0.60.40.30.1 0.2

(1) (5)

(6)(2)

(3)

(4)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 100 °C(4) Tj = 85 °C(5) Tj = 25 °C(6) Tj = -40 °C

Fig. 3. Forward current as a function of forwardvoltage; typical values

aaa-0241541

10-1

10-2

10-3

10-4

10-5

10-6

10-7

10-8

IR(A)

10-9

VR (V)0 604020

(1)

(2)

(3)

(4)

(5)

(6)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 100 °C(4) Tj = 85 °C(5) Tj = 25 °C(6) Tj = −40 °C

Fig. 4. Reverse current as a function of reversevoltage; typical values

VR (V)0 604020

aaa-024155700

Cd(pF)

0

100

200

300

400

500

600

f = 1 MHz; Tamb = 25 °C

Fig. 5. Diode capacitance as a function of reversevoltage; typical values

IF(AV) (A)0 542 31

aaa-024138

1.0

1.5

0.5

2.0

2.5

PF(AV)(W)

0

(1)

(5)

(2)

(3)

(4)

Tj = 100 °C(1) δ = 0.1(2) δ = 0.2(3) δ = 0.5(4) δ = 0.8(5) δ = 1

Fig. 6. Average forward power dissipation as afunction of average forward current; typicalvalues





aaa-024156

VR (V)0 604020

0.2

0.3

0.1

0.4

0.5

PR(AV)(W)

0

(1)

(2)

(3)

(4)

(5)

Tj = 100 °C(1) δ = 1(2) δ = 0.9(3) δ = 0.8(4) δ = 0.5(5) δ = 0.2

Fig. 7. Average reverse power dissipation as afunction of reverse voltage; typical values

aaa-024140

2

3

1

4

5

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Tamb (°C)0 20015050 100

FR4 PCB, standard footprintTj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 8. Average forward current as a function ofambient temperature; typical values

aaa-024141

2

3

1

4

5

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Tamb (°C)0 20015050 100

FR4 PCB, mounting pad for cathode 1 cm2

Tj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 9. Average forward current as a function ofambient temperature; typical values

aaa-024142

2

3

1

4

5

IF(AV)(A)

0

(1)

(2)

(3)

(4)

Tsp (°C)0 20015050 100

Tj = 175 °C(1) δ = 1; DC(2) δ = 0.5; f = 20 kHz(3) δ = 0.2; f = 20 kHz(4) δ = 0.1; f = 20 kHz

Fig. 10. Average forward current as a function of solderpoint temperature; typical values





11. Test information

time

IF

IR

trr

IR(meas)

006aad022

Fig. 11. Reverse recovery definition; step recovery

003aac562

trr

time

100 %

25 %

IFdlFdt

IR IRM

Qr

Fig. 12. Reverse recovery definition; ramp recovery

t1t2

P

t006aaa812

duty cycle δ =

t1

t2

Fig. 13. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations: IF(AV) = IM× δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined asRMS current.





Quality informationThis product has been qualified in accordance with the Automotive Electronics Council (AEC)standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.

12. Package outline

14-10-13Dimensions in mm

6.66.4

0.240.16

0.820.74

5.95.7

4.44.2

1.31.1

4.23.8

4.84.4

1.30.9

2.151.95 3.5

3.1

0.450.25

0.450.25

2.13

2 1

3

Fig. 14. Package outline CFP15 (SOT1289)

13. Soldering

Footprint information for reflow soldering of CFP15 package SOT1289

sot1289_frDimensions in mm

occupied area

solder paste

solder resist

solder lands

Issue date 13-08-2814-03-12

2.13

1.4 (2×)1.8 (2×)

1.6 (2×)

4.63.73

1.7 (4×)0.2

2.43.84

0.11

0.2

0.2

0.4

1.02

0.6

0.05

7.5

0.6

1.9

1.9

5.16 4.96

1.341.441.64

Fig. 15. Reflow soldering footprint for CFP15 (SOT1289)





14. Revision history

Table 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG060V030EPD v.1 20160812 Product data sheet - -





15. Legal information

Data sheet status

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16. Contents

1. General description......................................................12. Features and benefits.................................................. 13. Applications.................................................................. 14. Quick reference data....................................................15. Pinning information......................................................26. Ordering information....................................................27. Marking..........................................................................28. Limiting values............................................................. 39. Thermal characteristics............................................... 310. Characteristics............................................................511. Test information......................................................... 812. Package outline.......................................................... 913. Soldering..................................................................... 914. Revision history........................................................1015. Legal information..................................................... 11

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 12 August 2016

1. General description2. Features and benefits3. Applications4. Quick reference data5. Pinning information6. Ordering information7. Marking8. Limiting values9. Thermal characteristics10. Characteristics11. Test information12. Package outline13. Soldering14. Revision history15. Legal information16. Contents